JP5834212B2 - Component mounting apparatus and component mounting method - Google Patents

Component mounting apparatus and component mounting method Download PDF

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JP5834212B2
JP5834212B2 JP2012182911A JP2012182911A JP5834212B2 JP 5834212 B2 JP5834212 B2 JP 5834212B2 JP 2012182911 A JP2012182911 A JP 2012182911A JP 2012182911 A JP2012182911 A JP 2012182911A JP 5834212 B2 JP5834212 B2 JP 5834212B2
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substrate
component
unit
component mounting
crimping
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JP2014041890A (en
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味村 好裕
好裕 味村
隆二 浜田
隆二 浜田
明 亀田
明 亀田
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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本発明は、基板に部品を搭載した後、その部品を基板に圧着して液晶パネル基板等の基板の製造を行う部品実装装置及び部品実装方法に関するものである。   The present invention relates to a component mounting apparatus and a component mounting method for manufacturing a substrate such as a liquid crystal panel substrate by mounting the component on the substrate and then pressing the component onto the substrate.

従来、液晶パネル基板製造用の部品実装装置では、基板の端部に接着部材としてのテープ状のACF(Anisotropic Conductive Film)を貼着するACF貼着作業部、基板のACFテープが貼着された部分に駆動回路等のフィルム状部分を有する部品を搭載(仮圧着)する部品搭載作業部、部品搭載作業部において部品が搭載された基板にその部品を圧着(本圧着)する部品圧着作業部を備えている。ここで、部品圧着作業部は通常2基備えられており、基板の流れに沿ってACF貼着作業部、部品搭載作業部、第1の部品圧着作業部及び第2の部品圧着作業部がこの順で並んでいる(例えば、特許文献1参照)。そして、上記作業工程間での基板の受け渡しは先端に基板の吸着部を備えたアーム装置等の基板移載手段によって行われ、基板を作業工程間で受け渡しながら処理を進められる。   Conventionally, in a component mounting apparatus for manufacturing a liquid crystal panel substrate, an ACF adhering operation unit for adhering a tape-shaped ACF (Anisotropic Conductive Film) as an adhesive member to an end portion of the substrate, and an ACF tape for the substrate have been adhered A component mounting work section for mounting (temporary pressure bonding) a part having a film-like part such as a drive circuit on the part, and a component pressure bonding working part for pressure bonding (main pressure bonding) the part to the board on which the component is mounted in the component mounting work part. I have. Here, usually two component crimping work units are provided, and the ACF adhering work unit, the component mounting work unit, the first component crimping work unit, and the second component crimping work unit are arranged along the flow of the substrate. They are arranged in order (for example, refer to Patent Document 1). Then, the transfer of the substrate between the work steps is performed by a substrate transfer means such as an arm device having a substrate suction portion at the tip, and the processing can be advanced while the substrate is transferred between the work steps.

上記従来の部品実装装置には、基板の一辺にのみ部品を取り付けるタイプのものがある。そのような場合、第1の部品圧着作業部と第2の部品圧着作業部が同一の作業を行う。よって、部品の搭載作業がなされた基板は、第1の部品圧着作業部又は第2の部品圧着作業部において、それぞれ基板の一辺について部品の圧着作業を行う。   The conventional component mounting apparatus includes a type in which components are attached only to one side of a substrate. In such a case, the first component crimping operation unit and the second component crimping operation unit perform the same operation. Therefore, the substrate on which the component is mounted is subjected to the component crimping operation for each side of the substrate in the first component crimping working unit or the second component crimping working unit.

特開2005−129753号公報JP 2005-129753 A

ところで、上記のように、基板の端部にフィルム状部分を有する部品を搭載する部品実装装置では、部品の搭載作業から部品の圧着作業に移行する過程の基板移載手段による基板の移し変え時に、基板に搭載した部品に衝撃を与えるなどして落下させてしまうおそれがある。   By the way, as described above, in a component mounting apparatus that mounts a component having a film-like portion at the end of a substrate, when the substrate is transferred by the substrate transfer means in the process of shifting from the component mounting operation to the component crimping operation. There is a risk that the parts mounted on the substrate may be dropped due to impact.

そこで本発明は、基板に搭載した部品を落下させることなく部品の圧着作業に移行することができるようにした部品実装装置及び部品実装方法を提供することを目的とする。   Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method that can shift to a component crimping operation without dropping a component mounted on a substrate.

請求項1に記載の部品実装装置は、基板への部品の搭載作業を行う部品搭載作業部と、前記部品搭載作業部を両側方から挟む位置に設けられ、前記部品搭載作業部において部品の搭載作業が行われた基板に前記部品搭載作業部で搭載された部品を圧着する第1の部品圧着作業部及び第2の部品圧着作業部と、前記部品搭載作業部と前記第1の部品圧着作業部の間を水平方向に移動自在に設けられ、基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部による基板に対する部品の搭載作業が行われた後、前記第1の部品圧着作業部の側に移動して前記基板載置ステージに載置された状態のままの基板を前記第1の部品圧着作業部に移送する第1の基板移送手段と、前記部品搭載作業部と前記第2の部品圧着作業部の間を水平方向に移動自在に設けられ、基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部による基板に対する部品の搭載作業が行われた後、前記第2の部品圧着作業部の側に移動して前記基板載置ステージに載置された状態のままの基板を前記第2の部品圧着作業部に移送する第2の基板移送手段とを備える。   The component mounting apparatus according to claim 1 is provided at a position where the component mounting operation unit that performs the component mounting operation on the board and the component mounting operation unit are sandwiched from both sides. A first component crimping operation unit and a second component crimping operation unit for crimping a component mounted in the component mounting operation unit on a substrate on which work has been performed, the component mounting operation unit, and the first component crimping operation The components are mounted so as to be movable in the horizontal direction, and the substrate is transferred to the component mounting operation unit in a state where the substrate is mounted on the substrate mounting stage, and the component mounting operation unit mounts the component on the substrate. Is moved to the side of the first component crimping operation part, and the substrate that is still placed on the substrate mounting stage is transferred to the first component crimping operation unit. A substrate transfer means, the component mounting working unit, and the 2 is provided so as to be movable in the horizontal direction between the component crimping operation parts, and the substrate is transferred to the component mounting work unit in a state where the substrate is placed on the substrate mounting stage, and the substrate by the component mounting work unit After the component mounting operation is performed on the substrate, the substrate that has been placed on the substrate mounting stage and moved to the second component crimping operation portion side is moved to the second component crimping operation portion. Second substrate transfer means for transferring.

請求項2に記載の部品実装装置は、請求項1に記載の部品実装装置であって、外部より搬入された基板を保持する基板保持部と、前記基板保持部に保持された基板の前記部品搭載作業部により部品が搭載される箇所に接着部材を貼着する接着部材貼着作業部と、前記接着部材貼着作業部により接着部材が貼着された基板を第1の基板移送手段が備える前記基板載置ステージ及び前記第2の基板移送手段が備える前記基板載置ステージに振り分けて載置する基板移載手段とを備える。   The component mounting apparatus according to claim 2 is the component mounting apparatus according to claim 1, wherein the board holding unit that holds a board carried in from the outside, and the component of the board held by the board holding unit. The first substrate transfer means includes an adhesive member attaching operation portion for attaching an adhesive member to a place where a component is mounted by the mounting operation portion, and a substrate on which the adhesive member is attached by the adhesive member attaching operation portion. And a substrate transfer means for distributing and placing on the substrate placement stage provided in the substrate placement stage and the second substrate transfer means.

請求項3に記載の部品実装装置は、請求項1又は2に記載の部品実装装置であって、前記基板移載手段は、前記第1の部品圧着作業部により部品が圧着された基板を前記第1の基板移送手段が備える前記基板載置ステージから受け取って或いは前記第2の部品圧着作業部により部品が圧着された基板を前記第2の基板移送手段が備える前記基板載置ステージから受け取ってその基板を基板搬出部に受け渡す。   A component mounting apparatus according to a third aspect is the component mounting apparatus according to the first or second aspect, wherein the substrate transfer means includes a substrate on which a component is crimped by the first component crimping working unit. Received from the substrate placement stage included in the first substrate transfer means, or received from the substrate placement stage included in the second substrate transfer means, the substrate on which the component has been pressure-bonded by the second component pressure-bonding working unit. The substrate is transferred to the substrate carry-out section.

請求項4に記載の部品実装装置は、請求項1乃至3の何れかに記載の部品実装装置であって、前記部品搭載作業部は、前記第1の基板移送手段により移送された基板又は前記第2の基板移送手段により移送された基板に対する部品の搭載作業を行う前に、前記第1の基板移送手段が備える前記基板載置ステージに対する基板の位置認識又は前記第2の基板移送手段が備える前記基板載置ステージに対する基板の位置認識を行う位置認識手段を備える。   A component mounting apparatus according to a fourth aspect of the present invention is the component mounting apparatus according to any one of the first to third aspects, wherein the component mounting working unit is a substrate transferred by the first substrate transfer means or the Prior to performing a component mounting operation on the substrate transferred by the second substrate transfer means, the position recognition of the substrate with respect to the substrate mounting stage provided in the first substrate transfer means or the second substrate transfer means is provided. Position recognition means for recognizing the position of the substrate relative to the substrate placement stage is provided.

請求項5に記載の部品実装装置は、請求項1に記載の部品実装装置であって、前記部品搭載作業部によって基板に搭載される部品は基板に搭載された状態で基板の外にはみ出すフィルム状部分を有し、前記第1の基板移送手段が備える前記基板載置ステージ及び前記第2の基板移送手段が備える前記基板載置ステージは部品が基板に搭載された状態で前記フィルム状部分を下方から支持するフィルム状部分支持部を備える。   The component mounting apparatus according to claim 5 is the component mounting apparatus according to claim 1, wherein the component mounted on the substrate by the component mounting operation unit protrudes from the substrate in a state of being mounted on the substrate. The substrate placement stage provided in the first substrate transfer means and the substrate placement stage provided in the second substrate transfer means include the film-like portion in a state where components are mounted on the substrate. A film-like partial support portion that is supported from below is provided.

請求項6に記載の部品実装方法は、基板への部品の搭載作業が行われる部品搭載作業部と、前記部品搭載作業部を両側方から挟む位置に設けられ、前記部品搭載作業部において部品の搭載作業が行われた基板に前記部品搭載作業部で搭載された部品を圧着する第1の部品圧着作業部及び第2の部品圧着作業部と、前記部品搭載作業部と前記第1の部品圧着作業部の間を水平方向に移動自在に設けられた第1の基板移送手段及び前記部品搭載作業部と前記第2の部品圧着作業部の間を水平方向に移動自在に設けられた第2の基板移送手段とを備えた部品実装装置による部品実装方法であって、前記第1の基板移送手段が備える基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部により基板に対する部品の搭載作業を行った後、前記第1の基板移送手段を前記第1の部品圧着作業部の側に移動させて前記基板載置ステージに載置させた状態のままの基板を前記第1の部品圧着作業部に移送し、前記第1の部品圧着作業部により基板に部品を圧着する工程と、前記第2の基板移送手段が備える基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部により基板に対する部品の搭載作業を行った後、前記第2の基板移送手段を前記第2の部品圧着作業部の側に移動させて前記基板載置ステージに載置された状態のままの基板を前記第2の部品圧着作業部に移送し、前記第2の部品圧着作業部により基板に部品を圧着する工程とを含む。   According to a sixth aspect of the present invention, there is provided a component mounting method comprising: a component mounting operation unit that performs a component mounting operation on a board; and a position that sandwiches the component mounting operation unit from both sides. A first component crimping working unit and a second component crimping working unit for crimping a component mounted in the component mounting working unit on a substrate on which the mounting operation has been performed, the component mounting working unit, and the first component crimping A first substrate transfer means provided movably in the horizontal direction between the working parts, and a second board movably provided in the horizontal direction between the component mounting work part and the second component crimping work part. A component mounting method using a component mounting apparatus including a substrate transfer unit, wherein the substrate is transferred to the component mounting operation unit in a state where the substrate is mounted on a substrate mounting stage included in the first substrate transfer unit. And the component mounting working unit After the component mounting operation is performed, the first substrate transfer means is moved to the first component crimping operation portion side, and the substrate that has been mounted on the substrate mounting stage is moved to the first substrate mounting stage. In a state where the substrate is placed on the substrate placement stage included in the second substrate transfer means, and a step of crimping the component onto the substrate by the first component crimping operation portion. The board is transferred to the component mounting operation section, and after the component mounting operation section performs the component mounting operation on the board, the second substrate transfer means is moved to the second component crimping operation section side. And a step of transferring the substrate that has been placed on the substrate placement stage to the second component crimping operation unit, and crimping the component to the substrate by the second component crimping operation unit.

本発明では、基板は第1の基板移送手段又は第2の基板移送手段が備える基板載置ステージに載置された状態で部品搭載作業部に移送されて部品の搭載作業がなされ、部品の搭載作業の後は基板載置ステージに載置された状態のまま第1の部品圧着作業部又は第2の部品圧着作業部に移送されてそこで部品の圧着作業が行われるようになっており、部品の搭載作業から部品の圧着作業に移行する過程において、基板移載手段による基板の移し変えがなされないので、基板に搭載した部品を落下させることなく部品の圧着作業に移行することができる。   In the present invention, the substrate is transferred to the component mounting operation section while being mounted on the substrate mounting stage provided in the first substrate transfer means or the second substrate transfer means, and the component mounting operation is performed. After the work, it is transferred to the first component crimping work section or the second component crimping work section while being placed on the substrate placing stage, and the parts are crimped there. In the process of shifting from the mounting operation to the component crimping operation, the substrate transfer means does not change the substrate, so that it is possible to shift to the component crimping operation without dropping the component mounted on the substrate.

本発明の一実施の形態における部品実装装置の平面図The top view of the component mounting apparatus in one embodiment of this invention 本発明の一実施の形態における部品実装装置による基板に対する部品装着作業の進行手順を示す図The figure which shows the advancing procedure of the component mounting operation | work with respect to the board | substrate by the component mounting apparatus in one embodiment of this invention 本発明の一実施の形態における部品実装装置の制御系統を示すブロック図The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention (a)(b)本発明の一実施の形態における部品実装装置が備えるACF貼着作業部及び左方基板移送部の斜視図(A) (b) The perspective view of the ACF sticking operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a left board | substrate transfer part (a)(b)(c)本発明の一実施の形態におけるACF貼着作業部によるACFテープの貼着作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the sticking operation | work of the ACF tape by the ACF sticking operation | work part in one embodiment of this invention. (a)(b)本発明の一実施の形態における部品実装装置が備える部品搭載作業部及び中央基板移送部(右方基板移送部)の斜視図(A) (b) The perspective view of the component mounting operation part with which the component mounting apparatus in one embodiment of this invention is equipped, and a center board | substrate transfer part (right board | substrate transfer part) (a)(b)(c)本発明の一実施の形態における部品搭載作業部による部品搭載作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting operation part in one embodiment of this invention. (a)(b)(c)本発明の一実施の形態における部品搭載作業部による部品搭載作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting operation part in one embodiment of this invention. (a)(b)本発明の一実施の形態における部品実装装置が備える第1の部品圧着作業部(第2の部品圧着作業部)及び左方基板移送部(右方基板移送部)の斜視図(A) (b) The perspective view of the 1st component crimping operation part (2nd component crimping operation part) and the left board | substrate transfer part (right board transfer part) with which the component mounting apparatus in one embodiment of this invention is equipped. Figure (a)(b)(c)本発明の一実施の形態における第1の部品圧着作業部(第2の部品圧着作業部)作業部による部品圧着作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the component crimping operation | work by the 1st component crimping operation part (2nd component crimping operation part) working part in one embodiment of this invention. (a)〜(f)本発明の一実施の形態における第1の部品圧着作業部(第2の部品圧着作業部)による部品圧着作業の実行手順を示す図(A)-(f) The figure which shows the execution procedure of the component crimping operation | work by the 1st component crimping operation part (2nd component crimping operation part) in one embodiment of this invention. 本発明の一実施の形態における基板移載部の斜視図The perspective view of the board | substrate transfer part in one embodiment of this invention 本発明の一実施の形態における部品実装装置の部分平面図The fragmentary top view of the component mounting apparatus in one embodiment of this invention (a)(b)(c)本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (a)(b)(c)本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (a)(b)(c)本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (a)(b)(c)本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (a)(b)(c)本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図(A) (b) (c) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention. (a)(b)本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図(A) (b) The figure which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in one embodiment of this invention

以下、図面を参照して本発明の実施の形態について説明する。図1に示す液晶パネル基板製造用の部品実装装置1は、図2に示す長方形のパネル状の基板2の四辺のうちの一辺の端部に設けられた電極部2aに接着部材としてのACFテープ3を貼着したうえで、その貼着したACFテープ3に部品4を搭載(仮圧着)してその後圧着(本圧着)することにより基板2に部品4を装着する部品装着作業を実行する。ここで用いる部品4は例えば駆動回路部品であり、フィルム状部分4aを有する。   Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 for manufacturing a liquid crystal panel substrate shown in FIG. 1 has an ACF tape as an adhesive member on an electrode portion 2a provided at one end of four sides of a rectangular panel-like substrate 2 shown in FIG. After attaching 3, the component 4 is mounted on the attached ACF tape 3 (preliminary pressure bonding) and then pressure bonded (main pressure bonding), thereby performing the component mounting operation for mounting the component 4 on the substrate 2. The component 4 used here is, for example, a drive circuit component and has a film-like portion 4a.

図1において、部品実装装置1の基台11は、オペレータOPから見た左右方向(図1における紙面左右方向であり、X軸方向とする)の左方から左方基台11a、中央基台11b及び右方基台11cがこの順で配置され、左方基台11aには搬入基板載置部21、中央基台11bには部品実装実行部22、右方基台11cには搬出基板載置部23がそれぞれ備えられている。上記搬入基板載置部21、部品実装実行部22及び搬出基板載置部23はそれぞれ制御手段としての制御装置24(図3)によってその動作が制御されている。基板2はX軸方向を左側から右側に、すなわち搬入基板載置部21、部品実装実行部22、搬出基板載置部23の順に流れて順次作業が施される。   In FIG. 1, a base 11 of the component mounting apparatus 1 includes a left base 11 a and a center base from the left in the left-right direction as viewed from the operator OP (the left-right direction in FIG. 1 and the X-axis direction). 11b and the right base 11c are arranged in this order. The left base 11a has a carry-in board placement unit 21, the central base 11b has a component mounting execution part 22, and the right base 11c has a carry-out board placement. Placement portions 23 are provided. The operations of the carry-in substrate placement unit 21, the component mounting execution unit 22, and the carry-out substrate placement unit 23 are controlled by a control device 24 (FIG. 3) as control means. Substrate 2 flows in the X-axis direction from the left side to the right side, that is, the carry-in board placement unit 21, the component mounting execution unit 22, and the carry-out board placement unit 23 in this order, and the work is sequentially performed.

図1において、搬入基板載置部21は左側(上流工程側)と右側(下流工程側)の2つの基板載置ステージ21sを有している。これら2つの基板載置ステージ21sは左方基台11aに対して昇降自在に設けられており、2つの基板載置ステージ21sには部品実装装置1の上流工程側から送られてきた基板2が載置される。   In FIG. 1, the carry-in substrate placement unit 21 has two substrate placement stages 21s on the left side (upstream process side) and the right side (downstream process side). These two substrate mounting stages 21 s are provided so as to be movable up and down with respect to the left base 11 a, and the substrate 2 sent from the upstream process side of the component mounting apparatus 1 is placed on the two substrate mounting stages 21 s. Placed.

部品実装実行部22は、基板2に接着部材であるACFテープ3を貼着する作業を行うACF貼着作業部(接着部材貼着作業部)22a、基板2への部品4の搭載作業を行う部品搭載作業部22b、部品搭載作業部22bにおいて部品4の搭載作業が行われた基板2に部品搭載作業部22bで搭載された部品4を圧着する第1の部品圧着作業部22c及び第2の部品圧着作業部22dを有する。   The component mounting execution unit 22 performs an operation of attaching the ACF tape 3 that is an adhesive member to the substrate 2, an ACF attaching operation portion (adhesive member attaching operation portion) 22 a, and an operation of mounting the component 4 on the substrate 2. The component mounting operation unit 22b, the first component crimping operation unit 22c that crimps the component 4 mounted on the component mounting operation unit 22b on the substrate 2 on which the component 4 mounting operation has been performed, and the second component mounting operation unit 22b. It has a component crimping work part 22d.

ACF貼着作業部22aは中央基台11bの左部領域に設けられており、部品搭載作業部22bは中央基台11bの中央領域に設けられている。第1の部品圧着作業部22cは中央基台11b上のACF貼着作業部22aと部品搭載作業部22bとの間の領域に設けられており、第2の部品圧着作業部22dは中央基台11b上の部品搭載作業部22bの右側の領域に設けられている。すなわち、本実施の形態の部品実装装置1において、第1の部品圧着作業部22cと第2の部品圧着作業部22dは、部品搭載作業部22bを左右両側方から挟む位置に設けられている。   The ACF attaching work part 22a is provided in the left area of the central base 11b, and the component mounting work part 22b is provided in the central area of the central base 11b. The first component crimping work part 22c is provided in a region between the ACF adhering work part 22a and the component mounting work part 22b on the central base 11b, and the second component crimping work part 22d is the central base. It is provided in the area on the right side of the component mounting work part 22b on 11b. That is, in the component mounting apparatus 1 according to the present embodiment, the first component crimping work part 22c and the second component crimping work part 22d are provided at positions sandwiching the component mounting work part 22b from the left and right sides.

中央基台11b上のACF貼着作業部22aの前方領域(オペレータOPから見た前後方向をY軸方向とする)には第1のベース部31が設けられており、中央基台11b上の部品搭載作業部22b、第1の部品圧着作業部22c及び第2の部品圧着作業部22dの前方領域には第2のベース部32がX軸方向に延びて設けられている。   A first base portion 31 is provided in the front area of the ACF attaching work portion 22a on the central base 11b (the front-rear direction viewed from the operator OP is the Y-axis direction). A second base portion 32 is provided extending in the X-axis direction in the front region of the component mounting operation portion 22b, the first component crimping operation portion 22c, and the second component crimping operation portion 22d.

図1及び図4(a),(b)において、第1のベース部31には左方基板移送部33Lが設けられている。この左方基板移送部33Lは、第1のベース部31上にY軸方向に延びて設けられ、第1のベース部31上をX軸方向に移動自在に設けられたY軸テーブル34と、Y軸テーブル34上をY軸方向に移動自在に設けられた移動ステージ35と、移動ステージ35の上面にX軸方向に並んで設けられた2つの基板載置ステージ36を有する。2つの基板載置ステージ36上には搬入基板載置部21の2つの基板載置ステージ21sから2枚の基板2が移載されて保持される。   1 and FIGS. 4A and 4B, the first base portion 31 is provided with a left substrate transfer portion 33L. The left substrate transfer portion 33L is provided on the first base portion 31 so as to extend in the Y-axis direction, and is provided on the first base portion 31 so as to be movable in the X-axis direction. The moving stage 35 is provided so as to be movable in the Y-axis direction on the Y-axis table 34, and two substrate mounting stages 36 provided side by side in the X-axis direction on the upper surface of the moving stage 35. On the two substrate placement stages 36, the two substrates 2 are transferred and held from the two substrate placement stages 21s of the carry-in substrate placement portion 21.

2つの基板載置ステージ36はそれぞれ移動ステージ35に対して昇降自在に設けられており、制御装置24はY軸テーブル34に対して移動ステージ35をY軸方向に移動させて基板2の移送を行い、2つの基板載置ステージ36を昇降させて、2つの基板載置ステージ36に載置された2枚の基板2を上下させる。   The two substrate mounting stages 36 are provided so as to be movable up and down with respect to the moving stage 35. The control device 24 moves the moving stage 35 in the Y-axis direction with respect to the Y-axis table 34 to transfer the substrate 2. Then, the two substrate placement stages 36 are moved up and down to raise and lower the two substrates 2 placed on the two substrate placement stages 36.

図4(a),(b)において、ACF貼着作業部22aは中央基台11bの上方をX軸方向に並んで設けられた2つの貼着ヘッド41と、各貼着ヘッド41の下方にX軸方向に延びて設けられた2つのACF貼着作業用のバックアップステージ42を有する。   4 (a) and 4 (b), the ACF adhering work part 22a includes two adhering heads 41 arranged in the X-axis direction above the central base 11b, and below the adhering heads 41. Two backup stages 42 for attaching ACF are provided extending in the X-axis direction.

2つの貼着ヘッド41はそれぞれACFテープ3を繰り出し供給するとともに、その繰り出したACFテープ3を所定長さに切断してこれを所定の位置で水平姿勢に保持するテープ供給部41aと、テープ供給部41aが水平姿勢に保持したACFテープ3を上方からACF貼着作業用のバックアップステージ42の側に押し付ける貼着ツール41bを備えている。   Each of the two sticking heads 41 feeds and feeds the ACF tape 3, cuts the fed ACF tape 3 into a predetermined length, and holds it in a horizontal position at a predetermined position, and a tape supply A sticking tool 41b for pressing the ACF tape 3 held in a horizontal posture by the part 41a from above onto the backup stage 42 side for ACF sticking work is provided.

制御装置24は、左方基板移送部33Lの移動ステージ35をY軸テーブル34上の前方に設定された「基板受け渡し位置」(図4(a))と後方に設定された「作業位置」(図4(b))との間で移動させる。「基板受け渡し位置」は2つの基板載置ステージ36に対して基板2の受け渡しを行うことができる位置であり、「作業位置」は、2つの基板載置ステージ36に載置された2枚の基板2それぞれの電極部2aを2つのACF貼着作業用のバックアップステージ42の上方に位置させることができる位置である。   The control device 24 moves the moving stage 35 of the left substrate transfer part 33L on the Y-axis table 34 to the “substrate delivery position” (FIG. 4A) set to the front and the “work position” set to the rear (see FIG. 4A). 4 (b)). The “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate placement stages 36, and the “working position” is the two sheets placed on the two substrate placement stages 36. This is a position where the electrode portions 2a of the respective substrates 2 can be positioned above the two backup stages 42 for attaching the ACF.

貼着ヘッド41による基板2へのACFテープ3の貼着作業について図5を参照しながら説明する。先ず図5(a)に示すように、制御装置24が、テープ供給部41aを作動させて所定長さに切断した状態のACFテープ3を基板2(電極部2a)の上方に位置させる。次に図5(b)に示すように、貼着ツール41bを下降させてACFテープ3を基板2ごとACF貼着作業用のバックアップステージ42に押し付ける。最後に図5(c)に示すように、貼着ツール41bを基板2に対して上昇させる。結果、基板2に対して、所定長さのACFテープ3が貼着される。   An operation of attaching the ACF tape 3 to the substrate 2 by the attaching head 41 will be described with reference to FIG. First, as shown in FIG. 5A, the control device 24 operates the tape supply unit 41a to position the ACF tape 3 in a state cut to a predetermined length above the substrate 2 (electrode unit 2a). Next, as shown in FIG. 5B, the sticking tool 41b is lowered to press the ACF tape 3 together with the substrate 2 against the backup stage 42 for the ACF sticking work. Finally, as shown in FIG. 5C, the sticking tool 41 b is raised with respect to the substrate 2. As a result, the ACF tape 3 having a predetermined length is attached to the substrate 2.

図1において、第2のベース部32には中央基板移送部33Cと右方基板移送部33Rが設けられている。中央基板移送部33Cと右方基板移送部33Rは同型であり、中央基板移送部33Cは右方基板移送部33Rの左方に位置している。中央基板移送部33Cは(右方基板移送部33Rも同様)、図6(a),(b)に示すように、第2のベース部32に沿ってX軸方向に移動自在に設けられたY軸テーブル51、Y軸テーブル51の上をY軸方向に移動自在に設けられた移動ステージ52、移動ステージ52の上面にX軸方向に並んで設けられた2つの基板載置ステージ53を有する。2つの基板載置ステージ53は第2のベース部32に対するY軸テーブル51のX軸方向への移動及びY軸テーブル51に対する移動ステージ52の移動によって水平方向への移動が自在であり、2つの基板載置ステージ53上には左方基板移送部33Lから2枚の基板2が移載される。   In FIG. 1, the second base portion 32 is provided with a central substrate transfer portion 33C and a right substrate transfer portion 33R. The central substrate transfer unit 33C and the right substrate transfer unit 33R are the same type, and the central substrate transfer unit 33C is located to the left of the right substrate transfer unit 33R. The central substrate transfer unit 33C (same as the right substrate transfer unit 33R) is provided to be movable in the X-axis direction along the second base portion 32, as shown in FIGS. 6 (a) and 6 (b). A Y-axis table 51, a moving stage 52 provided on the Y-axis table 51 so as to be movable in the Y-axis direction, and two substrate mounting stages 53 provided side by side in the X-axis direction on the upper surface of the moving stage 52 are provided. . The two substrate placement stages 53 can move in the horizontal direction by moving the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moving the moving stage 52 with respect to the Y-axis table 51. On the substrate placement stage 53, the two substrates 2 are transferred from the left substrate transfer part 33L.

2つの基板載置ステージ53はそれぞれ移動ステージ52に対して昇降自在に設けられている。制御装置24は第2のベース部32に対するY軸テーブル51のX軸方向への移動及びY軸テーブル51に対する移動ステージ52のY軸方向への移動を行って2つの基板載置ステージ53を水平面内方向に移動させることで基板2の移送を行い、2つの基板載置ステージ53を昇降させて(図3)、2つの基板載置ステージ53に載置された2枚の基板2を上下させる。   The two substrate mounting stages 53 are provided so as to be movable up and down with respect to the moving stage 52. The control device 24 moves the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moves the moving stage 52 in the Y-axis direction with respect to the Y-axis table 51 to place the two substrate placement stages 53 in a horizontal plane. The substrate 2 is transferred by moving inward, the two substrate placement stages 53 are moved up and down (FIG. 3), and the two substrates 2 placed on the two substrate placement stages 53 are moved up and down. .

図1及び図6(a),(b)において、部品搭載作業部22bは、中央基台11bの後部から後方に張り出して設けられて部品4の供給を行う部品供給部61、中央基台11bの中央後部に設けられた搭載ヘッド移動機構62によって水平面内で移動自在であり、部品供給部61が供給する部品4を上方から吸着する搭載ヘッド63及び第2のベース部32の中央部後方領域にY軸方向に延びて設けられた部品搭載作業用のバックアップステージ64を備える。制御装置24は、部品供給部61による部品4の供給動作制御、搭載ヘッド移動機構62の作動による搭載ヘッド63の水平面内での移動動作、搭載ヘッド63による部品4の吸着動作を制御する。これにより、搭載ヘッド63による部品4の吸着(ピックアップ)から部品4の基板2への搭載までの一連の作業が行われる(図3)。   In FIG. 1 and FIGS. 6A and 6B, the component mounting work unit 22b is provided so as to project rearward from the rear portion of the central base 11b to supply the component 4, and the central base 11b. A mounting head 63 that is movable in a horizontal plane by a mounting head moving mechanism 62 provided at the center rear of the mounting head 63 and sucks the component 4 supplied by the component supply unit 61 from above, and a central rear region of the second base portion 32. Is provided with a backup stage 64 for component mounting provided extending in the Y-axis direction. The control device 24 controls the supply operation of the component 4 by the component supply unit 61, the movement operation of the mounting head 63 in the horizontal plane by the operation of the mounting head moving mechanism 62, and the suction operation of the component 4 by the mounting head 63. Thereby, a series of operations from adsorption (pickup) of the component 4 by the mounting head 63 to mounting of the component 4 on the substrate 2 is performed (FIG. 3).

図6(a)において、部品搭載作業用のバックアップステージ64内には撮像視野を上方に向けた2つの位置認識カメラ65がX軸方向に並んで設けられている。これら2つの位置認識カメラ65は制御装置24に制御されて撮像動作を行い、部品搭載用のバックアップステージ64の上部に設けられた石英ガラス等の透明材料部64a(図6(a))を通して部品搭載用のバックアップステージ64の上方に位置する物体を撮像する。   In FIG. 6A, in the backup stage 64 for component mounting work, two position recognition cameras 65 with the imaging field of view facing upward are provided side by side in the X-axis direction. These two position recognition cameras 65 are controlled by the control device 24 to perform an imaging operation, and the parts are passed through a transparent material part 64a (FIG. 6A) such as quartz glass provided on the upper part of the backup stage 64 for mounting parts. An object located above the mounting backup stage 64 is imaged.

制御装置24は、中央基板移送部33Cの移動ステージ52をY軸テーブル51上の前方に設定された「基板受け渡し位置」(図6(a))と後方に設定された「作業位置」(図6(b))との間で移動させる。「基板受け渡し位置」は2つの基板載置ステージ53に対して基板2の受け渡しを行うことができる位置である。「作業位置」は、2つの基板載置ステージ53に載置された基板2の電極部2aに貼着されたACFテープ3を部品搭載作業用のバックアップステージ64の上方(更には後述する部品圧着作業用のバックアップステージ72の上方)に位置させることができる位置である。   The control device 24 sets the moving stage 52 of the central substrate transfer unit 33C to the “substrate transfer position” (FIG. 6A) set in front of the Y-axis table 51 and the “work position” set in the rear (FIG. 6). 6 (b)). The “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate placement stages 53. The “working position” indicates that the ACF tape 3 attached to the electrode portion 2a of the substrate 2 placed on the two substrate placement stages 53 is positioned above the backup stage 64 for component placement work (further, component crimping described later). This is a position that can be positioned above the work backup stage 72.

基板2に部品4を搭載する場合、制御装置24は先ず、2つの位置認識カメラ65に、部品搭載用のバックアップステージ64の上方に位置された基板2が有する2つの位置認識マークm(図2)を撮像させ(図7(a))、基板載置ステージ53に対する基板2の位置を算出して基板2の位置認識を行って、その認識した基板2の位置情報を制御装置24の記憶部24b(図3)に記憶する。そして、一旦移動ステージ52を前方に移動させてバックアップステージ64の上方から基板2を退去させたら(図7(b))、搭載ヘッド63を下降させて、部品4をバックアップステージ64に(位置認識カメラ65の側)に近づける。そして、今度は2つの位置認識カメラ65に部品4が有する位置認識マーク(図示せず)を撮像させ(図7(c))、搭載ヘッド63に対する部品4の位置を算出して部品4の位置認識を行って、その認識した部品4の位置情報を上記記憶部24bに記憶する。   When the component 4 is mounted on the board 2, the control device 24 first has two position recognition cameras 65 and two position recognition marks m (see FIG. 2) of the board 2 positioned above the component mounting backup stage 64. ) (FIG. 7A), the position of the substrate 2 with respect to the substrate mounting stage 53 is calculated to recognize the position of the substrate 2, and the position information of the recognized substrate 2 is stored in the storage unit of the control device 24. 24b (FIG. 3). Once the moving stage 52 is moved forward and the substrate 2 is withdrawn from above the backup stage 64 (FIG. 7B), the mounting head 63 is lowered to move the component 4 to the backup stage 64 (position recognition). Approach the camera 65 side. Then, the position recognition marks (not shown) of the component 4 are picked up by the two position recognition cameras 65 (FIG. 7C), the position of the component 4 with respect to the mounting head 63 is calculated, and the position of the component 4 is calculated. Recognition is performed, and the position information of the recognized component 4 is stored in the storage unit 24b.

制御装置24は、基板2の位置情報と部品4の位置情報を記憶部24bに記憶したら、搭載ヘッド63を上昇させたうえで(図8(a))、移動ステージ52を再度「作業位置」に位置させる。そして、記憶部24bに記憶した部品4の位置と基板2の位置との相対位置関係に基づいて、部品4側の図示しない2つの位置認識マークと基板2側の2つの位置認識マークmが上下に合致するように、中央基板移送部33Cの作動制御を行って、基板2の位置を調整する(図8(b))。   After storing the position information of the substrate 2 and the position information of the component 4 in the storage unit 24b, the control device 24 raises the mounting head 63 (FIG. 8A), and then moves the moving stage 52 to the “working position” again. To be located. Then, based on the relative positional relationship between the position of the component 4 and the position of the substrate 2 stored in the storage unit 24b, two position recognition marks (not shown) on the component 4 side and two position recognition marks m on the substrate 2 side are moved up and down. The position of the substrate 2 is adjusted by controlling the operation of the central substrate transfer unit 33C so as to match the above (FIG. 8B).

このように、本実施の形態における部品実装装置1の部品搭載作業部22bが備える位置認識カメラ65は、中央基板移送部33Cにより移送された基板2又は右方基板移送部33Rにより移送された基板2に対する部品4の搭載作業を行う前に、中央基板移送部33Cが備える基板載置ステージ53に対する基板2の位置認識又は右方基板移送部33Rが備える基板載置ステージ53に対する基板2の位置認識を行う位置認識手段となっている。   As described above, the position recognition camera 65 included in the component mounting operation unit 22b of the component mounting apparatus 1 according to the present embodiment is the substrate 2 transferred by the central substrate transfer unit 33C or the substrate transferred by the right substrate transfer unit 33R. 2, the position recognition of the substrate 2 with respect to the substrate placement stage 53 provided in the central substrate transfer unit 33 </ b> C or the position recognition of the substrate 2 with respect to the substrate placement stage 53 provided in the right substrate transfer unit 33 </ b> R is performed. It is a position recognition means for performing.

制御装置24は、このようにして図示しない部品4側の2つの位置認識マークと基板2の2つの位置認識マークmが上下に合致するようにしたら、搭載ヘッド63を下降させ、搭載ヘッド63に吸着させた部品4を基板2上のACFテープ3に押し付けて基板2に搭載する(図8(c))。なお、このときの搭載ヘッド63の押し付け力は部品搭載用のバックアップステージ64によって支持される。   When the two position recognition marks on the component 4 side (not shown) and the two position recognition marks m on the substrate 2 are aligned vertically as described above, the control device 24 lowers the mounting head 63 and moves the mounting head 63 to the mounting head 63. The sucked component 4 is pressed against the ACF tape 3 on the substrate 2 and mounted on the substrate 2 (FIG. 8C). The pressing force of the mounting head 63 at this time is supported by the backup stage 64 for mounting components.

図6〜図8に示すように、中央基板移送部33C(右方基板移送部33Rも同じ)が備える2つの基板載置ステージ53のそれぞれには、その基板載置ステージ53の後方をX軸方向に延びる水平部54aを有した枠状のフィルム状部分支持部54が設けられている。図2等に示すように、部品搭載作業部22bによって基板2に搭載された部品4は、基板2に搭載された状態でフィルム状部分4aが基板2の外にはみ出す。しかしながら、上記フィルム状部分支持部54が各基板載置ステージ53に設けられていることにより、部品4が基板2に搭載された状態で基板2の外にはみ出している部品4のフィルム状部分4aがフィルム状部分支持部54の水平部54aによって下方から支持される。これにより、基板2に搭載された状態の部品4のフィルム状部分4aが下方に垂れ下がった状態になることが防止される。   As shown in FIGS. 6 to 8, each of the two substrate placement stages 53 provided in the central substrate transfer portion 33 </ b> C (the same applies to the right substrate transfer portion 33 </ b> R) is arranged so that the rear of the substrate placement stage 53 is placed on the X axis. A frame-like film-like partial support portion 54 having a horizontal portion 54a extending in the direction is provided. As shown in FIG. 2 and the like, the component 4 mounted on the substrate 2 by the component mounting operation unit 22 b protrudes from the substrate 2 in the state where the component 4 is mounted on the substrate 2. However, since the film-like portion support portion 54 is provided on each substrate mounting stage 53, the film-like portion 4 a of the component 4 protruding from the substrate 2 in a state where the component 4 is mounted on the substrate 2. Is supported from below by the horizontal part 54a of the film-like part support part 54. Thereby, it is prevented that the film-like part 4a of the component 4 in the state mounted on the board | substrate 2 will be in the state hung down below.

図9(a),(b)に示すように、第1の部品圧着作業部22cは(第2の部品圧着作業部22dも同様)は、X軸方向に並んで設けられた2つの圧着ヘッド71と、各圧着ヘッド71の下方にY軸方向に延びて設けられた2つの部品圧着作業用のバックアップステージ72を備える。制御装置24は、第1の部品圧着作業部22cが備える圧着ヘッド71及び第2の部品圧着作業部22dが備える圧着ヘッド71それぞれの昇降動作を制御する(図3)。   As shown in FIGS. 9A and 9B, the first component crimping work portion 22c (same as the second component crimping work portion 22d) has two crimping heads arranged side by side in the X-axis direction. 71 and two backup stages 72 for crimping the two components provided in the Y-axis direction below the respective crimping heads 71. The control device 24 controls the ascending and descending operations of the crimping head 71 provided in the first component crimping operation unit 22c and the crimping head 71 provided in the second component crimping operation unit 22d (FIG. 3).

制御装置24は、中央基板移送部33Cが備える2つの基板載置ステージ53に載置された2枚の基板2について、搭載ヘッド63による部品4の搭載作業が終了したら、Y軸テーブル51をそのまま第2のベース部32に沿って左方(すなわち第1の部品圧着作業部22cの側に水平方向に)に移動させ、2つの基板載置ステージ53に載置された2枚の基板2の各ACFテープ3が貼着された部分を2つの部品圧着作業用のバックアップステージ72の上方(2つの圧着ヘッド71の下方)に位置させる(図9(a))。そして、第1の部品圧着作業部22cが備える2つの圧着ヘッド71を順次下降させて、部品搭載作業部22bで搭載した部品4を2枚の基板2に圧着する(図10(a)→図10(b)→図10(c))。   When the mounting operation of the component 4 by the mounting head 63 is completed on the two substrates 2 placed on the two substrate placement stages 53 provided in the central substrate transfer unit 33C, the control device 24 uses the Y-axis table 51 as it is. The two substrates 2 placed on the two substrate placement stages 53 are moved to the left along the second base portion 32 (that is, horizontally toward the first component crimping work portion 22c). The portion to which each ACF tape 3 is attached is positioned above the backup stage 72 for two component crimping operations (below the two crimping heads 71) (FIG. 9A). Then, the two crimping heads 71 provided in the first component crimping work unit 22c are sequentially lowered, and the component 4 mounted by the component mounting work unit 22b is crimped to the two substrates 2 (FIG. 10A → FIG. 10). 10 (b) → FIG. 10 (c)).

また同様に、制御装置24は、右方基板移送部33Rが備える2つの基板載置ステージ53に載置された2枚の基板2について、搭載ヘッド63による部品4の搭載作業が終了したら、Y軸テーブル51をそのまま第2のベース部32に沿って右方(すなわち第2の部品圧着作業部22dの側)に移動させ、2つの基板載置ステージ53に載置された2枚の基板2の部品4が搭載された部分を2つの部品圧着作業用のバックアップステージ72の上方(2つの圧着ヘッド71の下方)に位置させる(図9(a))。そして、第2の部品圧着作業部22dが備える2つの圧着ヘッド71を順次下降させて、部品搭載作業部22bで搭載した部品4を2枚の基板2に圧着する(図10(a)→図10(b)→図10(c))。   Similarly, when the mounting operation of the component 4 by the mounting head 63 is completed on the two substrates 2 placed on the two substrate placement stages 53 provided in the right substrate transfer unit 33R, the control device 24 returns to Y The axis table 51 is moved rightward along the second base portion 32 (that is, on the second component crimping work portion 22d side), and the two substrates 2 placed on the two substrate placement stages 53 are moved. The part on which the component 4 is mounted is positioned above the backup stage 72 for two component crimping operations (below the two crimping heads 71) (FIG. 9A). Then, the two crimping heads 71 provided in the second component crimping operation unit 22d are sequentially lowered, and the component 4 mounted in the component mounting operation unit 22b is crimped to the two substrates 2 (FIG. 10A → FIG. 10). 10 (b) → FIG. 10 (c)).

この2つの圧着ヘッド71による部品4の圧着作業では、2枚の基板2が載置される2つの基板載置ステージ53は1つの移動ステージ52に取り付けられているので、各基板2の対応する圧着ヘッド71に対する位置決め(及びその後の部品圧着作業)は、タイミングをずらして順次行う。この動作を図11に従って詳細に説明する。   In the crimping operation of the component 4 by the two crimping heads 71, the two substrate placement stages 53 on which the two substrates 2 are placed are attached to the single moving stage 52. Positioning with respect to the pressure-bonding head 71 (and subsequent component pressure-bonding work) is sequentially performed at different timings. This operation will be described in detail with reference to FIG.

制御装置24は、2つの基板載置ステージ53に載置された2枚の基板2それぞれの部品4が搭載された部分をバックアップステージ72の上方に位置させ、前述の部品搭載作業において取得(記憶部24bに記憶)した左側の基板載置ステージ53に対する左側の基板2の位置情報に基づいて移動ステージ52を移動させる。これにより、一方の(ここでは左側の)基板2が対応する圧着ヘッド71に対して位置決めされる(図11(a))。そして、この状態で左側の圧着ヘッド71を下降させて基板2をバックアップステージ72と圧着ヘッド71との間でクランプし、左側の基板2に対して部品4を圧着する(図11(b))。そして、そのクランプ状態を保持したまま、左側の基板載置ステージ53をわずかに下降させて基板載置ステージ53による基板2の支持状態を解除する(図11(c))。   The control device 24 positions the part on which the components 4 of the two substrates 2 mounted on the two substrate mounting stages 53 are mounted above the backup stage 72, and acquires (stores) in the aforementioned component mounting operation. The moving stage 52 is moved based on the position information of the left substrate 2 relative to the left substrate mounting stage 53 stored in the unit 24b. Thereby, one (here, the left side) board | substrate 2 is positioned with respect to the corresponding crimping | compression-bonding head 71 (FIG. 11 (a)). In this state, the left pressure-bonding head 71 is lowered to clamp the substrate 2 between the backup stage 72 and the pressure-bonding head 71, and the component 4 is pressure-bonded to the left-side substrate 2 (FIG. 11B). . Then, while the clamped state is maintained, the left substrate placement stage 53 is slightly lowered to release the support state of the substrate 2 by the substrate placement stage 53 (FIG. 11C).

これにより左側の基板2とは独立して移動ステージ52を移動させることができるようになったら、同じく前述の部品搭載作業において取得(記憶部24bに記憶)した右側の基板載置ステージ53に対する右側の基板2の位置情報に基づいて移動ステージ52を移動させ、他方の(ここでは右側の)基板2を対応する圧着ヘッド71に対して位置決めする。そして、この状態で右側の圧着ヘッド71を下降させて基板2をバックアップステージ72と圧着ヘッド71との間でクランプし、右側の基板2に対して部品4を圧着する(図11(d))。制御装置24は、右側の基板2に対して部品4を圧着したら、左側の基板載置ステージ53を上昇させて基板2を支持させたうえで、左側の圧着ヘッド71を上昇させ(図11(e))、次いで右側の圧着ヘッド71を上昇させる(図11(f))。これにより2枚の基板2に対する部品4の圧着作業が完了する。   As a result, when the moving stage 52 can be moved independently of the left substrate 2, the right side with respect to the right substrate mounting stage 53 obtained (stored in the storage unit 24 b) in the same component mounting operation as described above. The moving stage 52 is moved based on the position information of the substrate 2 and the other (right side here) substrate 2 is positioned with respect to the corresponding pressure bonding head 71. In this state, the right pressure bonding head 71 is lowered to clamp the substrate 2 between the backup stage 72 and the pressure bonding head 71, and the component 4 is pressure bonded to the right substrate 2 (FIG. 11 (d)). . When the component 4 is crimped to the right substrate 2, the control device 24 raises the left substrate mounting stage 53 to support the substrate 2, and then raises the left crimping head 71 (FIG. 11 ( e)), and then the right crimping head 71 is raised (FIG. 11 (f)). Thereby, the crimping operation of the component 4 to the two substrates 2 is completed.

制御装置24は、上記の手順によって2枚の基板2に対して部品4を圧着したら、移動ステージ52をY軸テーブル51に沿って前方へ移動させ、移動ステージ52を「基板受け渡し位置」に復帰させる。   When the component 24 is crimped to the two substrates 2 by the above procedure, the control device 24 moves the moving stage 52 forward along the Y-axis table 51 and returns the moving stage 52 to the “substrate delivery position”. Let

なお、2つの基板載置ステージ53に載置された基板2に対する圧着ヘッド71の位置決め及び圧着ヘッド71による部品4の圧着は、上記したように左右の基板2に対して個別に行わず、同時に行ってもよい。その場合、部品搭載作業において取得した左側の基板載置ステージ53に対する左側の基板2の位置ずれと右側の基板載置ステージ53に対する右側の基板2の位置ずれとの平均値を算出し、左側と右側の基板載置ステージ53をそれぞれの対応する圧着ヘッド71に対して同時に位置決めする。その後、圧着ヘッド71により同時に基板2に部品4を圧着させる。この場合、個別に位置決めするのに比べ、若干位置決め精度は下がるが、タクトタイムを短くすることができる。   The positioning of the crimping head 71 with respect to the substrates 2 placed on the two substrate placement stages 53 and the crimping of the component 4 by the crimping head 71 are not performed individually on the left and right substrates 2 as described above, but at the same time. You may go. In that case, the average value of the positional deviation of the left substrate 2 relative to the left substrate placement stage 53 and the positional deviation of the right substrate 2 relative to the right substrate placement stage 53 obtained in the component mounting operation is calculated, The right substrate mounting stage 53 is simultaneously positioned with respect to the corresponding pressure bonding head 71. Thereafter, the component 4 is simultaneously crimped to the substrate 2 by the crimping head 71. In this case, the tact time can be shortened although the positioning accuracy is slightly lowered as compared with the individual positioning.

図1において、搬出基板載置部23は左側(上流工程側)と右側(下流工程側)の2つの基板載置ステージ23sを有している。これら左右2つの基板載置ステージ23sは右方基台11cに対して昇降自在に設けられており、2つの基板載置ステージ23sには第1の部品圧着作業部22c又は第2の部品圧着作業部22dにおいて部品4の圧着作業が終了した2枚の基板2が載置される。2つの基板載置ステージ23sに載置された2枚の基板2は、図示しない基板搬出手段によって、部品実装装置1の下流工程下側に設けられた他の装置に送られる。   In FIG. 1, the carry-out substrate placement unit 23 has two substrate placement stages 23s on the left side (upstream process side) and the right side (downstream process side). These two left and right substrate mounting stages 23s are provided so as to be movable up and down with respect to the right base 11c, and the first component pressing operation portion 22c or the second component pressing operation is provided on the two substrate mounting stages 23s. Two substrates 2 on which the crimping operation of the component 4 has been completed in the part 22d are placed. The two substrates 2 placed on the two substrate placement stages 23 s are sent to another device provided on the lower side of the component mounting apparatus 1 by a substrate unloading means (not shown).

図1において、基台11の前方領域には左方基台11a、中央基台11b及び右方基台11cにわたってX軸方向に延びた移動ベース81が設けられている。この移動ベース81上には左方から順に左方基板移載部82a、中央基板移載部82b及び右方基板移載部82cの3つの基板移載部82が設けられている。   In FIG. 1, a moving base 81 extending in the X-axis direction is provided in the front region of the base 11 over the left base 11a, the center base 11b, and the right base 11c. On the moving base 81, there are provided three substrate transfer portions 82, a left substrate transfer portion 82a, a central substrate transfer portion 82b, and a right substrate transfer portion 82c in order from the left.

各基板移載部82は、図12に示すように、移動ベース81に対してX軸方向に移動自在に設けられた基部91及び基部91上に設けられた2基のアームユニット92を有する。各アームユニット92は基部91に固定されたアームベース93と、アームベース93から水平後方に延びて設けられた2つのアーム94を備える。各アーム94には吸着面を下方に向けた複数の吸着パッド95が設けられている。各アームユニット92は2つのアーム94に設けられた計4個の吸着パッド95を介して1枚の基板2を真空吸着することができる。   As shown in FIG. 12, each substrate transfer unit 82 includes a base 91 provided so as to be movable in the X-axis direction with respect to the moving base 81 and two arm units 92 provided on the base 91. Each arm unit 92 includes an arm base 93 fixed to the base portion 91 and two arms 94 provided to extend horizontally rearward from the arm base 93. Each arm 94 is provided with a plurality of suction pads 95 with suction surfaces facing downward. Each arm unit 92 can vacuum-suck a single substrate 2 through a total of four suction pads 95 provided on the two arms 94.

搬入基板載置部21の基板載置ステージ21s上の基板2をアームユニット92に受け取らせるときには、制御装置24は、基板2の上方に2つのアーム94の吸着パッド95を位置させた状態で基板載置ステージ21sを昇降させる。また、左方基板移送部33Lの基板載置ステージ36上の基板2をアームユニット92に受け取らせ、或いはアームユニット92に吸着された基板2を基板載置ステージ36に載置させるときには、制御装置24は、基板2の上方に2つのアーム94の吸着パッド95を位置させた状態で基板載置ステージ36を昇降させる。また、中央基板移送部33C或いは右方基板移送部33Rの基板載置ステージ53上の基板2をアームユニット92に受け取らせ、或いはアームユニット92に吸着された基板2を基板載置ステージ53に載置させるときには、制御装置24は、基板2の上方に2つのアーム94の吸着パッド95を位置させた状態で基板載置ステージ53を昇降させる。   When the arm unit 92 receives the substrate 2 on the substrate placement stage 21 s of the carry-in substrate placement unit 21, the control device 24 keeps the suction pads 95 of the two arms 94 positioned above the substrate 2. The mounting stage 21s is moved up and down. When the substrate 2 on the substrate placement stage 36 of the left substrate transfer unit 33L is received by the arm unit 92 or the substrate 2 adsorbed by the arm unit 92 is placed on the substrate placement stage 36, the control device 24 lifts and lowers the substrate mounting stage 36 with the suction pads 95 of the two arms 94 positioned above the substrate 2. Further, the arm unit 92 receives the substrate 2 on the substrate placement stage 53 of the central substrate transfer unit 33C or the right substrate transfer unit 33R, or the substrate 2 adsorbed by the arm unit 92 is placed on the substrate placement stage 53. When placing, the control device 24 raises and lowers the substrate placement stage 53 with the suction pads 95 of the two arms 94 positioned above the substrate 2.

制御装置24は、左方基板移載部82a、中央基板移載部82b及び右方基板移載部82cそれぞれの移動ベース81に沿ったX軸方向への移動動作、各アームユニット92における吸着パッド95を介した基板2の吸着動作を制御する(図3)。具体的には、制御装置24は、左方基板移載部82aを作動させて搬入基板載置部21から左方基板移送部33Lに基板2を移送し、中央基板移載部82bを作動させて左方基板移送部33Lから中央基板移送部33C又は右方基板移送部33Rに基板2を移送する。すなわち、ACF貼着作業部22aによりACFテープ3が貼着された基板2を中央基板移送部33Cが備える2つの基板載置ステージ53及び右方基板移送部33Rが備える2つの基板載置ステージ53に振り分けて載置する。また、制御装置24は、右方基板移載部82cを作動させて、中央基板移送部33C又は右方基板移送部33Rから搬出基板載置部23に基板2を移送する。   The controller 24 moves the left substrate transfer unit 82a, the central substrate transfer unit 82b, and the right substrate transfer unit 82c in the X-axis direction along the movement base 81, and suction pads in each arm unit 92. The adsorption | suction operation | movement of the board | substrate 2 through 95 is controlled (FIG. 3). Specifically, the control device 24 operates the left substrate transfer unit 82a to transfer the substrate 2 from the carry-in substrate mounting unit 21 to the left substrate transfer unit 33L, and operates the central substrate transfer unit 82b. Then, the substrate 2 is transferred from the left substrate transfer unit 33L to the central substrate transfer unit 33C or the right substrate transfer unit 33R. That is, the two substrate placement stages 53 provided in the central substrate transfer portion 33C and the two substrate placement stages 53 provided in the right substrate transfer portion 33R include the substrate 2 on which the ACF tape 3 is attached by the ACF attachment operation portion 22a. Sort and place. In addition, the control device 24 operates the right substrate transfer unit 82c to transfer the substrate 2 from the central substrate transfer unit 33C or the right substrate transfer unit 33R to the carry-out substrate mounting unit 23.

次に、部品実装装置1が基板2への部品4の装着作業を行うときの各部の動作を説明する。制御装置24は、図13に示すように、3つの基板移載部82が取り得る位置として、搬入基板載置部21の前方位置(第1位置P1)、ACF貼着作業部22aの前方位置(第2位置P2)、第1の部品圧着作業部22cの前方位置(第3位置P3)、部品搭載作業部22bの前方位置(第4位置P4)、第2の部品圧着作業部22dの前方位置(第5位置P5)及び搬出基板載置部23の前方位置(第6位置P6)を定めている。   Next, the operation of each part when the component mounting apparatus 1 performs the mounting operation of the component 4 on the board 2 will be described. As shown in FIG. 13, the control device 24 is configured so that the three substrate transfer units 82 can take the front position (first position P <b> 1) of the carry-in substrate mounting unit 21 and the front position of the ACF attaching work unit 22 a. (Second position P2), the front position of the first component crimping work section 22c (third position P3), the front position of the component mounting work section 22b (fourth position P4), the front of the second component crimping work section 22d. The position (fifth position P5) and the front position (sixth position P6) of the carry-out substrate placement part 23 are determined.

基板2への部品4の装着作業を行う場合には、制御装置24は先ず、左方基板移載部82aを第1位置P1に、中央基板移載部82bを第2位置P2に、右方基板移載部82cを第4位置P4に位置させ、また中央基板移送部33Cを部品搭載作業部22bの前方位置に、右方基板移送部33Rを第2の部品圧着作業部22dの前方位置に位置させた状態で、上流工程側の装置から搬入されて搬入基板載置部21に載置されている2枚の基板2を左方基板移載部82aによって受け取る(図14(a))。   When performing the mounting operation of the component 4 on the board 2, the control device 24 first sets the left board transfer part 82a to the first position P1, the center board transfer part 82b to the second position P2, and the right side. The substrate transfer unit 82c is positioned at the fourth position P4, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b, and the right substrate transfer unit 33R is positioned in front of the second component crimping operation unit 22d. In the state of being positioned, the two substrates 2 carried in from the upstream process side apparatus and placed on the carry-in substrate placing portion 21 are received by the left substrate transfer portion 82a (FIG. 14A).

制御装置24は、左方基板移載部82aによって搬入基板載置部21から2枚の基板2を受け取ったら、左方基板移載部82aを第2位置P2に、中央基板移載部82bを第4位置P4に、右方基板移載部82cを第6位置P6に位置させることによって、左方基板移載部82aが受け取った2枚の基板2を左方基板移送部33Lの2つの基板載置ステージ36に受け渡す(図14(b)))。そして、左方基板移送部33Lの移動ステージ35を「作業位置」に移動させ、ACF貼着作業部22aによる2枚の基板2に対するACF貼着作業を実行する(図14(c))。なお、この間、搬入基板載置部21には、新たな2枚の基板2が載置(搬入)される。   When receiving the two substrates 2 from the carry-in substrate platform 21 by the left substrate transfer unit 82a, the control device 24 sets the left substrate transfer unit 82a to the second position P2 and the central substrate transfer unit 82b. By positioning the right substrate transfer unit 82c at the fourth position P4 at the sixth position P6, the two substrates 2 received by the left substrate transfer unit 82a are transferred to the two substrates of the left substrate transfer unit 33L. It is transferred to the mounting stage 36 (FIG. 14B)). Then, the moving stage 35 of the left substrate transfer part 33L is moved to the “working position”, and the ACF attaching work to the two substrates 2 by the ACF attaching work part 22a is executed (FIG. 14C). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.

制御装置24は、ACF貼着作業部22aによる2枚の基板2に対するACF貼着作業を実行したら、ACF左方基板移送部33Lの移動ステージ35を「基板受け渡し位置」に移動させ、そのうえで左方基板移載部82aを第1位置P1に、中央基板移載部82bを第2位置P2に、右方基板移載部82cを第4位置P4に位置させる。そして、左方基板移載部82aによって搬入基板載置部21上の2枚の基板2を受け取り、中央基板移載部82bによって、左方基板移送部33L上の2枚の基板2を受け取る(図15(a))。   When the control device 24 performs the ACF attaching operation to the two substrates 2 by the ACF attaching operation portion 22a, the control device 24 moves the moving stage 35 of the ACF left substrate transfer portion 33L to the “substrate delivery position”, and then to the left The substrate transfer unit 82a is positioned at the first position P1, the central substrate transfer unit 82b is positioned at the second position P2, and the right substrate transfer unit 82c is positioned at the fourth position P4. Then, the two substrates 2 on the carry-in substrate placement unit 21 are received by the left substrate transfer unit 82a, and the two substrates 2 on the left substrate transfer unit 33L are received by the central substrate transfer unit 82b ( FIG. 15 (a)).

制御装置24は、左方基板移載部82aによって搬入基板載置部21から2枚の基板2を受け取り、中央基板移載部82bによって左方基板移送部33L上の2枚の基板2を受け取ったら、左方基板移載部82aを第2位置P2に、中央基板移載部82bを第4位置P4に、右方基板移載部82cを第6位置P6に位置させることによって、左方基板移載部82aが受け取った2枚の基板2を左方基板移送部33Lの2つの基板載置ステージ36に載置させ、中央基板移載部82bが受け取った2枚の基板2を中央基板移送部33Cの2つの基板載置ステージ53に載置させる(図15(b))。   The control device 24 receives the two substrates 2 from the carry-in substrate placement unit 21 by the left substrate transfer unit 82a, and receives the two substrates 2 on the left substrate transfer unit 33L by the central substrate transfer unit 82b. Then, the left substrate transfer section 82a is positioned at the second position P2, the central substrate transfer section 82b is positioned at the fourth position P4, and the right substrate transfer section 82c is positioned at the sixth position P6. The two substrates 2 received by the transfer unit 82a are placed on the two substrate placement stages 36 of the left substrate transfer unit 33L, and the two substrates 2 received by the central substrate transfer unit 82b are transferred to the central substrate. It is made to mount on the two board | substrate mounting stages 53 of the part 33C (FIG.15 (b)).

制御装置24は、次いで、左方基板移送部33Lの移動ステージ35を「作業位置」に位置させてACF貼着作業部22aによる2枚の基板2に対するACF貼着作業を実行する一方、中央基板移送部33Cの移動ステージ52を「作業位置」に移動させ、2枚の基板2のうち左方の基板2を部品搭載作業用のバックアップステージ64の上方に位置させることによって(第1の移送工程)、部品搭載作業部22bによる左方の基板2に対する部品搭載作業を実行する(図15(c)。第1の部品搭載作業工程)。   Next, the control device 24 positions the moving stage 35 of the left substrate transfer unit 33L at the “working position” and executes the ACF adhering operation to the two substrates 2 by the ACF adhering operation unit 22a, while the central substrate The moving stage 52 of the transfer unit 33C is moved to the “working position” and the left substrate 2 of the two substrates 2 is positioned above the backup stage 64 for component mounting work (first transfer step). ), A component mounting operation is performed on the left board 2 by the component mounting operation unit 22b (FIG. 15C, first component mounting operation step).

制御装置24は、上記部品搭載作業部22bによる左方の基板2に対する部品搭載作業を実行したら、中央基板移送部33Cを左動させ(第2の移送工程)、中央基板移送部33Cの2つの基板載置ステージ53に載置された2枚の基板2のうちの右方の基板2を部品搭載作業用のバックアップステージ64の上方に位置させて、部品搭載作業部22bによる右方の基板2に対する部品搭載作業を実行する(図16(a)。第2の部品搭載作業工程)。なお、この間、搬入基板載置部21には、新たな2枚の基板2が載置(搬入)される。   When the component mounting operation is performed on the left substrate 2 by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (second transfer step), and the two of the central substrate transfer unit 33C. The right substrate 2 of the two substrates 2 placed on the substrate placement stage 53 is positioned above the backup stage 64 for component mounting work, and the right substrate 2 by the component mounting work unit 22b. The component mounting operation is executed (FIG. 16A, second component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.

制御装置24は、上記部品搭載作業部22bによる部品搭載作業を実行したら、中央基板移送部33Cをそのまま左方(第1の部品圧着作業部22cの側)へ移動させて基板載置ステージ53に載置させた状態のままの基板2を第1の部品圧着作業部22cに移送し(第1の部品圧着作業部22cへの移動工程)、2つの基板載置ステージ53に載置された2枚の基板2を2つの部品圧着作業用のバックアップステージ72の上方に位置させて、第1の部品圧着作業部22cによる2枚の基板2に対する部品圧着作業を実行する(第1の部品圧着作業部22cによる部品圧着作業工程。図16(b))。また、これと併せて、左方基板移載部82aを第1位置P1に位置させて、搬入基板載置部21に載置されている2枚の基板2を左方基板移載部82aによって受け取る一方、左方基板移送部33Lの移動ステージ35を「基板受け渡し位置」に位置させるのに合わせて中央基板移載部82bを第2位置P2に位置させ、中央基板移載部82bによって左方基板移送部33L上の2枚の基板2を受け取る。また、右方基板移送部33Rを部品搭載作業部22bの前方位置に位置させるとともに、右方基板移載部82cを第4位置P4に位置させる(図16(b))。   After executing the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is and moves it to the substrate mounting stage 53. The substrate 2 that has been placed is transferred to the first component crimping work unit 22c (the moving process to the first component crimping work unit 22c), and 2 placed on the two substrate placing stages 53. The two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the first component crimping operation unit 22c (first component crimping operation). Component crimping operation process by the portion 22c (FIG. 16B). At the same time, the left substrate transfer portion 82a is positioned at the first position P1, and the two substrates 2 placed on the carry-in substrate placement portion 21 are moved by the left substrate transfer portion 82a. On the other hand, the central substrate transfer unit 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer unit 33L being positioned at the “substrate transfer position”. The two substrates 2 on the substrate transfer unit 33L are received. Further, the right substrate transfer part 33R is positioned at the front position of the component mounting work unit 22b, and the right substrate transfer part 82c is positioned at the fourth position P4 (FIG. 16B).

制御装置24は上記作業が終了したら、右方基板移載部82cを第6位置P6に位置させたうえで、中央基板移載部82bを第4位置P4に位置させて、左方基板移送部33Lから受け取った2枚の基板2を右方基板移送部33Rの2つの基板載置ステージ53に受け渡し、また左方基板移載部82aを第2位置P2に位置させることによって、搬入基板載置部21から受け取った2枚の基板2を左方基板移送部33Lの2つの基板載置ステージ36に受け渡す(図16(c))。   When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6, and then positions the central substrate transfer portion 82b at the fourth position P4, thereby moving the left substrate transfer portion. The two substrates 2 received from 33L are transferred to the two substrate mounting stages 53 of the right substrate transfer unit 33R, and the left substrate transfer unit 82a is positioned at the second position P2, thereby loading the loaded substrate. The two substrates 2 received from the unit 21 are transferred to the two substrate placement stages 36 of the left substrate transfer unit 33L (FIG. 16C).

制御装置24は、右方基板移送部33Rと左方基板移送部33Lに基板2を受け渡したら、左方基板移送部33Lの移動ステージ35を「作業位置」に位置させてACF貼着作業部22aによる2枚の基板2に対するACF貼着作業を実行する一方、右方基板移送部33Rの移動ステージ52を「作業位置」に移動させ、2枚の基板2のうち右方の基板2を部品搭載作業用のバックアップステージ64の上方に位置させることによって(第3の移送工程)、部品搭載作業部22bによる右方の基板2に対する部品搭載作業を実行する(図17(a)。第3の部品搭載作業工程)。   When the control device 24 delivers the substrate 2 to the right-side substrate transfer unit 33R and the left-side substrate transfer unit 33L, the moving stage 35 of the left-side substrate transfer unit 33L is positioned at the “working position” and the ACF adhering work unit 22a. While the ACF attaching operation to the two substrates 2 is performed, the moving stage 52 of the right substrate transfer unit 33R is moved to the “operation position”, and the right substrate 2 of the two substrates 2 is mounted. By positioning it above the work backup stage 64 (third transfer step), a component mounting operation is performed on the right substrate 2 by the component mounting operation unit 22b (FIG. 17A). Mounting work process).

制御装置24は、上記ACF貼着作業部22aによるACF貼着作業と、部品搭載作業部22bによる部品搭載作業を実行したら、右方基板移送部33Rを右動させ(第4の移送工程)、右方基板移送部33Rの2つの基板載置ステージ53に載置された2枚の基板2のうちの左方の基板2を部品搭載作業用のバックアップステージ64の上方に位置させて、部品搭載作業部22bによる左方の基板2に対する部品搭載作業を実行する(図17(b)。第4の部品搭載作業工程)。なお、この間、搬入基板載置部21には、新たな2枚の基板2が載置(搬入)される。   After executing the ACF adhering operation by the ACF adhering operation unit 22a and the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the right substrate transfer unit 33R to the right (fourth transfer step), Component mounting is performed by positioning the left substrate 2 of the two substrates 2 placed on the two substrate mounting stages 53 of the right substrate transfer unit 33R above the backup stage 64 for mounting components. A component mounting operation is performed on the left substrate 2 by the working unit 22b (FIG. 17B, a fourth component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.

制御装置24は、上記部品搭載作業部22bによる部品搭載作業を実行したら、右方基板移送部33Rをそのまま右方(第2の部品圧着作業部22dの側)へ移動させて基板載置ステージ53に載置させた状態のままの基板2を第2の部品圧着作業部22dに移送し(第2の部品圧着作業部22dへの移動工程)、2つの基板載置ステージ53に載置された2枚の基板2を2つの部品圧着作業用のバックアップステージ72の上方に位置させて、第2の部品圧着作業部22dによる2枚の基板2に対する部品圧着作業を実行する(第2の部品圧着作業部22dによる部品圧着作業工程。図17(c))。また、これと併せて、左方基板移載部82aを第1位置P1に位置させて搬入基板載置部21に載置されている2枚の基板2を左方基板移載部82aによって受け取る一方、左方基板移送部33Lの移動ステージ35を「基板受け渡し位置」に位置させるのに合わせて中央基板移載部82bを第2位置P2に位置させ、中央基板移載部82bによって左方基板移送部33L上の2枚の基板2を受け取る。また、中央基板移送部33Cの移動ステージ52を「基板受け渡し位置」に移動させつつ中央基板移送部33Cを部品搭載作業部22bの前方位置に位置させ、部品搭載作業部22bの前方に位置させている右方基板移載部82cによって、中央基板移送部33C上の2枚の基板2を受け取る(図17(c))。   After executing the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the right substrate transfer unit 33R to the right (the second component crimping operation unit 22d side) as it is, and the substrate placement stage 53. The substrate 2 that has been placed on the substrate 2 is transferred to the second component crimping working unit 22d (moving step to the second component crimping working unit 22d) and placed on the two substrate placing stages 53. The two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the second component crimping operation unit 22d (second component crimping operation). Component crimping operation process by the working unit 22d (FIG. 17C). At the same time, the left substrate transfer unit 82a receives the two substrates 2 placed on the carry-in substrate mounting unit 21 with the left substrate transfer unit 82a positioned at the first position P1. On the other hand, the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”, and the left substrate is moved by the central substrate transfer portion 82b. The two substrates 2 on the transfer unit 33L are received. Further, while moving the moving stage 52 of the central substrate transfer unit 33C to the “substrate delivery position”, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b and is positioned in front of the component mounting operation unit 22b. The two substrates 2 on the central substrate transfer unit 33C are received by the right substrate transfer unit 82c (FIG. 17C).

制御装置24は上記作業が終了したら、右方基板移載部82cを第6位置P6に位置させて2枚の基板2を搬出基板載置部23に載置する一方、中央基板移載部82bを第4位置P4に位置させて、左方基板移送部33Lから受け取った2枚の基板2を中央基板移送部33Cの2つの基板載置ステージ53に受け渡し、また、左方基板移載部82aを第2位置P2に位置させることによって、搬入基板載置部21から受け取った2枚の基板2を左方基板移送部33Lの2つの基板載置ステージ36に受け渡す(図18(a))。   When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 to place the two substrates 2 on the carry-out substrate placement portion 23, while the central substrate transfer portion 82b. Is transferred to the fourth position P4, the two substrates 2 received from the left substrate transfer unit 33L are transferred to the two substrate placement stages 53 of the central substrate transfer unit 33C, and the left substrate transfer unit 82a. Is placed at the second position P2, and the two substrates 2 received from the carry-in substrate platform 21 are transferred to the two substrate platforms 36 of the left substrate transfer unit 33L (FIG. 18A). .

制御装置24は、中央基板移送部33Cと左方基板移送部33Lに基板2を受け渡したら、左方基板移送部33Lの移動ステージ35を「作業位置」に位置させてACF貼着作業部22aによる2枚の基板2に対するACF貼着作業を実行する一方、中央基板移送部33Cの移動ステージ52を「作業位置」に位置させ、2枚の基板2のうちの左方の基板2を部品搭載作業用のバックアップステージ64の上方に位置させることによって(第1の移送工程)、部品搭載作業部22bによる左方の基板2に対する部品搭載作業を実行する(図18(b)。第1の部品搭載作業工程)。   When the control device 24 delivers the substrate 2 to the central substrate transfer unit 33C and the left substrate transfer unit 33L, the moving stage 35 of the left substrate transfer unit 33L is positioned at the “working position” and the ACF adhering operation unit 22a performs the operation. While performing the ACF attaching operation to the two substrates 2, the moving stage 52 of the central substrate transfer unit 33C is positioned at the “operation position”, and the left substrate 2 of the two substrates 2 is mounted on the component. Is placed above the backup stage 64 (first transfer step), the component mounting operation on the left substrate 2 by the component mounting operation unit 22b is executed (FIG. 18B). Working process).

制御装置24は、上記ACF貼着作業部22aによるACF貼着作業と、部品搭載作業部22bによる部品搭載作業を実行したら、中央基板移送部33Cを左動させ(第2の移送工程)、中央基板移送部33Cの2つの基板載置ステージ53に載置された2枚の基板2のうちの右方の基板2を部品搭載作業用のバックアップステージ64の上方に位置させて、部品搭載作業部22bによる右方の基板2に対する部品搭載作業を実行する(図18(c)。第2の部品搭載作業工程)。なお、この間、搬入基板載置部21には、新たな2枚の基板2が載置(搬入)される。   When the controller 24 executes the ACF adhering operation by the ACF adhering operation unit 22a and the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (second transfer process), Of the two substrates 2 placed on the two substrate placement stages 53 of the substrate transfer unit 33C, the right substrate 2 is positioned above the backup stage 64 for component placement work, and the component placement work unit A component mounting operation is performed on the right board 2 by 22b (FIG. 18C, second component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.

制御装置24は、上記部品搭載作業部22bによる部品搭載作業を実行したら、中央基板移送部33Cをそのまま左方(第1の部品圧着作業部22cの側)に移動させて基板載置ステージ53に載置させた状態のままの基板2を第1の部品圧着作業部22cに移送し(第1の部品圧着作業部22cへの移動工程)、2つの基板載置ステージ53に載置された2枚の基板2を2つの部品圧着作業用のバックアップステージ72の上方に位置させて、第1の部品圧着作業部22cによる2枚の基板2に対する部品圧着作業を実行する(第1の部品圧着作業部22cによる部品圧着作業工程。図19(a))。また、これと併せて、左方基板移載部82aを第1位置P1に位置させて搬入基板載置部21に載置されている2枚の基板2を左方基板移載部82aによって受け取る一方、左方基板移送部33Lの移動ステージ35を「基板受け渡し位置」に位置させるのに合わせて中央基板移載部82bを第2位置P2に位置させ、中央基板移載部82bによって左方基板移送部33L上の2枚の基板2を受け取る。また、右方基板移送部33Rの移動ステージ52を「基板受け渡し位置」に移動させつつ右方基板移送部33Rを部品搭載作業部22bの前方に位置させ、既に部品搭載作業部22bの前方に位置させている右方基板移載部82cによって、右方基板移送部33R上の2枚の基板2を受け取る(図19(a))。   After executing the component mounting operation by the component mounting operation unit 22b, the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is and moves it to the substrate mounting stage 53. The substrate 2 that has been placed is transferred to the first component crimping work unit 22c (the moving process to the first component crimping work unit 22c), and 2 placed on the two substrate placing stages 53. The two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the first component crimping operation unit 22c (first component crimping operation). Component crimping operation process by the portion 22c (FIG. 19A). At the same time, the left substrate transfer unit 82a receives the two substrates 2 placed on the carry-in substrate mounting unit 21 with the left substrate transfer unit 82a positioned at the first position P1. On the other hand, the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”, and the left substrate is moved by the central substrate transfer portion 82b. The two substrates 2 on the transfer unit 33L are received. Further, while moving the moving stage 52 of the right board transfer section 33R to the “board delivery position”, the right board transfer section 33R is positioned in front of the component mounting work section 22b, and is already positioned in front of the component mounting work section 22b. The two substrates 2 on the right substrate transfer unit 33R are received by the right substrate transfer unit 82c that has been moved (FIG. 19A).

制御装置24は、上記作業が終了したら、右方基板移載部82cを第6位置P6に位置させて2枚の基板2を搬出基板載置部23に載置するとともに、中央基板移載部82bを第4位置P4に位置させて左方基板移送部33Lから受け取った2枚の基板2を右方基板移送部33Rの2つの基板載置ステージ53に受け渡し、左方基板移載部82aを第2位置P2に位置させることによって、搬入基板載置部21から受け取った2枚の基板2を左方基板移送部33Lの2つの基板載置ステージ36に受け渡す(図19(b))。   When the above operation is completed, the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 to place the two substrates 2 on the carry-out substrate placement portion 23 and the central substrate transfer portion. 82b is positioned at the fourth position P4, the two substrates 2 received from the left substrate transfer unit 33L are transferred to the two substrate placement stages 53 of the right substrate transfer unit 33R, and the left substrate transfer unit 82a is transferred. By positioning at the second position P2, the two substrates 2 received from the carry-in substrate platform 21 are transferred to the two substrate platforms 36 of the left substrate transport unit 33L (FIG. 19B).

この図19(b)の状態は図16(c)の状態と全く同じであるので、以後、図16(c)〜図19(a)の工程を繰り返すことによって、搬入基板載置部21への基板2の搬入から基板2への部品4の装着を経て搬出基板載置部23への搬出に至る一連の動作を繰り返し実行して連続的な基板生産を行うことができる。   Since the state of FIG. 19B is exactly the same as the state of FIG. 16C, thereafter, the steps of FIGS. 16C to 19A are repeated to return to the carry-in substrate placement unit 21. Continuous substrate production can be performed by repeatedly executing a series of operations from loading of the substrate 2 to mounting of the component 4 on the substrate 2 to unloading to the unloading substrate mounting portion 23.

以上説明したように、本実施の形態における部品実装装置1は、基板2への部品4の搭載作業を行う部品搭載作業部22b、部品搭載作業部22bを両側方から挟む位置に設けられ、部品搭載作業部22bにおいて部品4の搭載作業が行われた基板2に部品搭載作業部22bで搭載された部品4を圧着する第1の部品圧着作業部22c及び第2の部品圧着作業部22d、部品搭載作業部22bと第1の部品圧着作業部22cの間を水平方向に移動自在に設けられ、基板載置ステージ53に基板2を載置させた状態でその基板2を部品搭載作業部22bに移送し、部品搭載作業部22bによる基板2に対する部品4の搭載作業が行われた後、第1の部品圧着作業部22cの側に移動して基板載置ステージ53に載置された状態のままの基板2を第1の部品圧着作業部22cに移送する中央基板移送部33C(第1の基板移送手段)及び部品搭載作業部22bと第2の部品圧着作業部22dの間を水平方向に移動自在に設けられ、基板載置ステージ53に基板2を載置させた状態でその基板2を部品搭載作業部22bに移送し、部品搭載作業部22bによる基板2に対する部品4の搭載作業が行われた後、第2の部品圧着作業部22dの側に移動して基板載置ステージ53に載置された状態のままの基板2を第2の部品圧着作業部22dに移送する右方基板移送部33R(第2の基板移送手段)を備えたものとなっている。   As described above, the component mounting apparatus 1 according to the present embodiment is provided at a position where the component mounting operation unit 22b for mounting the component 4 on the board 2 and the component mounting operation unit 22b are sandwiched from both sides. A first component crimping work unit 22c and a second component crimping work unit 22d for crimping the component 4 mounted by the component mounting work unit 22b on the board 2 on which the component 4 mounting work has been performed in the mounting work unit 22b. Between the mounting work part 22b and the first component crimping work part 22c, it is provided so as to be movable in the horizontal direction, and the substrate 2 is mounted on the component mounting work part 22b in a state where the substrate 2 is mounted on the substrate mounting stage 53. After the parts are mounted and the component 4 is mounted on the substrate 2 by the component mounting unit 22b, the component 4 is moved to the first component crimping unit 22c and remains mounted on the substrate mounting stage 53. Board 2 A central substrate transfer portion 33C (first substrate transfer means) for transferring to one component crimping operation portion 22c and a component mounting operation portion 22b and a second component crimping operation portion 22d are provided so as to be movable in the horizontal direction; After the substrate 2 is placed on the substrate placement stage 53, the substrate 2 is transferred to the component mounting operation unit 22b, and after the component 4 is mounted on the substrate 2 by the component mounting operation unit 22b, the second operation is performed. The right side substrate transfer unit 33R (the second substrate transfer unit 33R) transfers the substrate 2 that has been moved to the component crimping operation unit 22d side and is still placed on the substrate mounting stage 53 to the second component crimping operation unit 22d. Substrate transfer means).

また、左方基板移送部33Lは、外部より搬入された基板2を保持する基板保持部であり、ACF貼着作業部22aは、左方基板移送部33Lに保持された基板2の部品搭載作業部22bにより部品4が搭載される箇所に接着部材としてのACFテープ3を貼着する接着部材貼着作業部である。   The left substrate transfer unit 33L is a substrate holding unit that holds the substrate 2 carried in from the outside, and the ACF adhering work unit 22a is a component mounting operation of the substrate 2 held by the left substrate transfer unit 33L. This is an adhesive member adhering operation unit for adhering the ACF tape 3 as an adhesive member to a place where the component 4 is mounted by the portion 22b.

また、基板移載部82である中央基板移載部82bは、ACF貼着作業部22aによりACFテープ3が貼着された基板2を中央基板移送部33Cが備える基板載置ステージ53及び右方基板移送部33Rが備える基板載置ステージ53に振り分けて載置する基板移載手段である。   In addition, the central substrate transfer unit 82b, which is the substrate transfer unit 82, includes a substrate mounting stage 53 provided in the central substrate transfer unit 33C and the right side of the substrate 2 on which the ACF tape 3 is attached by the ACF attaching operation unit 22a. This is a substrate transfer means for distributing and mounting on the substrate mounting stage 53 provided in the substrate transfer unit 33R.

また、基板移載部82である右方基板移載部82cは、第1の部品圧着作業部22cにより部品4が圧着された基板2を中央基板移送部33Cが備える基板載置ステージ53から受け取って或いは第2の部品圧着作業部22dにより部品4が圧着された基板2を右方基板移送部33Rが備える基板載置ステージ53から受け取ってその基板2を基板搬出部である搬出基板載置部23に受け渡す。   Further, the right substrate transfer unit 82c, which is the substrate transfer unit 82, receives the substrate 2 on which the component 4 is bonded by the first component crimping operation unit 22c from the substrate mounting stage 53 provided in the central substrate transfer unit 33C. Alternatively, the substrate 2 on which the component 4 is crimped by the second component crimping operation unit 22d is received from the substrate platform stage 53 provided in the right substrate transport unit 33R, and the substrate 2 is an unloading substrate platform that is a substrate unloading unit. Pass to 23.

また、本実施の形態における部品実装装置1による部品実装方法は、中央基板移送部33C(第1の基板移送手段)が備える基板載置ステージ53に基板2を載置させた状態でその基板2を部品搭載作業部22bに移送し(前述の第1の移送工程及び第2の移送工程)、部品搭載作業部22bにより基板2に対する部品4の搭載作業を行った後(前述の第1の部品搭載作業工程及び第2の部品搭載作業工程)、中央基板移送部33Cを第1の部品圧着作業部22cの側に移動させて基板載置ステージ53に載置させた状態のままの基板2を第1の部品圧着作業部22cに移送し(前述の第1の部品圧着作業部22cへの移動工程)、第1の部品圧着作業部22cにより基板2に部品4を圧着する工程(前述の第1の部品圧着作業部22cによる部品圧着作業工程)と、右方基板移送部33R(第2の基板移送手段)が備える基板載置ステージ53に基板2を載置させた状態でその基板2を部品搭載作業部22bに移送し(前述の第3の移送工程及び第4の移送工程)、部品搭載作業部22bにより基板2に対する部品4の搭載作業を行った後(前述の第3の部品搭載作業工程及び第4の部品搭載作業工程)、右方基板移送部33Rを第2の部品圧着作業部22dの側に移動させて基板載置ステージ53に載置された状態のままの基板2を第2の部品圧着作業部22dに移送し(前述の第2の部品圧着作業部22dへの移動工程)、第2の部品圧着作業部22dにより基板2に部品4を圧着する工程(前述の第2の部品圧着作業部22dによる部品圧着作業工程)を含むものとなっている。   Further, the component mounting method by the component mounting apparatus 1 in the present embodiment is that the substrate 2 is placed in a state where the substrate 2 is placed on the substrate placement stage 53 provided in the central substrate transfer unit 33C (first substrate transfer means). Is transferred to the component mounting operation unit 22b (the first transfer step and the second transfer step described above), and the component 4 is mounted on the substrate 2 by the component mounting operation unit 22b (the first component described above). Mounting work process and second component mounting work process), the substrate 2 as it is placed on the substrate placing stage 53 by moving the central substrate transfer part 33C to the first component crimping work part 22c side. Step of transferring to the first component crimping work part 22c (moving process to the first component crimping work part 22c described above), and crimping of the component 4 to the substrate 2 by the first component crimping work part 22c (described above) 1 by the component crimping work part 22c Component pressing operation step), and the substrate 2 is transferred to the component mounting operation unit 22b in a state where the substrate 2 is mounted on the substrate mounting stage 53 provided in the right substrate transfer unit 33R (second substrate transfer means). After the mounting operation of the component 4 on the substrate 2 is performed by the component mounting operation unit 22b (the above-described third transfer step and fourth transfer step) (the above-described third component mounting operation step and fourth component mounting). Working process), the right substrate transfer part 33R is moved to the second component crimping work unit 22d side, and the substrate 2 that is still placed on the substrate placement stage 53 is moved to the second component crimping work unit 22d. (Moving step to the above-described second component crimping operation portion 22d), and a step of crimping the component 4 to the substrate 2 by the second component crimping operation portion 22d (by the above-described second component crimping operation portion 22d). Parts crimping process) That.

本実施の形態における部品実装装置1及びその部品実装方法では、基板2は中央基板移送部33C(第1の基板移送手段)又は右方基板移送部33R(第2の基板移送手段)が備える基板載置ステージ53に載置された状態で部品搭載作業部22bに移送されて部品4の搭載作業がなされ、部品4の搭載作業の後は基板載置ステージ53に載置された状態のまま第1の部品圧着作業部22c又は第2の部品圧着作業部22dに移送されてそこで部品4の圧着作業が行われるようになっており、部品4の搭載作業から部品4の圧着作業に移行する過程において、基板移載部82(基板移載手段)による基板2の移し変えがなされないので、基板2に搭載した部品4を落下させることなく部品4の圧着作業に移行することができる。   In the component mounting apparatus 1 and the component mounting method according to the present embodiment, the substrate 2 is provided in the central substrate transfer unit 33C (first substrate transfer unit) or the right substrate transfer unit 33R (second substrate transfer unit). The component 4 is transferred to the component mounting operation unit 22b in a state of being mounted on the mounting stage 53, and the component 4 is mounted. After the component 4 is mounted, the component 4 is mounted on the substrate mounting stage 53. The process is transferred to the first component crimping work section 22c or the second component crimping work section 22d, where the crimping operation of the component 4 is performed, and the process of shifting from the mounting operation of the component 4 to the crimping operation of the component 4 is performed. In FIG. 5, since the substrate 2 is not transferred by the substrate transfer unit 82 (substrate transfer means), the component 4 mounted on the substrate 2 can be shifted to the pressure bonding operation without dropping.

なお、基板移載部82(中央基板移載部82b)による中央基板移送部33C又は右方基板移送部33Rへの基板2の移載は、実施の形態に示された順番に限られず、先ず右方基板移送部33Rへ移載した後に、中央基板移送部33Cへ移載してもよい。   The transfer of the substrate 2 to the central substrate transfer unit 33C or the right substrate transfer unit 33R by the substrate transfer unit 82 (central substrate transfer unit 82b) is not limited to the order shown in the embodiment. After transferring to the right substrate transfer part 33R, it may be transferred to the central substrate transfer part 33C.

また、部品搭載作業部22b、第1の部品圧着作業部22c及び第2の部品圧着作業部22dにおける部品搭載作業及び部品圧着作業は、それぞれ対応する基板移送部(左方基板移送部33L、中央基板移送部33C又は右方基板移送部33R)が備える左右いずれの基板載置ステージ36、53から行っても構わない。   The component mounting operation and the component crimping operation in the component mounting operation unit 22b, the first component crimping operation unit 22c, and the second component crimping operation unit 22d are respectively performed by the corresponding substrate transfer units (left substrate transfer unit 33L, center). You may carry out from the left-right board | substrate mounting stages 36 and 53 with which the board | substrate transfer part 33C or the right side board | substrate transfer part 33R) is equipped.

また、左方基台11a、中央基台11b、右方基台11cは、一体の基台として形成されていても、それぞれ別個の基台として形成されていてもよい。   Further, the left base 11a, the center base 11b, and the right base 11c may be formed as an integral base or may be formed as separate bases.

基板に搭載した部品を落下させることなく部品の圧着作業に移行することができるようにした部品実装装置及び部品実装方法を提供する。   Provided are a component mounting apparatus and a component mounting method which can shift to a component crimping operation without dropping a component mounted on a substrate.

1 部品実装装置
2 基板
3 ACFテープ(接着部材)
4 部品
4a フィルム状部分
22a ACF貼着作業部(接着部材貼着作業部)
22b 部品搭載作業部
22c 第1の部品圧着作業部
22d 第2の部品圧着作業部
23 搬出基板載置部(基板搬出部)
33L 左方基板移送部(基板保持部)
33C 中央基板移送部(第1の基板移送手段)
33R 右方基板移送部(第2の基板移送手段)
53 基板載置ステージ
54 フィルム状部分支持部
65 位置認識カメラ(位置認識手段)
82 基板移載部(基板移載手段)
DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 ACF tape (adhesive member)
4 Parts 4a Film-like part 22a ACF sticking work part (adhesive member sticking work part)
22b Component mounting operation unit 22c First component crimping operation unit 22d Second component crimping operation unit 23 Unloading substrate mounting unit (substrate unloading unit)
33L Left substrate transfer unit (substrate holding unit)
33C Central substrate transfer unit (first substrate transfer means)
33R Right substrate transfer unit (second substrate transfer means)
53 Substrate Placement Stage 54 Film-like Partial Supporting Unit 65 Position Recognition Camera (Position Recognition Means)
82 Substrate transfer section (substrate transfer means)

Claims (6)

基板への部品の搭載作業を行う部品搭載作業部と、
前記部品搭載作業部を両側方から挟む位置に設けられ、前記部品搭載作業部において部品の搭載作業が行われた基板に前記部品搭載作業部で搭載された部品を圧着する第1の部品圧着作業部及び第2の部品圧着作業部と、
前記部品搭載作業部と前記第1の部品圧着作業部の間を水平方向に移動自在に設けられ、基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部による基板に対する部品の搭載作業が行われた後、前記第1の部品圧着作業部の側に移動して前記基板載置ステージに載置された状態のままの基板を前記第1の部品圧着作業部に移送する第1の基板移送手段と、
前記部品搭載作業部と前記第2の部品圧着作業部の間を水平方向に移動自在に設けられ、基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部による基板に対する部品の搭載作業が行われた後、前記第2の部品圧着作業部の側に移動して前記基板載置ステージに載置された状態のままの基板を前記第2の部品圧着作業部に移送する第2の基板移送手段とを備えたことを特徴とする部品実装装置。
A component mounting work unit for mounting components on the board;
A first component crimping operation that is provided at a position sandwiching the component mounting operation unit from both sides and that crimps the component mounted in the component mounting operation unit on a substrate on which the component mounting operation has been performed in the component mounting operation unit. Part and second component crimping working part;
Between the component mounting operation unit and the first component crimping operation unit, a horizontal movement is provided, and the substrate is transferred to the component mounting operation unit while the substrate is placed on the substrate mounting stage. After the component mounting operation is performed on the substrate by the component mounting operation unit, the substrate that has been moved to the first component crimping operation unit side and mounted on the substrate mounting stage is A first substrate transfer means for transferring to the first component crimping working unit;
Between the component mounting operation unit and the second component crimping operation unit, a horizontal movement is provided, and the substrate is transferred to the component mounting operation unit while the substrate is placed on the substrate mounting stage. After the component mounting operation is performed on the substrate by the component mounting operation unit, the substrate that has been moved to the second component crimping operation unit side and mounted on the substrate mounting stage is A component mounting apparatus comprising: a second substrate transfer means for transferring to a second component crimping operation unit.
外部より搬入された基板を保持する基板保持部と、前記基板保持部に保持された基板の前記部品搭載作業部により部品が搭載される箇所に接着部材を貼着する接着部材貼着作業部と、前記接着部材貼着作業部により接着部材が貼着された基板を第1の基板移送手段が備える前記基板載置ステージ及び前記第2の基板移送手段が備える前記基板載置ステージに振り分けて載置する基板移載手段とを備えたことを特徴とする請求項1に記載の部品実装装置。   A substrate holding unit for holding a substrate carried in from the outside, and an adhesive member adhering work unit for adhering an adhesive member to a place where a component is mounted by the component mounting operation unit of the substrate held by the substrate holding unit; The substrate on which the adhesive member is attached by the adhesive member attaching operation unit is distributed and placed on the substrate placement stage provided in the first substrate transfer means and the substrate placement stage provided in the second substrate transfer means. The component mounting apparatus according to claim 1, further comprising a board transfer means for placing the board. 前記基板移載手段は、前記第1の部品圧着作業部により部品が圧着された基板を前記第1の基板移送手段が備える前記基板載置ステージから受け取って或いは前記第2の部品圧着作業部により部品が圧着された基板を前記第2の基板移送手段が備える前記基板載置ステージから受け取ってその基板を基板搬出部に受け渡すことを特徴とする請求項1又は2に記載の部品実装装置。   The substrate transfer means receives a substrate on which a component has been crimped by the first component crimping working unit from the substrate mounting stage provided in the first substrate transporting unit or by the second component crimping working unit. 3. The component mounting apparatus according to claim 1, wherein a substrate to which a component is pressure-bonded is received from the substrate mounting stage provided in the second substrate transfer unit, and the substrate is transferred to a substrate carry-out unit. 前記部品搭載作業部は、前記第1の基板移送手段により移送された基板又は前記第2の基板移送手段により移送された基板に対する部品の搭載作業を行う前に、前記第1の基板移送手段が備える前記基板載置ステージに対する基板の位置認識又は前記第2の基板移送手段が備える前記基板載置ステージに対する基板の位置認識を行う位置認識手段を備えたことを特徴とする請求項1乃至3の何れかに記載の部品実装装置。   The component mounting operation unit is configured so that the first substrate transfer unit performs the component mounting operation on the substrate transferred by the first substrate transfer unit or the substrate transferred by the second substrate transfer unit. 4. The apparatus according to claim 1, further comprising position recognition means for recognizing the position of the substrate with respect to the substrate placement stage, or for recognizing the position of the substrate with respect to the substrate placement stage provided in the second substrate transfer means. The component mounting apparatus according to any one of the above. 前記部品搭載作業部によって基板に搭載される部品は基板に搭載された状態で基板の外にはみ出すフィルム状部分を有し、前記第1の基板移送手段が備える前記基板載置ステージ及び前記第2の基板移送手段が備える前記基板載置ステージは部品が基板に搭載された状態で前記フィルム状部分を下方から支持するフィルム状部分支持部を備えたことを特徴とする請求項1に記載の部品実装装置。   The component mounted on the substrate by the component mounting operation unit has a film-like portion protruding from the substrate in a state of being mounted on the substrate, and the substrate mounting stage provided in the first substrate transfer means and the second 2. The component according to claim 1, wherein the substrate mounting stage included in the substrate transfer unit includes a film-shaped portion supporting portion that supports the film-shaped portion from below in a state where the component is mounted on the substrate. Mounting device. 基板への部品の搭載作業が行われる部品搭載作業部と、前記部品搭載作業部を両側方から挟む位置に設けられ、前記部品搭載作業部において部品の搭載作業が行われた基板に前記部品搭載作業部で搭載された部品を圧着する第1の部品圧着作業部及び第2の部品圧着作業部と、前記部品搭載作業部と前記第1の部品圧着作業部の間を水平方向に移動自在に設けられた第1の基板移送手段及び前記部品搭載作業部と前記第2の部品圧着作業部の間を水平方向に移動自在に設けられた第2の基板移送手段とを備えた部品実装装置による部品実装方法であって、
前記第1の基板移送手段が備える基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部により基板に対する部品の搭載作業を行った後、前記第1の基板移送手段を前記第1の部品圧着作業部の側に移動させて前記基板載置ステージに載置させた状態のままの基板を前記第1の部品圧着作業部に移送し、前記第1の部品圧着作業部により基板に部品を圧着する工程と、
前記第2の基板移送手段が備える基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部により基板に対する部品の搭載作業を行った後、前記第2の基板移送手段を前記第2の部品圧着作業部の側に移動させて前記基板載置ステージに載置された状態のままの基板を前記第2の部品圧着作業部に移送し、前記第2の部品圧着作業部により基板に部品を圧着する工程とを含むことを特徴とする部品実装方法。
A component mounting work unit in which a component mounting operation is performed on a board, and the component mounting work unit are provided at positions sandwiching the component mounting work unit from both sides. A first component crimping working unit and a second component crimping working unit for crimping a component mounted in the working unit, and a horizontal movement between the component mounting working unit and the first component crimping working unit. According to the component mounting apparatus including the first board transfer means provided and the second board transfer means provided so as to be movable in the horizontal direction between the component mounting work section and the second component crimping work section. A component mounting method,
After the substrate is transferred to the component mounting operation unit in a state where the substrate is mounted on the substrate mounting stage provided in the first substrate transfer means, and the component mounting operation unit performs the component mounting operation on the substrate. Then, the first substrate transfer means is moved to the first component crimping operation part side to transfer the substrate that has been placed on the substrate mounting stage to the first component crimping operation unit. , The step of crimping the component to the substrate by the first component crimping working unit;
After the substrate is transferred to the component mounting operation unit in a state where the substrate is placed on the substrate mounting stage provided in the second substrate transfer means, and the component mounting operation unit performs the component mounting operation on the substrate. Then, the second substrate transfer means is moved to the second component crimping operation part side to transfer the substrate that has been placed on the substrate mounting stage to the second component crimping operation unit. And a step of crimping the component to the substrate by the second component crimping operation section.
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