JP2017228617A - Holding mechanism and processing device of workpiece - Google Patents
Holding mechanism and processing device of workpiece Download PDFInfo
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- JP2017228617A JP2017228617A JP2016122917A JP2016122917A JP2017228617A JP 2017228617 A JP2017228617 A JP 2017228617A JP 2016122917 A JP2016122917 A JP 2016122917A JP 2016122917 A JP2016122917 A JP 2016122917A JP 2017228617 A JP2017228617 A JP 2017228617A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 54
- 239000012530 fluid Substances 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 11
- 230000005307 ferromagnetism Effects 0.000 claims abstract description 9
- 230000001747 exhibiting effect Effects 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 description 22
- 239000002390 adhesive tape Substances 0.000 description 10
- 230000032258 transport Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000035699 permeability Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002173 cutting fluid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Jigs For Machine Tools (AREA)
- Feeding Of Workpieces (AREA)
- Mechanical Engineering (AREA)
Abstract
Description
本発明は、板状の被加工物を保持する保持機構、及びこの保持機構を備える加工装置に関する。 The present invention relates to a holding mechanism that holds a plate-shaped workpiece, and a processing apparatus including the holding mechanism.
半導体ウェーハやパッケージ基板等に代表される板状の被加工物を複数のチップへと分割する際には、例えば、切削装置やレーザー加工装置等の加工装置が使用される。これらの加工装置には、ポンプ等によって形成される真空（負圧）を利用して被加工物を吸引、保持するチャックテーブルが設けられている（例えば、特許文献１参照）。 When a plate-like workpiece typified by a semiconductor wafer or a package substrate is divided into a plurality of chips, for example, a processing device such as a cutting device or a laser processing device is used. These processing apparatuses are provided with a chuck table that sucks and holds a workpiece using a vacuum (negative pressure) formed by a pump or the like (see, for example, Patent Document 1).
被加工物は、例えば、下面にダイシングテープ等と呼ばれる粘着テープが貼り付けられた状態で、このチャックテーブルに吸引、保持される。粘着テープの外周部分には、分割後の被加工物（複数のチップ）を取り扱い易くするために、環状のフレームが固定されることもある。 The workpiece is sucked and held on the chuck table in a state where an adhesive tape called a dicing tape or the like is attached to the lower surface, for example. An annular frame may be fixed to the outer peripheral portion of the adhesive tape in order to make it easy to handle the divided workpiece (a plurality of chips).
ところで、被加工物の分割時に使用される上述の粘着テープは使い捨てなので、製造コストの点において改善の余地がある。近年では、粘着テープを用いることなく分割後の被加工物（複数のチップ）を保持できるように、各チップに対応する吸引部を備えた治具テーブル等も提案されている（例えば、特許文献２，３参照）。 By the way, since the above-mentioned adhesive tape used at the time of division of a work piece is disposable, there is room for improvement in terms of manufacturing cost. In recent years, a jig table or the like provided with a suction portion corresponding to each chip has been proposed so that the divided workpiece (a plurality of chips) can be held without using an adhesive tape (for example, Patent Documents). 2 and 3).
しかしながら、上述のような治具テーブルでは、ある程度までチップが小型化されると各チップに作用する吸引力が不足してチップを適切に保持できなくなる。分割後の被加工物（複数のチップ）を吸引、保持して搬送する搬送ユニットについても、同様の問題が発生していた。 However, in the jig table as described above, if the chip is downsized to a certain extent, the suction force acting on each chip is insufficient and the chip cannot be held properly. The same problem has occurred in the transport unit that sucks, holds, and transports the workpiece (several chips) after the division.
本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、被加工物をより適切に保持できる被加工物の保持機構、及びこの保持機構を備える加工装置を提供することである。 The present invention has been made in view of such problems, and an object of the present invention is to provide a workpiece holding mechanism that can hold the workpiece more appropriately, and a processing apparatus including the holding mechanism. It is.
本発明の一態様によれば、保持面を有する保持基台と、該保持基台の該保持面に設置され、強磁性を示す材料を含む被加工物との間に引力を生じさせる磁石と、該磁石との間に生じる引力によって該保持基台の該保持面側に保持された被加工物に対し、該保持面から離れる向きの力を加えるリリース手段と、を備え、該リリース手段は、該保持面を覆うカバーシートと、該保持面と該カバーシートとの間に流体を供給して該カバーシートを膨らませる流体供給部と、を有し、該カバーシートを介して該磁石との間に生じる引力によって被加工物を保持することを特徴とする被加工物の保持機構が提供される。 According to one aspect of the present invention, a magnet that generates an attractive force between a holding base having a holding surface and a workpiece that is provided on the holding surface of the holding base and includes a material exhibiting ferromagnetism. Release means for applying a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base by an attractive force generated between the holding base and the release means, A cover sheet that covers the holding surface, and a fluid supply section that supplies fluid between the holding surface and the cover sheet to inflate the cover sheet, and the magnet is interposed through the cover sheet. A workpiece holding mechanism is provided, wherein the workpiece is held by an attractive force generated between the workpieces.
本発明の一態様において、該保持面には、該カバーシートと該保持面との間の該流体の排出を制御する排出路が接続されていることが好ましい。 In one aspect of the present invention, it is preferable that a discharge path for controlling discharge of the fluid between the cover sheet and the holding surface is connected to the holding surface.
本発明の別の一態様によれば、強磁性を示す材料を含む被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工ユニットと、該チャックテーブルに被加工物を搬入し、又は該チャックテーブルから被加工物を搬出する搬送手段と、を備え、該搬送手段は、保持面を有する保持基台と、該保持基台と該チャックテーブルとを相対的に移動させる移動手段と、該保持基台の該保持面に設置され、被加工物との間に引力を生じさせる磁石と、該磁石との間に生じる引力によって該保持基台の該保持面側に保持された被加工物に対し、該保持面から離れる向きの力を加えるリリース手段と、を備え、該リリース手段は、該保持面を覆うカバーシートと、該保持面と該カバーシートとの間に流体を供給して該カバーシートを膨らませる流体供給部と、を有し、該搬送手段は、該カバーシートを介して該磁石との間に生じる引力によって被加工物を保持することを特徴とする加工装置が提供される。 According to another aspect of the present invention, a chuck table for holding a workpiece including a material exhibiting ferromagnetism, a processing unit for processing a workpiece held on the chuck table, and a workpiece on the chuck table. Conveying means for loading a workpiece or unloading a workpiece from the chuck table, the conveying means relative to the holding base having a holding surface, the holding base and the chuck table. The holding means of the holding base is moved by the moving means for moving to the holding base, the magnet installed on the holding surface of the holding base and generating an attractive force with the workpiece, and the attractive force generated between the magnet and the holding surface. Release means for applying a force in a direction away from the holding surface to the workpiece held on the side, the release means covering the holding surface, the holding surface and the cover sheet Supplying a fluid during And a fluid supply section for inflating the bar sheet, wherein the conveying means holds the workpiece by attractive force generated between the magnet and the magnet via the cover sheet. The
本発明の別の一態様において、該保持面には、該カバーシートと該保持面との間の該流体の排出を制御する排出路が接続されていることが好ましい。 In another aspect of the present invention, it is preferable that a discharge path for controlling discharge of the fluid between the cover sheet and the holding surface is connected to the holding surface.
本発明の一態様に係る被加工物の保持機構は、強磁性を示す材料を含む被加工物との間に引力を生じさせる磁石を保持基台の保持面に備えている。よって、磁石との間に生じる引力によって被加工物を適切に保持できる。同様に、本発明の別の一態様に係る加工装置も、磁石との間に生じる引力によって被加工物を適切に保持できる。 A workpiece holding mechanism according to an aspect of the present invention includes a magnet that generates an attractive force between a workpiece including a material exhibiting ferromagnetism on a holding surface of a holding base. Accordingly, the workpiece can be appropriately held by the attractive force generated between the magnet and the magnet. Similarly, the processing apparatus according to another aspect of the present invention can appropriately hold the workpiece by the attractive force generated between the processing apparatus and the magnet.
また、本発明の一態様に係る被加工物の保持機構は、保持基台の保持面側に保持された被加工物に対し、保持面から離れる向きの力を加えるリリース手段を備えている。よって、このリリース手段で被加工物に力を加えることで、被加工物を保持基台から簡単に取り外すことができる。同様に、本発明の別の一態様に係る加工装置も、被加工物を保持基台から簡単に取り外すことができる。 In addition, the workpiece holding mechanism according to one aspect of the present invention includes release means for applying a force in a direction away from the holding surface to the workpiece held on the holding surface side of the holding base. Therefore, the workpiece can be easily detached from the holding base by applying a force to the workpiece with the release means. Similarly, the processing apparatus according to another aspect of the present invention can easily remove the workpiece from the holding base.
添付図面を参照して、本発明の一態様に係る実施形態について説明する。図１は、本実施形態に係る加工装置（切削装置）２の構成例を模式的に示す斜視図である。なお、本実施形態では、板状の被加工物を切削加工する加工装置２について説明するが、本発明に係る加工装置は、レーザービームにより被加工物を加工するレーザー加工装置等でも良い。 Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a configuration example of a processing apparatus (cutting apparatus) 2 according to the present embodiment. In addition, although this embodiment demonstrates the processing apparatus 2 which cuts a plate-shaped workpiece, the processing apparatus based on this invention may be the laser processing apparatus etc. which process a workpiece with a laser beam.
図１に示すように、加工装置２は、各構造を支持する基台４を備えている。基台４の中央には、Ｘ軸方向（前後方向、加工送り方向）に長い矩形の開口４ａが形成されている。この開口４ａ内には、Ｘ軸移動テーブル６、Ｘ軸移動テーブル６をＸ軸方向に移動させるＸ軸移動機構（移動手段）（不図示）、及びＸ軸移動機構を覆う防塵防滴カバー８が配置されている。 As shown in FIG. 1, the processing apparatus 2 includes a base 4 that supports each structure. In the center of the base 4, a rectangular opening 4 a that is long in the X-axis direction (front-rear direction, processing feed direction) is formed. Within this opening 4a, an X-axis moving table 6, an X-axis moving mechanism (moving means) (not shown) for moving the X-axis moving table 6 in the X-axis direction, and a dustproof and splash-proof cover 8 that covers the X-axis moving mechanism. Is arranged.
Ｘ軸移動テーブル６の上方には、板状の被加工物１１を保持するチャックテーブル１０が設けられている。図１に示すように、被加工物１１は、例えば、強磁性を示す鉄、コバルト、ニッケル等の材料を含んで形成された矩形のパッケージ基板、セラミックス基板、ガラス基板、半導体ウェーハ等であり、その下面には、粘着テープ（粘着フィルム）１３が貼り付けられている。 Above the X-axis moving table 6, a chuck table 10 that holds a plate-like workpiece 11 is provided. As shown in FIG. 1, the workpiece 11 is, for example, a rectangular package substrate, a ceramic substrate, a glass substrate, a semiconductor wafer, or the like formed by including a material such as iron, cobalt, or nickel that exhibits ferromagnetism, An adhesive tape (adhesive film) 13 is attached to the lower surface.
ただし、被加工物１１の形状等に制限はない。例えば、円盤状のパッケージ基板等を被加工物１１として用いることもできる。また、粘着テープ１３の外縁部に環状のフレーム（支持部材）等を固定しても良い。この場合、被加工物１１は、粘着テープ１３を介して環状のフレーム等に支持される。 However, the shape of the workpiece 11 is not limited. For example, a disk-shaped package substrate or the like can be used as the workpiece 11. Further, an annular frame (support member) or the like may be fixed to the outer edge portion of the adhesive tape 13. In this case, the workpiece 11 is supported by an annular frame or the like via the adhesive tape 13.
チャックテーブル１０は、モータ等の回転駆動源（不図示）に連結されており、Ｚ軸方向（鉛直方向、高さ方向）に概ね平行な回転軸の周りに回転する。また、上述したＸ軸移動機構でＸ軸移動テーブル６をＸ軸方向に移動させれば、チャックテーブル１０もＸ軸方向に移動する。 The chuck table 10 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction, height direction). Further, when the X-axis moving table 6 is moved in the X-axis direction by the X-axis moving mechanism described above, the chuck table 10 is also moved in the X-axis direction.
例えば、被加工物１１をチャックテーブル１０に搬入し、又はチャックテーブル１０から搬出する際には、被加工物１１が搬入、搬出される前方の搬入搬出領域と、被加工物１１が加工される中央の加工領域との間でチャックテーブル１０をＸ軸方向に移動させる。また、被加工物１１を加工する際には、上述した加工領域内でチャックテーブル１０をＸ軸方向に移動させる（加工送り）。 For example, when the workpiece 11 is carried into or out of the chuck table 10, the front loading / unloading area where the workpiece 11 is loaded and unloaded and the workpiece 11 are processed. The chuck table 10 is moved in the X-axis direction between the center machining area. Further, when the workpiece 11 is processed, the chuck table 10 is moved in the X-axis direction within the above-described processing region (processing feed).
チャックテーブル１０の上面は、被加工物１１に対応する形状（本実施形態では、概ね平坦な矩形）に形成されており、被加工物１１を保持する保持面１０ａになる。保持面１０ａは、Ｘ軸方向及びＹ軸方向（左右方向、割り出し送り方向）に対して概ね平行であり、チャックテーブル１０の内部に形成された流路（不図示）等を通じて吸引源（不図示）に接続されている。 The upper surface of the chuck table 10 is formed in a shape corresponding to the workpiece 11 (in the present embodiment, a generally flat rectangle) and serves as a holding surface 10 a that holds the workpiece 11. The holding surface 10a is substantially parallel to the X-axis direction and the Y-axis direction (left-right direction, indexing feed direction), and is provided with a suction source (not shown) through a flow path (not shown) formed inside the chuck table 10. )It is connected to the.
基台４の上面には、２組の切削ユニット（加工ユニット、加工手段）１２を支持する門型の支持構造１４が、開口４ａを跨ぐように配置されている。支持構造１４の前面上部には、各切削ユニット１２をＹ軸方向及びＺ軸方向に移動させる２組の切削ユニット移動機構１６が設けられている。 On the upper surface of the base 4, a gate-type support structure 14 that supports two sets of cutting units (processing units, processing means) 12 is disposed so as to straddle the opening 4 a. Two sets of cutting unit moving mechanisms 16 for moving each cutting unit 12 in the Y-axis direction and the Z-axis direction are provided on the upper front surface of the support structure 14.
各切削ユニット移動機構１６は、支持構造１４の前面に配置されＹ軸方向に平行な一対のＹ軸ガイドレール１８を共通に備えている。Ｙ軸ガイドレール１８には、各切削ユニット移動機構１６を構成するＹ軸移動プレート２０がスライド可能に取り付けられている。各Ｙ軸移動プレート２０の裏面側（後面側）には、ナット部（不図示）が設けられており、このナット部には、Ｙ軸ガイドレール１８に平行なＹ軸ボールネジ２２がそれぞれ螺合されている。 Each cutting unit moving mechanism 16 includes a pair of Y-axis guide rails 18 arranged in front of the support structure 14 and parallel to the Y-axis direction. A Y-axis moving plate 20 constituting each cutting unit moving mechanism 16 is slidably attached to the Y-axis guide rail 18. A nut portion (not shown) is provided on the back side (rear side) of each Y-axis moving plate 20, and a Y-axis ball screw 22 parallel to the Y-axis guide rail 18 is screwed to each nut portion. Has been.
各Ｙ軸ボールネジ２２の一端部には、Ｙ軸パルスモータ２４が連結されている。Ｙ軸パルスモータ２４でＹ軸ボールネジ２２を回転させれば、Ｙ軸移動プレート２０は、Ｙ軸ガイドレール１８に沿ってＹ軸方向に移動する。 A Y-axis pulse motor 24 is connected to one end of each Y-axis ball screw 22. If the Y-axis ball screw 22 is rotated by the Y-axis pulse motor 24, the Y-axis moving plate 20 moves in the Y-axis direction along the Y-axis guide rail 18.
各Ｙ軸移動プレート２０の表面（前面）には、Ｚ軸方向に平行な一対のＺ軸ガイドレール２６が設けられている。Ｚ軸ガイドレール２６には、Ｚ軸移動プレート２８がスライド可能に取り付けられている。各Ｚ軸移動プレート２８の裏面側（後面側）には、ナット部（不図示）が設けられており、このナット部には、Ｚ軸ガイドレール２６に平行なＺ軸ボールネジ３０がそれぞれ螺合されている。 A pair of Z-axis guide rails 26 parallel to the Z-axis direction are provided on the surface (front surface) of each Y-axis moving plate 20. A Z-axis moving plate 28 is slidably attached to the Z-axis guide rail 26. A nut portion (not shown) is provided on the back surface side (rear surface side) of each Z-axis moving plate 28, and a Z-axis ball screw 30 parallel to the Z-axis guide rail 26 is screwed to each nut portion. Has been.
各Ｚ軸ボールネジ３０の一端部には、Ｚ軸パルスモータ３２が連結されている。Ｚ軸パルスモータ３２でＺ軸ボールネジ３０を回転させれば、Ｚ軸移動プレート２８は、Ｚ軸ガイドレール２６に沿ってＺ軸方向に移動する。 A Z-axis pulse motor 32 is connected to one end of each Z-axis ball screw 30. When the Z-axis ball screw 30 is rotated by the Z-axis pulse motor 32, the Z-axis moving plate 28 moves in the Z-axis direction along the Z-axis guide rail 26.
各Ｚ軸移動プレート２８の下部には、切削ユニット１２が設けられている。この切削ユニット１２は、回転軸となるスピンドル（不図示）の一端側に装着された円環状の切削ブレード３４を備えている。切削ブレード３４の近傍には、純水等の切削液（加工液）を供給するノズル３６が配置されている。また、切削ユニット１２に隣接する位置には、チャックテーブル１０に保持された被加工物１１等を撮像するカメラ３８が設けられている。 A cutting unit 12 is provided below each Z-axis moving plate 28. The cutting unit 12 includes an annular cutting blade 34 attached to one end side of a spindle (not shown) serving as a rotation shaft. In the vicinity of the cutting blade 34, a nozzle 36 for supplying a cutting fluid (processing fluid) such as pure water is disposed. Further, a camera 38 that images the workpiece 11 and the like held on the chuck table 10 is provided at a position adjacent to the cutting unit 12.
各切削ユニット移動機構１６でＹ軸移動プレート２０をＹ軸方向に移動させれば、切削ユニット１２及びカメラ３８はＹ軸方向に移動する（割り出し送り）。また、各切削ユニット移動機構１６でＺ軸移動プレート２８をＺ軸方向に移動させれば、切削ユニット１２及びカメラ３８はＺ軸方向に移動する。 If the Y-axis moving plate 20 is moved in the Y-axis direction by each cutting unit moving mechanism 16, the cutting unit 12 and the camera 38 move in the Y-axis direction (index feed). Moreover, if the Z-axis moving plate 28 is moved in the Z-axis direction by each cutting unit moving mechanism 16, the cutting unit 12 and the camera 38 are moved in the Z-axis direction.
支持構造１４の前方側、かつ左右方向で開口４ａの一方側の領域には、加工前の被加工物１１を載せる搬入側テーブル（ロードテーブル）４０が配置されている。搬入側テーブル４０の上面は、被加工物１１に対応する形状（本実施形態では、概ね平坦な矩形）に形成されており、被加工物１１を保持する保持面４０ａになる。保持面４０ａは、搬入側テーブル４０の内部に形成された流路（不図示）等を通じて吸引源（不図示）に接続されている。 A loading-side table (load table) 40 on which the workpiece 11 before processing is placed is arranged in a region on the front side of the support structure 14 and on one side of the opening 4a in the left-right direction. The upper surface of the carry-in side table 40 is formed in a shape corresponding to the workpiece 11 (in the present embodiment, a generally flat rectangle), and becomes a holding surface 40 a that holds the workpiece 11. The holding surface 40a is connected to a suction source (not shown) through a flow path (not shown) formed in the carry-in side table 40.
搬入側テーブル４０の下方には、搬入側テーブル４０を開口４ａの上方に移動させる搬入側テーブル移動機構４２が設けられている。搬入側テーブル移動機構４２は、開口４ａの一方側の領域から開口４ａへと向かって伸びる一対のガイドレール４４を備えており、エアシリンダ等から発生する力で搬入側テーブル４０をガイドレール４４に沿って移動させる。具体的には、搬入側テーブル４０は、開口４ａの一方側で搬入搬出領域に隣接するロード領域と、搬入搬出領域の直上の直上領域との間を移動する。 A carry-in table moving mechanism 42 that moves the carry-in table 40 above the opening 4 a is provided below the carry-in table 40. The carry-in table moving mechanism 42 includes a pair of guide rails 44 extending from the region on one side of the opening 4a toward the opening 4a, and the carry-in table 40 is turned into the guide rails 44 by a force generated from an air cylinder or the like. Move along. Specifically, the carry-in side table 40 moves between a load area adjacent to the carry-in / carry-out area on one side of the opening 4a and a region immediately above the carry-in / carry-out area.
支持構造１４の前方側、かつ左右方向で開口４ａの他方側の領域には、加工後の被加工物１１を載せる搬出側テーブル（アンロードテーブル）４６が配置されている。搬出側テーブル４６の上面は、被加工物１１に対応する形状（本実施形態では、概ね平坦な矩形）に形成されており、被加工物１１を保持する保持面４６ａになる。保持面４６ａは、流路４６ｂ（図５（Ｂ）参照）やバルブ４６ｃ（図５（Ｂ）参照）等を通じて吸引源４６ｄ（図５（Ｂ）参照）に接続されている。 On the front side of the support structure 14 and the region on the other side of the opening 4a in the left-right direction, a carry-out table (unload table) 46 on which the processed workpiece 11 is placed is disposed. The upper surface of the carry-out side table 46 is formed in a shape corresponding to the workpiece 11 (in the present embodiment, a generally flat rectangle), and serves as a holding surface 46 a that holds the workpiece 11. The holding surface 46a is connected to a suction source 46d (see FIG. 5B) through a flow path 46b (see FIG. 5B), a valve 46c (see FIG. 5B), and the like.
搬出側テーブル４６の下方には、搬出側テーブル４６を開口４ａの上方に移動させる搬出側テーブル移動機構４８が設けられている。搬出側テーブル移動機構４８は、開口４ａの他方側の領域から開口４ａへと向かって伸びる一対のガイドレール５０を備えており、エアシリンダ等から発生する力で搬出側テーブル４６をガイドレール５０に沿って移動させる。具体的には、搬出側テーブル４６は、開口４ａの他方側で搬入搬出領域に隣接するアンロード領域と、搬入搬出領域の直上の直上領域との間を移動する。 Below the carry-out side table 46, a carry-out side table moving mechanism 48 for moving the carry-out side table 46 above the opening 4a is provided. The carry-out side table moving mechanism 48 includes a pair of guide rails 50 extending from the region on the other side of the opening 4a toward the opening 4a. The carry-out side table 46 is turned into the guide rail 50 by a force generated from an air cylinder or the like. Move along. Specifically, the carry-out side table 46 moves between an unload area adjacent to the carry-in / carry-out area on the other side of the opening 4a and a region immediately above the carry-in / carry-out area.
なお、本実施形態では、被加工物１１を吸引できる搬入側テーブル４０及び搬出側テーブル４６について例示しているが、加工装置２が備える搬入側テーブル及び搬出側テーブルは、少なくとも、被加工物１１を支持できるように構成されていれば良い。すなわち、搬入側テーブル及び搬出側テーブルは、必ずしも被加工物１１を吸引できなくて良い。 In the present embodiment, the carry-in side table 40 and the carry-out side table 46 that can suck the workpiece 11 are illustrated, but the carry-in side table and the carry-out side table included in the processing apparatus 2 are at least the workpiece 11. What is necessary is just to be comprised so that can be supported. That is, the carry-in side table and the carry-out side table do not necessarily have to suck the workpiece 11.
直上領域の更に上方には、チャックテーブル１０と、搬入側テーブル４０又は搬出側テーブル４６との間で被加工物１１を搬送して載せ替える搬送ユニット（搬送手段）５２が配置されている。この搬送ユニット５２は、被加工物１１を保持する保持機構（保持手段）５４と、保持機構５４を鉛直方向に移動させる直動機構（移動手段）５６とを含む。保持機構５４の詳細については後述する。 A conveyance unit (conveying means) 52 that conveys and replaces the workpiece 11 between the chuck table 10 and the carry-in side table 40 or the carry-out side table 46 is disposed further above the region immediately above. The transport unit 52 includes a holding mechanism (holding means) 54 that holds the workpiece 11 and a linear motion mechanism (moving means) 56 that moves the holding mechanism 54 in the vertical direction. Details of the holding mechanism 54 will be described later.
開口４ａと搬出側テーブル４６との間かつ搬出側テーブル４６より上方の領域には、下向きにエアーを噴射できるノズル５８が配置されている。このノズル５８は、被加工物１１を保持した搬出側テーブル４６が直上領域からアンロード領域へと移動する間に、搬出側テーブル４６上の被加工物１１等にエアーを吹き付ける。これにより、被加工物１１等に付着した切削液を乾燥させて除去できる。 In the region between the opening 4a and the carry-out side table 46 and above the carry-out side table 46, a nozzle 58 that can inject air downward is disposed. The nozzle 58 blows air to the workpiece 11 and the like on the unloading side table 46 while the unloading side table 46 holding the workpiece 11 moves from the region immediately above to the unloading region. Thereby, the cutting fluid adhering to the workpiece 11 etc. can be dried and removed.
次に、搬送ユニット５２に組み込まれる保持機構５４の詳細について説明する。図２は、主に保持機構５４の縦断面を模式的に示す図である。図２に示すように、本実施形態に係る保持機構５４は、被加工物１１に対応する大きさの保持基台６０を備えている。保持基台６０の形状は任意だが、ここでは、平板状とする。 Next, details of the holding mechanism 54 incorporated in the transport unit 52 will be described. FIG. 2 is a diagram schematically showing a longitudinal section of the holding mechanism 54 mainly. As shown in FIG. 2, the holding mechanism 54 according to this embodiment includes a holding base 60 having a size corresponding to the workpiece 11. The shape of the holding base 60 is arbitrary, but here it is a flat plate.
保持基台６０の下面は、被加工物１１に対応する形状（本実施形態では、概ね平坦な矩形）に形成されており、被加工物１１を保持するための保持面６０ａになる。図３は、保持基台６０の保持面６０ａ側の構造を模式的に示す斜視図である。図２及び図３に示すように、この保持面６０ａには、複数の磁石６２が設けられている。 The lower surface of the holding base 60 is formed in a shape corresponding to the workpiece 11 (in this embodiment, a generally flat rectangle), and serves as a holding surface 60 a for holding the workpiece 11. FIG. 3 is a perspective view schematically showing the structure of the holding base 60 on the holding surface 60a side. As shown in FIGS. 2 and 3, a plurality of magnets 62 are provided on the holding surface 60 a.
各磁石６２は、例えば、永久磁石又は電磁石である。上述のように、被加工物１１は、強磁性を示す材料を含んでいるので、被加工物１１に対して保持基台６０の保持面６０ａを近付ければ、各磁石６２と被加工物１１との間に引力（磁力）を生じさせることができる。被加工物１１は、この引力によって保持基台６０の保持面６０ａ側に吸着、保持される。磁石６２の数量や配置等の条件は、被加工物１１を適切に吸着、保持できる範囲で任意に決めることができる。 Each magnet 62 is, for example, a permanent magnet or an electromagnet. As described above, since the workpiece 11 includes a material exhibiting ferromagnetism, each of the magnets 62 and the workpiece 11 can be obtained by bringing the holding surface 60 a of the holding base 60 close to the workpiece 11. An attractive force (magnetic force) can be generated between them. The workpiece 11 is attracted and held on the holding surface 60a side of the holding base 60 by this attractive force. Conditions such as the quantity and arrangement of the magnets 62 can be arbitrarily determined within a range in which the workpiece 11 can be appropriately attracted and held.
保持基台６０には、保持基台６０から被加工物１１を容易に取り外せるように、保持基台６０に吸着、保持された被加工物１１に対して保持面６０ａから離れる向きの力を加えるリリース機構（リリース手段）６４が設けられている。リリース機構６４は、保持面６０ａを覆うカバーシート６６を含んでいる。 To the holding base 60, a force in a direction away from the holding surface 60 a is applied to the workpiece 11 attracted and held by the holding base 60 so that the workpiece 11 can be easily detached from the holding base 60. A release mechanism (release means) 64 is provided. The release mechanism 64 includes a cover sheet 66 that covers the holding surface 60a.
カバーシート６６は、例えば、伸縮性が高く通気性（通液性）が低い樹脂（例えば、塩化ビニルやポリオレフィン）等の材料を用いて薄膜状に形成されており、保持基台６０の側部を囲む固定枠６８によって保持基台６０に固定される。このように、固定枠６８を用いてカバーシート６６を保持基台６０の全周に固定することで、カバーシート６６と保持基台６０との隙間を減らして気密性を高めることができる。 The cover sheet 66 is formed into a thin film using a material such as a resin (for example, vinyl chloride or polyolefin) that has high stretchability and low air permeability (liquid permeability). It is fixed to the holding base 60 by a fixing frame 68 surrounding it. In this way, by fixing the cover sheet 66 to the entire circumference of the holding base 60 using the fixing frame 68, the gap between the cover sheet 66 and the holding base 60 can be reduced and the airtightness can be improved.
保持面６０ａには、複数の開口６０ｂが形成されており、この開口６０ｂには、第１流路（供給路、排出路）７０ａの一端側が接続されている。第１流路７０ａの他端には、流体を供給するための流体供給源（流体供給部）７２が接続されている。この流体供給源７２は、カバーシート６６と共にリリース機構６４を構成する。なお、本実施形態では、流体供給源７２から供給する流体として、空気等の気体を用いる。 A plurality of openings 60b are formed in the holding surface 60a, and one end side of a first flow path (supply path, discharge path) 70a is connected to the opening 60b. A fluid supply source (fluid supply unit) 72 for supplying fluid is connected to the other end of the first flow path 70a. The fluid supply source 72 forms a release mechanism 64 together with the cover sheet 66. In the present embodiment, a gas such as air is used as the fluid supplied from the fluid supply source 72.
第１流路７０ａの流体供給源７２側には、流体の供給を制御するための第１バルブ７４ａ及び第２バルブ７４ｂが設けられている。上流側の第１バルブ７４ａは、下流側の第２バルブ７４ｂへの流体の供給を制御する。具体的には、第１バルブ７４ａを開くと、流体供給源７２から第２バルブ７４ｂに流体が供給される。一方で、第１バルブ７４ａを閉じると、流体供給源７２から第２バルブ７４ｂに流体が供給されない。 A first valve 74a and a second valve 74b for controlling the supply of fluid are provided on the fluid supply source 72 side of the first flow path 70a. The first valve 74a on the upstream side controls the supply of fluid to the second valve 74b on the downstream side. Specifically, when the first valve 74a is opened, fluid is supplied from the fluid supply source 72 to the second valve 74b. On the other hand, when the first valve 74a is closed, no fluid is supplied from the fluid supply source 72 to the second valve 74b.
第２バルブ７４ｂは、流体供給源７２から供給される流体を、第１流路７０ａの一端側（開口６０ｂ側）、又はこの第２バルブ７４ｂを介して第１流路７０ａから分岐される第２流路（排出路）７０ｂのいずれかに供給する。具体的には、第２バルブ７４ｂを第１状態にすると、第１流路７０ａの一端側に流体が供給される。一方で、第２バルブ７４ｂを第２状態にすると、第２流路７０ｂに流体が供給される。 The second valve 74b is configured to branch the fluid supplied from the fluid supply source 72 from one end side (opening 60b side) of the first flow path 70a or from the first flow path 70a via the second valve 74b. Supply to one of the two flow paths (discharge paths) 70b. Specifically, when the second valve 74b is set to the first state, the fluid is supplied to one end side of the first flow path 70a. On the other hand, when the second valve 74b is set to the second state, the fluid is supplied to the second flow path 70b.
例えば、第１バルブ７４ａを開き、かつ第２バルブ７４ｂを第１状態にすると、流体は第１流路７０ａ、開口６０ｂ等を通じて保持面６０ａとカバーシート６６との間に供給される。上述のように、カバーシート６６は、伸縮性が高く通気性（通液性）が低い材料で形成されている。そのため、保持面６０ａとカバーシート６６との間に流体を供給すると、カバーシート６６を下向きに膨らませる（曲面状に変形させる）ことができる。 For example, when the first valve 74a is opened and the second valve 74b is set to the first state, the fluid is supplied between the holding surface 60a and the cover sheet 66 through the first flow path 70a, the opening 60b, and the like. As described above, the cover sheet 66 is formed of a material having high stretchability and low air permeability (liquid permeability). Therefore, when a fluid is supplied between the holding surface 60a and the cover sheet 66, the cover sheet 66 can be expanded downward (deformed into a curved surface).
第２流路７０ｂには、エジェクタ（アスピレータ）７６が設けられている。このエジェクタ７６の吸引口７６ａは、第２バルブ７４ｂと開口６０ｂ（一端）との間で第１流路７０ａに接続されている。また、エジェクタ７６の供給口７６ｂには、第２バルブ７４ｂを通過した流体が供給される。 An ejector (aspirator) 76 is provided in the second flow path 70b. The suction port 76a of the ejector 76 is connected to the first flow path 70a between the second valve 74b and the opening 60b (one end). Further, the fluid that has passed through the second valve 74 b is supplied to the supply port 76 b of the ejector 76.
例えば、第１バルブ７４ａを開き、かつ第２バルブ７４ｂを第２状態にすると、エジェクタ７６の供給口７６ｂから排出口７６ｃに向かって流体が流れ、エジェクタ７６の吸引口７６ａに負圧が発生する。よって、この負圧を利用することで、開口６０ｂ、第１流路７０ａ、第２流路７０ｂ等を通じて保持面６０ａとカバーシート６６との間の流体を外部に排出できる。第１流路７０ａの一端側には、第１流路７０ａの圧力（本実施形態では、気圧）を測定するための圧力計７８が設けられている。 For example, when the first valve 74a is opened and the second valve 74b is set to the second state, fluid flows from the supply port 76b of the ejector 76 toward the discharge port 76c, and a negative pressure is generated at the suction port 76a of the ejector 76. . Therefore, by utilizing this negative pressure, the fluid between the holding surface 60a and the cover sheet 66 can be discharged to the outside through the opening 60b, the first flow path 70a, the second flow path 70b, and the like. A pressure gauge 78 for measuring the pressure (atmospheric pressure in this embodiment) of the first flow path 70a is provided on one end side of the first flow path 70a.
次に、上述した搬送ユニット５２を用いて被加工物１１を搬送する搬送方法について説明する。なお、本実施形態では、切削加工後の被加工物１１をチャックテーブル１０から搬出側テーブル４６へと搬出する場合を例に挙げて説明するが、切削加工前の被加工物１１を搬入側テーブル４０からチャックテーブル１０へと搬入する場合も同様である。 Next, a transport method for transporting the workpiece 11 using the transport unit 52 described above will be described. In the present embodiment, the case where the workpiece 11 after cutting is carried out from the chuck table 10 to the carry-out side table 46 will be described as an example. However, the workpiece 11 before cutting is carried in the carry-in side table. The same applies to the case of loading from 40 to the chuck table 10.
図４（Ａ）は、被加工物を搬出する際の第１ステップを模式的に示す図であり、図４（Ｂ）は、被加工物を搬出する際の第２ステップを模式的に示す図であり、図５（Ａ）は、被加工物を搬出する際の第３ステップを模式的に示す図であり、図５（Ｂ）は、被加工物を搬出する際の第４ステップを模式的に示す図である。 FIG. 4A is a diagram schematically showing a first step when unloading the workpiece, and FIG. 4B schematically shows a second step when unloading the workpiece. FIG. 5 (A) is a diagram schematically showing a third step when unloading the workpiece, and FIG. 5 (B) shows a fourth step when unloading the workpiece. It is a figure shown typically.
被加工物１１をチャックテーブル１０から搬出側テーブル４６へと搬出する際には、まず、チャックテーブル１０の位置を搬入搬出領域に合わせ、搬出側テーブル４６の位置を直上領域以外（例えば、アンロード領域）に合わせる。また、保持面６０ａとカバーシート６６との間の流体を排出した上で、第１バルブ７４ａを閉じておく。 When unloading the workpiece 11 from the chuck table 10 to the unloading table 46, first, the position of the chuck table 10 is adjusted to the loading / unloading region, and the position of the unloading table 46 is set to a region other than the region directly above (for example, unloading). Area). Further, after the fluid between the holding surface 60a and the cover sheet 66 is discharged, the first valve 74a is closed.
その後、図４（Ａ）に示すように、直動機構５６（図１）で保持機構５４を下降させ、チャックテーブル１０上の被加工物１１に保持基台６０の保持面６０ａを接近させる。上述のように、保持面６０ａには、複数の磁石６２が設けられている。よって、被加工物１１に対して保持面６０ａを接近させると、磁石６２と被加工物１１との間に引力が生じ、被加工物１１はカバーシート６６を介して保持基台６０に吸着、保持される。 Thereafter, as shown in FIG. 4A, the holding mechanism 54 is lowered by the linear motion mechanism 56 (FIG. 1), and the holding surface 60 a of the holding base 60 is brought close to the workpiece 11 on the chuck table 10. As described above, the plurality of magnets 62 are provided on the holding surface 60a. Therefore, when the holding surface 60a is brought close to the workpiece 11, an attractive force is generated between the magnet 62 and the workpiece 11, and the workpiece 11 is attracted to the holding base 60 via the cover sheet 66. Retained.
保持基台６０で被加工物１１を吸着、保持した後には、チャックテーブル１０の保持面１０ａによる被加工物１１（粘着テープ１３）の吸引を停止させた上で、図４（Ｂ）に示すように、直動機構５６（図１）で保持機構５４を上昇させる。なお、この際にも、第１バルブ７４ａを閉じておく。 After the workpiece 11 is sucked and held by the holding base 60, the suction of the workpiece 11 (adhesive tape 13) by the holding surface 10a of the chuck table 10 is stopped, and then shown in FIG. Thus, the holding mechanism 54 is raised by the linear motion mechanism 56 (FIG. 1). Also at this time, the first valve 74a is closed.
その後、搬出側テーブル４６を直上領域に移動させ、図５（Ａ）に示すように、保持機構５４を下降させる。また、第１バルブ７４ａを開き、かつ第２バルブ７４ｂを第１状態とする。これにより、流体供給源７２から保持面６０ａとカバーシート６６との間に流体が供給され、カバーシート６６は下向きに膨らむ。なお、保持面４６ａに対する保持機構５４の高さは、保持面４６ａによってカバーシート６６の膨張（変形）が阻害されない範囲に調整される。 Thereafter, the carry-out side table 46 is moved to the region immediately above, and the holding mechanism 54 is lowered as shown in FIG. Further, the first valve 74a is opened and the second valve 74b is set to the first state. Thereby, the fluid is supplied from the fluid supply source 72 between the holding surface 60a and the cover sheet 66, and the cover sheet 66 expands downward. The height of the holding mechanism 54 with respect to the holding surface 46a is adjusted to a range in which the expansion (deformation) of the cover sheet 66 is not hindered by the holding surface 46a.
カバーシート６６が下向きに膨らむと、保持面６０ａに設けられた磁石６２と被加工物１１との距離が大きくなって、磁石６２と被加工物１１との間に作用する引力は小さくなる。よって、この状態で、例えば、図５（Ｂ）に示すように、バルブ４６ｃを開き、吸引源４６の負圧を保持面４６ａに作用させれば、被加工物１１（粘着テープ１３）を搬出側テーブル４６で吸引、保持して、保持基台６０から容易に取り外せる。 When the cover sheet 66 expands downward, the distance between the magnet 62 provided on the holding surface 60a and the workpiece 11 increases, and the attractive force acting between the magnet 62 and the workpiece 11 decreases. Therefore, in this state, for example, as shown in FIG. 5B, if the valve 46c is opened and the negative pressure of the suction source 46 is applied to the holding surface 46a, the workpiece 11 (adhesive tape 13) is carried out. It can be easily removed from the holding base 60 by being sucked and held by the side table 46.
被加工物１１が保持基台６０から取り外された後には、保持機構５４を上昇させる。また、第２バルブ７４ｂを第２状態に切り替える。これにより、保持面６０ａとカバーシート６６との間の流体は外部に排出され、カバーシート６６が保持面６０ａに密着する。すなわち、カバーシート６６の下面には、保持面６０ａの形状（本実施形態では、概ね平坦な形状）が反映される。これにより、被加工物１１を再び吸着、保持できるようになる。 After the workpiece 11 is removed from the holding base 60, the holding mechanism 54 is raised. Further, the second valve 74b is switched to the second state. Thereby, the fluid between the holding surface 60a and the cover sheet 66 is discharged to the outside, and the cover sheet 66 is in close contact with the holding surface 60a. That is, the shape of the holding surface 60a (in the present embodiment, a generally flat shape) is reflected on the lower surface of the cover sheet 66. Thereby, the workpiece 11 can be adsorbed and held again.
なお、保持面６０ａとカバーシート６６との間の流体の排出状況は、圧力計７８の測定値に基づいて判定できる。例えば、圧力計７８の測定値が所定の閾値より低い場合には、保持面６０ａとカバーシート６６との間に流体が残留していると判定する。この状態では、保持機構５４で被加工物１１を適切に吸着、保持できないので、保持面６０ａとカバーシート６６との間の流体の排出が完了するまで搬送ユニット５２を待機させると良い。 The discharge state of the fluid between the holding surface 60a and the cover sheet 66 can be determined based on the measurement value of the pressure gauge 78. For example, when the measurement value of the pressure gauge 78 is lower than a predetermined threshold value, it is determined that the fluid remains between the holding surface 60a and the cover sheet 66. In this state, the workpiece 11 cannot be properly adsorbed and held by the holding mechanism 54, so the conveyance unit 52 may be put on standby until the fluid discharge between the holding surface 60 a and the cover sheet 66 is completed.
以上のように、本実施形態に係る被加工物１１の保持機構５４及び加工装置２は、強磁性を示す材料を含む被加工物１１との間に引力を生じさせる磁石６２を保持基台６０の保持面６０ａに備えている。よって、磁石６２との間に生じる引力によって被加工物１１を適切に保持できる。 As described above, the holding mechanism 54 and the processing apparatus 2 for the workpiece 11 according to the present embodiment include the magnet 62 that generates an attractive force with the workpiece 11 including a material exhibiting ferromagnetism. Are provided on the holding surface 60a. Therefore, the workpiece 11 can be appropriately held by the attractive force generated between the magnet 62 and the magnet 62.
また、本実施形態に係る被加工物１１の保持機構５４及び加工装置２は、保持基台６０の保持面６０ａ側に保持された被加工物１１に対し、保持面６０ａから離れる向きの力を加えるリリース機構（リリース手段）６４を備えている。よって、このリリース機構６４で被加工物１１に力を加えることで、被加工物１１を保持基台６０から簡単に取り外すことができる。 In addition, the holding mechanism 54 and the processing apparatus 2 for the workpiece 11 according to the present embodiment apply a force in a direction away from the holding surface 60a to the workpiece 11 held on the holding surface 60a side of the holding base 60. An additional release mechanism (release means) 64 is provided. Therefore, the workpiece 11 can be easily detached from the holding base 60 by applying a force to the workpiece 11 with the release mechanism 64.
なお、本発明は、上記実施形態の記載に制限されず種々変更して実施可能である。例えば、カバーシートの表面等には、導電性の材料でなるパターンが形成されても良い。この場合、カバーシートの変形等に伴う静電気の発生を抑制できる。また、流体供給源から供給する流体として、水等の液体を用いても良い。さらに、本発明の保持機構を、加工装置のチャックテーブル等に用いることもできる。 In addition, this invention is not restrict | limited to description of the said embodiment, A various change can be implemented. For example, a pattern made of a conductive material may be formed on the surface of the cover sheet. In this case, generation of static electricity due to deformation of the cover sheet or the like can be suppressed. A liquid such as water may be used as the fluid supplied from the fluid supply source. Furthermore, the holding mechanism of the present invention can also be used for a chuck table or the like of a processing apparatus.
その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.
２ 加工装置（切削装置）
４ 基台
４ａ 開口
６ Ｘ軸移動テーブル
８ 防塵防滴カバー
１０ チャックテーブル
１０ａ 保持面
１２ 切削ユニット（加工ユニット、加工手段）
１４ 支持構造
１６ 切削ユニット移動機構
１８ Ｙ軸ガイドレール
２０ Ｙ軸移動プレート
２２ Ｙ軸ボールネジ
２４ Ｙ軸パルスモータ
２６ Ｚ軸ガイドレール
２８ Ｚ軸移動プレート
３０ Ｚ軸ボールネジ
３２ Ｚ軸パルスモータ
３４ 切削ブレード
３６ ノズル
３８ カメラ
４０ 搬入側テーブル（ロードテーブル）
４０ａ 保持面
４２ 搬入側テーブル移動機構
４４ ガイドレール
４６ 搬出側テーブル（アンロードテーブル）
４６ａ 保持面
４６ｂ 流路
４６ｃ バルブ
４６ｄ 吸引源
４８ 搬出側テーブル移動機構
５０ ガイドレール
５２ 搬送ユニット（搬送手段）
５４ 保持機構（保持手段）
５６ 直動機構（移動手段）
５８ ノズル
６０ 保持基台
６０ａ 保持面
６０ｂ 開口
６２ 磁石
６４ リリース機構（リリース手段）
６６ カバーシート
６８ 固定枠
７０ａ 第１流路（供給路、排出路）
７０ｂ 第２流路（排出路）
７２ 流体供給源（流体供給部）
７４ａ 第１バルブ
７４ｂ 第２バルブ
７６ エジェクタ（アスピレータ）
７６ａ 吸引口
７６ｂ 供給口
７６ｃ 排出口
７８ 圧力計
１１ 被加工物
１３ 粘着テープ
2 Processing equipment (cutting equipment)
4 Base 4a Opening 6 X-axis Movement Table 8 Dust / Splash-proof Cover 10 Chuck Table 10a Holding Surface 12 Cutting Unit (Processing Unit, Processing Means)
DESCRIPTION OF SYMBOLS 14 Support structure 16 Cutting unit moving mechanism 18 Y-axis guide rail 20 Y-axis moving plate 22 Y-axis ball screw 24 Y-axis pulse motor 26 Z-axis guide rail 28 Z-axis moving plate 30 Z-axis ball screw 32 Z-axis pulse motor 34 Cutting blade 36 Nozzle 38 Camera 40 Loading side table (load table)
40a Holding surface 42 Loading side table moving mechanism 44 Guide rail 46 Unloading table (unloading table)
46a Holding surface 46b Flow path 46c Valve 46d Suction source 48 Unloading side table moving mechanism 50 Guide rail 52 Conveying unit (conveying means)
54 Holding mechanism (holding means)
56 Linear motion mechanism (moving means)
58 Nozzle 60 Holding base 60a Holding surface 60b Opening 62 Magnet 64 Release mechanism (release means)
66 Cover sheet 68 Fixed frame 70a First flow path (supply path, discharge path)
70b Second flow path (discharge path)
72 Fluid supply source (fluid supply unit)
74a First valve 74b Second valve 76 Ejector (aspirator)
76a Suction port 76b Supply port 76c Discharge port 78 Pressure gauge 11 Workpiece 13 Adhesive tape
Claims (4)
該保持基台の該保持面に設置され、強磁性を示す材料を含む被加工物との間に引力を生じさせる磁石と、
該磁石との間に生じる引力によって該保持基台の該保持面側に保持された被加工物に対し、該保持面から離れる向きの力を加えるリリース手段と、を備え、
該リリース手段は、
該保持面を覆うカバーシートと、
該保持面と該カバーシートとの間に流体を供給して該カバーシートを膨らませる流体供給部と、を有し、
該カバーシートを介して該磁石との間に生じる引力によって被加工物を保持することを特徴とする被加工物の保持機構。 A holding base having a holding surface;
A magnet that is installed on the holding surface of the holding base and generates an attractive force between the workpiece including a material exhibiting ferromagnetism;
Release means for applying a force in a direction away from the holding surface to a workpiece held on the holding surface side of the holding base by an attractive force generated between the magnet and the magnet;
The release means is:
A cover sheet covering the holding surface;
A fluid supply section for supplying a fluid between the holding surface and the cover sheet to inflate the cover sheet;
A workpiece holding mechanism, wherein the workpiece is held by an attractive force generated between the magnet and the magnet via the cover sheet.
該チャックテーブルに保持された被加工物を加工する加工ユニットと、
該チャックテーブルに被加工物を搬入し、又は該チャックテーブルから被加工物を搬出する搬送手段と、を備え、
該搬送手段は、
保持面を有する保持基台と、
該保持基台と該チャックテーブルとを相対的に移動させる移動手段と、
該保持基台の該保持面に設置され、被加工物との間に引力を生じさせる磁石と、
該磁石との間に生じる引力によって該保持基台の該保持面側に保持された被加工物に対し、該保持面から離れる向きの力を加えるリリース手段と、を備え、
該リリース手段は、
該保持面を覆うカバーシートと、
該保持面と該カバーシートとの間に流体を供給して該カバーシートを膨らませる流体供給部と、を有し、
該搬送手段は、該カバーシートを介して該磁石との間に生じる引力によって被加工物を保持することを特徴とする加工装置。 A chuck table for holding a workpiece including a material exhibiting ferromagnetism,
A processing unit for processing a workpiece held on the chuck table;
A conveying means for carrying the workpiece into the chuck table or carrying the workpiece out of the chuck table;
The conveying means is
A holding base having a holding surface;
Moving means for relatively moving the holding base and the chuck table;
A magnet that is installed on the holding surface of the holding base and generates an attractive force with the workpiece;
Release means for applying a force in a direction away from the holding surface to a workpiece held on the holding surface side of the holding base by an attractive force generated between the magnet and the magnet;
The release means is:
A cover sheet covering the holding surface;
A fluid supply section for supplying a fluid between the holding surface and the cover sheet to inflate the cover sheet;
The processing means holds the workpiece by an attractive force generated between the conveying means and the magnet via the cover sheet.
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| TW106115660A TWI742080B (en) | 2016-06-21 | 2017-05-11 | Retaining mechanism and processing device of processed object |
| KR1020170068830A KR102203039B1 (en) | 2016-06-21 | 2017-06-02 | Holding mechanism of workpiece and machining apparatus |
| CN201710441368.5A CN107527853B (en) | 2016-06-21 | 2017-06-13 | Workpiece holding mechanism and machining device |
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| JP2019140172A (en) * | 2018-02-07 | 2019-08-22 | 株式会社ディスコ | Processing device |
| JP2021049619A (en) * | 2019-09-26 | 2021-04-01 | 株式会社ディスコ | Processing device |
| JP7295764B2 (en) | 2019-09-26 | 2023-06-21 | 株式会社ディスコ | processing equipment |
| WO2021177105A1 (en) * | 2020-03-04 | 2021-09-10 | 株式会社クリスタル光学 | Layered waterproof sheet for surface grinding of workpiece |
| JP2021137950A (en) * | 2020-03-04 | 2021-09-16 | 株式会社クリスタル光学 | Lamination waterproof sheet for surface-grinding workpiece |
| KR20210144570A (en) | 2020-05-22 | 2021-11-30 | 가부시기가이샤 디스코 | Holding mechanism of workpiece and machining apparatus |
| JP2021183369A (en) * | 2020-05-22 | 2021-12-02 | 株式会社ディスコ | Holding mechanism for workpiece and machining device |
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| CN118004758A (en) * | 2024-04-10 | 2024-05-10 | 四川华耀玻璃有限公司 | Toughened glass carrying device and use method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107527853A (en) | 2017-12-29 |
| TWI742080B (en) | 2021-10-11 |
| JP6765751B2 (en) | 2020-10-07 |
| TW201807766A (en) | 2018-03-01 |
| CN107527853B (en) | 2023-04-07 |
| KR102203039B1 (en) | 2021-01-13 |
| KR20170143436A (en) | 2017-12-29 |
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