JP5442171B1 - Workpiece adhesive chuck device and workpiece bonding machine - Google Patents

Abstract

The plate-like workpiece that has been adhesively peeled in vacuum is easily and reliably peeled off from the peeling portion in an air atmosphere.
The peeling part 2 is elastically protruded and deformed in a vacuum atmosphere with respect to the plate-like work W held and adhered by the sticking part 1, and the pressing surface 2a is brought into contact with the surface W1 of the plate-like work W. The plate-like workpiece W is peeled from 1. Thereafter, the space around the plate-like workpiece W is released to the atmosphere while the pressing surface 2a of the peeling portion 2 is in contact with the surface W1 of the plate-like workpiece W, so that the outer space S2 of the peeling portion 2 passes through the flow path 2p. Air flows into the inner space S <b> 1 from the inside, and the space between the inner space S <b> 1 of the peeling portion 2 and the plate-like workpiece W is broken in vacuum.

Description

  In the manufacturing process of a flat panel display such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, the present invention can be applied to a glass substrate such as CF glass or TFT glass or PES ( Substrate assembly equipment including a substrate laminating machine that adheres and holds plate-like workpieces such as synthetic resin substrates made of plastic films such as poly-Ether-Sulphone), insulators such as substrates, conductive The present invention relates to a workpiece adhesion chuck device used in a substrate conveyance device that conveys a workpiece (workpiece) such as a body or a semiconductor wafer, and a workpiece bonding machine including the workpiece adhesion chuck device.

  Conventionally, as this kind of workpiece adhesive chuck device and workpiece bonding machine, a first chamber provided with a first surface plate on which a first substrate is seated, separated from the first chamber, the first chamber is provided. A second chamber provided with a second surface plate on which a second substrate to be bonded to the substrate is fixed, and the first substrate fixed on the first surface plate are fixed using adhesive force. There is a substrate bonding apparatus including a substrate chuck having an adhesive rubber and an adhesion releasing device that induces a force in a direction opposite to the adhesive force so that the first substrate is detached from the adhesive rubber. The detackifying device includes a heating expansion unit provided on the first surface plate and configured to be heated and expanded in the direction of the attachment surface of the first substrate to release the first substrate. The heating expansion portion includes an expansion member made of a ductile material that expands toward the attachment surface side of the first substrate attached to the adhesive rubber, and the adhesive rubber is formed in a central portion, and the heating rubber is formed around it. The thermal expansion portion is arranged in an annular shape. By expanding the heating expansion portion in a vacuum state, the first substrate is detached from the adhesive rubber and is bonded to the second substrate positioned below, and then the first chamber and the above The second chamber is separated and opened to the atmosphere, and the bonded first substrate and second substrate are unloaded (see, for example, Patent Document 1).

JP 2010-126342 A (page 6-9, FIG. 1-8)

By the way, in the manufacturing process of LCDs, etc., two substrates are bonded together in a vacuum atmosphere so that an encapsulant such as liquid crystal is sandwiched between them, and then the adhesive holding of one substrate is released, and then the surroundings are exposed to the atmosphere. When opened, if the two substrates are not completely bonded with the encapsulant sandwiched between them, one substrate released from the adhesive hold may be separated from the encapsulant, and gas such as air may enter the encapsulant from the gap There is.
Therefore, in order to solve such problems, it is possible to prevent air from being mixed into the encapsulant by releasing the atmosphere while pressing the two substrates without releasing the adhesive holding of the substrates bonded in a vacuum atmosphere. Conceivable.
However, in the above-described substrate chuck of Patent Document 1, when the annular expansion member is brought into close contact with the surface of the first substrate and pressed against the second substrate in a vacuum state, the surrounding environment is opened to the atmosphere. The space around the adhesive rubber surrounded by the annular expansion member is in a vacuum state. For this reason, the annular expansion member becomes a suction pad with respect to the surface of the first substrate, and after that, even if the annular expansion member expands in an air atmosphere, the first substrate cannot be peeled off. There is a problem.
As a result, when the annular expansion member is contracted and deformed in the reverse direction in the subsequent process, the first substrate bonded to the second substrate is suspended by the annular expansion member (suction pad). At this time, when the first substrate is a thin substrate having a thickness of 0.3 mm or less, the first substrate is distorted by its own weight due to the suspension, and the bonding accuracy with the second substrate is increased. There is a problem of lowering.
Further, since the expansion member is made of a ductile material, the pressing surface of the expansion member becomes familiar with the surface of the first substrate as the first substrate is repeatedly peeled off by elastic deformation of the expansion member over a long period of time. As a result, when the pressing surface of the expansion member is pressed against the surface of the first substrate, there is a problem that the van der Waals force (attractive force) seen microscopically may not adhere to the surface of the first substrate and peel off. There is also.
In the above-described substrate bonding apparatus disclosed in Patent Document 1, a large number of substrate chucks and adhesion release devices are arranged in a matrix form with respect to the first surface plate, and the first substrate is formed by the adhesive rubber of the large number of substrate chucks. Are simultaneously held, and the first substrate is peeled off simultaneously by the expansion of the annular expansion member in a number of debonding devices.
However, when the surrounding environment is opened to the atmosphere while keeping a large number of annular expansion members in close contact with the surface of the first substrate in a vacuum state, at least some of the annular expansion members of the multiple debonding devices The surrounding space of the adhesive rubber surrounded by is in a vacuum state, and the first substrate cannot be peeled off. Therefore, when the annular expansion member is contracted and deformed at the same time, the first substrate bonded to the second substrate is partially suspended by some annular expansion members (suction pads), and the first substrate There is a problem that partial distortion occurs in the first substrate and the bonding accuracy with the second substrate decreases.

  An object of the present invention is to deal with such a problem, and an object of the present invention is to easily and reliably peel a plate-like workpiece that has been peeled off in a vacuum from a peeling portion in an air atmosphere. Is.

  In order to achieve such an object, the present invention provides a workpiece adhesive chuck device in which a plate-shaped workpiece held in an adhesive state is peeled off in a vacuum atmosphere, and then the periphery of the plate-shaped workpiece is released to the atmosphere. An adhesive part that is provided so as to be opposed to the sheet-like work and detachably adheres and holds the plate-shaped work; An elastically deformable peeling portion that presses against the surface of the workpiece and forcibly peels it from the adhesive portion, and the peeling portion is located outside the peeling portion and an inner space in which the adhesive portion is disposed. A pressing surface that is formed so as to surround the outer periphery of the inner space between the outer space and the outer surface to be in contact with the surface of the plate-like workpiece when the atmosphere is released from a vacuum atmosphere; In contact with the surface of the workpiece And having a flow path for the vacuum breakage communicating the inner space and the outer space when the gas released to flow air into the interior space from the exterior space, the.

The workpiece adhesive chuck device according to the present invention having the above-described features is obtained by elastically projecting and deforming a peeling portion in a vacuum atmosphere with respect to a plate-like workpiece adhered and held by an adhesion portion, and pressing the surface of the plate-like workpiece. The plate-like workpiece is peeled from the adhesive portion by contacting with the plate, and then the periphery of the plate-like workpiece is released to the atmosphere while the pressing surface of the peeling portion is kept in contact with the surface of the plate-like workpiece, whereby the flow path Air flows into the inner space from the outer space of the peeling portion through, and a vacuum break occurs between the inner space of the peeling portion and the plate-like workpiece.
Therefore, it is possible to easily and reliably peel the plate-shaped workpiece that has been peeled off in a vacuum from the peeling portion in an air atmosphere.
As a result, when the annular expansion member is brought into close contact with the first substrate in a vacuum state, the surrounding space of the adhesive rubber surrounded by the annular expansion member becomes a vacuum state and cannot be peeled off. Compared to those, even if the pressing surface of the peeling part is contracted and deformed in the reverse direction in the subsequent process, the plate-shaped workpiece is not suspended, and even if the plate-shaped workpiece is a thin substrate, no distortion occurs, and the plate It is possible to perform normal adhesion holding and peeling without deforming the workpiece.

It is explanatory drawing which shows the workpiece adhesion chuck apparatus which concerns on embodiment of this invention, (a) is a vertical front view, (b) is a bottom view. It is a reduction | restoration vertical front view which shows the workpiece bonding machine which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 (a) and 1 (b), a workpiece adhesive chuck device A according to an embodiment of the present invention is composed of, for example, an LCD substrate or the like in an air atmosphere, a vacuum atmosphere, or an atmosphere reaching a predetermined degree of vacuum. The plate-shaped workpiece W is detachably adhered and held, and the plate-shaped workpiece W held for adhesion is forcibly separated in a vacuum atmosphere, and then the surroundings of the plate-shaped workpiece W are opened to the atmosphere (returned to the atmospheric atmosphere). is there.
More specifically, the workpiece adhesive chuck device A according to the embodiment of the present invention is provided so as to face the plate-like workpiece W, and the adhesive portion 1 for holding the plate-like workpiece W in a detachable manner. An elastically deformable peeling portion 2 provided so as to surround the outer periphery of 1 and a support portion 3 provided for attaching the adhesive portion 1 and the peeling portion 2 directly or indirectly are provided as main components. Yes.

The adhesive part 1 is an adhesive sheet that is formed in a sheet shape with an adhesive material such as fluorine rubber, elastomer, butyl rubber, photosensitive resin, acrylic or silicon, for example, and has an elastic surface. It has an adhesive surface 1a to be formed.
The pressure-sensitive adhesive surface 1a of the pressure-sensitive adhesive portion 1 is attached to the support portion 3 described later so as to face the plate-shaped workpiece W, and contacts the pressure-sensitive adhesive portion 1 and the surface W1 of the plate-shaped workpiece W moving toward the support portion 3. Thus, the plate-like workpiece W is configured to be detachably adhered and held.
Furthermore, the adhesive surface 1a is configured to be easily sticked to the plate-like workpiece W by being formed into an uneven shape by, for example, embossing or the like so as to be easily elastically deformed as in the illustrated example. It is preferable.

The peeling part 2 is an elastic sheet such as a diaphragm or an elastic film, the whole or part of which is formed into a sheet shape such as a circle or a rectangle with an elastically deformable elastic material such as rubber, elastomer, or soft synthetic resin. It has an elastically deformable pressing surface 2 a formed in an annular shape surrounding the outer periphery of the adhesive surface 1 a of the adhesive portion 1.
The pressing surface 2a of the peeling portion 2 is capable of elastically projecting and deforming in the Z direction that faces the plate-like workpiece W with respect to the support portion 3 described later and approaches or separates toward the surface W1 of the plate-like workpiece W. And is configured to elastically project and deform toward the plate-like workpiece W due to a pressure difference between the primary side and the secondary side on the pressing surface 2a.

The support portion 3 is a base plate formed in a plate shape such as a circle or a rectangle with a material that is difficult to stick to the pressing surface 2a of the peeling portion 2 such as a hard synthetic resin, metal, or ceramic, and is parallel to the plate-like workpiece W. Installed to face each other.
In the support part 3, the adhesive part 1 is attached to the opposite surface 3 a facing the plate-like workpiece W in the center so as not to move in the Z direction and the XY direction intersecting therewith. It arrange | positions so that it may protrude a little toward the plate-shaped workpiece | work W rather than 2a.
A plate-shaped workpiece W in which the peeling portion 2 is attached to the ring-shaped portion surrounding the outer periphery of the adhesive portion 1 on the opposing surface 3a of the support portion 3 so as to be immovable in the X and Y directions, and is adhesively held on the adhesive surface 1a of the adhesive portion 1. The pressing surface 2a is elastically protruded and deformed in the Z direction toward the surface so as to be pressed against the surface W1 and further pressed in the same direction.

As a specific example of the means for elastically projecting and deforming the pressing surface 2a of the peeling unit 2 in the Z direction, the driving unit 4 for supplying the driving fluid F to the primary side of the pressing surface 2a is further provided. By supplying the driving fluid F from 4 to the primary side of the pressing surface 2a, the pressing surface 2a is expanded and deformed so as to elastically project toward the plate-like work W held on the adhesive surface 1a of the adhesive portion 1. It is preferable to make it.
The driving unit 4 supplies a driving fluid F made of a gas or a liquid such as compressed air only in one direction, or a driving source (not shown) such as a pump for taking in and out in both directions, and a surface facing the support unit 3. A flow path 3b is formed behind the ring-shaped part, and the drive source communicates with the primary side of the pressing surface 2a via the flow path 3b.
By driving the driving unit 4, the driving fluid F is supplied toward the primary side of the pressing surface 2 a through the flow path 3 b, so that the driving fluid F is directed to the plate-like workpiece W adhered and held on the adhesive surface 1 a of the adhesive unit 1. The pressing surface 2a is inflated and deformed and brought into pressure contact with the surface W1 of the plate-like workpiece W, so that the plate-like workpiece W is forcibly pushed off from the adhesive surface 1a of the adhesive portion 1.
Although not shown as another example, as a means for elastically projecting and deforming the pressing surface 2a of the peeling portion 2 in the Z direction, instead of the driving portion 4 that supplies the driving fluid F, pressing with a cylinder or the like, It is also possible to elastically project and deform the pressing surface 2a in the Z direction with another driving source.

The peeling operation | movement of the plate-shaped workpiece W by the peeling part 2 is demonstrated based on Fig.1 (a).
In the initial state, as shown by the alternate long and short dash line in FIG. 1A, the pressing surface 2a of the peeling portion 2 is contracted and deformed into a flat shape or a concave shape so as to be in contact with the opposing surface 3a of the support portion 3. It waits, without making peeling force act on the plate-shaped workpiece | work W hold | maintained adhesively by 1a.
At the time of peeling, as shown by the two-dot chain line in FIG. 1A, the pressure surface 2a is separated from the surface 3a of the support portion 3 in the Z direction by a pressure difference between the primary side and the secondary side of the pressing surface 2a and the plate The pressing surface 2a comes into contact with and presses the surface W1 of the plate-like workpiece W by expanding and projecting so as to approach the plate-like workpiece W, and the plate-like workpiece W is forcibly separated from the adhesive surface 1a ( Push away).
In addition, after the plate-like workpiece W is peeled from the adhesive surface 1a, the pressing surface 2a of the peeling portion 2 is contracted in the reverse direction so as to be separated from the surface W1 of the plate-like workpiece W in the Z direction. , The initial state shown by the alternate long and short dash line in FIG.

And when the peeling surface 2 contacts and presses the surface W1 of the plate-shaped workpiece W, the peeling portion 2 has an inner space S1 of the peeling portion 2 in which the adhesive portion 1 is disposed and an outer space on the opposite side. A vacuum breaking flow path 2p for communicating with S2 is provided.
The vacuum breaking flow path 2p has a large number of gaps 2b formed so as to communicate with the inner space S1 and the outer space S2 by subjecting the pressing surface 2a of the peeling portion 2 to an uneven surface, and peeling. A plurality of pressing surfaces 2a of the portion 2 are intermittently provided in the circumferential direction centered on the adhesive portion 1, so that the inner space S1 and the outer space S2 are communicated between the pressing surfaces 2a adjacent in the circumferential direction. And a plurality of recessed grooves 2c.
In the example shown in FIGS. 1 (a) and 1 (b), as the flow path 2p, the pressing surface 2a of the peeling portion 2 is formed in an uneven shape by, for example, embossing, blasting (sand blasting), or other surface processing. In addition to the formation of a plurality of gaps 2b, the plurality of pressing surfaces 2a are provided intermittently in the circumferential direction centered on the adhesive portion 1, thereby providing a plurality of concave grooves 2c extending in the radial direction centered on the adhesive portion 1. Is formed.
Furthermore, the uneven shape of the pressing surface 2a by embossing or surface processing, the shape of the numerous gaps 2b, and the size and depth thereof are not limited to the illustrated examples, and various modifications are possible.
Although not shown as another example, as the flow path 2p, a plurality of gaps 2b formed by uneven surface processing on the pressing surface 2a or a plurality of gaps formed between the pressing surfaces 2a adjacent in the circumferential direction. It is also possible to provide only one of the concave grooves 2c.

According to the workpiece adhesion chuck device A according to the embodiment of the present invention, the plate-like workpiece W is adhered and held by the adhesion surface 1a of the adhesion portion 1 in the air atmosphere or the vacuum atmosphere. The peeled portion 2 is elastically expanded and protruded and deformed in a vacuum atmosphere with respect to the held plate-like workpiece W, and the pressing surface 2a is brought into contact with and brought into pressure contact with the surface W1 of the plate-like workpiece W.
Thereby, the plate-like workpiece W is peeled from the adhesive portion 1.
Thereafter, the periphery of the plate-like workpiece W is released to the atmosphere while the pressing surface 2a of the peeling portion 2 is kept in contact with the surface W1 of the plate-like workpiece W.
Thereby, air flows from the outer space S2 of the peeling part 2 into the inner space S1 through the flow path 2p, and the space between the inner space S1 of the peeling part 2 and the plate-like workpiece W is broken in vacuum.
Therefore, the plate-like workpiece W that has been peeled off from the pressure-sensitive adhesive portion 1 in a vacuum can be easily and reliably peeled off from the peeling portion 2 in the air atmosphere.
As a result, the plate-like workpiece W can be suspended even if the pressing surface 2a of the peeling portion 2 is contracted in the opposite direction so as to be separated from the surface W1 of the plate-like workpiece W in the Z direction in the subsequent process. Even if the plate-like workpiece W is a thin substrate having a thickness of 0.3 mm or less, for example, no distortion occurs, and the plate-like workpiece W can be normally held and peeled without distortion.

In particular, when the flow path 2p is a large number of gaps 2b formed so as to communicate with the inner space S1 and the outer space S2 by surface processing the pressing surface 2a of the peeling portion 2 into an uneven shape, By bringing the uneven pressing surface 2a into pressure contact with the surface W1 of the plate-like workpiece W along with the projecting deformation of the peeling portion 2, the outer space S2 passes through the numerous gaps 2b serving as the flow paths 2p, respectively, to the inner space S1. Air flows in, and a vacuum break occurs between the inner space S1 of the peeling portion 2 and the plate-like workpiece W.
Therefore, the plate-like workpiece W can be normally peeled from the peeling portion 2 in the air atmosphere with a simple structure.
As a result, manufacturing and maintenance are simple and cost reduction can be achieved.

Further, the flow path 2p intermittently provides a plurality of pressing surfaces 2a of the peeling portion 2 in the circumferential direction centering on the adhesive portion 1, so that the inner space S1 and the outer side between the pressing surfaces 2a adjacent to each other in the circumferential direction are provided. In the case of the plurality of concave grooves 2c formed so as to communicate with the space S2, the concave groove 2c that becomes the flow path 2p deeper than the pressing surface 2a of the peeling portion 2 can be formed, and the protruding deformation of the peeling portion 2 is achieved. Accordingly, the plurality of pressing surfaces 2a are simultaneously brought into pressure contact with the surface W1 of the plate-like workpiece W, so that air flows from the outer space S2 to the inner space S1 through the concave grooves 2c serving as the flow paths 2p, respectively, and the peeling portion The space between the two inner spaces S1 and the plate-like workpiece W is broken by vacuum.
Therefore, the plate-like workpiece W can be reliably peeled from the peeling portion 2 in the air atmosphere for a long period of time while having a simple structure.
As a result, manufacturing and maintenance are easy and cost reduction can be achieved, and stable peeling can be performed over a long period of time.
That is, if the first substrate is repeatedly peeled off over a long period of time due to the elastic deformation of the expansion member made of a ductile material, the pressing surface of the expansion member becomes familiar with the surface of the first substrate, and the fan as viewed in a microscopic manner. Compared to the conventional one in which the surface of the first substrate is brought into close contact with the surface of the first substrate by Delwars force and cannot be peeled off, the plate-like workpiece W is pushed and peeled off by elastic deformation of the peeling portion 2 made of an elastic body (ductile material). As it repeats over a long period of time, even if the pressing surface 2a of the peeling portion 2 is worn, it becomes possible to form the concave groove 2c that becomes the flow path 2p deeper than the pressing surface 2a of the peeling portion 2, so that the influence of van der Waals force , And can maintain the peeling over a long period of time, and is excellent in stability.

On the other hand, as shown in FIG. 2, the workpiece bonding machine according to the embodiment of the present invention includes a plurality of workpiece adhesive chuck devices A described above on either one or both of a pair of holding plates 11 and 11 ′ facing each other. Each plate workpiece (first plate workpiece) W is detachably adhered and held by a plurality of workpiece adhesion chuck devices A, and is separated by a plurality of workpiece adhesion chuck devices A, whereby another plate workpiece ( Second plate-like workpiece) W 'is overlapped and bonded.
As a specific example, the holding plates 11 and 11 ′ are formed smoothly, for example, by a surface plate, and the work adhesive holding device A is provided on one (upper) holding plate 11, and the first plate is provided by the adhesive member 1. A second plate-like workpiece W ′ is held on the other (lower) holding plate 11 ′ so as to face the first plate-like workpiece W in parallel with the sealing material C. Yes.
Further, if necessary, either one or both of the pair of holding plates 11 and 11 ′ are provided with a plurality of suction suction means 12 so as to surround the work adhesive holding device A, and the suction suction means 12 makes the first. Either or both of the plate-like workpiece W and the second plate-like workpiece W ′ can be detachably sucked and sucked.

Next, each embodiment of the present invention will be described with reference to the drawings.
In the first embodiment, as shown in FIGS. 1A and 1B, the workpiece adhesive chuck device A has an inner peripheral portion 2 d and an outer peripheral portion 2 e of the peeling portion 2 formed in an annular shape with respect to the support portion 3. Are respectively fixed so that the driving fluid F from the driving unit 4 is sealed.
More specifically, the peeling portion 2 is a diaphragm or an elastic film integrally formed in an annular shape by, for example, compression molding (compression molding) or injection molding (injection molding), and is formed along the surface 3 a of the support portion 3. And a flange-shaped inner peripheral portion 2d and an outer peripheral portion 2e formed so as to extend in the radial direction continuously from the inner side and the outer side of the pressing surface 2a.

In the example shown in FIGS. 1A and 1B, an attachment hole 3c is opened in the center of the support portion 3, and the base material 5 of the adhesive portion 1 is inserted into the attachment hole 3c from the surface 3a side in the Z direction. Thus, the inner peripheral portion 2d of the peeling portion 2 is sandwiched in the Z direction and fixed so as not to move.
The base material 5 of the adhesive portion 1 is formed in a columnar or prismatic shape, and the adhesive portion 1 is fixed to one end surface 5a thereof, and a fastening portion 5c such as a nut from the back of the support portion 3 to the other end portion 5b. Are fixed to the mounting hole 3c of the support portion 3 by fixing them by screwing.
Step portions 5d and 3c1 that engage with each other are formed on the outer surface of the base material 5 and the inner peripheral surface of the mounting hole 3c that faces the outer surface, and the inner peripheral portion 2d of the peeling portion 2 is provided between the step portions 5d and 3c1. Is sandwiched in the Z direction.
An annular recess 3d is formed on the outer periphery of the support portion 3 on the surface 3a side, and the ring 6 is attached to the annular recess 3d with a fastener 7 such as a screw or a bolt. The outer peripheral portion 2e of the peeling portion 2 is sandwiched in the Z direction.
It is preferable that annular thick portions 2d1 and 2e1 are integrally formed on the inner peripheral portion 2d and the outer peripheral portion 2e so as to prevent positional deviation when the holding portion 3 is clamped and fixed.
The surface 3a of the support portion 3 is formed in a convex shape by the step portion 3c1 of the mounting hole 3c and the annular recess 3d, and along the pressing surface 2a of the peeling portion 2, the inner peripheral portion 2d and the outer peripheral portion 2e, A pair of leg portions 2f are integrally formed.
And the base material 5, the peeling part 2, the support part 3, and the ring 6 of the adhesion part 1 are integrated by assembling them one by one, and it becomes the workpiece adhesion chuck apparatus A.
Although not shown in the drawings as other examples, the inner peripheral part 2d and the outer peripheral part 2e of the peeling part 2 are clamped and fixed to the support part 3 without using the base material 5 and the ring 6, or the support part 3 and the peeling part It is also possible to change the shape of the part 2 to a shape other than the illustrated example.

According to the workpiece adhesive chuck device A according to the first embodiment of the present invention, the driving unit 4 is configured such that the inner peripheral part 2d and the outer peripheral part 2e of the annular peeling part 2 are sandwiched and fixed to the support part 3, respectively. Since the driving fluid F supplied to the primary side of the pressing surface 2a is sealed by the pressing surface 2a, the pressing surface 2a is directed to the surface W1 of the plate-like workpiece W without leakage of the driving fluid F. It bulges and deforms toward the secondary side.
Therefore, the pressing surface 2a can be driven stably over a long period of time while preventing the driving fluid F from leaking with a simple structure.
As a result, there are advantages that manufacturing and maintenance are simple and cost can be reduced, and that the plate-like workpiece W can be stably peeled over a long period of time.

As shown in FIGS. 1 (a) and 1 (b), as the flow path 2p, a large number of gaps 2b formed by uneven surface processing on the pressing surface 2a and the pressing surface 2a adjacent in the circumferential direction are provided. In the case of providing both of the plurality of concave grooves 2c formed in the plurality of gaps 2b, even if the number of gaps 2b alone is not sufficient, even if the amount of air passing from the outer space S2 to the inner space S1 of the peeling portion 2 is insufficient. Since air is supplied from the outer space S2 to the inner space S1 through the concave groove 2c, the space between the inner space S1 of the peeling portion 2 and the plate-like workpiece W is broken in vacuum.
Thereby, there exists an advantage that the plate-shaped workpiece | work W peeled off from the adhesion part 1 in the vacuum can be peeled from the peeling part 2 quickly and reliably in an atmospheric condition.
Furthermore, even if a large number of gaps 2b surface-processed on the pressing surface 2a as the flow path 2p are worn by contact peeling with the plate-like workpiece W over a long period of time, the recessed grooves 2c provided at a position deeper than the gap 2b are Since it remains, there is also an advantage that stable peeling can be performed over a longer period.

  In the second embodiment, as shown in FIG. 2, a plurality of work adhesive chuck devices A provided on one holding plate 11 in an air atmosphere, a vacuum atmosphere, or an atmosphere reaching a predetermined degree of vacuum. At the same time, the plate-like workpiece (first plate-like workpiece) W is adhered and held by the adhesive portion 1 and bonded to another plate-like workpiece (second plate-like workpiece) W ′ held on the other holding plate 11 ′. Thereafter, in the vacuum atmosphere, after the first plate-like workpiece W and the second plate-like workpiece W ′ are peeled at the same time by the peeling portions 2 of the workpiece adhesive chuck device A provided on one holding plate 11. The surroundings of the first plate-like workpiece W and the second plate-like workpiece W ′ are opened to the atmosphere (returned to the atmosphere).

In the example shown in FIG. 2, the support portion 3 of the workpiece adhesive chuck device A is inserted into the plurality of concave portions 11 a formed on the surface of the holding plate 11, and the holding plate 11 is fastened with a fastener 7 such as a screw or a bolt. By attaching and fixing the workpiece adhesive chuck device A and supplying the driving fluid F to the flow path 3b of the support portion 3 from the air holes 11b opened in the holding plate 11, the pressing surface 2a of the peeling portion 2 expands. The first plate-like workpiece W that has been deformed and held by the adhesive surface 1a is forcibly pushed off.
Although not shown in the drawings as another example, as a means for attaching the support portion 3 to the holding plate 11, other fixing means or the like can be used instead of the fastener 7 such as a screw or a bolt.

According to such a workpiece laminating machine according to the second embodiment of the present invention, the plate-like workpiece (first plate-like workpiece) W is adhered and held at the same time by the adhesion portions 1 of the plurality of workpiece adhesion chuck devices A. After being bonded to the plate-like workpiece (second plate-like workpiece) W ′, the peeling portions 2 of the plurality of workpiece adhesive chuck devices A are projected and deformed at the same time in a vacuum atmosphere, and the pressing surface 2 a is changed to the first plate-like workpiece W. The plate-like workpiece W is peeled from the adhesive portion 1 by being brought into pressure contact with each of the surfaces W1. Thereafter, the periphery of the first plate-like workpiece W and the second plate-like workpiece W ′ is opened to the atmosphere while the pressing surface 2a of the peeling portion 2 is kept in contact with the surface W1 of the plate-like workpiece W. Air flows into the inner space S1 from the outer space S2 through 2p, and the space between the inner space S1 of the peeling portion 2 and the first plate-like workpiece W is broken in vacuum.
Therefore, the bonded plate-like workpiece (first plate-like workpiece) W and another plate-like workpiece (second plate-like workpiece) W ′ can be easily and reliably removed from the peeling portion 2 in the air atmosphere while being kept in a parallel state. Can be peeled off.
As a result, when a large number of the annular expansion members are kept in close contact with the surface of the first substrate in a vacuum state and the surrounding environment is opened to the atmosphere, the adhesive rubber surrounded by at least some of the annular expansion members is removed. Even if the surrounding space is in a vacuum state and the first substrate cannot be peeled and the pressing surface 2a of the peeling portion 2 is simultaneously contracted and immersively deformed in the subsequent process, the first plate-like workpiece W Is not partially suspended, and partial distortion of the first plate-like workpiece W is prevented.
Thereby, the bonding accuracy between the first plate-like workpiece W and the second plate-like workpiece W ′ can be maintained high, and there is an advantage that the yield and productivity can be improved.

  In the example shown in FIG. 2, the workpiece adhesive chuck device A and the suction suction means 12 are provided only on one (upper) holding plate 11. However, the present invention is not limited to this, and the other (lower) holding plate 11 is provided. 'May also be provided with a workpiece adhesive chuck device A and suction suction means 12.

A Workpiece adhesive chuck device 1 Adhesive part 1a Adhesive surface 2 Peeling part 2a Pressing surface 2b Gap 2c Concave groove 2d Inner peripheral part 2e Outer peripheral part 2p Flow path 3 Support part 4 Drive part 11 One holding plate 11 'The other holding plate F Drive fluid S1 Inner space S2 Outer space W Plate workpiece (first plate workpiece)
W1 Surface W 'Another plate workpiece (second plate workpiece)

Claims (5)

A workpiece adhesion chuck device in which a plate-shaped workpiece held in an adhesive state is peeled off in a vacuum atmosphere, and then the periphery of the plate-shaped workpiece is released to the atmosphere.
An adhesive portion provided so as to be opposed to the plate-like workpiece and holding the plate-like workpiece in an attachable and detachable manner;
An elastically deformable peeling portion that is provided so as to surround the outer periphery of the adhesive portion, and is forced to peel from the adhesive portion by being pressed against the surface of the plate-like workpiece in accordance with the projecting deformation toward the plate-like workpiece; Prepared,
The peeling portion is formed so as to surround the outer periphery of the inner space between the inner space where the adhesive portion is arranged and the outer space arranged outside the peeling portion, and is released from the vacuum atmosphere to the atmosphere. A pressing surface that contacts the surface of the plate-like workpiece over time;
A vacuum breaking flow path that communicates the inner space and the outer space and allows air to flow from the outer space to the inner space when the pressing surface is in contact with the surface of the plate-like workpiece and released to the atmosphere. A workpiece adhesive chuck device characterized by that.   The flow path is a large number of gaps formed so as to communicate with the inner space and the outer space by subjecting the pressing surface of the peeling portion to an uneven surface. The work adhesive chuck device according to 1.   The flow path intermittently provides a plurality of pressing surfaces of the peeling portion in the circumferential direction centered on the adhesive portion, so that the inner space and the outer space are disposed between the pressing surfaces adjacent to each other in the circumferential direction. The work adhesive chuck device according to claim 1, wherein the work adhesive chuck device is a plurality of concave grooves formed so as to communicate with each other. A support portion to which the adhesive portion and the peeling portion are attached; and a drive portion that supplies a drive fluid to the primary side of the pressing surface;
The inner peripheral part and the outer peripheral part of the peeling part formed in an annular shape are sandwiched and fixed to the support part so that the driving fluid from the driving part is sealed by the pressing surface. The workpiece adhesive chuck device according to claim 1, 2, or 3. The workpiece adhesive chuck device according to any one of claims 1 to 4, is a workpiece laminating machine provided in plural on either one or both of a pair of opposing holding plates,
The plate-like workpiece is simultaneously adhered and held by the adhesive portion of the workpiece adhesive chuck device provided on the one holding plate, and bonded to another plate-like workpiece held on the other holding plate, and a vacuum atmosphere In the above, the peeling part of the workpiece adhesive chuck device provided on the one holding plate, at the same time, the plate-like workpiece and the other plate-like workpiece that are bonded together are peeled off at the same time, A workpiece laminating machine that opens the air around another plate-shaped workpiece.

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