CN101316777A - Workpiece transfer method and electro-static sucker device and substrate sticking method - Google Patents
Workpiece transfer method and electro-static sucker device and substrate sticking method Download PDFInfo
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- CN101316777A CN101316777A CNA2006800007517A CN200680000751A CN101316777A CN 101316777 A CN101316777 A CN 101316777A CN A2006800007517 A CNA2006800007517 A CN A2006800007517A CN 200680000751 A CN200680000751 A CN 200680000751A CN 101316777 A CN101316777 A CN 101316777A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
An electrostatic chuck device enabling even a thin work with low rigidity to be releasedly placed without causing deformation and displacement during the movement. An electrostatic chuck (2) is attached to a holding plate (1) by an attaching means (3). A work (A) is chucked and held by the attached electrostatic chuck (2). The electrostatic chuck (2) and the work (A) are integrally separated from the holding plate (1) by a separating means (4). Since the work (A) is not brought into a free state, it can be transferred to the release position without being affected by the gravity.; When only the electrostatic chuck (2) is re-attached to the holding plate (1) by the attaching means (3) after the electrostatic attracting function of the electrostatic chuck (2) is stopped, the electrostatic chuck (2) is separated from the surface of the work (A) moved to the release position, and the work (A) is left at the release position and placed.
Description
Technical field
The present invention relates to be included in the manufacturing process of flat-panel monitor such as Liquid Crystal Display (LCD) (LCD) or plasma scope (PDP) or flexible display for example glass substrates such as CF glass or TFT glass or by PES (Poly-Ether-Sulphone; Polyethersulfone) etc. the synthetic resin substrate detachable ground that constitutes of plastic sheeting keep and the base board delivery device of the workpiece (handled object) such as insulators such as substrate, electric conductor or semiconductor wafer that substrate assembling apparatus, the conveying of the substrate sticking machine pasted is such in employed Workpiece transfer method and electro-static sucker device, use its substrate sticking method.
Keep workpiece in particular to the electrostatic chuck absorption that is used as holding plate, decontrol the workpiece that keeps and be placed to the Workpiece transfer method of assigned position; The electro-static sucker device that keeps the electrostatic chuck of workpiece to constitute by holding plate and absorption; And the substrate sticking method of using it.
Background technology
In the past, as the substrate sticking machine that substrate is overlapping two, increased pressure board is the electrostatic chuck by the insulativity component set-up that is built-in with battery lead plate in inside, to remain on this increased pressure board as the glass substrate of workpiece, upper substrate and infrabasal plate after position alignment on the XY direction, by vacuum chamber is reduced pressure, in vacuum chamber, become required degree of vacuum, remove the electrostatic adherence function of increased pressure board, upper substrate is fallen on the infrabasal plate so that upper and lower base plate is overlapping, increased pressure board is descended, upper and lower base plate is pressurizeed, it is predetermined gap (for example, with reference to patent documentation 1) that both intervals are pasted.
In addition, with keep removing upper substrate (upside substrate) in linkage based on electrostatic chuck (electrostatic adherence parts), the back side one side ejection gas from this upper substrate, force to inject this gas up between the back side of the electrostatic adherence face of holding plate and upper substrate, thereby that destroys these electrostatic adherence faces and real estate is close to state so that both are peeled off, force to decay and eliminate between the two electrostatic attraction, and the pressure acceleration/accel that pressure applies the power of falling that is falls to infrabasal plate (downside substrate) with the gas that injects, in view of the above, this upper substrate is crimped on the infrabasal plate instantaneous, and state to keep by the electrostatic adherence parts, the attitude of upper substrate is moved and crimping on infrabasal plate unchangeably, upper and lower base plate is sealed and is piled up (for example, with reference to patent documentation 2).
Patent documentation 1: the spy open the 2001-166272 communique (the 6th page, Fig. 8)
Patent documentation 2: No. 3721378 communique of Japanese Patent (the 8th page, Fig. 1)
; in so existing Workpiece transfer method and electro-static sucker device; under the situation of patent documentation 1; by removing the electrostatic adherence function, workpiece (upper substrate) is freely fallen in a vacuum, even but cut off the electricity supply; the substrate adsorption affinity of electrostatic chuck does not also disappear but the continuation effect at once; so the decline of the substrate adsorption affinity after can be therefore and remove inhomogeneously, it is that peel off the part that the interface of electrostatic adherence face and workpiece begins, and last workpiece is peeled off comprehensively and freely fallen.
In view of the above, workpiece (upper substrate) is that the center rotation is moved with the place of peeling off at last on one side, Yi Bian freely fall, so on upper and lower base plate position alignment each other, produce error, and under free-falling pressure, sealing becomes not exclusively, has the problem of easy entrained air.
In addition, workpiece (upper substrate) begins from the place that begins earlier to peel off for the electrostatic adherence face, the local sagging and run-off the straight owing to gravity, and this inclination changes with situation easily, so can not freely fall middle correction, and also be difficult to revise after falling on the infrabasal plate, existence can't realize the problem of the parallelism stipulated.
, under the tendency that the substrate of Liquid Crystal Display (LCD) and plasma scope maximizes, begin to make the product that a length of side surpasses 1000mm in recent years, but, also require and the small-sized same parallelism of substrate even substrate maximizes.If particularly a length of side of substrate surpasses 1000mm, to compare with the size of XY direction, the interval of Z direction becomes minimum, so though it is desirable to make upper and lower base plate keeping approaching moving, in fact very difficulty under the completely parallel prerequisite.
Under such environment, if surpassing the large-scale upper substrate of 1000mm, a length of side tilts a little, because compare the interval of Z direction with the size of XY direction minimum, so might make sealing liquid crystal on any one party of the opposite face that is coated in upper and lower base plate in advance with the problem of the face damage of leakproofing material (cyclic adhesion agent) or two substrates, existence can't be expected normal problem of pasting.
In addition, under the situation of patent documentation 2, peel off from jet gas between the back side one side direction of workpiece (upper substrate) and this workpiece, but if as existing employed workpiece, have the glass substrate of the thickness of 0.7～1.1mm, the rigidity of its face direction is than higher, on the face direction, evenly propagate easily so peel off,, can peel off reliably from electrostatic chuck by this gas with gas.
In recent years, the usefulness that image drift mobile phone or notebook PC are paid attention to the weight-saving Liquid Crystal Display (LCD) like that is many very on the way, in such purposes, the glass of workpiece shows as the following extremely thin thickness of about 0.5mm, and then has used the PES plastic sheetings such as (polyethersulfones) of workpiece as the hundreds of μ m of thickness in flexible display more.
Compare with the glass substrate of existing employed 0.7～1.1mm, workpiece rigidity such as glass substrate that about 0.5mm like this is following or plastic sheeting are extremely low, even so spray the gas of peeling off usefulness, the local extrusion of workpiece is out of shape, peel off runner with gas and concentrate on crushed element and leak gas, might can't peel off workpiece reliably because of residual adsorption affinity, and when peeling off, extrude owing to the air-flow of peeling off usefulness in the segment set of distortion and stretch, distortion that might residual part.
Summary of the invention
The purpose of first, fourth aspect of the present invention is, even thin and the low workpiece of rigidity do not discharge with not producing distortion or offset in moving yet and lay.
The purpose of a second aspect of the present invention is, except that above-mentioned first aspect ground purpose, keeps reliably and conveying workpieces.
The purpose of a third aspect of the present invention is, except that above-mentioned first and second ground, aspect purpose, improves the fissility of workpiece.
The purpose of a fifth aspect of the present invention is, except that above-mentioned fourth aspect ground purpose, even the low substrate of rigidity is also peeled off reliably with inhomogeneous irrespectively the stickup also at assigned address of the releasing of electrostatic adherence power.
To achieve these goals, a first aspect of the present invention is characterised in that: form electrostatic chuck lamellar or membranaceous and support with can move freely; The electrostatic adherence surface of the work relative on this electrostatic chuck with it; The state that makes this electrostatic chuck workpiece with electrostatic adherence moves to the releasing position from absorption position, and stops the electrostatic adherence function of electrostatic chuck; Electrostatic chuck is oppositely moved, with sur-face peeling electrostatic chuck from the workpiece that moves to the releasing position from this releasing position to absorption position.
A second aspect of the present invention is characterised in that: on the basis of the structure of first aspect present invention, described electrostatic chuck is formed lamellar or membranaceous, and can support this electrostatic chuck with moving freely in the direction that the level and smooth basal plane with the holding plate that is made of rigid body intersects.
A third aspect of the present invention is characterised in that: on the basis of the structure aspect the present invention first or two, the electrostatic adherence portion that makes described electrostatic chuck is out of shape partly from the place facing to the peripheral end portion of workpiece, and this workpiece peripheral end portion between form the gap of peeling off usefulness partly.
In addition, a fourth aspect of the present invention is characterised in that: support that electrostatic chuck can move freely it on the direction that workpiece one side surface with holding plate intersects; Make the surface of electrostatic chuck at electrostatic adherence workpiece under the state of this workpiece one side surface; This electrostatic chuck at electrostatic adherence under the state of workpiece moved to the releasing position, and stop the electrostatic adherence function of electrostatic chuck from absorption position; Electrostatic chuck is oppositely moved, from the sur-face peeling electrostatic chuck of the workpiece that is moved to the releasing position from this releasing position to absorption position.
A fifth aspect of the present invention is characterised in that: on any one party of a pair of holding plate or both sides the electro-static sucker device that above-mentioned fourth aspect is put down in writing is set; Detachable ground keeps two the relative substrates as described workpiece between these holding plates; To be pulled away from the electrostatic chuck of described electro-static sucker device under the state of the substrate of a side with electrostatic adherence from any one party of this holding plate; One side's substrate is moved to the opposing party's substrate, paste two substrates by the cyclic adhesion agent.
A first aspect of the present invention with attachment members electrostatic chuck attached on the holding plate, and keep workpiece with this electrostatic chuck that adheres to absorption, and with isolated part these electrostatic chucks and workpiece as keeping apart from holding plate integratedly, workpiece does not become free state in view of the above, so be not subjected to gravity etc. influence be transported to the releasing position, and after stopping the electrostatic adherence function of this electrostatic chuck, only make electrostatic chuck attached on the holding plate and, this workpiece is stayed the releasing position with attachment members once again with the sur-face peeling of electrostatic chuck from the workpiece that moves to the releasing position.
Therefore, even thin and the low workpiece of rigidity can not discharge with not producing distortion or offset in moving yet and lay.
As a result, that the releasing of electrostatic adherence power takes place is inhomogeneous and make the attitude of workpiece become unsettled existing apparatus easily to compare, can be transported to assigned position to workpiece with stable attitude with releasing owing to electrostatic adherence.
In addition, compare with the existing apparatus of peeling off workpiece with the injection pressure of gas, even the situation that concentrates on specific part with the runner of gas because of peeling off can not take place the low workpiece of rigidity yet, can peel off equally reliably with the high workpiece of rigidity, have excellent operability.
Except the effect of above-mentioned first aspect, second aspect present invention forms electrostatic chuck lamellar or membranaceous, it can be supported on the direction that the level and smooth basal plane with the holding plate that is made of rigid body intersects with moving freely, under the effect of attachment members, at least the electrostatic adherence portion of electrostatic chuck is flattened along the level and smooth basal plane that is made of rigid body, these basal planes and electrostatic adherence portion are seamlessly contacted and electrostatic adherence, then use the action of isolated part, the state of workpiece with electrostatic adherence draws back electrostatic chuck from basal plane, workpiece can not become free state in view of the above, so not being subjected to the influence ground of gravity etc. carries, then under the effect of attachment members, from by the sur-face peeling electrostatic chuck of the workpiece that should move, and get back to initial condition along basal plane.
Therefore, can keep reliably, conveying workpieces.
Except first or the effect of second aspect, a third aspect of the present invention is out of shape the electrostatic adherence portion of electrostatic chuck partly from the place facing to the peripheral end portion of workpiece, and the peripheral end portion of workpiece between form the gap of peeling off usefulness partly, between the surface of the electrostatic adherence portion of electrostatic chuck and workpiece, enlarge the gap that this peels off usefulness once, force decay also to eliminate residual adsorption affinity.
Therefore, can improve the fissility of workpiece.
A fourth aspect of the present invention supports electrostatic chuck that it can be moved freely on and the direction that intersects with it relative with workpiece one side surface of holding plate; Make the surface of electrostatic chuck at electrostatic adherence workpiece under the state of this workpiece one side surface; This electrostatic chuck is moved from absorption position under the state that is keeping the electrostatic adherence workpiece.In view of the above, workpiece does not become free state, thus be not subjected to gravity etc. influence be transported to the releasing position, and stop the electrostatic adherence function of electrostatic chuck; Electrostatic chuck is oppositely moved, from the sur-face peeling electrostatic chuck of the workpiece that is moved to the releasing position from this releasing position to absorption position.
Therefore, even thin and the low workpiece of rigidity can not discharge with not producing distortion or offset in moving and lay yet.
As a result, that the releasing of electrostatic adherence power takes place is inhomogeneous and make the attitude of workpiece become unsettled existing apparatus easily to compare, can be transported to assigned position to workpiece with stable attitude with releasing owing to electrostatic adherence.
In addition, compare with the existing apparatus of peeling off workpiece with the injection pressure of gas, even the situation that concentrates on specific part with the runner of gas because of peeling off can not take place the low workpiece of rigidity yet, can peel off equally reliably with the high workpiece of rigidity, have excellent operability.
Except the effect of fourth aspect, a fifth aspect of the present invention a side substrate with electrostatic adherence state draws back the side of electrostatic chuck from two holding plates and move to the opposing party's substrate, and by two substrates of cyclic adhesion agent stickup, in view of the above, one side's substrate does not become free state, so be not subjected to gravity etc. influence be transferred and correctly paste, a side's who keeps from the binding power by described cyclic adhesion agent substrate is not peeled off electrostatic chuck limpingly.
Therefore, even the low workpiece of rigidity also can be peeled off reliably with inhomogeneous irrespectively the stickup also at assigned position of the releasing of electrostatic adherence power.
The result, with the releasing that utilizes electrostatic adherence the free-falling existing substrate sticking machine of upper substrate is compared, can prevent two substrates position alignment error to each other, simultaneously can form seal cavity reliably, prevent sneaking into of air, and be accompanied by peel off the fully not run-off the straight of upper substrate from the electrostatic adherence face, so can realize the parallelism of regulation, even a length of side surpasses the large substrate of 1000mm, also can prevent fully because of the problem of the caused damage sealing liquid crystal of the inclination of upper substrate with the face of leakproofing material (cyclic adhesion agent) or two substrates.
In addition, compare with the existing substrate sticking machine of only directly peeling off substrate with the injection pressure of gas, even the situation that concentrates on specific part with the runner of gas because of peeling off can not take place the low substrate of rigidity yet, can peel off equally reliably with the high workpiece of rigidity, have excellent operability.
In addition, even since foreign matter enter the destroyed and et out of order of the surface local that causes electrostatic chuck, because holding plate is different parts with lamellar or membranaceous electrostatic chuck, even so also can be easily to holding plate replacing electrostatic chuck at the scene that is provided with, so maintainability excellence, when particularly electro-static sucker device of the present invention being used for the manufacturing line of Liquid Crystal Display (LCD) etc., can restart the work of whole production line at short notice, not reduce rate of operation so can expect stable productive output.
Description of drawings
Following brief description accompanying drawing.
Fig. 1 is the vertical profile front view of the embodiment 1 of expression Workpiece transfer method of the present invention and electro-static sucker device, represents by the work process sequence in (a) and (b).
Fig. 2 is along the upward view that dwindles of Fig. 1 (a) (2)-(2) line.
Fig. 3 is along the amplification view that dwindles of Fig. 1 (a) (3)-(3) line
Fig. 4 is the vertical profile front view of the embodiment 2 of expression Workpiece transfer method of the present invention and electro-static sucker device, represents by the work process sequence in (a) and (b).
Fig. 5 be the expression labelling machine that uses Workpiece transfer method of the present invention and electro-static sucker device embodiment 3 dwindle the vertical profile front view, in (a)～(c), represent the method for attaching of substrate by the work process sequence.
Fig. 6 is that expression is dwindled the vertical profile front view when eliminating electric charge, represents by the work process sequence in (a) and (b).
The specific embodiment
The following describes and Workpiece transfer method of the present invention and electro-static sucker device D are configured in detachable ground keep and paste situation as the substrate sticking machine of the glass substrate of panel workpiece A, B, that be used for Liquid Crystal Display (LCD) (LCD), plasma scope (PDP), flexible display or plastic film substrate.
The aforesaid substrate labelling machine disposes a pair of holding plate 1,1 ' up and down that flat adapter plate constituted of the thickness with not flexure deformation that is formed by for example rigid body such as metal or pottery shown in Fig. 5 (a)～(c); On above-mentioned up and down holding plate 1,1 ' parallel relative smooth surface, detachable ground maintenance two substrate A, B respectively; After in the local vacuum chamber S that forms around them, reaching the specified vacuum degree, holding plate 1,1 ' is relatively mobile to XY θ direction (horizontal direction in the drawings) adjustment up and down, carry out substrate A, B position alignment to each other, then, the any one party that makes substrate A, B is at least peeled off the poststack of laying equal stress on from holding plate up and down 1,1 ' smooth surface, destroy the vacuum in the vacuum chamber S, the draught head of inside and outside generation that is used in two substrate A, B is being pressurized to predetermined gap between two substrate A, the B.
If describe in detail, then shown in the solid line of Fig. 5 (a), with Lift Part (not shown) support up and down holding plate 1,1 ' so that up and down holding plate 1,1 ' can on Z direction (above-below direction in the drawings), relatively move, in atmospheric atmosphere, to be somebody's turn to do up and down holding plate 1,1 ' under the state that direction is left up and down, will be provided with for each smooth surface and keep respectively by carrying with manipulator (not shown) substrate conveying A, B.
Shown in the long and two-short dash line of Fig. 5 (a), by the action of described Lift Part, holding plate 1,1 ' closely moves about making, at the vacuum chamber of part formation between the two S then.
Then, action by inspiratory component (not shown), S deflates from vacuum chamber, when reaching specified vacuum and spend, action by parallel motion parts (not shown), holding plate up and down 1,1 ' any one party adjusted on XY θ direction with respect to the opposing party move, carry out coarse alignment successively and thin the aligning will be by substrate A, the B of their maintenances position alignment (alignment) each other.
After these aim to finish, shown in Fig. 5 (b),, clip cyclic adhesion agent (leakproofing material) the C ground moment crimping on the infrabasal plate B, will seal also overlapping between the two moving to the opposing party by holding plate 1,1 ' the substrate A that keeps, any one party of B up and down.
Then, shown in Fig. 5 (c), by the action of described Lift Part, holding plate 1, the 1 ' direction of separating towards each other move up and down, meanwhile, make described inspiratory component reverse operation, or with other mechanisms to air supply or nitrogen in the vacuum chamber S, make the atmosphere in the vacuum chamber S get back to barometric pressure, pressurize equably with draught head in the inside and outside generation of two substrate A, B, be sealed under the state of liquid crystal, be pressed onto given interval, finishing to paste step.
Keep the electrostatic chuck 2 of substrate A, B to constitute electro-static sucker device D of the present invention with the above-mentioned holding plate up and down that constitutes by rigid body 1,1 ', absorption.
In illustrated embodiment, move freely on the Z direction (above-below direction in the drawings) of supporting electrostatic chuck 2 that it can be intersected at the smooth surface with last holding plate 1, go up holding plate 1 in addition and also have: be used for this electrostatic chuck 2 is pulled to attachment members 3 that each smooth surface and detachable ground engages with this smooth surface and the isolated part 4 that is used for drawing back from each smooth surface electrostatic chuck 2.
Make on the smooth surface of electrostatic chuck 2 attached to last holding plate 1 with attachment members 3, with the electrostatic chuck 2 electrostatic adherence upper substrate A that adhere to, with described isolated part 4 electrostatic chuck 2 and upper substrate A as moving to the releasing position is parallel isolator from last holding plate 1 integratedly, stop the electrostatic adherence function of electrostatic chuck 2 simultaneously, with 3 of attachment members electrostatic chuck 2 holding plate 1 that makes progress from the releasing position is oppositely moved then, electrostatic chuck 2 is peeled off from the upper substrate A that is moved to the releasing position, thereby carried out above-mentioned substrate A, the sticking placement of B.
Described electrostatic chuck 2 be by for example polyimide, polyetheretherketone (PEEK), polyethylene naphthalenedicarboxylate insulativity such as (PEN) organic material form the dielectric 2b of level and smooth lamellar or film like and by portion within it by screen printing etc. and the 2c of electrode portion that patterned conductive paste or conductive foil constitute is integratedly stacked.
The 2c of this electrode portion forms with the ground that insulate on every side, and is connected with the power supply that is used for applying voltage thereon (not shown).
As concrete example, the plural electrode 2c of portion of preferred use is set to for example bipolar electrostatic chuck of comb teeth shape.
In addition, control for the 2c of electrode portion of electrostatic chuck 2 that can freely come and go being supported at above-below direction, after the release with the isolated part 4 of description in the back, the connection of cutting off the electricity supply immediately stops the electrostatic adherence function.
Described attachment members 3 strides across a side of holding plate up and down 1,1 ' smooth surface or both sides and the electrostatic chuck 2 relative with it outwardly, fixed configurations for example has magnet such as permanent magnet or electromagnet 3a and forms membranaceous magnetic substance 3b such as metal by the magnet of this magnetic attraction or by for example sputter etc. respectively, perhaps respectively fixed configurations have except that magnetic force jointing material or except that machinery one touch type bindiny mechanism structure, magnetic force or binding power etc. by them engage described electrostatic chuck 2 with respect to this smooth surface detachable ground.
The opposite face of described isolated part 4 from holding plate up and down 1,1 ' smooth surface one side or both sides towards electrostatic chuck 2 injects for example nitrogen or air etc. other or other fluid, pushes electrostatic chuck 2; Perhaps with cylinder etc. up and down the driving body of motion push electrostatic chuck 2; Perhaps conversion is as the magnetic pole of any one party of magnet 3a described attachment members 3, that be oppositely arranged, 3b, the identical and mutual exclusion of the magnetic pole that makes these relative magnet 3a, 3b, with electrostatic chuck from the parallel separation of this smooth surface.
Various embodiments of the present invention below are described with reference to the accompanying drawings.
In addition, on described holding plate 1 and base, be provided in atmosphere, adsorbing the attraction adsorption element 5 of maintenance, attraction source (not shown) pipe arrangements such as a plurality of attraction circuits of forming as attracting adsorption element 5 and for example vacuum pump are connected, and the attraction circuit are used as the air extractor vent 4a of isolated part 4.
It should be noted that, in the accompanying drawings, only represented with respect to the described upward smooth surface of holding plate 1, on above-below direction, can support electrostatic chuck 2 with freely coming and going, thus the example that under absorption is keeping state as the surface of the extremely low upper substrate of the rigidity below about 0.5mm of workpiece A, is moving; But on above-below direction, can support electrostatic chuck 2 with respect to the following smooth surface of holding plate 1 ' with freely coming and going, keep situation about moving under the state on surface of infrabasal plate B too in absorption in view of the above, so omission.
As the magnet 3a of fixed configurations on the base of described holding plate 1, use permanent magnet or electromagnet etc.; As the magnet 3b of fixed configurations on the opposite face of electrostatic chuck 2, if use the magnet that forms lamellar or film like, just can guarantee the resiliency of electrostatic chuck 2 and the fissility of two magnet 3a, 3b, be preferred therefore.
In addition, as shown in Figures 2 and 3, as described attachment members 3, magnet 3b on the opposite face of electrostatic chuck 2 is configured to alternately arrange in its vicinity the opposite electrode of magnetic pole respectively at magnet 3a on the base of described holding plate 1 and fixed configurations fixed configurations, in view of the above, with the action of described isolated part 4 when described basal plane 1a draws back electrostatic chuck 2, even produce a little offset, also can utilize magnetic force (repulsion) to make it get back to original position automatically based on the action of after this attachment members 3 in XY θ direction.
In addition, by action the further basal plane 1a of holding plate 1 of electrostatic chuck 2 is come when workpiece (upper substrate) A that finishes to move forces to peel off with described attachment members 3, electrostatic chuck 2 whole simultaneously do not further, but preferably shown in the enlarged drawing of the part of Fig. 1 (b), furthered earlier so that its local deformation in the position relative with the peripheral end portion A1 of the workpiece A that moves, and the peripheral end portion A1 of workpiece A between the local gap S1 that peels off usefulness that forms.
The following describes the Workpiece transfer method of using described electro-static sucker device D.
At first, shown in Fig. 1 (a), action by described attachment members 3 or attraction adsorption element 5, the electrostatic chuck 2 of lamellar or film like is pulled to the basal plane 1a of the holding plate 1 that constitutes by rigid body, the 2a of electrostatic adherence portion is engaged smoothly along basal plane 1a, with workpiece A electrostatic adherence on electrostatic chuck 2.
Then, shown in Fig. 1 (b), if utilize the action of described isolated part 4, draw back electrostatic chuck 2 from the basal plane 1a of holding plate 1 at workpiece A under by the state of electrostatic adherence, make workpiece A to the parallel mobile words of the opposing party's workpiece (infrabasal plate) B, workpiece A does not just become free state, thus be not subjected to gravity etc. influence be transferred, and be temporarily fixed with respect to the opposing party's workpiece B by cyclic adhesion agent C.
In addition, after mobile end, cut off the power supply of electrostatic chuck 2 immediately, stop the electrostatic adherence function.
If a little later make described attachment members 3 or attract parts 5 work than this, force to draw back the words of lamellar or membranaceous electrostatic chuck 2 from the workpiece A of working fastening, at this moment the residual adsorption affinity of electrostatic chuck 2 weakens, so can produce the gap S1 that peels off usefulness between the 2a of electrostatic adherence portion of these workpiece A and electrostatic chuck 2, the 2a of electrostatic adherence portion of electrostatic chuck 2 can be stripped from limpingly from this gap S1 part.
Meanwhile, utilize the opposite electrode of magnetic pole is alternately arranged magnet 3a, the 3b of ground configuration, the electrostatic chuck 2 of lamellar or film like can be with respect to the basal plane 1a of holding plate 1 to the skew of XY θ direction occurrence positions, but automatically attached to original position and get back to initial condition.
In view of the above, even the extremely low workpiece A of rigidity also can peel off reliably with the residual adsorption affinity of electrostatic chuck 2 or inhomogeneous irrespectively the conveying also to the fixed position of releasing of electrostatic adherence power.
In addition, the 2a of electrostatic adherence portion that makes electrostatic chuck 2 is along the basal plane 1a of the holding plate 1 that is made of the rigid body cunning that flattens, so the surface of 2a of these electrostatic adherence portions and workpiece A seamlessly contacts and by electrostatic adherence, can keep workpiece A reliably.
In addition, if make electrostatic chuck 2 from position local deformation facing to the peripheral end portion A1 of workpiece A, and the peripheral end portion A1 of workpiece A between form the words of the gap S1 that peels off usefulness partly, this gap S1 that peels off usefulness once will expand between the surface of the 2a of electrostatic adherence portion of these electrostatic chucks 2 and workpiece A, decay forcibly and eliminate residual adsorption affinity, so can improve the fissility of workpiece A.
As Fig. 4 (a), (b) shown in, the structure of embodiment 2 and described Fig. 1～embodiment 1 difference shown in Figure 3 is, electrostatic chuck 2 is formed than the basal plane 1a or the workpiece A of described holding plate 1 biglyyer, with fixed parts 2e with the outer end 2d of this electrostatic chuck 2 with respect to this holding plate 1 detachable fix, perhaps utilize fixed parts 2e a part or the full week of outer end 2d is fixing foldedly with respect to this holding plate 1 detachable ground, simultaneously be connected to come supplying electric current to the 2c of electrode portion with the 2f of current supply portion, the local deflection division 2g that forms the energy elastic deformation between outer end 2d and the 2a of electrostatic adherence portion in view of the above can be free toward the ground return configuration electrostatic adherence 2a of portion on above-below direction.In addition the embodiment 1 of structure and Fig. 1～shown in Figure 3 is identical.
Under the situation of illustrated example, the outer end 2d of electrostatic chuck 2 is striden across its whole picture frame shape that peripherally is fixed as, or outside outer end 2d whole, place and fix with point-like every appropriate intervals.
As other examples,, perhaps one group of parallel outer end 2d is fixed with point-like every appropriate intervals ground fixing abreast with the one group of outer end 2d that disposes abreast of electrostatic chuck 2.
In view of the above, embodiment 2 shown in Figure 4 does not have guide member (not shown), just can on above-below direction, support electrostatic chuck 2 with moving freely, simultaneously, action by isolated part 4, when the basal plane 1a from described holding plate 1 draws back electrostatic chuck 2, make electrostatic chuck 2 on XY θ direction, get back to original position the position non-migration.
Therefore, as attachment members 3, as shown in Figures 2 and 3, fixed configurations need not be configured near the form of alternately arranging the opposite electrode of magnetic pole it respectively at the magnet 3b on the opposite face of electrostatic chuck 2 in the magnet 3a on the base of described holding plate 1 and fixed configurations, simultaneously, configuration also fixing forms the magnet 3b that membranaceous magnetic substances such as metal replace electrostatic chuck 2 by for example sputter etc., also can come and go and move and can not be offset at XY θ direction occurrence positions, compare with the embodiment 1 of described Fig. 1～shown in Figure 3, can simplify the structure of described attachment members 3, thus cost-cutting.
In addition, between following basal plane 1a ' that descends holding plate 1 ' and electrostatic chuck 2, dispose for example jointing material or mechanical one touch type bindiny mechanism or adhesives, with the two detachable be installed together, and down the electrostatic chuck 2 of holding plate 1 ' can not pass through the action of attachment members 3 or isolated part 4 and be round mobile on above-below direction as above-mentioned last holding plate 1.
As required, as Fig. 6 (a), (b) shown in, on the electrostatic chuck 2 of the following basal plane 1a ' of this time holding plate 1 ' and below, on the straight line of each Z (up and down) direction, leave a plurality of through holes 6 with connecting, can move freely on Z (up and down) direction in the internal configurations of these through holes 6, the withdrawal of needle that top ends is formed by insulating material is as the upper and lower base plate A that stickup is finished, B is from the separating component 7 of the surface isolation of this electrostatic chuck 2, perhaps control to spray for example gas such as nitrogen or air or other fluid upward, the next upper and lower base plate A that stickup is finished, B pushes away from the surface of the electrostatic chuck 2 of below, and the back surface B 1 of infrabasal plate B between form the elimination electric charge gap S2 that for example has only about 2～3mm.
By separating component 7 below the surface of electrostatic chuck 2 and the back surface B 1 of infrabasal plate B between formed in the atmosphere of gap S2 or in the low vacuum of regulation, between the electrode portion 2c of electrostatic chuck 2 in-to-ins more than 2 that is arranged on this below, apply high potential from high-voltage power supply (not shown), repeat from the action of the state that applies when the infrabasal plate B electrostatic adherence the reversal of poles of voltage, change the voltage of the described 2c of electrode portion more than 2, produce induction field in view of the above and remain in electric charge among upper and lower base plate A, the B with neutralization.
In addition, in illustrated example,, used Fig. 1～embodiment 1 shown in Figure 3 as above-mentioned electro-static sucker device D, though not shown, as other examples, also can use embodiment shown in Figure 42.
The following describes the action of the substrate sticking machine that uses described electro-static sucker device D.
At first, shown in the solid line of Fig. 5 (a), under atmospheric pressure state, the action by described attachment members 3 or attraction adsorption element 5 pulls to top base 1a to the electrostatic chuck 2 of lamellar or film like, and engages smoothly along top base 1a; Under this state, by carrying the upper and lower base plate A, the B that carry with manipulator respectively by attached to the electrostatic chuck 2 of the top on the last maintenance face 1a be installed in down 2 electrostatic adherences of electrostatic chuck and the maintenance of the below on the basal plane 1a '.
Then, shown in the long and two-short dash line of Fig. 5 (a), action by described Lift Part, making up and down, holding plate 1,1 ' closely moves and forms vacuum chamber S, after in this vacuum chamber S, reaching given degree of vacuum, holding plate 1,1 ' up and down in statu quo relatively adjusted on XY θ direction move, carry out the position alignment action of upper and lower base plate A, B.
After the position alignment release, shown in Fig. 5 (b), by the action of described isolated part 4, under the state that upper substrate A by electrostatic attaction, the electrostatic chuck 2 from top base 1a draws back the top makes this upper substrate A move to infrabasal plate B.
In view of the above, upper and lower base plate A, B clip cyclic adhesion agent C moment crimping, between the two sealing and overlapping.
In this overlapping step, can prevent fully that gas or fluid from entering between upper and lower base plate A, the B; And for the extremely low upper substrate A of rigidity, the padded coaming that becomes that has thereon lamellar or film like, so there is following advantage:, also be difficult to (not shown) such as the cyclic adhesion agent C that forms between upper and lower base plate A, the B or spacing blocks impacted even adding of cyclic adhesion agent C pressed a little inhomogeneous of generation.
In addition, behind the mobile end of upper substrate A, cut off the power supply of the electrostatic chuck 2 of top immediately, stop the electrostatic adherence function.
Then, get back to barometric pressure in the vacuum chamber S, pressurize equably by the draught head in the inside and outside generation of two substrate A, B, the draught head that is used in the inside and outside generation of two substrate A, B is pressed into predetermined gap, pastes step and finishes.
Then shown in Fig. 5 (c), utilize the action of described attachment members 3 or attraction adsorption element 5, the electrostatic chuck 2 of top is pulled to top base 1a from the upper substrate A that pastes by cyclic adhesion agent C and infrabasal plate B, begin both peeling off.
At this moment, in the Paschen region of discharge of the degree of vacuum in the vacuum chamber S about tens of Pa～thousands of Pa, the residual adsorption affinity of the electrostatic chuck 2 of top is extremely low.
, because by the upper substrate A that binding power kept of cyclic adhesion agent C and electrostatic chuck 2 full face contacts of top, so there is the situation that is difficult to peel off.
Therefore, draw back whole of electrostatic chuck 2 of top simultaneously if not aforesaid surface from upper substrate A, be out of shape partly but make from position facing to the peripheral end portion A1 of the upper substrate A that pastes, and the peripheral end portion A1 of upper substrate A between form the words in the gap of peeling off usefulness partly, this gap of peeling off usefulness just can once be expanded at the 2a of electrostatic adherence portion of electrostatic chuck 2 and the surface of upper substrate A, decay forcibly and eliminate residual adsorption affinity, so the whole electrostatic adherence face of the electrostatic chuck 2 of top is successfully from the sur-face peeling of upper substrate A.
In view of the above, even the extremely low substrate A of rigidity also can irrespectively paste in the fixed position with the releasing inequality of the residual adsorption affinity of the electrostatic chuck 2 of top or electrostatic adherence power and peel off reliably.
In addition, from the sur-face peeling of upper substrate A the electrostatic chuck 2 of top attached to top base 1a, after this,, holding plate 1, the 1 ' direction of separating are towards each other up and down moved by the action of described Lift Part, get back to initial condition.
Under such situation, the upper and lower base plate A that stickup is through with, around the B barometric pressure or the above low vacuum of 100Pa, in this atmosphere, as required, as Fig. 6 (a), (b) shown in, make as the withdrawal of needle of described separating component 7 a plurality of through holes 6 and rise from the electrostatic chuck 2 of the basal plane 1a ' that run through time holding plate 1 ' and below, or spray for example gas such as nitrogen or air or other fluid upward, the next upper and lower base plate A that stickup is finished, B pushes away from the electrostatic chuck 2 of below, and the back surface B 1 of infrabasal plate B between form the gap S2 that the elimination electric charge about 2～3mm is only used.
Under this state, if change the voltage of the electrode portion 2c of electrostatic chuck 2 in-to-ins more than 2 be embedded in the below, just can by below the stripping charge that moment produced peeled off from the state of the infrabasal plate B of glassivation system of electrostatic chuck 2 respond to the generation with upper and lower base plate A, B in the electric field (particularly being alternating electric field) of residual electric charge.
In view of the above, in the electric field part of this induction, a part of moment ionization of atmosphere gas such as air and ionization, promptly neutral molecule is separated into the electric charge of positive and negative, so they can in and among the infrabasal plate B residual electric charge eliminate electric charge.
In addition, carry upper and lower base plate A, B by above-mentioned conveying with manipulator, when the electrostatic chuck 2 of the top on being installed in top base 1a and the electrostatic chuck 2 that is installed in down the below on the basal plane 1a ' moved and be provided with, the fragment of glass etc. might enter.
At this moment, be accompanied by the electrostatic adherence with upper and lower base plate A, B, can take place that this fragment enters between each electrostatic chuck 2 and the fault that causes the surface local of the medium 2a etc. of electrostatic chuck 2 to destroy.
Even in this case,,, has the advantage of maintainability excellence so can provide for simple replacement of these electrostatic chucks 2 because the electrostatic chuck 2 of lamellar or film like is that detachable ground disposes for basal plane 1a, 1a ' up and down respectively.
It should be noted that, although understand electro-static sucker device D of the present invention is arranged on that detachable ground keeps and stickup as the situation in the substrate sticking machine of the glass substrate of the panel that is used for Liquid Crystal Display (LCD) (LCD), plasma scope (PDP), flexible display of workpiece A, B or plastic film substrate, but be not limited to this, also can be configured in the base board delivery device of substrate assembling apparatus beyond the substrate sticking machine, conveying substrate, perhaps paste and keep the LCD panel with the substrate beyond the glass substrate.
In addition, although understand the substrate sticking machine of pasting two substrate A, B in a vacuum, but be not limited to this, also can be the substrate sticking machine of in atmosphere, pasting two substrate A, B, at this moment also can obtain the action effect identical with above-mentioned substrate sticking machine.
In addition, in the illustrated example, only the basal plane 1a for last holding plate 1 can support electrostatic chuck 2 on above-below direction with freely coming and going, but be not limited to this, also can electrostatic chuck 2 be supported on the Z direction with can move freely for the following basal plane 1a ' of following holding plate 1 ', also have attachment members 3 and isolated part 4 on the holding plate 1 ' down, with attachment members 3 electrostatic chuck 2 is attached to down on the following basal plane 1a ' of holding plate 1 ', with this electrostatic chuck that adheres to 2 electrostatic adherence infrabasal plate B, will be parallel isolator mobile to the releasing position with infrabasal plate B with isolated part 4 from following holding plate 1 ' as the electrostatic chuck 2 of one, stop the electrostatic adherence function of electrostatic chuck 2 simultaneously, oppositely mobile from the releasing position with 3 of attachment members then towards following holding plate 1 ' electrostatic chuck 2, from the sur-face peeling electrostatic chuck 2 of the infrabasal plate B that moves to the releasing position, thereby carry out substrate A, the sticking placement of B.
Claims (5)
1. one kind keeps workpiece, the workpiece that is kept is discharged and be placed to the Workpiece transfer method of assigned position with the absorption of the electrostatic chuck of holding plate, it is characterized in that:
On described holding plate, be provided with and electrostatic chuck pulled to this holding plate and along the attachment members of this holding plate detachable and the isolated part that electrostatic chuck is pulled away from from this holding plate; Make electrostatic chuck attached on the holding plate with above-mentioned attachment members; Utilize the absorption of this electrostatic chuck that adheres to keep workpiece, and utilize above-mentioned isolated part with above-mentioned electrostatic chuck and workpiece as keeping apart from holding plate integratedly; After stopping the electrostatic adherence function of this electrostatic chuck, utilize described attachment members only to make above-mentioned electrostatic chuck, and stay workpiece to be placed on the releasing position once more attached on the holding plate.
2. Workpiece transfer method according to claim 1 is characterized in that:
Described electrostatic chuck is formed lamellar or membranaceous, and on the direction that the level and smooth face with the holding plate that is made of rigid body intersects, can support this electrostatic chuck with moving freely.
3. Workpiece transfer method according to claim 1 and 2 is characterized in that:
The electrostatic adherence portion that makes described electrostatic chuck is out of shape partly from the place facing to the peripheral end portion of workpiece, and the workpiece peripheral end portion between form the gap of peeling off usefulness partly.
4. electro-static sucker device that keeps the electrostatic chuck of workpiece to constitute by holding plate and absorption is characterized in that:
Support that electrostatic chuck can move freely it on the direction that workpiece one side surface with holding plate intersects; Make the surface of electrostatic chuck at electrostatic adherence workpiece under the state of workpiece one side surface; This electrostatic chuck is moved to the releasing position from this absorption position under the state that is keeping the electrostatic adherence workpiece, and stop the electrostatic adherence function of electrostatic chuck; Electrostatic chuck is oppositely moved, from the sur-face peeling electrostatic chuck of the workpiece that is moved to the releasing position from this releasing position to absorption position.
5. substrate sticking method is characterized in that:
On any one party of a pair of holding plate or both sides, electro-static sucker device as claimed in claim 4 is set; Detachable ground keeps two the relative substrates as described workpiece between these holding plates; To be pulled away from the electrostatic chuck of described electro-static sucker device under the state of the substrate that keeping using electrostatic adherence one side from any one party of this holding plate; One side's substrate is moved to the opposing party's substrate, and paste two substrates by the cyclic adhesion agent.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2006/319540 WO2008041293A1 (en) | 2006-09-29 | 2006-09-29 | Work transferring method, electrostatic chuck device, and board joining method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101316777A true CN101316777A (en) | 2008-12-03 |
| CN101316777B CN101316777B (en) | 2012-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800007517A Expired - Fee Related CN101316777B (en) | 2006-09-29 | 2006-09-29 | Workpiece transfer method and electro-static sucker device and substrate sticking method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN101316777B (en) |
| TW (1) | TWI412480B (en) |
| WO (1) | WO2008041293A1 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102636913A (en) * | 2011-02-15 | 2012-08-15 | 常阳工学株式会社 | Sealing method and apparatus thereof |
| CN103094167A (en) * | 2011-10-28 | 2013-05-08 | 无锡华润安盛科技有限公司 | Device for picking up semiconductor parts |
| CN106927258A (en) * | 2017-01-26 | 2017-07-07 | 江苏东旭亿泰智能装备有限公司 | A kind of conveyer and its transfer approach for glass substrate |
| CN109972085A (en) * | 2017-12-27 | 2019-07-05 | 佳能特机株式会社 | The manufacturing method of electrostatic chuck, film formation device, the adsorption method of substrate, film build method and electronic equipment |
| CN110783247A (en) * | 2018-07-31 | 2020-02-11 | 佳能特机株式会社 | Electrostatic chuck system, film forming apparatus, adsorption and film forming method, and method for manufacturing electronic device |
| CN110938800A (en) * | 2018-09-21 | 2020-03-31 | 佳能特机株式会社 | Adsorption apparatus and method, film forming apparatus and method, and method for manufacturing electronic device |
| CN111052313A (en) * | 2017-08-10 | 2020-04-21 | 东京毅力科创株式会社 | Substrate processing method |
| CN111128828A (en) * | 2018-10-31 | 2020-05-08 | 佳能特机株式会社 | Adsorption and alignment method, adsorption system, film forming method and apparatus, and method for manufacturing electronic device |
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| CN102187447B (en) * | 2008-10-20 | 2013-03-27 | 创意科技股份有限公司 | Method for inspecting electrostatic chuck, and electrostatic chuck apparatus |
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| WO2015083257A1 (en) * | 2013-12-04 | 2015-06-11 | 信越エンジニアリング株式会社 | Method for manufacturing bonded device |
| JP6765751B2 (en) * | 2016-06-21 | 2020-10-07 | 株式会社ディスコ | Work piece holding mechanism and processing equipment |
| JP7488738B2 (en) * | 2020-09-18 | 2024-05-22 | 日機装株式会社 | Vacuum lamination device and method for manufacturing laminate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06235896A (en) * | 1993-02-08 | 1994-08-23 | Ropuko:Kk | Contactless pressure sticking method |
| JP3596127B2 (en) * | 1995-12-04 | 2004-12-02 | ソニー株式会社 | Electrostatic chuck, thin plate holding device, semiconductor manufacturing device, transport method, and semiconductor manufacturing method |
| AU2003275604A1 (en) * | 2003-10-23 | 2005-05-11 | Shin-Etsu Engineering Co., Ltd. | Method for sealing substrates while stacking |
| CN2715187Y (en) * | 2004-02-14 | 2005-08-03 | 鸿富锦精密工业（深圳）有限公司 | Substrate adhering equipment |
| CN100403104C (en) * | 2004-04-28 | 2008-07-16 | 鸿富锦精密工业（深圳）有限公司 | Substrate application method |
| CN100376945C (en) * | 2004-06-11 | 2008-03-26 | 鸿富锦精密工业（深圳）有限公司 | Substrate plying-up apparatus and substrate plying-up process |
| JP2005353987A (en) * | 2004-06-14 | 2005-12-22 | Canon Inc | Electrostatic chuck, and device manufacturing apparatus and method therefor |
-
2006
- 2006-09-29 WO PCT/JP2006/319540 patent/WO2008041293A1/en active Application Filing
- 2006-09-29 CN CN2006800007517A patent/CN101316777B/en not_active Expired - Fee Related
-
2007
- 2007-01-12 TW TW096101276A patent/TWI412480B/en not_active IP Right Cessation
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| CN102636913B (en) * | 2011-02-15 | 2017-04-12 | 常阳工学株式会社 | Sealing method and apparatus thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP4043506B2 (en) | 2008-02-06 |
| CN101316777B (en) | 2012-01-18 |
| JPWO2008041293A1 (en) | 2010-01-28 |
| TWI412480B (en) | 2013-10-21 |
| TW200815268A (en) | 2008-04-01 |
| WO2008041293A1 (en) | 2008-04-10 |
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