WO2022113572A1 - Cutting device and production method of cut article - Google Patents

Cutting device and production method of cut article Download PDF

Info

Publication number
WO2022113572A1
WO2022113572A1 PCT/JP2021/038659 JP2021038659W WO2022113572A1 WO 2022113572 A1 WO2022113572 A1 WO 2022113572A1 JP 2021038659 W JP2021038659 W JP 2021038659W WO 2022113572 A1 WO2022113572 A1 WO 2022113572A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting
cut
suction
elements
dividing
Prior art date
Application number
PCT/JP2021/038659
Other languages
French (fr)
Japanese (ja)
Inventor
聡子 堀
直毅 高田
康弘 岩田
善夏 黄
雄大 北川
昌一 片岡
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN202180076966.1A priority Critical patent/CN116547108A/en
Priority to KR1020237016369A priority patent/KR20230088772A/en
Publication of WO2022113572A1 publication Critical patent/WO2022113572A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Definitions

  • the present invention relates to a cutting device and a method for manufacturing a cut product.
  • Patent Document 1 for example, in a cutting device for cutting a workpiece such as a chip scale package (CSP) substrate, a plurality of first suction ports for sucking the package and an edge fragment adjacent to the package are used. Some have a cutting table with a plurality of second suction ports for sucking (scrap area). In this cutting device, the plurality of first suction ports are arranged so as to correspond to the arrangement configuration of the package to be cut, and the plurality of second suction ports coincide with the positions of the edge fragments. It is arranged in the vicinity of the periphery of the plurality of first suction ports.
  • CSP chip scale package
  • the present invention has been made to solve the above-mentioned problems, and makes it possible to easily cut a cutting object in which cutting lines in dividing elements adjacent to each other are set on different straight lines by a blade. Is the main issue.
  • a plurality of dividing elements are connected by a connecting portion, and a cutting object in which cutting lines in the dividing elements adjacent to each other are set on different straight lines is used as the cutting line.
  • It is a cutting device that cuts along the line, and includes a cutting table that adsorbs and holds the object to be cut, and a cutting mechanism that cuts the object to be cut held by the cutting table with a blade.
  • the first table adsorption unit that adsorbs one of the divided elements
  • the second table adsorption unit that is independent of the first table adsorption unit and adsorbs the other divided element. It is characterized by having and.
  • Cutting device W ... Cutting object W1 ... Dividing elements of odd-numbered columns (multiple dividing elements) W2 ... Even-numbered column division elements (multiple division elements) W3 ... Connecting part CL1, CL2 ... Cutting line P ... Cut product 2 ... Cutting table 21 ... First table suction part 22 ... Second table suction part 3 ... Cutting mechanism 31 ... Blade 4 ... Loader (transport mechanism) 411 ... 1st transport suction unit 412 ... 2nd transport suction unit
  • the cutting device of the present invention cuts a cutting object in which a plurality of dividing elements are connected by a connecting portion and the cutting lines in the dividing elements adjacent to each other are set on different straight lines.
  • a cutting device that cuts along a line includes a cutting table that adsorbs and holds the object to be cut, and a cutting mechanism that cuts the object to be cut held by the cutting table with a blade.
  • the table is independent of the first table suction unit that adsorbs one of the divided elements and the first table adsorption unit in the divided elements adjacent to each other, and the second table that adsorbs the other divided element. It is characterized by having a suction portion.
  • the cutting table has a first table suction unit that adsorbs one of the divided elements adjacent to each other and a second table adsorption unit that adsorbs the other of the divided elements adjacent to each other, they are adjacent to each other. It is possible to release the adsorption of only one or the other of the split elements to be relocated to the cutting table or to remove it from the cutting table. This makes it possible for the blade to easily cut an object to be cut in which the cutting lines in the dividing elements adjacent to each other are set on different straight lines.
  • the cutting device of the present invention is the cutting device. It is conceivable that the table is further provided with a transport mechanism for transporting the object to be cut, and the transport mechanism has a transport suction unit that sucks only one or the other of the divided elements adjacent to each other.
  • the cutting table is capable of adsorbing the dividing element by either the first table suction portion or the second table suction portion. It is desirable that the transport mechanism is aligned so that the cutting lines of the divided elements adjacent to each other are on the same straight line after the divided elements whose adsorption has been released are adsorbed on the cutting table. In this configuration, since the cutting lines adjacent to each other are aligned so as to be on the same straight line, the cutting lines of the dividing elements adjacent to each other can be cut at once.
  • the plurality of dividing elements are arranged along the cutting direction by the blade, and the arrangement thereof is divided into at least two sets, and one set is used. It is conceivable that the cutting line of the dividing element is located on the same straight line and the cutting line of the other set of the dividing elements is located on the same straight line.
  • the first table adsorption unit adsorbs the one set of dividing elements, and the second table adsorption unit adsorbs the other set of dividing elements. It is desirable to have.
  • the transport mechanism includes a first transport suction unit that sucks the split element of one set and the split element of the other set. It is conceivable to have a second transport adsorption unit for adsorption.
  • a method for manufacturing a cut product using the above-mentioned cutting device is also one aspect of the present invention.
  • the cutting device 100 of the present embodiment cuts the cutting lines CL0 to CL2 set on the cutting object W to separate them into a plurality of cut products P (product P).
  • a plurality of dividing elements W1 and W2 are connected by a connecting portion W3, and the cutting lines CL1 in the dividing elements W1 and W2 adjacent to each other are connected.
  • CL2 is set on different straight lines.
  • a plurality of chips are sealed by resin molding, and here, a plurality of chips are arranged in a row.
  • leads are provided corresponding to each chip.
  • the plurality of dividing elements W1 and W2 are arranged along the cutting direction (left-right direction in FIG. 1) by the blade 31 (see FIG. 3), and both ends thereof are connected by the connecting portion W3.
  • the odd-numbered column dividing element W1 which is one set and the even-numbered column dividing element W2 which is the other set are configured so that their leads are staggered.
  • the cutting line CL1 of the odd-numbered row dividing element W1 in one set is located on the same straight line
  • the cutting line CL2 of the even-numbered row dividing element W2 in the other set is located on the same straight line. ..
  • the cutting line CL1 of the odd-numbered dividing element W1 and the cutting line CL2 of the even-numbered dividing element W2 are located on different straight lines (see FIG. 2).
  • the cutting line CL0 to CL2 shown in each figure are virtual lines scheduled to be cut by the blade 31, and are not displayed on the actual cutting object W.
  • the cutting device 100 has a cutting table 2 that adsorbs and holds the cutting object W, and a cutting mechanism 3 that cuts the cutting object W held by the cutting table 2 by the blade 31.
  • a transport mechanism 4 (hereinafter, also referred to as a loader 4) for transporting the object W to be cut to the cutting table 2
  • a carry-out mechanism 5 (hereinafter, also referred to as) for transporting the cut product P cut on the cutting table 2 from the cutting table 2.
  • unloader 5 also referred to as unloader 5
  • the cutting table 2 sucks and holds the object W to be cut, and as shown in FIG. 4, the first table suction unit 21 that sucks one of the split elements W1 in the split elements W1 and W2 adjacent to each other. And a second table adsorption unit 22 that adsorbs the other split element W2.
  • the cutting table 2 is configured to be movable in at least the Y direction by a moving mechanism (not shown). Further, the cutting table 2 may be configured to rotate in the ⁇ direction by a rotation mechanism (not shown).
  • the first table suction unit 21 and the second table suction unit 22 are independent of each other, and each is configured to be able to independently switch between suction and its stop.
  • the first table suction unit 21 collectively sucks the divided elements W1 of the even-numbered rows (1 row, 3 rows, 5 rows, ...) In the object W to be cut, and sucks the second table.
  • the unit 22 collectively adsorbs the even-numbered rows (2 rows, 4 rows, 6 rows, ...) Of the even-numbered rows (2 rows, 4 rows, 6 rows, ...) Of the cut object W. That is, the cutting table 2 is configured so that the adsorption or stop of the odd-numbered split element W1 and the suction or stop of the even-numbered split element W2 can be independently switched.
  • the first table suction unit 21 includes a first suction hole 21a that opens on the upper surface of the cutting table 2, a first internal flow path 21b that is continuous with the first suction hole 21a and is formed inside the cutting table 2. It has a first suction pump 21c connected to the first internal flow path 21b. Further, the second table suction portion 22 is continuous with the second suction hole 22a opened on the upper surface of the cutting table 2 and the second suction hole 22a, and the second internal flow path 22b formed inside the cutting table 2. And a second suction pump 22c connected to the second internal flow path 22b.
  • the first suction pump 21c and the second suction pump 22c may be shared, and the internal flow path connected to the suction pump may be switched by using, for example, a switching valve (not shown). An ejector can also be used in addition to the suction pump.
  • the cutting mechanism 3 cuts the object W to be cut in a straight line, and as shown in FIG. 3, the blade 31, the spindle portion 32 for rotating the blade 31, and the spindle portion 32 are cut at least in the X direction and at least in the X direction. It is equipped with a moving mechanism (not shown) that moves in the Z direction. The direction of rotation of the blade 31 is parallel to the upper surface of the cutting table 2, and here, the direction is along the horizontal direction. Then, by relatively moving the cutting table 2 and the cutting mechanism 3, the cutting object W is cut by the blade 31.
  • the loader 4 conveys the object to be cut W from the object accommodating unit 6 (see FIG. 3) for accommodating the object W to be cut to the cutting table 2. Further, as will be described later, the loader 4 moves one of the dividing elements W1 and W2 adjacent to each other so that the cutting lines CL1 and CL2 of the dividing elements W1 and W2 adjacent to each other in the cutting table 2 coincide with each other. ..
  • the loader 4 has a suction block 41 provided with transport suction portions 411 and 412 for sucking the object W to be cut, and a moving mechanism (not shown) for moving the suction block 41. ) And.
  • the suction block 41 is provided with a first transport suction unit 411 that sucks one of the split elements W1 and a second transport suction unit 412 that sucks the other split element W2 in the split elements W1 and W2 that are adjacent to each other. ing. That is, the suction block 41 of the loader 4 has transport suction portions 411 and 412 corresponding to the table suction portions 21 and 22 of the cutting table 2.
  • the first transport suction unit 411 adsorbs the even-numbered rows (1 row, 3 rows, 5 rows, ...) Of the divided elements W1 in the object W to be cut, and the second transport suction unit 412 , The dividing element W2 of an even number of rows (2 rows, 4 rows, 6 rows, ...) In the cutting target W is adsorbed. That is, the loader 4 is configured to be able to independently switch between sucking or stopping the odd-numbered row dividing element W1 and sucking or stopping the even-numbered row splitting element W2.
  • the first transport suction unit 411 includes a first suction hole 411a that opens on the lower surface of the suction block 41, a first internal flow path 411b that is continuous with the first suction hole 411a and is formed inside the suction block 41. It has a first suction pump 411c connected to the first internal flow path 411b.
  • the first suction hole 411a is provided with, for example, a resin suction pad 411d.
  • the second transport suction unit 412 is continuous with the second suction hole 412a opened on the lower surface of the suction block 41 and the second suction hole 412a, and the second internal flow path 412b formed inside the suction block 41. And a second suction pump 412c connected to the second internal flow path 412b.
  • the second suction hole 412a is provided with a suction pad 412d.
  • the first suction pump 411c and the second suction pump 412c may be shared in common, and the internal flow path connected to the suction pump may be switched by using, for example, a switching valve (not shown).
  • the unloader 5 adsorbs the cut cut product P and conveys the cut product P from the cutting table 2 to the cut product accommodating portion 7 (see FIG. 3).
  • the unloader 5 has a suction block 51 provided with a transport suction unit 511 for sucking the cut product P, and a moving mechanism (not shown) for moving the suction block 51. I have.
  • the transport suction portion 511 of the suction block 51 has a suction hole 511a that opens on the lower surface of the suction block 51, an internal flow path 511b that is continuous with the suction hole 511a and is formed inside the suction block 51, and the internal flow path. It has a suction pump 511c connected to 511b.
  • the suction hole 511a is provided with, for example, a resin suction pad 511d.
  • the unloader 5 does not have two independent transport suction units, but has a transport suction unit 511 that sucks a plurality of cut products P without distinction.
  • the odd-numbered rows of suction holes 511a and the even-numbered rows of suction holes 511a are aligned in the Y direction, but they may be offset from each other.
  • the loader 4 attracts and holds the object W to be cut housed in the object accommodating unit 6 to be cut, and conveys the object W to the cutting table 2.
  • the object W to be cut transported to the cutting table 2 is adsorbed and held by the first table adsorption unit 21 and the second table adsorption unit 22 of the cutting table 2 ( ⁇ adsorption and holding of the object to be cut> in FIG. 7). ..
  • the positioning of the cutting object W with respect to the cutting table 2 is performed, for example, by fitting a positioning hole formed in the cutting object W with a positioning pin provided in the cutting table 2. In addition, it can also be performed by fitting the positioning hole formed in the object W to be cut and the positioning pin provided in the loader 4.
  • the connecting portion W3 of the object to be cut W adsorbed and held on the cutting table 2 is cut by the cutting mechanism 3 ( ⁇ cutting of the connecting portion> in FIGS. 7 and 8).
  • the connecting portion W3 connecting both ends of the plurality of dividing elements W1 and W2 is cut.
  • the plurality of dividing elements W1 and W2 of the object to be cut W are separated from each other.
  • the cutting lines CL1 and CL2 between the odd-numbered row dividing element W1 and the even-numbered row dividing element W2 are staggered (staggered) and not on the same straight line, but on different straight lines.
  • the suction pad of the loader 4 (specifically, the suction pad 412d of the second transport suction unit 412) is pressed against the even-numbered row of dividing elements W2. This prevents the position of the even-numbered division element W2 from being displaced by stopping the adsorption of the second table adsorption unit 22 of the cutting table 2.
  • the loader 4 sucks the even-numbered split element W2 whose adsorption has been stopped in the cutting table 2, and then lifts the even-numbered split element W2 from the cutting table 2 (4). ⁇ Stopping / lifting of even-numbered rows> in FIGS. 7 and 8). Then, the loader 4 is aligned and rearranged so that the cutting line CL2 of the even-numbered dividing element W2 is on the same straight line as the cutting line CL1 of the odd-numbered dividing element W1 ( ⁇ even-numbered columns in FIGS. 7 and 8). Relocation>). The rearranged even-numbered rows of dividing elements W2 are sucked and held on the cutting table 2 by the second table suction unit 22.
  • the positioning in the rearrangement of the even-numbered division element W2 is as follows: (i) The arrangement of the even-numbered division element W1 and the even-numbered division element W2 (for example, the edge portion) before moving the even-numbered division element W2.
  • the image is recognized by the camera, the moving amount of the positioning of the even-numbered dividing element W2 is calculated by the image recognition, and the loader 4 is controlled based on the calculated moving amount. Is possible.
  • positioning in the rearrangement of the even-numbered row dividing element W2 is performed by (ii) fitting the positioning hole provided in the even-numbered row dividing element W2 and the positioning pin provided in the cutting table 2.
  • the position adjustment amount of the even-numbered column division element W2 may be set in advance, and the movement mechanism of the loader 4 may be controlled based on the position adjustment amount.
  • the unloader 5 sucks and holds a plurality of cut products P adsorbed and held on the cutting table 2 and conveys them to the cut product accommodating unit 7.
  • the suction pad 511d of the unloader 5 may be pressed against the plurality of cut products P before the suction of the cutting table 2 is released to prevent the position shift and the suction error of the plurality of cut products P. ..
  • the cutting table 2 is independent of the first table suction unit 21 that sucks one of the divided elements W1 and W2 adjacent to each other and the first table suction unit 21. Since it has a second table adsorption unit 22 that adsorbs the other of the divided elements W1 and W2 that are adjacent to each other, the adsorption of only one or the other of the divided elements W1 and W2 that are adjacent to each other is released to the cutting table 2. Can be rearranged or removed from the cutting table 2. Thereby, the cutting object W in which the cutting lines CL1 and CL2 in the dividing elements W1 and W2 adjacent to each other are set on different straight lines can be easily cut by the blade 31.
  • the even-numbered column dividing element W2 is rearranged, but by rearranging the odd-numbered column dividing element W1, the cutting line CL1 of the odd-numbered column dividing element W1 and the even-numbered column are arranged. It may be configured to align with the cutting line CL2 of the dividing element W2.
  • the loader 4 has a configuration having a first transport suction unit 411 and a second transport suction unit 412, but a configuration having only one of them may be used.
  • the loader 4 when the cutting object W is carried into the cutting table 2, the loader 4 sucks and holds the odd-numbered row of division elements W1 and carries in. Will be done.
  • the first table suction portion 21 of the cutting table 2 stops the suction of the odd-numbered row dividing element W1, and the loader 4 re-adsorbs the odd-numbered row split element W1 from which the suction is stopped. Will be placed.
  • the odd-numbered column or even-numbered column dividing elements W1 and W2 are rearranged by the loader 4, but the odd-numbered column or even-numbered column dividing elements W1 and W2 are rearranged by using the unloader 5. It may be configured to be used.
  • the unloader 5 has a configuration having a first transport suction unit that sucks the odd-numbered row of the split elements W1 and a second transport suction unit that sucks the even-numbered row of the split elements W2, similarly to the loader 4 of the embodiment. Become.
  • the cutting line CL1 of the odd-numbered dividing element W1 and the cutting line CL2 of the even-numbered dividing element W2 are aligned and cut at once, but the following may be used.
  • the even-numbered column dividing element W2 is taken out from the cutting table 2, and the cutting line CL1 of the odd-numbered column dividing element W1 is cut to be individualized.
  • the individualized cut product P is carried out from the cutting table 2
  • the even-numbered division element W2 is adsorbed and held on the cutting table 2
  • the cutting line CL2 of the even-numbered division element W2 is cut and individually. Disintegrate.
  • the individualized cut product P is carried out from the cutting table 2.
  • the object W to be cut by the cutting device 100 of the present invention is not limited to the above embodiment, and may be a substrate such as a printed circuit board (PCB substrate) that is not resin-molded.
  • the cutting object W is a substrate in which a notch K is made by, for example, router processing, and the substrate has a plurality of dividing elements W1 and W2 having a substantially L-shaped shape in a plan view.
  • the cutting lines CL1 and CL2 in the dividing elements W1 and W2 adjacent to each other are set on different straight lines while being connected by the connecting portion W3.
  • the cutting line CL1 of the odd-numbered dividing element W1 and the cutting line CL2 of the even-numbered dividing element W2 are aligned. , They can be cut at once ( ⁇ cutting by aligning the cutting lines of odd-numbered columns and even-numbered columns> in FIG. 9). Further, after cutting the connecting portion W3, the odd-numbered column dividing element W1 and the even-numbered column dividing element W2 can be separately cut ( ⁇ cutting the odd-numbered column and the even-numbered column separately> in FIG. 9).
  • the cutting object W of the above-described embodiment is divided into two sets (odd-numbered columns and even-numbered columns) in which a plurality of dividing elements are arranged, and is cut by the odd-numbered column dividing elements W1 and the even-numbered columns of the dividing elements W2.
  • the lines CL1 and CL2 were different from each other, but they are not limited to the odd-numbered column dividing element and the even-numbered column dividing element, and also include those having a dividing element in which the cutting lines are not on the same straight line in a plurality of dividing elements. Can be applied.
  • the arrangement mode of the plurality of division elements of the object W to be cut may be grouped so that the left and right two columns are the same, for example.
  • the object W to be cut may be divided into three or more sets in which a plurality of division elements are arranged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The cutting device 100 according to the present invention is for making it possible to cut, by means of a blade, a to-be-cut object where cutting lines within mutually adjacent division elements are set on mutually different straight lines, and cuts said to-be-cut object W, where a plurality of division elements W1, W2 are coupled via a connection part W3 while cutting lines CL1, CL2 within mutually adjacent division elements W1, W2 are set on mutually different straight lines, along said cutting lines CL1, CL2, the cutting device being provided with: a cutting table 2 on which the to-be-cut object W is held in place by suction; and a cutting mechanism 3 for cutting, by means of a blade 31, the to-be-cut object W held on the cutting table 2. The cutting table 2 comprises: a first table suction part 21 which, of the mutually adjacent division elements W1, W2, attracts one division element W1 by suction; and a second table suction part 22 which is independent of the first table suction part 21 and attracts the other division element W2 by suction.

Description

切断装置及び切断品の製造方法Cutting device and manufacturing method of cut products
　本発明は、切断装置及び切断品の製造方法に関するものである。 The present invention relates to a cutting device and a method for manufacturing a cut product.
　従来、例えば特許文献１に示すように、チップスケールパッケージ（ＣＳＰ）基板などの加工物を切断する切断装置において、パッケージを吸引するための複数の第１の吸引ポートと、パッケージに隣接するエッジ断片（屑領域）を吸引するための複数の第２の吸引ポートとを有する切断テーブルを有するものがある。この切断装置では、複数の第１の吸引ポートは、切断されるパッケージの配置構成に対応して配列をなすように配置されており、複数の第２の吸引ポートは、エッジ断片の位置に一致する複数の第１の吸引ポートの周辺近傍に配置されている。 Conventionally, as shown in Patent Document 1, for example, in a cutting device for cutting a workpiece such as a chip scale package (CSP) substrate, a plurality of first suction ports for sucking the package and an edge fragment adjacent to the package are used. Some have a cutting table with a plurality of second suction ports for sucking (scrap area). In this cutting device, the plurality of first suction ports are arranged so as to correspond to the arrangement configuration of the package to be cut, and the plurality of second suction ports coincide with the positions of the edge fragments. It is arranged in the vicinity of the periphery of the plurality of first suction ports.
特開２００３－２３４３１０号公報Japanese Patent Application Laid-Open No. 2003-234310
　一方、近年では、ＳＯＴ（Small Outline Transistor）やＳＯＩＣ（Small Outline Integrated Circuit）などの半導体パッケージにおいて、同じ大きさのリードフレームを用いてより多くのパッケージを製造するために、図１０のように、リードが互い違いに形成されたリードフレームを用いて樹脂成形した樹脂成形基板が製造されている。 On the other hand, in recent years, in semiconductor packages such as SOT (Small Outline Transistor) and SOIC (Small Outline Integrated Circuit), in order to manufacture more packages using lead frames of the same size, as shown in FIG. A resin-molded substrate is manufactured by resin-molding using a lead frame in which leads are alternately formed.
　しかしながら、リードが互い違いに形成されたリードフレームを用いた樹脂成形基板では、パッケージの切断線が同一直線上に位置しないため、従来のブレードを用いた切断装置では切断することが難しい。 However, in a resin molded substrate using lead frames in which leads are alternately formed, it is difficult to cut with a conventional cutting device using a blade because the cutting lines of the package are not located on the same straight line.
　そこで本発明は、上記問題点を解決すべくなされたものであり、互いに隣接する分割要素内の切断線が互いに異なる直線上に設定された切断対象物をブレードにより容易に切断できるようにすることをその主たる課題とするものである。 Therefore, the present invention has been made to solve the above-mentioned problems, and makes it possible to easily cut a cutting object in which cutting lines in dividing elements adjacent to each other are set on different straight lines by a blade. Is the main issue.
　すなわち本発明に係る切断装置は、複数の分割要素が連結部によって連結されるとともに、互いに隣接する前記分割要素内の切断線が互いに異なる直線上に設定された切断対象物を、前記切断線に沿って切断する切断装置であって、前記切断対象物を吸着して保持する切断テーブルと、前記切断テーブルに保持された前記切断対象物をブレードにより切断する切断機構とを備え、前記切断テーブルは、互いに隣接する前記分割要素において、一方の前記分割要素を吸着する第１テーブル吸着部と、当該第１テーブル吸着部とは独立しており、他方の前記分割要素を吸着する第２テーブル吸着部とを有することを特徴とする。 That is, in the cutting device according to the present invention, a plurality of dividing elements are connected by a connecting portion, and a cutting object in which cutting lines in the dividing elements adjacent to each other are set on different straight lines is used as the cutting line. It is a cutting device that cuts along the line, and includes a cutting table that adsorbs and holds the object to be cut, and a cutting mechanism that cuts the object to be cut held by the cutting table with a blade. In the divided elements adjacent to each other, the first table adsorption unit that adsorbs one of the divided elements and the second table adsorption unit that is independent of the first table adsorption unit and adsorbs the other divided element. It is characterized by having and.
　このように構成した本発明によれば、互いに隣接する分割要素内の切断線が互いに異なる直線上に設定された切断対象物をブレードにより容易に切断できるようにすることができる。 According to the present invention configured as described above, it is possible to easily cut an object to be cut in which cutting lines in the dividing elements adjacent to each other are set on different straight lines by the blade.
切断対象物を模式的に示す平面図である。It is a top view which shows typically the object to be cut. 切断対象物の切断線を示す部分拡大平面図である。It is a partially enlarged plan view which shows the cutting line of the cutting object. 本発明に係る一実施形態の切断装置の構成を模式的に示す平面図である。It is a top view schematically showing the structure of the cutting apparatus of one Embodiment which concerns on this invention. 同実施形態の切断テーブルの構成を模式的に示す平面図及び断面図である。It is a plan view and a sectional view schematically showing the structure of the cutting table of the same embodiment. 同実施形態の搬送機構（ローダ）の構成を模式的に示す平面図及び断面図である。It is a plan view and a sectional view schematically showing the structure of the transport mechanism (loader) of the same embodiment. 同実施形態の搬出機構（アンローダ）の構成を模式的に示す平面図及び断面図である。It is a plan view and a sectional view schematically showing the structure of the carry-out mechanism (unloader) of the same embodiment. 同実施形態の切断動作の各状態を示す断面図である。It is sectional drawing which shows each state of the cutting operation of the same embodiment. 同実施形態の切断動作における切断対象物の各状態を示す平面図である。It is a top view which shows each state of the cutting object in the cutting operation of the same embodiment. 変形実施形態の切断対象物及びその切断方法を示す平面図である。It is a top view which shows the cutting object of the modification embodiment and the cutting method thereof. リードが互い違いに形成されたリードフレームを用いた樹脂成形基板を示す平面図である。It is a top view which shows the resin molded substrate using the lead frame in which leads are formed alternately.
１００・・・切断装置
Ｗ・・・切断対象物
Ｗ１・・・奇数列の分割要素（複数の分割要素）
Ｗ２・・・偶数列の分割要素（複数の分割要素）
Ｗ３・・・連結部
ＣＬ１、ＣＬ２・・・切断線
Ｐ・・・切断品
２・・・切断テーブル
２１・・・第１テーブル吸着部
２２・・・第２テーブル吸着部
３・・・切断機構
３１・・・ブレード
４・・・ローダ（搬送機構）
４１１・・・第１搬送吸着部
４１２・・・第２搬送吸着部 100 ... Cutting device W ... Cutting object W1 ... Dividing elements of odd-numbered columns (multiple dividing elements)
W2 ... Even-numbered column division elements (multiple division elements)
W3 ... Connecting part CL1, CL2 ... Cutting line P ... Cut product 2 ... Cutting table 21 ... First table suction part 22 ... Second table suction part 3 ... Cutting mechanism 31 ... Blade 4 ... Loader (transport mechanism)
411 ... 1st transport suction unit 412 ... 2nd transport suction unit
　次に、本発明について、例を挙げてさらに詳細に説明する。ただし、本発明は、以下の説明により限定されない。 Next, the present invention will be described in more detail with an example. However, the present invention is not limited by the following description.
　本発明の切断装置は、前述のとおり、複数の分割要素が連結部によって連結されるとともに、互いに隣接する前記分割要素内の切断線が互いに異なる直線上に設定された切断対象物を、前記切断線に沿って切断する切断装置であって、前記切断対象物を吸着して保持する切断テーブルと、前記切断テーブルに保持された前記切断対象物をブレードにより切断する切断機構とを備え、前記切断テーブルは、互いに隣接する前記分割要素において、一方の前記分割要素を吸着する第１テーブル吸着部と、当該第１テーブル吸着部とは独立しており、他方の前記分割要素を吸着する第２テーブル吸着部とを有することを特徴とする。
　この切断装置であれば、切断テーブルが、互いに隣接する分割要素の一方を吸着する第１テーブル吸着部と、互いに隣接する分割要素の他方を吸着する第２テーブル吸着部とを有するので、互いに隣接する分割要素の一方又は他方のみの吸着を解除して、切断テーブルに対して再配置する、或いは、切断テーブルから取り出すことができる。これにより、互いに隣接する分割要素内の切断線が互いに異なる直線上に設定された切断対象物をブレードにより容易に切断できるようにすることができる。 As described above, the cutting device of the present invention cuts a cutting object in which a plurality of dividing elements are connected by a connecting portion and the cutting lines in the dividing elements adjacent to each other are set on different straight lines. A cutting device that cuts along a line, and includes a cutting table that adsorbs and holds the object to be cut, and a cutting mechanism that cuts the object to be cut held by the cutting table with a blade. The table is independent of the first table suction unit that adsorbs one of the divided elements and the first table adsorption unit in the divided elements adjacent to each other, and the second table that adsorbs the other divided element. It is characterized by having a suction portion.
In this cutting device, since the cutting table has a first table suction unit that adsorbs one of the divided elements adjacent to each other and a second table adsorption unit that adsorbs the other of the divided elements adjacent to each other, they are adjacent to each other. It is possible to release the adsorption of only one or the other of the split elements to be relocated to the cutting table or to remove it from the cutting table. This makes it possible for the blade to easily cut an object to be cut in which the cutting lines in the dividing elements adjacent to each other are set on different straight lines.
　互いに隣接する分割要素の一方又は他方のみを吸着して、切断テーブルに対して再配置する、或いは、切断テーブルから取り出すための具体的な実施の態様としては、本発明の切断装置は、前記切断テーブルに前記切断対象物を搬送する搬送機構をさらに備え、前記搬送機構は、互いに隣接する前記分割要素において一方又は他方のみを吸着する搬送吸着部を有することが考えられる。 As a specific embodiment for adsorbing only one or the other of the dividing elements adjacent to each other and rearranging them on the cutting table or taking them out from the cutting table, the cutting device of the present invention is the cutting device. It is conceivable that the table is further provided with a transport mechanism for transporting the object to be cut, and the transport mechanism has a transport suction unit that sucks only one or the other of the divided elements adjacent to each other.
　前記連結部が前記切断機構により切断されて互いに隣接する前記分割要素が互いに分離した状態において、前記切断テーブルは、前記第１テーブル吸着部又は前記第２テーブル吸着部の一方による前記分割要素の吸着を解除し、前記搬送機構は、前記切断テーブルにおいて吸着が解除された前記分割要素を吸着した後に、互いに隣接する前記分割要素の切断線が同一直線上となるように揃えることが望ましい。
　この構成であれば、互いに隣接する切断線が同一直線上となるように揃えているので、互いに隣接する分割要素の切断線を一挙に切断することができる。 In a state where the connecting portion is cut by the cutting mechanism and the dividing elements adjacent to each other are separated from each other, the cutting table is capable of adsorbing the dividing element by either the first table suction portion or the second table suction portion. It is desirable that the transport mechanism is aligned so that the cutting lines of the divided elements adjacent to each other are on the same straight line after the divided elements whose adsorption has been released are adsorbed on the cutting table.
In this configuration, since the cutting lines adjacent to each other are aligned so as to be on the same straight line, the cutting lines of the dividing elements adjacent to each other can be cut at once.
　切断対象物の具体的な実施の態様としては、前記複数の分割要素は、前記ブレードによる切断方向に沿って配列され、それらの配置態様が少なくとも２つの組に分けられており、一方の組の前記分割要素の切断線が同一直線上に位置し、他方の組の前記分割要素の切断線が同一直線上に位置するものが考えられる。
　この構成の切断対象物において、前記第１テーブル吸着部は、前記一方の組の分割要素を吸着するものであり、前記第２テーブル吸着部は、前記他方の組の分割要素を吸着するものであることが望ましい。 As a specific embodiment of the object to be cut, the plurality of dividing elements are arranged along the cutting direction by the blade, and the arrangement thereof is divided into at least two sets, and one set is used. It is conceivable that the cutting line of the dividing element is located on the same straight line and the cutting line of the other set of the dividing elements is located on the same straight line.
In the object to be cut having this configuration, the first table adsorption unit adsorbs the one set of dividing elements, and the second table adsorption unit adsorbs the other set of dividing elements. It is desirable to have.
　この場合、切断テーブルの吸着態様に合わせて搬送機構を構成することが望ましく、前記搬送機構は、前記一方の組の分割要素を吸着する第１搬送吸着部と、前記他方の組の分割要素を吸着する第２搬送吸着部とを有することが考えられる。 In this case, it is desirable to configure the transport mechanism according to the suction mode of the cutting table, and the transport mechanism includes a first transport suction unit that sucks the split element of one set and the split element of the other set. It is conceivable to have a second transport adsorption unit for adsorption.
　また、上述した切断装置を用いた切断品の製造方法も本発明の一態様である。 Further, a method for manufacturing a cut product using the above-mentioned cutting device is also one aspect of the present invention.
＜本発明の一実施形態＞
　以下に、本発明に係る切断装置の一実施形態について、図面を参照して説明する。なお、以下に示すいずれの図についても、わかりやすくするために、適宜省略し又は誇張して模式的に描かれている。同一の構成要素については、同一の符号を付して説明を適宜省略する。 <One Embodiment of the present invention>
Hereinafter, an embodiment of the cutting device according to the present invention will be described with reference to the drawings. All of the figures shown below are schematically drawn by omitting or exaggerating them for the sake of clarity. The same components are designated by the same reference numerals and the description thereof will be omitted as appropriate.
＜切断装置の全体構成＞
　本実施形態の切断装置１００は、切断対象物Ｗに設定された切断線ＣＬ０～ＣＬ２を切断することにより複数の切断品Ｐ（製品Ｐ）に個片化するものである。 <Overall configuration of cutting device>
The cutting device 100 of the present embodiment cuts the cutting lines CL0 to CL2 set on the cutting object W to separate them into a plurality of cut products P (product P).
　ここで、切断対象物Ｗは、図１及び図２に示すように、複数の分割要素Ｗ１、Ｗ２が連結部Ｗ３によって連結されるとともに、互いに隣接する分割要素Ｗ１、Ｗ２内の切断線ＣＬ１、ＣＬ２が互いに異なる直線上に設定されたものである。それぞれの分割要素Ｗ１、Ｗ２は、複数のチップが樹脂成形により封止されており、ここでは、複数のチップが一列に配置されたものである。また、それぞれのチップに対応してリードが設けられている。そして、複数の分割要素Ｗ１、Ｗ２は、ブレード３１（図３参照）による切断方向（図１において左右方向）に沿って配列され、それらの両端部が連結部Ｗ３により連結されている。具体的に一方の組である奇数列の分割要素Ｗ１と他方の組である偶数列の分割要素Ｗ２とは、それらのリードが互い違いとなるように構成されている。これにより、一方の組である奇数列の分割要素Ｗ１の切断線ＣＬ１が同一直線上に位置し、他方の組である偶数列の分割要素Ｗ２の切断線ＣＬ２が同一直線上に位置している。また、奇数列の分割要素Ｗ１の切断線ＣＬ１と偶数列の分割要素Ｗ２の切断線ＣＬ２とは互いに異なる直線上に位置している（図２参照）。なお、図２における符号ＣＬ０は、連結部Ｗ３を切断して複数の分割要素Ｗ１、Ｗ２に分離するための切断線である。また、各図に示す切断線ＣＬ０～ＣＬ２は、ブレード３１により切断が予定される仮想線であり、実際の切断対象物Ｗには表示されていない。 Here, as shown in FIGS. 1 and 2, in the cutting object W, a plurality of dividing elements W1 and W2 are connected by a connecting portion W3, and the cutting lines CL1 in the dividing elements W1 and W2 adjacent to each other are connected. CL2 is set on different straight lines. In each of the dividing elements W1 and W2, a plurality of chips are sealed by resin molding, and here, a plurality of chips are arranged in a row. In addition, leads are provided corresponding to each chip. The plurality of dividing elements W1 and W2 are arranged along the cutting direction (left-right direction in FIG. 1) by the blade 31 (see FIG. 3), and both ends thereof are connected by the connecting portion W3. Specifically, the odd-numbered column dividing element W1 which is one set and the even-numbered column dividing element W2 which is the other set are configured so that their leads are staggered. As a result, the cutting line CL1 of the odd-numbered row dividing element W1 in one set is located on the same straight line, and the cutting line CL2 of the even-numbered row dividing element W2 in the other set is located on the same straight line. .. Further, the cutting line CL1 of the odd-numbered dividing element W1 and the cutting line CL2 of the even-numbered dividing element W2 are located on different straight lines (see FIG. 2). The reference numeral CL0 in FIG. 2 is a cutting line for cutting the connecting portion W3 and separating it into a plurality of dividing elements W1 and W2. Further, the cutting lines CL0 to CL2 shown in each figure are virtual lines scheduled to be cut by the blade 31, and are not displayed on the actual cutting object W.
　具体的に切断装置１００は、図３に示すように、切断対象物Ｗを吸着して保持する切断テーブル２と、切断テーブル２に保持された切断対象物Ｗをブレード３１により切断する切断機構３と、切断テーブル２に切断対象物Ｗを搬送する搬送機構４（以下、ローダ４ともいう。）と、切断テーブル２上で切断された切断品Ｐを切断テーブル２から搬出する搬出機構５（以下、アンローダ５ともいう。）とを備えている。 Specifically, as shown in FIG. 3, the cutting device 100 has a cutting table 2 that adsorbs and holds the cutting object W, and a cutting mechanism 3 that cuts the cutting object W held by the cutting table 2 by the blade 31. A transport mechanism 4 (hereinafter, also referred to as a loader 4) for transporting the object W to be cut to the cutting table 2, and a carry-out mechanism 5 (hereinafter, also referred to as) for transporting the cut product P cut on the cutting table 2 from the cutting table 2. , Also referred to as unloader 5).
　切断テーブル２は、切断対象物Ｗを吸着して保持するものであり、図４に示すように、互いに隣接する分割要素Ｗ１、Ｗ２において、一方の分割要素Ｗ１を吸着する第１テーブル吸着部２１と、他方の分割要素Ｗ２を吸着する第２テーブル吸着部２２とを有している。なお、切断テーブル２は、図示しない移動機構によって、少なくともＹ方向に移動可能に構成されている。また、切断テーブル２は、図示しない回転機構によってθ方向に回転するように構成しても良い。 The cutting table 2 sucks and holds the object W to be cut, and as shown in FIG. 4, the first table suction unit 21 that sucks one of the split elements W1 in the split elements W1 and W2 adjacent to each other. And a second table adsorption unit 22 that adsorbs the other split element W2. The cutting table 2 is configured to be movable in at least the Y direction by a moving mechanism (not shown). Further, the cutting table 2 may be configured to rotate in the θ direction by a rotation mechanism (not shown).
　第１テーブル吸着部２１及び第２テーブル吸着部２２は、互いに独立しており、それぞれが独立して吸着とその停止とを切り替えることができるように構成されている。 The first table suction unit 21 and the second table suction unit 22 are independent of each other, and each is configured to be able to independently switch between suction and its stop.
　具体的に第１テーブル吸着部２１は、切断対象物Ｗにおける奇数列（１列、３列、５列、・・・）の分割要素Ｗ１を一括して吸着するものであり、第２テーブル吸着部２２は、切断対象物Ｗにおける偶数列（２列、４列、６列、・・・）の分割要素Ｗ２を一括して吸着するものである。つまり、切断テーブル２は、奇数列の分割要素Ｗ１の吸着又はその停止と、偶数列の分割要素Ｗ２の吸着又はその停止とを独立して切り替えることができるように構成されている。 Specifically, the first table suction unit 21 collectively sucks the divided elements W1 of the even-numbered rows (1 row, 3 rows, 5 rows, ...) In the object W to be cut, and sucks the second table. The unit 22 collectively adsorbs the even-numbered rows (2 rows, 4 rows, 6 rows, ...) Of the even-numbered rows (2 rows, 4 rows, 6 rows, ...) Of the cut object W. That is, the cutting table 2 is configured so that the adsorption or stop of the odd-numbered split element W1 and the suction or stop of the even-numbered split element W2 can be independently switched.
　第１テーブル吸着部２１は、切断テーブル２の上面に開口する第１吸着孔２１ａと、当該第１吸着孔２１ａに連続し、切断テーブル２の内部に形成された第１内部流路２１ｂと、当該第１内部流路２１ｂに接続された第１吸引ポンプ２１ｃとを有している。また、第２テーブル吸着部２２は、切断テーブル２の上面に開口する第２吸着孔２２ａと、当該第２吸着孔２２ａに連続し、切断テーブル２の内部に形成された第２内部流路２２ｂと、当該第２内部流路２２ｂに接続された第２吸引ポンプ２２ｃとを有している。なお、第１吸引ポンプ２１ｃと第２吸引ポンプ２２ｃを共通として、例えば図示しない切替バルブを用いて吸引ポンプに接続される内部流路を切り替えるように構成しても良い。なお、吸引ポンプの他にエジェクタを用いることもできる。 The first table suction unit 21 includes a first suction hole 21a that opens on the upper surface of the cutting table 2, a first internal flow path 21b that is continuous with the first suction hole 21a and is formed inside the cutting table 2. It has a first suction pump 21c connected to the first internal flow path 21b. Further, the second table suction portion 22 is continuous with the second suction hole 22a opened on the upper surface of the cutting table 2 and the second suction hole 22a, and the second internal flow path 22b formed inside the cutting table 2. And a second suction pump 22c connected to the second internal flow path 22b. The first suction pump 21c and the second suction pump 22c may be shared, and the internal flow path connected to the suction pump may be switched by using, for example, a switching valve (not shown). An ejector can also be used in addition to the suction pump.
　切断機構３は、切断対象物Ｗを直線状に切断するものであり、図３に示すように、ブレード３１と、当該ブレード３１を回転させるスピンドル部３２と、当該スピンドル部３２を少なくともＸ方向及びＺ方向に移動させる移動機構（不図示）とを備えている。ブレード３１の回転軸方向は、切断テーブル２の上面に平行であり、ここでは、水平方向に沿った方向である。そして、切断テーブル２と切断機構３とを相対的に移動させることによって、切断対象物Ｗがブレード３１によって切断される。 The cutting mechanism 3 cuts the object W to be cut in a straight line, and as shown in FIG. 3, the blade 31, the spindle portion 32 for rotating the blade 31, and the spindle portion 32 are cut at least in the X direction and at least in the X direction. It is equipped with a moving mechanism (not shown) that moves in the Z direction. The direction of rotation of the blade 31 is parallel to the upper surface of the cutting table 2, and here, the direction is along the horizontal direction. Then, by relatively moving the cutting table 2 and the cutting mechanism 3, the cutting object W is cut by the blade 31.
　ローダ４は、切断対象物Ｗを収容する切断対象物収容部６（図３参照）から切断テーブル２に切断対象物Ｗを搬送するものである。また、ローダ４は、後述するように、切断テーブル２において互いに隣接する分割要素Ｗ１、Ｗ２の切断線ＣＬ１、ＣＬ２が一致するように互いに隣接する分割要素Ｗ１、Ｗ２の一方を移動させるものである。 The loader 4 conveys the object to be cut W from the object accommodating unit 6 (see FIG. 3) for accommodating the object W to be cut to the cutting table 2. Further, as will be described later, the loader 4 moves one of the dividing elements W1 and W2 adjacent to each other so that the cutting lines CL1 and CL2 of the dividing elements W1 and W2 adjacent to each other in the cutting table 2 coincide with each other. ..
　具体的にローダ４は、図５に示すように、切断対象物Ｗを吸着するための搬送吸着部４１１、４１２が設けられた吸着ブロック４１と、当該吸着ブロック４１を移動させる移動機構（不図示）とを備えている。 Specifically, as shown in FIG. 5, the loader 4 has a suction block 41 provided with transport suction portions 411 and 412 for sucking the object W to be cut, and a moving mechanism (not shown) for moving the suction block 41. ) And.
　吸着ブロック４１には、互いに隣接する分割要素Ｗ１、Ｗ２において、一方の分割要素Ｗ１を吸着する第１搬送吸着部４１１と、他方の分割要素Ｗ２を吸着する第２搬送吸着部４１２とが設けられている。つまり、ローダ４の吸着ブロック４１は、切断テーブル２の各テーブル吸着部２１、２２に対応する搬送吸着部４１１、４１２を有している。 The suction block 41 is provided with a first transport suction unit 411 that sucks one of the split elements W1 and a second transport suction unit 412 that sucks the other split element W2 in the split elements W1 and W2 that are adjacent to each other. ing. That is, the suction block 41 of the loader 4 has transport suction portions 411 and 412 corresponding to the table suction portions 21 and 22 of the cutting table 2.
　具体的に第１搬送吸着部４１１は、切断対象物Ｗにおける奇数列（１列、３列、５列、・・・）の分割要素Ｗ１を吸着するものであり、第２搬送吸着部４１２は、切断対象物Ｗにおける偶数列（２列、４列、６列、・・・）の分割要素Ｗ２を吸着するものである。つまり、ローダ４は、奇数列の分割要素Ｗ１の吸着又はその停止と、偶数列の分割要素Ｗ２の吸着又はその停止とを独立して切り替えることができるように構成されている。 Specifically, the first transport suction unit 411 adsorbs the even-numbered rows (1 row, 3 rows, 5 rows, ...) Of the divided elements W1 in the object W to be cut, and the second transport suction unit 412 , The dividing element W2 of an even number of rows (2 rows, 4 rows, 6 rows, ...) In the cutting target W is adsorbed. That is, the loader 4 is configured to be able to independently switch between sucking or stopping the odd-numbered row dividing element W1 and sucking or stopping the even-numbered row splitting element W2.
　第１搬送吸着部４１１は、吸着ブロック４１の下面に開口する第１吸着孔４１１ａと、当該第１吸着孔４１１ａに連続し、吸着ブロック４１の内部に形成された第１内部流路４１１ｂと、当該第１内部流路４１１ｂに接続された第１吸引ポンプ４１１ｃとを有している。なお、第１吸着孔４１１ａには、例えば樹脂製の吸着パッド４１１ｄが設けられている。また、第２搬送吸着部４１２は、吸着ブロック４１の下面に開口する第２吸着孔４１２ａと、当該第２吸着孔４１２ａに連続し、吸着ブロック４１の内部に形成された第２内部流路４１２ｂと、当該第２内部流路４１２ｂに接続された第２吸引ポンプ４１２ｃとを有している。なお、第２吸着孔４１２ａには、吸着パッド４１２ｄが設けられている。その他、第１吸引ポンプ４１１ｃと第２吸引ポンプ４１２ｃを共通として、例えば図示しない切替バルブを用いて吸引ポンプに接続される内部流路を切り替えるように構成しても良い。 The first transport suction unit 411 includes a first suction hole 411a that opens on the lower surface of the suction block 41, a first internal flow path 411b that is continuous with the first suction hole 411a and is formed inside the suction block 41. It has a first suction pump 411c connected to the first internal flow path 411b. The first suction hole 411a is provided with, for example, a resin suction pad 411d. Further, the second transport suction unit 412 is continuous with the second suction hole 412a opened on the lower surface of the suction block 41 and the second suction hole 412a, and the second internal flow path 412b formed inside the suction block 41. And a second suction pump 412c connected to the second internal flow path 412b. The second suction hole 412a is provided with a suction pad 412d. In addition, the first suction pump 411c and the second suction pump 412c may be shared in common, and the internal flow path connected to the suction pump may be switched by using, for example, a switching valve (not shown).
　アンローダ５は、切断された切断品Ｐを吸着して、切断テーブル２から切断品収容部７（図３参照）に切断品Ｐを搬送するものである。具体的にアンローダ５は、図６に示すように、切断品Ｐを吸着するための搬送吸着部５１１が設けられた吸着ブロック５１と、当該吸着ブロック５１を移動させる移動機構（不図示）とを備えている。 The unloader 5 adsorbs the cut cut product P and conveys the cut product P from the cutting table 2 to the cut product accommodating portion 7 (see FIG. 3). Specifically, as shown in FIG. 6, the unloader 5 has a suction block 51 provided with a transport suction unit 511 for sucking the cut product P, and a moving mechanism (not shown) for moving the suction block 51. I have.
　吸着ブロック５１の搬送吸着部５１１は、吸着ブロック５１の下面に開口する吸着孔５１１ａと、当該吸着孔５１１ａに連続し、吸着ブロック５１の内部に形成された内部流路５１１ｂと、当該内部流路５１１ｂに接続された吸引ポンプ５１１ｃとを有している。吸着孔５１１ａには、例えば樹脂製の吸着パッド５１１ｄが設けられている。このようにアンローダ５は、ローダ４とは異なり、独立した２つの搬送吸着部を有さずに、複数の切断品Ｐを区別なく吸着する搬送吸着部５１１を有する構成である。なお、図６では、奇数列の吸着孔５１１ａと偶数列の吸着孔５１１ａとがＹ方向に一直線に並んでいるが、互いにずれていても良い。 The transport suction portion 511 of the suction block 51 has a suction hole 511a that opens on the lower surface of the suction block 51, an internal flow path 511b that is continuous with the suction hole 511a and is formed inside the suction block 51, and the internal flow path. It has a suction pump 511c connected to 511b. The suction hole 511a is provided with, for example, a resin suction pad 511d. As described above, unlike the loader 4, the unloader 5 does not have two independent transport suction units, but has a transport suction unit 511 that sucks a plurality of cut products P without distinction. In FIG. 6, the odd-numbered rows of suction holes 511a and the even-numbered rows of suction holes 511a are aligned in the Y direction, but they may be offset from each other.
＜切断装置１００の切断動作＞
　この切断装置１００の動作について、図７及び図８を参照して説明する。なお、以下の切断動作は、制御部ＣＴＬ（図３参照）により各部が制御されることにより行われる。 <Cut operation of cutting device 100>
The operation of the cutting device 100 will be described with reference to FIGS. 7 and 8. The following cutting operation is performed by controlling each unit by the control unit CTL (see FIG. 3).
（１）切断対象物Ｗの搬入
　ローダ４が、切断対象物収容部６に収容されている切断対象物Ｗを吸着して保持し、切断テーブル２に搬送する。切断テーブル２に搬送された切断対象物Ｗは、切断テーブル２の第１テーブル吸着部２１及び第２テーブル吸着部２２により吸着されて保持される（図７の＜切断対象物を吸着保持＞）。ここで、切断テーブル２に対する切断対象物Ｗの位置決めは、例えば、切断対象物Ｗに形成された位置決め用の孔と、切断テーブル２に設けられた位置決めピンとを嵌め合わせることにより行われる。その他、切断対象物Ｗに形成された位置決め用の孔とローダ４に設けられた位置決めピンとを嵌めあわせることにより行うこともできる。 (1) Carrying in the object to be cut W The loader 4 attracts and holds the object W to be cut housed in the object accommodating unit 6 to be cut, and conveys the object W to the cutting table 2. The object W to be cut transported to the cutting table 2 is adsorbed and held by the first table adsorption unit 21 and the second table adsorption unit 22 of the cutting table 2 (<adsorption and holding of the object to be cut> in FIG. 7). .. Here, the positioning of the cutting object W with respect to the cutting table 2 is performed, for example, by fitting a positioning hole formed in the cutting object W with a positioning pin provided in the cutting table 2. In addition, it can also be performed by fitting the positioning hole formed in the object W to be cut and the positioning pin provided in the loader 4.
（２）連結部Ｗ３の切断
　切断テーブル２に吸着保持された切断対象物Ｗの連結部Ｗ３を切断機構３により切断する（図７及び図８の＜連結部の切断＞）。本実施形態では、複数の分割要素Ｗ１、Ｗ２の両端部を連結する連結部Ｗ３をそれぞれ切断する。これにより、切断対象物Ｗの複数の分割要素Ｗ１、Ｗ２は、互いに分離した状態となる。この状態においては、奇数列の分割要素Ｗ１と偶数列の分割要素Ｗ２との切断線ＣＬ１、ＣＬ２は、互い違い（千鳥状）で同一直線上にはなく、互いに異なる直線上に位置している。 (2) Cutting of the connecting portion W3 The connecting portion W3 of the object to be cut W adsorbed and held on the cutting table 2 is cut by the cutting mechanism 3 (<cutting of the connecting portion> in FIGS. 7 and 8). In the present embodiment, the connecting portion W3 connecting both ends of the plurality of dividing elements W1 and W2 is cut. As a result, the plurality of dividing elements W1 and W2 of the object to be cut W are separated from each other. In this state, the cutting lines CL1 and CL2 between the odd-numbered row dividing element W1 and the even-numbered row dividing element W2 are staggered (staggered) and not on the same straight line, but on different straight lines.
（３）偶数列の分割要素Ｗ２の吸着停止
　連結部Ｗ３が切断されて互いに隣接する分割要素Ｗ１、Ｗ２が互いに分離した状態において、切断テーブル２は、第２テーブル吸着部２２による偶数列の分割要素Ｗ２の吸着を停止する（図７及び図８の＜偶数列の吸着停止・持ち上げ＞）。なお、切断テーブル２において、第１テーブル吸着部２１による奇数列の分割要素Ｗ１の吸着を維持されている。ここで、第２テーブル吸着部２２による吸着を停止する前に、ローダ４の吸着パッド（具体的には第２搬送吸着部４１２の吸着パッド４１２ｄ）を偶数列の分割要素Ｗ２に押し付けておく。これにより、切断テーブル２の第２テーブル吸着部２２の吸着を停止することによる偶数列の分割要素Ｗ２の位置ズレを防止している。 (3) Stopping adsorption of even-numbered row dividing elements W2 In a state where the connecting portion W3 is cut and the adjacent dividing elements W1 and W2 are separated from each other, the cutting table 2 is divided into even-numbered rows by the second table adsorption unit 22. Stops the adsorption of the element W2 (<stopping / lifting of even-numbered rows of adsorption> in FIGS. 7 and 8). In the cutting table 2, the adsorption of the odd-numbered row of the dividing elements W1 by the first table adsorption unit 21 is maintained. Here, before stopping the suction by the second table suction unit 22, the suction pad of the loader 4 (specifically, the suction pad 412d of the second transport suction unit 412) is pressed against the even-numbered row of dividing elements W2. This prevents the position of the even-numbered division element W2 from being displaced by stopping the adsorption of the second table adsorption unit 22 of the cutting table 2.
（４）偶数列の分割要素Ｗ２の再配置
　ローダ４は、切断テーブル２において吸着が停止された偶数列の分割要素Ｗ２を吸着した後に、当該偶数列の分割要素Ｗ２を切断テーブル２から持ち上げる（図７及び図８の＜偶数列の吸着停止・持ち上げ＞）。そして、ローダ４は、偶数列の分割要素Ｗ２の切断線ＣＬ２が奇数列の分割要素Ｗ１の切断線ＣＬ１と同一直線上となるように揃えて再配置する（図７及び図８の＜偶数列の再配置＞）。再配置された偶数列の分割要素Ｗ２は、第２テーブル吸着部２２によって切断テーブル２に吸着保持される。 (4) Relocation of the even-numbered split element W2 The loader 4 sucks the even-numbered split element W2 whose adsorption has been stopped in the cutting table 2, and then lifts the even-numbered split element W2 from the cutting table 2 (4). <Stopping / lifting of even-numbered rows> in FIGS. 7 and 8). Then, the loader 4 is aligned and rearranged so that the cutting line CL2 of the even-numbered dividing element W2 is on the same straight line as the cutting line CL1 of the odd-numbered dividing element W1 (<even-numbered columns in FIGS. 7 and 8). Relocation>). The rearranged even-numbered rows of dividing elements W2 are sucked and held on the cutting table 2 by the second table suction unit 22.
　ここで、偶数列の分割要素Ｗ２の再配置における位置決めは、（ｉ）偶数列の分割要素Ｗ２を移動させる前に、奇数列の分割要素Ｗ１及び偶数列の分割要素Ｗ２の配置（例えばエッジ部分やリード部分などの特徴部）をカメラにより画像認識して、当該画像認識により偶数列の分割要素Ｗ２の位置決めの移動量を算出し、算出した移動量に基づいてローダ４を制御することにより行うことが考えられる。その他、偶数列の分割要素Ｗ２の再配置における位置決めは、（ｉｉ）偶数列の分割要素Ｗ２に設けた位置決め用の孔と、切断テーブル２に設けた位置決め用のピンとを嵌め合わせることにより行うこともできるし、（ｉｉｉ）予め偶数列の分割要素Ｗ２の位置調整量を設定しておき、その位置調整量に基づいてローダ４の移動機構を制御することにより行うこともできる。 Here, the positioning in the rearrangement of the even-numbered division element W2 is as follows: (i) The arrangement of the even-numbered division element W1 and the even-numbered division element W2 (for example, the edge portion) before moving the even-numbered division element W2. The image is recognized by the camera, the moving amount of the positioning of the even-numbered dividing element W2 is calculated by the image recognition, and the loader 4 is controlled based on the calculated moving amount. Is possible. In addition, positioning in the rearrangement of the even-numbered row dividing element W2 is performed by (ii) fitting the positioning hole provided in the even-numbered row dividing element W2 and the positioning pin provided in the cutting table 2. Alternatively, (iii) the position adjustment amount of the even-numbered column division element W2 may be set in advance, and the movement mechanism of the loader 4 may be controlled based on the position adjustment amount.
（５）奇数列及び偶数列の分割要素Ｗ１、Ｗ２の切断
　偶数列の分割要素Ｗ２が再配置された後に、切断機構３は、同一直線上にある奇数列の分割要素Ｗ１の切断線ＣＬ１と偶数列の分割要素Ｗ２の切断線ＣＬ２とを切断する（図８の＜奇数列及び偶数列の切断＞）。なお、複数の分割要素Ｗ１、Ｗ２の切断前に、カメラにより画像認識して、奇数列の分割要素Ｗ１の切断線ＣＬ１と偶数列の分割要素Ｗ２の切断線ＣＬ２とが同一直線上にあることを確認してもよい。 (5) Cutting of the odd-numbered and even-numbered dividing elements W1 and W2 After the even-numbered dividing elements W2 are rearranged, the cutting mechanism 3 and the cutting line CL1 of the odd-numbered dividing elements W1 on the same straight line. It cuts the even-numbered column dividing element W2 from the cutting line CL2 (<cutting of odd-numbered columns and even-numbered columns> in FIG. 8). Before cutting the plurality of dividing elements W1 and W2, the image is recognized by the camera, and the cutting line CL1 of the odd-numbered dividing element W1 and the cutting line CL2 of the even-numbered dividing element W2 are on the same straight line. May be confirmed.
（６）切断品Ｐの搬出
　アンローダ５は、切断テーブル２に吸着保持されている複数の切断品Ｐを吸着して保持し、切断品収容部７に搬送する。ここで、切断テーブル２の吸着を解除する前に、アンローダ５の吸着パッド５１１ｄを複数の切断品Ｐに押し付けることにより、複数の切断品Ｐの位置ズレや吸着ミスを防止するようにしても良い。 (6) Carrying out the cut product P The unloader 5 sucks and holds a plurality of cut products P adsorbed and held on the cutting table 2 and conveys them to the cut product accommodating unit 7. Here, the suction pad 511d of the unloader 5 may be pressed against the plurality of cut products P before the suction of the cutting table 2 is released to prevent the position shift and the suction error of the plurality of cut products P. ..
＜本実施形態の効果＞
　本実施形態の切断装置１００によれば、切断テーブル２が、互いに隣接する分割要素Ｗ１、Ｗ２の一方を吸着する第１テーブル吸着部２１と、当該第１テーブル吸着部２１とは独立しており、互いに隣接する分割要素Ｗ１、Ｗ２の他方を吸着する第２テーブル吸着部２２とを有するので、互いに隣接する分割要素Ｗ１、Ｗ２の一方又は他方のみの吸着を解除して、切断テーブル２に対して再配置する、或いは、切断テーブル２から取り出すことができる。これにより、互いに隣接する分割要素Ｗ１、Ｗ２内の切断線ＣＬ１、ＣＬ２が互いに異なる直線上に設定された切断対象物Ｗをブレード３１により容易に切断できるようにすることができる。 <Effect of this embodiment>
According to the cutting device 100 of the present embodiment, the cutting table 2 is independent of the first table suction unit 21 that sucks one of the divided elements W1 and W2 adjacent to each other and the first table suction unit 21. Since it has a second table adsorption unit 22 that adsorbs the other of the divided elements W1 and W2 that are adjacent to each other, the adsorption of only one or the other of the divided elements W1 and W2 that are adjacent to each other is released to the cutting table 2. Can be rearranged or removed from the cutting table 2. Thereby, the cutting object W in which the cutting lines CL1 and CL2 in the dividing elements W1 and W2 adjacent to each other are set on different straight lines can be easily cut by the blade 31.
＜その他の変形実施形態＞
　なお、本発明は前記実施形態に限られるものではない。 <Other modified embodiments>
The present invention is not limited to the above embodiment.
　例えば、前記実施形態では、偶数列の分割要素Ｗ２を再配置する構成であったが、奇数列の分割要素Ｗ１を再配置することにより、奇数列の分割要素Ｗ１の切断線ＣＬ１と偶数列の分割要素Ｗ２の切断線ＣＬ２とを揃える構成としても良い。 For example, in the above embodiment, the even-numbered column dividing element W2 is rearranged, but by rearranging the odd-numbered column dividing element W1, the cutting line CL1 of the odd-numbered column dividing element W1 and the even-numbered column are arranged. It may be configured to align with the cutting line CL2 of the dividing element W2.
　前記実施形態では、ローダ４が第１搬送吸着部４１１及び第２搬送吸着部４１２を有する構成であったが、何れか一方のみを有する構成としても良い。例えば、ローダ４が第１搬送吸着部４１１のみを有する構成の場合には、切断対象物Ｗを切断テーブル２に搬入する際には、ローダ４は奇数列の分割要素Ｗ１を吸着保持して搬入することになる。また、連結部Ｗ３を切断後においては、切断テーブル２の第１テーブル吸着部２１が奇数列の分割要素Ｗ１の吸着を停止し、ローダ４は吸着が停止された奇数列の分割要素Ｗ１を再配置することになる。 In the above embodiment, the loader 4 has a configuration having a first transport suction unit 411 and a second transport suction unit 412, but a configuration having only one of them may be used. For example, in the case where the loader 4 has only the first transport suction unit 411, when the cutting object W is carried into the cutting table 2, the loader 4 sucks and holds the odd-numbered row of division elements W1 and carries in. Will be done. Further, after the connecting portion W3 is cut, the first table suction portion 21 of the cutting table 2 stops the suction of the odd-numbered row dividing element W1, and the loader 4 re-adsorbs the odd-numbered row split element W1 from which the suction is stopped. Will be placed.
　また、前記実施形態では、ローダ４により奇数列又は偶数列の分割要素Ｗ１、Ｗ２を再配置する構成であったが、アンローダ５を用いて奇数列又は偶数列の分割要素Ｗ１、Ｗ２を再配置する構成としても良い。この場合、アンローダ５は、前記実施形態のローダ４と同様に、奇数列の分割要素Ｗ１を吸着する第１搬送吸着部及び偶数列の分割要素Ｗ２を吸着する第２搬送吸着部を有する構成となる。 Further, in the above embodiment, the odd-numbered column or even-numbered column dividing elements W1 and W2 are rearranged by the loader 4, but the odd-numbered column or even-numbered column dividing elements W1 and W2 are rearranged by using the unloader 5. It may be configured to be used. In this case, the unloader 5 has a configuration having a first transport suction unit that sucks the odd-numbered row of the split elements W1 and a second transport suction unit that sucks the even-numbered row of the split elements W2, similarly to the loader 4 of the embodiment. Become.
　さらに、前記実施形態では、奇数列又は偶数列の分割要素Ｗ１、Ｗ２の一方のみを再配置する構成であったが、例えば切断対象物Ｗに設定された切断線ＣＬ１、ＣＬ２の配置態様によっては、奇数列及び偶数列の分割要素Ｗ１、Ｗ２の両方を再配置する構成としても良い。 Further, in the above-described embodiment, only one of the odd-numbered row or even-numbered row dividing elements W1 and W2 is rearranged. , Both the odd-numbered column and the even-numbered column dividing elements W1 and W2 may be rearranged.
　前記実施形態では、奇数列の分割要素Ｗ１の切断線ＣＬ１と偶数列の分割要素Ｗ２の切断線ＣＬ２とを揃えて一挙に切断する構成であったが、以下のものであっても良い。例えば、連結部Ｗ３を切断した後に、偶数列の分割要素Ｗ２を切断テーブル２から取り出し、奇数列の分割要素Ｗ１の切断線ＣＬ１を切断して個片化する。そして、個片化された切断品Ｐを切断テーブル２から搬出した後に、偶数列の分割要素Ｗ２を切断テーブル２に吸着保持させて、偶数列の分割要素Ｗ２の切断線ＣＬ２を切断して個片化する。そして、個片化された切断品Ｐを切断テーブル２から搬出する。 In the above embodiment, the cutting line CL1 of the odd-numbered dividing element W1 and the cutting line CL2 of the even-numbered dividing element W2 are aligned and cut at once, but the following may be used. For example, after cutting the connecting portion W3, the even-numbered column dividing element W2 is taken out from the cutting table 2, and the cutting line CL1 of the odd-numbered column dividing element W1 is cut to be individualized. Then, after the individualized cut product P is carried out from the cutting table 2, the even-numbered division element W2 is adsorbed and held on the cutting table 2, and the cutting line CL2 of the even-numbered division element W2 is cut and individually. Disintegrate. Then, the individualized cut product P is carried out from the cutting table 2.
　本発明の切断装置１００により切断される切断対象物Ｗは、前記実施形態に限られず、樹脂成形されていない例えばプリント基板（ＰＣＢ基板）などの基板であっても良い。この場合、切断対象物Ｗは、図９に示すように、例えばルータ加工により切り込みＫが入れられた基板であり、当該基板は、平面視において概略Ｌ字形状の複数の分割要素Ｗ１、Ｗ２が連結部Ｗ３によって連結されるとともに、互いに隣接する分割要素Ｗ１、Ｗ２内の切断線ＣＬ１、ＣＬ２が互いに異なる直線上に設定されている。このような切断対象物Ｗにおいても、前記実施形態と同様、連結部Ｗ３を切断した後に、奇数列の分割要素Ｗ１の切断線ＣＬ１と偶数列の分割要素Ｗ２の切断線ＣＬ２とを揃えた後に、それらを一挙に切断することができる（図９の＜奇数列及び偶数列の切断線を揃えて切断＞）。また、連結部Ｗ３を切断した後に、奇数列の分割要素Ｗ１及び偶数列の分割要素Ｗ２を別々に切断することもできる（図９の＜奇数列及び偶数列を別々に切断＞）。 The object W to be cut by the cutting device 100 of the present invention is not limited to the above embodiment, and may be a substrate such as a printed circuit board (PCB substrate) that is not resin-molded. In this case, as shown in FIG. 9, the cutting object W is a substrate in which a notch K is made by, for example, router processing, and the substrate has a plurality of dividing elements W1 and W2 having a substantially L-shaped shape in a plan view. The cutting lines CL1 and CL2 in the dividing elements W1 and W2 adjacent to each other are set on different straight lines while being connected by the connecting portion W3. In such a cutting object W as well, as in the above embodiment, after cutting the connecting portion W3, the cutting line CL1 of the odd-numbered dividing element W1 and the cutting line CL2 of the even-numbered dividing element W2 are aligned. , They can be cut at once (<cutting by aligning the cutting lines of odd-numbered columns and even-numbered columns> in FIG. 9). Further, after cutting the connecting portion W3, the odd-numbered column dividing element W1 and the even-numbered column dividing element W2 can be separately cut (<cutting the odd-numbered column and the even-numbered column separately> in FIG. 9).
　前記実施形態の切断対象物Ｗは、複数の分割要素の配置態様が２つの組（奇数列及び偶数列）に分けられており、奇数列の分割要素Ｗ１と偶数列の分割要素Ｗ２とで切断線ＣＬ１、ＣＬ２が互いに異なるものであったが、奇数列の分割要素と偶数列の分割要素とに限られず、複数の分割要素において互いに切断線が同一直線上にない分割要素を有するものにも適用することができる。例えば、切断対象物Ｗの複数の分割要素の配置態様が例えば左右２列ずつで同じである等のように組分けされているものであっても良い。その他、切断対象物Ｗは、複数の分割要素の配置態様が３つ以上の組に分けられたものであっても良い。 The cutting object W of the above-described embodiment is divided into two sets (odd-numbered columns and even-numbered columns) in which a plurality of dividing elements are arranged, and is cut by the odd-numbered column dividing elements W1 and the even-numbered columns of the dividing elements W2. The lines CL1 and CL2 were different from each other, but they are not limited to the odd-numbered column dividing element and the even-numbered column dividing element, and also include those having a dividing element in which the cutting lines are not on the same straight line in a plurality of dividing elements. Can be applied. For example, the arrangement mode of the plurality of division elements of the object W to be cut may be grouped so that the left and right two columns are the same, for example. In addition, the object W to be cut may be divided into three or more sets in which a plurality of division elements are arranged.
　その他、本発明は前記実施形態に限られず、その趣旨を逸脱しない範囲で種々の変形が可能であるのは言うまでもない。 In addition, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the spirit of the present invention.
　本発明によれば、互いに隣接する分割要素内の切断線が互いに異なる直線上に設定された切断対象物をブレードにより容易に切断できるようにすることができる。

  According to the present invention, it is possible to easily cut an object to be cut by cutting objects whose cutting lines in the dividing elements adjacent to each other are set on different straight lines.

Claims (6)

  1. 　複数の分割要素が連結部によって連結されるとともに、互いに隣接する前記分割要素内の切断線が互いに異なる直線上に設定された切断対象物を、前記切断線に沿って切断する切断装置であって、
    　前記切断対象物を吸着して保持する切断テーブルと、
    　前記切断テーブルに保持された前記切断対象物をブレードにより切断する切断機構とを備え、
    　前記切断テーブルは、互いに隣接する前記分割要素において、一方の前記分割要素を吸着する第１テーブル吸着部と、当該第１テーブル吸着部とは独立しており、他方の前記分割要素を吸着する第２テーブル吸着部とを有する、切断装置。     A cutting device in which a plurality of dividing elements are connected by a connecting portion and a cutting object whose cutting lines in the dividing elements adjacent to each other are set on different straight lines is cut along the cutting line. ,
    A cutting table that adsorbs and holds the object to be cut,
    It is provided with a cutting mechanism for cutting the object to be cut held on the cutting table with a blade.
    In the divided elements adjacent to each other, the cutting table is independent of the first table adsorption unit that adsorbs one of the divided elements and the first table adsorption unit, and adsorbs the other divided element. A cutting device having two table suction portions.
  2. 　前記切断テーブルに前記切断対象物を搬送する搬送機構をさらに備え、
    　前記搬送機構は、互いに隣接する前記分割要素において一方又は他方のみを吸着する搬送吸着部を有する、請求項１に記載の切断装置。     The cutting table is further provided with a transport mechanism for transporting the object to be cut.
    The cutting device according to claim 1, wherein the transport mechanism has a transport suction unit that adsorbs only one or the other of the split elements adjacent to each other.
  3. 　前記連結部が前記切断機構により切断されて互いに隣接する前記分割要素が互いに分離した状態において、前記切断テーブルは、前記第１テーブル吸着部又は前記第２テーブル吸着部の一方による前記分割要素の吸着を停止し、
    　前記搬送機構は、前記切断テーブルにおいて吸着が停止された前記分割要素を吸着した後に、互いに隣接する前記分割要素の切断線が同一直線上となるように揃える、請求項２に記載の切断装置。     In a state where the connecting portion is cut by the cutting mechanism and the dividing elements adjacent to each other are separated from each other, the cutting table is capable of adsorbing the dividing element by either the first table suction portion or the second table suction portion. Stop and
    The cutting device according to claim 2, wherein the transport mechanism aligns the divided elements whose adsorption has been stopped on the cutting table so that the cutting lines of the divided elements adjacent to each other are aligned on the same straight line.
  4. 　前記複数の分割要素は、前記ブレードによる切断方向に沿って配列され、それらの配置態様が少なくとも２つの組に分けられており、一方の組の前記分割要素の切断線が同一直線上に位置し、他方の組の前記分割要素の切断線が同一直線上に位置しており、
    　前記第１テーブル吸着部は、前記一方の組の分割要素を吸着するものであり、
    　前記第２テーブル吸着部は、前記他方の組の分割要素を吸着するものである、請求項１乃至３の何れか一項に記載の切断装置。     The plurality of dividing elements are arranged along the cutting direction by the blade, and their arrangement mode is divided into at least two sets, and the cutting lines of the dividing elements in one set are located on the same straight line. , The cutting line of the other set of the dividing elements is located on the same straight line.
    The first table adsorption unit adsorbs one of the set of dividing elements.
    The cutting device according to any one of claims 1 to 3, wherein the second table adsorption unit adsorbs the other set of dividing elements.
  5. 　前記搬送機構は、
    　前記一方の組の分割要素を吸着する第１搬送吸着部と、
    　前記他方の組の分割要素を吸着する第２搬送吸着部とを有するものである、請求項２もしくは３、又は、請求項２を引用する請求項４に記載の切断装置。     The transport mechanism is
    A first transport adsorption unit that adsorbs one set of split elements,
    The cutting device according to claim 2 or 3, or claim 4, which cites claim 2, which has a second transport suction section that adsorbs the other set of split elements.
  6. 　請求項１乃至５の何れか一項に記載の切断装置を用いた切断品の製造方法。

          A method for manufacturing a cut product using the cutting device according to any one of claims 1 to 5.
PCT/JP2021/038659 2020-11-24 2021-10-19 Cutting device and production method of cut article WO2022113572A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202180076966.1A CN116547108A (en) 2020-11-24 2021-10-19 Cutting device and method for manufacturing cut product
KR1020237016369A KR20230088772A (en) 2020-11-24 2021-10-19 Manufacturing method of cutting device and cut product

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020194369A JP7530809B2 (en) 2020-11-24 2020-11-24 Cutting device and method for manufacturing cut products
JP2020-194369 2020-11-24

Publications (1)

Publication Number Publication Date
WO2022113572A1 true WO2022113572A1 (en) 2022-06-02

Family

ID=81754308

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/038659 WO2022113572A1 (en) 2020-11-24 2021-10-19 Cutting device and production method of cut article

Country Status (5)

Country Link
JP (1) JP7530809B2 (en)
KR (1) KR20230088772A (en)
CN (1) CN116547108A (en)
TW (1) TWI810693B (en)
WO (1) WO2022113572A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190932A (en) * 2011-03-09 2012-10-04 Disco Abrasive Syst Ltd Processing device
JP2017098465A (en) * 2015-11-26 2017-06-01 株式会社ディスコ Processing device
JP2018174191A (en) * 2017-03-31 2018-11-08 Ｔｏｗａ株式会社 Cutting device, sticking method of semiconductor package and manufacturing method of electronic component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6746022B2 (en) 2001-12-26 2004-06-08 Asm Assembly Automation Ltd. Chuck for holding a workpiece
JP7102157B2 (en) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 Cutting device and manufacturing method of cut products

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190932A (en) * 2011-03-09 2012-10-04 Disco Abrasive Syst Ltd Processing device
JP2017098465A (en) * 2015-11-26 2017-06-01 株式会社ディスコ Processing device
JP2018174191A (en) * 2017-03-31 2018-11-08 Ｔｏｗａ株式会社 Cutting device, sticking method of semiconductor package and manufacturing method of electronic component

Also Published As

Publication number Publication date
JP2022083106A (en) 2022-06-03
KR20230088772A (en) 2023-06-20
TW202221774A (en) 2022-06-01
TWI810693B (en) 2023-08-01
JP7530809B2 (en) 2024-08-08
CN116547108A (en) 2023-08-04

Similar Documents

Publication Publication Date Title
CN107533965B (en) Adsorption mechanism, adsorption method, manufacturing device and manufacturing method
JP5960532B2 (en) Processing method of package substrate
JP2006156809A (en) Cutter
US9508570B2 (en) Singulation apparatus and method
JP2008511164A5 (en)
JP2009135259A (en) Transport device and transport method of segmented electronic component
JP2012144261A (en) Transport tray
JP2010283016A (en) Method of manufacturing semiconductor package, and cutting device
WO2022113572A1 (en) Cutting device and production method of cut article
KR101779701B1 (en) Manufacturing apparatus and manufacturing method
WO2022113574A1 (en) Cutting device and cut item production method
WO2022113573A1 (en) Cutting device and method for manufacturing cut product
JP2012227485A (en) Processing method of package substrate
JP2004304194A (en) Sewing device for semiconductor package production process and its control method therefor
CN112440166B (en) Flange end face correction device and method, cutting device and cutting method
JP6218686B2 (en) Substrate cutting apparatus and substrate cutting method
TW201135903A (en) Punch singulation system and method
JP2013222835A (en) Method for dividing package substrate and dividing device
JP2003340787A (en) Board fixing device and method
KR100327759B1 (en) Mounter apparatus of semiconductor equipment
KR20130119615A (en) Method for sawing semiconductor material
JP2003297773A (en) Method and device for cutting substrate
KR20130007906A (en) System and method for singulation of semiconductor package

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21897550

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20237016369

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 202180076966.1

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21897550

Country of ref document: EP

Kind code of ref document: A1