JP2017098465A - Processing device - Google Patents
Processing device Download PDFInfo
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- JP2017098465A JP2017098465A JP2015230740A JP2015230740A JP2017098465A JP 2017098465 A JP2017098465 A JP 2017098465A JP 2015230740 A JP2015230740 A JP 2015230740A JP 2015230740 A JP2015230740 A JP 2015230740A JP 2017098465 A JP2017098465 A JP 2017098465A
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- 238000005520 cutting process Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 4
- 230000032258 transport Effects 0.000 description 42
- 238000010586 diagram Methods 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
Description
本発明は、板状の被加工物を加工する加工装置に関する。 The present invention relates to a processing apparatus for processing a plate-shaped workpiece.
ＩＣ、ＬＳＩ等の半導体チップは、樹脂等で被覆されたパッケージデバイス（packaged devices）の態様で電子機器等に組み込まれることが多い。このパッケージデバイスは、例えば、複数の半導体チップを封止したパッケージ基板を所定の分割予定ライン（ストリート）に沿って分割することで製造できる（例えば、特許文献１参照）。 Semiconductor chips such as ICs and LSIs are often incorporated into electronic devices and the like in the form of packaged devices coated with resin or the like. This package device can be manufactured by, for example, dividing a package substrate encapsulating a plurality of semiconductor chips along a predetermined division line (street) (see, for example, Patent Document 1).
上述のようなパッケージデバイスの製造に係るコストは、例えば、パッケージ基板を大型化すれば下げることができる。そのため、パッケージデバイスの製造時には、分割装置（加工装置）によって分割できる範囲内で最も大きいパッケージ基板を形成するのが一般的である。 The cost for manufacturing the package device as described above can be reduced by increasing the size of the package substrate, for example. Therefore, at the time of manufacturing a package device, it is common to form the largest package substrate within a range that can be divided by a dividing device (processing device).
近年では、パッケージ基板の大型化が比較的容易になっており、分割装置で一度に分割できないような大きさのパッケージ基板が形成されることもある。この場合には、形成された大型のパッケージ基板を事前にカット（プレカット）して、分割装置で分割できる大きさへと加工する必要がある。 In recent years, it has become relatively easy to increase the size of a package substrate, and a package substrate having a size that cannot be divided at one time by a dividing apparatus may be formed. In this case, it is necessary to cut (pre-cut) the formed large package substrate in advance and process it to a size that can be divided by a dividing device.
しかしながら、上述のような事前のカットは、専用のプレカット装置を用いて行われるので、このプレカット装置がコストダウンを妨げる要因になっていた。本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、プレカット装置を用いることなく大型の被加工物を加工できる加工装置を提供することである。 However, since the pre-cutting as described above is performed using a dedicated pre-cut device, this pre-cut device has been a factor that hinders cost reduction. This invention is made | formed in view of this problem, The place made into the objective is providing the processing apparatus which can process a large sized workpiece, without using a precut apparatus.
本発明の一側面によれば、板状の第１被加工物が載置される載置部と、第１被加工物を分割して得られる第２被加工物を保持面で保持するチャックテーブルと、該チャックテーブルで保持した第２被加工物を加工する加工手段と、該載置部に載置された第１被加工物を保持して搬送する搬送手段と、該搬送手段で保持した第１被加工物をカットして該保持面に対応した大きさの複数の第２被加工物に分割するプレカット手段と、を備え、該プレカット手段は、該搬送手段の移動経路内に設置され、該搬送手段を移動しながら、該搬送手段で保持した第１被加工物に該プレカット手段を切り込ませることで、第１被加工物を該チャックテーブルへ搬送する前に複数の第２被加工物に分割することを特徴とする加工装置が提供される。 According to one aspect of the present invention, a mounting portion on which a plate-like first workpiece is placed, and a chuck that holds a second workpiece obtained by dividing the first workpiece on a holding surface. A table, a processing means for processing the second work piece held by the chuck table, a transport means for holding and transporting the first work piece placed on the mounting portion, and held by the transport means And a precut means for cutting the first work piece and dividing it into a plurality of second work pieces having a size corresponding to the holding surface, and the precut means is installed in the movement path of the transport means. The precut means is cut into the first workpiece held by the conveyance means while moving the conveyance means, so that a plurality of second workpieces are transferred before the first workpiece is conveyed to the chuck table. A processing apparatus is provided that is divided into workpieces.
本発明の一側面において、該搬送手段は、第２被加工物にそれぞれ対応する第１被加工物の複数の領域を保持できるように構成されており、該プレカット手段で第１被加工物を複数の第２被加工物に分割してから、複数の第２被加工物を順に該チャックテーブルへ搬送することが好ましい。 In one aspect of the present invention, the conveying unit is configured to be able to hold a plurality of regions of the first workpiece corresponding to the second workpiece, respectively, and the precut unit holds the first workpiece. It is preferable to divide the plurality of second workpieces into the plurality of second workpieces, and then sequentially convey the plurality of second workpieces to the chuck table.
本発明の一側面に係る加工装置では、第１被加工物を保持して搬送する搬送手段の移動経路内にプレカット手段が配置されているので、第１被加工物を保持した搬送手段を移動しながら、この第１被加工物にプレカット手段を切り込ませることで、第１被加工物をチャックテーブルへ搬送する前に複数の第２被加工物に分割できる。 In the processing apparatus according to one aspect of the present invention, the precut means is disposed in the movement path of the conveying means that holds and conveys the first workpiece, so that the conveying means that holds the first workpiece is moved. However, by cutting the precut means into the first workpiece, the first workpiece can be divided into a plurality of second workpieces before being conveyed to the chuck table.
つまり、本発明の一側面に係る加工装置では、搬送手段とプレカット手段とを用いて、大型の第１被加工物を、チャックテーブルの保持面に対応した大きさの複数の第２被加工物に分割するので、専用のプレカット装置を用いることなく大型の被加工物を加工できる。 In other words, in the processing apparatus according to one aspect of the present invention, a plurality of second workpieces having a size corresponding to the holding surface of the chuck table are transferred from the large first workpiece using the conveying means and the precut means. Therefore, a large workpiece can be processed without using a dedicated precut device.
添付図面を参照して、本発明の一側面に係る実施形態について説明する。図１は、本実施形態に係る加工装置の構成例を模式的に示す平面図である。なお、本実施形態では、板状の被加工物を切削する加工装置（切削装置）について説明するが、本発明に係る加工装置は、被加工物をレーザー光線で加工するレーザー加工装置等でも良い。 An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view schematically showing a configuration example of a processing apparatus according to the present embodiment. In addition, although this embodiment demonstrates the processing apparatus (cutting device) which cuts a plate-shaped workpiece, the processing apparatus which concerns on this invention may be the laser processing apparatus etc. which process a workpiece with a laser beam.
図１に示すように、加工装置（切削装置）２は、各構造を支持する基台４を備えている。基台４の前端部には、矩形の開口４ａが形成されており、この開口４ａ内には、大型の被加工物（第１被加工物）１１を載せる搬入側テーブル（載置部）６が配置されている。被加工物１１としては、例えば、複数の半導体チップを樹脂等で封止した矩形のパッケージ基板が用いられる。ただし、被加工物１１の種類、大きさ、形状等に制限はない。 As shown in FIG. 1, the processing apparatus (cutting apparatus) 2 includes a base 4 that supports each structure. A rectangular opening 4 a is formed at the front end of the base 4, and a loading-side table (mounting unit) 6 on which a large workpiece (first workpiece) 11 is placed in the opening 4 a. Is arranged. As the workpiece 11, for example, a rectangular package substrate in which a plurality of semiconductor chips are sealed with resin or the like is used. However, there is no restriction on the type, size, shape, etc. of the workpiece 11.
搬入側テーブル６の上方には、Ｘ軸方向（前後方向、加工送り方向）に移動可能な第１搬送ユニット（搬送手段）８が設けられている。搬入側テーブル６に載せられた大型の被加工物１１は、この第１搬送ユニット８で吸引、保持され、後方に搬送される。第１搬送ユニット８の詳細については後述する。 Above the carry-in table 6, a first transport unit (transport means) 8 is provided that is movable in the X-axis direction (front-rear direction, processing feed direction). The large workpiece 11 placed on the carry-in side table 6 is sucked and held by the first transport unit 8 and transported backward. Details of the first transport unit 8 will be described later.
開口４ａの後方には、Ｘ軸方向に長い矩形の開口４ｂが形成されている。この開口４ｂ内には、Ｘ軸移動テーブル１０、Ｘ軸移動テーブル１０をＸ軸方向に移動させるＸ軸移動機構（不図示）、及びＸ軸移動機構を覆う防塵防滴カバー１２が配置されている。 A rectangular opening 4b that is long in the X-axis direction is formed behind the opening 4a. In the opening 4b, an X-axis moving table 10, an X-axis moving mechanism (not shown) for moving the X-axis moving table 10 in the X-axis direction, and a dustproof and drip-proof cover 12 that covers the X-axis moving mechanism are arranged. Yes.
Ｘ軸移動テーブル１０の上方には、被加工物１１より小型の被加工物（第２被加工物）１３（図３（Ｃ）等参照）を保持するチャックテーブル１４が設けられている。チャックテーブル１４は、上述したＸ軸移動機構によってＸ軸移動テーブル１０と共にＸ軸方向に移動する。また、チャックテーブル１４は、モータ等の回転駆動源（不図示）に連結されており、Ｚ軸方向（鉛直方向）に概ね平行な回転軸の周りに回転する。 Above the X-axis moving table 10, a chuck table 14 that holds a workpiece (second workpiece) 13 (see FIG. 3C) that is smaller than the workpiece 11 is provided. The chuck table 14 moves in the X-axis direction together with the X-axis movement table 10 by the above-described X-axis movement mechanism. The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction).
チャックテーブル１４の上面は、被加工物１３を吸引、保持する保持面１４ａになっている。この保持面１４ａは、チャックテーブル１４の内部に形成された吸引路（不図示）等を通じて吸引源（不図示）に接続されており、被加工物１３を分割して得られる複数のチップ（不図示）を個別に吸引、保持できる。 The upper surface of the chuck table 14 is a holding surface 14 a that sucks and holds the workpiece 13. The holding surface 14 a is connected to a suction source (not shown) through a suction path (not shown) formed inside the chuck table 14, and a plurality of chips (not shown) obtained by dividing the workpiece 13. (Shown) can be sucked and held individually.
開口４ｂの上方には、チャックテーブル１４に保持された被加工物１３を切削加工して複数のチップに分割する切削ユニット（加工ユニット、加工手段）１６が配置されている。この切削ユニット１６は、切削ユニット移動機構（不図示）に支持されたスピンドルハウジング１８を含む。スピンドルハウジング１８の内部には、回転軸となるスピンドル（不図示）が収容されており、スピンドルの一端側には、円環状の切削ブレード２０が装着されている。 A cutting unit (processing unit, processing means) 16 for cutting the workpiece 13 held on the chuck table 14 and dividing it into a plurality of chips is disposed above the opening 4b. The cutting unit 16 includes a spindle housing 18 supported by a cutting unit moving mechanism (not shown). A spindle (not shown) serving as a rotating shaft is accommodated in the spindle housing 18, and an annular cutting blade 20 is attached to one end side of the spindle.
開口４ｂの後方には、分割後の被加工物１３を載せる搬出側テーブル２２が配置されている。切削ユニット１６で複数のチップに分割された被加工物１３は、搬出側テーブル２２の近傍に配置された第２搬送ユニット２４によって、チャックテーブル１４から搬出側テーブル２２へと搬送される。 A carry-out table 22 on which the divided workpiece 13 is placed is arranged behind the opening 4b. The workpiece 13 divided into a plurality of chips by the cutting unit 16 is transported from the chuck table 14 to the unloading side table 22 by the second transport unit 24 disposed in the vicinity of the unloading side table 22.
開口４ａと開口４ｂとの間の位置には、第１搬送ユニット８に保持された大型の被加工物１１をカット（プレカット）して、チャックテーブル１４の保持面１４ａに対応した大きさの複数の被加工物１３に分割するプレカットユニット（プレカット手段）２６が設けられている。 At a position between the opening 4a and the opening 4b, a large workpiece 11 held by the first transport unit 8 is cut (pre-cut), and a plurality of sizes corresponding to the holding surface 14a of the chuck table 14 are obtained. A precut unit (precut means) 26 for dividing the workpiece 13 is provided.
このプレカットユニット２６は、切削ブレード２０と同様の円環状の切削ブレード２８を備えている。また、プレカットユニット２６は、第１搬送ユニット８の移動経路内に設置されている。そのため、例えば、被加工物１１を保持した第１搬送ユニット８をＸ軸方向に移動しながら、この被加工物１１にプレカットユニット２６（切削ブレード２８）を切り込ませるだけで、大型の被加工物１１を複数の被加工物１３に分割できる。 The precut unit 26 includes an annular cutting blade 28 similar to the cutting blade 20. The precut unit 26 is installed in the movement path of the first transport unit 8. Therefore, for example, by moving the first transport unit 8 holding the workpiece 11 in the X-axis direction, the large-size workpiece can be obtained simply by cutting the precut unit 26 (cutting blade 28) into the workpiece 11. The object 11 can be divided into a plurality of workpieces 13.
被加工物１１をプレカットして得られた小型の被加工物１３は、第１搬送ユニット８で順にチャックテーブル１４へと搬送される。なお、本実施形態では、円環状の切削ブレード２８を備えるプレカットユニット２６を例示しているが、プレカットユニット２６の構成に制限はない。例えば、ドリルやルータ等をプレカットユニット２６として用いることもできる。 A small workpiece 13 obtained by precutting the workpiece 11 is sequentially conveyed to the chuck table 14 by the first conveyance unit 8. In the present embodiment, the precut unit 26 including the annular cutting blade 28 is illustrated, but the configuration of the precut unit 26 is not limited. For example, a drill or a router can be used as the precut unit 26.
プレカットユニット２６と開口４ｂとの間の位置には、第１搬送ユニット８に保持された被加工物１１，１３に対してエアー等を吹き付ける洗浄ユニット（ノズル）３０が配置されている。この洗浄ユニット３０を用いて被加工物１１，１３にエアーを吹き付けることで、プレカットの際に発生する加工屑を被加工物１１，１３から除去できる。なお、洗浄ユニット３０の構成に制限はなく、例えば、ブラシやスポンジ等を洗浄ユニット３０として用いることもできる。 A cleaning unit (nozzle) 30 for blowing air or the like to the workpieces 11 and 13 held by the first transport unit 8 is disposed at a position between the pre-cut unit 26 and the opening 4b. By using this cleaning unit 30 to blow air onto the workpieces 11 and 13, it is possible to remove the processing waste generated during the precut from the workpieces 11 and 13. The configuration of the cleaning unit 30 is not limited, and for example, a brush, a sponge, or the like can be used as the cleaning unit 30.
図２（Ａ）は、第１搬送ユニット８の構造等を模式的に示す図であり、図２（Ｂ）は、第１搬送ユニット８の下面側を模式的に示す図である。図２（Ａ）及び図２（Ｂ）に示すように、第１搬送ユニット８は、被加工物１１，１３を保持する保持ハンド３２を備えている。 FIG. 2A is a diagram schematically illustrating the structure and the like of the first transport unit 8, and FIG. 2B is a diagram schematically illustrating the lower surface side of the first transport unit 8. As shown in FIGS. 2A and 2B, the first transport unit 8 includes a holding hand 32 that holds the workpieces 11 and 13.
この保持ハンド３２は、搬送ユニット移動機構（不図示）に支持されており、Ｘ軸方向及びＺ軸方向に移動する。また、保持ハンド３２の上部には、モータ等の回転駆動源（不図示）が連結されており、保持ハンド３２は、Ｚ軸方向に概ね平行な回転軸の周りに回転する。 The holding hand 32 is supported by a transport unit moving mechanism (not shown) and moves in the X-axis direction and the Z-axis direction. Further, a rotation driving source (not shown) such as a motor is connected to the upper portion of the holding hand 32, and the holding hand 32 rotates around a rotation axis substantially parallel to the Z-axis direction.
保持ハンド３２の下面には、被加工物１１，１３の上面側を吸引、保持する複数（本実施形態では４個）の吸引パッド３４が設けられている。各吸引パッド３４は、被加工物１１を分割（本実施形態では４分割）して得られる被加工物１３に対応した形状に形成されており、吸引路３６、バルブ３８等を介して吸引源４０に接続されている。これにより、各吸引パッド３４で、被加工物１３に対応する被加工物１１の領域を個別に吸引、保持できる。 A plurality of (four in this embodiment) suction pads 34 are provided on the lower surface of the holding hand 32 to suck and hold the upper surfaces of the workpieces 11 and 13. Each suction pad 34 is formed in a shape corresponding to the workpiece 13 obtained by dividing the workpiece 11 (in this embodiment, four divisions), and a suction source is provided via a suction path 36, a valve 38, and the like. 40. Thereby, each suction pad 34 can individually suck and hold the region of the workpiece 11 corresponding to the workpiece 13.
次に、上述した第１搬送ユニット８及びプレカットユニット２６を用いる被加工物１１，１３の搬送及びプレカットについて説明する。まず、被加工物１１を載せた搬入側テーブル６の上方に第１搬送ユニット８を位置付ける。次に、保持ハンド３２を下降させて、被加工物１１の上面に吸引パッド３４を接触させる。 Next, conveyance and precut of the workpieces 11 and 13 using the first conveyance unit 8 and the precut unit 26 described above will be described. First, the first transport unit 8 is positioned above the carry-in table 6 on which the workpiece 11 is placed. Next, the holding hand 32 is lowered to bring the suction pad 34 into contact with the upper surface of the workpiece 11.
この状態で、全てのバルブ３８を開いて吸引源４０の負圧を各吸引パッド３４に作用させれば、被加工物１１を保持ハンド３２で吸引、保持できる。図３（Ａ）は、被加工物１１が搬入側テーブル６から第１搬送ユニット８に受け渡される様子を模式的に示す図である。図３（Ａ）に示すように、被加工物１１を保持ハンド３２で吸引、保持した後には、保持ハンド３２を上昇させる。これにより、被加工物１１は第１搬送ユニット８に受け渡される。 In this state, if all the valves 38 are opened and the negative pressure of the suction source 40 is applied to each suction pad 34, the workpiece 11 can be sucked and held by the holding hand 32. FIG. 3A is a diagram schematically illustrating a state in which the workpiece 11 is transferred from the carry-in side table 6 to the first transport unit 8. As shown in FIG. 3A, after the workpiece 11 is sucked and held by the holding hand 32, the holding hand 32 is raised. As a result, the workpiece 11 is transferred to the first transport unit 8.
第１搬送ユニット８に受け渡された被加工物１１は、プレカットユニット２６でプレカットされる。図３（Ｂ）は、被加工物１１がプレカットユニット２６でプレカットされる様子を模式的に示す図である。まず、保持ハンド３２の高さを調整し、保持ハンド３２で保持した被加工物１１の上面よりも僅かに高い位置に切削ブレード２８の上端を位置付ける。 The workpiece 11 transferred to the first transport unit 8 is precut by the precut unit 26. FIG. 3B is a diagram schematically illustrating a state in which the workpiece 11 is precut by the precut unit 26. First, the height of the holding hand 32 is adjusted, and the upper end of the cutting blade 28 is positioned at a position slightly higher than the upper surface of the workpiece 11 held by the holding hand 32.
次に、切削ブレード２８を回転させつつ保持ハンド３２を後方に移動させ、被加工物１１に切削ブレード２８を切り込ませる。これにより、被加工物１１は２分割される。なお、被加工物１１に切削ブレード２８を切り込ませる際には、洗浄ユニット３０から被加工物１１にエアーを吹き付けておく。これにより、被加工物１１への加工屑の付着を抑制できる。 Next, the holding hand 32 is moved backward while rotating the cutting blade 28, and the cutting blade 28 is cut into the workpiece 11. Thereby, the workpiece 11 is divided into two. Note that when the cutting blade 28 is cut into the workpiece 11, air is blown from the cleaning unit 30 to the workpiece 11. Thereby, adhesion of the processing waste to the workpiece 11 can be suppressed.
次に、保持ハンド３２を回転軸の周りに９０°回転させて、同様の手順を繰り返す。これにより、被加工物１１を４分割した被加工物１３が得られる。各吸引パッド３４は、被加工物１３に対応する形状を有しているので、切削ブレード２８を各吸引パッド３４に切り込ませることなく被加工物１１を完全に切断できる。 Next, the holding hand 32 is rotated 90 ° around the rotation axis, and the same procedure is repeated. Thereby, the workpiece 13 obtained by dividing the workpiece 11 into four parts is obtained. Since each suction pad 34 has a shape corresponding to the workpiece 13, the workpiece 11 can be completely cut without cutting the cutting blade 28 into each suction pad 34.
なお、本実施形態では、被加工物１１を４分割しているが、被加工物１１の分割数に制限はない。例えば、第１搬送ユニット８又はプレカットユニット２６をＹ軸方向に移動できるように構成すれば、被加工物１１を任意の数に分割できるようになる。同様に、Ｙ軸方向に複数のプレカットユニット２６を配置することで、被加工物１１の分割数を増加させることができる。 In the present embodiment, the workpiece 11 is divided into four parts, but the number of divisions of the workpiece 11 is not limited. For example, if the first transport unit 8 or the precut unit 26 is configured to be movable in the Y-axis direction, the workpiece 11 can be divided into an arbitrary number. Similarly, by arranging a plurality of precut units 26 in the Y-axis direction, the number of divisions of the workpiece 11 can be increased.
分割後の複数の被加工物１３は、順にチャックテーブル２２へと受け渡される。図３（Ｃ）は、分割後の被加工物１３が第１搬送ユニット８からチャックテーブル１４に受け渡される様子を模式的に示す図である。まず、チャックテーブル１４を前方側の搬入位置に位置付け、また、この搬入位置の上方に第１搬送ユニット８を位置付ける。これにより、受け渡しの対象となる被加工物１３が、チャックテーブル１４の直上に配置される。 The plurality of workpieces 13 after the division are sequentially transferred to the chuck table 22. FIG. 3C is a diagram schematically illustrating a state in which the divided workpiece 13 is transferred from the first transport unit 8 to the chuck table 14. First, the chuck table 14 is positioned at the front loading position, and the first transport unit 8 is positioned above the loading position. As a result, the workpiece 13 to be delivered is placed immediately above the chuck table 14.
次に、保持ハンド３２を下降させて、対象となる被加工物１３の下面をチャックテーブル１４の保持面１４ａに接触させる。この状態で、保持面１４ａに吸引源の負圧を作用させ、また、対象の被加工物１３に対応するバルブ３８を閉じれば、第１搬送ユニット８からチャックテーブル１４に対象の被加工物１３を受け渡して、この被加工物１３をチャックテーブル１４で吸引、保持できる。 Next, the holding hand 32 is lowered, and the lower surface of the target workpiece 13 is brought into contact with the holding surface 14 a of the chuck table 14. In this state, if the negative pressure of the suction source is applied to the holding surface 14a and the valve 38 corresponding to the target workpiece 13 is closed, the target workpiece 13 is transferred from the first transport unit 8 to the chuck table 14. The workpiece 13 can be delivered and sucked and held by the chuck table 14.
図４（Ａ）は、被加工物１３をチャックテーブル１４に受け渡した後の第１搬送ユニット８の動作を模式的に示す図である。なお、図４（Ａ）では、便宜的に２つの被加工物１３のみを示している。図４（Ａ）に示すように、対象の被加工物１３をチャックテーブル１４に受け渡した後には、保持ハンド３２を上昇させる。 FIG. 4A is a diagram schematically illustrating the operation of the first transport unit 8 after the workpiece 13 is transferred to the chuck table 14. In FIG. 4A, only two workpieces 13 are shown for convenience. As shown in FIG. 4A, after the target workpiece 13 is transferred to the chuck table 14, the holding hand 32 is raised.
その後、チャックテーブル１４で吸引、保持された被加工物１３は、上述した切削ユニット１６を用いて複数のチップへと分割される。被加工物１３を複数のチップへと分割した後には、チャックテーブル１４を後方側の搬出位置に位置付けて、第２搬送ユニット２４で被加工物１３（複数のチップ）を搬出側テーブル２２へと搬送する（図１）。 Thereafter, the workpiece 13 sucked and held by the chuck table 14 is divided into a plurality of chips using the cutting unit 16 described above. After the workpiece 13 is divided into a plurality of chips, the chuck table 14 is positioned at a rearward carry-out position, and the workpiece 13 (a plurality of chips) is transferred to the carry-out table 22 by the second transport unit 24. Transport (FIG. 1).
被加工物１３（複数のチップ）を搬出側テーブル２２へと搬送した後には、別の被加工物１３をチャックテーブル１４に受け渡す。具体的には、例えば、チャックテーブル１４を搬入位置に位置付け、保持ハンド３２を回転軸の周りに回転させることで、受け渡しの対象となる別の被加工物１３をチャックテーブル１４の上方に位置付ける。なお、保持ハンド３２の回転は、事前に実施しておいても良い。 After the workpiece 13 (a plurality of chips) is transferred to the carry-out table 22, another workpiece 13 is transferred to the chuck table 14. Specifically, for example, by positioning the chuck table 14 at the loading position and rotating the holding hand 32 around the rotation axis, another workpiece 13 to be transferred is positioned above the chuck table 14. The holding hand 32 may be rotated in advance.
図４（Ｂ）は、別の被加工物１３が第１搬送ユニット８からチャックテーブル１４に受け渡される様子を模式的に示す図である。まず、保持ハンド３２を下降させて、対象となる被加工物１３の下面をチャックテーブル１４の保持面１４ａに接触させる。この状態で、保持面１４ａに吸引源の負圧を作用させ、また、対象の被加工物１３に対応するバルブ３８を閉じれば、第１搬送ユニット８からチャックテーブル１４に対象の被加工物１３を受け渡して、この被加工物１３をチャックテーブル１４で吸引、保持できる。 FIG. 4B is a diagram schematically illustrating a state in which another workpiece 13 is transferred from the first transport unit 8 to the chuck table 14. First, the holding hand 32 is moved down so that the lower surface of the target workpiece 13 is brought into contact with the holding surface 14 a of the chuck table 14. In this state, if the negative pressure of the suction source is applied to the holding surface 14a and the valve 38 corresponding to the target workpiece 13 is closed, the target workpiece 13 is transferred from the first transport unit 8 to the chuck table 14. The workpiece 13 can be delivered and sucked and held by the chuck table 14.
以上のように、本実施形態に係る加工装置２では、被加工物（第１被加工物）１１を保持して搬送する第１搬送ユニット（搬送手段）８の移動経路内にプレカットユニット（プレカット手段）２６が配置されているので、被加工物１１を保持した第１搬送ユニット８を移動しながら、この被加工物１１にプレカットユニット２６（切削ブレード２８）を切り込ませることで、被加工物１１をチャックテーブル１４へ搬送する前に複数の被加工物（第２被加工物）１３に分割できる。 As described above, in the processing apparatus 2 according to the present embodiment, the precut unit (precut) is provided in the movement path of the first transport unit (transport means) 8 that holds and transports the workpiece (first workpiece) 11. Means) 26 is arranged, so that the pre-cut unit 26 (cutting blade 28) is cut into the workpiece 11 while moving the first transport unit 8 holding the workpiece 11, so that the workpiece is processed. The workpiece 11 can be divided into a plurality of workpieces (second workpieces) 13 before being conveyed to the chuck table 14.
つまり、本実施形態に係る加工装置２では、第１搬送ユニット８とプレカットユニット２６とを用いて、大型の被加工物１１を、チャックテーブル１４の保持面１４ａに対応した大きさの複数の被加工物１３に分割するので、専用のプレカット装置を用いることなく大型の被加工物１１を加工できる。 That is, in the processing apparatus 2 according to the present embodiment, the large workpiece 11 is transferred to a plurality of workpieces having a size corresponding to the holding surface 14 a of the chuck table 14 using the first transport unit 8 and the precut unit 26. Since the workpiece 13 is divided, the large workpiece 11 can be processed without using a dedicated precut device.
なお、本発明は上記実施形態の記載に限定されず、種々変更して実施可能である。例えば、上記実施形態では、プレカットユニット２６と開口４ｂとの間の位置にのみ洗浄ユニット（ノズル）３０を配置しているが、プレカットユニット２６と開口４ａとの間の位置に別の洗浄ユニットを配置しても良い。 In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, the cleaning unit (nozzle) 30 is disposed only at a position between the precut unit 26 and the opening 4b, but another cleaning unit is disposed at a position between the precut unit 26 and the opening 4a. It may be arranged.
この場合には、例えば、プレカットの際に保持ハンド３２を前方に移動させて、被加工物１１に切削ブレード２８を切り込ませても、被加工物１１への加工屑の付着を抑制できる。つまり、被加工物１１を清浄に保ちながら往復動作によるプレカットが可能になるので、加工装置２の生産性は高まる。 In this case, for example, even if the holding hand 32 is moved forward at the time of pre-cutting and the cutting blade 28 is cut into the workpiece 11, the attachment of the machining waste to the workpiece 11 can be suppressed. That is, since the pre-cut by reciprocation is possible while keeping the workpiece 11 clean, the productivity of the processing apparatus 2 is increased.
その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.
２ 加工装置（切削装置）
４ 基台
４ａ，４ｂ 開口
６ 搬入側テーブル（載置部）
８ 第１搬送ユニット（搬送手段）
１０ Ｘ軸移動テーブル
１２ 防塵防滴カバー
１４ チャックテーブル
１４ａ 保持面
１６ 切削ユニット（加工ユニット、加工手段）
１８ スピンドルハウジング
２０ 切削ブレード
２２ 搬出側テーブル
２４ 第２搬送ユニット
２６ プレカットユニット（プレカット手段）
２８ 切削ブレード
３０ 洗浄ユニット（ノズル）
３２ 保持ハンド
３４ 吸引パッド
３６ 吸引路
３８ バルブ
４０ 吸引源
１１ 被加工物（第１被加工物）
１３ 被加工物（第２被加工物）
2 Processing equipment (cutting equipment)
4 Base 4a, 4b Opening 6 Loading side table (mounting part)
8 First transport unit (transport means)
DESCRIPTION OF SYMBOLS 10 X-axis moving table 12 Dust-proof drip-proof cover 14 Chuck table 14a Holding surface 16 Cutting unit (processing unit, processing means)
18 Spindle housing 20 Cutting blade 22 Unloading table 24 Second transport unit 26 Precut unit (precut means)
28 Cutting blade 30 Cleaning unit (nozzle)
32 Holding Hand 34 Suction Pad 36 Suction Path 38 Valve 40 Suction Source 11 Workpiece (First Workpiece)
13 Work piece (second work piece)
Claims (2)
該プレカット手段は、該搬送手段の移動経路内に設置され、
該搬送手段を移動しながら、該搬送手段で保持した第１被加工物に該プレカット手段を切り込ませることで、第１被加工物を該チャックテーブルへ搬送する前に複数の第２被加工物に分割することを特徴とする加工装置。 A mounting portion on which the plate-like first workpiece is placed, a chuck table that holds a second workpiece obtained by dividing the first workpiece on a holding surface, and the chuck table that holds the workpiece. A processing means for processing the second work piece, a transport means for holding and transporting the first work piece placed on the mounting portion, and a first work piece held by the transport means are cut. And pre-cut means for dividing into a plurality of second workpieces having a size corresponding to the holding surface,
The precut means is installed in the movement path of the transport means,
A plurality of second workpieces are transferred before the first workpiece is conveyed to the chuck table by moving the conveying means and cutting the precut means into the first workpiece held by the conveying means. The processing apparatus characterized by dividing into objects.
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| WO2022113574A1 (en) * | 2020-11-24 | 2022-06-02 | Ｔｏｗａ株式会社 | Cutting device and cut item production method |
| WO2022113572A1 (en) * | 2020-11-24 | 2022-06-02 | Ｔｏｗａ株式会社 | Cutting device and production method of cut article |
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| JP4339452B2 (en) | 1999-07-09 | 2009-10-07 | 株式会社ディスコ | CSP substrate splitting device |
| JP2005129567A (en) | 2003-10-21 | 2005-05-19 | Trecenti Technologies Inc | Manufacturing method for semiconductor device |
| JP2009302369A (en) | 2008-06-16 | 2009-12-24 | Disco Abrasive Syst Ltd | Method and apparatus for processing plate-like object |
| JP2014093444A (en) | 2012-11-05 | 2014-05-19 | Disco Abrasive Syst Ltd | Wafer processing method |
| JP6228058B2 (en) | 2014-03-28 | 2017-11-08 | 株式会社東京精密 | Semiconductor manufacturing apparatus and semiconductor manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH09148275A (en) * | 1995-11-17 | 1997-06-06 | Disco Abrasive Syst Ltd | Dicing system of large diameter wafer |
| US20060056955A1 (en) * | 2004-09-08 | 2006-03-16 | Yong-Kuk Kim | Sawing and sorting system |
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| WO2022113574A1 (en) * | 2020-11-24 | 2022-06-02 | Ｔｏｗａ株式会社 | Cutting device and cut item production method |
| WO2022113572A1 (en) * | 2020-11-24 | 2022-06-02 | Ｔｏｗａ株式会社 | Cutting device and production method of cut article |
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