WO2013141388A1 - Device and method for mounting electronic component - Google Patents

Device and method for mounting electronic component Download PDF

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Publication number
WO2013141388A1
WO2013141388A1 PCT/JP2013/058436 JP2013058436W WO2013141388A1 WO 2013141388 A1 WO2013141388 A1 WO 2013141388A1 JP 2013058436 W JP2013058436 W JP 2013058436W WO 2013141388 A1 WO2013141388 A1 WO 2013141388A1
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WO
WIPO (PCT)
Prior art keywords
substrate
stage
electronic component
mounting
side portion
Prior art date
Application number
PCT/JP2013/058436
Other languages
French (fr)
Japanese (ja)
Inventor
光弘 岡澤
Original Assignee
芝浦メカトロニクス株式会社
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Filing date
Publication date
Application filed by 芝浦メカトロニクス株式会社 filed Critical 芝浦メカトロニクス株式会社
Publication of WO2013141388A1 publication Critical patent/WO2013141388A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a mounting apparatus and mounting method for a mounted member that mounts an electronic component as a mounted member, such as a TCP (Tape Carrier Package), on a substrate such as a glass panel used in a liquid crystal display device.
  • a mounted member that mounts an electronic component as a mounted member, such as a TCP (Tape Carrier Package), on a substrate such as a glass panel used in a liquid crystal display device.
  • TCP Transmission Carrier Package
  • a mounting device for mounting an electronic component such as TCP as a member to be mounted on a substrate such as a glass panel is used (for example, Japanese Patent No. 4579658).
  • Electronic components are often mounted on two or three sides of the four sides of the substrate except at least one side.
  • the mounting apparatus has a mounting stage on which the substrate is supplied and mounted.
  • the stage has a mounting surface having a smaller area than the planar shape of the substrate, and the substrate is supplied and mounted on the mounting surface. At that time, the substrate is positioned and held by causing the peripheral portion on which the electronic component is mounted to protrude outward from the periphery of the mounting surface of the stage.
  • a tape-like anisotropic conductive member having adhesiveness is attached to the side on which the electronic component of the substrate is mounted.
  • the temporarily pressure-bonded electronic components are pressure-heated and finally bonded to the substrate. Done.
  • the stage is rotated by 180 degrees, the other side part facing the one side of the two substrates is positioned with respect to the mounting means, and then electronic components are simultaneously mounted on the side part.
  • each board when mounting electronic components on one side of the board, the position of the other side of each board must be corrected separately, for example, each board may be displaced on the stage. If this is not the case, the two substrates may not be positioned separately and accurately with respect to the mounting means.
  • an object of the present invention is to provide an electronic component mounting apparatus and mounting method that can shorten the waiting time and can mount electronic components by separately correcting the positions of two substrates.
  • the substrate when an electronic component is mounted on one side of the substrate held by the carrying-in means on one side of the stage, the substrate is transferred to the upper surface of the stage, and then the stage is moved to 180 degrees.
  • the electronic component is mounted on the other side portion of the substrate by rotating it at the same time, and at the same time, one side portion of the new substrate sucked and held on the upper surface of the loading means is positioned on the other side portion of the stage.
  • the electronic parts are mounted on one side.
  • the substrate can be unloaded from the stage and a new substrate can be supplied by the loading means. Since it can be performed one by one at a time, the time required for substrate transfer and unloading can be shortened and productivity can be improved as compared with the case where two substrates are transferred and unloaded from the stage.
  • each substrate when electronic components are mounted on two substrates, one substrate is sucked and held by the loading means, and the other substrate is sucked and held by the stage. Positioning can be performed independently by the stage. That is, even when electronic components are mounted simultaneously on the side portions of two substrates, each substrate can be precisely positioned with respect to the mounting means.
  • FIG. 1 is a plan view showing a schematic configuration of a mounting apparatus according to an embodiment of the present invention.
  • FIG. 2 is a front view showing a structure for attaching a pressurizing tool at the crimping portion.
  • FIG. 3 is a side view showing a pressure tool and a backup tool in the crimping part.
  • FIG. 4 is a control system diagram of the mounting apparatus.
  • FIG. 5 is an explanatory view when one side portion of the substrate supplied to the one side portion of the stage by the carry-in arm is positioned on the backup tool, and the electronic component on the one side portion is finally crimped.
  • FIG. 5 is an explanatory view when one side portion of the substrate supplied to the one side portion of the stage by the carry-in arm is positioned on the backup tool, and the electronic component on the one side portion is finally crimped.
  • FIG. 6 is an explanatory diagram when the electronic component is finally pressure-bonded to one side of the substrate at one side of the stage, and then the stage is retracted in the ⁇ Y direction and then rotated 180 degrees.
  • the stage rotated 180 degrees is driven in the + Y direction, the other side of the substrate on one side of the stage is positioned on the backup tool, and then placed on the other side of the stage by the loading arm.
  • the stage 1 is driven by a first X, Y, Z, and ⁇ driving source 2 in the horizontal direction, the vertical direction, and a rotational direction centered on a direction orthogonal to the horizontal direction.
  • the horizontal directions are the X direction and the Y direction as indicated by arrows in FIG. 1, and each direction has a + direction and a ⁇ direction.
  • a holding portion 3 having a planar H shape is projected on the upper surface of the stage 1.
  • the upper surface of the holding portion 3 is formed as a flat surface, and a plurality of suction holes 4 are formed in the upper surface.
  • a suction pump (not shown) is connected to the suction hole 4 via a tube (not shown). Thereby, a suction force can be generated in the suction hole 4.
  • a control valve (not shown) is provided between the suction hole 4 and the suction pump.
  • the suction holes 4 are divided into two groups of one end and the other end in the width direction of the stage 1, and the suction holes 4 of each group are controlled by a control device 13 to be described later.
  • a suction force can be generated or stopped for each group.
  • Two substrates W can be placed side by side on the upper surface of the stage 1 as indicated by a chain line in FIG. 1, and each substrate W is held by the suction force generated in the suction hole 4. 3 is adsorbed and held on the upper surface of 3.
  • the substrate W has a rectangular shape, and in this embodiment, among the pair of opposing short sides and the pair of long sides, the electronic component P as a mounted component such as TCP is provided on each of the pair of short sides in this embodiment. It is temporarily pressure-bonded by an anisotropic conductive tape (not shown).
  • the substrate W is transferred to the stage 1 by a loading arm 6 as loading means.
  • the carry-in arm 6 is formed in a comb-like shape having a pair of recesses 7 in a planar shape, and a plurality of suction holes 8 are formed on the upper surface of the portion that becomes each tooth.
  • the suction hole 8 is connected to a suction pump (not shown) via a tube (not shown) so that a suction force is generated.
  • the carry-in arm 6 is driven in a horizontal direction, a vertical direction, and a rotational direction by a second X, Y, Z, and ⁇ drive source 9, and has a pair of sides facing each other as described above.
  • the substrate W on which the electronic component P is temporarily press-bonded on the side is supplied and placed by a robot (not shown).
  • the substrate W supplied to the upper surface of the carry-in arm 6 is attracted and held by the suction force generated in the suction hole 8 and then is transferred to the Y direction before being transferred to one side of the holding unit 3 of the stage 1.
  • Alignment marks (not shown) provided at both ends of one side portion located on the + Y direction side of the pair of side portions to be arranged are spaced apart at a predetermined interval in the X direction. Images are taken by a pair of first imaging cameras 11 as first imaging means. The first imaging camera 11 can image the substrate W from the upper side or the lower side.
  • the image pickup signal of the first image pickup camera 11 is processed by the image processing unit 12 and converted into a digital signal, and then output to the control device 13.
  • the control device 13 is provided with an arithmetic processing unit 14 for processing a digital signal from the image processing unit 12.
  • the arithmetic processing unit 14 processes the imaging signal from the first imaging camera 11 so that the X and Y coordinates of the substrate W sucked and held on the upper surface of the loading arm 6 and the horizontal rotation of the substrate W are obtained.
  • the angle ⁇ is calculated.
  • the calculation result of the arithmetic processing unit 14 is output to the output unit 15.
  • the output unit 15 outputs a drive signal for driving the carry-in arm 6 to the second X, Y, Z, ⁇ drive source 9 based on the calculation result in the arithmetic processing unit 14. That is, on the + Y direction side of the stage 1, as shown in FIGS. 1 and 3, the crimping portion 17 constituting the mounting means is arranged, and the first imaging of the substrate W held by the carry-in arm 6. One side portion imaged by the camera 11 is positioned with respect to a backup tool 21 described later of the crimping portion 17.
  • the crimping portion 17 has a length that can support the side portions of the two substrates W held side by side with the holding portion 3 of the stage 1, and the upper side of the backup tool 21. And a pair of pressure tools 22 each having a length corresponding to the side portion of one substrate W and having a built-in heater 22a.
  • each pressing tool 22 is driven in the vertical direction by a first Z driving source 23 such as a cylinder.
  • the pair of Z drive sources 23 are provided on the lower surface of the horizontal portion of the movable body 24 whose side surface has an L shape.
  • the movable body 24 is provided by movably engaging a receiving portion 25 provided on the back surface of the vertical portion with a pair of guide rails 27 provided on the front surface of the support body 26 along the vertical direction.
  • the receiving portion 25 and the guide rail 27 are dovetail coupled so that their engagement is not released.
  • a second Z drive source 28 such as a motor is provided at the upper end of the support 26.
  • the second Z drive source 28 is configured to rotationally drive the screw shaft 29, and the screw shaft 29 is provided on the back surface of the movable body 24 and is therefore screwed into the screw body 31.
  • the pressing tool 22 is driven in a descending direction from above the backup tool 21, that is, in an up-and-down direction indicated by Z in FIG.
  • the pressurizing tool 22 is driven in a descending direction as will be described later, the upper surface of the side portion where the electronic component P of the substrate W positioned on the backup tool 21 is temporarily pressed is heated.
  • the electronic component P is finally pressure-bonded.
  • the pressure tool 22 is lowered by the first Z drive source 28 to a position in contact with or approaching the electronic component P temporarily bonded to the substrate W positioned on the backup tool 21, and then the first tool.
  • the Z driving source 23 applies pressure to pressurize the electronic component P.
  • the carry-in arm 6 When one side of the substrate W sucked and held on the upper surface of the carry-in arm 6 is imaged by the pair of first imaging cameras 11, the carry-in arm 6 is based on the imaging signal of the first imaging camera 11. It is positioned with respect to the crimping part 17.
  • the carry-in arm 6 receives the substrate W on the upper surface by a robot (not shown), and then is driven in the + X direction as shown in FIG. Positioning is performed so that the lower surface of one side portion to which the electronic component P of the substrate W held by suction on the upper surface is temporarily bonded is supported by the upper end surface of the crimping portion 17 on the one end portion side in the longitudinal direction of the backup tool 21. That is, the height of the stage 1 and the carry-in arm 6 is controlled so that the substrate W has the same height as the upper surface of the upper surface of one side in the width direction of the stage 1.
  • the movable body 24 of the crimping part 17 is moved. After being lowered to a predetermined height by the second Z drive source 28, one pressure tool 22 located above one end of the backup tool 21 among the pair of pressure tools 22 is the first pressure tool 22. Driven in the downward direction by the Z drive source 23. Thereby, the electronic component P temporarily press-bonded to one side portion of the substrate W is pressurized and heated and finally pressed.
  • the pressing tool 22 is configured to be driven in the vertical direction by the first Z driving source 23.
  • the pressing tool 22 is held at a predetermined lowered position, and the second Z
  • the pressing tool 22 may be driven in the vertical direction by the driving source 28 to pressurize the electronic component P temporarily bonded to the substrate W.
  • the pressure applied by the second Z drive source 28 is set smaller than the pressure applied by the first Z drive source 23, the thickness of the substrate W placed on the stage 1 becomes thicker. It is possible to prevent the substrate W from being pressurized and damaged.
  • the pressing tool 22 by dividing the pressing tool 22 into two, even when the substrate W is held only on one end side on the stage 1, the electrons provided on the substrate W by the pressing tool 22 are provided.
  • pressurizing the component P it is possible to prevent a moment in the rotational direction from being applied to the movable body 24 provided with the pressurizing tool 22.
  • the substrate W can be uniformly pressed by the pressing tool 22, the mounting accuracy can be improved.
  • the suction state of the substrate W by the carry-in arm 6 is released, and at the same time, the group of the one side portion side of the stage 1 is released. A suction force is generated in the suction hole 4. Thereby, the substrate W is transferred from the carry-in arm 6 to the upper surface of one side of the stage 1. That is, it is sucked and held on the upper surface of one side of the stage 1.
  • the carry-in arm 6 moves backward in the ⁇ X direction, which is a direction away from the upper surface of the stage 1, and a new substrate W is delivered to the upper surface from a robot (not shown).
  • the substrate W is sucked and held.
  • the stage 1 When the carry-in arm 6 moves backward in the ⁇ X direction, the stage 1 is driven in the upward direction, and then is driven a predetermined distance in the ⁇ Y direction as shown in FIG. 6 and then rotated 180 degrees in the direction indicated by the arrow ⁇ . Be made. That is, the stage 1 is rotated 180 degrees after being retracted to a position where it does not interfere with the backup tool 21.
  • FIG. 6 shows the stage 1 rotated 180 degrees.
  • the other side part to which the electronic component P of the substrate W sucked and held on the upper surface of the one side part of the stage 1 is temporarily crimped is positioned on the crimping part 17 side.
  • both ends in the longitudinal direction of the other side portion of the substrate W on the stage 1 are paired with the pair of second imaging cameras.
  • the second imaging camera 33 may image the other side of the substrate W from above. Thereby, it is possible to prevent the movement of the stage 1 from being obstructed.
  • the pair of second imaging cameras 33 captures alignment marks (not shown) provided at both ends along the X direction of the other side of the substrate W, and the imaging signals are as shown in FIG.
  • the image is output to the image processing unit 12.
  • the imaging signal processed into a digital signal by the image processing unit 12 is output to the arithmetic processing unit 14 of the control device 13 where the position of the other side portion of the substrate W is calculated.
  • the stage 1 positions the other side portion of the substrate W based on the calculation result of the control device 13. That is, as shown in FIG. 7, the substrate W is positioned such that the lower surface of the other side is supported on the upper surface of the other end in the longitudinal direction of the backup tool 21.
  • the other side portion of the substrate W (this substrate is referred to as Wa in FIG. 7) on which the electronic component P on one side portion is held by suction and held on one side portion of the stage 1 is positioned.
  • the carry-in arm 6 holding the new substrate W (this substrate is Wb in FIG. 7) on the upper surface is driven in the direction indicated by + X in FIG.
  • the backup tool 21 Positioned to be supported on the upper surface of one end in the longitudinal direction.
  • the electronic component temporarily bonded to the other side portion of the substrate Wa sucked and held on one side portion of the stage 1 and the one side portion of the substrate Wb sucked and held on the upper surface of the carry-in arm 6. P is finally pressure-bonded at the same time.
  • the other side of the substrate W sucked and held on the upper surface of one side of the stage 1 and the one side of the substrate W sucked and held on the upper surface of the loading arm 6 are temporarily mounted.
  • the substrate Wa adsorbed and held on the upper surface of one side of the stage 1 that is, the substrate Wa to which the electronic components P on a pair of side sides facing each other are pressure-bonded is obtained.
  • the sheet is unloaded from the upper surface of the stage 1 by a unloading arm 35 (shown in FIG. 1) as unloading means.
  • the carry-out arm 35 is formed in a comb-like shape having a plurality of recesses 36, like the carry-in arm 6, and a plurality of suction holes 37 are formed on the upper surface of the portions to be a plurality of teeth. An opening is formed.
  • the suction hole 37 is connected to a suction pump (both not shown) via a tube.
  • the carry-out arm 35 is driven by a third X, Y, Z, and ⁇ drive source 38 in the horizontal direction, the vertical direction, and the rotational direction.
  • the first to third X, Y, Z, and ⁇ drive sources 2, 9, and 38 and the first and second Z drive sources 23 and 28 are driven by the control device 13 as shown in FIG. To be controlled.
  • the carry-out arm 35 is shown by -X in FIG. Driven in the direction shown. As a result, the carry-out arm 35 moves upward by entering the lower surface side of the substrate Wa held by the holding portion 3 at the tooth portion where the suction hole 37 is formed.
  • the carry-out arm 35 may be configured to suck and carry the upper surface of the substrate W.
  • the suction holding of the substrate W by the carry-in arm 6 is released, and the substrate W is sucked and held by the holding portion 3 on the upper surface of the other side portion of the stage 1. That is, the substrate W is transferred from the carry-in arm 6 to the stage 1.
  • FIG. 8 shows a state before the stage 1 is rotated 180 degrees.
  • the stage 1 rotates 180 degrees, as shown in FIG. 6, the other side portion of the substrate W sucked and held on the upper surface of the other side portion of the stage 1 is imaged by a pair of second imaging cameras 33. .
  • the stage 1 is driven by the control device 13 based on the imaging signal, and the other side portion of the substrate W sucked and held on the upper surface of the other side portion of the stage 1 is the backup tool 21 of the crimping portion 17. Positioned relative to the end and supported on its upper surface.
  • a new substrate W (Wb) sucked and held on the upper surface of the carry-in arm 6 is supplied to the upper surface of one side portion of the stage 1, and one side portion thereof is paired with a pair. Based on the imaging signal of the first imaging camera 11, positioning is performed so as to be positioned on one end of the backup tool 21.
  • the electronic component P temporarily bonded to the two side portions as described above is finally pressure-bonded at the same time, and then the pair of side portion electrons.
  • the operation of carrying out the substrate W on which the component P is finally bonded is repeatedly performed.
  • the substrate W is first sucked and held on the upper surface of the carry-in arm 6. If the electronic component P temporarily bonded to one side of the substrate W is finally bonded, the substrate W is transferred to one side of the holding unit 3 of the stage 1 and sucked and held. Rotate degrees.
  • the substrate W on which the electronic components P on the pair of side sides facing each other are finally bonded is carried out by the carry-out arm 35, the substrate W sucked and held by the carry-in arm 6 is transferred to the other side portion of the stage 1.
  • the stage 1 is rotated 180 degrees, and the other side of the substrate W sucked and held on the other side of the stage 1 and the upper surface of one side of the stage 1 by the carry-in arm 6 are transferred.
  • the electronic component P temporarily bonded to one side portion of the substrate W that has been positioned is finally pressure bonded.
  • the final press-bonding of the electronic component P that has been temporarily press-bonded can be performed on the two substrates W at the same time, so that productivity can be improved.
  • the supply and unloading of the substrate W with respect to the stage 1 can be performed simultaneously by the loading arm 6 and the unloading arm 35 one by one. Therefore, the time required for loading and unloading is shortened compared to the conventional method of loading and unloading the substrate W from the stage 1, that is, the conventional method of loading and unloading the substrate W separately. However, productivity can be improved.
  • the two substrates W can be positioned independently by the carry-in arm 6 and the stage 1 driven in the X, Y, Z, and ⁇ directions. That is, even when the electronic component P is simultaneously mounted on the side portions of the two substrates W, each substrate W can be precisely positioned with respect to the backup tool 21 of the crimping portion 17. Become.
  • the stage 1 is provided with a holding portion 3 having a suction hole 8 for adsorbing and holding the substrate W formed on the upper surface thereof, while supplying and unloading the substrate W to and from the holding portion 3.
  • the carry-in arm 6 and the carry-out arm 35 have a comb-like shape having the concave portions 7 and 36 into which the holding unit 3 enters.
  • the substrate W attracted and held by the carry-in arm 6 can be carried by the carry-in arm 6 to a position facing the upper surface of the holding unit 3, the substrate is transferred from the carry-in arm 6 to the holding unit 3. Delivery can be performed reliably.
  • the electronic component P on one side is finally pressure-bonded by being sucked and held by the carry-in arm 6, the electronic component P on the other side is finally pressure-bonded by being transferred to the holding portion 3. Since the unloading arm 35 can be made to enter the lower surface side of the substrate W, the unloading of the substrate W from the holding unit 3 can also be performed reliably.
  • the backup tool 21 of the crimping portion 17 has a length dimension that can support the side portions of the two substrates W at the same time, and is temporarily bonded to the upper surface of the substrate W whose lower surface is supported by the backup tool 21.
  • the crimping unit 17 drives the one pressurizing tool 22 to perform final crimping of the electronic component P temporarily bonded to one substrate W.
  • the two pressure tools 22 can be driven and the electronic component P temporarily bonded to the two substrates W can be finally bonded.
  • the stage 1 is rotated. Therefore, after mounting the electronic component P on one side of the substrate W, the productivity can be improved as compared with the case where the electronic component P is mounted on the other side by changing the orientation by holding the substrate W with an arm or the like.
  • the case where the electronic component temporarily bonded to the pair of side portions (short sides) facing the substrate is described as an example, but the pair of side sides facing the substrate is exemplified.
  • the electronic component is finally pressure-bonded to the three side portions of the portion and one of the remaining two side portions.
  • the electronic component is temporarily crimped to the three side sides of the substrate, and the electronic component temporarily crimped to the two side sides facing each other by the mounting apparatus described above is finally crimped, and then the substrate is fixed to the long side. What is necessary is just to carry out the main crimping
  • the delivery of the board to the stage by the carry-in arm is made so that the adsorption of the board by the carry-in arm is released after the electronic components are mounted on the board.
  • the adsorption of the substrate may be released. By doing so, it is possible to further reduce the tact time.
  • the position of the substrate may be recognized while the substrate on the stage is being permanently bonded. By doing so, it becomes possible to quickly supply the next substrate to the stage, which can also reduce the tact time.
  • the stage is driven in the X, Y, Z, and ⁇ directions by the X, Y, Z, and ⁇ drive sources. However, if the backup tool is configured to be driven in the Z direction, the stage is moved in the Z direction. It is good also as a structure driven only in the X, Y, and (theta) directions except for.
  • the present invention can also be applied to the case where the electronic component is temporarily bonded or the anisotropic conductive member is attached to the substrate. That is, the present invention can be applied when mounting a mounted member such as an electronic component or an anisotropic conductive member.
  • the present invention it is possible to improve the productivity by simultaneously mounting electronic components on the side portions of two substrates, reduce the time required to transfer and carry out the substrates, and improve the productivity. Can be improved. Further, even when electronic components are mounted simultaneously on the side portions of two substrates, each substrate can be accurately positioned with respect to the mounting means.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

This invention is provided with: a pressure-bonding part (17) for simultaneously mounting electronic components (P) onto two lateral face parts located in the same direction on two substrates (W) provided next to each other on a stage (1); a loading arm (6) for suction-holding a substrate (W) on the upper surface and positioning one lateral face part of the substrate (W) against the pressure-bonding part (17) on the stage (1) to mount the electronic components (P), and then handing over the substrate (W) to the upper surface on one lateral part of the stage (1); a control device (13) for controlling the position of the loading arm (6) and the stage (1) and mounting the components (P) on the other lateral face part of the substrate (W) fed to and placed on one lateral part of the stage (1) and turned 180° together with the stage (1), whereupon the electronic components (P) are simultaneously mounted on one lateral face part of a new substrate (W) suction-held by the loading arm (6) and positioned on the other lateral part of the stage (1); and an unloading arm (35) for removing, from the stage (1), the substrate (W) that has had electronic components (P) mounted on the pair of lateral face parts.

Description

電子部品の実装装置及び実装方法Electronic component mounting apparatus and mounting method
　この発明はたとえば液晶表示装置に用いられるガラス製のパネルなどの基板に、被実装部材としての電子部品、たとえばＴＣＰ（Tape Carrier Package）などを実装する被実装部材の実装装置及び実装方法に関する。 The present invention relates to a mounting apparatus and mounting method for a mounted member that mounts an electronic component as a mounted member, such as a TCP (Tape Carrier Package), on a substrate such as a glass panel used in a liquid crystal display device.
　たとえば、液晶表示装置を製造する場合、ガラス製のパネルなどの基板に、被実装部材としてしてのＴＣＰなどの電子部品を実装するための実装装置が用いられる（例えば、特許第４５７９６５８号公報）。電子部品は上記基板の４つの辺のうち、少なくとも１つの辺を除く２つ或いは３つの辺に実装されることが多い。 For example, when manufacturing a liquid crystal display device, a mounting device for mounting an electronic component such as TCP as a member to be mounted on a substrate such as a glass panel is used (for example, Japanese Patent No. 4579658). . Electronic components are often mounted on two or three sides of the four sides of the substrate except at least one side.
　上記実装装置は上記基板が供給載置される実装用のステージを有する。このステージは上記基板の平面形状よりも面積の小さな載置面を有し、この載置面に上記基板が供給載置される。その際、上記基板は、上記電子部品が実装される周辺部を上記ステージの載置面の周縁から外方に突出させて位置決め保持される。 The mounting apparatus has a mounting stage on which the substrate is supplied and mounted. The stage has a mounting surface having a smaller area than the planar shape of the substrate, and the substrate is supplied and mounted on the mounting surface. At that time, the substrate is positioned and held by causing the peripheral portion on which the electronic component is mounted to protrude outward from the periphery of the mounting surface of the stage.
　基板をステージに供給載置した後、この基板の電子部品を実装する辺に粘着性を有するテープ状の異方性導電部材が貼着される。ついで、この異方性導電部材が貼着された箇所に複数の上記電子部品を１つずつ仮圧着した後、仮圧着された電子部品を加圧加熱して上記基板に本圧着するということが行われる。 After supplying and mounting the substrate on the stage, a tape-like anisotropic conductive member having adhesiveness is attached to the side on which the electronic component of the substrate is mounted. Next, after temporarily bonding a plurality of the electronic components one by one to the place where the anisotropic conductive member is adhered, the temporarily pressure-bonded electronic components are pressure-heated and finally bonded to the substrate. Done.
　上述した実装工程においては、タクトタイムを短縮して生産性の向上を図ることが要求されている。タクトタイムの短縮を図るために、従来はたとえば上記基板をステージに搬送供給したり、電子部品の実装が終えた基板をステージから搬出するための時間を短縮するということが行われたり、基板への異方性導電部材の供給や仮圧着される電子部品の供給に要する時間を短縮するという改善が行われていた。 In the mounting process described above, it is required to improve the productivity by shortening the tact time. In order to shorten the tact time, conventionally, for example, the above-mentioned substrate is transported and supplied to the stage, or the time for carrying out the mounting of the electronic component from the stage is shortened. Improvements have been made to reduce the time required for supplying the anisotropic conductive member and the electronic component to be temporarily bonded.
　しかしながら、基板の搬送時間の短縮や基板への異方性導電部材や電子部品の供給時間の短縮には限界があるため、組み立て作業全体のタクトタイムを大きく短縮するということが難しかった。 However, since there is a limit to shortening the time for transporting the substrate and the time for supplying the anisotropic conductive member and electronic component to the substrate, it has been difficult to greatly reduce the tact time of the entire assembly operation.
　しかも、基板の複数の辺に電子部品を実装する場合には、基板の一辺に電子部品を実装したならば、この基板を９０度又は１８０度回転させて次の辺に電子部品を実装するということをそれぞれの基板に対して繰り返して行わなければならない。そのため、電子部品を実装する基板の枚数が多くなればなる程、生産性の低下を招くということがあった。 Moreover, when electronic components are mounted on a plurality of sides of the board, if the electronic components are mounted on one side of the board, the board is rotated 90 degrees or 180 degrees to mount the electronic parts on the next side. This must be repeated for each substrate. For this reason, the larger the number of substrates on which electronic components are mounted, the lower the productivity.
　とくに、基板に電子部品を本圧着する場合、異方性導電部材を加圧加熱するために多くの時間が必要となる。しかしながら、異方性導電部材を加圧加熱する時間は異方性導電部材を確実に溶融硬化させなければならないため、短縮することができない。したがって、基板の複数の辺に電子部品を実装する場合にはタクトタイムが大幅に増大するということがある。 In particular, when an electronic component is finally pressure-bonded to a substrate, a lot of time is required to pressurize and heat the anisotropic conductive member. However, the time for pressure-heating the anisotropic conductive member cannot be shortened because the anisotropic conductive member must be surely melted and cured. Therefore, when electronic components are mounted on a plurality of sides of the board, the tact time may be greatly increased.
　そこで、たとえば基板の３つの側辺部に電子部品を実装する場合、まず、ステージに２枚の基板を並べて載置し、これら基板の同一方向に位置する一方の側辺部を実装手段に位置決めした後、この２枚の基板の一方の側辺部に電子部品を同時に実装する。 Therefore, for example, when electronic components are mounted on the three side portions of the substrate, first, two substrates are placed side by side on the stage, and one side portion located in the same direction of these substrates is positioned on the mounting means. After that, an electronic component is simultaneously mounted on one side portion of the two substrates.
　ついで、ステージを１８０度回転させ、２枚の基板の上記一方の側辺に対向する他方の側辺部を上記実装手段に対して位置決めした後、側辺部に電子部品を同時に実装する。 Next, the stage is rotated by 180 degrees, the other side part facing the one side of the two substrates is positioned with respect to the mounting means, and then electronic components are simultaneously mounted on the side part.
　その後、対向する一対の側辺部に電子部品が実装された基板を上記ステージから取り出してつぎの実装装置に供給し、そこで残りの一側部に電子部品を実装するようにしている。 Thereafter, a substrate on which electronic components are mounted on a pair of opposing side portions is taken out of the stage and supplied to the next mounting apparatus, where the electronic components are mounted on the remaining one side portion.
　しかしながら、上述したように２枚の基板をステージ上に並べて載置し、これら基板の一側部に電子部品を同時に実装した後、他方の側辺部に電子部品を同時に実装するようにすると、上記ステージ上で対向する一対の側辺部に電子部品が実装された２枚の基板を搬出した後でないと、つぎに電子部品が実装される新たな基板を上記ステージに受け渡すことができないということがある。 However, as described above, two substrates are placed side by side on the stage, and after electronic components are simultaneously mounted on one side of these substrates, the electronic components are simultaneously mounted on the other side, It is said that a new substrate on which an electronic component is mounted cannot be transferred to the stage without carrying out two substrates on which electronic components are mounted on a pair of side portions facing each other on the stage. Sometimes.
　そのため、上記ステージ上から一対の側辺部に電子部品が実装された２枚の基板を搬出し終わるまでは新たな基板を供給できないから、待ち時間が生じて生産性の低下を招くということがあった。 For this reason, a new substrate cannot be supplied until the two substrates on which electronic components are mounted on the pair of side portions from the stage are completely unloaded, resulting in a waiting time and a decrease in productivity. there were.
　また、ステージに２枚の基板を同時に供給載置し、これら基板の一側部に電子部品を実装した後、他方の側辺部に電子部品を実装するようにすると、２枚の基板の一側部は実装ステージに供給載置するときに撮像カメラの撮像に基づいて個別に位置決めすることができるものの、他側部に電子部品を実装するときには２枚の基板は既にステージに供給載置されているため、これらの基板を別々に位置決めすることができない。 In addition, when two substrates are supplied and placed on the stage at the same time, electronic components are mounted on one side of these substrates, and then electronic components are mounted on the other side, one of the two substrates is mounted. Although the side portions can be individually positioned based on the imaging of the imaging camera when supplied and placed on the mounting stage, when mounting electronic components on the other side portions, the two substrates are already supplied and placed on the stage. Therefore, these substrates cannot be positioned separately.
　そのため、上記基板の一側部に電子部品を実装する際、各基板が上記ステージ上で位置ずれが生じたりするなどして、各基板の他側部の位置をそれぞれ別々に位置補正しなければならない場合、２枚の基板を実装手段に対して別々に精度よく位置決めすることができないということもある。 Therefore, when mounting electronic components on one side of the board, the position of the other side of each board must be corrected separately, for example, each board may be displaced on the stage. If this is not the case, the two substrates may not be positioned separately and accurately with respect to the mounting means.
　この発明は、２枚の基板の側辺部に対して電子部品を同時に実装して生産性の向上を図るとともに、ステージからの基板の搬出と、新たな基板の供給を１枚ずつ行なえるようにすることで、待ち時間を短縮したり、２枚の基板を別々に位置補正して電子部品を実装できるようにした電子部品の実装装置及び実装方法を提供することにある。 According to the present invention, electronic components are simultaneously mounted on the side portions of two substrates to improve productivity, and the substrate can be unloaded from the stage and a new substrate can be supplied one by one. Thus, an object of the present invention is to provide an electronic component mounting apparatus and mounting method that can shorten the waiting time and can mount electronic components by separately correcting the positions of two substrates.
　この発明によれば、ステージの一側部上で搬入手段によって保持された基板の一方の側辺部に電子部品を実装したならば、その基板を上記ステージの上面に受け渡した後、ステージを１８０度回転させて上記基板の他方の側辺部に電子部品を実装すると同時に、上記搬入手段の上面に吸着保持された新たな基板の一方の側辺部を上記ステージの他側部上で位置決めし、その一側部に電子部品を実装するようにした。 According to the present invention, when an electronic component is mounted on one side of the substrate held by the carrying-in means on one side of the stage, the substrate is transferred to the upper surface of the stage, and then the stage is moved to 180 degrees. The electronic component is mounted on the other side portion of the substrate by rotating it at the same time, and at the same time, one side portion of the new substrate sucked and held on the upper surface of the loading means is positioned on the other side portion of the stage. The electronic parts are mounted on one side.
　そのため、２枚の基板の側辺部に対して電子部品を同時に実装して生産性の向上を図ることができるばかりか、ステージからの基板の搬出と、上記搬入手段による新たな基板の供給を１枚ずつ同時に行なえるから、上記ステージに対する基板の受け渡しと搬出を２枚ずつ行なう場合に比べ、基板の受け渡しと搬出に要する時間を短縮し、生産性を向上させることができる。 Therefore, not only can the electronic components be mounted on the sides of the two substrates at the same time to improve productivity, but the substrate can be unloaded from the stage and a new substrate can be supplied by the loading means. Since it can be performed one by one at a time, the time required for substrate transfer and unloading can be shortened and productivity can be improved as compared with the case where two substrates are transferred and unloaded from the stage.
　しかも、２枚の基板に対して電子部品を実装するとき、一方の基板は搬入手段に吸着保持され、他方の基板はステージに吸着保持されているから、２枚の基板を上記搬入手段と上記ステージとによって独立して位置決めすることが可能となる。つまり、２枚の基板の側辺部に対して同時に電子部品を実装する場合であっても、各基板をそれぞれ実装手段に対して精密に位置決めすることが可能となる。 Moreover, when electronic components are mounted on two substrates, one substrate is sucked and held by the loading means, and the other substrate is sucked and held by the stage. Positioning can be performed independently by the stage. That is, even when electronic components are mounted simultaneously on the side portions of two substrates, each substrate can be precisely positioned with respect to the mounting means.
図１は、この発明の一実施の形態の実装装置の概略的構成を示す平面図である。FIG. 1 is a plan view showing a schematic configuration of a mounting apparatus according to an embodiment of the present invention. 図２は、圧着部の加圧ツールの取り付け構造を示す正面図である。FIG. 2 is a front view showing a structure for attaching a pressurizing tool at the crimping portion. 図３は、圧着部の加圧ツールとバックアップツールを示す側面図である。FIG. 3 is a side view showing a pressure tool and a backup tool in the crimping part. 図４は、実装装置の制御系統図である。FIG. 4 is a control system diagram of the mounting apparatus. 図５は、ステージの一側部に搬入アームによって供給された基板の一方の側辺部をバックアップツール上に位置決めし、その一側部の電子部品を本圧着するときの説明図である。FIG. 5 is an explanatory view when one side portion of the substrate supplied to the one side portion of the stage by the carry-in arm is positioned on the backup tool, and the electronic component on the one side portion is finally crimped. 図６は、ステージの一側部で基板の一方の側辺部に電子部品を本圧着した後、上記ステージを－Ｙ方向に後退させてから１８０度回転させたときの説明図である。FIG. 6 is an explanatory diagram when the electronic component is finally pressure-bonded to one side of the substrate at one side of the stage, and then the stage is retracted in the −Y direction and then rotated 180 degrees. 図７は、１８０度回転させたステージを＋Ｙ方向へ駆動し、ステージの一側部の基板の他方の側辺部をバックアップツール上に位置決めした後、上記ステージの他側部に搬入アームによってつぎの基板を供給して上記バックアップツール上に位置決めしてから、２枚の基板の側辺部の電子部品を同時に本圧着するときの説明図である。In FIG. 7, the stage rotated 180 degrees is driven in the + Y direction, the other side of the substrate on one side of the stage is positioned on the backup tool, and then placed on the other side of the stage by the loading arm. It is explanatory drawing when carrying out the main press-bonding of the electronic component of the side part of two board | substrates simultaneously after supplying the board | substrate and positioning on the said backup tool. 図８は、２枚の基板の側辺部の電子部品が本圧着された後、搬入アームを－Ｘ方向に後退させてから、ステージを－Ｙ方向に後退させ、ステージの一側部の基板が搬出アームによって搬出されたときの説明図である。FIG. 8 shows the substrate on one side of the stage after the electronic parts on the side portions of the two substrates are finally pressure-bonded and then the carrying arm is retracted in the −X direction and then the stage is retracted in the −Y direction. It is explanatory drawing when is carried out by the carrying-out arm.
　以下、この発明の一実施の形態を図面を参照しながら説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
　図１に示す実装装置はステージ１を有する。このステージ１は第１のＸ・Ｙ・Ｚ・θ駆動源２によって水平方向、上下方向、及び水平方向と直交する方向を中心とする回転方向に対して駆動されるようになっている。なお、水平方向は図１に矢印で示すようにＸ方向とＹ方向であって、各方向は＋方向と－方向を有する。 The mounting apparatus shown in FIG. The stage 1 is driven by a first X, Y, Z, and θ driving source 2 in the horizontal direction, the vertical direction, and a rotational direction centered on a direction orthogonal to the horizontal direction. The horizontal directions are the X direction and the Y direction as indicated by arrows in FIG. 1, and each direction has a + direction and a − direction.
　上記ステージ１の上面には平面形状がＨ形状の保持部３が突設されている。この保持部３の上面は平坦面に形成されていて、その上面には複数の吸引孔４が開口形成されている。この吸引孔４には、図示しない吸引ポンプが同じく図示しないチューブを介して接続されている。それによって、上記吸引孔４に吸引力を生じさせることができるようになっている。 A holding portion 3 having a planar H shape is projected on the upper surface of the stage 1. The upper surface of the holding portion 3 is formed as a flat surface, and a plurality of suction holes 4 are formed in the upper surface. A suction pump (not shown) is connected to the suction hole 4 via a tube (not shown). Thereby, a suction force can be generated in the suction hole 4.
　なお、上記吸引孔４と上記吸引ポンプとの間には図示しない制御弁が設けられている。上記吸引孔４は上記ステージ１の幅方向一端部と他端部の２つのグループに分けられていて、各グループの吸引孔４は上記制御弁が後述する制御装置１３によって制御されることで、各グループ毎に吸引力を発生させたり、停止させることができるようになっている。 A control valve (not shown) is provided between the suction hole 4 and the suction pump. The suction holes 4 are divided into two groups of one end and the other end in the width direction of the stage 1, and the suction holes 4 of each group are controlled by a control device 13 to be described later. A suction force can be generated or stopped for each group.
　上記ステージ１の上面には図１に鎖線で示すように２枚の基板Ｗを並べて載置することができるようになっていて、各基板Ｗは上記吸引孔４に生じる吸引力で上記保持部３の上面に吸着保持されるようになっている。 Two substrates W can be placed side by side on the upper surface of the stage 1 as indicated by a chain line in FIG. 1, and each substrate W is held by the suction force generated in the suction hole 4. 3 is adsorbed and held on the upper surface of 3.
　なお、上記基板Ｗは矩形状をなしていて、対向する一対の短辺と一対の長辺のうち、この実施の形態では一対の短辺にそれぞれＴＣＰなどの被実装部品としての電子部品Ｐが図示しない異方性導電テープによって仮圧着されている。 The substrate W has a rectangular shape, and in this embodiment, among the pair of opposing short sides and the pair of long sides, the electronic component P as a mounted component such as TCP is provided on each of the pair of short sides in this embodiment. It is temporarily pressure-bonded by an anisotropic conductive tape (not shown).
　上記基板Ｗは上記ステージ１に搬入手段としての搬入アーム６によって受け渡されるようになっている。この搬入アーム６は平面形状が一対の凹部７を有する櫛歯状に形成されていて、各歯となる部分の上面には複数の吸引孔８が開口形成されている。この吸引孔８は図示しない吸引ポンプに同じく図示しないチューブを介して接続されていて、吸引力が生じるようになっている。 The substrate W is transferred to the stage 1 by a loading arm 6 as loading means. The carry-in arm 6 is formed in a comb-like shape having a pair of recesses 7 in a planar shape, and a plurality of suction holes 8 are formed on the upper surface of the portion that becomes each tooth. The suction hole 8 is connected to a suction pump (not shown) via a tube (not shown) so that a suction force is generated.
　上記搬入アーム６は第２のＸ・Ｙ・Ｚ・θ駆動源９によって水平方向、上下方向及び回転方向に駆動されるようになっていて、その上面には上述したように対向する一対の側辺に電子部品Ｐが仮圧着された上記基板Ｗが図示しないロボットによって供給載置される。 The carry-in arm 6 is driven in a horizontal direction, a vertical direction, and a rotational direction by a second X, Y, Z, and θ drive source 9, and has a pair of sides facing each other as described above. The substrate W on which the electronic component P is temporarily press-bonded on the side is supplied and placed by a robot (not shown).
　上記搬入アーム６の上面に供給された基板Ｗは上記吸引孔８に生じる吸引力によって吸着保持された後、上記ステージ１の保持部３の一側部に受け渡される前に、Ｙ方向に位置する一対の側辺部のうちの、＋Ｙ方向側に位置する一方の側辺部の両端部に設けられた位置合わせマーク（図示せず）が、Ｘ方向に所定間隔で離間して配置された第１の撮像手段としての一対の第１の撮像カメラ１１によって撮像される。この第１の撮像カメラ１１は上記基板Ｗを上側或いは下側のどちらからでも撮像可能となっている。 The substrate W supplied to the upper surface of the carry-in arm 6 is attracted and held by the suction force generated in the suction hole 8 and then is transferred to the Y direction before being transferred to one side of the holding unit 3 of the stage 1. Alignment marks (not shown) provided at both ends of one side portion located on the + Y direction side of the pair of side portions to be arranged are spaced apart at a predetermined interval in the X direction. Images are taken by a pair of first imaging cameras 11 as first imaging means. The first imaging camera 11 can image the substrate W from the upper side or the lower side.
　図４に示すように、上記第１の撮像カメラ１１の撮像信号は画像処理部１２で処理されてデジタル信号に変換された後、上記制御装置１３に出力される。この制御装置１３には上記画像処理部１２からのデジタル信号を処理する演算処理部１４が設けられている。この演算処理部１４は上記第１の撮像カメラ１１からの撮像信号を処理することで、上記搬入アーム６の上面に吸着保持された基板ＷのＸ、Ｙ座標及び上記基板Ｗの水平方向の回転角度θを算出する。上記演算処理部１４の算出結果は出力部１５に出力される。 As shown in FIG. 4, the image pickup signal of the first image pickup camera 11 is processed by the image processing unit 12 and converted into a digital signal, and then output to the control device 13. The control device 13 is provided with an arithmetic processing unit 14 for processing a digital signal from the image processing unit 12. The arithmetic processing unit 14 processes the imaging signal from the first imaging camera 11 so that the X and Y coordinates of the substrate W sucked and held on the upper surface of the loading arm 6 and the horizontal rotation of the substrate W are obtained. The angle θ is calculated. The calculation result of the arithmetic processing unit 14 is output to the output unit 15.
　上記出力部１５は上記演算処理部１４での算出結果に基づいて上記搬入アーム６を駆動する駆動信号を第２のＸ・Ｙ・Ｚ・θ駆動源９に出力する。すなわち、上記ステージ１の＋Ｙ方向側には図１と図３に示すように実装手段を構成する圧着部１７が配置されていて、上記搬入アーム６に保持された基板Ｗの上記第１の撮像カメラ１１によって撮像された一方の側辺部が上記圧着部１７の後述するバックアップツール２１に対して位置決めされる。 The output unit 15 outputs a drive signal for driving the carry-in arm 6 to the second X, Y, Z, θ drive source 9 based on the calculation result in the arithmetic processing unit 14. That is, on the + Y direction side of the stage 1, as shown in FIGS. 1 and 3, the crimping portion 17 constituting the mounting means is arranged, and the first imaging of the substrate W held by the carry-in arm 6. One side portion imaged by the camera 11 is positioned with respect to a backup tool 21 described later of the crimping portion 17.
　上記圧着部１７は、上記ステージ１の保持部３に並んで保持された２枚の基板Ｗの側辺部を支持することができる長さを有する上記バックアップツール２１と、このバックアップツール２１の上方に対向して配置され１枚の基板Ｗの側辺部に対応する長さ寸法に形成されヒータ２２ａが内蔵された一対の加圧ツール２２によって構成されている。 The crimping portion 17 has a length that can support the side portions of the two substrates W held side by side with the holding portion 3 of the stage 1, and the upper side of the backup tool 21. And a pair of pressure tools 22 each having a length corresponding to the side portion of one substrate W and having a built-in heater 22a.
　図２と図３に示すように、各加圧ツール２２はそれぞれシリンダなどの第１のＺ駆動源２３によって上下方向に駆動されるようになっている。一対のＺ駆動源２３は側面形状がＬ字状をなした可動体２４の水平部分の下面に設けられている。 As shown in FIGS. 2 and 3, each pressing tool 22 is driven in the vertical direction by a first Z driving source 23 such as a cylinder. The pair of Z drive sources 23 are provided on the lower surface of the horizontal portion of the movable body 24 whose side surface has an L shape.
　上記可動体２４は垂直部分の背面に設けられた受け部２５を支持体２６の前面に上下方向に沿って設けられた一対のガイドレール２７に移動可能に係合させて設けられている。なお、上記受け部２５と上記ガイドレール２７とは、これらの係合が外れないようアリ溝結合となっている。 The movable body 24 is provided by movably engaging a receiving portion 25 provided on the back surface of the vertical portion with a pair of guide rails 27 provided on the front surface of the support body 26 along the vertical direction. The receiving portion 25 and the guide rail 27 are dovetail coupled so that their engagement is not released.
　上記支持体２６の上端にはモータなどの第２のＺ駆動源２８が設けられている。この第２のＺ駆動源２８はねじ軸２９を回転駆動するようになっていて、このねじ軸２９は上記可動体２４の背面に設けられためねじ体３１に螺合している。 A second Z drive source 28 such as a motor is provided at the upper end of the support 26. The second Z drive source 28 is configured to rotationally drive the screw shaft 29, and the screw shaft 29 is provided on the back surface of the movable body 24 and is therefore screwed into the screw body 31.
　それによって、上記加圧ツール２２は上記バックアップツール２１の上方から下降方向、つまり図３にＺで示す上下方向に駆動されるようになっている。そして、上記加圧ツール２２は後述するように下降方向に駆動されると、上記バックアップツール２１上に位置決めされた基板Ｗの電子部品Ｐが仮圧着された側辺部の上面を加圧加熱し、上記電子部品Ｐを本圧着するようになっている。 Thereby, the pressing tool 22 is driven in a descending direction from above the backup tool 21, that is, in an up-and-down direction indicated by Z in FIG. When the pressurizing tool 22 is driven in a descending direction as will be described later, the upper surface of the side portion where the electronic component P of the substrate W positioned on the backup tool 21 is temporarily pressed is heated. The electronic component P is finally pressure-bonded.
　なお、上記加圧ツール２２は上記第のＺ駆動源２８によって上記バックアップツール２１上に位置決めされた基板Ｗに仮圧着された電子部品Ｐに接触或いは接近する位置まで下降された後、上記第１のＺ駆動源２３によって上記電子部品Ｐを加圧する加圧力が付与されるようになっている。 The pressure tool 22 is lowered by the first Z drive source 28 to a position in contact with or approaching the electronic component P temporarily bonded to the substrate W positioned on the backup tool 21, and then the first tool. The Z driving source 23 applies pressure to pressurize the electronic component P.
　上記搬入アーム６の上面に吸着保持された基板Ｗの一側部が一対の第１の撮像カメラ１１によって撮像されると、上記搬入アーム６は上記第１の撮像カメラ１１の撮像信号に基づいて上記圧着部１７に対して位置決めされる。 When one side of the substrate W sucked and held on the upper surface of the carry-in arm 6 is imaged by the pair of first imaging cameras 11, the carry-in arm 6 is based on the imaging signal of the first imaging camera 11. It is positioned with respect to the crimping part 17.
　つまり、上記搬入アーム６は図示しないロボットによって上面に基板Ｗを受けた後、図５に示すように＋Ｘ方向に駆動されて一側部が上記第１の撮像カメラ１１で撮像された後、その上面に吸着保持された基板Ｗの電子部品Ｐが仮圧着された一側部の下面が上記圧着部１７のバックアップツール２１の長手方向の一端部側の上端面に支持されるよう位置決めされる。つまり、上記基板Ｗは上記ステージ１の幅方向一側部の上面で、この上面とほぼ同じ高さになるよう、上記ステージ１と上記搬入アーム６の高さが制御される。 That is, the carry-in arm 6 receives the substrate W on the upper surface by a robot (not shown), and then is driven in the + X direction as shown in FIG. Positioning is performed so that the lower surface of one side portion to which the electronic component P of the substrate W held by suction on the upper surface is temporarily bonded is supported by the upper end surface of the crimping portion 17 on the one end portion side in the longitudinal direction of the backup tool 21. That is, the height of the stage 1 and the carry-in arm 6 is controlled so that the substrate W has the same height as the upper surface of the upper surface of one side in the width direction of the stage 1.
　上記搬入アーム６の上面に吸着保持された基板Ｗの電子部品Ｐが仮圧着された一側部がバックアップツール２１の一端部の上端面に支持されると、上記圧着部１７の可動体２４が上記第２のＺ駆動源２８によって所定の高さまで下降された後、一対の加圧ツール２２のうち、上記バックアップツール２１の一端部の上方に位置する一方の加圧ツール２２が上記第１のＺ駆動源２３によって下降方向に駆動される。それによって、上記基板Ｗの一側部に仮圧着された電子部品Ｐが加圧加熱されて本圧着されることになる。 When the one side part on which the electronic component P of the substrate W sucked and held on the upper surface of the carry-in arm 6 is temporarily crimped is supported by the upper end surface of one end of the backup tool 21, the movable body 24 of the crimping part 17 is moved. After being lowered to a predetermined height by the second Z drive source 28, one pressure tool 22 located above one end of the backup tool 21 among the pair of pressure tools 22 is the first pressure tool 22. Driven in the downward direction by the Z drive source 23. Thereby, the electronic component P temporarily press-bonded to one side portion of the substrate W is pressurized and heated and finally pressed.
　上記実施の形態では加圧ツール２２は第１のＺ駆動源２３によって上下方向に駆動される構成であると説明したが、上記加圧ツール２２を所定の下降位置で保持し、第２のＺ駆動源２８によって上記加圧ツール２２を上下方向に駆動して基板Ｗに仮圧着された電子部品Ｐを加圧するようにしてもよい。 In the above embodiment, it has been described that the pressing tool 22 is configured to be driven in the vertical direction by the first Z driving source 23. However, the pressing tool 22 is held at a predetermined lowered position, and the second Z The pressing tool 22 may be driven in the vertical direction by the driving source 28 to pressurize the electronic component P temporarily bonded to the substrate W.
　その場合、第２のＺ駆動源２８による加圧力を第１のＺ駆動源２３による加圧力よりも小さく設定しておけば、ステージ１に載置される基板Ｗの厚さが厚くなった場合、上記基板Ｗを加圧し過ぎて損傷させるのを防止することができる。 In that case, if the pressure applied by the second Z drive source 28 is set smaller than the pressure applied by the first Z drive source 23, the thickness of the substrate W placed on the stage 1 becomes thicker. It is possible to prevent the substrate W from being pressurized and damaged.
　また、加圧ツール２２を２つに分割したことで、ステージ１上の一端部側だけに基板Ｗが保持されている場合であっても、上記加圧ツール２２によって基板Ｗに設けられた電子部品Ｐを加圧するとき、上記加圧ツール２２が設けられた可動体２４に回転方向のモーメントが加わるのを防止できる。 Further, by dividing the pressing tool 22 into two, even when the substrate W is held only on one end side on the stage 1, the electrons provided on the substrate W by the pressing tool 22 are provided. When pressurizing the component P, it is possible to prevent a moment in the rotational direction from being applied to the movable body 24 provided with the pressurizing tool 22.
　それによって、上記加圧ツール２２により基板Ｗを均一に加圧できるから、実装精度を向上させることができる。 Thereby, since the substrate W can be uniformly pressed by the pressing tool 22, the mounting accuracy can be improved.
　上記基板Ｗの一側部に仮圧着された電子部品Ｐが本圧着されると、上記搬入アーム６による基板Ｗの吸着状態が解除されると同時に、上記ステージ１の一側部側のグループの吸引孔４に吸引力が発生する。それによって、上記基板Ｗは上記搬入アーム６から上記ステージ１の一側部上面に受け渡される。つまり、上記ステージ１の一側部上面に吸着保持される。 When the electronic component P temporarily bonded to one side portion of the substrate W is finally bonded, the suction state of the substrate W by the carry-in arm 6 is released, and at the same time, the group of the one side portion side of the stage 1 is released. A suction force is generated in the suction hole 4. Thereby, the substrate W is transferred from the carry-in arm 6 to the upper surface of one side of the stage 1. That is, it is sucked and held on the upper surface of one side of the stage 1.
　基板Ｗがステージ１に受け渡されると、上記搬入アーム６はステージ１の上面から外れる方向である、－Ｘ方向へ後退し、その上面に、図示しないロボットから新たな基板Ｗが受け渡され、その基板Ｗを吸着保持する。 When the substrate W is delivered to the stage 1, the carry-in arm 6 moves backward in the −X direction, which is a direction away from the upper surface of the stage 1, and a new substrate W is delivered to the upper surface from a robot (not shown). The substrate W is sucked and held.
　上記搬入アーム６が－Ｘ方向へ後退すると、上記ステージ１は上昇方向に駆動されてから、図６に示すように－Ｙ方向へ所定距離駆動された後、矢印θで示す方向に１８０度回転させられる。つまり、上記ステージ１は上記バックアップツール２１と干渉しない位置まで後退してから１８０度回転させられることになる。なお、図６はステージ１が１８０度回転した状態を示している。 When the carry-in arm 6 moves backward in the −X direction, the stage 1 is driven in the upward direction, and then is driven a predetermined distance in the −Y direction as shown in FIG. 6 and then rotated 180 degrees in the direction indicated by the arrow θ. Be made. That is, the stage 1 is rotated 180 degrees after being retracted to a position where it does not interfere with the backup tool 21. FIG. 6 shows the stage 1 rotated 180 degrees.
　それによって、上記ステージ１の一側部上面に吸着保持された基板Ｗの電子部品Ｐが仮圧着された他方の側辺部が上記圧着部１７側に位置することになる。 Thereby, the other side part to which the electronic component P of the substrate W sucked and held on the upper surface of the one side part of the stage 1 is temporarily crimped is positioned on the crimping part 17 side.
　上記圧着部１７のバックアップツール２１の長手方向他端部に対向する位置には、図１と図６に示すようにＸ方向に沿って第２の撮像手段としての一対の第２の撮像カメラ３３が配置されている。 A pair of second imaging cameras 33 as second imaging means along the X direction as shown in FIG. 1 and FIG. 6 at a position facing the other end in the longitudinal direction of the backup tool 21 of the crimping portion 17. Is arranged.
　上述したように、上記ステージ１が－Ｙ方向に駆動されてから、１８０度回転すると、ステージ１上の基板Ｗの他方の側辺部の長手方向の両端部が上記一対の第２の撮像カメラ３３の上方に対向位置する。なお、第２の撮像カメラ３３は上方から基板Ｗの他方の側辺部を撮像するようにしてもよい。それによって、ステージ１の移動の邪魔になるのを防止できる。 As described above, when the stage 1 is driven in the −Y direction and then rotated 180 degrees, both ends in the longitudinal direction of the other side portion of the substrate W on the stage 1 are paired with the pair of second imaging cameras. Positioned above 33. Note that the second imaging camera 33 may image the other side of the substrate W from above. Thereby, it is possible to prevent the movement of the stage 1 from being obstructed.
　上記一対の第２の撮像カメラ３３は、上記基板Ｗの他方の側辺部のＸ方向に沿う両端部に設けられた図示しない位置合わせマークを撮像し、その撮像信号を図４に示すように上記画像処理部１２に出力する。この画像処理部１２でデジタル信号に処理された撮像信号は制御装置１３の演算処理部１４に出力され、ここで上記基板Ｗの他方の側辺部の位置が算出される。 The pair of second imaging cameras 33 captures alignment marks (not shown) provided at both ends along the X direction of the other side of the substrate W, and the imaging signals are as shown in FIG. The image is output to the image processing unit 12. The imaging signal processed into a digital signal by the image processing unit 12 is output to the arithmetic processing unit 14 of the control device 13 where the position of the other side portion of the substrate W is calculated.
　上記ステージ１は上記制御装置１３の算出結果に基づいて上記基板Ｗの他方の側辺部を位置決めする。つまり、図７に示すように基板Ｗは他方の側辺部の下面が上記バックアップツール２１の長手方向他端部の上面に支持されるよう位置決めされる。 The stage 1 positions the other side portion of the substrate W based on the calculation result of the control device 13. That is, as shown in FIG. 7, the substrate W is positioned such that the lower surface of the other side is supported on the upper surface of the other end in the longitudinal direction of the backup tool 21.
　上記ステージ１の一側部に吸着保持されて一方の側辺部の電子部品Ｐが本圧着された基板Ｗ（図７ではこの基板をＷａとする。）の他方の側辺部が位置決めされる作業と平行して、新たな基板Ｗ（図７ではこの基板をＷｂとする。）を上面に吸着保持した搬入アーム６が図７に＋Ｘで示す方向に駆動されてくる。 The other side portion of the substrate W (this substrate is referred to as Wa in FIG. 7) on which the electronic component P on one side portion is held by suction and held on one side portion of the stage 1 is positioned. In parallel with the work, the carry-in arm 6 holding the new substrate W (this substrate is Wb in FIG. 7) on the upper surface is driven in the direction indicated by + X in FIG.
　それによって、上記ステージ１の他側部の上面には、上記第１の撮像カメラ１１の撮像に基づいて上記基板Ｗｂの電子部品Ｐが仮圧着された一方の側辺部が上記バックアップツール２１の長手方向一端部の上面に支持されるよう位置決めされる。 Thereby, on the upper surface of the other side portion of the stage 1, one side portion where the electronic component P of the substrate Wb is temporarily press-bonded based on the imaging of the first imaging camera 11 is the backup tool 21. Positioned to be supported on the upper surface of one end in the longitudinal direction.
　上記ステージ１の一側部に吸着保持された基板Ｗａの他方の側辺部と、搬入アーム６の上面に吸着保持され上記ステージ１の他側部の上面で位置決めされた基板Ｗｂの一方の側辺部とが上記圧着部１７のバックアップツール２１の他端部と一端部の上面に位置決め支持されると、一対の加圧ツール２２が同時に下降方向に駆動される。 One side of the substrate Wb sucked and held on the upper surface of the loading arm 6 and positioned on the upper surface of the other side of the stage 1 by the other side of the substrate Wa sucked and held on one side of the stage 1 When the side portion is positioned and supported on the upper surface of the other end portion and one end portion of the backup tool 21 of the crimping portion 17, the pair of pressure tools 22 are simultaneously driven in the downward direction.
　それによって、ステージ１の一側部に吸着保持された基板Ｗａの他方の側辺部と、搬入アーム６の上面に吸着保持された基板Ｗｂの一方の側辺部とに仮圧着された電子部品Ｐが同時に本圧着されることになる。 Accordingly, the electronic component temporarily bonded to the other side portion of the substrate Wa sucked and held on one side portion of the stage 1 and the one side portion of the substrate Wb sucked and held on the upper surface of the carry-in arm 6. P is finally pressure-bonded at the same time.
　このようにして、上記ステージ１の一側部の上面に吸着保持された基板Ｗの他方の側辺部と、搬入アーム６の上面に吸着保持された基板Ｗの一方の側辺部とに仮圧着された電子部品Ｐが本圧着されると、上記ステージ１の一側部の上面に吸着保持された基板Ｗａ、つまり対向する一対の側辺部の電子部品Ｐが本圧着された基板Ｗａは搬出手段としての搬出アーム３５（図１に示す）によって後述するように上記ステージ１の上面から搬出される。 In this manner, the other side of the substrate W sucked and held on the upper surface of one side of the stage 1 and the one side of the substrate W sucked and held on the upper surface of the loading arm 6 are temporarily mounted. When the pressure-bonded electronic component P is finally pressure-bonded, the substrate Wa adsorbed and held on the upper surface of one side of the stage 1, that is, the substrate Wa to which the electronic components P on a pair of side sides facing each other are pressure-bonded is obtained. As will be described later, the sheet is unloaded from the upper surface of the stage 1 by a unloading arm 35 (shown in FIG. 1) as unloading means.
　図１に示すように、上記搬出アーム３５は上記搬入アーム６と同様、複数の凹部３６を有する櫛歯状に形成されていて、複数の歯となる部分の上面には複数の吸引孔３７が開口形成されている。上記吸引孔３７はチューブを介して吸引ポンプ（ともに図示せず）に接続されている。 As shown in FIG. 1, the carry-out arm 35 is formed in a comb-like shape having a plurality of recesses 36, like the carry-in arm 6, and a plurality of suction holes 37 are formed on the upper surface of the portions to be a plurality of teeth. An opening is formed. The suction hole 37 is connected to a suction pump (both not shown) via a tube.
　そして、上記搬出アーム３５は第３のＸ・Ｙ・Ｚ・θ駆動源３８によって水平方向、上下方向及び回転方向に駆動されるようになっている。 The carry-out arm 35 is driven by a third X, Y, Z, and θ drive source 38 in the horizontal direction, the vertical direction, and the rotational direction.
　なお、上記第１乃至第３のＸ・Ｙ・Ｚ・θ駆動源２，９，３８及び第１、第２のＺ駆動源２３，２８は図４に示すように上記制御装置１３によって駆動が制御されるようになっている。 The first to third X, Y, Z, and θ drive sources 2, 9, and 38 and the first and second Z drive sources 23 and 28 are driven by the control device 13 as shown in FIG. To be controlled.
　そして、上記ステージ１の一側部の上面の保持部３に吸着保持された基板Ｗの一対の側辺部の電子部品Ｐが本圧着されると、上記搬出アーム３５は図７に－Ｘで示す方向に駆動される。それによって、上記搬出アーム３５は吸引孔３７が開口形成された歯の部分が保持部３に吸着保持された上記基板Ｗａの下面側に入り込んで上昇する。 When the electronic components P on the pair of side portions of the substrate W held by suction on the holding portion 3 on the upper surface of one side portion of the stage 1 are finally press-bonded, the carry-out arm 35 is shown by -X in FIG. Driven in the direction shown. As a result, the carry-out arm 35 moves upward by entering the lower surface side of the substrate Wa held by the holding portion 3 at the tooth portion where the suction hole 37 is formed.
　上記搬出アーム３５が上昇すると同時に、上記ステージ１の一側部側のグループの吸引孔４の吸引力が消失される。それによって、一対の側辺部に電子部品Ｐが本圧着された基板Ｗａは上記搬出アーム３５に吸着保持されてステージ１から上昇し、次工程へ搬送される。 At the same time as the carry-out arm 35 is raised, the suction force of the suction holes 4 of the group on one side of the stage 1 disappears. As a result, the substrate Wa having the electronic component P finally bonded to the pair of side portions is attracted and held by the carry-out arm 35 and is lifted from the stage 1 and conveyed to the next process.
　なお、上記搬出アーム３５は基板Ｗの上面を吸着して搬送する構成であってもよい。 The carry-out arm 35 may be configured to suck and carry the upper surface of the substrate W.
　上記搬出アーム３５によってステージ１の一側部上面から基板Ｗが搬出されるとき、上記ステージ１の他側部では搬入アーム６による基板Ｗの吸着状態が解除され、上記ステージ１の他側部側のグループの吸引孔４に吸引力が発生する。 When the substrate W is unloaded from the upper surface of one side portion of the stage 1 by the unloading arm 35, the suction state of the substrate W by the loading arm 6 is released at the other side portion of the stage 1, and the other side portion side of the stage 1. A suction force is generated in the suction holes 4 of the groups.
　それによって、上記搬入アーム６による基板Ｗの吸着保持が解除され、その基板Ｗは上記ステージ１の他側部上面の保持部３に吸着保持される。つまり、基板Ｗは搬入アーム６からステージ１に受け渡される。 Thereby, the suction holding of the substrate W by the carry-in arm 6 is released, and the substrate W is sucked and held by the holding portion 3 on the upper surface of the other side portion of the stage 1. That is, the substrate W is transferred from the carry-in arm 6 to the stage 1.
　ついで、上記搬入アーム６が下降してから－Ｘ方向に退避した後、上記ステージ１は図８に矢印で示すようにバックアップツール２１と干渉しない位置まで－Ｙ方向に後退してから矢印θで示す方向へ１８０度回転駆動される。なお、図８はステージ１が１８０度回転する前の状態を示している。 Next, after the carry-in arm 6 is lowered and retracted in the −X direction, the stage 1 is retracted in the −Y direction to a position where it does not interfere with the backup tool 21 as indicated by an arrow in FIG. It is rotated 180 degrees in the direction shown. FIG. 8 shows a state before the stage 1 is rotated 180 degrees.
　上記ステージ１が１８０度回転すると、図６に示すように、上記ステージ１の他側部上面に吸着保持された基板Ｗの他方の側辺部が一対の第２の撮像カメラ３３によって撮像される。 When the stage 1 rotates 180 degrees, as shown in FIG. 6, the other side portion of the substrate W sucked and held on the upper surface of the other side portion of the stage 1 is imaged by a pair of second imaging cameras 33. .
　そして、その撮像信号に基づいて上記ステージ１が制御装置１３によって駆動され、上記ステージ１の他側部上面に吸着保持された基板Ｗの他方の側辺部が圧着部１７のバックアップツール２１の他端部に対して位置決めされ、その上面に支持される。 Then, the stage 1 is driven by the control device 13 based on the imaging signal, and the other side portion of the substrate W sucked and held on the upper surface of the other side portion of the stage 1 is the backup tool 21 of the crimping portion 17. Positioned relative to the end and supported on its upper surface.
　それと同時に、図７に示すように上記搬入アーム６の上面に吸着保持された新たな基板Ｗ（Ｗｂ）が上記ステージ１の一側部の上面に供給され、その一方の側辺部が一対の第１の撮像カメラ１１の撮像信号に基づいて上記バックアップツール２１の一端部上に位置するよう位置決めされる。 At the same time, as shown in FIG. 7, a new substrate W (Wb) sucked and held on the upper surface of the carry-in arm 6 is supplied to the upper surface of one side portion of the stage 1, and one side portion thereof is paired with a pair. Based on the imaging signal of the first imaging camera 11, positioning is performed so as to be positioned on one end of the backup tool 21.
　このようにして、２枚の基板Ｗが位置決めされると、上述したようにこれら２枚の側辺部に仮圧着された電子部品Ｐが同時に本圧着された後、一対の側辺部の電子部品Ｐが本圧着された基板Ｗが搬出されるという作業が繰り返して行なわれることになる。 Thus, when the two substrates W are positioned, the electronic component P temporarily bonded to the two side portions as described above is finally pressure-bonded at the same time, and then the pair of side portion electrons. The operation of carrying out the substrate W on which the component P is finally bonded is repeatedly performed.
　上記構成の実装装置によれば、２枚の基板Ｗの側辺部に仮圧着された電子部品Ｐを本圧着する際、最初に基板Ｗを搬入アーム６の上面に吸着保持した状態で、この基板Ｗの一方の側辺部に仮圧着された電子部品Ｐを本圧着したならば、その基板Ｗをステージ１の保持部３の一側部に受け渡して吸着保持した後、上記ステージ１を１８０度回転させる。 According to the mounting apparatus having the above configuration, when the electronic component P temporarily bonded to the side portions of the two substrates W is finally bonded, the substrate W is first sucked and held on the upper surface of the carry-in arm 6. If the electronic component P temporarily bonded to one side of the substrate W is finally bonded, the substrate W is transferred to one side of the holding unit 3 of the stage 1 and sucked and held. Rotate degrees.
　ついで、搬入アーム６に吸着保持された新たな基板Ｗを、１８０度回転されたステージ１の他側部上で圧着部１７のバックアップツール２１に対して位置決めしたならば、その基板の一方の側辺部と、上記ステージ１の一側部の上面に吸着保持された基板Ｗの他方の側辺部とに仮圧着された電子部品Ｐを同時に本圧着する。 Then, if the new substrate W attracted and held by the carry-in arm 6 is positioned with respect to the backup tool 21 of the crimping portion 17 on the other side portion of the stage 1 rotated 180 degrees, one side of the substrate The electronic component P temporarily bonded to the side portion and the other side portion of the substrate W held by suction on the upper surface of one side portion of the stage 1 is simultaneously press-bonded simultaneously.
　そして、対向する一対の側辺部の電子部品Ｐが本圧着された基板Ｗを搬出アーム３５で搬出したならば、上記搬入アーム６に吸着保持された基板Ｗを上記ステージ１の他側部に受け渡した後、上記ステージ１を１８０度回転させ、このステージ１の他側部に吸着保持された基板Ｗの他方の側辺部と、上記搬入アーム６によって上記ステージ１の一側部の上面に位置決めされた基板Ｗの一方の側辺部とにそれぞれ仮圧着された電子部品Ｐを本圧着するようにしている。 Then, if the substrate W on which the electronic components P on the pair of side sides facing each other are finally bonded is carried out by the carry-out arm 35, the substrate W sucked and held by the carry-in arm 6 is transferred to the other side portion of the stage 1. After the delivery, the stage 1 is rotated 180 degrees, and the other side of the substrate W sucked and held on the other side of the stage 1 and the upper surface of one side of the stage 1 by the carry-in arm 6 are transferred. The electronic component P temporarily bonded to one side portion of the substrate W that has been positioned is finally pressure bonded.
　そのため、仮圧着された電子部品Ｐの本圧着は、２枚の基板Ｗに対して同時に行なうことができるから、生産性の向上を図ることができる。 Therefore, the final press-bonding of the electronic component P that has been temporarily press-bonded can be performed on the two substrates W at the same time, so that productivity can be improved.
　上記ステージ１に対する基板Ｗの供給と搬出を、搬入アーム６と搬出アーム３５とによって１枚ずつ同時に行なうことができる。そのため、ステージ１に対して基板Ｗを搬出してから搬入する従来の方式、つまり基板Ｗの搬入と搬出を別々に行なう従来に比べ、搬入と搬出に要する時間が短縮されるから、そのことによっても生産性の向上を図ることができるということがある。 The supply and unloading of the substrate W with respect to the stage 1 can be performed simultaneously by the loading arm 6 and the unloading arm 35 one by one. Therefore, the time required for loading and unloading is shortened compared to the conventional method of loading and unloading the substrate W from the stage 1, that is, the conventional method of loading and unloading the substrate W separately. However, productivity can be improved.
　２枚の基板Ｗに対して電子部品Ｐを実装するとき、一方の基板Ｗは搬入アーム６に吸着保持され、他方の基板Ｗはステージ１の保持部３に吸着保持されている。そのため、２枚の基板ＷをＸ、Ｙ、Ｚ及びθ方向に駆動される上記搬入アーム６と上記ステージ１とによって独立して位置決めすることが可能となる。つまり、２枚の基板Ｗの側辺部に対して同時に電子部品Ｐを実装する場合であっても、各基板Ｗをそれぞれ圧着部１７のバックアップツール２１に対して精密に位置決めすることが可能となる。 When the electronic component P is mounted on the two substrates W, one substrate W is sucked and held by the carry-in arm 6 and the other substrate W is sucked and held by the holding unit 3 of the stage 1. Therefore, the two substrates W can be positioned independently by the carry-in arm 6 and the stage 1 driven in the X, Y, Z, and θ directions. That is, even when the electronic component P is simultaneously mounted on the side portions of the two substrates W, each substrate W can be precisely positioned with respect to the backup tool 21 of the crimping portion 17. Become.
　したがって、基板Ｗの対向する一対の側辺部に仮圧着された電子部品Ｐの本圧着を精度よく、確実に行なうことができる。 Therefore, it is possible to accurately and surely perform the main press-bonding of the electronic component P temporarily bonded to the pair of opposing side portions of the substrate W.
　上記ステージ１には基板Ｗを吸着保持するための吸引孔８が上面に開口形成された保持部３を突設する一方、この保持部３に対して基板Ｗを供給したり、搬出するための搬入アーム６と搬出アーム３５は、上記保持部３が入り込む凹部７，３６を有する櫛歯状とした。 The stage 1 is provided with a holding portion 3 having a suction hole 8 for adsorbing and holding the substrate W formed on the upper surface thereof, while supplying and unloading the substrate W to and from the holding portion 3. The carry-in arm 6 and the carry-out arm 35 have a comb-like shape having the concave portions 7 and 36 into which the holding unit 3 enters.
　そのため、上記搬入アーム６に吸着保持された基板Ｗを、この搬入アーム６によって上記保持部３の上面に対向する位置まで搬送することができるから、上記搬入アーム６から保持部３への基板の受け渡しを確実に行なうことができる。 Therefore, since the substrate W attracted and held by the carry-in arm 6 can be carried by the carry-in arm 6 to a position facing the upper surface of the holding unit 3, the substrate is transferred from the carry-in arm 6 to the holding unit 3. Delivery can be performed reliably.
　しかも、上記搬入アーム６に吸着保持されて一方の側辺部の電子部品Ｐが本圧着された後、上記保持部３に受け渡されて他方の側辺部の電子部品Ｐが本圧着された基板Ｗの下面側へ上記搬出アーム３５を進入させることができるから、上記保持部３からの基板Ｗの搬出も、確実に行なうことができる。 In addition, after the electronic component P on one side is finally pressure-bonded by being sucked and held by the carry-in arm 6, the electronic component P on the other side is finally pressure-bonded by being transferred to the holding portion 3. Since the unloading arm 35 can be made to enter the lower surface side of the substrate W, the unloading of the substrate W from the holding unit 3 can also be performed reliably.
　上記圧着部１７のバックアップツール２１は２枚の基板Ｗの側辺部を同時に支持することができる長さ寸法とし、上記バックアップツール２１に下面が支持された基板Ｗの上面に仮圧着された電子部品Ｐを加圧加熱する加圧ツール２２は２つであって、各加圧ツール２２は一枚の基板Ｗの側辺部に対応する長さ寸法で、別々の第１のＺ駆動源２３によってＺ方向に駆動できるようにしている。 The backup tool 21 of the crimping portion 17 has a length dimension that can support the side portions of the two substrates W at the same time, and is temporarily bonded to the upper surface of the substrate W whose lower surface is supported by the backup tool 21. There are two pressurizing tools 22 for pressurizing and heating the component P, and each pressurizing tool 22 has a length corresponding to the side portion of one substrate W, and is a separate first Z drive source 23. Can be driven in the Z direction.
　そのため、上記圧着部１７は上記バックアップツール２１上に支持される基板Ｗが１枚であれば１つの加圧ツール２２を駆動して１枚の基板Ｗに仮圧着された電子部品Ｐを本圧着することができ、２枚であれば２つの加圧ツール２２を駆動して２枚の基板Ｗに仮圧着された電子部品Ｐを本圧着することができる。 For this reason, if there is only one substrate W supported on the backup tool 21, the crimping unit 17 drives the one pressurizing tool 22 to perform final crimping of the electronic component P temporarily bonded to one substrate W. In the case of two sheets, the two pressure tools 22 can be driven and the electronic component P temporarily bonded to the two substrates W can be finally bonded.
　つまり、上記圧着部１７のバックアップツール２１に電子部品Ｐが仮圧着された端部の下面が支持される基板Ｗが１枚或いは２枚のいずれであっても、その基板Ｗの側辺部に仮圧着された電子部品Ｐを確実に本圧着することができる。 That is, even if one or two substrates W are supported on the lower surface of the end portion where the electronic component P is temporarily crimped to the backup tool 21 of the crimping portion 17, The temporarily press-bonded electronic component P can be securely pressed.
　また、基板Ｗの対向する２つの辺に電子部品Ｐを実装するに際し、ステージ１を回転させて行なうようにしている。そのため、基板Ｗの一辺に電子部品Ｐを実装した後、アームなどで上記基板Ｗを持ち替えて向きを変えて他辺に電子部品Ｐを実装する場合に比べ、生産性を向上させることができる。 Further, when the electronic component P is mounted on two opposing sides of the substrate W, the stage 1 is rotated. Therefore, after mounting the electronic component P on one side of the substrate W, the productivity can be improved as compared with the case where the electronic component P is mounted on the other side by changing the orientation by holding the substrate W with an arm or the like.
　なお、上記一実施の形態では基板の対向する一対の側辺部（短辺）に仮圧着された電子部品を本圧着する場合を例に挙げて説明したが、基板の対向する一対の側辺部と、残りの２つの側辺部の一方の側辺部の３つの側辺部に電子部品を本圧着することがある。 In the above-described embodiment, the case where the electronic component temporarily bonded to the pair of side portions (short sides) facing the substrate is described as an example, but the pair of side sides facing the substrate is exemplified. In some cases, the electronic component is finally pressure-bonded to the three side portions of the portion and one of the remaining two side portions.
　その場合、基板の３つの側辺部に電子部品を仮圧着しておき、上述した実装装置によって対向する２つの側辺部に仮圧着された電子部品を本圧着した後、その基板を長辺用の実装装置に搬送し、そこで長辺に仮圧着された電子部品の本圧着を行なうようにすればよい。 In that case, the electronic component is temporarily crimped to the three side sides of the substrate, and the electronic component temporarily crimped to the two side sides facing each other by the mounting apparatus described above is finally crimped, and then the substrate is fixed to the long side. What is necessary is just to carry out the main crimping | compression-bonding of the electronic component temporarily conveyed to the long side there.
　また、搬入アームによる基板のステージへの受け渡しは、基板への電子部品の実装が終わってから、搬入アームによる基板の吸着を解除するようにしたが、実装中、つまり本圧着を行なっているときに基板の吸着を解除するようにしてもよい。このようにすることで、さらにタクトタイムの短縮を図ることが可能となる。 In addition, the delivery of the board to the stage by the carry-in arm is made so that the adsorption of the board by the carry-in arm is released after the electronic components are mounted on the board. Alternatively, the adsorption of the substrate may be released. By doing so, it is possible to further reduce the tact time.
　また、つぎに新たな基板を搬入アームで供給する際、その基板の位置認識はステージ上の基板を本圧着している最中に行うようにしてもよい。このようにすることで、つぎの基板のステージへの供給を迅速に行なうことが可能となるから、そのことによってもタクトタイムの短縮を図ることができる。 Further, when a new substrate is next supplied by the carry-in arm, the position of the substrate may be recognized while the substrate on the stage is being permanently bonded. By doing so, it becomes possible to quickly supply the next substrate to the stage, which can also reduce the tact time.
　また、ステージをＸ・Ｙ・Ｚ・θ駆動源によってＸ、Ｙ、Ｚ及びθ方向に駆動される構成としたが、バックアップツールをＺ方向に駆動可能な構成とすれば、上記ステージをＺ方向を除くＸ、Ｙ及びθ方向にだけ駆動される構成としてもよい。 The stage is driven in the X, Y, Z, and θ directions by the X, Y, Z, and θ drive sources. However, if the backup tool is configured to be driven in the Z direction, the stage is moved in the Z direction. It is good also as a structure driven only in the X, Y, and (theta) directions except for.
　また、上記実施の形態では基板に電子部品を本圧着する場合について説明したが、電子部品を仮圧着する場合や基板に異方性導電部材を貼着する場合にも適用することができる。つまり、電子部品や異方性導電部材などの被実装部材を実装する場合に適用可能である。 In the above-described embodiment, the case where the electronic component is permanently bonded to the substrate has been described. However, the present invention can also be applied to the case where the electronic component is temporarily bonded or the anisotropic conductive member is attached to the substrate. That is, the present invention can be applied when mounting a mounted member such as an electronic component or an anisotropic conductive member.
　本発明によれば、２枚の基板の側辺部に対して電子部品を同時に実装して生産性の向上を図ることができると共に、基板の受け渡しと搬出に要する時間を短縮し、生産性を向上させることができる。また、２枚の基板の側辺部に対して同時に電子部品を実装する場合であっても、各基板をそれぞれ実装手段に対して精密に位置決めすることが可能となる。 According to the present invention, it is possible to improve the productivity by simultaneously mounting electronic components on the side portions of two substrates, reduce the time required to transfer and carry out the substrates, and improve the productivity. Can be improved. Further, even when electronic components are mounted simultaneously on the side portions of two substrates, each substrate can be accurately positioned with respect to the mounting means.

Claims (4)

  1. 　矩形状の基板の４つの側辺部のうち、対向する２つの側辺部に電子部品を実装する実装装置であって、
    　上面に２枚の基板を並べて吸着保持することが可能であって、水平方向、上下方向及び水平方向と直交する方向を中心とする回転方向のうち、少なくとも上下方向を除く方向に対して位置決め可能に設けられたステージと、
    　このステージ上に並設される２枚の基板の同一方向に位置する２つの側辺部に対して電子部品を同時に実装することが可能な構成の実装手段と、
    　上面に上記基板を吸着保持して上記ステージ上で上記基板の対向する２つの側辺部のうちの一方の側辺部を上記実装手段に対して位置決めして上記電子部品を実装させたなら、その基板を上記ステージの一側部の上面に受け渡す搬入手段と、
    　この搬入手段に吸着保持された上記基板の一方の側辺部に上記電子部品を実装する前に、上記基板の一方の側辺部を上記実装手段に位置決めするために撮像する第１の撮像手段と、
    　一方の側辺部に上記電子部品が実装された上記基板が上記搬入手段から上記ステージの一側部の上面に受け渡されて上記ステージが１８０度回転させられたときに、上記基板の一方の側辺部に対向する他方の側辺部を上記実装手段に対して位置決めするために撮像する第２の撮像手段と、
    　上記第１の撮像手段と上記第２の撮像手段の撮像に基づいて上記搬入手段と上記ステージを位置決め制御し、上記ステージの一側部に供給載置されこのステージとともに１８０度回転させられた上記基板の他方の側辺部に上記実装手段によって電子部品を実装するとき、上記搬入手段に吸着保持されて上記ステージの他側部で上記実装手段に対して位置決めされた新たな基板の一方の側辺部に上記実装手段によって電子部品を同時に実装させる制御手段と、
    　一方の側辺部に電子部品が実装された後、上記ステージに受け渡されて１８０度回転させられてから他方の側辺部に電子部品が実装された基板を上記ステージから取り出す搬出手段と
    　を具備したことを特徴とする電子部品の実装装置。     A mounting device for mounting an electronic component on two opposing side portions of four side portions of a rectangular substrate,
    It is possible to adsorb and hold two substrates side by side on the upper surface, and to position in at least the direction excluding the vertical direction among the rotation directions centered on the horizontal direction, the vertical direction, and the direction orthogonal to the horizontal direction And the stage set in
    Mounting means having a configuration capable of simultaneously mounting electronic components on two side portions located in the same direction of two substrates arranged side by side on the stage;
    When the electronic component is mounted by adsorbing and holding the substrate on the upper surface and positioning one of the two opposing side portions of the substrate on the stage with respect to the mounting means, Loading means for transferring the substrate to the upper surface of one side of the stage;
    Before mounting the electronic component on one side portion of the board held by suction by the carry-in means, first imaging means for imaging to position the one side portion of the board on the mounting means When,
    When the substrate on which the electronic component is mounted on one side is transferred from the carry-in means to the upper surface of one side of the stage and the stage is rotated 180 degrees, one of the substrates A second image pickup means for picking up an image for positioning the other side portion facing the side portion with respect to the mounting means;
    The carrying-in means and the stage are positioned and controlled based on the images of the first imaging means and the second imaging means, supplied and mounted on one side of the stage, and rotated 180 degrees together with the stage. When mounting an electronic component on the other side portion of the board by the mounting means, one side of the new board that is attracted and held by the carry-in means and positioned with respect to the mounting means at the other side of the stage Control means for simultaneously mounting electronic components on the side by the mounting means;
    After the electronic component is mounted on one side portion, it is transferred to the stage and rotated 180 degrees, and then the unloading means for taking out the substrate on which the electronic component is mounted on the other side portion from the stage. An electronic component mounting apparatus comprising the electronic component mounting apparatus.
  2. 　上記実装手段は、上記搬入手段に吸着保持されて一方の側辺部に電子部品が実装される基板と、一方の側辺部に電子部品が実装されて上記ステージによって１８０度回転させられて他方の側辺部に電子部品が実装される基板との２枚の基板に対応する長さを有してこれら基板の側辺部の下面を支持するバックアップツールと、
    　このバックアップツールの上方に別々に上下駆動可能に設けられ各基板の側辺部の長さと対応する長さ寸法に形成されていて、下降方向に駆動されることで上記バックアップツールに側辺部の下面が支持された各基板の上面に上記電子部品を実装する一対の加圧ツールとによって構成されていることを特徴とする請求項１記載の電子部品の実装装置。     The mounting means includes a substrate that is sucked and held by the carry-in means and has an electronic component mounted on one side, and an electronic component that is mounted on one side and rotated 180 degrees by the stage and A backup tool that has a length corresponding to two substrates and a substrate on which electronic components are mounted on the side portions of the substrate and supports the lower surfaces of the side portions of these substrates;
    This backup tool is provided separately so that it can be driven up and down, and is formed to have a length corresponding to the length of the side part of each substrate. 2. The electronic component mounting apparatus according to claim 1, comprising a pair of pressure tools for mounting the electronic component on the upper surface of each substrate on which the lower surface is supported.
  3. 　上記ステージの上面には、上記搬入手段によって受け渡された基板を吸着保持する保持部が突設されていて、
    　上記搬入手段と上記搬出手段は上記保持部が入り込む凹部を有する形状であることを特徴とする請求項１記載の電子部品の実装装置。     On the upper surface of the stage, a holding part for sucking and holding the substrate transferred by the carry-in means is projected,
    2. The electronic component mounting apparatus according to claim 1, wherein the carry-in means and the carry-out means have a shape having a recess into which the holding part is inserted.
  4. 　矩形状の基板の４つの側辺部のうち、対向する２つの側辺部に電子部品を実装する実装方法であって、
    　上面に２枚の基板を並べて吸着保持することが可能であって、水平方向、上下方向及び水平方向と直交する方向を中心とする回転方向に対して位置決め可能なステージ上で、搬入手段の上面に吸着保持された上記基板を位置決めする工程と、
    　上記ステージ上で、上記搬入手段によって位置決めされた上記基板の一方の側辺部に電子部品を実装する工程と、
    　一方の側辺部に電子部品が実装された基板を上記搬入手段から上記ステージの一側部に受け渡す工程と、
    　一方の側辺部に電子部品が実装された基板を受けた上記ステージを１８０度回転させて上記基板の他方の側辺部を位置決めし、この他方の側辺部に電子部品を実装する工程と、
    　上記基板の他方の側辺部に電子部品を実装するときに、上記搬入手段の上面に吸着保持された新たな基板の一方の側辺部を上記ステージの他側部上で位置決めしその一方の側部に電子部品を同時に実装する工程と、
    　上記基板の一側部と他側部とに電子部品が実装された基板を上記ステージから搬出する工程と
    　を具備したことを特徴とする電子部品の実装方法。     A mounting method for mounting an electronic component on two opposing side portions of four side portions of a rectangular substrate,
    The upper surface of the loading means can be mounted on a stage that can hold two substrates side by side on the upper surface and can be positioned with respect to a rotation direction centered on a horizontal direction, a vertical direction, and a direction orthogonal to the horizontal direction. Positioning the substrate held by suction on the substrate,
    Mounting electronic components on one side of the substrate positioned by the loading means on the stage;
    A step of transferring a substrate having an electronic component mounted on one side thereof from the carrying-in means to one side of the stage;
    A step of rotating the stage that has received the substrate on which the electronic component is mounted on one side portion by 180 degrees, positioning the other side portion of the substrate, and mounting the electronic component on the other side portion; ,
    When mounting an electronic component on the other side portion of the substrate, one side portion of a new substrate sucked and held on the upper surface of the carrying-in means is positioned on the other side portion of the stage, and one of the side portions is positioned. Mounting electronic components on the side at the same time;
    A method of mounting an electronic component, comprising: a step of unloading a substrate having electronic components mounted on one side and the other side of the substrate from the stage.
PCT/JP2013/058436 2012-03-23 2013-03-22 Device and method for mounting electronic component WO2013141388A1 (en)

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WO2016088594A1 (en) * 2014-12-01 2016-06-09 シャープ株式会社 Mounting board manufacturing device, and mounting board manufacturing method
CN109600983A (en) * 2017-10-03 2019-04-09 松下知识产权经营株式会社 The manufacturing method of apparatus for mounting component and installation base plate

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CN110289229B (en) * 2019-04-23 2024-04-05 惠州华科技术研究院有限公司 Storage type laminating equipment for electronic product components

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JP4579658B2 (en) * 2004-11-19 2010-11-10 芝浦メカトロニクス株式会社 Mounting device and mounting method for mounted member
JP2011064792A (en) * 2009-09-15 2011-03-31 Hitachi High-Technologies Corp Electronic component mounting device

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JP4579658B2 (en) * 2004-11-19 2010-11-10 芝浦メカトロニクス株式会社 Mounting device and mounting method for mounted member
JP2011064792A (en) * 2009-09-15 2011-03-31 Hitachi High-Technologies Corp Electronic component mounting device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016088594A1 (en) * 2014-12-01 2016-06-09 シャープ株式会社 Mounting board manufacturing device, and mounting board manufacturing method
CN109600983A (en) * 2017-10-03 2019-04-09 松下知识产权经营株式会社 The manufacturing method of apparatus for mounting component and installation base plate

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