CN210245498U - Microchip transfer equipment - Google Patents
Microchip transfer equipment Download PDFInfo
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- CN210245498U CN210245498U CN201920710287.5U CN201920710287U CN210245498U CN 210245498 U CN210245498 U CN 210245498U CN 201920710287 U CN201920710287 U CN 201920710287U CN 210245498 U CN210245498 U CN 210245498U
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- 238000007639 printing Methods 0.000 claims abstract description 122
- 238000006073 displacement reaction Methods 0.000 claims abstract description 109
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 230000005684 electric field Effects 0.000 claims abstract description 57
- 239000000969 carrier Substances 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 22
- 239000012528 membrane Substances 0.000 claims description 7
- 230000007306 turnover Effects 0.000 claims description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 5
- -1 polydimethylsiloxane Polymers 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
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- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
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- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a chip shifts equipment, this chip shifts equipment includes: a controller, a displacement printing part and an electric field generating part; the controller is respectively electrically connected with the displacement printing component and the electric field generating component; the controller is electrically connected with the electric field generating component and is used for controlling the electric field generating component to generate an external electric field; the displacement printing part is provided with a plurality of elastic die carriers, and the elastic die carriers are arranged in an external electric field and used for adsorbing the chips to be transferred on the original substrate in a one-to-one correspondence manner; the controller is electrically connected with the displacement printing component and used for controlling the displacement printing component to move the chip to be transferred from the position of the original substrate to the target position of the target substrate and bonding the chip with the target substrate. The utility model provides a chip transfer device to solve the problem that current microchip transfer efficiency is low excessively.
Description
Technical Field
The utility model relates to a LED shows technical field, especially relates to a microchip shifts equipment.
Background
An organic Light Emitting Diode (LED) has the advantages of long life, small volume, low emission and low power consumption, and is widely used in the technical fields of indicator lamps, illumination, panel display, and the like. Micro LEDs (Micro-LEDs) are a new type of flat panel display technology, for example, different Micro-LED devices emitting red, green and blue light are formed into an LED array in a specific arrangement, which can be fabricated to form a pixel array useful for displays. Compared with a Liquid Crystal Display (LCD) which is widely used at present, the micro LED Display has better contrast, faster response speed and lower energy consumption.
Since the micro LEDs are individually manufactured in the form of chips with sizes in the order of micrometers, a huge number of micro LED chips need to be transferred to the same target substrate in a specific arrangement manner in the process of manufacturing the display device. The existing LED transfer technology extracts the micro LED chips one by one, the process takes long time, and the transfer efficiency is too low for large-scale production.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a microchip shifts equipment to solve current microchip and shift the problem that efficiency is low excessively.
An embodiment of the utility model provides a chip transfer equipment, include: a controller, a displacement printing part and an electric field generating part; the controller is electrically connected with the displacement printing component and the electric field generating component respectively;
the controller is electrically connected with the electric field generating component and is used for controlling the electric field generating component to generate an external electric field;
the displacement printing part is provided with a plurality of elastic stamp carriers, and the elastic stamp carriers are arranged in the external electric field and used for adsorbing the chips to be transferred on the original substrate in a one-to-one correspondence manner;
the controller is electrically connected with the displacement printing component and used for controlling the displacement printing component to move the chip to be transferred from the position of the original substrate to the target position of the target substrate and bonding the chip to the target substrate.
Optionally, the elastomeric stamp carrier comprises a print head and an elastomeric film covering the print head.
Optionally, the elastic membrane is a polydimethylsiloxane elastic membrane.
Optionally, the displacement printing part is a cube, a cuboid or a cylinder.
Optionally, at least one side of the displacement printing part is provided with the elastic stamp carrier; the chip transfer device also comprises a turnover adjusting component; the turnover adjusting component is connected with the displacement printing component and is used for controlling turnover of the displacement printing component.
Optionally, the chip transfer apparatus further includes: an optical positioning detection section; the optical positioning detection component is electrically connected with the controller and used for controlling the displacement printing component to align the elastic stamp carrier with the corresponding chip to be transferred on the original substrate through the controller; the optical positioning detection component is also used for controlling the displacement printing component to align the elastic stamp carrier with a corresponding target position on the target substrate through a controller; the controller is also used for controlling the displacement printing component to adsorb the chip to be transferred and controlling the displacement printing component to bond the chip to be transferred at the target position.
Optionally, the chip transfer apparatus further includes: a screen plate; the screen plate is electrically connected with the controller; the screen is used for printing a bonding layer at a target position of the target substrate; the printing bonding layer is solder paste or paster glue.
In the utility model, the chip transfer device comprises a controller, a displacement printing component and an electric field generating component, the controller is respectively electrically connected with the displacement printing component and the electric field generating component, the controller can control the electric field generating component to generate an external electric field, a plurality of elastic die carriers are arranged on the displacement printing component, and the elastic stamp carrier is positioned in the external electric field, the surface molecules of the elastic stamp carrier are instantaneously polarized to generate an induced dipole moment and can adsorb chips to be transferred on the original substrate, which correspond to the elastic stamp carrier one by one, the controller controls the displacement printing component to move the chips to be transferred from the original substrate to the target position of the target substrate, so that the chips to be transferred can be bonded with the target substrate, therefore, the displacement printing component can simultaneously transfer a large number of chips to be transferred, the chip transfer speed is increased, and the chip transfer efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of a chip transfer apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an elastic impression carrier according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another elastomeric stamp carrier provided in an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a displacement printing component according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another displacement printing component according to an embodiment of the present invention;
fig. 6 is a schematic partial structural diagram of a chip transfer apparatus provided in an embodiment of the present invention;
fig. 7 is a schematic flowchart of a chip transfer method according to an embodiment of the present invention;
fig. 8 is a schematic flowchart of another chip transfer method according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the production process of the Micro LED display, different Micro-LED chips emitting red, green and blue light form an LED array on a target substrate in a specific arrangement, thereby forming a display array. The size of each Micro-LED chip is only within the range of 5-20 microns, each Micro-LED display needs a large number of Micro-LED chips, when the Micro-LED chips are connected with a driving circuit on a target substrate, the Micro-LED chips are often transferred one by one in the prior art, the transfer efficiency is too low, and huge obstacles are brought to the manufacturing process of the Micro-LED display.
For solving the problem that above-mentioned Micro-LED chip shifts inefficiency, the embodiment of the utility model provides a chip shifts equipment, as shown in FIG. 1, FIG. 1 is the embodiment of the utility model provides a structural schematic diagram of a chip shifts equipment, chip shifts equipment and includes: a controller 11, a displacement printing part 12, and an electric field generating part 13; the controller 11 is electrically connected with the displacement printing part 12 and the electric field generating part 13 respectively;
the controller 11 is electrically connected with the electric field generating part 13 and is used for controlling the electric field generating part 13 to generate an external electric field 131;
the displacement printing part 12 is provided with a plurality of elastic stamp carriers 121, and the elastic stamp carriers 121 are arranged in an external electric field 131 and used for adsorbing the chips 3 to be transferred on the original substrate 2 in a one-to-one correspondence manner;
the controller 11 is electrically connected to the displacement printing part 12, and is configured to control the displacement printing part 12 to move the chip 3 to be transferred from the original substrate 2 to a target position of a target substrate (not shown in fig. 1) and bond with the target substrate.
The electric field generating unit 13 can generate an external electric field 131, and for example, the electric field generating unit 13 may include two electrode plates, one of which is turned on at a high level and the other of which is turned on at a low level, so that the external electric field 131 can be generated between the two electrode plates. The displacement printing part 12 is provided with a plurality of elastic stamp carriers 121, the displacement printing part 12 is electrically connected with the controller 11, and the displacement printing part 12 can be placed in the external electric field 131 under the control of the controller 11, or only the elastic stamp carriers 121 on the displacement printing part 12 are placed in the external electric field 131.
The elastomeric stamp carrier 121 may be integrally formed with the displacement printing part 12, or may be a raised structure or a recessed structure formed on the displacement printing part 12, when the elastomeric stamp carrier 121 adsorbs the chip 3 to be transferred on the original substrate 2, the displacement printing part 12 is moved to a position directly above the original substrate 2, each elastomeric stamp carrier 121 corresponds to one chip to be transferred, each elastomeric stamp carrier 121 is used for adsorbing its corresponding chip 3 to be transferred, in the external electric field 131, the motion of electrons in surface molecules of the elastomeric stamp carrier 121 generates an instantaneous dipole moment, which makes adjacent molecules instantaneously polarized, so that an induced dipole moment is generated and attracted between the surface molecules of the elastomeric stamp carrier 121 and the surface molecules of the chip 3 to be transferred on the original substrate 2, i.e. intermolecular forces generated between the surface molecules of the elastomeric stamp carrier 121 and the surface molecules of the chip 3 to be transferred, the intermolecular force is an electric attractive force of weak alkalinity existing between neutral molecules or atoms, and the molecules on the surface of the elastic stamp carrier 121 are physically changed and are not changed in charge. Compared with the scheme that the displacement printing part 12 adopts the electrostatic adsorption to the chip 3 to be transferred, the scheme that the chip 3 to be transferred is adsorbed by intermolecular force is safer, and the electrostatic breakdown of the chip to be transferred can not occur.
The displacement printing part 12 that treats the transfer chip 3 that controller 11 steerable has adsorbed will be removed to the target location department of target base plate by original base plate 2 position department, and will treat to transfer chip 3 and target base plate on the drive treat the drive circuit who transfers chip 3 and carry out the bonding, thereby reach and will treat to transfer chip 3 and transfer the purpose of target base plate by original base plate 2, to waiting to transfer chip 3 that Micro-LED chip etc. need shift in batches, the embodiment of the utility model provides a chip transfer equipment can realize faster batch transfer, improves chip transfer efficiency, in miniature LED display, can accelerate the time of arranging of Micro-LED chip array, very big acceleration the making of miniature LED display.
In the embodiment of the utility model, the chip transfer device comprises a controller, a displacement printing component and an electric field generating component, the controller is respectively electrically connected with the displacement printing component and the electric field generating component, the controller can control the electric field generating component to generate an external electric field, a plurality of elastic die carriers are arranged on the displacement printing component, and the elastic stamp carrier is positioned in the external electric field, the surface molecules of the elastic stamp carrier are instantaneously polarized to generate an induced dipole moment and can adsorb chips to be transferred on the original substrate, which correspond to the elastic stamp carrier one by one, the controller controls the displacement printing component to move the chips to be transferred from the original substrate to the target position of the target substrate, so that the chips to be transferred can be bonded with the target substrate, therefore, the displacement printing component can simultaneously transfer a large number of chips to be transferred, the chip transfer speed is increased, and the chip transfer efficiency is improved.
Above is the core thought of the utility model, will combine the attached drawing in the embodiment of the utility model below, to the technical scheme in the embodiment of the utility model clearly, describe completely. Based on the embodiments in the present invention, under the premise that creative work is not done by ordinary skilled in the art, all other embodiments obtained all belong to the protection scope of the present invention.
Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of an elastomeric stamp carrier according to an embodiment of the present invention, fig. 3 is a schematic structural diagram of another elastomeric stamp carrier according to an embodiment of the present invention, and optionally, the elastomeric stamp carrier 121 may include a printing head 122 and an elastic membrane 123 covering the printing head 122. In fig. 2, which shows the case that the elastic stamp carrier 121 is of a convex structure, the print head 122 may be integrally disposed with the displacement printing part 12, the elastic film 123 is disposed to cover the print head 122, and molecules on the surface of the elastic film 123 are polarized under the action of the external electric field 131, so as to generate an induced dipole moment to attract the chip to be transferred, as shown in fig. 2, the elastic film 123 may cover all exposed surfaces of the print head 122, of course, the elastic film 123 may only include a part of the surface of the print head 122, as shown in fig. 3, and only one side of the elastic stamp carrier 121 close to the chip to be transferred is ensured to be provided with the elastic film 123.
Optionally, the elastic membrane 123 is a polydimethylsiloxane elastic membrane. The polydimethylsiloxane elastic material is one of organic silicon, is low in cost and simple to use, has good adhesion with a silicon wafer, and is easy to adsorb a transfer chip. In addition, the polydimethylsiloxane elastic material has good chemical inertness and higher chemical stability.
Alternatively, the displacement printing part 12 may be a cube, a rectangular parallelepiped, or a cylinder. Fig. 4 is a structural schematic diagram of a displacement printing component provided by the embodiment of the present invention, fig. 5 is a structural schematic diagram of another displacement printing component provided by the embodiment of the present invention, fig. 4 shows that the displacement printing component 12 is a specific structure of a cube or a cuboid, fig. 5 shows that the displacement printing component 12 is a structural schematic diagram of a cylinder, and the displacement printing component 12 is provided with an elastic stamp carrier 121 arranged in an array for adsorbing a chip to be transferred under the control of the controller 11. When the displacement printing part 12 is a cylinder, the elastic stamp carriers 121 arranged in an array may be disposed on a side surface of the cylinder, and the chip to be transferred is adsorbed to the corresponding elastic stamp carrier 121 by rolling the displacement printing part 12 in the axial direction, thereby increasing the disposition area of the elastic stamp carriers 121 on the displacement printing part 12. Of course, the displacement printer 12 may have a regular or irregular shape such as a circular truncated cone or a prism, other than the three-dimensional structure described above, and this embodiment is not limited thereto.
Alternatively, with continued reference to FIG. 4, at least one side of the displacement printing member 12 may be provided with an elastic stamp carrier 121; the chip transfer apparatus further includes a flip adjustment part 14; the inversion adjustment unit 14 is connected to the shift printing unit 12 and controls the inversion of the shift printing unit 12.
An elastic stamp carrier 121 may be disposed on at least one side of the displacement printing part 12, for example, as shown in fig. 4, when the displacement printing part 12 is a rectangular parallelepiped, the elastic stamp carrier 121 may be disposed on at least one side of the rectangular parallelepiped, specifically, the elastic stamp carrier 121 may be disposed on three or five sides of the rectangular parallelepiped, and an inversion adjustment part 14 is disposed on one side of the rectangular parallelepiped, the inversion adjustment part 14 is fixedly connected to the displacement printing part 12 and electrically connected to the controller 11, the inversion adjustment part 14 may control the inversion of the displacement printing part 12 under the control of the controller 11, so as to adjust one side of the displacement printing part 12 to be aligned with the chip to be transferred, and the inversion adjustment part 14 may absorb the chip to be transferred to all the side surfaces of the displacement printing part 12 on which the elastic stamp carrier 121 is disposed, thereby increasing the number of chip transfers per time, and accelerating the chip transfer process.
Optionally, referring to fig. 6, fig. 6 is a schematic partial structure diagram of a chip transfer device provided in an embodiment of the present invention, and the chip transfer device may further include: an optical positioning detection section 15; the optical positioning detection component 15 is electrically connected with the controller 11 and is used for controlling the displacement printing component 12 to align the elastic stamp carrier 121 with the corresponding chip 3 to be transferred on the original substrate 2 through the controller 11; the optical positioning detection part 15 is also used for controlling the displacement printing part 12 to align the elastomeric stamp carrier 121 with a corresponding target position on a target substrate through the controller 11; the controller 11 is also used for controlling the displacement printing component 12 to adsorb the chip 3 to be transferred, and controlling the displacement printing component 12 to bond the chip 3 to be transferred at the target position.
The optical positioning detection component 15 is mainly used to ensure that the elastomeric stamp carrier 121 and the corresponding chip to be transferred can be aligned in position when the displacement printing component 12 adsorbs the chip to be transferred, so that the elastomeric stamp carrier 121 can accurately adsorb the corresponding chip to be transferred, and when the displacement printing component 12 transfers the elastomeric stamp carrier 121 to a target substrate, the chip to be transferred adsorbed on the elastomeric stamp carrier 121 can be aligned with the corresponding target position, because each chip to be transferred is provided with a target position corresponding to one another on the target substrate, so that the chip to be transferred and a driving circuit in the target substrate can be accurately bonded.
Specifically, the optical positioning detection component 15 is electrically connected to the controller 11, the optical positioning detection component 15 is configured to detect a relative position relationship between the displacement printing component 12 and the target substrate or the original substrate, and send a position detection result to the controller 11, the controller 11 controls the displacement printing component 12 to displace in a direction parallel to the target substrate or the original substrate according to the position detection result, and detects the relative position relationship between the displacement printing component 12 and the target substrate or the original substrate again through the optical positioning detection component 15, and the above steps are repeated until the displacement printing component 12 and the target substrate or the original substrate complete accurate alignment. The optical positioning detection component 15 can ensure the transfer precision of the chip to be transferred, thereby improving the arrangement precision of the chip array on the target substrate, accelerating the manufacturing process of the micro LED display and improving the production yield of the micro LED display.
The optical positioning detection component 15 may include at least one Charge Coupled device camera 151 (CCD), as shown in fig. 6, the CCD camera 151 can capture images of the displacement printing component 12 and the target substrate or the original substrate in real time when the displacement printing component 12 is aligned with the target substrate or the original substrate, so as to achieve accurate alignment of the displacement printing component 12 with the target substrate or the original substrate.
Optionally, with reference to fig. 1, when the chip 3 to be transferred is bonded to the driving circuit in the target substrate, the controller 11 may control the electric field generating component to stop generating the external electric field 131, so as to effectively reduce the intermolecular force between the elastic stamp carrier 121 and the chip 3 to be transferred, and facilitate the displacement printing component 12 to place the chip 3 to be transferred on the target substrate, so as to bond the chip 3 to be transferred and the target substrate.
Optionally, the chip transfer device may further include a screen (not shown in fig. 1), the screen being electrically connected to the controller 11; the screen is used for printing a bonding layer at a target position of the target substrate; the printing bonding layer is solder paste or paster glue. Specifically, before the chip 3 to be transferred is bonded to the target substrate, the bonding layer may be printed on the target position of the target substrate through the screen, so that when the displacement printing component 12 places the chip 3 to be transferred on the target position, the chip 3 to be transferred can be rapidly bonded to the driving circuit on the target substrate, and bonding firmness of each chip in the chip array is enhanced. In the embodiment, the screen plate is adopted to coat the bonding layer, so that the point coating of the bonding layer on the target position of the target substrate one by one is not needed, and the bonding efficiency is greatly improved.
Optionally, the optical positioning detection component 15 may be further configured to detect the chip 3 to be transferred remaining on the original substrate 2, and send a reminding signal to the controller 11; the controller 11 is further configured to control the displacement printing component 12 to adsorb the remaining chip 3 to be transferred by the original substrate 2 according to the reminding signal.
When the displacement printing part 12 adsorbs the chip 3 to be transferred on the original substrate 2, there may be a possibility that all the chips 3 to be adsorbed are not transferred, the optical positioning detection part 15 can return to the position of the original substrate 2 to detect the residual chip 3 to be transferred on the original substrate 2 after the alignment between the displacement printing part 12 and the target substrate is completed, if the chip 3 to be transferred remains, the optical positioning detection part 15 sends a reminding signal to the controller 11, the controller 11 controls the displacement printing part 12 completing the task of the chip 3 to be transferred to return to the position of the original substrate 2 according to the reminding signal, and the residual chip 3 to be transferred is adsorbed.
Based on the same conception, the embodiment of the utility model provides a still provide a chip transfer method. Fig. 7 is a schematic flowchart of a chip transferring method according to an embodiment of the present invention, and as shown in fig. 7, the chip transferring method according to this embodiment includes the following steps:
s110, the controller controls the electric field generating component to generate an external electric field, so that the plurality of the elastic stamp carriers arranged on the displacement printing component are positioned in the external electric field.
And S120, adsorbing the chips to be transferred, which correspond to the elastic stamp carriers one by one, on the original substrate by the elastic stamp carriers.
S130, the controller controls the displacement printing component to move the chip to be transferred from the position of the original substrate to the target position of the target substrate, and the chip to be transferred is bonded with the target substrate.
In the embodiment of the utility model, the chip transfer device comprises a controller, a displacement printing component and an electric field generating component, the controller is respectively electrically connected with the displacement printing component and the electric field generating component, the controller can control the electric field generating component to generate an external electric field, a plurality of elastic die carriers are arranged on the displacement printing component, and the elastic stamp carrier is positioned in the external electric field, the surface molecules of the elastic stamp carrier are instantaneously polarized to generate an induced dipole moment and can adsorb chips to be transferred on the original substrate, which correspond to the elastic stamp carrier one by one, the controller controls the displacement printing component to move the chips to be transferred from the original substrate to the target position of the target substrate, so that the chips to be transferred can be bonded with the target substrate, therefore, the displacement printing component can simultaneously transfer a large number of chips to be transferred, the chip transfer speed is increased, and the chip transfer efficiency is improved.
Optionally, before bonding the chip to be transferred and the target substrate, the method further includes: printing a bonding layer at a target position of the target substrate through a screen; the printing bonding layer is solder paste or surface mount adhesive, so that the bonding process of the chip to be transferred and the target substrate is accelerated.
On the basis of the above embodiment, the chip transferring apparatus further includes an optical positioning detection component, the optical positioning detection component is electrically connected to the controller, referring to fig. 8, fig. 8 is a schematic flow chart of another chip transferring method provided by the embodiment of the present invention, and the chip transferring method includes:
s210, the controller controls the electric field generating component to generate an external electric field, so that the plurality of the elastic stamp carriers arranged on the displacement printing component are positioned in the external electric field.
S220, the elastic stamp carriers adsorb the chips to be transferred on the original substrate, wherein the chips to be transferred correspond to the elastic stamp carriers one by one.
And S230, the optical positioning detection component controls the displacement printing component to align the elastic stamp carrier with the corresponding chip to be transferred on the original substrate through the controller.
S240, the controller controls the displacement printing component to adsorb the chip to be transferred and move the chip to be transferred to the target position of the target substrate.
And S250, the optical positioning detection component controls the displacement printing component to align the elastic stamp carrier with the corresponding target position on the target substrate through the controller.
S260, printing a bonding layer at a target position of a target substrate through a screen; the printing bonding layer is solder paste or paster glue.
And S270, controlling the displacement printing component to bond the chip to be transferred at the target position by the controller.
Steps S230 to S250, and S270 specifically describe a process in which the controller controls the displacement printing component to move the chip to be transferred from the original substrate to the target substrate, and bond the chip to the target substrate, so as to enhance the accuracy of the displacement printing component in adsorbing or placing the chip to be transferred, and improve the chip transfer efficiency, and it is noted that the execution sequence of S260 and S210 to S250 is not limited, and S260 may be executed before S210, may also be executed after S250, or may be executed between any two steps in steps S210 to S250.
In step S270, when the controller controls the displacement printing component to bond the chip to be transferred and the target position of the target substrate, the controller controls the electric field generating component to stop generating the external electric field, so as to effectively reduce the intermolecular force between the elastomeric stamp carrier and the chip to be transferred, thereby facilitating the bonding of the chip to be transferred and the target substrate.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (7)
1. A chip transfer apparatus, comprising: a controller, a displacement printing part and an electric field generating part; the controller is electrically connected with the displacement printing component and the electric field generating component respectively;
the controller is electrically connected with the electric field generating component and is used for controlling the electric field generating component to generate an external electric field;
the displacement printing part is provided with a plurality of elastic stamp carriers, and the elastic stamp carriers are arranged in the external electric field and used for adsorbing the chips to be transferred on the original substrate in a one-to-one correspondence manner;
the controller is electrically connected with the displacement printing component and used for controlling the displacement printing component to move the chip to be transferred from the position of the original substrate to the target position of the target substrate and bonding the chip to the target substrate.
2. The chip transfer apparatus according to claim 1,
the elastomeric stamp carrier includes a print head and an elastomeric film covering the print head.
3. The chip transfer apparatus according to claim 2,
the elastic membrane is a polydimethylsiloxane elastic membrane.
4. The chip transfer apparatus according to claim 1,
the displacement printing component is a cube, a cuboid or a cylinder.
5. The chip transfer apparatus according to claim 4,
at least one side of the displacement printing part is provided with the elastic stamp carrier;
the chip transfer device also comprises a turnover adjusting component; the turnover adjusting component is connected with the displacement printing component and is used for controlling turnover of the displacement printing component.
6. The chip transfer apparatus according to claim 1, further comprising: an optical positioning detection section;
the optical positioning detection component is electrically connected with the controller and used for controlling the displacement printing component to align the elastic stamp carrier with the corresponding chip to be transferred on the original substrate through the controller; the optical positioning detection component is also used for controlling the displacement printing component to align the elastic stamp carrier with a corresponding target position on the target substrate through a controller;
the controller is also used for controlling the displacement printing component to adsorb the chip to be transferred and controlling the displacement printing component to bond the chip to be transferred at the target position.
7. The chip transfer apparatus according to claim 1, further comprising: a screen plate; the screen plate is electrically connected with the controller;
the screen is used for printing a bonding layer at a target position of the target substrate; the printing bonding layer is solder paste or paster glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920710287.5U CN210245498U (en) | 2019-05-17 | 2019-05-17 | Microchip transfer equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920710287.5U CN210245498U (en) | 2019-05-17 | 2019-05-17 | Microchip transfer equipment |
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| Publication Number | Publication Date |
|---|---|
| CN210245498U true CN210245498U (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920710287.5U Withdrawn - After Issue CN210245498U (en) | 2019-05-17 | 2019-05-17 | Microchip transfer equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112170A (en) * | 2019-05-17 | 2019-08-09 | 上海九山电子科技有限公司 | A kind of microchip transfer equipment and transfer method |
-
2019
- 2019-05-17 CN CN201920710287.5U patent/CN210245498U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112170A (en) * | 2019-05-17 | 2019-08-09 | 上海九山电子科技有限公司 | A kind of microchip transfer equipment and transfer method |
| CN110112170B (en) * | 2019-05-17 | 2024-01-09 | 上海九山电子科技有限公司 | Microchip transferring equipment and transferring method |
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