KR101944155B1 - Workpiece adhesive chuck device and workpiece attachment machine - Google Patents

Workpiece adhesive chuck device and workpiece attachment machine Download PDF

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KR101944155B1
KR101944155B1 KR1020157021342A KR20157021342A KR101944155B1 KR 101944155 B1 KR101944155 B1 KR 101944155B1 KR 1020157021342 A KR1020157021342 A KR 1020157021342A KR 20157021342 A KR20157021342 A KR 20157021342A KR 101944155 B1 KR101944155 B1 KR 101944155B1
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plate
workpiece
peeling
work
adhesive
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KR1020157021342A
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KR20150104191A (en
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요시카즈 오오타니
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신에츠 엔지니어링 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

The plate-like workpiece adhered and peeled off in a vacuum is easily and reliably peeled off from the peeling section in the atmosphere.
The peeling section 2 is resiliently deformed in a vacuum atmosphere with respect to the plate-like workpiece W adhered and held by the adhesive section 1 so that the pressing surface 2a is pressed against the surface W1 of the plate- , The plate-like workpiece W is peeled off from the adhesive portion 1. The plate- Thereafter, the periphery of the plate-shaped work W is opened to the atmosphere while the pressure surface 2a of the peeling section 2 is in contact with the surface W1 of the plate-like work W, Air flows into the inner space S1 from the outer space S2 of the peeling section 2 and the inner space S1 of the peeling section 2 and the plate work W are vacuum fractured.

Figure 112015076403516-pct00001

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a workpiece sticking apparatus and a workpiece attaching apparatus,

The present invention relates to a method of manufacturing a flat panel display such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, And a substrate adherer for adhering and adhering a plate-like work such as a synthetic resin raised plate made of a plastic film such as poly-ether-sulphone or the like, To a workpiece chucking apparatus used for a substrate transporting apparatus or the like for transporting a work (workpiece) such as a semiconductor wafer, and a workpiece attaching apparatus having the workpiece chucking apparatus.

2. Description of the Related Art Conventionally, as a work sticking apparatus and a work attaching apparatus of this kind, there are a first chamber having a first platen on which a first substrate is placed, a second chamber spaced apart from the first chamber, A substrate chuck having an adhesive rubber for fixing the first substrate to be adhered to the first surface plate with adhesive force, and a second substrate having a second substrate on which the first substrate is adhered, There is a substrate adhering apparatus including an adherence releasing device for inducing a force in a direction opposite to the adhering force. The adhe- sion releasing device is constituted by a heat expanding portion provided on the first platen and heating and expanding in the direction of the attachment surface of the first substrate to disengage the first substrate. Wherein the heating and expanding portion includes an expansion member made of a ductile material which is attached to the adhesive rubber and expands to the attachment surface side of the first substrate, the adhesive rubber is formed at the central portion, So that it is positioned in an annular shape. The first substrate is detached from the adhesive rubber by being inflated in a vacuum state so as to be adhered to the second substrate located below and then separated from the first chamber and the second chamber, And the first substrate and the second substrate are bonded together (see, for example, Patent Document 1).

Patent Document 1: JP-A-2010-126342 (page 6-9, Fig. 1-8)

However, in the manufacturing process of an LCD or the like, two substrates are bonded together in a vacuum atmosphere so that an encapsulating material such as liquid crystal is sandwiched therebetween. Thereafter, the adhesive holding of one of the substrates is released, The reason why the two substrates are not completely bonded with the sealing material interposed therebetween is that there is a fear that one of the substrates from which the adhesive holding is released is separated from the sealing material and gas such as air is mixed into the sealing material from the gap .

Therefore, in order to solve such a problem, it is conceivable to prevent the introduction of air into the sealing material by releasing the atmosphere to the atmosphere while depressing the two substrates without releasing the adhesion of the substrate bonded in a vacuum atmosphere.

However, in the substrate chuck of Patent Document 1 described above, when the annular expanding member is brought into close contact with the surface of the first substrate in a vacuum state and is pressed toward the second substrate and the ambient environment is opened to the atmosphere, The surrounding space becomes a vacuum state. As a result, there is a fatal problem that the annular expanding member becomes like the adsorption pad with respect to the surface of the first substrate, and thereafter the first substrate can not be peeled off even if the annular expanding member expands in the atmosphere.

As a result, when the annular expanding member is shrunk and deformed in the reverse direction in the subsequent process, the first substrate bonded to the second substrate is suspended by the annular expanding member (the adsorption pad). At this time, when the first substrate is a thin substrate having a thickness of 0.3 mm or less, distortion occurs in the first substrate due to the self weight due to the hanging, and the accuracy with which the second substrate is bonded with the second substrate is lowered.

Further, since the expansion member is made of a soft material, the pressing surface of the expansion member is fused to the surface of the first substrate while repeating the peeling of the first substrate by the elastic deformation of the expansion member for a long period of time, There is a problem in that when the pressing surface of the member is pressed against the surface of the first substrate, it can not be peeled off in close contact with the surface of the first substrate due to the van der Waals force (attracting force) in terms of micrometers.

In the substrate laminating apparatus of Patent Document 1 described above, a plurality of substrate chucks and an adherend releasing device are arranged in a matrix form with respect to the first plate, the first substrate is adhered and held simultaneously by the adhesive rubbers of the plurality of substrate chucks, The first substrate is simultaneously peeled off by the expansion of the annular expanding member in a plurality of adhe- sion releasing devices.

However, when a plurality of annular expanding members are kept in close contact with the surface of the first substrate in a vacuum state, and the surrounding environment is opened to the atmosphere, among the many adhe- sion releasing devices, The first substrate can not be peeled off. As a result, the annular expanding member is contracted and deformed at the same time, so that the first substrate bonded to the second substrate is partially suspended by several annular expanding members (adsorption pads), so that partial distortion occurs in the first substrate, There is a problem that the precision with which the substrate is bonded is lowered.

It is an object of the present invention to overcome such a problem, and to provide an easy and reliable separation of a plate-like workpiece adhered and peeled off from a vacuum in an atmospheric environment.

In order to achieve the above object, the present invention provides a workpiece-sticking chuck apparatus in which a plate-like workpiece adhered and held is peeled off in a vacuum atmosphere, and then the periphery of the plate- Like workpiece in a state of being pressed against the surface of the plate-like workpiece in accordance with protruding deformation directed to the plate-like workpiece so as to surround the outer periphery of the adhesive- Wherein the peeling section is formed so as to surround the outer periphery of the inner space between an inner space in which the adhesive section is disposed and an outer space disposed outside the peeling section, Like workpiece from the vacuum atmosphere to the surface of the plate-like workpiece And a vacuum evacuation flow path for allowing air to flow from the outer space to the inner space while communicating with the inner space and the outer space at the time of atmospheric release in which the pressure surface is in contact with the surface of the plate- .

The workpiece-sticking chucking apparatus according to the present invention having the above-described features resiliently deforms the peeling section in a vacuum atmosphere to bring the pressing surface into contact with the surface of the plate-like workpiece, Like workpiece is peeled off from the adhesive portion and then the periphery of the plate-like workpiece is opened to the atmosphere while the pressing surface of the peeling portion is in contact with the surface of the plate-like workpiece, thereby passing from the outer space of the peeling portion to the inner space Air is blown in between the inner space of the peeling section and the plate-like work.

Thus, the plate-like workpiece adhered and peeled off in vacuum can be easily and reliably peeled off from the peeling section in the atmosphere.

As a result, if the annular expanding member is kept in close contact with the first substrate in the vacuum state, the surrounding space of the adhesive rubber surrounded by the annular expanding member becomes in a vacuum state, Even if the plate-like workpiece is a thin substrate, distortion does not occur even when the pressing surface of the negative pressure surface is shrunk and deformed in the reverse direction, and the normal pressure-sensitive adhesive holding and peeling can be performed without distorting the plate-like workpiece.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view showing a workpiece-sticking chucking apparatus according to an embodiment of the present invention, wherein (a) is a longitudinal end elevation view and (b) is a bottom view.
Fig. 2 is a reduced longitudinal end elevational view showing a work piece assembly according to an embodiment of the present invention. Fig.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

As shown in Figs. 1 (a) and 1 (b), the workpiece-sticking chucking apparatus A according to the embodiment of the present invention is a workpiece-sticking chucking apparatus A in which, in an atmospheric or vacuum atmosphere or in an atmosphere reaching a predetermined degree of vacuum, Like workpiece W made of a substrate or the like is detachably adhered and held, and the plate-like workpiece W is forcedly peeled off in a vacuum atmosphere, and then the periphery of the plate-like workpiece W is released to the atmosphere (Returning to the atmosphere).

More specifically, the workpiece-sticking chucking apparatus A according to the embodiment of the present invention includes an adhesive portion 1 provided to face the plate-like workpiece W and detachably holding the plate-like workpiece W in a detachable manner, A releasable portion 2 which is provided so as to surround the outer periphery of the adhesive portion 1 and a support portion 3 which is provided for directly or indirectly mounting the adhesive portion 1 and the peeling portion 2, As a component.

The adhesive portion 1 is a pressure sensitive adhesive sheet which is formed in a sheet form by an adhesive material such as fluorine rubber, elastomer, butyl rubber, photosensitive resin, acrylic or silicone adhesive, or the like, As shown in Fig.

The adhesive surface 1a of the adhesive section 1 is mounted so as to oppose the plate-like workpiece W with respect to the support section 3 to be described later and attached to the plate-like workpiece W moving toward the adhesive section 1 and the support section 3. [ Like workpiece W is brought into contact with the surface W1 of the work W so that the plate-like workpiece W is detachably adhered and held.

The adhesive surface 1a is preferably formed so as to be easily adhered to the plate-shaped workpiece W by being formed into a concave-convex shape by, for example, embossing or the like as shown in the drawing and being elastically deformed as a whole Do.

The peeling section 2 is an elastic sheet such as a diaphragm or an elastic film formed in a sheet shape such as a circular shape or a rectangle by an elastic material which is elastically deformable such as rubber, elastomer or soft synthetic resin, And has an annularly formed elastically deformable pressing surface 2a surrounding the outer periphery of the adhesive surface 1a of the adhesive portion 1. [

The pressing surface 2a of the peeling section 2 is opposed to the plate-like workpiece W with respect to the support section 3 to be described later, And is resiliently deformed toward the plate-shaped work W by a pressure difference between the primary side and the secondary side of the pressing surface 2a.

The supporting portion 3 is a base plate formed in a plate shape such as a circular or rectangular shape with a material difficult to be attached to the pressing surface 2a of the peeling portion 2 such as a hard synthetic resin, metal, ceramic or the like, So as to be opposed to the shape work W in parallel.

The adhesive portion 1 is mounted on the opposing face 3a facing the plate-like work W in the support portion 3 in such a manner that it can not move in the Z direction and the X and Y directions intersecting with the plate face workpiece W, Like workpiece W is slightly projected from the pressing surface 2a of the peeling section 2 toward the plate-shaped workpiece W.

The peeling section 2 is mounted so as not to move in the XY direction on the ring-shaped part surrounding the outer periphery of the adhesive section 1 on the opposing face 3a of the support section 3, The pressing surface 2a is elastically protruded and deformed in the Z direction toward the plate-like workpiece W adhered and held on the workpiece 1a so that the pressing surface 2a is pressed against the surface W1 and pressed further in the same direction have.

As a concrete example of means for resiliently deforming the pressing surface 2a of the peeling portion 2 in the Z direction is a driving portion 4 for supplying the driving fluid F to the primary side of the pressing surface 2a Like workpiece W adhered and held on the adhered surface 1a of the adhered portion 1 by supplying the driving fluid F from the driving portion 4 to the primary side of the pressing surface 2a, It is preferable to expand and deform the pressing surface 2a so as to resiliently protrude.

The driving unit 4 includes a driving source (not shown) such as a pump for supplying the driving fluid F made of a gas or liquid such as compressed air only in one direction or in a bidirectional manner, And the drive source communicates with the primary side of the pressing surface 2a via the flow path 3b.

The driving fluid F passes through the flow path 3b and is supplied toward the primary side of the pressing surface 2a by the operation of the driving unit 4 to thereby adhere to the pressing surface 1a of the adhesive unit 1 The pressing surface 2a is expanded and deformed toward the plate-like workpiece W and pressed against the surface W1 of the plate-like workpiece W so that the plate-like workpiece W ) Are forced to peel off.

As a means for elastically projecting and deforming the pressing surface 2a of the peeling portion 2 in the Z direction instead of the driving portion 4 for supplying the driving fluid F It is also possible to resiliently deform the pressing surface 2a in the Z direction by another driving source such as pressing by a cylinder or the like.

The peeling operation of the plate-shaped workpiece W by the peeling section 2 will be described with reference to Fig.

In the initial state, as shown by the alternate long and short dash line in Fig. 1 (a), the pressing surface 2a of the peeling portion 2 is in contact with the opposed surface 3a of the supporting portion 3, And stands by without exerting a peeling force on the plate-shaped workpiece W adhered and held by the adhesive surface 1a.

The pressing surface 2a is pressed against the surface 3a of the supporting portion 3 in the Z direction by the pressure difference between the primary side and the secondary side of the pressing surface 2a as shown by the two- Like workpiece W so that the pressing surface 2a comes into contact with and presses against the surface W1 of the plate-like workpiece W, The shape work W is forcibly peeled off (peeled off).

After the plate-shaped workpiece W is peeled from the adhesive surface 1a, the pressing surface 2a of the peeling section 2 is moved so as to be separated from the surface W1 of the plate-shaped workpiece W in the Z direction Shrinking in the opposite direction to perform immersion deformation, thereby returning to the initial state represented by the one-dot chain line in Fig. 1 (a).

When the pressing surface 2a of the peeling section 2 comes into contact with the surface W1 of the plate-like work W and is in pressure contact with the peeling section 2, (2p) for communicating the outer space (S2) on the opposite side with the inner space (S1) for vacuum breaking.

The vacuum evacuating flow path 2p is formed by machining the pressing surface 2a of the peeling portion 2 in a concavo-convex shape to form a plurality of gaps (not shown) formed so as to communicate with the inner space S1 and the outer space S2 And the pressing surface 2a of the peeling portion 2 are intermittently arranged in the circumferential direction in which the adhesive portion 1 is the center of each of the pressing surfaces 2a and 2b, A plurality of concave grooves 2c formed so as to communicate the outer space S2 and the outer space S2, and the like.

In the example shown in Figs. 1 (a) and 1 (b), as the flow path 2p, the pressing surface 2a of the peeling portion 2 is subjected to, for example, embossing or blasting (sand blasting) A plurality of gaps 2b are formed and the plurality of pressing surfaces 2a are intermittently provided in the circumferential direction in which the adhesive portion 1 is the center, A plurality of concave grooves 2c extending in the radial direction are formed.

The shape of the irregularities of the pressing surface 2a by embossing or surface processing, the shape of the plurality of gaps 2b, and the sizes and depths thereof are not limited to those shown in the drawings, but can be variously modified.

As another example of the flow path 2p, a plurality of gaps 2b formed by machining the surface of the pressing surface 2a in a concavo-convex shape, or a plurality of gaps 2b formed in the pressing surface 2a It is also possible to provide only one of the plurality of concave grooves 2c formed between the concave grooves 2c.

According to the workpiece-sticking chucking apparatus A according to the embodiment of the present invention, the plate-like workpiece W is adhered and held by the adhered surface 1a of the adhered portion 1 in an atmospheric or vacuum atmosphere, Thereafter, the peeling section 2 is elastically expanded and protruded in the vacuum atmosphere to the plate-like workpiece W adhered and held by the adhesive section 1, and the pressing surface 2a is pressed against the plate-like workpiece W And is brought into pressure contact with the surface W1.

As a result, the plate-like workpiece W is peeled from the adhesive portion 1.

Thereafter, the periphery of the plate-like work W is opened to the atmosphere while the pressing surface 2a of the peeling section 2 is in contact with the surface W1 of the plate-like work W.

As a result, air flows into the inner space S1 from the outer space S2 of the peeling section 2 through the flow path 2p, so that the inner space S1 of the peeling section 2 and the plate- The vacuum is broken.

Thus, the plate-shaped workpiece W adhered and peeled off from the adhesive portion 1 in vacuum can be easily and reliably peeled off from the peeling portion 2 in the atmosphere.

As a result, even if the pressing surface 2a of the peeling section 2 is shrunk in the reverse direction so as to be separated from the surface W1 of the plate-like work W in the Z direction in the subsequent steps so as to cause the plate-like work W So that even if the plate-like workpiece W is, for example, a thin substrate having a thickness of 0.3 mm or less, distortion does not occur and the plate-like workpiece W can be normally maintained and peeled without distortion distortion .

Particularly when the passage 2p has a plurality of gaps 2b formed so as to communicate with the inner space S1 and the outer space S2 by surface-machining the pressing surface 2a of the peeling portion 2 in a concave- Like workpiece W is brought into pressure contact with the surface W1 of the plate-shaped workpiece W in accordance with the protruding deformation of the peeling section 2 so that a large number of gaps 2b, which become the flow path 2p, Air flows from the outer space S2 into the inner space S1 and the space between the inner space S1 of the peeling section 2 and the plate-like work W is vacuum-broken.

Thus, the plate-like workpiece W can be normally peeled off from the peeling section 2 in an atmospheric environment with a simple structure.

As a result, the manufacturing and maintenance can be simplified and the cost can be reduced.

The flow path 2p is provided with a plurality of pressing surfaces 2a of the peeling portion 2 intermittently in the circumferential direction in which the adhesive portion 1 is the center, Which are formed so as to communicate with the inner space S1 and the outer space S2 between the inner space S1 and the outer space S2, Like workpiece W by bringing the plurality of pressing surfaces 2a into contact with the surface W1 of the plate-shaped workpiece W in accordance with the protruding deformation of the peeling portion 2, Air flows from the outer space S2 into the inner space S1 through the grooves 2c and the inner space S1 of the peeling section 2 and the plate-like work W are vacuum-broken.

Therefore, the plate-shaped workpiece W can be surely peeled off from the peeling section 2 in an atmospheric environment over a long period of time with a simple structure.

As a result, it is possible to simplify the manufacturing and maintenance and to reduce the cost, and to carry out stable peeling for a long period of time.

That is, when the peeling off of the first substrate is repeated over a long period of time by the elastic deformation of the expansion member made of a soft material, the pressing surface of the expansion member is fused to the surface of the first substrate, The peeling of the plate-shaped work W due to the elastic deformation of the peeling section 2 composed of an elastic body (soft material) can be prevented from being peeled off from the surface of the first substrate for a long period of time The recessed groove 2c which becomes deeper than the pressing surface 2a of the peeling portion 2 and becomes the flow path 2p can be formed even if the pressing surface 2a of the peeling portion 2 is worn out, It is possible to reduce the influence due to the van der Waals force and to maintain the peeling for a long period of time.

On the other hand, as shown in Fig. 2, the work-attaching machine according to the embodiment of the present invention is characterized in that the above-described workpiece-sticking chucking device A is provided on one of the pair of holding plates 11 and 11 ' (First plate shaped workpiece) W is removably adhered to and peeled off from a plurality of workpiece sticking chuck apparatuses A by dispersing the plate workpiece W (Second plate-shaped workpiece) W '.

As a specific example, the holding plates 11 and 11 'are formed smoothly by, for example, a platen and the holding plate 11 on one side (upper side) is provided with a work adhesive holding device A, Like workpiece W is adhered to the first plate-like workpiece W by the seal member C and the second plate-shaped workpiece W is held in the opposite (lower) The second plate shaped workpiece W 'is held.

Further, as necessary, a plurality of suction suction means 12 are provided on either or both of the pair of holding plates 11, 11 'so as to surround the workpiece sticking and holding device A, Either one or both of the first plate-shaped workpiece W and the second plate-shaped workpiece W 'can be detachably sucked and sucked by the first and second plate-shaped workpieces W and W'.

Example  One

Next, each embodiment of the present invention will be described with reference to the drawings.

1 (a) and 1 (b), the workpiece-sticking chucking apparatus A includes an inner circumferential portion 2d of the peelable portion 2 formed annularly with respect to the support portion 3, And the outer peripheral portion 2e are clamped and fixed such that the driving fluid F from the driving portion 4 is sealed.

More specifically, the peeling section 2 is a diaphragm or an elastic membrane integrally formed in an annular shape by, for example, compression molding (compression molding) or injection molding (injection molding) And a flange-shaped inner peripheral portion 2d and an outer peripheral portion 2e which are formed so as to extend in the radial direction continuously from the inside and outside of the pressing surface 2a .

In the example shown in Figs. 1 (a) and 1 (b), a mounting hole 3c is formed in the center of the supporting portion 3 and is adhered to the mounting hole 3c in the Z direction from the surface 3a side The inner peripheral portion 2d of the peeling portion 2 is sandwiched and fixed in the Z direction so as to be immovable by inserting the base material 5 of the portion 1. [

The base material 5 of the adhesive portion 1 is formed into a cylindrical shape or a prismatic shape so that the adhesive portion 1 is fixed to one end face 5a and the adhesive portion 1 is fixed to the rear end of the support portion 3 with respect to the other end portion 5b And is fixed to the mounting hole 3c of the support portion 3 by screwing or otherwise fixing the fixing portion 5c such as a nut.

End portions 5d and 3c1 to be engaged with each other are formed on the outer surface of the substrate 5 and the inner circumferential surface of the mounting hole 3c facing the outer surface of the mounting hole 3c, And the portion 2d is sandwiched in the Z direction.

An annular recessed portion 3d is formed on the outer periphery of the surface 3a of the support portion 3 and a ring 6 is fastened to the annular recessed portion 3d by fastening means 7 such as a screw or bolt, The outer peripheral portion 2e of the peeling portion 2 is sandwiched between the annular recess 3d and the ring 6 in the Z direction.

It is preferable that the inner circumferential portion 2d and the outer circumferential portion 2e are formed integrally with the annular thick portions 2d1 and 2e1 for preventing positional deviation when the holder 3 is held and fixed.

The surface 3a of the support portion 3 is formed in a convex shape by the end portion 3c1 and the annular recessed portion 3d of the mounting hole 3c and along the pressing surface 2a of the peeling portion 2 A pair of leg portions 2f are integrally formed between the inner circumferential portion 2d and the outer circumferential portion 2e.

The substrate 5, the peeling portion 2, the supporting portion 3 and the ring 6 of the adhesive portion 1 are integrally formed by sequentially mounting them to form the work adhesive chucking device A. [

The inner circumferential portion 2d and the outer circumferential portion 2e of the peeling portion 2 are held with respect to the support portion 3 without using the substrate 5 or the ring 6, Or the shape of the supporting portion 3 or the peeling portion 2 may be changed to a shape other than the illustrated example.

According to the workpiece-sticking apparatus A according to the first embodiment of the present invention, the inner circumferential portion 2d and the outer circumferential portion 2e of the annular peelable portion 2 are held and fixed to the support portion 3 The driving fluid F supplied to the primary side of the pressing surface 2a from the driving portion 4 is sealed by the pressing surface 2a so that the leakage of the driving fluid F does not occur, 2a are bulged and deformed toward the secondary side toward the surface W1 of the plate-shaped workpiece W.

Therefore, the pressing surface 2a can be stably driven for a long period of time while preventing the leakage of the driving fluid F with a simple structure.

As a result, the manufacturing and maintenance are simple and the cost is reduced, and the plate-like workpiece W can be stably peeled off for a long period of time.

As shown in Figs. 1 (a) and 1 (b), the passage 2p includes a plurality of gaps 2b formed by machining the surface of the pressing surface 2a in a concavo-convex shape, The inner space S1 from the outer space S2 of the peeling section 2 is formed to be larger than the outer space S2 of the peeling section 2 only by the plurality of gaps 2b, Even if the amount of air passing through the separating portion 2 is insufficient, the air is supplied from the outer space S2 to the inner space S1 through the plurality of recessed grooves 2c, The shape work W is vacuum-fractured.

This has the advantage that the plate-shaped workpiece W adhered and peeled off from the adhered portion 1 in vacuum can be quickly and surely peeled off from the peeling portion 2 in the atmosphere.

Even if a plurality of gaps 2b surface-machined to the pressing surface 2a as the flow path 2p are worn by contact separation with the plate-shaped work W for a long period of time, they are provided at positions deeper than the gaps 2b The concave groove 2c remains. Therefore, there is an advantage that stable peeling can be performed over a longer period of time.

Example  2

2, a work sticking machine is provided with a plurality of work sticking chucks A (A) and a plurality of work sticking chucking machines A (b) arranged on one of the holding plates 11 in an atmospheric or vacuum atmosphere or in an atmosphere having reached a predetermined degree of vacuum, Shaped workpiece W (first plate-shaped workpiece W) is simultaneously adhered and held by the adhesive portion 1 of the other plate-shaped workpiece W (second plate-shaped workpiece W) And then the first plate-like workpiece W1 is bonded to the peeled portion 2 of the workpiece-sticking chuck device A provided on one of the holding plates 11 in a vacuum atmosphere, The work W and the second plate-shaped work W 'are simultaneously released and then the atmosphere around the first plate-shaped work W and the second plate-shaped work W' .

In the example shown in Fig. 2, the support portion 3 of the workpiece sticking chuck device A is fitted into the concave portion 11a formed on the surface of the holding plate 11 in plural, The workpiece sticking chucking device A is mounted and fixed to the holding plate 11 by the ball 7 and the driving fluid F is discharged from the ventilation hole 11b through the holding plate 11 to the support portion 3, Shaped workpiece W which is adhered and held on the pressure-sensitive adhesive surface 1a by forcibly peeling off the pressure-sensitive surface 2a of the peelable portion 2 by supplying the pressure-sensitive adhesive layer 3b to the pressure-sensitive adhesive layer 3b.

It is also possible to use other fixing means or the like instead of a fastener 7 such as a screw or bolt as a mounting means of the supporting portion 3 to the holding plate 11 although not shown as another example.

According to the work-attaching machine according to the second embodiment of the present invention, the plate-like work (first plate-like workpiece) W is adhered and held at the same time by the adhesive portions 1 of the plurality of work- (Second plate-shaped workpiece) W 'after the plate-shaped workpiece W (second plate-shaped workpiece W') is bonded to the other plate-shaped workpiece W Like workpiece W is peeled from the adhered portion 1 by bringing the surface 2a of the plate-like workpiece W into pressure contact with the surface W1 of the first plate- After that, the pressing surface 2a of the peeling portion 2 is brought into contact with the surface W1 of the plate-like work W, and the first plate-shaped work W and the second plate-shaped work W ' Air is introduced into the inner space S1 from the outer space S2 through the respective flow paths 2p so that the inner space S1 of the peeling portion 2 and the inner space S1 of the first plate- W are vacuum-fractured.

Therefore, while the bonded plate-like work (first plate shaped workpiece) W and the other plate-shaped work (second plate shaped workpiece) W 'are kept in parallel, It is possible to easily and surely peel off.

As a result, when a plurality of annular expanding members are kept in close contact with the surface of the first substrate in a vacuum state, and the surrounding environment is opened to the atmosphere, the surrounding space of the adhesive rubber surrounded by at least some annular expanding members becomes a vacuum state, The first plate-shaped workpiece W is not partially suspended even if the pressing surface 2a of the peeling section 2 is shrunk at the same time to perform the immersion deformation in the subsequent step, The partial distortion of the first plate-shaped workpiece W is prevented.

Thus, it is possible to maintain the high precision of the first plate-shaped workpiece W and the second plate-shaped workpiece W ', thereby improving the yield and improving the productivity.

In the example shown in Fig. 2, the work sticking device A and the suction suction means 12 are provided only on one (upper) holding plate 11, but the present invention is not limited to this, The plate 11 'may also be provided with a work adhesive chucking device A and a suction suction means 12.

A work sticking device
1 adhesive
1a adhesive surface
2 peeling section
2a pressure surface
2b clearance
2c concave groove
2d inner circumference portion
2e circumferential region
2p euro
3 support portion
4 drive unit
11 one-sided retaining plate
11 'The other holding plate
F drive fluid
S1 inner space
S2 outer space
W plate-shaped work (first plate-shaped work)
W1 surface
W 'Another plate-like work (second plate-shaped work)

Claims (6)

Like workpiece is peeled off in a vacuum atmosphere and the periphery of the plate-like workpiece is open to the atmosphere,
An adhesive portion provided so as to oppose the plate-like work and detachably holding the plate-like work so as to be detachable,
And an elastic deformable peeling portion which is provided so as to surround the outer periphery of the adhesive portion and which is brought into pressure contact with the surface of the plate-like work in accordance with protruding deformation toward the plate-like work, forcibly peeling off the plate-
And,
The peeling section is formed so as to surround the outer periphery of the inner space between an inner space in which the adhesive section is disposed and an outer space disposed outside the peeling section, A pressing surface contacting the surface,
And a vacuum destroying flow path for allowing air to flow from the outer space to the inner space by communicating the inner space and the outer space when the pressure surface is in contact with the surface of the plate- Wherein the workpiece is a workpiece. The method according to claim 1,
Wherein the flow path is a plurality of gaps formed so as to communicate with the inner space and the outer space by surface-machining the pressing surface of the peeling portion in a concavo-convex shape. The method according to claim 1,
The flow path is intermittently arranged in a circumferential direction in which a plurality of the pressing surfaces of the peeling portion are centered on the adhesive portion so that the inner space and the outer space are formed to communicate with each other between adjacent pressing surfaces in the circumferential direction And a plurality of concave grooves formed in the concave groove. The method according to claim 1,
A supporting portion on which the adhesive portion and the peeling portion are mounted,
A driving unit for supplying a driving fluid to the primary side of the pressing surface,
Further comprising:
Wherein an inner circumferential portion and an outer circumferential portion of the peelable portion formed annularly with respect to the support portion are sandwiched and fixed so that the drive fluid from the drive portion is sealed with the pressure surface. The method according to claim 2 or 3,
A supporting portion on which the adhesive portion and the peeling portion are mounted,
A driving unit for supplying a driving fluid to the primary side of the pressing surface,
Further comprising:
Wherein an inner circumferential portion and an outer circumferential portion of the peelable portion formed annularly with respect to the support portion are sandwiched and fixed so that the drive fluid from the drive portion is sealed with the pressure surface. A work sticking apparatus according to any one of claims 1 to 4, wherein a plurality of work sticking apparatuses are provided on either one or both of a pair of opposing holding plates,
Like workpiece by simultaneously adhering and holding the plate-like workpiece to the adherend of the workpiece-sticking chuck device provided on the one holding plate, and to adhere to another plate-shaped workpiece held by the other holding plate, Like workpiece and the other plate-like workpiece are simultaneously peeled off at the peeling section of the workpiece-sticking chuck device provided on one of the holding plates, and then the plate-like workpiece and the other plate- And the periphery is opened to the atmosphere.
KR1020157021342A 2013-01-09 2013-01-09 Workpiece adhesive chuck device and workpiece attachment machine KR101944155B1 (en)

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JP6605730B2 (en) * 2016-11-10 2019-11-13 アプライド マテリアルズ インコーポレイテッド Holding device for holding substrate, carrier including holding device, processing system using carrier, and method for releasing substrate from holding device
WO2020175401A1 (en) * 2019-02-28 2020-09-03 日東電工株式会社 Adhering device, transfer device using same, and transfer method
KR102592800B1 (en) * 2020-11-13 2023-10-20 신에츠 엔지니어링 가부시키가이샤 Work adhesion chuck device and work joining machine

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JP4785995B1 (en) * 2011-02-28 2011-10-05 信越エンジニアリング株式会社 Workpiece adhesive chuck device and workpiece bonding machine
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JP2010126342A (en) 2008-12-01 2010-06-10 Advanced Display Process Engineering Co Ltd Substrate chuck and substrate fusion device having the same

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TWI576954B (en) 2017-04-01
CN104904004B (en) 2017-05-31
CN104904004A (en) 2015-09-09
KR20150104191A (en) 2015-09-14
WO2014109018A1 (en) 2014-07-17
JP5442171B1 (en) 2014-03-12
TW201442140A (en) 2014-11-01

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