CN1690787A - Substrate application method - Google Patents
Substrate application method Download PDFInfo
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- CN1690787A CN1690787A CN 200410027099 CN200410027099A CN1690787A CN 1690787 A CN1690787 A CN 1690787A CN 200410027099 CN200410027099 CN 200410027099 CN 200410027099 A CN200410027099 A CN 200410027099A CN 1690787 A CN1690787 A CN 1690787A
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- substrate
- electrostatic chuck
- vacuum chamber
- gas
- worktable
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Abstract
The invention discloses a joint method for basal plate and comprises follows steps: supply a vacuum cavity with a workbench and first electrostatic suction; adsorb the first basal plate to first electrostatic suction; put the second basal plate on workbench; joint the first and second basal plate; when vacuumizing vacuum cavity to keep vacuum, supply a kind of gas to impact the first basal plate and make it divorce from first electrostatic suction.
Description
[technical field]
The invention relates to a kind of method for bonding substrate, the particularly a kind of mode of dripping (One Drop Filling, method for bonding substrate of liquid crystal filling processing procedure ODF) of being applicable to.
[background technology]
The structure of display panels generally includes two glass substrates, is coated in the glue frame between these two glass substrates and is poured in this glue frame and two glass substrates are formed liquid crystal in the space.
The method that liquid crystal filling is gone in the space that this glue frame and two glass substrates form generally comprises two kinds.A kind of is injection method, that is: earlier the glue frame is coated on the glass substrate, and one or more liquid crystal injection openings are set on this glue frame; Then another glass substrate and aforementioned glass substrate are fitted, and the curing of glue frame is made two glass substrate strong bonded; In vacuum environment, make liquid crystal inject opening contact liquid crystal again, cancel vacuum subsequently and make liquid crystal under the atmospheric pressure effect, inject the space of this display panels.Another kind of liquid crystal filling method is the mode of dripping, that is: earlier a complete glue frame is coated on the glass substrate of a horizontal positioned; With liquid crystal droplet separator (Dispenser) liquid crystal is distributed in the space that this glue frame and glass substrate formed; In vacuum environment, another glass substrate and aforementioned glass substrate are fitted, and the curing of glue frame is made two glass substrate strong bonded.
The liquid crystal filling processing procedure of the mode of dripping need adopt the Base Plate Lamination Device that vacuum condition can be provided, and the prior art of this kind Base Plate Lamination Device sees also to be announced in No. the 526367th, the TaiWan, China patent on April 1st, 2003.The Base Plate Lamination Device of the prior art is under vacuum condition, utilizes electrostatic chuck absorption first substrate to be fitted, and moves this first substrate towards second orientation substrate that is arranged on the worktable then, makes this first substrate and second baseplate-laminating.
But, after utilizing electrostatic chuck to adsorb this first substrate to fit, only by the voltage of eliminating on the electrostatic chuck this first substrate and this electrostatic chuck are broken away from immediately, this is to be difficult to the reason that disappears at short notice usually because of the static on the electrostatic chuck.
Seeing also Fig. 1, is a kind of prior art Base Plate Lamination Device that breaks away from by air-flow power-assisted substrate.This Base Plate Lamination Device 1 comprises a vacuum chamber 11, first electrostatic chuck 12, a worktable 13, a feeder 14 and a control device 15.This first electrostatic chuck 12 and worktable 13 are arranged in this vacuum chamber 11, this first electrostatic chuck 12 comprises a suction cup main body 121, offer a plurality of gas ports 122 on this suction cup main body 121, this feeder 14 connects by a plurality of gas ports 122 of a gas piping 141 and this, these control device 15 control feeders 14 and vacuum chamber 11 alternations.
This Base Plate Lamination Device 1 be used to fit first substrate 22 and second substrate 23, before applying, this second substrate 23 has been coated with glue frame 231 and liquid crystal 232 has been instiled and finished.
The method for bonding substrate of this Base Plate Lamination Device 1 is as described below.At first, move first electrostatic chuck 12, first substrate 22 and second substrate 23 that are adsorbed on first electrostatic chuck 12 are fitted towards second substrate, 23 directions; Secondly, with reference to Fig. 2, control device 15 control vacuum chambers 11 stop the work of vacuumizing, and begin to control feeder 14 gas port 122 the supply of nitrogen to suction cup main body 121, by the power-assisted first substrate 22 disengaging suction cup main body 121 of air-flow.
But, there is following shortcoming in this method for bonding substrate: because this Base Plate Lamination Device 1 is when air feed, this vacuum chamber 11 stops to vacuumize, first substrate 22 after feasible applying the and the air pressure in second substrate, the 23 formed spaces are less than the air pressure in the vacuum chamber 11, therefore this glue frame 231 is still uncured the time again, the nitrogen that feeder 14 is supplied might pour in first substrate 22 and second substrate, the 23 formed spaces because of pressure differential, even make liquid crystal 232 form bubbles, cause display panels bad and scrap.
[summary of the invention]
For the method for bonding substrate that overcomes prior art causes the problem that display panels is bad and scrap easily, the invention provides a kind of method for bonding substrate that improves the display panels yield.
Method for bonding substrate of the present invention may further comprise the steps: a vacuum chamber is provided, and this vacuum chamber has a worktable and one first electrostatic chuck; One first substrate is adsorbed on this first electrostatic chuck, one second substrate is arranged on this worktable; Fit first substrate and second substrate; When keeping vacuum chamber to continue to vacuumize, provide a gas, impact this first substrate and make it and this first electrostatic chuck breaks away from.
Compared to prior art, because method for bonding substrate of the present invention can be in the first supply substrate air-flow power, continue vacuum chamber is bled, avoid gas to pour in first substrate and the formed space of second substrate, thereby improve the yield of display panels.
[description of drawings]
Fig. 1 is a kind of diagrammatic cross-section of prior art Base Plate Lamination Device.
Fig. 2 is the synoptic diagram that adopts the method for bonding substrate of Base Plate Lamination Device shown in Figure 1.
Fig. 3 is the diagrammatic cross-section of the Base Plate Lamination Device that adopts of method for bonding substrate of the present invention.
Fig. 4 is the synoptic diagram that adopts the method for bonding substrate of Base Plate Lamination Device shown in Figure 3.
[embodiment]
As shown in Figure 3, be the diagrammatic cross-section of the Base Plate Lamination Device that method for bonding substrate of the present invention adopted.This Base Plate Lamination Device 3 comprises a vacuum chamber 31, one first electrostatic chuck 32, a worktable 33, a feeder 34, a first control device 36 and a second control device 37.
This vacuum chamber 31 is one can provide the cavity of vacuum condition, and himself has air extractor, by the continuous firing of second control device 37 control air extractors, keeps being vacuum state in this vacuum chamber 31.
This first electrostatic chuck 32 has the suction cup main body 321 of offering a plurality of gas ports 322, and this suction cup main body 321 is by electrostatic induction phenomenon absorption first substrate 42 to be fitted.This first electrostatic chuck 32 has the function that moves up and down, and moves up and down in vacuum chamber 31 to drive first substrate 42.
This worktable 33 is in order to place second substrate 43, and it is to be oppositely arranged in this vacuum chamber 31 with this suction cup main body 321 when carrying out the applying of first substrate 42 and second substrate 43.But, but these worktable 33 move left and right with this vacuum chamber 31 of coming in and going out, coating adhesive frame 431 on this second substrate 43 and dispenser method 432 promptly are to carry out outside this vacuum chamber 31.In the present embodiment, this worktable 33 is electrostatic chucks, and its principle of work is identical with suction cup main body 321, also is to adsorb second substrate 43 by the electrostatic induction phenomenon.
This feeder 34 is to connect by the gas port 322 of a gas piping 341 with this suction cup main body 321, and the work of this feeder 34 is that the gas of being supplied is nitrogen by first control device 36 controls.Whether the air feed of this this feeder 34 of control device 36 may command.
With reference to Fig. 4, method for bonding substrate of the present invention is as described below together.
At first, provide a Base Plate Lamination Device 3.
Secondly, first substrate 42 is adsorbed on this first electrostatic chuck 32, second substrate 43 is arranged on this worktable 33.
Once more, fit first substrate 42 and second substrate 43, wherein, the applying of this first substrate 42 and second substrate 43 is to move realization by first electrostatic chuck 32 towards worktable 33 directions.
At last, when keeping vacuum chamber 31 to continue to vacuumize, provide a gas, impact this first substrate 42 and make it and this first electrostatic chuck 32 breaks away from.Wherein, this gas is nitrogen, and it is by feeder 34 supplies, and this feeder 34 connects by the gas port 322 of gas piping 341 with this suction cup main body 321.The work of this feeder 34 is by first control device 36 controls, and the work of this vacuum chamber 31 is by second control device 37 controls.
Certainly, method for bonding substrate of the present invention also is included in the step of coating adhesive frame 431 and dispenser method 432 on this second substrate 43.
Because the Base Plate Lamination Device that method for bonding substrate of the present invention adopted 3 adopts two control device 36,37 to control the work of feeder 34 and vacuum chamber 31 respectively, it can be implemented in and continue bleeding to vacuum chamber 31 in the time of first substrate, 42 supply air flow power, air pressure and vacuum chamber 31 internal gas pressure balances after keeping fitting in first substrate 42 and second substrate, the 43 formed spaces, avoid gas to pour in first substrate 42 and second substrate, 43 formed spaces after the applying, thereby improve the yield of display panels.
Claims (9)
1. method for bonding substrate, may further comprise the steps: a vacuum chamber is provided, and this vacuum chamber has a worktable and one first electrostatic chuck; One first substrate is adsorbed on this first electrostatic chuck, one second substrate is arranged on this worktable; Fit this first substrate and second substrate; When keeping vacuum chamber to continue to vacuumize, provide a gas, impact this first substrate and make it and this first electrostatic chuck breaks away from.
2. method for bonding substrate as claimed in claim 1 is characterized in that: this worktable is an electrostatic chuck.
3. method for bonding substrate as claimed in claim 1 is characterized in that: this gas is nitrogen.
4. method for bonding substrate as claimed in claim 1 is characterized in that: the applying of this first substrate and second substrate is to move realization by first electrostatic chuck towards the worktable direction.
5. method for bonding substrate as claimed in claim 1 is characterized in that: this first electrostatic chuck has the suction cup main body of offering a plurality of gas ports, and this first substrate is adsorbed on this first electrostatic chuck main body.
6. method for bonding substrate as claimed in claim 5 is characterized in that: this gas is by a feeder supply, and this feeder connects by the gas port of a gas piping and this suction cup main body.
7. method for bonding substrate as claimed in claim 6 is characterized in that: the work of this feeder is to control by a first control device.
8. method for bonding substrate as claimed in claim 1 is characterized in that: the work of this vacuum chamber is to control by a second control device.
9. method for bonding substrate as claimed in claim 1 is characterized in that: before the step that one second substrate is arranged on this worktable, also be included in the step of coating adhesive frame and dispenser method on this second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100270990A CN100403104C (en) | 2004-04-28 | 2004-04-28 | Substrate application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100270990A CN100403104C (en) | 2004-04-28 | 2004-04-28 | Substrate application method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1690787A true CN1690787A (en) | 2005-11-02 |
| CN100403104C CN100403104C (en) | 2008-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100270990A Expired - Fee Related CN100403104C (en) | 2004-04-28 | 2004-04-28 | Substrate application method |
Country Status (1)
| Country | Link |
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| CN (1) | CN100403104C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101706624B (en) * | 2009-11-09 | 2011-09-07 | 友达光电股份有限公司 | Substrate combination system and method |
| CN102209621A (en) * | 2008-11-06 | 2011-10-05 | 芝浦机械电子装置股份有限公司 | Bonding apparatus and bonding method |
| CN101316777B (en) * | 2006-09-29 | 2012-01-18 | 信越工程株式会社 | Workpiece transfer method and electro-static sucker device and substrate sticking method |
| WO2014029126A1 (en) * | 2012-08-21 | 2014-02-27 | 深圳市华星光电技术有限公司 | Frameless liquid crystal display device |
| US8836886B2 (en) | 2012-08-21 | 2014-09-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Frameless liquid crystal display device |
| CN106097893A (en) * | 2015-04-27 | 2016-11-09 | 三星显示有限公司 | Engagement device and use its curved-surface display device producing method |
| CN108890680A (en) * | 2018-08-23 | 2018-11-27 | 苏州软体机器人科技有限公司 | A kind of actuator carrying out grasping movement using Electrostatic Absorption effect |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3545076B2 (en) * | 1995-01-11 | 2004-07-21 | 富士通ディスプレイテクノロジーズ株式会社 | Liquid crystal display device and method of manufacturing the same |
| JPH08304835A (en) * | 1995-04-28 | 1996-11-22 | Hitachi Electron Eng Co Ltd | Sticking device |
| JP2000002862A (en) * | 1998-06-12 | 2000-01-07 | Matsushita Electric Ind Co Ltd | Manufacture of liquid crystal display element |
| JP3411023B2 (en) * | 2001-04-24 | 2003-05-26 | 株式会社 日立インダストリイズ | Board assembly equipment |
| US6991699B2 (en) * | 2002-02-05 | 2006-01-31 | Lg.Philips Lcd Co., Ltd. | LCD bonding machine and method for fabricating LCD by using the same |
| US6793756B2 (en) * | 2002-03-22 | 2004-09-21 | Lg. Phillips Lcd Co., Ltd. | Substrate bonding apparatus for liquid crystal display device and method for driving the same |
-
2004
- 2004-04-28 CN CNB2004100270990A patent/CN100403104C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101316777B (en) * | 2006-09-29 | 2012-01-18 | 信越工程株式会社 | Workpiece transfer method and electro-static sucker device and substrate sticking method |
| CN102209621A (en) * | 2008-11-06 | 2011-10-05 | 芝浦机械电子装置股份有限公司 | Bonding apparatus and bonding method |
| CN102209621B (en) * | 2008-11-06 | 2014-09-03 | 芝浦机械电子装置股份有限公司 | Bonding apparatus and bonding method |
| CN101706624B (en) * | 2009-11-09 | 2011-09-07 | 友达光电股份有限公司 | Substrate combination system and method |
| WO2014029126A1 (en) * | 2012-08-21 | 2014-02-27 | 深圳市华星光电技术有限公司 | Frameless liquid crystal display device |
| US8836886B2 (en) | 2012-08-21 | 2014-09-16 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Frameless liquid crystal display device |
| CN106097893A (en) * | 2015-04-27 | 2016-11-09 | 三星显示有限公司 | Engagement device and use its curved-surface display device producing method |
| CN108890680A (en) * | 2018-08-23 | 2018-11-27 | 苏州软体机器人科技有限公司 | A kind of actuator carrying out grasping movement using Electrostatic Absorption effect |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100403104C (en) | 2008-07-16 |
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Granted publication date: 20080716 Termination date: 20160428 |