JP2014154775A - Electronic component mounting method and mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting method capable of efficiently mounting electronic components on neighboring two sides of one wafer.SOLUTION: A mounting method includes a supplying step of supplying two wafers W to two tables 22a, 22b, respectively, and a mounting step of mounting electronic components P on the supplied two wafers. In the supplying step, the wafers are supplied respectively while protruding to a side between the two tables which are positioned separately and oppositely. At such a time, the wafer is supplied to one table while projecting neighboring two sides to mount electronic components thereon, and the wafer is supplied to the other table while projecting the side to mount the electronic components thereon and a side on which no electronic component is mounted and which is adjacent to the side to mount the electronic components thereon. In the mounting step, the electronic components are simultaneously mounted on the two wafers while positioning, in one row, the sides to mount the electronic components thereon of the respective wafers protruding from the respective tables.

Description

  The present invention relates to an electronic component mounting method and mounting device for mounting an electronic component on a side of a rectangular substrate.

  For example, in a liquid crystal display device used for a mobile phone or the like, an IC chip as an electronic component is mounted on the side of the surface of a glass substrate as a rectangular substrate.

  A mounting apparatus that performs this mounting includes a bonding portion for bonding an anisotropic conductive pressure-sensitive adhesive tape (ACF) to the substrate, and a temporary bonding of the electronic component to the pressure-sensitive adhesive tape bonded by the bonding portion. A crimping part and a main crimping part for final crimping the temporarily crimped electronic component are provided.

  Each of the adhering part, the temporary pressure bonding part, and the main pressure bonding part includes a table that holds the substrate by suction. Each table is rotationally driven in a rotation direction about an axis perpendicular to the horizontal direction that is the X and Y directions and the horizontal plane that is the θ direction.

  And the said board | substrate is positioned with respect to the said adhesion part, temporary crimping | compression-bonding part, and this crimping | crimping part by the said table, respectively, adhesion | attachment of an adhesive tape, temporary crimping | bonding of an electronic component, and final crimping | compression-bonding of an electronic component are carried out. To be done.

  In the mounting apparatus, the adhering portion, the temporary pressure bonding portion, and the main pressure bonding portion are often arranged in a row.

  A substrate is supplied to the table of each part from each previous process. That is, a board | substrate is supplied to the said sticking part from a supply part. Thereby, the adhesive tape is attached to the two sides on which the electronic components of the substrate are mounted.

  The substrate to which the adhesive tape has been attached at the attaching portion is supplied to the temporary pressure-bonding portion, where the electronic component is temporarily pressure-bonded to the two sides to which the adhesive tape has been attached. The substrate on which the electronic component is temporarily crimped is supplied to the main crimping portion, where the electronic component temporarily crimped on the substrate is finally crimped.

  Since the main pressure bonding of the electronic component takes longer work time than the adhesion of the adhesive tape at the bonding portion and the temporary pressure bonding of the electronic component at the temporary pressure bonding portion, a plurality of main pressure bonding portions may be provided. .

  As a result, the working times at the adhering part, the temporary pressure-bonding part, and the main pressure-bonding part provided in the mounting apparatus are made substantially uniform to improve productivity.

  In addition, productivity is improved by supplying a plurality of substrates to the adhering part, the temporary pressure bonding part, and the main pressure bonding part.

  By the way, there are cases where electronic components are mounted on two adjacent sides of the substrate in mounting electronic components on the side of the substrate. In the liquid crystal display device, the substrate is usually rectangular, and electronic components are mounted on the long side and the short side of the rectangle, respectively.

  In such a case, in the sticking part, the temporary press-bonding part, and the main press-bonding part, the table holding the substrate is rotated 90 degrees so that each work is performed on the long side and the short side. In many cases, each operation is performed from above while supporting a portion from which the portion on which the electronic component of the substrate is mounted protruding from the table is held by a backup tool or the like.

JP 2009-99775 A

  By the way, when mounting the electronic component on the board is performed with the board protruding from the table as described above, it is important for uniform work to suppress the deformation of the board. If the amount of protrusion is too large or the amount of protrusion differs depending on the location of the substrate, the amount of deformation of the substrate becomes large or the amount of deformation varies.

  And when performing each said operation | work, the stress resulting from this deformation | transformation influences and a uniform operation result cannot be obtained. Therefore, it is better to make the protrusion amount uniform and less. In other words, the shape and size of the surface for holding the substrate of the table is preferably close to the substrate.

  Moreover, the said board | substrate is used for the thing of various sizes according to the kind. Therefore, considering the above conditions, the shape and size of the table correspond to the maximum size substrate applied in the mounting apparatus.

  Here, when electronic components are mounted on two adjacent sides of the board, if the shape and size of the table are determined in this way, a large table T is used when mounting a small board W as shown in FIG. The two sides for mounting the electronic component are projected and held at the corners.

  That is, if the shape and size of the table T are determined with respect to the size of the substrate W to be applied as described above, the work quality in each work of mounting is improved, but the large size is the standard, so the small-sized substrate W Then, a useless portion corresponding to the length of S1 in FIG. This wasted portion S1 also causes a wasted portion in the size of the work head (for example, the main pressure bonding head) when mounting the electronic component.

  The present invention can also be applied to substrates of various sizes. When two substrates are processed and mounted, invalid portions are not affected by the table and high productivity and lower An object is to provide a small-sized mounting apparatus and mounting method at low cost.

The present invention is a mounting method for mounting an electronic component on two adjacent sides of a rectangular substrate,
A supplying step of supplying two substrates to two tables respectively;
A mounting step of mounting electronic components on the two supplied substrates,
In the supplying step, the substrates are supplied by projecting to the side between the two tables positioned to face each other,
At this time, two adjacent sides on which the electronic component is mounted are projected and supplied to one table, and the other table is adjacent to the side on which the electronic component is mounted and the side. The side where the electronic component is not mounted is projected and supplied,
In the mounting process, the electronic components are mounted on two substrates at the same time by positioning the sides on which the electronic components are mounted on the respective substrates protruding from the respective tables in a row. It is in the implementation method.

The present invention is a mounting apparatus for mounting an electronic component on two adjacent sides of a rectangular substrate,
Two tables supplied with the substrate;
Supply means for supplying a substrate to the table;
Mounting means for mounting the electronic component on the supplied substrate;
When each of the two substrates is supplied to the two tables, the substrates are supplied to protrude between the two tables positioned so as to face each other,
At this time, two adjacent sides on which the electronic component is mounted are projected on one table, the side on which the electronic component is mounted on the other table, and the side on which the electronic component adjacent to the side is not mounted Controlling the supply means so that the sides are projected and supplied;
An electronic component mounting apparatus comprising: a control unit that controls the mounting unit so that the electronic component is mounted on a side of each substrate protruding from each table.

  According to the present invention, when supplying a substrate to each of the two tables, one of the tables is supplied by protruding two adjacent sides on which the electronic component is mounted, and the other table is mounted with the electronic component. The side that is not mounted and the side on which the electronic component adjacent to the side is not mounted is projected and supplied, and the two sides are aligned in a row so that the electronic components are mounted on the two boards simultaneously. I made it.

  Therefore, when one side that mounts electronic components on two boards is arranged in a row, the other side can be approached without being disturbed by the table, so that the two boards are arranged in a row. By reducing the length dimension formed by the two side edges, it is possible to improve productivity and reduce the size and cost of the mounting apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. The top view which shows the carrying-in part of the said mounting apparatus, the sticking part, and a temporary crimping | compression-bonding part. The top view which shows the 1st main crimping | compression-bonding part, the 2nd main crimping | compression-bonding part, and the carrying-out part of the said mounting apparatus. The front view of the 1st delivery apparatus. The front view of the 2nd, 3rd delivery apparatus. (A)-(d) is explanatory drawing which showed the procedure which sticks an adhesive tape to the long side and short side of the board | substrate supplied to a pair of sticking table of the sticking part. (A)-(d) is explanatory drawing which showed the procedure which carries out temporary crimping | bonding of an electronic component to the long side and short side of the board | substrate supplied to the pair of temporary crimping | compression-bonding table of a temporary crimping | compression-bonding part. (A)-(c) shows the procedure of carrying out final press-bonding of the electronic components temporarily press-bonded to the short sides of the two substrates supplied to the pair of first final press-bonding tables of the first final press-bonding section. Explanatory drawing. (A)-(c) shows the procedure of carrying out final press-bonding of the electronic components temporarily press-bonded to the long sides of the two substrates supplied to the pair of second final press-bonding tables of the second final press-bonding section. Explanatory drawing. The substrates are supplied and mounted on the two tables in the same state, the sides on which the electronic components of the two substrates are temporarily bonded are arranged in a line, and the electronic components temporarily bonded to these two sides are finally bonded. The figure explaining the conventional this crimping | compression-bonding.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 9 show an embodiment of the present invention. FIG. 1 is a schematic diagram of a mounting apparatus, and the mounting apparatus has an apparatus main body B. In this apparatus main body B, the carrying-in part 1, the sticking part 2, the temporary crimping | compression-bonding part 3, the 1st main crimping | compression-bonding part 4, the 2nd final crimping | compression-bonding part 5, and the carrying-out part 6 are set to the X direction shown by the arrow in FIG. It is arranged in a line along. In this embodiment, the adhesive tape 17 and the electronic component P are applied to the substrate W so that the sticking part 2, the temporary pressure bonding part 3, the first main pressure bonding part 4 and the second main pressure bonding part 5 will be described later. A mounting means for mounting is configured.

  In this embodiment, in order to equalize the tact time as described above, two main press-bonding portions are provided, the first main press-bonding portion 4 performs short-side main press-bonding, and the second main press-bonding portion 5. In this case, the main crimping of the long side is performed.

  2 and 3, the direction orthogonal to the X direction is the Y direction. Although not shown in the figure, the direction orthogonal to the horizontal plane formed by the X direction and the Y direction is defined as the Z direction, and the rotation direction about the Z axis is defined as the θ direction.

  As shown in FIG. 2, the carry-in unit 1 has a pair of carry-in tables 8. The pair of carry-in tables 8 are spaced apart from each other at a predetermined interval with respect to the X direction, and a pair of carry-in tables of the carry-in unit 1 is loaded with two substrates W by a delivery robot (not shown) from a supply unit (not shown). 8 is supplied.

  The substrate W is a rectangular glass substrate used for a liquid crystal display device, for example, and has two sides, a long side (source side) and a short side (grid side) adjacent to the long side, as will be described later. An electronic component P such as an IC is mounted as described later.

  The board | substrate W supplied to the said table 8 for carrying in is supplied to the said sticking part 2 by the 1st delivery apparatus 9 as a 1st supply means. As shown in FIG. 4, the first delivery device 9 includes a drive body 12 that is driven in the X, Y, and Z directions by an XYZ drive source 11. At one end and the other end in the longitudinal direction of the lower surface of the driving body 12, a pair of suction portions 13a and 13b for sucking and holding the substrates W spaced at a predetermined interval in the X direction are provided. A suction pad 14 for sucking and holding the upper surface of the substrate W is provided on the lower surfaces of the suction portions 13a and 13b.

  The distance between the pair of suction portions 13 a and 13 b is set corresponding to the distance between the two substrates W supplied to the pair of loading tables 8 of the loading portion 1.

  Accordingly, the first delivery device 9 can simultaneously suck the two substrates W supplied to the loading table 8 of the loading portion 1 by the pair of first suction portions 13a and 13b. ing.

  Then, the distance between the pair of sticking tables 15a and 15b waiting at the standby position R1 of the sticking part 2 shown in FIG. 2 is the same as the distance between the two substrates W supplied to the carry-in table 8. Is set.

  When the first delivery device 9 sucks the two substrates W of the carry-in unit 1, it is driven in the + X direction. And the two board | substrates W which each adsorption | suction part 13a, 13b adsorb | sucked is supplied to said pair of sticking table 15a, 15b which waits in standby position R1 of the said sticking part 2. FIG.

  The suction portions 13a and 13b are fixedly provided with respect to the drive body 12. However, a structure that can be positioned and adjusted at least in the X direction of the X direction and the Y direction may be used. By doing so, even if a space | interval of a pair of carrying-in table 8 and a pair of sticking tables 15a and 15b differs, the said board | substrate W of the carrying-in part 1 corresponding to the space | interval is attached to the said sticking part. 2 can be reliably supplied.

  As described above, the pair of sticking tables 15a and 15b are positioned at the standby position R1 of the sticking part 2. The pair of sticking tables 15a and 15b are formed in a square shape in plan view, and can be driven in the X, Y, Z, and θ directions, respectively. In the θ direction, the center of the square is driven as the center of rotation.

  And as shown in FIG.2 and FIG.6 (a), as shown in FIG. 2 and FIG. 6 (a), a pair of said sticking tables 15a and 15b which stand by in the standby position R1 of the said sticking part 2 are the said carrying-in part 1. The pair of substrates W adsorbed from the pair of carry-in tables 8 is based on one corner C1 located on the + X direction side and the + Y direction side of the four corners of the attaching table 15 as a reference. The long side and the short side on which the electronic component P is mounted are supplied in a state of protruding outward from the side of the sticking table 15.

In this embodiment, as shown in FIG. 2, the substrate W is supplied so that the long side protrudes from the + Y direction side of the sticking table 15 and the short side protrudes from the + X direction side.
Note that the protruding dimensions of the long side and the short side that each substrate W protrudes from the side edge of the loading table 8 are set so that the distance to the mounting position of each side is the same.

  The pair of sticking tables 15a and 15b supplied with the substrate W on the upper surface is driven in the + Y direction in the sticking part 2 as shown by an arrow in FIG. 2, and first of the sticking tables 15a and 15b. The long sides of the pair of substrates W protruding from the side sides are positioned so as to face the sticking head 16 respectively.

  The said sticking head 16 is arrange | positioned in the X direction at the one end part of the + Y direction of the said sticking part 2, and the long side of each board | substrate W positioned as shown to FIG.6 (b), (c) and A plurality of adhesive tapes 17 each made of ACF cut to a predetermined length are attached to the short sides.

  That is, the sticking head 16 has a pressurizing tool (not shown) driven in the Z direction, and the pressurizing tool is driven downward in the Z direction, so that it is cut into a predetermined length and formed on the lower surface. The upper surface of a release tape (not shown) to which the adhesive tape 17 is attached is pressurized. Accordingly, a plurality of adhesive tapes 17 corresponding to the number of electronic components P mounted on the long side of the substrate W are attached to the long side of the substrate W at predetermined intervals.

  FIG. 6A shows a state in which the substrate W is supplied to the pair of attachment tables 15a and 15b positioned at the standby position R1 with reference to one corner C1 of each attachment table 15a and 15b. .

  In FIG. 6B, a pair of sticking tables 15a and 15b are driven in the + Y direction from the standby position R1, and after the long side of the substrate W is positioned with respect to the sticking head 16, a plurality of the sticking tables 15a and 15b are arranged on the long side. In this embodiment, a state in which three adhesive tapes 17 cut to a predetermined length are attached is shown.

  When the adhesive tape 17 is stuck to the long side of the substrate W by the sticking head 16, the pair of sticking tables 15 are below the sticking head 16, with the center of the square as the center of rotation in FIG. It is rotated 90 degrees counterclockwise as indicated by the arrow in b). A state in which the pair of pasting tables 15 is rotated by 90 degrees is shown in FIG.

  The distance between the substrate W and the mounting position along the long side and the short side on which the electronic component P is mounted is based on one corner C1 of the sticking table 15. Since the sticking table 15 is held so as to protrude outward from the side of the sticking table 15 so as to be the same in the X and Y directions from the rotation center, the sticking table 15 is rotated around the center of the square as shown in FIG. 6), the short side of the substrate W is as shown in FIG. 6C with respect to the X direction along the longitudinal direction of the sticking head 16. Although the position shifts in the −X direction indicated by the arrow, the position does not shift with respect to the Y direction.

  Therefore, after positioning the long side of the substrate W with respect to the sticking head 16, in order to position the short side with respect to the sticking head 16, the pair of sticking tables 15 are counterclockwise 90. Therefore, the positioning of the short side of the substrate W with respect to the sticking head 16 can be performed quickly and accurately.

  In this way, when the short side of the substrate W is positioned with respect to the sticking head 16, two adhesive tapes 17 cut to a predetermined length are attached to the short side, like the long side. Will be.

  When sticking the adhesive tape 17 on the long side and the short side of the substrate W, the lower surface of the side portion of the substrate W protruding outward from the sticking tables 15a and 15b is supported by a backup tool (not shown). The

  When the substrate W is rotated 90 degrees counterclockwise and the position is shifted in the −X direction, the short side of the substrate W is not deviated from the attachment position of the adhesive tape 17 by the attachment head 16. The application range in the X direction of the sticking head 16 is made sufficiently long.

  Accordingly, after the substrate W is rotated 90 degrees counterclockwise, the adhesive tape 17 can be attached to the short side of the substrate W without positioning in the X direction with respect to the attaching head 16. it can. Of course, the sticking head 16 or the pair of sticking tables 15 may be positioned in the X direction. In this case, the application range of the sticking head 16 can be reduced.

  Further, the number of pressure tools for attaching the adhesive tape 17 to the substrate W may be a plurality corresponding to the number of adhesive tapes 17 to be attached, or one, and the substrate W is moved in the X direction. You may make it stick the some adhesive tape 17 one by one, making it go.

  Thus, when the some adhesive tape 17 is affixed on the long side and the short side of the board | substrate W, respectively, as shown by the arrow in FIG.6 (c), a pair of adhesion | attachment tables 15a and 15b are what was just before. Rotate 90 degrees clockwise, which is the opposite direction. At the same time, the pair of sticking tables 15a and 15b are driven in the -Y direction and positioned at the standby position R1 of the sticking part 2 as shown in FIG.

  When the adhesive tape 17 is stuck to the substrate W and the pair of sticking tables 15a and 15b return to the standby position R1 of the sticking part 2, the second delivery device 19 as a second supply means having a configuration to be described later. Thus, the upper surface of the substrate W held on the pair of sticking tables 15a and 15b is adsorbed.

  At the same time, the second delivery device 19 has an upper surface of the substrate W held on a pair of temporary crimping tables 21a and 21b that waits at a standby position R2 of the temporary crimping portion 3 shown in FIG. To adsorb. The temporary press bonding tables 21 a and 21 b are formed in a square shape like the sticking table 15.

  As shown in FIG. 5, the second delivery device 19 includes a drive body 42 that is driven in the X, Y, and Z directions by an X, Y, and Z drive source 41. The drive body 42 has a length approximately twice as long as the drive body 12 of the first delivery device 9.

  Two pairs of first suction portions 43a and 43b are provided on one end side of the drive body 42, and second pair of second suction portions 44a and 44b are also provided on the other end side. It has been. A suction pad 45 for sucking the upper surface of the substrate W is provided on the lower surface of each suction portion 43a, 43b and 44a, 44b.

  The second delivery device 19 is positioned above the substrate W held by the pair of sticking tables 15a and 15b in which the pair of first suction parts 43a stands by at the standby position R1 of the sticking part 2. The pair of second suction portions 44a and 44b are positioned above the substrate W held by the pair of temporary crimping tables 21a and 21b waiting at the standby position R2 of the temporary crimping portion 3.

  In FIG. 2, the second delivery device 19 is in a position deviated in the −Y direction from the standby positions R <b> 1 and R <b> 2 of the sticking unit 2 and the temporary crimping unit 3. Waiting at. The same applies to the first and third transfer devices 9 and 27 described later.

  Next, the second delivery device 19 is driven downward in the Z direction, and the substrates on the upper surfaces of the pair of sticking tables 15a and 15b that wait at the standby position R1 of the sticking part 2 by the first suction parts 43a and 43b. W is adsorbed, and the substrates W on the upper surfaces of the pair of temporary crimping tables 21a and 21b waiting at the standby position R2 of the temporary crimping portion 3 are sucked by the second suction portions 44a and 44b.

  After the second delivery device 19 that sucks the substrates W at the standby positions R1 and R2 of the sticking portion 2 and the temporary pressure bonding portion 3 is driven upward in the Z direction, the first suction portions 43a and 43b are The pair of temporary crimping tables 21a and 21b at the standby position R2 of the temporary crimping portion 3 is positioned above the pair of temporary crimping tables 21a and 21b, so that the second suction portions 44a and 44b are in the standby position R3 (see FIG. 3)), and is driven to + X so as to be positioned above the pair of first final press-bonding tables 22a and 22b.

  The second delivery device 19 waits for a pair of substrates W adsorbed by the first adsorbing portions 43a and 43b at the standby position R2 of the temporary adhering portion 3 as shown in FIG. Of the four corners of the tables 21a and 21b, the long side and the short side to which the adhesive tape 17 is attached with reference to one corner C2 positioned closest to the + X direction and the + Y direction, that is, the electrons The long side and the short side on which the component P is mounted are supplied in a state of protruding outward from the side sides of the temporary crimping tables 21a and 21b in the same manner as in the pasting.

  At the same time, the two electronic parts P, which are adsorbed by the second adsorbing portions 44a, 44b from the pair of temporary adhering tables 21a, 21b waiting at the standby position R2 of the temporary press bonding portion 3, are temporarily bonded. The substrate W is supplied to a pair of first final press-bonding tables 22a and 22b that are opposed to each other at a standby position R3 of the first main press-bonding portion 4 and are spaced apart at a predetermined interval in the X direction.

  That is, as shown in FIG. 3, the supply of the substrate W to one of the main pressure bonding tables 22a is located at the most −X direction side and + Y direction side of the four corners of the main pressure bonding table 22a. The long side and the short side on which the electronic component P is temporarily press-bonded with reference to one corner C3a on the side facing the other first main press-bonding table 22b It is carried out in a state of protruding outward.

  Supply of the substrate W to the other main press bonding table 22b is located on the + X direction side and the + Y direction side of the four corners of the main press bonding table 22b, and is opposed to the one main press bonding table 22a. The long side where the electronic component P is not temporarily crimped and the short side where the electronic component P is temporarily crimped are outward from the side of the main crimping table 22 with respect to one corner C3b on the side to be It is performed in a protruding state.

At this time, the protruding amount by which the long side where the electronic component P is not temporarily bonded is also set so that the distance to the position corresponding to the mounting position is the same as that of the short side from the rotation center.
The provisional pressure bonding of the electronic component P to the substrate W is performed as described later.

  As shown in FIG. 7A, when the substrate W is supplied to the pair of temporary pressure bonding tables 21a and 21b waiting at the standby position R2 of the temporary pressure bonding portion 3 as described above, the pair of temporary pressure bonding tables. 21a and 21b are driven in the + Y direction indicated by an arrow in FIG. 2, and the long side to which the adhesive tape 17 of the substrate W is attached is temporarily crimped to the electronic component P as shown in FIG. 7B. The head 23 is positioned so as to face the lower side.

  Next, a temporary crimping tool (not shown) provided on the temporary crimping head 23 and attracting the electronic component P at the lower end was driven downward in the Z direction, and the adhesive tape 17 on the long side of the substrate W was adhered. The electronic component P is temporarily pressure-bonded to the place. This state is shown in FIG.

  When the electronic component P is temporarily pressure-bonded to the long side of the substrate W, the pair of temporary pressure-bonding tables 21a and 21b are rotated 90 degrees counterclockwise as indicated by arrows in FIG. Accordingly, as shown in FIG. 7C, the substrate W is positioned so that the short side is parallel to the X direction.

  At this time, the short side of the substrate W is not displaced with respect to the temporary crimping head 23 with respect to the Y direction as in the case where the short side of the substrate W is rotated by 90 degrees with the sticking part 2. At the same position. Therefore, after the pair of temporary crimping tables 21a and 21b are rotated by 90 degrees, a temporary crimping tool (not shown) provided in the temporary crimping head 23 is driven downward in the Z direction. The electronic component P adsorbed by the temporary crimping tool is temporarily crimped to the short side of the substrate W as shown in FIG.

  When the electronic component P is temporarily crimped to the long side and the short side of the substrate W, the lower surface of the side portion to which the electronic component P of the substrate W is temporarily crimped is supported by a backup tool (not shown).

  Thus, when the electronic component P is temporarily press-bonded to the short side of the substrate W, the pair of temporary press-bonding tables 21a and 21b are driven in the -Y direction, and the standby position R2 as shown in FIG. I will go back and wait.

  After the electronic component P is temporarily crimped to the long side of the substrate W, even if the temporary crimping tables 21a and 21b are rotated 90 degrees in order to temporarily crimp the electronic component P to the short side, the position of the short side in the Y direction Does not shift with respect to the temporary press-bonding head 23. Therefore, the electronic component P can be temporarily bonded to the short side without repositioning the substrate W in the Y direction with respect to the temporary bonding head 23.

  That is, after the electronic component P is temporarily bonded to the long side of the substrate W, the electronic component P can be temporarily bonded to the short side of the substrate W simply by rotating the pair of temporary bonding tables 21a and 21b by 90 degrees. Therefore, compared with the case where the pair of temporary crimping tables 21a and 21b are driven in the X and Y directions and the short side of the substrate W is positioned with respect to the temporary crimping head 23, the temporary crimping operation of the electronic component P is performed. It becomes possible to carry out quickly and easily.

  In addition, by rotating the pair of temporary press-bonding tables 21a and 21b by 90 degrees, the short side of the substrate W does not shift in the Y direction, but shifts in the X direction. However, if the provisional pressure bonding head 23 is set to an applicable range that can accommodate the substrate W whose position is shifted with respect to the X direction, the substrate W is rotated and then positioned in the X direction without being positioned. An electronic component can be temporarily bonded to the short side.

  That is, after the electronic component P is temporarily crimped to the long side of the substrate W and rotated 90 degrees, the electronic component P is not aligned with the short side without adjusting the positioning of the substrate W in both the X and Y directions. Temporary pressure bonding can be performed. Of course, the provisional pressure bonding head 23 or the pair of provisional pressure bonding tables 21 may be positioned in the X direction. In this case, the application range of the temporary crimping head 23 can be reduced.

  As described above, the substrate W on which the electronic component P is temporarily crimped to the long side and the short side in the temporary crimping portion 3 is placed in the standby position of the first final crimping portion 4 by the second delivery device 19 as described above. With reference to one corner C3a, C3b on the opposite side of the pair of first main crimping tables 22a, 22b positioned with R3 facing one side away from the X direction at a predetermined interval. Supplied.

  That is, as shown in FIG. 3 and FIG. 8A, among the pair of first final press-bonding tables 22a and 22b that stand by at the standby position R3 of the first main press-bonding portion 4, they are positioned on the + X direction side. The main press-bonding table 22a is supplied with the short side and the long side on which the electronic component P is temporarily press-bonded protruding in the + Y direction and the −X direction, respectively.

  For the other final crimping table 22b located on the −X direction side, the long side where the electronic component P is not temporarily crimped is projected in the + X direction, and the short side where the electronic component P is provisionally crimped is the + Y direction. It is supplied with protruding.

  Thereby, the long side where the electronic component P of one substrate W is temporarily press-bonded to the side between the opposing side edges of the pair of first main press-bonding tables 22a and 22b positioned to face each other. The other side of the electronic component of the substrate W is supplied so that the long side that is not temporarily bonded is projected.

  The pair of substrates W waiting at the standby position R2 of the temporary crimping portion 3 and the pair of substrates W waiting at the standby position R3 of the first main crimping portion 4 have the same distance along the X direction. The distance between the pair of first main press bonding tables 22a and 22b that are waiting at the standby position R3 of the first main press bonding portion 4 is set.

  As shown in FIG. 8B, the pair of first main press bonding tables 22a and 22b supplied with the substrate W is temporarily bonded to the electronic component P of one substrate W as shown in FIG. 8B. The driven long side is driven in the + Y direction while being driven in the −X direction and the + X direction so that the long side to which the electronic component P of the other substrate W is not temporarily bonded is approached.

  Then, the short side of each substrate W that protrudes outward (+ Y direction side) from the side in the + Y direction of each of the first main pressure bonding tables 22a and 22b is the first mounting shown in FIG. 8B. Positioned in a line along the X direction below the first main pressure bonding head 25 as a means.

  The first main pressure bonding head 25 has an application range in which a plurality of electronic components P temporarily bonded to the short sides of the pair of substrates W can be mounted. That is, the range corresponds to the short side of the maximum size substrate W to be applied. For the sake of explanation, FIG. 8B shows the main pressure-bonding head 25 in such a length that a total of four electronic components P are mounted on the short side.

  And if a pair of board | substrate W is positioned with respect to the said 1st main crimping | compression-bonding head 25, the pressurization tool which is not illustrated will be driven in a descent | fall direction. At the same time, the lower surface of the substrate W is supported by a backup tool (not shown). As a result, the electronic components P temporarily bonded to the short sides of the pair of substrates W are respectively pressure bonded.

  When the electronic component P on the short side of the pair of substrates W is finally press-bonded, one first main-bonding table 22a located on the + X direction side is rotated 90 degrees in the clockwise direction indicated by an arrow in FIG. Is done. As a result, the orientation of the long side of one substrate W is changed so as to be parallel to the X direction, and at the same time, the first main press-bonding table 22a has the first main press-bonding as shown in FIG. The drive positioning is performed up to the standby position R3 of the unit 4.

  On the other hand, the other first main press-bonding table 22b is driven and positioned to the standby position R3 with the orientation of the substrate W being the same as that during the main press-bonding, that is, with the short side parallel to the X direction. The

  The pair of substrates W positioned at the standby position R3 of the first main crimping section 4 is adsorbed by the third delivery device 27 as the third supply means shown in FIG. 5 is supplied to a pair of second final press-bonding tables 28a and 28b that wait at a standby position R4. Since the third delivery device 27 has the same configuration as the second delivery device 19, the same parts are denoted by the same reference symbols and description thereof is omitted.

  At this time, as shown in FIG. 3 and FIG. 9A, one substrate W is placed on the second main pressure bonding table 28a with respect to one second main pressure bonding table 28a located on the + X direction side. Based on one corner C4a located in the −X direction and the + Y direction, the long side on which the electronic component P is temporarily crimped is protruded from the side located in the + Y direction of the second final crimping table 28a. The short side on which the electronic component P is not mounted is supplied by protruding outward from the side located on the −X direction side.

  With respect to the other second final press-bonding table 28b, the other substrate W is an electronic component with reference to one corner C4b positioned in the −X direction and the + Y direction of the second final press-bonding table 28a. The long side to which P is temporarily press-bonded protrudes from the side located in the −X direction of the second final crimping table 28b, and the short side on which the electronic component P is mounted is from the side located on the + Y direction side. Supplied protruding outward.

  When the substrate W is supplied to the pair of second final crimping tables 28a, 28b, the other second final crimping table 28b is rotated 90 degrees clockwise as indicated by an arrow in FIG. The

  As a result, the substrate W supplied to the upper surfaces of the pair of second final press-bonding tables 28a and 28b has a long side to which the electronic component P is temporarily press-bonded with respect to the X direction as shown in FIG. 9B. Become parallel. That is, the orientation of the long side of the other substrate W is changed so that the long sides of the pair of substrates W are arranged in a line along the X direction.

  That is, the two substrates W are temporarily bonded to the electronic component P of the one substrate W on the side between the opposing sides of the pair of first main pressure bonding tables 28a and 28b that are positioned to face each other. The short side that is not formed and the short side on which the electronic component of the other substrate W is mounted are positioned so as to protrude.

  At the same time, the pair of second final press-bonding tables 28a and 28b are driven in the + Y direction as indicated by arrows in FIG. 3, and the pair of second main press-bonding tables 28a and 28b are supplied to the pair of substrates W. As shown in FIG. 9B, the long side is positioned in a row so as to face the lower side of the second main crimping head 31 as the second mounting means.

  The second main press-bonding head 31 has an application range in which a plurality of electronic components P temporarily bonded to the long sides of the pair of substrates W can be mounted. That is, the range corresponds to the long side of the maximum size substrate W to be applied. For the sake of explanation, in FIG. 9B, the second main press-bonding heads 31 are shown in such a length that a total of six electronic components P can be mounted on the long sides of the two substrates W positioned in a row. Yes.

  When the pair of substrates W is positioned below the second main press-bonding head 31, the pressing tool descends toward the pair of substrates W. At the same time, the lower surface of the substrate W is supported by a backup tool (not shown). As a result, a total of six electronic components P temporarily bonded to the upper surfaces of the long sides of the pair of substrates W are simultaneously finally bonded.

  When the electronic component P temporarily bonded to the long side of the substrate W is finally bonded by the second final pressing portion 5, the pair of second final pressing tables 28a and 28b do not change the orientation of the substrate W. Driven in the -Y direction while widening the interval with respect to the X direction, the pair of substrates W are positioned at the standby position R4 of the second main crimping portion 5. This state is shown in FIG.

  The substrate W on the pair of second final press-bonding tables 28a, 28b positioned at the standby position R4 of the second final press-bonding part 5 is the second suction parts 44a, 44b of the third delivery device 27. And are supplied to a pair of unloading tables 29 that stand by at the unloading unit 6.

  That is, in the third delivery device 27, the electronic component P is finally crimped to the short side of the first main crimping portion 4 by the first suction portions 43a and 43b, and the first main crimping portion 4 is on standby. The pair of substrates W positioned at the position R3 are sucked and supplied to the pair of second final press-bonding tables 28a and 28b that wait at the standby position R4 of the second main press-bonding portion 5.

  At the same time, the second adsorbing portions 44a and 44b of the third delivery device 27 are subjected to the final compression bonding of the electronic component P on the long side by the second final compression bonding portion 5 and the second final compression bonding portion 5. The pair of substrates W positioned at the standby position R4 is sucked, and the substrates W are supplied to the pair of unloading tables 29 waiting at the unloading unit 6.

  On the other hand, a pair of tables 15a, 15b, 21a, 21b, 22a, 22b and 28a provided in the sticking part 2, the provisional pressure bonding part 3, the first main pressure bonding part 4 and the second main pressure bonding part 5, 28b, the sticking head 16, the temporary pressure bonding head 23, the first main pressure bonding head 25, the second main pressure bonding head 31, and the first to third delivery devices 9, 19, and 27 are shown in FIG. The operation is controlled by a control device 47 as control means.

  Accordingly, as described above, in the sticking portion 2, the provisional pressure bonding portion 3, the first main pressure bonding portion 4 and the second main pressure bonding portion 5, each pair of tables 15a, 15b, 21a, 21b, 22a, 22b and 28a is provided. 28b, the substrate W is supplied to the supplied substrate W, and the adhesive tape 17 is attached to the supplied substrate W, and the electronic component P is temporarily bonded and permanently bonded as described above.

  Since the number of electronic components P mounted on the long side and the short side varies depending on the size change of the substrate W, it is provided in the main crimping heads 25 and 31 of the first and second final crimping portions 4 and 5. The number of pressurizing tools to be used is not limited to four or six, but the number corresponding to the number of electronic components P mounted on the short side and the long side of the substrate W of the maximum size is provided. Depending on the size, a required number of pressing tools may be operated.

  Moreover, the structure which mounts the several electronic component P by providing one pressurization tool to the main-bonding heads 25 and 31 so that a movement is possible, and driving the pressurization tool to a some mounting position sequentially may be sufficient.

  Furthermore, the structure which mounts the some electronic component P with one pressurization tool may be sufficient.

  By doing so, even if the size of the substrate W is changed and the number of electronic components P mounted on the short side and the long side is changed, the change can be dealt with.

  The first to third delivery devices 9, 19, and 27 are driven in synchronization with the X direction when the substrate W is supplied and conveyed. Accordingly, the first to third transfer devices 9, 19, and 27 are driven in the X direction without interfering with each other. In addition, the tact time can be shortened by driving in synchronization.

  The first to third delivery devices 9, 19, and 27 may be integrally formed. Further, the configuration of the first to third delivery devices 9, 19, and 27 may be a rail, a belt conveyor, a SCARA type robot, or the like.

  According to the mounting apparatus having the above-described configuration, in the first main press-bonding portion 4, the short sides on which the electronic components P of the pair of substrates W are temporarily press-bonded are arranged in a row so as to be parallel to the X direction, and the pair of first A pair of long sides where the electronic component P of one substrate W is temporarily bonded to the main bonding tables 22a and 22b and a long side where the electronic component P of the other substrate W is not temporarily bonded are spaced apart from each other. It protrudes to the side between the first main pressure bonding tables 22a and 22b so as to face each other, and the short sides of the pair of substrates W are positioned so as to be aligned with the first main pressure bonding head 25. .

  Therefore, since the electronic component P temporarily bonded to the short sides of the two substrates W can be simultaneously bonded, the final bonding of the electronic components P to the short sides of the two substrates W is performed one by one. Productivity can be improved compared with the case where it carries out.

  Further, when the electronic parts P temporarily bonded to the short sides of the pair of substrates W are finally bonded, when the short sides of the pair of substrates W are aligned in a row along the X direction, d1 in FIG. The facing interval between the long sides of the pair of substrates W shown can be made sufficiently small.

  Thereby, the length dimension along the X direction formed by the short sides of the pair of substrates W indicated by D1 in FIG. 8B is sufficient without being affected by the pair of first main pressure bonding tables 22a and 22b. Can be made smaller.

  That is, the dimension D1 can be slightly larger than or substantially equal to the length of the two short sides of the two substrates W. Therefore, the length dimension along the X direction of the first main press-bonding head 25 that performs the main press-bonding of the electronic component P to the short sides of the pair of substrates W is sufficiently reduced, and The width dimension along the X direction can be reduced. That is, it is possible to reduce the size in the X direction of the apparatus main body B of the mounting apparatus.

  In the second final press-bonding portion 5, the long side where the electronic components P of the pair of substrates W are temporarily press-bonded is arranged in a row so as to be parallel to the X direction, and with respect to the pair of second final press-bonding tables 28a and 28b. The short side where the electronic component P of the pair of substrates W is not temporarily press-bonded and the short side where the electronic component P is mounted are on the side between the pair of second final press-bonding tables 28a and 28b. The long sides of the pair of substrates W are aligned and supplied to the pair of second main press-bonding heads 31 so as to protrude and face each other.

  Therefore, the electronic components P temporarily bonded to the long sides of the pair of substrates W can be simultaneously pressed together, so that the productivity is higher than when the electronic components P are mounted on the long sides for each substrate W. Can be done.

  In addition, the pair of second main crimping tables 28a and 28b face the short side where the electronic component P of one substrate W is not temporarily bonded and the short side where the electronic component of the other substrate W is mounted. It protrudes from the side. Therefore, when the electronic components P having the long sides of the pair of substrates W are finally press-bonded, when the long sides of the pair of substrates W are aligned in a row with respect to the X direction, the facing distance between the short sides of the pair of substrates W is sufficient. Can be made smaller.

  Accordingly, the distance between the short sides of the pair of substrates W indicated by d2 in FIG. 9B can be made sufficiently small, so that in the X direction formed by the long sides of the pair of substrates W indicated by D2 in FIG. The length dimension along can be made sufficiently small without being affected by the pair of second final press bonding tables 28a, 28b. That is, the length of the two long sides of the two substrates W can be made almost equal to or slightly larger.

  As a result, since the length dimension along the X direction of the second main press-bonding head 31 for main-bonding the electronic component P to the long sides of the pair of substrates W can be reduced, the second book is correspondingly reduced. The width dimension along the X direction of the crimping part 5 can be reduced. That is, it is possible to reduce the size in the X direction of the apparatus main body B of the mounting apparatus.

  That is, according to the mounting apparatus having the above-described configuration, the book of the electronic component P with respect to the short side and the long side of the two substrates W in the first main crimping unit 4 and the second main crimping unit 5, respectively. Since crimping can be performed at the same time, productivity can be improved.

  In addition, the length dimension along the X direction of the two substrates W can be made substantially the same as the dimension formed by the short sides of the two substrates W or the dimension formed by the long sides. That is, the long side or the short side of the two substrates W can be positioned close to each other without being affected by the size of the first and second main press bonding tables 22a, 22b, 28a, 28b. Therefore, it is possible to reduce the size of the first and second main pressure bonding heads 25 and 31 for final pressure bonding the electronic component P to each side of the substrate W.

  In the above-described embodiment, the first and second main pressure bonding portions bring the opposing sides of the two substrates supplied to the main pressure bonding table closer together, and the electronic component is placed on the side adjacent to the side. Although mounted, such a method can also be applied to a sticking part and a temporary pressure bonding part.

  In addition, after the adhesive tape is attached to the substrate in the attaching part, the substrate is rotated 90 degrees and then supplied to the temporary pressure bonding part, but the substrate with the adhesive tape attached is rotated 90 degrees. However, it may be supplied to the provisional pressure bonding part. In that case, it is only necessary to mount the electronic component on the short side of the substrate after mounting the electronic component on the short side.

  Further, the shape of the table used in each of the carry-in part, the sticking part, the temporary pressure-bonding part, the first and second main pressure-bonding parts, and the carry-out part is not limited to a square, but a polygon such as a circle, a triangle, or a pentagon. In short, the distance from the center of rotation to the working part on the long side and the short side of the substrate when rotated 90 degrees in the adhering part, the temporary pressure bonding part and the first and second main pressure bonding parts. However, any shape can be used as long as the substrate can be held in a wide range.

  The order of operations performed on the substrate in the adhering portion, the temporary pressure bonding portion, and the first and second main pressure bonding portions may be performed from either the short side or the long side.

  DESCRIPTION OF SYMBOLS 1 ... Carry-in part, 2 ... Adhering part, 3 ... Temporary press-bonding part, 4 ... 1st main press-bonding part, 5 ... 2nd main press-bonding part, 6 ... Unloading part, 8 ... Loading table, 9 ... 1st Transfer device, 15a, 15b ... sticking table, 16 ... sticking head, 17 ... adhesive tape, 19 ... second transfer device, 21a, 21b ... temporary crimping table, 22a, 22b ... first primary crimping Table, 23... Temporary press-bonding head, 25... First main press-bonding head, 27... Third transfer device, 28 a, 28 b ... Second final press-bonding table, 29 ... Unloading table, 31. Main pressure bonding head 47... Control device (control means).

Claims (5)

A mounting method for mounting an electronic component on two adjacent sides of a rectangular substrate,
A supplying step of supplying two substrates to two tables respectively;
A mounting step of mounting electronic components on the two supplied substrates,
In the supplying step, the substrates are supplied by projecting to the side between the two tables positioned to face each other,
At this time, two adjacent sides on which the electronic component is mounted are projected and supplied to one table, and the other table is adjacent to the side on which the electronic component is mounted and the side. The side where the electronic component is not mounted is projected and supplied,
In the mounting process, the electronic components are mounted on two substrates at the same time by positioning the sides on which the electronic components are mounted on the respective substrates protruding from the respective tables in a row. Implementation method. A mounting device for mounting electronic components on two adjacent sides of a rectangular substrate,
Two tables supplied with the substrate;
Supply means for supplying a substrate to the table;
Mounting means for mounting the electronic component on the supplied substrate;
When each of the two substrates is supplied to the two tables, the substrates are supplied to protrude between the two tables positioned so as to face each other,
At this time, two adjacent sides on which the electronic component is mounted are projected on one table, the side on which the electronic component is mounted on the other table, and the side on which the electronic component adjacent to the side is not mounted Controlling the supply means so that the sides are projected and supplied;
An electronic component mounting apparatus comprising: a control unit that controls the mounting unit so that the electronic component is mounted on a side of each substrate protruding from each table. The mounting means includes an adhesive portion that adheres an adhesive tape to two sides on which the electronic components of the substrate are mounted;
A temporary pressure-bonding portion that temporarily pressure-bonds the electronic component to the side of the substrate on which the adhesive tape is attached;
3. The electronic component mounting apparatus according to claim 2, wherein the electronic component mounting device comprises: a main press-bonding portion that press-bonds the electronic component temporarily press-bonded to the side portion of the substrate.   4. The electronic component mounting apparatus according to claim 3, wherein two tables are arranged on each of the adhering portion, the temporary pressure bonding portion, and the main pressure bonding portion of the mounting means.   2. A delivery means for simultaneously supplying and unloading two substrates to and from each of the two tables of the adhering portion, the temporary pressure-bonding portion, and the main pressure-bonding portion of the mounting means. 4. The electronic component mounting apparatus according to 4.

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