JP2008227134A - Component mounting apparatus and substrate conveying method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent positional misalignment from occurring due to the suction failure of a substrate while speeding up the delivery operation of the substrate. <P>SOLUTION: A substrate conveying method comprises: a process for sucking and holding a substrate 1 by a substrate placement section 15 for conveying to a substrate delivery position; and a process for detecting the presence or absence of the upper warpage of the substrate 1. The substrate conveying method performs: a process for releasing the suction of the substrate at the substrate delivery position in the substrate placement section 15 when the substrate 1 does not have any upper warpage, receiving the substrate 1 of which suction is released by moving the substrate holding section 16 from a lower side to an upper side of the substrate delivery position, sucking the substrate by the substrate holding section by performing suction operation when receiving the substrate 1 or during operation before and after receiving the substrate 1, and moving the substrate holding section 16 for sucking and holding the substrate 1 appropriately; and a process for positioning the substrate holding section 16 to the substrate delivery position when the substrate 1 has an upper warpage, correcting warpage in the substrate 1 by pressing the substrate 1 from an upper part to the substrate holding section 16 by a warpage correction means 21 while the suction of the substrate placement section 15 has been released, and moving the substrate holding section 16 that has sucked and held the substrate 1 appropriately. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus for mounting components such as an IC chip, various semiconductor devices, and a flexible printed board on a substrate such as a glass substrate for a liquid crystal display or a plasma display, and a substrate for carrying such a substrate. It relates to a transport method.

  Conventionally, as shown in FIG. 3, when a component 2 is mounted on a side end of a substrate 1 such as a glass substrate for display, the substrate is placed on a mounting line 3 as shown in FIGS. 4 (a) and 4 (b). Implementation is performed by supplying 1. The mounting line 3 includes an anisotropic conductive film (hereinafter referred to as “ACF”) sticking device 4, a temporary crimping device 5, and main crimping devices 6 and 7. The ACF sticking device 4 mounts the component 2 of the substrate 1. ACF pasting step of pasting the ACF on the side end portion to be performed is performed, and the provisional crimping device 5 performs the temporary crimping step of supplying and temporarily crimping the component 2 onto the side end portion of the substrate 1. 7, main compression bonding is performed in which pressure and heat are applied to the component 2 that is temporarily bonded to the side edges of the long side and the short side of the substrate 1, so that the component 2 is finally bonded to the side edge of the substrate 1. By performing the process, the component 2 is mounted on the substrate 1.

  A specific configuration example will be described with reference to FIGS. 5 and 4B. The ACF sticking device 4 receives the substrate 1 carried into the substrate carry-in position and receives the substrate 1 at the substrate delivery position, and the substrate carrying device 11 that carries the substrate 1 to the substrate delivery position set at an appropriate position of the ACF sticking device 4. The mounting work device 12a performs the work of attaching the ACF to the side edge of the substrate. The substrate transport device 11 is configured to support the substrate 1 by a pair of substrate platforms 15 and to convey the substrate 1 by suction and holding it by suction means (not shown). The mounting work device 12a receives and transfers the mounting operation device 13a for supplying and pasting the ACF onto the side end portion of the substrate 1 and the substrate mounting portion 15 at the substrate delivery position. And a transfer device 14 for positioning the substrate 1 so that the side end portion of the substrate 1 is positioned on the backup portion 19 disposed immediately below the head portion 18 of the mounting operation device 13a.

  The transfer device 14 supports a substantially central part of the substrate 1 from below and adsorbs the substrate holding part 16 (see FIG. 6) by adsorption means (not shown), and the substrate holding part 16 as a pair of substrate placements. Transfer means 17 for moving and positioning between the portions 15 and 15 from the lower side to the upper side and receiving the substrate 1 on the substrate holding portion 16 so that the side end portion of the substrate 1 is positioned on the backup portion 19. It is composed of. The transfer means 17 includes an X-axis table that performs transfer positioning in the X direction along the transfer direction of the substrate transfer device 11, and a Y-direction that is orthogonal to the X direction and that is a perspective direction with respect to the backup unit 19 of the mounting operation device 13 a. A Y-axis table that performs transfer positioning, a Z-axis table that performs vertical movement and vertical positioning, and a θ-axis table that performs rotation and positioning around a vertical axis that passes through the center of the substrate holding unit 16, and holds the substrate The substrate 1 on the portion 16 is configured to be able to arbitrarily move and position around the X axis, Y axis, Z axis direction, and θ axis.

  The substrate 1 to which the ACF is attached by the mounting operation device 13a is returned to the substrate delivery position of the ACF attaching device 4 by the transfer device 14, and the substrate 1 is transported between the ACF attaching device 4 and the provisional pressure bonding device 5. Then, the substrate is transported to the substrate delivery position of the next temporary press-bonding device 5 by the substrate transport device 11 arranged as described above.

  The temporary crimping apparatus 5 includes a mounting operation device 13b that supplies the components 2 to predetermined locations on the side end portions of the substrate 1 and temporarily crimps them, and a mounting operation device 12b that includes the transfer device 14, and the transfer device 14 is provided. Then, the board 1 is transferred from the board delivery position to the mounting operation device 13b, the component 2 is temporarily crimped, and the board 1 on which the component 2 is temporarily crimped is returned to the board delivery position. Subsequently, the substrate 1 on which the component 2 has been temporarily crimped is transferred to the next final crimping device 6 by a substrate transport device 11 disposed so as to transport the substrate 1 between the temporary crimping device 5 and the final crimping device 6. It is transported to the board delivery position.

  The main crimping device 6 includes a mounting operation device 13c that performs final press-bonding of the component 2 temporarily crimped to the long side of the substrate 1 and a mounting operation device 12c including a transfer device 14. The board 1 is transferred from the delivery position to the mounting operation device 13c, the long-side component 2 is finally crimped, and the long-side component 2 is finally crimped, and the board 1 is returned to the board delivery position. Subsequently, the substrate 1 on which the long-side component 2 is finally crimped is transferred to a next crimping device 7 by a substrate transport device 11 arranged to transport the substrate 1 between the crimping devices 6 and 7. To the board delivery position.

  The main crimping device 7 includes a mounting operation device 13 d that includes a mounting operation device 13 d that performs final pressure bonding of the component 2 that is temporarily crimped to the short side of the substrate 1 and a transfer device 14. The substrate 1 is transferred from the delivery position to the mounting operation device 13d, the short-side component 2 is finally crimped, and the short-side component 2 is finally crimped, and the substrate 1 is returned to the substrate delivery position. Subsequently, the substrate 1 on which the short-side component 2 is finally crimped is unloaded by a substrate transfer device 11 arranged to transfer the substrate 1 between the final bonding device 7 and the unloading position of the mounting line 3. It is transported to a position, and is transported to the next process by a transport device as appropriate from its unloading position.

  The main object of the present invention is not related to the work contents of the mounting work devices 12a to 12d and the mounting operation devices 13a to 13d, but the board transfer device 11 and the transfer device 14 of the mounting work devices 12a to 12d. In the following description, the mounting work devices 12a to 12d are the mounting work device 12, the mounting operation devices 13a to 13d are the mounting operation device 13, the ACF sticking device 4 and the provisional operation. The crimping device 5 and the main crimping devices 6 and 7 are collectively referred to as a component mounting device 10.

  By the way, the transfer operation | movement of the board | substrate 1 between the conventional board | substrate mounting part 15 and the board | substrate holding | maintenance part 16 was performed as shown in FIG. The suction means (not shown) of the substrate platform 15 is connected to the vacuum pump 20 via the suction detection means 15a and the atmosphere release valve 15b, and the suction means (not shown) of the substrate holder 16 is also detected by suction. The vacuum pump 20 is connected via the means 16a and the atmosphere release valve 16b. Further, the suction detection means 15a and 16a detect the vacuum pressure in the vacuum path in the vicinity of the suction means (not shown), and are properly sucked when the predetermined vacuum pressure is not reached. However, when the pressure reaches a predetermined vacuum pressure or higher, it is determined that the material is properly adsorbed.

  In FIG. 6, first, in step (a), the substrate 1 is sucked and held by the substrate platform 15 and positioned at the substrate delivery position, and the substrate holder 16 is positioned below the substrate platforms 15 and 15. The substrate holding part 16 starts to rise from the state of being located at the position. Next, in step (b), the substrate holding unit 16 is stopped at the substrate delivery position, and suction by the substrate holding unit 16 is started in this state, and the suction detection means 16a indicates that the suction pressure has reached a predetermined pressure. After the detection, the atmosphere release valve 15b is then opened to stop the adsorption of the substrate mounting parts 15 and 15. Thereafter, the adsorption pressure of the substrate mounting parts 15 and 15 is reduced to the atmospheric pressure or the vicinity thereof by the adsorption detection means 15a. Depressurize and confirm that adsorption is completely released. Next, in the step (c), the substrate holder 16 is raised to a predetermined transfer height and transferred toward the mounting operation device 13. When the adsorption is stopped, high-pressure air that is equal to or higher than the atmospheric pressure (atmospheric pressure + α) is blown into the vacuum path, and the substrate 1 is separated from the substrate platform 15 so that the vacuum path can be set to the atmospheric pressure in a short time. .

  In the transfer operation between the conventional substrate placement unit 15 and the substrate holding unit 16, the suction at the substrate holding unit 16 is started while the substrate holding unit 16 is stopped at the substrate transfer position, and the suction is confirmed. After that, the suction on the substrate platform 15 is released, and after confirming the release of the suction, the substrate holding unit 16 is moved. Therefore, it takes time to transfer the substrate, and the transfer time of the substrate is reduced. There was a problem that the mounting work efficiency could not be improved by shortening. In recent years, the substrate 1 has been reduced in thickness to increase the size and / or reduce the weight, so that the substrate 1 is attracted simultaneously by both the substrate holding unit 16 and the substrate mounting unit 15. Then, the substrate 1 is distorted and remains as a residual strain, which causes display unevenness in the case of a display panel substrate.

  Therefore, the present applicant has previously proposed the transfer operation of the substrate 1 as shown in FIG. In FIG. 7, in step (a), the substrate 1 is sucked and held by the substrate platform 15 and positioned at the substrate delivery position, and the substrate holder 16 is positioned below the substrate platforms 15 and 15. In this state, the substrate holding unit 16 starts to rise, and the atmosphere release valve 15b is opened to release the adsorption to the atmosphere, or to lower the vacuum and release the adsorption on the substrate placement units 15 and 15. Next, in the step (b), the substrate holding unit 16 is preferably decelerated and moved up as it is without stopping at the substrate delivery position, and the substrate 1 is received. At the time of receiving the substrate 1 or during the operation before and after that, the substrate holding unit 16 adsorbs the substrate 1, raises the substrate holding unit 16 to the transfer position, and adsorbs the substrate 1 by the adsorption detection means 16a at the transfer position. After confirming, move to transfer operation. According to this transfer operation, the transfer time of the substrate 1 is shortened to improve the mounting work efficiency, and the state in which the substrate 1 is simultaneously adsorbed by both the substrate holding unit 16 and the substrate mounting unit 15 is eliminated. Generation of distortion can be eliminated (see Japanese Patent Application No. 2006-320393).

  By the way, as shown in FIG. 8, the substrate 1 is not only one that maintains a plane state with high accuracy as shown in FIG. 8A, but also one that is warped upward as shown in FIG. ) And (d), it is unavoidable that there are warped items such as those that warp upward in any one axial direction.

  When the substrate 1 as shown in FIGS. 8B to 8D is transferred between the substrate platform 15 and the substrate holder 16 as shown in FIG. As shown, in the step (a), the substrate holding unit 16 starts to rise from the state where the substrate holding unit 16 is positioned below the substrate placement units 15 and 15, and then the step ( In b), when the substrate holding part 16 is stopped at the substrate delivery position and the substrate 1 is adsorbed by the substrate holding part 16 in this state, the adsorbing pressure is reduced because the substrate 1 is warped. Insufficient adsorption may occur and the adsorption of the substrate placement units 15 and 15 is stopped as it is, and then the substrate holding unit 16 is raised to a predetermined transfer height in step (c). When the transfer operation is performed, the substrate 1 is displaced on the substrate holding unit 16 and a transfer failure occurs. That.

  For such problems, the substrate delivery position for delivering the substrate when delivering the substrate from the substrate placement arm (corresponding to the substrate placement unit) of the substrate transport apparatus to the substrate stage (corresponding to the substrate holding unit) After the substrate stage is positioned, the suction holding of the substrate by the substrate stage is started, and then the holding force of the suction holding is detected. If the holding force is less than a predetermined threshold, the substrate is placed on the substrate stage by the warp correction device. It is known that the substrate is corrected by correcting the warpage of the substrate by pressing the substrate to ensure that the substrate is attracted and held on the substrate stage (for example, see Patent Document 1).

Further, in order to correct a substrate having an upward warp, the substrate is sucked with a suction pad, the substrate is brought into contact with a support pin while being sucked with the suction pad, and then the suction pad is not warped. There is also known one that corrects and holds the warp of the substrate by moving it to a position (see, for example, Patent Document 2).
JP 2006-219261 A JP 63-169242 A

  Therefore, it is conceivable to apply a warp correction means to the delivery operation shown in FIGS. 6 and 9 as described in Patent Document 1 and Patent Document 2. That is, as shown in FIG. 10, first, in the step (a), the substrate 1 is sucked and held by the substrate platform 15 and positioned at the substrate delivery position, and the substrate holder 16 is moved to the substrate platforms 15 and 15. The substrate holding part 16 starts to rise from the state of being positioned on the lower side. Next, in the step (b), the substrate holding unit 16 is stopped at the substrate delivery position, and the suction by the substrate holding unit 16 is started in this state, and the suction pressure is detected by the suction detection means 16a. Here, when the substrate 1 is warped and the adsorption pressure does not reach a predetermined pressure, in step (c), the warp correction means 21 is operated, the substrate 1 is pressed against the substrate holding portion 16, and the substrate 1 is moved. Adsorption is held securely, and then the atmosphere release valve 15b is opened to release the adsorption of the substrate platforms 15 and 15. Next, in the step (d), the substrate holding part 16 is raised to a predetermined transfer height and shifts to a transfer operation, so that it is considered possible to eliminate the possibility of occurrence of displacement of the substrate 1 during transfer. .

  However, in the configuration of FIG. 10, when the substrate 1 is large, for example, 42 to 50 inches or more, as shown in FIG. 11, in step (c), the warp correction means 21 is operated to place the substrate 1 on the substrate. When the substrate 1 is pressed against the holding portion 16, the strength of the substrate 1 is reduced due to an increase in size and / or thickness, and the stress is locally concentrated on the portion pressed by the warp correction means 21. As shown in the lower part, even when the substrate pressing portion 22 of the warp correction means 21 is enlarged, the substrate 1 is attracted and held by the substrate mounting portions 15 and 15, so that the periphery of the substrate pressing portion 22 is Then, in step (d), the substrate 1 is held by the local stress concentration of the substrate 1 when the substrate holder 16 is raised to a predetermined transfer height and shifts to the transfer operation. Secure on the entire surface of the part 16 The fact that the substrate 1 is difficult to be adsorbed and the peripheral portion of the substrate 1 bends due to the weight of the substrate 1 may cause an adsorption failure during the transfer, and the stress concentration may cause a failure of the substrate 1. There is a problem of becoming.

  Further, as described above, the substrate holding unit 16 is stopped at the substrate delivery position, and the suction of the substrate 1 by the substrate holding unit 16 and the suction release by the substrate mounting unit 15 are performed. There is also a problem that it takes time. For this problem, it is conceivable to adopt the configuration shown in FIG. 7 as described above. However, when the substrate 1 is warped, it is more difficult to absorb than the configuration shown in FIG. There is a problem that is likely to occur. Accordingly, the warp correction means 21 is applied in the same manner as shown in FIG. 10, and when the suction failure is detected when the substrate holding unit 16 receives the substrate 1 and rises to the transfer height, the warp correction means 21 detects the substrate 1. It is conceivable that the suction failure is eliminated by pressing the substrate against the substrate holding part 16, but a problem occurs as in the case described with reference to FIG.

  In view of the above-described conventional problems, the present invention can prevent the occurrence of misalignment due to a substrate adsorption failure while speeding up the substrate transfer operation, and can improve the component mounting productivity on the substrate. An object is to provide an apparatus and a substrate transfer method.

  The component mounting apparatus according to the present invention performs a component mounting operation on a substrate transporting device that sucks and holds a substrate in a both-side supported state by the substrate mounting unit and transports the substrate to the substrate delivery position, and the substrate received at the substrate delivery position. Component mounting apparatus comprising: a mounting work apparatus; a warp detecting means for detecting the presence / absence of warping of the substrate held by suction on the substrate mounting portion; and a control device for controlling operations of the substrate transport apparatus and the mounting work apparatus. The mounting operation device includes a transfer device that receives a substrate at a substrate delivery position, transfers the substrate to a predetermined work position, and positions the substrate, and a mounting operation device that performs a component mounting operation on the substrate positioned at the work position. The transfer apparatus includes a substrate holding unit that supports a substantially central portion of the substrate from below and that is adsorbed by the adsorption unit, an adsorption detection unit that detects an adsorption state of the substrate by the substrate holding unit, and a substrate holding unit. Under the substrate mounting section And a transfer means for moving the substrate upward and receiving the substrate on the substrate holding portion and then transferring the substrate to the working position for positioning, and a warp for correcting the substrate warp by pressing the substrate from above above the substrate delivery position. And when the substrate is not warped, the controller receives the substrate at the substrate holding unit after releasing the suction of the substrate mounting unit and receives the substrate at the time of receiving the substrate or during the operation before and after the substrate. After the suction operation by the suction unit of the holding unit is performed and the proper suction holding state is confirmed, the operation of the transfer unit is continued, and if the substrate is warped, the substrate holding unit is positioned at the substrate delivery position and then mounted on the substrate. With the suction of the mounting portion released, the substrate is pressed by the warp correction means to correct the warp of the substrate, and then the suction operation by the suction means of the substrate holding portion is performed, and the substrate holding portion is moved upward to remove the substrate. Receiving and holding the board properly And controls so as to continue the operation of the transfer means after confirming the status.

  According to this configuration, according to the result of detecting the presence or absence of the substrate warping first, if there is no warping, the suction of the substrate on the substrate mounting portion is first released and the lower side is After the substrate is received by the substrate holding unit that moves upward, the substrate holding unit is stopped at the substrate delivery position, and then the substrate holding unit performs suction holding in the stopped state and the suction on the substrate mounting unit is released. Then, compared with the case of receiving the substrate on the substrate holding portion, the time required for the substrate transfer operation can be greatly reduced, thereby improving the productivity of component mounting, and the substrate mounting portion and the substrate. Since the state in which the substrate is adsorbed by both of the holding portions does not occur, it is possible to prevent the substrate from being distorted in the delivery process. If the substrate is warped, the substrate holder is positioned at the substrate delivery position, and then the substrate is warped by pressing the substrate with the warp correcting means in a state where the suction of the substrate mounting portion is released. Correcting and then adsorbing the substrate with the substrate holding part can secure an appropriate suction holding state, and then moving the substrate holding part upward to receive and transfer the substrate, the positional deviation of the substrate being transferred Occurrence can be prevented, and productivity of component mounting on the board can be improved.

  Further, if the warp correction means has a substrate pressing portion that presses substantially the same plane range as the substrate holding portion, it is possible to press the substrate in as wide a plane range as possible. While suppressing effectively, the curvature of a board | substrate can be corrected and an appropriate adsorption | suction holding state can be ensured.

  In addition, the substrate transfer method of the present invention includes a step of sucking and holding a substrate in a both-supported state in the substrate mounting portion of the substrate transfer apparatus and transferring the substrate to the substrate delivery position, and when the substrate is positioned at the substrate delivery position. Or a step of detecting whether or not the substrate is warped before, and when the substrate is not warped, a step of releasing the adsorption of the substrate at the substrate mounting portion at the substrate delivery position, and a transfer device The substrate holding unit is moved from the lower side to the upper side of the substrate delivery position to receive the released substrate, and the substrate holding unit is used to perform the adsorption operation when receiving the substrate or before and after the operation. The process of adsorbing, the process of moving the substrate holding part that appropriately adsorbed and holding the substrate, the process of positioning the substrate holding part at the substrate delivery position when the substrate is warped, and the adsorption of the substrate mounting part With the open, direct the substrate from above to the substrate holder A step of pressing and correcting the warp of the substrate, a step of attracting the substrate by the substrate holding unit, a step of moving the substrate holding unit above the substrate delivery position and receiving the substrate by the substrate holding unit, and a substrate The step of moving the substrate holding portion that has been properly sucked and held is performed.

  According to this configuration, it is possible to detect the warpage of the substrate first, and if there is no warpage of the substrate, the time required for the substrate transfer operation can be greatly shortened, and the substrate distortion during the transfer process can be greatly reduced. When the substrate is warped, the substrate is warped by pressing the substrate with the warp correcting means while the substrate is supported without being adsorbed by the substrate mounting portion and the substrate holding portion. By correcting the above, it is possible to secure an appropriate suction holding state and to prevent the occurrence of positional deviation of the substrate during transfer.

  According to the component mounting apparatus and the substrate transport method of the present invention, the presence or absence of the substrate warpage is detected first, and if there is no warpage according to the result, the substrate mounting portion adsorbs the substrate. When the substrate is received by the substrate holding part that is opened first and moves from the lower side to the upper side, the time required for the substrate transfer operation can be greatly shortened, and the substrate is warped. In the state where the substrate holding part is positioned at the substrate delivery position, the substrate holding part is released, the substrate is warped by the warp correcting means, and the substrate is held by the substrate holding part. Since the state can be secured and the occurrence of displacement of the substrate during transfer can be prevented, the productivity of component mounting on the substrate can be improved.

  Hereinafter, an embodiment of a component mounting apparatus according to the present invention will be described with reference to FIGS. As shown in FIG. 3, the component mounting apparatus according to the present embodiment mounts the component 2 on the substrate 1, and the entire configuration thereof is the component mounting apparatus 10 described with reference to FIGS. The description in the conventional example is cited.

  FIG. 1 shows a transfer operation of the substrate 1 between the substrate mounting portion 15 of the substrate transfer device 11 and the substrate holding portion 16 of the transfer device 14 in the component mounting apparatus 10 according to the present invention. In FIG. 1, the suction means (not shown) of the substrate platform 15 is connected to the vacuum pump 20 via the suction detection means 15a and the atmospheric release valve 15b, and the suction means (not shown) of the substrate holder 16 is also included. It is connected to the vacuum pump 20 via the adsorption detection means 16a and the atmosphere release valve 16b. The suction means (not shown) includes a plurality of suction holes arranged at appropriate intervals on the upper surface of the substrate mounting part 15 and the substrate holding part 16, or preferably a plurality of suctions with a cushioning property. Consists of pads. Further, the suction detection means 15a and 16a detect the vacuum pressure in the vacuum path communicating with the suction means (not shown), and are properly sucked when they do not reach the predetermined vacuum pressure set in advance. First, when the pressure reaches a predetermined vacuum pressure or higher, it is determined that the material is properly adsorbed.

  In FIG. 1, first, in step (a), the substrate 1 is sucked and held by the substrate platform 15 of the substrate transport apparatus 11 and transported toward the substrate delivery position, or during the transport. Whether the substrate 1 is warped or not is detected by the warp detecting means 25 disposed on the upper or side of the transport path including the delivery position. As the warp detection means 25, a length measuring sensor that measures the distance to the upper surface of the substrate 1 is used, and a detection type that detects from a change in the distance during the relative movement of the substrate 1 or a reflection type or transmission type photo. What detects the presence or absence of curvature with a sensor is suitable. Further, as a measurement method, even if the warp detecting means 25 is fixedly installed on the transport path including the substrate delivery position and the measurement is performed during the transport operation of the substrate 1, the warp detection means 25 is not included in the transport path including the substrate delivery position. The substrate 1 may be stopped at the set detection position, and the warp detection means 25 may move on the substrate 1 to perform measurement.

  As a result of detecting the presence or absence of warping of the substrate 1, when there is no upper warping, the process proceeds to step (b), and the substrate mounting portion 15 holds the substrate 1 by suction and holds it in a doubly supported state. At the substrate delivery position, the atmosphere release valve 15b is opened, the suction means is brought to atmospheric pressure or a low vacuum state, and the suction of the substrate 1 on the substrate platform 15 is released. At this time, the substrate holding part 16 is located below the substrate mounting parts 15 and 15, and the substrate holding part 16 starts moving from the lower side to the upper side from the substrate delivery position.

  Next, in step (c), the substrate holding unit 16 is not stopped at the substrate delivery position, and is preferably decelerated at the substrate delivery position so that the substrate 1 is not subjected to an impact during delivery. The substrate holding part 16 receives the substrate 1 by moving from the side to the upper side, and the substrate holding part 16 operates the suction means of the substrate holding part 16 when receiving the substrate 1 or during the operation before and after that. To adsorb. Here, whether or not the adsorption holding state of the substrate 1 by the substrate holding unit 16 is appropriate is detected by the adsorption detecting means 16a, and the appropriate adsorption holding state is confirmed, and the substrate 1 is transferred by the substrate holding unit 16 as it is.

  On the other hand, if the substrate 1 is warped from the detection result of the step (a), the process proceeds to the step (d), and the substrate placement unit 15 holds the substrate 1 in a state where it is supported in a dual-supported state. Then, when the substrate is transferred to the substrate delivery position and positioned, the substrate holding unit 16 then moves up to the substrate delivery position between the substrate platforms 15 and 15 and stops. Further, the atmosphere release valve 15b of the substrate platform 15 is opened, the suction means is set to atmospheric pressure or a low vacuum state, and the adsorption of the substrate 1 at the substrate platform 15 is released.

  Next, in the step (e), the substrate 1 is moved from the upper side to the substrate holder 16 by the warp correction means 21 in a state where the atmosphere release valve 16b is opened and the adsorption of the substrate 1 by the substrate holder 16 is opened. The warping of the substrate 1 is corrected by pressing toward it. At this time, since the adsorption on the substrate platform 15 is released, the occurrence of stress on the substrate 1 can be reduced by performing warp correction while the substrate platform 15 is restrained by the substrate platform 15. Thus, with the substrate 1 supported by the substrate platform 15 and the substrate holder 16, the warp correction means 21 presses the substrate 1 from above toward the substrate holder 16 to correct the warp of the substrate 1. In this state, the atmosphere release valve 16 b is closed and the suction means of the substrate holding part 16 is operated, and the substrate 1 is sucked by the substrate holding part 16.

  Next, in step (f), the warp correction means 21 is retracted to raise the substrate holding part 16 to a predetermined transfer height, and the suction detection means 16a indicates that the suction pressure by the substrate holding part 16 has reached a predetermined pressure. After the detection, the substrate 1 is transferred toward the mounting operation device 13 by the substrate holder 16.

  In the step (e), in order to ensure that the substrate 1 is attracted to the entire surface of the substrate holding portion 16, the substrate pressing portion that presses the warp correction means 21 in substantially the same plane range as the substrate holding portion 16 as shown in the figure. 22 is preferably provided. By providing such a substrate pressing portion 22, the substrate 1 can be pressed in the widest possible plane range, and the warpage of the substrate 1 can be effectively suppressed while generating local stress on the substrate 1. It is possible to correct and secure an appropriate suction holding state, and there is no fear that the suction becomes unstable due to the deflection of the substrate 1 due to its own weight f during the transfer.

  As a specific configuration of the substrate pressing portion 22, as shown in FIG. 2, a pressing body 24 is attached to each of a plurality of arms 23 extending radially from the central portion so that the position can be arbitrarily adjusted in the longitudinal direction. The configuration in which the position of the pressing body 24 is adjusted and set according to the size of the substrate holding portion 16 is preferable because it can easily cope with the model change of the substrate 1.

  The above-described transfer operation of the substrate 1 between the substrate platform 15 and the substrate holder 16 includes components including the substrate transport device 11 having the substrate platform 15 and the transfer device 14 having the substrate holder 16. It is controlled by a control device (not shown) that controls the operation of the entire mounting apparatus 10.

  According to the above configuration, whether the substrate 1 is warped is first detected by the warp detecting means 25, and if there is no warping according to the detection result, the substrate 1 on the substrate platform 15 is detected. When the substrate 1 is received by the substrate holding part 16 that moves from the lower side to the upper side after the suction of the substrate 1 is released, the substrate 1 can be received without difficulty in a short time. The time required for the delivery operation can be greatly shortened, thereby improving the productivity of component mounting. Further, since the state in which the substrate is adsorbed by both the substrate placement unit 15 and the substrate holding unit 16 does not occur, it is possible to prevent the substrate 1 from being distorted in the delivery process, and the substrate 1 is displayed. In the case of the glass substrate of the panel, the occurrence of display unevenness can be prevented.

  On the other hand, when the substrate 1 is warped, the substrate holder 16 is positioned at the substrate delivery position, and then the substrate 1 is sucked and released by the warp correction means 21 in a state where the suction of the substrate platform 15 is released. The substrate holding unit 16 in the state is pressed to correct the warp of the substrate 1, and then the substrate holding unit 16 adsorbs the substrate 1 to ensure an appropriate suction holding state. Thereafter, the substrate holding unit 16 is moved upward. By receiving and transporting the substrate 1, it is possible to reliably prevent the displacement of the substrate 1 during the transportation even when the substrate 1 is warped, thereby improving the productivity of component mounting on the substrate 1. Can do.

  In the above-described embodiment, an example in which the warp detection unit 25 including a length measurement sensor, a photo sensor, and the like is disposed on the upper part of the transport path including the substrate transfer position of the substrate transport apparatus 11 has been described. For example, in the preceding component mounting apparatus 10, if the substrate 1 is detected to be warped due to a suction failure of the substrate 1, the detection result data is transmitted to the subsequent component mounting apparatus 10. In the subsequent component mounting apparatus 10, the transfer operations of steps (b) and (c) are normally performed. When the substrate 1 in which the warpage is detected is transferred, the transfer of steps (d) to (f) is performed. The mounting operation may be performed so that the preceding component mounting apparatus 10 has the function of the warp detection means 25.

  According to the component mounting apparatus and the substrate transport method of the present invention, the presence or absence of the substrate warpage is detected first, and if there is no warpage according to the result, the substrate mounting portion adsorbs the substrate. When the substrate is received by the substrate holding part that is opened first and moves from the lower side to the upper side, the time required for the substrate transfer operation can be greatly shortened, and the substrate is warped. In the state where the substrate holding part is positioned at the substrate delivery position, the substrate holding part is released, the substrate is warped by the warp correcting means, and the substrate is held by the substrate holding part. Since the state can be secured and the occurrence of misalignment of the substrate during transfer can be prevented, the productivity of component mounting on the substrate can be improved, and it can be suitably used for a component mounting apparatus that mounts various components on various substrates. Can do.

Process explanatory drawing of the delivery operation | movement of the board | substrate to the board | substrate holding part from the board | substrate mounting part in one Embodiment of this invention. The curvature correction means of the embodiment is shown, (a) is a perspective view, (b) is a front view. The perspective view of the board | substrate which mounted the component of this invention object. The component mounting line of a prior art example is shown, (a) is a top view which shows the arrangement configuration of each component mounting apparatus, (b) is explanatory drawing of the mounting operation process in each component mounting apparatus. The perspective view which shows the whole schematic structure of the component mounting line of the prior art example. Process explanatory drawing of the delivery operation | movement of the board | substrate from the board | substrate mounting part in the same prior art example to a board | substrate holding part. Process explanatory drawing of the delivery operation | movement of the board | substrate from the board | substrate mounting part proposed prior to this invention to the board | substrate holding part. The perspective view which shows the curvature generation | occurrence | production state in a board | substrate. Operation process explanatory drawing which shows the problem in the delivery operation | movement of the board | substrate of a prior art example. Process explanatory drawing of the delivery operation | movement of a board | substrate at the time of solving a trouble by applying a prior art. FIG. 11 is an operation process explanatory diagram illustrating problems in the substrate transfer operation of FIG. 10.

Explanation of symbols

1 substrate 2 component 4 ACF sticking device (component mounting device)
5 Temporary crimping equipment (component mounting equipment)
6, 7 Crimping device (component mounting device)
DESCRIPTION OF SYMBOLS 10 Component mounting apparatus 11 Board | substrate conveyance apparatus 12 (12a-12d) Mounting operation apparatus 13 (13a-13d) Mounting operation apparatus 15 Board | substrate mounting part 15a Adsorption detection means 15b Atmospheric release valve 16 Substrate holding part 16a Adsorption detection means 16b Atmospheric release Valve 17 Transfer means 21 Warpage correction means 22 Substrate pressing part 25 Warpage detection means

Claims (3)

A substrate transfer device that sucks and holds a substrate in a both-side supported state by the substrate mounting portion and transfers the substrate to a substrate delivery position, a mounting work device that performs a component mounting operation on the substrate received at the substrate delivery position, and substrate mounting A component mounting apparatus comprising a warp detecting means for detecting the presence or absence of a warp of a substrate held by suction on a part, and a control device for controlling operations of the substrate transfer device and the mounting work device,
The mounting work apparatus includes a transfer device that receives a substrate at a substrate delivery position, transfers the substrate to a predetermined work position, and a mounting operation device that performs a component mounting operation on the substrate positioned at the work position.
The transfer device includes a substrate holding unit that supports a substantially central portion of the substrate from below and is adsorbed by an adsorption unit, an adsorption detection unit that detects an adsorption state of the substrate by the substrate holding unit, and a substrate holding unit. A transfer means for moving the substrate from the lower side to the upper side to receive the substrate on the substrate holding unit and then transferring the substrate to the working position, and pressing the substrate from above above the substrate delivery position to warp the substrate And a warp correction means for correcting
When the substrate is not warped, the control device receives the substrate at the substrate holding unit after releasing the adsorption of the substrate mounting unit and uses the adsorption unit of the substrate holding unit at the time of receiving the substrate or during the operation before and after the substrate is received. After performing the suction operation and confirming the proper suction holding state, continue the operation of the transfer means, and if the substrate is warped, position the substrate holding part at the substrate delivery position, and then release the suction of the substrate mounting part In this state, the substrate is pressed by the warp correction means to correct the warp of the substrate, and then the suction operation by the suction means of the substrate holding portion is performed, the substrate holding portion is moved upward, the substrate is received, A component mounting apparatus that controls to continue the operation of the transfer means after confirming the suction holding state.   The component mounting apparatus according to claim 1, wherein the warp correcting means includes a board pressing portion that presses substantially the same plane range as the board holding portion. The process of adsorbing and holding the substrate in a state where it is supported by the substrate mounting part of the substrate transport apparatus and transporting it to the substrate delivery position, and whether the substrate is warped when positioned at or before the substrate delivery position And a step of detecting
When there is no warping on the board,
A step of releasing the adsorption of the substrate at the substrate placement portion at the substrate delivery position, a step of moving the substrate holding portion of the transfer device from the lower side to the upper side to receive the substrate released from the adsorption, and Performing a step of sucking the substrate with the substrate holding unit during the operation before and after receiving the substrate, and a step of moving the substrate holding unit appropriately holding the substrate,
When there is warping on the board,
A step of positioning the substrate holding portion at the substrate delivery position, a step of pressing the substrate from above to the substrate holding portion in a state where the adsorption of the substrate mounting portion is released, and correcting the warp of the substrate; A step of sucking the substrate, a step of moving the substrate holding portion above the substrate delivery position and receiving the substrate at the substrate holding portion, and a step of moving the substrate holding portion appropriately holding and holding the substrate A substrate carrying method characterized by the above.

Images