WO2005098522A1

WO2005098522A1 - Adhesive chuck device

Info

Publication number: WO2005098522A1
Application number: PCT/JP2005/006925
Authority: WO
Inventors: Yoshikazu Ohtani; Michiya Yokota
Original assignee: Shin-Etsu Engineering Co., Ltd.
Priority date: 2004-04-09
Filing date: 2005-04-08
Publication date: 2005-10-20
Also published as: KR100869088B1; TWI364576B; TW200606501A; JP3882004B2; JPWO2005098522A1; KR20060133942A; CN1777832A; CN1777832B

Abstract

A board is surely mounted and removed by a simple structure. On a board side of a holding plate (1), an adhesive member (3) for adhering and holding a board (A) by facing a rear plane (A1) of the board, and a deforming film (4) which can deform by protruding and receding in a direction crossing a plane (1a) on the board side are provided. An adhesive surface (3a) of the adhesive member (3) and the board (A) are abutted and adhered by the protruding and receding deformation of the deforming film (4), and the board (A) is peeled from the adhesive surface (3a) of the adhesive member (3) without difficulty by forcibly separating the both.

Description

Adhesive chuck device

Technical field

The present invention relates to a process for manufacturing a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP), for example, by using a glass substrate such as CF glass or TFT glass or a synthetic resin substrate. The present invention relates to a substrate assembling device including a substrate bonding machine for holding and bonding an adhesive, and an adhesive chuck device used for a substrate transfer device for transferring a substrate.

More specifically, the present invention relates to an adhesive chuck device for holding a substrate detachably with an adhesive on a holding plate.

Background art

[0002] Conventionally, in a substrate bonding machine in which two substrates are overlapped, a substrate is held by an electrostatic chuck. However, with the recent enlargement of the substrate, a large-sized electrostatic chuck has been manufactured. It became difficult, and even if it could be manufactured, it was very expensive.

In order to solve these problems, there is an adhesive chuck device using an adhesive material for holding a substrate.

As one example of such an adhesive chuck device, an upper substrate is attached to and held on an adhesive sheet stretched freely over a pair of rollers, and then the upper substrate and the lower substrate are attached to each other. By driving the plurality of motors to rotate the spindle and wind the adhesive sheet, the spindle and one of the rollers are horizontally moved in the same winding direction at a speed synchronized with the winding speed. There is a type in which an adhesive sheet is gradually peeled off from the upper surface of an upper substrate (for example, see Patent Document 1).

Then, instead of the above-mentioned winding of the adhesive sheet by the spindle, after the two substrates are bonded to each other to form a cell, a plurality of actuators are driven to move the cutter base and the cutter base to the lower end of the cutter blade by the plurality of actuators. After moving the cutter to the position, the cutter is moved in the width direction of the adhesive sheet to cut the adhesive sheet with the upper substrate attached, and the cell is taken out with the adhesive sheet attached. Cell force is also adhesive And strip it off.

As still another example, a plurality of openings are provided in the upper pressure plate, actuators are respectively provided in these openings, and an adhesive member is attached to the tip of a shaft extending downward from each actuator in a downward force, The adhesive member is lowered in the opening by the operation of the actuator, and when the lower surface of the adhesive member contacts the upper substrate, the adhesive member holds the lower surface of the adhesive member in close contact with the lower surface of the pressure plate. Upper substrate force When peeling the adhesive, when the adhesive is raised in the opening by an actuator, the periphery of the opening prevents the upper substrate from moving and separates the upper substrate from the adhesive member ( For example, see Patent Document 2).

In addition, a plurality of openings are provided in the upper pressurizing plate, and a rotating actuator and an up / down driving actuator are provided in these openings, and the tip of the rotating shaft extending downward from each rotating actuator is provided. The members are attached, each adhesive member is lowered in the opening by the operation of the actuator for vertical drive, the upper substrate is held by suction and suction with these adhesive members, and bonded while positioning, and the adhesive members are placed in the pressure plate. When the adhesive member is retreated, the adhesive member may be retreated by a vertical actuator while twisting the adhesive member with respect to the substrate surface by a rotating actuator, or the adhesive substrate may be peeled off by an up-down driving actuator (for example, a patent). Reference 3).

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2001-133745 (Pages 3-5, Figures 1-7)

Patent Document 2: JP-A-2003-241160 (page 5, FIG. 7)

Patent Document 3: Japanese Patent Application Laid-Open No. 2003-273508 (Page 5, FIG. 1-5)

Disclosure of the invention

Problems to be solved by the invention

However, in such a conventional adhesive chuck device, in the case of Patent Document 1, in order to peel off the adhesive member and the substrate, the adhesive sheet is wound while winding the adhesive sheet at a speed synchronized with the winding speed. Force to move horizontally in the picking direction or raise the cutter base and cutter base to cut the adhesive sheet with the cutter, and each operation requires many drive sources such as multiple motor actuators. There was a problem that the structure was complicated.

Further, in the case of Patent Document 2, a plurality of actuators are required for each of the adhesive members in order to raise the adhesive member in the opening of the pressure plate, and in the case of Patent Document 3, However, there has been a problem that a rotating actuator and a vertical driving actuator for retreating while twisting the adhesive member are required for each adhesive member, and the structure is complicated.

Therefore, Patent Documents 1 to 3 are not only high in the rate of occurrence of failures but also in a substrate assembling apparatus or a substrate transporting apparatus including a substrate bonding machine because the peeling structure is particularly complicated. There has been a problem that it is difficult to replace an existing substrate holding mechanism such as an electrostatic chuck with the adhesive chuck device of the present invention.

An object of the present invention described in claim 1 is to reliably attach and detach a substrate with a simple structure.

The invention described in claim 2 aims at easily manufacturing the substrate adhesive structure in addition to the object of the invention described in claim 1.

The invention described in claim 3 aims at further simplifying the entire structure in addition to the object of the invention described in claim 1 or 2.

The invention described in claim 4 has the object of securely holding a substrate while easily realizing a suction piping system and suction control, in addition to the object of the invention described in claim 2 or 3. .

Means for solving the problem

[0006] In order to achieve the above-mentioned object, an invention according to claim 1 of the present invention provides an adhesive member for holding an adhesive on a substrate side of a holding plate in opposition to the back surface of the substrate and intersecting the side surface of the substrate. A deformable film that can be deformed in and out in the direction in which the adhesive film is formed, and the adhesive surface is brought into contact with the substrate by the deformed deformation of the deformable film, and the two are forcibly separated from each other and peeled off. Is what you do.

The invention according to claim 2 is characterized in that a configuration in which the adhesive member and the deformable film are integrally formed is added to the configuration of the invention according to claim 1.

A third aspect of the present invention is characterized in that a configuration in which an adhesive surface of an adhesive member is provided on a part of the deformable film is added to the configuration of the first or second aspect of the invention.

The invention according to claim 4 is characterized in that, in addition to the structure of the invention according to claim 2 or 3, a ventilation hole is opened in a part of the plate-like body, and a structure in which the back surface of the substrate has a suction force is added. It is characterized by.

The invention's effect

[0007] The invention according to claim 1 of the present invention is directed to an adhesive member that is provided on the substrate side of the holding plate and that is adhesively held opposite to the back surface of the substrate, and a deformable film that can be deformed in a direction intersecting the side surface of the substrate. The substrate is separated from the adhesive surface of the adhesive member without force by bringing the substrate into contact with the adhesive surface of the adhesive member and sticking the substrate by the deformation of the deformable film. You.

Therefore, the substrate can be reliably attached and detached with a simple structure.

As a result, since the peeling structure is particularly simple compared to the conventional one that requires a large number of drive sources such as a motor actuator to peel off the adhesive member and the substrate, the rate of occurrence of failures can be significantly reduced. When it is installed in a substrate assembling device or a substrate transporting device including a aligner, the existing substrate holding mechanism such as an electrostatic chuck can be easily replaced with the adhesive chuck device of the present invention, resulting in a significant increase in manufacturing costs. A great reduction can be achieved. Another advantage is that static electricity is not spontaneously generated because the substrate is not held by electrostatic attraction.

[0008] The invention of claim 2 provides the effect of the invention of claim 1, and furthermore, by forming the adhesive member and the deformable film integrally, the adhesive member and the deformable film can be simply arranged on the substrate side of the holding plate. Are placed at the same time.

Therefore, the substrate adhesive structure can be easily manufactured.

[0009] The invention of claim 3 provides, in addition to the effect of the invention of claim 1 or 2, the arrangement of the adhesive surface of the adhesive member on a part of the deformable film, thereby making the substrate side of the holding plate a deformable film. The adhesive surface of the adhesive member is arranged at the same time simply by covering with the cover.

Therefore, the overall structure can be further simplified.

As a result, since there is no need to cut and paste an adhesive member separately from the deformable film, it can be manufactured at low cost in a short time and is suitable for mass production.

Further, when the adhesive surface of the adhesive member is integrally formed flush with the surface of the deformable film, no step is generated between the adhesive surface and the surface of the deformable film. When a pair of substrates are bonded together, these substrates can be pressed uniformly without distortion. Other adverse effects that can be minimized can be minimized.

[0010] The invention of claim 4 is based on the effect of the invention of claim 2 or 3, by opening air holes in a part of the plate-like body, and by suction-adsorbing the back surface of the substrate. In addition, the adhesive holding by the adhesive member and the holding by vacuum suction are used together.

Therefore, it is possible to securely hold the substrate while easily realizing the suction piping system and the suction control.

BEST MODE FOR CARRYING OUT THE INVENTION

[0011] The adhesive chuck device of the present invention shows a case where it is provided in a substrate bonding machine for bonding and holding a glass substrate such as a liquid crystal display (LCD) panel.

In this substrate bonding machine, two glass substrates A and B are respectively held on holding surfaces la and 2a of the holding plates 1 and 2 which are arranged vertically as shown in FIGS. After the inside of the closed space S defined around them reaches a predetermined degree of vacuum, the upper and lower holding plates 1 and 2 are relatively moved in the ΧΥ Θ direction to adjust the positions of the substrates A and B. After that, the upper substrate A is forcibly peeled off from the holding surface la of the upper holding plate 1 and momentarily press-bonded to the annular bonding agent (sealant) C on the lower substrate B, whereby Then, the substrates A and B are pressurized to a predetermined gap by a pressure difference generated between the inside and outside of the substrates A and B.

More specifically, the upper and lower holding plates 1 and 2 are supported by elevating means (not shown) so as to be relatively movable in the Z direction, and the upper and lower holding plates 1 and 2 are vertically separated from each other. Then, the substrates A and B are set on the respective holding surfaces la and 2a, and then the upper and lower holding plates 1 and 2 are brought close by the operation of the lifting / lowering means, thereby forming a closed space S.

[0013] Then, when air is evacuated from the closed space S by the operation of the suction means (not shown) and a predetermined degree of vacuum is reached, the horizontal movement means (not shown) activates the upper and lower holding plates 1. , 2 is adjusted in the XY 0 direction with respect to the other, so that rough alignment and fine alignment are sequentially performed as alignment (alignment) between the substrates A and B held thereon.

After these alignments are completed and the upper and lower substrates A and B are overlaid, air or nitrogen is supplied into the closed space S to return the atmosphere in the closed space S to the atmospheric pressure. , Both substrates A , And B are evenly pressurized by the pressure difference between the inside and outside, and crushed up to a predetermined gap with the liquid crystal sealed therein to complete the product.

[0015] Further, the adhesive chuck device of the present invention is provided on the substrate side of the holding plates 1 and 2.

More specifically, as shown in FIGS. 1, 3 and 5, one or both of the holding surfaces la and 2a on the substrate side of the upper and lower holding plates 1 and 2 are provided with the back surface Al of the substrates A and B. , B1 and an adhesive member 3 and 3 'for holding the adhesive, and a deformable deformable film 4 in a direction intersecting the holding surfaces la and 2a on the substrate side. ) The adhesive surfaces 3a, 3a 'of the adhesive members 3, 3' are brought into contact with the substrates A, B by deformation, and the substrates A, B are adhered. The substrates A and B are easily peeled off.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Example 1

In the first embodiment, as shown in FIGS. 1 and 2, the upper and lower holding plates 1 and 2 are formed into a flat plate having a thickness without being deformed (radially) deformed by a rigid body such as metal or ceramics. A platen 4 ′ composed of a plurality of adhesive members 3 and a plurality of deformable films (pressing films) 4 covers only the substrate side of the upper holding plate 1, and these deformable films are formed. 4 shows a case where the upper substrate A is forcibly separated from the adhesive surface 3a of the adhesive member 3 by projecting (protruding) and deforming the upper holding plate 1 from the substrate side of the upper holding plate 1 by pressing. .

The holding surface la of the upper holding plate 1 is provided with a plurality or a single concave portion lb, and the concave portion lb and an intake source (not shown) such as a vacuum pump or a compressor are connected to the ventilation passage lc. The gas in the concave part lb is supplied and exhausted to the outside by the operation of the intake source, the adhesive member 3 is detachably fixed around the concave part lb, and the opening of the concave part lb is deformed by the deformable film 4. It is covered.

In the illustrated example, as shown in FIG. 2, a large number of circular recesses lb are provided on the holding surface la of the upper holding plate 1 via partition walls Id arranged at substantially equal intervals. These openings are hermetically covered with a single deformable film 4, and the deformable film 4 is superimposed on the surface of the deformable film 4 at a position corresponding to the tip end surface of the partition wall Id to form an annular adhesive member 3. Is fixed.

The adhesive member 3 also has an adhesive material such as a silicon-based, acrylic-based, or fluorine-based adhesive. It is desirable to dispose the adhesive surface 3a as close as possible to the deformable film 4 to be described later, and furthermore, the area of the adhesive surface 3a is adjusted so that the upper substrate A can suspend the adhesive sheet. It is desirable that the pressure-sensitive adhesive member 3 be set small within the range having the above, and that the adhesive member 3 be easily removably attached.

In the case of the illustrated example, the adhesive force of the adhesive surface 3a of the adhesive member 3 that comes into contact with the glass substrate A is changed by the adhesion that comes into contact with the deformable film 4 disposed on the holding surface la side of the upper holding plate 1. The adhesive force of the back surface 3b is weaker than the adhesive force of the back surface 3b, and the adhesive member 3 on the holding surface la side does not peel off due to its weight when adhering to the substrate A. Peelable.

The plate-like body 4 ′ and the deformable film 4 are made of, for example, a thin metal plate such as stainless steel, a synthetic resin such as rubber or engineering plastic, or a sheet molded of a non-conductive material. An elastically deformable diaphragm, which is adhered to the tip end surface of the partition wall Id by, for example, welding such as electron beam welding or by an adhesive material, and exhausts gas from the inside of each concave portion lb to the outside through the air passage lc. This deforms the deformed film 4 radially so as to be depressed into each concave portion lb, and conversely supplies an external force gas into each concave portion lb, thereby deforming the deformable film 4 into each concave portion lb. Opening force Radially deformed to protrude.

Further, the method of attaching the plate-like body 4 ′ is not limited to the above-described welding or bonding with an adhesive, and for example, a holding plate (not shown) may be screwed on the partition Id between the recesses lb. The plate-shaped member 4 'may be detachably held between the tip end surface of the partition wall Id and the holding plate.

If necessary, small holes 4a may be formed in the deformable film 4 at positions substantially corresponding to the centers of the concave portions lb as shown in FIG.

Next, the operation of the substrate bonding machine will be described.

First, the upper and lower substrates A and B are set on the respective holding surfaces la and 2a in a state where the upper and lower holding plates 1 and 2 are vertically separated as shown in FIG. 1 (a). By evacuating and depressurizing the inside of the concave portion lb formed on the holding surface la of 1, the deformable film 4 is bent in a concave shape.

In this state, the upper substrate A is transferred by a substrate transfer robot (not shown),

Move A1 toward the holding surface la of the upper holding plate 1 and apply a predetermined pressure to the adhesive surface 3a of the adhesive member 3. , The upper substrate A is held by the adhesive force of the adhesive surface 3a.

[0026] Further, as shown in FIG. 2, when small holes 4a are formed in the deformable film 4 corresponding to the respective concave portions lb,

If vacuum suction is performed through these small holes 4a, the upper substrate A is more strongly suction-held.

After that, as shown in FIG. 1 (b), the upper and lower holding plates 1 and 2 approach to each other and the inside of the closed space S reaches a predetermined degree of vacuum, and then one of the upper and lower holding plates 1 and 2 is connected to the other. Is adjusted in the XY 0 direction, and the substrates A and B held by them are aligned.

[0028] After this alignment is completed, gas is introduced into the concave portion lb formed on the holding surface la of the upper holding plate 1 as shown in FIG. The pressure is applied from the side to bend into a convex shape, and the tip is made to protrude from the adhesive surface 3a of the adhesive member 3.

[0029] Thereby, the upper substrate A, which is adhesively held on the adhesive surface 3a of the adhesive member 3, is forcibly separated, and the upper substrate A is easily peeled off from the adhesive surface 3a of the adhesive member 3 at the same time. The upper substrate A is pressed against the circular adhesive C on the lower substrate B with the projecting pressure of the deformable film 4 and overlapped.

At this time, when the small holes 4 a are formed in the deformable film 4, a gas such as nitrogen gas is blown out from the small holes 4 a to the back surface A 1 of the upper substrate A, thereby forming the adhesive member 3. The adhesive surface 3a also forcibly peels off the upper substrate A and instantaneously presses against the circular adhesive C on the lower substrate B, thereby sealing between the two.

Therefore, the upper and lower substrates A and B made of glass can be uniformly pressed together in a vacuum without distortion, and the pressing force can be easily changed.

[0031] Since the substrate side of the upper holding plate 1 is covered with the plurality of adhesive members 3 and the plurality of deformable films 4 in a plate-like body 4 ', a plurality of portions of the upper substrate A are simultaneously adhesively held. At the same time, simultaneous peeling is possible, and even if the upper substrate A is large, it can be reliably held and peeled.

Further, since the adhesive member 3 and the deformable film 4 are arranged as close to each other as possible, when the upper substrate A made of glass is peeled off from the adhesive surface 3a by the projecting pressure of the deformable film 4, the upper substrate A Since a part does not bend greatly, there is no problem that the upper and lower substrates A and B, which have been aligned, are misaligned or the annular adhesive C for sealing the liquid crystal is cut.

[0033] Further, since the area of the adhesive member 3 is set to be small, the upper substrate made of glass is separated from the adhesive surface 3a. When peeling A, a large force is not required, preventing accidents such as breakage of the glass, and the adhesive member 3 is attached so that it can be easily replaced, so that the adhesive contact and separation of the upper substrate A are repeated. Although there is a concern that the adhesion may cause the adhesion of foreign matter or a decrease in the adhesive strength, the problem can be solved by replacing the adhesive member 3 in this case.

Example 2

In the second embodiment, as shown in FIGS. 3 and 4, a plurality of ventilation holes le extend from the partition wall Id formed on the holding surface la of the upper holding plate 1 to the adhesive member 3 and the deformable film 4. And a ventilation path If connecting these ventilation holes le and an intake source (not shown) such as a vacuum pump or a compressor is formed in a different system from the ventilation path lc of the recess lb. However, unlike the first embodiment shown in FIGS. 1 and 2, the other configuration is the same as that of the first embodiment shown in FIGS.

With the above configuration, when the upper substrate A is set on the holding surface la of the upper holding plate 1 as shown in FIG. As shown in Fig. 3 (c), when the substrates A and B are peeled off from each other after being aligned, the gaseous material such as compressed air or nitrogen gas is blown out from the ventilation holes le to form the adhesive member 3. The upper substrate A is forcibly peeled off from the adhesive surface 3a of the lower substrate B with a stronger force and is instantaneously pressed to the annular adhesive C on the lower substrate B.

As a result, Example 2 shown in FIGS. 3 and 4 has the same operation and effect as Example 1 shown in FIGS. 1 and 2 described above, and furthermore, the upper substrate A by the adhesive member 3 of Example 1 is obtained. In addition to the adhesive holding, the vacuum suction holding of the upper substrate A by suction from the ventilation hole le is added, so that the upper substrate A is more secure while the configuration of the suction piping system and the suction control are easy to realize. In addition to this, there is an advantage that the displacement of the upper substrate A due to the unevenness in the projected pressure of the deformable film 4 can be completely prevented.

Example 3

In the third embodiment, instead of the above-described annular adhesive member 3 as shown in FIGS. 5 and 6, an adhesive member 3 ′ is provided on a part of the deformable film 4. A plate-like body 4 composed of a plurality of deformable films 4 and an adhesive member 3 ′ is configured. The plate-like body 4 covers the substrate side of the upper holding plate 1. Adhesive surface 3 of member to upper substrate A, and the adhesive film 3 is forcedly separated by making the deformable film 4 immerse (concave) and deform under reduced pressure on the substrate side of the upper holding plate 1 to force the adhesive surface 3 of the adhesive member to the upper substrate A force. The configuration for peeling off is different from the embodiment 1 shown in FIGS. 1 and 2 and the embodiment 2 shown in FIGS. 3 and 4, and other configurations are the same as those of the embodiment 1 shown in FIGS. 1 and 2. This is the same as the embodiment 2 shown in FIGS.

As a method of disposing the adhesive member 3 ′ on a part of the deformable film 4, a surface treatment of the deformable film 4 made of an elastic material or a process similar thereto is performed so that the surface of the deformable film 4 is processed. The pressure-sensitive adhesive surface 3 is formed integrally with the surface of the deformable film 4 at the desired position only, or is provided integrally, thereby forming a plate-like body 4.

The shape of the plate-like body 4 is not limited to the flat plate-like shape shown in the drawing, and the deformed film 4 is partially recessed into the concave portion lb formed on the holding surface la of the upper holding plate 1. It does not need to be completely flat.

In the case of the illustrated example, the circular adhesive surface 3 is partially formed substantially at the substantially center position of the deformable film 4. However, if the back surface A 1 of the upper substrate A can be securely held, other than that, It is also possible to have a shape of.

Further, in the illustrated example, the above-described small holes 4a are not perforated in the deformable membrane 4, but if necessary, similarly to those shown in FIG. 2 of the first embodiment and FIG. It is also possible to penetrate the small holes 4a at substantially the center positions of the holes.

With the above configuration, gas is introduced into the concave portion lb formed on the holding surface la of the upper holding plate 1 as shown in FIGS. When the adhesive surface 3 of the adhesive member is brought into contact with the upper substrate A by applying pressure from the side to bend into a convex shape, the upper substrate A is held by the adhesive force.

[0040] After the upper and lower substrates A and B are overlapped, the atmosphere in the closed space S is returned to the atmospheric pressure, and then the pressure in the concave portion lb is reduced by evacuation as shown in Fig. 5 (c). As a result, if the deformed membrane 4 is bent into a concave shape and the adhesive surface 3 of the adhesive member 3 ′ is immersed in the concave portion lb,

Then, the adhesive surface 3 is forcibly separated from the upper substrate A.

At the same time, if gas such as compressed air or nitrogen gas is blown out from the vent hole le,

Thus, the upper substrate A can be forcibly peeled off with a stronger force. As a result, in the third embodiment shown in FIGS. 5 and 6, the same operational effects as those in the first embodiment shown in FIGS. 1 and 2 and the second embodiment shown in FIGS. Further, since the adhesive surface 3 of the adhesive material is provided on a part of the deformable film 4, the holding surface la on the substrate side of the upper holding plate 1 and the entire concave portion lb are simply covered with the plate-shaped body 4 '. 3 ′ adhesive members 3 ′ are arranged at the same time, which further simplifies the overall structure of the adhesive chuck device, and cuts and adheres the adhesive members 3 separately from the deformable film 4 as in the first and second embodiments. There is an advantage that it can be manufactured at low cost and in a short time because there is no need.

When the adhesive surface 3 of the adhesive member 3 ′ is integrally formed flush with the surface of the deformable film 4 by surface treatment or the like, a step is formed between the adhesive surface 3 and the surface of the deformable film 4. Therefore, when bonding the upper and lower substrates A and B, the substrates A and B can be crimped uniformly without distortion, and other adverse effects that can be minimized can be minimized. .

Although the adhesive chuck device of the present invention has been described as being applied to a substrate bonding machine for bonding and holding a glass substrate such as a liquid crystal display (LCD) panel, the present invention is not limited to this. It may be installed in a substrate assembling device other than this substrate bonding machine, a substrate transport device that transports substrates, or may hold substrates other than glass substrates for LCD panels by adhesion. Although the substrate bonding machine for bonding has been described, the present invention is not limited to this, and the substrate bonding machine for bonding the substrates A and B in the air can be used. Is obtained.

Further, in the above-described embodiment, the adhesive member 3 and the deformable film 4 are arranged only on the holding surface la, which is the substrate side of the upper holding plate 1. Similarly, the holding surface 2a may be provided with an adhesive member 3 for holding and holding the lower substrate B by being opposed to the back surface B1, and a deformable film 4 elastically deformable in the vertical direction may be provided.

Further, a large number of circular concave portions lb are formed in the holding surface la of the upper holding plate 1, and the force of covering the openings of all the concave portions lb with a single plate-like body 4 ', " The shape of the concave portion lb is not limited to a circular shape, and each concave portion lb may be separately covered with a plurality of deformation films 4. Brief Description of Drawings

FIG. 1 is a partial longitudinal front view showing an embodiment 1 of an adhesive chuck device of the present invention, and its operation steps are shown in (a) to (c).

FIG. 2 is a partial cross-sectional bottom view taken along the line (2)-(2) in FIG. 1.

FIG. 3 is a partial longitudinal front view showing Embodiment 2 of the adhesive chuck device of the present invention, and the operation steps are shown in (a) to (c).

FIG. 4 is a partial cross-sectional bottom view taken along line (4)-(4) in FIG. 3.

FIG. 5 is a partial longitudinal front view showing a third embodiment of the adhesive chuck device of the present invention, and the operation steps are shown in (a) to (c).

FIG. 6 is a partial cross-sectional bottom view taken along the line (6)-(6) in FIG.

Explanation of symbols

A board (upper board) A1 袅 surface

B board (lower board) B1 back side

C Ring adhesive S Closed space

1 Upper holding plate (upper surface plate) la Side of substrate (holding surface)

lb recess lc vent

Id septum le Toru: ^ Shishi

If Ventilation path 2 Lower holding plate (Lower surface plate)

2a Side of substrate (holding surface) 3, 3 'Adhesive

3a, 3a front surface 3b fixed back surface

4 Deformable membrane 4a Small hole

4 ', 4〃 plate

Claims

The scope of the claims

[1] An adhesive chuck device for detachably holding a substrate with an adhesive on a holding plate, comprising: an adhesive member for holding an adhesive on the substrate side of the holding plate in opposition to the back surface of the substrate; A deformable film that can be deformed in and out in the direction is provided, and the adhesive surface of the adhesive member is brought into contact with the substrate by the deformed deformation of the deformable film, and the two are forcibly separated and peeled off. Adhesive chuck device.

2. The adhesive chuck device according to claim 1, wherein the adhesive member and the deformable film are integrally formed.

3. The adhesive chuck device according to claim 1, wherein an adhesive surface of an adhesive member is provided on a part of the deformable film.

4. The pressure-sensitive adhesive chuck device according to claim 2, wherein a ventilation hole is formed in a part of the plate-like body, and the back surface of the substrate is sucked and adsorbed.