KR20100062517A - Suction pad for semiconductor packages - Google Patents
Suction pad for semiconductor packages Download PDFInfo
- Publication number
- KR20100062517A KR20100062517A KR1020080121186A KR20080121186A KR20100062517A KR 20100062517 A KR20100062517 A KR 20100062517A KR 1020080121186 A KR1020080121186 A KR 1020080121186A KR 20080121186 A KR20080121186 A KR 20080121186A KR 20100062517 A KR20100062517 A KR 20100062517A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor package
- adsorption
- pad
- vacuum
- adsorption pad
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
BACKGROUND OF THE
In a device for manufacturing a semiconductor package, a package conveying picker for performing a task of conveying a semiconductor package from one process position to another process position has a suction pad made of a flexible material such as silicon or rubber at a lower end thereof. The semiconductor package is adsorbed and fixed by generating a vacuum pressure through the adsorption pad.
1 is a view showing a suction pad of a conventional pick-up package picker, the
However, the
That is, as shown in FIG. 2, warpage deformation in which an edge of the semiconductor package P is bent upward or downward occurs in the manufacturing process of the semiconductor package P, or as shown in FIG. When itself is manufactured by bending upwards or downwards, or when both the
The present invention is to solve the above problems, an object of the present invention is that even when the semiconductor package is deformed or the adsorption pad is deformed, the leakage of air does not occur in the process of the adsorption pad vacuum adsorption of the semiconductor package The present invention provides a semiconductor package adsorption pad which can reliably vacuum adsorb a semiconductor package at a constant vacuum pressure.
The present invention for achieving the above object, and a body portion coupled to the holder of the picker for package transport; A semiconductor package adsorption pad is provided below the body portion so as to be movable about the body portion, and includes an adsorption portion that contacts the surface of the semiconductor package to adsorb the semiconductor package.
According to the present invention, since the adsorption portion can be moved up and down with respect to the body portion, even if there is deformation of the semiconductor package or deformation of the adsorption pad itself, the adsorption portion is in close contact with the surface of the semiconductor package while moving up and down corresponding to the deformation form. Therefore, air leakage does not occur between the semiconductor package and the adsorption unit during the vacuum adsorption of the semiconductor package, so that a reliable vacuum pressure may be formed.
Hereinafter, preferred embodiments of the semiconductor package adsorption pad according to the present invention will be described in detail with reference to the accompanying drawings.
5 to 7 show a first embodiment of the semiconductor package adsorption pad according to the present invention, wherein the semiconductor
The
The lower surface of the
That is, as illustrated in FIGS. 6 and 7, deformation of the
8 is a modification of the
In addition, Figure 9 is another modification of the first embodiment, the
10 to 12 show a second embodiment of the
The
The
On the other hand, in this second embodiment, the
As described above, the
1 is a cross-sectional view showing a state in which a conventional suction pad is coupled to a holder of a package transport picker.
2 is a cross-sectional view showing a state in which a conventional suction pad vacuum suctions a warpage-deformed semiconductor package.
3 is a cross-sectional view showing a state in which a conventional modified suction pad vacuum suctions a normal semiconductor package.
Figure 4 is a cross-sectional view showing a state in which the conventional modified suction pad vacuum suction the warpage modified semiconductor package
5 is a cross-sectional view showing a state in which the suction pad according to the first embodiment of the present invention is coupled to the holder of the pick-up package for transporting the package;
6 is a cross-sectional view illustrating a state in which the adsorption pad of FIG. 5 vacuum-sorbs a warpage deformed semiconductor package that is bent upwardly;
7 is a cross-sectional view illustrating a state in which the adsorption pad of FIG. 5 vacuum-sorbs a warpage deformed semiconductor package that is bent downward;
8 is a cross-sectional view showing a modification of the adsorption pad of FIG.
9 is a cross-sectional view showing another modification of the adsorption pad of FIG.
10 is a cross-sectional view showing a state in which a suction pad according to a second embodiment of the present invention is coupled to a holder of a package transport picker.
FIG. 11 is a cross-sectional view illustrating a state in which the adsorption pad of FIG. 10 vacuum absorbs a warpage-deformed semiconductor package that is bent upwards.
12 is a cross-sectional view illustrating a state in which the adsorption pad of FIG. 10 vacuum-sorbs a warpage deformed semiconductor package that is bent downward;
Explanation of symbols on the main parts of the drawings
10, 110:
12, 112:
15: cutting groove 16: deformable member
115: adhesive member
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080121186A KR20100062517A (en) | 2008-12-02 | 2008-12-02 | Suction pad for semiconductor packages |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080121186A KR20100062517A (en) | 2008-12-02 | 2008-12-02 | Suction pad for semiconductor packages |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20100062517A true KR20100062517A (en) | 2010-06-10 |
Family
ID=42362769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080121186A KR20100062517A (en) | 2008-12-02 | 2008-12-02 | Suction pad for semiconductor packages |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20100062517A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140134773A (en) * | 2013-05-14 | 2014-11-25 | 세메스 주식회사 | Apparatus for picking LED package |
KR20150137257A (en) * | 2014-05-29 | 2015-12-09 | 세메스 주식회사 | Suction pad for holding a semiconductor package |
-
2008
- 2008-12-02 KR KR1020080121186A patent/KR20100062517A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140134773A (en) * | 2013-05-14 | 2014-11-25 | 세메스 주식회사 | Apparatus for picking LED package |
KR20150137257A (en) * | 2014-05-29 | 2015-12-09 | 세메스 주식회사 | Suction pad for holding a semiconductor package |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200636905A (en) | Suction device, polishing device, semiconductor device and manufacturing method of semiconductor device | |
KR102344555B1 (en) | Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector | |
KR20100006154A (en) | Collet for transferring a semiconductor chip and apparatus including the same | |
TWD191199S (en) | Part of the vacuum injection pad | |
JP2003025174A (en) | Substrate suction method and substrate suction mechanism | |
KR20100062517A (en) | Suction pad for semiconductor packages | |
CN109421191B (en) | Suction hand, conveyance mechanism and method, molding apparatus and method | |
TWI513059B (en) | Phosphor film pick-up apparatus for led chip | |
JP4399863B2 (en) | Holding device | |
JP2003191191A (en) | Vacuum suction device | |
JP2012009751A (en) | Vacuum tweezers | |
KR200448310Y1 (en) | Vacuun chuck table for sawing apparatus of semiconductor device | |
KR100880652B1 (en) | Equipment for handling semiconductor package | |
JP2002137183A (en) | Suction pad | |
JP4655272B2 (en) | Substrate adsorption device and substrate transfer device using the same | |
JP4973704B2 (en) | HOLDING DEVICE AND CONVEYING DEVICE HAVING HOLDING DEVICE | |
KR200448311Y1 (en) | Vacuun chuck table for sawing apparatus of semiconductor device | |
JP2022051595A (en) | Vacuum suction chuck | |
CN216736444U (en) | Suction nozzle structure | |
JPH07214489A (en) | Suction pad | |
JP2014176914A (en) | Suction pad and suction device | |
JP2013165219A (en) | Die bonding apparatus, collet, and die bonding method | |
KR101599812B1 (en) | The semiconductor package of the suction holding means | |
KR100420177B1 (en) | Vacuum pad for picking up ball grid array package | |
TWM470375U (en) | Vacuum suction apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |