WO2020087812A1

WO2020087812A1 - Transfer device and transfer method for microelement

Info

Publication number: WO2020087812A1
Application number: PCT/CN2019/076193
Authority: WO
Inventors: 王岩
Original assignee: 昆山工研院新型平板显示技术中心有限公司; 昆山国显光电有限公司
Priority date: 2018-10-31
Filing date: 2019-02-26
Publication date: 2020-05-07
Also published as: CN111128833A; KR20210088608A; CN111128833B; KR102563694B1

Abstract

A transfer device (1) and a transfer method for a microelement (3). The transfer device (1) comprises: a transfer substrate (10); a plurality of attachment members (12) fixed to at least one surface of the transfer substrate (10) for attaching the microelement (3); a plurality of movable members (14) connected to the at least one surface of the transfer substrate (10), and each of the attachment members (12) being provided adjacent to at least one of the movable members (14); and a driving circuit (16) for driving the movable members (14) independently so as to apply a force to the selected microelement (3), thereby making the microelement (3) disengaged from the attachment member (12) or not attached by the attachment member (12). By means of said method, separate operation on each microelement (3) is able to be realized during batch transfer.

Description

Micro-element transfer device and transfer method

Technical field

The present application relates to the field of transfer technology, and in particular, to a micro-device transfer device and transfer method.

Background technique

Micro light-emitting diode (Micro-LED) chips refer to micro-LED arrays of small size integrated on a certain donor substrate (eg, donor wafer, etc.) with high density. The size of Micro-LED chips is generally below 100 microns. In the process of manufacturing a display, it is generally necessary to transfer the Micro-LED chips from the donor substrate to the target substrate in batches using electrostatic adsorption, magnetic adsorption, van der Waals force action, vacuum adsorption and other technologies.

The inventor of the present application discovered during the long-term research that it is impossible to perform a separate operation on each Micro-LED chip in the existing batch transfer process.

Summary of the invention

The technical problem mainly solved by the present application is to provide a micro-element transfer device and transfer method, which can realize the individual operation of each micro-element in the batch transfer process.

In order to solve the above technical problems, a technical solution adopted by the present application is to provide a micro-element transfer device, the transfer device includes: a transfer substrate; an adsorption member, a number of which is fixed to at least one of the transfer substrate The surface is used to attract the micro-elements; the number of movable parts is multiple, connected to the at least one surface of the transfer substrate, and each of the adsorption parts is disposed adjacent to at least one of the movable parts; the driving circuit , Used to independently drive the movable member so that it exerts force on the selected micro-element so that the micro-element is detached from the adsorption member or cannot be adsorbed by the adsorption member.

Wherein, the adsorption member is higher than the at least one surface by a first distance; the movable member is driven by the driving circuit, and is switched at least in a first state and a second state, and the activity in the first state The piece is higher than the at least one surface by a second distance, and in the second state the movable piece is higher than the at least one surface by a third distance, wherein the first distance is greater than the second distance and less than the A third distance; wherein, at least a portion of the movable member is located between the transfer substrate and the micro-element, in the second state, the micro-element is urged on the side of the transfer substrate, so that The micro element is detached from the adsorption member or cannot be adsorbed by the adsorption member.

Wherein, the movable member is an elastic member, one end of the elastic member is fixed to the at least one surface of the transfer substrate, the other end is a free end and is provided with a first electrode, and the at least one surface of the transfer substrate A second electrode is provided at a position corresponding to the first electrode, the first electrode and the second electrode are both connected to the driving circuit, and the first electrode and the second electrode are under the control of the driving circuit Charges with opposite or same properties, which attract or repel each other, make the free end of the elastic member approach or move away from the transfer substrate to form the first state and the second state of the free end of the elastic member.

Wherein, the driving circuit includes: a first charge generation sub-circuit for providing a first voltage required to generate positive or negative charges; a number of first switches, and each of the first switches is correspondingly connected to one of the A first electrode, the first switch includes a first control terminal, a first terminal, and a second terminal, wherein the first terminal is connected to the first charge generation sub-circuit, and the second terminal is connected to the corresponding The first electrode is connected; the second charge generation sub-circuit is used to provide a second voltage required to generate positive or negative charges; there are a plurality of second switches, and one of the second switches is correspondingly connected to one of the second Electrodes, the second switch includes a second control terminal, a third terminal, and a fourth terminal, wherein the third terminal is connected to the second charge generation subcircuit, and the fourth terminal is connected to the corresponding Two switch connections; a switch control circuit for respectively connecting each of the first control terminals of the plurality of first switches and each of the second control terminals of the plurality of second switches.

Wherein, the orthographic projection of the suction member and the corresponding elastic member on the plane of the transfer substrate does not cross.

Wherein, one of the adsorption members corresponds to two of the elastic members, two of the elastic members are provided on opposite sides of one of the adsorption members, and the free end of each of the elastic members can be close to or away from the transfer substrate .

Wherein, one of the adsorption members corresponds to two of the elastic members, two of the elastic members are provided on the same side of the one of the adsorption members, and the free end of each of the elastic members can be close to or away from the transfer substrate.

Wherein, one of the suction members corresponds to one of the elastic members, and the free end of the elastic member may be close to or away from the transfer substrate on one side of the suction member.

Wherein, one end of the elastic member extends from the transfer substrate in a direction perpendicular to the surface of the transfer substrate, and the free end of the elastic member extends from the one end in a direction parallel to the surface of the transfer substrate.

Wherein, the first electrode is located at the head of the free end, and the width of the head is greater than or equal to the width of the rest of the free end except the head.

Wherein, the projection of the elastic member on the surface of the transfer substrate is T-shaped.

Wherein, the projection of the elastic member on the surface of the transfer substrate is L-shaped.

Wherein, the transfer substrate includes a first region fixedly connected to one end of the elastic member, and the roughness of the first region is greater than the roughness of other regions of the transfer substrate except the first region.

Wherein, the adsorption member includes rubber, and the rubber includes polydimethylsiloxane.

In order to solve the above technical problems, another technical solution adopted by the present application is to provide a method for transferring microelements. The method includes: providing a donor substrate on which a plurality of microelements are provided; and providing a transfer device , And align a plurality of adsorption members fixed to at least one surface of the transfer substrate with a plurality of the micro-elements in the transfer device; a drive circuit in the transfer device drives at least one connected to the transfer substrate A plurality of movable members on the surface are close to the surface of the transfer substrate, and the adsorption members corresponding to the plurality of movable members contact the surface of the micro-element to adsorb the micro-element; the transfer device will adsorb The micro-element is transferred to the receiving substrate; the driving circuit drives a plurality of the movable parts away from a surface of the transfer substrate, so that the micro-element is detached from the adsorption part.

Wherein, the driving circuit in the transfer device drives a plurality of movable parts connected to at least one surface of the transfer substrate close to the transfer substrate and the surface, including: the drive circuit drives the corresponding The first electrode and the second electrode are charged with opposite properties, which in turn causes the movable member to move toward a surface of the transfer substrate under the action of attractive force; wherein, the movable member is an elastic member, and one end of the elastic member The at least one surface fixed to the transfer substrate, the other end is a free end and is provided with a first electrode, and the at least one surface of the transfer substrate is provided with a second electrode corresponding to the position of the first electrode.

Wherein the driving circuit drives a plurality of the movable parts away from a surface of the transfer substrate, including: the driving circuit drives the first electrode and the second electrode corresponding to the micro-elements with the same properties The charge of the moving part, in turn, causes the movable member to move toward a surface away from the transfer substrate under the effect of repulsive force. Wherein, one adsorption element corresponds to one micro-element; or, multiple adsorption elements correspond to one micro-element.

The beneficial effects of the present application are: different from the situation in the prior art, the transfer device provided in the present application includes a driving circuit, and the driving circuit can independently drive the movable member to apply force to the selected micro-elements, thereby detaching the micro-elements from the adsorption member Or it cannot be adsorbed by the adsorption member, so that each micro-element can be operated separately during the batch transfer process; at the same time, the transfer device provided in this application can improve the efficiency of grasping the micro-element.

In addition, since the adsorbent in the transfer device provided by the present application includes rubber, for example, polydimethylsiloxane, when the micro-elements are adsorbed, the transfer device can simultaneously adsorb micro-elements with slightly different heights through deformation.

【Explanation】

In order to more clearly explain the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without paying any creative work, other drawings can also be obtained based on these drawings, in which:

FIG. 1 is a schematic structural diagram of an embodiment of a micro-device transfer device of the present application;

2 is a schematic top view of an embodiment corresponding to the transfer device in FIG. 1;

3 is a schematic top view of another embodiment corresponding to the transfer device in FIG. 1;

4a is a schematic structural view of another embodiment of the transfer device in FIG. 1;

4b is a schematic structural diagram of another embodiment of the transfer device in FIG. 1;

5 is a schematic structural diagram of another embodiment of a micro-element transfer device of the present application;

6 is a schematic top view of an embodiment corresponding to the transfer device in FIG. 5;

7 is a schematic top view of another embodiment corresponding to the transfer device in FIG. 5;

8 is a schematic diagram of a circuit structure of an embodiment in which the driving circuit in FIG. 1 is connected to the first electrode and the second electrode;

9 is a schematic flow chart of an embodiment of using the transfer device in FIG. 1 to transfer micro-elements;

FIG. 10 is a schematic structural diagram of an embodiment corresponding to steps S101 to S105 in FIG. 9.

【detailed description】

The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

Please refer to FIGS. 1-3, FIG. 1 is a schematic structural view of an embodiment of a micro-device transfer device of the present application, FIG. 2 is a top schematic view of an embodiment corresponding to the transfer device of FIG. 1, and FIG. 3 is a transfer device of FIG. Corresponding top schematic view of another embodiment. The transfer device 1 includes a transfer substrate 10, an adsorption member 12, a movable member 14, and a drive circuit 16.

Specifically, the material of the transfer substrate 10 may be silicon, glass, or the like.

There are a plurality of adsorbing members 12 fixed on at least one surface 100 of the transfer substrate 10 for adsorbing micro-elements. Preferably, the plurality of adsorbing members 12 can be arranged in an array on the surface 100 of the transfer substrate 10 and can be combined with micro-elements Better correspondence; of course, in other embodiments, the multiple adsorption members 12 may also adopt other arrangements on the surface 100 of the transfer substrate 10, for example, irregular arrangements; in this embodiment, the adsorption The member 12 includes rubber. Preferably, the rubber includes polydimethylsiloxane. Of course, in other embodiments, the material of the adsorption member 12 may also be other rubbers, such as polyurethane, EPDM, and the like. When the adsorption member 12 is in contact with the micro-element, the micro-element is adsorbed by the van der Waals force. In addition, when the adsorption member 12 adsorbs the micro-elements, the deformation can enable the transfer device 1 to simultaneously adsorb micro-elements with slightly different heights.

There are a plurality of movable elements 14 connected to at least one surface 100 of the transfer substrate 10, and one adsorption element 12 is adjacent to at least one movable element 14; in an application scenario, as shown in FIG. 2, one adsorption element 12 is adjacent to one activity 14; in another application scenario, as shown in FIG. 3, one adsorption element 12a is adjacent to two movable elements 14a; of course, in other application scenarios, each adsorption element 12 can also be adjacent to three or four Wait for the movable part 14 to be set.

The driving circuit 16 is used to independently drive the movable member 14 to apply force to the selected micro-elements so that the micro-elements are separated from the adsorption member 12 or cannot be adsorbed by the adsorption member.

In one embodiment, please refer to FIG. 1 again, the adsorption member 12 is higher than the first distance d1 of at least one surface 100; the movable member 14 is driven by the driving circuit 16 at least in the first state (as shown in the middle one movable member in FIG. 1) a)), in the second state (as shown by the rightmost movable part b in FIG. 1), the movable part 14 in the first state is higher than at least one surface 100 by a second distance d2, and the movable part 14 in the second state A third distance d3 above at least one surface 100, where the first distance d1 is greater than the second distance d2 and less than the third distance d3; wherein at least a portion of the movable member 14 is located between the transfer substrate 10 and the micro-elements, at the second In this state, force is applied to the side of the micro-component adjacent to the transfer substrate 10, so that the micro-component is detached from the adsorption member 12 or cannot be adsorbed by the adsorption member.

It should be noted that the orthographic projections of the movable element 14 and the micro-components on the surface 100 of the transfer substrate 10 have mutually overlapping areas, and the portion where the orthographic projections of the movable element 14 are located in the mutually overlapping areas is defined as the first part. The second distance d2 and the third distance d3 both refer to the distance that the first portion is higher than the surface 100 of the transfer substrate 10, and the second distance d2 and the third distance d3 may be average values or extreme values. In addition, when the driving circuit 16 does not drive the movable element 14, the state of the movable element 14 is the initial state. The initial state may be the first state, the second state, or the first state and the first state. The state between the two states (as shown in the leftmost movable part c in FIG. 1) is not limited in this application.

In this embodiment, please continue to refer to FIG. 1, the movable member 14 is an elastic member 14, one end A of the elastic member 14 is fixed to at least one surface 100 of the transfer substrate 10, the other end B is a free end B and a first electrode 18 is provided At least one surface 100 of the transfer substrate 10 is provided with a second electrode 11 corresponding to the position of the first electrode 18. The first electrode 18 and the second electrode 11 are electrically connected to the driving circuit 16 through a wire, and the first The electrode 18 and the second electrode 11 are charged with opposite or same properties, and then attract or repel each other so that the free end B of the elastic member 14 approaches or moves away from the transfer substrate 10 to form the first and second states of the free end B of the elastic member 14 status. When the driving circuit 16 controls the first electrode 18 and the second electrode 11 to have opposite charges, an attractive force F1 is generated between the first electrode 18 and the second electrode 11, and the attractive force F1 attracts the free end B and approaches The transfer substrate 10 moves in the direction, which is the first state of the free end B; when the drive circuit 16 controls the first electrode 18 and the second electrode 11 to have the same charge, the first electrode 18 and the second electrode 11 A repulsive force F2 is generated, and the free end B moves away from the transfer substrate 10 under the action of the repulsive force F2. The farther the free end B is from the transfer substrate 10, the smaller the repulsive force F2 and the greater the deformation generated by the free end B itself If the two forces balance each other, they will reach a balanced state at a certain position, and this balanced state is the second state; but the action of the free end B of the elastic member 14 and the micro-elements does not necessarily occur in the second state. When the free end B moves away from the transfer substrate 10, when the free end B is closer to the micro-element than the adsorbing member 12, it comes into contact with the micro-element.

In an application scenario, please refer to FIG. 1 again, one end A of the elastic member 14 extends from the transfer substrate 10 in a direction perpendicular to the surface 100 of the transfer substrate 10, and the free end B of the elastic member 14 faces the transfer substrate 10 from the one end A The surface 100 extends in a parallel direction. With this design, the contact area between the elastic member 14 and the micro-element can be increased, so as to ensure that the elastic member 14 can separate the micro-element from the adsorption member 12. In other application scenarios, one end of the elastic member 14 and the free end may also be on the same straight line. The structure of the elastic member 14 is similar to that of a spring. One end of the elastic member 14 is perpendicular to the surface 100 of the transfer substrate 10 from the transfer substrate 10 The direction extends, and the other end of the extension is the free end.

In another application scenario, as shown in FIG. 2, the first electrode 18 is located at the head B1 of the free end B, the edge of the first electrode 18 may be a predetermined distance away from the edge of the head B1, and the width d4 of the head B1 Greater than or equal to the width d5 of the free end B except the head B1. The design of the head B1 allows the head B1 to carry the first electrode 18 corresponding to its width, so as to increase the attractive or repulsive force between the first electrode 18 and the second electrode 11; on the other hand This design can increase the effective area of the free end B and the micro-elements, so that when the free end B exerts force on the selected micro-elements, the micro-elements can be detached from the adsorption member 12 or cannot be adsorbed by the adsorption member. In this embodiment, as shown in FIG. 2, the projection of the elastic member 14 on the surface 100 of the transfer substrate 10 is “T” -shaped. In other embodiments, the projection of the elastic member 14 on the surface 100 of the transfer substrate 10 may also be Other shapes, for example, "L" shape as shown in FIGS. 4a and 4b.

In addition, in this embodiment, the transfer substrate 10 includes a first region (not shown) fixedly connected to one end A of the elastic member 14, the roughness of the first region is greater than the roughness of the remaining regions of the transfer substrate 10 except the first region The way to achieve a large roughness in the first area may be frosting, drilling, etc. The design of the roughness is to increase the adhesion between the elastic member 14 and the transfer substrate 10, so that the elastic member 14 and the transfer substrate 10 Connection is tighter; of course, in other application scenarios, in order to further increase the adhesion between the elastic member 14 and the transfer substrate 10, the area of the surface 100 where the one end A of the elastic member 14 is fixed to the transfer substrate 10 can also be increased .

In the above embodiment, one adsorption member 12 corresponds to one micro-element, and one micro-element can be adsorbed by a plurality of adsorption members 12. The adsorption member 12 and the corresponding micro-element cross the orthographic projection of the plane 100 of the transfer substrate 10, that is, to ensure that The adsorbing member 12 can be in contact with the micro-elements to adsorb the micro-elements; the free end B of the elastic member 14 and the corresponding micro-elements cross the front projection of the plane 100 of the transfer substrate 10, that is, the free end B of the elastic member 14 can be The micro-elements are in contact to apply force to the micro-elements; the orthographic projection of the free end B of the corresponding elastic member 14 and the free end B of the elastic member 14 on the plane 100 of the transfer substrate 10 does not cross to ensure that the elastic member 14 moves away from or near the transfer substrate 10, The suction member 12 has no influence on the movement of the elastic member 14. Of course, in other embodiments, the adsorption member 12 and the corresponding free end B of the elastic member 14 cross at the front projection of the plane 100 of the transfer substrate 10. For example, the adsorption member 12 is a hollow structure, and the edges of the adsorption member 12 adsorb micro For the element, the free end B is located in the hollow structure of the adsorbent 12, and can move away from or close to the transfer substrate 10 in the hollow structure.

In an application scenario, one suction member corresponds to one elastic member, and the free end of the elastic member can be close to or away from the transfer substrate on one side of the suction member. As shown in FIG. 2, the suction member 12 is located in a direction parallel to the extending direction of the free end B of the elastic member 14. Alternatively, as shown in FIGS. 5-6, FIG. 5 is a schematic structural diagram of another embodiment of a micro-device transfer device of the present application, and FIG. 6 is a top schematic diagram of an embodiment of the transfer device in FIG. In this embodiment, one suction member 12b corresponds to one elastic member 14b. In this embodiment, the suction member 12b is located in the extending direction of the free end Bb of the elastic member 14b and is in contact with the head of the free end Bb of the elastic member 14b B1b is relatively set.

In yet another application scenario, preferably, one suction member corresponds to two elastic members, two elastic members are provided on opposite sides or the same side of one suction member, and the free end of each elastic member can be close to or away from the transfer substrate, The two elastic members simultaneously apply force to the micro-elements to ensure that the elastic members can separate the adsorption member from the micro-elements. Of course, in other application scenarios, one adsorption member can also correspond to more (for example, three, four, etc.) elastic members. As shown in FIG. 3, the free ends Ba of the two elastic members 14a are located on opposite sides of the suction member 12a, and the free ends Ba of each elastic member 14a are close to or away from the transfer substrate 10a on opposite sides of the suction member 12a. Or, as shown in FIG. 7, FIG. 7 is a schematic top view of another embodiment of the transfer device in FIG. 5. In this embodiment, the free ends Bc of the two elastic members 14c are located on the same side of the suction member 12c.

In another embodiment, in order to realize that the driving circuit 16 independently drives the elastic member 14, please refer to FIG. 8. FIG. 8 is a schematic diagram of a circuit structure of an embodiment in which the driving circuit in FIG. 1 is connected to the first electrode and the second electrode. The driver circuit 16 provided by the application includes:

The first charge generation sub-circuit 160 is used to provide a first voltage required to generate positive or negative charges; in this embodiment, the first charge generation sub-circuit 160 may be any static electricity generation circuit in the prior art.

There are a plurality of first switches 162. One first switch 162 is correspondingly connected to a first electrode 18. The first switch 162 includes a first control terminal K1, a first terminal K2, and a second terminal K3, where the first terminal K2 It is connected to the first charge generating sub-circuit 160, and the second terminal K3 is connected to the corresponding first electrode 18; in this embodiment, the first switch 162 may be a switching transistor, for example, a P-type switching transistor or an N-type switching transistor, etc. .

The second charge generation sub-circuit 164 is used to provide a second voltage required to generate positive or negative charges; in this embodiment, the second charge generation sub-circuit 164 may be any static electricity generation circuit in the prior art.

There are a plurality of second switches 166, one second switch 166 is correspondingly connected to one second electrode 11, the second switch 166 includes a second control terminal K4, a third terminal K5 and a fourth terminal K6, wherein the third terminal K5 It is connected to the second charge generating sub-circuit 164, and the fourth terminal K6 is connected to the corresponding second switch 166; in this embodiment, the second switch 166 may be a switching transistor, for example, a P-type switching transistor or an N-type switching transistor, etc. .

The switch control circuit 168 is configured to connect each first control terminal K1 of the plurality of first switches 162 and each second control terminal K4 of the plurality of second switches 166 respectively.

The following describes the method of forming the above transfer device. In an application scenario, the method of forming the above transfer device 1 includes: providing a transfer substrate 10, and forming a plurality of first electrodes 11 at corresponding positions of the transfer substrate 10; Multiple sacrificial blocks are deposited on 10, and an elastic member 14 is deposited on the surface of the sacrificial block. The material of the elastic member 14 may be glass, resin, plastic, etc .; The contact position is polished, punched, etc. to increase the roughness; the sacrificial block is removed by etching, dissolution, etc .; the second electrode 18 is formed at the free end B of the elastic member 14; finally, the driving circuit 16 and the suction member 12 are fabricated. Of course, in other application scenarios, other preparation methods may also be used to form the transfer device 1, which is not limited in this application.

The following describes the specific process of transferring micro-elements using the transfer device provided in this application. Please refer to FIGS. 9-10. FIG. 9 is a schematic flowchart of an embodiment for transferring micro-elements using the transfer device in FIG. 1. FIG. 10 is a schematic structural diagram of an embodiment corresponding to steps S101-S105 in FIG. The transfer process includes:

S101: A donor substrate 2 is provided, wherein a plurality of microelements 3 are provided on the donor substrate 2.

Specifically, as shown in FIG. 10a, in this embodiment, the donor substrate 2 may be a donor wafer, and the donor substrate 2 and the micro-device 3 may be fixedly connected by means of adhesive or the like. The micro-elements 3 may be vertical micro-light-emitting diode chips or lateral micro-light-emitting diode chips, and the plurality of micro-elements 3 may be micro-light-emitting diode chips of the same color (for example, red or green or blue) or different colors. The heights of the multiple micro-elements 3 may be the same or slightly different.

S102: A transfer device 1 is provided, and a plurality of adsorption members 12 of the transfer device 1 are aligned with a plurality of microelements 3.

Specifically, as shown in FIG. 10b, in this embodiment, one adsorption member 12 may correspond to one micro-element 3; of course, in other embodiments, multiple adsorption members 12 may correspond to one micro-element 3. A plurality of adsorption members 12 may be spaced between adjacent microelements 3.

S103: The driving circuit 16 drives the plurality of movable members 14 close to a surface 100 of the transfer substrate 10, and the adsorption member 12 corresponding to the plurality of movable members 14 contacts the surface of the micro-element 3 to adsorb the micro-element 3.

Specifically, as shown in FIG. 10c, the driving circuit 16 can drive the first electrode 18 and the second electrode 11 to have charges of opposite properties, for example, one with a positive charge and one with a negative charge, thereby making the movable member 14 attractive Under the action, it moves toward a surface 100 of the transfer substrate 10, and the corresponding adsorption member 12 contacts the surface of the micro-element 3 to attract the micro-element 3. For the micro-element 3 that does not need to be adsorbed, as shown in the rightmost micro-element 3 in FIG. 10c, the drive circuit 16 can drive the corresponding first electrode 18 and the second electrode 11 with the same property of charge, thereby making the movable part 14 Under the action of the repulsive force, it moves toward a surface 100 away from the transfer substrate 10, and the corresponding adsorption member 12 and the surface of the micro-element 3 cannot contact.

In addition, in the present embodiment, the above step S103 further includes an adhesive glue between the laser peeling / sintering micro-component 3 and the donor substrate 2.

S104: The transfer device 1 transfers the adsorbed micro-elements 3 to the receiving substrate 4.

Specifically, referring to FIG. 10d, the receiving substrate 4 includes: a temporary substrate, a TFT backplane, and the like.

S105: The driving circuit 16 drives the plurality of movable members 14 away from the surface 100 of the transfer substrate 10, so that the micro-elements 3 are detached from the adsorption member 12.

Specifically, referring to FIG. 10e, the driving circuit 16 can drive the first electrode 18 and the second electrode 11 corresponding to the micro-element 3 to carry charges with the same properties, thereby causing the movable member 14 to move away from the transfer substrate 10 under the repulsive force When a surface 100 moves, the movable member 14 gives the micro-elements 3 a force toward the receiving substrate 4, thereby causing the micro-elements 3 to be detached from the adsorption member 12.

The transfer device provided by the present application includes a driving circuit, which can independently drive the moving parts to apply force to the selected micro-elements, thereby making the micro-elements detached from the adsorption parts or unable to be adsorbed by the adsorption parts, so as to realize Each micro-element is operated separately; meanwhile, the transfer device provided in this application can improve the efficiency of grasping micro-element. In addition, since the adsorbent in the transfer device provided by the present application includes rubber, for example, polydimethylsiloxane, when the micro-elements are adsorbed, the transfer device can simultaneously adsorb micro-elements with slightly different heights through deformation.

The above are only the embodiments of the present application, and therefore do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by the description and drawings of this application, or directly or indirectly used in other related technologies In the field, the same reason is included in the scope of patent protection of this application.

Claims

A micro-element transfer device, including:

Transfer substrate

There are a plurality of adsorption pieces, fixed on at least one surface of the transfer substrate, for adsorbing the micro-elements;

There are a plurality of movable members, which are connected to the at least one surface of the transfer substrate, and each of the adsorption members is disposed adjacent to at least one movable member;

A driving circuit is used to independently drive the movable element to apply force to the selected micro-element, thereby detaching the micro-element from the adsorption element or being unable to be adsorbed by the adsorption element.
The transfer device according to claim 1, wherein

The adsorption member is higher than the at least one surface by a first distance;

Driven by the driving circuit, the movable member switches at least in a first state and a second state, the movable member is higher than the at least one surface by a second distance in the first state, and the second state The movable member is higher than the at least one surface by a third distance, wherein the first distance is greater than the second distance and less than the third distance;

Wherein at least a part of the movable member is located between the transfer substrate and the micro-element, in the second state, a force is applied to the side of the micro-element adjacent to the transfer substrate, so that the micro-element The adsorption member is detached or cannot be adsorbed by the adsorption member.
The transfer device according to claim 2, wherein

The movable member is an elastic member, one end of the elastic member is fixed to the at least one surface of the transfer substrate, the other end is a free end and is provided with a first electrode, and the at least one surface of the transfer substrate corresponds to the A second electrode is provided at the position of the first electrode, the first electrode and the second electrode are both connected to the driving circuit, and under the control of the driving circuit, the first electrode and the second electrode are provided with Charges with opposite or identical properties, which in turn attract or repel each other, cause the free end of the elastic member to approach or move away from the transfer substrate to form the first state and the second state of the free end of the elastic member.
The transfer device according to claim 3, wherein the driving circuit comprises:

The first charge generation sub-circuit is used to provide a first voltage required to generate positive or negative charges;

There are a plurality of first switches, one of the first switches is correspondingly connected to one of the first electrodes, the first switch includes a first control terminal, a first terminal and a second terminal, wherein the first terminal Connected to the first charge generation sub-circuit, and the second end is connected to the corresponding first electrode;

The second charge generation sub-circuit is used to provide a second voltage required to generate positive or negative charges;

There are a plurality of second switches, one second switch corresponding to one second electrode, the second switch includes a second control terminal, a third terminal and a fourth terminal, wherein the third terminal Connected to the second charge generation sub-circuit, and the fourth end is connected to the corresponding second switch;

A switch control circuit is respectively connected to each of the first control terminals of the plurality of first switches and each of the second control terminals of the plurality of second switches.
The transfer device according to claim 3, wherein

The orthographic projection of the suction member and the corresponding elastic member on the plane of the transfer substrate does not cross.
The transfer device according to claim 5, wherein

One of the suction members corresponds to two of the elastic members, and two of the elastic members are provided on opposite sides of one of the suction members, and the free end of each of the elastic members can be close to or away from the transfer substrate.
The transfer device according to claim 5, wherein

One of the suction members corresponds to two of the elastic members, two of the elastic members are provided on the same side of the one of the suction members, and the free end of each of the elastic members can be close to or away from the transfer substrate.
The transfer device according to claim 5, wherein

One suction member corresponds to one elastic member, and a free end of the elastic member may be close to or far from the transfer substrate on one side of the suction member.
The transfer device according to claim 3, wherein

One end of the elastic member extends from the transfer substrate in a direction perpendicular to the surface of the transfer substrate, and the free end of the elastic member extends from the one end in a direction parallel to the surface of the transfer substrate.
The transfer device according to claim 3, wherein the first electrode is located at the head of the free end, and the width of the head is greater than or equal to the width of the rest of the free end except the head.
The transfer device according to claim 10, wherein the projection of the elastic member on the surface of the transfer substrate is T-shaped.
The transfer device according to claim 10, wherein the projection of the elastic member on the surface of the transfer substrate is L-shaped.
The transfer device according to claim 3, wherein

The transfer substrate includes a first region fixedly connected to one end of the elastic member, and the roughness of the first region is greater than the roughness of other regions of the transfer substrate except the first region.
The transfer device according to claim 1, wherein the adsorption member includes rubber, and the rubber includes polydimethylsiloxane.
A method for transferring microelements, wherein the transferring method includes:

A donor substrate is provided, and a plurality of microelements are provided on the donor substrate;

Providing a transfer device, and aligning a plurality of adsorption members fixed to at least one surface of the transfer substrate with the plurality of micro-elements in the transfer device;

The driving circuit in the transfer device drives a plurality of movable members connected to at least one surface of the transfer substrate close to the surface of the transfer substrate, and the suction members corresponding to the plurality of movable members contact the The surface of the micro-element to attract the micro-element;

The transfer device transfers the adsorbed micro-elements to the receiving substrate;

The driving circuit drives a plurality of the movable members away from a surface of the transfer substrate, so that the micro-elements are separated from the adsorption member.
The transfer method according to claim 15, wherein the driving circuit in the transfer device drives a plurality of movable members connected to at least one surface of the transfer substrate close to the transfer substrate and the surface, including:

The driving circuit drives the first electrode and the second electrode corresponding to the micro-elements to have charges with opposite properties, thereby causing the movable member to move toward a surface of the transfer substrate under the action of attractive force; The movable member is an elastic member, one end of the elastic member is fixed to the at least one surface of the transfer substrate, the other end is a free end and is provided with a first electrode, the at least one surface of the transfer substrate corresponds to the The second electrode is provided at the position of the first electrode.
The transfer method according to claim 15, wherein the driving circuit drives a plurality of the movable members away from a surface of the transfer substrate, comprising:

The driving circuit drives the first electrode and the second electrode corresponding to the micro-elements to have charges with the same properties, thereby causing the movable member to move away from a surface of the transfer substrate under the effect of repulsive force motion.
The transfer method according to claim 15, wherein

One adsorption element corresponds to one micro-element; or, multiple adsorption elements correspond to one micro-element.