TWM470375U - Vacuum suction apparatus - Google Patents

Description

Vacuum absorber

This creation relates to a vacuum sorber, and more particularly to a vacuum sorbent for adsorbing wafers.

Vacuum adsorption devices are usually applied to the transportation of sheets, such as wafers, glass substrates, circuit boards, diaphragms, etc., for example, in a packaging and testing plant, a vacuum adsorption device is mounted on a robot arm and sucked by a vacuum adsorption device. To be sucked, such as a wafer.

Referring to FIG. 1 , the vacuum adsorption device is an integrally formed metal component, and includes a body 11 and a nozzle 12 . The base 11 and the nozzle 12 have a passage 10 through the center thereof, and the base 11 is An end surface 111 is connected to a driving member (not shown) capable of generating vacuum suction, so that the passage 10 can be evacuated, and the vacuum suction device moves the seat 11 of the vacuum suction device during the adsorption process. Aligned to a wafer 13, then the adsorption surface 121 of the nozzle 12 is brought into contact with and contacts the metal bumps 131 on the active surface of the wafer 13, and then the vacuum is attracted by the driving member, and the wafer 13 is subjected to the channel 10 Vacuum suction causes the active surface side of the wafer 13 to be adsorbed on the adsorption surface 121 of the nozzle 12, and the wafer 13 can be moved to a predetermined position along with the vacuum suction device.

However, since the vacuum adsorption device is an integrally formed metal component, the adsorption surface 121 of the suction nozzle 12 has high hardness and is not elastic, when the vacuum adsorption device is performing adsorption operation, The active surface of the wafer 13 and the metal bumps 131 are more likely to cause deformation, wear or scratches due to frequent contact with the adsorption surface 121 of the nozzle 12, thereby causing circuit failure of the active surface.

Therefore, it is necessary to provide an improved vacuum sorber to solve the problems of the conventional technology.

The main purpose of the present invention is to provide a vacuum absorbing device which utilizes the soft plastic nozzle as a soft material design to avoid defects such as deformation, abrasion or scratch of the active surface of the wafer and the metal bump to reduce the transportation. The wear and tear generated by the wafer.

The second objective of the present invention is to provide a vacuum absorbing device which utilizes the soft plastic nozzle as a soft material design, which can increase the convenience of replacing the nozzle and relatively reduce the material cost of replacing the nozzle.

In order to achieve the above object, the present invention provides a vacuum absorbing device comprising a metal mounting seat and a soft plastic nozzle, the metal mounting base comprising a mounting body, a fixing joint, a receiving groove and a passage. The mounting body has a mounting surface and an opposite surface, and the fixing joint extends from an opposite surface of the mounting body, the receiving groove is formed on a mounting surface of the mounting body, and the passage is formed on the mounting body The flexible plastic nozzle is embedded in the receiving groove, and the soft plastic nozzle has an adsorption surface, a nozzle hole, a joint surface and a communication hole. The adsorption surface protrudes from the accommodating groove and is attached to an active surface of the wafer to be held, and the nozzle hole is formed on the adsorption surface, and the joint surface is opposite to the adsorption surface and is attached to the surface The communication hole is formed in the receiving groove of the seat body, and the communication hole is formed on the joint surface and communicates with the nozzle hole.

In one embodiment of the present invention, the metal mount is a stainless steel mount.

In one embodiment of the present invention, the soft plastic nozzle is a nylon nozzle.

In an embodiment of the present invention, the receiving groove extends through opposite sides of the mounting body.

In an embodiment of the present invention, the nozzle hole has an elongated shape.

In an embodiment of the present invention, the communication hole has a cylindrical shape.

In an embodiment of the present invention, the depth of the nozzle hole is smaller than the depth of the communication hole.

In an embodiment of the present invention, the vacuum sorber further includes an adhesive for adhering the bonding surface of the soft plastic nozzle to the receiving groove.

In an embodiment of the present invention, the soft plastic nozzle further has a buffer space between the joint surface and the adsorption surface, and communicates with the nozzle hole and the communication hole.

In an embodiment of the present invention, the vacuum sorber further includes a moving seat, the fixed joint is combined on the moving seat, and the passage is connected to a vacuum pipe of the moving seat.

In an embodiment of the present invention, the fixed joint has a ring groove for being tightly fixed with the moving seat.

In one embodiment of the present invention, the wafer to be held is a rectangular chip-on-glass (COG) wafer.

In order to achieve the above purpose, the present invention provides a vacuum absorbing device comprising a stainless steel mounting seat and a nylon nozzle, the stainless steel mounting base comprising a mounting body, a fixing joint, a receiving groove and a passage. The mounting body has a mounting surface and an opposite surface, and the fixing joint extends from an opposite surface of the mounting body, the receiving groove is formed on a mounting surface of the mounting body, and the passage is formed in the mounting body and The accommodating groove is connected to the fixed joint.

As described above, when the soft plastic nozzle is designed as a soft material, the adsorption surface of the soft plastic nozzle is attached to the active surface of the wafer, and the active surface and the metal bump are not worn or scraped. The damage can reduce the wear and tear caused by transporting the wafer; at the same time, the convenience of replacing the nozzle and the relative material cost of replacing the nozzle can be increased.

10‧‧‧ channel

11‧‧‧

111‧‧‧ end face

12‧‧‧ nozzle

121‧‧‧Adsorption surface

13‧‧‧ wafer

131‧‧‧Metal bumps

100‧‧‧Vacuum absorber

2‧‧‧Metal mount

21‧‧‧Mounting body

211‧‧‧Installation surface

212‧‧‧ opposite

22‧‧‧Fixed joints

23‧‧‧ accommodating slots

24‧‧‧ channel

3‧‧‧Soft plastic nozzle

31‧‧‧Adsorption surface

32‧‧‧ nozzle hole

33‧‧‧ joint surface

34‧‧‧Connected holes

4‧‧‧Mobile seat

41‧‧‧vacuum pipe

42‧‧‧Fixed components

5‧‧‧Send wafers

51‧‧‧Metal bumps

1 is a cross-sectional view of a vacuum adsorption device of a conventional technique; FIGS. 2 and 3 are perspective views of a vacuum absorber according to an embodiment of the present invention; and FIGS. 4 and 5 are cross-sectional views of a vacuum absorber according to an embodiment of the present invention. Fig. 6 is a plan view showing a vacuum absorber of an embodiment of the present invention; and Fig. 7 is a view showing a state of use of the vacuum absorber of an embodiment of the present invention.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention will be described in detail below. Furthermore, the directional terms mentioned in this creation, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, side, surrounding, central, horizontal, horizontal, vertical, vertical, axial, Radial, uppermost or lowermost, etc., only refer to the direction of the additional schema. Therefore, the directional terminology used is used to describe and understand the creation, and is not intended to limit the creation.

Referring to FIG. 2, the vacuum absorbing device 100 of the present embodiment is connected to a driving member capable of generating vacuum suction for adsorbing a wafer, such as a rectangular chip-on-glass package. , a COG-type holding wafer 5 (see FIG. 7), moves the wafer 5 to be held from a processing station to a next processing station, wherein the vacuum absorbing device 100 mainly comprises a metal mounting 2. A soft plastic nozzle 3 and a moving seat 4, the details of the structure, assembly relationship and operation principle of the components of the vacuum absorber 100 will be described in detail below.

As shown in FIG. 3, FIG. 4 and FIG. 5, the metal mounting base 2 includes a mounting body 21, a fixing joint 22, a receiving groove 23 and a passage 24. The mounting body 21 has a mounting surface 211. And the opposite surface 212; the fixing joint 22 extends from the opposite surface 212 of the mounting body 21 and has a ring groove 221; the receiving groove 23 is recessed and formed on the mounting surface 211 of the mounting body 21; The passage 24 is formed in the mount body 21 and the fixed joint 22 and communicates with the accommodating groove 23.

In this embodiment, the metal mounting base 2 is, for example, a stainless steel mounting seat, and the receiving groove 23 extends through opposite sides of the mounting body 21 (such as the left and right sides of FIG. 3) to make the soft plastic. The nozzle 3 can be easily inserted into the accommodating groove 23 when assembled, and is only limited by a single direction (perpendicular to the through direction, such as the front and rear sides of FIG. 3). In another embodiment, the receiving groove 23 can also be selected as a closed rectangular groove and does not extend through any side of the mounting body 21 (not shown).

The size of the soft plastic nozzle 3 is matched with the size of the accommodating groove 23, so that the soft plastic nozzle 3 can be embedded in the accommodating groove 23, and The soft plastic nozzle 3 has an adsorption surface 31, a nozzle hole 32, a joint surface 33 and a communication hole 34. The height of the soft plastic nozzle 3 is greater than the depth of the receiving groove 23, so that the adsorption surface 31 (ie, the top surface) protrudes from the accommodating groove 23 of the metal mount 2, and the nozzle hole 32 is formed on the suction surface 31. The bonding surface 33 (ie, the bottom surface) is opposite to the adsorption surface 31 and is attached to the receiving groove 23 of the mounting body 2, and the bonding surface 33 is coated with an adhesive (not shown). Covering between the metal mount 2 and the soft plastic nozzle 3 for bonding and fixing the joint surface 33 of the soft plastic nozzle 3 The receiving groove 23 is in the middle. The communication hole 34 is formed on the joint surface 33 and communicates with the nozzle hole 32.

In the embodiment, the soft plastic nozzle 3 is, for example, a nylon nozzle, and the nozzle hole 32 has an elongated shape, and the communication hole 34 has a cylindrical shape, wherein the depth of the nozzle hole 32 is deep. It is generally designed to be smaller than the depth of the communication hole 34. If necessary, a suitable buffer space (not shown) may be added between the joint surface 33 and the adsorption surface 31 so that the adsorption surface 31 is adjacent to the surface near the nozzle hole 32, and has a slight depression. The elastic deformation margin prevents the instantaneous vacuum attraction of the driving member from being excessively large and causes damage to the wafer 5 to be held.

Continuing with reference to Figures 2 and 3, the fixed joint 22 is combined on the moving base 4, and the moving base 4 can be manually or automatically manipulated to be moved laterally or longitudinally to be positioned on the wafer 5 (see Figure 7). The moving base 4 has a vacuum duct 41. The opposite surface 212 of the metal mounting base 2 can be provided with a block (not shown), and the insert or the like can be inserted into the card slot on the top end of the moving base 4. The fixing joint 22 is inserted into an assembly hole (not shown) on the top end of the moving base 4, and the ring groove 221 is directly inserted into the moving base 4, and the tension inside the moving base 4 is A mechanism (not shown) is used for the fastening, and an external vacuum return line (not shown) is fixed to the movable base 4 by a fixing member 42.

The metal mount 2 is fixed to the movable base 4. After the fixed joint 22 is assembled to the moving base 4, the passage 24 of the metal mount 2 can communicate with the vacuum duct 41, and the vacuum duct 41 is externally connected to the driving member for vacuum suction operation.

According to the above structure, when the vacuum absorbing device 100 is used for manual or automated wafer absorbing operation, the metal mount 2 is first fixed on the movable base 4, wherein the size of the soft plastic nozzle 3 corresponds to the The size of the wafer 5 to be held is pre-designed; then, the moving seat 4 is adjusted to move the soft plastic nozzle 3 to the opposite direction of the wafer 5 to be held (eg Moving to the bottom thereof), and vacuum suction is performed through the vacuum duct 41 by using the driving member, and as shown in FIG. 7, the vacuum suction force causes the adsorption surface 31 of the soft plastic nozzle 3 to be closely attached to the suction target Holding an active surface of the wafer 5, only the metal bump 51 of the wafer 5 to be held contacts the adsorption surface 31 of the soft plastic nozzle 3, but the vacuum suction still enables the wafer 5 to be held to remain positioned. The suction surface 31 of the soft plastic nozzle 3 is moved to a predetermined position with the vacuum absorbing device 100, for example, moved to the next processing station to hold the wafer 5 to be held (rectangular glass flip chip package) The wafer is bonded to the transparent electrode terminal of the liquid crystal glass substrate.

With the above design, the soft plastic nozzle 3 is designed as a nylon nozzle, so that the adsorption surface 31 of the soft plastic nozzle 3 provides the properties possessed by the soft plastic itself, and the suction surface is under vacuum suction. 31 adsorbs an active surface of the wafer 5 to be held, but does not cause defects such as deformation, abrasion or scratch of the active surface and the metal bump 51, thereby reducing the wear and tear caused by transporting the wafer; It can increase the convenience of replacing the nozzle and relatively reduce the material cost of replacing the nozzle. Furthermore, the nozzle hole 32 has an elongated shape to increase the effective adsorption area for adsorbing the rectangular active surface for enhancing the adsorption force.

Although the present invention has been disclosed in its preferred embodiments, it is not intended to limit the present invention, and anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application.

100‧‧‧Vacuum absorber

2‧‧‧Metal mount

3‧‧‧Soft plastic nozzle

31‧‧‧Adsorption surface

32‧‧‧ nozzle hole

4‧‧‧Mobile seat

41‧‧‧vacuum pipe

42‧‧‧Fixed components

Claims (13)

A vacuum absorbing device comprising: a metal mounting base comprising: a mounting body having a mounting surface and an opposite surface; a fixed joint extending from an opposite surface of the mounting body; a receiving groove formed on the mounting surface of the mounting body; and a passage formed in the mounting body and the fixing joint and communicating with the receiving groove; and a soft plastic nozzle embedded in the receiving In the groove, the soft plastic nozzle has: an adsorption surface protruding from the receiving groove and attached to an active surface of the wafer to be held; a nozzle hole formed on the adsorption surface; The joint surface is opposite to the suction surface and is fitted into the receiving groove of the mounting body; and a communication hole is formed on the joint surface and communicates with the nozzle hole. The vacuum sorbent of claim 1, wherein the metal mounting seat is a stainless steel mounting seat. The vacuum sorbent of claim 1, wherein the soft plastic nozzle is a nylon nozzle. The vacuum sorbent of claim 1, wherein the accommodating groove extends through opposite sides of the mounting body. The vacuum sorbent of claim 1, wherein the nozzle hole has an elongated shape. The vacuum sorbent of claim 1 or 5, wherein the communication hole has a cylindrical shape. A vacuum sorbent according to claim 1 or 5, wherein the nozzle The depth of the hole is smaller than the depth of the communication hole. The vacuum absorbing device of claim 1, further comprising an adhesive for fixing the joint surface of the soft plastic nozzle in the accommodating groove. The vacuum absorbing device of claim 1, wherein the soft plastic nozzle further has a buffer space between the joint surface and the adsorption surface, and communicates with the nozzle hole and the communication hole . The vacuum sorbent of claim 1, further comprising a moving seat, the fixed joint being combined on the moving seat, and the passage is connected to a vacuum pipe of the moving seat. The vacuum sorbent of claim 10, wherein the fixed joint has a ring groove for being tightly fixed with the moving seat. The vacuum sorbent of claim 1, wherein the wafer to be held is a rectangular glass flip chip packaged wafer. A vacuum absorbing device comprising: a stainless steel mounting base comprising: a mounting body having a mounting surface and an opposite surface; a fixed joint extending from an opposite surface of the mounting body; a receiving groove formed on the mounting surface of the mounting body; and a passage formed in the mounting body and the fixing joint and communicating with the receiving groove; and a nylon nozzle embedded in the receiving groove The nylon nozzle has: an adsorption surface protruding from the receiving groove and attached to an active surface of a glass-clad packaged wafer; a nozzle hole formed on the adsorption surface; a joint surface opposite to the adsorption surface and attached to the receiving groove of the mounting body; And a communication hole formed on the joint surface and connected to the nozzle hole.