CN207116403U - A kind of transposition head for microcomponent transfer - Google Patents
A kind of transposition head for microcomponent transfer Download PDFInfo
- Publication number
- CN207116403U CN207116403U CN201720426695.9U CN201720426695U CN207116403U CN 207116403 U CN207116403 U CN 207116403U CN 201720426695 U CN201720426695 U CN 201720426695U CN 207116403 U CN207116403 U CN 207116403U
- Authority
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- China
- Prior art keywords
- microcomponent
- bulge
- adhesive layer
- transposition head
- flexible adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017105 transposition Effects 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000012790 adhesive layer Substances 0.000 claims abstract description 27
- 238000010521 absorption reaction Methods 0.000 claims abstract description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004425 Makrolon Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of transposition head for microcomponent transfer, including：Substrate body；Bulge-structure, it protrudes from the substrate body；And flexible adhesive layer, it is covered in the surface of the bulge-structure.Transposition head provided by the utility model, it protrudes a bulge-structure using from substrate body, and the absorption affinity of microcomponent is shifted by the flexible adhesive layer being covered on bulge-structure, is applied to microcomponent of the transfer with certain surface roughness especially；Bulge-structure excludes air using through hole, and microcomponent is shifted by vacuum pressure, lifts the reliability of high quality fast transfer microcomponent.
Description
Technical field
It the utility model is related to a kind of transposition head, more particularly to a kind of transposition head for microcomponent transfer.
Background technology
Microcomponent technology refers on substrate with the element arrays of the microsize of High Density Integration.At present, micro- spacing hair
Optical diode（Micro LED）Technology is increasingly becoming research hot topic, and the microcomponent product that industrial quarters is expected to have high-quality enters to enter the market
.The micro- spacing light emitting diode product of high-quality can such as LCD/OLED existing in the market tradition to show that product produces deep
Carving influences.
During microcomponent is manufactured, microcomponent is formed on donor substrate first, then microcomponent is transferred to and connect
Receive on substrate.It is, for example, display screen to receive substrate.A difficulty during microcomponent is manufactured is：How by microcomponent from
It is transferred to and is received on substrate on donor substrate.
The method of tradition transfer microcomponent is to be engaged by substrate（Wafer Bonding）Microcomponent is turned from transfer base substrate
Move to reception substrate.The one of which implementation of transfer method is directly transfer, that is, directly by microcomponent array rotation
Move substrate and be bonded to reception substrate, afterwards again remove transfer base substrate.Another implementation is indirect branch.The method includes
The step of engaging/peeling off twice, first, transfer base substrate extract microcomponent array from donor substrate, and then transfer base substrate again will be micro-
Element arrays are bonded to reception substrate, and finally transfer base substrate is removed again.Wherein, extraction microcomponent array is typically picked up by electrostatic
The mode that takes performs.Transfer head array is needed to use during electrostatic picks up.It is relative complex to shift the structure of head array,
And need to consider its reliability.Manufacture transfer head array needs extra cost.Using before shifting the pickup of head array
Need to produce phase change.In addition, shifting process limited efficacy, and cause yield small and poor reliability.
The content of the invention
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model includes：One kind is used for microcomponent and shifted
Transposition head, including：Substrate body；Bulge-structure, it protrudes from the substrate body；And flexible adhesive layer, it is covered in
The surface of the bulge-structure.
Further, the bulge-structure is shifted using flexible adhesive layer to the absorption affinity of microcomponent.
Further, the bulge-structure includes the table top that side surface and lower surface are formed.
Further, the bulge-structure includes a through hole, and the through hole extends from substrate body, and through flexible viscous
Attached layer.
Further, the bulge-structure excludes air using through hole, and microcomponent is shifted by vacuum pressure.
Further, the flexible adhesive layer is covered in the side surface of the bulge-structure and the portion of the substrate body
Divide lower surface.
Further, the substrate body is from silicon or one of ceramics or metal or polymer or foregoing any combination.
Further, the flexible adhesive layer choosing silicones or glass or polyimides (PI) or dimethione
(PDMS) or polymethyl methacrylate (PMMA) or it is foregoing any combination one of.
Further, the thickness of the flexible adhesive layer is micron dimension.
Further, the thickness of the flexible adhesive layer is 10 μm ~ 1000 μm.
Compared with prior art, the utility model comprises at least following advantage：Transposition head provided by the utility model, its profit
A bulge-structure, and the absorption affinity by the flexible adhesive layer being covered on bulge-structure to microcomponent are protruded with from substrate body
Shifted, be applied to microcomponent of the transfer with certain surface roughness especially；Bulge-structure excludes air using through hole, by
Vacuum pressure shifts to microcomponent, lifts the reliability of high quality fast transfer microcomponent.
Other features and advantages of the utility model will illustrate in the following description, also, partly from specification
In become apparent, or understood by implementing the utility model.The purpose of this utility model and other advantages can pass through
Specifically noted structure is realized and obtained in specification, claims and accompanying drawing.
Brief description of the drawings
The utility model is further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the schematic diagram of the transposition head for being used for microcomponent transfer described in embodiment 1.
Fig. 2 is the schematic diagram of the transposition head for being used for microcomponent transfer described in embodiment 2.
Fig. 3 is the schematic diagram of the transposition head for being used for microcomponent transfer described in embodiment 3.
Fig. 4 is the schematic diagram of the transposition head for being used for microcomponent transfer described in embodiment 4.
Part symbol description in figure：100：Substrate body；101：Bulge-structure；200：Flexible adhesive layer；300：Microcomponent；
400：Bearing substrate；500：Through hole.
Embodiment
The utility model is described in detail with reference to specific embodiment.
Embodiment 1
As shown in Figure 1, there is provided a bearing substrate 400, material can be glass, silicon, makrolon（PC）, acrylic nitrile-butadiene two
Alkene-styrene（ABS）Or its any combination.Several microcomponents 300 are placed on bearing substrate 400, microcomponent can be hair
Optical element, LCD Controlling element, the components of photo-electric conversion, piezoelectric element, membrane transistor element, film diode element, resistance
Element, switch element, small magnetic element, minute optical element etc., the preferred microcomponent of the present embodiment are film LED（Thin
Light-emitting Diode）Light-emitting component, thickness can be about 0.5 μm to about 100 μm.The shape of microcomponent 300 can be circle
Cylinder, and the radius of cylinder can be about 0.5 μm to about 500 μm, but this is not limited to, microcomponent 300 can also be fabricated to three
Prism, cube, cuboid, hexagonal cylinder, anistree cylinder or other polygonal cylinders.
With continued reference to shown in Fig. 1, the transposition head for being used for microcomponent transfer of the present embodiment, including：Substrate body 100；It is convex
Structure 101, including the table top that side surface and lower surface are formed are played, it protrudes from substrate body 100；And flexible adhesive layer 200,
It is covered in the lower surface and side surface of the table top of the bulge-structure, i.e. bulge-structure.When the transposition head is micro- for shifting
During element, by transposition head towards the microcomponent 300 on bearing substrate 400, further, by the bulge-structure of transposition head
Microcomponent 300 of 101 alignments on bearing substrate, its relief structure are protruded from substrate body, are used to adsorb to provide
Effective contact point of microcomponent, the absorption affinity of microcomponent is adsorbed using flexible adhesive layer, to realize the transfer of microcomponent.
Aforesaid substrate body 100 is from silicon or one of ceramics or metal or polymer or foregoing any combination, the present embodiment
It is preferred that silicon, as substrate body, it can be monocrystalline silicon or polysilicon.Flexible adhesive layer 200 is from silicones or glass or poly-
Acid imide（PI）Or dimethione（PDMS）Or polymethyl methacrylate（PMMA）Or one of foregoing any combination, this reality
It is micron dimension that the preferred PDMS of example, which is applied, as flexible adhesive layer, its thickness, is preferably between 10 μm ~ 1000 μm, is had enough
Thin and excellent flexibility.
In general, transposition head realizes effective chucking power on the microcomponent of the flat surface without roughness, with
Adsorbed or captured.And in the case of adsorbing or capturing the microcomponent with certain surface roughness, have difficulties.In addition,
If simultaneously pick up several microcomponents, generation deviation that may be in the height direction.It is excellent by having in the present embodiment
It is flexible（As buffering）Flexible adhesive layer, the deviation can be overcome to a certain extent, so as to improve microcomponent transfer it is reliable
Property.
Embodiment 2
As shown in Fig. 2 as different from Example 1, the flexible adhesive layer 200 of the present embodiment transposition head is convex except being covered in
The lower surface and side surface of structure 101 are played, is also covered in the portion lower surface of substrate body 100, be i.e. flexible adhesive layer 200 covers
It is placed between the gap of several bulge-structures, that is, adds the area coverage of flexible adhesive layer, is advantageous to strengthen flexible adhesive
The contact area of layer and microcomponent, so as to strengthen the chucking power of the microcomponent on absorption out-of-flatness surface, it is adapted to absorption or crawl
The more irregular microcomponent of shape, as surface has the microcomponent of roughening or groove structure.Based on van der Waals interaction, this reality
Bigger chucking power can be provided more irregular microcomponent surface by applying the transposition head of example offer.
Embodiment 3
As shown in figure 3, as different from Example 1, the flexible adhesive layer 200 of the present embodiment transposition head is not covered in projection
The side surface of structure 101, the lower surface of bulge-structure 101 is only covered in, is adapted to absorption or crawl shape more regular（Highly
Difference is relatively low）Microcomponent.
Embodiment 4
As shown in figure 4, as different from Example 1, the bulge-structure 101 of the present embodiment transposition head also includes a through hole
500, the through hole extends from substrate body 100, and runs through flexible adhesive layer 200.The present embodiment utilizes the through hole of bulge-structure
Air is excluded, microcomponent is shifted with realizing by vacuum pressure.Vacuum is utilized because the transposition head of the present embodiment can provide
The chucking power of state, so further increasing the reliability of high quality fast transfer microcomponent.
Although have been described above exemplary embodiment of the present utility model, it should be understood that, the utility model not office
It is limited to these exemplary embodiments, but can be in the sheet as required by claim above including those skilled in the art
Variations and modifications are carried out in the spirit and scope of utility model.
Claims (9)
1. a kind of transposition head for microcomponent transfer, including：Substrate body；Bulge-structure, it protrudes from the substrate body；
And flexible adhesive layer, it is covered in the surface of the bulge-structure；The substrate body selects silicon or ceramics or metal.
A kind of 2. transposition head for microcomponent transfer according to claim 1, it is characterised in that：The bulge-structure profit
The absorption affinity of microcomponent is shifted with flexible adhesive layer.
A kind of 3. transposition head for microcomponent transfer according to claim 1, it is characterised in that：The bulge-structure bag
Include the table top that side surface and lower surface are formed.
A kind of 4. transposition head for microcomponent transfer according to claim 1, it is characterised in that：The bulge-structure bag
A through hole is included, the through hole extends from substrate body, and runs through flexible adhesive layer.
A kind of 5. transposition head for microcomponent transfer according to claim 4, it is characterised in that：The bulge-structure profit
Air is excluded with through hole, microcomponent is shifted by vacuum pressure.
A kind of 6. transposition head for microcomponent transfer according to claim 1, it is characterised in that：The flexible adhesive layer
It is covered in the side surface of the bulge-structure and the portion lower surface of the substrate body.
A kind of 7. transposition head for microcomponent transfer according to claim 1, it is characterised in that：The flexible adhesive layer
From silicones or glass or polyimides or dimethione or polymethyl methacrylate.
A kind of 8. transposition head for microcomponent transfer according to claim 1, it is characterised in that：The flexible adhesive layer
Thickness be micron dimension.
A kind of 9. transposition head for microcomponent transfer according to claim 8, it is characterised in that：The flexible adhesive layer
Thickness be 10 μm ~ 1000 μm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720426695.9U CN207116403U (en) | 2017-04-21 | 2017-04-21 | A kind of transposition head for microcomponent transfer |
| PCT/CN2018/082436 WO2018192389A1 (en) | 2017-04-21 | 2018-04-10 | Transposing head for transferring micro-elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720426695.9U CN207116403U (en) | 2017-04-21 | 2017-04-21 | A kind of transposition head for microcomponent transfer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207116403U true CN207116403U (en) | 2018-03-16 |
Family
ID=61596721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720426695.9U Active CN207116403U (en) | 2017-04-21 | 2017-04-21 | A kind of transposition head for microcomponent transfer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207116403U (en) |
| WO (1) | WO2018192389A1 (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018192389A1 (en) * | 2017-04-21 | 2018-10-25 | 厦门市三安光电科技有限公司 | Transposing head for transferring micro-elements |
| CN109304681A (en) * | 2018-11-06 | 2019-02-05 | 业成科技（成都）有限公司 | Adsorbent equipment and applying system |
| CN110265291A (en) * | 2018-03-12 | 2019-09-20 | 天津大学 | A kind of seal of transferring device and method using the seal transferring device |
| CN110416139A (en) * | 2019-09-11 | 2019-11-05 | 京东方科技集团股份有限公司 | A kind of transfer method shifting support plate, its production method and light-emitting diode chip for backlight unit |
| WO2020087812A1 (en) * | 2018-10-31 | 2020-05-07 | 昆山工研院新型平板显示技术中心有限公司 | Transfer device and transfer method for microelement |
| WO2020088099A1 (en) * | 2018-10-31 | 2020-05-07 | 昆山工研院新型平板显示技术中心有限公司 | Micro device transferring device and preparation method therefor |
| CN111199907A (en) * | 2018-11-20 | 2020-05-26 | 昆山工研院新型平板显示技术中心有限公司 | Transfer method and transfer apparatus for micro-light emitting device |
| CN111199908A (en) * | 2018-11-20 | 2020-05-26 | 昆山工研院新型平板显示技术中心有限公司 | Transfer method and transfer apparatus for micro-light emitting device |
| CN111244009A (en) * | 2018-11-29 | 2020-06-05 | 昆山工研院新型平板显示技术中心有限公司 | Transfer device for micro-components |
| CN112018218A (en) * | 2019-05-31 | 2020-12-01 | 云谷（固安）科技有限公司 | Micro light emitting diode transfer method and display panel manufacturing method |
| CN112582328A (en) * | 2020-12-10 | 2021-03-30 | 深圳市华星光电半导体显示技术有限公司 | Transfer substrate, manufacturing method thereof and transfer device |
| CN112967986A (en) * | 2020-10-19 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Transfer component, preparation method thereof and transfer head |
| CN113396485A (en) * | 2019-02-12 | 2021-09-14 | 信越化学工业株式会社 | Micro-structure transfer device, template head unit, micro-structure transfer template member, and micro-structure integrated member transfer method |
| CN113424305A (en) * | 2019-02-13 | 2021-09-21 | 普因特工程有限公司 | Micro light emitting diode absorber |
| WO2021237511A1 (en) * | 2020-05-27 | 2021-12-02 | 重庆康佳光电技术研究院有限公司 | Transfer substrate of micro-leds and preparation method therefor |
| US12027408B2 (en) | 2018-11-29 | 2024-07-02 | Chengdu Vistar Optoelectronics Co., Ltd. | Transfer device of micro-elements and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004537158A (en) * | 2001-02-08 | 2004-12-09 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Chip transfer method and apparatus |
| KR100869088B1 (en) * | 2004-04-09 | 2008-11-18 | 신에츠 엔지니어링 가부시키가이샤 | Adhesive chuck device |
| KR20140122861A (en) * | 2013-04-11 | 2014-10-21 | (주)엠프리시젼 | Adhesion pad and method of manufacturing the same |
| CN106328576B (en) * | 2016-09-30 | 2019-01-04 | 厦门市三安光电科技有限公司 | The production method of transposition head for microcomponent transfer |
| CN207116403U (en) * | 2017-04-21 | 2018-03-16 | 厦门市三安光电科技有限公司 | A kind of transposition head for microcomponent transfer |
-
2017
- 2017-04-21 CN CN201720426695.9U patent/CN207116403U/en active Active
-
2018
- 2018-04-10 WO PCT/CN2018/082436 patent/WO2018192389A1/en active Application Filing
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| CN110265291A (en) * | 2018-03-12 | 2019-09-20 | 天津大学 | A kind of seal of transferring device and method using the seal transferring device |
| CN111128833B (en) * | 2018-10-31 | 2021-08-17 | 成都辰显光电有限公司 | Transfer device of microelement |
| WO2020087812A1 (en) * | 2018-10-31 | 2020-05-07 | 昆山工研院新型平板显示技术中心有限公司 | Transfer device and transfer method for microelement |
| WO2020088099A1 (en) * | 2018-10-31 | 2020-05-07 | 昆山工研院新型平板显示技术中心有限公司 | Micro device transferring device and preparation method therefor |
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| CN112018218B (en) * | 2019-05-31 | 2023-02-28 | 成都辰显光电有限公司 | Micro light emitting diode transfer method and display panel manufacturing method |
| CN112018218A (en) * | 2019-05-31 | 2020-12-01 | 云谷（固安）科技有限公司 | Micro light emitting diode transfer method and display panel manufacturing method |
| CN110416139B (en) * | 2019-09-11 | 2021-08-31 | 京东方科技集团股份有限公司 | Transfer carrier plate, manufacturing method thereof and transfer method of light-emitting diode chip |
| US11798919B2 (en) | 2019-09-11 | 2023-10-24 | Boe Technology Group Co., Ltd. | Transfer carrier and manufacturing method thereof, and method for transferring light-emitting diode chip |
| CN110416139A (en) * | 2019-09-11 | 2019-11-05 | 京东方科技集团股份有限公司 | A kind of transfer method shifting support plate, its production method and light-emitting diode chip for backlight unit |
| WO2021237511A1 (en) * | 2020-05-27 | 2021-12-02 | 重庆康佳光电技术研究院有限公司 | Transfer substrate of micro-leds and preparation method therefor |
| CN112967986A (en) * | 2020-10-19 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Transfer component, preparation method thereof and transfer head |
| CN112582328A (en) * | 2020-12-10 | 2021-03-30 | 深圳市华星光电半导体显示技术有限公司 | Transfer substrate, manufacturing method thereof and transfer device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018192389A1 (en) | 2018-10-25 |
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Effective date of registration: 20231026 Address after: 436000 No. 18, Gaoxin fifth road, Gedian Development Zone, Ezhou City, Hubei Province Patentee after: Hubei San'an photoelectric Co.,Ltd. Address before: 361009 no.1721-1725, Luling Road, Siming District, Xiamen City, Fujian Province Patentee before: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |