CN109449100A - A kind of the flood tide transfer method and device of electronic component - Google Patents
A kind of the flood tide transfer method and device of electronic component Download PDFInfo
- Publication number
- CN109449100A CN109449100A CN201811204677.1A CN201811204677A CN109449100A CN 109449100 A CN109449100 A CN 109449100A CN 201811204677 A CN201811204677 A CN 201811204677A CN 109449100 A CN109449100 A CN 109449100A
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- 238000012546 transfer Methods 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000013013 elastic material Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 7
- 238000005411 Van der Waals force Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 2
- 238000012800 visualization Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000006194 liquid suspension Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000013404 process transfer Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A kind of flood tide transfer device of electronic component, including die bond weldering arm, flip weldering arm, additional physics field device and station；Respectively by being electrically connected in station, additional physics field device is respectively arranged at the two sides of die bond weldering arm and flip weldering arm for die bond weldering arm and flip weldering arm；Flip rotating electric machine is set to the side of flip both ends clamping device, flip both ends clamping device is set to the two sides of flip mandril, flip guide rail is set to flip mandril, flip bracket is movably arranged in flip guide rail, flip transfer head is set to flip bracket, and flip elastic material is set between adjacent flip bracket.It is an object of the invention to propose the flood tide transfer method and device of a kind of electronic component, apparatus of the present invention are simple, and efficiency improves a2C times, the spacing of electronic component is fully controllable and flood tide transfer is in target base plate, has great application value in field of semiconductor manufacture.
Description
Technical field
The present invention relates to field of semiconductor manufacture more particularly to the flood tide transfer methods and device of a kind of electronic component.
Background technique
Micro-LED is a kind of by LED structure microminiaturization and matrixing, each pixel is operated alone and addressing control
The display technology of system.Due to the brightness of Micro-LED technology, service life, contrast, reaction time, energy consumption, visible angle and resolution
The various indexs such as rate are superior to LCD and OLED technology, are considered as that the display technology of new generation of OLED and tradition LED can be surmounted.But
Be, due to extreme efficiency in encapsulation process, 99.9999% yields and it is 0.5 μm positive and negative within shift the needs of precision, and
It is tens of thousands of to millions of that Micro-LED component size, which is approximately less than 50 μm and number, therefore in Micro-LED industrialization
There is still a need for the flood tides that the core technology problem overcome is exactly Micro-LED component to shift (Mass in the process
Transfer) technology.For modern Ultraprecision Machining, flood tide transfer is tens of thousands of to hundreds of thousands Micro- from wafer
LED itself has been a huge challenge to substrate, and processing efficiency, yields and transfer precision not can guarantee more.
Micro-LED flood tide transfer method mainly has electrostatic force adsorption method, Van der Waals force transfer method, electromagnetic force at present
Adsorption method, the radium-shine laser ablation methods of patterning, fluid assembly method etc..The electrostatic force absorption that u s company LuxVue is proposed
Van der Waals force transfer method and TaiWan, China work that method, u s company X-Celeprint are proposed grind the electromagnetism of institute ITRI proposition
Flood tide Micro-LED is accurately adsorbed, is retransferred respectively by electrostatic force, Van der Waals force and electromagnetic force by power adsorption method
It is discharged to target substrate, and accurately.However, above-mentioned three kinds of methods can not solve on wafer in Micro-LED spacing and substrate
The problem that Micro-LED spacing does not wait.Radium-shine laser ablation methods laser lift-off Micro-LED directly from wafer is patterned,
But it is needed using expensive excimer laser.Fluid assembly method is rolled on substrate using brush bucket, so that Micro-LED
As in liquid suspension, LED is allowed to fall into the corresponding well on substrate by fluid force.However, the method have it is certain with
Machine is unable to ensure the yield of self assembly.
United States Patent (USP) US20180053742A1 proposes electronic device being adhered to temporary fixing layer, by expanding this temporarily
When property fixing layer changes LED spacing to being transferred on bearing substrate.Due to fixing layer temporary in the method laterally and
It is longitudinal to expand, it is difficult to ensure horizontal transfer precision is unable to satisfy the demanding flood tide transfer of transverse precision, and temporary solid
Given layer expansion multiple is limited, is unable to satisfy big horizontal spacing.The Micro-LED's that Chinese patent CN201711162098 is proposed
Flood tide transfer method is only shifted to the asymmetrical LED of upper lower edge, and uses the mold being pre-designed, Wu Faman
Sufficient electronic component spacing.
In conclusion at present still without the flood tide transfer method and device of a kind of electronic component, need it is further proposed that efficiently,
Feasible solution.
Summary of the invention
The purpose of the present invention is to solve the above problem proposes the flood tide transfer method and device of a kind of electronic component, overcomes
The prior art can not again in the target base plates such as panel or wafer flood tide shift fully controllable spacing Micro-LED difficulty
Topic.
In order to achieve this goal, the invention adopts the following technical scheme:
A kind of flood tide transfer method of electronic component, comprising the following steps:
Step 1, driving motion platform XY axis carry out machine vision alignment, and Z axis protects flip transfer head and Micro-LED
Certain distance is held, according to the substrate Micro-LED spacing of required crawl, applying external force by both ends clamping device makes elastic material
Expect longitudinal deformation, flip transfer head precisely aligns substrate Micro-LED, grabs substrate when applying positive voltage to flip transfer head
Micro-LED；
Step 2 overturns flip transfer head, while die bond transfer head clamps substrate Micro-LED, die bond transfer head up and down
LED is grabbed when imposing on positive voltage, flip transfer head unclamps LED when imposing on negative voltage；
Step 3, according to the Micro-LED spacing of required placement, the external force numerical value applied required for calculating changes bullet
Property material longitudinal deformation, target base plate Micro-LED spacing required for obtaining；
Step 4 drives target base plate motion platform, and the Micro-LED of die bond transfer head crawl is positioned at target position,
Die bond transfer head moves down into after target base plate and places LED when imposing on negative voltage；
Step 5 repeats step 1 to step 4, realizes the flood tide transfer of electronic component spacing-controllable.
More preferably, the flip transfer head and the die bond transfer head have dipolar configuration, crawl when imposing on positive voltage
LED places LED when imposing on negative voltage.
More preferably, the elastic material is the elastic polymer materials such as silicon rubber.
More preferably, the response time of the elastic material is 10-100ms.
More preferably, the flood tide transfer device of a kind of electronic component, including die bond weldering arm, flip weldering arm, additional physical field dress
It sets and station；
The die bond weldering arm and flip weldering arm are respectively by being electrically connected in the station, the additional physical field
Device is respectively arranged at the two sides of the die bond weldering arm and flip weldering arm；
The die bond weldering arm includes die bond both ends clamping device, die bond mandril, die bond guide rail, die bond bracket, die bond transfer
Head and die bond elastic material, die bond both ends clamping device are set to the two sides of the die bond mandril, and the die bond guide rail is set
It is placed in the die bond mandril, the die bond bracket is movably arranged at the die bond guide rail, and the die bond transfer head is set to
The die bond bracket, the die bond elastic material are set between the adjacent die bond bracket；
The flip weldering arm includes flip rotating electric machine, flip both ends clamping device, flip guide rail, flip mandril, flip
Bracket, flip transfer head and flip elastic material, the flip rotating electric machine are set to the one of flip both ends clamping device
Side, flip both ends clamping device are set to the two sides of the flip mandril, and the flip guide rail is set to the flip top
Bar, the flip bracket are movably arranged in the flip guide rail, and the flip transfer head is set to the flip bracket, described
Flip elastic material is set between the adjacent flip bracket.
More preferably, the additional physics field device is linear drive motor.
More preferably, the station includes visualization PLC screen and integrated PLC control system.
More preferably, the elastic force of the die bond elastic material is greater than clamping force when die bond both ends clamping device powers off,
The elastic force of the die bond elastic material is less than clamping force when die bond both ends clamping device is powered.
More preferably, the elastic force of the flip elastic material is greater than clamping force when flip both ends clamping device powers off,
The elastic force of the flip elastic material is less than clamping force when flip both ends clamping device is powered.
It is an object of the invention to propose the flood tide transfer method and device of a kind of electronic component, apparatus of the present invention are simple,
Efficiency improves a2C times, the spacing of electronic component is fully controllable and flood tide transfer is in target base plate, has in field of semiconductor manufacture
There is great application value.
Detailed description of the invention
Fig. 1 is the Micro-LED flood tide transfer process schematic three dimensional views of one embodiment of the present of invention；
Fig. 2 is the transfer head cross-sectional view of one embodiment of the present of invention；
Fig. 3 is the transfer head overturning and docking exchange cross-sectional view of one embodiment of the present of invention；
Fig. 4 is the schematic diagram of the transfer head alignment target substrate cross section of one embodiment of the present of invention；
Fig. 5 is the flexible cross-sectional view of transfer head of one embodiment of the present of invention；
Fig. 6 is that the transfer head of one embodiment of the present of invention places the schematic diagram of the cross section Micro-LED；
Fig. 7 is the transfer head of one embodiment of the present of invention far from the schematic diagram of target base plate cross section；
Fig. 8 is that the substrate Micro-LED of one embodiment of the present of invention is transferred process schematic top plan view；
Fig. 9 is that the substrate Micro-LED of one embodiment of the present of invention is transferred process schematic top plan view；
Figure 10 is that the substrate Micro-LED of one embodiment of the present of invention is transferred process schematic top plan view；
Figure 11 is that the substrate Micro-LED of one embodiment of the present of invention is transferred process schematic top plan view；
Wherein: Micro-LED11；Substrate 12；Target base plate 13；Die bond welds arm 2；Die bond both ends clamping device 21；Die bond
Mandril 22；Die bond guide rail 23；Die bond bracket 24；Die bond transfer head 25；Die bond elastic material 26；Flip welds arm 3；Flip electric rotating
Machine 31；Flip both ends clamping device 32；Flip guide rail 33；Flip mandril 34；Flip bracket 35；Flip transfer head 36；Flip bullet
Property material 37；Substrate Micro-LED spacing L1；Target base plate Micro-LED spacing L2；Crawl point spacing a；Elastic material shape
Longitudinal length c1 before becoming；Longitudinal length c2 after elastic material deformation.
Specific embodiment
With reference to the accompanying drawing and pass through specific embodiment mode to further illustrate the technical scheme of the present invention.
A kind of flood tide transfer method of electronic component, comprising the following steps:
Step 1, driving motion platform XY axis carry out machine vision alignment, and Z axis protects flip transfer head and Micro-LED
Certain distance is held, according to the substrate Micro-LED spacing of required crawl, applying external force by both ends clamping device makes elastic material
Expect longitudinal deformation, flip transfer head precisely aligns substrate Micro-LED, grabs substrate when applying positive voltage to flip transfer head
Micro-LED；
Step 2 overturns flip transfer head, while die bond transfer head clamps substrate Micro-LED, die bond transfer head up and down
LED is grabbed when imposing on positive voltage, flip transfer head unclamps LED when imposing on negative voltage；
Step 3, according to the Micro-LED spacing of required placement, the external force numerical value applied required for calculating changes bullet
Property material longitudinal deformation, target base plate Micro-LED spacing required for obtaining；
Step 4 drives target base plate motion platform, and the Micro-LED of die bond transfer head crawl is positioned at target position,
Die bond transfer head moves down into after target base plate and places LED when imposing on negative voltage；
Step 5 repeats step 1 to step 4, realizes the flood tide transfer of electronic component spacing-controllable.
As shown in figs. 1-11, the present invention provides a kind of flood tide transfer methods of electronic component, are substituted with elastic material former
There is the rigid structure between transfer head, according to the Micro-LED spacing of required crawl, elastic material is changed by additional physical field
Expect longitudinal deformation, to accurately grab substrate Micro-LED, after crawl, according to the Micro-LED spacing of required placement, leads to
It crosses additional physical field and changes elastic material longitudinal deformation, the accurate Micro-LED that places realizes electronic component spacing in target base plate
Fully controllable flood tide transfer.
Further description, the flip transfer head and the die bond transfer head have dipolar configuration, impose on positive voltage
When grab LED, place LED when imposing on negative voltage.
Further description, the elastic material are the elastic polymer materials such as silicon rubber.
Further description, the response time of the elastic material are 10-100ms.
Further description, a kind of flood tide transfer device of electronic component, including die bond weld arm 2, flip welds arm 3, outer
Add physics field device and station；
The die bond weldering arm 2 and flip weldering arm 3 are respectively by being electrically connected in the station, the additional physics
Field device is respectively arranged at the two sides of the die bond weldering arm 2 and flip weldering arm 3；
Die bond weldering arm 2 include die bond both ends clamping device 21, die bond mandril 22, die bond guide rail 23, die bond bracket 24,
Die bond transfer head 25 and die bond elastic material 26, die bond both ends clamping device 21 are set to the two of the die bond mandril 22
Side, the die bond guide rail 23 are set to the die bond mandril 22, and the die bond bracket 24 is movably arranged at the die bond and leads
Rail 23, the die bond transfer head 25 are set to the die bond bracket 24, and the die bond elastic material 26 is set to adjacent described solid
Between crystal holder frame 24；
The flip weldering arm 3 includes flip rotating electric machine 31, flip both ends clamping device 32, flip guide rail 33, flip top
Bar 34, flip bracket 35, flip transfer head 36 and flip elastic material 37, the flip rotating electric machine 31 are set to the flip
The side of both ends clamping device 32, flip both ends clamping device 32 is set to the two sides of the flip mandril 34, described to cover
Brilliant guide rail 33 is set to the flip mandril 34, and the flip bracket 35 is movably arranged in the flip guide rail 33, described to cover
Brilliant transfer head 36 is set to the flip bracket 35, the flip elastic material 37 be set to the adjacent flip bracket 35 it
Between.
As shown in figs. 1-11, this example proposes a kind of flood tide transfer device of electronic component, innovatively overcomes target base
This limitation that plate Micro-LED spacing can only depend on transfer head template spacing does not pass through elastic material and substitutes original transfer head
Between rigid structure, and by both ends clamping device change elastic material longitudinal deformation, realize electronic component spacing it is complete
Controllable flood tide transfer.Motion platform XY axis is driven to carry out machine vision alignment, Z axis makes the flip transfer head 36 in Micro-
50 μm above LED11, according to the affiliated substrate Micro-LED spacing L1 to be grabbed, flip both ends clamping device 32 applies
Clamping force keeps the flip elastic material 37 flexible, and the accurate aligning substrate Micro-LED of the flip transfer head 36 is covered to described
Brilliant transfer head 36 applies positive voltage and grabs substrate Micro-LED, and the response time of the flip elastic material 37 is 10-
100ms.The flip transfer head 36 is overturn, while the die bond transfer head 25 moves down, clamps substrate Micro-LED, it is described solid
Brilliant transfer head 25 applies positive voltage and grabs Micro-LED, and the flip transfer head 36 applies negative voltage and unclamps Micro-LED.Root
According to the Micro-LED11 spacing of required placement, the clamping force numerical value applied required for calculating changes the die bond elastic material
26 longitudinal deformations, longitudinal length is c1 before 26 deformation of die bond elastic material, and longitudinal length is c2 after deformation, required for obtaining
Target base plate 13 Micro-LED11 spacing be L2.Target base plate motion platform is driven, the die bond transfer head 25 grabs
Micro-LED11 be positioned at target position, the die bond transfer head 25 applies negative voltage after moving down into target base plate 13, puts
Set Micro-LED11.Aforesaid operations are repeated, realize the flood tide transfer of electronic component spacing-controllable.
Further description, the additional physics field device are linear drive motor.
Further description, the station include visualization PLC screen and integrated PLC control system.
The elastic force of further description, the die bond elastic material 26 is disconnected greater than die bond both ends clamping device 21
Clamping force when electric, the elastic force of the die bond elastic material 26 are less than clamping when die bond both ends clamping device 21 is powered
Power.
The elastic force of further description, the flip elastic material 37 is disconnected greater than flip both ends clamping device 32
Clamping force when electric, the elastic force of the flip elastic material 37 are less than clamping when flip both ends clamping device 32 is powered
Power.
The technical principle of the invention is described above in combination with a specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and shall not be construed in any way as a limitation of the scope of protection of the invention.Based on the explanation herein, the technology of this field
Personnel can associate with other specific embodiments of the invention without creative labor, these modes are fallen within
Within protection scope of the present invention.
Claims (9)
1. a kind of flood tide transfer method of electronic component, which comprises the following steps:
Step 1, driving motion platform XY axis carry out machine vision alignment, and Z axis makes flip transfer head and Micro-LED keep one
Set a distance, according to the substrate Micro-LED spacing of required crawl, applying external force by both ends clamping device keeps elastic material vertical
To deformation, flip transfer head precisely aligns substrate Micro-LED, grabs substrate Micro- when applying positive voltage to flip transfer head
LED；
Step 2 overturns flip transfer head, while die bond transfer head clamps substrate Micro-LED up and down, and die bond transfer head imposes on
LED is grabbed when positive voltage, flip transfer head unclamps LED when imposing on negative voltage；
Step 3, according to the Micro-LED spacing of required placement, the external force numerical value applied required for calculating changes elastic material
Expect longitudinal deformation, target base plate Micro-LED spacing required for obtaining；
Step 4, drives target base plate motion platform, and the Micro-LED of die bond transfer head crawl is positioned at target position, die bond
Transfer head moves down into after target base plate and places LED when imposing on negative voltage；
Step 5 repeats step 1 to step 4, realizes the flood tide transfer of electronic component spacing-controllable.
2. a kind of flood tide transfer method of electronic component according to claim 1, it is characterised in that: the flip transfer head
There is dipolar configuration with the die bond transfer head, grab LED when imposing on positive voltage, place LED when imposing on negative voltage.
3. a kind of flood tide transfer method of electronic component according to claim 1, it is characterised in that: the elastic material is
The elastic polymer materials such as silicon rubber.
4. a kind of flood tide transfer method of electronic component according to claim 1, it is characterised in that: the elastic material
Response time is 10-100ms.
5. the device of -4 flood tide transfer methods using electronic component according to claim 1, it is characterised in that: including die bond
Weld arm, flip weldering arm, additional physics field device and station；
The die bond weldering arm and flip weldering arm are respectively by being electrically connected in the station, the additional physics field device
It is respectively arranged at the two sides of the die bond weldering arm and flip weldering arm；
Die bond weldering arm include die bond both ends clamping device, die bond mandril, die bond guide rail, die bond bracket, die bond transfer head and
Die bond elastic material, die bond both ends clamping device are set to the two sides of the die bond mandril, and the die bond guide rail is set to
The die bond mandril, the die bond bracket are movably arranged at the die bond guide rail, and the die bond transfer head is set to described
Die bond bracket, the die bond elastic material are set between the adjacent die bond bracket；
Flip weldering arm include flip rotating electric machine, flip both ends clamping device, flip guide rail, flip mandril, flip bracket,
Flip transfer head and flip elastic material, the flip rotating electric machine are set to the side of flip both ends clamping device, institute
The two sides that flip both ends clamping device is set to the flip mandril are stated, the flip guide rail is set to the flip mandril, institute
It states flip bracket to be movably arranged in the flip guide rail, the flip transfer head is set to the flip bracket, the flip
Elastic material is set between the adjacent flip bracket.
6. a kind of flood tide transfer device of electronic component according to claim 5, it is characterised in that: the additional physical field
Device is linear drive motor.
7. a kind of flood tide transfer device of electronic component according to claim 5, it is characterised in that: the station includes
Visualize PLC screen and integrated PLC control system.
8. a kind of flood tide transfer device of electronic component according to claim 5, it is characterised in that: the die bond elasticity material
The elastic force of material is greater than clamping force when die bond both ends clamping device powers off, and the elastic force of the die bond elastic material is less than described
Clamping force when die bond both ends clamping device is powered.
9. a kind of flood tide transfer device of electronic component according to claim 5, it is characterised in that: the flip elasticity material
The elastic force of material is greater than clamping force when flip both ends clamping device powers off, and the elastic force of the flip elastic material is less than described
Clamping force when flip both ends clamping device is powered.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811204677.1A CN109449100B (en) | 2018-10-16 | 2018-10-16 | A kind of the flood tide transfer method and device of electronic component |
| PCT/CN2018/124562 WO2020077865A1 (en) | 2018-10-16 | 2018-12-28 | Method and device for transferring massive electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811204677.1A CN109449100B (en) | 2018-10-16 | 2018-10-16 | A kind of the flood tide transfer method and device of electronic component |
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| Publication Number | Publication Date |
|---|---|
| CN109449100A true CN109449100A (en) | 2019-03-08 |
| CN109449100B CN109449100B (en) | 2019-07-02 |
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| CN201811204677.1A Active CN109449100B (en) | 2018-10-16 | 2018-10-16 | A kind of the flood tide transfer method and device of electronic component |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109449100B (en) |
| WO (1) | WO2020077865A1 (en) |
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| CN110088920A (en) * | 2019-03-19 | 2019-08-02 | 京东方科技集团股份有限公司 | Transfer method and transfer device |
| CN110112091A (en) * | 2019-04-26 | 2019-08-09 | 清华大学深圳研究生院 | A kind of device of batch transferring plates bare die |
| CN110289240A (en) * | 2019-06-27 | 2019-09-27 | 上海天马微电子有限公司 | Electronic component flood tide transfer head and transfer method |
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| WO2020186456A1 (en) * | 2019-03-19 | 2020-09-24 | 京东方科技集团股份有限公司 | Transfer printing method and transfer printing apparatus |
| CN110088920B (en) * | 2019-03-19 | 2022-07-22 | 京东方科技集团股份有限公司 | Transfer method and transfer device |
| US11538786B2 (en) | 2019-03-19 | 2022-12-27 | Ordos Yuansheng Optoelectronics Co., Ltd. | Transfer printing method and transfer printing apparatus |
| CN110112091A (en) * | 2019-04-26 | 2019-08-09 | 清华大学深圳研究生院 | A kind of device of batch transferring plates bare die |
| CN110289240A (en) * | 2019-06-27 | 2019-09-27 | 上海天马微电子有限公司 | Electronic component flood tide transfer head and transfer method |
| CN110379761A (en) * | 2019-07-18 | 2019-10-25 | 京东方科技集团股份有限公司 | Micro- light emitting diode transfer base substrate and device |
| CN110379761B (en) * | 2019-07-18 | 2021-08-24 | 京东方科技集团股份有限公司 | Micro light-emitting diode transfer substrate and device |
| US11404399B2 (en) | 2019-07-18 | 2022-08-02 | Beijing Boe Display Technology Co., Ltd. | Chip transfer substrate, chip transfer device and chip transfer method |
| CN113937039A (en) * | 2021-12-16 | 2022-01-14 | 佛山市华道超精科技有限公司 | Chip mass transfer method and chip mass transfer equipment |
| CN113937039B (en) * | 2021-12-16 | 2022-02-25 | 佛山市华道超精科技有限公司 | Chip mass transfer method and chip mass transfer equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020077865A1 (en) | 2020-04-23 |
| CN109449100B (en) | 2019-07-02 |
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