TWI826854B - Cutting device and manufacturing method for cut product - Google Patents

Cutting device and manufacturing method for cut product Download PDF

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Publication number
TWI826854B
TWI826854B TW110139950A TW110139950A TWI826854B TW I826854 B TWI826854 B TW I826854B TW 110139950 A TW110139950 A TW 110139950A TW 110139950 A TW110139950 A TW 110139950A TW I826854 B TWI826854 B TW I826854B
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cutting
elements
divided
dividing
cut
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TW110139950A
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TW202221775A (en
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堀聡子
高田直毅
岩田康弘
黄善夏
北川雄大
片岡昌一
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日商Towa股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/061Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention makes it possible to cut, by a blade, an object to be cut in which cutting lines in divided elements adjacent to each other are set on straight lines different from each other. A cutting device 100 of the invention cuts an object W to be cut along cutting lines CL1 and CL2, in which in the object W to be cut, multiple divided elements W1 and W2 are connected by a connection part W3 and the cutting lines CL1 and CL2 in the divided elements W1 and W2 adjacent to each other are set on different straight lines. The cutting device 100 includes: a cutting table 2, sucking and holding the object W to be cut; a cutting mechanism 3, cutting, by a blade 31, the object W to be cut; and a divided element conveyance part 10, conveying one of the divided elements W1 and W2 adjacent to each other from the cutting table 2 in a state where the connection part W3 is cut by the cutting mechanism 3 and the divided elements W1 and W2 are separated from each other.

Description

切斷裝置以及切斷品的製造方法Cutting device and method of manufacturing cut product

本發明是有關於一種切斷裝置以及切斷品的製造方法。The present invention relates to a cutting device and a method for manufacturing cut products.

先前,例如如專利文獻1所示,考慮一種包括移送墊的切削裝置,所述移送墊抽吸保持封裝體基板的全部晶片中的一部分晶片。於該切削裝置中,構成為於吸盤工作台設定有與收容托盤的外形尺寸相適應的多個區域,按照各設定有移送墊的區域進行分割,統一抽吸並搬送晶片。 [現有技術文獻] [專利文獻] Previously, as shown in Patent Document 1, for example, a cutting device including a transfer pad that sucks and holds a part of all wafers of a package substrate has been considered. In this cutting device, a plurality of areas adapted to the outer dimensions of the storage tray are set on the suction cup table, and the wafers are sucked and transferred uniformly by dividing the areas according to the transfer pads set therein. [Prior art documents] [Patent Document]

[專利文獻1]日本專利特開2003-234310號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 2003-234310

[發明所欲解決之課題][Problem to be solved by the invention]

另一方面,近年來,於小外形電晶體(Small Outline Transistor,SOT)或小外形積體電路(Small Outline Integrated Circuit,SOIC)等半導體封裝中,為了使用大小相同的引線框架製造更多的封裝體,而如圖14般,使用引線交錯形成的引線框架製造樹脂成形而成的樹脂成形基板。On the other hand, in recent years, in semiconductor packages such as Small Outline Transistor (SOT) or Small Outline Integrated Circuit (SOIC), in order to use the same size lead frame to manufacture more packages body, and as shown in Figure 14, a resin molded substrate is manufactured using a lead frame in which leads are interlaced.

然而,於使用引線交錯形成的引線框架的樹脂成形基板中,由於封裝體的切斷線並不位於同一直線上,故而現有的使用刀片的切斷裝置難以進行切斷。However, in a resin molded substrate using a lead frame formed by staggered leads, since the cutting lines of the package are not located on the same straight line, it is difficult to cut with a conventional cutting device using a blade.

因此,本發明是為了解決所述問題點而完成,其主要課題在於使得能夠藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。 [解決課題之手段] Therefore, the present invention has been completed in order to solve the above-mentioned problems, and its main subject is to enable a cutting object to be easily cut with a blade in which cutting lines in mutually adjacent dividing elements are set on mutually different straight lines. things. [Means to solve the problem]

即,本發明的切斷裝置是一種將藉由連結部連結多個分割要素、並且互相鄰接的所述分割要素內的切斷線被設定於互不相同的直線上的切斷對象物沿著所述切斷線切斷的切斷裝置,其特徵在於包括:切斷工作台,吸附並保持所述切斷對象物;切斷機構,藉由刀片切斷所述切斷對象物;以及分割要素搬送部,於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,自所述切斷工作台搬送互相鄰接的所述分割要素的其中一者。 [發明的效果] That is, the cutting device of the present invention is a cutting object along which a plurality of divided elements are connected by a connecting portion and the cutting lines in the divided elements adjacent to each other are set on mutually different straight lines. The cutting device for cutting the cutting line is characterized by including: a cutting table that attracts and holds the cutting object; a cutting mechanism that cuts the cutting object with a blade; and dividing The element transport unit transports one of the mutually adjacent divided elements from the cutting table in a state where the connecting part is cut by the cutting mechanism and the divided elements are separated from each other. [Effects of the invention]

根據以所述方式構成的本發明,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。According to the invention configured as described above, it is possible to easily cut an object to be cut with a blade in which the cutting lines in the dividing elements adjacent to each other are set on mutually different straight lines.

以下,舉例對本發明進一步進行詳細說明。但本發明不受以下的說明所限定。The present invention will be further described in detail below with examples. However, the present invention is not limited to the following description.

本發明的切斷裝置如上文所述,為將藉由連結部連結多個分割要素、並且互相鄰接的所述分割要素內的切斷線被設定於互不相同的直線上的切斷對象物沿著所述切斷線切斷的切斷裝置,其特徵在於包括:切斷工作台,吸附並保持所述切斷對象物;切斷機構,藉由刀片切斷所述切斷對象物;以及分割要素搬送部,於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,自所述切斷工作台搬送互相鄰接的所述分割要素的其中一者。 若為該切斷裝置,則由於包括於分割要素互相分離的狀態下自切斷工作台搬送互相鄰接的分割要素的其中一者的分割要素搬送部,故而能夠自切斷工作台取出互相鄰接的分割要素的其中一者。藉此,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。 As mentioned above, the cutting device of the present invention is a cutting object in which a plurality of divided elements are connected by a connecting portion and the cutting lines in the divided elements adjacent to each other are set on mutually different straight lines. The cutting device for cutting along the cutting line is characterized in that it includes: a cutting table that attracts and holds the cutting object; a cutting mechanism that cuts the cutting object with a blade; and a divided element transport unit that transports one of the mutually adjacent divided elements from the cutting table in a state where the connecting part is cut by the cutting mechanism and the divided elements are separated from each other. According to this cutting device, since the dividing element transport unit is included in the cutting table to transport one of the dividing elements adjacent to each other in a state where the dividing elements are separated from each other, it is possible to take out the dividing elements adjacent to each other from the cutting table. One of the dividing elements. This makes it possible to easily cut an object to be cut with a blade in which the cutting lines in the dividing elements adjacent to each other are set on mutually different straight lines.

作為所述分割要素搬送部的具體的實施態樣,考慮將互相鄰接的所述分割要素的其中一者自所述切斷工作台搬送至其他切斷工作台。 於該結構的情形時,互相鄰接的分割要素分別於不同的切斷工作台被切斷。再者,於在不同的切斷工作台切斷時,可藉由共用的刀片切斷,亦可藉由不同的刀片切斷。 As a specific embodiment of the divided element transport unit, it is conceivable to transport one of the mutually adjacent divided elements from the cutting table to another cutting table. In the case of this structure, the dividing elements adjacent to each other are cut on different cutting tables. Furthermore, when cutting on different cutting tables, it can be cut by a common blade or by different blades.

又,作為所述分割要素搬送部的具體的實施態樣,考慮將互相鄰接的所述分割要素的其中一者自所述切斷工作台搬送至暫置工作台。 於該結構的情形時,切斷機構依序切斷互相鄰接的分割要素。具體而言,於所述分割要素搬送部將互相鄰接的分割要素的其中一者搬送至暫置工作台後,切斷機構於切斷工作台上切斷互相鄰接的分割要素的另一者。然後,將該切斷品自切斷工作台搬出後,分割要素搬送部將互相鄰接的所述分割要素的其中一者自暫置工作台搬送至切斷工作台,切斷機構於切斷工作台上切斷互相鄰接的分割要素的其中一者。 Furthermore, as a specific embodiment of the divided element transport unit, it is conceivable to transport one of the mutually adjacent divided elements from the cutting table to the temporary holding table. In the case of this structure, the cutting mechanism sequentially cuts the dividing elements adjacent to each other. Specifically, after the divided element transport unit transports one of the adjacent divided elements to the temporary stage, the cutting mechanism cuts the other of the adjacent divided elements on the cutting table. Then, after the cut product is carried out from the cutting workbench, the divided element transport unit transports one of the adjacent divided elements from the temporary workbench to the cutting workbench, and the cutting mechanism performs the cutting operation. Cut off one of the adjacent divided elements on the stage.

進而,作為所述分割要素搬送部的具體的實施態樣,考慮自所述切斷工作台搬送並保持互相鄰接的所述分割要素的其中一者。 於該結構的情形時,與搬送至所述暫置工作台的情形時相同,切斷機構依序切斷互相鄰接的分割要素。具體而言,於所述分割要素搬送部自切斷工作台搬送並保持互相鄰接的分割要素的其中一者的狀態下,切斷機構於切斷工作台上切斷互相鄰接的分割要素的另一者。然後,將該切斷品自切斷工作台搬出後,分割要素搬送部將互相鄰接的所述分割要素的其中一者搬送至切斷工作台,切斷機構於切斷工作台上切斷互相鄰接的分割要素的其中一者。 Furthermore, as a specific embodiment of the divided element transport unit, it is considered that one of the divided elements adjacent to each other is transported and held from the cutting table. In the case of this structure, the cutting mechanism sequentially cuts the dividing elements adjacent to each other as in the case of transportation to the temporary workbench. Specifically, in a state where the divided element transport unit transports and holds one of the adjacent divided elements from the cutting table, the cutting mechanism cuts the other of the adjacent divided elements on the cutting table. One. Then, after the cut product is carried out from the cutting table, the divided element transport unit transports one of the mutually adjacent divided elements to the cutting table, and the cutting mechanism cuts each other on the cutting table. One of the adjacent dividing features.

為了利用分割要素搬送部進行分割要素的搬送,理想的是所述切斷工作台包括:第一工作台吸附部,吸附互相鄰接的所述分割要素中的其中一所述分割要素;以及第二工作台吸附部,獨立於該第一工作台吸附部,吸附另一所述分割要素。 若為該結構,則可停止僅由分割要素搬送部搬送的分割要素的吸附,而可確實地利用分割要素搬送部進行分割要素的搬送。 In order to transport the divided elements by the divided element transport unit, it is desirable that the cutting table includes: a first table adsorption part for adsorbing one of the divided elements adjacent to each other; and a second The workbench adsorption part is independent of the first workbench adsorption part and adsorbs the other divided element. According to this structure, the adsorption of the divided elements conveyed only by the divided element conveying section can be stopped, and the divided elements can be transported reliably by the divided element conveying section.

作為用以利用分割要素搬送部進行分割要素的搬送的具體實施態樣,考慮於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,所述切斷工作台停止所述第一工作台吸附部或所述第二工作台吸附部的其中一者對所述分割要素的吸附,所述分割要素搬送部自所述切斷工作台搬送所述切斷工作台上吸附被停止的所述分割要素。As a specific embodiment for transporting the divided elements using the divided element transport unit, it is considered that the cutting table is in a state where the connecting portion is cut by the cutting mechanism and the divided elements are separated from each other. Stopping one of the first table adsorption part or the second table adsorption part from adsorbing the dividing element, and the dividing element transport part transports the cutting table from the cutting table The adsorption is stopped on the divided element.

作為切斷對象物的具體的實施態樣,考慮所述多個分割要素沿著基於所述刀片的切斷方向排列,該些的配置態樣被分為至少兩組,其中一組的所述分割要素的切斷線位於同一直線上,另一組的所述分割要素的切斷線位於同一直線上。 於該結構的切斷對象物中,理想的是所述分割要素搬送部搬送所述其中一組的分割要素或所述另一組的分割要素的其中一者。 As a specific implementation aspect of cutting the object, it is considered that the plurality of dividing elements are arranged along the cutting direction by the blade, and the arrangement aspect of these is divided into at least two groups, one of which is the The cutting lines of the dividing elements are located on the same straight line, and the cutting lines of the dividing elements of the other group are located on the same straight line. In the object to be cut with this structure, it is preferable that the divided element transport unit transports one of the one set of divided elements or the other set of divided elements.

又,理想的是本發明的切斷裝置包括:搬送機構,將所述切斷對象物搬送至所述切斷工作台;以及搬出機構,將所述切斷工作台上被切斷的切斷品搬出,且所述搬送機構或所述搬出機構作為所述分割要素搬送部發揮功能。 若為該結構,則可由搬送機構或搬出機構構成分割要素搬送部,因此與除了搬送機構以及搬出機構以外另行設置分割要素搬送部的情形時相比,可使裝置結構變得簡單。 Furthermore, it is preferable that the cutting device of the present invention includes: a conveying mechanism for conveying the cutting object to the cutting table; and an unloading mechanism for cutting the cut material on the cutting table. The product is transported out, and the transport mechanism or the transport mechanism functions as the divided element transport section. With this structure, the divided element conveying section can be constituted by the conveying mechanism or the unloading mechanism. Therefore, compared with the case where a divided element conveying section is separately provided in addition to the conveying mechanism and the unloading mechanism, the device structure can be simplified.

關於用於搬送機構或搬出機構作為分割要素搬送部發揮功能的具體實施態樣,考慮所述搬送機構或所述搬出機構包括:第一搬送吸附部,吸附所述其中一組的分割要素;以及第二搬送吸附部,獨立於所述第一搬送吸附部,吸附所述另一組的分割要素,且所述搬送機構或所述搬出機構使用所述第一搬送吸附部或所述第二搬送吸附部,作為所述分割要素搬送部發揮功能。As for the specific implementation mode for the transport mechanism or the carry-out mechanism to function as the divided element transport section, it is considered that the transport mechanism or the carry-out mechanism includes: a first transport adsorption section that adsorbs one of the divided elements of the group; and The second conveying and adsorbing part adsorbs the divided elements of the other group independently of the first conveying and adsorbing part, and the conveying mechanism or the unloading mechanism uses the first conveying and adsorbing part or the second conveying and adsorbing part. The adsorption unit functions as the divided element transport unit.

又,使用所述切斷裝置的切斷品的製造方法亦為本發明的一態樣。Moreover, a method of manufacturing a cut product using the cutting device is also an aspect of the present invention.

<本發明的第一實施形態> 以下,參照圖式對本發明的切斷裝置的第一實施形態進行說明。再者,對於以下所示的任一圖,為了容易理解,而適當省略或誇張地示意性繪製。對相同的結構要素標註相同的符號,並適當省略說明。 <First embodiment of the present invention> Hereinafter, a first embodiment of the cutting device of the present invention will be described with reference to the drawings. In addition, for easy understanding, any of the figures shown below are appropriately omitted or exaggerated to schematically draw them. The same structural elements are labeled with the same symbols and descriptions are omitted appropriately.

<切斷裝置的整體結構> 本實施形態的切斷裝置100藉由將設定於切斷對象物W的切斷線CL0~切斷線CL2切斷而將其單片化為多個切斷品P(製品P)。 <Overall structure of cutting device> The cutting device 100 of this embodiment cuts the cutting object W at the cutting lines CL0 - cutting lines CL2 set therein, thereby singulating it into a plurality of cut products P (products P).

此處,如圖1以及圖2所示,切斷對象物W藉由連結部W3連結多個分割要素W1、W2,並且互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上。各分割要素W1、分割要素W2藉由樹脂成形將多個晶片密封,此處,將多個晶片配置為一行。又,對應於各晶片而設置有引線。並且,多個分割要素W1、W2沿著基於刀片31(參照圖3)的切斷方向(圖1中為左右方向)排列,該些的兩端部藉由連結部W3連結。具體而言,其中一組的奇數行的分割要素W1與另一組的偶數行的分割要素W2以該些的引線交錯的方式構成。藉此,其中一組的奇數行的分割要素W1的切斷線CL1位於同一直線上,另一組的偶數行的分割要素W2的切斷線CL2位於同一直線上。又,奇數行的分割要素W1的切斷線CL1與偶數行的分割要素W2的切斷線CL2位於互不相同的直線上(參照圖2)。再者,圖2中的符號CL0為用於切斷連結部W3而分離為多個分割要素W1、W2的切斷線。又,各圖所示的切斷線CL0~切斷線CL2為藉由刀片31預定切斷的假想線,實際的切斷對象物W上並不顯示。Here, as shown in FIGS. 1 and 2 , the cutting object W is connected to a plurality of dividing elements W1 and W2 via a connecting portion W3, and the dividing elements W1 and the cutting lines CL1 and the cutting lines in the dividing elements W2 are adjacent to each other. The broken lines CL2 are set on different straight lines. Each of the division elements W1 and W2 seals a plurality of wafers by resin molding. Here, the plurality of wafers are arranged in a row. In addition, leads are provided corresponding to each wafer. Furthermore, the plurality of divided elements W1 and W2 are arranged along the cutting direction (the left-right direction in FIG. 1 ) by the blade 31 (see FIG. 3 ), and both ends of these are connected by the connection part W3. Specifically, one group of the dividing elements W1 in the odd-numbered rows and the other group of the dividing elements W2 in the even-numbered rows are configured such that their leads are interlaced. Thereby, the cutting lines CL1 of the dividing elements W1 of one group of odd-numbered rows are located on the same straight line, and the cutting lines CL2 of the dividing elements W2 of the other group of even-numbered rows are located on the same straight line. Furthermore, the cutting line CL1 of the dividing element W1 in the odd-numbered rows and the cutting line CL2 of the dividing element W2 in the even-numbered rows are located on mutually different straight lines (see FIG. 2 ). In addition, symbol CL0 in FIG. 2 is a cutting line for cutting the connection part W3 and dividing it into a plurality of divided elements W1 and W2. In addition, the cutting lines CL0 to CL2 shown in each figure are virtual lines intended to be cut by the blade 31, and the actual cutting target object W is not shown.

具體而言,如圖3所示,切斷裝置100包括:切斷工作台2,吸附並保持切斷對象物W;切斷機構3,藉由刀片31切斷由切斷工作台2保持的切斷對象物W;搬送機構4(以下亦稱為載入器4),將切斷對象物W搬送至切斷工作台2;以及搬出機構5(以下亦稱為卸載器5),將於切斷工作台2上切斷的切斷品P自切斷工作台2搬出。Specifically, as shown in FIG. 3 , the cutting device 100 includes: a cutting table 2 that attracts and holds the cutting object W; and a cutting mechanism 3 that cuts the object held by the cutting table 2 with a blade 31 . The object to be cut W; the transport mechanism 4 (hereinafter also referred to as the loader 4) transports the object to be cut W to the cutting table 2; and the unloading mechanism 5 (hereinafter also referred to as the unloader 5) will be The cut product P cut on the cutting table 2 is carried out from the cutting table 2 .

切斷工作台2吸附並保持切斷對象物W,如圖4所示,包括:第一工作台吸附部21,吸附互相鄰接的分割要素W1、分割要素W2中的其中一分割要素W1;以及第二工作台吸附部22,吸附另一分割要素W2。再者,切斷工作台2構成為可藉由未圖示的移動機構而至少沿著Y方向移動。又,切斷工作台2亦可以藉由未圖示的旋轉機構而沿著θ方向旋轉的方式構成。The cutting table 2 adsorbs and holds the cutting object W. As shown in FIG. 4 , it includes: a first table adsorbing part 21 that adsorbs one of the divided elements W1 and divided elements W2 adjacent to each other; and The second workbench adsorption part 22 adsorbs another divided element W2. Furthermore, the cutting table 2 is configured to be movable in at least the Y direction by a moving mechanism not shown in the figure. In addition, the cutting table 2 may be configured to rotate in the θ direction by a rotation mechanism not shown in the figure.

第一工作台吸附部21以及第二工作台吸附部22互相獨立,以能夠各自獨立地切換吸附與其停止的方式構成。The first table suction part 21 and the second table suction part 22 are independent of each other, and are configured to be able to switch suction and stop independently.

具體而言,第一工作台吸附部21統一吸附切斷對象物W中的奇數行(1行、3行、5行、・・・)的分割要素W1,第二工作台吸附部22統一吸附切斷對象物W中的偶數行(2行、4行、6行、・・・)的分割要素W2。即,切斷工作台2以能夠獨立切換奇數行的分割要素W1的吸附或其停止與偶數行的分割要素W2的吸附或其停止的方式構成。Specifically, the first table suction unit 21 collectively sucks the divided elements W1 in odd-numbered rows (1st row, 3rd row, 5th row, ・・・) of the cutting object W, and the second table suction unit 22 collectively sucks the divided elements W1 Cut off the dividing elements W2 of the even-numbered rows (2 rows, 4 rows, 6 rows, ・・・) in the object W. That is, the cutting table 2 is configured to be able to independently switch between the adsorption or stopping of the dividing elements W1 in the odd-numbered rows and the adsorption or stopping of the dividing elements W2 in the even-numbered rows.

第一工作台吸附部21包括:第一吸附孔21a,於切斷工作台2的上表面開口;第一內部流路21b,與該第一吸附孔21a連續,形成於切斷工作台2的內部;以及第一抽吸泵21c,連接於該第一內部流路21b。又,第二工作台吸附部22包括:第二吸附孔22a,於切斷工作台2的上表面開口;第二內部流路22b,與該第二吸附孔22a連續,形成於切斷工作台2的內部;以及第二抽吸泵22c,連接於該第二內部流路22b。再者,亦可將第一抽吸泵21c與第二抽吸泵22c設為共通,例如使用未圖示的切換閥切換連接於抽吸泵的內部流路。再者,除了抽吸泵以外,亦可使用噴射器。The first table adsorption part 21 includes: a first adsorption hole 21a, which is opened on the upper surface of the cutting table 2; and a first internal flow path 21b, which is continuous with the first adsorption hole 21a and formed on the cutting table 2. inside; and the first suction pump 21c is connected to the first internal flow path 21b. Moreover, the second table adsorption part 22 includes: a second adsorption hole 22a, which is opened on the upper surface of the cutting table 2; and a second internal flow path 22b, which is continuous with the second adsorption hole 22a and is formed in the cutting table. 2; and the second suction pump 22c is connected to the second internal flow path 22b. Furthermore, the first suction pump 21c and the second suction pump 22c may be made common, and for example, a switching valve (not shown) may be used to switch the internal flow path connected to the suction pump. Furthermore, in addition to a suction pump, an ejector can also be used.

切斷機構3將切斷對象物W切斷為直線狀,如圖3所示,包括刀片31、使該刀片31旋轉的轉軸部32、以及使該轉軸部32至少沿著X方向以及Z方向移動的移動機構(未圖示)。刀片31的旋轉軸方向平行於切斷工作台2的上表面,此處,為沿著水平方向的方向。並且,藉由使切斷工作台2與切斷機構3相對移動,而利用刀片31將切斷對象物W切斷。The cutting mechanism 3 cuts the cutting object W into a linear shape. As shown in FIG. 3 , the cutting mechanism 3 includes a blade 31 , a rotating shaft 32 that rotates the blade 31 , and a rotating shaft 32 that rotates the rotating shaft 32 along at least the X direction and the Z direction. Moving moving mechanism (not shown). The direction of the rotation axis of the blade 31 is parallel to the upper surface of the cutting table 2, here, it is the direction along the horizontal direction. Then, by relatively moving the cutting table 2 and the cutting mechanism 3, the cutting object W is cut by the blade 31.

載入器4將切斷對象物W自收容切斷對象物W的切斷對象物收容部6(參照圖3)搬送至切斷工作台2。又,如下文所述,載入器4以切斷工作台2中互相鄰接的分割要素W1、分割要素W2的切斷線CL1、切斷線CL2一致的方式使互相鄰接的分割要素W1、分割要素W2的其中一者移動。The loader 4 transports the cutting object W from the cutting object storage part 6 (see FIG. 3 ) that accommodates the cutting object W to the cutting table 2 . Furthermore, as described below, the loader 4 causes the dividing elements W1 and W2 adjacent to each other in the cutting table 2 to coincide with the cutting lines CL1 and CL2 of the dividing elements W1 and W2 adjacent to each other. One of the elements W2 moves.

具體而言,如圖5所示,載入器4包括:吸附區塊41,設置有用於吸附切斷對象物W的搬送吸附部411、搬送吸附部412;以及移動機構(未圖示),使該吸附區塊41移動。Specifically, as shown in FIG. 5 , the loader 4 includes an adsorption block 41 provided with a conveyance adsorption part 411 and a conveyance adsorption part 412 for adsorbing the cutting object W; and a moving mechanism (not shown), The adsorption block 41 is moved.

於吸附區塊41設置有吸附互相鄰接的分割要素W1、分割要素W2中的其中一分割要素W1的第一搬送吸附部411、以及吸附另一分割要素W2的第二搬送吸附部412。即,載入器4的吸附區塊41包括與切斷工作台2的各工作台吸附部21、工作台吸附部22對應的搬送吸附部411、搬送吸附部412。The adsorption block 41 is provided with a first conveyance adsorption part 411 that adsorbs one of the divided elements W1 and the divided elements W2 adjacent to each other, and a second conveyance adsorbing part 412 that adsorbs the other divided element W2. That is, the adsorption block 41 of the loader 4 includes the conveyance adsorption part 411 and the conveyance adsorption part 412 corresponding to the table adsorption part 21 and the table adsorption part 22 of the cutting table 2 .

具體而言,第一搬送吸附部411吸附切斷對象物W中的奇數行(1行、3行、5行、・・・)的分割要素W1,第二搬送吸附部412吸附切斷對象物W中的偶數行(2行、4行、6行、・・・)的分割要素W2。即,載入器4以能夠獨立切換奇數行的分割要素W1的吸附或其停止與偶數行的分割要素W2的吸附或其停止的方式構成。Specifically, the first conveyance and adsorption unit 411 adsorbs the divided elements W1 in odd-numbered rows (line 1, line 3, line 5, ・・・) of the object to be cut W, and the second conveyance and adsorption unit 412 adsorbs the object to be cut. The dividing element W2 of the even-numbered rows (2 rows, 4 rows, 6 rows, ・・・) in W. That is, the loader 4 is configured to be able to independently switch between the adsorption or stopping of the divided elements W1 in the odd-numbered rows and the adsorption or stopping of the divided elements W2 in the even-numbered rows.

第一搬送吸附部411包括:第一吸附孔411a,於吸附區塊41的下表面開口;第一內部流路411b,與該第一吸附孔411a連續,形成於吸附區塊41的內部;以及第一抽吸泵411c,連接於該第一內部流路411b。再者,於第一吸附孔411a設置有例如樹脂製的吸附墊411d。又,第二搬送吸附部412包括:第二吸附孔412a,於吸附區塊41的下表面開口;第二內部流路412b,與該第二吸附孔412a連續,形成於吸附區塊41的內部;以及第二抽吸泵412c,連接於該第二內部流路412b。再者,於第二吸附孔412a設置有吸附墊412d。除此以外,亦可構成為將第一抽吸泵411c與第二抽吸泵412c設為共通,例如使用未圖示的切換閥切換連接於抽吸泵的內部流路。The first transport adsorption part 411 includes: a first adsorption hole 411a opening on the lower surface of the adsorption block 41; a first internal flow path 411b continuous with the first adsorption hole 411a and formed inside the adsorption block 41; and The first suction pump 411c is connected to the first internal flow path 411b. Furthermore, an adsorption pad 411d made of, for example, resin is provided in the first adsorption hole 411a. In addition, the second transport adsorption part 412 includes: a second adsorption hole 412a, which is opened on the lower surface of the adsorption block 41; and a second internal flow path 412b, which is continuous with the second adsorption hole 412a and is formed inside the adsorption block 41. ; And the second suction pump 412c is connected to the second internal flow path 412b. Furthermore, an adsorption pad 412d is provided in the second adsorption hole 412a. Alternatively, the first suction pump 411c and the second suction pump 412c may be configured in common, and for example, a switching valve (not shown) may be used to switch the internal flow path connected to the suction pump.

以所述方式構成的載入器4作為於連結部W3被切斷機構3切斷而分割要素W1、分割要素W2互相分離的狀態下,將互相鄰接的分割要素W1、分割要素W2的其中一者自切斷工作台2搬送至其他切斷工作台11(參照圖3)的分割要素搬送部10發揮功能。本實施形態的分割要素搬送部10使用載入器4的第二搬送吸附部412而構成。即,分割要素搬送部10將偶數行的分割要素W2自切斷工作台2搬送至其他切斷工作台11。The loader 4 configured as described above is configured to separate one of the adjacent divided elements W1 and W2 in a state where the connecting portion W3 is cut by the cutting mechanism 3 and the divided elements W1 and W2 are separated from each other. The divided element transport unit 10 functions to transport the cutting elements from the cutting table 2 to other cutting tables 11 (see FIG. 3 ). The divided element transport unit 10 of this embodiment is configured using the second transport suction unit 412 of the loader 4 . That is, the divided element transport unit 10 transports the divided elements W2 of even-numbered rows from the cutting table 2 to other cutting tables 11 .

卸載器5吸附經切斷的切斷品P,將切斷品P自切斷工作台2搬送至切斷品收容部7(參照圖3)。具體而言,如圖6所示,卸載器5包括:吸附區塊51,設置有用於吸附切斷品P的搬送吸附部511、搬送吸附部512;以及移動機構(未圖示),使該吸附區塊51移動。The unloader 5 absorbs the cut product P and transports the cut product P from the cutting table 2 to the cut product accommodating part 7 (see FIG. 3 ). Specifically, as shown in FIG. 6 , the unloader 5 includes: an adsorption block 51 provided with a conveyance adsorption part 511 and a conveyance adsorption part 512 for adsorbing the cut product P; and a moving mechanism (not shown) to move the The adsorption block 51 moves.

具體而言,第一搬送吸附部511吸附切斷對象物W中的奇數行(1行、3行、5行、・・・)的分割要素W1的切斷品P,第二搬送吸附部512吸附切斷對象物W中的偶數行(2行、4行、6行、・・・)的分割要素W2的切斷品P。即,卸載器5以能夠獨立地切換奇數行的分割要素W1的切斷品P的吸附或其停止與偶數行的分割要素W2的切斷品P的吸附或其停止的方式構成。Specifically, the first conveyance and adsorption unit 511 adsorbs the cut products P of the dividing elements W1 in odd-numbered rows (line 1, line 3, line 5, ・・・) of the cutting object W, and the second conveyance and adsorption unit 512 The cut product P of the dividing element W2 in the even-numbered rows (2 rows, 4 rows, 6 rows, ・・・) of the cutting object W is adsorbed. That is, the unloader 5 is configured to be able to independently switch between the suction and stop of the cut products P of the divided elements W1 in the odd-numbered rows and the suction and stop of the cut products P of the divided elements W2 in the even-numbered rows.

第一搬送吸附部511包括:第一吸附孔511a,於吸附區塊51的下表面開口;第一內部流路511b,與該第一吸附孔511a連續,形成於吸附區塊51的內部;以及第一抽吸泵511c,連接於該第一內部流路511b。再者,於第一吸附孔511a設置有例如樹脂製的吸附墊511d。又,第二搬送吸附部512包括:第二吸附孔512a,於吸附區塊51的下表面開口;第二內部流路512b,與該第二吸附孔512a連續,形成於吸附區塊51的內部;以及第二抽吸泵512c,連接於該第二內部流路512b。再者,於第二吸附孔512a設置有吸附墊512d。除此以外,亦可構成為將第一抽吸泵511c與第二抽吸泵512c設為共通,例如使用未圖示的切換閥切換連接於抽吸泵的內部流路。再者,於圖6中,奇數行的吸附孔512a與偶數行的吸附孔513a沿著Y方向排列為一直線,亦可互相錯開。The first transport adsorption part 511 includes: a first adsorption hole 511a opening on the lower surface of the adsorption block 51; a first internal flow path 511b continuous with the first adsorption hole 511a and formed inside the adsorption block 51; and The first suction pump 511c is connected to the first internal flow path 511b. Furthermore, an adsorption pad 511d made of, for example, resin is provided in the first adsorption hole 511a. In addition, the second transport adsorption part 512 includes: a second adsorption hole 512a, which is opened on the lower surface of the adsorption block 51; and a second internal flow path 512b, which is continuous with the second adsorption hole 512a and is formed inside the adsorption block 51. ; And the second suction pump 512c is connected to the second internal flow path 512b. Furthermore, an adsorption pad 512d is provided in the second adsorption hole 512a. Alternatively, the first suction pump 511c and the second suction pump 512c may be configured in common, and for example, a switching valve (not shown) may be used to switch the internal flow path connected to the suction pump. Furthermore, in FIG. 6 , the adsorption holes 512 a in odd-numbered rows and the adsorption holes 513 a in even-numbered rows are arranged in a straight line along the Y direction, and may also be staggered from each other.

<切斷裝置100的切斷動作> 參照圖7以及圖8對該切斷裝置100的動作進行說明。再者,以下切斷動作藉由利用控制部CTL(參照圖3)控制各部而進行。 <Cutting operation of the cutting device 100> The operation of the cutting device 100 will be described with reference to FIGS. 7 and 8 . In addition, the following cutting operation is performed by controlling each part using the control part CTL (refer FIG. 3).

(1)切斷對象物W的搬送 載入器4吸附並保持收容於切斷對象物收容部6中的切斷對象物W,將其搬送至切斷工作台2。搬送至切斷工作台2的切斷對象物W被切斷工作台2的第一工作台吸附部21以及第二工作台吸附部22吸附並保持(圖7的<吸附保持切斷對象物>)。此處,切斷對象物W相對於切斷工作台2的定位例如藉由使形成於切斷對象物W的定位用的孔與設置於切斷工作台2的定位銷嵌合而進行。除此以外,亦可藉由使形成於切斷對象物W的定位用的孔與設置於載入器4的定位銷嵌合而進行。 (1) Transport of cutting object W The loader 4 attracts and holds the object to be cut W accommodated in the object to be cut accommodating portion 6 , and transports the object to the cutting table 2 . The object to be cut W conveyed to the cutting table 2 is adsorbed and held by the first table adsorbing part 21 and the second table adsorbing part 22 of the cutting table 2 (<Object to be cut is adsorbed and held> in FIG. 7 ). Here, positioning of the cutting object W with respect to the cutting table 2 is performed, for example, by fitting a positioning hole formed in the cutting object W with a positioning pin provided on the cutting table 2 . Alternatively, it can also be performed by fitting a positioning hole formed in the cutting object W with a positioning pin provided in the loader 4 .

(2)連結部W3的切斷 藉由切斷機構3切斷由切斷工作台2吸附保持的切斷對象物W的連結部W3(圖8的<連結部的切斷>)。於本實施形態中,將連結多個分割要素W1、W2的兩端部的連結部W3分別切斷。藉此,切斷對象物W的多個分割要素W1、W2成為互相分離的狀態。於該狀態下,奇數行的分割要素W1與偶數行的分割要素W2的切斷線CL1、切斷線CL2位於互不相同的直線上,而非交錯(錯位狀)地位於同一直線上。 (2) Cutting off the connection part W3 The connecting portion W3 of the cutting object W adsorbed and held by the cutting table 2 is cut by the cutting mechanism 3 (<cutting of the connecting portion> in FIG. 8 ). In this embodiment, the connecting portion W3 connecting both ends of the plurality of divided elements W1 and W2 is cut respectively. Thereby, the plurality of dividing elements W1 and W2 of the cutting object W are separated from each other. In this state, the cutting lines CL1 and CL2 of the dividing elements W1 in the odd-numbered rows and the dividing elements W2 in the even-numbered rows are located on different straight lines, but are not staggered (dislocated) on the same straight line.

(3)將偶數行的分割要素W2搬送至其他切斷工作台11 於連結部W3被切斷而互相鄰接的分割要素W1、分割要素W2互相分離的狀態下,切斷工作台2將第二工作台吸附部22對偶數行的分割要素W2的吸附停止。再者,於切斷工作台2上維持第一工作台吸附部21對奇數行的分割要素W1的吸附。此處,於停止由第二工作台吸附部22進行的吸附之前,預先將成為分割要素搬送部10的載入器4的吸附墊(具體而言為第二搬送吸附部412的吸附墊412d)壓抵於偶數行的分割要素W2。藉此,防止了因停止切斷工作台2的第二工作台吸附部22的吸附而引起的偶數行的分割要素W2的位置偏移。然後,成為分割要素搬送部10的載入器4的第二搬送吸附部412將偶數行的分割要素W2搬送至其他切斷工作台11(圖7以及圖8的<將偶數行搬送至其他切斷工作台>)。再者,被搬送至其他切斷工作台11的偶數行的分割要素W2由其他切斷工作台11的吸附部111吸附保持。此處,偶數行的分割要素W2相對於其他切斷工作台11的定位例如考慮藉由相機對偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別而進行等。 (3) Transport the dividing elements W2 of the even-numbered rows to the other cutting table 11 In a state where the connecting portion W3 is cut and the adjacent divided elements W1 and W2 are separated from each other, the cutting table 2 stops the adsorption of the even-numbered rows of divided elements W2 by the second table suction unit 22 . Furthermore, the first table suction unit 21 maintains suction of the odd-numbered rows of dividing elements W1 on the cutting table 2 . Here, before stopping the suction by the second table suction unit 22, the suction pad (specifically, the suction pad 412d of the second transport suction unit 412) of the loader 4 of the divided element transport unit 10 is previously used. Press against the dividing element W2 of the even-numbered row. This prevents the positional deviation of the divided elements W2 of the even-numbered rows caused by stopping the suction of the second table suction part 22 of the cutting table 2 . Then, the second transport suction unit 412 of the loader 4 serving as the divided element transport unit 10 transports the even-numbered rows of divided elements W2 to other cutting tables 11 (<Transfer even-numbered rows to other cutting tables 11 in FIGS. 7 and 8 Break off the workbench>). Furthermore, the divided elements W2 of the even-numbered rows conveyed to the other cutting tables 11 are adsorbed and held by the suction portions 111 of the other cutting tables 11 . Here, the positioning of the even-numbered rows of dividing elements W2 with respect to the other cutting tables 11 is performed, for example, by considering image recognition of the arrangement of the even-numbered rows of dividing elements W2 (for example, edge portions, lead portions, and other feature portions) using a camera. wait.

(4)奇數行以及偶數行的分割要素W1、分割要素W2的切斷 於將偶數行的分割要素W2搬送至其他切斷工作台11後,切斷機構3於切斷工作台2上切斷處於同一直線上的奇數行的分割要素W1的切斷線CL1。又,於其他切斷工作台11上,藉由其他切斷機構或切斷機構3切斷處於同一直線上的偶數行的分割要素W2的切斷線CL2(圖7以及圖8的<奇數行以及偶數行的切斷>)。再者,於本實施形態中,設為對應於各切斷工作台2、切斷工作台11設置切斷機構3的雙轉軸方式(參照圖3),但亦可設為於各切斷工作台2、切斷工作台11設置共通的切斷機構3的單轉軸方式。 (4) Cutting of the dividing elements W1 and W2 of odd-numbered rows and even-numbered rows After the even-numbered rows of divided elements W2 are transported to other cutting tables 11 , the cutting mechanism 3 cuts the cutting line CL1 of the odd-numbered rows of divided elements W1 on the cutting table 2 on the same straight line. In addition, on the other cutting table 11, the cutting lines CL2 of the even-numbered rows of dividing elements W2 on the same straight line are cut by other cutting mechanisms or the cutting mechanism 3 (<odd-numbered rows in Figs. 7 and 8 And the cutting off of even-numbered lines>). Furthermore, in this embodiment, the dual-axis system in which the cutting mechanism 3 is provided corresponding to each cutting table 2 and cutting table 11 is adopted (see FIG. 3 ), but it may also be adopted as a method for each cutting operation. The table 2 and the cutting table 11 are provided with a common cutting mechanism 3 of a single-rotation axis type.

(5)切斷品P的搬出 卸載器5使用第一搬送吸附部511吸附並保持由切斷工作台2吸附保持的多個切斷品P,並將其搬送至切斷品收容部7。又,卸載器5使用第二搬送吸附部512吸附並保持由其他切斷工作台11吸附保持的多個切斷品P,並將其搬送至切斷品收容部7。此處,於解除切斷工作台2以及其他切斷工作台11的吸附之前,可藉由將卸載器5的吸附墊511d、吸附墊512d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (5) Unloading the cut product P The unloader 5 uses the first conveyance suction unit 511 to suck and hold the plurality of cut products P suctioned and held by the cutting table 2 , and transports them to the cut product storage unit 7 . Furthermore, the unloader 5 uses the second conveyance suction unit 512 to suction and hold the plurality of cut products P suctioned and held by the other cutting tables 11 , and transports them to the cut product storage unit 7 . Here, before releasing the suction of the cutting table 2 and other cutting tables 11, the suction pads 511d and 512d of the unloader 5 can be pressed against the plurality of cutting products P to prevent multiple cutting products P. The position of the cut product P is shifted or mistakenly adsorbed.

<第一實施形態的效果> 根據第一實施形態的切斷裝置100,由於包括於分割要素W1、分割要素W2互相分離的狀態下將互相鄰接的分割要素W1、分割要素W2的其中一者自切斷工作台2搬送至其他切斷工作台11的分割要素搬送部10,故而可自切斷工作台2取出互相鄰接的分割要素W1、分割要素W2的其中一者並使不同的切斷工作台2、切斷工作台11保持。藉此,能夠實現可藉由刀片31容易地切斷互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上的切斷對象物W。 <Effects of the first embodiment> According to the cutting device 100 of the first embodiment, since the dividing element W1 and the dividing element W2 are separated from each other, one of the dividing elements W1 and W2 adjacent to each other is transported from the cutting table 2 to the other. The dividing element transport part 10 of the cutting table 11 can take out one of the dividing elements W1 and W2 that are adjacent to each other from the cutting table 2 and make the cutting table 2 and the cutting table 11 different. Keep. This allows the blade 31 to easily cut the object W in which the cutting lines CL1 and CL2 in the dividing elements W1 and W2 that are adjacent to each other are set on mutually different straight lines. .

<本發明的第二實施形態> 繼而參照圖式對本發明的切斷裝置的第二實施形態進行說明。再者,第二實施形態的切斷裝置100於不包括其他切斷工作台11的方面,結構不同於所述第一實施形態。再者,其他結構與所述第一實施形態相同。 <Second Embodiment of the Invention> Next, a second embodiment of the cutting device of the present invention will be described with reference to the drawings. Furthermore, the cutting device 100 of the second embodiment is structurally different from the first embodiment in that it does not include another cutting table 11 . In addition, other structures are the same as the said 1st embodiment.

具體而言,如圖9所示,第二實施形態的切斷裝置100為僅將互相鄰接的分割要素W1、分割要素W2的其中一者搬送至暫時載置的暫置工作台12而非切斷工作台的結構。此處,考慮將暫置工作台12設為包括吸附並保持經搬送的分割要素的吸附部的結構。藉由使用該暫置工作台12,切斷機構3於切斷工作台2上依序切斷奇數行的分割要素W1與偶數行的分割要素W2。Specifically, as shown in FIG. 9 , the cutting device 100 of the second embodiment transports only one of the divided elements W1 and W2 that are adjacent to each other to the temporarily placed stage 12 without cutting. Break the structure of the workbench. Here, it is considered that the temporary stage 12 has a structure including an adsorption part that adsorbs and holds the transported divided elements. By using the temporary table 12, the cutting mechanism 3 sequentially cuts the dividing elements W1 of the odd-numbered rows and the dividing elements W2 of the even-numbered rows on the cutting table 2.

於該結構的切斷裝置100的切斷動作中,(1)切斷對象物W的搬送、(2)連結部W3的切斷與所述實施形態相同。以下,對連結部W3的切斷後的動作進行說明。In the cutting operation of the cutting device 100 having this structure, (1) conveyance of the cutting object W and (2) cutting of the connecting portion W3 are the same as in the above-described embodiment. Hereinafter, the operation after cutting of the connecting part W3 will be described.

(3)將偶數行的分割要素W2搬送至暫置工作台12 於連結部W3被切斷而互相鄰接的分割要素W1、分割要素W2互相分離的狀態下,切斷工作台2將第二工作台吸附部22對偶數行的分割要素W2的吸附停止。再者,於切斷工作台2上維持第一工作台吸附部21對奇數行的分割要素W1的吸附。此處,於停止由第二工作台吸附部22進行的吸附之前,預先將成為分割要素搬送部10的載入器4的吸附墊(具體而言為第二搬送吸附部412的吸附墊412d)壓抵於偶數行的分割要素W2。藉此,防止了因停止切斷工作台2的第二工作台吸附部22的吸附而引起的偶數行的分割要素W2的位置偏移。然後,成為分割要素搬送部10的載入器4的第二搬送吸附部412將偶數行的分割要素W2搬送至暫置工作台12(圖10的<將偶數行搬送至暫置工作台>)。此處,於需要相對於暫置工作台12將偶數行的分割要素W2定位的情形時,考慮例如藉由相機對偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別而進行等。 (3) Move the even-numbered row dividing element W2 to the temporary workbench 12 In a state where the connecting portion W3 is cut and the adjacent divided elements W1 and W2 are separated from each other, the cutting table 2 stops the adsorption of the even-numbered rows of divided elements W2 by the second table suction unit 22 . Furthermore, the first table suction unit 21 maintains suction of the odd-numbered rows of dividing elements W1 on the cutting table 2 . Here, before stopping the suction by the second table suction unit 22, the suction pad (specifically, the suction pad 412d of the second transport suction unit 412) of the loader 4 of the divided element transport unit 10 is previously used. Press against the dividing element W2 of the even-numbered row. This prevents the positional deviation of the divided elements W2 of the even-numbered rows caused by stopping the suction of the second table suction part 22 of the cutting table 2 . Then, the second transport suction unit 412 of the loader 4 serving as the divided element transport unit 10 transports the even-numbered rows of divided elements W2 to the temporary stage 12 (<Transfer even-numbered rows to the temporary stage> in FIG. 10 ) . Here, when it is necessary to position the even-numbered rows of divided elements W2 with respect to the temporary workbench 12 , it may be considered that the arrangement of the even-numbered rows of divided elements W2 (for example, edge portions, lead portions, and other feature portions) may be performed using a camera. Image recognition and so on.

(4)奇數行的分割要素W1的切斷 將偶數行的分割要素W2搬送至暫置工作台12後,切斷機構3於切斷工作台2上切斷處於同一直線上的奇數行的分割要素W1的切斷線CL1(圖10的<奇數行的切斷>)。 (4) Cutting off the dividing element W1 of the odd-numbered rows After the even-numbered rows of dividing elements W2 are transported to the temporary stage 12, the cutting mechanism 3 cuts the odd-numbered rows of dividing elements W1 on the cutting table 2 along the cutting line CL1 (< in Fig. 10 Cutting off odd-numbered lines >).

(5)切斷奇數行的分割要素W1而成的切斷品P的搬出 卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (5) Unloading the cut product P obtained by cutting the dividing elements W1 of odd-numbered rows The unloader 5 adsorbs and holds the plurality of cut products P adsorbed and held by the cutting table 2 , and transports them to the cut product storage portion 7 . Here, before releasing the suction of the cutting table 2, the suction pad 511d of the unloader 5 can be pressed against the plurality of cut products P to prevent the positional deviation or misalignment of the plurality of cut products P. Adsorption.

(6)偶數行的分割要素W2的搬送 成為分割要素搬送部10的載入器4的第二搬送吸附部412(分割要素搬送部10)吸附並保持處於暫置工作台12的偶數行的分割要素W2,並將其搬送至切斷工作台2(圖10的<將偶數行搬送至切斷工作台>)。搬送至切斷工作台2的偶數行的分割要素W2被切斷工作台2的第二工作台吸附部22吸附並保持。此處,偶數行的分割要素W2相對於切斷工作台2的定位考慮例如藉由相機對偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別而進行等。 (6) Transport of even-numbered row dividing element W2 The second conveyance suction unit 412 of the loader 4 (divided element conveyance unit 10 ), which becomes the divided element conveying unit 10 , adsorbs and holds the divided elements W2 in the even-numbered rows on the temporary stage 12 , and conveys them to the cutting operation. Station 2 (<Transfer the even-numbered rows to the cutting table> in Figure 10). The divided elements W2 of the even-numbered rows conveyed to the cutting table 2 are sucked and held by the second table suction part 22 of the cutting table 2 . Here, the positioning of the even-numbered rows of dividing elements W2 with respect to the cutting table 2 may be performed, for example, by image recognition of the arrangement of the even-numbered rows of dividing elements W2 (for example, edge portions, lead portions, and other feature portions) using a camera. .

(7)偶數行的分割要素W2的切斷 將偶數行的分割要素W2搬送至切斷工作台2後,切斷機構3於切斷工作台2上切斷處於同一直線上的偶數行的分割要素W2的切斷線CL2(圖10的<偶數行的切斷>)。 (7) Cutting off the dividing element W2 of the even-numbered rows After the even-numbered rows of dividing elements W2 are conveyed to the cutting table 2, the cutting mechanism 3 cuts the even-numbered rows of dividing elements W2 on the cutting table 2 along the cutting line CL2 (< in Fig. 10 Cutting off even-numbered lines>).

(8)切斷偶數行的分割要素W2而成的切斷品P的搬出 卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (8) Unloading the cut product P obtained by cutting the dividing elements W2 of the even-numbered rows The unloader 5 adsorbs and holds the plurality of cut products P adsorbed and held by the cutting table 2 , and transports them to the cut product storage portion 7 . Here, before releasing the suction of the cutting table 2, the suction pad 511d of the unloader 5 can be pressed against the plurality of cut products P to prevent the positional deviation or misalignment of the plurality of cut products P. Adsorption.

再者,於所述中,設為藉由分割要素搬送部10將偶數行的分割要素W2搬送至暫置工作台12的結構,但亦可設為藉由分割要素搬送部10將奇數行的分割要素W1搬送至暫置工作台12的結構。In addition, in the above description, it is assumed that the divided elements W2 of the even-numbered rows are transported to the temporary stage 12 by the divided element transporting unit 10 , but it may also be configured that the divided elements transporting unit 10 transports the divided elements W2 of the odd-numbered rows. The divided element W1 is transported to the temporary workbench 12 .

<第二實施形態的效果> 根據第二實施形態的切斷裝置100,由於包括於分割要素W1、分割要素W2互相分離的狀態下將互相鄰接的分割要素W1、分割要素W2的其中一者自切斷工作台2搬送至暫置工作台12的分割要素搬送部10,故而可自切斷工作台2取出互相鄰接的分割要素W1、分割要素W2的其中一者。藉此,能夠實現可藉由刀片31容易地切斷互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上的切斷對象物W。 <Effects of the second embodiment> According to the cutting device 100 of the second embodiment, since the dividing element W1 and the dividing element W2 are separated from each other, one of the dividing elements W1 and W2 adjacent to each other is transported from the cutting table 2 to the temporary The divided element transport unit 10 of the table 12 is provided, so that one of the divided elements W1 and W2 adjacent to each other can be taken out from the cutting table 2 . This allows the blade 31 to easily cut the object W in which the cutting lines CL1 and CL2 in the dividing elements W1 and W2 that are adjacent to each other are set on mutually different straight lines. .

<本發明的第三實施形態> 繼而參照圖式對本發明的切斷裝置的第三實施形態進行說明。再者,第三實施形態的切斷裝置100於不包括其他切斷工作台11以及暫置工作台12的方面,結構不同於所述各實施形態。再者,其他結構與所述第一實施形態相同。 <Third Embodiment of the Invention> Next, a third embodiment of the cutting device of the present invention will be described with reference to the drawings. Furthermore, the cutting device 100 of the third embodiment is different in structure from the above-described embodiments in that it does not include another cutting table 11 and a temporary table 12 . In addition, other structures are the same as the said 1st embodiment.

具體而言,第三實施形態的切斷裝置100並不將互相鄰接的分割要素W1、分割要素W2的其中一者搬送至其他切斷工作台11或暫置工作台12,而是如圖11所示,為自切斷工作台2搬送並保持互相鄰接的分割要素W1、分割要素W2的其中一者的結構。Specifically, the cutting device 100 of the third embodiment does not transport one of the dividing elements W1 and W2 adjacent to each other to the other cutting table 11 or the temporary table 12, but as shown in FIG. 11 As shown in the figure, one of the divided elements W1 and W2 adjacent to each other is transported from the cutting table 2 and held therein.

於該結構的切斷裝置100的切斷動作中,(1)切斷對象物W的搬送、(2)連結部W3的切斷與所述實施形態相同。以下,對連結部W3的切斷後的動作進行說明。In the cutting operation of the cutting device 100 having this structure, (1) conveyance of the cutting object W and (2) cutting of the connecting portion W3 are the same as in the above-described embodiment. Hereinafter, the operation after cutting of the connecting part W3 will be described.

(3)搬送並保持偶數行的分割要素W2 於連結部W3被切斷而互相鄰接的分割要素W1、分割要素W2互相分離的狀態下,切斷工作台2將第二工作台吸附部22對偶數行的分割要素W2的吸附停止。再者,於切斷工作台2上維持第一工作台吸附部21對奇數行的分割要素W1的吸附。此處,於停止由第二工作台吸附部22進行的吸附之前,預先將成為分割要素搬送部10的載入器4的吸附墊(具體而言為第二搬送吸附部412的吸附墊412d)壓抵於偶數行的分割要素W2。藉此,防止了因停止切斷工作台2的第二工作台吸附部22的吸附而引起的偶數行的分割要素W2的位置偏移。然後,成為分割要素搬送部10的載入器4的第二搬送吸附部412搬送偶數行的分割要素W2,並於切斷工作台2的外側保持(圖12的<偶數行的取出、奇數行的切斷>)。 (3) Transport and hold the dividing element W2 of the even-numbered rows In a state where the connecting portion W3 is cut and the adjacent divided elements W1 and W2 are separated from each other, the cutting table 2 stops the adsorption of the even-numbered rows of divided elements W2 by the second table suction unit 22 . Furthermore, the first table suction unit 21 maintains suction of the odd-numbered rows of dividing elements W1 on the cutting table 2 . Here, before stopping the suction by the second table suction unit 22, the suction pad (specifically, the suction pad 412d of the second transport suction unit 412) of the loader 4 of the divided element transport unit 10 is previously used. Press against the dividing element W2 of the even-numbered row. This prevents the positional deviation of the divided elements W2 of the even-numbered rows caused by stopping the suction of the second table suction part 22 of the cutting table 2 . Then, the second transport suction unit 412 of the loader 4 serving as the divided element transport unit 10 transports the even-numbered rows of divided elements W2 and holds them outside the cutting table 2 (<removal of even-numbered rows, odd-numbered rows in Fig. 12 Cut off>).

(4)奇數行的分割要素W1的切斷 於自切斷工作台2搬送偶數行的分割要素W2後,切斷機構3於切斷工作台2上切斷處於同一直線上的奇數行的分割要素W1的切斷線CL1(圖12的<偶數行的取出、奇數行的切斷>)。 (4) Cutting off the dividing element W1 of the odd-numbered rows After the even-numbered rows of divided elements W2 are transported from the cutting table 2, the cutting mechanism 3 cuts the odd-numbered rows of divided elements W1 on the cutting table 2 at the cutting line CL1 (< in Fig. 12 Removal of even-numbered lines and cutting of odd-numbered lines>).

(5)切斷奇數行的分割要素W1而成的切斷品P的搬出 卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (5) Unloading the cut product P obtained by cutting the dividing elements W1 of odd-numbered rows The unloader 5 adsorbs and holds the plurality of cut products P adsorbed and held by the cutting table 2 , and transports them to the cut product storage portion 7 . Here, before releasing the suction of the cutting table 2, the suction pad 511d of the unloader 5 can be pressed against the plurality of cut products P to prevent the positional deviation or misalignment of the plurality of cut products P. Adsorption.

(6)偶數行的分割要素W2的搬送 成為分割要素搬送部10的載入器4的第二搬送吸附部412將所保持的偶數行的分割要素W2搬送至切斷工作台2(圖12的<將偶數行搬送至切斷工作台>)。搬送至切斷工作台2的偶數行的分割要素W2被切斷工作台2的第二工作台吸附部22吸附並保持。此處,偶數行的分割要素W2相對於切斷工作台2的定位考慮例如藉由相機對偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別而進行等。 (6) Transport of even-numbered row dividing element W2 The second transport suction unit 412 of the loader 4 serving as the divided element transport unit 10 transports the held even-numbered rows of divided elements W2 to the cutting table 2 (<Transfer even-numbered rows to the cutting table> in FIG. 12 ). The divided elements W2 of the even-numbered rows conveyed to the cutting table 2 are sucked and held by the second table suction part 22 of the cutting table 2 . Here, the positioning of the even-numbered rows of dividing elements W2 with respect to the cutting table 2 may be performed, for example, by image recognition of the arrangement of the even-numbered rows of dividing elements W2 (for example, edge portions, lead portions, and other feature portions) using a camera. .

(7)偶數行的分割要素W2的切斷 將偶數行的分割要素W2搬送至切斷工作台2後,切斷機構3於切斷工作台2上切斷處於同一直線上的偶數行的分割要素W2的切斷線CL2(圖12的<偶數行的切斷>)。 (7) Cutting off the dividing element W2 of the even-numbered rows After the even-numbered rows of dividing elements W2 are conveyed to the cutting table 2, the cutting mechanism 3 cuts the even-numbered rows of dividing elements W2 on the cutting table 2 along the cutting line CL2 (< in Fig. 12 Cutting off even-numbered lines>).

(8)切斷偶數行的分割要素W2而成的切斷品P的搬出 卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (8) Unloading the cut product P obtained by cutting the dividing elements W2 of the even-numbered rows The unloader 5 adsorbs and holds the plurality of cut products P adsorbed and held by the cutting table 2 , and transports them to the cut product storage portion 7 . Here, before releasing the suction of the cutting table 2, the suction pad 511d of the unloader 5 can be pressed against the plurality of cut products P to prevent the positional deviation or misalignment of the plurality of cut products P. Adsorption.

<第三實施形態的效果> 根據第三實施形態的切斷裝置100,由於包括於分割要素W1、分割要素W2互相分離的狀態下自切斷工作台2搬送並保持互相鄰接的分割要素W1、分割要素W2的其中一者的分割要素搬送部10,故而可自切斷工作台2取出互相鄰接的分割要素W1、分割要素W2的其中一者。藉此,能夠實現可藉由刀片31容易地切斷互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上的切斷對象物W。 <Effects of the third embodiment> According to the cutting device 100 of the third embodiment, one of the dividing elements W1 and W2 adjacent to each other is transported from the cutting table 2 in a state where the dividing elements W1 and W2 are separated from each other. The divided element transport unit 10 can take out one of the divided elements W1 and W2 adjacent to each other from the cutting table 2 . This allows the blade 31 to easily cut the object W in which the cutting lines CL1 and CL2 in the dividing elements W1 and W2 that are adjacent to each other are set on mutually different straight lines. .

<其他變形實施形態> 再者,本發明並不限於所述各實施形態。 <Other variations> In addition, this invention is not limited to each embodiment mentioned above.

例如,於所述第一實施形態中,為將偶數行的分割要素W2搬送至其他切斷工作台11的結構,但亦可設為藉由分割要素搬送部10將奇數行的分割要素W1搬送至其他切斷工作台11的結構。又,亦可設為於在切斷工作台2上切斷連結部W3後,藉由分割要素搬送部10將奇數行的分割要素W1以及偶數行的分割要素W2分別搬送至不同的切斷工作台的結構。又,於所述第二實施形態中,可設為藉由分割要素搬送部10將奇數行的分割要素W1搬送至暫置工作台12的結構,於第三實施形態中,可設為藉由分割要素搬送部10搬送並保持奇數行的分割要素W1的結構。For example, in the first embodiment, the dividing elements W2 of the even-numbered rows are transported to the other cutting tables 11 . However, the dividing elements W1 of the odd-numbered rows may be transported by the dividing element transport unit 10 . to other cutting table 11 structures. Alternatively, after the connection portion W3 is cut on the cutting table 2, the divided elements W1 of the odd-numbered rows and the divided elements W2 of the even-numbered rows are transported to different cutting operations by the divided element transport unit 10. The structure of the platform. Furthermore, in the second embodiment, the divided element transport unit 10 may be configured to transport the divided elements W1 of odd-numbered rows to the temporary workbench 12 . In the third embodiment, the divided element conveying unit 10 may be configured to transport the divided elements W1 of odd-numbered rows to the temporary workbench 12 . The divided element transport unit 10 transports and holds the structure of the divided elements W1 of odd-numbered rows.

於所述各實施形態中,載入器4為包括第一搬送吸附部411以及第二搬送吸附部412的結構,但亦可設為僅包括任一者的結構。例如,於載入器4為僅包括第一搬送吸附部411的結構的情形時,於將切斷對象物W搬送至切斷工作台2時,載入器4吸附保持奇數行的分割要素W1而將其搬送。又,於切斷連結部W3後,切斷工作台2的第一工作台吸附部21停止奇數行的分割要素W1的吸附,載入器4的第一搬送吸附部411將吸附被停止的奇數行的分割要素W1搬送至其他切斷工作台11。In each of the above-described embodiments, the loader 4 is configured to include the first conveying and adsorbing portion 411 and the second conveying and adsorbing portion 412, but may be configured to include only any one of them. For example, when the loader 4 has a structure including only the first conveyance and adsorption part 411, when the cutting object W is conveyed to the cutting table 2, the loader 4 adsorbs and holds the divided elements W1 of odd-numbered rows. And move it. In addition, after cutting the connection part W3, the first table suction part 21 of the cutting table 2 stops suctioning the divided elements W1 of the odd-numbered rows, and the first conveyance suction part 411 of the loader 4 stops suctioning the odd-numbered rows. The dividing element W1 of the row is conveyed to another cutting table 11.

又,於所述各實施形態中,為載入器4作為分割要素搬送部10發揮功能的結構,亦可設為卸載器5作為分割要素搬送部10發揮功能的結構。於該情形時,卸載器5成為包括僅吸附奇數行的分割要素W1或偶數行的分割要素W2的其中一者的搬送吸附部的結構。In addition, in each of the above-described embodiments, the loader 4 is configured to function as the divided element transport unit 10 , but the unloader 5 may be configured to function as the divided element transport unit 10 . In this case, the unloader 5 has a structure including a transport suction unit that suctions only one of the divided elements W1 of the odd-numbered rows or the divided elements W2 of the even-numbered rows.

於所述各實施形態中,為卸載器5將奇數行的分割要素W1的切斷品P與偶數行的分割要素W2的切斷品P逐個搬送至切斷品收容部7的結構,但卸載器5亦可於吸附奇數行的分割要素W1的切斷品P以及偶數行的分割要素W2的切斷品P的兩者後,搬送至切斷品收容部7。In each of the above-described embodiments, the unloader 5 is configured to transport the cut products P of the divided elements W1 in the odd-numbered rows and the cut products P of the divided elements W2 in the even-numbered rows one by one to the cut product accommodating part 7. However, the unloader 5 The device 5 may adsorb both the cut products P of the dividing elements W1 in the odd-numbered rows and the cut products P of the dividing elements W2 in the even-numbered rows, and then transport them to the cut product storage part 7 .

藉由本發明的切斷裝置100切斷的切斷對象物W並不限於所述實施形態,亦可為未經樹脂成形的例如印刷基板(印刷電路板(Printed Circuit Board,PCB)基板)等基板。於該情形時,切斷對象物W如圖13所示,為例如藉由雕銑加工形成了切口K的基板,該基板藉由連結部W3連結俯視下大致為L字形狀的多個分割要素W1、W2,並且互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上。於此種切斷對象物W中,亦與所述實施形態同樣,於切斷連結部W3後,可將互相鄰接的分割要素的其中一者搬送至其他切斷工作台11並切斷,或使用暫置工作台12依序切斷,或藉由保持於分割要素搬送部10而依序切斷。The cutting object W cut by the cutting device 100 of the present invention is not limited to the above-described embodiment, and may also be a substrate without resin molding, such as a printed circuit board (Printed Circuit Board (PCB) substrate). . In this case, the object W to be cut is, as shown in FIG. 13 , a substrate with a cutout K formed by, for example, engraving and milling processing, and the substrate is connected to a plurality of divided elements that are approximately L-shaped in plan view through the connecting portion W3 W1, W2, and the cutting lines CL1 and CL2 in the dividing elements W1 and W2 adjacent to each other are set on mutually different straight lines. In this type of cutting object W, similarly to the above-mentioned embodiment, after cutting the connection part W3, one of the mutually adjacent divided elements may be transported to another cutting table 11 and cut, or It is cut sequentially using the temporary workbench 12 or by being held in the dividing element transport unit 10 .

所述各實施形態的切斷對象物W中多個分割要素的配置態樣被分為兩組(奇數行以及偶數行),奇數行的分割要素W1與偶數行的分割要素W2中切斷線CL1、切斷線CL2互不相同,但並不限於奇數行的分割要素與偶數行的分割要素,亦可應用於包括多個分割要素中切斷線互相不位於同一直線上的分割要素者。例如,亦可為切斷對象物W的多個分割要素的配置態樣以例如左右各兩行且相同等方式進行分組者。除此以外,切斷對象物W亦可為將多個分割要素的配置態樣分為三個以上組者。The arrangement of the plurality of dividing elements in the cutting object W in each of the above embodiments is divided into two groups (odd-numbered rows and even-numbered rows). The cutting lines of the dividing elements W1 in the odd-numbered rows and the dividing elements W2 in the even-numbered rows CL1 and cutting line CL2 are different from each other, but are not limited to dividing elements of odd-numbered rows and dividing elements of even-numbered rows, and may also be applied to dividing elements including multiple dividing elements whose cutting lines are not located on the same straight line. For example, the arrangement of the plurality of divided elements of the cutting object W may be grouped in two identical rows on the left and right, for example. In addition, the cutting object W may be one in which the arrangement of a plurality of dividing elements is divided into three or more groups.

此外,本發明並不限於所述實施形態,當然可於不脫離其主旨的範圍內進行各種變形。 [產業上的可利用性] In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. [Industrial availability]

根據本發明,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。According to the present invention, it is possible to easily cut an object to be cut with a blade in which the cutting lines in the dividing elements adjacent to each other are set on mutually different straight lines.

2、11:切斷工作台 3:切斷機構 4:載入器(搬送機構) 5:卸載器(搬出機構) 6:切斷對象物收容部 7:切斷品收容部 10:分割要素搬送部 12:暫置工作台 21:第一工作台吸附部(工作台吸附部) 21a、411a、511a:第一吸附孔 21b、411b、511b:第一內部流路 21c、411c、511c:第一抽吸泵 22:第二工作台吸附部(工作台吸附部) 22a、412a、512a:第二吸附孔 22b、412b、512b:第二內部流路 22c、412c、512c:第二抽吸泵 31:刀片 32:轉軸部 41、51:吸附區塊 100:切斷裝置 111:吸附部 411、511:第一搬送吸附部(搬送吸附部) 411d、412d、511d、512d:吸附墊 412、512:第二搬送吸附部(搬送吸附部) CL0、CL1、CL2:切斷線 CTL:控制部 K:切口 P:切斷品 W:切斷對象物 W1:奇數行的分割要素(多個分割要素) W2:偶數行的分割要素(多個分割要素) W3:連結部 2. 11: Cut off the workbench 3: Cut off mechanism 4:Loader (transport mechanism) 5: Unloader (move-out mechanism) 6: Cut off object storage part 7: Cut-off product storage department 10: Divided element transport department 12: Temporary workbench 21: The first workbench adsorption part (workbench adsorption part) 21a, 411a, 511a: first adsorption hole 21b, 411b, 511b: first internal flow path 21c, 411c, 511c: first suction pump 22: The second workbench adsorption part (workbench adsorption part) 22a, 412a, 512a: second adsorption hole 22b, 412b, 512b: Second internal flow path 22c, 412c, 512c: Second suction pump 31:Blade 32:Rotating shaft part 41, 51: Adsorption block 100: Cut-off device 111:Adsorption part 411, 511: First conveying and adsorbing part (conveying and adsorbing part) 411d, 412d, 511d, 512d: adsorption pad 412, 512: Second conveying and adsorbing part (conveying and adsorbing part) CL0, CL1, CL2: Cut off line CTL:Control Department K: incision P: cut product W: Cut off the object W1: Split elements of odd-numbered rows (multiple split elements) W2: Split elements of even-numbered rows (multiple split elements) W3: Connection Department

圖1是示意性地表示切斷對象物的平面圖。 圖2是表示切斷對象物的切斷線的部分放大平面圖。 圖3是示意性地表示本發明的第一實施形態的切斷裝置的結構的平面圖。 圖4是示意性地表示同一實施形態的切斷工作台的結構的平面圖以及截面圖。 圖5是示意性地表示同一實施形態的搬送機構(載入器)的結構的平面圖以及截面圖。 圖6是示意性地表示同一實施形態的搬出機構(卸載器)的結構的平面圖以及截面圖。 圖7是表示同一實施形態的切斷動作的各狀態的截面圖。 圖8是表示同一實施形態的切斷動作中的切斷對象物的各狀態的平面圖。 圖9是示意性地表示第二實施形態的切斷裝置的結構的平面圖。 圖10是表示第二實施形態的切斷動作的各狀態的截面圖。 圖11是示意性地表示第三實施形態的切斷裝置的結構的平面圖。 圖12是表示第三實施形態的切斷動作的各狀態的截面圖。 圖13是表示變形實施形態的切斷對象物以及其切斷方法的平面圖。 圖14是表示使用引線交錯形成的引線框架的樹脂成形基板的平面圖。 FIG. 1 is a plan view schematically showing an object to be cut. FIG. 2 is a partially enlarged plan view showing a cutting line of the object to be cut. 3 is a plan view schematically showing the structure of the cutting device according to the first embodiment of the present invention. 4 is a plan view and a cross-sectional view schematically showing the structure of the cutting table of the same embodiment. 5 is a plan view and a cross-sectional view schematically showing the structure of the transport mechanism (loader) of the same embodiment. 6 is a plan view and a cross-sectional view schematically showing the structure of the unloading mechanism (unloader) of the same embodiment. 7 is a cross-sectional view showing various states of the cutting operation in the same embodiment. 8 is a plan view showing various states of the cutting object in the cutting operation of the same embodiment. Fig. 9 is a plan view schematically showing the structure of a cutting device according to the second embodiment. 10 is a cross-sectional view showing various states of the cutting operation in the second embodiment. FIG. 11 is a plan view schematically showing the structure of a cutting device according to the third embodiment. 12 is a cross-sectional view showing various states of the cutting operation in the third embodiment. FIG. 13 is a plan view showing an object to be cut and a method of cutting the object according to the modified embodiment. FIG. 14 is a plan view showing a resin molded substrate using a lead frame in which leads are interlaced.

2、11:切斷工作台 2. 11: Cut off the workbench

4:載入器(搬送機構) 4: Loader (transport mechanism)

10:分割要素搬送部 10: Divided element transport department

21:第一工作台吸附部(工作台吸附部) 21: The first workbench adsorption part (workbench adsorption part)

22:第二工作台吸附部(工作台吸附部) 22: Second workbench adsorption part (workbench adsorption part)

31:刀片 31:Blade

111:吸附部 111:Adsorption part

411:第一搬送吸附部(搬送吸附部) 411: First conveyance and adsorption part (conveyance and adsorption part)

412:第二搬送吸附部(搬送吸附部) 412: Second conveyance and adsorption part (conveyance and adsorption part)

W:切斷對象物 W: Cut off the object

W1:奇數行的分割要素(多個分割要素) W1: Split elements of odd-numbered rows (multiple split elements)

W2:偶數行的分割要素(多個分割要素) W2: Split elements for even-numbered rows (multiple split elements)

W3:連結部 W3: Connection Department

Claims (10)

一種切斷裝置,將藉由連結部連結多個分割要素、並且互相鄰接的所述分割要素內的切斷線被設定於互不相同的直線上的切斷對象物沿著所述切斷線切斷,且包括:切斷工作台,吸附並保持所述切斷對象物;切斷機構,藉由刀片切斷所述切斷對象物;以及分割要素搬送部,於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,自所述切斷工作台搬送互相鄰接的所述分割要素的其中一者,各所述分割要素藉由樹脂成形將多個晶片密封,其中多個所述晶片配置為一行,多個所述分割要素藉由所述連結部連結的狀態下,在作為第一直線的所述切斷線上的一個或多個所述分割要素,與在作為第二直線的所述切斷線上的一個或多個所述分割要素交錯地配置,所述第一直線與所述第二直線不同。 A cutting device that cuts an object to be cut along a plurality of dividing elements connected by a connecting portion and the cutting lines in the dividing elements adjacent to each other are set on mutually different straight lines. Cutting includes: a cutting table that adsorbs and holds the cutting object; a cutting mechanism that cuts the cutting object with a blade; and a dividing element transport unit that is connected to the connecting portion. In a state where the cutting mechanism cuts and the dividing elements are separated from each other, one of the dividing elements adjacent to each other is transported from the cutting table, and each of the dividing elements molds a plurality of wafers with resin. Sealing, wherein a plurality of the wafers are arranged in a row and one or more of the dividing elements are on the cutting line as a first straight line in a state where a plurality of the dividing elements are connected by the connecting portion, The first straight line and the second straight line are arranged staggeredly with one or more of the dividing elements on the cutting line as a second straight line. 如請求項1所述的切斷裝置,其中所述分割要素搬送部將互相鄰接的所述分割要素的其中一者自所述切斷工作台搬送至其他切斷工作台。 The cutting device according to claim 1, wherein the dividing element transport unit transports one of the mutually adjacent dividing elements from the cutting table to another cutting table. 如請求項1所述的切斷裝置,其中所述分割要素搬送部將互相鄰接的所述分割要素的其中一者自所述切斷工作台搬送至暫置工作台。 The cutting device according to claim 1, wherein the divided element transport unit transports one of the mutually adjacent divided elements from the cutting table to the temporary holding table. 如請求項1所述的切斷裝置,其中所述分割要素搬 送部自所述切斷工作台搬送並保持互相鄰接的所述分割要素的其中一者。 The cutting device according to claim 1, wherein the dividing element moves The transporting unit transports and holds one of the mutually adjacent divided elements from the cutting table. 如請求項1至請求項4中任一項所述的切斷裝置,其中所述切斷工作台包括:第一工作台吸附部,吸附互相鄰接的所述分割要素中的其中一所述分割要素;以及第二工作台吸附部,獨立於所述第一工作台吸附部,吸附另一所述分割要素。 The cutting device according to any one of claims 1 to 4, wherein the cutting workbench includes: a first workbench adsorption part for adsorbing one of the divided elements adjacent to each other. element; and a second workbench adsorption part, independent of the first workbench adsorption part, adsorbs another of the divided elements. 如請求項5所述的切斷裝置,其中於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,所述切斷工作台停止所述第一工作台吸附部或所述第二工作台吸附部的其中一者對所述分割要素的吸附,所述分割要素搬送部自所述切斷工作台搬送所述切斷工作台上吸附被停止的所述分割要素。 The cutting device according to claim 5, wherein the cutting table stops adsorption of the first table in a state where the connecting portion is cut by the cutting mechanism and the dividing elements are separated from each other. One of the part or the second table adsorption part adsorbs the divided element, and the divided element transport part transports the divided part whose adsorption is stopped on the cutting table from the cutting table. elements. 如請求項1至請求項4中任一項所述的切斷裝置,其中所述多個分割要素沿著基於所述刀片的切斷方向排列,且所述分割要素搬送部搬送在作為所述第一直線的所述切斷線上的所述分割要素或在作為所述第二直線的所述切斷線上的所述分割要素。 The cutting device according to any one of Claims 1 to 4, wherein the plurality of dividing elements are arranged along a cutting direction by the blade, and the dividing element conveying section conveys the cutting elements as the The dividing element is on the cutting line of the first straight line or the dividing element is on the cutting line which is the second straight line. 如請求項1至請求項4中任一項所述的切斷裝置,其包括:搬送機構,將所述切斷對象物搬送至所述切斷工作台;以及搬出機構,將所述切斷工作台上被切斷的切斷品搬出,且所述搬送機構或所述搬出機構作為所述分割要素搬送部發揮 功能。 The cutting device according to any one of claims 1 to 4, including: a conveying mechanism for conveying the cutting object to the cutting table; and a carry-out mechanism for conveying the cutting object to the cutting table. The cut product cut on the workbench is carried out, and the transport mechanism or the carry-out mechanism functions as the dividing element transport section Function. 如請求項7所述的切斷裝置,其包括:搬送機構,將所述切斷對象物搬送至所述切斷工作台;以及搬出機構,將所述切斷工作台上被切斷的切斷品搬出,且所述搬送機構或所述搬出機構作為所述分割要素搬送部發揮功能,其中所述搬送機構或所述搬出機構包括:第一搬送吸附部,吸附所述其中一組的分割要素;以及第二搬送吸附部,獨立於所述第一搬送吸附部,吸附所述另一組的分割要素,且所述搬送機構或所述搬出機構使用所述第一搬送吸附部或所述第二搬送吸附部,作為所述分割要素搬送部發揮功能。 The cutting device according to claim 7, which includes: a transport mechanism for transporting the cutting object to the cutting table; and a carry-out mechanism for transporting the cut pieces cut on the cutting table. The broken products are carried out, and the transport mechanism or the carry-out mechanism functions as the divided element transport section, wherein the transport mechanism or the carry-out mechanism includes a first transport adsorption section that adsorbs one of the divided elements of the group. elements; and a second conveying and adsorbing part, which is independent of the first conveying and adsorbing part, adsorbs the divided elements of the other group, and the conveying mechanism or the unloading mechanism uses the first conveying and adsorbing part or the The second transport and suction unit functions as the divided element transport unit. 一種切斷品的製造方法,其使用如請求項1至請求項9中任一項所述的切斷裝置。 A method of manufacturing a cut product using the cutting device according to any one of claims 1 to 9.
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