TW202221774A - Cutting device and manufacturing method for cut product - Google Patents
Cutting device and manufacturing method for cut product Download PDFInfo
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- TW202221774A TW202221774A TW110139940A TW110139940A TW202221774A TW 202221774 A TW202221774 A TW 202221774A TW 110139940 A TW110139940 A TW 110139940A TW 110139940 A TW110139940 A TW 110139940A TW 202221774 A TW202221774 A TW 202221774A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 214
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 238000001179 sorption measurement Methods 0.000 claims description 39
- 230000011218 segmentation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 230000008707 rearrangement Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
本發明是有關於一種切斷裝置以及切斷品的製造方法。The present invention relates to a cutting device and a method for manufacturing a cut product.
先前,例如如專利文獻1所示,於將晶片級封裝(Chip Scale Package,CSP)基板等加工物切斷的切斷裝置中,有一種包括切斷工作台的切斷裝置,所述切斷工作台包括用於對封裝體進行抽吸的多個第一抽吸埠、以及用於對與封裝體鄰接的邊緣碎片(碎屑區域)進行抽吸的多個第二抽吸埠。於該切斷裝置中,多個第一抽吸埠以對應於所切斷的封裝體的配置結構形成陣列的方式配置,多個第二抽吸埠配置於與邊緣碎片的位置一致的多個第一抽吸埠的周邊附近。
[現有技術文獻]
[專利文獻]
Conventionally, as disclosed in
[專利文獻1]日本專利特開2003-234310號公報[Patent Document 1] Japanese Patent Laid-Open No. 2003-234310
[發明所欲解決之課題][The problem to be solved by the invention]
另一方面,近年來,於小外形電晶體(Small Outline Transistor,SOT)或小外形積體電路(Small Outline Integrated Circuit,SOIC)等半導體封裝中,為了使用大小相同的引線框架製造更多的封裝體,而如圖10般,使用引線交錯形成的引線框架製造樹脂成形而成的樹脂成形基板。On the other hand, in recent years, in semiconductor packages such as Small Outline Transistor (SOT) or Small Outline Integrated Circuit (SOIC), in order to use lead frames of the same size to manufacture more packages As shown in FIG. 10 , a resin-molded substrate formed by resin molding was produced using a lead frame formed by interlacing the leads.
然而,於使用引線交錯形成的引線框架的樹脂成形基板中,由於封裝體的切斷線並不位於同一直線上,故而現有的使用刀片的切斷裝置難以進行切斷。However, in a resin-molded substrate using a lead frame formed by staggered leads, since the cutting lines of the package are not located on the same straight line, it is difficult to cut the conventional cutting device using a blade.
因此,本發明是為了解決所述問題點而完成,其主要課題在於使得能夠藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。 [解決課題之手段] Therefore, the present invention has been made in order to solve the above-mentioned problems, and its main problem is to easily cut with a blade a cutting object whose cutting lines in mutually adjacent division elements are set on mutually different straight lines thing. [Means of Solving Problems]
即,本發明的切斷裝置是一種將藉由連結部連結多個分割要素、並且互相鄰接的所述分割要素內的切斷線被設定於互不相同的直線上的切斷對象物沿著所述切斷線切斷的切斷裝置,其特徵在於包括:切斷工作台,吸附並保持所述切斷對象物;以及切斷機構,藉由刀片切斷由所述切斷工作台保持的所述切斷對象物,且所述切斷工作台包括:第一工作台吸附部,吸附互相鄰接的所述分割要素中的其中一所述分割要素;以及第二工作台吸附部,獨立於該第一工作台吸附部,吸附另一所述分割要素。 [發明的效果] That is, the cutting device of the present invention is a cutting object along which a plurality of division elements are connected by a connecting portion and the cutting lines in the adjacent division elements are set on mutually different straight lines. The cutting device for cutting the cutting line is characterized by comprising: a cutting table for adsorbing and holding the object to be cut; and a cutting mechanism for cutting by a blade and being held by the cutting table the cutting object, and the cutting table includes: a first table suction part, which suctions one of the divided elements adjacent to each other; and a second table suction part, which is independent The other division element is adsorbed on the first table adsorption part. [Effect of invention]
根據以所述方式構成的本發明,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。According to the present invention constituted as described above, it is possible to easily cut a cutting object whose cutting lines in mutually adjacent division elements are set on mutually different straight lines by a blade.
以下,舉例對本發明進一步進行詳細說明。但本發明不受以下的說明所限定。Hereinafter, the present invention will be described in further detail by way of examples. However, the present invention is not limited by the following description.
本發明的切斷裝置如上文所述,為將藉由連結部連結多個分割要素、並且互相鄰接的所述分割要素內的切斷線被設定於互不相同的直線上的切斷對象物沿著所述切斷線切斷的切斷裝置,其特徵在於包括:切斷工作台,吸附並保持所述切斷對象物;以及切斷機構,藉由刀片切斷由所述切斷工作台保持的所述切斷對象物,且所述切斷工作台包括:第一工作台吸附部,吸附互相鄰接的所述分割要素中的其中一所述分割要素;以及第二工作台吸附部,獨立於該第一工作台吸附部,吸附另一所述分割要素。 若為該切斷裝置,則由於切斷工作台包括吸附互相鄰接的分割要素的其中一者的第一工作台吸附部、以及吸附互相鄰接的分割要素的另一者的第二工作台吸附部,故而可解除僅互相鄰接的分割要素的其中一者或另一者的吸附,而相對於切斷工作台進行重新配置,或自切斷工作台取出。藉此,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。 As described above, the cutting device of the present invention is an object to be cut in which a plurality of division elements are connected by a connecting portion, and the cutting lines in the adjacent division elements are set on mutually different straight lines. The cutting device for cutting along the cutting line is characterized by comprising: a cutting table for sucking and holding the object to be cut; and a cutting mechanism for cutting by a blade and performing the cutting operation the object to be cut held by a table, and the cutting table includes: a first table suction part for suctioning one of the divided elements adjacent to each other; and a second table suction part , which is independent of the first table adsorption part to adsorb the other said division element. In the case of this cutting device, since the cutting table includes a first table suction portion for sucking one of the adjacent division elements, and a second table suction portion for sucking the other of the adjacent division elements Therefore, the adsorption of only one or the other of the adjacent division elements can be released, and can be rearranged with respect to the cutting table or taken out from the cutting table. Thereby, it is possible to easily cut an object to be cut in which the cutting lines in the division elements adjacent to each other are set on straight lines different from each other by the blade.
作為用於僅吸附互相鄰接的分割要素的其中一者或另一者而相對於切斷工作台進行重新配置、或自切斷工作台取出的具體的實施態樣,考慮本發明的切斷裝置更包括向所述切斷工作台搬送所述切斷對象物的搬送機構,且所述搬送機構包括僅吸附互相鄰接的所述分割要素中的其中一者或另一者的搬送吸附部。The cutting device of the present invention can be considered as a specific embodiment for adsorbing only one or the other of the adjacent division elements, and rearranging them with respect to the cutting table or taking them out from the cutting table. It further includes a conveyance mechanism that conveys the object to be cut to the cutting table, and the conveyance mechanism includes a conveyance suction portion that suctions only one or the other of the adjacent division elements.
理想的是於所述連結部被所述切斷機構切斷而互相鄰接的所述分割要素互相分離的狀態下,所述切斷工作台解除所述第一工作台吸附部或所述第二工作台吸附部的其中一者對所述分割要素的吸附,所述搬送機構於將所述切斷工作台上吸附被解除的所述分割要素吸附後,以互相鄰接的所述分割要素的切斷線成為同一直線上的方式加以對齊。 若為該結構,則由於對齊為互相鄰接的切斷線成為同一直線上,故而能夠一舉切斷互相鄰接的分割要素的切斷線。 Preferably, the cutting table releases the first table suction part or the second table in a state in which the connecting part is cut by the cutting mechanism and the adjacent division elements are separated from each other. One of the table suction parts sucks the divided elements, and after the conveying mechanism has sucked the divided elements whose suction on the cutting table has been released, cut the adjacent divided elements with each other. The broken lines are aligned in such a way that they become on the same straight line. With this configuration, since the cutting lines adjacent to each other are aligned so as to be on the same straight line, the cutting lines of the adjacent division elements can be cut at one stroke.
作為切斷對象物的具體的實施態樣,考慮所述多個分割要素沿著基於所述刀片的切斷方向排列,該些的配置態樣被分為至少兩組,其中一組的所述分割要素的切斷線位於同一直線上,另一組的所述分割要素的切斷線位於同一直線上。 於該結構的切斷對象物中,理想的是所述第一工作台吸附部吸附所述其中一組的分割要素,所述第二工作台吸附部吸附所述另一組的分割要素。 As a specific embodiment of the object to be cut, it is considered that the plurality of division elements are arranged along the cutting direction by the blade, and the arrangement of these elements is divided into at least two groups, wherein the The cutting lines of the divided elements are located on the same straight line, and the cutting lines of the divided elements of another group are located on the same straight line. In the object to be cut having this structure, it is preferable that the first table suction part suctions the division elements of the one group, and the second table suction part suctions the division elements of the other group.
於該情形時,理想的是根據切斷工作台的吸附態樣構成搬送機構,考慮所述搬送機構包括吸附所述其中一組的分割要素的第一搬送吸附部、以及吸附所述另一組的分割要素的第二搬送吸附部。In this case, it is desirable to configure the conveyance mechanism according to the suction state of the cutting table, and it is considered that the conveyance mechanism includes a first conveyance suction part for suctioning the divided elements of one group, and suction for the other group. The second transfer suction part of the divided element.
又,使用所述切斷裝置的切斷品的製造方法亦為本發明的一態樣。Moreover, the manufacturing method of the cut product using the said cutting device is also an aspect of this invention.
<本發明的一實施形態> 以下,參照圖式對本發明的切斷裝置的一實施形態進行說明。再者,對於以下所示的任一圖,為了容易理解,而適當省略或誇張地示意性繪製。對相同的結構要素標註相同的符號,並適當省略說明。 <An embodiment of the present invention> Hereinafter, an embodiment of the cutting device of the present invention will be described with reference to the drawings. It should be noted that any of the drawings shown below are appropriately omitted or exaggerated and schematically drawn for easy understanding. The same symbols are attached to the same structural elements, and explanations are appropriately omitted.
<切斷裝置的整體結構>
本實施形態的切斷裝置100藉由將設定於切斷對象物W的切斷線CL0~切斷線CL2切斷而將其單片化為多個切斷品P(製品P)。
<Overall structure of cutting device>
The
此處,如圖1以及圖2所示,切斷對象物W藉由連結部W3連結多個分割要素W1、W2,並且互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上。各分割要素W1、分割要素W2藉由樹脂成形將多個晶片密封,此處,將多個晶片配置為一行。又,對應於各晶片而設置有引線。並且,多個分割要素W1、W2沿著基於刀片31(參照圖3)的切斷方向(圖1中為左右方向)排列,該些的兩端部藉由連結部W3連結。具體而言,其中一組的奇數行的分割要素W1與另一組的偶數行的分割要素W2以該些的引線交錯的方式構成。藉此,其中一組的奇數行的分割要素W1的切斷線CL1位於同一直線上,另一組的偶數行的分割要素W2的切斷線CL2位於同一直線上。又,奇數行的分割要素W1的切斷線CL1與偶數行的分割要素W2的切斷線CL2位於互不相同的直線上(參照圖2)。再者,圖2中的符號CL0為用於切斷連結部W3而分離為多個分割要素W1、W2的切斷線。又,各圖所示的切斷線CL0~切斷線CL2為藉由刀片31預定切斷的假想線,實際的切斷對象物W上並不顯示。Here, as shown in FIGS. 1 and 2 , the object to be cut W is connected to a plurality of division elements W1 and W2 by a connecting portion W3, and the division elements W1 and W2 adjacent to each other, the cutting line CL1 in the division element W2, and the cut The disconnection CL2 is set on a straight line different from each other. Each of the division elements W1 and W2 seals a plurality of wafers by resin molding, and here, the plurality of wafers are arranged in a row. In addition, leads are provided corresponding to the respective wafers. The plurality of dividing elements W1 and W2 are arranged along the cutting direction (left-right direction in FIG. 1 ) by the blade 31 (see FIG. 3 ), and both ends of these are connected by the connecting portion W3 . Specifically, the division elements W1 of the odd-numbered rows of one group and the division elements W2 of the even-numbered rows of the other group are configured such that the leads of these are interleaved. Thereby, the cutting lines CL1 of the division elements W1 in odd-numbered rows of one group are located on the same straight line, and the cutting lines CL2 of the division elements W2 in the even-numbered rows of the other group are located on the same straight line. Moreover, the cutting line CL1 of the division element W1 of odd-numbered rows and the cutting line CL2 of division element W2 of the even-numbered row are located on mutually different straight lines (refer FIG. 2). In addition, the code|symbol CL0 in FIG. 2 is a cutting line for cutting|disconnecting the connection part W3, and dividing into several division elements W1 and W2. In addition, the cutting line CL0 - the cutting line CL2 shown in each figure are imaginary lines which are scheduled to be cut by the
具體而言,如圖3所示,切斷裝置100包括:切斷工作台2,吸附並保持切斷對象物W;切斷機構3,藉由刀片31切斷由切斷工作台2保持的切斷對象物W;搬送機構4(以下亦稱為載入器4),將切斷對象物W搬送至切斷工作台2;以及搬出機構5(以下亦稱為卸載器5),將於切斷工作台2上切斷的切斷品P自切斷工作台2搬出。Specifically, as shown in FIG. 3 , the
切斷工作台2吸附並保持切斷對象物W,如圖4所示,包括:第一工作台吸附部21,吸附互相鄰接的分割要素W1、分割要素W2中的其中一分割要素W1;以及第二工作台吸附部22,吸附另一分割要素W2。再者,切斷工作台2構成為可藉由未圖示的移動機構而至少沿著Y方向移動。又,切斷工作台2亦可以藉由未圖示的旋轉機構而沿著θ方向旋轉的方式構成。As shown in FIG. 4 , the cutting table 2 suctions and holds the cutting object W, and includes: a first
第一工作台吸附部21以及第二工作台吸附部22互相獨立,以能夠各自獨立地切換吸附與其停止的方式構成。The first
具體而言,第一工作台吸附部21統一吸附切斷對象物W中的奇數行(1行、3行、5行、・・・)的分割要素W1,第二工作台吸附部22統一吸附切斷對象物W中的偶數行(2行、4行、6行、・・・)的分割要素W2。即,切斷工作台2以能夠獨立切換奇數行的分割要素W1的吸附或其停止與偶數行的分割要素W2的吸附或其停止的方式構成。Specifically, the first
第一工作台吸附部21包括:第一吸附孔21a,於切斷工作台2的上表面開口;第一內部流路21b,與該第一吸附孔21a連續,形成於切斷工作台2的內部;以及第一抽吸泵21c,連接於該第一內部流路21b。又,第二工作台吸附部22包括:第二吸附孔22a,於切斷工作台2的上表面開口;第二內部流路22b,與該第二吸附孔22a連續,形成於切斷工作台2的內部;以及第二抽吸泵22c,連接於該第二內部流路22b。再者,亦可將第一抽吸泵21c與第二抽吸泵22c設為共通,例如使用未圖示的切換閥切換連接於抽吸泵的內部流路。再者,除了抽吸泵以外,亦可使用噴射器。The first
切斷機構3將切斷對象物W切斷為直線狀,如圖3所示,包括刀片31、使該刀片31旋轉的轉軸部32、以及使該轉軸部32至少沿著X方向以及Z方向移動的移動機構(未圖示)。刀片31的旋轉軸方向平行於切斷工作台2的上表面,此處,為沿著水平方向的方向。並且,藉由使切斷工作台2與切斷機構3相對移動,而利用刀片31將切斷對象物W切斷。The
載入器4將切斷對象物W自收容切斷對象物W的切斷對象物收容部6(參照圖3)搬送至切斷工作台2。又,如下文所述,載入器4以切斷工作台2中互相鄰接的分割要素W1、分割要素W2的切斷線CL1、切斷線CL2一致的方式使互相鄰接的分割要素W1、分割要素W2的其中一者移動。The
具體而言,如圖5所示,載入器4包括:吸附區塊41,設置有用於吸附切斷對象物W的搬送吸附部411、搬送吸附部412;以及移動機構(未圖示),使該吸附區塊41移動。Specifically, as shown in FIG. 5 , the
於吸附區塊41設置有吸附互相鄰接的分割要素W1、分割要素W2中的其中一分割要素W1的第一搬送吸附部411、以及吸附另一分割要素W2的第二搬送吸附部412。即,載入器4的吸附區塊41包括與切斷工作台2的各工作台吸附部21、工作台吸附部22對應的搬送吸附部411、搬送吸附部412。The
具體而言,第一搬送吸附部411吸附切斷對象物W中的奇數行(1行、3行、5行、・・・)的分割要素W1,第二搬送吸附部412吸附切斷對象物W中的偶數行(2行、4行、6行、・・・)的分割要素W2。即,載入器4以能夠獨立切換奇數行的分割要素W1的吸附或其停止與偶數行的分割要素W2的吸附或其停止的方式構成。Specifically, the first
第一搬送吸附部411包括:第一吸附孔411a,於吸附區塊41的下表面開口;第一內部流路411b,與該第一吸附孔411a連續,形成於吸附區塊41的內部;以及第一抽吸泵411c,連接於該第一內部流路411b。再者,於第一吸附孔411a設置有例如樹脂製的吸附墊411d。又,第二搬送吸附部412包括:第二吸附孔412a,於吸附區塊41的下表面開口;第二內部流路412b,與該第二吸附孔412a連續,形成於吸附區塊41的內部;以及第二抽吸泵412c,連接於該第二內部流路412b。再者,於第二吸附孔412a設置有吸附墊412d。除此以外,亦可構成為將第一抽吸泵411c與第二抽吸泵412c設為共通,例如使用未圖示的切換閥切換連接於抽吸泵的內部流路。The first
卸載器5吸附經切斷的切斷品P,將切斷品P自切斷工作台2搬送至切斷品收容部7(參照圖3)。具體而言,如圖6所示,卸載器5包括:吸附區塊51,設置有用於吸附切斷品P的搬送吸附部511;以及移動機構(未圖示),使該吸附區塊51移動。The
吸附區塊51的搬送吸附部511包括:吸附孔511a,於吸附區塊51的下表面開口;內部流路511b,與該吸附孔511a連續,形成於吸附區塊51的內部;以及抽吸泵511c,連接於該內部流路511b。於吸附孔511a設置有例如樹脂製的吸附墊511d。如上所述,卸載器5不同於載入器4,為不包括獨立的兩個搬送吸附部、而包括不加區別地吸附多個切斷品P的搬送吸附部511的結構。再者,於圖6中,奇數行的吸附孔511a與偶數行的吸附孔511a沿著Y方向排列為一直線,亦可互相錯開。The conveyance and
<切斷裝置100的切斷動作>
參照圖7以及圖8對該切斷裝置100的動作進行說明。再者,以下切斷動作藉由利用控制部CTL(參照圖3)控制各部而進行。
<Cutting operation of the
(1)切斷對象物W的搬入
載入器4吸附並保持收容於切斷對象物收容部6中的切斷對象物W,將其搬送至切斷工作台2。搬送至切斷工作台2的切斷對象物W被切斷工作台2的第一工作台吸附部21以及第二工作台吸附部22吸附並保持(圖7的<吸附保持切斷對象物>)。此處,切斷對象物W相對於切斷工作台2的定位例如藉由使形成於切斷對象物W的定位用的孔與設置於切斷工作台2的定位銷嵌合而進行。除此以外,亦可藉由使形成於切斷對象物W的定位用的孔與設置於載入器4的定位銷嵌合而進行。
(1) Loading of the cutting object W
The
(2)連結部W3的切斷 藉由切斷機構3切斷由切斷工作台2吸附保持的切斷對象物W的連結部W3(圖7以及圖8的<連結部的切斷>)。於本實施形態中,將連結多個分割要素W1、W2的兩端部的連結部W3分別切斷。藉此,切斷對象物W的多個分割要素W1、W2成為互相分離的狀態。於該狀態下,奇數行的分割要素W1與偶數行的分割要素W2的切斷線CL1、切斷線CL2位於互不相同的直線上,而非交錯(錯位狀)地位於同一直線上。 (2) Cutting of the connecting portion W3 The connecting portion W3 of the object to be cut W that is adsorbed and held by the cutting table 2 is cut by the cutting mechanism 3 (<cutting of the connecting portion> in FIGS. 7 and 8 ). In this embodiment, the connection part W3 which connects the both ends of the some division element W1, W2 is cut|disconnected, respectively. Thereby, the plurality of division elements W1 and W2 of the object to be cut W are in a state of being separated from each other. In this state, the cutting lines CL1 and CL2 of the dividing elements W1 of odd-numbered rows and the dividing elements W2 of even-numbered rows are located on different straight lines, and are not staggered (displaced) on the same straight line.
(3)偶數行的分割要素W2的吸附停止
於連結部W3被切斷而互相鄰接的分割要素W1、分割要素W2互相分離的狀態下,切斷工作台2將第二工作台吸附部22對偶數行的分割要素W2的吸附停止(圖7以及圖8的<偶數行的吸附停止/上拉>)。再者,於切斷工作台2上維持第一工作台吸附部21對奇數行的分割要素W1的吸附。此處,於停止由第二工作台吸附部22進行的吸附之前,預先將載入器4的吸附墊(具體而言為第二搬送吸附部412的吸附墊412d)壓抵於偶數行的分割要素W2。藉此,防止了因停止切斷工作台2的第二工作台吸附部22的吸附而引起的偶數行的分割要素W2的位置偏移。
(3) The adsorption of the division elements W2 of the even-numbered rows is stopped.
In a state where the connecting portion W3 is cut and the adjacent divided elements W1 and W2 are separated from each other, the cutting table 2 stops the suction of the divided elements W2 in the even rows by the second table suction portion 22 ( FIG. 7 . and <Suction stop/pull-up for even-numbered rows> in FIG. 8 . In addition, on the cutting table 2, the first
(4)偶數行的分割要素W2的重新配置
載入器4吸附切斷工作台2上吸附被停止的偶數行的分割要素W2後,將該偶數行的分割要素W2自切斷工作台2上拉(圖7以及圖8的<偶數行的吸附停止/上拉>)。然後,載入器4以偶數行的分割要素W2的切斷線CL2與奇數行的分割要素W1的切斷線CL1處於同一直線上的方式對齊而重新配置(圖7以及圖8的<偶數行的重新配置>)。經重新配置的偶數行的分割要素W2藉由第二工作台吸附部22而被吸附保持於切斷工作台2。
(4) Rearrangement of division elements W2 of even-numbered rows
After the
此處,考慮偶數行的分割要素W2的重新配置中的定位藉由以下方式進行:(i)於移動偶數行的分割要素W2之前,利用相機對奇數行的分割要素W1以及偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別,藉由該圖像識別算出偶數行的分割要素W2的定位的移動量,並基於所算出的移動量控制載入器4。除此以外,偶數行的分割要素W2的重新配置中的定位亦可藉由以下方式進行:(ii)藉由使設置於偶數行的分割要素W2的定位用的孔與設置於切斷工作台2的定位用的銷嵌合而進行;或者(iii)預先設定偶數行的分割要素W2的位置調整量,並基於所述位置調整量控制載入器4的移動機構。Here, the positioning in the rearrangement considering the division elements W2 of the even-numbered rows is performed in the following manner: (i) Before moving the division elements W2 of the even-numbered rows, the division elements W1 of the odd-numbered rows and the division elements of the even-numbered rows are determined by a camera with a camera. Image recognition is performed on the arrangement of W2 (for example, a feature part such as an edge portion and a lead portion), the movement amount of the positioning of the division elements W2 of the even-numbered lines is calculated by the image recognition, and the
(5)奇數行以及偶數行的分割要素W1、分割要素W2的切斷
將偶數行的分割要素W2重新配置後,切斷機構3將處於同一直線上的奇數行的分割要素W1的切斷線CL1與偶數行的分割要素W2的切斷線CL2切斷(圖8的<奇數行以及偶數行的切斷>)。再者,於多個分割要素W1、W2的切斷前,亦可藉由相機進行圖像識別,確認奇數行的分割要素W1的切斷線CL1與偶數行的分割要素W2的切斷線CL2處於同一直線上。
(5) Cutting of the division elements W1 and W2 of odd-numbered lines and even-numbered lines
After rearranging the division elements W2 of the even-numbered rows, the
(6)切斷品P的搬出
卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。
(6) Carrying out the cut product P
The
<本實施形態的效果>
根據本實施形態的切斷裝置100,由於切斷工作台2包括吸附互相鄰接的分割要素W1、分割要素W2的其中一者的第一工作台吸附部21以及獨立於該第一工作台吸附部21而吸附互相鄰接的分割要素W1、分割要素W2的另一者的第二工作台吸附部22,故而可解除僅互相鄰接的分割要素W1、分割要素W2的其中一者或另一者的吸附,而相對於切斷工作台2進行重新配置,或自切斷工作台2取出。藉此,能夠實現可藉由刀片31容易地切斷互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上的切斷對象物W。
<Effects of the present embodiment>
According to the
<其他變形實施形態> 再者,本發明並不限於所述實施形態。 <Other variant embodiments> In addition, this invention is not limited to the said embodiment.
例如,於所述實施形態中,為重新配置偶數行的分割要素W2的結構,但亦可設為藉由重新配置奇數行的分割要素W1而將奇數行的分割要素W1的切斷線CL1與偶數行的分割要素W2的切斷線CL2對齊的結構。For example, in the above-described embodiment, the division elements W2 of the even-numbered rows are rearranged. However, by rearranging the division elements W1 of the odd-numbered rows, the cutting lines CL1 of the division elements W1 of the odd-numbered rows may be separated from each other. A structure in which the cutting lines CL2 of the division elements W2 of the even-numbered rows are aligned.
於所述實施形態中,載入器4為包括第一搬送吸附部411以及第二搬送吸附部412的結構,但亦可設為僅包括任一者的結構。例如,於載入器4為僅包括第一搬送吸附部411的結構的情形時,於將切斷對象物W搬入切斷工作台2時,載入器4吸附保持奇數行的分割要素W1而將其搬入。又,於切斷連結部W3後,切斷工作台2的第一工作台吸附部21停止奇數行的分割要素W1的吸附,載入器4將吸附被停止的奇數行的分割要素W1進行重新配置。In the said embodiment, although the
又,於所述實施形態中,為藉由載入器4重新配置奇數行或偶數行的分割要素W1、分割要素W2的結構,但亦可設為使用卸載器5重新配置奇數行或偶數行的分割要素W1、分割要素W2的結構。於該情形時,卸載器5與所述實施形態的載入器4同樣地成為包括吸附奇數行的分割要素W1的第一搬送吸附部以及吸附偶數行的分割要素W2的第二搬送吸附部的結構。In the above-described embodiment, the
進而,於所述實施形態中,為僅重新配置奇數行或偶數行的分割要素W1、分割要素W2的其中一者的結構,但例如根據設定於切斷對象物W的切斷線CL1、切斷線CL2的配置態樣,亦可設為重新配置奇數行以及偶數行的分割要素W1、分割要素W2的兩者的結構。Furthermore, in the above-described embodiment, only one of the division elements W1 and W2 of the odd-numbered or even-numbered rows is rearranged. The arrangement aspect of the disconnection CL2 may be a configuration in which both the division elements W1 and W2 of the odd-numbered rows and the even-numbered rows are rearranged.
於所述實施形態中,為將奇數行的分割要素W1的切斷線CL1與偶數行的分割要素W2的切斷線CL2對齊而一舉切斷的結構,但亦可為以下者。例如,於切斷連結部W3後,將偶數行的分割要素W2自切斷工作台2取出,切斷奇數行的分割要素W1的切斷線CL1進行單片化。然後,於將經單片化的切斷品P自切斷工作台2搬出後,使切斷工作台2吸附保持偶數行的分割要素W2,切斷偶數行的分割要素W2的切斷線CL2進行單片化。然後,將經單片化的切斷品P自切斷工作台2搬出。In the above-described embodiment, the cutting line CL1 of the divided elements W1 of odd-numbered rows is aligned with the cutting line CL2 of divided elements W2 of even-numbered rows, and the cutting line CL2 of the divided elements W2 of even-numbered rows is cut in one fell swoop, but the following may be employed. For example, after cutting the connecting portion W3, the even-numbered rows of the divided elements W2 are taken out from the cutting table 2, and the cutting lines CL1 of the odd-numbered rows of the divided elements W1 are cut into pieces. Then, after the singulated cut product P is unloaded from the cutting table 2, the cutting table 2 is made to hold the even-numbered row division elements W2 by suction, and the cutting line CL2 of the even-numbered row division elements W2 is cut. Monolithic. Then, the singulated cut product P is carried out from the cutting table 2 .
藉由本發明的切斷裝置100切斷的切斷對象物W並不限於所述實施形態,亦可為未經樹脂成形的例如印刷基板(印刷電路板(Printed Circuit Board,PCB)基板)等基板。於該情形時,切斷對象物W如圖9所示,為例如藉由雕銑加工形成了切口K的基板,該基板藉由連結部W3連結俯視下大致為L字形狀的多個分割要素W1、分割要素W2,並且互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上。於此種切斷對象物W中,亦與所述實施形態同樣,於切斷連結部W3後,將奇數行的分割要素W1的切斷線CL1與偶數行的分割要素W2的切斷線CL2對齊,然後可將該些一舉切斷(圖9的<將奇數行以及偶數行的切斷線對齊並切斷>)。又,於切斷連結部W3後,亦可分別切斷奇數行的分割要素W1以及偶數行的分割要素W2(圖9的<分別切斷奇數行以及偶數行>)。The object to be cut W to be cut by the
所述實施形態的切斷對象物W中多個分割要素的配置態樣被分為兩組(奇數行以及偶數行),奇數行的分割要素W1與偶數行的分割要素W2中切斷線CL1、切斷線CL2互不相同,但並不限於奇數行的分割要素與偶數行的分割要素,亦可應用於包括多個分割要素中切斷線互相不位於同一直線上的分割要素者。例如,亦可為切斷對象物W的多個分割要素的配置態樣以例如左右各兩行且相同等方式進行分組者。除此以外,切斷對象物W亦可為將多個分割要素的配置態樣分為三個以上組者。The arrangement of the plurality of division elements in the object to be cut W in the above-described embodiment is divided into two groups (odd-numbered lines and even-numbered lines), and the division elements W1 of the odd-numbered lines and the division elements W2 of the even-numbered lines are divided by the cutting line CL1. The cutting lines CL2 are different from each other, but are not limited to the division elements of odd-numbered lines and the division elements of even-numbered lines, and can also be applied to division elements including division elements whose cutting lines are not located on the same straight line among a plurality of division elements. For example, the arrangement of the plurality of division elements of the cutting object W may be grouped in the same manner, for example, in two rows on the left and right. In addition to this, the object to be cut W may be one in which the arrangement of the plurality of division elements is divided into three or more groups.
此外,本發明並不限於所述實施形態,當然可於不脫離其主旨的範圍內進行各種變形。 [產業上的可利用性] In addition, this invention is not limited to the said embodiment, It cannot be overemphasized that various deformation|transformation are possible in the range which does not deviate from the summary. [Industrial Availability]
根據本發明,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。According to the present invention, it is possible to easily cut an object to be cut in which the cutting lines in the adjacent division elements are set on mutually different straight lines by the blade.
2:切斷工作台
3:切斷機構
4:載入器(搬送機構)
5:卸載器(搬出機構)
6:切斷對象物收容部
7:切斷品收容部
21:第一工作台吸附部(工作台吸附部)
21a、411a:第一吸附孔
21b、411b:第一內部流路
21c、411c:第一抽吸泵
22:第二工作台吸附部(工作台吸附部)
22a、412a:第二吸附孔
22b、412b:第二內部流路
22c、412c:第二抽吸泵
31:刀片
32:轉軸部
41、51:吸附區塊
100:切斷裝置
411:第一搬送吸附部(搬送吸附部)
411d、412d、511d:吸附墊
412:第二搬送吸附部(搬送吸附部)
511:搬送吸附部
511a:吸附孔
511b:內部流路
511c:抽吸泵
CL0、CL1、CL2:切斷線
CTL:控制部
K:切口
P:切斷品
W:切斷對象物
W1:奇數行的分割要素(多個分割要素)
W2:偶數行的分割要素(多個分割要素)
W3:連結部
2: Cut off the workbench
3: Cut off mechanism
4: Loader (transport mechanism)
5: Unloader (carry out mechanism)
6: Cut the object storage part
7: Cut-off storage department
21: The first worktable adsorption part (the worktable adsorption part)
21a, 411a: the
圖1是示意性地表示切斷對象物的平面圖。 圖2是表示切斷對象物的切斷線的部分放大平面圖。 圖3是示意性地表示本發明的一實施形態的切斷裝置的結構的平面圖。 圖4是示意性地表示同一實施形態的切斷工作台的結構的平面圖以及截面圖。 圖5是示意性地表示同一實施形態的搬送機構(載入器)的結構的平面圖以及截面圖。 圖6是示意性地表示同一實施形態的搬出機構(卸載器)的結構的平面圖以及截面圖。 圖7是表示同一實施形態的切斷動作的各狀態的截面圖。 圖8是表示同一實施形態的切斷動作中的切斷對象物的各狀態的平面圖。 圖9是表示變形實施形態的切斷對象物以及其切斷方法的平面圖。 圖10是表示使用引線交錯形成的引線框架的樹脂成形基板的平面圖。 FIG. 1 is a plan view schematically showing an object to be cut. FIG. 2 is a partially enlarged plan view showing a cutting line for cutting an object. 3 is a plan view schematically showing the configuration of the cutting device according to the embodiment of the present invention. 4 is a plan view and a cross-sectional view schematically showing the configuration of the cutting table according to the same embodiment. 5 is a plan view and a cross-sectional view schematically showing the configuration of a conveying mechanism (loader) according to the same embodiment. 6 is a plan view and a cross-sectional view schematically showing the configuration of a carry-out mechanism (unloader) according to the same embodiment. 7 is a cross-sectional view showing each state of the cutting operation in the same embodiment. 8 is a plan view showing each state of the object to be cut in the cutting operation according to the same embodiment. 9 is a plan view showing an object to be cut and a method of cutting the same according to a modified embodiment. 10 is a plan view showing a resin-molded substrate using a lead frame formed by staggered leads.
2:切斷工作台 2: Cut off the workbench
4:載入器(搬送機構) 4: Loader (transport mechanism)
21:第一工作台吸附部(工作台吸附部) 21: The first table adsorption part (table adsorption part)
22:第二工作台吸附部(工作台吸附部) 22: Second worktable adsorption part (table adsorption part)
41:吸附區塊 41: Adsorption block
411:第一搬送吸附部(搬送吸附部) 411: The first conveying suction part (the conveying suction part)
412:第二搬送吸附部(搬送吸附部) 412: Second conveyance suction part (conveyance suction part)
W:切斷對象物 W: cut the object
W1:奇數行的分割要素(多個分割要素) W1: Split elements of odd-numbered rows (multiple split elements)
W2:偶數行的分割要素(多個分割要素) W2: Split elements of even rows (multiple split elements)
W3:連結部 W3: Link
Claims (6)
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JP2020194369A JP7530809B2 (en) | 2020-11-24 | 2020-11-24 | Cutting device and method for manufacturing cut products |
JP2020-194369 | 2020-11-24 |
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TW202221774A true TW202221774A (en) | 2022-06-01 |
TWI810693B TWI810693B (en) | 2023-08-01 |
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JP (1) | JP7530809B2 (en) |
KR (1) | KR20230088772A (en) |
CN (1) | CN116547108A (en) |
TW (1) | TWI810693B (en) |
WO (1) | WO2022113572A1 (en) |
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US6746022B2 (en) | 2001-12-26 | 2004-06-08 | Asm Assembly Automation Ltd. | Chuck for holding a workpiece |
JP5709593B2 (en) | 2011-03-09 | 2015-04-30 | 株式会社ディスコ | Processing equipment |
JP6579929B2 (en) | 2015-11-26 | 2019-09-25 | 株式会社ディスコ | Processing equipment |
JP6640142B2 (en) | 2017-03-31 | 2020-02-05 | Towa株式会社 | Cutting apparatus, method of attaching semiconductor package, and method of manufacturing electronic component |
JP7102157B2 (en) * | 2018-02-08 | 2022-07-19 | Towa株式会社 | Cutting device and manufacturing method of cut products |
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- 2021-10-19 KR KR1020237016369A patent/KR20230088772A/en unknown
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TWI810693B (en) | 2023-08-01 |
JP7530809B2 (en) | 2024-08-08 |
CN116547108A (en) | 2023-08-04 |
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