KR102198179B1 - A vacuum attachment system for the substrate touch panel and a vacuum attachment method for the substrate touch panel using the system - Google Patents

Abstract

The present invention relates to a substrate vacuum bonding system for a touch panel and a substrate vacuum bonding method for a touch panel using the system. A substrate vacuum bonding system for a touch panel according to an embodiment of the present invention includes a turntable unit in which a chamber is divided into 4 parts and the turntable unit so that the upper and lower substrates constituting the touch panel can be vacuum bonded to each other in a rotation method. It includes a slip ring that supplies electricity. And a vision unit for checking the coordinates by photographing the upper and lower substrates, a transfer supply device for supplying the upper substrate, and a vacuum press device for vacuum bonding the upper and lower substrates.

Description

A vacuum bonding system for a touch panel and a vacuum bonding method for a substrate for a touch panel by using the system {A VACUUM ATTACHMENT SYSTEM FOR THE SUBSTRATE TOUCH PANEL AND A VACUUM ATTACHMENT METHOD FOR THE SUBSTRATE TOUCH PANEL USING THE SYSTEM}

The present invention relates to a substrate vacuum bonding system for a touch panel. In more detail, the present invention relates to a substrate vacuum bonding system for a touch panel for bonding substrates constituting the touch panel by vacuum, and a vacuum bonding method for a substrate for a touch panel using the system.

For example, a touch panel is a transparent switch panel that can control a device by directly touching the position where text and pictures are displayed.It is an optical type using infrared and a transparent conductive film coated with an indium tin oxide (ITO) film on a polyester film. The transparent electrode method using a contact point, the transparent conductive film method in which stainless steel wire is embedded in the transparent conductive film, the capacitance method that detects the change in capacitance, the pressure of the fingertip touching the panel is applied to the pressure sensor placed around the panel. A method of detecting the position from distribution is being put into practice.

As described above, since the touch panel is composed of multiple layers, a process of bonding each component is in progress, and is typically bonded through an optically clear adhesive (OCA). That is, an optical transparent adhesive film is formed and bonded between the components constituting the touch panel.

Here, the cover glass constituting the touch panel and the optically transparent adhesive film are bonded through a vacuum bonding system. Since the vacuum bonding system is specifically disclosed in (Patent Document 1), it will be described with reference to it as follows.

According to (Patent Document 1), the prior art is a transfer module for transferring a cover glass and a lower substrate, a vacuum chamber, an alignment loading unit, a vacuum means, a CCD camera unit, a bonding unit, a vacuum evacuation unit, a curing treatment unit, an unloading unit. And a loader unit. In addition, the vacuum chamber constitutes an electrostatic chuck (ESC) for fixing the cover glass in an electrostatic manner.

However, in the prior art, since the vacuum bonding process of the cover glass and the lower substrate is performed through a single vacuum chamber, it takes too much time to prepare the process for the next vacuum bonding after the process for vacuum bonding. There is this.

Republic of Korea Patent Publication No. 10-1213199

An object of the present invention is to improve the vacuum bonding process for bonding the substrates constituting the touch panel with a vacuum using a rotation method to easily improve workability, and a vacuum bonding system for a touch panel and a touch using the system It is to provide a substrate vacuum bonding method for panels.

In order to solve the above problem,

A substrate vacuum bonding system for a touch panel according to an embodiment of the present invention includes a base frame;

The lower chamber is rotatably installed on the upper part of the base frame and has an electrostatic chuck (ESC) or a stage composed of rubber chuck for bonding the upper and lower substrates constituting the touch panel. ) A turntable unit including a turntable configured to be divided into four sections on the outer side of the chamber seating unit (Turn Table Unit);

A slip ring installed on the drive shaft of the turntable unit so as to supply electricity to the stage, and installed at the lower end of the drive shaft protruding into the inner space of the base frame;

An alignment device (Aligner) including a first vision unit (Vision Unit) that is installed on the upper part of the base frame to check the coordinates by photographing the lower substrate supplied to the upper part of the stage with a camera module;

A transfer device installed on the base frame to adsorb and transfer the upper substrate through a vacuum pad to supply the upper substrate to the upper part of the lower substrate supplied to the stage; And

A vacuum press device installed on the upper part of the base frame so as to be disposed in a direction crossing the transfer supply device, and vacuum bonding the upper and lower substrates supplied to the stage through the lifting of the upper chamber;

It may include.

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, the upper substrate may be a cover glass (CG), and the lower substrate may be an optical transparent adhesive film (OCA).

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, the turntable may be formed in a rectangular shape, so that a chamber seat may be configured at each vertex.

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, the turntable is mounted in each chamber so that the lower chamber can be elevated through a cylinder type table support unit installed on an upper portion of the base frame. A passage part may be formed in the part.

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, the lower chamber may have an accommodation space for accommodating two stages thereon.

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, the upper substrate installed on the base frame, disposed under the transfer supply device, and the upper substrate adsorbed by the transfer supply device is a camera module. A second vision unit for checking the coordinates by taking an image; And

A position correction module (UVW Stage) for correcting the position of the upper substrate according to the coordinates checked through the second vision unit;

It may further include.

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, a protective film attached to the surface of the lower substrate supplied to the stage is installed on the upper part of the base frame so as to be disposed in a direction crossing the transfer supply device. Peeling unit (Peeler) for peeling through the horizontal transfer of the peeling roller (Peeling Roller);

It may further include.

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, a basket installed on the base frame and into which the protective film removed from the lower substrate through the peeling unit is put; And

A loading box which is movably installed under the base frame and loaded with a protective film injected into the basket;

It may further include.

On the other hand, the vacuum bonding method for a substrate for a touch panel according to an embodiment of the present invention includes (a) supplying a lower substrate to the upper portion of the stage and lowering the cylinder-type table support unit, and then interlocking the drive shaft with the drive motor. Rotating the unit and raising the cylinder type table support unit;

(b) transferring the peeling roller in a horizontal direction in a state in which the peeling roller of the peeling unit is in contact with the protective film attached to the surface of the lower substrate to peel the protective film and then putting it into a basket;

(c) checking coordinates by taking an image of the lower substrate supplied to the upper portion of the stage through a first vision unit of an alignment device;

(d) The upper substrate supplied to the upper part of the lower substrate is gripped with a vacuum pad of the transfer supply device, and the upper substrate is imaged through a second vision unit to check the coordinates, and then the upper substrate is supplied to the upper part of the lower substrate. , Rotating the turntable unit in a state in which the cylinder type table support unit is lowered;

(e) raising the lower chamber through the cylinder type table support unit and lowering the vacuum press device through the lifting device to vacuum-bond the upper and lower substrates through the upper and lower chambers of the vacuum press device; And

(f) lifting the vacuum press device through the lifting device, lowering the lower chamber through the cylinder type table support unit, and rotating the turntable unit to unload the upper and lower substrates bonded to each other on the stage;

It may include.

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, the step (a) includes the steps of rolling a lower substrate supplied to an upper portion of the stage with an upper roller;

It may include.

In addition, in the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, the step (d) includes: correcting the position of the upper substrate through the position correction module according to the coordinates checked through the second vision unit;

It may include.

This solution will become more apparent from the detailed contents for carrying out the following invention based on the accompanying drawings.

Prior to this, terms or words used in the present specification and claims should not be interpreted in a conventional and dictionary meaning, and the inventor should appropriately define the concept of terms in order to explain his own invention in the best way. It should be interpreted as a meaning and concept consistent with the technical idea of the present invention based on the principle that it can be.

According to an embodiment of the present invention, by improving the bonding process by a rotation method through the turntable unit, the workability of the bonding process can be easily improved, and accordingly, mass production of the touch panel is easy.

In addition, according to an embodiment of the present invention, it is possible to correct the bonding position by checking the coordinates of the upper and lower substrates through each of the vision units, thereby effectively improving the reliability of the bonding process.

On the other hand, according to an embodiment of the present invention, the bonding process of the upper substrate and the lower substrate constituting the touch panel is sequentially carried out in a rotation method, thereby improving work efficiency, thereby effectively improving the reliability of the bonding process as well as work convenience. Can be improved.

1 to 2 are perspective views showing a substrate vacuum bonding system for a touch panel according to an embodiment of the present invention.
FIG. 3 is a side view showing the substrate vacuum bonding system for a touch panel according to FIG. 1 when viewed from the side.
4 is a perspective view showing an alignment device of a substrate vacuum bonding system for a touch panel according to an embodiment of the present invention.
5 is a perspective view showing an alignment device and a vacuum press device removed from the substrate vacuum bonding system for a touch panel according to FIG. 1.
6 is a perspective view showing a turntable unit of a substrate vacuum bonding system for a touch panel according to an embodiment of the present invention.
FIG. 7 is a plan view showing the substrate vacuum bonding system for a touch panel according to FIG. 6 as viewed from above.
FIG. 8 is a side view showing the substrate vacuum bonding system for a touch panel according to FIG. 6 as viewed from the side.
9 is a perspective view showing a lower chamber of a substrate vacuum bonding system for a touch panel according to an embodiment of the present invention.

Specific aspects and specific technical features of the present invention will become more apparent from the following specific content and one embodiment associated with the accompanying drawings. In the present specification, in adding reference numerals to elements of each drawing, it should be noted that the same elements are assigned the same numerals as possible even if they are indicated on different drawings. In addition, in describing an embodiment of the present invention, when it is determined that a detailed description of a related known configuration or function may obscure the subject matter of the present invention, a detailed description thereof will be omitted.

In addition, in describing the constituent elements of the present invention, terms such as first, second, A, B, (a), (b) may be used. These terms are only for distinguishing the component from other components, and the nature, order, or order of the component is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, the component may be directly connected or connected to that other component, but another component between each component It should be understood that elements may be “connected”, “coupled” or “connected”.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 to 2 are perspective views showing a substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, in which a turntable unit 20 is installed in the upper center of the base frame 10, and the turntable unit 20 The vacuum press device 80 is installed on the top of the vacuum press device 80 and the transfer supply device 70 is disposed in a crosswise direction.

3 is a side view showing the vacuum bonding system for a touch panel according to FIG. 1 as viewed from the side, and vacuum press devices 80 on both upper sides of the turntable unit 20 installed in the upper center of the base frame 10 ) And the peeling unit 100 are disposed, and the basket 110 and the loading box 120 are disposed below the peeling unit 100.

4 is a perspective view showing an alignment device 60 of a substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, in which a first camera module 62 is installed under the transfer module 63 The overall configuration of the alignment device 60 including the first vision unit 60 is shown.

5 is a perspective view showing an alignment device and a vacuum press device removed from the substrate vacuum bonding system for a touch panel according to FIG. 1, and peeled on both sides around the turntable unit 20 installed on the base frame 10 The unit 100 and the vacuum press device 80 are disposed, and the vacuum press device 80 and the transfer supply device 70 are disposed in a crosswise direction.

6 is a perspective view showing a turntable unit 20 of a substrate vacuum bonding system for a touch panel according to an embodiment of the present invention, in which the turntable unit 20 is rotatably installed on an upper portion of the base frame 10, Four lower chambers 30 are mounted on the outer periphery of the turntable 21, and the two stages 31 are provided above each lower chamber 30, showing a coupling relationship.

FIG. 7 is a plan view showing the vacuum bonding system for a touch panel according to FIG. 6 as viewed from above, and is integrally formed at each vertex of the turntable 21 formed in a quadrangular shape, and a chamber seating portion 21a configured in four divisions The four lower chambers 30 are mounted on the upper part of each of the lower chambers 30, and the two stages 31 are provided inside each of the lower chambers 30, showing a coupling relationship.

FIG. 8 is a side view showing the substrate vacuum bonding system for a touch panel according to FIG. 6 as viewed from the side, and the drive shaft 22 of the turntable unit 20 protruding into the inner space 10a of the base frame 10 The slip ring 40 is installed on the inner space 10a to show a coupling relationship.

9 is a perspective view showing a lower chamber of a vacuum bonding system for a touch panel according to an embodiment of the present invention, and an electrostatic chuck 31a and a rubber chuck are provided in an accommodation space 30a provided above the lower chamber 30 It shows the coupling relationship provided with the stage 31 composed of (31b).

1 to 9, the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention includes a substrate bonding machine 1 for performing a process of bonding the upper and lower substrates constituting the touch panel. do.

The substrate bonding machine 1 includes a base frame 10, a turntable unit 20 rotatably installed on the base frame 10, and a slip ring 40 installed on a drive shaft 22 of the turntable unit. , An alignment device 60 including a first vision unit 60 for checking coordinates by photographing the upper substrate, a transfer supplying device 70 for transferring and supplying the upper substrate, and vacuuming the upper and lower substrates. It includes a vacuum press device 80 for bonding.

In addition to this, a second vision unit 90 for checking coordinates by photographing the lower substrate and a peeling unit 100 for peeling the protective film attached to the surface of the lower substrate may be further included.

Here, the upper substrate may be, for example, a cover glass (CG) constituting a touch panel. In addition, the lower substrate may be an optically clear adhesive (OCA) film for bonding the cover glass to other components.

However, it should be noted in advance that this may be other components constituting the touch panel, such as OLED, in addition to being specific in order to easily explain and understand the upper and lower substrates.

The base frame 10 is configured by mutually coupling a normal vertical frame 11 and a horizontal frame 12 having a rectangular cross section so as to support the turntable unit 20 installed thereon, and It includes a flat shelf 13 to be installed. In addition, it may further include a height adjustment device 14 arranged and installed in the lower portion so as to align the level of the substrate bonding machine (1).

As the base frame 10 is configured by combining the vertical frame 11 and the horizontal frame 12, an inner space 10a is provided, which is the central axis of the turntable unit 20 through the inner space 10a. The slip ring 40 installed at the lower end of the drive shaft 22 and the lower end of the drive shaft 22 is accommodated.

The turntable unit 20 is installed in the center of the turntable 21 and the turntable 21 in which the chamber seating portion 21a on which the lower chamber 30 is seated is divided into four parts, for example, by an index motor. It is driven in conjunction with the driving motor to be implemented, and as described above, includes a drive shaft 22 protruding from the lower end to the inner space (10a).

The turntable 21 is a type of four-divided index in which the upper surface is formed in a rectangular shape and the chamber seating portion 21a is formed at each vertex. The chamber seating portion 21a corresponds to the shape of the lower chamber 30. Can be formed, for example, is shown by showing the chamber seating portion (21a) formed in a square shape.

In addition, the turntable 21 is the lower chamber 30 so that the lower chamber 30 can be raised and lowered through a cylinder-type table support unit (hereinafter referred to as'table support unit') installed above the base frame 10. A passage portion (23 in FIG. 8) may be formed and provided inside each chamber seating portion 21a on which is seated.

That is, the table support unit 50 prevents shaking of the turntable 21 during the bonding process of the upper substrate and the lower substrate of the touch panel, and the base frame is used to elevate the lower chamber 30 toward the vacuum press device 80. It can be installed and operated on the upper part of (10), in this case, a passage part 23 is formed inside each chamber seating part 21a so that the lower chamber 30 can be raised and lowered through the table support unit 50 It becomes.

Here, the lower chamber 30 seated on the chamber seating part 21a and the stage 31 provided above the lower chamber 30 are known configurations widely known in the art, and the lower substrate is formed by an electrostatic method. A receiving space 30a in which the stage 31 consisting of an electrostatic chuck 31a to be detached or a rubber chuck 31b to attach and detach a lower substrate by an adhesive method is provided on the upper side is provided on the receiving space ( Since the stage 31 is provided in 30a), the bonding process of the upper substrate and the lower substrate is performed through the stage 31.

As is widely known, the slip ring 40 is installed on the shaft of the rotor to supply electricity to the rotor of an electric motor or motor, and this is a turntable unit that is a rotor in the substrate bonding machine 1 ( By applying to 20), high voltage electricity is supplied to the stage 31.

That is, the turntable unit 20 rotates around the drive shaft 22 to perform a bonding process in a rotation method. If the slip ring 40 is not applied, the wires supplying electricity to each stage 31 are twisted together. The rotation method of the turntable unit 20 cannot be easily implemented.

In order to solve this problem, the slip ring 40 is installed on the drive shaft 22 to configure the turntable unit 20 to supply electricity to the stage 31. Accordingly, even if the turntable 21 rotates, the wires are not twisted together. Therefore, it is possible to implement a rotation method through rotation of the turntable unit 20.

Here, as described above, the slip ring 40 is installed at the lower end of the drive shaft 22 protruding into the inner space 10a to prevent contact with the outside, thereby reducing the risk of safety accidents.

Therefore, according to an embodiment of the present invention, it is possible to easily improve the bonding process of the upper substrate and the lower substrate constituting the touch panel through the turntable unit 20 and the slip ring 40 by a rotation method, thereby facilitating workability. Not only can it be improved, but also mass production of the touch panel is easy due to this.

As shown in FIG. 4, the alignment device 60 according to an embodiment of the present invention includes, for example, a transfer module 63 that can be implemented as an LM guide (Linear Motion Guide) on the upper part of a frame assembly composed of a vertical frame and a horizontal frame. ) Is installed, and a first vision unit 60 configured by installing a CCD type first camera module 62 under the transfer module 63. In addition to this, a lighting module that illuminates toward the first camera module 62 may be further included.

The alignment device 60 is a device that enables an alignment operation by checking coordinates by taking an image of the lower substrate. For example, the first camera module 62 is configured to be adjustable in X, Y, and Z axes. The lower substrate can be easily imaged, and the upper substrate is configured to be avoided without collision during transport.

That is, the bonding process can be performed while checking the coordinates of the lower substrate supplied to the upper part of the stage through the alignment device 60, thereby improving reliability due to the bonding of the lower substrate and the upper substrate.

As shown in Figures 3 and 5, the transfer supply device 70 according to an embodiment of the present invention is installed on the upper portion of the base frame 10 and supplied to the upper portion of the stage 31, specifically the above The upper substrate is transferred and supplied to the protruding upper end of the stage 31.

To this end, the transfer supply device 70 installs a base plate 73 between the first transfer robot 72 that can be implemented as an LM guide, and sucks the upper substrate under the base plate 73 in a vacuum manner. It is configured by installing the vacuum pad 71 so as to be elevating.

Here, a second vision unit 90 for checking coordinates by taking an image of the upper substrate adsorbed through the vacuum pad 71 through the vacuum pad 71, for example, is disposed under the transfer supply device 70 The second vision unit 90 is installed on the base frame 10. The second camera module 91 may be configured to enable position adjustment in the X, Y, and Z axis directions.

Further, a position correction module 74 for correcting the position of the upper substrate according to the coordinates checked through the second vision unit 90 as well as the vacuum pad 71 may be installed under the base plate 73.

That is, by correcting the position of the vacuum pad 71 through the position correction module 74 performed in a conventional UVW-Stage, as a result, the bonding position of the upper and lower substrates is corrected, thereby improving the reliability of the bonding process. have.

A vacuum press device 80 and a peeling unit 100 respectively disposed on both sides of the turntable unit 20 are installed on the upper part of the base frame 10 on which the transfer supply device 70 is installed, and the transfer supply device It is arranged in the direction of intersection with (70).

The vacuum press device 80 is installed on the top of the base frame 10 so as to be disposed in a direction crossing with the transfer supply device 70 to move the upper and lower substrates supplied to the stage 31 to the upper chamber 81 Through vacuum cementation.

That is, the vacuum press device 80 raises and lowers the upper chamber 81 disposed above the lower chamber 30 with an elevating device 82 implemented by a combination of a motor and an LM guide, while lifting the lower substrate and the upper substrate. Vacuum bonding is performed by uniform pressure, and an upper chuck installed in the upper chamber 81, a vacuum pump for vacuuming the upper and lower chambers 30, and a chamber vent It may further include.

The peeling unit 100 disposed on the opposite side of the vacuum press device 80 is installed on the second transfer robot 103 installed on the upper part of the base frame 10 so as to be elevating and descending through the bracket 102. It includes a peeling roller 101 to remove the protective film attached to the surface by peeling in a roller method.

The peeling roller 101 peels off the protective film attached to the surface of the lower substrate using a conventional peeling tape, and peels the protective film through rotation while being transported in the horizontal direction along the second transfer robot 103. do.

Here, a basket 110 is installed on the upper part of the base frame 10 so that the protective film removed from the lower substrate through the peeling unit 100 can be recovered in the bonding process, and the lower part of the base frame 10 A loading box 120 in communication with the basket 110 may be installed. In addition, the loading box 120 may be provided with a moving wheel in the lower portion so as to be movable.

Therefore, according to an embodiment of the present invention, not only can the bonding process of the upper substrate and the lower substrate be easily performed through the vacuum press device 80, but also the peeling unit 100 and the basket 110 connected thereto are loaded. Through the recovery of the protective film through the bonding process can be carried out, it is possible to effectively improve the workability.

Hereinafter, a process of a substrate vacuum bonding system for a touch panel according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, this is only an example, and it is disclosed in advance that it can be changed according to the configuration.

In order to perform the process of the substrate vacuum bonding system for a touch panel according to an embodiment of the present invention shown in FIGS. 1 to 9, first, a lower substrate is loaded on the stage 31. That is, the step of supplying the lower substrate to the upper portion of the stage 31 is performed.

Here, when the lower substrate is supplied to the upper portion of the stage 31, a step of rolling the lower substrate with an upper roller (not shown) may be performed.

Thereafter, the table support unit 50 installed on the upper part of the base frame 10 is lowered, and in this state, the turntable unit 20 is rotated by 90° through the linkage between the drive shaft 22 and the drive motor, and the table The step of raising the support unit 50 is performed.

Next, a step of peeling the protective film attached to the surface of the lower substrate through the peeling unit 100 is performed. That is, in a state in which the peeling roller 101 of the peeling unit 100 is lowered and brought into contact with the protective film, the peeling roller 101 is transported in the horizontal direction and raised to peel the protective film, and then protected by the basket 110. The discarding step is carried out to put the film in.

When the step of discarding the protective film through the peeling unit 100 is completed, the turntable unit 20 is rotated by 90° while the table support unit 50 is lowered.

On the other hand, in order to perform the alignment operation of the lower substrate supplied to the upper part of the stage 31, first, the first vision unit 60 of the alignment device 60 is loaded, and in a lowered state, lighting and the 1 A step of checking the coordinates by photographing the lower substrate through the first camera module 62 of the vision unit 60 is performed.

In addition, in order to perform an alignment operation of the upper substrate supplied to the upper part of the lower substrate, the transfer supply device 70 is loaded, the upper substrate is vacuum gripped with a vacuum pad 71, and then the second vision unit 90 The upper substrate is supplied to the upper portion of the lower substrate, which is a bonding position, after the upper substrate is imaged through the image and the coordinates are checked.

In this case, the step of correcting the position of the upper substrate through the position correction module 74 according to the coordinates checked through the second vision unit 90 may be performed. Thereafter, a step of rotating the turntable unit 20 by rotating it by 90° is performed.

Next, in order to carry out the step of vacuum bonding the lower substrate and the upper substrate, the lower chamber 30 is raised through the table support unit 50, and the upper chamber of the vacuum press device 80 through the lifting device 82. (81) lowers the position. That is, the upper and lower substrates are vacuum-bonded through the upper chuck provided in the upper chamber 81 and the stage 31 provided in the lower chamber 30.

When the implementation of this vacuum bonding step is completed, the vacuum press device 80 is raised in position through the lifting device 82, the lower chamber 30 is lowered through the table support unit 50, and then the turntable unit 20 By rotating by rotating by 90°, a step of unloading the upper and lower substrates bonded to each other is performed in the stage 31.

Therefore, according to an embodiment of the present invention, each step for bonding the upper substrate and the lower substrate constituting the touch panel can be sequentially performed in a rotation method, thereby improving work efficiency and convenience of work as well as the bonding process. Reliability can be effectively improved.

Although the present invention has been described in detail through an embodiment, this is for explaining the present invention in detail, and the substrate vacuum bonding system for a touch panel according to the present invention is not limited thereto. And the terms such as "comprise", "comprise", or "have" described above mean that the corresponding component may be included unless otherwise stated, so excluding other components It should be construed as that it may further include other components, and all terms including technical or scientific terms are generally understood by those of ordinary skill in the technical field to which the present invention belongs, unless otherwise defined. It has the same meaning as being.

In addition, the above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains can various modifications and variations without departing from the essential characteristics of the present invention. Accordingly, the exemplary embodiments disclosed in the present disclosure are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present disclosure is not limited by this exemplary embodiment. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

1: substrate bonding machine 10: base frame
10a: inner space 11: vertical frame
12: horizontal frame 13: shelf
14: height adjustment device 20: turntable unit
21: turntable 21a: chamber seat
22: drive shaft 23: passage
30: lower chamber 30a: accommodation space
31: electrostatic chuck 32: electrode part
33: protective cover 40: slip ring
50: table support unit 60: alignment device
61: first vision unit 62: first camera module
63: transfer module 70: transfer supply device
71: vacuum pad 72: first transfer robot
73: base plate 74: position correction module
80: vacuum press device 81: upper chamber
82: lifting device 90: second vision unit
91: second camera module 100: peeling unit
101: peeling roller 102: bracket
103: second transfer robot 110: basket
120: loading box

Claims (10)

Base frame;
The lower chamber is rotatably installed on the upper part of the base frame, and has a stage formed on the upper part of an electrostatic chuck or a rubber chuck for bonding the upper substrate, which is a cover glass constituting the touch panel, and the lower substrate, which is an optical transparent adhesive film. A turntable unit including a turntable formed in a quadrangular shape so as to be seated and configured to be divided into four chamber seats formed at each vertex;
A slip ring installed on the drive shaft of the turntable unit so as to supply electricity to the stage, the slip ring installed at the lower end of the drive shaft protruding into the inner space of the base frame;
An alignment device including a first vision unit installed on the base frame and configured to check coordinates by photographing a lower substrate supplied to the upper part of the stage with a first camera module;
A transfer and supply device installed above the base frame to adsorb and transfer the upper substrate through a vacuum pad to supply the upper substrate to the upper substrate supplied to the stage; And
And a vacuum press device installed on an upper portion of the base frame so as to be disposed in a direction crossing with the transfer supply device to vacuum-bond the upper and lower substrates supplied to the stage through the lifting of the upper chamber, and
A cylinder type table slot unit installed on the base frame to lift the lower chamber along a passage portion formed in the chamber seating portion;
A peeling unit installed on the top of the base frame in a direction crossing with the transfer supplying device to peel the protective film attached to the surface of the lower substrate supplied to the stage through horizontal transfer of a peeling roller;
A second vision unit installed above the base frame, disposed below the transfer supply device, and check coordinates by photographing an upper substrate adsorbed by the transfer supply device with a second camera module;
A position correction module for correcting the position of the upper substrate according to the coordinates checked through the second vision unit;
A basket installed on the base frame and into which the protective film removed from the lower substrate through the peeling unit is put; And
A loading box installed to be movable under the base frame and loaded with a protective film inserted into the basket, and having moving wheels;
A substrate vacuum bonding system for a touch panel further comprising a.
delete delete delete delete delete delete In a method of bonding an upper substrate and a lower substrate using a substrate vacuum bonding system for a touch panel,
(a) The lower substrate is supplied to the upper part of the stage, the lower substrate is rolled with the upper roller, the cylinder type table support unit is lowered, and the turntable unit is rotated through interlocking the drive shaft and the drive motor, and the cylinder type table Raising the support unit;
(b) transferring the peeling roller in a horizontal direction in a state in which the peeling roller of the peeling unit is in contact with the protective film attached to the surface of the lower substrate to peel the protective film and then putting it into a basket;
(c) checking coordinates by taking an image of the lower substrate supplied to the upper portion of the stage through a first vision unit of an alignment device;
(d) The upper substrate supplied to the upper part of the lower substrate is gripped with a vacuum pad of the transfer supply device, the upper substrate is imaged through a second vision unit to check the coordinates, and the position of the upper substrate through the position correction module A step of rotating the turntable unit while the upper substrate is supplied to the upper portion of the lower substrate and the cylinder type table support unit is lowered;
(e) raising the lower chamber through the cylinder type table support unit and lowering the vacuum press device through the lifting device to vacuum-bond the upper and lower substrates through the upper and lower chambers of the vacuum press device; And
(f) lifting the vacuum press device through the lifting device, lowering the lower chamber through the cylinder type table support unit, and rotating the turntable unit to unload the upper and lower substrates bonded together on the stage;
A substrate vacuum bonding method for a touch panel comprising a. delete delete

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