KR20140000495A - Laminating device and method for apparatus of bonding substrates, and apparatus and method of bonding substrates having the same - Google Patents

Abstract

In the present invention, disclosed are a laminating device and method for apparatus for bonding a substrate, and the apparatus and method for bonding the substrate including the same. The laminating device for bonding the substrate according to the present invention includes: a gantry; a connection member which is mounted on the gantry to be lifted; a laminating member which is rotationally mounted on the connection member and includes a contact member in contact with a top substrate on the lower side thereof; and a support member which slantingly supports one side of the top substrate and downwardly moves one side of the top substrate. The laminating member is controlled to form a vertical contact angle between the top substrate and the contact member and is hardened.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminating apparatus and method for a substrate laminating apparatus, and a laminating apparatus and method for the same.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminating apparatus and method for a substrate laminating apparatus, and a substrate laminating apparatus and method using the same.

More particularly, the present invention relates to a method of manufacturing a liquid crystal display device, which is capable of changing the contact angle between the upper substrate and the laminating roll to be vertical while vertically moving the lower substrate while supporting the upper substrate in a tilted state, The possibility of bubbling between the upper substrate and the lower substrate is minimized or prevented, tack time is reduced, and expensive equipment such as a vacuum device for adsorbing the upper substrate is unnecessary, The present invention relates to a laminating apparatus and method for a substrate laminating apparatus in which the configuration is simplified, the cost is reduced, and the possibility of occurrence of a defect in the final product is greatly reduced, thereby improving the quality remarkably.

As the information society develops, the demand for a display device for outputting image information is diversified, and thus, a plasma display panel (PDP) and a liquid crystal display (LCD) are used to replace a conventional cathode ray tube (CRT). Many flat panel displays (FPDs) such as Liquid Crystal Display (FED), Field Emission Display (FED), Organic Light Emitting Diode (OLED), Monitor for PC, and Monitor for Tablet PC. Flat Panel Display) appeared.

Of the various FPDs described above, a PDP or an LCD, which is widely used from a mobile phone screen to a large-sized TV screen, is used as a typical flat panel display.

For example, in order to manufacture an LCD, preparing a thin film transistor array substrate (first substrate) having a thin film transistor generally; Preparing a color filter array substrate (second substrate) having a color filter layer; Bonding the first and second substrates together. In this case, the step of bonding the first and second substrates is performed by the substrate bonding apparatus.

As one example of the substrate sticking apparatus used in the prior art, a planar stage is used to fix the substrate. This stage includes a flat platen, an electrostatic chuck mounted to the platen, and a plurality of holes formed in the platen and disposed between the electrostatic chucks.

1 is a perspective view showing a base plate according to the prior art.

Referring to FIG. 1, the surface of a base 1 according to the prior art is formed in a planar structure, and a plurality of holes 2 are formed on the surface. The plurality of holes 12 transmit a vacuum force to attract and fix the substrate.

FIGS. 2A to 2E are views showing a method of attaching a substrate by using a substrate bonding apparatus having a planar stage according to the related art. Such a substrate bonding apparatus and a substrate bonding method with a planar stage according to the prior art are disclosed in Korean Patent Application No. 10-2006 (hereinafter, referred to as " substrate bonding apparatus and substrate bonding method " -0138217, filed on July 3, 2008, and Korean Patent Laid-Open No. 10-2008-0062424.

2A to 2E, in the conventional method of attaching a substrate, a first substrate 14a and a second substrate 14b are fixed to a planar upper stage 10 and a planar lower stage 20, respectively (See FIG. In this case, the first substrate 14a and the second substrate 14b are fixed to the stage by a vacuum force transmitted through a plurality of holes (see FIG. 1A) formed on the stage.

A seal layer 16 is formed on the first substrate 14a to fix the two substrates to each other and a liquid crystal 18 is dropped on the second substrate 14b.

Thereafter, the upper stage 10 is lowered to bring the first substrate 14a close to the second substrate 14b, and then the lower stage 20 is translated or rotated in the left and right and front and back directions to form the first substrate 14a And the second substrate 14b are aligned with each other (see FIG. 2B). In this case, use a turbo molecular pump (TMP) or a mechanical booster pump to make the surrounding environment a vacuum environment. When the ambient environment becomes a vacuum environment, the substrate is not fixed to the stage by the vacuum force. Therefore, the substrate is fixed by chucking the stage by the electrostatic force supplied from the electrostatic chuck mounted on the stage.

Thereafter, the first substrate 14a fixed to the upper stage is detached from the upper stage 10, and then the first substrate 14a and the second substrate 14b are attached to each other and the upper stage 10 is raised 2C). In this case, the process of detaching the coalesced substrate is performed by dechucking the coalesced substrate by removing the electrostatic force supplied from the electrostatic chuck. Thereafter, a stable gas such as N ₂ gas is used to uniformly pressurize the bonded substrate (see FIG. 2D). Thereafter, the seal layer 16 is cured by irradiating UV light 24 under the bonded substrate (see Fig. 2E).

All of the processes used in the above-described prior art substrate bonding method are performed under a vacuum environment such as a vacuum chamber.

Since the apparatus and method for bonding a substrate according to the related art described above must be performed under a vacuum environment, equipment such as a vacuum chamber, a vacuum pumping apparatus, an electrostatic chuck, and the like must be essentially used. Therefore, there is a problem that the configuration of the bonding apparatus is complicated, and the bonding process is increased to increase the total time and cost required for the bonding process.

Another conventional technique for solving the problems of the above-described prior art is disclosed in Korean Patent Application No. 10-2011-A, entitled " Glass substrate coalescence method and glass substrate cohesion apparatus " Korean Patent No. 10-1059952 (hereinafter referred to as " 952 patent ") filed as U.S. Patent Application No. 0044754, filed on August 22, 2011,

3A is a flow chart of a method of attaching a glass substrate according to yet another prior art 952 patent.

Referring to FIG. 3A, in the method of attaching a glass substrate according to the '952 patent, an optical clear adhesive (OCA) film is formed on a surface of a glass substrate of either the upper substrate 110 or the lower substrate 120, (S1); In step S1, the surface on which the optical adhesive film 130 is attached is transferred to one surface of the other glass substrate, and one end of the glass substrate contacts one surface of the other glass substrate before the other end; And a step S3 in which the optical adhesive film 130 is attached to another glass substrate by pressing a surface of the glass substrate on which the optical adhesive film 130 is not attached.

Further, in the method of attaching the glass substrate according to the 952 patent, the lower substrate 120 is seated on the lower stage 100. The upper substrate 110 is detachably adsorbed on the upper stage 200. In addition, the upper stage 200 is pressed using the rollers 221 provided on the upper surface of the upper stage 200. The roller 221 is coupled to a roller conveying unit (not shown) and can move up and down and left and right.

In the above-described method of attaching a glass substrate according to the '952 patent, when the upper substrate 110 comes into contact with one end of the lower substrate 120, the roller 221 is lowered by a roller transfer unit (not shown) So that the upper stage 200 is sequentially pressed to remove the air bubbles between the upper substrate 110 and the lower substrate 120.

The above-described method of attaching a glass substrate according to the 952 patent has an advantage that it is not necessary to use an expensive vacuum equipment, but the following problems still occur.

More specifically, in the method of attaching a glass substrate according to the '952 patent, a transparent optical adhesive (OCA) film 130 is used in lieu of a lacquer to bond the upper substrate 110 and the lower substrate 120 together. The optical adhesive film 130 is a double-sided adhesive film, one side of which is attached to the upper substrate 110 and the other side of which is attached to the lower substrate 120. In this case, when the optical adhesive film 130 adhered on the upper substrate 110 is adhered to the lower substrate 120 by using the rollers 221 after the upper substrate 110 is inclined with respect to the lower substrate 120 , Bubbles that may occur between the optical adhesive film (130) and the lower substrate (120) can be removed. However, since the optical adhesive film 130 itself must be attached to the upper substrate 110 in advance, the surface roughness of the surface of the optical adhesive OCA on the film 130 may cause a difference between the optical adhesive film 130 and the upper substrate 110 There is a high possibility that bubbles are generated. Accordingly, defects may occur in the substrate on which the upper substrate 110 and the lower substrate 120 are bonded.

When the substrate on which the bubbles are generated between the optical adhesive film 130 and the upper substrate 110 is defective, the upper substrate 110 and the lower substrate 120 are separated and then the optical adhesive film 130 is removed. The upper substrate 110 and the lower substrate 120 should be cleaned. Thereafter, the upper substrate 110 and the lower substrate 120 are bonded together using the new optical adhesive film 130 according to the above-described coalescence method. Alternatively, the final substrate on which the failure has occurred should be discarded. As a result, the process time (tact time) of the substrate bonding is increased or the cost is increased.

Further, in order to attract the upper substrate 110 in an inclined state, for example, an expensive vacuum device should be used to avoid mechanical interference with the roller 221 of the upper stage 200.

Further, in the method of attaching a glass substrate according to the '952 patent, there is a high possibility of bubbles between the upper substrate 110 and the lower substrate 120.

More specifically, FIG. 3B is a schematic view of the contact relationship between the roller and the upper substrate in the glass substrate bonding method shown in FIG. 3A.

Referring to FIG. 3B, after the upper substrate 110 is provided in an inclined state with respect to the lower substrate 120, the rollers 221 are advanced and joined together. In this case, the roller 221 has a relatively large inclined state with respect to the lower substrate 120 (for example, when the inclination angle is? 1), and the roller 221 contacts the upper substrate 110, The first contact point CA1 has an angle of? 1 in the vertical direction. Thereafter, as the laminating process proceeds, the roller 221 has a relatively small inclined state with respect to the lower substrate 120 (for example, when the inclination angle is &thetas; 2) The second contact point CA2 at which the upper substrate 110 contacts the upper substrate 110 has an angle of? 2 with respect to the vertical direction. Accordingly, the contact points of the rollers 221 contacting the upper substrate 110 are aligned with the vertical direction through the second contact point CA2 from the first contact point CA1 as the adhesion is progressed. As a result, since the contact point of the roller 221 contacting with the upper substrate 110 continuously changes and the force applied by the roller 221 to the upper substrate 110 is not maintained constant, The possibility of air bubbles is high.

Therefore, there is a need for a new method for solving the problems of the above-described prior art substrate sticking method.

Korean Patent Publication No. 10-2008-0062424 Korean Patent No. 10-1059952

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems described above, and it is an object of the present invention to provide a liquid crystal display device and a liquid crystal display device, The possibility of bubbling is minimized or prevented between the upper substrate and the lower substrate, the tack time is reduced, and the use of expensive equipment such as a vacuum device for adsorbing the upper substrate is unnecessary The present invention is to provide a laminating apparatus and method for a substrate laminating apparatus in which the possibility of occurrence of defects in the final product is greatly reduced and the quality is remarkably improved, and a substrate laminating apparatus and method having the same.

A laminating apparatus for a substrate cementing apparatus according to a first aspect of the present invention comprises: a gantry; A connecting member mounted to the gantry so as to be able to move up and down; A laminating member rotatably mounted on the connecting member and having a contact member in contact with the upper substrate at a lower portion thereof; And a support member for moving the upper substrate in a downward direction while supporting one side of the upper substrate in an inclined state, wherein the laminating member is variably controlled so that the contact angle between the upper substrate and the contact member contacts vertically. do.

According to a second aspect of the present invention, there is provided a substrate cohesive apparatus comprising: a movable stage on which a lower substrate is mounted; A fixed stage on which the movable stage is provided; A conveying member provided on the fixed stage and conveying the movable stage; A nozzle device for applying a liquor onto the lower substrate; A moving member for moving the upper substrate onto the lower substrate; A support member which is provided on the fixed stage and moves downward while supporting one side of the upper substrate in an inclined state; And a laminating device provided on the fixed stage and vertically pressing the upper substrate as the movable stage moves on the fixed stage.

According to a third aspect of the present invention, there is provided a laminating method comprising the steps of: a) supporting one side of an upper substrate in an inclined state on a supporting member; b) lowering a connecting member mounted on the gantry so as to vertically contact a contact member provided on a lower portion of the laminating member which is rotatably mounted on the connecting member, with the other side of the upper substrate; And c) varying the contact angle between the upper substrate and the contact member so as to vertically contact the upper substrate while moving the upper substrate downward using the support member as the upper substrate moves in the gantry direction And a control unit.

A method of attaching a substrate according to a fourth aspect of the present invention comprises the steps of: a) providing a lower substrate on a movable stage; b) applying the lacquer onto the lower substrate; c) moving the upper substrate on the lower substrate to support one side of the lower substrate in an inclined state on the supporting member; d) lowering a connecting member mounted on the gantry so that a contact member provided at a lower portion of the laminating member rotatably mounted on the connecting member is brought into contact with the other side of the upper substrate perpendicularly; And e) vertically pressing the upper substrate using the laminating member while moving the upper substrate downward using the support member as the movable stage moves in the gantry direction. do.

INDUSTRIAL APPLICABILITY The laminating apparatus and method for a substrate laminating apparatus according to the present invention and the substrate laminating apparatus and method using the same provide the following effects.

1. Bubble generation between the upper substrate and the lower substrate is minimized or prevented.

2. The tact time is reduced.

3. It is unnecessary to use expensive equipment such as a vacuum device for adsorbing the upper substrate, which simplifies the structure of the lid and reduces the cost.

4. Significantly improves the quality of the final product, greatly reducing the possibility of failure.

Further advantages of the present invention can be clearly understood from the following description with reference to the accompanying drawings, in which like or similar reference numerals denote like elements.

1 is a perspective view showing a base plate according to the prior art.
FIGS. 2A to 2E are views showing a method of attaching a substrate by using a substrate bonding apparatus having a planar stage according to the related art.
3A is a flow chart of another conventional method of bonding a glass substrate.
FIG. 3B is a view schematically showing the contact relationship between the roller and the upper substrate in the glass substrate bonding method shown in FIG. 3A.
4A and 4B are side views for explaining a laminating apparatus and method for a substrate laminating apparatus according to an embodiment of the present invention, and a substrate laminating apparatus and method therefor.
4C is a plan view showing a part of a laminating apparatus and a substrate laminating apparatus for a substrate laminating apparatus according to an embodiment of the present invention shown in Figs. 4A and 4B.
FIG. 4D is a view for explaining a descending speed of a plurality of support pins and a rotating speed of a laminating member in a laminating apparatus and a substrate laminating apparatus for a substrate laminating apparatus according to an embodiment of the present invention.
5A is a diagram showing a flowchart of a substrate bonding method according to the first embodiment of the present invention.
Fig. 5B is a flowchart showing a method of sticking a substrate according to a second embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described with reference to embodiments and drawings of the present invention.

4A and 4B are views for explaining a laminating apparatus and method for a substrate laminating apparatus according to an embodiment of the present invention and a substrate laminating apparatus and method therefor, FIG. 1 is a plan view showing a part of a laminating apparatus and a substrate laminating apparatus for a substrate laminating apparatus according to an embodiment of the present invention.

4A to 4C, a laminating apparatus 450 for a substrate cementing apparatus according to an embodiment of the present invention includes a gantry G; A connecting member 452 mounted on the gantry G in a liftable manner; A laminating member 454 rotatably mounted on the connecting member 452 and having a contact member 456 in contact with the upper substrate 410 at a lower portion thereof; And a supporting member 412 for moving the upper substrate 410 in a downward direction while supporting one side surface of the upper substrate 410 in an inclined state while the laminating member 454 is disposed between the upper substrate 410 and the contact member 456, So that the contact angle between the first and second electrodes is perpendicularly contacted.

In addition, the substrate adhesion apparatus 400 according to an embodiment of the present invention includes a movable stage 100 on which a lower substrate 420 is mounted; A fixed stage 102 on which the movable stage 100 is provided; A conveying member (104) provided on the fixing stage (102) for conveying the movable stage (100); A nozzle device 440 for applying a lid 430 on the lower substrate 420; A moving member (not shown) for moving the upper substrate 410 onto the lower substrate 420; A support member 412 provided on the fixed stage 102 for moving the upper substrate 410 in a downward direction while supporting one side of the upper substrate 410 in an inclined state; And a laminating apparatus 450 that is provided on the fixed stage 102 and vertically presses the upper substrate 410 as the movable stage 100 moves on the fixed stage 102. [ Here, the laminating apparatus 450 may be a laminating apparatus 450 for a substrate laminating apparatus according to an embodiment of the present invention. Reference character B denotes a base member to which the fixed stage 102 and the gantry G are mounted.

Hereinafter, a laminating apparatus and a substrate laminating apparatus for a substrate laminating apparatus according to an embodiment of the present invention will be described in detail.

4A to 4C, the substrate adhering apparatus 400 includes a movable stage 100 on which the lower substrate 420 is mounted and a fixed stage 102 on which the movable stage 100 is provided. The movable stage 100 can be transported on the movable stage 100 by the conveying member 104 provided on the fixed stage 102. [ The conveying member 104 may be implemented by, for example, a linear motion guide (LMG). Further, the movable stage 100 can be driven by, for example, the second driving member 460. [ The second driving member 460 may be implemented as a servo motor or a linear servo motor.

The substrate bonding apparatus 400 according to an exemplary embodiment of the present invention includes a nozzle device 440 for applying a bonding liquid 430 on a lower substrate 420. The nozzle device 440 may be implemented as a slit die nozzle, for example, and may be coated on the lower substrate 420 with the lid 430 thereon.

In addition, the substrate cohesive apparatus 400 according to an embodiment of the present invention may include a moving member (not shown) for moving the upper substrate 410 onto the lower substrate 420. The moving member (not shown) may be embodied as a robot arm or a pick-up element, for example. One side of the upper substrate 410 moved by the moving member (not shown) is positioned on the supporting member 412 and the other side of the upper substrate 410 is positioned on the lower substrate 420. Accordingly, the upper substrate 410 is supported in an inclined state on the lower substrate 420 by the supporting member 412. [

In addition, the substrate bonding apparatus 400 according to an embodiment of the present invention includes a laminating apparatus 450 provided on the fixing stage 102. The laminating apparatus 450 presses the upper substrate 410 vertically as the movable stage 100 moves on the fixed stage 102.

More specifically, the laminating apparatus 450 included in the substrate bonding apparatus 400 according to an embodiment of the present invention includes a gantry G. A connecting member 452 is mounted on the gantry G so as to be movable up and down. The elevation movement of the connecting member 452 may be performed by the first driving motor 451, for example. The first drive motor 451 may be implemented as a linear motor and a rotary motor, for example.

Further, a laminating member 454 is rotatably mounted on the connecting member 452. [ The lower portion of the laminating member 454 is provided with a contact member 456 which contacts the upper substrate 410. The contact member 456 has a round shape and may be embodied as an elastic member such as rubber.

In addition, the laminating apparatus 450 for a substrate cementing apparatus according to an embodiment of the present invention includes a support member 412 for supporting one side of the upper substrate 410 in an inclined state. The support member 412 moves the upper substrate 410, which is supported on one side in an inclined state, in a downward direction. At this time, as will be described in detail later, the contact angle between the upper substrate 410 and the contact member 456 is variably controlled so as to be vertically contacted.

Hereinafter, specific operations of the laminating apparatus and the substrate laminating apparatus for a substrate laminating apparatus according to an embodiment of the present invention will be described in detail.

Referring again to FIGS. 4A and 4B, in the substrate bonding apparatus 400 according to an embodiment of the present invention, a lower substrate 420 is provided on the movable stage 100 on the substrate 100. Thereafter, the nozzle device 440 covers the entire surface of the bonding liquid 430 on the lower substrate 420. Thereafter, the upper substrate 410 is moved onto the upper substrate 410 by a moving member (not shown) so that one side is positioned on the supporting member 412 and the other side of the upper substrate 410 is moved (420). At this time, the support member 412 may have a plurality of support pins 412a. Accordingly, when the upper substrate 410 is moved onto the lower substrate 420 by a moving member (not shown), the upper substrate 410 is supported in an inclined state by the plurality of support pins 412a.

The connecting member 452 mounted on the gantry G is lowered by the first driving motor 451 so that the contact member 456 provided on the laminating member 454 contacts the other side of the upper substrate 410 Vertically touch. Thereafter, the movable stage 100 is moved in the direction of the gantry G on the fixed stage 102 by the second drive motor 460. The plurality of support pins 412a on the support member 412 descend to a height substantially equal to the surface height of the lower substrate 420 while the movable stage 100 moves in the gantry G direction on the fixed stage 102 do. As a result, a bonded substrate in which the upper substrate 410 and the lower substrate 420 are laminated is obtained.

FIG. 4D is a view for explaining a descending speed of a plurality of support pins and a rotating speed of a laminating member in a laminating apparatus and a substrate laminating apparatus for a substrate laminating apparatus according to an embodiment of the present invention.

4d, in the laminating apparatus and the substrate bonding apparatus for a substrate bonding apparatus according to an embodiment of the present invention, the lowering speed vv of the plurality of support pins 412a = the horizontal moving speed vh of the lower substrate 420, x tan &thetas; Here, θ is an inclination angle formed by the upper substrate 410 and the lower substrate 420. The lowering speed vv of the plurality of support pins 412a is determined in advance by the horizontal moving speed vh of the upper substrate 410 and the inclination angle? Formed by the upper substrate 410 and the lower substrate 420, .

 As the plurality of support pins 412a are lowered, the laminating member 454 is vertically moved by the first driving member 451 in order to keep the contact angle between the contact member 456 and the upper substrate 410 to be vertical, (G) direction. The turning speed v? Of the laminating member 454 is given by the horizontal moving speed vh of the lower substrate 420 x tan? / L. The formula of the turning speed v? Of the laminating member 454 is an approximate value applied when the inclination angle? Is a very small value (in fact, the inclination angle? Is in the range of about 3 to 5 degrees). Here, L is a moving direction length of the lower substrate 420. The turning speed v? Of the laminating member 454 can also be predetermined by the horizontal moving speed vh of the upper substrate 410, the inclination angle?, And the length L of the upper substrate 410 . The contact member 456 is rotated by the rotation of the laminating member 454 even when the inclination angle? Between the upper substrate 410 and the lower substrate 420 is reduced by the movement of the movable stage 100 in this manner, 410 can be kept perpendicular to the contact angle. Accordingly, the force applied by the contact member 456 to the upper substrate 110 is kept constant so that the possibility of bubbling between the upper substrate 410 and the lower substrate 420 is minimized or prevented.

Although the case where the lower substrate 420 is mounted on the movable stage 100 and moves in the direction of the gantry G is disclosed in the substrate sticking apparatus 400 according to the embodiment of the present invention, It will be appreciated that the present invention can be applied to a case in which the gantry 100 and the gantry 102 are relatively moved in directions relatively close to each other.

The gantry G may move in the direction of the lower substrate 420 while the movable stage 100 on which the lower substrate 420 is mounted is stopped, It will be understood by those skilled in the art that the gantry G can be applied to both the movable stage 100 and the gantry G in which the movable stage 100 and the gantry G are mounted.

5A is a flow chart of a laminating method according to an embodiment of the present invention.

Referring to FIG. 5A, with reference to FIGS. 4A through 4C, a laminating method 500 according to an embodiment of the present invention includes the steps of: a) supporting one side of the upper substrate 410 in an inclined state on a supporting member 412 Step 510; b) Lowering the connecting member 452 mounted on the gantry G and bringing the contact member 456 provided below the laminating member 454 rotatably mounted on the connecting member 452 into contact with the upper substrate 410 Gt; 520 < / RTI > And c) moving the upper substrate 410 in a downward direction using the support member 412 as the upper substrate 410 moves in the direction of the gantry G, And varying the contact angle between the contact members 456 such that the contact angle is vertically contacted (step 530).

In the step a) of the laminating method 500 according to an embodiment of the present invention, the inclined state of the upper substrate 410 is supported by a plurality of support pins 412a provided on the support member 412 .

In the laminating method 500 according to the embodiment of the present invention, the descending speed vv of the plurality of support pins 412a is given as the horizontal moving speed vh of the lower substrate 420 x tan? And the horizontal movement speed vh of the lower substrate 420 is expressed by x tan? / L, and? Is the rotation speed of the laminating member 454, ), And L is a moving direction length of the lower substrate 420.

FIG. 5B is a flowchart showing a method of sticking a substrate according to an embodiment of the present invention. FIG.

Referring to FIG. 5B, with reference to FIGS. 4A-4C, a substrate adhering method 501 according to one embodiment of the present invention includes the steps of: a) providing (510) a lower substrate 420 on a movable stage 100; b) applying (520) the liquor (430) onto the lower substrate (420); c) moving 530 the upper substrate 410 onto the lower substrate 420 to support one side of the lower substrate 420 on the supporting member 412 in an inclined state 530; d) Lowering the connecting member 452 mounted on the gantry G and bringing the contact member 456 provided below the laminating member 454 pivotally mounted on the connecting member 452 into contact with the upper substrate 410 (Step 540); And e) moving the upper substrate 410 in a downward direction using the support member 412 as the movable stage 100 moves in the direction of the gantry G while using the laminating member 454 And pressing the upper substrate 410 vertically (550).

In the step e) of the substrate bonding method 501 according to an embodiment of the present invention, the laminating member 454 is arranged such that the contact angle between the upper substrate 410 and the contact member 456 is perpendicular .

In the step c) of the substrate bonding method 501 according to an embodiment of the present invention, the inclined state of the upper substrate 410 may be formed by a plurality of support pins 412a provided on the support member 412, As shown in FIG.

In the substrate bonding method 501 according to an embodiment of the present invention, the lowering speed vv of the plurality of support pins 412a is given as the horizontal moving speed vh of the lower substrate 420, (Vh) x tan? / L of the upper substrate 410 and the lower substrate 420, and the rotation speed v? Of the laminating member 454 is given by the horizontal moving speed vh x tan? / L of the lower substrate 420, 420), and L is a moving direction length of the lower substrate (420).

Various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention as defined by the following claims. It is not. Accordingly, the scope of the present invention should not be limited by the above-described exemplary embodiments, but should be determined only in accordance with the following claims and their equivalents.

1: Platen 2: Hole 10, 20, 100, 200: Stage 14a, 14b, 110, 120,
16: seal layer 18: liquid crystal 102: fixed stage 104:
130: optical adhesive film 221: roller 400: substrate bonding device 412: support member
412a: support pin 430: lapping liquid 440: nozzle device 450: laminating device
451, 460: driving member 452: connecting member 454: laminating member
456: contact member B: base member G: gantry

Claims (16)

A laminating apparatus for a substrate cementing apparatus,
Gantry;
A connecting member mounted to the gantry so as to be able to move up and down;
A laminating member rotatably mounted on the connecting member and having a contact member in contact with the upper substrate at a lower portion thereof; And
A supporting member for supporting the upper substrate in a downward direction while supporting one side surface of the upper substrate in an inclined state,
, ≪ / RTI &
The laminating member is variably controlled so that the contact angle between the upper substrate and the contact member contacts vertically
A laminating apparatus for a substrate cementing apparatus. The method of claim 1,
Wherein the laminating apparatus for the substrate cementing apparatus further comprises a linear and rotary motor for driving the elevating movement of the connecting member and the rotation of the laminating member. The method of claim 1,
Wherein the contact member is embodied as an elastic member having a round shape. 4. The method according to any one of claims 1 to 3,
Wherein the inclined state of the upper substrate is formed by a plurality of support pins provided on the support member. In the substrate bonding apparatus,
A movable stage on which the lower substrate is mounted;
A fixed stage on which the movable stage is provided;
A conveying member provided on the fixed stage and conveying the movable stage;
A nozzle device for applying a liquor onto the lower substrate;
A moving member for moving the upper substrate onto the lower substrate;
A support member which is provided on the fixed stage and moves downward while supporting one side of the upper substrate in an inclined state; And
A laminating device provided on the fixed stage and vertically pressing the upper substrate as the movable stage moves on the fixed stage,
Substrate bonding apparatus comprising a. 6. The method of claim 5,
The substrate cementing apparatus
A first driving member for driving up and down movement of the connecting member and rotation of the laminating member; And
A second driving member for driving the movable stage,
Further comprising: 6. The method of claim 5,
Wherein the conveying member is implemented as a linear motion guide,
The nozzle member is implemented as a slit die nozzle,
The moving member may be a robot arm or a pickup member
Substrate bonding device. 6. The method of claim 5,
Wherein the contact member is embodied as an elastic member having a round shape. 9. The method according to any one of claims 5 to 8,
Wherein the inclined state of the upper substrate is formed by a plurality of support pins provided on the support member. In the laminating method,
a) supporting one side of the upper substrate in an inclined state on a supporting member;
b) lowering a connecting member mounted on the gantry so as to vertically contact a contact member provided on a lower portion of the laminating member which is rotatably mounted on the connecting member, with the other side of the upper substrate; And
c) moving the upper substrate downward using the support member as the upper substrate moves in the gantry direction, and variably controlling the contact angle between the upper substrate and the contact member to be perpendicular to each other
≪ / RTI > The method of claim 10,
Wherein in the step a), the inclined state of the upper substrate is formed by a plurality of support pins provided on the support member. 12. The method of claim 11,
The lowering speed vv of the plurality of support pins is given by the horizontal moving speed vh of the lower substrate x tan?
The turning speed v? Of the laminating member is given by the horizontal moving speed vh of the lower substrate x tan? / L,
Is an inclination angle between the upper substrate and the lower substrate,
L is a length in a moving direction of the lower substrate
Laminating method. In the method for bonding a substrate,
a) providing a lower substrate on a movable stage;
b) applying the lacquer onto the lower substrate;
c) moving the upper substrate on the lower substrate to support one side of the lower substrate in an inclined state on the supporting member;
d) lowering a connecting member mounted on the gantry so that a contact member provided at a lower portion of the laminating member rotatably mounted on the connecting member is brought into contact with the other side of the upper substrate perpendicularly; And
e) vertically pressing the upper substrate with the laminating member while moving the upper substrate downward using the support member as the movable stage moves in the gantry direction
≪ / RTI > 14. The method of claim 13,
Wherein in the step (e), the laminating member is variably controlled such that a contact angle between the upper substrate and the contact member is vertically contacted. 14. The method of claim 13,
In the step c), the inclined state of the upper substrate is formed by a plurality of support pins provided on the support member. 16. The method of claim 15,
The lowering speed vv of the plurality of support pins is given by the horizontal moving speed vh of the lower substrate x tan?
The turning speed v? Of the laminating member is given by the horizontal moving speed vh of the lower substrate x tan? / L,
Is an inclination angle between the upper substrate and the lower substrate,
L is a length in a moving direction of the lower substrate
/ RTI >

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