TWI415777B - Adhesive chuck device - Google Patents

Abstract

A work is easily peeled off in the peeling direction by a peeling means. An adhesive member (2) is so disposed that the adhesive force per unit area of the adhesive member (2) is increased in the direction of peeling of a work (W) relative to the adhesive member (2) in connection with the operation of the peeling means (3), whereby peeling-off of the work (A) from the adhesive member (2) can be started by a small peeling force in connection with the operation of the peeling means (3), and the peeling can be smoothly advanced. When the work is peeled off in the direction different from the advancement direction of the peeling, a force far larger than the peeling force by the operation of the peeling means (3) is required.

Description

Adhesive chuck device

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an adhesive chuck device for use in the manufacture of a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP) or a flexible display, for use in containing glass or TFT glass. A substrate assembly device for a substrate bonding machine in which a synthetic resin substrate such as a glass substrate or a plastic film such as a PES (Poly-Ether-Sulphone) is adhered and bonded, or an insulator or the like for transporting such a substrate or the like A substrate transfer device or the like of a workpiece (subject to be processed) such as a body or a semiconductor wafer.

Specifically, with respect to an adhesive chuck device that is held by an adhesive member with respect to a retaining plate, the workpiece is forcibly peeled off from the adhesive member by a peeling mechanism and isolated from the retaining plate.

Conventionally, as such an adhesive chuck device, a plurality of openings are formed in the upper holding plate (pressure plate), and the rotation actuator and the vertical drive actuator are provided in the openings, respectively. An adhesive member is attached to the distal end of the rotating shaft extending downward, and the movable member is lowered in the opening by the operation of the vertical driving actuator, and the upper workpiece (substrate) is held by the adhesive member and the suction suction function. When the adhesive member is brought back into the pressure plate, the adhesive member is twisted with respect to the workpiece surface by the rotation actuator, or is twisted and then driven by the upper and lower drive actuators. This is retracted, whereby the adhesive member is peeled off from the upper workpiece (for example, refer to Patent Document 1).

In addition, at least the upper holding plate (pressing plate) is provided with an adhesive member (adhesive) At the same time as the sheet), a plurality of openings are provided, and a presser shaft driven by the upper and lower drive actuators is provided as a peeling mechanism in the openings, and the upper workpiece (substrate) is held by the adhesive members and the suction suction function. After the bonding is performed, the upper workpiece is pressed and peeled off from the adhesive sheet by the pressing operation of the pressing shaft (for example, see Patent Document 2).

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-273508 (pages 3 to 5, Figs. 2, 5)

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2003-283185 (pages 3 to 5, Figs. 3 to 4)

However, in such a conventional adhesive chuck device, since the adhesive force of the adhesive member does not have directionality, the workpiece is easily peeled off from the adhesive member by a peeling mechanism such as an actuator or a tilting shaft. When the adhesive force is set to be weak, the workpiece is easily peeled off by an external force other than the peeling mechanism, and the workpiece cannot be reliably adhered and held, and there is a problem that the workpiece is dropped or the position is displaced at the time of bonding, resulting in a defective product.

On the other hand, if the adhesive force of the adhesive member is set to be strong, the peeling performance of the workpiece is lowered, the workpiece cannot be attached well, or in the vacuum bonding of the liquid crystal, the bubbles remain in the display cell portion. , causing bad problems in the product.

The first invention of the present invention has an object of easily peeling off a workpiece in a direction in which the peeling mechanism is peeled off.

a second invention and a third invention, the object of which is to achieve the object of the first invention In addition, the adhesion of the adhesive member is directional with a simple structure.

According to a fourth aspect of the invention, in addition to the object of the first invention, the second invention, or the third aspect of the invention, the peeling and opening of the workpiece is surely performed with a simple configuration.

In order to achieve the above object, a first invention of the present invention is characterized in that it comprises: a holding plate having a holding surface for holding a workpiece; and an adhesive member for adhering the workpiece to the holding surface; and a peeling mechanism that is disposed in an opening formed in the holding surface and that moves in a direction intersecting the holding surface, forcibly peeling the workpiece from the adhesive member; wherein the acting portion of the peeling mechanism is along the opening Arranging a plurality of the adhesive members along the peripheral edge of the action portion of the peeling mechanism; and the peeling mechanism starts from the peeling start position of the workpiece toward the peeling end position, so that the peeling mechanism causes the adhesive member The shape of the adhesive member is formed in such a manner that the peeling force required for peeling off the workpiece is increased, and the workpiece is adhered and held by the adhesive member with respect to the holding plate, and the peeling mechanism is forcibly removed from the adhesive member The above workpiece is peeled off and isolated from the above holding plate.

According to a second aspect of the invention, in the configuration of the first aspect of the invention, the shape of the adhesive member is increased, and the cross section is gradually increased toward the outer side in the radial direction from the opening center of the opening toward the opening edge. Composition.

A third invention characterized in that in the constitution of the first invention, an increase is made The shape of the adhesive member is such that the thickness of the adhesive member is increased toward the outer side in the radial direction from the center of the opening of the opening toward the opening edge.

According to a fourth aspect of the present invention, in the configuration of the first aspect, the second or the third aspect of the invention, the adhesive member and the peeling mechanism are grouped together, and a plurality of the groups are dispersed and disposed with respect to the holding plate. .

According to a fifth aspect of the present invention, in the configuration of the first aspect, the second, the third or the fourth aspect of the invention, the plurality of the adhesive members are provided to surround the peeling mechanism with respect to the holding surface of the holding plate The workpiece is dispersed and disposed in the circumferential direction, and the peeling mechanism is configured to be forcibly peeled off from the adhesive member by projecting from the holding surface of the holding plate.

In the first invention of the present invention, the adhesive member is disposed such that the adhesive force per unit area increases in direction toward the peeling of the workpiece with the adhesive member by the action of the peeling mechanism, whereby the workpiece is small due to the action of the peeling mechanism The peeling force starts to peel off from the adhesive member, and the peeling proceeds smoothly. However, when peeling is performed in a direction different from the direction in which the peeling is performed, a force much larger than the peeling force due to the action of the peeling mechanism is required.

Therefore, the workpiece can be easily peeled off in the direction in which the peeling mechanism is peeled off.

As a result, compared with the conventional apparatus in which the adhesive force of the adhesive member does not have directionality, it is possible to peel off the workpiece with difficulty with a weak peeling force, and it is difficult to cause problems such as dropping of the workpiece.

According to this, when the apparatus is used for the substrate assembly of the liquid crystal panel display, a problem such as unevenness due to the incorporation of air bubbles into the panel or the crushing of the spacer or the like can be obtained, and a large limit can be obtained.

Further, even if the local adhesive force is lowered due to the engagement of the foreign matter or the like between the adhesive member and the workpiece, the adhesion of most of the peeling start end portion is strong, so that the peeling is not caused, and the peeling can be surely performed. Adhere to keep the workpiece.

According to a second aspect of the invention, in addition to the effect of the first aspect of the invention, the mechanism for increasing the adhesion per unit area toward the peeling of the peeling mechanism is increased in direction by peeling off the workpiece to the adhesive member. The adhesive area of the adhesive member of the workpiece is set to be large, and the adhesive force is set to be strong from the peeling start position of the workpiece to the adhesive member to the peeling end position.

Therefore, the adhesive force of the adhesive member can be made directional with a simple structure.

As a result, since the structure of the entire apparatus can be simplified, it is also possible to reduce the cost of manufacturing.

According to a third aspect of the present invention, in addition to the effect of the first aspect of the invention, the mechanism for increasing the adhesion per unit area toward the peeling of the peeling mechanism is increased in direction by the peeling of the workpiece to the adhesive member. The amount of elastic deformation of the adhesive member of the workpiece is large, and the peeling force is set to be strong from the peeling start position of the workpiece to the adhesive member to the peeling end position.

Therefore, the adhesive force of the adhesive member can be oriented with a simple structure. Sex.

As a result, since the structure of the entire apparatus can be simplified, it is also possible to reduce the cost of manufacturing.

According to a fourth aspect of the invention, in addition to the effects of the first invention, the second invention, or the third invention, the adhesive member and the peeling mechanism are grouped, and the plurality of groups are dispersedly disposed at appropriate intervals with respect to the holding plate, thereby The adhesive members are disposed in a dispersed manner, and the workpieces are partially adhered and held, and these adhesives are detached by the action of the respective peeling mechanisms without applying brute force to the entire workpiece.

Therefore, with a simple structure, the peeling and opening of the workpiece can be surely performed.

As a result, since the structure of the entire apparatus can be simplified, it is also possible to reduce the cost of manufacturing.

The adhesive chuck device D of the present invention shows a glass substrate which is provided on a panel for a liquid crystal display (LCD), a plasma display (PDP) or a flexible display as the workpieces A and B, or is detachably held and attached. The case of a substrate bonding machine that incorporates a plastic film substrate.

As shown in FIGS. 1(a) to 1(c) or FIGS. 7(a) to 7(c), the substrate bonding machine is provided with, for example, a flat plate formed of a rigid body such as metal or ceramic so as not to be warped (bent). The upper and lower pair of holding plates 1 and 1' formed by the reference base plate are detachably attached to the parallel holding surfaces 1a and 1a' of the upper and lower holding plates 1 and 1'. After the predetermined degree of vacuum is reached in the closed space S which is formed around the circumference, the upper and lower holding plates 1 and 1' are relatively moved in the XYθ direction (the horizontal direction in the drawing), and the substrates A and B are moved to each other. Positioning, and then at least one of the substrates A, B After the holding surfaces 1a and 1a' of the upper and lower holding plates 1 and 1' are peeled off and overlapped, vacuum destruction in the closed space S is performed to generate a difference in air pressure between the inside and the outside of the substrates A and B, and between the substrates A and B. Pressurize to a specified gap.

As will be described in detail, as shown by the solid line in FIG. 1( a ) or FIG. 7( a ), the upper and lower holding plates 1 and 1 ′ can be moved in the Z direction (up and down direction in the drawing) by a lifting mechanism (not shown). In the atmospheric pressure environment, the upper and lower holding plates 1 and 1' are released in the upward and downward directions, and are transported by a transport robot (not shown) with respect to each of the holding surfaces 1a and 1a'. The substrates A and B are held separately in groups.

Thereafter, as shown by the double-dot chain line in FIG. 1(a) or FIG. 7(a), the upper and lower holding plates 1, 1' are moved close by the operation of the lifting mechanism, and the closed space is formed therebetween. .

Then, when air is extracted from the closed space S by the operation of the air suction means (not shown) and reaches a predetermined degree of vacuum, the upper and lower holding plates 1, 1' are held by the horizontal movement mechanism (not shown). Either one of the substrates is adjusted and moved in the XYθ direction with respect to the other side, and the position adjustment (adjustment) of the substrates A and B held by the other is performed, and the coarse adjustment and the fine adjustment are sequentially performed.

After the position adjustment is completed, as shown in FIG. 1(b) or FIG. 7(b), one of the substrates A and B held by the upper and lower holding plates 1 and 1' is moved to the other side by the clip. The annular adhesive (sheet) C on the substrate B is placed and pressed instantaneously to seal the two.

Thereafter, as shown in FIG. 1(c) or FIG. 7(c), the upper and lower holding plates 1 and 1' are moved in a direction separating from each other by the operation of the elevating mechanism, and the suction is performed at substantially the same time. Institutional counteraction or use other institutions to close the air Air or nitrogen is supplied to the space S, and the atmosphere in the closed space S is returned to the atmospheric pressure, so that the pressure difference between the inside and the outside of the two substrates A and B is uniformly pressurized, and the liquid crystal is sealed, and the press-fit is completed. Engineering to the prescribed clearance.

Further, in the adhesive chuck device D of the present invention, the upper and lower holding plates 1, 1' formed of the rigid body, and the adhesive member 2 for adhering and holding the substrates A and B, and the substrates A and B are forcibly removed from the adhesive member The peeling mechanism 3 of the peeling is configured, and the upper and lower substrates A and B are adhered to the holding surfaces 1a and 1a' of the upper and lower holding plates 1 and 1' by the adhesive member 2, and the upper and lower substrates A and the upper and lower substrates A are moved by the action of the peeling mechanism 3. B is forcibly peeled off from the adhesive member 2, and is isolated from the holding faces 1a, 1a' of the upper and lower holding plates 1, 1'.

In the example of the drawing, the adhesive chuck device D of the present invention is provided with the peeling mechanism 3 in a Z-direction (up-and-down direction) intersecting with the holding surface 1a of the upper holding plate 1, and the peeling mechanism 3 is provided by the peeling mechanism. 3, the upper substrate A is forcibly peeled off from the adhesive member 2, and is separated from the holding surface 1a of the upper holding plate 1 and overlaps with the lower substrate A held by the lower holding plate 1'. The example is explained.

The adhesive member 2 is an adhesive sheet made of an adhesive material such as butyl rubber, fluororubber, photosensitive resin, acrylic or enamel, and the back surface thereof is fixed to the holding surface 1a of the upper holding plate 1 or the following. The substrate side surface of the peeling mechanism 3.

The adhesive member 2 and the peeling mechanism 3 described below are preferably unitized such that the two are grouped and dispersed with respect to the upper holding plate 1 at appropriate intervals, in Fig. 1 (a) to (c) or Fig. 7 ( In the example shown in a)~(c), due to space, only Two sets are set, but corresponding to the size of the upper substrate A, only the number that can be hung is arranged.

Further, a plurality of openings 1b are opened in the holding surface 1a of the upper holding plate 1, and the peeling mechanism 3 is disposed in the upper and lower directions of the opening 1b.

As a specific example of the peeling mechanism 3, as shown in Figs. 1(a) to (c) or Figs. 7(a) to 7(c), for example, an elastically deformable film made of a metal such as stainless steel or rubber or engineering is used. The elastic film 3a in which a synthetic resin such as a plastic is formed into a thin plate-shaped diaphragm plate is supported in the opening portion 1b of the upper holding plate 1 in a downward direction, and is sandwiched between the elastic film 3a and formed therein. The pressure difference between the air pressure chamber 3b on the side (back) and the closed space S formed on the secondary side is elastically deformed and reciprocated upward and downward, or is driven up and down by a drive source (not shown) such as an actuator. Actuate.

In the illustrated example, the outer peripheral portion of the elastic film 3a is fixed by being sandwiched by the holding member 1c provided in the opening portion 1b of the upper holding plate 1, but may be fixed by other supporting means, and in addition, in the elasticity The rigid portion 3c which is not deformable is connected to the center portion of the film 3a. However, for example, the elastic film 3a made of a diaphragm plate having no rigid body portion 3c may be adhered to, as described in the manual of International Publication No. 2005/098522. The member 2 forcibly peels off the upper substrate A and is isolated from the holding surface 1a of the upper holding plate 1.

When the elastic film 3a or the driving source is actuated in the vertical direction, the upper substrate A adhered and held by the adhesive member 2 is deformed, and the adhesive member 2 is elastically deformed in accordance with the distortion of the deformation, and peeling occurs when the adhesive force reaches the yield value. .

Therefore, the above-mentioned adhesive member 2 is configured such that adhesion per unit area The force of the upper substrate A with respect to the action of the above-described peeling mechanism 3 increases the direction in which the adhesive member 2 is peeled off, and the strength of the peeling force has an in-plane directivity.

In other words, in accordance with the operation of the peeling mechanism 3, the adhesive member 2 is placed in the direction in which the deformation of the upper substrate A is distorted, so that the force required for peeling (the adhesive yielding force of the adhesive member 2) is substantially increased at each point.

Further, the present invention refers to the direction in which the deformation distortion of the upper substrate A as described above is propagated as "peeling progress direction".

The adhesion area of the adhesive member 2 with respect to the upper substrate A is set so as to increase the adhesion of the adhesive force per unit area to the upper substrate A of the adhesive member 2 in response to the action of the peeling mechanism 3 The direction of peeling of the upper substrate A with respect to the adhesive member 2 is increased or the amount of elastic deformation of the adhesive member 2 with respect to the upper substrate A is increased in the direction of peeling of the workpiece A with respect to the adhesive member 2, and the like. The strength of the peeling force has a directionality in the plane.

[Detailed Description of Embodiments]

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.

Example 1

In the first embodiment, as shown in FIGS. 1 to 6, the adhesive member 2 is fixed to surround the peeling mechanism 3 with respect to the holding surface 1a of the upper holding plate 1, and the peeling mechanism 3 is moved upward to make it upward. The inside of the opening 1b of the holding plate 1 is recessed, and the surface A1 of the upper substrate A is adhered to the adhesive surface 2a of the adhesive member 2, and is moved downward by the peeling mechanism 3. The secondary side space (closed space) S protrudes, and the surface A1 of the upper substrate A is forcibly pressed and peeled off from the adhesive surface 2a of the adhesive member 2.

As an example of the installation of the adhesive member 2, the shape of the adhesive member 2 that is fixed along the opening edge of each opening portion 1b of the upper holding plate 1 is changed in the direction in which the peeling of the sheet 1 is upwardly changed, thereby facilitating the follow-up according to each The cross-section or the adhesion per unit area of the adhesive member 2 in which the upper and lower sides of the upper substrate A during the peeling of the peeling mechanism 3 in the opening 1b are moved up and down are increased or decreased.

In the example shown in FIG. 2(b), the plurality of adhesive members 2 are disposed at an appropriate interval in the circumferential direction along the opening edge of each of the opening portions 1b in which the upper holding plate 1 is opened in a circular shape, and the adhesive members are fixed. The shape of the adhesive faces of 2 is substantially triangular, and the cross-sectional area of the adhesive member 2 is gradually increased from the center of the opening of each opening 1b toward the outside in the radial direction facing the opening edge.

As another example, as shown in FIG. 3, an annular adhesive member 2 that is continuous in the circumferential direction along the opening edge of each opening portion 1b of the upper holding plate 1 is disposed so that the appropriate portion from the circumferential direction of the inner portion to the surface The center of the opening of the opening 1b is substantially a mountain shape or a trapezoidal shape, and the cross-sectional area of the adhesive member 2 may be gradually increased from the opening center of each opening 1b toward the outside in the radial direction facing the opening edge.

The shape of these adhesive members 2 is not limited to the substantially triangular shape or the substantially mountain shape or the trapezoidal shape shown in the drawings, but may be changed to a trapezoidal or the like.

Further, as shown in FIG. 4, the adhesive member 2 is dispersed in a plurality of dots, and the number, density, size, and the like of the dot-shaped adhesive members 2 can be changed to facilitate the follow-up according to each of the openings 1b. The adhesion force per unit area of the adhesive member 2 in which the upper and lower sides of the peeling mechanism 3 are moved up and down and the vertical direction of the upper substrate A is changed during the peeling is gradually increased or decreased.

In addition, as an example of the arrangement of the adhesive member 2 other than the above, the direction in which the thickness of the adhesive member 2 fixed along the opening edge in each opening portion 1b of the upper holding plate 1 is held upward is changed or the direction is changed. The fixing portion of the adhesive member 2 with respect to the holding surface 1a of the upper holding plate 1 is changed in the direction in which the peeling of the holding plate 1 is changed, and is increased or decreased to facilitate the peeling of the peeling mechanism 3 in the respective opening portions 1b. The amount of elastic deformation of the adhesive member 2 in which the upper substrate A is displaced in the vertical direction (vertical direction).

In the example shown in Fig. 5, the plurality of adhesive members 2 are fixedly disposed at appropriate intervals in the circumferential direction along the opening edges of the respective opening portions 1b of the upper holding plate 1, or are fixed in a ring shape continuous in the circumferential direction, and these are adhered. The thickness dimension of the member 2 is increased from the center of the opening of each opening portion 1b toward the outside in the radial direction facing the opening edge, and the amount of elastic deformation of the adhesive member 2 is gradually increased, whereby the peeling force is made stronger in the same direction.

In the illustrated example, since the adhesive member 2 is fixed to the holding surface 1a of the upper holding plate 1 via the adhesive holding plate 2b, it is preferable to accurately position the adhesive member 2 having different inner and outer thicknesses, but it is also possible not to use the adhesive holding plate. 2b and directly fixed.

For example, as shown in Fig. 6 (a) and (b), the plurality of adhesive members 2 are arranged and fixed at appropriate intervals in the circumferential direction along the opening edges of the respective opening portions 1b of the upper holding plate 1, or are continuous in the circumferential direction. In the arrangement of the fixing member 2, only the outer side in the radial direction of the adhesive member 2 is fixed to the holding surface 1a of the upper holding plate 1, and the elasticity of the adhesive member 2 is made from the center of the opening of each opening 1b toward the outer side in the radial direction facing the opening edge. The amount of deformation gradually increases, whereby the peeling force is made stronger in the same direction.

In the example of the drawing, the adhesive holding plate 2b is provided along the back surface of the adhesive member 2, and the tensile strength of the adhesive member 2 is changed by fixing only the radially outer portion 2c with respect to the holding surface 1a of the upper holding plate 1 or the like. The height is preferable, but it is also possible to directly fix it without using the adhesive holding plate 2b.

Further, the installation example shown in FIGS. 2 to 6 may be appropriately combined, and the adhesion force per unit area may be directed to the peeling of the upper substrate A with respect to the adhesive member 2 toward the downward movement of the peeling mechanism 3 . (the outer side in the radial direction of the opening edge from the opening center of each opening portion 1b) increases.

On the other hand, a rigid body portion 3c made of a non-deformable material is connected to a portion of the upper substrate A of the peeling mechanism 3, and the upper and lower portions of the peeling mechanism 3 are moved to open the opening portion 1b of the holding plate 1. The rigid body portion 3c moves in parallel in the up and down direction.

In the example of the figure, the upper substrate A is brought into contact with the adhesive member 2 of the upper holding plate 1 in a state where the rigid body portion 3c is embedded in the opening portion 1b by the upward movement of the elastic film 3a of the peeling mechanism 3, and the upper substrate A is brought into contact with the adhesive member 2 of the upper holding plate 1 to be adhered thereto. In addition, by the downward movement of the elastic film 3a, the rigid body portion 3c is protruded to the secondary side space (closed space) S, and is deformed downward, and the upper substrate A is pressed in a direction away from the adhesive surface 2a of the adhesive member 2. Surface A1.

Further, although the shape of the rigid body portion 3c is circular in accordance with the opening portion 1b of the holding plate 1, the shape of the rigid body portion 3c and the opening portion 1b may be, for example, a rectangular or polygonal equiangular shape or the like.

Next, the operation of such an adhesive chuck device D will be described.

First, as shown by the solid line in FIG. 2(a), the solid line in FIG. 5, and FIG. 6(a), the adhesive member is held by the adhesive member 2 by the downward movement of the peeling mechanism 3 described above. The surface A1 of the upper substrate A of the adhesive surface 2a is as shown in the double-dot chain line of FIG. 2(a), the double-dot chain line of FIG. 5, and FIG. 6(b), and the extruded portion of the upper substrate A is partially generated. The deformation corresponds to the distortion of the deformation, and the adhesive force of the adhesive member 2 reaches the yield value and peeling occurs.

In the peeling, the adhesive member 2 is disposed such that the adhesive force per unit area increases in the direction in which the substrate A is peeled off, that is, in the present embodiment, from the opening center of each opening portion 1b toward the outside in the radial direction, therefore, Due to the small peeling force, the surface A1 of the upper substrate A is first peeled off from the inside, and the peeling proceeds smoothly.

However, even if the other external force acts in a direction different from the direction in which the peeling mechanism 3 is peeled off, the upper substrate A acts on this, but since the peeling force with respect to the adhesive member 2 becomes very large, it is difficult to peel off.

According to this, the peeling mechanism 3 is surely achieved that the upper substrate A is peeled off by the adhesive member 2, and the interference force in the other direction can be provided with peeling resistance, and the upper substrate A can be reliably prevented. Peel off the drop.

Example 2

In the second embodiment, as shown in FIGS. 7 to 8(a), the fixing position of the adhesive member 2 is replaced by the holding surface 1a of the upper holding plate 1 as the front end surface of the peeling mechanism 3, and the peeling mechanism is used. 3 moving downward so that the adhesive surface 2a of the adhesive member 2 fixed to the front end surface thereof and the holding surface 1a of the upper holding plate 1 protrude in a substantially planar shape or a plurality of (about 100 μm) convex portions, whereby the upper substrate A is The surface A1 is adhered to the adhesive surface 2a of the adhesive member 2, and is moved upward by the peeling mechanism 3, so that the adhesive surface 2a of the adhesive member 2 fixed to the front end surface thereof is held upward in the opening 1b of the plate 1. Buried in a concave shape, Accordingly, the configuration in which the adhesive surface 2a of the adhesive member 2 is forcibly peeled off from the surface A1 of the upper substrate A is different from the first embodiment shown in FIGS. 1 to 5, and the configuration other than the above is shown in FIG. The embodiment 1 shown in Fig. 5 is the same.

In the case of the example, the rigid body portion 3c is connected to the portion facing the upper substrate A of the peeling mechanism 3, and the adhesive member 2 is fixed to the front end surface of the rigid body portion 3c.

As an example of the arrangement of the above-described adhesive member 2 in the second embodiment, as in the above-described first embodiment, the shape of the adhesive member 2 or the thickness of the adhesive member 2 or the peeling mechanism is changed by the peeling direction of the upward holding plate 1. The fixed portion of the adhesive member 2 on the distal end surface of the third surface is increased or decreased to facilitate the up-and-down (vertical) displacement of the upper substrate A during peeling in accordance with the vertical movement of the peeling mechanism 3 in each opening 1b. The cross-sectional area of the adhesive member 2 or the amount of adhesive force or elastic deformation per unit area.

For example, as shown in FIG. 8(b), a plurality of adhesive members 2 are disposed and fixed at an appropriate interval in the circumferential direction along the outer peripheral edge of the front end surface of the rigid body portion 3c of the peeling mechanism 3, and the adhesive members 2 are disposed. The shape of the adhesive faces is set to be substantially triangular, and the cross-sectional area of the adhesive member 2 is gradually increased from the opening edge of each opening portion 1b toward the inner side in the radial direction facing the center of the opening.

As another example, although not shown, the fixing position of the adhesive member 2 in the installation example shown in FIGS. 2 to 6 may be replaced by the holding surface 1a of the upper holding plate 1 and the front end surface of the peeling mechanism 3 at the same time. In the opposite direction of the adhesive member 2, the cross-sectional area of the adhesive member 2 is gradually increased from the opening edge of each opening portion 1b toward the inner side in the radial direction facing the center of the opening.

Further, such an arrangement example may be appropriately combined so that the adhesion per unit area is directed to the upward movement of the peeling mechanism 3 with respect to the adhesive member 2 The peeling progress direction of the upper substrate A (inward in the radial direction from the opening edge of each opening portion 1b toward the center of the opening) increases.

When the operation of the second embodiment is described, the adhesive member 2 fixed to the front end surface thereof is recessed and pulled away from the surface A1 of the upper substrate A by the upward movement of the peeling mechanism 3, thereby adhering to the upper substrate A. Partially partial deformation occurs, and the adhesive force of the adhesive member 2 reaches the yield value and peels off in response to the deformation of the deformation, so that the surface A1 of the upper substrate A is peeled off effortlessly.

In this peeling, the adhesive member 2 is disposed such that the adhesive force per unit area is increased toward the direction in which the substrate A is peeled off, that is, in the present embodiment, from the opening edge of each opening portion 1b toward the inner side in the radial direction, Due to the small peeling force, the surface A1 of the upper substrate A starts to peel off, and the peeling proceeds smoothly.

However, even if the other external force acts on the upper substrate A in a direction different from the direction in which the peeling mechanism 3 is peeled off, since the peeling force with respect to the adhesive member 2 becomes very large, peeling is difficult.

As a result, in the second embodiment as shown in FIGS. 7 to 8, as in the first embodiment, the peeling mechanism 3 is actuated to surely peel off the upper substrate A from the adhesive member 2, and other directions are obtained. The interference force can make the peeling resistance, and the peeling of the upper substrate A can be surely prevented.

Further, the adhesive chuck device D of the present invention indicates that the workpieces A and B are provided with a glass substrate for use in a panel of a liquid crystal display (LCD), a plasma display (PDP) or a flexible display, or are detachably held and In the case of a substrate bonding machine to which a plastic film substrate is bonded, the present invention is not limited thereto, and may be provided in a substrate assembly device other than the substrate bonding machine or a substrate on which the substrate is transferred. The carrier device may adhere to a substrate other than the glass substrate for the LCD panel.

Further, although the substrate bonding machine in which the two substrates A and B are bonded in a vacuum has been described, the present invention is not limited thereto, and may be a substrate bonding machine in which the substrates A and B are bonded together in the air. The same effects as those of the vacuum laminator described above were obtained.

Further, in the illustrated example, the peeling mechanism 3 is provided to the holding surface 1a of the upper holding plate 1 in a reciprocating manner, and the upper substrate A is forcibly peeled off from the adhesive member 2 by the vertical movement of the peeling mechanism 3, but In addition to the above, the holding surface 1a' of the lower holding plate 1' can be reciprocally provided with a peeling mechanism in the same manner, and the peeling mechanism can be forcibly peeled off from the adhesive member. The substrate B is isolated from the holding surface 1a' of the lower holding plate 1'.

1‧‧‧ holding plate (upper holding plate)

1'‧‧‧ holding plate (lower holding plate)

1a‧‧‧ Keep face

1a'‧‧‧ Keep face

1b‧‧‧ openings

1c‧‧‧Clamping members

2‧‧‧Adhesive members

2a‧‧‧Adhesive

2b‧‧‧Adhesive holding plate

2c‧‧‧Outside the radial direction

3‧‧‧ peeling mechanism

3a‧‧‧elastic film

3b‧‧‧air pressure chamber (primary space)

3c‧‧‧ rigid body

A‧‧‧Workpiece (upper substrate)

A1‧‧‧ surface

B‧‧‧Workpiece (lower substrate)

C‧‧‧Ring Adhesive

D‧‧‧Adhesive chuck device

S‧‧‧closed space (secondary space)

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal cross-sectional front view showing a first embodiment of an adhesive chuck device according to the present invention, and the operation steps provided in the substrate bonding machine are shown in (a) to (c).

Fig. 2 is a partially enlarged view of the embodiment 1, (a) is a longitudinal sectional front view, and (b) is a transverse sectional bottom view.

Fig. 3 is an enlarged transverse cross-sectional bottom view showing a modified example of the adhesive member.

Fig. 4 is an enlarged lateral cross-sectional bottom view showing a modified example of the adhesive member.

Fig. 5 is an enlarged longitudinal sectional front view showing a modified example of the adhesive member.

Fig. 6 is a front view showing an enlarged longitudinal section of a modified example of the adhesive member, wherein (a) shows a state before peeling, and (b) shows a state when peeling progresses.

Fig. 7 is a longitudinal cross-sectional front view showing a second embodiment of the adhesive chuck device of the present invention, and the operation steps provided in the substrate bonding machine are shown in (a) to (c).

Fig. 8 is a partially enlarged view showing the second embodiment, (a) is a longitudinal sectional front view, and (b) is a transverse sectional bottom view.

1‧‧‧ holding plate (upper holding plate)

1a‧‧‧ Keep face

1b‧‧‧ openings

1c‧‧‧Clamping members

2‧‧‧Adhesive members

2a‧‧‧Adhesive

3‧‧‧ peeling mechanism

3a‧‧‧elastic film

3b‧‧‧air pressure chamber (primary space)

3c‧‧‧ rigid body

A‧‧‧Workpiece (upper substrate)

A1‧‧‧ surface

D‧‧‧Adhesive chuck device

S‧‧‧closed space (secondary space)

Claims (6)

An adhesive chuck device comprising: a holding plate having a holding surface for holding a workpiece; an adhesive member for adhering and holding the workpiece to the holding surface; and a peeling mechanism disposed to be formed in the holding The opening of the surface is moved in a direction intersecting the holding surface, and the workpiece is forcibly peeled off from the adhesive member; wherein the action portion of the peeling mechanism is disposed along an opening edge of the opening, and the adhesive member is placed along the a plurality of peripheral portions of the action portion of the peeling mechanism are dispersedly disposed, and the peeling force required to peel the adhesive member from the workpiece is increased by the peeling mechanism from the peeling start position of the workpiece toward the peeling end position. The shape of the adhesive member is formed, and the workpiece is adhered and held by the adhesive member with respect to the holding plate, and the workpiece is forcibly peeled off from the adhesive member by the peeling mechanism, and is separated from the holding plate. The adhesive chuck device according to claim 1, wherein the shape of the adhesive member is a triangular shape in which a cross section is gradually increased toward an outer side in a radial direction from an opening center of the opening portion toward an opening edge. In the adhesive chuck device of claim 1, the adhesive member has a shape in which the thickness of the adhesive member is increased toward the outer side in the radial direction from the center of the opening of the opening toward the opening edge. An adhesive chuck device according to 2 or 3, wherein the adhesive member and the peeling mechanism are grouped together, and a plurality of the groups are dispersedly arranged with respect to the holding plate. The adhesive chuck device of 2 or 3, wherein a plurality of the adhesive members are dispersed in a circumferential direction so as to surround the peeling mechanism with respect to the holding surface of the holding plate, wherein the peeling mechanism is made from the holding plate The holding surface is projected to move so that the workpiece can be forcibly pressed and peeled from the adhesive member. The adhesive chuck device of claim 4, wherein a plurality of the adhesive members are dispersed in a circumferential direction so as to surround the peeling mechanism with respect to the holding surface of the holding plate, wherein the peeling mechanism is moved from the holding plate The holding surface is projected to move so that the workpiece can be forcibly pressed and peeled from the adhesive member.