JP7165904B2 - COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING APPARATUS - Google Patents

Description

The present invention relates to a component mounting method and a component mounting apparatus for mounting a mounting object such as an electronic component on a substrate to produce a display panel or the like.

In the process of assembling a display panel used in a mobile phone or the like, electronic parts for drivers are mounted on a substrate made of glass that constitutes the panel body. This mounting operation is carried out through a process of mounting an electronic component at a mounting position on the edge of the substrate via an adhesive tape and pressing the electronic component against the substrate for pressure bonding. In recent years, in order to improve production efficiency, a display panel assembly apparatus capable of simultaneously working on a plurality of substrates at each station performing the above work has been used (see, for example, Patent Document 1). By using the display panel assembly apparatus having such a configuration, it is possible to efficiently mount electronic components on the substrate and carry the substrate.

JP-A-2005-129753

However, as mobile phones and the like become thinner year by year, the thickness of the edge portion of the substrate becomes thinner. The method has a problem that it is difficult to maintain high positional accuracy of the component to be mounted with respect to the board.

Accordingly, the present disclosure provides a component mounting method and the like that can easily maintain high positional accuracy of the component to be mounted with respect to the board.

In addition, these general or specific aspects may be realized by a system, method, integrated circuit, computer program, or a recording medium such as a computer-readable CD-ROM. and any combination of recording media.

A component mounting method according to an aspect of the present disclosure is a component mounting method for mounting a component on a board, wherein a correction amount associated with a thickness difference that is a difference in thickness between two portions on the board is specified. a correction amount specifying step; a correction step of correcting a predetermined component mounting position of the component on the substrate according to the specified correction amount; and a crimping step of crimping with a crimping tool.

The component mounting method of the present disclosure can easily maintain high positional accuracy of the component to be mounted with respect to the board.

FIG. 1 is a plan view of a display panel assembly apparatus according to an embodiment. FIG. 2 is a plan view of a display panel to be worked by the display panel assembly apparatus according to the embodiment. FIG. 3 is a perspective view of a temporary pressure-bonding portion included in the display panel assembly apparatus according to the embodiment. FIG. 4 is an explanatory view of the configuration of a horizontal rotation drive mechanism provided in the temporary pressure-bonding portion according to the embodiment. FIG. 5 is a block diagram showing the configuration of a control system in the temporary crimping section according to the embodiment. FIG. 6 is a flow chart showing an example of a temporary pressure bonding operation by the temporary pressure bonding unit according to the embodiment. 7A and 7B are diagrams for explaining an example of a temporary pressure bonding operation by the temporary pressure bonding unit according to the embodiment. FIG. FIG. 8 is a diagram for explaining an example of a temporary pressure bonding operation by the temporary pressure bonding unit according to the embodiment. FIG. 9 is a diagram showing an example of the thickness difference at the edge of the substrate. 10A and 10B are diagrams for explaining positioning of temporary pressure bonding in the temporary pressure bonding portion in the embodiment. FIG. FIG. 11 is a diagram showing an example of a reference table and a thickness difference offset table according to the embodiment. FIG. 12 is a diagram illustrating an example of a mounting position table according to the embodiment; FIG. 13 is a flowchart showing an example of a process of correcting a component mounting position and crimping an electronic component by the control unit according to the embodiment. 14 is a flowchart illustrating an example of processing for generating a thickness difference offset table by the control unit according to the embodiment; FIG. FIG. 15 is a flow chart showing an example of processing for correcting a component mounting position according to an inspection result of a board on which a temporary pressure-bonding unit has been mounted according to the embodiment. FIG. 16 is a plan view showing another example of the display panel assembly device. FIG. 17 is a plan view showing another example of the display panel.

(Knowledge on which the present invention is based)
The inventors of the present invention have found that the display panel assembly apparatus of Patent Document 1 described in the "Background Art" section has the following problems.

The display panel assembling apparatus of Patent Document 1 includes a device (that is, a temporary pressure-bonding unit) that performs a process of placing an electronic component on an adhesive tape stuck on a substrate as a temporary pressure-bonding process. Specifically, the temporary pressure-bonding unit places an electronic component on a substrate via an adhesive tape, and presses a pressure-bonding tool against the electronic component. The crimping tool then presses the electronic component according to set process parameters such as temperature, pressure and time. As a result, the electronic component is temporarily pressure-bonded to the substrate.

Here, a component mounting area for mounting components is formed on the edge of the substrate. This component mounting area is formed by cutting the edge horizontally. However, as the display panel becomes thinner, the thickness of the component mounting area may vary. In other words, there may be a difference in thickness between one end and the other end in the longitudinal direction of the edge of one substrate. As a result, in the temporary crimping of electronic components, the aforementioned process parameters may not be uniform in the electronic components pressed against such a substrate. As a result, the electronic component to be temporarily crimped may be shifted in the longitudinal direction of the edge of the board, and the positional accuracy of the mounted component with respect to the board may be lowered. In addition, due to the decrease in positional accuracy, there is a possibility that the positions of the mounted components may vary on a plurality of mounted boards.

Therefore, in order to solve such problems, a component mounting method according to an aspect of the present disclosure is a component mounting method for mounting a component on a substrate, wherein the thickness, which is the difference between the thicknesses of two portions of the substrate, is a correction amount specifying step of specifying a correction amount associated with the difference; a correction step of correcting a predetermined component mounting position of the component on the board according to the specified correction amount; and a crimping step of crimping the component to the corrected component mounting position with a crimping tool. For example, the correction amount may be the distance in the arrangement direction of the two parts on the substrate. Note that the component may be an electronic component, or may be a component other than the electronic component. The two parts of the substrate are, for example, both ends of the substrate in the X-axis direction.

As a result, the component is crimped to the corrected component mounting position on the board. Therefore, even if the crimped component deviates in the arrangement direction (for example, the X-axis direction) of the two parts due to the thickness difference between the two parts on the substrate, the part can be replaced with the original part mounting before correction. position can be approached. As a result, the component can be mounted at an appropriate position on the board. In other words, it is possible to easily maintain high positional accuracy of the component to be mounted with respect to the board. Furthermore, it is possible to suppress variations in the positions of the mounted components on a plurality of mounted boards.

Further, the correction amount specifying step includes: an identification information obtaining step of obtaining identification information of a mounting target substrate, which is the substrate on which the component is mounted; a first table referencing step of referring to a first data table indicating the correction amount corresponding to the thickness difference of the substrate in association with the identification information of the mounting target board from the first data table; and a first extracting step of specifying the correction amount of the mounting target board by extracting the correction amount of the mounting target board.

Accordingly, when the identification information of the mounting target board is acquired, the correction amount of the mounting target board can be easily specified from the identification information and the first data table. Note that the first data table is, for example, a thickness difference offset table.

Further, the component mounting method further includes a table generation step of generating the first data table, wherein the table generation step acquires the thickness difference of each of the plurality of substrates as a thickness difference measurement value. a obtaining step; and a second table referring step of referring to a second data table showing, for each type of substrate, a plurality of thickness differences in the substrate of that type and correction amounts corresponding to each of the plurality of thickness differences. and, for each of the plurality of substrates, the correction associated with the thickness difference measurement value obtained for the substrate from the plurality of correction amounts for the type of the substrate indicated by the second data table. The first data table is created by associating a second extraction step of extracting the amount, identification information of each of the plurality of substrates, and the correction amount extracted for each of the plurality of substrates. and a matching step of generating.

The second data table shows correction amounts corresponding to each type of substrate and each thickness difference. Therefore, by referring to the first data table generated based on the second data table and the thickness difference measurement value, a more appropriate thickness difference measurement value for each substrate type can be obtained. A correction amount can be specified. Note that the second data table is, for example, a reference table.

Further, the component mounting method further comprises: a deviation amount acquisition step of acquiring a positional deviation amount of the component on the mounted board; and determining whether or not the amount exceeds a threshold value, and in the correction amount specifying step, if it is determined in the determining step that the deviation amount in the arrangement direction exceeds the threshold value, the correction amount is determined. may be specified.

As a result, the correction amount is applied to the component mounting position when the amount of deviation in the arrangement direction (for example, the X-axis direction) is conspicuous among the amount of positional deviation of the component on the mounted board. Therefore, it is possible to suppress an increase in the processing load by applying the correction amount even when the positional deviation in the arrangement direction is slight and does not affect the quality of the mounted board. .

Hereinafter, embodiments will be specifically described with reference to the drawings.

It should be noted that the embodiments described below are all comprehensive or specific examples. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, and the like shown in the following embodiments are examples and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in independent claims representing the highest concept will be described as arbitrary constituent elements.

Each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected about the same component.

(Embodiment)
FIG. 1 is a plan view of a display panel assembly apparatus according to this embodiment. Also, FIG. 2 is a plan view of a display panel assembled by the display panel assembly apparatus according to the present embodiment.

A display panel assembly apparatus assembles a display panel by mounting electronic components for a driver on a glass substrate (hereinafter simply referred to as "substrate") by pressure bonding via an adhesive tape. In FIG. 1, on a base 1, a waiting stage 2, an adhesive tape sticking section 3, a temporary pressure bonding section 4, a final pressure bonding section 5, and an unloading stage 6 are arranged in a horizontal row. Here, in the present embodiment, the temporary pressure-bonding unit 4 is a component mounting device that mounts a mounting target on a board. The mounting object is, for example, an electronic component, but may be an object other than the electronic component. Moreover, since the mounting object is mounted on the substrate by crimping, it can also be said to be a crimping object. The mounting object is specifically an IC (integrated circuit), a flexible substrate, or the like. Further, in the present embodiment, the direction in which the substrate 7 is conveyed is called the X-axis direction, and the direction perpendicular to the X-axis direction on the horizontal plane is called the Y-axis direction. Furthermore, the direction orthogonal to the X-axis direction and the Y-axis direction is called the Z-axis direction.

The standby stage 2 includes a panel mounting table 2a on which two substrates 7 to which electronic components are to be bonded can be mounted. The two substrates 7 are aligned on the panel mounting table 2a by a pre-centering mechanism (not shown), whereby the relative positions of the two substrates 7 are aligned.

As shown in FIG. 2, the substrate 7 has a structure in which two glass substrates for forming a display panel are superimposed. Two mutually orthogonal edges 7a and 7b of the substrate 7 serve as component mounting surfaces (that is, component mounting areas) where the circuit forming surface of the glass substrate is exposed. An electronic component 8 for a driver is mounted by crimping on the connection terminals provided on the edge portions 7a and 7b.

The adhesive tape application unit 3 applies an adhesive tape for bonding electronic components to the two substrates 7 held by the substrate holding unit 30 . The adhesive tape is, for example, an ACF (Anisotropic conductive film) tape. The substrate holder 30 has an XYZθ table mechanism 31 . The substrate holding part 30 drives the XYZ.theta. Positioned on portion 33A and second support portion 33B respectively. Then, the adhesive tape application portion 3 is crimped in a state in which the edge portions of the two substrates 7 are supported by the first support portion 33A and the second support portion 33B corresponding to the substrates 7. A mechanism 32 applies the adhesive tape. The pressure bonding mechanism 32 is composed of tape applying units 32A and 32B, and each of the tape applying units 32A and 32B applies an adhesive tape to the substrate 7. As shown in FIG.

The temporary pressure-bonding portion 4 temporarily pressure-bonds the two substrates 7 to which the adhesive tape is applied by the adhesive tape applying portion 3 and the electronic component 8 for the driver is mounted on the two substrates 7 held by the substrate holding portion 40 . The substrate holder 40 has an XYZθ table mechanism 41 . When the electronic component 8 is mounted, the substrate holding portion 40 drives the XYZθ table mechanism 41 to hold the edge portions of the two substrates 7 against the support portion provided adjacent to the substrate holding portion 40 . 47 in sequence. The electronic component 8 is mounted on the temporary pressure-bonding portion 4 by the electronic component mounting mechanism 42 while the edge of the substrate 7 is supported by the lower receiving portion 47 . Here, the temporary crimping unit 4 sequentially index-rotates the holding head 45 provided on the index table 42a of the electronic component mounting mechanism 42 in the direction of the arrow, so that the electronic component 8 taken out from the electronic component supply unit 43 is It is conveyed to the crimping work position on the lower receiving portion 47 .

The temporary crimping unit 4 is a component mounting device that mounts the electronic component 8 on the board 7 by temporarily crimping the electronic component 8 as described above. Further, when it is not necessary to distinguish the temporary pressure bonding in the temporary pressure bonding portion 4 from the final pressure bonding in the final pressure bonding portion 5, it is simply referred to as pressure bonding.

The main crimping section 5 includes two crimping sections 5A and 5B. The crimping units 5A and 5B use the crimping mechanisms 52 and 62 to actually crimp the electronic components 8 temporarily crimped to the two substrates 7 held by the substrate holding units 50 and 60, respectively. That is, in the main crimping unit 5 as a crimping device, the electronic component 8 mounted on the substrate 7 via the adhesive tape is the object to be crimped. The crimping mechanism 52 is provided with a first lower receiving portion 53A and a second lower receiving portion 53B, and the crimping mechanism 62 is provided with a third lower receiving portion 63A and a fourth lower receiving portion 63B. It is During the main pressure bonding, the pressure bonding mechanisms 52 and 62 drive the first XYZ.theta. The rims are moved onto their respective supporters 53A, 53B, 63A and 63B.

The carry-out stage 6 includes a panel carry-out table 6a, and the substrate 7 after the main pressure bonding by the main pressure bonding section 5 is placed on the panel carry-out table 6a. A substrate transfer mechanism 70 is arranged in front of each work stage described above. The substrate transport mechanism 70 has a structure in which a plurality of substrate transport heads are arranged on a moving member 72 that reciprocates on a slide table 71 in the substrate transport direction (horizontal direction in FIG. 1, that is, the X-axis direction). By moving the moving member 72, the substrate 7 can be simultaneously transported between the work stages by a plurality of substrate transport heads.

Of these substrate transport heads, the first substrate transport head 75 and the second substrate transport head 76 are directly coupled to the moving member 72 . A third substrate transport head 77 and a fourth substrate transport head 78 are coupled to the moving member 72 via a first telescopic mechanism 73 and a second telescopic mechanism 74, respectively. The first substrate transport head 75 and the second substrate transport head 76 simultaneously transport two substrates 7 from the standby stage 2 to the adhesive tape applying section 3 and from the adhesive tape applying section 3 to the temporary pressure bonding section 4, respectively. .

The third substrate transport head 77 and the fourth substrate transport head 78 simultaneously transport two substrates 7 from the temporary pressure bonding section 4 to the final pressure bonding section 5 and from the final pressure bonding section 5 to the unloading stage 6, respectively. At this time, by extending and contracting the rod 73 a of the first telescopic mechanism 73 , the transport destination when the substrate 7 is transported to the main pressure-bonding unit 5 by the third substrate transport head 77 can be selected from the substrate holding units 50 and 60 . You can switch between Further, by extending and retracting the rod 74 a of the second extension mechanism 74 , the substrate holding portions 50 and 60 can be selected as the substrate 7 picking-out source when the substrate 7 is taken out from the main pressure-bonding portion 5 by the fourth substrate conveying head 78 . You can switch to either.

FIG. 3 is a perspective view of the temporary pressure bonding section 4, which is a component mounting device included in the display panel assembly device of the present embodiment.

As described above, the temporary pressure-bonding section 4 in this embodiment includes the substrate holding section 40 having the XYZθ table mechanism 41 . As shown in FIG. 3, the XYZθ table mechanism 41 of the substrate holding section 40 is configured by sequentially stacking an X table 41X, a Y table 41Y, a Z table 41Z and a horizontal rotation driving mechanism 41θ from the bottom. A first holding portion 44A and a second holding portion 44B of the substrate holding portion 40 are provided on the XYZθ table mechanism 41 . By driving the XYZθ table mechanism 41 , the temporary crimping unit 4 sequentially positions the edges of the substrate 7 held by the first holding unit 44A and the second holding unit 44B to the crimping operation position by the crimping tool 46 . can be matched.

A holding head 45 of a crimping mechanism (electronic component mounting mechanism) 42 (see FIG. 1) includes a crimping tool 46 extending downward. The crimping tool 46 is positioned while holding the electronic component 8 on its lower surface at the crimping position, and crimps the electronic component 8 onto the upper surface of the board 7 located at the crimping position. A block-shaped lower receiving portion 47 made of a transparent material is arranged at a crimping operation position of the crimping tool 46 . The lower receiving portion 47 supports from below the substrate 7 held by the first holding portion 44A and the second holding portion 44B at the crimping position.

An observation camera A 48A and an observation camera B 48B are arranged below the support part 47. As shown in FIG. Observation camera A 48A and observation camera B 48B observe the edge of substrate 7 located on lower receiving portion 47 from below through lower receiving portion 47, and recognize the recognition mark formed on substrate 7. As shown in FIG. Further, the observation camera A 48A and the observation camera B 48B observe the electronic component 8 conveyed by the crimping tool 46 and positioned above the lower receiving portion 47 from below through the lower receiving portion 47 .

FIG. 4 is an explanatory diagram of the configuration of the horizontal rotation driving mechanism 41θ in the temporary pressure-bonding section 4 of this embodiment.

As shown in FIG. 4A, the pulleys 35 coupled to the respective rotation shafts of the first holding portion 44A and the second holding portion 44B are provided with a motor 36 provided in the horizontal rotation drive mechanism 41θ. , the rotation is transmitted via belt 38 and pulley 37 . Therefore, by driving the motor 36, the first holding portion 44A and the second holding portion 44B rotate by θ in the horizontal plane. Thereby, the substrate 7 held by each of the first holding portion 44A and the second holding portion 44B can be rotated in the horizontal plane.

As shown in FIG. 4B, the height positions of the upper surfaces of the first holding portion 44A and the second holding portion 44B are not the same. That is, the upper surface of the second holding portion 44B is higher than the upper surface of the first holding portion 44A by ΔH. This ΔH is set larger than the thickness t of the substrate 7 to be held. Therefore, when the first holding portion 44A and the second holding portion 44B are rotated, the two substrates 7 adjacent to each other are rotated at different heights.

By holding the two substrates 7 at different height positions in this way, even if the distance between the first holding portion 44 and the second holding portion 44B is narrow, the two adjacent substrates 7 can be rotated by θ. It is possible to suppress the occurrence of interference in these substrates 7 when the substrates 7 are arranged in the same direction. As a result, the dimension of the temporary pressure-bonding portion 4 in the substrate transport direction (that is, the X-axis direction) can be made compact.

FIG. 5 is a block diagram showing the configuration of the control system in the temporary crimping section 4, which is the component mounting apparatus of this embodiment.

In addition to the components described above, the temporary crimping unit 4 in the present embodiment includes a position detection unit 83, a first valve 84 and a second valve 85, a storage unit 48, a vacuum source 82, a control unit 79. Note that the storage section 48 , the control section 79 and the vacuum source 82 may be shared with the adhesive tape application section 3 and the main pressure bonding section 5 . Further, the vacuum source 82 is continuously driven while the display panel is being assembled by the display panel assembly apparatus.

The position detection unit 83 acquires the observation results of the observation camera A 48A and the observation camera B 48B, and performs recognition processing on the observation results. Thereby, the position detection section 83 recognizes the position of the substrate 7 held by the first holding section 44A and the second holding section 44B and the position of the electronic component 8 held by the crimping tool 46. . The position recognition result is transmitted to the control section 79 .

The control unit 79 controls the crimping mechanism 42 and the XYZθ table mechanism 41 . At this time, the control unit 79 controls the XYZθ table mechanism 41 based on the position recognition results of the electronic component 8 and the substrate 7 . Thereby, the substrate 7 can be aligned in the horizontal direction, the height direction, and the θ rotation direction with respect to the electronic component 8 held by the crimping tool 46 of the crimping mechanism 42 . That is, the controller 79 controls at least the position of the substrate 7 in the XY directions based on the recognition result of the position detector 83 . By this control, the control section 79 aligns the board 7 and the electronic component 8 .

The suction hole formed on the upper surface of the first holding portion 44A and the suction hole formed on the upper surface of the second holding portion 44B are connected via a first valve 84 and a second valve 85, respectively. It is connected to a vacuum source 82 . The control unit 79 controls opening and closing of each of the first valve 84 and the second valve 85 . As a result, the control unit 79 holds the substrate 7 on the upper surface of each of the first holding unit 44A and the second holding unit 44B by vacuum suction, or releases the holding.

The storage unit 48 stores a plurality of data tables regarding the positions of the electronic components 8 mounted on the board 7 . For example, the storage unit 48 is configured by a memory such as ROM (Read Only Memory) or RAM (Random Access Memory), or a hard disk. The plurality of data tables are a reference table 48a, a thickness difference offset table 48b, and a mounting position table 48c. The control unit 79 corrects the component mounting position of the electronic component 8 with respect to the board 7 by referring to these data tables stored in the storage unit 48 . Details of the processing for correcting the component mounting position will be described later.

FIG. 6 is a flow chart showing an example of the crimping operation by the temporary crimping part 4 in this embodiment. 7 and 8 are diagrams for explaining an example of the crimping operation by the temporary crimping portion 4. FIG. In the following description, in order to distinguish between the two substrates 7 held by the substrate holding portion 40, the two substrates 7 are referred to as the first substrate 7A and the second substrate 7B, respectively. .

First, as shown in FIG. 6, the control unit 79 moves the first substrate 7A to the observation position by the observation camera A48A and the observation camera B48B. That is, the control section 79 drives the XYZθ table mechanism 41 to horizontally move the first holding section 44A and the second holding section 44B. As a result, the first substrate 7A held by the first holding portion 44A is positioned between the lower receiving portion 47 and the crimping tool 46. As shown in FIG. At this time, both the first substrate 7A and the second substrate 7B have the edges 7a (see FIG. 2) on the crimping mechanism 42 side. In this state, the adhesive tape attached to the first substrate 7A is positioned directly below the crimping tool 46. As shown in FIG.

Observation camera A 48 A and observation camera B 48 B (see FIG. 3) then observe first substrate 7 A and electronic component 8 held by crimping tool 46 . Then, the position detection unit 83 recognizes the positions of the first board 7A and the electronic component 8 by recognizing the observation result. Based on the position recognition result, the control unit 79 controls the XYZθ table mechanism 41 to position the first substrate 7A at the crimping position (S101), as shown in FIG. 7A.

Next, as shown in FIG. 7B, the control section 79 causes the first substrate 7A to land on the lower receiving section 47 (step S102). Then, as shown in FIG. 7C, the control unit 79 lowers the crimping tool 46 to temporarily crimp the electronic component 8 to the first substrate 7A with the crimping tool 46 (step S103). Thereafter, the control unit 79 counts the temporary pressure bonding time and determines whether or not the predetermined temporary pressure bonding time has elapsed (step S104). (Yes in step S104), the crimping tool 46 is raised (step S105). Next, the control section 79 raises the first holding section 44A and the second holding section 44B (step S106).

Next, the control unit 79 determines whether or not the temporary press-bonding to the second substrate 7B is completed (step S107). When the control unit 79 determines that the temporary pressure-bonding has not been completed (No in step S107), the position detection unit 83 recognizes the observation results of the second board 7B and the electronic component 8. FIG. Based on the recognition process, the control unit 79 controls the XYZθ table mechanism 41 to position the second substrate 7B at the crimping position (S108), as shown in FIG. 8A.

Next, as shown in FIG. 8B, the control section 79 causes the second substrate 7B to land on the lower receiving section 47 (step S102). Then, as shown in FIG. 8C, the control unit 79 lowers the crimping tool 46 to temporarily crimp the electronic component 8 to the second substrate 7B with the crimping tool 46 (step S103). Thereafter, the control unit 79 counts the temporary pressure bonding time and determines whether or not the predetermined temporary pressure bonding time has elapsed (step S104). (Yes in step S104), the crimping tool 46 is raised (step S105). Next, the control section 79 raises the first holding section 44A and the second holding section 44B (step S106).

Then, the control unit 79 rotates the first holding portion 44A and the second holding portion 44B by 90° to similarly perform the crimping operation targeting the edge portion 7b side orthogonal to the edge portion 7a side. When all the operations are completed, the control section 79 rotates the first holding section 44A and the second holding section 44B by 90 degrees in opposite directions, thereby separating the first substrate 7A and the second substrate 7B. Align the orientation of the Then, the first substrate 7A and the second substrate 7B are transported to the main pressure bonding section 5 by the third substrate transport head 77 in this state.

Here, edge portions 7a and 7b of substrate 7 are formed as component mounting regions. That is, the component mounting area is formed by horizontally cutting the edges 7a and 7b of the substrate 7. As shown in FIG. However, depending on the processing accuracy of the cut, there may be a difference in thickness between one end and the other end in the longitudinal direction of each of these edge portions 7a and 7b.

FIG. 9 is a diagram showing an example of the thickness difference of the edge portion 7a of the substrate 7. As shown in FIG. 9A shows the appearance of the substrate 7 held by the substrate holding portion 40 on the Z-axis direction plus side (that is, the upper side). 9B shows the outer shape of the surface of the substrate 7 held by the substrate holding portion 40 on the Y-axis direction plus side (that is, the back side).

As shown in FIG. 9A, the substrate 7 is formed with an edge portion 7a along one side of the substrate 7 and an edge portion 7b along a side orthogonal to the one side as component mounting areas. . In the example shown in FIG. 9A, the edge 7a of the substrate 7 faces the electronic component mounting mechanism 42. As shown in FIG. Therefore, in this case, the longitudinal direction of the edge portion 7a is parallel to the X-axis direction, and the longitudinal direction of the edge portion 7b is parallel to the Y-axis direction.

Terminal regions 8a and 8b are set in the edge portion 7a as regions having connection terminals for the electronic component 8, respectively. A terminal area 8c is set. The temporary pressure-bonding portion 4 positions the substrate 7 so that the electronic component 8 is mounted on each of the terminal regions 8a, 8b, and 8c via the adhesive tape.

However, as described above, depending on the processing accuracy of the component mounting area, the edge portion 7a may have a thickness difference d as shown in FIG. 9B. This thickness difference d is the difference in thickness in the Z-axis direction between one end and the other end in the longitudinal direction of the edge portion 7a. Similar to the edge portion 7a, the edge portion 7b may also have such a thickness difference. The longitudinal direction of each of the edges 7a and 7b is parallel to the transport direction of the substrate 7 in the display panel assembly apparatus, that is, the X-axis direction, when the edges are temporarily pressure-bonded. Therefore, the longitudinal direction of each of the edges 7a and 7b is hereinafter referred to as the X-axis direction.

FIG. 10 is a diagram for explaining the positioning of temporary pressure bonding in the temporary pressure bonding portion 4 in this embodiment. FIG. 10(a), ie, (a1) to (a3), shows the process of temporary pressure bonding by another temporary pressure bonding device different from the temporary pressure bonding unit 4. FIG. FIG. 10(b), ie, (b1) to (b3), shows the process of temporary pressure bonding by the temporary pressure bonding portion 4 in this embodiment.

For example, when positioning the substrate 7, the temporary crimping device places the crimping tool 146 holding the electronic component 8 on the substrate 7 placed on the upper surface of the lower receiving portion 147, as shown in FIG. Opposite the terminal area. An adhesive tape 22a is attached to the terminal area. Next, the temporary crimping device lowers its crimping tool 146 to press the electronic component 8 against the terminal area of the substrate 7 via the adhesive tape 22a, as shown in FIG. 10(a2). That is, the temporary crimping device recognizes the position of the terminal area of the board 7 as the component mounting position, lowers the crimping tool 146 to the component mounting position, and crimps the electronic component 8 onto the board 7 . Then, the temporary crimping device raises the crimping tool 146 as shown in FIG. 10(a3). Here, there is a thickness difference d at the edge of the substrate 7 having the terminal area. That is, the upper surface of the edge of the substrate 7 is inclined. As a result, the electronic component 8 may not be properly pre-compression-bonded to the terminal area of the substrate 7 and may be displaced in the X-axis direction.

On the other hand, in the temporary crimping portion 4 of the present embodiment, when positioning the substrate 7, the crimping tool 46 for holding the electronic component 8 is arranged on the upper surface of the lower receiving portion 47 as shown in FIG. 10(b1). It is shifted in the X-axis direction so as not to face the terminal area of the substrate 7 where the substrate 7 is located. That is, the temporary crimping portion 4 corrects the component mounting position preset in the position of the terminal area in the X-axis direction. In addition, the displacement width or correction amount of the crimping tool 46 with respect to the substrate 7 in the X-axis direction is hereinafter referred to as an X offset. This X offset is determined by the thickness difference d of the substrate 7 described above.

Then, as shown in FIG. 10(b2), the temporary crimping unit 4 lowers the crimping tool 146 to the corrected component mounting position, and presses the electronic component 8 against the substrate 7 via the adhesive tape 22a. . That is, the electronic component 8 is pressure-bonded to the corrected component mounting position on the substrate 7 via the adhesive tape 22a. Then, the temporary crimping part 4 raises the crimping tool 46 as shown in FIG. 10(b3). At this time, even if the substrate 7 has a thickness difference d, in the present embodiment, the electronic component 8 is crimped onto the corrected component mounting position on the substrate 7. Even if it deviates, the electronic component 8 can be appropriately temporarily crimped to the terminal area of the substrate 7 .

11 and 12 are diagrams showing examples of a plurality of data tables stored in the storage section 48 of the temporary crimping section 4. FIG. Specifically, FIG. 11 shows an example of the reference table 48a and the thickness difference offset table 48b, and FIG. 12 shows an example of the mounting position table 48c.

As shown in FIG. 11(a), the reference table 48a stores, for each of a plurality of types of substrates 7, a plurality of thickness differences d in the substrates 7 of that type, and X offsets corresponding to the thickness differences d. are shown in association with each other. For example, the reference table 48a indicates xa01 (.mu.m) as the X offset for the thickness difference d for the substrate 7 of product A if the thickness difference d is within the range of d<d01 (.mu.m). Further, the reference table 48a indicates xa02 (μm) as the X offset for the thickness difference d if the thickness difference d is within the range of d01≦d<d02 (μm). Further, the reference table 48a indicates xa03 (μm) as the X offset for the thickness difference d if the thickness difference d is within the range of d02≦d<d03 (μm).

The thickness difference offset table 48b, as shown in FIG. The measured thickness difference and the X offset corresponding to the thickness difference are shown in association with each other. For example, the thickness difference offset table 48b stores, for the substrate 7 with the substrate ID “001”, the substrate ID “001”, the type “A” of the substrate 7, and the thickness difference “dm1” measured with respect to the substrate 7. ” and the X offset “xa03” corresponding to the thickness difference. In addition, the measured thickness difference is also called thickness difference measurement value. Such a thickness difference measurement value is a value obtained by measuring the substrate 7 with a measuring device. Moreover, the measuring device may be provided in the display panel assembling apparatus or may be outside the display panel assembling apparatus.

Such a thickness difference offset table 48 b is generated by the controller 79 . That is, the control unit 79 acquires the substrate ID, product type, and thickness difference measurement value of each of the plurality of substrates from the measuring device, and writes them in the thickness difference offset table 48b. Then, for each of the plurality of substrates, the control unit 79 specifies the type and the X offset corresponding to the thickness difference measurement value by referring to the reference table 48a, and writes the X offset to the thickness difference offset table 48b. .

Specifically, the control unit 79 acquires, for example, the substrate ID “001”, the product type “A”, and the thickness difference measurement value “dm1” from the measuring device described above. Then, the control unit 79 associates the acquired substrate ID "001", product type "A" and thickness difference measurement value "dm1" with each other and writes them in the thickness difference offset table 48b. Next, the control unit 79 identifies the X offset corresponding to the product type "A" and the thickness difference measurement value "dm1" by referring to the reference table 48a. For example, if the thickness difference measurement value “dm1” is within the range of d02≦dm1<d03, the control unit 79 specifies xa03 (μm) as the X offset. As a result, the control unit 79 associates the X offset "xa03" with the substrate ID "001" and writes it in the thickness difference offset table 48b. The control unit 79 writes such an X offset into the thickness difference offset table 48b for each of the plurality of substrates.

As shown in FIG. 12, the mounting position table 48c includes, for each of a plurality of types of the board 7, for each electronic component mounted on the board 7 of that type, a component ID, which is identification information of the electronic component, and its A component mounting position, which is a position where an electronic component is mounted, is shown. A component mounting position is represented by a position x on the X-axis, a position y on the Y-axis, a position z on the Z-axis, and a rotation angle θ on the XY plane on the board 7 .

For example, the mounting position table 48c indicates the component ID “p01” and the component mounting position (x1, y1, z1, θ) where the component with the component ID “p01” is mounted for the board 7 of the product type A. The component mounting positions indicated by the mounting position table 48c are the positions of the terminal areas of the board 7 and are predetermined positions.

FIG. 13 is a flow chart showing an example of processing for correcting the component mounting position and crimping the electronic component 8 by the control unit 79 .

First, the control unit 79 acquires a board ID, which is identification information of the board to be mounted, which is the board 7 on which the electronic component 8 is mounted (step S201). Next, the control unit 79 reads the thickness difference offset table 48b stored in the storage unit 48 and refers to the thickness difference offset table 48b. As shown in FIG. 11B, the thickness difference offset table 48b associates the substrate ID of each of the plurality of substrates 7 with the X offset corresponding to the thickness difference of the substrate 7. It is a first data table shown in FIG. Then, the control unit 79 specifies the X offset of the mounting target board by extracting the X offset associated with the board ID of the mounting target board from the thickness difference offset table 48b (step S202). In other words, the control unit 79 specifies the correction amount associated with the difference in thickness between the two portions of the board 7, which is the mounting target board.

Next, the control unit 79 corrects the predetermined component mounting position of the electronic component 8 on the board 7 according to the specified X offset (step S203). In other words, the control unit 79 adds the X offset to the component mounting position associated with the board ID acquired in step S201 in the mounting position table 48c stored in the storage unit 48, thereby obtaining the component Correct the mounting position. The correction amount, which is the X offset, is the distance in the arrangement direction (that is, the X-axis direction) of the two parts on the substrate 7 .

Then, the control unit 79 controls the crimping mechanism 42 to crimp the electronic component 8 onto the corrected component mounting position of the board 7 with the crimping tool 46 (step S204).

As described above, in the present embodiment, the electronic component 8 is pressure-bonded to the corrected component mounting position on the substrate 7 . Therefore, even if the crimped electronic component 8 is displaced in the X-axis direction due to the thickness difference at both ends of the substrate 7 in the X-axis direction, the electronic component 8 can be moved to the original component mounting position before correction, that is, to the original component mounting position before correction. It can be brought closer to the terminal area of the substrate 7 . In other words, the electronic component 8 can be mounted at an appropriate position on the board 7 .

Note that the reference table 48a indicates a longer X offset, for example, as the thickness difference d is larger, that is, as the inclination of the component mounting area is larger. Also, the thickness difference d may be a positive or negative value instead of an absolute value. For example, in the transport direction of the substrate 7, that is, in the X-axis direction, when the direction of the transport source is the negative side and the direction of the transport destination is the positive side, the thickness difference d is the thickness of the end of the substrate 7 on the positive side in the X-axis direction. It may be a value obtained by subtracting the thickness of the end of the substrate 7 on the negative side in the X-axis direction from the thickness. For example, in the example shown in FIG. 10(b), the thickness difference d is a negative value. In this case, reference table 48a may indicate a negative X offset for that negative thickness difference d. In the case of the example shown in FIG. 10B, the component mounting position shown in the mounting position table 48c is corrected by a negative X offset by the thickness difference offset table 48b generated based on the reference table 48a. be. At this time, depending on the production state, a correction may be made by adding a specific process to the negative X offset. That is, the control unit 79 adds a negative X offset to the component mounting position to correct the X coordinate position of the component mounting position to a small value. As a result, even if the electronic component 8 crimped to the substrate 7 shifts to the positive side in the X-axis direction, the electronic component 8 approaches the original component mounting position before correction, that is, the terminal area. 7 can be suitably mounted in the terminal area.

FIG. 14 is a flow chart showing an example of processing for the control unit 79 to generate the thickness difference offset table 48b.

First, the control unit 79 acquires the thickness difference of each of the plurality of substrates 7 as a thickness difference measurement value (step S211). That is, the control unit 79 acquires the thickness difference measurement value of the substrate 7 together with the substrate ID and the product type from the above-described measuring device for each of the plurality of substrates 7 .

Next, the control unit 79 reads the reference table 48a stored in the storage unit 48 and refers to the reference table 48a (step S212). As shown in FIG. 11A, the reference table 48a stores, for each type of substrate 7, a plurality of thickness differences in the substrate 7 of the type and the X offset corresponding to each of the plurality of thickness differences. 2 is a second data table shown;

Next, the control unit 79 determines, for each of the plurality of substrates 7 for which the thickness difference measurement values have been acquired, from the plurality of correction amounts for the type of the substrate 7 indicated by the reference table 48a. Then, the X offset associated with the thickness difference measurement value obtained by step S213 is extracted.

Then, the control unit 79 associates the substrate ID of each of the plurality of substrates 7 for which the thickness difference measurement value is acquired with the X offset extracted for each of the plurality of substrates 7 to determine the thickness. A difference offset table 48b is generated (step S214). At this time, the control unit 79 may also write the product type and the thickness difference measurement value to the thickness difference offset table 48b.

The reference table 48a in the present embodiment shows the correction amount corresponding to each type of substrate 7 and each thickness difference. Therefore, by referring to the thickness difference offset table 48b generated based on the reference table 48a and the thickness difference measurement value, a more appropriate thickness difference measurement value of the substrate 7 can be obtained for each type of the substrate 7. A correction amount can be specified.

Further, the control unit 79 may generate the thickness difference offset table 48b for the plurality of substrates 7 before performing temporary pressure bonding on all of the plurality of substrates 7 . Alternatively, the control unit 79 may generate the thickness difference offset table 48b while sequentially performing temporary pressure bonding on a plurality of substrates 7 . In other words, when the substrate 7 is loaded into the display panel assembly apparatus, the control unit 79 measures the substrate ID, product type, and thickness difference of the substrate 7 by feedforward from the measuring device before the substrate 7 is temporarily pressure-bonded. get the value. Next, the control unit 79 writes the substrate ID, product type, and thickness difference measurement value to the thickness difference offset table 48b, and calculates the X offset corresponding to the product type and thickness difference measurement value by referring to the reference table 48a. Identify. Next, the control unit 79 writes the specified X offset to the thickness difference offset table 48b in association with the substrate ID described above. Then, when the board 7 is transported to the temporary crimping section 4 as a mounting target board, the control section 79 uses the X offset for the mounting target board shown in the thickness difference offset table 48b to correct the component mounting position. use.

In the present embodiment, by generating the thickness difference offset table 48b in this manner, the X offset of the substrate 7 can be easily identified by acquiring the substrate ID of the substrate 7. FIG.

Further, the temporary crimping unit 4, which is the component mounting apparatus according to the present embodiment, is configured such that when the amount of positional deviation of the electronic component 8 on the mounted board 7 is inspected by an inspection machine, the component is mounted according to the inspection result. The mounting position may be corrected.

FIG. 15 is a flow chart showing the process of correcting the component mounting position according to the inspection result of the board 7 on which the temporary pressure bonding section 4 has been mounted.

First, the temporary pressure-bonding unit 4 temporarily pressure-bonds the electronic component 8 to the substrate 7 (step S301). As a result, the board 7 on which the electronic component 8 is mounted is generated as the mounted board 7 .

Next, the control unit 79 of the temporary crimping unit 4 acquires the displacement amount of the electronic component 8 on the mounted board 7 from the inspection machine (step S302). For example, the control unit 79 defines the amount of positional deviation of the electronic component 8 as a deviation amount Δx in the X-axis direction, a deviation amount Δy in the Y-axis direction, a deviation amount Δz in the Z-axis direction, and a deviation amount Δθ in the rotation angle θ. get. Moreover, when a plurality of electronic components 8 are mounted on the substrate 7 , the control section 79 may acquire the average value of the deviation amounts of the plurality of electronic components 8 .

Next, the control unit 79 determines whether or not the X offset has been applied to the electronic component 8 on the board 7 (step S303). Here, if it is determined that the X offset has not been applied (No in step S303), the control unit 79 further determines whether the shift amount Δx in the X-axis direction out of the shift amount of the position is larger than the threshold value Th. is determined (step S304). Here, when the controller 79 determines that the deviation amount Δx in the X-axis direction is larger than the threshold value Th (Yes in step S304), it applies the X offset to the component mounting position shown in the mounting position table 48c (step S305). In other words, the control unit 79 is set so as to apply the X offset to the next board 7 of the same type as the mounted board 7 . This X offset is the X offset associated with the board ID of the next board 7 shown in the thickness difference offset table 48b.

Then, the control unit 79 determines whether or not there is a substrate 7 to be temporarily pressure-bonded next (step S306), and when determining that there is the substrate 7 (Yes in step S306), executes the processing from step S301. do. That is, when the application of the X offset has already been set in step S305, in the temporary crimping in step S301, the control unit 79 temporarily crimps the electronic component 8 to the corrected component mounting position on the next board 7. . More specifically, the control unit 79 adds the X offset to the component mounting position associated with the next type of substrate 7 and electronic component 8 shown in the mounting position table 48c, so that the component Correct the mounting position. Then, the control unit 79 crimps the electronic component 8 onto the corrected component mounting position.

In this way, the temporary crimping unit 4 acquires the positional deviation amount of the electronic component 8 on the mounted board 7, and determines whether the deviation amount in the X-axis direction out of the acquired positional deviation amount exceeds the threshold value. determine whether Then, when it is determined that the deviation amount in the X-axis direction exceeds the threshold value, the temporary pressure-bonding unit 4 specifies the X-offset and corrects the component mounting position.

As a result, in the present embodiment, the X offset is applied when the electronic component 8 on the mounted substrate 7 is significantly displaced in the X-axis direction. Therefore, even when the positional deviation in the X-axis direction is slight and does not affect the quality of the mounted substrate 7, it is possible to suppress the processing load from increasing by applying the X-offset. can be done.

As described above, in the component mounting method using the temporary crimping portion 4 according to the present embodiment, the component mounting position on the board 7 is corrected according to the thickness difference of the board 7 , so that the electronic component 8 is mounted at an appropriate position on the board 7 . can do. That is, it is possible to easily maintain high positional accuracy of the mounted electronic component 8 with respect to the substrate 7 . Furthermore, variations in the positions of the mounted electronic components 8 can be suppressed on a plurality of mounted substrates 7 .

Further, the component mounting apparatus that is the temporary crimping unit 4 in the present embodiment is a component mounting apparatus that mounts the electronic component 8 on the substrate 7, and includes a crimping tool 46 for crimping the electronic component 8 onto the substrate 7. , and a control unit 79 that controls the crimping tool 46 . Then, the control unit 79 executes each step shown in the flow charts of FIGS. 6 and 13-15. This makes it possible to easily maintain high positional accuracy of the electronic component 8 to be mounted with respect to the substrate 7, as described above.

Moreover, although the component mounting method and the component mounting apparatus according to one aspect of the present disclosure have been described based on the embodiment, the present disclosure is not limited to this embodiment. As long as they do not deviate from the gist of the present disclosure, various modifications conceived by those skilled in the art may also be included within the scope of the present disclosure.

For example, the mounting position table 48c in the above embodiment indicates the component mounting position for each component ID of the electronic component 8, but not only the component mounting position but also the adjustment amount (Δx , Δy, Δz, Δθ) may also be shown. In this case, the control unit 79 adds the adjustment amount (Δx, Δy, Δz, Δθ) to the component mounting position shown in the mounting position table 48c, eg, (x1, y1, z1, θ1). Then, the controller 79 controls the crimping mechanism 42 to crimp the electronic component 8 to the component mounting position (x1+Δx, y1+Δy, z1+Δz, θ1+Δθ) on the substrate 7 to which the adjustment amount has been added. Here, when the X offset is applied, the control unit 79 corrects the position (x1+Δx) by adding the X offset to the position (x1+Δx) in the X-axis direction.

In addition, although the thickness difference offset table 48b in the above-described embodiment shows the type and thickness difference measurement value in association with the board ID, these need not be shown. That is, the thickness difference offset table 48b only needs to indicate the substrate IDs of the plurality of substrates 7 and the X offsets associated with the substrate IDs, and does not have to indicate other information.

Further, the component mounting apparatus in the above-described embodiment is configured as a so-called rotary temporary crimping unit 4 included in the display panel assembly apparatus shown in FIG. 1, but may be configured as a so-called fixed type device. .

That is, as shown in FIG. 1, the temporary pressure-bonding unit 4 is configured as a rotary type in which the holding head 45 provided on the index table 42a of the electronic component mounting mechanism 42 is sequentially index-rotated. By this index rotation, the electronic component 8 taken out from the electronic component supply section 43 is transported to the crimping work position on the lower receiving section 47 .

However, the component mounting apparatus according to the present embodiment may be configured as a fixed type apparatus that does not perform such index rotation.

FIG. 16 is a plan view showing another example of the display panel assembly device.

The display panel assembly apparatus includes a base 111 consisting of a left base 111a, a center base 111b and a right base 111c. These three bases are arranged in order of the left base 111a, the center base 111b, and the right base 111c from the left side in the left-right direction viewed from the operator OP (the left-right direction in FIG. 16, that is, the X-axis direction). are placed. The left base 111a is provided with a carry-in board placement section 121, the center base 111b is provided with a component mounting execution section 122, and the right base 111c is provided with a carry-out board placement section 123. . The board 7 is processed in order from the left side to the right side in the X-axis direction, that is, the carry-in board placement section 121, the component mounting execution section 122, and the carry-out board placement section 123. As shown in FIG.

The carry-in substrate platform 121 has two substrate platform stages 121s. Two substrates 7 sent from the upstream process side of the display panel assembly apparatus are placed on these two substrate placement stages 121s.

The carry-out substrate platform 123 has two substrate platform stages 123s. Two substrates 7 on which the electronic components 8 have been crimped by the component mounting execution unit 122 are placed on these two substrate placement stages 123s.

The component mounting executing section 122 includes an ACF attaching working section 122a, a component mounting working section 122b, a component crimping working section 122c, and a component crimping working section 122d.

Here, a first base portion 131 and a second base portion 132 are arranged on the central base 111b. A left substrate transfer section 133L having two substrate mounting stages 136 is provided on the first base section 131 . Further, the second base portion 132 is provided with a central substrate transfer portion 133C and a right substrate transfer portion 133R each having two substrate mounting stages 153 . The left substrate transfer section 133L moves the substrates 7 respectively held by the two substrate mounting stages 136 to the working position of the ACF bonding working section 122a. The central board transfer section 133C moves the board 7 held by each of the two board mounting stages 153 to the working position of the component mounting working section 122b and the working position of the component crimping working section 122c. The right board transfer section 133R moves the board 7 held by each of the two board mounting stages 153 to the working position of the component mounting working section 122b and the working position of the component crimping working section 122d.

A moving base 181 is arranged on the base 111 . On this moving base 181, a left substrate transfer section 182a, a central substrate transfer section 182b, and a right substrate transfer section 182c are provided. The two substrates 7 are transferred by the left substrate transfer section 182a, the central substrate transfer section 182b, and the right substrate transfer section 182c. That is, the two substrates 7 are transferred from the carry-in substrate placement portion 121 to the left substrate transfer portion 133L, and transferred from the left substrate transfer portion 133L to the central substrate transfer portion 133C or the right substrate transfer portion 133R. . Further, the two substrates 7 are transferred to the unloading substrate placement portion 123 from the central substrate transfer portion 133C or the right substrate transfer portion 133R.

The ACF sticking working part 122a is held by each of the two substrate mounting stages 136 of the left substrate transfer part 133L, and applies an adhesive tape (specifically, an ACF tape) to the edge of the substrate 7 placed at the working position. affixed.

The component mounting work unit 122b is a component mounting device corresponding to the temporary crimping unit 4 in the above-described embodiment, and performs the work of mounting the electronic component 8 on the substrate 7. FIG. In other words, the component mounting work section 122b temporarily crimps the electronic component 8 onto the board 7 . Specifically, the component mounting work section 122b is held by each of the two board mounting stages 153, the central board transfer section 133C and the right board transfer section 133R, and is arranged at the work position of the component mounting work section 122b. An electronic component 8 is mounted on the edge of the substrate 7 via an adhesive tape. More specifically, the component mounting work unit 122b mounts the electronic component 8 via an adhesive tape on the edge of the substrate 7 held by the substrate mounting stage 153 and supported from below by the backup stage 164. do.

The component crimping working units 122c and 122d respectively crimp the electronic component 8 onto the board 7 on which the electronic component 8 has been mounted by the component mounting working unit 122b. In other words, the component pressure-bonding working units 122c and 122d perform the final pressure-bonding of the electronic component 8 onto the substrate 7, respectively.

Here, the component mounting work section 122b described above has a mounting head 163 for temporarily pressure-bonding the electronic component 8. As shown in FIG. Unlike the temporary pressure-bonding unit 4 in the above-described embodiment, this component mounting working unit 122b is moved by the mounting head moving mechanism 162 in the X-axis direction without index-rotating the mounting head 163 when temporarily pressure-bonding the electronic component 8 . and move in the Y-axis direction. Specifically, the mounting head 163 moves to the component supply section 161 behind the central base 111b and picks up the electronic component 8 supplied from the component supply section 161 from above. Next, the mounting head 163 moves above the substrate 7 supported by the backup stage 164 while sucking the electronic component 8 , and descends to temporarily press the electronic component 8 onto the substrate 7 .

At this time, the component mounting working section 122b corrects the component mounting position on the board 7 according to the thickness difference of the board 7, like the temporary pressure bonding section 4 of the above-described embodiment. Specifically, the component mounting working unit 122b adds an X offset to the component mounting position associated with the board ID of the board 7 in the mounting position table 48c shown in FIG. correct. Then, by controlling the mounting head moving mechanism 162, the component mounting working section 122b crimps the electronic component 8 onto the corrected component mounting position of the board 7 with the mounting head 163. FIG.

Thus, the component mounting apparatus and component mounting method in the present disclosure are not limited to the rotary type apparatus shown in FIG. 1 and the method using the apparatus, and can be applied to any type of apparatus and method. be able to.

In the above-described embodiment, as shown in FIG. 2, the electronic component 8 is temporarily crimped by the temporary crimping portion 4 to two sides of the substrate 7, that is, the edge portions 7a and 7b. , edges 7a and 7b. For example, the electronic component 8 may be temporarily pressure-bonded to four sides of the substrate 7 .

FIG. 17 is a plan view showing another example of the display panel assembled by the display panel assembly device.

The temporary pressure-bonding portion 4 may temporarily pressure-bond four electronic components 8 to a peripheral edge portion 7c including four sides of a substrate 7 constituting a display panel. That is, the electronic component 8 is temporarily pressure-bonded to each of the four sides of the peripheral portion 7c. At this time as well, the temporary pressure-bonding section 4 corrects the component mounting position on each side according to the thickness difference between the two ends of the substrate 7 on each side. Thereby, the electronic component 8 can be mounted at an appropriate position on the board 7 even if there is a thickness difference between the sides. Note that the electronic component 8 may be temporarily pressure-bonded to only one side or three sides of the substrate 7 .

Further, in the above-described embodiment, the control unit 79 may be configured by dedicated hardware, or realized by executing a software program suitable for the control unit 79 . Control unit 79 may be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded in a recording medium such as a hard disk or semiconductor memory. Here, the software that implements the control unit 79 and the like of the above-described embodiment causes the computer to execute each step included in any one of the flowcharts of FIGS. 6 and 13 to 16. FIG.

The component mounting method of the present disclosure has the effect that it is possible to easily maintain high positional accuracy of the components to be mounted with respect to the substrate, and is used in devices such as those for assembling display panels by mounting electronic components on a glass substrate by crimping. It is possible.

3 Adhesive Tape Applied Section 4 Temporary Pressure Bonding Section 5 Final Pressure Bonding Section 7 Board 7A First Board 7B Second Board 8 Electronic Components 8a to 8c Terminal Area 40 Board Holding Section 41 XYZθ Table Mechanism 42 Crimp Mechanism (Electronic Component Mounting Mechanism)
44A first holding portion 44B second holding portion 46 crimping tool 47 lower receiving portion 48 storage portion 48a reference table 48b thickness difference offset table 48c mounting position table 79 control portion

Claims (8)

A component mounting method for mounting a component on a substrate,
a correction amount specifying step of specifying a correction amount associated with a thickness difference that is a difference in thickness between two portions of the substrate;
a correction step of correcting a predetermined component mounting position of the component on the board according to the identified correction amount;
a crimping step of crimping the component to the corrected component mounting position of the substrate with a crimping tool ;
The correction amount is the distance in the arrangement direction of the two parts on the substrate,
Component mounting method. The correction amount specifying step includes:
an identification information acquisition step of acquiring identification information of a mounting target board, which is the board on which the component is mounted;
a first table referencing step of referencing a first data table indicating, for each of a plurality of substrates, identification information of the substrate and a correction amount according to the thickness difference of the substrate in association with each other;
a first extracting step of specifying the correction amount of the mounting target board by extracting the correction amount associated with the identification information of the mounting target board from the first data table;
The component mounting method according to claim 1 . The component mounting method further comprises:
including a table generation step of generating the first data table;
The table generation step includes:
a thickness difference acquiring step of acquiring the thickness difference of each of the plurality of substrates as a thickness difference measurement value;
a second table referring step of referring to a second data table indicating, for each type of substrate, a plurality of thickness differences in the substrate of the type and correction amounts corresponding to each of the plurality of thickness differences;
For each of the plurality of substrates, the correction amount associated with the thickness difference measurement value obtained for the substrate is determined from the plurality of correction amounts for the type of the substrate indicated by the second data table. a second extraction step of extracting;
an associating step of generating the first data table by associating the identification information of each of the plurality of substrates with the correction amount extracted for each of the plurality of substrates;
The component mounting method according to claim 2 . The component mounting method further comprises:
a deviation amount acquiring step of acquiring a deviation amount of the position of the component on the mounted board;
a determination step of determining whether or not the amount of misalignment in the arrangement direction of the two sites out of the amount of misalignment obtained exceeds a threshold;
In the correction amount specifying step,
specifying the correction amount when it is determined in the determining step that the deviation amount in the arrangement direction exceeds a threshold;
A component mounting method according to any one of claims 1 to 3 . A component mounting apparatus for mounting components on a substrate,
a crimping tool for crimping the component to the substrate;
A control unit that controls the crimping tool,
The control unit
a correction amount specifying step of specifying a correction amount associated with a thickness difference that is a difference in thickness between two portions of the substrate;
a correction step of correcting a predetermined component mounting position of the component on the board according to the identified correction amount;
causing the crimping tool to crimp the component onto the corrected component mounting position of the substrate ;
The correction amount is the distance in the arrangement direction of the two parts on the substrate,
Component mounting equipment. The correction amount specifying step includes:
an identification information acquiring step of acquiring identification information of a mounting target board, which is the board on which the component is mounted;
a first table referencing step of referring to a first data table indicating, for each of the plurality of substrates, identification information of the substrate and a correction amount according to the thickness difference of the substrate in association with each other;
a first extraction step of specifying the correction amount of the mounting target board by extracting the correction amount associated with the identification information of the mounting target board from the first data table;
The component mounting apparatus according to claim 5 . The control unit further
performing a table generation step of generating the first data table;
The table generation step includes:
a thickness difference acquisition step of acquiring the thickness difference of each of the plurality of substrates as a thickness difference measurement value;
a second table referring step of referring to a second data table showing, for each type of substrate, a plurality of thickness differences in the substrate of the type and correction amounts corresponding to each of the plurality of thickness differences;
For each of the plurality of substrates, the correction amount associated with the thickness difference measurement value obtained for the substrate is determined from the plurality of correction amounts for the type of the substrate indicated by the second data table. a second extraction step of extracting;
an associating step of generating the first data table by associating the identification information of each of the plurality of substrates with the correction amount extracted for each of the plurality of substrates;
The component mounting apparatus according to claim 6 . The control unit further
a deviation amount acquisition step of acquiring a deviation amount of the position of the component on the mounted board;
a determination step of determining whether or not the amount of misalignment in the arrangement direction of the two sites out of the obtained amounts of misalignment of the positions exceeds a threshold;
The control unit, in the correction amount specifying step,
specifying the correction amount when it is determined in the determining step that the deviation amount in the arrangement direction exceeds a threshold;
A component mounting apparatus according to any one of claims 5 to 7 .

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