201203197 六、發明說明： 【發明所屬之技彳行領域】 [0001] 本發明是有關於一種顯示裝置及其製造方法，特別是有 關於一種以軟性封裝發光二極體之顯示裝置及其製造方 法。 [先前技術] [0002] 目前，軟性顯示器具有輕薄、可撓曲、耐衝擊且不受使 用場合及空間限制的一種顯示裴置，其係為下一個世代 最具潛力的平面顯示器。.款i而’軟性基板有著許多材料 〇 特性上的限制，因此無法完全適用於目前的玻璃基板製 程。其中的一個限制便是’在軟性基板遭到彎曲時，於 其上的各類顯示元件的光電特性便會趣到改變，顯示品 質也因此受到影響。 [0003] 相對於液晶顯示器，發光二極體（Light Emitting Diode，LED)顯不器由於具有尚:亮度、廣.視角、耐衝擊 、壽命長以及高發光效率等優點，非常適合作為人類訊 q 息傳遞的介面。然崩，製作一#全彩的1^1)顯示器，每一 個畫素必須要包含紅藍綠三原色光，礙於製程技術上的 限制’目前尚無法在同一塊基板上同時製作出三種不同 顏色的LED，於是較常見的方法便是將三種顏色之led封 裝成一個像素模組。即便如此，上述的製程時間及成本 也偏高，故目前的應用多以像素密度較低的大型顯示器 為主。 【發明内容】 [0004] 有鑑於上述習知技藝之問題’本發明之目的就是在提供 099122077 表單編號A0101 第3頁/共18頁 0992038883-0 201203197 一種顯示裝置或照明設備及其製造方法，以解決直接將 發光二極體組裝成顯示元件或照明設備的成本過高的問 題。 [0005] 根據本發明之目的，提出一種顯示裝置或照明設備，其 包含一第一軟性基板、複數個發光二極體、複數個第一 導線、複數個導電質點、複數個第二導線及一第二軟性 基板。發光二極體係以陣列狀設置於第一軟性基板上， 而各第一導線則以列向連接各發光二極體。導電質點係 設置在各發光二極體上，且各第二導線係以行向連接導 電質點。第二軟性基板係設有複數個溝槽並容納第二導 線。 [0006] 其中，第一軟性基板及第二軟性基板之間更填充一強化 結構。 [0007] 其中，第一軟性基板、第二軟性基板及強化結構係為聚 二曱基石圭氧烧（polydimethylsi:loxa:n.e ’ PDMS)。 [0008] 其中，導電質點係為無鉛銲錫球。 [0009] 其中，第一導線及第二導線係為金銲線。 [0010] 其中，顯示裝置更包括一掃瞄控制單元連接第一導線， 用以序列式地開啟發光二極體。 [0011] 其中，顯示裝置更包括一資料控制單元連接第二導線， 用以控制發光二極體之亮度。 [0012] 根據本發明之目的，再提出一種顯示裝置之製造方法， 其係適用於一顯示裝置，顯示裝置係包含一第一軟性基 099122077 表單編號A0101 第4頁/共18頁 0992038883-0 201203197 板、複數個發光二極體、複數個第一導線、複數個導電 質點、複數個第二導線及一第二軟性基板，本方法包含 下列步驟：於第一軟性基板上以陣列狀設置發光二極體 ，再設置第一導線列向連接發光二極體。接著於第二軟 性基板上設置複數個溝槽以容納第二導線後，於第二軟 性基板上設置導電質點，再對黏並熱壓第一軟性基板及 第二軟性基板，使導電質點連接發光二極體。 [0013] 其中，第一軟性基板及第二軟性基板之間更填充一強化 結構。 Ο [0014] 其中，第一軟性基板、第二軟性基板及強化結構係為聚 二甲基石圭氧烧（polydimethylsiloxane，PDMS)。 [0015] 其中，導電質點係為無鉛銲錫球。 [0016] 其中，第一導線及第二導線係為金銲線。 [0017] 其中，顯示裝置更包括一掃瞄控制單元連接第一導線， 用以序列式地開啟發光二極體。 〇 [0018] 其中，顯示裝置更包括一資料控制單元連接第二導線， 用以控制發光二極體之亮度。 [0019] 承上所述，依本發明之顯示裝置及其製造方法，其可具 有一或多個下述優點： (1)此顯示裝置之製造方法可藉由網狀電路結構搭配平 行批量化的立體組裝技術，藉此可製作出具可撓性、高 亮度且無視角限制之發光二極體軟性顯示元件或照明設 備。 099122077 表單編號A0101 第5頁/共18頁 0992038883-0 201203197 (2)此顯示裝置及其製造方法可藉由較為精簡的製程， 藉此可解決封裝三色發光二極體成本過高的問題。 【實施方式】 [0020] 請參閱第1圖，其係為本發明之顯示裝置之示意圖。如圖 所示，本發明之顯示裝置1，其包含一第一軟性基板10、 複數個發光二極體11、複數個第一導線12、複數個導電 質點13、複數個第二導線14及一第二軟性基板15。發光 二極體11係以陣列狀設置於第一軟性基板上10，而各第 一導線12則以列向連接各發光二極體11。導電質點13係 設置在各發光二極體Π上，且各第二導線14係以行向連 接導電質點13。第二軟性基板15係設有複數個溝槽150 ( 如第4圖所示）並容納複數個第二導線14。 [0021] 其中，第一軟性基板10及第二軟性基板15之間更可填充 一強化結構16 (如第7圖所示）。在一些較佳的實施例中 ，第一軟性基板10、第二軟性基板15及強化結構16係可 為聚二甲基石圭氧烧（polydimethylsiloxane，PDMS)， 導電質點13係為無鉛銲錫球，而第一導線12及第二導線 14則可為金銲線。 [0022] 請參閱第2圖，其係為本發明之顯示裝置之製造方法之流 程圖。如圖所示，本發明之顯示裝置之製造方法，其係 適用於一顯示裝置，顯示裝置係包含一第一軟性基板、 複數個發光二極體、複數個第一導線、複數個導電質點 、複數個第二導線及一第二軟性基板，本方法包含下列 步驟：（S10)於第一軟性基板上以陣列狀設置發光二極 體；（S20)設置第一導線列向連接發光二極體；（S30 099122077 表單編號A0101 第6頁/共18頁 0992038883-0 201203197 )於第二軟性基板上設置複數個溝槽以容納第二導線； (S40)於第二軟性基板上設置導電質點；（S50)對黏 並熱壓第一軟性基板及第二軟性基板，使導電質點連接 發光二極體。 [0023] Ο ❹ [0024] 請同時參閱第3圖，其係為本發明之第一軟性基板製造流 程之示意圖。如圖所示，剛出廠的發光二極體11係黏在 一藍膜20 (blue tape)上，將發光二極體11黏在一膠 帶21 (adhesive tape)後，將藍膜20撕下以完成晶片 移轉（chip transferring)。接/著在發光二極體11四 周及膠帶21上設置間隔物22，並注入第一軟性基板10的 材料後以一玻璃23封住並進行加熱。在本實施例中，間 隔物22的高度大約是1. 14mm。當加熱完畢後第一軟性基 板10的材料即固化（仍具可撓性），此時將各間隔物22 及玻璃23移除，再將膠帶21以置入丙酮24溶液中去除， 去除完畢後再於發光二極體11上佈置多條第一導線12， 其中每一條第一導線12係將對應列的發光二極體11負極 端連接起來。 另請同時參閱第4〜6圖，其係為本發明之第二軟性基板 製造流程之第一至第三示意圖及第一軟性基板結合第二 軟性基板之示意圖。如第4圖所示，第二軟性基板15的製 造流程首先先在一基板30上，以黃光微影製程及濕式蝕 刻製程製作多個凹槽300，此凹槽300係可輔助第二導線 14的排列。接著將尼龍線31纏繞在凹槽300中，再將第二 軟性基板15壓印在基板30上，使得第二軟性基板15上凹 陷多個溝槽150。最後再將金線（即第二導線14)纏繞至 099122077 表單編號A0101 第7頁/共18頁 0992038883-0 201203197 溝槽150中，即完成初步的第二軟性基板15。另外，導電 夤點〗3係可為無鉛銲錫球，其—開始係先佈設在第二軟 性基板15上，之後才與第一軟性基板1〇連接，使得導電 質點13與發光二極體11連接。另外，如第5A圖所示，佈 a又導電質點13首先需先將銘模以丙酮μ清潔後，將導 電質點13射入丙嗣24中與鋁模4〇共震盪約20秒後，由於 鋁模4 0設有多個孔洞，該些孔洞即可容置導電質點13。 如第5B圖所示之後將剩餘的導電質點13倒出，並將含有 導電質點13的紹模40與含有第二導線14之第二軟性基板 15對壓並加熱’即完成導電質點13的轉置。再者，如第6 圖所示，第一軟性基板10及第二軟性基板15係分別置放 在玻璃載板50、51上，且由於第一軟性基板10及第二軟 性基板15為透明的聚二甲基硅氧烷材質’故可藉由每一 個發光二極體11上對角設置兩個導電質點13的方式對位 ’再加熱壓合玻璃載板50、51，使第一軟性基板10及第 二軟性基板15對黏。此後，再於第一軟隹基板1〇及第二 軟性基板15之間填充強化鐃構16，此強化結構16係可為 聚二甲基硅氧烷（polydimetliylsiloxane，PDMS)。如 此’便完成了本發明之顯示裝置。 [0025] 此外，值得一提的是，發光二極體11的各個電極（導電 質點13連接發光二極體11之連接點）並不侷限僅設置在 發光一極體11的單一面。在本實施例中’各個發光二極 體π的兩個電極係設置在同一面（發光面或非發光面） 上’然而’在本發明所屬之技術領域具有通常知識者皆 可將此些電極佈設在發光二極體11的不同面上（其一設 099122077 表單蝙號A0101 第8頁/共18頁 0992038883- 201203197 置在發光面上，另一設置在非發光面上），其排列方式 係可視實際的設計需求而加以變化。 [0026] 本發明之顯示裝置在隨後的點亮測試下，以給予單顆發 光二極體電壓3福特及電流20毫安培的方式點亮，在10公 分的距離量測，其亮度為20. 06勒克司（Lux);而視角 的測試則顯示了在10公分的距離、環境亮度0勒克司、電 壓3福特及電流20毫安培時，其視角範圍可大於175度， 亦即幾乎無視角限制。 [0027] 另外，本發明之顯示裝置1更可包括一掃瞄控制單元（未 繪示）連接各第一導線12，用以序列式地開啟發光二極 體11 ;且顯示裝置1更包括一資料控制單元（未繪示）連 接第二導線14，用以控制發光二極體11之亮度。在一些 較佳的實施例中，掃瞄控制單元係以單排發光二極體晶 粒逐次點亮的方式掃瞄，而資料控制單元則利用脈寬調 控（pulse width modulation vPWM)的方式，藉由 數位訊號1 (ON)、0 (OF)搭配工作週期（duty 〇 cycle)控制電流輸入的長短來決定發光二極體的明暗， 藉此便可決定單一畫素的色彩，其結果如第7圖所示。 [0028] 本發明成功地利用網狀電路結構搭配微機電組裝技術， 製作出具可撓式發光二極體軟性顯示元件或照明設備， 大幅的提升軟性顯示或照明的應用性且降低其製造成本 :本發明並更以數位定頻脈衝寬度變調驅動此發光二極 體軟性顯示元件，以進行畫面的顯示。本發明所揭露的 微組裝技術的整合，實有助於開發新式的軟性顯示元件 以及照明設備；跟傳統的液晶顯示器相比較，本發明使 099122077 表單編號A0101 第9頁/共18頁 0992038883-0 201203197 用發光二極體作為發光畫素，不會因基板彎曲而使得畫 面失真，也不會有亮度損失的問題，奍常適合於陽光下 使用。 [0029] 以上所述僅為舉例性，而非為限制性者，例如：顯示裝 置亦可為發光裝置或照明裝置，導電質點亦可為導電小 球。任何未脫離本發明之精神與範疇，而對其進行之等 效修改或變更，均應包含於後附之申請專利範園中 【圖式簡單說明】 [0030] 第1圖係為本發明之顯示裝置之示意阖； 第2圖係為本發明之顯示装置之製造方法之流程圖’ 第3圖係為本發明之第一軟性基板製造流程之不意圖’ 〆章圖 第4圖係為本發明之第二軟性基板製造流程之第一不心 9 一 Ju 第5A圖係為本發明之第二軟性基板製造流程之第二不思 圖； 第5B圖係為本發明之第二軟性基板製造流程之第三示意 圖； . ; 第6圖係為本發明之第一軟性基板結合第二軟性基板之示 意圖；以及 第7圖係為本發明之顯示裝置之運作示意圖。 【主要元件符號說明】 [] 1 :顯示裝置； 10 :第一軟性基板； 11 :發光二極體； 12 :第一導線； 099122077 表單編號A0101 第10頁/共18頁 0992038883-0 201203197 1 3 :導電質點； 14 :第二導線； 15 :第二軟性基板； 150 :溝槽； 16 :強化結構； 20 :藍膜； 21 :膠帶； 22 :間隔物； 2 3 .玻璃，201203197 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a display device and a method of fabricating the same, and more particularly to a display device for packaging a light-emitting diode in a flexible package and a method of fabricating the same . [Prior Art] [0002] Currently, a flexible display has a display device that is thin, flexible, impact resistant, and free from the use and space constraints, and is the most promising flat display of the next generation. The 'soft substrate' has many material limitations and is therefore not fully applicable to current glass substrate processes. One of the limitations is that when the flexible substrate is bent, the photoelectric characteristics of the various display elements thereon are changed, and the display quality is affected. [0003] Compared with a liquid crystal display, a light emitting diode (LED) display device has the advantages of brightness, wide viewing angle, impact resistance, long life, and high luminous efficiency, and is very suitable as a human body. The interface of the interest transfer. Ran collapse, make a # full color 1 ^ 1) display, each pixel must contain red, blue and green three primary colors, due to process limitations. At present, it is impossible to simultaneously produce three different colors on the same substrate. The LED, so the more common method is to package the three colors of the LED into a pixel module. Even so, the above-mentioned process time and cost are also high, so the current application is mainly based on large displays with low pixel density. SUMMARY OF THE INVENTION [0004] In view of the above-mentioned problems of the prior art, the object of the present invention is to provide 099122077 Form No. A0101 Page 3 / 18 pages 0992038883-0 201203197 A display device or lighting device and its manufacturing method, Solving the problem of excessively high cost of directly assembling a light emitting diode into a display element or a lighting device. [0005] According to the purpose of the present invention, a display device or a lighting device includes a first flexible substrate, a plurality of light emitting diodes, a plurality of first wires, a plurality of conductive dots, a plurality of second wires, and a The second flexible substrate. The light emitting diode system is arranged in an array on the first flexible substrate, and each of the first wires connects the light emitting diodes in a column direction. The conductive dots are disposed on the respective light emitting diodes, and each of the second wires is connected to the conductive dots in a row direction. The second flexible substrate is provided with a plurality of grooves and accommodates the second wires. [0006] wherein the first flexible substrate and the second flexible substrate are further filled with a reinforcing structure. [0007] The first flexible substrate, the second flexible substrate, and the reinforcing structure are polydimethylsi:loxa:n.e ’ PDMS. [0008] wherein the conductive dots are lead-free solder balls. [0009] wherein the first wire and the second wire are gold bonding wires. [0010] wherein the display device further comprises a scan control unit connected to the first wire for sequentially turning on the light emitting diode. [0011] wherein the display device further comprises a data control unit connected to the second wire for controlling the brightness of the light emitting diode. [0012] According to the purpose of the present invention, a method for manufacturing a display device is further provided, which is applicable to a display device, and the display device includes a first soft base 099122077 Form No. A0101 Page 4 / Total 18 Page 0992038883-0 201203197 a plate, a plurality of light-emitting diodes, a plurality of first wires, a plurality of conductive dots, a plurality of second wires, and a second flexible substrate, the method comprising the steps of: arranging the light-emitting arrays on the first flexible substrate in an array The pole body is further provided with a first wire column to connect the light emitting diodes. After the plurality of trenches are disposed on the second flexible substrate to accommodate the second conductive lines, the conductive dots are disposed on the second flexible substrate, and the first flexible substrate and the second flexible substrate are bonded and thermally pressed to connect the conductive dots to emit light. Diode. [0013] wherein the first flexible substrate and the second flexible substrate are further filled with a reinforcing structure. [0014] wherein, the first flexible substrate, the second flexible substrate, and the reinforcing structure are polydimethylsiloxane (PDMS). [0015] wherein, the conductive dots are lead-free solder balls. [0016] wherein the first wire and the second wire are gold bonding wires. [0017] wherein the display device further comprises a scan control unit connected to the first wire for sequentially turning on the light emitting diode. [0018] wherein the display device further comprises a data control unit connected to the second wire for controlling the brightness of the light emitting diode. [0019] As described above, the display device and the method of manufacturing the same according to the present invention may have one or more of the following advantages: (1) The manufacturing method of the display device can be parallelized by the mesh circuit structure The three-dimensional assembly technology can produce a light-emitting diode flexible display element or a lighting device with flexibility, high brightness and no viewing angle limitation. 099122077 Form No. A0101 Page 5 of 18 0992038883-0 201203197 (2) This display device and its manufacturing method can solve the problem of excessive cost of the packaged three-color LED by a relatively simple process. Embodiments [0020] Please refer to FIG. 1 , which is a schematic diagram of a display device of the present invention. As shown in the figure, the display device 1 of the present invention comprises a first flexible substrate 10, a plurality of light emitting diodes 11, a plurality of first wires 12, a plurality of conductive dots 13, a plurality of second wires 14, and a The second flexible substrate 15. The light-emitting diodes 11 are arranged in an array on the first flexible substrate 10, and each of the first wires 12 connects the respective light-emitting diodes 11 in a row direction. The conductive dots 13 are disposed on the respective light emitting diodes, and the second wires 14 are connected to the conductive dots 13 in the row direction. The second flexible substrate 15 is provided with a plurality of grooves 150 (as shown in FIG. 4) and accommodates a plurality of second wires 14. [0021] The first flexible substrate 10 and the second flexible substrate 15 may be further filled with a reinforcing structure 16 (as shown in FIG. 7). In some preferred embodiments, the first flexible substrate 10, the second flexible substrate 15 and the reinforcing structure 16 may be polydimethylsiloxane (PDMS), and the conductive dots 13 are lead-free solder balls. The first wire 12 and the second wire 14 may be gold wire. [0022] Please refer to FIG. 2, which is a flow chart of a method of manufacturing a display device of the present invention. As shown in the figure, the manufacturing method of the display device of the present invention is applicable to a display device comprising a first flexible substrate, a plurality of light emitting diodes, a plurality of first wires, a plurality of conductive dots, a plurality of second wires and a second flexible substrate, the method comprising the steps of: (S10) arranging the light emitting diodes in an array on the first flexible substrate; (S20) setting the first wire array to connect the light emitting diodes (S30 099122077 Form No. A0101, page 6 / 18 pages 0992038883-0 201203197) a plurality of trenches are disposed on the second flexible substrate to accommodate the second wire; (S40) a conductive dot is disposed on the second flexible substrate; S50) bonding and thermally pressing the first flexible substrate and the second flexible substrate to connect the conductive dots to the light emitting diode. [0023] Please also refer to FIG. 3, which is a schematic diagram of the manufacturing process of the first flexible substrate of the present invention. As shown in the figure, the factory-made light-emitting diode 11 is adhered to a blue tape 20, and after the light-emitting diode 11 is adhered to an adhesive tape 21, the blue film 20 is peeled off. Complete chip transfer. A spacer 22 is placed on the light-emitting diode 11 and the tape 21, and the material of the first flexible substrate 10 is injected and sealed with a glass 23 and heated. The height of the spacer 22 is about 1.14 mm. After the heating is completed, the material of the first flexible substrate 10 is cured (still flexible). At this time, the spacers 22 and the glass 23 are removed, and the tape 21 is removed by placing it in the acetone 24 solution. A plurality of first wires 12 are disposed on the light-emitting diode 11, wherein each of the first wires 12 connects the negative ends of the corresponding columns of the light-emitting diodes 11. Please also refer to FIGS. 4~6, which are first to third schematic views of the second flexible substrate manufacturing process of the present invention and a schematic diagram of the first flexible substrate combined with the second flexible substrate. As shown in FIG. 4, the manufacturing process of the second flexible substrate 15 firstly forms a plurality of grooves 300 on a substrate 30 by a yellow lithography process and a wet etching process, and the groove 300 can assist the second wires 14 Arrangement. Next, the nylon thread 31 is wound in the groove 300, and the second flexible substrate 15 is embossed on the substrate 30, so that the plurality of grooves 150 are recessed on the second flexible substrate 15. Finally, the gold wire (ie, the second wire 14) is wound to 099122077 Form No. A0101 Page 7 of 18 0992038883-0 201203197 In the groove 150, the preliminary second flexible substrate 15 is completed. In addition, the conductive defect 3 can be a lead-free solder ball, which is initially disposed on the second flexible substrate 15 before being connected to the first flexible substrate 1 , so that the conductive dots 13 are connected to the LED 11 . . In addition, as shown in FIG. 5A, the conductive a-point 13 of the cloth a first needs to be cleaned with acetone μ, and then the conductive dot 13 is injected into the B-type 24 and oscillated with the aluminum mold for about 20 seconds. The aluminum mold 40 is provided with a plurality of holes, and the holes can accommodate the conductive dots 13. After the 5B is shown, the remaining conductive dots 13 are poured out, and the die 40 containing the conductive dots 13 and the second flexible substrate 15 containing the second wires 14 are pressed and heated to complete the rotation of the conductive dots 13. Set. Furthermore, as shown in FIG. 6, the first flexible substrate 10 and the second flexible substrate 15 are respectively placed on the glass carrier boards 50, 51, and the first flexible substrate 10 and the second flexible substrate 15 are transparent. The polydimethylsiloxane material can be used to re-heat the laminated glass carrier plates 50, 51 by arranging two conductive dots 13 diagonally on each of the light-emitting diodes 11 to make the first flexible substrate 10 and the second flexible substrate 15 are adhesive. Thereafter, a reinforcing structure 16 is further interposed between the first soft substrate 1〇 and the second flexible substrate 15, and the reinforcing structure 16 may be polydimetliylsiloxane (PDMS). Thus, the display device of the present invention has been completed. Further, it is worth mentioning that the respective electrodes of the light-emitting diode 11 (the connection point of the conductive dots 13 to the light-emitting diodes 11) are not limited to being provided only on a single face of the light-emitting diode 11. In the present embodiment, the two electrode systems of the respective light-emitting diodes π are disposed on the same surface (light-emitting surface or non-light-emitting surface). However, those having ordinary knowledge in the technical field to which the present invention pertains can use these electrodes. Arranged on different faces of the light-emitting diode 11 (there is a 099122077 form bat number A0101 page 8 / 18 pages 0992038883-201203197 placed on the light-emitting surface, and the other is placed on the non-light-emitting surface), and the arrangement thereof is It can be changed depending on actual design needs. [0026] The display device of the present invention is illuminated in a subsequent lighting test with a single LED voltage of 3 Ford and a current of 20 milliamps, measured at a distance of 10 cm, and has a brightness of 20. 06 Lux (Lux); and the viewing angle test shows that at a distance of 10 cm, ambient brightness 0 lux, voltage 3 Ford and current 20 mA, the viewing angle range can be greater than 175 degrees, that is, almost no viewing angle limit . [0027] In addition, the display device 1 of the present invention may further include a scan control unit (not shown) connecting the first wires 12 for sequentially turning on the LEDs 11; and the display device 1 further includes a data A control unit (not shown) is connected to the second wire 14 for controlling the brightness of the light emitting diode 11. In some preferred embodiments, the scan control unit scans in a single row of LED dies, and the data control unit utilizes pulse width modulation (PWM). The digital signal 1 (ON), 0 (OF) and duty cycle (duty 〇 cycle) control the length of the current input to determine the brightness of the light-emitting diode, thereby determining the color of a single pixel, the result is the seventh The figure shows. [0028] The present invention successfully utilizes a mesh circuit structure and a micro-electromechanical assembly technology to produce a flexible display element or a lighting device with a flexible light-emitting diode, which greatly improves the applicability of soft display or illumination and reduces the manufacturing cost thereof: In the present invention, the light-emitting diode flexible display element is further driven by digital constant-frequency pulse width modulation to display the screen. The integration of the micro-assembly technology disclosed in the present invention contributes to the development of a new type of flexible display element and illumination device; compared with the conventional liquid crystal display, the present invention makes 099122077 form number A0101 page 9 / 18 pages 0992038883-0 201203197 Using a light-emitting diode as a light-emitting pixel, the picture is not distorted due to the bending of the substrate, and there is no problem of loss of brightness. It is often suitable for use in sunlight. The above description is merely exemplary and not limiting. For example, the display device may also be a light-emitting device or a lighting device, and the conductive dots may also be conductive beads. Any equivalent modifications or alterations to the spirit and scope of the present invention should be included in the appended patent application. [FIG. 1] FIG. 1 is a 2 is a flow chart of a method for manufacturing a display device of the present invention. FIG. 3 is a schematic view of the first flexible substrate manufacturing process of the present invention. The first soft substrate manufacturing process of the invention is the first one. The fifth FIG. 5A is the second non-thinking of the second flexible substrate manufacturing process of the present invention; FIG. 5B is the second flexible substrate manufacturing of the present invention. The third schematic diagram of the process is a schematic diagram of the first flexible substrate in combination with the second flexible substrate of the present invention; and FIG. 7 is a schematic diagram of the operation of the display device of the present invention. [Description of main component symbols] [] 1 : Display device; 10: First flexible substrate; 11: Light-emitting diode; 12: First wire; 099122077 Form number A0101 Page 10/18 pages 0992038883-0 201203197 1 3 : conductive dots; 14: second wire; 15: second flexible substrate; 150: trench; 16: strengthened structure; 20: blue film; 21: tape; 22: spacer;
24 :丙酮； 30 :基板； 300 :凹槽； 31 :尼龍線； 4 0 .紹模， 50、51 :玻璃載板；以及 S10〜S50 :步驟。 ❹ 099122077 表單編號A0101 第11頁/共18頁 0992038883-024: acetone; 30: substrate; 300: groove; 31: nylon thread; 4 0. stencil, 50, 51: glass carrier; and S10 to S50: steps. ❹ 099122077 Form No. A0101 Page 11 of 18 0992038883-0