JPWO2005098522A1 - Adhesive chuck device - Google Patents

Adhesive chuck device Download PDF

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JPWO2005098522A1
JPWO2005098522A1 JP2006515325A JP2006515325A JPWO2005098522A1 JP WO2005098522 A1 JPWO2005098522 A1 JP WO2005098522A1 JP 2006515325 A JP2006515325 A JP 2006515325A JP 2006515325 A JP2006515325 A JP 2006515325A JP WO2005098522 A1 JPWO2005098522 A1 JP WO2005098522A1
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adhesive
substrate
holding
plate
film
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JP3882004B2 (en
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義和 大谷
義和 大谷
道也 横田
道也 横田
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信越エンジニアリング株式会社
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Priority to PCT/JP2005/006925 priority patent/WO2005098522A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04Arrangements of vacuum systems or suction cups
    • B65G2249/045Details of suction cups suction cups
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133354Arrangements for aligning or assembling substrates

Abstract

簡単な構造で基板を確実に着脱する。 保持板1の基板側に、基板Aの裏面A1と対向して粘着保持する粘着部材3と、該基板側面1aと交差する方向へ出没変形可能な変形膜4とを設け、この変形膜4の出没変形で粘着部材3の粘着表面3aと基板Aを当接させて粘着すると共に、これら両者を強制的に引き離すことにより、粘着部材3の粘着表面3aから基板Aが無理なく剥離される。The substrate is securely attached and detached with a simple structure. On the substrate side of the holding plate 1, there are provided an adhesive member 3 that is adhesively held opposite to the back surface A 1 of the substrate A, and a deformation film 4 that can be deformed in and out in a direction intersecting the substrate side surface 1 a. The adhesive surface 3a of the adhesive member 3 and the substrate A are brought into contact with each other by the deformation of the protrusions and adhered, and the two are forcibly separated, whereby the substrate A is peeled off from the adhesive surface 3a of the adhesive member 3 without difficulty.

Description

本発明は、例えば液晶ディスプレー(LCD)やプラズマディスプレー(PDP)などのフラットパネルディスプレーの製造過程において、CFガラスやTFTガラスなどのガラス製基板か又は合成樹脂製基板を粘着保持して貼り合わせる基板貼り合わせ機を含む基板組立装置や、基板を搬送する基板搬送装置などに用いられる粘着チャック装置に関する。
詳しくは、基板を保持板に対し、粘着で着脱自在に保持する粘着チャック装置に関する。
In the present invention, for example, a glass substrate such as CF glass or TFT glass or a synthetic resin substrate is bonded and bonded in a manufacturing process of a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP). The present invention relates to an adhesive chuck device used for a substrate assembly apparatus including a bonding machine, a substrate transfer apparatus for transferring a substrate, and the like.
Specifically, the present invention relates to an adhesive chuck device that holds a substrate detachably with respect to a holding plate.
従来、二枚の基板を重ね合わせる基板貼り合わせ機では、静電チャックで基板を保持していたが、近年の基板の大型化に伴い、大きなサイズの静電チャックを製作することが難しくなり、また仮に製作できても非常に高価な物となっていた。
そこで、これらの問題を解決するため、基板の保持に粘着材を使用した粘着チャック装置がある。
このような粘着チャック装置の一例として、一対のローラに亘り巻き取り自在に張られた粘着シートに対し、上基板を貼り付け保持した後、上基板と下基板の貼り合わせを行ない、その後、複数のモータの駆動で、スピンドルを回転させて粘着シートを巻き取ると同時に、その巻き取り速度と同期した速さで同巻き取り方向へ該スピンドル及び一方のローラを水平移動させることにより、上基板の上面から粘着シートを徐々に剥がすものがある(例えば、特許文献1参照)。
そして、上述したスピンドルによる粘着シートの巻き取りに代えて、両基板を貼り合わせてセルができた後に、複数のアクチュエータの駆動で、カッタ台及びカッタベースを複数のアクチュエータによりカッタの刃の下端位置まで上昇させてから、粘着シートの幅方向へカッタを移動させることにより、上基板が貼り付いている粘着シートを切断し、この粘着シートが付いたままセルを取り出し、適宜な時点でセルから粘着シートを剥ぎ取るようにしている。
更に他の例として、上方の加圧板に開孔を複数設け、これら開孔内にアクチュエータを夫々備え、各アクチュエータから下方に向かって伸びた軸の先端に粘着部材が貼着され、上記アクチュエータの動作により開孔内で粘着部材を下降させ、粘着部材の下面が上基板と接触すると、その粘着作用で加圧板の下面に密着した形で保持され、また基板の貼り合わせ後に上基板から粘着材を剥がす時は、アクチュエータにより開孔内で粘着部材を上昇させると、開孔の周縁部が上基板の移動を阻止して粘着部材から上基板を引き離すものがある(例えば、特許文献2参照)。
また、上方の加圧板に開口を複数設け、これら開口内に回転用アクチュエータと上下駆動用アクチュエータを夫々備え、夫々の回転用アクチュエータから下方に向かって伸びた回転軸の先端に粘着部材が取り付けられ、上下駆動用アクチュエータの動作により開口内で各粘着部材を下降させ、これら粘着部材と吸引吸着で上基板を保持して、位置決めしながら貼り合わせを行い、粘着部材を加圧板内に退行させる時は、粘着部材を基板面に対して回転用アクチュエータにより捻りながら、又は捻ってから上下駆動用アクチュエータにより退行させて、粘着部材を上基板から剥がすものがある(例えば、特許文献3参照)。
Conventionally, in a substrate bonding machine that superimposes two substrates, the substrate is held by an electrostatic chuck, but with the recent increase in size of the substrate, it becomes difficult to manufacture a large size electrostatic chuck, Even if it could be manufactured, it was very expensive.
Therefore, in order to solve these problems, there is an adhesive chuck device using an adhesive material for holding the substrate.
As an example of such an adhesive chuck device, the upper substrate is attached to and held on an adhesive sheet that is rewound over a pair of rollers, and then the upper substrate and the lower substrate are bonded together, and then a plurality of By driving the motor, the spindle is rotated to wind up the adhesive sheet, and at the same time, the spindle and one roller are moved horizontally in the same winding direction at a speed synchronized with the winding speed of the upper substrate. There is one that gradually peels the adhesive sheet from the upper surface (see, for example, Patent Document 1).
Then, instead of winding the adhesive sheet by the spindle described above, after the two substrates are bonded together to form a cell, the plurality of actuators drive the cutter table and the cutter base to the lower end position of the cutter blade. The adhesive sheet with the upper substrate attached is cut by moving the cutter in the width direction of the adhesive sheet, and the cell is taken out with the adhesive sheet attached, and the adhesive is adhered to the cell at an appropriate time. The sheet is peeled off.
As yet another example, a plurality of apertures are provided in the upper pressure plate, actuators are provided in the apertures, and an adhesive member is attached to the tip of a shaft extending downward from each actuator. When the adhesive member is lowered in the opening by the operation and the lower surface of the adhesive member comes into contact with the upper substrate, the adhesive member is held in close contact with the lower surface of the pressure plate by the adhesive action. When removing the adhesive member, when the adhesive member is lifted in the opening by the actuator, the peripheral portion of the opening prevents the upper substrate from moving and pulls the upper substrate away from the adhesive member (for example, see Patent Document 2). .
In addition, a plurality of openings are provided in the upper pressure plate, and a rotation actuator and a vertical drive actuator are provided in each of these openings, and an adhesive member is attached to the tip of the rotation shaft extending downward from each rotation actuator. When each adhesive member is lowered in the opening by the operation of the vertical drive actuator, the upper substrate is held by suction adhesion with these adhesive members, and bonding is performed while positioning, and the adhesive member is retracted into the pressure plate In some cases, the adhesive member is peeled from the upper substrate by twisting the adhesive member with respect to the substrate surface with a rotating actuator or by reversing the adhesive member with a vertical drive actuator (see, for example, Patent Document 3).
特開2001−133745号公報(第3−5頁、図1−図7)JP 2001-133745 A (page 3-5, FIG. 1 to FIG. 7) 特開2003−241160号公報(第5頁、図7)Japanese Patent Laying-Open No. 2003-241160 (5th page, FIG. 7) 特開2003−273508号公報(第5頁、図1−5)JP 2003-273508 A (5th page, FIG. 1-5)
しかし乍ら、このような従来の粘着チャック装置では、特許文献1の場合、粘着部材と基板とを剥がすために、粘着シートを巻き取りながら巻き取り速度と同期した速さで同巻き取り方向へ水平移動させるか、又はカッタ台及びカッタベースを上昇させカッタで粘着シートを切断しなければならず、夫々の作動には複数のモータやアクチュエータなどの駆動源が多く必要になって構造が複雑化するという問題があった。
更に、特許文献2の場合には、加圧板の開孔内で粘着部材を上昇させるために複数のアクチュエータが各粘着部材毎に夫々必要になり、また特許文献3の場合には、粘着部材を捻りながら退行させるための回転用アクチュエータ及び上下駆動用アクチュエータが各粘着部材毎に夫々必要に必要になって構造が複雑化するという問題があった。
従って、特許文献1〜3は、特に剥離構造が複雑であるため、故障の発生率が高いだけでなく、更に基板貼り合わせ機を含む基板組立装置や基板搬送装置などに配備する場合には、既設の静電チャックなどの基板保持機構を本発明の粘着チャック装置へ置き換えることが困難であるという問題があった。
However, in such a conventional adhesive chuck device, in the case of Patent Document 1, in order to peel off the adhesive member and the substrate, in the same winding direction at a speed synchronized with the winding speed while winding the adhesive sheet. It must be moved horizontally, or the cutter base and cutter base must be lifted and the adhesive sheet must be cut with the cutter. Each operation requires a large number of drive sources such as multiple motors and actuators, resulting in a complicated structure. There was a problem to do.
Furthermore, in the case of Patent Document 2, a plurality of actuators are required for each adhesive member in order to raise the adhesive member in the opening of the pressure plate. There has been a problem that the rotation actuator and the vertical drive actuator for retraction while twisting are necessary for each adhesive member, and the structure becomes complicated.
Therefore, in Patent Documents 1 to 3, since the peeling structure is particularly complicated, not only the failure occurrence rate is high, but also when deployed in a substrate assembly apparatus or a substrate transport apparatus including a substrate bonding machine, There is a problem that it is difficult to replace the existing substrate holding mechanism such as an electrostatic chuck with the adhesive chuck device of the present invention.
本発明のうち請求項1記載の発明は、簡単な構造で基板を確実に着脱することを目的としたものである。
請求項2記載の発明は、請求項1に記載の発明の目的に加えて、基板粘着構造を簡単に製作することを目的としたものである。
請求項3記載の発明は、請求項1または2に記載の発明の目的に加えて、全体構造を更に簡素化することを目的としたものである。
請求項4記載の発明は、請求項2または3に記載の発明の目的に加えて、吸引用配管系や吸引制御を容易に実現しながら基板を確実に保持することを目的としたものである。
The invention according to the first aspect of the present invention aims to securely attach and detach the substrate with a simple structure.
In addition to the object of the invention described in claim 1, the invention described in claim 2 aims to easily produce a substrate adhesive structure.
In addition to the object of the invention described in claim 1 or 2, the invention described in claim 3 aims to further simplify the overall structure.
In addition to the object of the invention described in claim 2 or 3, the invention described in claim 4 is intended to hold the substrate securely while easily realizing the suction piping system and suction control. .
前述した目的を達成するために、本発明のうち請求項1記載の発明は、保持板の基板側に、基板の裏面と対向して粘着保持する粘着部材と、該基板側面と交差する方向へ出没変形可能な変形膜とを設け、この変形膜の出没変形で粘着部材の粘着表面と基板を当接させて粘着すると共に、これら両者を強制的に引き離して剥離することを特徴とするものである。
請求項2記載の発明は、請求項1記載の発明の構成に、前記粘着部材と変形膜を一体に形成した構成を加えたことを特徴とする。
請求項3記載の発明は、請求項1または2記載の発明の構成に、前記変形膜の一部に粘着部材の粘着表面を配設した構成を加えたことを特徴とする。
請求項4記載の発明は、請求項2または3記載の発明の構成に、前記板状体の一部に通気孔を開設し、この通気孔から基板の裏面を吸引吸着した構成を加えたことを特徴とする。
In order to achieve the above-described object, the invention according to claim 1 of the present invention is such that an adhesive member that adheres and holds on the substrate side of the holding plate opposite to the back surface of the substrate, and a direction intersecting the side surface of the substrate. It is characterized by providing a deformable film that can be deformed and deformed, and by adhering the adhesive surface of the adhesive member to the substrate by the deformation of the deformed film, and forcibly pulling them apart and separating them. is there.
The invention described in claim 2 is characterized in that a configuration in which the adhesive member and the deformation film are integrally formed is added to the configuration of the invention described in claim 1.
The invention described in claim 3 is characterized in that a configuration in which an adhesive surface of an adhesive member is disposed on a part of the deformation film is added to the configuration of the invention described in claim 1 or 2.
The invention according to claim 4 adds a configuration in which a vent is formed in a part of the plate-like body and the back surface of the substrate is sucked and adsorbed from the vent to the configuration of the invention according to claim 2 or 3. It is characterized by.
本発明のうち請求項1記載の発明は、保持板の基板側に、基板の裏面と対向して粘着保持する粘着部材と、該基板側面と交差する方向へ出没変形可能な変形膜とを設け、この変形膜の出没変形で粘着部材の粘着表面と基板を当接させて粘着すると共に、これら両者を強制的に引き離すことにより、粘着部材の粘着表面から基板が無理なく剥離される。
従って、簡単な構造で基板を確実に着脱することができる。
その結果、粘着部材と基板とを剥がすためにモータやアクチュエータなどの駆動源が多く必要な従来のものに比べ、特に剥離構造が簡単であるため、故障の発生率を著しく低下でき、更に基板貼り合わせ機を含む基板組立装置や基板搬送装置などに配備する場合には、既設の静電チャックなどの基板保持機構を本発明の粘着チャック装置へ容易に置き換えることができて、製造コストの大幅な低減化が図れる。
また、静電吸着により基板を保持しないから、静電気を自発的に発生させないという利点もある。
According to the first aspect of the present invention, an adhesive member that adheres and holds the substrate opposite to the back surface of the substrate and a deformable film that can be deformed so as to intersect with the side surface of the substrate are provided on the substrate side of the holding plate. The adhesive surface of the adhesive member and the substrate are brought into contact with each other by the deformation of the deformed film, and the substrate is peeled off from the adhesive surface of the adhesive member by forcibly separating them.
Therefore, the substrate can be reliably attached and detached with a simple structure.
As a result, compared to conventional devices that require a large number of drive sources such as motors and actuators to separate the adhesive member and the substrate, the separation structure is particularly simple, so the failure rate can be significantly reduced and the substrate attached In the case of deployment to a substrate assembly apparatus or a substrate transport apparatus including an aligner, an existing substrate holding mechanism such as an electrostatic chuck can be easily replaced with the adhesive chuck apparatus of the present invention, which greatly increases the manufacturing cost. Reduction can be achieved.
Further, since the substrate is not held by electrostatic adsorption, there is an advantage that static electricity is not generated spontaneously.
請求項2の発明は、請求項1の発明の効果に加えて、粘着部材と変形膜を一体に形成することにより、保持板の基板側に配設するだけで粘着部材と変形膜が同時に配置される。
従って、基板粘着構造を簡単に製作することができる。
In the invention of claim 2, in addition to the effect of the invention of claim 1, by forming the adhesive member and the deformable film integrally, the adhesive member and the deformable film are arranged at the same time only by arranging them on the substrate side of the holding plate. Is done.
Therefore, the substrate adhesive structure can be easily manufactured.
請求項3の発明は、請求項1または2の発明の効果に加えて、変形膜の一部に粘着部材の粘着表面を配設することにより、保持板の基板側を変形膜で覆うだけで粘着部材の粘着表面が同時に配置される。
従って、全体構造を更に簡素化することができる。
その結果、変形膜とは別個に粘着部材を切り貼りする必要がないため、低コストで短時間に製造できて、大量生産に向いている。
更に、粘着部材の粘着表面を変形膜の表面と面一状に一体形成した場合には、これら粘着表面と変形膜の表面との間に段差が発生しないため、基板貼り合わせ機に用いて一対の基板を貼り合わせると、これら基板同士を歪みなく均一に圧着することができるだけでなく、その他の悪影響を最小に抑えることができる。
In addition to the effect of the invention of claim 1 or 2, the invention of claim 3 is merely provided by covering the substrate side of the holding plate with the deformation film by disposing the adhesive surface of the adhesive member on a part of the deformation film. The adhesive surface of the adhesive member is disposed at the same time.
Therefore, the overall structure can be further simplified.
As a result, it is not necessary to cut and paste the adhesive member separately from the deformable film, so that it can be manufactured at a low cost in a short time and is suitable for mass production.
Further, when the adhesive surface of the adhesive member is integrally formed with the surface of the deformable film, there is no step between the adhesive surface and the surface of the deformable film. When these substrates are bonded together, not only can these substrates be uniformly bonded without distortion, but also other adverse effects can be minimized.
請求項4の発明は、請求項2または3の発明の効果に加えて、板状体の一部に通気孔を開設し、この通気孔から基板の裏面を吸引吸着することにより、粘着部材による粘着保持と真空吸着による保持と併用される。
従って、吸引用配管系や吸引制御を容易に実現しながら基板を確実に保持することができる。
According to the invention of claim 4, in addition to the effect of the invention of claim 2 or 3, an air hole is formed in a part of the plate-like body, and the back surface of the substrate is sucked and adsorbed from the air hole, thereby using the adhesive member. Used in combination with adhesive holding and holding by vacuum suction.
Therefore, the substrate can be reliably held while easily realizing the suction piping system and suction control.
本発明の粘着チャック装置が、液晶ディスプレー(LCD)パネルなどのガラス基板を粘着保持して貼り合わせる基板貼り合わせ機に配備された場合を示す。
この基板貼り合わせ機は、図1〜図6に示す如く、上下に配置された保持板1,2の平行に対向する保持面1a,2aに二枚のガラス製基板A,Bを夫々保持させ、それらの周囲に区画形成された閉空間S内が所定の真空度に達してから、上下保持板1,2を相対的にXYθ方向へ調整移動し、基板A,B同士の位置合わせが行われ、その後、上保持板1の保持面1aから上基板Aを強制的に剥離して下基板B上の環状接着剤(シール材)Cへ瞬間的に圧着することにより、両者間を封止して重ね合わせ、その後は、両基板A,Bの内外に生じる気圧差で両基板A,Bの間を所定のギャップまで加圧するものである。
The case where the adhesive chuck device of the present invention is provided in a substrate laminating machine for adhering and holding a glass substrate such as a liquid crystal display (LCD) panel is shown.
In this substrate bonding machine, as shown in FIGS. 1 to 6, two glass substrates A and B are respectively held on holding surfaces 1a and 2a which are parallelly opposed to holding plates 1 and 2 arranged vertically. Then, after the inside of the closed space S defined and formed around them reaches a predetermined degree of vacuum, the upper and lower holding plates 1 and 2 are relatively moved in the XYθ directions so that the substrates A and B are aligned with each other. After that, the upper substrate A is forcibly peeled off from the holding surface 1a of the upper holding plate 1 and sealed between the two by instantaneously pressing the ring adhesive (sealing material) C on the lower substrate B. After that, the two substrates A and B are pressurized to a predetermined gap by a pressure difference generated inside and outside the substrates A and B.
詳しく説明すれば、上下保持板1,2が昇降手段(図示せず)でZ方向へ相対的に移動可能に支持され、これら上下保持板1,2を上下方向へ離した状態で、夫々の保持面1a,2aに基板A,Bがセットされ、その後、この昇降手段の作動により上下保持板1,2を接近させることにより閉空間Sが区画形成される。  More specifically, the upper and lower holding plates 1 and 2 are supported by an elevating means (not shown) so as to be relatively movable in the Z direction, and the upper and lower holding plates 1 and 2 are separated in the vertical direction. Substrates A and B are set on the holding surfaces 1a and 2a, and then the closed space S is defined by bringing the upper and lower holding plates 1 and 2 closer by operating the elevating means.
そして、この閉空間Sから吸気手段(図示せず)の作動により、空気を抜いて所定の真空度に達したところで、水平移動手段(図示せず)の作動により、上下保持板1,2のどちらか一方を他方に対しXYθ方向へ調整移動させることで、それらに保持された基板A,B同士の位置合わせ(アライメント)として粗合わせと微合わせが順次行われる。  Then, when the air is drawn from the closed space S by the operation of the intake means (not shown) to reach a predetermined vacuum level, the upper and lower holding plates 1 and 2 are operated by the operation of the horizontal moving means (not shown). By adjusting and moving one of the substrates in the XYθ direction with respect to the other, rough alignment and fine alignment are sequentially performed as alignment (alignment) between the substrates A and B held by them.
これらの位置合わせが完了して上下基板A,Bを重ね合わせた後は、閉空間S内に空気や窒素を供給して、該閉空間S内の雰囲気を大気圧に戻すことにより、両基板A,Bの内外に生じる気圧差で均等に加圧され、液晶が封入された状態で所定のギャップまで押し潰れて製品を完成させている。  After these alignment is completed and the upper and lower substrates A and B are overlapped, both substrates are supplied by supplying air or nitrogen into the closed space S and returning the atmosphere in the closed space S to atmospheric pressure. Pressure is evenly applied by the pressure difference generated inside and outside of A and B, and the product is completed by being crushed to a predetermined gap while liquid crystal is sealed.
更に、前記保持板1,2の基板側に、本発明の粘着チャック装置を備えている。
詳しく説明すれば、図1、図3及び図5に示す如く、上下保持板1,2の基板側である保持面1a,2aのどちらか一方か又は両方に、基板A,Bの裏面A1,B1と対向して粘着保持する粘着部材3,3′と、該基板側の保持面1a,2aと交差する方向へ出没変形可能な変形膜4とを設け、この変形膜4の出没(凹凸)変形で粘着部材3,3′の粘着表面3a,3a′と基板A,Bを当接させて粘着すると共に、これら両者を強制的に引き離すことにより、粘着部材3の粘着表面3a,3a′から基板A,Bが無理なく剥離されるようにしている。
以下、本発明の各実施例を図面に基づいて説明する。
Furthermore, the adhesive chuck device of the present invention is provided on the substrate side of the holding plates 1 and 2.
More specifically, as shown in FIGS. 1, 3, and 5, the back surface A1, B of the substrates A, B is provided on one or both of the holding surfaces 1a, 2a on the substrate side of the upper and lower holding plates 1, 2. Adhesive members 3 and 3 ′ that are adhesively held opposite to B 1 and a deformable film 4 that can be deformed in and out in a direction intersecting the holding surfaces 1 a and 2 a on the substrate side are provided. The adhesive surfaces 3a and 3a 'of the adhesive members 3 and 3' are brought into contact with the substrates A and B by the deformation, and the two are forcibly separated from each other so that they are separated from the adhesive surfaces 3a and 3a 'of the adhesive member 3. The substrates A and B are peeled off without difficulty.
Embodiments of the present invention will be described below with reference to the drawings.
この実施例1は、図1〜図2に示す如く、上下保持板1,2が例えば金属やセラミックスなどの剛体で歪み(撓み)変形しない厚さの平板状に形成された定盤であり、これらのうち上保持板1の基板側のみを、複数の粘着部材3と複数の変形膜(加圧膜)4からなる板状体4′で覆い、これら変形膜4を該上保持板1の基板側から加圧で突出(凸状)変形させることにより、粘着部材3の粘着表面3aから上基板Aを強制的に引き離して剥離する場合を示すものである。  As shown in FIGS. 1 to 2, the first embodiment is a surface plate in which the upper and lower holding plates 1 and 2 are formed in a flat plate shape having a thickness that does not deform (bend) with a rigid body such as metal or ceramics. Of these, only the substrate side of the upper holding plate 1 is covered with a plate-like body 4 ′ composed of a plurality of adhesive members 3 and a plurality of deformation films (pressure films) 4, and these deformation films 4 are covered by the upper holding plate 1. The case where the upper substrate A is forcibly separated from the pressure-sensitive adhesive surface 3a of the pressure-sensitive adhesive member 3 and peeled off by projecting (convex) deformation under pressure from the substrate side is shown.
この上保持板1の保持面1aには、複数か又は単数の凹部1bを凹設し、この凹部1bと例えば真空ポンプやコンプレッサなどの吸気源(図示せず)とを通気路1cで連絡して、該吸気源の作動により凹部1b内の気体を外部へ給排気させ、上記凹部1bの周囲に粘着部材3を着脱自在に固着すると共に、凹部1bの開口を変形膜4で被蓋している。  The holding surface 1a of the upper holding plate 1 is provided with a plurality of or a single concave portion 1b, and the concave portion 1b is connected to an intake source (not shown) such as a vacuum pump or a compressor through an air passage 1c. Then, the gas in the recess 1b is supplied and exhausted by the operation of the intake source, the adhesive member 3 is detachably fixed around the recess 1b, and the opening of the recess 1b is covered with the deformation film 4. Yes.
図示例では図2に示す如く、上保持板1の保持面1aに、概ね等間隔毎に配置された隔壁1dを介して円形の凹部1bが多数凹設され、これら全ての凹部1bの開口を一枚の変形膜4で夫々密閉状に覆い、この変形膜4で上記隔壁1dの先端面と対応する位置に、該変形膜4の表面に重ねて、円環状の粘着部材3を固着している。  In the illustrated example, as shown in FIG. 2, a large number of circular recesses 1b are formed on the holding surface 1a of the upper holding plate 1 through partition walls 1d arranged at approximately equal intervals, and the openings of all these recesses 1b are formed. Each of the deformation films 4 is hermetically covered, and the deformation film 4 is overlapped on the surface of the deformation film 4 at a position corresponding to the front end surface of the partition wall 1d, and the annular adhesive member 3 is fixed. Yes.
この粘着部材3は、例えばシリコン系、アクリル系やフッ素系などの粘着材料からなる粘着シートであり、その粘着表面3aを後述する変形膜4と可能な限り接近させて配置することが望ましく、更に該粘着表面3aの面積を、上基板Aが吊持可能な粘着力を有する範囲内で小さく設定すると共に、粘着部材3を簡単に貼り替え可能に取り付けることが望ましい。  The pressure-sensitive adhesive member 3 is a pressure-sensitive adhesive sheet made of, for example, a silicon-based, acrylic-based, or fluorine-based pressure-sensitive adhesive material, and it is desirable that the pressure-sensitive adhesive surface 3a be disposed as close as possible to the deformation film 4 described later. It is desirable that the area of the adhesive surface 3a is set to be small within a range where the upper substrate A has an adhesive force that can be suspended, and the adhesive member 3 is attached so that it can be easily replaced.
図示例の場合には、前記ガラス製基板Aと接触する粘着部材3の粘着表面3aの粘着力を、上保持板1の保持面1a側に配置された変形膜4と接触する固着裏面3bの粘着力より弱くして、基板Aとの粘着時にその重量で、保持面1a側から粘着部材3は剥離しないが、必要に応じて粘着部材3はいつでも変形膜4の表面から剥離可能にしている。  In the case of the illustrated example, the adhesive force of the adhesive surface 3a of the adhesive member 3 that comes into contact with the glass substrate A is applied to the fixed back surface 3b that comes into contact with the deformation film 4 arranged on the holding surface 1a side of the upper holding plate 1. The adhesive member 3 is weaker than the adhesive force and does not peel from the holding surface 1a by its weight when sticking to the substrate A, but the adhesive member 3 can be peeled from the surface of the deformation film 4 at any time as necessary. .
そして、前記板状体4′及び変形膜4は、例えばステンレスなどの金属製薄板か又はゴムやエンジニアリング−プラスチックなどの合成樹脂か或いはその以外の弾性材料で成型されたシートからなる弾性変形可能なダイヤフラムであり、隔壁1dの先端面に対して例えば電子ビーム溶接などの溶着か又は接着材などにより接着され、上記通気路1cを介して各凹部1b内から気体を外部へ排気することで、該変形膜4を各凹部1b内へ凹むように撓み変形させ、これと逆に各凹部1b内へ外部から気体を供給することで、該変形膜4を各凹部1bの開口から突出するように撓み変形させている。  The plate-like body 4 ′ and the deformable film 4 are elastically deformable, for example, made of a metal thin plate such as stainless steel, a synthetic resin such as rubber or engineering plastic, or a sheet molded with other elastic materials. A diaphragm, which is bonded to the front end surface of the partition wall 1d by, for example, electron beam welding or an adhesive, and exhausts gas from the inside of each recess 1b through the air passage 1c. The deformation film 4 is bent and deformed so as to be recessed into each recess 1b, and conversely, by supplying gas from the outside into each recess 1b, the deformation film 4 is bent so as to protrude from the opening of each recess 1b. It is deformed.
更に、上記板状体4′の取り付け方法は、上述した溶着や接着材による接着に限定されず、例えば各凹部1b間の隔壁1dに対し抑え板(図示せず)をネジなどの固定手段で取り付け、これら隔壁1dの先端面と抑え板との間に該板状体4′を着脱自在に挟持しても良い。  Further, the attachment method of the plate-like body 4 'is not limited to the above-mentioned welding or adhesion by an adhesive material. For example, a holding plate (not shown) is fixed to the partition 1d between the recesses 1b by a fixing means such as a screw. The plate-like body 4 ′ may be detachably sandwiched between the front end face of the partition wall 1 d and the holding plate.
また必要に応じて、上記変形膜4には図2に示す如く、各凹部1bの略中心と対応する位置に、小孔4aを夫々貫通開穿しても良い。  If necessary, small holes 4a may be formed through the deformable membrane 4 at positions corresponding to the approximate centers of the recesses 1b as shown in FIG.
次に、斯かる基板貼り合わせ機の作動について説明する。
先ず、図1(a)に示す如く、上下保持板1,2が上下方向へ離れた状態で、夫々の保持面1a,2aに上下基板A,Bをセットするが、この際、上保持板1の保持面1aに形成された凹部1b内を真空引きして減圧することにより、変形膜4を凹状に撓ませる。
Next, the operation of such a substrate bonding machine will be described.
First, as shown in FIG. 1A, the upper and lower substrates A and B are set on the respective holding surfaces 1a and 2a with the upper and lower holding plates 1 and 2 being separated in the vertical direction. The deformation film 4 is bent into a concave shape by evacuating and depressurizing the inside of the concave portion 1b formed on the holding surface 1a.
この状態で、基板搬送用ロボット(図示せず)により上基板Aが移送され、その裏面A1を上保持板1の保持面1aへ向け移動して、粘着部材3の粘着表面3aに所定圧力で接触させれば、該粘着表面3aの粘着力によって上基板Aが保持される。  In this state, the upper substrate A is transferred by a substrate transfer robot (not shown), the rear surface A1 is moved toward the holding surface 1a of the upper holding plate 1, and the adhesive surface 3a of the adhesive member 3 is applied with a predetermined pressure. If contact is made, the upper substrate A is held by the adhesive force of the adhesive surface 3a.
また、図2に示す如く、変形膜4に各凹部1bと対応して小孔4aを開穿した場合には、これら小孔4aから真空吸引すれば、上基板Aが更に強く吸着保持される。  As shown in FIG. 2, when the small holes 4a are opened in the deformation film 4 corresponding to the respective recesses 1b, the upper substrate A is more strongly adsorbed and held by vacuum suction from these small holes 4a. .
その後、図1(b)に示す如く、上下保持板1,2が接近して閉空間S内が所定の真空度に達してから、上下保持板1,2のどちらか一方を他方に対してXYθ方向へ調整移動して、それらに保持された基板A,B同士の位置合わせが行われる  Thereafter, as shown in FIG. 1B, after the upper and lower holding plates 1 and 2 approach and the inside of the closed space S reaches a predetermined degree of vacuum, one of the upper and lower holding plates 1 and 2 is made to the other. Adjusting and moving in the XYθ direction, the substrates A and B held by them are aligned.
この位置合わせが完了してから、図1(c)に示す如く、上保持板1の保持面1aに形成された凹部1b内に気体を導入して、変形膜4をその背面側から加圧して凸状に撓ませ、その先端を粘着部材3の粘着表面3aよりも突出させる。  After this alignment is completed, as shown in FIG. 1 (c), gas is introduced into the recess 1b formed in the holding surface 1a of the upper holding plate 1, and the deformation membrane 4 is pressurized from the back side. The tip of the adhesive member 3 is made to protrude beyond the adhesive surface 3 a of the adhesive member 3.
それにより、粘着部材3の粘着表面3aに粘着保持された上基板Aが強制的に引き離されて、粘着部材3の粘着表面3aから上基板Aを無理なく剥離すると同時に、これら変形膜4の突出圧力で該上基板Aを下基板B上の環状接着剤Cに押し付けて重ね合わせる。  As a result, the upper substrate A that is adhesively held on the adhesive surface 3a of the adhesive member 3 is forcibly separated, and the upper substrate A is peeled off from the adhesive surface 3a of the adhesive member 3 without difficulty. The upper substrate A is pressed against the annular adhesive C on the lower substrate B by pressure so as to overlap each other.
この際、変形膜4に小孔4aを開穿した場合には、これら小孔4aから上基板Aの裏面A1へ例えば窒素ガスなどの気体を噴き出すことで、該粘着部材3の粘着表面3aから上基板Aを強制的に剥離して下基板B上の環状接着剤Cへ瞬間的に圧着し、両者間が封止される。
従って、ガラス製の上下基板A,Bを歪みなく真空中で均一に基板A,B同士を圧着することができ、その加圧力も容易に変えることができる。
At this time, when the small holes 4 a are opened in the deformation film 4, for example, a gas such as nitrogen gas is blown from the small holes 4 a to the back surface A 1 of the upper substrate A, so that the pressure from the adhesive surface 3 a of the adhesive member 3. The upper substrate A is forcibly peeled off and instantaneously pressure-bonded to the annular adhesive C on the lower substrate B, and the space between the two is sealed.
Therefore, the upper and lower substrates A and B made of glass can be uniformly bonded to each other in a vacuum without distortion, and the pressing force can be easily changed.
そして、上保持板1の基板側を、複数の粘着部材3と複数の変形膜4からなる板状体4′で覆ったため、上基板Aの複数箇所が同時に粘着保持されると共に、同時剥離が可能となり、上基板Aが大型であっても確実に保持と剥離ができる。  And since the board | substrate side of the upper holding plate 1 was covered with the plate-shaped body 4 'which consists of the some adhesive member 3 and the some deformation | transformation film | membrane 4, several places of the upper board | substrate A are adhesively held simultaneously, and simultaneous peeling is carried out. Thus, even if the upper substrate A is large, it can be reliably held and peeled off.
更に、上記粘着部材3と変形膜4とを可能な限り接近させて配置したため、変形膜4の突出圧力で粘着表面3aからガラス製の上基板Aを引き剥がす時に、上基板Aの一部が大きく撓むことがなく、これによって位置合わせが完了した上下基板A,Bに位置ズレが生じたり、液晶を封止する環状接着剤Cが切れたりするという不具合が発生しない。  Furthermore, since the adhesive member 3 and the deformable film 4 are arranged as close as possible, when the glass upper substrate A is peeled off from the adhesive surface 3a by the protruding pressure of the deformable film 4, a part of the upper substrate A is removed. It does not bend greatly, and this does not cause a problem that the upper and lower substrates A and B that have been aligned are not displaced and the annular adhesive C that seals the liquid crystal is cut off.
また、粘着部材3の面積を小さく設定したため、粘着表面3aからガラス製の上基板Aを引き剥がす時に、大きな力が必要とならず、ガラスの破壊などの事故が防止されると共に、粘着部材3を簡単に貼り替え可能に取り付けたため、繰り返して上基板Aの粘着接触と離隔を行うことによって異物の付着や粘着力の低下が懸念されるものの、その際には粘着部材3を貼り替えることで解消される。  In addition, since the area of the adhesive member 3 is set to be small, a large force is not required when the glass upper substrate A is peeled off from the adhesive surface 3a, and an accident such as glass breakage is prevented. Is attached so that it can be easily pasted, so that repeated adhesion and separation of the upper substrate A may cause adhesion of foreign matter and a decrease in adhesive strength. It will be resolved.
この実施例2は、図3〜図4に示す如く、前記上保持板1の保持面1aに形成された隔壁1dから粘着部材3及び変形膜4に亘って、複数の通気孔1eを貫通状に開設し、これら通気孔1eと例えば真空ポンプやコンプレッサなどの吸気源(図示せず)とを連絡する通気路1fを、前記凹部1bの通気路1cと別系統で形成した構成が、前記図1〜図2に示した実施例1とは異なり、それ以外の構成は図1〜図2に示した実施例1と同じものである。  In the second embodiment, as shown in FIGS. 3 to 4, a plurality of air holes 1 e are penetrated from the partition wall 1 d formed on the holding surface 1 a of the upper holding plate 1 to the adhesive member 3 and the deformation film 4. The air passage 1f that connects the air holes 1e and an air intake source (not shown) such as a vacuum pump or a compressor is formed separately from the air passage 1c of the recess 1b. Unlike the first embodiment shown in FIGS. 1 and 2, the other configuration is the same as that of the first embodiment shown in FIGS.
上記構成により、図3(a)に示す如く、上保持板1の保持面1aに上基板Aをセットする際に通気孔1eから吸引することで、上基板Aが更に強い力で吸着保持され、また図3(c)に示す如く、基板A,B同士の位置合わせ後の剥離時に、通気孔1eから例えば圧縮空気や窒素ガスなどの気体を噴き出すことにより、粘着部材3の粘着表面3aから上基板Aを更に強い力で強制的に剥離して下基板B上の環状接着剤Cへ瞬間的に圧着させる。
その結果、図3〜図4に示す実施例2は、上述した図1〜図2に示した実施例1と同様な作用効果が得られ、更に実施例1の粘着部材3による上基板Aの粘着保持に加えて、通気孔1eからの吸引による上基板Aの真空吸着保持が追加されるため、吸引用配管系などの構成や吸引制御の実現が容易でありながら上基板Aを更に確実に保持できると共に、変形膜4の突出加圧ムラによる上基板Aの位置ズレを完全に防止できるという利点がある。
With the above configuration, as shown in FIG. 3A, when the upper substrate A is set on the holding surface 1a of the upper holding plate 1, the upper substrate A is sucked and held with a stronger force by suction from the vent hole 1e. Further, as shown in FIG. 3C, at the time of peeling after alignment between the substrates A and B, a gas such as compressed air or nitrogen gas is blown out from the vent hole 1e, so that the adhesive surface 3a of the adhesive member 3 is ejected. The upper substrate A is forcibly peeled off with a stronger force and is instantaneously pressed against the annular adhesive C on the lower substrate B.
As a result, in Example 2 shown in FIGS. 3 to 4, the same effect as that of Example 1 shown in FIGS. 1 to 2 described above can be obtained, and the upper substrate A by the adhesive member 3 of Example 1 can be obtained. In addition to holding the adhesive, vacuum suction holding of the upper substrate A by suction from the vent hole 1e is added, so that the configuration of the suction piping system and the like and the suction control can be easily realized, but the upper substrate A is more reliably secured. There is an advantage that the upper substrate A can be completely prevented from being displaced due to uneven pressing and unevenness of the deformation film 4 while being held.
この実施例3は、図5〜図6に示す如く、上述した円環状の粘着部材3に代えて、前記変形膜4の一部に粘着部材3′を配設することで、複数の変形膜4と粘着部材3′からなる板状体4″が構成され、この板状体4″で上保持板1の基板側を覆うと共に、これら変形膜4をフラットにした状態で、該粘着部材3′の粘着表面3a′を上基板Aに当接させて粘着保持し、また変形膜4を該上保持板1の基板側の減圧で没入(凹状)変形させることにより、粘着部材3′の粘着表面3a′を上基板Aから強制的に引き離して剥離する構成が、前記図1〜図2に示した実施例1及び図3〜図4に示した実施例2とは異なり、それ以外の構成は図1〜図2に示した実施例1及び図3〜図4に示した実施例2と同じものである。  As shown in FIGS. 5 to 6, the third embodiment replaces the annular adhesive member 3 described above with a plurality of deformation membranes by disposing an adhesive member 3 ′ in a part of the deformation membrane 4. 4 and an adhesive member 3 ′ are formed. The plate-like body 4 ″ covers the substrate side of the upper holding plate 1, and the adhesive film 3 is flat with the deformation film 4 being flat. The adhesive surface 3a 'is brought into contact with the upper substrate A to be adhesively held, and the deformable film 4 is immersed (recessed) by pressure reduction on the substrate side of the upper holding plate 1 to thereby adhere the adhesive member 3'. Unlike the first embodiment shown in FIGS. 1 and 2 and the second embodiment shown in FIGS. 3 to 4, the configuration in which the surface 3 a ′ is forcibly separated from the upper substrate A and peeled is different. These are the same as Example 1 shown in FIGS. 1 to 2 and Example 2 shown in FIGS.
上記変形膜4の一部に粘着部材3′を配設する方法としては、弾性材料からなる変形膜4を表面処理するか又はそれに類似する加工を行うことにより、その表面の所望箇所のみに粘着表面3a′を、該変形膜4の表面と面一状に一体形成するか又は一体的に設けて、板状体4″としている。
この板状体4″の形状は、図示した平坦な板状に限定されず、上保持板1の保持面1aに形成された凹部1b内へ向けて変形膜4を部分的に凹ませるなど、完全な平板状でなくても良い。
As a method of disposing the adhesive member 3 ′ on a part of the deformation film 4, the deformation film 4 made of an elastic material is surface-treated or a similar process is performed so that only the desired portion of the surface is adhered. The surface 3a ′ is formed integrally with or integrally with the surface of the deformation film 4 to form a plate-like body 4 ″.
The shape of the plate-like body 4 ″ is not limited to the illustrated flat plate shape, and the deformation film 4 is partially recessed into the concave portion 1b formed in the holding surface 1a of the upper holding plate 1, etc. It does not have to be completely flat.
図示例の場合には、上記変形膜4の略中心位置に円形状の粘着表面3a′を部分的に一体形成しているが、上基板Aの裏面A1を確実に保持できれば、それ以外の形状にすることも可能である。
更に図示例では、上述した小孔4aを変形膜4に開穿していないが、必要に応じて前記実施例1の図2や実施例2の図4に示したものと同様に、粘着部材3′の略中心位置に小孔4aを夫々貫通開穿することも可能である。
In the case of the illustrated example, the circular adhesive surface 3a 'is partially formed integrally at the substantially central position of the deformation film 4. However, if the back surface A1 of the upper substrate A can be securely held, other shapes are possible. It is also possible to make it.
Further, in the illustrated example, the small hole 4a described above is not opened in the deformable membrane 4, but if necessary, the adhesive member is similar to that shown in FIG. 2 of the first embodiment and FIG. 4 of the second embodiment. It is also possible to penetrate the small holes 4a at substantially the center position of 3 '.
上記構成により、図5(a)及び図5(b)に示す如く、上保持板1の保持面1aに形成された凹部1b内に気体を導入し、変形膜4をその背面側から加圧して凸状に撓ませることにより、粘着部材3′の粘着表面3a′を上基板Aに当接させれば、その粘着力によって上基板Aが保持される。  With the above configuration, as shown in FIGS. 5A and 5B, gas is introduced into the recess 1b formed in the holding surface 1a of the upper holding plate 1, and the deformation film 4 is pressurized from the back side. If the adhesive surface 3a ′ of the adhesive member 3 ′ is brought into contact with the upper substrate A by being bent into a convex shape, the upper substrate A is held by the adhesive force.
上下基板A,Bの重ね合わせた後に閉空間S内の雰囲気を大気圧に戻してから、図5(c)に示す如く、凹部1b内を真空引きして減圧させるなどの減圧駆動により、変形膜4を凹状に撓ませて粘着部材3′の粘着表面3a′を凹部1b内に没入させれば、粘着表面3a′が上基板Aから強制的に引き離される。
これと同時に、通気孔1eから例えば圧縮空気や窒素ガスなどの気体を噴き出せば、粘着部材3′の粘着表面3a′から上基板Aを更に強い力で強制的に剥離できる。
After the upper and lower substrates A and B are superposed, the atmosphere in the closed space S is returned to atmospheric pressure, and then deformed by a decompression drive such as evacuating and decompressing the interior of the recess 1b as shown in FIG. 5 (c). The adhesive surface 3a 'is forcibly separated from the upper substrate A by bending the film 4 into a concave shape and immersing the adhesive surface 3a' of the adhesive member 3 'into the recess 1b.
At the same time, if a gas such as compressed air or nitrogen gas is ejected from the vent 1e, the upper substrate A can be forcibly separated from the adhesive surface 3a 'of the adhesive member 3' with a stronger force.
その結果、図5〜図6に示す実施例3は、上述した図1〜図2に示した実施例1や図3〜図4に示す実施例2と同様な作用効果が得られ、更に変形膜4の一部に粘着部材3′の粘着表面3a′を配設したので、上保持板1の基板側である保持面1a及び凹部1b全体を板状体4′で覆うだけで粘着部材3′の粘着部材3′が同時に配置され、それにより粘着チャック装置の全体構造が更に簡素化され、実施例1や実施例2のように変形膜4とは別個に粘着部材3を切り貼りする必要がないから低コストで短時間に製造できるという利点がある。  As a result, the third embodiment shown in FIGS. 5 to 6 has the same effects as those of the first embodiment shown in FIGS. 1 and 2 and the second embodiment shown in FIGS. Since the adhesive surface 3 a ′ of the adhesive member 3 ′ is disposed on a part of the film 4, the adhesive member 3 simply covers the holding surface 1 a and the recess 1 b on the substrate side of the upper holding plate 1 with the plate-like body 4 ′. The 'adhesive member 3' is arranged at the same time, thereby further simplifying the overall structure of the adhesive chuck device, and the adhesive member 3 needs to be cut and pasted separately from the deformable film 4 as in the first and second embodiments. There is an advantage that it can be manufactured at a low cost in a short time.
また、粘着部材3′の粘着表面3a′を表面処理などで変形膜4の表面と面一状に一体形成した場合には、これら粘着表面3a′と変形膜4の表面との間に段差が発生しないため、上下基板A,Bの貼り合わせ時において、これら基板A,B同士を歪みなく均一に圧着することができるだけでなく、その他の悪影響を最小に抑えることができるという利点がある。  Further, when the adhesive surface 3a ′ of the adhesive member 3 ′ is integrally formed with the surface of the deformable film 4 by surface treatment or the like, there is a step between the adhesive surface 3a ′ and the surface of the deformable film 4. Therefore, when the upper and lower substrates A and B are bonded together, there is an advantage that not only these substrates A and B can be uniformly bonded without distortion but also other adverse effects can be minimized.
尚、本発明の粘着チャック装置が、液晶ディスプレー(LCD)パネルなどのガラス基板を粘着保持して貼り合わせる基板貼り合わせ機に配備される場合を示したが、これに限定されず、この基板貼り合わせ機以外の基板組立装置や、基板を搬送する基板搬送装置に配備したり、LCDパネル用ガラス基板以外の基板を粘着保持しても良い。
更に、真空中で基板A,Bを貼り合わせる基板貼り合わせ機を説明したが、これに限定されず、大気中で基板A,Bを貼り合わせる基板貼り合わせ機でも良く、この場合でも、上述した真空貼り合わせ機と同じ作用効果が得られる。
Although the case where the adhesive chuck device of the present invention is provided in a substrate laminating machine for adhering and holding a glass substrate such as a liquid crystal display (LCD) panel is shown, the present invention is not limited to this. You may arrange | position to board | substrate assembly apparatuses other than a matching machine, the board | substrate conveyance apparatus which conveys a board | substrate, and may adhere | attach and hold | maintain board | substrates other than the glass substrate for LCD panels.
Furthermore, although the board | substrate bonding machine which bonds the board | substrates A and B in the vacuum was demonstrated, it is not limited to this, The board | substrate bonding machine which bonds the board | substrates A and B in air | atmosphere may be sufficient. The same effect as a vacuum bonding machine can be obtained.
また、前示実施例では、上保持板1の基板側である保持面1aのみに粘着部材3と変形膜4を配置したが、これに限定されず、下保持板2の基板側である保持面2aにも同様に、下基板Bの裏面B1と対向して粘着保持する粘着部材3を固着すると共に、上下方向へ弾性変形可能な変形膜4を設けても良い。  Further, in the previous embodiment, the adhesive member 3 and the deformation film 4 are disposed only on the holding surface 1a that is the substrate side of the upper holding plate 1. However, the present invention is not limited to this, and the holding on the substrate side of the lower holding plate 2 is performed. Similarly, the adhesive member 3 that adheres and holds the opposite surface to the back surface B1 of the lower substrate B may be fixed to the surface 2a, and a deformation film 4 that is elastically deformable in the vertical direction may be provided.
また更に、上保持板1の保持面1aに円形の凹部1bを多数凹設し、これら全ての凹部1bの開口を一枚の板状体4′,4″で覆ったが、これに限定されず、凹部1bの形状を円形以外の形状に変えたり、各凹部1bを複数枚の変形膜4で別々に覆っても良い。  Further, a large number of circular recesses 1b are formed in the holding surface 1a of the upper holding plate 1 and the openings of all the recesses 1b are covered with a single plate-like body 4 ', 4 ". Instead, the shape of the recess 1b may be changed to a shape other than a circle, or each recess 1b may be separately covered with a plurality of deformation films 4.
[図1]本発明の粘着チャック装置の実施例1を示す部分的な縦断正面図であり、その作動工程を(a)〜(c)に示している。
[図2]図1の(2)−(2)線に沿える部分的な横断底面図である。
[図3]本発明の粘着チャック装置の実施例2を示す部分的な縦断正面図であり、その作動工程を(a)〜(c)に示している。
[図4]図3の(4)−(4)線に沿える部分的な横断底面図である。
[図5]本発明の粘着チャック装置の実施例3を示す部分的な縦断正面図であり、その作動工程を(a)〜(c)に示している。
[図6]図5の(6)−(6)線に沿える部分的な横断底面図である。
FIG. 1 is a partial longitudinal sectional front view showing Example 1 of an adhesive chuck device of the present invention, and its operation steps are shown in (a) to (c).
FIG. 2 is a partial transverse bottom view taken along line (2)-(2) in FIG.
[FIG. 3] It is a partial vertical front view showing Example 2 of the adhesive chuck device of the present invention, and its operation steps are shown in (a) to (c).
FIG. 4 is a partial transverse bottom view taken along line (4)-(4) in FIG.
FIG. 5 is a partial longitudinal sectional front view showing Embodiment 3 of the adhesive chuck device of the present invention, and its operation steps are shown in (a) to (c).
FIG. 6 is a partial transverse bottom view taken along line (6)-(6) in FIG.
符号の説明Explanation of symbols
A 基板(上基板) A1 裏面
B 基板(下基板) B1 裏面
C 環状接着剤 S 閉空間
1 上保持板(上定盤) 1a 基板側面(保持面)
1b 凹部 1c 通気路
1d 隔壁 1e 通気孔
1f 通気路 2 下保持板(下定盤)
2a 基板側面(保持面) 3,3′ 粘着部材
3a,3a′ 粘着表面 3b 固着裏面
4 変形膜 4a 小孔
4′,4″ 板状体
A substrate (upper substrate) A1 back surface B substrate (lower substrate) B1 back surface C annular adhesive S closed space 1 upper holding plate (upper surface plate) 1a substrate side surface (holding surface)
1b Concave part 1c Ventilation path 1d Partition 1e Vent hole 1f Ventilation path 2 Lower holding plate (lower surface plate)
2a Substrate side surface (holding surface) 3,3 'Adhesive member 3a, 3a' Adhesive surface 3b Adhering back surface 4 Deformed film 4a Small hole 4 ', 4 "Plate

Claims (4)

  1. 基板を保持板に対し、粘着で着脱自在に保持する粘着チャック装置において、
    前記保持板の基板側に、基板の裏面と対向して粘着保持する粘着部材と、該基板側面と交差する方向へ出没変形可能な変形膜とを設け、この変形膜の出没変形で粘着部材の粘着表面と基板を当接させて粘着すると共に、これら両者を強制的に引き離して剥離することを特徴とする粘着チャック装置。
    In the adhesive chuck device that holds the substrate detachably on the holding plate with adhesive,
    On the substrate side of the holding plate, there are provided an adhesive member that holds and holds the adhesive facing the back surface of the substrate, and a deformation film that can be deformed in and out in a direction intersecting the side surface of the substrate. An adhesive chuck device characterized in that an adhesive surface and a substrate are brought into contact with each other and adhered, and both of them are forcibly separated and separated.
  2. 前記粘着部材と変形膜を一体に形成した請求項1記載の粘着チャック装置。The adhesive chuck device according to claim 1, wherein the adhesive member and the deformation film are integrally formed.
  3. 前記変形膜の一部に粘着部材の粘着表面を配設した請求項1または2記載の粘着チャック装置。The pressure-sensitive adhesive chuck device according to claim 1, wherein a pressure-sensitive adhesive surface of a pressure-sensitive adhesive member is disposed on a part of the deformation film.
  4. 前記板状体の一部に通気孔を開設し、この通気孔から基板の裏面を吸引吸着した請求項2または3記載の粘着チャック装置。The pressure-sensitive adhesive chuck device according to claim 2 or 3, wherein a vent hole is formed in a part of the plate-like body, and the back surface of the substrate is sucked and adsorbed from the vent hole.
JP2006515325A 2004-04-09 2005-04-08 Adhesive chuck device Active JP3882004B2 (en)

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