CN101316777B - Workpiece transfer method and electro-static sucker device and substrate sticking method - Google Patents
Workpiece transfer method and electro-static sucker device and substrate sticking method Download PDFInfo
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- CN101316777B CN101316777B CN2006800007517A CN200680000751A CN101316777B CN 101316777 B CN101316777 B CN 101316777B CN 2006800007517 A CN2006800007517 A CN 2006800007517A CN 200680000751 A CN200680000751 A CN 200680000751A CN 101316777 B CN101316777 B CN 101316777B
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- electrostatic chuck
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- holding plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
An electrostatic chuck device enabling even a thin work with low rigidity to be releasedly placed without causing deformation and displacement during the movement. An electrostatic chuck (2) is attached to a holding plate (1) by an attaching means (3). A work (A) is chucked and held by the attached electrostatic chuck (2). The electrostatic chuck (2) and the work (A) are integrally separated from the holding plate (1) by a separating means (4). Since the work (A) is not brought into a free state, it can be transferred to the release position without being affected by the gravity.; When only the electrostatic chuck (2) is re-attached to the holding plate (1) by the attaching means (3) after the electrostatic attracting function of the electrostatic chuck (2) is stopped, the electrostatic chuck (2) is separated from the surface of the work (A) moved to the release position, and the work (A) is left at the release position and placed.
Description
Technical field
The present invention relates to be included in the manufacture process of flat-panel monitor such as LCD (LCD) or plasma scope (PDP) or flexible display for example glass substrates such as CF glass or TFT glass or by PES (Poly-Ether-Sulphone; Polyethersulfone) etc. the synthetic resin substrate detachable ground that constitutes of plastic sheeting keep and the base board delivery device of the workpiece (handled object) such as insulators such as substrate, electric conductor or semiconductor wafer that substrate assembling apparatus, the conveying of the substrate sticking machine pasted is such in employed Workpiece transfer method and electro-static sucker device, use its substrate sticking method.
Keep workpiece in particular to the electrostatic chuck absorption that is used as holding plate, decontrol the workpiece that keeps and be placed to the Workpiece transfer method of assigned position; The electro-static sucker device that keeps the electrostatic chuck of workpiece to constitute by holding plate and absorption; And the substrate sticking method of using it.
Background technology
In the past, as the substrate sticking machine that substrate is overlapping two, increased pressure board was the electrostatic chuck that is made up of the insulativity parts that are built-in with battery lead plate in inside; To remain on as the glass substrate of workpiece on this increased pressure board, upper substrate and infrabasal plate after position alignment on the XY direction, through reducing pressure vacuum chamber; In vacuum chamber, become required vacuum tightness, remove the Electrostatic Absorption function of increased pressure board, upper substrate is fallen on the infrabasal plate so that upper and lower base plate is overlapping; Increased pressure board is descended; Pressurize upper and lower base plate, pasting both intervals is predetermined gap (for example, with reference to patent documentation 1).
In addition, and keep removing upper substrate (upside substrate) interlock ground based on electrostatic chuck (Electrostatic Absorption parts), from the back side one side ejection gas of this upper substrate; Force to inject this gas up between the back side of the Electrostatic Absorption face of holding plate and upper substrate; Thereby that destroys these Electrostatic Absorption faces and real estate is close to state to peel off both, forces to decay and eliminate electrostatic attraction between the two, and with the pressure of the gas that injects infrabasal plate (downside substrate) is forced the acceleration that applies the power of falling that is fall; In view of the above; This upper substrate is crimped on the infrabasal plate instantaneous, and the state to be kept by the Electrostatic Absorption parts, and the attitude of upper substrate is moved and crimping on infrabasal plate unchangeably; Upper and lower base plate is sealed and is piled up (for example, with reference to patent documentation 2).
Patent documentation 1: the spy open the 2001-166272 communique (the 6th page, Fig. 8)
Patent documentation 2: No. 3721378 communique of Jap.P. (the 8th page, Fig. 1)
, in so existing Workpiece transfer method and electro-static sucker device, under the situation of patent documentation 1; Through removing the Electrostatic Absorption function, workpiece (upper substrate) is freely fallen in a vacuum, even but cut off the electricity supply; The substrate absorption affinity of electrostatic chuck does not also disappear but the continuation effect at once; So the decline of the substrate absorption affinity after can be therefore and remove inhomogeneously, it is that peel off the part that the interface of Electrostatic Absorption face and workpiece begins, and last workpiece is peeled off also comprehensively and freely fallen.
In view of the above, workpiece (upper substrate) is that the center rotation is moved with the place of peeling off at last on one side, Yi Bian freely fall; So on upper and lower base plate position alignment each other, produce error; And under free-falling pressure, sealing becomes not exclusively, has the problem of easy entrained air.
In addition; Workpiece (upper substrate) begins from the place that begins earlier to peel off for the Electrostatic Absorption face; Because gravity and local sagging and run-off the straight, and this inclination changes with situation easily, so can not freely fall middle correction; And after falling on the infrabasal plate, also be difficult to revise the problem of the depth of parallelism that existence can't realize stipulating.
, under the tendency that the substrate of LCD and plasma scope maximizes, begin to make the product that a length of side surpasses 1000mm in recent years, but, also require and the small-sized same depth of parallelism of substrate even substrate maximizes.If particularly a length of side of substrate surpasses 1000mm, with the size compared of XY direction, the interval of Z direction becomes minimum, so though it is desirable to make upper and lower base plate keeping approaching moving, in fact very difficulty under the completely parallel prerequisite.
Under such environment; If surpassing the large-scale upper substrate of 1000mm, a length of side tilts a little; Because it is minimum with the interval of the size compared Z direction of XY direction; So might make sealing liquid crystal on any side of the opposite face that is coated in upper and lower base plate in advance with the problem of the face damage of encapsulant (cyclic adhesion agent) or two substrates, existence can't be expected normal problem of pasting.
In addition; Under the situation of patent documentation 2, peel off from jet gas between the back side one side direction of workpiece (upper substrate) and this workpiece, but if picture has the glass substrate that has the thickness of 0.7～1.1mm the employed workpiece now; The rigidity of its face direction is than higher; On the face direction, evenly propagate easily so peel off,, can peel off reliably from electrostatic chuck through this gas with gas.
In recent years; Very the way is many for the usefulness of the light-weighted LCD of the such attention of image drift mobile phone or notebook computer; In such purposes; The glass of workpiece shows as the extremely thin thickness below about 0.5mm, and then in flexible display, has used the PES plastic sheetings such as (polyethersulfones) of workpiece as the hundreds of μ m of thickness more.
Compare with the glass substrate of existing employed 0.7～1.1mm, workpiece rigidity such as glass substrate below so about 0.5mm or plastic sheeting are extremely low, so even spray the gas of peeling off usefulness; The local extrusion of workpiece is out of shape; Peel off runner with gas and concentrate on crushed element and leak gas, might can't peel off workpiece reliably because of residual absorption affinity, and when peeling off; Extrude owing to the air-flow of peeling off usefulness in the segment set of distortion and stretch, distortion that might residual part.
Summary of the invention
The purpose of first, fourth aspect of the present invention is, even thin and the low workpiece of rigidity do not discharge with in moving, not producing distortion or offset yet and lay.
The purpose of second aspect of the present invention is, except that above-mentioned first aspect ground purpose, keeps reliably and conveying workpieces.
The purpose of the third aspect of the invention is, except that above-mentioned first and second ground, aspect purpose, improves the fissility of workpiece.
The purpose of the 5th aspect of the present invention is, except that above-mentioned fourth aspect ground purpose, even the low substrate of rigidity is also peeled off with inhomogeneous irrespectively the stickup also at assigned address of the releasing of Electrostatic Absorption power reliably.
To achieve these goals, first aspect of the present invention is characterised in that: form electrostatic chuck lamellar or membranaceous and support with can move freely; The Electrostatic Absorption surface of the work relative on this electrostatic chuck with it; The state that makes this electrostatic chuck workpiece with Electrostatic Absorption moves to the off-position from absorption position, and stops the Electrostatic Absorption function of electrostatic chuck; Electrostatic chuck is oppositely moved, with sur-face peeling electrostatic chuck from the workpiece that moves to the off-position from this off-position to absorption position.
Second aspect of the present invention is characterised in that: on the basis of the structure of first aspect present invention; Form said electrostatic chuck lamellar or membranaceous, and can support this electrostatic chuck with moving freely in the direction that the level and smooth basal plane with the holding plate that is made up of rigid body intersects.
The third aspect of the invention is characterised in that: on the basis of the structure aspect the present invention first or two; The Electrostatic Absorption portion that makes said electrostatic chuck is out of shape from the place facing to the peripheral end portion of workpiece partly, and this workpiece peripheral end portion between form the gap of peeling off usefulness partly.
In addition, fourth aspect of the present invention is characterised in that: support that electrostatic chuck can move freely it on the direction that workpiece one side surface with holding plate intersects; Make the surface of electrostatic chuck at Electrostatic Absorption workpiece under the state of this workpiece one side surface; This electrostatic chuck in Electrostatic Absorption under the state of workpiece moved to the off-position, and stop the Electrostatic Absorption function of electrostatic chuck from absorption position; Electrostatic chuck is oppositely moved, from the sur-face peeling electrostatic chuck of the workpiece that is moved to the off-position from this off-position to absorption position.
The 5th aspect of the present invention is characterised in that: on any side of a pair of holding plate or both sides, the electro-static sucker device that above-mentioned fourth aspect is put down in writing is set; Detachable ground keeps two the relative substrates as said workpiece between these holding plates; To be pulled away from the electrostatic chuck of said electro-static sucker device under the state of the substrate of a side with Electrostatic Absorption from any side of this holding plate; One side's substrate is moved to the opposing party's substrate, paste two substrates by the cyclic adhesion agent.
First aspect of the present invention with attachment members electrostatic chuck attached on the holding plate; And keep workpiece with this electrostatic chuck that adheres to absorption; And with isolated part these electrostatic chucks and workpiece as keeping apart from holding plate integratedly; Workpiece does not become free state in view of the above, thus do not receive gravity etc. influence be transported to the off-position, and after stopping the Electrostatic Absorption function of this electrostatic chuck; Only make electrostatic chuck attached on the holding plate and, this workpiece is stayed the off-position with attachment members once again with the sur-face peeling of electrostatic chuck from the workpiece that moves to the off-position.
Therefore, even thin and the low workpiece of rigidity can not discharge with in moving, not producing distortion or offset yet and lay.
As a result, that the releasing of Electrostatic Absorption power takes place is inhomogeneous and make the attitude of workpiece become unsettled existing apparatus easily to compare, can be transported to assigned position to workpiece with stable attitude with releasing owing to Electrostatic Absorption.
In addition; Compare with the existing apparatus of peeling off workpiece with the expulsion pressure of gas, even the situation that concentrates on specific part with the runner of gas because of peeling off can not take place the low workpiece of rigidity yet; Can peel off equally reliably with the high workpiece of rigidity, have excellent operability.
Except the effect of above-mentioned first aspect, second aspect present invention forms electrostatic chuck lamellar or membranaceous, and it can be supported on the direction that the level and smooth basal plane with the holding plate that is made up of rigid body intersects with moving freely; Under the effect of attachment members; At least the Electrostatic Absorption portion of electrostatic chuck is flattened along the level and smooth basal plane that is made up of rigid body, these basal planes and Electrostatic Absorption portion are seamlessly contacted and Electrostatic Absorption, follow action with isolated part; The state of workpiece with Electrostatic Absorption draws back electrostatic chuck from basal plane; Workpiece can not become free state in view of the above, thus not carried by the influence ground of gravity etc., then under the effect of attachment members; From by the sur-face peeling electrostatic chuck of the workpiece that should move, and get back to original state along basal plane.
Therefore, can keep reliably, conveying workpieces.
Except first or the effect of second aspect; The third aspect of the invention is out of shape the Electrostatic Absorption portion of electrostatic chuck from the place facing to the peripheral end portion of workpiece partly; And the peripheral end portion of workpiece between form the gap of peeling off usefulness partly; Between the surface of the Electrostatic Absorption portion of electrostatic chuck and workpiece, enlarge the gap that this peels off usefulness once, force decay also to eliminate residual absorption affinity.
Therefore, can improve the fissility of workpiece.
Fourth aspect of the present invention supports electrostatic chuck that it can be moved freely at workpiece one side surface with holding plate relatively and on the direction that intersects with it; Make the surface of electrostatic chuck at Electrostatic Absorption workpiece under the state of this workpiece one side surface; This electrostatic chuck is moved from absorption position under the state that is keeping the Electrostatic Absorption workpiece.In view of the above, workpiece does not become free state, thus do not receive gravity etc. influence be transported to the off-position, and stop the Electrostatic Absorption function of electrostatic chuck; Electrostatic chuck is oppositely moved, from the sur-face peeling electrostatic chuck of the workpiece that is moved to the off-position from this off-position to absorption position.
Therefore, even thin and the low workpiece of rigidity can not discharge with in moving, not producing distortion or offset and lay yet.
As a result, that the releasing of Electrostatic Absorption power takes place is inhomogeneous and make the attitude of workpiece become unsettled existing apparatus easily to compare, can be transported to assigned position to workpiece with stable attitude with releasing owing to Electrostatic Absorption.
In addition; Compare with the existing apparatus of peeling off workpiece with the expulsion pressure of gas, even the situation that concentrates on specific part with the runner of gas because of peeling off can not take place the low workpiece of rigidity yet; Can peel off equally reliably with the high workpiece of rigidity, have excellent operability.
Except the effect of fourth aspect; The 5th aspect of the present invention a side substrate with Electrostatic Absorption state draws back the side of electrostatic chuck from two holding plates and move to the opposing party's substrate; And by two substrates of cyclic adhesion agent stickup, in view of the above, a side substrate does not become free state; So do not receive gravity etc. influence be transferred and correctly paste, a side's who keeps from the bounding force by said cyclic adhesion agent substrate is not peeled off electrostatic chuck limpingly.
Therefore, even the low workpiece of rigidity also can be peeled off with inhomogeneous irrespectively the stickup also at assigned position of the releasing of Electrostatic Absorption power reliably.
The result; With the releasing that utilizes Electrostatic Absorption the free-falling existing substrate sticking machine of upper substrate is compared; Can prevent two substrates position alignment error to each other, can form seal cavity reliably simultaneously, prevent sneaking into of air; And be accompanied by peel off the fully not run-off the straight of upper substrate from the Electrostatic Absorption face; So can realize the depth of parallelism of regulation,, also can prevent fully because of the problem of the caused damage sealing liquid crystal of the inclination of upper substrate with the face of encapsulant (cyclic adhesion agent) or two substrates even a length of side surpasses the large substrate of 1000mm.
In addition; Compare with the existing substrate sticking machine of only directly peeling off substrate with the expulsion pressure of gas, even the situation that concentrates on specific part with the runner of gas because of peeling off can not take place the low substrate of rigidity yet; Can peel off equally reliably with the high workpiece of rigidity, have excellent operability.
In addition; Even break down owing to the entering of foreign matter causes the surface local of electrostatic chuck to be destroyed; Because holding plate is different parts with lamellar or membranaceous electrostatic chuck; Even so also can be easily holding plate be changed electrostatic chuck at the scene that is provided with, so maintainability is excellent, when particularly being used for the production line of LCD etc. to electro-static sucker device of the present invention; Can restart the work of whole production line at short notice, not reduce working rate so can expect stable turnout.
Description of drawings
Following brief description accompanying drawing.
Fig. 1 is the vertical profile front view of the embodiment 1 of expression Workpiece transfer method of the present invention and electro-static sucker device, in (a) and (b), representes by the work process sequence.
Fig. 2 is along the upward view that dwindles of Fig. 1 (a) (2)-(2) line.
Fig. 3 is along the amplification view that dwindles of Fig. 1 (a) (3)-(3) line
Fig. 4 is the vertical profile front view of the embodiment 2 of expression Workpiece transfer method of the present invention and electro-static sucker device, in (a) and (b), representes by the work process sequence.
Fig. 5 be the expression labelling machine that uses Workpiece transfer method of the present invention and electro-static sucker device embodiment 3 dwindle the vertical profile front view, in (a)～(c), represent the method for attaching of substrate by the work process sequence.
Fig. 6 is that expression is dwindled the vertical profile front view when eliminating electric charge, in (a) and (b), representes by the work process sequence.
Embodiment
Explanation is configured in the maintenance of detachable ground and the stickup situation as the substrate sticking machine of the glass substrate of panel workpiece A, B, that be used for LCD (LCD), plasma scope (PDP), flexible display or plastic film substrate with Workpiece transfer method of the present invention and electro-static sucker device D below.
The aforesaid substrate labelling machine disposes a pair of holding plate 1,1 ' up and down that flat fixed head constituted of the thickness with not deflection deformation that is formed by for example rigid body such as metal or pottery shown in Fig. 5 (a)～(c); On above-mentioned up and down holding plate 1,1 ' parallel relative even surface, two substrate A of detachable ground maintenance, B respectively; After in the local vacuum chamber S that forms around them, reaching the specified vacuum degree; Holding plate 1,1 ' is relatively mobile to XY θ direction (horizontal direction in the drawings) adjustment up and down; Carry out substrate A, B position alignment to each other, then, any side who makes substrate A, B at least peels off the poststack of laying equal stress on from holding plate up and down 1,1 ' even surface; Destroy the vacuum in the vacuum chamber S, the draught head of inside and outside generation that is used in two substrate A, B is being pressurized to predetermined gap between two substrate A, the B.
If specify; Then shown in the solid line of Fig. 5 (a); With Lift Part (not shown) support up and down holding plate 1,1 ' so that up and down holding plate 1,1 ' can on Z direction (above-below direction in the drawings), relatively move; In atmospheric atmosphere, will be somebody's turn to do up and down holding plate 1,1 ' under the state that leaves to above-below direction, will be provided with for each even surface and maintenance respectively by carrying with mechanical arm (not shown) substrate conveying A, B.
Shown in the double dot dash line of Fig. 5 (a), through the action of said Lift Part, holding plate 1,1 ' closely moves about making, at the vacuum chamber of part formation between the two S then.
Then; Action through inspiratory component (not shown); S deflates from vacuum chamber, when reaching specified vacuum and spend, through moving horizontally the action of parts (not shown); On XY θ direction, adjust with respect to the opposing party holding plate up and down 1, any side of 1 ' and to move, carrying out coarse alignment and thin aligning successively will be by the substrate A of their maintenances, B position alignment (alignment) each other.
After these aim to finish, shown in Fig. 5 (b), move the substrate A that keeps by holding plate 1,1 ' up and down, any direction the opposing party of B, clip cyclic adhesion agent (encapsulant) the C ground moment crimping on the infrabasal plate B, will seal also overlapping between the two.
Then, shown in Fig. 5 (c), through the action of said Lift Part; Move holding plate up and down 1,1 ' to direction separated from one another, meanwhile, make said inspiratory component reverse operation; Or with other mechanisms to air supply or nitrogen in the vacuum chamber S, make the atmosphere in the vacuum chamber S get back to atmospheric pressure, pressurize equably with draught head in the inside and outside generation of two substrate A, B; Be sealed under the state of liquid crystal, be pressed onto given interval, finishing to paste step.
Keep the electrostatic chuck 2 of substrate A, B to constitute electro-static sucker device D of the present invention with the above-mentioned holding plate up and down that constitutes by rigid body 1,1 ', absorption.
In embodiment illustrated; Move freely on the Z direction (above-below direction in the drawings) of supporting electrostatic chuck 2 that it can be intersected at the even surface with last holding plate 1, go up holding plate 1 in addition and also have: be used for pulling to attachment members 3 that each even surface and detachable ground engages with this even surface and the isolated part 4 that is used for drawing back electrostatic chuck 2 to this electrostatic chuck 2 from each even surface.
Make on the even surface of electrostatic chuck 2 attached to last holding plate 1 with attachment members 3; With the electrostatic chuck 2 Electrostatic Absorption upper substrate A that adhere to; Parallel isolator mobile from last holding plate 1 with upper substrate A with said isolated part 4 to the off-position as integratedly electrostatic chuck 2; Stop the Electrostatic Absorption function of electrostatic chuck 2 simultaneously; Oppositely move electrostatic chuck 2 holding plate 1 that makes progress from the off-position with 3 of attachment members then, electrostatic chuck 2 is peeled off from the upper substrate A that is moved to the off-position, thereby carried out above-mentioned substrate A, the sticking placement of B.
Said electrostatic chuck 2 be by for example polyimide, polyetheretherketone (PEEK), polyethylene naphthalenedicarboxylate insulativity such as (PEN) organic material form the dielectric 2b of level and smooth lamellar or film like and by portion within it through serigraphy etc. and the electrode part 2c that patterned conductive paste or conductive foil constitute is integratedly range upon range of.
This electrode part 2c forms with the ground that insulate on every side, and is connected with the power supply that is used for applying voltage above that (not shown).
As concrete example, the plural electrode part 2c of preferred use is set to the for example bipolar electrostatic chuck of comb teeth shape.
In addition, the electrode part 2c that is supported at above-below direction to electrostatic chuck 2 that can freely come and go is controlled, after the release with the isolated part 4 of description in the back, the connection of cutting off the electricity supply immediately stops the Electrostatic Absorption function.
A side or both sides and the electrostatic chuck 2 relative with it that said attachment members 3 strides across holding plate up and down 1,1 ' even surface are outwardly; Fixed configurations for example has magnet such as permanent magnet or electromagnet 3a and forms membranaceous magnetic 3b such as metal by the magnet of this magnetic attraction or by for example sputter etc. respectively; Perhaps fixed configurations has jointing material or the structure except that the one touch type bindiny mechanism of machinery except that magnetic force respectively; Magnetic force or bounding force etc. through them engage said electrostatic chuck 2 with respect to this even surface detachable ground.
The opposite face of said isolated part 4 from holding plate up and down 1,1 ' even surface one side or both sides towards electrostatic chuck 2 injects for example nitrogen or air etc. other or other fluid, pushes electrostatic chuck 2; Perhaps with cylinder etc. up and down the driving body of motion push electrostatic chuck 2; Perhaps conversion is as any side's of magnet 3a said attachment members 3, that be oppositely arranged, 3b magnetic pole, the identical and mutual exclusion of the magnetic pole that makes these relative magnet 3a, 3b, with electrostatic chuck from the parallel separation of this even surface.
Following according to the description of drawings various embodiments of the present invention.
In addition; On said holding plate 1 and base, be provided in atmosphere, adsorbing the attraction adsorption element 5 of maintenance; Attraction source (not shown) pipe arrangements such as a plurality of attraction circuits of forming as attracting adsorption element 5 and for example vacuum pump are connected, and are used as the air hole 4a of isolated part 4 to the attraction circuit.
It should be noted that; In the accompanying drawings; Only represented with respect to the said upward even surface of holding plate 1; On above-below direction, can support electrostatic chuck 2 with freely coming and going, thereby keep the example that moves under the state as the surface of the extremely low upper substrate of the rigidity below about 0.5mm of workpiece A in absorption; But on above-below direction, can support electrostatic chuck 2 with respect to the following even surface of holding plate 1 ' with freely coming and going, the situation that is keeping moving under the state on surface of infrabasal plate B in absorption in view of the above too, so omission.
As the magnet 3a of fixed configurations on the base of said holding plate 1, use permanent magnet or electromagnet etc.; As the magnet 3b of fixed configurations on the opposite face of electrostatic chuck 2,, just can guarantee resiliency and two magnet 3a of electrostatic chuck 2, the fissility of 3b, so be preferred if use the magnet form lamellar or film like.
In addition; As shown in Figures 2 and 3; As said attachment members 3; Be configured near it, alternately arrange the opposite electrode of magnetic pole to fixed configurations respectively at magnet 3a on the base of said holding plate 1 and the magnet 3b of fixed configurations on the opposite face of electrostatic chuck 2, in view of the above, with the action of said isolated part 4 when said basal plane 1a draws back electrostatic chuck 2; Even produce offset a little, also can utilize magnetic force (repulsion) to make it get back to original position automatically based on the action of after this attachment members 3 in XY θ direction.
In addition; Through action the further basal plane 1a of holding plate 1 of electrostatic chuck 2 is come when workpiece (upper substrate) A that finishes to move forces to peel off with said attachment members 3; Electrostatic chuck 2 whole simultaneously do not further; But shown in the enlarged drawing of the part of preferred as Fig. 1 (b), only make and further earlier with the relative position of peripheral end portion A1 of the workpiece A that moves so that its local deformation, and the peripheral end portion A1 of workpiece A between local formation peel off the gap S1 of usefulness.
The Workpiece transfer method of said electro-static sucker device D is used in explanation below.
At first; Shown in Fig. 1 (a); Action through said attachment members 3 or attraction adsorption element 5; Pull to the basal plane 1a of the holding plate 1 that constitutes by rigid body to the electrostatic chuck 2 of lamellar or film like, the 2a of Electrostatic Absorption portion engaged along basal plane 1a smoothly, with workpiece A Electrostatic Absorption on electrostatic chuck 2.
Then; Shown in Fig. 1 (b),, draw back electrostatic chuck 2 from the basal plane 1a of holding plate 1 under by the state of Electrostatic Absorption at workpiece A if utilize the action of said isolated part 4; Make workpiece A to the parallel mobile words of the opposing party's workpiece (infrabasal plate) B; Workpiece A does not just become free state, thus do not receive gravity etc. influence be transferred, and be temporarily fixed with respect to the opposing party's workpiece B through cyclic adhesion agent C.
In addition, after mobile end, cut off the power supply of electrostatic chuck 2 immediately, stop the Electrostatic Absorption function.
If a little later make said attachment members 3 or attract parts 5 work than this; Force to draw back the words of lamellar or membranaceous electrostatic chuck 2 from temporary fixed workpiece A; At this moment the residual absorption affinity of electrostatic chuck 2 weakens; So between the 2a of Electrostatic Absorption portion of these workpiece A and electrostatic chuck 2, can produce the gap S1 that peels off usefulness, the 2a of Electrostatic Absorption portion of electrostatic chuck 2 can the S1 part be stripped from from this gap limpingly.
Meanwhile; Utilize and alternately arrange magnet 3a, the 3b of ground configuration to the opposite electrode of magnetic pole; The electrostatic chuck 2 of lamellar or film like can be with respect to the basal plane 1a of holding plate 1 to the skew of XY θ direction occurrence positions, but automatically attached to original position and get back to original state.
In view of the above, even the extremely low workpiece A of rigidity also can peel off with the residual absorption affinity of electrostatic chuck 2 or inhomogeneous irrespectively the conveying also to the fixed position of releasing of Electrostatic Absorption power reliably.
In addition, make the basal plane 1a smoothed of the 2a of Electrostatic Absorption portion of electrostatic chuck 2, so the surface of 2a of these Electrostatic Absorption portions and workpiece A seamlessly contacts and by Electrostatic Absorption, can keep workpiece A reliably along the holding plate that constitutes by rigid body 1.
In addition; If make electrostatic chuck 2 from position local deformation facing to the peripheral end portion A1 of workpiece A; And the peripheral end portion A1 of workpiece A between form the words of the gap S1 that peels off usefulness partly; This gap S1 that peels off usefulness once will expand between the surface of the 2a of Electrostatic Absorption portion of these electrostatic chucks 2 and workpiece A, decays by the strong hand and eliminates residual absorption affinity, so can improve the fissility of workpiece A.
Shown in Fig. 4 (a) and (b); The structure of embodiment 2 and said Fig. 1～embodiment 1 difference shown in Figure 3 is; Electrostatic chuck 2 is formed than the basal plane 1a or the workpiece A of said holding plate 1 biglyyer; With fixed part 2e with the outer end 2d of this electrostatic chuck 2 with respect to this holding plate 1 detachable fix, or utilize fixed part 2e a part or the full week of outer end 2d to be fixed foldedly with respect to this holding plate 1 detachable ground; Simultaneously be connected to come supplying electric current to electrode part 2c with the 2f of current supply portion; The local deflection division 2g that forms the ability elastic deformation between outer end 2d and the 2a of Electrostatic Absorption portion in view of the above can be free toward the ground return configuration Electrostatic Absorption 2a of portion on above-below direction.In addition the embodiment 1 of structure and Fig. 1～shown in Figure 3 is identical.
Under the situation of illustrated example, be fixed as the picture frame shape to the outer end 2d of electrostatic chuck 2, or every separated appropriate intervals is fixed with point-like on the entire periphery of outer end 2d with striding across its entire periphery.
As other examples,, perhaps fix the every separated appropriate intervals of one group of parallel outer end 2d ground with point-like fixing abreast with the one group of outer end 2d that disposes abreast of electrostatic chuck 2.
In view of the above; Embodiment 2 shown in Figure 4 does not have guide member (not shown); Just can on above-below direction, support electrostatic chuck 2 with moving freely, simultaneously, through the action of isolated part 4; When the basal plane 1a from said holding plate 1 draws back electrostatic chuck 2, make electrostatic chuck 2 on XY θ direction, get back to original position the position non-migration.
Therefore; As attachment members 3, as shown in Figures 2 and 3, need not fixed configurations be configured near the form of alternately arranging the opposite electrode of magnetic pole it respectively at the magnet 3b on the opposite face of electrostatic chuck 2 in the magnet 3a on the base of said holding plate 1 and fixed configurations; Simultaneously; Configuration also fixing forms the magnet 3b that membranaceous magnetics such as metal replace electrostatic chuck 2 by for example sputter etc., also can come and go to move and can not compare with said Fig. 1～embodiment 1 shown in Figure 3 in the skew of XY θ direction occurrence positions; Can simplify the structure of said attachment members 3, thereby reduce cost.
In addition; Between following basal plane 1a ' that descends holding plate 1 ' and electrostatic chuck 2, dispose for example jointing material or mechanical one touch type bindiny mechanism or bonding agent; With the two detachable be installed together, and down the electrostatic chuck 2 of holding plate 1 ' can be through the action of attachment members 3 or isolated part 4 and round mobile on above-below direction as above-mentioned last holding plate 1.
As required; Shown in Fig. 6 (a) and (b); On the electrostatic chuck 2 of the following basal plane 1a ' of this time holding plate 1 ' and below, on the straight line of each Z (up and down) direction, leave a plurality of through holes 6 with connecting; The withdrawal of needle that can move freely on Z (up and down) direction in the internal configurations of these through holes 6, top ends is formed by insulating material as the upper and lower base plate A that stickup is finished, B from the separating component 7 of the surface isolation of this electrostatic chuck 2, or control to spray for example gas such as nitrogen or air or other fluid to the top; Come upper and lower base plate A, the B finish stickup to push away from the surface of the electrostatic chuck 2 of below, and the back surface B 1 of infrabasal plate B between form and for example have only the elimination electric charge about 2～3mm to use gap S2.
By separating component 7 below the back surface B 1 of surface and infrabasal plate B of electrostatic chuck 2 between formed in the atmosphere of gap S2 or in the low vacuum of regulation; Between the electrode part 2c more than 2 of the electrostatic chuck that is arranged on this below 2 inside, apply high voltage from high-voltage power supply (not shown); Repeat from the action of the state that applies when the infrabasal plate B Electrostatic Absorption the reversal of poles of voltage; Change the voltage of said electrode part 2c more than 2, produce induction field in view of the above and remain in the electric charge among upper and lower base plate A, the B with neutralization.
In addition, in illustrated example,, used Fig. 1～embodiment 1 shown in Figure 3 as above-mentioned electro-static sucker device D, though not shown, as other examples, also can use embodiment shown in Figure 42.
The action of the substrate sticking machine of said electro-static sucker device D is used in explanation below.
At first, shown in the solid line of Fig. 5 (a), under atmospheric pressure state, the action through said attachment members 3 or attraction adsorption element 5 pulls to top base 1a to the electrostatic chuck 2 of lamellar or film like, and engages smoothly along top base 1a; Under this state, by carrying the upper and lower base plate A that carries with mechanical arm, B respectively by attached to the electrostatic chuck 2 of the top on the last maintenance face 1a be installed in down 2 Electrostatic Absorption of electrostatic chuck and the maintenance of the below on the basal plane 1a '.
Then; Shown in the double dot dash line of Fig. 5 (a); Through the action of said Lift Part, make up and down that holding plate 1,1 ' closely moves and forms vacuum chamber S, in this vacuum chamber S, reach given vacuum tightness after; Holding plate up and down 1,1 ' in statu quo relatively on XY θ direction adjustment move, carry out the position alignment action of upper and lower base plate A, B.
After the position alignment release, shown in Fig. 5 (b), through the action of said isolated part 4, under the state that upper substrate A by electrostatic attraction, the electrostatic chuck 2 from top base 1a draws back the top makes this upper substrate A move to infrabasal plate B.
In view of the above, upper and lower base plate A, B clip cyclic adhesion agent C moment crimping, between the two sealing and overlapping.
In this overlapping step, can prevent fully that gas or fluid from getting between upper and lower base plate A, the B; And for the extremely low upper substrate A of rigidity; The padded coaming that becomes that has on it lamellar or film like; So there is following advantage:, also be difficult to (not shown) such as the cyclic adhesion agent C that forms between upper and lower base plate A, the B or spacing blocks impacted even adding of cyclic adhesion agent C pressed a little inhomogeneous of generation.
In addition, behind the mobile end of upper substrate A, cut off the power supply of the electrostatic chuck 2 of top immediately, stop the Electrostatic Absorption function.
Then, get back to atmospheric pressure in the vacuum chamber S, pressurize equably through the draught head in the inside and outside generation of two substrate A, B, the draught head that is used in the inside and outside generation of two substrate A, B is pressed into predetermined gap, pastes step and finishes.
Then shown in Fig. 5 (c), utilize the action of said attachment members 3 or attraction adsorption element 5, pull to top base 1a to the electrostatic chuck 2 of top from the upper substrate A that pastes through cyclic adhesion agent C and infrabasal plate B, begin both peeling off.
At this moment, in the Paschen region of discharge of the vacuum tightness in the vacuum chamber S about tens of Pa～thousands of Pa, the residual absorption affinity of the electrostatic chuck 2 of top is extremely low.
, because by the upper substrate A that bounding force kept of cyclic adhesion agent C and electrostatic chuck 2 comprehensive engagements of top, so there is the situation that is difficult to peel off.
Therefore; Draw back whole of electrostatic chuck 2 of top simultaneously if not aforesaid surface from upper substrate A; Be out of shape partly but make from position facing to the peripheral end portion A1 of the upper substrate A that pastes; And the peripheral end portion A1 of upper substrate A between form the words in the gap of peeling off usefulness partly; This gap of peeling off usefulness just can be once in the surface expansion of the 2a of Electrostatic Absorption portion and the upper substrate A of electrostatic chuck 2, decay by the strong hand and eliminate residual absorption affinity, so the whole Electrostatic Absorption face of the electrostatic chuck 2 of top is successfully from the sur-face peeling of upper substrate A.
In view of the above, even the extremely low substrate A of rigidity also can irrespectively paste in the fixed position with the releasing inequality of the residual absorption affinity of the electrostatic chuck 2 of top or Electrostatic Absorption power and peel off reliably.
In addition, from the sur-face peeling of upper substrate A the electrostatic chuck 2 of top attached to top base 1a, after this,, move holding plate up and down 1,1 ' to direction separated from one another through the action of said Lift Part, get back to original state.
Under such situation; Be atmospheric pressure or the above low vacuum of 100Pa around the upper and lower base plate A that stickup is through with, the B; In this atmosphere; As required, shown in Fig. 6 (a) and (b), make as the withdrawal of needle of said separating component 7 and rise or spray for example gas such as nitrogen or air or other fluid to the top from a plurality of through holes 6 of the electrostatic chuck 2 of the basal plane 1a ' that run through time holding plate 1 ' and below; Come upper and lower base plate A, the B finish stickup to push away from the electrostatic chuck 2 of below, and the back surface B 1 of infrabasal plate B between form the gap S2 that the elimination electric charge about 2～3mm is only used.
Under this state; If change the voltage of the inner electrode part 2c more than 2 of the electrostatic chuck 2 be embedded in the below, just can through below the stripping charge that moment produced peeled off from the state of the infrabasal plate B of glassivation system of electrostatic chuck 2 respond to the generation and upper and lower base plate A, B in the electric field (particularly being alternating electric field) of residual electric charge.
In view of the above, in the electric field part of this induction, a part of moment ionization of atmosphere gas such as air and ionization, promptly neutral molecule is separated into the electric charge of positive and negative, so they can in infrabasal plate B in residual electric charge eliminate electric charge.
In addition, carry upper and lower base plate A, B by above-mentioned conveying with mechanical arm, when the electrostatic chuck 2 of the top on being installed in top base 1a and the electrostatic chuck 2 that is installed in down the below on the basal plane 1a ' moved and be provided with, the fragment of glass etc. might get into.
At this moment, be accompanied by the Electrostatic Absorption with upper and lower base plate A, B, can take place that this fragment gets between each electrostatic chuck 2 and the fault that causes the surface local of the medium 2a etc. of electrostatic chuck 2 to destroy.
Even in this case,,, has the advantage of maintainability excellence so can provide for simple replacement of these electrostatic chucks 2 because the electrostatic chuck 2 of lamellar or film like is the configuration of detachable ground for basal plane 1a, 1a ' up and down respectively.
It should be noted that; Although clear with electro-static sucker device D of the present invention be arranged on that detachable ground keeps and stickup as the situation in the substrate sticking machine of the glass substrate of the panel that is used for LCD (LCD), plasma scope (PDP), flexible display of workpiece A, B or plastic film substrate; But be not limited to this; Also can be configured in the base board delivery device of substrate assembling apparatus beyond the substrate sticking machine, conveying substrate, perhaps paste and keep the LCD panel with the substrate beyond the glass substrate.
In addition, although the clear substrate sticking machine of pasting two substrate A, B in a vacuum, but be not limited to this, also can be the substrate sticking machine of in atmosphere, pasting two substrate A, B, at this moment also can obtain the action effect identical with above-mentioned substrate sticking machine.
In addition; In the illustrated example; Only the basal plane 1a for last holding plate 1 can support electrostatic chuck 2 on above-below direction with freely coming and going, but is not limited to this, also can electrostatic chuck 2 be supported on the Z direction with can move freely for the following basal plane 1a ' of following holding plate 1 '; Also have attachment members 3 and isolated part 4 on the holding plate 1 ' down; With attachment members 3 electrostatic chuck 2 is attached to down on the following basal plane 1a ' of holding plate 1 ', with this electrostatic chuck that adheres to 2 Electrostatic Absorption infrabasal plate B, will be parallel isolator mobile to the off-position with infrabasal plate B with isolated part 4 from following holding plate 1 ' as the electrostatic chuck 2 of one; Stop the Electrostatic Absorption function of electrostatic chuck 2 simultaneously; Then with 3 of attachment members electrostatic chuck 2 from the off-position towards holding plate 1 ' reverse moving down, from the sur-face peeling electrostatic chuck 2 of the infrabasal plate B that moves to the off-position, thereby carry out the sticking placement of substrate A, B.
Claims (4)
1. one kind keeps workpiece, the workpiece that is kept is discharged and be placed to the Workpiece transfer method of assigned position with the absorption of the electrostatic chuck of holding plate, it is characterized in that:
On said holding plate, be provided with electrostatic chuck is pulled to this holding plate and along the attachment members of this holding plate detachable and the isolated part that electrostatic chuck is pulled away from from this holding plate; Make electrostatic chuck attached on the holding plate with above-mentioned attachment members; Utilize the absorption of this electrostatic chuck that adheres to keep workpiece, and utilize above-mentioned isolated part with above-mentioned electrostatic chuck and workpiece as keeping apart from holding plate integratedly; After stopping the Electrostatic Absorption function of this electrostatic chuck, utilize said attachment members only to make above-mentioned electrostatic chuck, and stay workpiece to be placed on the off-position once more attached on the holding plate.
2. Workpiece transfer method according to claim 1 is characterized in that:
Form said electrostatic chuck lamellar or membranaceous, support this electrostatic chuck that it can be moved freely on the direction that the level and smooth basal plane with the holding plate that is made up of rigid body intersects.
3. Workpiece transfer method according to claim 1 and 2 is characterized in that:
The Electrostatic Absorption portion that makes said electrostatic chuck is out of shape from the place facing to the peripheral end portion of workpiece partly, and the workpiece peripheral end portion between form the gap of peeling off usefulness partly.
4. one kind by holding plate and the electro-static sucker device that absorption keeps the electrostatic chuck of workpiece to constitute, and it is characterized in that:
Support that electrostatic chuck can move freely it on the direction that workpiece one side surface with holding plate intersects; Make the surface of electrostatic chuck at Electrostatic Absorption workpiece under the state of workpiece one side surface; This electrostatic chuck is moved to the off-position from this absorption position under the state that is keeping the Electrostatic Absorption workpiece, and stop the Electrostatic Absorption function of electrostatic chuck; Electrostatic chuck is oppositely moved, from the sur-face peeling electrostatic chuck of the workpiece that is moved to the off-position from this off-position to absorption position.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2006/319540 WO2008041293A1 (en) | 2006-09-29 | 2006-09-29 | Work transferring method, electrostatic chuck device, and board joining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101316777A CN101316777A (en) | 2008-12-03 |
| CN101316777B true CN101316777B (en) | 2012-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800007517A Expired - Fee Related CN101316777B (en) | 2006-09-29 | 2006-09-29 | Workpiece transfer method and electro-static sucker device and substrate sticking method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN101316777B (en) |
| TW (1) | TWI412480B (en) |
| WO (1) | WO2008041293A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102187447B (en) * | 2008-10-20 | 2013-03-27 | 创意科技股份有限公司 | Method for inspecting electrostatic chuck, and electrostatic chuck apparatus |
| JP5706180B2 (en) * | 2011-02-15 | 2015-04-22 | 常陽工学株式会社 | Sealing method and apparatus |
| CN103094167B (en) * | 2011-10-28 | 2016-03-30 | 无锡华润安盛科技有限公司 | Semiconductor device pick device |
| KR102082271B1 (en) * | 2013-05-24 | 2020-04-16 | 엘지디스플레이 주식회사 | System for Separating Carrier Substrate and Method of Separating the Same |
| JP6226563B2 (en) * | 2013-05-28 | 2017-11-08 | リンテック株式会社 | Electrostatic holding device and method for removing object to be held from electrostatic holding device |
| JP6254795B2 (en) * | 2013-09-06 | 2017-12-27 | リンテック株式会社 | Sheet sticking device and sticking method |
| WO2015083257A1 (en) * | 2013-12-04 | 2015-06-11 | 信越エンジニアリング株式会社 | Method for manufacturing bonded device |
| JP6765751B2 (en) * | 2016-06-21 | 2020-10-07 | 株式会社ディスコ | Work piece holding mechanism and processing equipment |
| CN106927258A (en) * | 2017-01-26 | 2017-07-07 | 江苏东旭亿泰智能装备有限公司 | A kind of conveyer and its transfer approach for glass substrate |
| US20200234961A1 (en) * | 2017-08-10 | 2020-07-23 | Tokyo Electron Limited | Substrate processing method |
| KR20190100980A (en) * | 2017-12-27 | 2019-08-30 | 캐논 톡키 가부시키가이샤 | Electrostatic chuck, film forming apparatus, substrate adsorption method, film forming method and manufacturing method of electronic device |
| KR102421610B1 (en) * | 2018-07-31 | 2022-07-14 | 캐논 톡키 가부시키가이샤 | Electrostatic chuk system, film formation apparatus, suction method, film formation method, and manufacturing method of electronic device |
| KR102430361B1 (en) * | 2018-09-21 | 2022-08-05 | 캐논 톡키 가부시키가이샤 | Adsorption apparatus, apparatus for forming film, adsorption method, method for forming film, and manufacturing method of electronic device |
| KR102550586B1 (en) * | 2018-10-31 | 2023-06-30 | 캐논 톡키 가부시키가이샤 | Adsorption and alignment method, adsorption system, film forming method, film forming apparatus, and manufacturing method of electronic device |
| JP7488738B2 (en) * | 2020-09-18 | 2024-05-22 | 日機装株式会社 | Vacuum lamination device and method for manufacturing laminate |
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| CN2715187Y (en) * | 2004-02-14 | 2005-08-03 | 鸿富锦精密工业（深圳）有限公司 | Substrate adhering equipment |
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| JPH06235896A (en) * | 1993-02-08 | 1994-08-23 | Ropuko:Kk | Contactless pressure sticking method |
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| JP2005353987A (en) * | 2004-06-14 | 2005-12-22 | Canon Inc | Electrostatic chuck, and device manufacturing apparatus and method therefor |
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- 2006-09-29 CN CN2006800007517A patent/CN101316777B/en not_active Expired - Fee Related
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| CN2715187Y (en) * | 2004-02-14 | 2005-08-03 | 鸿富锦精密工业（深圳）有限公司 | Substrate adhering equipment |
| CN1690787A (en) * | 2004-04-28 | 2005-11-02 | 鸿富锦精密工业（深圳）有限公司 | Substrate application method |
| CN1707323A (en) * | 2004-06-11 | 2005-12-14 | 鸿富锦精密工业（深圳）有限公司 | Substrate plying-up apparatus and substrate plying-up process |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP4043506B2 (en) | 2008-02-06 |
| JPWO2008041293A1 (en) | 2010-01-28 |
| CN101316777A (en) | 2008-12-03 |
| TWI412480B (en) | 2013-10-21 |
| TW200815268A (en) | 2008-04-01 |
| WO2008041293A1 (en) | 2008-04-10 |
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