JP7129645B2 - Crimping method and crimping device - Google Patents

Description

The present invention relates to a crimping method and a crimping apparatus for crimping an object such as an electronic component onto a substrate to produce a display panel or the like.

In the process of assembling a display panel used in a mobile phone or the like, electronic parts for drivers are mounted on a substrate made of glass that constitutes the panel body. This mounting operation is carried out through a process of mounting an electronic component at a mounting position on the edge of the substrate via an adhesive tape and pressing the electronic component against the substrate for pressure bonding. In recent years, in order to improve production efficiency, crimping devices capable of working on a plurality of substrates at the same time have been used at each station performing the above work (see, for example, Patent Document 1). By using the crimping device having such a configuration, it is possible to efficiently mount the electronic component on the substrate and carry out the operation of transporting the substrate.

JP-A-2005-129753

However, there is a problem that it is difficult to equalize the production conditions for a plurality of substrates.

Accordingly, the present disclosure provides a crimping method and the like that can easily equalize the production conditions of a plurality of substrates.

In addition, these general or specific aspects may be realized by a system, method, integrated circuit, computer program, or a recording medium such as a computer-readable CD-ROM. and any combination of recording media.

A crimping method according to an aspect of the present disclosure comprises: a first holding part for holding the first substrate in contact with a part of the lower surface of the first substrate; and a part of the lower surface of the second substrate. A crimping method for crimping an object to be crimped onto each of the first substrate and the second substrate, wherein a crimping device comprising a second holding portion that holds the second substrate in contact with the A holding mechanism including a first holding portion and a second holding portion is moved to support a lower surface of the first substrate held by the first holding portion on a first support portion. a first supporting step, in which the first substrate is attracted to a first suction portion so that the lower surface of the first substrate is maintained in a state of being supported by the first support portion; A first suction step of releasing the holding of the first substrate by the first holding portion and suction by the first suction portion cause the lower surface of the first substrate to adhere to the first lower receiving portion. a second supporting step of moving the holding mechanism while being supported to support the lower surface of the second substrate held by the second holding portion on the second lower receiving portion; A first object to be crimped is crimped onto the upper surface of the first substrate that is sucked by the first suction portion and supported by the first support portion, and is held by the second holding portion. and a crimping step of crimping a second crimping object to the upper surface of the second substrate supported by the second support portion.

The crimping method of the present disclosure can easily equalize the production conditions for multiple substrates.

FIG. 1 is a plan view of a display panel assembly apparatus according to an embodiment. FIG. 2 is a plan view of a display panel to be worked by the display panel assembly apparatus according to the embodiment. FIG. 3 is a perspective view of a main pressure-bonding part included in the display panel assembly apparatus according to the embodiment. FIG. 4 is a configuration explanatory diagram of a horizontal rotation drive mechanism provided in the main crimping portion in the embodiment. FIG. 5 is a perspective view of a support part and a suction part in the embodiment. FIG. 6 is a block diagram showing the configuration of a control system in the main crimping section of the embodiment. 7A is a flowchart illustrating an example of a crimping operation by the crimping unit according to the embodiment; FIG. 7B is a flowchart illustrating an example of a crimping operation by the crimping unit according to the embodiment; FIG. FIG. 8 is a diagram for explaining an example of a crimping operation by the crimping unit according to the embodiment; FIG. 9 is a diagram for explaining an example of a crimping operation by the crimping unit according to the embodiment; 10A and 10B are diagrams for explaining an example of a crimping operation by the crimping unit according to the embodiment. FIG. FIG. 11 is a flow chart showing an example of the processing operation of the crimping device according to the embodiment. FIG. 12 is a diagram showing another configuration example of part of the crimping portion in the embodiment. FIG. 13 is a plan view showing another example of the display panel assembly device.

(Knowledge on which the present invention is based)
The inventors of the present invention have found that the crimping device of Patent Document 1 described in the "Background Art" section has the following problems.

Like the crimping device of Patent Document 1, in small liquid crystal panel mounting equipment, two display panels (hereinafter also simply referred to as panels) are conveyed and produced at the same time in a pseudo-simultaneous manner in order to increase productivity. Pseudo-simultaneously means that the timings of processing such as transportation and production performed on each of the two panels are different, but the timings are roughly the same. means In addition, quasi-simultaneous crimping of crimping objects such as electronic components on two substrates constituting a display panel will be hereinafter referred to as pseudo-simultaneous crimping.

In the crimping device of Patent Document 1 described above, crimping is performed efficiently and with high precision by performing quasi-simultaneous crimping on two substrates.

However, even in the crimping by the crimping device of Patent Document 1, since it is a pseudo simultaneous crimping, the crimping of the first substrate is started first, and then the crimping of the second substrate is delayed. is started. Specifically, when the crimping device of Patent Document 1 performs pseudo simultaneous crimping, first, the first substrate is recognized, and based on the recognition result of the substrate, the position of the first substrate is corrected. (that is, alignment), and crimping of the electronic components. Next, while the crimping device is crimping the first substrate, that is, while holding the first substrate sandwiched between the crimping tool and the lower receiving portion, , the position of the second substrate is corrected, and the components are crimped onto the second substrate. In other words, the timing at which the first substrate is sandwiched between the crimping tools and the application of heat and pressure to the substrate is started, and the timing at which the second substrate is sandwiched by the crimping tools and the substrate is heated and pressurized. There is a slight difference from the timing when the pressure is started.

Such a slight difference in timing appears as a difference in production conditions such as heating time and pressurizing time. Not suitable.

Therefore, in order to solve such a problem, a crimping method according to an aspect of the present disclosure provides a first holding member for holding the first substrate in contact with a portion of the lower surface of the first substrate. and a second holding portion for holding the second substrate in contact with a portion of the lower surface of the second substrate, and presses the first substrate and the second substrate. A crimping method for crimping an object, wherein a holding mechanism including the first holding part and the second holding part is moved to move the first substrate held by the first holding part. a first supporting step of supporting the lower surface of the substrate on the first lower receiving portion; a first adsorption step of causing a portion to adsorb the first substrate to release the holding of the first substrate by the first holding portion; When the lower surface of the substrate is supported by the first lower receiving portion, the holding mechanism is moved to move the lower surface of the second substrate held by the second holding portion to the second lower surface. a second supporting step of causing a receiving portion to support the first crimping object on the upper surface of the first substrate sucked by the first suction portion and supported by the first lower receiving portion; and a crimping step of crimping a second object to be crimped onto the upper surface of the second substrate held by the second holding portion and supported by the second support portion; include.

For example, when the holding mechanism is moved, the first holding portion and the second holding portion move simultaneously. Therefore, when the second substrate is positioned and supported by the second lower receiving portion, the state of the first substrate already supported and positioned by the first lower receiving portion is changed. While maintaining, it is necessary to separate the first holding part from the first substrate. However, in the crimping method of Patent Document 1, the state of the first substrate is maintained by crimping with a crimping tool. That is, the crimping tool presses the object to be crimped and the first substrate against the lower receiving portion, thereby maintaining the state of the already positioned first substrate. As a result, the crimping of the object to be crimped starts earlier on the first substrate than on the second substrate.

In contrast, in the crimping method according to one aspect of the present disclosure, the first adsorption step and the second support step are performed. Therefore, when the second substrate is positioned, the state of the already positioned first substrate is maintained not by the crimping tool but by suction by the first suction unit. Then, in the crimping step of the crimping method according to one aspect of the present disclosure, the first of crimping objects are crimped. Also, the second object to be crimped is crimped onto the upper surface of the second substrate 7B held by the second holding portion and supported by the second support portion. That is, in the crimping method according to one aspect of the present disclosure, the first substrate and the second substrate are respectively supported by the first lower receiving portion and the second lower receiving portion in order to perform crimping. is maintained by suction by the first suction section and holding by the second holding section. Therefore, the two crimping tools corresponding to the first substrate and the second substrate can easily crimp the first substrate and the second substrate respectively for the same amount of time. As a result, the production conditions for the two substrates can be easily equalized.

Further, in the pressure bonding step, the timing of starting pressure bonding of the first pressure bonding object to the top surface of the first substrate and the timing of starting pressure bonding of the second pressure bonding object to the top surface of the second substrate. may be at the same time. Furthermore, in the pressure-bonding step, the pressure-bonding of the first pressure-bonding object to the top surface of the first substrate is completed, and the pressure-bonding of the second pressure-bonding object to the top surface of the second substrate is completed. may be at the same time.

As a result, the first substrate and the second substrate can be easily crimped simultaneously without providing a difference in the control timing of the two crimping tools corresponding to the first substrate and the second substrate. can be done.

Further, when the crimping device further includes a third holding portion for holding the third substrate by contacting a portion of the lower surface of the third substrate, as a holding portion included in the holding mechanism. In the above-mentioned pressure-bonding method, after the start of the first adsorption step, the holding mechanism is further moved to move the lower surface of the third substrate held by the third holding portion to a third holding portion. a third supporting step of supporting the lower receiving portion; and a second adsorption step of releasing the holding of the third substrate by the third holding portion by adsorbing the first substrate and releasing the holding of the third substrate by the third holding portion. When the lower surface of the first substrate is supported by the first lower receiving portion and the lower surface of the third substrate is supported by the third lower receiving portion by suction by the suction portion of 2. and moving the holding mechanism to cause the second lower support portion to support the lower surface of the second substrate held by the second holding portion. A third object to be crimped may be crimped onto the upper surface of the third substrate which is sucked by the suction portion and supported by the third lower receiving portion.

As a result, not only two substrates but also three substrates can be easily crimped for the same amount of time. As a result, it is possible to easily equalize the production conditions for the three substrates. Also, the crimping by the three crimping tools may be started at the same time, and the crimping by the three crimping tools may be finished at the same time. As a result, simultaneous crimping can be easily performed on each of the three substrates without providing differences in the control timings of the three crimping tools.

Further, the component mounting apparatus according to an aspect of the present disclosure includes N holders for respectively holding the N substrates (N is an integer equal to or greater than 2) in contact with part of the lower surfaces of the substrates. lower surfaces of the N substrates held by the N holding portions by moving a holding mechanism including the portion, the N lower receiving portions, and the N holding portions; A moving mechanism for supporting each of the lower receiving portions, and corresponding to the (N-1) holding portions when the holding by the (N-1) holding portions out of the N holding portions is released. (N-1) suction units for sucking each of the (N-1) substrates to be pressed, and N crimping tools for crimping the crimping target on the upper surface of each of the N substrates, Of the N substrates crimped by the N crimping tools, (N−1) substrates are respectively sucked by the (N−1) suction units, and Among the N substrates supported by (N−1) lower receiving portions of the receiving portions and crimped by the N crimping tools, the remaining one substrate out of the N substrates is It may be held by the remaining one holding portion among the holding portions and supported by the remaining one lower receiving portion among the N number of lower receiving portions.

As a result, not only two or three substrates but also N substrates can be easily crimped for the same amount of time. As a result, it is possible to easily equalize the production conditions for the N substrates. Also, the crimping by the N crimping tools may be started at the same time, and the crimping by the N crimping tools may be finished at the same time. As a result, simultaneous pressure bonding can be easily performed on each of the N substrates without providing differences in the control timings of the N pressure bonding tools.

Hereinafter, embodiments will be specifically described with reference to the drawings.

It should be noted that the embodiments described below are all comprehensive or specific examples. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, and the like shown in the following embodiments are examples and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest concept will be described as arbitrary constituent elements.

Each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected about the same component. In addition, in the following embodiments, expressions such as “substantially the same” are used. For example, "substantially the same" means not only exactly the same, but also substantially the same, that is, including an error of, for example, several percent. Also, "substantially the same" means the same within the scope where the effects of the present disclosure can be achieved. The same applies to expressions using other "abbreviations".

(Embodiment)
FIG. 1 is a plan view of a display panel assembly apparatus according to this embodiment. Also, FIG. 2 is a plan view of a display panel assembled by the display panel assembly apparatus according to the present embodiment.

A display panel assembly apparatus assembles a display panel by mounting electronic components for a driver on a glass substrate (hereinafter simply referred to as "substrate") by pressure bonding via an adhesive tape. In FIG. 1, on a base 1, a waiting stage 2, an adhesive tape sticking section 3, a temporary pressure bonding section 4, a final pressure bonding section 5, and an unloading stage 6 are arranged in a horizontal row. Here, in the present embodiment, the main crimping unit 5 is a crimping device that crimps the crimping object to the substrate. The object to be crimped is, for example, an electronic component, but may be an object other than the electronic component. Further, in the present embodiment, the direction in which the substrate 7 is conveyed is called the X-axis direction, and the direction perpendicular to the X-axis direction on the horizontal plane is called the Y-axis direction. Furthermore, the direction orthogonal to the X-axis direction and the Y-axis direction is called the Z-axis direction.

The standby stage 2 includes a panel mounting table 2a on which two substrates 7 to which electronic components are to be bonded can be mounted. The two substrates 7 are aligned on the panel mounting table 2a by a pre-centering mechanism (not shown), whereby the relative positions of the two substrates 7 are aligned.

As shown in FIG. 2, the substrate 7 has a structure in which two glass substrates for forming a display panel are superimposed. Two mutually orthogonal edge portions 7a and 7b of the substrate 7 serve as component mounting surfaces on which the circuit forming surface of the glass substrate is exposed. An electronic component 8 for a driver is mounted by crimping on the connection terminals provided on the edge portions 7a and 7b.

The adhesive tape application unit 3 applies an adhesive tape for bonding electronic components to the two substrates 7 held by the substrate holding unit 30 . The adhesive tape is, for example, an ACF (Anisotropic conductive film) tape. The substrate holder 30 has an XYZθ table mechanism 31 . The substrate holding part 30 drives the XYZ.theta. Positioned on portion 33A and second support portion 33B respectively. Then, the adhesive tape application portion 3 is crimped in a state in which the edge portions of the two substrates 7 are supported by the first support portion 33A and the second support portion 33B corresponding to the substrates 7. A mechanism 32 applies the adhesive tape. The pressure bonding mechanism 32 is composed of tape applying units 32A and 32B, and each of the tape applying units 32A and 32B applies an adhesive tape to the substrate 7. As shown in FIG.

The temporary pressure-bonding portion 4 temporarily pressure-bonds the two substrates 7 to which the adhesive tape is applied by the adhesive tape applying portion 3 and the electronic component 8 for the driver is mounted on the two substrates 7 held by the substrate holding portion 40 . The substrate holder 40 has an XYZθ table mechanism 41 . When the electronic component 8 is mounted, the substrate holding portion 40 drives the XYZθ table mechanism 41 to hold the edge portions of the two substrates 7 against the support portion provided adjacent to the substrate holding portion 40 . 47 in sequence. The electronic component 8 is mounted on the temporary pressure-bonding portion 4 by the electronic component mounting mechanism 42 while the edge of the substrate 7 is supported by the lower receiving portion 47 . Here, the temporary crimping unit 4 sequentially index-rotates the holding head 45 provided on the index table 42a of the electronic component mounting mechanism 42 in the direction of the arrow, so that the electronic component 8 taken out from the electronic component supply unit 43 is It is conveyed to the crimping work position on the lower receiving portion 47 .

The main crimping section 5 includes two crimping sections 5A and 5B. The crimping units 5A and 5B use the crimping mechanisms 52 and 62 to actually crimp the electronic components 8 temporarily crimped to the two substrates 7 held by the substrate holding units 50 and 60, respectively. That is, in the main crimping unit 5 as a crimping device, the electronic component 8 mounted on the substrate 7 via the adhesive tape is the object to be crimped. The crimping mechanism 52 is provided with a first lower receiving portion 53A and a second lower receiving portion 53B, and the crimping mechanism 62 is provided with a third lower receiving portion 63A and a fourth lower receiving portion 63B. It is During the main pressure bonding, the pressure bonding mechanisms 52 and 62 drive the first XYZ.theta. The rims are moved onto their respective supporters 53A, 53B, 63A and 63B.

The carry-out stage 6 includes a panel carry-out table 6a, and the substrate 7 after the main pressure bonding by the main pressure bonding section 5 is placed on the panel carry-out table 6a. A substrate transfer mechanism 70 is arranged in front of each work stage described above. The substrate transport mechanism 70 has a structure in which a plurality of substrate transport heads are arranged on a moving member 72 that reciprocates on a slide table 71 in the substrate transport direction (horizontal direction in FIG. 1, that is, the X-axis direction). By moving the moving member 72, the substrate 7 can be simultaneously transported between the work stages by a plurality of substrate transport heads.

Of these substrate transport heads, the first substrate transport head 75 and the second substrate transport head 76 are directly coupled to the moving member 72 . A third substrate transport head 77 and a fourth substrate transport head 78 are coupled to the moving member 72 via a first telescopic mechanism 73 and a second telescopic mechanism 74, respectively. The first substrate transport head 75 and the second substrate transport head 76 simultaneously transport two substrates 7 from the standby stage 2 to the adhesive tape applying section 3 and from the adhesive tape applying section 3 to the temporary pressure bonding section 4, respectively. .

The third substrate transport head 77 and the fourth substrate transport head 78 simultaneously transport two substrates 7 from the temporary pressure bonding section 4 to the final pressure bonding section 5 and from the final pressure bonding section 5 to the unloading stage 6, respectively. At this time, by extending and contracting the rod 73 a of the first telescopic mechanism 73 , the transport destination when the substrate 7 is transported to the main pressure-bonding unit 5 by the third substrate transport head 77 can be selected from the substrate holding units 50 and 60 . You can switch between Further, by extending and retracting the rod 74 a of the second extension mechanism 74 , the substrate holding portions 50 and 60 can be selected as the substrate 7 picking-out source when the substrate 7 is taken out from the main pressure-bonding portion 5 by the fourth substrate conveying head 78 . You can switch to either.

FIG. 3 is a perspective view of the main pressure-bonding unit 5, which is a pressure-bonding device included in the display panel assembly apparatus according to the present embodiment.

As described above, the main crimping portion 5 in this embodiment includes two crimping portions 5A and 5B. The crimping portion 5A has a substrate holding portion 50, and the crimping portion 5B has a substrate holding portion 60. As shown in FIG.

The substrate holders 50 and 60 have a first XYZθ table mechanism 51 and a second XYZθ table mechanism 61, respectively. The first XYZθ table mechanism 51 is configured by sequentially stacking an X table 51X, a Y table 51Y, a Z table 51Z, and a horizontal rotation driving mechanism 51θ from the bottom. Similarly, the second XYZθ table mechanism 61 is constructed by sequentially stacking an X table 61X, a Y table 61Y, a Z table 61Z and a horizontal rotation driving mechanism 61θ. The X tables 51X and 61X are provided on a common guide rail.

A first holding portion 54A and a second holding portion 54B of the substrate holding portion 50 are provided on the first XYZθ table mechanism 51 . Similarly, on the second XYZθ table mechanism 61, a third holding portion 64A and a fourth holding portion 64B of the substrate holding portion 60 are provided. By driving the first XYZθ table mechanism 51, the crimping section 5A moves the edge of the substrate 7 held by the first holding section 54A and the second holding section 54B to a first crimping tool 52A described later. and to a second crimping position by a second crimping tool 52B, respectively. Further, the crimping section 5B drives the second XYZθ table mechanism 61 to press the edge of the substrate 7 held by the third holding section 64A and the fourth holding section 64B to the third crimping section described later. It is moved to a third crimping position by tool 62A and a fourth crimping position by fourth crimping tool 62B, respectively.

A first lower receiving portion 53A and a second lower receiving portion 53B are arranged behind the substrate holding portion 50 (that is, on the back side in the Y-axis direction). The first support portion 53A and the second support portion 53B support the two substrates 7 held by the first holding portion 54A and the second holding portion 54B from below at the same height. . That is, the first lower receiving portion 53A and the second lower receiving portion 53B form two sheets at a first crimping position by the first crimping tool 52A and a second crimping position by the second crimping tool 52B. The substrate 7 is supported from below. A third lower receiving portion 63A and a fourth lower receiving portion 63B are arranged behind the substrate holding portion 60. As shown in FIG. The third support part 63A and the fourth support part 63B support the two substrates 7 held by the third support part 64A and the fourth support part 64B from below at the same height. . That is, the third lower receiving portion 63A and the fourth lower receiving portion 63B form two sheets at the third crimping position by the third crimping tool 62A and the fourth crimping position by the fourth crimping tool 62B. The substrate 7 is supported at the same height from below.

Above the substrate holders 50 and 60, a substrate recognition camera 56 is arranged so as to be movable in the X direction. The substrate recognition camera 56 images the four substrates 7 on the first holding portion 54A, the second holding portion 54B, the third holding portion 64A, and the fourth holding portion 64B. By this imaging, the main pressure-bonding unit 5 recognizes the recognition marks provided on the four substrates 7 and detects the positions of the four substrates 7 . Based on this position detection result, the main crimping section 5 drives the first XYZθ table mechanism 51 and the second XYZθ table mechanism 61, thereby forming the first holding portion 54A and the second holding portion 54B. , the third holding portion 64A, and the fourth holding portion 64B are moved in the horizontal direction. As a result, the held four substrates 7 can be positioned at the first, second, third, and fourth crimping positions, respectively.

A first crimping tool 52A, a second crimping tool 52A, and a second crimping tool 52A are provided above the first, second, 53B, 63A, and 63B, respectively. 52B, a third crimping tool 62A and a fourth crimping tool 62B are provided. The main pressure-bonding unit 5 positions the edge of the substrate 7 , the electronic component 8 of which has been temporarily pressure-bonded onto the adhesive tape by the temporary pressure-bonding unit 4 , at a pressure-bonding position corresponding to the substrate 7 . Then, the main crimping unit 5 lowers the crimping tool with respect to the substrate 7 and maintains the pressed state for a predetermined crimping time. As a result, the electronic component 8 is permanently pressure-bonded to the substrate 7 via the adhesive tape.

FIG. 4 is a configuration explanatory diagram of the horizontal rotation driving mechanism 51θ in the crimping portion 5A of the present embodiment.

As shown in FIG. 4A, the pulleys 35 coupled to the rotation shafts of the first holding portion 54A and the second holding portion 54B are connected to the motor 36 provided in the horizontal rotation driving mechanism 51θ. , the rotation is transmitted via belt 38 and pulley 37 . Therefore, by driving the motor 36, the first holding portion 34A and the second holding portion 34B rotate by θ in the horizontal plane. Thereby, the substrate 7 held by each of the first holding portion 34A and the second holding portion 34B can be rotated in the horizontal plane.

As shown in FIG. 4B, the height positions of the upper surfaces of the first holding portion 54A and the second holding portion 54B are not the same. That is, the upper surface of the second holding portion 54B is higher than the upper surface of the first holding portion 54A by ΔH. This ΔH is set larger than the thickness t of the substrate 7 to be held. Therefore, when the first holding portion 34A and the second holding portion 34B are rotated, the two substrates 7 adjacent to each other are rotated at different heights.

By holding the two substrates 7 at different height positions in this way, even if the distance between the first holding portion 54 and the second holding portion 54B is narrow, the two adjacent substrates 7 can be rotated by θ. It is possible to suppress the occurrence of interference in these substrates 7 when the substrates 7 are arranged in the same direction. As a result, the dimension of the crimping portion 5A in the board transfer direction (that is, the X-axis direction) can be made compact. Also, the crimping portion 5B is configured in the same manner as the crimping portion 5A.

FIG. 5 is a diagram showing the first support portion 53A and the first suction portion 53C in the crimping portion 5A.

The crimping portion 5A in the present embodiment includes a first suction portion 53C for sucking the substrate 7. As shown in FIG. A suction hole 53D connected to a vacuum source via a valve is formed in the first suction portion 53C.

Here, the surface on which the suction holes 53D of the first suction portion 53C are formed is substantially the same height as the upper surface of the first lower receiving portion 53A. Further, the first suction portion 53C is arranged between the first holding portion 54A and the first support portion 53A, as shown in FIG. 4(a).

Therefore, when the lower surface of the edge portion of the substrate 7 held by the first holding portion 54A is supported by the first lower receiving portion 53A, the first suction portion 53C is used for the suction from the suction hole 53D. The substrate 7 can be sucked by vacuum suction. In this manner, the substrate 7 sucked by the first suction portion 53C is maintained in a state of being supported by the first lower receiving portion 53A even when the holding by the first holding portion 54A is released. In other words, the first suction portion 53C maintains the state in which the substrate 7 is supported by the first lower receiving portion 53A instead of the first holding portion 54A.

It should be noted that the first suction portion 53C may be arranged with respect to the first lower receiving portion 53A and may not be arranged with respect to the second lower receiving portion 53B. Further, as shown in FIG. 3, the crimping portion 5B also has a second suction portion 63C having the same configuration as the first suction portion 53C. The second suction portion 63C may be arranged with respect to the third lower receiving portion 63A and may not be arranged with respect to the fourth lower receiving portion 63B.

FIG. 6 is a block diagram showing the configuration of the control system in the main crimping section 5, which is the crimping device of the present embodiment.

The main crimping unit 5 in the present embodiment includes a substrate position detection unit 86, a first valve 87 to a sixth valve 92, a vacuum source 82, and a control unit 79 in addition to the components described above. . Note that the controller 79 and the vacuum source 82 may be shared with the adhesive tape application section 3 and the temporary pressure bonding section 4 . Further, the vacuum source 82 is continuously driven while the display panel is being assembled by the display panel assembly apparatus.

The substrate position detection unit 86 acquires the observation result of the substrate recognition camera 56 and performs recognition processing on the observation result to obtain the first holding unit 54A, the second holding unit 54B, the third holding unit 64A and the third holding unit 64A. The position of the substrate 7 held by each of the four holding portions 64B is recognized. The position recognition result is transmitted to the control section 79 .

The control unit 79 controls the crimping mechanisms 52 and 62 , the first XYZθ table mechanism 51 and the second XYZθ table mechanism 61 . At this time, the control unit 79 controls the first XYZθ table mechanism 51 and the second XYZθ table mechanism 61 based on the position recognition results of each of the four substrates 7 . Thereby, the four substrates 7 can be aligned in the horizontal direction, the height direction, and the θ rotation direction with respect to the crimping mechanisms 52 and 62 . That is, the control unit 79 controls the positions of at least four substrates 7 in the XY direction based on the positions of the substrates 7 recognized by the substrate position detection unit 86 . Under its control, the control section 79 positions the two substrates 7 with respect to the first crimping tool 52A and the second crimping tool 52B of the crimping mechanism 52 . Furthermore, the controller 79 positions the two substrates 7 with respect to the third crimping tool 62A and the fourth crimping tool 62B of the crimping mechanism 62 .

The suction hole formed on the upper surface of the first holding portion 54A and the suction hole formed on the upper surface of the second holding portion 54B are connected via a first valve 87 and a second valve 88, respectively. It is connected to a vacuum source 82 . Further, the suction hole formed in the upper surface of the third holding portion 64A and the suction hole formed in the upper surface of the fourth holding portion 64B are connected to the third valve 89 and the fourth valve 90, respectively. It is connected to a vacuum source 82 via. The control unit 79 controls opening and closing of the first valve 87 , the second valve 88 , the third valve 89 and the fourth valve 90 . As a result, the controller 79 causes the substrate 7 to be held by vacuum suction on the upper surfaces of the first holding portion 54A, the second holding portion 54B, the third holding portion 64A, and the fourth holding portion 64B. or cancel its retention.

Further, the main pressure-bonding portion 5 in the present embodiment includes a fifth valve 91 for switching between suction of the substrate 7 by the first suction portion 53C and release of the suction. The fifth valve 91 is connected to the suction hole 53D of the first suction portion 53C and the vacuum source 82 via pipes. By controlling the opening and closing of the fifth valve 91, the control section 79 vacuum-sucks the substrate 7 onto the upper surface of the first suction section 53C, and releases the suction.

Similarly, the main pressure-bonding section 5 in the present embodiment includes a sixth valve 92 for switching between suction of the substrate 7 by the second suction section 63C and release of the suction. The sixth valve 92 is connected to the suction hole of the second suction portion 63C and the vacuum source 82 via pipes. The control unit 79 controls the opening and closing of the sixth valve 92 to cause the substrate 7 to be attracted to the upper surface of the second suction unit 63C by vacuum suction, or to release the suction.

7A and 7B are flowcharts showing an example of the crimping operation by the crimping portion 5A according to the present embodiment. 8, 9 and 10 are diagrams for explaining an example of the crimping operation by the crimping portion 5A. In the following description, in order to distinguish between the two substrates 7 held by the substrate holding portion 50, the two substrates 7 are referred to as the first substrate 7A and the second substrate 7B, respectively. . Also, for the crimping portion 5B, the crimping operation similar to the examples shown in FIGS. 7A to 10 is performed.

First, as shown in FIG. 7A, the control unit 79 turns ON the adsorption of each of the first holding unit 54A and the second holding unit 54B (step S101).

Next, the crimping unit 5A moves the first substrate 7A and the second substrate 7B to observation positions by the substrate recognition camera 56 (S102). That is, the crimping section 5A drives the first XYZθ table mechanism 51 to move the first holding section 54A and the second holding section 54B. This places the first substrate 7A between the first lower receiving portion 53A and the first crimping tool 52A, and the second substrate between the second lower receiving portion 53B and the second crimping tool 52B. 7B is placed.

For movement of these first substrate 7A and second substrate 7B, the first level is commanded as the Z table control height. At the first level, the lower surface of the first substrate 7A held by the first holding portion 54A (lower holding portion) is higher than the upper surfaces of the first lower receiving portion 53A and the first suction portion 53C. It is a level corresponding to the state of being placed in a position. As a result, as shown in FIG. 8A, the first substrate 7A and the second substrate 7B are positioned above the first support portion 53A and the second support portion 53B. 8 to 10, the arrows written inside each of the first holding portion 54A and the second holding portion 54B indicate that the substrate 7 is sucked by the holding portion. .

In this state, the edges 7a (see FIG. 2) of the first substrate 7A and the second substrate 7B are positioned on the first support portion 33A and the second support portion 33B. ing. An electronic component 8 is mounted on each edge 7a of the first substrate 7A and the second substrate 7B via an adhesive tape.

Next, the board recognition camera 56 observes the first board 7A and the second board 7B (S103). Then, the substrate position detection unit 86 recognizes the positions of the first substrate 7A and the second substrate 7B by performing recognition processing on the observation results. Then, the control unit 79 controls the first XYZθ table mechanism 51 based on the position recognition result to position the first substrate 7A at the first crimping position as shown in FIG. 8(b). (S104).

Next, the controller 79 commands the second level as the Z table control height. Thereby, the control section 79 lowers the first holding section 54A and the second holding section 54B, and as shown in FIG. (S105). At this time, the lower surface of the first substrate 7A is supported by the first support portion 53A. In other words, the controller 79 moves the holding mechanism including the first holding portion 54A and the second holding portion 54B to move the lower surface of the first substrate 7A held by the first holding portion 54A to the first holding portion 54A. It is supported by one lower receiving portion 53A.

Here, the control unit 79 turns ON the suction of the first suction unit 53C (step S106). Furthermore, the control unit 79 turns off the adsorption of the first holding unit 54A (step S107). As a result, the first substrate 7A is not held by the first holding portion 54A and is held by the first suction portion 53C while being placed on the first lower receiving portion 53A. That is, the control unit 79 causes the first suction unit 53C to suck the first substrate 7A so that the lower surface of the first substrate 7A is maintained in a state of being supported by the first lower receiving unit 53A. , the holding of the first substrate 7A by the first holding portion 54A is released.

Then, the control unit 79 commands the third level as the Z table control height. As a result, as shown in FIG. 9A, the controller 79 causes the first holding portion 54A and the second holding portion 54B to be held while causing the first suction portion 53C to hold the first substrate 7A. downwards. As a result, the first XYZθ table mechanism 51 becomes capable of horizontally moving the second substrate 7B held by the second holding portion 54B. After that, the controller 79 positions the second substrate 7B at the second crimping position (step S109). 9 and 10, an arrow inside the first suction section 53C indicates that the substrate 7 is sucked by the first suction section 53C.

Then, the control unit 79 commands the fourth level as the Z table control height. As a result, as shown in FIG. 9B, the control section 79 causes the second substrate 7B to land on the second support section 53B (step S110). That is, when the lower surface of the first substrate 7A is supported by the first lower receiving portion 53A by suction by the first suction portion 53C, the control portion 79 moves the holding mechanism to move the second substrate 7A. The lower surface of the second substrate 7B held by the holding portion 54B is supported by the second lower receiving portion 53B.

Then, the controller 79 lowers the first crimping tool 52A and the second crimping tool 52B as shown in FIG. 9(c). As a result, the control unit 79 presses the electronic component 8, which is the object to be crimped, with the first crimping tool 52A to crimp it onto the first substrate 7A, and presses the electronic component, which is the object to be crimped, by the second crimping tool 52B. 8 is pressurized and bonded to the second substrate 7B (step S111). That is, the control unit 79 presses the first crimping object onto the upper surface of the first substrate 7A that is sucked by the first suction portion 53C and supported by the first support portion 53A, A second object to be crimped is crimped onto the upper surface of the second substrate 7B held by the second holding portion 54B and supported by the second support portion 53B. Such pressure bonding to the first substrate 7A and pressure bonding to the second substrate 7B are performed simultaneously. In other words, the start timing of crimping the first crimping object to the upper surface of the first substrate 7A and the start timing of crimping the second crimping object to the upper surface of the second substrate 7B are simultaneous. Therefore, in step S111, simultaneous pressure bonding to the first substrate 7A and the second substrate 7B is started.

When the simultaneous crimping is started, the control unit 79 counts the crimping time and determines whether or not a predetermined crimping time has passed (step S112). Here, when the controller 79 determines that the predetermined crimping time has passed (Yes in step S112), the first crimping tool 52A and the second crimping tool 52B are moved as shown in FIG. Raise (step S113). In this step S113, the end timing of crimping the first crimping object to the upper surface of the first substrate 7A and the end timing of crimping the second crimping object to the upper surface of the second substrate 7B are simultaneous. be. Accordingly, in step S113, the simultaneous pressure bonding started in step S111 ends.

Next, the controller 79 commands the second level as the Z table control height. As a result, the controller 79 raises the first holding portion 54A and the second holding portion 54B, as shown in FIG. It is brought into contact with the lower surface of 7A (step S114).

Next, the control unit 79 turns off the suction of the first suction unit 53C (step S115). That is, the control unit 79 releases the suction of the first substrate 7A by the first suction unit 53C. Furthermore, the control unit 79 turns ON the adsorption of the first holding unit 54A (step S116). As a result, the first substrate 7A is not held by the first suction portion 53C, but is held by the first holding portion 54A while being supported on the upper surface of the first lower receiving portion 53A. That is, the first holding portion 54A holds the first substrate 7A instead of the first suction portion 53C.

Then, the control unit 79 commands the first level as the Z table control height. As a result, as shown in (c) of FIG. 10, the first holding portion 54A and the second holding portion 54B are lifted, and the first substrate 7A and the second substrate 7B are separated from the respective support portions. Leave (step S117).

After that, the control section 79 rotates the first holding section 54A and the second holding section 54B by 90°. As a result, in both the first board 7A and the second board 7B, the side of the edge 7b (see FIG. 2) orthogonal to the side of the edge 7a on which the main pressure-bonding operation of the electronic component 8 has already been completed is the first substrate. are located in respective crimping positions on the lower receiving portion 53A and the second lower receiving portion 53B.

After that, the control section 79 performs the same operations as in steps S104 to S117. That is, the control unit 79 performs the processes of steps S104 to S117 on the edge portions 7b of the first substrate 7A and the second substrate 7B in the same order as the crimping operation on the edge portion 7a. do. At this time, if board position recognition needs to be performed again, the control unit 79 performs the operations of steps S102 and S103 again.

When all the operations are completed, the control section 79 rotates the first holding section 54A and the second holding section 54B by 90 degrees in opposite directions. As a result, the orientations of the first substrate 7A and the second substrate 7B are returned to the same directions as when they were loaded, and these substrates 7 are transported to the unloading stage 6 by the fourth substrate transport head 78 in this state. be.

Note that the control unit 79 controls the opening and closing of each of the first valve 87 to the sixth valve 92 shown in FIG. 6 when switching the attraction of the substrate 7 between ON and OFF as described above. In other words, the control unit 79 controls the opening and closing of the first valve 87 to the sixth valve 92, thereby controlling the opening and closing of the first holding unit 54A, the second holding unit 54B, and the first suction unit 53C. The adsorption of the substrate 7 by each is switched between ON and OFF.

As described above, the crimping portion 5A and the crimping portion 5B of the main crimping portion 5 in the present embodiment are crimping devices capable of simultaneously crimping objects to be crimped onto two substrates 7, respectively. For example, the crimping portion 5A includes a first holding portion 54A for contacting and holding a portion of the lower surface of the first substrate 7A and a portion of the lower surface of the second substrate 7B. and a second holding portion 54B for holding the second substrate 7B in contact with the second substrate 7B. Then, the crimping method performed by the crimping unit 5A, that is, the crimping method for crimping the crimping object to each of the first substrate 7A and the second substrate 7B is performed in steps S11 to S14 shown in FIG. 11 below. including the steps of

FIG. 11 is a flow chart showing an example of the processing operation of the crimping section 5A, which is the crimping device according to the embodiment. Note that FIG. 11 is a flow chart showing main steps for carrying out simultaneous pressure bonding among the steps shown in FIG.

As described above, the crimping method according to the present embodiment includes steps S11 to S14. A step S11 moves the holding mechanism including the first holding portion 54A and the second holding portion 54B to move the lower surface of the first substrate 7A held by the first holding portion 54A to the first lower surface. This is the first supporting step of supporting the receiving portion 53A.

In step S12, the first substrate 7A is attracted to the first suction portion 53C so that the lower surface of the first substrate 7A is maintained in a state supported by the first support portion 53A. This is the first adsorption step of releasing the holding of the first substrate 7A by the holding portion 54A.

In step S13, when the lower surface of the first substrate 7A is supported by the first lower support portion 53A by suction by the first suction portion 53C, the holding mechanism is moved to move the second holding portion. This is a second supporting step of supporting the lower surface of the second substrate 7B held by 54B on the second support portion 53B.

A step S14 presses the first crimping object onto the upper surface of the first substrate 7A which is sucked by the first suction portion 53C and supported by the first support portion 53A, and performs the second holding. This is a crimping step of crimping the second crimping object onto the upper surface of the second substrate 7B held by the portion 54B and supported by the second support portion 53B.

Further, the crimping portion 5A, which is the crimping device in the present embodiment, includes a first holding portion 54A and a second holding portion 54B, a first XYZθ table mechanism 51, a first suction portion 53C, a first 53A and 53B, a first crimping tool 52A and a second crimping tool 52B, and a controller 79. The first holding portion 54A is a component for holding the first substrate 7A in contact with a portion of the lower surface of the first substrate 7A. The second holding portion 54B is a component that holds the second substrate 7B in contact with a part of the lower surface of the second substrate 7B. The first XYZθ table mechanism 51 is a moving mechanism that moves a holding mechanism including the first holding portion 54A and the second holding portion 54B. The first suction part 53C is a component for sucking the first substrate 7A. The control unit 79 controls the first holding portion 54A and the second holding portion 54B, the first XYZθ table mechanism 51, the first suction portion 53C, the first support portion 53A and the second holding portion 53A. It controls the undercarriage 53B and the first crimping tool 52A and the second crimping tool 52B. By these controls, the control section 79 executes steps S11 to S14 shown in FIG.

Here, when the holding mechanism is moved, the first holding portion 54A and the second holding portion 54B are moved simultaneously. Therefore, when positioning the second substrate 7B and supporting the second substrate 7B on the second lower receiving portion 53B, the first substrate already supported and positioned by the first lower receiving portion 53A is positioned. It is necessary to separate the first holding portion 54A from the first substrate 7A while maintaining the state of 7A. However, conventionally, the state of the first substrate 7A is maintained by crimping with a crimping tool. That is, the crimping tool presses the object to be crimped and the first substrate 7A against the lower receiving portion, thereby maintaining the already positioned first substrate 7A. As a result, the crimping of the object to be crimped starts on the first substrate 7A earlier than on the second substrate 7B.

On the other hand, in the crimping method according to the present embodiment, the first adsorption step of step S12 and the second support step of step S13 are performed. That is, the first substrate 7A is sucked by the first suction portion 53C so that the lower surface of the first substrate 7A is maintained in a state of being supported by the first lower receiving portion 53A, and the first holding portion The holding of the first substrate 7A by 54A is released. Then, when the lower surface of the first substrate 7A is supported by the first lower receiving portion 53A by suction by the first suction portion 53C, the holding mechanism moves and is held by the second holding portion 54B. The second substrate 7B is supported by the second support portion 53B. Therefore, when positioning the second substrate 7B, the state of the already positioned first substrate 7A is maintained not by the first crimping tool 52A but by suction by the first suction portion 53C.

In the crimping method according to the present embodiment, after the second substrate 7B is positioned and supported by the second lower receiving portion 53B, the first crimping tool 52A and the Crimping is performed by the second crimping tool 52B. At this time, the first crimping tool 52A presses the first crimping object onto the upper surface of the first substrate 7A which is sucked by the first suction portion 53C and supported by the first support portion 53A. crimp. Further, the second crimping tool 52B crimps the second crimping object onto the upper surface of the second substrate 7B held by the second holding portion 54B and supported by the second support portion 53B. do. That is, in the crimping method according to the present embodiment, the state in which the first substrate 7A and the second substrate 7B are respectively supported by the first support portion 53A and the second support portion 53B is the first is maintained by suction by the suction portion 53C and holding by the second holding portion 54B. Therefore, the first crimping tool 52A and the second crimping tool 52B can easily crimp the first substrate 7A and the second substrate 7B for the same amount of time. As a result, the production conditions for the two substrates 7 can be easily made equal.

Further, in the present embodiment, the start timing of crimping the first crimping object to the upper surface of the first substrate 7A and the start timing of crimping the second crimping object to the upper surface of the second substrate 7B are set as follows. , can be done at the same time. Further, the end timing of crimping the first crimping object to the upper surface of the first substrate 7A and the end timing of crimping the second crimping object to the upper surface of the second substrate 7B may be simultaneous. good.

As a result, the first substrate 7A and the second substrate 7B can be easily crimped simultaneously without providing a difference in control timing between the first crimping tool 52A and the second crimping tool 52B. can be done.

Here, each of the crimping portions 5A and 5B in the present embodiment crimps two substrates 7, but may crimp three or more substrates 7. FIG. In other words, the crimping device further includes a third holding portion for holding the third substrate 7 in contact with a portion of the lower surface of the third substrate 7 as a holding portion included in the holding mechanism described above. You may prepare. In this case, the crimping method according to the present embodiment further includes a third supporting step and a second adsorption step. In the third supporting step, the control unit 79 moves the holding mechanism after the first adsorption step (step S12) starts to move the lower surface of the third substrate 7 held by the third holding unit. is supported by the third support portion. In the second suction step, the control unit 79 holds the third substrate 7 to the second suction unit so that the lower surface of the third substrate 7 is supported by the third support portion. Then, the third substrate 7 is released from being held by the third holding portion. Then, in the second supporting step (step S13), the lower surface of the first substrate 7A is supported by the first lower receiving portion 53A by suction by the first suction portion 53C and the second suction portion, and When the lower surface of the third substrate 7 is supported by the third lower receiving portion, the control section 79 moves the holding mechanism to remove the second substrate 7B held by the second holding portion 54B. is supported by the second lower receiving portion 53B. Further, in the crimping step (step S14), the control unit 79 further causes the third substrate 7, which is sucked by the second suction unit and supported by the third support unit, to be pressed onto the upper surface of the third substrate 7. crimping the object to be crimped by a third crimping tool.

As a result, as in the case described above, each of the three substrates 7 can be easily crimped for the same amount of time. As a result, the production conditions for the three substrates 7 can be easily equalized. Also, the crimping by the three crimping tools may be started at the same time, and the crimping by the three crimping tools may be finished at the same time. This makes it possible to simultaneously crimp each of the three substrates 7 while simplifying the control of the three crimping tools.

FIG. 12 is a diagram showing another configuration example of part of the crimping portion 5A. The crimping portion 5A shown in FIG. 12 has a configuration capable of simultaneously crimping each of the three substrates 7 .

Specifically, the crimping section 5A includes not only a first crimping tool 52A and a second crimping tool 52B, but also a crimping tool 52C corresponding to the third crimping tool. This crimping tool 52C is positioned between the first crimping tool 52A and the second crimping tool 52B.

Furthermore, the crimping portion 5A includes not only the first and second support portions 53A and 53B, but also a support portion 53E corresponding to the third support portion. The lower receiving portion 53E is arranged between the first lower receiving portion 53A and the second lower receiving portion 53B.

Furthermore, the crimping portion 5A includes not only the first suction portion 53C but also a suction portion 53F corresponding to the second suction portion. The suction portion 53F is aligned with the first suction portion 53C along the X-axis direction and attached to the lower receiving portion 53E.

Further, the crimping portion 5A includes not only the first holding portion 54A and the second holding portion 54B, but also the holding portion 54C corresponding to the third holding portion. The holding portion 54C is arranged between the first holding portion 54A and the second holding portion 54B on the horizontal rotation drive mechanism 51θ.

In the crimping step (step S14), such a crimping portion 5A is sucked by the first suction portion 53C and crimps the object to be crimped onto the upper surface of the substrate 7 supported by the first support portion 53A. Then, the object to be crimped is crimped onto the upper surface of the substrate 7 held by the second holding portion 54B and supported by the second support portion 53B. At this time, the crimping portion 5A further crimps the object to be crimped onto the upper surface of the substrate 7 which is sucked by the suction portion 53F and supported by the lower receiving portion 53E. As a result, each of the three substrates 7 can be easily crimped for the same amount of time.

In addition, the crimping device such as the crimping portions 5A and 5B includes N (N is an integer equal to or greater than 2) holding portions, N lower receiving portions, a moving mechanism, and (N−1) suction portions. , N crimping tools. The N holding portions are components for holding the N substrates 7 by contacting portions of the lower surfaces of the N substrates 7 . The moving mechanism moves the holding mechanism including the N holders to support the lower surfaces of the N substrates 7 held by the N holders on the N lower receiving parts. is an element. The (N−1) suction units correspond to the (N−1) holding units when the holding by the (N−1) holding units out of the N holding units is released. It is a component that adsorbs each of the (N−1) substrates 7 . The N crimping tools are tools for crimping objects to be crimped onto the upper surfaces of the N substrates 7 . Of the N substrates 7 crimped by the N crimping tools, (N−1) substrates 7 are respectively sucked by (N−1) suction units, and N It is supported by (N-1) lower receiving portions among the lower receiving portions. The remaining one substrate 7 out of the N substrates 7 crimped by the N crimping tools is held by the remaining one holding portion out of the N holding portions, and It is supported by the remaining one of the N lower receiving portions.

As a result, similarly to the above, each of the N substrates 7 can be easily crimped for the same amount of time. As a result, the production conditions for the N substrates 7 can be easily equalized. Also, the crimping by the N crimping tools may be started at the same time, and the crimping by the N crimping tools may be finished at the same time. This makes it possible to simultaneously crimp each of the N substrates 7 while simplifying the control of the N crimping tools.

The crimping method according to one aspect of the present disclosure has been described above based on the embodiment, but the present disclosure is not limited to this embodiment. As long as they do not deviate from the gist of the present disclosure, various modifications conceived by those skilled in the art may also be included within the scope of the present disclosure.

For example, the main crimping portion 5 in the present embodiment includes the crimping portions 5A and 5B, but may include only one of these crimping portions, or three or more crimping portions. may be provided.

Further, in the main crimping portion 5 in the present embodiment, the first suction portion 53C is arranged between the first support portion 53A and the first holding portion 54A, and the second suction portion 63C is It is arranged between the third support portion 63A and the third holding portion 64A. However, the first suction portion 53C and the second suction portion 63C do not have to be arranged as described above. In other words, the first suction portion 53C can be placed at any position if the state in which the substrate 7 is supported by the first lower receiving portion 53A is maintained by suction of the substrate 7 by the first suction portion 53C. may be placed. Similarly, the second suction portion 63C can be positioned at any position as long as the state in which the substrate 7 is supported by the third lower receiving portion 63A is maintained by suction of the substrate 7 by the second suction portion 63C. may be placed in

Further, the first suction portion 53C and the second suction portion 63C in the present embodiment are formed with rectangular suction holes in the XY plane. good too. Moreover, not only one suction hole but also a plurality of suction holes may be formed in each of the first suction portion 53C and the second suction portion 63C.

Further, although the display panel assembly apparatus shown in FIG. 1 in the above embodiment includes a so-called rotary type temporary pressure bonding section 4, it may be provided with a so-called fixed type temporary pressure bonding section.

That is, as shown in FIG. 1, the temporary pressure-bonding unit 4 is configured as a rotary type in which the holding head 45 provided on the index table 42a of the electronic component mounting mechanism 42 is sequentially index-rotated. By this index rotation, the electronic component 8 taken out from the electronic component supply section 43 is transported to the crimping work position on the lower receiving section 47 .

However, the display panel assembling apparatus in the present embodiment may be provided with a fixed temporary pressure-bonding section that does not perform such index rotation.

FIG. 13 is a plan view showing another example of the display panel assembly device.

The display panel assembly apparatus includes a base 111 consisting of a left base 111a, a center base 111b and a right base 111c. These three bases are arranged in the order of the left base 111a, the center base 111b, and the right base 111c from the left side in the left-right direction viewed from the operator OP (the left-right direction of the paper surface in FIG. 13, that is, the X-axis direction). are placed. The left base 111a is provided with a carry-in board placement section 121, the center base 111b is provided with a component mounting execution section 122, and the right base 111c is provided with a carry-out board placement section 123. . The board 7 is processed in order from the left side to the right side in the X-axis direction, that is, the carry-in board placement section 121, the component mounting execution section 122, and the carry-out board placement section 123. As shown in FIG.

The carry-in substrate platform 121 has two substrate platform stages 121s. Two substrates 7 sent from the upstream process side of the display panel assembly apparatus are placed on these two substrate placement stages 121s.

The carry-out substrate platform 123 has two substrate platform stages 123s. Two substrates 7 on which the electronic components 8 have been crimped by the component mounting execution unit 122 are placed on these two substrate placement stages 123s.

The component mounting executing section 122 includes an ACF attaching working section 122a, a component mounting working section 122b, a component crimping working section 122c, and a component crimping working section 122d.

Here, a first base portion 131 and a second base portion 132 are arranged on the central base 111b. A left substrate transfer section 133L having two substrate mounting stages 136 is provided on the first base section 131 . Further, the second base portion 132 is provided with a central substrate transfer portion 133C and a right substrate transfer portion 133R each having two substrate mounting stages 153 . The left substrate transfer section 133L moves the substrates 7 respectively held by the two substrate mounting stages 136 to the working position of the ACF bonding working section 122a. The central board transfer section 133C moves the board 7 held by each of the two board mounting stages 153 to the working position of the component mounting working section 122b and the working position of the component crimping working section 122c. The right board transfer section 133R moves the board 7 held by each of the two board mounting stages 153 to the working position of the component mounting working section 122b and the working position of the component crimping working section 122d.

A moving base 181 is arranged on the base 111 . On this moving base 181, a left substrate transfer section 182a, a central substrate transfer section 182b, and a right substrate transfer section 182c are provided. The two substrates 7 are transferred by the left substrate transfer section 182a, the central substrate transfer section 182b, and the right substrate transfer section 182c. That is, the two substrates 7 are transferred from the carry-in substrate placement portion 121 to the left substrate transfer portion 133L, and transferred from the left substrate transfer portion 133L to the central substrate transfer portion 133C or the right substrate transfer portion 133R. . Further, the two substrates 7 are transferred to the unloading substrate placement portion 123 from the central substrate transfer portion 133C or the right substrate transfer portion 133R.

The ACF sticking working part 122a is held by each of the two substrate mounting stages 136 of the left substrate transfer part 133L, and applies an adhesive tape (specifically, an ACF tape) to the edge of the substrate 7 placed at the working position. affixed.

The component mounting work unit 122b is a component mounting device corresponding to the temporary crimping unit 4 in the above-described embodiment, and performs the work of mounting the electronic component 8 on the substrate 7. FIG. In other words, the component mounting work section 122b temporarily crimps the electronic component 8 onto the board 7 . Specifically, the component mounting work section 122b is held by each of the two board mounting stages 153, the central board transfer section 133C and the right board transfer section 133R, and is arranged at the work position of the component mounting work section 122b. An electronic component 8 is mounted on the edge of the substrate 7 via an adhesive tape. More specifically, the component mounting work unit 122b mounts the electronic component 8 via an adhesive tape on the edge of the substrate 7 held by the substrate mounting stage 153 and supported from below by the backup stage 164. do.

Here, the component mounting work section 122b described above has a mounting head 163 for temporarily pressure-bonding the electronic component 8. As shown in FIG. Unlike the temporary pressure-bonding unit 4 in the above-described embodiment, this component mounting working unit 122b is moved by the mounting head moving mechanism 162 in the X-axis direction without index-rotating the mounting head 163 when temporarily pressure-bonding the electronic component 8 . and move in the Y-axis direction. Specifically, the mounting head 163 moves to the component supply section 161 behind the central base 111b and picks up the electronic component 8 supplied from the component supply section 161 from above. Next, the mounting head 163 moves above the substrate 7 supported by the backup stage 164 while sucking the electronic component 8 , and descends to temporarily press the electronic component 8 onto the substrate 7 .

The component crimping working units 122c and 122d respectively crimp the electronic component 8 onto the board 7 on which the electronic component 8 has been mounted by the component mounting working unit 122b. In other words, the component pressure-bonding working units 122c and 122d perform the final pressure-bonding of the electronic component 8 onto the substrate 7, respectively. Specifically, the component crimping working section 122c is held by each of the two board mounting stages 153 of the central board transfer section 133C, and places the electronic component 8 on the board 7 arranged at the working position of the component crimping working section 122c. crimp. Similarly, the component crimping working section 122d is held by each of the two board mounting stages 153 of the right board transfer section 133R, and crimps the electronic component 8 onto the board 7 placed at the working position of the component crimping working section 122d. do. At this time, the component crimping working units 122c and 122d perform simultaneous crimping on the two substrates 7, respectively, like the crimping units 5A and 5B in the above embodiment. As a result, pressure bonding can be easily performed for the same amount of time on each of the two substrates, so that the production conditions for the two substrates can be easily equalized.

Thus, the crimping device and crimping method in the present disclosure are not limited to the display panel assembling device provided with the rotary type temporary crimping part 4 shown in FIG. can be applied.

Further, in the above-described embodiment, the control unit 79 may be configured by dedicated hardware, or realized by executing a software program suitable for the control unit 79 . Control unit 79 may be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded in a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the control unit 79 and the like of the above embodiment causes the computer to execute each step included in any one of the flowcharts of FIGS. 7A, 7B, and 11. FIG.

The crimping method of the present disclosure has the effect of easily equalizing the production conditions of a plurality of substrates, and can be used for devices that assemble display panels by mounting electronic components on glass substrates by crimping.

3 Adhesive tape applying part 4 Temporary pressure bonding part 5 Main pressure bonding part 5A, 5B Pressure bonding part 7 Substrate 7A First substrate 7B Second substrate 52A First pressure bonding tool 52B Second pressure bonding tool 50, 60 Substrate holding part 51 Second 1 XYZθ table mechanism 52A First crimping tool 52B Second crimping tool 53A First lower receiving part 53B Second lower receiving part 53C First suction part 54A First holding part 54B Second holding part 79 control unit

Claims (9)

a first holding portion for holding the first substrate in contact with a portion of the lower surface of the first substrate; and a portion of the lower surface of the second substrate in contact with the second substrate to hold the second substrate. A crimping method for crimping an object to be crimped onto each of the first substrate and the second substrate, wherein
A holding mechanism including the first holding portion and the second holding portion is moved to support the lower surface of the first substrate held by the first holding portion on the first lower receiving portion. a first supporting step that causes
The first substrate is attracted to the first suction portion so that the lower surface of the first substrate is maintained in a state of being supported by the first lower receiving portion, and the first holding portion holds the first substrate. a first adsorption step of releasing the holding of the first substrate;
When the lower surface of the first substrate is supported by the first support portion by suction by the first suction portion, the holding mechanism is moved to be held by the second holding portion. a second supporting step of supporting the lower surface of the second substrate on the second support portion;
A first object to be crimped is crimped onto the upper surface of the first substrate that is sucked by the first suction portion and supported by the first support portion, and is held by the second holding portion. a crimping step of crimping a second crimping target onto the upper surface of the second substrate supported by the second support portion;
Crimp method including. In the crimping step,
The start timing of crimping the first crimping object to the upper surface of the first substrate and the start timing of crimping the second crimping object to the upper surface of the second substrate are simultaneous.
The crimping method according to claim 1. In the crimping step,
The end timing of crimping the first crimping object to the upper surface of the first substrate and the end timing of crimping the second crimping object to the upper surface of the second substrate are simultaneous.
The crimping method according to claim 1 or 2. When the crimping device further includes a third holding portion for holding the third substrate by contacting a part of the lower surface of the third substrate as a holding portion included in the holding mechanism ,
The crimping method further comprises:
After the first adsorption step is started, the holding mechanism is moved to support the lower surface of the third substrate held by the third holding portion on the third lower receiving portion. a supporting step;
The third substrate is attracted to the second suction portion so that the lower surface of the third substrate is maintained in a state of being supported by the third lower receiving portion. and a second adsorption step of releasing the holding of the third substrate,
In the second supporting step,
By suction by the first suction portion and the second suction portion, the lower surface of the first substrate is supported by the first support portion, and the lower surface of the third substrate is supported by the third substrate. moving the holding mechanism while being supported by the lower receiving portion to support the lower surface of the second substrate held by the second holding portion on the second lower receiving portion;
Further, in the crimping step,
A third object to be crimped is crimped onto an upper surface of the third substrate that is sucked by the second suction portion and supported by the third support portion. The crimping method described in the section. a first holding portion for holding the first substrate in contact with a portion of the lower surface of the first substrate;
a second holding part that holds the second substrate in contact with a portion of the lower surface of the second substrate;
a moving mechanism for moving a holding mechanism including the first holding portion and the second holding portion;
a first suction unit for sucking the first substrate;
a first support portion and a second support portion;
a first crimping tool and a second crimping tool;
and a control unit,
The control unit
a first supporting step of causing the moving mechanism to move the holding mechanism to support the lower surface of the first substrate held by the first holding portion on the first lower receiving portion;
The first holding portion causes the first suction portion to suck the first substrate so that the lower surface of the first substrate is maintained in a state of being supported by the first lower receiving portion. a first adsorption step of releasing the holding of the first substrate by
When the lower surface of the first substrate is supported by the first lower receiving portion by suction by the first suction portion, the holding mechanism is moved by the moving mechanism to perform the second holding. a second supporting step of supporting the lower surface of the second substrate held by the portion on the second support portion;
The first crimping tool is used to crimp the first crimping object onto the upper surface of the first substrate which is sucked by the first suction portion and supported by the first support portion. and performing crimping of a second crimping object onto the upper surface of the second substrate held by the second holding portion and supported by the second support portion. a crimping device that performs a crimping step that causes a crimping tool to perform; In the crimping step,
The start timing of crimping the first crimping object to the upper surface of the first substrate and the start timing of crimping the second crimping object to the upper surface of the second substrate are simultaneous.
A crimping device according to claim 5 . The end timing of crimping the first crimping object to the upper surface of the first substrate and the end timing of crimping the second crimping object to the upper surface of the second substrate are simultaneous.
The crimping device according to claim 5 or 6. The crimping device further comprises:
a third holding portion included in the holding mechanism, the holding portion contacting a part of the lower surface of the third substrate to hold the third substrate;
a second suction unit for sucking the third substrate;
a third support portion;
a third crimping tool;
The control unit further
After the first suction step is started, the holding mechanism is moved by the moving mechanism to move the lower surface of the third substrate held by the third holding portion to the third lower receiving portion. a third supporting step of providing support;
The third substrate is attracted to the second suction portion so that the lower surface of the third substrate is maintained in a state of being supported by the third lower receiving portion. performing a second adsorption step of releasing the holding of the third substrate;
In the second supporting step,
By suction by the first suction portion and the second suction portion, the lower surface of the first substrate is supported by the first support portion, and the lower surface of the third substrate is supported by the third substrate. While being supported by the lower receiving portion, the holding mechanism is moved by the moving mechanism to move the lower surface of the second substrate held by the second holding portion to the second lower receiving portion. to support
The crimping step further includes:
Any one of claims 5 to 7, wherein the third crimping tool crimps a third crimping object onto the upper surface of the third substrate supported by the third under-supporting portion. Crimping device according to. N holders for respectively holding the N substrates (N is an integer equal to or greater than 2) in contact with portions of the lower surfaces of the substrates;
N lower receiving portions;
a moving mechanism that moves a holding mechanism including the N holders to support the lower surfaces of the N substrates held by the N holders on the N lower receiving parts;
each of (N-1) substrates corresponding to the (N-1) holding portions when the holding by the (N-1) holding portions out of the N holding portions is released; (N−1) suction units for sucking
N crimping tools for crimping objects to be crimped onto the upper surfaces of the N substrates;
Of the N substrates crimped by the N crimping tools, (N−1) substrates are respectively sucked by the (N−1) suction units, and supported by (N−1) lower receiving portions of the receiving portions,
The remaining one substrate among the N substrates to be crimped by the N crimping tools is held by the remaining one holding portion among the N holding portions, and a crimping device supported on a remaining one of the sub-supports;

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