JP2015216223A - Adsorption/desorption device - Google Patents

Adsorption/desorption device Download PDF

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JP2015216223A
JP2015216223A JP2014098009A JP2014098009A JP2015216223A JP 2015216223 A JP2015216223 A JP 2015216223A JP 2014098009 A JP2014098009 A JP 2014098009A JP 2014098009 A JP2014098009 A JP 2014098009A JP 2015216223 A JP2015216223 A JP 2015216223A
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adsorption
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JP6398301B2 (en
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秀伸 安齊
Hidenobu Anzai
秀伸 安齊
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藤倉化成株式会社
Fujikura Kasei Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an adsorption/desorption device capable of surely removing an adsorbed object while suppressing damage or contamination.SOLUTION: The adsorption/desorption device includes: a flexible adsorption member 3 adsorbing a wafer W on a front face; a rear-face member 5 forming a space part 15 partitioned with respect to an ambient atmosphere on a rear face of the adsorption member 3; a piping part 7 connecting the space part 15 to atmospheric air as a pressure reduction source and to a pressurizing source 23; and a switching valve 9 for switching the pressure reduction by the atmospheric air via the piping part 7 and the pressurization by the pressurizing source 23 with respect to the space part 15. By switching the switching valve 9, the space part 15 is pressurized when removing the wafer W, a pressure difference from the ambient atmosphere is increased, and the adsorption member 3 is expanded closer to the wafer W. When not removing the wafer W, the space part 15 is open in the atmospheric air, the pressure difference between the space part 15 and the ambient atmosphere is eliminated, and the adsorption member 3 is brought into a non-expanded state.

Description

本発明は、吸着した対象物を取り外し可能とする吸着離脱装置に関する。   The present invention relates to a suction and detachment apparatus that makes it possible to remove a sucked object.
例えば、液晶パネルの組み立てでは、一対の基板を接着剤と液晶材料とを介在させて貼り合わせることが行われている。この貼り合わせとしては、吸着装置を用いて一対の基板を吸着保持しつつ加圧し、貼り合わせ後には、吸着装置から基板を取り外して液晶パネルの組み立てが完了する。   For example, in assembling a liquid crystal panel, a pair of substrates are bonded together with an adhesive and a liquid crystal material interposed therebetween. As the bonding, a pair of substrates is pressed and held using an adsorption device, and after bonding, the substrate is detached from the adsorption device and the assembly of the liquid crystal panel is completed.
基板の吸着は、通常、静電気力、粘着力、電気力等を利用して行われ、基板の取り外しは、静電気力や電気力を消失させることにより、或いは粘着力に抗して強制的に基板を剥がすことにより行うことができる。   Adsorption of the substrate is usually performed using electrostatic force, adhesive force, electric force, etc., and removal of the substrate is performed by erasing the electrostatic force or electric force or forcibly against the adhesive force. This can be done by peeling off.
しかし、吸着装置では、静電気力や電気力が残留した場合や対象物の密着度が高い場合、基板を取り外すことが困難となることがあった。   However, in the adsorption device, it may be difficult to remove the substrate when the electrostatic force or the electric force remains or when the adhesion of the object is high.
これに対し、例えば特許文献1には、吸着装置に基板の離脱機構を設けた吸着離脱装置が開示されている。   On the other hand, for example, Patent Document 1 discloses an adsorption / desorption device in which an adsorption device is provided with a substrate removal mechanism.
かかる吸着離脱装置は、一対の加圧板にそれぞれ基板を吸着する粘着シートが設けられ、且つ各吸着シートに対し孔を介して出没する離脱機構としての押し軸を有する。   Such an adsorption / desorption device is provided with an adhesive sheet for adsorbing a substrate on each of a pair of pressure plates, and has a push shaft as a desorption mechanism that protrudes and retracts through each hole with respect to the adsorption sheet.
押し軸は、基板の貼り合わせ後に粘着シートから突出し、基板を押圧して粘着シートから取り外すことを可能とする。   The push shaft protrudes from the pressure-sensitive adhesive sheet after the substrates are bonded together, and allows the substrate to be pressed and removed from the pressure-sensitive adhesive sheet.
しかし、押し軸によって基板を押圧すると、基板が損傷するおそれがある。特許文献1には、基板の押圧前に圧縮空気を基板に吹き付けることも開示されているが、基板の損傷防止に限界があり、また基板を汚染してしまうおそれもある。   However, if the substrate is pressed by the push shaft, the substrate may be damaged. Patent Document 1 discloses that compressed air is blown onto a substrate before the substrate is pressed. However, there is a limit to preventing damage to the substrate, and the substrate may be contaminated.
解決しようとする問題点は、吸着した対象物を取り外す際に損傷や汚染のおそれがあった点である。   The problem to be solved is that there is a risk of damage or contamination when removing the adsorbed object.
本発明の吸着離脱装置は、吸着した対象物を損傷や汚染を抑制しながら確実に取り外すことを可能とするため、対象物を表面に吸着する可撓性の吸着部材と、該吸着部材の裏面に周辺雰囲気に対して区画された空間部を形成する裏面部材と、前記空間部を減圧源に接続すると共に加圧源に接続する配管部と、前記空間部に対し前記配管部を介した前記減圧源による減圧と前記加圧源による加圧とを切り替える切替部とを備え、前記切替部の切り替えにより、前記対象物の取り外し時に前記空間部を加圧し、前記周辺雰囲気との圧力差を増加させて前記吸着部材を前記対象物側に膨出させ、前記対象物の非取り外し時に前記空間部を減圧し、前記周辺雰囲気との圧力差を減少させて前記吸着部材を非膨出状態とすることを特徴とする。   The adsorption / desorption device of the present invention makes it possible to reliably remove an adsorbed object while suppressing damage and contamination, and a flexible adsorbing member that adsorbs the object to the surface, and the back surface of the adsorbing member A back surface member that forms a space section partitioned with respect to the surrounding atmosphere, a piping section that connects the space section to a pressure source and a pressure source, and the space section via the piping section. A switching unit that switches between depressurization by the depressurization source and pressurization by the pressurization source, and switching the switching unit pressurizes the space when the object is removed, thereby increasing the pressure difference from the surrounding atmosphere. The suction member is bulged to the object side, the space is decompressed when the object is not removed, and the pressure difference from the surrounding atmosphere is reduced to bring the suction member into a non-bulged state. It is characterized by that.
本発明の吸着離脱装置では、対象物を吸着する吸着部材自体を膨出させることにより、対象物を押圧して取り外すことができ、対象物を損傷したり汚染することがない。   In the adsorption / desorption device of the present invention, the adsorption member itself that adsorbs the object is bulged, so that the object can be pressed and removed, and the object is not damaged or contaminated.
しかも、対象物の非取り外し時には、吸着部材が膨出することはなく、対象物の吸着保持を確実に行わせることができる。   In addition, when the object is not removed, the adsorption member does not bulge, and the object can be reliably adsorbed and held.
吸着離脱装置を適用した基板の保持装置の概略断面図である(実施例1)。(Example 1) which is a schematic sectional drawing of the holding | maintenance apparatus of the board | substrate to which the adsorption | suction removal apparatus is applied. 図1の保持装置による基板の吸着及び取り外し動作を示す概略断面図であり、図2(A)は、基板の吸着動作、図2(B)は、基板の取り外し動作である(実施例1)。FIGS. 2A and 2B are schematic cross-sectional views showing the operation of adsorbing and removing a substrate by the holding device of FIG. 1, FIG. 2A is the operation of adsorbing the substrate, and FIG. 2B is the operation of removing the substrate (Example 1). . 変形例に係る保持装置の吸着部材及びその周辺構造の概略断面図であり、図3(A)は、電気レオロジー材料で構成した吸着部材、図3(B)は、静電チャックの絶縁材料で構成した吸着部材を有する(実施例1)。FIG. 3A is a schematic cross-sectional view of an adsorbing member of a holding device according to a modification and a peripheral structure thereof, FIG. 3A is an adsorbing member made of an electrorheological material, and FIG. 3B is an insulating material of an electrostatic chuck. It has the comprised adsorption | suction member (Example 1). 変形例に係る切替弁を有する保持装置の概略断面図である(実施例1)。It is a schematic sectional drawing of the holding | maintenance apparatus which has the switching valve which concerns on a modification (Example 1). 吸着離脱装置を適用した基板組立装置の概略断面図である(実施例2)。(Example 2) which is a schematic sectional drawing of the board | substrate assembly apparatus to which the adsorption | suction removal apparatus is applied.
吸着した対象物を損傷や汚染を抑制しながら確実に取り外すことを可能にするという目的を、対象物を吸着する可撓性の吸着部材の裏面に空間部を区画し、対象物の取り外し時に空間部を加圧して圧力差により吸着部材を対象物側に膨出させる吸着離脱装置により実現した。   A space is defined on the back surface of the flexible adsorption member that adsorbs the object for the purpose of reliably removing the adsorbed object while suppressing damage and contamination. This is realized by an adsorption / desorption device that pressurizes the part and bulges the adsorption member toward the object side by a pressure difference.
空間部は、配管部によって減圧源及び加圧源に接続され、切替部によって配管部を介した減圧源による減圧と加圧源による加圧とが切り替えられる。   The space portion is connected to the pressure reduction source and the pressure source by the piping portion, and the switching portion switches between the pressure reduction by the pressure reduction source and the pressure application by the pressure source via the piping portion.
かかる切替部の切り替えにより、対象物の取り外し時には、空間部を加圧して周辺雰囲気との圧力差を増加させ、吸着部材を対象物側に膨出させ、対象物の非取り外し時には、空間部を減圧して周辺雰囲気との圧力差を減少させ、吸着部材を非膨出状態とする。   By switching the switching unit, when the object is removed, the space part is pressurized to increase the pressure difference from the surrounding atmosphere, the adsorption member is bulged toward the object side, and when the object is not removed, the space part is The pressure difference is reduced to reduce the pressure difference from the surrounding atmosphere, and the adsorption member is brought into a non-bulged state.
減圧源及び加圧源は、特に限定されるものではないが、例えば吸着離脱装置を周辺雰囲気としての大気中で用いる場合、減圧源を大気とし、加圧源を大気圧以上に加圧可能なものとすることができる。   The decompression source and the pressurization source are not particularly limited. For example, when the adsorption / desorption device is used in the atmosphere as the ambient atmosphere, the decompression source can be the atmosphere and the pressurization source can be pressurized to atmospheric pressure or higher. Can be.
一方、吸着離脱装置は、減圧室内での減圧雰囲気中で対象物を処理する際にも用いることができ、この場合は、例えば減圧源を減圧室に対する減圧源とし、加圧源を大気とすることができる。   On the other hand, the adsorption / desorption device can also be used when processing an object in a reduced-pressure atmosphere in a reduced-pressure chamber. In this case, for example, the reduced-pressure source is a reduced-pressure source for the reduced-pressure chamber, and the pressurized source is the atmosphere. be able to.
かかる吸着離脱装置は、液晶パネル等の基板同士を貼り合わせる時、偏光膜の貼り付け時、又はシリコンウェハの搬送時等に適用することができるが、その他、吸着した対象物を大気中或いは減圧雰囲気中で処理する場合に広く適用できる。   Such an adsorption / detachment device can be applied when substrates such as liquid crystal panels are bonded to each other, when a polarizing film is attached, or when a silicon wafer is transported. It can be widely applied when processing in an atmosphere.
以下、本発明の実施例について図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.
[保持装置の構成]
図1は、実施例1に係る吸着離脱装置を適用した保持装置の概略断面図である。
[Configuration of holding device]
FIG. 1 is a schematic cross-sectional view of a holding device to which the adsorption / desorption device according to the first embodiment is applied.
本実施例の保持装置1は、吸着部材3と、裏面部材5と、配管部7と、切替部としての切替弁9とを備えている。   The holding device 1 of the present embodiment includes an adsorption member 3, a back surface member 5, a piping part 7, and a switching valve 9 as a switching part.
吸着部材3は、例えば、樹脂等の粘着性のシートからなり、可撓性を有している。吸着部材3は、その粘着力によって表面に対象物としての基板Wを吸着保持する。吸着部材3の表面は、周辺雰囲気に面し、吸着部材3の裏面には、裏面部材5が設けられている。   The adsorbing member 3 is made of an adhesive sheet such as a resin and has flexibility. The adsorption member 3 adsorbs and holds the substrate W as an object on the surface by the adhesive force. The surface of the adsorbing member 3 faces the ambient atmosphere, and a back surface member 5 is provided on the back surface of the adsorbing member 3.
裏面部材5は、支持部11に貫通孔13を設けて構成されている。支持部11は、吸着部材3よりも高剛性の板状体であり、その表面に吸着部材3が取り付けられている。これにより、支持部11は、吸着部材3を裏面側から支持する。   The back member 5 is configured by providing a through hole 13 in the support portion 11. The support part 11 is a plate-like body having higher rigidity than the adsorption member 3, and the adsorption member 3 is attached to the surface thereof. Thereby, the support part 11 supports the adsorption | suction member 3 from the back surface side.
貫通孔13は、例えば支持部11の中央部に設けられ、支持部11を板厚方向(上下方向)で貫通する。貫通孔13は、支持部11の表面側で吸着部材3によって閉止される。すなわち、貫通孔13は、吸着部材3の裏面に至り、その吸着部材3の裏面に空間部15を区画する。なお、貫通孔13は、支持部11に複数設けてもよい。また、貫通孔13の位置は、後述するように吸着部材3に吸着した基板Wを取り外すことができれば変更することが可能である。   The through hole 13 is provided, for example, in the center of the support portion 11 and penetrates the support portion 11 in the plate thickness direction (vertical direction). The through hole 13 is closed by the adsorption member 3 on the surface side of the support portion 11. That is, the through-hole 13 reaches the back surface of the suction member 3 and defines the space 15 on the back surface of the suction member 3. A plurality of through holes 13 may be provided in the support portion 11. Further, the position of the through hole 13 can be changed as long as the substrate W adsorbed on the adsorption member 3 can be removed as will be described later.
貫通孔13には、支持部11の裏面側で配管部7に接続されている。配管部7は、共通管17と、減圧管19と、加圧管21とを備えている。   The through hole 13 is connected to the piping part 7 on the back side of the support part 11. The piping unit 7 includes a common pipe 17, a decompression pipe 19, and a pressurization pipe 21.
共通管17は、貫通孔13に対する接続口を構成し、一端が貫通孔13の開口に取り付けられている。共通管17の他端側は、切替弁9を介して減圧管19と加圧管21とに分岐している。   The common pipe 17 constitutes a connection port for the through hole 13, and one end is attached to the opening of the through hole 13. The other end side of the common pipe 17 branches into a decompression pipe 19 and a pressurization pipe 21 via the switching valve 9.
減圧管19は、端部が大気中に開口し、切替弁9及び共通管17を介して空間部15を減圧源としての大気に開放させる。なお、減圧源としては、別途、ポンプ等を設け、減圧管は、そのポンプ等に接続してもよい。   The end of the decompression pipe 19 opens into the atmosphere, and opens the space 15 to the atmosphere as a decompression source via the switching valve 9 and the common pipe 17. Note that a pump or the like may be separately provided as the decompression source, and the decompression pipe may be connected to the pump or the like.
加圧管21は、その端部がポンプ等からなる加圧源23に接続され、切替弁9及び共通管17を介して空間部15を加圧源23に接続する。なお、加圧源23は、後述するコントローラ25によって制御され、大気圧以上に空間部15を加圧する構成となっている。   The end of the pressurizing pipe 21 is connected to a pressurizing source 23 such as a pump, and the space 15 is connected to the pressurizing source 23 via the switching valve 9 and the common pipe 17. The pressurizing source 23 is controlled by a controller 25 to be described later, and is configured to pressurize the space 15 above atmospheric pressure.
切替弁9は、三方弁からなり、切替動作によって減圧管19及び加圧管21の一方を遮断して他方を開放する。これにより、切替弁9は、空間部15に対し配管部7を介した減圧源としての大気による減圧と加圧源23による加圧とを切り替え可能な構成となっている。   The switching valve 9 is a three-way valve, which shuts off one of the decompression pipe 19 and the pressurization pipe 21 and opens the other by a switching operation. As a result, the switching valve 9 is configured to be able to switch between the decompression by the atmosphere as the decompression source via the piping part 7 and the pressurization by the pressurization source 23 with respect to the space part 15.
本実施例の切替弁9は、電気的に駆動される電磁弁として構成され、演算装置等からなるコントローラ25によって切替が制御される。ただし、切替弁9は、作業者が手動によって切り替える弁として構成することも可能である。   The switching valve 9 of the present embodiment is configured as an electrically driven electromagnetic valve, and switching is controlled by a controller 25 including an arithmetic device or the like. However, the switching valve 9 can also be configured as a valve that is manually switched by an operator.
コントローラ25は、保持装置1によって基板Wを保持している間(基板Wの非取り外し時)、切替弁9を切り替えて空間部15と大気とを連通させる。これにより、空間部15が大気圧まで減圧されて空間部15と大気(周辺雰囲気)との圧力差が無くなり(減少し)、吸着部材3が非膨出状態となる。   While holding the substrate W by the holding device 1 (when the substrate W is not removed), the controller 25 switches the switching valve 9 to make the space portion 15 communicate with the atmosphere. Thereby, the space part 15 is depressurized to atmospheric pressure, the pressure difference between the space part 15 and the atmosphere (surrounding atmosphere) disappears (decreases), and the adsorbing member 3 enters a non-bulged state.
一方、基板Wの取り外し時には、コントローラ25が切替弁9を切り替えて、空間部15と加圧源23とを連通させる。このとき、コントローラ25は、加圧源23を駆動して、空間部15を加圧源23によって大気圧以上に加圧させる。従って、空間部15と大気との圧力差が増加し(生じ)、吸着部材3を基板W側に膨出させる。
[基板の吸着及び取り外し動作]
図2は、基板の吸着及び取り外し動作を示す断面図であり、図2(A)は、基板の吸着動作、図2(B)は、基板の取り外し動作である。
On the other hand, when the substrate W is removed, the controller 25 switches the switching valve 9 so that the space 15 and the pressurization source 23 communicate with each other. At this time, the controller 25 drives the pressurizing source 23 to pressurize the space 15 to the atmospheric pressure or higher by the pressurizing source 23. Accordingly, the pressure difference between the space portion 15 and the atmosphere increases (occurs), and the adsorption member 3 is expanded toward the substrate W side.
[Suction and removal of substrate]
2A and 2B are cross-sectional views showing the operation of sucking and removing the substrate, FIG. 2A shows the operation of sucking the substrate, and FIG. 2B shows the operation of removing the substrate.
基板Wを吸着する際には、図2(A)のように、コントローラ25が切替弁9を切り替えて空間部15を大気に開放しておく。この状態で、保持装置1の吸着部材3に基板Wを押し付ける等して、基板Wを保持装置1によって吸着保持する。   When adsorbing the substrate W, the controller 25 switches the switching valve 9 to open the space 15 to the atmosphere as shown in FIG. In this state, the substrate W is sucked and held by the holding device 1 by pressing the substrate W against the suction member 3 of the holding device 1.
このとき、空間部15及び周辺雰囲気が共に大気圧であるため、空間部15と周辺雰囲気との間、つまり吸着部材3の表裏に圧力差が生じず、基板Wを吸着している吸着部材3の姿勢が維持される(非膨出状態となる)。従って、保持装置1は、基板Wの吸着保持状態を確実に維持することができ、基板Wの処理としての搬送や加工等を行わせることができる。   At this time, since the space portion 15 and the surrounding atmosphere are both atmospheric pressure, no pressure difference is generated between the space portion 15 and the surrounding atmosphere, that is, the front and back of the suction member 3, and the suction member 3 that sucks the substrate W is sucked. Is maintained (becomes a non-bulged state). Therefore, the holding device 1 can reliably maintain the suction holding state of the substrate W, and can carry and process the substrate W as a process.
基板Wを取り外す際には、図2(B)のように、コントローラ25が切替弁9を切り替えて空間部15を加圧源23に接続すると共に加圧源23を動作させ、空間部15を大気圧以上に加圧する。   When removing the substrate W, as shown in FIG. 2B, the controller 25 switches the switching valve 9 to connect the space portion 15 to the pressure source 23 and operate the pressure source 23 to change the space portion 15 Pressurize above atmospheric pressure.
これに応じ、空間部15が周辺雰囲気に対して相対的に高圧となり、空間部15と周辺雰囲気との間、つまり空間部15に対応した位置において吸着部材3の表裏で圧力差が生じる。かかる圧力差に基づき、吸着部材3は、空間部15側から押圧されて基板W側に部分的に膨出する。この膨出により、基板Wは、吸着部材3の他の部分に対して離間し、保持装置1から取り外されることになる。   Accordingly, the space portion 15 has a relatively high pressure with respect to the surrounding atmosphere, and a pressure difference is generated between the space portion 15 and the surrounding atmosphere, that is, at a position corresponding to the space portion 15 between the front and back of the adsorption member 3. Based on the pressure difference, the adsorbing member 3 is pressed from the space 15 side and partially bulges to the substrate W side. Due to this swelling, the substrate W is separated from the other part of the adsorption member 3 and is removed from the holding device 1.
なお、吸着部材3の膨出は、加圧源23による加圧量や加圧速度に応じたものとなる。この加圧源23の加圧量や加圧速度の閾値は、吸着部材3が過剰に膨出して吸着部材3自体や基板Wを損傷させない範囲や吸着部材3の膨出によって基板Wを過度な衝撃により損傷させない範囲で設定するのが好ましい。
[実施例1の効果]
本実施例の保持装置1は、基板Wを表面に吸着する可撓性の吸着部材3と、吸着部材3の裏面に周辺雰囲気に対して区画された空間部15を形成する裏面部材5と、空間部15を減圧源としての大気に接続すると共に加圧源23に接続する配管部7と、空間部15に対し配管部7を介した大気による減圧と加圧源23による加圧とを切り替える切替弁9とを備えている。
The swelling of the adsorbing member 3 depends on the amount of pressure applied by the pressure source 23 and the pressure rate. The pressure amount and pressure threshold of the pressurizing source 23 are set so that the adsorption member 3 is excessively expanded and the adsorption member 3 itself and the substrate W are not damaged, and the substrate W is excessively expanded by the expansion of the adsorption member 3. It is preferable to set within a range where damage is not caused by impact.
[Effect of Example 1]
The holding device 1 of the present embodiment includes a flexible adsorption member 3 that adsorbs the substrate W to the surface, a back surface member 5 that forms a space 15 that is partitioned with respect to the surrounding atmosphere on the back surface of the adsorption member 3, The space portion 15 is connected to the atmosphere as a decompression source and the piping portion 7 is connected to the pressurization source 23, and the space portion 15 is switched between the decompression by the atmosphere via the piping portion 7 and the pressurization by the pressurization source 23. And a switching valve 9.
そして、保持装置1は、切替弁9の切り替えにより、基板Wの取り外し時に空間部15を加圧し、周辺雰囲気との圧力差を増加させて吸着部材3を基板W側に膨出させ、基板Wの非取り外し時に空間部15を大気に開放し、空間部15と周辺雰囲気との圧力差を無くして吸着部材3を非膨出状態とする。   Then, the holding device 1 pressurizes the space 15 when the substrate W is removed by switching the switching valve 9, increases the pressure difference with the surrounding atmosphere, and causes the adsorption member 3 to bulge to the substrate W side. At the time of non-removal, the space portion 15 is opened to the atmosphere, the pressure difference between the space portion 15 and the surrounding atmosphere is eliminated, and the adsorption member 3 is brought into a non-expanded state.
従って、本実施例では、基板Wを吸着する吸着部材3自体を膨出させることにより、基板Wを押圧して取り外すことができ、基板Wを損傷したり汚染することがない。   Therefore, in this embodiment, the suction member 3 itself that sucks the substrate W is swelled so that the substrate W can be pressed and removed, and the substrate W is not damaged or contaminated.
また、本実施例では、圧力差を利用して吸着部材3を膨出させるので、吸着部材3以外に基板Wに押圧力を働かせる部材が存在せず、かかる点からも基板Wを損傷することを確実に防止できる。   Further, in this embodiment, since the suction member 3 is expanded using the pressure difference, there is no member that exerts a pressing force on the substrate W other than the suction member 3, and the substrate W is also damaged from this point. Can be reliably prevented.
しかも、基板Wの非取り外し時には、吸着部材3が基板W側に膨出することはなく、基板Wの吸着保持を確実に行わせることができる。   In addition, when the substrate W is not detached, the suction member 3 does not bulge toward the substrate W, and the suction holding of the substrate W can be performed reliably.
また、本実施例では、周辺雰囲気が大気であり、配管部7が空間部15を減圧源としての大気に開放すると共に大気圧以上に加圧する加圧源23に接続するので、大気を利用して構造の簡素化を図ることができる。   Further, in this embodiment, the ambient atmosphere is the atmosphere, and the piping part 7 opens the space part 15 to the atmosphere as the decompression source and connects to the pressurization source 23 that pressurizes the atmospheric pressure or higher, so that the atmosphere is used. The structure can be simplified.
裏面部材5は、吸着部材3を裏面側から支持する支持部11と、支持部11を貫通して吸着部材3の裏面に至り空間部15を区画する貫通孔13とを備える。   The back surface member 5 includes a support portion 11 that supports the adsorption member 3 from the back surface side, and a through hole 13 that penetrates the support portion 11 and reaches the back surface of the adsorption member 3 to partition the space portion 15.
従って、本実施例では、吸着部材3を支持する支持部11を利用して裏面部材5を構成することができ、より確実に構造の簡素化を図ることができる。   Therefore, in the present embodiment, the back surface member 5 can be configured by using the support portion 11 that supports the adsorption member 3, and the structure can be simplified more reliably.
また、本実施例では、加圧源23による加圧量の設定に応じ、吸着部材3が過剰に膨出して吸着部材3自体が損傷することや押圧力の調整を通じて基板Wを損傷させることを防止できる。   Further, in the present embodiment, the suction member 3 is excessively expanded according to the setting of the pressurization amount by the pressure source 23, and the suction member 3 itself is damaged or the substrate W is damaged by adjusting the pressing force. Can be prevented.
また、加圧源23による加圧速度の設定に応じ、吸着部材3の膨出速度を調整して、基板Wを過度な衝撃により損傷させることを防止できる。
[変形例]
図3は、実施例1の変形例に係る吸着部材及びその周辺構造の断面図であり、図3(A)は、電気レオロジー材料で構成した吸着部材、図3(B)は、静電チャックの絶縁材料で構成した吸着部材を有する。
Moreover, according to the setting of the pressurization speed by the pressurization source 23, the swelling speed of the adsorption member 3 can be adjusted, and the substrate W can be prevented from being damaged by an excessive impact.
[Modification]
3 is a cross-sectional view of an adsorption member and its peripheral structure according to a modification of Example 1, FIG. 3A is an adsorption member made of an electrorheological material, and FIG. 3B is an electrostatic chuck. The adsorbing member is made of an insulating material.
実施例1の吸着部材3は、可撓性を有して基板W等の対象物を吸着できれば良く、各種の構造を採用することができる。   The suction member 3 according to the first embodiment only needs to be flexible and can suck an object such as the substrate W, and various structures can be employed.
例えば、図3(A)の例ように、吸着部材3は、電気レオロジー粒子27を電気絶縁媒体29中に分散させた可撓性のシートで構成することも可能である。この場合、吸着部材3の裏面には、裏面部材5を構成する電極基板31が支持部11との間に介設されている。   For example, as in the example of FIG. 3A, the adsorbing member 3 can be formed of a flexible sheet in which the electrorheological particles 27 are dispersed in the electric insulating medium 29. In this case, an electrode substrate 31 constituting the back member 5 is interposed between the support member 11 and the back surface of the adsorption member 3.
電極基板31には、支持部11側の貫通孔13に対応して、板厚方向に貫通する電極貫通孔33が設けられている。これら電極貫通孔33及び貫通孔13により、空間部15が区画形成されている。   The electrode substrate 31 is provided with an electrode through hole 33 penetrating in the thickness direction corresponding to the through hole 13 on the support portion 11 side. A space 15 is defined by the electrode through-hole 33 and the through-hole 13.
図3(A)の吸着部材3は、電極基板31を介した電圧印加に応じ、電気力等によって基板Wに対する吸着力を発生させることができる。   The adsorbing member 3 in FIG. 3A can generate an adsorbing force on the substrate W by an electric force or the like in response to voltage application via the electrode substrate 31.
図3(B)の例では、吸着部材3を可撓性を有する電気絶縁シートで構成し、吸着部材3が電極基板31と共に静電チャック35を構成する。図3(B)の吸着部材3は、電極基板31を介した電圧印加に応じ、静電気力によって基板Wに対する吸着力を発生させることができる。   In the example of FIG. 3B, the attracting member 3 is composed of a flexible electrical insulating sheet, and the attracting member 3 constitutes an electrostatic chuck 35 together with the electrode substrate 31. The adsorbing member 3 of FIG. 3B can generate an adsorbing force on the substrate W by electrostatic force in response to voltage application via the electrode substrate 31.
図4は、実施例1の変形例に係る切替弁を有する保持装置1の概略断面図である。   FIG. 4 is a schematic cross-sectional view of a holding device 1 having a switching valve according to a modification of the first embodiment.
実施例1の切替弁9は、空間部15と連通する配管部7の減圧管19及び加圧管21を切り替えることができればよく、各種の構造を採用することができる。   The switching valve 9 according to the first embodiment only needs to be able to switch between the decompression pipe 19 and the pressurization pipe 21 of the pipe section 7 communicating with the space section 15, and various structures can be employed.
図4の例では、電気的に駆動される切替弁9a,9bが配管部7の減圧管19と加圧管21とにそれぞれ設けられている。   In the example of FIG. 4, the electrically driven switching valves 9 a and 9 b are provided in the decompression pipe 19 and the pressurization pipe 21 of the pipe section 7, respectively.
かかる図3(A)〜図4の変形例でも、実施例1と同様の作用効果を奏することができる。   3A to 4 can achieve the same operational effects as those of the first embodiment.
図5は、実施例2に係る吸着離脱装置を適用した基板組立装置の概略断面図である。なお、実施例2では、実施例1と対応する構成部分に同符号又は同符号にAを付加したものを用いて、重複した説明を省略する。
[基板組立装置]
本実施例の基板組立装置37は、図5のように、減圧室39と、本実施例の吸着離脱装置である上下保持装置1Aa,1Abとを備えている。この基板組立装置37は、上下保持装置1Aa,1Abによって基板W1,W2を吸着保持し、減圧雰囲気の減圧室39内において基板W1,W2貼り合わせるものである。
FIG. 5 is a schematic cross-sectional view of a substrate assembly apparatus to which the adsorption / desorption apparatus according to the second embodiment is applied. In the second embodiment, the components corresponding to those in the first embodiment are denoted by the same reference numerals or the same reference numerals with A added thereto, and redundant description is omitted.
[Board assembly equipment]
As shown in FIG. 5, the substrate assembly apparatus 37 of the present embodiment includes a decompression chamber 39 and upper and lower holding devices 1Aa and 1Ab that are the adsorption and desorption devices of the present embodiment. The substrate assembly device 37 is configured to suck and hold the substrates W1 and W2 by the upper and lower holding devices 1Aa and 1Ab and to bond the substrates W1 and W2 in the decompression chamber 39 in a decompressed atmosphere.
減圧室39は、例えば上下チャンバ部41a,41bで構成され、両者間にOリング等のシール部材43が位置して密閉状態となっている。この減圧室39は、例えば、上チャンバ部41aを下チャンバ部41bに対して上下方向で近接離反することで開閉可能となっている。   The decompression chamber 39 is composed of, for example, upper and lower chamber portions 41a and 41b, and a sealing member 43 such as an O-ring is located between the two, and is in a sealed state. The decompression chamber 39 can be opened and closed by, for example, moving the upper chamber portion 41a close to and away from the lower chamber portion 41b in the vertical direction.
減圧室39内は、吸気管45によってポンプ等の減圧源47に接続され、減圧源47により減圧して減圧雰囲気とすることが可能となっている。なお、減圧源47は、後述するコントローラ25Aによって制御される。   The inside of the decompression chamber 39 is connected to a decompression source 47 such as a pump by an intake pipe 45 and can be decompressed by the decompression source 47 to form a decompressed atmosphere. The decompression source 47 is controlled by a controller 25A described later.
また、減圧室39内は、リーク管49及びリーク弁51が取り付けられ、リーク弁51の切替に応じて大気に開放可能(大気による加圧可能)となっている。   In addition, a leak pipe 49 and a leak valve 51 are attached in the decompression chamber 39, and can be opened to the atmosphere (pressurization by the atmosphere is possible) according to switching of the leak valve 51.
減圧室39内の圧力は、圧力センサ53によって監視される。   The pressure in the decompression chamber 39 is monitored by a pressure sensor 53.
なお、減圧室39の構成は、特に限定されるものではなく、減圧源47によって減圧できるものであれば種々のものを採用することが可能である。   The configuration of the decompression chamber 39 is not particularly limited, and various configurations can be adopted as long as the decompression source 47 can decompress the configuration.
減圧室39内には、上下保持装置1Aa,1Abが、それぞれ上下チャンバ部41a,41bに支持されている。この上下保持装置1Aa,1Abは、図5のように基板W1,W2を吸着保持した状態で、例えば上保持装置1Aaが下方に駆動されて基板W1,W2を加圧により貼り合わせる。基板W1,W2の貼り合わせ後には、それら基板W1,W2が上下保持装置1Aa,1Abから取り外されて、例えば液晶パネル等の組立が完了する。   In the decompression chamber 39, upper and lower holding devices 1Aa and 1Ab are supported by upper and lower chamber portions 41a and 41b, respectively. The upper and lower holding devices 1Aa and 1Ab hold the substrates W1 and W2 as shown in FIG. 5 and, for example, the upper holding device 1Aa is driven downward to bond the substrates W1 and W2 together under pressure. After the substrates W1 and W2 are bonded, the substrates W1 and W2 are removed from the upper and lower holding devices 1Aa and 1Ab, and the assembly of, for example, a liquid crystal panel is completed.
なお、本実施例では、対象物としての基板W1,W2を貼り合わせる目的で、基板組立装置37の上下保持装置1Aa,1Abとして吸着離脱装置が一対設けられているが、これに限定されるものではない。   In the present embodiment, a pair of adsorption / desorption devices are provided as the upper and lower holding devices 1Aa and 1Ab of the substrate assembly device 37 for the purpose of bonding the substrates W1 and W2 as the objects. However, the present invention is not limited to this. is not.
すなわち、吸着離脱装置は、減圧雰囲気中で処理される対象物を吸着保持するものであればよく、実施例1の保持装置1のように一つ設ける等、対象物の処理目的に応じて個数等を適宜変更することができる。   In other words, the adsorption / desorption device may be any device that adsorbs and holds an object to be processed in a reduced-pressure atmosphere. Etc. can be appropriately changed.
上下保持装置1Aa,1Abは、基本的に実施例1の保持装置1と同一構成であるが、配管部7Aが実施例1とは異なる。また、本実施例では、コントローラ25Aも実施例1とは異なっている。   The upper and lower holding devices 1Aa and 1Ab basically have the same configuration as the holding device 1 of the first embodiment, but the piping portion 7A is different from the first embodiment. In the present embodiment, the controller 25A is also different from the first embodiment.
すなわち、配管部7Aは、減圧管19Aが減圧室39内に開口すると共に加圧管21Aが減圧室39外に引き出されて大気中に開口する。   That is, in the piping part 7A, the decompression pipe 19A opens into the decompression chamber 39 and the pressurization pipe 21A is drawn out of the decompression chamber 39 and opens into the atmosphere.
従って、空間部15は、一方で共通管17、切替弁9A、減圧管19Aを介して減圧室39に開放されて、減圧室39に対する減圧源47に接続される。他方では、空間部15が共通管17、切替弁9A、加圧管21Aを介して加圧源としての大気に開放される。なお、減圧管19Aは、減圧源47に直接接続しても良い。   Accordingly, the space portion 15 is opened to the decompression chamber 39 via the common pipe 17, the switching valve 9 </ b> A, and the decompression pipe 19 </ b> A, and is connected to the decompression source 47 for the decompression chamber 39. On the other hand, the space 15 is opened to the atmosphere as a pressurizing source through the common pipe 17, the switching valve 9A, and the pressurizing pipe 21A. Note that the pressure reducing pipe 19 </ b> A may be directly connected to the pressure reducing source 47.
コントローラ25Aは、基板W1,W2を保持装置1Aa,1Abによって吸着保持する時又は吸着保持している時(非取り外し時)に、切替弁9Aを切り替えて空間部15と減圧室39とを連通させる。   The controller 25A switches the switching valve 9A to connect the space portion 15 and the decompression chamber 39 when the substrates W1 and W2 are sucked and held by the holding devices 1Aa and 1Ab or are sucked and held (when not removed). .
これにより、空間部15は、減圧室39を介して減圧源47によって減圧され、減圧室39の内部雰囲気(周辺雰囲気)である減圧雰囲気との圧力差が減少して吸着部材3Aが非膨出状態となる。なお、かかる圧力差の減少は、吸着部材3Aが非膨出状態となる程度に小さい場合と圧力差が無くなる場合とを含む。   As a result, the space 15 is decompressed by the decompression source 47 through the decompression chamber 39, the pressure difference from the decompressed atmosphere that is the internal atmosphere (peripheral atmosphere) of the decompression chamber 39 is reduced, and the adsorption member 3A does not bulge. It becomes a state. The reduction in the pressure difference includes a case where the adsorption member 3A is small enough to be in a non-expanded state and a case where the pressure difference disappears.
一方、基板W1,W2の取り外し時には、コントローラ25Aが切替弁9Aを切り替えて、空間部15と減圧室39外の大気とを連通させる。これにより、空間部15は、大気によって加圧され、減圧室39の内部雰囲気との圧力差が増加し、吸着部材3Aを基板W1,W2側に膨出させる(図2(B)参照)。なお、かかる圧力差の増加は、少なくとも吸着部材3Aが膨出する程度のものであり、圧力差が無い状態から圧力差が生じる場合も含む。   On the other hand, when the substrates W1 and W2 are removed, the controller 25A switches the switching valve 9A to connect the space 15 and the atmosphere outside the decompression chamber 39. As a result, the space 15 is pressurized by the atmosphere, the pressure difference from the internal atmosphere of the decompression chamber 39 increases, and the adsorption member 3A bulges toward the substrates W1 and W2 (see FIG. 2B). The increase in the pressure difference is at least enough to cause the adsorbing member 3A to swell, and includes a case where the pressure difference occurs from a state where there is no pressure difference.
本実施例では、減圧室39が基板W1,W2の取り外し時に大気に開放され、そのときの減圧室39内の圧力に応じてコントローラ25Aが切替弁9Aの切替を行う。   In this embodiment, the decompression chamber 39 is opened to the atmosphere when the substrates W1 and W2 are removed, and the controller 25A switches the switching valve 9A according to the pressure in the decompression chamber 39 at that time.
すなわち、コントローラ25Aは、基板W1,W2の取り外しを開始する場合、リーク弁51を切り替えて減圧室39を大気に開放する。このとき、コントローラ25Aは、減圧室39の圧力を圧力センサ53から取得し、減圧室39内の圧力が大気圧よりも低い間に切替弁9Aを切り替えて空間部15を大気に開放する。   That is, when starting to remove the substrates W1 and W2, the controller 25A switches the leak valve 51 to open the decompression chamber 39 to the atmosphere. At this time, the controller 25A acquires the pressure in the decompression chamber 39 from the pressure sensor 53, and switches the switching valve 9A to open the space 15 to the atmosphere while the pressure in the decompression chamber 39 is lower than the atmospheric pressure.
本実施例では、減圧室39内の圧力と大気圧との圧力差が閾値以下になったときに、切替弁9Aを切り替えて空間部15を大気に開放する。圧力差の閾値は、空間部15が大気に開放された際に、吸着部材3Aが過剰に膨出しない範囲で設定される。また、空間部15の大気への開放速度は、吸着部材3Aの膨出によって基板W1,W2に過度な衝撃を与えない範囲で設定するのが好ましい。   In the present embodiment, when the pressure difference between the pressure in the decompression chamber 39 and the atmospheric pressure becomes equal to or less than the threshold value, the switching valve 9A is switched to open the space 15 to the atmosphere. The threshold value of the pressure difference is set in a range in which the adsorption member 3A does not bulge excessively when the space 15 is opened to the atmosphere. Moreover, it is preferable that the opening speed of the space 15 to the atmosphere is set within a range in which an excessive impact is not applied to the substrates W1 and W2 due to the swelling of the adsorption member 3A.
なお、実施例2にも、実施例1の変形例の構成を適用することができる。
[基板の貼り合わせ及び取り外し動作]
基板W1,W2を貼り合わせる際には、図5のように、上下保持装置1Aa,1Abに基板W1,W2を吸着保持させ、且つ減圧室39を密閉状態としておく。
The configuration of the modified example of the first embodiment can also be applied to the second embodiment.
[Boarding and removal of substrates]
When the substrates W1 and W2 are bonded together, as shown in FIG. 5, the substrates W1 and W2 are sucked and held by the vertical holding devices 1Aa and 1Ab, and the decompression chamber 39 is kept in a sealed state.
基板W1,W2の吸着保持の際は、まず減圧室39の上下チャンバ部41a,41bを開放しておき、ロボット・アーム等で基板W1,W2を搬送しつつ上下保持装置1Aa,1Abの吸着部材3Aに基板W1,W2を押し付ける。この場合、上下チャンバ部41a,41bの一方、例えば下チャンバ部41bを水平方向に移動させる等して、上下チャンバ部41a,41bやそれらに支持される上下保持装置1Aa,1Abが上下に対向しないようにするのが好ましい。   When adsorbing and holding the substrates W1 and W2, first, the upper and lower chamber portions 41a and 41b of the decompression chamber 39 are opened, and the adsorbing members of the upper and lower holding devices 1Aa and 1Ab are conveyed while the substrates W1 and W2 are conveyed by a robot arm or the like. The substrates W1 and W2 are pressed against 3A. In this case, one of the upper and lower chamber portions 41a and 41b, for example, the lower chamber portion 41b is moved in the horizontal direction, so that the upper and lower chamber portions 41a and 41b and the upper and lower holding devices 1Aa and 1Ab supported by them do not face vertically. It is preferable to do so.
なお、これら上下チャンバ部41a,41bの動作は、コントローラ25Aや他の制御ユニットによって制御させればよい。   In addition, what is necessary is just to control operation | movement of these upper and lower chamber parts 41a and 41b by the controller 25A or another control unit.
このとき、コントローラ25Aは、上下保持装置1Aa,1Abの切替弁9Aを切り替えて、上下保持装置1Aa,1Abの空間部15を減圧室39内に連通させる。   At this time, the controller 25 </ b> A switches the switching valve 9 </ b> A of the upper and lower holding devices 1 </ b> Aa and 1 </ b> Ab to communicate the space portion 15 of the upper and lower holding devices 1 </ b> Aa and 1 </ b> Ab with the inside of the decompression chamber 39.
この吸着保持の際には、減圧室39が大気に開放されており、空間部15を減圧室39を介して大気に開放することができる。このため、空間部15は、減圧室39の内部雰囲気との圧力差が無くなる。   At the time of this adsorption holding, the decompression chamber 39 is opened to the atmosphere, and the space 15 can be opened to the atmosphere via the decompression chamber 39. For this reason, the space 15 has no pressure difference from the internal atmosphere of the decompression chamber 39.
なお、空間部15が直前に行われた基板W1,W2の吸着離脱によって大気圧との圧力差が無いか或いは吸着部材3Aが膨出しない程度に小さい場合は、次述する減圧室39を減圧する際に、上下保持装置1Aa,1Abの空間部15を減圧室39内に連通させてもよい。   If there is no pressure difference from the atmospheric pressure due to the adsorption and separation of the substrates W1 and W2 performed immediately before the space 15 or the adsorption member 3A is small enough not to bulge, the decompression chamber 39 described below is decompressed. In doing so, the space 15 of the upper and lower holding devices 1Aa and 1Ab may be communicated with the decompression chamber 39.
図5の基板W1,W2の保持状態且つ減圧室39の密閉状態では、減圧室39が減圧されて減圧雰囲気とされる。すなわち、コントローラ25Aは、吸気管45を介して減圧源47によって減圧室39内を減圧させる。   When the substrates W1 and W2 in FIG. 5 are held and the decompression chamber 39 is sealed, the decompression chamber 39 is decompressed to form a decompressed atmosphere. That is, the controller 25 </ b> A depressurizes the interior of the decompression chamber 39 by the decompression source 47 through the intake pipe 45.
このとき、空間部15は、減圧室39に連通しているので、減圧室39と共に減圧源47によって減圧され、減圧雰囲気となった減圧室39の内部雰囲気との圧力差が無くなる。   At this time, since the space portion 15 communicates with the decompression chamber 39, the pressure is reduced by the decompression source 47 together with the decompression chamber 39, and the pressure difference from the internal atmosphere of the decompression chamber 39 that has become the decompressed atmosphere disappears.
結果として、基板W1,W2を吸着している吸着部材3Aの姿勢が非膨出状態で維持され、基板W1,W2の吸着状態を確実に維持することができる。   As a result, the posture of the adsorption member 3A that adsorbs the substrates W1 and W2 is maintained in the non-expanded state, and the adsorption state of the substrates W1 and W2 can be reliably maintained.
こうして減圧室39が減圧雰囲気になった後は、例えば上保持装置1Aaを下方に駆動し、上下保持装置1Aa,1Abによって基板W1,W2同士を加圧して貼り合わせる。   After the decompression chamber 39 is in a decompressed atmosphere in this way, for example, the upper holding device 1Aa is driven downward, and the substrates W1 and W2 are pressurized and bonded together by the upper and lower holding devices 1Aa and 1Ab.
なお、基板W1,W2の貼り合わせは、予め基板W2に塗布された接着剤を介して行われる。また、基板W1,W2の貼り合わせは、減圧雰囲気中で行われるから、空気の残留(気泡の発生)を防止することができる。   Bonding of the substrates W1 and W2 is performed via an adhesive that is applied to the substrate W2 in advance. Further, since the substrates W1 and W2 are bonded together in a reduced-pressure atmosphere, it is possible to prevent air from remaining (bubble generation).
基板W1,W2を貼り合わせた後は、上下保持装置1Aa,1Abから基板W1,W2が取り外されて、それら基板W1,W2からなるパネルの組立が完了する。   After the substrates W1 and W2 are bonded together, the substrates W1 and W2 are removed from the upper and lower holding devices 1Aa and 1Ab, and the assembly of the panel composed of the substrates W1 and W2 is completed.
上保持装置1Aaから基板W1を取り外す際は、まず、コントローラ25Aがリーク弁51を切り替えて減圧室39内をリーク管49を介して大気に開放する。これにより、減圧室39内の圧力が上昇していく。   When removing the substrate W1 from the upper holding device 1Aa, first, the controller 25A switches the leak valve 51 to open the inside of the decompression chamber 39 to the atmosphere via the leak pipe 49. As a result, the pressure in the decompression chamber 39 increases.
このとき、コントローラ25Aは、圧力センサ53から減圧室39内の圧力を取得し、減圧室39内の圧力と大気圧との差が閾値以下になったか否かを判断する。   At this time, the controller 25A acquires the pressure in the decompression chamber 39 from the pressure sensor 53, and determines whether or not the difference between the pressure in the decompression chamber 39 and the atmospheric pressure is equal to or less than a threshold value.
減圧室39内の圧力と大気圧との差が閾値以下になった場合は、コントローラ25Aが上保持装置1Aaの切替弁9Aを切り替えて空間部15を大気に開放する。このため、上保持装置1Aaでは、その空間部15が減圧室39の内部雰囲気よりも相対的に高い大気圧となって(加圧されて)、減圧室39と空間部15との間の圧力差が生じる。   When the difference between the pressure in the decompression chamber 39 and the atmospheric pressure becomes equal to or less than the threshold value, the controller 25A switches the switching valve 9A of the upper holding device 1Aa to open the space 15 to the atmosphere. For this reason, in the upper holding device 1 </ b> Aa, the space portion 15 becomes an atmospheric pressure that is relatively higher (pressurized) than the internal atmosphere of the decompression chamber 39, and the pressure between the decompression chamber 39 and the space portion 15. There is a difference.
これに応じ、吸着部材3Aは、空間部15に対応した位置において表裏での圧力差が生じ、かかる圧力差に基づいて空間部15側から大気圧で押圧され、基板W1側である下方に部分的に膨出する(図2(B)参照)。   Accordingly, the suction member 3A has a pressure difference between the front and back surfaces at a position corresponding to the space portion 15, and is pressed by the atmospheric pressure from the space portion 15 side based on the pressure difference, and is partially below the substrate W1 side. Bulge out (see FIG. 2B).
この膨出により、基板W1は、吸着部材3Aの他の部分に対して下方に押圧されて、上保持装置1Aaから取り外されることになる。この状態で、上保持装置1Aaを上方へ駆動すると、上保持装置1Aaからの基板W1の取り外しが完了する。   Due to this swelling, the substrate W1 is pressed downward against the other part of the adsorption member 3A, and is removed from the upper holding device 1Aa. When the upper holding device 1Aa is driven upward in this state, the removal of the substrate W1 from the upper holding device 1Aa is completed.
一方、下保持装置1Abに対しても、基板W2の取り外しが行われる。下保持装置1Abからの基板W2の取り外しは、減圧室39内の圧力と大気圧との差が閾値以下である間、本実施例では上保持装置1Aaからの基板W1の取り外しと同時期に行われる。   On the other hand, the substrate W2 is also removed from the lower holding device 1Ab. The removal of the substrate W2 from the lower holding device 1Ab is performed at the same time as the removal of the substrate W1 from the upper holding device 1Aa in this embodiment while the difference between the pressure in the decompression chamber 39 and the atmospheric pressure is equal to or less than the threshold value. Is called.
下保持装置1Abからの基板W2の取り外しの際も、コントローラ25Aが下保持装置1Abの切替弁9Aを切り替えて空間部15を大気に開放し、吸着部材3Aを空間部15に対応した位置において基板W2側である上方に部分的に膨出させる(図2(B)参照)。かかる膨出により、基板W2は、下保持装置1Abから取り外されることになる。   When removing the substrate W2 from the lower holding device 1Ab, the controller 25A switches the switching valve 9A of the lower holding device 1Ab to open the space 15 to the atmosphere, and the adsorption member 3A is located at a position corresponding to the space 15. Partially bulges upward on the W2 side (see FIG. 2B). Due to such swelling, the substrate W2 is removed from the lower holding device 1Ab.
こうして基板W1,W2が上下保持装置1Aa,1Abから取り外されると、それら基板W1,W2からなるパネルが下保持装置1Ab上に載置された状態となる。   When the substrates W1 and W2 are removed from the upper and lower holding devices 1Aa and 1Ab in this way, the panel made of the substrates W1 and W2 is placed on the lower holding device 1Ab.
その後は、減圧室39を開放することにより、パネルを減圧室39から搬送させることができる。
[実施例2の効果]
本実施例の上下保持装置1Aa,1Abは、それぞれ基板W1,W2を表面に吸着し少なくとも基板W1,W2の貼り合わせ(処理)時に減圧室39内に配置される可撓性の吸着部材3Aと、吸着部材3Aの裏面に周辺雰囲気である減圧室39の内部雰囲気に対して区画された空間部15を形成する裏面部材5と、空間部15を減圧源47に接続すると共に加圧源としての大気に接続する配管部7Aと、空間部15に対し配管部7Aを介した減圧源47による減圧と大気による加圧とを切り替える切替弁9Aとを備えている。
Thereafter, the panel can be transported from the decompression chamber 39 by opening the decompression chamber 39.
[Effect of Example 2]
The upper and lower holding devices 1Aa and 1Ab of the present embodiment are respectively provided with a flexible adsorbing member 3A that adsorbs the substrates W1 and W2 to the surface and is disposed in the decompression chamber 39 at least when the substrates W1 and W2 are bonded (processed). The back surface member 5 that forms the space 15 partitioned with respect to the inner atmosphere of the decompression chamber 39, which is the ambient atmosphere, on the back surface of the adsorbing member 3A, and the space 15 is connected to the decompression source 47 and as a pressure source 7 A of piping parts connected to air | atmosphere and the switching valve 9A which switches the pressure reduction by the pressure reduction source 47 via the piping part 7A and the pressurization by air | atmosphere with respect to the space part 15 are provided.
そして、上下保持装置1Aa,1Abは、切替部9Aの切り替えにより、基板W1,W2の取り外し時に空間部15を加圧し、減圧室39の内部雰囲気との圧力差を増加させて吸着部材3Aを基板W1,W2側に膨出させ、基板W1,W2の非取り外し時に空間部15を減圧し、減圧室39の内部雰囲気との圧力差を減少させて吸着部材3Aを非膨出状態とする。   Then, the upper and lower holding devices 1Aa and 1Ab pressurize the space 15 when the substrates W1 and W2 are removed by switching the switching unit 9A, and increase the pressure difference with the internal atmosphere of the decompression chamber 39 to place the adsorption member 3A on the substrate. When the substrates W1 and W2 are not removed, the space 15 is decompressed to reduce the pressure difference from the internal atmosphere of the decompression chamber 39, and the adsorption member 3A is brought into a non-expanded state.
従って、本実施例では、減圧雰囲気中で基板W1,W2を貼り合わせる際にも、実施例1と同様の作用効果を奏することができる。   Therefore, in the present embodiment, the same effects as those of the first embodiment can be achieved when the substrates W1 and W2 are bonded together in a reduced-pressure atmosphere.
加えて、本実施例では、配管部7Aを、一方で空間部15を減圧室39に開放し、他方で空間部15を加圧源としての大気に開放する単純な構造とすることができ、減圧室39及び大気を利用して構造の簡素化を図ることができる。   In addition, in the present embodiment, the piping part 7A can have a simple structure that opens the space part 15 to the decompression chamber 39 on the one hand and opens the space part 15 to the atmosphere as a pressurization source on the other hand, The structure can be simplified using the decompression chamber 39 and the atmosphere.
また、本実施例では、切替弁9Aを制御するコントローラ25Aと、減圧室39内の圧力を監視する圧力センサ53とを備え、減圧室39が、基板W1,W2を取り外す時に大気に開放され、コントローラ25Aが、圧力センサ53による減圧室39内の圧力の監視に基づいて、減圧室39内の圧力が大気圧よりも低い間に切替弁9Aを切り替えて空間部15を大気に開放する。   In this embodiment, the controller 25A for controlling the switching valve 9A and the pressure sensor 53 for monitoring the pressure in the decompression chamber 39 are provided, and the decompression chamber 39 is opened to the atmosphere when the substrates W1 and W2 are removed. Based on the monitoring of the pressure in the decompression chamber 39 by the pressure sensor 53, the controller 25A switches the switching valve 9A to open the space 15 to the atmosphere while the pressure in the decompression chamber 39 is lower than the atmospheric pressure.
従って、本実施例では、空間部15と減圧室39との圧力差を確実に増加させ、確実に基板W1,W2の取り外しを行うことができる。   Therefore, in this embodiment, the pressure difference between the space portion 15 and the decompression chamber 39 can be reliably increased, and the substrates W1 and W2 can be reliably removed.
本実施例のコントローラ25Aは、減圧室39内の圧力と大気圧との圧力差が閾値以下になったときに、切替弁9Aを切り替えて空間部15を大気に開放する。   The controller 25A according to the present embodiment switches the switching valve 9A to open the space 15 to the atmosphere when the pressure difference between the pressure in the decompression chamber 39 and the atmospheric pressure becomes equal to or less than the threshold value.
従って、本実施例では、減圧室39内の圧力及び大気圧間の圧力差と吸着部材3Aの撓み量等とに応じて閾値を設定すれば、吸着部材3Aの膨出量を調整して吸着部材3Aが過度に撓むことを抑制できる。   Therefore, in this embodiment, if the threshold value is set according to the pressure difference between the pressure reducing chamber 39 and the atmospheric pressure, the amount of deflection of the adsorption member 3A, and the like, the amount of expansion of the adsorption member 3A is adjusted and the adsorption is performed. It can suppress that member 3A bends excessively.
結果として、吸着部材3Aの損傷を防止できると共に、吸着部材3Aの膨出による基板W1,W2に対する押圧力を調整でき基板W1,W2の損傷を確実に防止できる。   As a result, damage to the adsorption member 3A can be prevented, and the pressing force against the substrates W1 and W2 due to the expansion of the adsorption member 3A can be adjusted, so that damage to the substrates W1 and W2 can be reliably prevented.
また、本実施例では、空間部15の大気への開放速度(加圧速度)に応じ、吸着部材3Aの膨出速度を調整し、基板W1,W2を過度な衝撃によって損傷させることを防止できる。
[その他]
以上、本発明の実施例について説明したが、本発明はこれに限定されるものではない。
Further, in this embodiment, the bulging speed of the adsorption member 3A is adjusted according to the opening speed (pressurization speed) of the space 15 to the atmosphere, and it is possible to prevent the substrates W1 and W2 from being damaged by excessive impact. .
[Others]
As mentioned above, although the Example of this invention was described, this invention is not limited to this.
例えば、実施例1では、空間部15の減圧源として大気を利用し、実施例2では、空間部15の減圧源として減圧室39の減圧源47を利用すると共に加圧源として大気を利用していたが、それらの利用に代えて、別途ポンプ等からなる減圧源や加圧源を設けてもよい。   For example, in the first embodiment, the atmosphere is used as a decompression source of the space portion 15, and in the embodiment 2, the decompression source 47 of the decompression chamber 39 is used as a decompression source of the space portion 15 and the atmosphere is used as a pressurization source. However, instead of using them, a pressure reduction source or a pressure source consisting of a pump or the like may be provided separately.
この場合、切替部としては、減圧源及び加圧源の駆動制御を行うコントローラ等とすることも可能である。   In this case, the switching unit may be a controller or the like that performs drive control of the decompression source and the pressurization source.
また、加圧管21,21A及び減圧管19,19Aは、共通管17によって空間部15に接続されていたが、それぞれ独立して空間部15に接続する構成であっても良い。   Moreover, although the pressurization pipes 21 and 21A and the pressure reduction pipes 19 and 19A are connected to the space part 15 by the common pipe 17, they may be configured to be connected to the space part 15 independently.
1 保持装置(吸着離脱装置)
3 吸着部材
5 裏面部材
7 配管部
9 切替弁(切替部)
11 支持部
13 貫通孔
23 加圧源
25 コントローラ
1 Holding device (Suction / removal device)
3 Adsorbing member 5 Back member 7 Piping section 9 Switching valve (switching section)
DESCRIPTION OF SYMBOLS 11 Support part 13 Through-hole 23 Pressure source 25 Controller

Claims (7)

  1. 対象物を表面に吸着する可撓性の吸着部材と、
    該吸着部材の裏面に周辺雰囲気に対して区画された空間部を形成する裏面部材と、
    前記空間部を減圧源に接続すると共に加圧源に接続する配管部と、
    前記空間部に対し前記配管部を介した前記減圧源による減圧と前記加圧源による加圧とを切り替える切替部とを備え、
    前記切替部の切り替えにより、前記対象物の取り外し時に前記空間部を加圧し、前記周辺雰囲気との圧力差を増加させて前記吸着部材を前記対象物側に膨出させ、前記対象物の非取り外し時に前記空間部を減圧し、前記周辺雰囲気との圧力差を減少させて前記吸着部材を非膨出状態とする、
    ことを特徴とする吸着離脱装置。
    A flexible adsorption member that adsorbs an object to the surface;
    A back surface member that forms a space partitioned with respect to the surrounding atmosphere on the back surface of the adsorption member;
    A pipe part for connecting the space part to a pressure source and a pressure source;
    A switching unit that switches between depressurization by the depressurization source and pressurization by the pressurization source via the piping unit with respect to the space unit,
    By switching the switching unit, the space part is pressurized when the object is removed, the pressure difference from the surrounding atmosphere is increased, and the adsorption member is bulged toward the object side, and the object is not removed. Sometimes the space is depressurized and the pressure difference with the surrounding atmosphere is reduced to bring the adsorbing member into a non-bulged state,
    An adsorption / desorption device characterized by that.
  2. 請求項1記載の吸着離脱装置であって、
    前記周辺雰囲気は、大気であり、
    前記配管部は、前記空間部を前記減圧源としての大気に開放すると共に大気圧以上に加圧する加圧源に接続する、
    ことを特徴とする吸着離脱装置。
    The adsorption / desorption device according to claim 1,
    The ambient atmosphere is air,
    The pipe part is connected to a pressure source that opens the space part to the atmosphere as the pressure reduction source and pressurizes the space part to an atmospheric pressure or higher.
    An adsorption / desorption device characterized by that.
  3. 減圧室の減圧雰囲気中で処理される対象物を吸着し、前記処理後に対象物を取り外す吸着離脱装置であって、
    前記対象物を表面に吸着し少なくとも前記対象物の処理時に前記減圧室内に配置される可撓性の吸着部材と、
    該吸着部材の裏面に前記減圧室の内部雰囲気に対して区画された空間部を形成する裏面部材と、
    前記空間部を減圧源に接続すると共に加圧源に接続する配管部と、
    前記空間部に対し前記配管部を介した前記減圧源による減圧と前記加圧源による加圧とを切り替える切替部とを備え、
    前記切替部の切り替えにより、前記対象物の取り外し時に前記空間部を加圧し、前記減圧室の内部雰囲気との圧力差を増加させて前記吸着部材を前記対象物側に膨出させ、前記対象物の非取り外し時に前記空間部を減圧し、前記減圧室の内部雰囲気との圧力差を減少させて前記吸着部材を非膨出状態とする、
    ことを特徴とする吸着離脱装置。
    An adsorption desorption device that adsorbs an object to be processed in a reduced pressure atmosphere of a decompression chamber and removes the object after the processing,
    A flexible adsorbing member that adsorbs the object to the surface and is disposed in the decompression chamber at least when the object is processed;
    A back member that forms a space defined on the back surface of the suction member with respect to the internal atmosphere of the decompression chamber;
    A pipe part for connecting the space part to a pressure source and a pressure source;
    A switching unit that switches between depressurization by the depressurization source and pressurization by the pressurization source via the piping unit with respect to the space unit,
    By switching the switching unit, the space is pressurized when the object is removed, the pressure difference with the internal atmosphere of the decompression chamber is increased, and the adsorption member is expanded toward the object, and the object Decompressing the space when not removed, reducing the pressure difference with the internal atmosphere of the decompression chamber to bring the adsorbing member into a non-expanded state,
    An adsorption / desorption device characterized by that.
  4. 請求項3記載の吸着離脱装置であって、
    前記配管部は、前記空間部を前記減圧室に開放して前記減圧室に対する減圧源に接続すると共に前記空間部を前記加圧源としての大気に開放する、
    ことを特徴とする吸着離脱装置。
    The adsorption / desorption device according to claim 3,
    The piping part opens the space part to the decompression chamber and connects to a decompression source for the decompression chamber and opens the space part to the atmosphere as the pressurization source.
    An adsorption / desorption device characterized by that.
  5. 請求項4記載の吸着離脱装置であって、
    前記切替部を制御するコントローラと、
    前記減圧室内の圧力を監視する圧力センサとを備え、
    前記減圧室は、前記吸着した対象物を取り外す時に大気に開放され、
    前記コントローラは、前記圧力センサによる前記減圧室内の圧力の監視に基づいて前記減圧室内の圧力が大気圧よりも低い間に前記切替部を切り替えて前記空間部を大気に開放する、
    ことを特徴とする吸着離脱装置。
    The adsorption / desorption device according to claim 4,
    A controller for controlling the switching unit;
    A pressure sensor for monitoring the pressure in the decompression chamber;
    The decompression chamber is opened to the atmosphere when removing the adsorbed object,
    The controller switches the switching unit while the pressure in the decompression chamber is lower than the atmospheric pressure based on monitoring of the pressure in the decompression chamber by the pressure sensor to open the space portion to the atmosphere.
    An adsorption / desorption device characterized by that.
  6. 請求項5記載の吸着離脱装置であって、
    前記コントローラは、前記減圧室内の圧力と大気圧との圧力差が閾値以下になったときに、前記切替部を切り替えて前記空間部を大気に開放する、
    ことを特徴とする吸着離脱装置。
    The adsorption / desorption device according to claim 5,
    When the pressure difference between the pressure in the decompression chamber and the atmospheric pressure is equal to or less than a threshold, the controller switches the switching unit to open the space to the atmosphere.
    An adsorption / desorption device characterized by that.
  7. 請求項1〜6の何れか一項に記載の吸着離脱装置であって、
    前記裏面部材は、前記吸着部材を裏面側から支持する支持部と、該支持部を貫通して前記吸着部材の裏面に至り前記空間部を区画する貫通孔とを備える、
    ことを特徴とする吸着離脱装置。
    The adsorption / desorption device according to any one of claims 1 to 6,
    The back surface member includes a support portion that supports the adsorption member from the back surface side, and a through hole that penetrates the support portion and reaches the back surface of the adsorption member to partition the space portion.
    An adsorption / desorption device characterized by that.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200117214A (en) * 2019-04-03 2020-10-14 세메스 주식회사 A substrate supproting module

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005098522A1 (en) * 2004-04-09 2005-10-20 Shin-Etsu Engineering Co., Ltd. Adhesive chuck device
JP2006000930A (en) * 2004-06-15 2006-01-05 Shin Etsu Polymer Co Ltd Component holder
JP2009294638A (en) * 2008-06-02 2009-12-17 Advanced Display Process Engineering Co Ltd Substrate-attaching device {apparatus for attaching substrates}
JP2010049048A (en) * 2008-08-22 2010-03-04 Kuraimu Prod Kk Method and apparatus for sticking workpiece
JP2012195609A (en) * 2006-07-07 2012-10-11 Erich Thallner Handling device and handling method for wafer
JP2013112119A (en) * 2011-11-28 2013-06-10 Denso Corp Electric power steering control device
JP2014232772A (en) * 2013-05-28 2014-12-11 リンテック株式会社 Electrostatic holding device and method for removing holding object from the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005098522A1 (en) * 2004-04-09 2005-10-20 Shin-Etsu Engineering Co., Ltd. Adhesive chuck device
JP2006000930A (en) * 2004-06-15 2006-01-05 Shin Etsu Polymer Co Ltd Component holder
JP2012195609A (en) * 2006-07-07 2012-10-11 Erich Thallner Handling device and handling method for wafer
JP2009294638A (en) * 2008-06-02 2009-12-17 Advanced Display Process Engineering Co Ltd Substrate-attaching device {apparatus for attaching substrates}
JP2010049048A (en) * 2008-08-22 2010-03-04 Kuraimu Prod Kk Method and apparatus for sticking workpiece
JP2013112119A (en) * 2011-11-28 2013-06-10 Denso Corp Electric power steering control device
JP2014232772A (en) * 2013-05-28 2014-12-11 リンテック株式会社 Electrostatic holding device and method for removing holding object from the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200117214A (en) * 2019-04-03 2020-10-14 세메스 주식회사 A substrate supproting module
KR102226270B1 (en) 2019-04-03 2021-03-09 세메스 주식회사 A substrate supproting module

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