KR20100062517A - Suction pad for semiconductor packages - Google Patents

Suction pad for semiconductor packages Download PDF

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Publication number
KR20100062517A
KR20100062517A KR1020080121186A KR20080121186A KR20100062517A KR 20100062517 A KR20100062517 A KR 20100062517A KR 1020080121186 A KR1020080121186 A KR 1020080121186A KR 20080121186 A KR20080121186 A KR 20080121186A KR 20100062517 A KR20100062517 A KR 20100062517A
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KR
South Korea
Prior art keywords
semiconductor package
adsorption
pad
vacuum
adsorption pad
Prior art date
Application number
KR1020080121186A
Other languages
Korean (ko)
Inventor
장동기
Original Assignee
한미반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한미반도체 주식회사 filed Critical 한미반도체 주식회사
Priority to KR1020080121186A priority Critical patent/KR20100062517A/en
Publication of KR20100062517A publication Critical patent/KR20100062517A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A semiconductor package suction pad is provided to prevent the leakage of air in a process of vacuum-sucking the semiconductor package by being closely contacted with one side of the semiconductor package while vertically moving. CONSTITUTION: A body unit(11) is combined to the holder(2) of a picker for returning a semiconductor package(P). An sucking unit(12) is formed on the lower part of the body unit to be transferable. The suction unit sucks the semiconductor package by contacting with a side of the semiconductor package. A cut groove(15) is integrated to the body unit. A transform unit is inserted in the cut groove. The suction unit is attached to the body unit using an adhesive.

Description

Suction Pad for Semiconductor Packages

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction pad of a semiconductor package conveying picker, and more particularly, to a semiconductor package conveying picker which picks up a semiconductor package and conveys the semiconductor package to a designated process position during the semiconductor package manufacturing process. It relates to a semiconductor package adsorption pad.

In a device for manufacturing a semiconductor package, a package conveying picker for performing a task of conveying a semiconductor package from one process position to another process position has a suction pad made of a flexible material such as silicon or rubber at a lower end thereof. The semiconductor package is adsorbed and fixed by generating a vacuum pressure through the adsorption pad.

1 is a view showing a suction pad of a conventional pick-up package picker, the suction pad 1 is fitted to the lower end of the holder (2) of the picker, the lower end is in close contact with the edge of the semiconductor package (P) The flange portion (1a) to prevent leakage is made of a structure formed to protrude downward. Although not shown in the drawing, the holder 2 is formed with an air flow path for forming a vacuum pressure.

However, the conventional adsorption pad 1 as described above is a process of adsorbing the semiconductor package when the semiconductor package has a deformation such as warpage or when the adsorption pad itself is deformed in the manufacturing process, so that the lower surface is not flat. In the air, a leak occurs, which causes a problem that the semiconductor package is not properly vacuum-adsorbed.

That is, as shown in FIG. 2, warpage deformation in which an edge of the semiconductor package P is bent upward or downward occurs in the manufacturing process of the semiconductor package P, or as shown in FIG. When itself is manufactured by bending upwards or downwards, or when both the suction pad 1 and the semiconductor package P are curved upwards or downwards as shown in FIG. 4, the flange portion 1a of the suction pad 1 is fixed. ) Is not completely in close contact with the edge surface of the semiconductor package (P), thereby causing a leak of air, a problem that the vacuum pressure is not properly formed.

The present invention is to solve the above problems, an object of the present invention is that even when the semiconductor package is deformed or the adsorption pad is deformed, the leakage of air does not occur in the process of the adsorption pad vacuum adsorption of the semiconductor package The present invention provides a semiconductor package adsorption pad which can reliably vacuum adsorb a semiconductor package at a constant vacuum pressure.

The present invention for achieving the above object, and a body portion coupled to the holder of the picker for package transport; A semiconductor package adsorption pad is provided below the body portion so as to be movable about the body portion, and includes an adsorption portion that contacts the surface of the semiconductor package to adsorb the semiconductor package.

According to the present invention, since the adsorption portion can be moved up and down with respect to the body portion, even if there is deformation of the semiconductor package or deformation of the adsorption pad itself, the adsorption portion is in close contact with the surface of the semiconductor package while moving up and down corresponding to the deformation form. Therefore, air leakage does not occur between the semiconductor package and the adsorption unit during the vacuum adsorption of the semiconductor package, so that a reliable vacuum pressure may be formed.

Hereinafter, preferred embodiments of the semiconductor package adsorption pad according to the present invention will be described in detail with reference to the accompanying drawings.

5 to 7 show a first embodiment of the semiconductor package adsorption pad according to the present invention, wherein the semiconductor package adsorption pad 10 of this embodiment is fitted to the holder 2 of the package transport picker and is coupled to the body 11. ) And an adsorption part 12 formed integrally with the lower part of the body part 11 and formed to be movable up and down with respect to the body part 11.

The body portion 11 and the adsorption portion 12 is made of a flexible material such as silicone, silicone rubber, rubber, or the like. In addition, an air flow passage 14 for forming a vacuum pressure is formed through the central portion of the body portion 11 and the suction portion 12.

The lower surface of the adsorption part 12 is formed to protrude downward to the flange portion 13 in contact with the edge surface of the semiconductor package (P) to prevent the leakage of air. In addition, an incision groove 15 is formed at a predetermined depth along the edge between the adsorption part 12 and the body part 11, so that the edge portion of the adsorption part 12 flows up and down. The deformation or the deformation of the adsorption pad 10 are adapted.

That is, as illustrated in FIGS. 6 and 7, deformation of the adsorption pad 10 is bent upwards or downwards during the manufacturing process, and warpage deformation of the semiconductor package P is also bent upwards or downwards. Even if it occurs, when the adsorption pad 10 picks up the semiconductor package P, the edge portion of the adsorption part 12 flows so that the flange portion 13 of the adsorption part 12 is the edge surface of the semiconductor package P. The semiconductor package P can be reliably vacuum-sorbed without leaking air.

8 is a modification of the adsorption pad 10 of the first embodiment, in which the adsorption pad 10 of this embodiment forms a deeper cutout 15a between the body portion 11 and the adsorption portion 12 to adsorb. The fluidity of the part 12 is further increased.

In addition, Figure 9 is another modification of the first embodiment, the suction pad 10 of this embodiment is a very flexible material such as a sponge inside the cutting groove 15 between the body portion 11 and the suction portion 12 The deformable member 16 is made of a structure attached to and attached. The deforming member 16 prevents foreign matter from penetrating into the cutout 15 while maintaining fluidity of the adsorption part 12 and increases durability of the adsorption part 12.

10 to 12 show a second embodiment of the adsorption pad 110 according to the present invention. The adsorption pad 110 of the second embodiment has a body portion 111 and a semiconductor package P fixed to the holder 2. Adsorption unit 112 for contacting the vacuum in contact with the () is made of an individual, the adsorption unit 112 is able to flow up and down the body portion 111 via the adhesive member 115 of a very flexible material, such as a sponge It is made of attached structure.

The adhesive member 115 is coated with an adhesive or an adhesive tape on both sides so that the adsorption portion 112 and the body portion 111 are integrally bonded to each other, and the adsorption portion 112 has a flow with respect to the body portion 111. Function to make it possible.

The adsorption pad 110 configured as described above is also similar to the one shown in FIGS. 11 and 12 because the adsorption part 112 is capable of flow with respect to the body part 111, similarly to the adsorption pad 10 of the first embodiment. Likewise, even when warpage deformation occurs in which the adsorption pad 110 and the semiconductor package P are bent upwards or downwards, when the adsorption pad 110 vacuums the semiconductor package P, the adsorption unit 112 is vacuumed. ) Flows and the flange portion 113 of the adsorption portion 112 is in close contact with the edge surface of the semiconductor package (P), thereby ensuring a vacuum suction of the semiconductor package (P) without air leakage phenomenon. .

On the other hand, in this second embodiment, the adhesive member 115 is attached over the entire surface between the adsorption portion 112 and the body portion 111, but the adhesive member 115 is different from the adsorption portion 112 and the body. It may be attached only to the middle portion between the portions 111 so that the fluidity of the edge portion of the adsorption portion 112 may be further increased.

As described above, the adsorption pads 10 and 110 of the present invention are formed so that the adsorption parts 12 and 112 are flowable with respect to the body parts 11 and 111, and thus, the semiconductor package P and / or the adsorption pad 10 may be used. , 110, even when deformation occurs, the suction portions 12 and 112 are in close contact with the surface of the semiconductor package P while flowing in response to the deformed shape when the semiconductor package P is vacuum-adsorbed. Therefore, the semiconductor package can be reliably vacuum-sorbed and conveyed at a constant vacuum pressure at all times.

1 is a cross-sectional view showing a state in which a conventional suction pad is coupled to a holder of a package transport picker.

2 is a cross-sectional view showing a state in which a conventional suction pad vacuum suctions a warpage-deformed semiconductor package.

3 is a cross-sectional view showing a state in which a conventional modified suction pad vacuum suctions a normal semiconductor package.

Figure 4 is a cross-sectional view showing a state in which the conventional modified suction pad vacuum suction the warpage modified semiconductor package

5 is a cross-sectional view showing a state in which the suction pad according to the first embodiment of the present invention is coupled to the holder of the pick-up package for transporting the package;

6 is a cross-sectional view illustrating a state in which the adsorption pad of FIG. 5 vacuum-sorbs a warpage deformed semiconductor package that is bent upwardly;

7 is a cross-sectional view illustrating a state in which the adsorption pad of FIG. 5 vacuum-sorbs a warpage deformed semiconductor package that is bent downward;

8 is a cross-sectional view showing a modification of the adsorption pad of FIG.

9 is a cross-sectional view showing another modification of the adsorption pad of FIG.

10 is a cross-sectional view showing a state in which a suction pad according to a second embodiment of the present invention is coupled to a holder of a package transport picker.

FIG. 11 is a cross-sectional view illustrating a state in which the adsorption pad of FIG. 10 vacuum absorbs a warpage-deformed semiconductor package that is bent upwards.

12 is a cross-sectional view illustrating a state in which the adsorption pad of FIG. 10 vacuum-sorbs a warpage deformed semiconductor package that is bent downward;

Explanation of symbols on the main parts of the drawings

10, 110: suction pad 11, 111: body portion

12, 112: adsorption portion 13, 113: flange portion

15: cutting groove 16: deformable member

115: adhesive member

Claims (5)

A body portion coupled to a holder of a package transport picker; The semiconductor package adsorption pad is formed in the lower portion of the body portion to be movable to the body portion, and comprises an adsorption portion for adsorbing the semiconductor package in contact with the surface of the semiconductor package. The semiconductor package adsorption pad of claim 1, wherein the adsorption part is integrally formed with the body part, and a cutout groove is formed for the flow of the adsorption part along an edge between the adsorption part and the body part. The semiconductor package adsorption pad of claim 2, further comprising a deformation member made of a flexible material inserted into and attached to the incision groove. The semiconductor package adsorption pad of claim 1, wherein the adsorption part and the body part are made of an individual body, and the adsorption part is attached to the body part through an adhesive member made of a flexible material. The semiconductor package adsorption pad of claim 4, wherein the adhesive member is attached to an intermediate portion between the adsorption part and the body part to form a space at a predetermined interval along an edge between the adsorption part and the body part.
KR1020080121186A 2008-12-02 2008-12-02 Suction pad for semiconductor packages KR20100062517A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080121186A KR20100062517A (en) 2008-12-02 2008-12-02 Suction pad for semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080121186A KR20100062517A (en) 2008-12-02 2008-12-02 Suction pad for semiconductor packages

Publications (1)

Publication Number Publication Date
KR20100062517A true KR20100062517A (en) 2010-06-10

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Family Applications (1)

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KR1020080121186A KR20100062517A (en) 2008-12-02 2008-12-02 Suction pad for semiconductor packages

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140134773A (en) * 2013-05-14 2014-11-25 세메스 주식회사 Apparatus for picking LED package
KR20150137257A (en) * 2014-05-29 2015-12-09 세메스 주식회사 Suction pad for holding a semiconductor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140134773A (en) * 2013-05-14 2014-11-25 세메스 주식회사 Apparatus for picking LED package
KR20150137257A (en) * 2014-05-29 2015-12-09 세메스 주식회사 Suction pad for holding a semiconductor package

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