JP2019160854A - Component mounting method and component mounting line - Google Patents

Abstract

To provide a component mounting method and a component mounting line improving the mounting accuracy of component, by calculating a correction value considering the worked facility configuration for every board.SOLUTION: On the basis of inspection information associating the board identification information with inspection results obtained by inspecting the position of a component 3 crimped to the board 2, the board identification information for identifying the inspected board 2, and the transportation stage information transported the inspected board 2, a correction value for correcting the relative position of the right side transportation stage 55R for transporting the right side board 2 and a right side crimp tool 51R for crimping the component 3 to the right side board 2, or the relative position of the left side transportation stage 55L for transporting the left side board 2 and a left side crimp tool 51L for crimping the component 3 to the left side board 2 is calculated. Mounting position is corrected when mounting the component 3 on the board 2, with the correction value calculated based on the transportation stage information.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a component mounting method and a component mounting line for crimping a component mounted on a substrate with a crimping tool.

  In an apparatus for manufacturing a liquid crystal panel substrate, an ACF adhering portion for adhering an anisotropic conductive film (ACF) tape of an anisotropic conductive member as an adhesive to the end portion of the substrate, and a portion where the ACF tape of the substrate is adhered A component mounting portion for mounting the component on the board, and a component crimping portion for crimping the component to the board on which the component is mounted in the component mounting portion. In Patent Document 1, a correction value for correcting a displacement of a component mounting position with respect to a substrate is calculated from a result of inspection by an inspection device connected to the rear side of the component mounting device, and the component mounting work unit is calculated using the correction value. It is described that the parts are mounted.

Japanese Patent Laid-Open No. 9-17825

  However, in order to improve productivity, a component mounting device having a component configuration that includes a conveyance unit that conveys a plurality of substrates at a time and a component crimping unit that has a crimping mechanism capable of crimping a plurality of substrates. If the correction value is not calculated in consideration of the above, the amount of misalignment may increase.

  Accordingly, an object of the present invention is to provide a component mounting method and a component mounting line in which a correction value is calculated in consideration of the equipment configuration worked for each board to improve the component mounting accuracy.

  In the component mounting method of the present invention, a component mounting portion for mounting a component on a substrate and two substrates on which the component is mounted are transported by a first transport stage and a second transport stage, and a first crimping unit and a second crimping unit. Component mounting in a component mounting line having a component mounting device having a component crimping section that crimps the component to each of the two substrates, and an inspection device that inspects the position of the component crimped to each of the two substrates. The method includes a first transfer step of transferring the substrate to the component mounting unit, a component mounting step of mounting the component on the substrate by the component mounting unit, and information of a transfer stage for transferring the substrate. Based on the transport stage information, one of the substrates is transported to the component crimping section by the first transport stage, and the other substrate is transported to the component crimping section by the second transport stage. A first crimping step of crimping the component mounted on one of the substrates by the first crimping means; and a second crimping of the component mounted on the other substrate by the second crimping means. A crimping step, an inspection step for inspecting the position of the component crimped to the substrate, an inspection result in the inspection step, substrate identification information for identifying the inspected substrate, and the transport stage information of the inspected substrate A correction value calculating step for calculating a correction value for correcting a relative position between the first transfer stage and the first pressure bonding unit or a relative position between the second transfer stage and the second pressure bonding unit; And a mounting position correction step of correcting a mounting position in the component mounting step with the calculated correction value based on the transfer stage information of the substrate.

  The component mounting line according to the present invention includes a component mounting unit that includes a component mounting unit that mounts a component on a substrate, a component crimping unit that crimps the component mounted on the substrate, and a position of the component that is crimped to the substrate. The component mounting line includes a first transport unit that transports the substrate to the component mounting unit, and a second transport unit that transports the two substrates to the component crimping unit. 2 parts, and the component crimping section includes a first crimping unit that crimps the component mounted on one of the substrates and a second crimping unit that crimps the component mounted on the other substrate. And the second transfer means has a first transfer stage for transferring one of the substrates to the first pressure bonding means, and a second transfer stage for transferring the other substrate to the second pressure bonding means. , The component mounting portion and the first A correction value is calculated from the mounting control unit that controls the mounting position by relatively controlling the sending unit, the inspection information acquiring unit that acquires the inspection information from the inspection apparatus, and the inspection information acquired by the inspection information acquisition unit. A correction value calculation unit; and a storage unit that stores substrate identification information for identifying the substrate associated with information on a transport stage to be transported, and the inspection apparatus determines a position of the component that is press-bonded to the substrate. An inspection unit that inspects, and an inspection information output unit that outputs an inspection result obtained by inspecting the position of the component by the inspection unit in association with the board identification information, and the correction value calculation unit includes the inspection information. And the relative position between the first transfer stage and the first pressure-bonding means or the second transfer stage based on the substrate identification information and the transfer stage information that transferred the inspected substrate. The correction value for correcting the relative position with respect to the two crimping means is calculated, and the mounting control unit is configured to calculate the correction value based on the transfer stage information of the substrate and the component mounting unit and the first transfer unit. Control the relative position of.

  According to the present invention, it is possible to improve a component mounting accuracy by calculating a correction value considering the equipment configuration worked for each board.

The top view of the component mounting line in one embodiment of this invention The figure which shows the advancing procedure of the operation | work which mounts components in the board | substrate by the component mounting line in one embodiment of this invention The perspective view of the board | substrate transfer body with which the component mounting line in one embodiment of this invention is provided (A) (b) Perspective view of ACF sticking part with which component mounting line in one embodiment of this invention is provided. (A) (b) The perspective view of the component mounting part with which the component mounting line in one embodiment of this invention is provided. (A) (b) The perspective view of the component crimping | compression-bonding part with which the component mounting line in one embodiment of this invention is provided. (A) (b) The perspective view of the test | inspection part with which the component mounting line in one embodiment of this invention is provided. The block diagram which shows the control system of the component mounting line in one embodiment of this invention (A) (b) Operation | movement explanatory drawing of ACF sticking part with which the component mounting line in one embodiment of this invention is provided (A) (b) Operation | movement explanatory drawing of the component mounting part with which the component mounting line in one embodiment of this invention is provided (A) (b) Operation | movement explanatory drawing of the component crimping apparatus with which the component mounting line in one embodiment of this invention is provided The flowchart which shows the flow of the test | inspection which the test | inspection apparatus with which the component mounting line in one embodiment of this invention is provided. (A) (b) Operation | movement explanatory drawing of the test | inspection apparatus with which the component mounting line in one embodiment of this invention is provided The figure which shows an example of the inspection information which the inspection information acquisition part of the component mounting line in one embodiment of this invention acquired The figure which shows an example of the correction value data of the mounting position which the correction value calculation part of the component mounting line in one embodiment of this invention calculated

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component mounting line 1 according to an embodiment of the present invention. The component mounting line 1 has a configuration in which a component mounting device 1A and an inspection device 1B on the downstream side thereof are connected, and a component 3 is mounted on a substrate 2 such as a liquid crystal panel (FIG. 2). In the present embodiment, for convenience of explanation, the front side of the component mounting line 1 viewed from the operator OP is referred to as the front of the component mounting line 1 and the back side of the component mounting line 1 viewed from the operator OP is referred to as the component mounting line 1. It is called the back of the. Further, the left side of the component mounting line 1 viewed from the operator OP is referred to as the left side of the component mounting line 1, and the right side of the component mounting line 1 viewed from the operator OP is referred to as the right side of the component mounting line. Further, the left-right direction of the component mounting line 1 is the X-axis direction, the front-rear direction is the Y-axis direction, and the vertical direction is the Z-axis direction.

  In FIG. 2, the substrate 2 has one or a plurality (two in this case) of mounting positions 2d (mounting positions) composed of a plurality of terminals on its upper surface, and a pair of positions 2d between the mounting positions 2d from both sides. The substrate side mark 2m is provided. On the other hand, the component 3 is provided with a joint portion 3D composed of a plurality of terminals corresponding to the plurality of terminals constituting the mounting position 2d on the lower surface thereof, and a pair of component side marks at positions sandwiching the joint portion 3D from both sides. 3M. The distance between the pair of board-side marks 2m and the pair of component-side marks 3M are the same, and the parts 3 are arranged so that the pair of board-side marks 2m and the pair of component-side marks 3M coincide in plan view. By attaching to the substrate 2, the component 3 can be attached to the substrate 2 in a state where the mounting position 2 d and the bonding portion 3 </ b> D are matched.

  In FIG. 1, the component mounting line 1 has a board transfer mechanism 12 in a front area of a base 11. In the rear region of the base 11, an ACF adhering portion 13, a component mounting portion 14, and a component crimping portion 15 are provided in order from the left side as viewed from the operator OP. The substrate transfer mechanism 12 has a configuration in which a plurality of substrate transfer bodies 12M can move independently in the X-axis direction on a guide table 12T provided by extending the foremost region of the base 11 in the X-axis direction.

  In FIG. 3, each substrate transfer body 12M has a plurality of suction arms 21 extending rearward. Each suction arm 21 is provided with a plurality of suction portions 22 with suction ports facing downward. Each substrate transfer body 12M sucks (picks up) the substrate 2 from above by the suction portion 22, and moves the substrate 2 by moving in the X-axis direction along the guide table 12T. Each substrate transfer body 12M can transfer two substrates 2 simultaneously.

  4A and 4B, the ACF sticking unit 13 includes two sticking tools 31 and two sticking support bases 32. The two sticking tools 31 are provided side by side in the X-axis direction and can be raised and lowered. Above each sticking tool 31, a tape supply reel 35 around which a tape member 34 with an ACF tape 33 attached is wound is provided. Each of the two sticking support bases 32 protrudes upward from the base 11 and has a shape extending in the X-axis direction. The two sticking support bases 32 are respectively located below the two sticking tools 31.

  In FIG. 1 and FIGS. 4A and 4B, a substrate moving mechanism 36 that positions the substrate 2 with respect to the ACF adhering portion 13 is provided in front of the ACF adhering portion 13. The substrate moving mechanism 36 is composed of an orthogonal coordinate moving mechanism. The substrate moving mechanism 36 moves the sticking stage base 37 extending in the X-axis direction in the X-axis direction, the Y-axis direction, and the Z-axis direction. As shown in FIG. 4A, the sticking stage base 37 includes sticking stages 38 having vacuum suction ports at both ends in the X-axis direction. In these two sticking stages 38, two substrates 2 are provided. Adsorb and hold.

  The sticking stage base 37 is moved between the “preparation position” (position shown in FIG. 4A) and the “working position” behind it (position shown in FIG. 4B) by the substrate moving mechanism 36. Is done. The distance in the X-axis direction of the two sticking tools 31 provided in the ACF sticking unit 13 and the distance in the X-axis direction of the two sticking support bases 32 of the two substrates 2 held by the two sticking stages 38 are as follows. It matches the interval in the X-axis direction.

  1 and FIGS. 5A and 5B, the component mounting unit 14 includes a component supply unit 41, a mounting head 42, a mounting support base 43, and an alignment camera 44. The component supply unit 41 supplies the component 3 mounted on the substrate 2. The mounting head 42 has a component suction port (not shown) for sucking the component 3 at the lower end. The mounting head 42 is moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the rotation directions around the Z-axis by a mounting head moving mechanism 42K configured by an orthogonal coordinate moving mechanism. The mounting support 43 has a shape that protrudes upward from the base 11 and extends in the X-axis direction. The alignment camera 44 is provided in the vicinity of the mounting support 43, and the imaging optical axis is directed upward.

  6 (a) and 6 (b), the component crimping portion 15 includes two crimping tools 51 and two crimping support bases 52. The two crimping tools 51 are provided side by side in the X-axis direction and can be raised and lowered. Of the two crimping tools 51, the right crimping tool 51 (right crimping tool 51R) is referred to as first crimping means, and the left crimping tool 51 (left crimping tool 51L) is referred to as second crimping means. Each of the two crimping support bases 52 has a shape protruding upward from the base 11 and extending in the X-axis direction. The two crimping support bases 52 are respectively positioned below the two crimping tools 51.

  In FIG. 1, FIG. 5 (a), (b) and FIG. 6 (a), (b), in front of the component mounting part 14 and the component crimping part 15, with respect to the component mounting part 14 and the component crimping part 15. A stage moving mechanism 53 for positioning the substrate 2 is provided. The stage moving mechanism 53 is composed of an orthogonal coordinate moving mechanism. The stage moving mechanism 53 moves the left and right transfer stage bases 54 extending in the X-axis direction in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.

  The left transfer stage base 54 (left transfer stage base 54L. FIGS. 1 and 5A, 5B) and the right transfer stage base 54 (right transfer stage base 54R. FIGS. 1 and 6A). (B)) includes transport stages 55 each having a vacuum suction port at both ends in the X-axis direction. The two transport stages 55 suck and hold the two substrates 2. Here, of the two transfer stage bases 54, the left transfer stage base 54L is referred to as a first transfer unit, and the right transfer stage base 54R is referred to as a second transfer unit. Further, one (right side) transfer stage 55 (right side transfer stage 55R) of the two transfer stages 55 included in each transfer stage base 54 is referred to as a first transfer stage, and the other (left side) transfer stage 55 (left side transfer). The stage 55L) is referred to as a second transfer stage.

  The left transfer stage base 54L is moved by the stage moving mechanism 53 between a “preparation position” (position shown in FIG. 5A) and a “working position” behind it (position shown in FIG. 5B). Is done. Similarly, the right transport stage base 54R is moved between a “preparation position” (position shown in FIG. 6A) and a “working position” behind it (position shown in FIG. 6B) by the stage moving mechanism 53. Moved between. The distance between the two crimping tools 51 provided in the component crimping section 15 in the X-axis direction and the distance between the two crimping support bases 52 in the X-axis direction are the two held by the two transport stages 55 provided in the right transport stage base 54R. This is consistent with the distance in the X-axis direction of the substrate 2.

  7A and 7B, the inspection apparatus 1B includes a camera 61 and a substrate moving unit 62. The camera 61 is installed downward toward the imaging optical axis. The substrate moving unit 62 is composed of an orthogonal coordinate moving mechanism. The substrate moving unit 62 moves the inspection stage base 63 extending in the X axis direction in the X axis direction, the Y axis direction, and the Z axis direction. The inspection stage base 63 includes inspection stages 64 having vacuum suction ports at both ends in the X-axis direction. The two inspection stages 64 suck and hold the two substrates 2.

  In FIG. 8, the operation of each part of the component mounting line 1 is controlled by the control device 70 provided in the component mounting line 1. The control device 70 includes a substrate transfer control unit 71, an ACF attachment control unit 72, a mounting control unit 73, and a pressure bonding control unit 74. The substrate transfer control unit 71 controls the transfer of the substrate 2 by the substrate transfer mechanism 12. The ACF sticking control unit 72 performs sticking control of the ACF tape 33 to the substrate 2 by the ACF sticking unit 13. The mounting control unit 73 controls the mounting position by relatively controlling the component mounting unit 14 and the left transport stage base 54L as the first transport unit. The crimping controller 74 controls the crimping of the component 3 to the substrate 2 by the component crimping unit 15. The control device 70 includes an inspection information acquisition unit 75, a correction value calculation unit 76, and a storage unit 77, and the inspection device 1B includes an inspection unit 78 and an inspection information output unit 79.

  Next, an operation procedure of each part of the component mounting line 1 (component mounting method using the component mounting line 1) will be described. In FIG. 1, when two substrates 2 of the same type are supplied from the outside, the two substrates 2 are received by the substrate transfer body 12M located on the leftmost side, and two substrates of the bonding stage base 37 positioned at the preparation position are received. Delivered to the sticking stage 38. The two sticking stages 38 suck and hold the two substrates 2 received from the substrate transfer body 12M.

  When the two bonding stages 38 hold the two substrates 2, the bonding stage base 37 moves from the preparation position to the working position and conveys the two substrates 2 to the ACF bonding unit 13 (FIG. 4A). FIG. 4 (b)). Thus, the lower surfaces of the rear end portions (mounting positions 2d) of the two substrates 2 held by the two bonding stages 38 are supported by the two bonding support bases 32 of the ACF bonding portion 13 (FIG. 4). (B)).

  When the rear end portions of the two substrates 2 are supported by the two sticking support bases 32, the two sticking tools 31 are lowered to push down the tape member 34 supplied by the tape supply reel 35. As a result, the ACF tape 33 attached to the tape member 34 is pressed against the substrate 2 and attached to the mounting position 2d (FIG. 4 (b) → FIG. 9 (a) → FIG. 9 (b). See also).

  When the two sticking tools 31 stick the ACF tape 33 to one of the two mounting positions 2d of each board 2, the sticking stage 38 moves in the X-axis direction, and the two boards 2 The other mounting position 2d is positioned below the two sticking tools 31. Then, the two attaching tools 31 are lowered, and the ACF tape 33 is attached to the other mounting position 2d. When the ACF tape 33 is attached to each of the two mounting positions 2d provided on the two substrates 2 in this manner, the attaching stage base 37 moves (returns) from the working position to the preparation position.

  When the sticking stage base 37 returns to the preparation position, the left substrate stage in which the two substrates 2 held by the two sticking stages 38 are located at the preparation position by the leftmost substrate transfer body 12M. It is delivered to the two transfer stages 55 of the base 54L. The two transfer stages 55 of the left transfer stage base 54L suck and hold the two substrates 2 received from the substrate transfer body 12M.

  When the two transfer stages 55 of the left transfer stage base 54L hold the two substrates 2, the left transfer stage base 54L moves from the preparation position in front of the component mounting unit 14 to the working position, and the two substrates 2 are moved to the component mounting unit. 14 (FIG. 5 (a) → FIG. 5 (b), first conveying step). When the two substrates 2 held by the two transfer stages 55 are transferred to the component mounting unit 14, the component mounting unit 14 mounts the component 3 on each of the two substrates 2 (component mounting process).

  When mounting a component, the component mounting unit 14 first operates the stage moving mechanism 53 to place the rear end portion of one of the two substrates 2 (for example, the right substrate 2) on the mounting support base 43. Support. When the rear end portion of the substrate 2 is supported by the mounting support base 43, the mounting head 42 moves above the component supply unit 41 and sucks the component 3 supplied by the component supply unit 41. Then, the mounting head 42 moves above the mounting support base 43 to position the joining portion 3D of the component 3 above the mounting position 2d (FIGS. 5B and 10A).

  When the joint portion 3D of the component 3 is positioned above the mounting position 2d, the mounting head 42 is lowered, and the component 3 is mounted on the substrate 2 via the ACF tape 33 attached to the substrate 2 (temporary pressure bonding) (FIG. 10). (A) → FIG. 10 (b)). At this time, the control device 70 causes the alignment camera 44 to observe both the pair of substrate side marks 2m and the pair of component side marks 3M, and based on the obtained image and a correction value described later, the mounting head 42 and the substrate movement The mechanism 36 is controlled.

  When the component 3 is mounted on one of the two substrates 2 held by the two transfer stages 55, the transfer stage base 54 moves in the X-axis direction and the other one of the two substrates 2. The substrate 2 (for example, the left substrate 2) is supported by the mounting support base 43. Then, the component 3 is mounted on the substrate 2 by the same procedure. In this way, when the component 3 is mounted on each of the two mounting positions 2d included in each substrate 2, the left transfer stage base 54L moves (returns) from the working position to the preparation position.

  When the left conveyance stage base 54L returns to the preparation position, the two substrates 2 held by the two conveyance stages 55 are moved to the right conveyance stage base 54R located at the preparation position by the substrate transfer body 12M located at the center. Are transferred to the two transfer stages 55. The two transfer stages 55 of the right transfer stage base 54R suck and hold the two substrates 2 received from the substrate transfer body 12M.

  When the two transfer stages 55 of the right transfer stage base 54R hold the two substrates 2, the right transfer stage base 54R moves from the preparation position in front of the component crimping unit 15 to the working position, and the two substrates 2 are moved to the component crimping unit. 15 (FIG. 6 (a) → FIG. 6 (b), second conveying step). Specifically, one of the two substrates 2 (right substrate 2) is transferred by the right transfer stage 55R, and the other substrate 2 (left substrate 2) is transferred by the left transfer stage 55L. Thereby, the lower surfaces of the rear end portions (mounting position 2d on which the component 3 is mounted) of each of the two substrates 2 are supported by the two crimping support bases 52 (FIGS. 6B and 11A). .

  When the lower surfaces of the end portions of the two substrates 2 are supported by the two crimping support bases 52, the two crimping tools 51 descend and press the component 3 (FIG. 11 (a) → FIG. 11 (b)). . As a result, the component 3 is pressed together with the substrate 2 against the crimping support base 52, and the component 3 is crimped (mainly crimped) to the substrate 2 (FIG. 11B). At this time, the component 3 mounted on one substrate 2 (right substrate 2) is crimped to the right substrate 2 by the right crimping tool 51R (first crimping means) (first crimping step), and the other substrate 2 (left side). The component 3 mounted on the substrate 2) is crimped to the left substrate 2 by the left crimping tool 51L (second crimping means) (second crimping step). As a result, when the component 3 is crimped to each of the two mounting positions 2d included in each substrate 2, the transfer stage base 54 moves (returns) from the work position to the preparation position.

  When the right transport stage base 54R returns to the preparation position, the two substrates 2 held by the two transport stages 55 are transferred to the 2 of the inspection stage base 63 included in the inspection apparatus 1B by the substrate transfer body 12M positioned on the rightmost side. Passed to one inspection stage 64. The two inspection stages 64 of the inspection stage base 63 suck and hold the substrate 2 received from the substrate transfer body 12M.

  When the two inspection stages 64 hold the two substrates 2, the inspection stage base 63 moves from the preparation position in front of the camera 61 to the working position, and the two substrates 2 are transported below the camera 61. When the two substrates 2 are positioned below the camera 61, the inspection apparatus 1B inspects the positions of the components 3 mounted (crimped) on the two substrates 2 (inspection process).

  The inspection of the position of the component 3 on the two substrates 2 is performed by the inspection unit 78 of the inspection apparatus 1B. The inspection unit 78 first moves the inspection stage base 63 in the X-axis direction, and of the two substrates 2 held by the two inspection stages 64, the mounting position of the substrate 2 to be inspected (for example, the right substrate 2). 2d is observed (imaged) by the camera 61 (step ST1 in the flowchart shown in FIG. 12; FIG. 13A). Then, the inspection unit 78 analyzes the image data acquired by the camera 61 and detects a positional deviation of the component 3 with respect to each mounting position 2d (step ST2).

  The inspection unit 78 detects the positional deviation of the component 3 with respect to the mounting position 2d by determining the positional deviation (ΔX1, ΔY1, Δθ1) of the two component-side marks 3M with respect to the two board-side marks 2m. Here, ΔX1 is a positional shift in the X-axis direction, ΔY1 is a positional shift in the Y-direction, and Δθ1 is a positional shift around the Z-axis.

  When the inspection unit 78 obtains the positional deviation (ΔX1, ΔY1, Δθ1), the inspection unit 78 examines whether each component of the positional deviation (ΔX1, ΔY1, Δθ1) is equal to or less than a reference value determined for each of the substrates 2. Is determined (step ST3). In this pass / fail determination, if each component of the positional deviation (ΔX1, ΔY1, Δθ1) is equal to or less than the reference value, it is determined that the crimping state of the component 3 to the substrate 2 is normal. On the other hand, when at least one of the components of the positional deviations (ΔX1, ΔY1, Δθ1) exceeds a predetermined reference value, the crimping state of the component 3 to the substrate 2 is abnormal. Determination is made and the substrate 2 is treated so as to be removed.

  When the inspection unit 78 inspects the position of the component 3, the inspection information output unit 79 included in the inspection apparatus 1B inspects the inspection result (the inspection result of the inspection unit 78 inspecting the position of the component 3) in association with the board identification information. Information is output (feedback) (step ST4). Note that the inspection information to be output is inspection information in which the crimping state of the component 3 to the substrate 2 is normal, but there is a certain positional deviation from the mounting position 2d.

  Here, the substrate identification information is information for identifying the inspected substrate 2. Specifically, information on the substrate 2 related to information on the transport stage 55 to be transported (information on whether the transport stage is the right transport stage 55R or the left transport stage 55L) (that is, the substrate 2 is a transport stage on the left and right). This information is used to identify the substrate 2 associated with which one of the two pressure bonding tools 51 is held. The board identification information is stored in the storage unit 77. The inspection apparatus 1B may acquire the board identification information from an ID mark (not shown) attached to the board 2 and associate it with the inspection result. In addition, the inspection apparatus 1B assigns serial numbers associated with the board identification information to the boards 2 placed in the component mounting line 1 in order, and the board identification associated with the inspection result by passing the serial numbers between the apparatuses. Information may be acquired.

  When the inspection of the substrate 2 to be inspected (right substrate 2) is completed in this way, it is determined whether there is still another substrate 2 to be inspected (step ST5). If there is still a substrate 2 to be inspected (left substrate 2), the process returns to step ST1, and inspection (step ST1 to step ST4) is performed on the next substrate 2 (left substrate 2) (step ST1). FIG. 13B). Thereby, the inspection results for each of the two substrates 2 are linked to the substrate identification information and fed back.

  The inspection information of the two substrates 2 fed back from the inspection unit 78 is acquired by the inspection information acquisition unit 75. FIG. 14 is an example of the inspection information acquired by the inspection information acquisition unit 75, and shows the positional deviation of the joint part 3D with respect to the mounting position 2d for each mounting position 2d. The positional deviation information is provided with a “left” or “right” flag that is substrate identification information and a “left” or “right” flag that is transfer stage information.

  When the inspection information acquisition unit 75 acquires the positional deviation information fed back from the inspection apparatus 1B, the correction value calculation unit 76 acquires the inspection information, the substrate identification information, and information on the transport stage 55 that transports the inspected substrate 2 ( And a correction value for correcting the relative position between the right conveyance stage 55R and the right crimping tool 51R or the relative position between the left conveyance stage 55L and the left crimping tool 51L (correction value calculation step). .

  FIG. 15 shows an example of correction value data calculated by the correction value calculation unit 76. Based on the positional deviation of the part 3 acquired by the inspection information acquisition unit 75, the right transport stage 55R and the right crimping tool 51R. Or a correction value for correcting the relative position between the left conveyance stage 55L and the left crimping tool 51L for each mounting position 2d. These correction values are provided with a “left” or “right” flag that is substrate identification information and a “left” or “right” flag that is transfer stage information. Here, ΔX is a correction value for correcting the positional deviation in the X-axis direction, ΔY is a correction value for correcting the positional deviation in the Y-direction, and Δθ is a correction value for correcting the positional deviation about the Z-axis.

  When the correction value calculation unit 76 calculates the correction value, the mounting control unit 73 executes a mounting position correction step), thereby determining the relative position between the component mounting unit 14 and the left transport stage base 54L as the first transport unit. Control. Here, the mounting position correction step is a correction value calculated based on transport stage information of the substrate 2 (information on whether the substrate 2 is bonded by the right crimping tool 51R or the left crimping tool 51L). This is a process of correcting the mounting position in the component mounting process.

  In the mounting position correction step, the mounting control unit 73 first determines that the substrate 2 on which the component mounting unit 14 mounts the component 3 is the two crimping tools 51 based on the mounting program stored in the storage unit 77. The information is read as to which is pressed. Then, the crimping tool 51 that will subsequently press the component mounted at the corrected mounting position and information on the transport stage 55 to be transported (information on whether it is the right transport stage 55R or the left transport stage 55L). Based on the associated board identification information, a correction value corresponding to the positional deviation corresponding to the crimping tool 51 is read, and the mounting position is corrected using the read correction value. When the relative position between the component mounting portion 14 and the left transport stage base 54L is controlled so that the component 3 is mounted at the mounting position corrected in this way, the mounted component 3 is used in the subsequent component crimping process. By being pressed by the crimping tool 51, it is crimped to an accurate position (designed mounting position) on the substrate 2.

  As described above, in the component mounting line 1 and the component mounting method (component mounting method) according to this component mounting line 1 according to the present embodiment, the inspection results obtained by inspecting the position of the component 3 crimped to the substrate 2; Based on the substrate identification information for identifying the inspected substrate 2 and the transport stage information for transporting the inspected substrate 2, the first transport that transports one of the two substrates 2 on which the component 3 is mounted by the component mounting unit 14. The component 3 is mounted at a relative position between the stage (right conveyance stage 55R) and the first crimping means (right crimping tool 51R) for crimping the component 3 mounted on one of the substrates 2 to the substrate 2 or at the component mounting portion 14. A second transfer stage (left transfer stage 55L) for transferring the other of the two substrates 2 and a second pressing means for pressing the component 3 mounted on the other substrate 2 to the substrate 2 (the left press tool 5). The relative positions of the L) is adapted to calculate a correction value for correcting. Then, based on the transfer stage information of the substrate 2 (information on whether the substrate 2 is crimped by the first crimping means or the second crimping means), the component 3 is mounted on the substrate 2 with the calculated correction value. The mounting position at the time is corrected. As described above, in the present embodiment, the correction value considering the equipment configuration worked for each substrate 2 is calculated, so that the mounting accuracy of the component 3 can be improved.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to the above-described ones, and various design changes can be made. For example, in the above-described embodiment, the correction value calculation unit calculates a correction value every time inspection information is output from the inspection apparatus 1B. However, a plurality of output results are accumulated and statistically calculated. The correction value may be calculated by processing. Moreover, in the above-mentioned embodiment, although the components 3 mounted on one board | substrate 2 were two left and right, this is an example and the number of the components 3 may be one, There may be three or more.

  Provided are a component mounting method and a component mounting line in which a correction value is calculated in consideration of the equipment configuration worked for each board and the mounting accuracy of the components is improved.

DESCRIPTION OF SYMBOLS 1 Component mounting line 1A Component mounting apparatus 1B Inspection apparatus 2 Board | substrate 2d Mounting position 3 Components 14 Component mounting part 15 Component crimping part 51R Right side crimping tool (1st crimping means)
51L Left side crimping tool (second crimping means)
54L Left transfer stage base (first transfer means)
54R Right transport stage base (second transport means)
55R Right transfer stage (first transfer stage)
55L Left transfer stage (second transfer stage)
73 Mounting Control Unit 75 Inspection Information Acquisition Unit 76 Correction Value Calculation Unit 77 Storage Unit 78 Inspection Unit 79 Inspection Information Output Unit

Claims (2)

A component mounting portion for mounting a component on a substrate, and the two substrates on which the component is mounted are transported by a first transport stage and a second transport stage, and the two substrates are transported by first and second crimping means. A component mounting method in a component mounting line having a component mounting device including a component crimping portion that crimps each of the components, and an inspection device that inspects the position of the component crimped to each of the two substrates,
A first transport step for transporting the substrate to the component mounting unit;
A component mounting step of mounting the component on the substrate by the component mounting unit;
Based on transport stage information which is information of a transport stage for transporting the substrate, one of the substrates is transported to the component crimping section by the first transport stage, and the other substrate is transported to the component crimping section by a second transport stage. A second conveying step for conveying to
A first crimping step of crimping the component mounted on one of the substrates by the first crimping means;
A second crimping step of crimping the component mounted on the other substrate by the second crimping means;
An inspection step of inspecting the position of the component crimped to the substrate;
Based on the inspection result in the inspection step, the substrate identification information for identifying the inspected substrate and the transport stage information of the inspected substrate, the relative position between the first transport stage and the first pressure bonding unit or the A correction value calculating step for calculating a correction value for correcting a relative position between the second transfer stage and the second pressure bonding unit;
A component mounting method including a mounting position correcting step of correcting a mounting position in the component mounting step with the calculated correction value based on the transport stage information of the substrate. A component mounting device including a component mounting portion for mounting a component on a substrate, a component crimping portion for crimping the component mounted on the substrate, and an inspection device for inspecting the position of the component crimped to the substrate. A component mounting line,
The component mounting apparatus includes:
First conveying means for conveying the substrate to the component mounting unit;
A second conveying means for conveying the two substrates to the component crimping portion;
The component crimping portion includes a first crimping unit that crimps the component mounted on one of the substrates and a second crimping unit that crimps the component mounted on the other substrate.
The second transport unit includes a first transport stage that transports one of the substrates to the first pressure-bonding unit, and a second transport stage that transports the other substrate to the second pressure-bonding unit,
A mounting control unit that controls the mounting position by relatively controlling the component mounting unit and the first transport unit;
An inspection information acquisition unit for acquiring inspection information from the inspection device;
A correction value calculation unit that calculates a correction value from the inspection information acquired by the inspection information acquisition unit;
A storage unit for storing substrate identification information for identifying the substrate associated with information on a transfer stage to be transferred;
The inspection device includes:
An inspection unit for inspecting the position of the component crimped to the substrate;
An inspection information output unit that outputs the inspection result obtained by inspecting the position of the component by the inspection unit in association with the board identification information;
The correction value calculator is configured to determine a relative position between the first transport stage and the first pressure bonding unit based on the inspection information, the substrate identification information, and transport stage information that transports the inspected substrate. Calculating a correction value for correcting a relative position between the second transport stage and the second pressure-bonding means;
The mounting control unit is a component mounting line that controls a relative position between the component mounting unit and the first transport unit with the calculated correction value based on the transport stage information of the substrate.

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