CN106449498B - For shifting the transposition head of microcomponent and the transfer method of microcomponent - Google Patents
For shifting the transposition head of microcomponent and the transfer method of microcomponent Download PDFInfo
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- CN106449498B CN106449498B CN201610865728.XA CN201610865728A CN106449498B CN 106449498 B CN106449498 B CN 106449498B CN 201610865728 A CN201610865728 A CN 201610865728A CN 106449498 B CN106449498 B CN 106449498B
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- 238000012546 transfer Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000017105 transposition Effects 0.000 title claims abstract description 20
- 230000003287 optical effect Effects 0.000 claims abstract description 18
- 238000010521 absorption reaction Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 52
- 238000003795 desorption Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a kind of for shifting the transposition head of microcomponent and the transfer method of microcomponent, it include: the cavity with free-air path, and the external member with several suction nozzles He several free-air path components, the suction nozzle is configured to communicate with the free-air path component respectively, the free-air path component is formed to communicate with the free-air path being formed in the cavity respectively, and the suction nozzle uses vacuum pressure absorption microcomponent or release microcomponent, the vacuum pressure via in each access free-air path component and free-air path transmit, it is characterized by: when the external member is installed to the cavity, the upper surface of external member is provided with optical switch component, for controlling the on or off of free-air path component and free-air path in each access, to control the microcomponent needed for suction nozzle is adsorbed or discharged using vacuum pressure.
Description
Technical field
The present invention relates to the microcomponent for display, more particularly, to a kind of transposition head for shifting microcomponent and
The transfer method of microcomponent.
Background technique
Microcomponent technology refers on substrate with the element arrays of the microsize of High Density Integration.Currently, micro- spacing hair
Optical diode (Micro LED) technology is increasingly becoming research hot topic, and industry expectation has the microcomponent product of high-quality to enter city
?.It is deep that the micro- spacing light emitting diode product of high-quality can show that product generates to the tradition of existing such as LCD/OLED in the market
Carving influences.
During manufacturing microcomponent, microcomponent is formed on donor substrate first, then microcomponent is transferred to and is connect
It receives on substrate.Receiving substrate is, for example, display screen.Difficulty during manufacturing microcomponent is: how by microcomponent from
It is transferred to and is received on substrate on donor substrate.
The method of tradition transfer microcomponent is to engage (Wafer Bonding) by substrate to turn microcomponent from transfer base substrate
Move to reception substrate.One of implementation method of transfer method is directly transfer, that is, directly by microcomponent array rotation
It moves substrate and is bonded to reception substrate, later again remove transfer base substrate.Another implementation method is indirect branch.The method includes
The step of engaging/removing twice, firstly, transfer base substrate extracts microcomponent array from donor substrate, then transfer base substrate again will be micro-
Element arrays are bonded to reception substrate, and finally transfer base substrate is removed again.Wherein, microcomponent array is extracted generally to pick up by electrostatic
The mode that takes executes.It is needed during electrostatic picks up using transfer head array.The structure for shifting head array is relative complex,
And need to consider its reliability.Manufacture transfer head array needs additional cost.Before the pickup using transfer head array
It needs to generate phase change.In addition, microcomponent is used for the heat budget of phase change in the manufacturing process using transfer head array
It is restricted, usually less than 350 DEG C, or more specifically, less than 200 DEG C；Otherwise, the performance of microcomponent can deteriorate.
Summary of the invention
In view of the above-mentioned problems, the transposition head that the invention proposes a kind of for shifting microcomponent and the transfer side of microcomponent
Method.
According to the first aspect of the invention, a kind of for shifting the transposition head of microcomponent, comprising: with free-air path
Cavity, and the external member with several suction nozzles He several free-air path components, the suction nozzle be configured to respectively with it is described
Free-air path component communicates, the free-air path component be formed respectively with the free-air path phase that is formed in the cavity
It is logical, and the suction nozzle, using vacuum pressure absorption microcomponent or release microcomponent, the vacuum pressure is via true in each access
Empty path components and free-air path transmission, it is characterised in that: when the external member is installed to the cavity, the upper surface of external member is set
It is equipped with optical switch component, for controlling the on or off of free-air path component and free-air path in each access, to control suction
Mouth adsorbs using vacuum pressure or discharges required microcomponent.
Preferably, the optical switch component includes DMD(digital micro-mirror) chip.
Preferably, the dmd chip includes micro-reflector, by changing the folder between micro-reflector and the upper surface of external member
Angle, to control the on or off of free-air path component and free-air path in each access.
Preferably, the angle is less than or equal to 12 °.
Preferably, when the angle is zero, free-air path component and free-air path in each access are closed；When the folder
When angle is not zero, free-air path component and free-air path in each access are opened.
According to the second aspect of the invention, a kind of transfer method of microcomponent is provided, it is characterised in that: the infinitesimal
The transfer method of part includes step:
(1) at least one microcomponent is placed on the first substrate；
(2) transposition head described in claim 1 is used, direction simultaneously contacts the microcomponent, and the suction nozzle uses vacuum pressure
Power adsorbs the microcomponent, by optical switch component control free-air path component in each access and free-air path open or
It closes, to extract required microcomponent；And
(3) transposition head described in claim 1 is used, towards a second substrate, the suction nozzle is discharged using vacuum pressure
Microcomponent controls the on or off of the free-air path component and free-air path in each access, by optical switch component to discharge
The microcomponent needed is in the second substrate.
Preferably, the quantity of the microcomponent is multiple, and wherein step (2) only adsorbs the part microcomponent, to mention
Take required microcomponent.
Preferably, the quantity of the microcomponent is multiple, and wherein only the part microcomponent is desorbed for step (3), to release
Put required microcomponent.
Preferably, the optical switch component includes dmd chip.
Preferably, the dmd chip includes micro-reflector, by changing the folder between micro-reflector and the upper surface of external member
Angle, to control the on or off of free-air path component and free-air path in each access.
Preferably, the angle is less than or equal to 12 °.
Preferably, when the angle is zero, free-air path component and free-air path in each access are closed；When the folder
When angle is not zero, free-air path component and free-air path in each access are opened.
Preferably, the first substrate is growth substrate or bearing substrate.
Preferably, the second substrate is active component array base board or passive device array substrate.
In addition, it will be appreciated by those skilled in the art that although many problems exist in the prior art, it is of the invention
The technical solution of each embodiment or claim can be improved only at one or several aspects, existing without solving simultaneously
The whole technical problems for having in technology or being listed in background technique.It will be appreciated by those skilled in the art that for a right
The content that do not mention in it is required that should not be taken as the limitation for the claim.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In addition, attached drawing data be description summary, be not by
Ratio is drawn.
Fig. 1 is the flow chart of the transfer method for the microcomponent implemented according to the present invention.
Fig. 2 ~ Fig. 6 is the process schematic according to the transfer method of the microcomponent of the embodiment of the present invention.
It is indicated in figure: 100: first substrate；200: microcomponent；300: transposition head；301: the cavity with free-air path；
302: external member；303: suction nozzle；304: free-air path component；305: optical switch component；400: the second substrate.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Specific embodiment
It present embodiments describes the transposition head for shifting microcomponent and transfer infinitesimal is carried out using the transposition head
The method of part.Wherein, microcomponent can be miniature LED component, diode, transistor, integrated circuit (IC) chip etc., ruler
Very little is 1 ~ 100 μm, but is not necessarily limited to this, and some aspects of embodiment are applicable to bigger and smaller size.
Fig. 1 shows a kind of transfer method of microcomponent, mainly includes processing step S100 ~ S300, below with reference to
Fig. 2 ~ 6 are illustrated.
As shown in Fig. 2, providing a first substrate 100, which can be growth substrate or bearing substrate, the present embodiment
It is preferred that bearing substrate, the material of bearing substrate can be glass, silicon, polycarbonate (Polycarbonate), acrylonitrile-butadiene-
Styrene (Acrylonitrile Butadiene Styrene) or any combination thereof.It should be appreciated that carrying provided above
The specific embodiment of substrate is only to illustrate, and is not intended to limit the invention, and has usually know in the technical field of the invention
The knowledgeable should regard actual needs, the specific embodiment of flexible choice first substrate 100.Several are placed on first substrate 100
Microcomponent 200, microcomponent can be the wafer for not yet carrying out wafer dicing processes or light emitting diode or laser diode,
The preferred microcomponent of the present embodiment is thin-film led (Thin Light-emitting Diode), and thickness can be about 0.5 μm
To about 100 μm.The shape of microcomponent 200 can be cylindrical body, and the radius of cylindrical body can be about 0.5 μm to about 500 μm, but not
It is limited to this, microcomponent 200 can also be for triangulo column, cube, cuboid, hexagonal cylinder, octagonal cylinder or other are polygonal
Cylinder.
As shown in Figures 3 and 4, a transposition head 300 is provided, direction simultaneously contacts the microcomponent 200 being located on first substrate 100.
Transposition head 300 includes: the cavity 301 with free-air path, and has several suction nozzles 303 and several free-air path components
304 external member 302, suction nozzle 303 are configured to communicate with free-air path component 304 respectively, and free-air path component 304 is formed
It is communicated respectively with the free-air path being formed in cavity 301, and suction nozzle 303 uses vacuum pressure absorption microcomponent or release infinitesimal
Part, vacuum pressure via in each access free-air path component and free-air path transmit.When external member 302 is installed to vacuum road
When the cavity 301 of diameter, the upper surface of external member is provided with optical switch component 305, for controlling the free-air path portion in each access
The on or off of part and free-air path, to control the microcomponent needed for suction nozzle is adsorbed or discharged using vacuum pressure.The present embodiment
Suction nozzle, free-air path component, microcomponent number be 3, define suction nozzle/free-air path component/microcomponent in Fig. 3 from a left side
It is the 1st, the 2nd and the 3rd to the right side.It such as needs adsorption potential in the 1st and the 3rd microcomponent on bearing substrate 100, only needs
It is in an open state (ON) by the access that optical switch component 305 controls the 1st free-air path component and free-air path, the 2nd
The access of free-air path component and free-air path is in off state (OFF), the access of the 3rd free-air path component and free-air path
It is in an open state (ON).Specifically, optical switch component 305 preferably includes dmd chip, and dmd chip has micro-reflector, leads to
The angle changed between micro-reflector and the upper surface of external member is crossed, to control free-air path component and the free-air path in each access
On or off.Preferably, the angle is less than or equal to 12 °, when the angle is zero, the 2nd free-air path component and vacuum
The path blockade in path；When the angle is α=8 °, the access of the 1st free-air path component and free-air path is opened；Work as institute
When to state angle be β=12 °, the access of the 3rd free-air path component and free-air path is opened.It should be noted that micro- by changing
Angle between reflecting mirror and the upper surface of external member, can control the free-air path component and free-air path in each access open or
It closes, also can control the size of vacuum pressure.
As described above, transposition head 300 towards and contact be located at first substrate 100 on microcomponent 200, suction nozzle use vacuum
Pressure adsorption microcomponent controls the on or off of the free-air path component and free-air path in each access by optical switch component,
To extract required microcomponent.
As it can be seen in figures 5 and 6, providing a second substrate 400, transposition head 300 is towards the second substrate 400.The second substrate is made
For receive substrate, vehicle glass, sheet glass, flexible electronic substrate can be selected all if any the flexible membrane of circuit, display backplane,
Solar energy glass, metal, polymer, polymer complex and glass fibre.Suction nozzle 303 discharges infinitesimal using vacuum pressure
Part 200 controls the on or off of the free-air path component and free-air path in each access by optical switch component 305, with release
Required microcomponent is in the second substrate 400.
The second substrate 400 can be active component array base board or passive device array substrate, in the present embodiment, excellent
Active component array base board is selected, therefore the second substrate 400 and microcomponent 200 will form active display panels, but it is not limited to this.
The second substrate 400 and microcomponent 200 can also form light emitting device.
It should be noted that above-mentioned microcomponent disposably can be extracted all, only extracting section also can according to need.Into
One step, it can be shifted with extracting section qualification microcomponent, leave remaining unqualified microcomponent；Unqualified infinitesimal can also be extracted
Part, and qualified microcomponent is left on the first substrate, it can so promote efficiency and yield in microcomponent transfer process.
The microcomponent transfer method of the present embodiment can be used for making electronic device, can be widely applied in electronic equipment,
The electronic equipment can be mobile phone, tablet computer etc..
Although exemplary embodiment of the present invention has been described, it is understood that, the present invention should not necessarily be limited by these examples
Property embodiment but those skilled in the art can be in the spirit and scope of the present invention as required by claim above
Interior carry out variations and modifications.
Claims (7)
1. for shifting the transposition head of microcomponent, comprising: the cavity with free-air path, and there are several suction nozzles and several
The external member of a free-air path component, the suction nozzle are configured to communicate with the free-air path component respectively, the free-air path
Component is formed to communicate with the free-air path being formed in the cavity respectively, and the suction nozzle adsorbed using vacuum pressure it is micro-
Element or release microcomponent, the vacuum pressure via in each access free-air path component and free-air path transmit, feature
Be: when the external member is installed to the cavity, the upper surface of external member is provided with optical switch component, the optical switch group
Part includes dmd chip, and the dmd chip includes micro-reflector, by changing the folder between micro-reflector and the upper surface of external member
Angle, for controlling the on or off of free-air path component and free-air path in each access, so that controlling suction nozzle uses vacuum pressure
Microcomponent needed for absorption or release.
2. according to claim 1 for shifting the transposition head of microcomponent, it is characterised in that: the angle is less than or equal to
12°。
3. according to claim 1 for shifting the transposition head of microcomponent, it is characterised in that: when the angle is zero,
Free-air path component and free-air path in each access are closed；Free-air path portion when the angle is not zero, in each access
Part and free-air path are opened.
4. the transfer method of microcomponent, it is characterised in that: the transfer method of the microcomponent includes step:
(1) at least one microcomponent is placed on the first substrate；
(2) transposition head described in claim 1 is used, direction simultaneously contacts the microcomponent, and the suction nozzle uses vacuum pressure absorbing
The attached microcomponent controls the on or off of the free-air path component and free-air path in each access by optical switch component, with
Microcomponent needed for extracting；And
(3) transposition head described in claim 1 is used, towards a second substrate, the suction nozzle discharges infinitesimal using vacuum pressure
Part controls the on or off of the free-air path component and free-air path in each access by optical switch component, needed for release
Microcomponent is in the second substrate；
Wherein the optical switch component in step (2) or step (3) includes dmd chip, and the dmd chip includes micro-reflector,
By changing the angle between micro-reflector and the upper surface of external member, to control the free-air path component in each access and vacuum road
The on or off of diameter.
5. the transfer method of microcomponent according to claim 4, it is characterised in that: the quantity of the microcomponent be it is multiple,
Wherein step (2) only adsorbs the part microcomponent, and to extract required microcomponent, step (3) is only by the part infinitesimal
Part desorption, to discharge required microcomponent.
6. the transfer method of microcomponent according to claim 4, it is characterised in that: the angle is less than or equal to 12 °.
7. the transfer method of microcomponent according to claim 4, it is characterised in that: when the angle is zero, each access
In free-air path component and free-air path close；When the angle is not zero, free-air path component in each access and true
Dead circuit diameter is opened.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610865728.XA CN106449498B (en) | 2016-09-30 | 2016-09-30 | For shifting the transposition head of microcomponent and the transfer method of microcomponent |
| PCT/CN2016/104868 WO2018058748A1 (en) | 2016-09-30 | 2016-11-07 | Pick-and-place head for use in transfer of micro-component and method for transferring micro-component |
| US15/859,659 US10916458B2 (en) | 2016-09-30 | 2017-12-31 | Transfer head for transferring micro element and transferring method of micro element |
| US17/139,976 US11631601B2 (en) | 2016-09-30 | 2020-12-31 | Transfer head for transferring micro element and transferring method of micro element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610865728.XA CN106449498B (en) | 2016-09-30 | 2016-09-30 | For shifting the transposition head of microcomponent and the transfer method of microcomponent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106449498A CN106449498A (en) | 2017-02-22 |
| CN106449498B true CN106449498B (en) | 2019-01-04 |
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| CN201610865728.XA Active CN106449498B (en) | 2016-09-30 | 2016-09-30 | For shifting the transposition head of microcomponent and the transfer method of microcomponent |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107818931B (en) | 2017-09-30 | 2021-10-19 | 厦门市三安光电科技有限公司 | Transfer method and transfer device for semiconductor micro-component |
| KR102424246B1 (en) * | 2018-03-30 | 2022-07-25 | (주)포인트엔지니어링 | Transfer system for micro led with transfer head |
| JP7193062B2 (en) * | 2018-08-01 | 2022-12-20 | Thk株式会社 | Actuator sensing device and actuator control system |
| CN109360883B (en) * | 2018-09-29 | 2020-02-14 | 惠州雷通光电器件有限公司 | Light emitting diode die bonding device and method and display panel manufacturing device and method |
| CN111244009B (en) | 2018-11-29 | 2022-10-28 | 成都辰显光电有限公司 | Transfer device for micro-components |
| CN109927403B (en) * | 2019-04-19 | 2021-06-29 | 成都辰显光电有限公司 | Transfer printing device, manufacturing method of transfer printing device and transfer printing method |
| CN111987193B (en) * | 2019-05-22 | 2021-06-11 | 成都辰显光电有限公司 | Micro light emitting diode transfer device and manufacturing method thereof |
| CN112786514B (en) * | 2019-11-11 | 2023-01-03 | 成都辰显光电有限公司 | Temporary transfer substrate of micro-component and preparation method thereof |
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| JPH06115687A (en) * | 1992-10-02 | 1994-04-26 | Shindengen Electric Mfg Co Ltd | Mechanism for reversing top and back of polar electronic parts |
| JP2009188052A (en) * | 2008-02-04 | 2009-08-20 | Yamaha Motor Co Ltd | Electronic component transferring apparatus |
| CN101920247A (en) * | 2009-06-11 | 2010-12-22 | 泰克元有限公司 | Pick-and-place module for test handler |
| CN102610535A (en) * | 2011-01-21 | 2012-07-25 | 三星半导体(中国)研究开发有限公司 | Ball attachment device, solder ball picking method and solder ball mounting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06115687A (en) * | 1992-10-02 | 1994-04-26 | Shindengen Electric Mfg Co Ltd | Mechanism for reversing top and back of polar electronic parts |
| JP2009188052A (en) * | 2008-02-04 | 2009-08-20 | Yamaha Motor Co Ltd | Electronic component transferring apparatus |
| CN101920247A (en) * | 2009-06-11 | 2010-12-22 | 泰克元有限公司 | Pick-and-place module for test handler |
| CN102610535A (en) * | 2011-01-21 | 2012-07-25 | 三星半导体(中国)研究开发有限公司 | Ball attachment device, solder ball picking method and solder ball mounting method |
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| CN106449498A (en) | 2017-02-22 |
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