JP4785995B1 - Workpiece adhesive chuck device and workpiece bonding machine - Google Patents

Workpiece adhesive chuck device and workpiece bonding machine Download PDF

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JP4785995B1
JP4785995B1 JP2011043224A JP2011043224A JP4785995B1 JP 4785995 B1 JP4785995 B1 JP 4785995B1 JP 2011043224 A JP2011043224 A JP 2011043224A JP 2011043224 A JP2011043224 A JP 2011043224A JP 4785995 B1 JP4785995 B1 JP 4785995B1
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workpiece
adhesive
plate
support member
peeling
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JP2012182254A (en
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義和 大谷
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Shin Etsu Engineering Co Ltd
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Shin Etsu Engineering Co Ltd
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Priority to KR1020110145793A priority patent/KR101867098B1/en
Priority to TW101100969A priority patent/TWI493640B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Abstract

【課題】粘着部材と剥離部材のユニット化を構成し易くしながら剥離性能を向上させる。
【解決手段】支持部材３の側面３ｂと環状部材４の係止凹部４ａとの間に、剥離部材２の取付凸部２ｃを変形部２ａの変形方向へ移動不能に挟み込むとともに、環状部材４の取付面４ｂに、変形部２ａの外縁と隣接して粘着部材１を取り付けることにより、環状部材４を介して剥離部材２及び支持部材３と粘着部材１が一体的に組み付けられる。さらに変形部２ａと粘着面１ａが互いに隣り合って限りなく接近して配置されるため、粘着面１ａに粘着保持された板状ワークＷを変形部２ａの変形で剥離する際に、大きな剥離力が得られ、剥離時において板状ワークＷに生ずる撓みが最小限に抑えられる。
【選択図】図１An object of the present invention is to improve peeling performance while making it easy to form a unit of an adhesive member and a peeling member.
An attachment convex portion 2c of a peeling member 2 is sandwiched between a side surface 3b of a support member 3 and a locking concave portion 4a of the annular member 4 so as to be immovable in a deformation direction of the deformation portion 2a. By attaching the adhesive member 1 to the attachment surface 4b adjacent to the outer edge of the deformable portion 2a, the peeling member 2, the support member 3, and the adhesive member 1 are assembled together via the annular member 4. Further, since the deformable portion 2a and the adhesive surface 1a are arranged as close as possible next to each other, when the plate-like workpiece W adhered and held on the adhesive surface 1a is peeled by deformation of the deformable portion 2a, a large peeling force is obtained. And the bending that occurs in the plate-like workpiece W during peeling is minimized.
[Selection] Figure 1

Description

本発明は、例えば液晶ディスプレイ（ＬＣＤ）や有機ＥＬディスプレイ（ＯＬＥＤ）やプラズマディスプレイ（ＰＤＰ）やフレキシブルディスプレイなどのフラットパネルディスプレイの製造過程において、ＣＦガラスやＴＦＴガラスなどのガラス製基板か又はＰＥＳ（Poly-Ether-Sulphone）などのプラスチックフィルムなどからなる合成樹脂製基板などの板状ワークを粘着保持して貼り合わせる基板貼り合わせ機を含む基板組立装置や、このような基板などの絶縁体、導電体又は半導体ウエハなどのワーク（被処理体）を搬送する基板搬送装置などに用いられるワーク粘着チャック装置と、このワーク粘着チャック装置を備えたワーク貼り合わせ機に関する。   In the manufacturing process of a flat panel display such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, the present invention can be applied to a glass substrate such as CF glass or TFT glass or PES ( Substrate assembly equipment including a substrate laminating machine that adheres and holds plate-like workpieces such as synthetic resin substrates made of plastic films such as poly-Ether-Sulphone), insulators such as substrates, conductive The present invention relates to a workpiece adhesion chuck device used in a substrate conveyance device for conveying a workpiece (workpiece) such as a body or a semiconductor wafer, and a workpiece bonding machine including the workpiece adhesion chuck device.

従来、この種のワーク粘着チャック装置及びワーク貼り合わせ機としては、第１の基板が安着する第１の定盤が備えられる第１のチャンバと、上記第１のチャンバから離隔され、上記第１の基板と合着される第２の基板が安着する第２定盤が備えられる第２のチャンバと、上記第１の定盤に安着する第１の基板を、粘着力を用いて固定させる粘着ゴムと、上記第１の基板が上記粘着ゴムから離脱されるように上記粘着力と反対される方向の力を誘導する粘着解除装置とを含む基板合着装置がある（例えば、特許文献１参照）。
上記第１の定盤の付着面に複数個の通孔を備え、上記通孔に上記粘着ゴムが露出されるように設けられる。上記粘着解除装置は、上記第１の定盤に備えられた凹部に設けられ、上記第１の基板の付着面方向に加熱膨脹して上記第１の基板を離脱させる加熱膨脹部で構成される。上記加熱膨脹部は、上記粘着ゴムに付着された上記第１の基板の付着面側に膨脹する膨脹部材と、上記膨脹部材が設けられて密閉空間を形成するハウジングと、上記膨脹部材が膨脹するように上記ハウジング内部のエアーを加熱するための加熱部とを含む。上記ハウジングには、上記膨脹部材の収縮時に支持して復帰の際の変形を防止するための支持部材が備えられる。
さらに、上記第１の定盤の上記凹部に上記ハウジングが嵌入され、上記ハウジングの中心部に突設された上記支持部材の表面に沿って、上記膨脹部材となるダイヤフラム（ダイアフラム）を張架し、上記ダイヤフラムの外周部と上記ハウジングの外周部をボルトで上記第１の定盤に対し共締めして取り付けている。上記粘着ゴムは、上記ボルトの外側に上記ダイヤフラムを中心として放射状に複数に設けられている。 Conventionally, as this kind of workpiece adhesive chuck device and workpiece bonding machine, a first chamber provided with a first surface plate on which a first substrate is seated, and a first chamber provided apart from the first chamber, The second chamber provided with the second surface plate on which the second substrate to be bonded to the first substrate is attached, and the first substrate to be fixed on the first surface plate are bonded using adhesive force. There is a substrate bonding apparatus including an adhesive rubber to be fixed and an adhesion release device that induces a force in a direction opposite to the adhesive force so that the first substrate is detached from the adhesive rubber (for example, a patent) Reference 1).
The attachment surface of the first surface plate is provided with a plurality of through holes, and the adhesive rubber is provided in the through holes. The detackifying device is provided in a recess provided in the first surface plate, and is configured by a heating expansion unit that heats and expands in the direction of the attachment surface of the first substrate to release the first substrate. . The heating and expanding section includes an expansion member that expands on the adhesion surface side of the first substrate attached to the adhesive rubber, a housing that is provided with the expansion member to form a sealed space, and the expansion member expands. And a heating unit for heating the air inside the housing. The housing is provided with a support member that is supported when the expansion member is contracted to prevent deformation upon return.
Further, the housing is inserted into the recess of the first surface plate, and a diaphragm (diaphragm) serving as the expansion member is stretched along the surface of the support member protruding from the center of the housing. The outer peripheral portion of the diaphragm and the outer peripheral portion of the housing are attached to the first surface plate with bolts. A plurality of the adhesive rubbers are radially provided around the diaphragm on the outside of the bolt.

特開２０１０−１２６３４２号公報（図１−５，６−８）JP 2010-126342 A (FIGS. 1-5, 6-8)

近年では液晶ディスプレイや有機ＥＬディスプレイなどに用いられる基板サイズが大型化する傾向で、一辺が2000ｍｍを超えるものまで製造され始めている。その場合、粘着部及び剥離部からなるユニットを数百個以上配置する必要がある。したがって、生産性を向上させるためには、多品種の板状ワークに対応するためのそれらの配置換え、故障又は性能劣化に伴う交換作業等を容易に行うことが不可欠であるとともに、それぞれの粘着部及び剥離部の動作を確実化し且つ均一化する必要がある。
しかし乍ら、このような従来のワーク粘着チャック装置及びワーク貼り合わせ機では、定盤に複数の加熱膨脹部が所定間隔毎に分散配置されるとともに、各加熱膨脹部の周囲に多数の粘着ゴムが分散配置されているものの、これら加熱膨脹部と粘着ゴムを定盤に対してそれぞれ個別に取り付けているため、設置作業と部品交換作業が面倒であるという問題があった。
さらに、基板を粘着保持する粘着ゴムと、粘着ゴムから基板を離脱するために定盤から離脱する方向へ押圧するダイヤフラムとが、取り付け用のボルトを挟んで離れて配置されるため、ダイヤフラムの膨張変形で基板を剥離方向へ押圧すると、基板においてダイヤフラムによる押圧部位と粘着ゴムによる粘着部位との間に撓み変形が発生して、この粘着部位を粘着ゴムから剥離方向へ押圧できず、確実に剥離できない場合がある。
特に、基板の厚さ寸法が薄くなると、ダイヤフラムによる押圧で基板の撓み変形量が大きくなり、基板の粘着部分を粘着ゴムから剥離することが困難であった。
さらに、粘着ゴムで粘着保持された第１基板と、別に保持された第２基板とを互いに接近させた後に、ダイヤフラムの膨張変形で粘着ゴムから第１基板を剥離して重ね合わせるワーク貼り合わせ機では、ダイヤフラムにより剥離時に発生した第１基板の撓み変形が貼り合わせ後にも残ってしまい、第１基板と第２基板同士の貼り合わせ精度が部分的に悪くなるという問題もあった。
また、ダイヤフラムが支持部材の表面に沿って張架され、粘着ゴムによる基板の粘着保持時にはダイヤフラムが基板ヘ向け突出しないようにダイヤフラムの裏面を支持部材の表面に密接させる必要があるため、ダイヤフラムと支持部材の材質によっては、それらの対向面同士が部分的又は全体的に貼り付くおそれがある。このような場合には、基板の剥離時に、支持部材の表面からダイヤフラムの裏面の一部のみが部分的に離隔されて、ダイヤフラムが歪な形状に膨張変形し、そのために粘着ゴムの粘着面から基板を斜め方向へ押し剥がしたり、不均一な剥離状態になることがあった。
特に、真空状態で基板を粘着保持するには、ダイヤフラムを支持部材側から真空吸引して両者を強く密接させる必要があるため、ダイヤフラムの裏面を支持部材の表面が更に貼り付き易くなり、内圧の上昇だけで全面的に離すことが困難であった。 In recent years, substrate sizes used for liquid crystal displays, organic EL displays, and the like tend to increase in size, and the manufacture of products having a side exceeding 2000 mm has begun. In that case, it is necessary to arrange several hundred units or more of the adhesive portion and the peeling portion. Therefore, in order to improve productivity, it is indispensable to easily replace them in order to deal with a wide variety of plate-like workpieces, and perform replacement work associated with failure or performance deterioration. It is necessary to ensure and equalize the operation of the part and the peeling part.
However, in such a conventional workpiece adhesive chuck device and workpiece bonding machine, a plurality of heating expansion portions are distributed and arranged on the surface plate at predetermined intervals, and a large number of adhesive rubbers are provided around each heating expansion portion. However, since the heating expansion part and the adhesive rubber are individually attached to the surface plate, there is a problem that the installation work and the part replacement work are troublesome.
In addition, since the adhesive rubber that holds the substrate in an adhesive state and the diaphragm that presses in the direction away from the surface plate in order to release the substrate from the adhesive rubber are arranged apart from each other with the bolts for mounting, the expansion of the diaphragm When the substrate is pressed in the peeling direction due to deformation, bending deformation occurs between the pressing portion by the diaphragm and the sticking portion by the adhesive rubber on the substrate, and this sticking portion cannot be pressed from the sticking rubber in the peeling direction, and the peeling is surely performed. There are cases where it is not possible.
In particular, when the thickness dimension of the substrate is reduced, the amount of bending deformation of the substrate is increased by pressing with the diaphragm, and it is difficult to peel the adhesive portion of the substrate from the adhesive rubber.
Furthermore, after the first substrate held and adhered by the adhesive rubber and the second substrate held separately are brought close to each other, the workpiece bonding machine for peeling and superimposing the first substrate from the adhesive rubber by the expansion deformation of the diaphragm Then, the deformation | transformation deformation | transformation of the 1st board | substrate which generate | occur | produced at the time of peeling with a diaphragm remains after bonding, and there also existed a problem that the bonding precision of a 1st board | substrate and 2nd board | substrates deteriorated partially.
In addition, the diaphragm is stretched along the surface of the support member, and when the substrate is held by the adhesive rubber, it is necessary to bring the back surface of the diaphragm into close contact with the surface of the support member so that the diaphragm does not protrude toward the substrate. Depending on the material of the support member, the facing surfaces may be partially or entirely attached. In such a case, when the substrate is peeled off, only a part of the back surface of the diaphragm is partially separated from the surface of the support member, and the diaphragm expands and deforms into a distorted shape. The substrate may be peeled off in an oblique direction or may be in a non-uniform peeled state.
In particular, in order to adhere and hold the substrate in a vacuum state, it is necessary to vacuum-suck the diaphragm from the support member side so that the two are strongly in close contact with each other. It was difficult to release the entire area only by ascending.

本発明は、このような問題に対処することを課題とするものであり、粘着部材と剥離部材のユニット化を構成し易くしながら剥離性能を向上させることが可能なワーク粘着チャック装置を提供すること、粘着保持された第１の板状ワークを第２の板状ワークと平行に剥離して貼り合わせることが可能で生産性が高いワーク貼り合わせ機を提供すること、などを目的とするものである。   An object of the present invention is to cope with such a problem, and provides a workpiece adhesive chuck device capable of improving the peeling performance while easily forming a unit of an adhesive member and a peeling member. It is intended to provide a work laminating machine that can peel and bond the first plate-like work held in an adhesive state in parallel with the second plate-like work and has high productivity. It is.

このような目的を達成するために本発明によるワーク粘着チャック装置は、板状ワークと対向するように設けられて該板状ワークを着脱自在に粘着保持する粘着部材と、前記板状ワークと交差する方向へ変形して前記粘着部材の粘着面から前記板状ワークを強制的に剥離させるように設けられる剥離部材と、前記剥離部材の背後に設けられて前記剥離部材に沿った表面及び側面を有する支持部材と、前記支持部材の前記側面の外周を囲むように設けられる環状部材とを備え、前記剥離部材は、前記支持部材の前記表面に沿って変形可能に形成される変形部と、該変形部の外周から前記支持部材の前記側面に沿って厚さ方向へ延びるように形成される脚部と、該脚部から前記環状部材に向け突出するように形成される取付凸部と、前記支持部材の前記側面に形成した係合凸部が嵌合する係合溝とを有し、前記環状部材は、前記支持部材の前記側面及び前記係合凸部との間に前記剥離部材の前記取付凸部を前記変形部の変形方向へ移動不能に挟み込む係止凹部と、前記変形部の外縁と隣接して前記粘着部材が取り付けられる取付面とを有することを特徴とする。 In order to achieve such an object, a workpiece adhesive chuck device according to the present invention is provided so as to face a plate-like workpiece, and attaches and detachably holds the plate-like workpiece, and intersects the plate-like workpiece. A peeling member provided so as to forcibly peel the plate-like workpiece from the adhesive surface of the adhesive member by deforming in the direction to be, and a surface and side surfaces along the peeling member provided behind the peeling member a support member that Yusuke, and an annular member provided so as to surround the outer periphery of the side surface of the support member, the release member comprises a deformable portion formed deformable along said surface of said support member , a leg portion which is formed so as to extend from the outer periphery of the mutant form section to the thickness direction along the side of the support member, the mounting being formed so as to exit towards only collision before Symbol annular member from the leg and the convex portion, the support member And a engaging groove in which the engagement convex portion formed on the side surface is fitted, the annular member, the attachment member of the peeling member between the side surface and the engaging protrusion of the support member And a mounting recess to which the adhesive member is attached adjacent to the outer edge of the deformable portion.

また本発明によるワーク貼り合わせ機は、前記ワーク粘着チャック装置を、対向する一対の保持板のどちらか一方か又は両方に設け、前記ワーク粘着チャック装置で前記板状ワークを粘着保持するとともに剥離して、もう一つの板状ワークに重ね合わせることを特徴とする。   In the workpiece laminating machine according to the present invention, the workpiece adhesive chuck device is provided on one or both of a pair of opposing holding plates, and the plate-like workpiece is adhesively held by the workpiece adhesive chuck device and peeled off. And superimposing it on another plate-like workpiece.

前述した特徴を有する本発明によるワーク粘着チャック装置は、支持部材の側面と環状部材の係止凹部との間に、剥離部材の取付凸部を変形部の変形方向へ移動不能に挟み込むとともに、環状部材の取付面に、変形部の外縁と隣接して粘着部材を取り付けることにより、環状部材を介して剥離部材及び支持部材と粘着部材が一体的に組み付けられ、さらに変形部と粘着面が互いに隣り合って限りなく接近して配置されるため、離れて配置されるものよりも、粘着面に粘着保持された板状ワークを変形部の変形で剥離する際に、大きな剥離力が得られ、それにより剥離時において板状ワークに生ずる撓みが最小限に抑えられるので、粘着部材と剥離部材のユニット化を構成し易くしながら剥離性能を向上させることができる。
その結果、複数の加熱膨脹部と多数の粘着ゴムをそれぞれ個別に取り付けている従来のものに比べ、定盤などに対する設置作業と部品交換作業を容易に行うことができて、コストの低減化が図れる。
さらに、板状ワークの基板サイズの大型化に伴い多数のワーク粘着チャック装置を配置する場合であっても、それぞれの粘着動作と剥離動作を均一化することができ、一辺が2000ｍｍ以上に大型化された確実に粘着保持と剥離を行うことができる。
また、粘着ゴムとダイヤフラムが取り付け用のボルトを挟んで離れて配置される従来のものに比べ、板状ワークが薄くなっても、粘着面から確実に剥離することができる。 The workpiece adhesive chuck device according to the present invention having the above-described features is provided in such a manner that the mounting convex portion of the peeling member is immovably sandwiched between the side surface of the support member and the locking concave portion of the annular member in the deformation direction of the deformation portion. By attaching the adhesive member adjacent to the outer edge of the deformed portion to the mounting surface of the member, the peeling member, the support member, and the adhesive member are integrally assembled via the annular member, and the deformable portion and the adhesive surface are adjacent to each other. Since it is arranged as close as possible, a larger peeling force can be obtained when peeling a plate-like work held on the adhesive surface by deformation of the deformed part than that arranged far away. As a result, the bending that occurs in the plate-like workpiece at the time of peeling can be minimized, so that the peeling performance can be improved while making it easy to form a unit of the adhesive member and the peeling member.
As a result, the installation work and the parts replacement work on the surface plate etc. can be easily performed and the cost can be reduced compared to the conventional one in which a plurality of heating expansion parts and a large number of adhesive rubbers are individually attached. I can plan.
In addition, even when a large number of workpiece adhesive chuck devices are installed as the substrate size of plate-like workpieces increases, each adhesive operation and peeling operation can be made uniform, and each side is increased to 2000 mm or more. It is possible to reliably hold and peel the adhesive.
Moreover, even if the plate-like workpiece becomes thinner, the adhesive rubber and the diaphragm can be reliably peeled from the adhesive surface as compared to the conventional one in which the adhesive rubber and the diaphragm are arranged apart from each other with the mounting bolt interposed therebetween.

また、前述した特徴を有する本発明によるワーク貼り合わせ機は、一方の保持板に設けたワーク粘着チャック装置の粘着部材で粘着保持される第１の板状ワークと、他方の保持板に保持される第２の板状ワークとを互いに接近させ、ワーク粘着チャック装置の剥離部材で粘着部材から第１の板状ワークを剥離する場合に、剥離部材と粘着部材が互いに隣り合って限りなく接近して配置されるため、離れて配置されるものよりも、粘着面に粘着保持された板状ワークを変形部の変形で剥離する際に、大きな剥離力が得られ、それにより剥離時において板状ワークに生ずる撓みが最小限に抑えられるので、粘着保持された第１の板状ワークを第２の板状ワークと平行に剥離して貼り合わせることができる。
その結果、ダイヤフラムにより剥離時に発生した第１基板の撓み変形が貼り合わせ後にも残る従来のものに比べ、板状ワークの剥離時における部分的な精度不良に対する影響を少なくすることができ、板状ワーク同士の貼り合わせ精度が向上するとともに、生産性を高めることができる。 In addition, the workpiece laminating machine according to the present invention having the above-described characteristics is held by the first plate-like workpiece adhered and held by the adhesive member of the workpiece adhesive chuck device provided on one holding plate and the other holding plate. When the first plate-like workpiece is peeled from the adhesive member by the peeling member of the workpiece adhesive chuck device, the peeling member and the adhesive member are adjacent to each other as much as possible. Therefore, a larger peeling force can be obtained when peeling a plate-like workpiece that is held on the adhesive surface by deformation of the deformed part than a piece that is placed away from the plate. Since the bending generated in the workpiece is suppressed to the minimum, the first plate-like workpiece that is adhered and held can be peeled and bonded in parallel with the second plate-like workpiece.
As a result, it is possible to reduce the influence on the partial accuracy failure at the time of peeling of the plate-like workpiece as compared with the conventional one in which the bending deformation of the first substrate generated at the time of peeling by the diaphragm remains after the bonding. It is possible to improve the bonding accuracy between the workpieces and increase the productivity.

本発明の実施形態に係るワーク粘着チャック装置を示す説明図であり、（ａ）が縦断正面図、（ｂ）が底面図である。It is explanatory drawing which shows the workpiece adhesion chuck apparatus which concerns on embodiment of this invention, (a) is a vertical front view, (b) is a bottom view. 本発明の実施形態に係るワーク貼り合わせ機を示す縮小縦断正面図である。It is a reduction | restoration vertical front view which shows the workpiece bonding machine which concerns on embodiment of this invention.

以下、本発明の実施形態を図面に基づいて詳細に説明する。
本発明の実施形態に係るワーク粘着チャック装置Ａは、図１（ａ）（ｂ）に示すように、板状ワークＷと対向するように設けられて板状ワークＷを着脱自在に粘着保持する粘着部材１と、板状ワークＷと交差（直交）する方向へ変形して粘着部材１の粘着面１ａから板状ワークＷを強制的に剥離させるように設けられる剥離部材２と、剥離部材２の背後に設けられる支持部材３と、剥離部材２の外周を囲むように設けられる環状部材４を、主要な構成要素として備えている。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1A and 1B, the workpiece adhesive chuck device A according to the embodiment of the present invention is provided so as to face the plate-like workpiece W and detachably holds the plate-like workpiece W. The peeling member 2 provided to deform the adhesive member 1 in a direction intersecting (orthogonal) with the plate-like workpiece W to forcibly peel the plate-like workpiece W from the adhesive surface 1a of the adhesive member 1, and the peeling member 2 A supporting member 3 provided behind the annular member 4 and an annular member 4 provided so as to surround the outer periphery of the peeling member 2 are provided as main components.

粘着部材１は、板状ワークＷと対向する表面に粘着面１ａを有する粘着シートであり、少なくとも粘着面１ａ又は全体が、例えばフッ素ゴムやエラストマー、ブチルゴム、感光性樹脂、アクリル系やシリコン系などの粘着材料で、粘着面１ａが弾性のある面状に形成されている。
さらに、粘着面１ａには、例えばエンボス処理や凹溝などを形成して全体的に弾性変形し易くすることにより、板状ワークＷに対して容易に粘り付くように構成することが好ましい。 The pressure-sensitive adhesive member 1 is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive surface 1a on the surface facing the plate-like workpiece W, and at least the pressure-sensitive adhesive surface 1a or the whole is, for example, fluorine rubber, elastomer, butyl rubber, photosensitive resin, acrylic or silicon-based, etc. In this adhesive material, the adhesive surface 1a is formed into an elastic surface.
Furthermore, it is preferable that the adhesive surface 1a is configured to easily stick to the plate-like workpiece W by forming an embossing process, a concave groove, or the like to facilitate elastic deformation as a whole.

剥離部材２は、例えばゴムやエラストマー、軟質合成樹脂などの弾性変形可能な材料で、粘着部材１の粘着面１ａで粘着保持される板状ワークＷに対して接近又は離隔する方向へ変形可能に形成されるダイヤフラムや弾性膜などからなり、例えば圧縮成形（コンプレッション成型）や射出成形（インジェクション成型）などにより、後述する支持部材３の表面３ａ及び側面３ｂに沿った断面略コの字形に形成している。   The peeling member 2 is made of an elastically deformable material such as rubber, an elastomer, or a soft synthetic resin, and can be deformed in a direction in which the peeling member 2 approaches or separates from the plate-like workpiece W that is adhesively held by the adhesive surface 1a of the adhesive member 1. It is formed of a diaphragm or an elastic film to be formed, and is formed into a substantially U-shaped cross section along the surface 3a and side surface 3b of the support member 3 to be described later by, for example, compression molding (compression molding) or injection molding (injection molding). ing.

さらに詳しく説明すると、剥離部材２は、後述する支持部材３の表面３ａに沿って形成される変形部２ａと、変形部２ａと連続して厚さ方向へ延びるように形成される脚部２ｂと、脚部２ｂから外側へ向け突出するように形成されるフランジ状の取付凸部２ｃとを有する。
剥離部材２による粘着面１ａからの板状ワークＷの剥離動作についてその具体例を挙げると、剥離部材２の変形部２ａは、図１（ａ）の実線に示すように、支持部材３の表面３ａと接するように平面状又は凹状に収縮変形させることにより、粘着面１ａで粘着保持された板状ワークＷに剥離力を作用させずに待機している。剥離時には、図１（ａ）の二点鎖線に示すように、変形部２ａの一次側と二次側の圧力差で変形部２ａを支持部材３の表面３ａから離れる方向へ膨張変形させることにより、その先端が板状ワークＷに接触し押圧して粘着面１ａから板状ワークＷを強制的に剥離する。 More specifically, the peeling member 2 includes a deformed portion 2a formed along a surface 3a of the support member 3 described later, and a leg portion 2b formed so as to extend in the thickness direction continuously with the deformed portion 2a. And a flange-shaped mounting convex portion 2c formed so as to protrude outward from the leg portion 2b.
When the specific example is given about the peeling operation | movement of the plate-shaped workpiece | work W from the adhesion surface 1a by the peeling member 2, the deformation | transformation part 2a of the peeling member 2 is the surface of the support member 3 as shown to the continuous line of Fig.1 (a). By contracting and deforming into a flat shape or a concave shape so as to come into contact with 3a, the plate-like workpiece W adhered and held by the adhesive surface 1a is on standby without causing a peeling force to act. At the time of peeling, as shown by the two-dot chain line in FIG. 1 (a), the deformation portion 2a is expanded and deformed in a direction away from the surface 3a of the support member 3 due to the pressure difference between the primary side and the secondary side of the deformation portion 2a. The tip of the plate-shaped workpiece W comes into contact with and presses the plate-shaped workpiece W to forcibly separate the plate-shaped workpiece W from the adhesive surface 1a.

脚部２ｂは、変形部２ａの外周端から剥離部材２において変形部２ａと反対側（裏側）へ向け、後述する支持部材３の側面３ｂに沿って円筒状又は角筒状に一体形成される。
取付凸部２ｃは、脚部２ｂの裏側外面に後述する環状部材４の内面へ向けて環状に突設されている。取付凸部２ｃと反対側で後述する支持部材３の側面３ｂと対向する内面には、環状の係合溝２ｄを形成することが好ましい。 The leg portion 2b is integrally formed in a cylindrical shape or a rectangular tube shape along the side surface 3b of the support member 3 described later from the outer peripheral end of the deformable portion 2a toward the opposite side (back side) of the deformable portion 2a in the peeling member 2. .
The mounting convex part 2c is projected in an annular shape toward the inner surface of the annular member 4 to be described later on the rear side outer surface of the leg part 2b. An annular engagement groove 2d is preferably formed on the inner surface facing the side surface 3b of the support member 3 to be described later on the side opposite to the mounting convex portion 2c.

支持部材３は、例えば硬質合成樹脂、金属、セラミックなどの剥離部材２の変形部２ａと貼り付き難い材料で、後述する環状部材４の内周と嵌り合う例えば円形又は矩形などの板状に形成され、その中央には、剥離部材２の変形部２ａを弾性変形させる流体が通る通路３ｃを形成している。
さらに、互いに対向する剥離部材２の変形部２ａの裏面又は支持部材３の表面３ａのいずれか一方か、若しくは変形部２ａの裏面及び支持部材３の表面３ａの両方には、通路３ｃを中心として放射方向へ連通する拡散路５を形成することが好ましい。
また、支持部材３の側面３ｂには、剥離部材２の係合溝２ｄと嵌り合う環状の係合凸部３ｄを形成することが好ましい。 The support member 3 is made of a material that is difficult to stick to the deformed portion 2a of the peeling member 2 such as hard synthetic resin, metal, or ceramic, and is formed in a plate shape such as a circle or a rectangle that fits with the inner periphery of the annular member 4 described later. In the center, a passage 3c is formed through which a fluid that elastically deforms the deforming portion 2a of the peeling member 2 passes.
Furthermore, either the back surface of the deformable portion 2a of the peeling member 2 or the front surface 3a of the support member 3 facing each other, or both the back surface of the deformable portion 2a and the front surface 3a of the support member 3 are centered on the passage 3c. It is preferable to form the diffusion path 5 communicating in the radial direction.
Moreover, it is preferable to form an annular engagement convex portion 3 d that fits with the engagement groove 2 d of the peeling member 2 on the side surface 3 b of the support member 3.

環状部材４は、例えば金属、硬質合成樹脂、セラミックなどにより支持部材３の厚さと略同じ厚さの板状に形成され、その中央には、支持部材３よりも大きな貫通孔が開穿され、貫通孔の内面４ｉには、剥離部材２の取付凸部２ｃを挟んで支持部材３が嵌入される。
さらに、環状部材４は、支持部材３の側面３ｂとの間に剥離部材２の取付凸部２ｃを挟み込むように形成される係止凹部４ａと、変形部２ａの外縁と隣接して粘着部材１が取り付けられる取付面４ｂとを有している。
係止凹部４ａは、環状部材４の内面４ｉで裏側に剥離部材２の取付凸部２ｃと対向して凹設され、係止凹部４ａと取付凸部２ｃを当接させることにより、係止凹部４ａに対して取付凸部２ｃが変形部２ａの膨張変形方向へ移動不能に保持される。
取付面４ｂは、環状部材４の表側に変形部２ａの外縁と隣接して凹設され、粘着部材１の裏面を例えば接着剤などで固着することにより、粘着面１ａが変形部２ａの表面よりも若干突出するように配置されている。 The annular member 4 is formed in a plate shape having a thickness substantially the same as the thickness of the support member 3 by, for example, metal, hard synthetic resin, ceramic, etc., and a through hole larger than the support member 3 is opened at the center thereof. The support member 3 is fitted into the inner surface 4i of the through hole with the attachment convex portion 2c of the peeling member 2 interposed therebetween.
Further, the annular member 4 is adjacent to the locking recess 4a formed so as to sandwich the mounting protrusion 2c of the peeling member 2 between the side surface 3b of the support member 3 and the outer edge of the deformable portion 2a. Has a mounting surface 4b.
The locking recess 4a is recessed on the back side of the inner surface 4i of the annular member 4 so as to be opposed to the mounting projection 2c of the peeling member 2, and the locking recess 4a and the mounting projection 2c are brought into contact with each other. The mounting convex portion 2c is held so as not to move in the expansion deformation direction of the deformation portion 2a with respect to 4a.
The attachment surface 4b is recessed on the front side of the annular member 4 adjacent to the outer edge of the deformable portion 2a, and the adhesive surface 1a is attached to the surface of the deformable portion 2a by fixing the back surface of the adhesive member 1 with, for example, an adhesive. Is also arranged to protrude slightly.

そして、粘着部材１、剥離部材２、支持部材３及び環状部材４は、それらを順次組み付けることで一体化される。その具体例を説明する。
先ず、環状部材４の内面４ｉ及び係止凹部４ａと、剥離部材２の脚部２ｂ及び取付凸部２ｃとを、接着剤などにより固着して一体化するか、環状部材４の内面４ｉ及び係止凹部４ａに沿って、剥離部材２を圧縮成形や射出成形などの型形成により一体化する。
この際、環状部材４の内面４ｉ及び係止凹部４ａと剥離部材２の脚部２ｂ及び取付凸部２ｃとの接着強度を高めるために、環状部材４及び剥離部材２の対向面においてそのいずれか一方又は両方をサンドブラストなどで粗面に形成することが好ましい。
その後工程で、環状部材４と一体化された剥離部材２内に、支持部材３を嵌入して、その係合凸部３ｄが剥離部材２の係合溝２ｄと嵌合することにより、環状部材４及び剥離部材２に支持部材３が一体化される。
また、環状部材４の取付面４ｂには、粘着部材１の裏面を接着剤などにより固着して一体化され、ワーク粘着チャック装置Ａとなる。 And the adhesion member 1, the peeling member 2, the support member 3, and the annular member 4 are integrated by assembling them sequentially. A specific example will be described.
First, the inner surface 4i and the locking recess 4a of the annular member 4 and the leg 2b and the mounting projection 2c of the peeling member 2 are fixed and integrated with an adhesive or the like, or the inner surface 4i and the engagement of the annular member 4 are integrated. The peeling member 2 is integrated along the stopper recess 4a by mold formation such as compression molding or injection molding.
At this time, in order to increase the adhesive strength between the inner surface 4i and the locking concave portion 4a of the annular member 4 and the leg portion 2b and the mounting convex portion 2c of the peeling member 2, any one of them is provided on the opposing surface of the annular member 4 and the peeling member 2. One or both are preferably formed on a rough surface by sandblasting or the like.
In the subsequent process, the supporting member 3 is inserted into the peeling member 2 integrated with the annular member 4, and the engaging convex portion 3 d is engaged with the engaging groove 2 d of the peeling member 2. A support member 3 is integrated with 4 and the peeling member 2.
Further, the back surface of the pressure-sensitive adhesive member 1 is fixed to and integrated with the mounting surface 4b of the annular member 4 with an adhesive or the like to form a work pressure-sensitive adhesive chuck device A.

このように組み立てられたワーク粘着チャック装置Ａは、例えば定盤などからなる保持板１１に対し、粘着面１ａで粘着保持される板状ワークＷと対向するように分散して多数配置される。
図１（ａ）（ｂ）に示される例では、環状部材４の外周部分に開穿される取付孔４ｃに、例えばボルトなどの取付手段６を挿通して保持板１１に固着することにより、保持板１１に対し環状部材４が着脱自在に取り付けられている。
また、その他の例として図示しないが、保持板１１に対する環状部材４の取付手段６として、ボルトに代えて他の固着手段などを用いることも可能である。 A large number of workpiece adhesive chuck devices A assembled in this manner are arranged so as to be opposed to the plate-like workpiece W that is adhesively held on the adhesive surface 1a with respect to the holding plate 11 made of, for example, a surface plate.
In the example shown in FIGS. 1A and 1B, by attaching an attachment means 6 such as a bolt to the attachment hole 4c opened in the outer peripheral portion of the annular member 4 and fixing it to the holding plate 11, An annular member 4 is detachably attached to the holding plate 11.
Although not shown as another example, other fixing means or the like can be used as the attaching means 6 of the annular member 4 to the holding plate 11 in place of the bolts.

このような本発明の実施形態に係るワーク粘着チャック装置Ａによると、支持部材３の側面３ｂと環状部材４の係止凹部４ａとの間に、剥離部材２の取付凸部２ｃが変形部２ａの（膨張）変形方向へ移動不能に挟み込まれるとともに、環状部材４の取付面４ｂに、変形部２ａの外縁と隣接して粘着部材１が取り付けられる。
それにより、環状部材４を介して剥離部材２及び支持部材３と粘着部材１が一体的に組み付けられる。
ところで、変形部２ａと粘着面１ａの距離は、接近して配置した方が遠く離れて配置されるものに比べて、粘着面１ａに粘着保持された板状ワークＷを、変形部２ａの（膨張）変形で剥離する際に、大きな剥離力が得られる。それにより、剥離時において板状ワークＷに生ずる撓み（歪み）も、変形部２ａと粘着面１ａを接近して配置した方が、遠く離れて配置されるものに比べて、小さくすることができる。
この点に関し、本発明の実施形態に係るワーク粘着チャック装置Ａによると、変形部２ａと粘着面１ａが互いに隣り合って限りなく接近して配置されるため、剥離時において板状ワークＷに生ずる撓みを最小限に抑えることができる。
したがって、本発明の実施形態に係るワーク粘着チャック装置Ａは、粘着部材１と剥離部材２のユニット化を構成し易くしながら剥離性能を向上させることができる。
さらに、環状部材４の係止凹部４ａと剥離部材２の取付凸部２ｃとの当接部分を接着剤で固着しても、接着剤が弾性変形する変形部２ａまではみ出して付着するおそれがないので、変形部２ａの変形に伴う繰り返し応力によって接着剤が付着した箇所の端部から亀裂が生ずることがなく、繰り返し耐久性、信頼性が高いダイヤフラム構造を提供できる。 According to the workpiece adhesive chuck device A according to the embodiment of the present invention, the mounting convex portion 2c of the peeling member 2 is formed between the side surface 3b of the support member 3 and the locking concave portion 4a of the annular member 4 as the deformed portion 2a. The pressure-sensitive adhesive member 1 is attached to the attachment surface 4b of the annular member 4 adjacent to the outer edge of the deformation portion 2a.
Thereby, the peeling member 2, the support member 3, and the adhesive member 1 are assembled together via the annular member 4.
Incidentally, the distance between the deformable portion 2a and the adhesive surface 1a is such that the plate-like workpiece W held on and adhered to the adhesive surface 1a is compared with that of the deformable portion 2a as compared with the distance between the deformed portion 2a and the adhesive surface 1a. When peeling due to (expansion) deformation, a large peeling force is obtained. Thereby, the bending (strain) generated in the plate-like workpiece W at the time of peeling can be reduced when the deformed portion 2a and the adhesive surface 1a are arranged close to each other as compared with those arranged far away. .
In this regard, according to the workpiece adhesive chuck device A according to the embodiment of the present invention, the deformed portion 2a and the adhesive surface 1a are arranged as close as possible to each other, so that they occur in the plate-like workpiece W at the time of peeling. Deflection can be minimized.
Therefore, the workpiece adhesive chuck device A according to the embodiment of the present invention can improve the peeling performance while easily configuring the adhesive member 1 and the peeling member 2 as a unit.
Furthermore, even if the contact portion between the locking recess 4a of the annular member 4 and the mounting protrusion 2c of the peeling member 2 is fixed with an adhesive, there is no possibility that the adhesive protrudes and adheres to the deformed portion 2a where the adhesive is elastically deformed. Therefore, no crack is generated from the end of the portion where the adhesive is attached due to repeated stress accompanying deformation of the deformed portion 2a, and a diaphragm structure having high repeated durability and reliability can be provided.

特に、変形部２ａの裏面又は支持部材３の表面３ａのいずれか一方か、若しくは変形部２ａの裏面及び支持部材３の表面３ａの両方に、支持部材３の中央に形成される通路３ｃを中心として放射方向へ連通する拡散路５を形成した場合には、通路３ｃから流体を放射状の拡散路５に供給することにより、支持部材３の表面３ａに対し、変形部２ａの裏面がその中央部位から外周部位へ向かい順次（膨張）変形して、支持部材３の表面から変形部２ａの裏面全体が離隔される。
それにより、支持部材３から変形部２ａをそれらの材質と関係なく全面的に離して対称形状に（膨張）変形させることができる。
その結果、ダイヤフラムと支持部材の材質によってそれらの対向面同士が部分的又は全体的に貼り付くおそれがある従来のものに比べ、変形部２ａの（膨張）変形によって粘着部材１の粘着面１ａから板状ワークＷを垂直に押し剥がすことができる。それにより、剥離された板状ワークＷの姿勢を均一化できる。 In particular, either the back surface of the deformable portion 2a or the front surface 3a of the support member 3, or both the back surface of the deformable portion 2a and the front surface 3a of the support member 3 is centered on a passage 3c formed in the center of the support member 3. When the diffusion path 5 communicating in the radial direction is formed, the fluid is supplied from the passage 3c to the radial diffusion path 5 so that the back surface of the deformable portion 2a is the central portion of the surface 3a of the support member 3. From the surface of the support member 3 to the entire outer surface of the deformable portion 2a.
As a result, the deformable portion 2a can be separated from the support member 3 in a symmetrical shape (expanded) regardless of their material.
As a result, the opposing surfaces of the diaphragm and the support member may be partially or wholly adhered to each other, compared to the conventional one in which the deformed portion 2a is (expanded) from the adhesive surface 1a of the adhesive member 1 due to (expansion) deformation. The plate-like workpiece W can be pushed and peeled vertically. Thereby, the posture of the peeled plate workpiece W can be made uniform.

そして、本発明の実施形態に係るワーク貼り合わせ機は、図２に示すように、複数のワーク粘着チャック装置Ａを、対向する一対の保持板１１，１１′のどちらか一方か又は両方に分散配置し、ワーク粘着チャック装置Ａで板状ワークＷを粘着保持するとともに剥離することにより、もう一つの板状ワークＷ′に重ね合わせている。
その具体例として、一方（上方）の保持板１１には、ワーク粘着チャック装置Ａが設けられ、その粘着部材１で第１の板状ワークＷを粘着保持し、他方（下方）の保持板１１′には、シール材Ｃを介して第１の板状ワークＷと平行に対向するように第２の板状ワークＷ′が保持されている。
さらに必要に応じて、一対の保持板１１，１１′のどちらか一方か又は両方には、ワーク粘着チャック装置Ａを囲むように吸引吸着手段１２が複数設けられ、これら吸引吸着手段１２によって板状ワークＷ，Ｗ′を着脱自在に吸引吸着することも可能である。 As shown in FIG. 2, the workpiece laminating machine according to the embodiment of the present invention is configured such that a plurality of workpiece adhesive chuck devices A are provided with either one or both of a pair of holding plates 1 1 and 1 1 ′ facing each other. The plate-like workpiece W is adhered and held by the workpiece adhesive chuck device A, and peeled to overlap another plate-like workpiece W ′.
As a specific example, a workpiece adhesive chuck device A is provided on one (upper) holding plate 11, and the first plate-like workpiece W is adhered and held by the adhesive member 1, and the other (lower) holding plate 11 is provided. ′ Holds a second plate-like workpiece W ′ so as to face the first plate-like workpiece W in parallel with the sealing material C interposed therebetween.
Further, if necessary, one or both of the pair of holding plates 1 1 , 1 1 ′ is provided with a plurality of suction suction means 12 so as to surround the workpiece adhesive chuck device A. It is also possible to detachably suck and suck the plate-like workpieces W and W ′.

このような本発明の実施形態に係るワーク貼り合わせ機によると、ワーク粘着チャック装置Ａの剥離部材２と粘着部材１が互いに隣り合って限りなく接近して配置されるため、離れて配置されるものよりも、粘着面１ａに粘着保持された板状ワークＷを変形部２ａの変形で剥離する際に、大きな剥離力が得られ、それにより剥離時において板状ワークＷに生ずる撓みが最小限に抑えられる。
それにより、粘着保持された第１の板状ワークＷを第２の板状ワークＷ′と平行に剥離して貼り合わせることができる。その結果、板状ワークＷ，Ｗ′同士の貼り合わせ精度が向上するとともに、生産性を高めることができる。 According to such a workpiece laminating machine according to the embodiment of the present invention, the peeling member 2 and the adhesive member 1 of the workpiece adhesive chuck device A are arranged adjacent to each other as close as possible, and therefore are arranged apart from each other. When the plate-like workpiece W adhered and held on the adhesive surface 1a is peeled off by deformation of the deformable portion 2a, a large peeling force can be obtained, thereby minimizing the bending that occurs in the plate-like workpiece W at the time of peeling. Can be suppressed.
As a result, the first plate-like workpiece W held in an adhesive state can be peeled and bonded in parallel with the second plate-like workpiece W ′. As a result, the bonding accuracy between the plate-like workpieces W and W ′ is improved, and the productivity can be increased.

この実施例は、図１（ａ）（ｂ）及び図２に示すように、保持板１１の表面に形成される凹状部１１ａに対し、ワーク粘着チャック装置Ａの環状部材４が嵌入され、ボルトなどの取付手段６で保持板１１にワーク粘着チャック装置Ａを取り付け、保持板１１に開穿される通気孔１１ｂから圧縮空気などの流体を支持部材３の通路３ｃへ供給することにより、剥離部材２の変形部２ａが膨張変形して、粘着面１ａで粘着保持された板状ワークＷを強制的に押し剥がすものである。   In this embodiment, as shown in FIGS. 1A and 1B and FIG. 2, the annular member 4 of the workpiece adhesive chuck device A is inserted into the concave portion 11a formed on the surface of the holding plate 11, and the bolt By attaching the workpiece adhesive chuck device A to the holding plate 11 with the attaching means 6 such as, and supplying fluid such as compressed air to the passage 3c of the support member 3 from the vent hole 11b opened in the holding plate 11, the peeling member The second deformable portion 2a expands and deforms, and the plate-like workpiece W adhered and held by the adhesive surface 1a is forcibly pushed off.

通路３ｃの外側には、通路３ｃから環状部材４に繋がる流路を遮断する環状シール部２ｅが、支持部材３の外周を囲むように形成されている。
図示される例では、剥離部材２の取付凸部２ｃに環状シール部２ｅが、保持板１１の凹状部１１ａの内底面に向けて突出するように一体成形され、環状シール部２ｅの先端を凹状部１１ａの内底面に突き当てることにより、保持板１１の通気孔１１ｂから供給される流体が凹状部１１ａの内底面に沿って環状部材４へ向け流出することを防止している。
また、その他の例として図示しないが、支持部材３の裏面に通路３ｃを囲むように環状の凹溝を形成し、この凹溝に環状シール部２ｅとしてＯリングなどを保持板１１の凹状部１１ａの内底面に向け突出するように設けて、凹状部１１ａの内底面に突き当てることも可能である。 On the outside of the passage 3 c, an annular seal portion 2 e that blocks a flow path that connects the passage 3 c to the annular member 4 is formed so as to surround the outer periphery of the support member 3.
In the illustrated example, the annular seal portion 2e is integrally formed on the mounting convex portion 2c of the peeling member 2 so as to protrude toward the inner bottom surface of the concave portion 11a of the holding plate 11, and the tip of the annular seal portion 2e is concave. By abutting against the inner bottom surface of the portion 11a, the fluid supplied from the vent hole 11b of the holding plate 11 is prevented from flowing out toward the annular member 4 along the inner bottom surface of the concave portion 11a.
Although not illustrated as another example, an annular groove is formed on the back surface of the support member 3 so as to surround the passage 3c, and an O-ring or the like is formed in the groove as an annular seal portion 2e. It is also possible to provide it so as to protrude toward the inner bottom surface and to abut against the inner bottom surface of the concave portion 11a.

このような本発明の実施例に係るワーク粘着チャック装置Ａ及びワーク貼り合わせ機によると、真空又は真空に近い雰囲気において、粘着部材１の粘着面１ａに粘着保持された板状ワークＷを剥離させるために、支持部材３の通路３ｃを経て流体が剥離部材２の変形部２ａへ向けて供給される際に、環状シール部２ｅで通路３ｃから環状部材４へ向け流体が流出することを堰き止めるため、真空又は真空に近い雰囲気中に流体が流れ出ることがなく、高真空状態が保たれる。
それにより、剥離部材２を変形させる駆動流体が漏れ出すのを防止することができる。
その結果、真空中で例えば液晶ディスプレーなどを製造する際に、液晶デバイスの中に変形部２ａを変形させるための流体が混入することがなく、気泡などの問題が起こらないという利点がある。 According to the workpiece adhesive chuck device A and the workpiece bonding machine according to the embodiment of the present invention, the plate-like workpiece W adhered and held on the adhesive surface 1a of the adhesive member 1 is peeled in a vacuum or an atmosphere close to vacuum. Therefore, when the fluid is supplied to the deformed portion 2a of the peeling member 2 through the passage 3c of the support member 3, the annular seal portion 2e blocks the fluid from flowing out of the passage 3c toward the annular member 4. Therefore, a fluid does not flow out in a vacuum or an atmosphere close to vacuum, and a high vacuum state is maintained.
Thereby, it is possible to prevent the driving fluid that deforms the peeling member 2 from leaking out.
As a result, when a liquid crystal display or the like is manufactured in a vacuum, for example, there is an advantage that a fluid for deforming the deforming portion 2a is not mixed in the liquid crystal device and problems such as bubbles do not occur.

なお、図２に示される例では、一方（上方）の保持板１１だけに、ワーク粘着チャック装置Ａと吸引吸着手段１２を設けたが、これに限定されず、他方（下方）の保持板１１′にもワーク粘着チャック装置Ａや吸引吸着手段１２を設けても良い。   In the example shown in FIG. 2, the workpiece adhesive chuck device A and the suction suction means 12 are provided only on one (upper) holding plate 11. However, the present invention is not limited to this, and the other (lower) holding plate 11 is provided. 'May also be provided with a workpiece adhesive chuck device A and suction suction means 12.

Ａ ワーク粘着チャック装置 １ 粘着部材
１ａ 粘着面 ２ 剥離部材
２ａ 変形部 ２ｃ 取付凸部
３ 支持部材 ３ａ 表面
３ｂ 側面 ３ｃ 通路
４ 環状部材 ４ａ 係止凹部
４ｂ 取付面 ５ 拡散路
１１，１１′ 保持板 Ｗ，Ｗ′ 板状ワーク A Workpiece adhesive chuck device 1 Adhesive member 1a Adhesive surface 2 Peeling member 2a Deformed portion 2c Mounting convex portion 3 Support member 3a Surface 3b Side surface 3c Passage 4 Annular member 4a Locking concave portion 4b Mounting surface 5 Diffusion path 11, 11 'Holding plate W , W 'Plate work

Claims (4)

板状ワーク（Ｗ）と対向するように設けられて該板状ワーク（Ｗ）を着脱自在に粘着保持する粘着部材（１）と、
前記板状ワーク（Ｗ）と交差する方向へ変形して前記粘着部材（１）の粘着面（１ａ）から前記板状ワーク（Ｗ）を強制的に剥離させるように設けられる剥離部材（２）と、
前記剥離部材（２）の背後に設けられて前記剥離部材（２）に沿った表面（３ａ）及び側面（３ｂ）を有する支持部材（３）と、
前記支持部材（３）の前記側面（３ｂ）の外周を囲むように設けられる環状部材（４）とを備え、
前記剥離部材（２）は、前記支持部材（３）の前記表面（３ａ）に沿って変形可能に形成される変形部（２ａ）と、該変形部（２ａ）の外周から前記支持部材（３）の前記側面（３ｂ）に沿って厚さ方向へ延びるように形成される脚部（２ｂ）と、該脚部（２ｂ）から前記環状部材（４）に向け突出するように形成される取付凸部（２ｃ）と、前記支持部材（３）の前記側面（３ｂ）に形成した係合凸部（３ｄ）が嵌合する係合溝（２ｄ）とを有し、
前記環状部材（４）は、前記支持部材（３）の前記側面（３ｂ）及び前記係合凸部（３ｄ）との間に前記剥離部材（２）の前記取付凸部（２ｃ）を前記変形部（２ａ）の変形方向へ移動不能に挟み込む係止凹部（４ａ）と、前記変形部（２ａ）の外縁と隣接して前記粘着部材（１）が取り付けられる取付面（４ｂ）とを有することを特徴とするワーク粘着チャック装置。 An adhesive member (1) provided so as to face the plate-like workpiece (W) and detachably holding the plate-like workpiece (W);
A peeling member (2) provided to deform in a direction intersecting with the plate-like workpiece (W) to forcibly peel the plate-like workpiece (W) from the adhesive surface (1a) of the adhesive member (1 ). When,
Wherein the peeling member (2) surface along said separating member (2) is provided behind (3a) and side support member that have a (3b) (3),
An annular member (4) provided so as to surround the outer periphery of the side surface (3b) of the support member (3) ,
The release member (2), the said deformable part being deformable to form along the surface (3a) of the support member (3) and (2a), the support member from the outer periphery of the mutant form part (2a) (3 ) and the side surface of the (leg portion formed so as to extend in the thickness direction along the 3b) (2b), formed to counter only out collision before Symbol annular member (4) from the leg (2b) Mounting protrusions (2c), and engaging grooves (2d) into which engaging protrusions (3d) formed on the side surface (3b) of the support member (3) are fitted .
Said annular member (4), the deformed said attachment member of the separating member (2) to (2c) between said side surface (3b) and the engagement convex portion of the support member (3) (3d) A locking recess (4a) that is immovably sandwiched in the deformation direction of the portion (2a), and an attachment surface (4b) to which the adhesive member (1) is attached adjacent to the outer edge of the deformation portion (2a). Workpiece adhesive chuck device characterized by 前記支持部材の中央には、前記剥離部材の前記変形部を変形させる流体の通路が形成され、
前記変形部の裏面又は前記支持部材の表面のいずれか一方か、若しくは前記変形部の裏面及び前記支持部材の表面の両方には、前記通路を中心として放射方向へ連通する拡散路を形成したことを特徴とする請求項１記載のワーク粘着チャック装置。 A fluid passage for deforming the deforming portion of the peeling member is formed in the center of the support member,
A diffusion path communicating in the radial direction with the passage as a center is formed on either the back surface of the deformable portion or the front surface of the support member, or on both the back surface of the deformable portion and the front surface of the support member. The work adhesive chuck device according to claim 1. 前記通路の外側には、該通路から前記環状部材に繋がる流路を遮断する環状シール部が、前記支持部材の外周を囲むように形成されることを特徴とする請求項２記載のワーク粘着チャック装置。   3. The workpiece adhesive chuck according to claim 2, wherein an annular seal portion for blocking a flow path connecting from the passage to the annular member is formed outside the passage so as to surround an outer periphery of the support member. apparatus. 請求項１〜３のいずれか一つに記載のワーク粘着チャック装置を、対向する一対の保持板のどちらか一方か又は両方に設け、前記ワーク粘着チャック装置で前記板状ワークを粘着保持するとともに剥離して、もう一つの板状ワークに重ね合わせることを特徴とするワーク貼り合わせ機。   The workpiece adhesive chuck device according to any one of claims 1 to 3 is provided on either one or both of a pair of opposing holding plates, and the plate-like workpiece is adhesively held by the workpiece adhesive chuck device. A workpiece laminating machine that peels and superimposes on another plate-shaped workpiece.
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WO2014109018A1 (en) * 2013-01-09 2014-07-17 信越エンジニアリング株式会社 Workpiece adhesive chuck device and workpiece attachment machine
KR20150104191A (en) * 2013-01-09 2015-09-14 신에츠 엔지니어링 가부시키가이샤 Workpiece adhesive chuck device and workpiece attachment machine
JP2019501279A (en) * 2016-11-10 2019-01-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Holding device for holding substrate, carrier including holding device, processing system using carrier, and method for releasing substrate from holding device

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TW201308464A (en) 2013-02-16
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CN102649336A (en) 2012-08-29
KR101867098B1 (en) 2018-06-12

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