TW202221775A - Cutting device and manufacturing method for cut product - Google Patents

Cutting device and manufacturing method for cut product Download PDF

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TW202221775A
TW202221775A TW110139950A TW110139950A TW202221775A TW 202221775 A TW202221775 A TW 202221775A TW 110139950 A TW110139950 A TW 110139950A TW 110139950 A TW110139950 A TW 110139950A TW 202221775 A TW202221775 A TW 202221775A
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cutting
elements
division
cut
suction
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TW110139950A
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TWI826854B (en
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堀聡子
高田直毅
岩田康弘
黄善夏
北川雄大
片岡昌一
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日商Towa股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • B24B41/061Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention makes it possible to cut, by a blade, an object to be cut in which cutting lines in divided elements adjacent to each other are set on straight lines different from each other. A cutting device 100 of the invention cuts an object W to be cut along cutting lines CL1 and CL2, in which in the object W to be cut, multiple divided elements W1 and W2 are connected by a connection part W3 and the cutting lines CL1 and CL2 in the divided elements W1 and W2 adjacent to each other are set on different straight lines. The cutting device 100 includes: a cutting table 2, sucking and holding the object W to be cut; a cutting mechanism 3, cutting, by a blade 31, the object W to be cut; and a divided element conveyance part 10, conveying one of the divided elements W1 and W2 adjacent to each other from the cutting table 2 in a state where the connection part W3 is cut by the cutting mechanism 3 and the divided elements W1 and W2 are separated from each other.

Description

切斷裝置以及切斷品的製造方法Cutting device and manufacturing method of cut product

本發明是有關於一種切斷裝置以及切斷品的製造方法。The present invention relates to a cutting device and a method for manufacturing a cut product.

先前,例如如專利文獻1所示,考慮一種包括移送墊的切削裝置,所述移送墊抽吸保持封裝體基板的全部晶片中的一部分晶片。於該切削裝置中,構成為於吸盤工作台設定有與收容托盤的外形尺寸相適應的多個區域,按照各設定有移送墊的區域進行分割,統一抽吸並搬送晶片。 [現有技術文獻] [專利文獻] Conventionally, as shown in Patent Document 1, for example, there has been considered a cutting apparatus including a transfer pad that sucks and holds a part of all the wafers of the package substrate. In this cutting apparatus, a plurality of regions corresponding to the external dimensions of the storage tray are set on the chuck table, and the wafers are collectively suctioned and transported by dividing each region in which the transfer pads are set. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2003-234310號公報[Patent Document 1] Japanese Patent Laid-Open No. 2003-234310

[發明所欲解決之課題][The problem to be solved by the invention]

另一方面,近年來,於小外形電晶體(Small Outline Transistor,SOT)或小外形積體電路(Small Outline Integrated Circuit,SOIC)等半導體封裝中,為了使用大小相同的引線框架製造更多的封裝體,而如圖14般,使用引線交錯形成的引線框架製造樹脂成形而成的樹脂成形基板。On the other hand, in recent years, in semiconductor packages such as Small Outline Transistor (SOT) or Small Outline Integrated Circuit (SOIC), in order to use lead frames of the same size to manufacture more packages As shown in FIG. 14 , a resin-molded substrate formed by resin molding was produced using a lead frame formed by staggered leads.

然而,於使用引線交錯形成的引線框架的樹脂成形基板中,由於封裝體的切斷線並不位於同一直線上,故而現有的使用刀片的切斷裝置難以進行切斷。However, in a resin-molded substrate using a lead frame formed by staggered leads, since the cutting lines of the package are not located on the same straight line, it is difficult to cut the conventional cutting device using a blade.

因此,本發明是為了解決所述問題點而完成,其主要課題在於使得能夠藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。 [解決課題之手段] Therefore, the present invention has been made in order to solve the above-mentioned problems, and its main problem is to easily cut with a blade a cutting object whose cutting lines in mutually adjacent division elements are set on mutually different straight lines thing. [Means of Solving Problems]

即,本發明的切斷裝置是一種將藉由連結部連結多個分割要素、並且互相鄰接的所述分割要素內的切斷線被設定於互不相同的直線上的切斷對象物沿著所述切斷線切斷的切斷裝置,其特徵在於包括:切斷工作台,吸附並保持所述切斷對象物;切斷機構,藉由刀片切斷所述切斷對象物;以及分割要素搬送部,於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,自所述切斷工作台搬送互相鄰接的所述分割要素的其中一者。 [發明的效果] That is, the cutting device of the present invention is a cutting object along which a plurality of division elements are connected by a connecting portion and the cutting lines in the adjacent division elements are set on mutually different straight lines. The cutting device for cutting the cutting line is characterized by comprising: a cutting table for adsorbing and holding the object to be cut; a cutting mechanism for cutting the object to be cut with a blade; and dividing The element conveying unit conveys one of the adjacent division elements from the cutting table in a state in which the connection part is cut by the cutting mechanism and the division elements are separated from each other. [Effect of invention]

根據以所述方式構成的本發明,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。According to the present invention constituted as described above, it is possible to easily cut a cutting object whose cutting lines in mutually adjacent division elements are set on mutually different straight lines by a blade.

以下,舉例對本發明進一步進行詳細說明。但本發明不受以下的說明所限定。Hereinafter, the present invention will be described in further detail by way of examples. However, the present invention is not limited by the following description.

本發明的切斷裝置如上文所述,為將藉由連結部連結多個分割要素、並且互相鄰接的所述分割要素內的切斷線被設定於互不相同的直線上的切斷對象物沿著所述切斷線切斷的切斷裝置,其特徵在於包括:切斷工作台,吸附並保持所述切斷對象物;切斷機構,藉由刀片切斷所述切斷對象物;以及分割要素搬送部,於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,自所述切斷工作台搬送互相鄰接的所述分割要素的其中一者。 若為該切斷裝置,則由於包括於分割要素互相分離的狀態下自切斷工作台搬送互相鄰接的分割要素的其中一者的分割要素搬送部,故而能夠自切斷工作台取出互相鄰接的分割要素的其中一者。藉此,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。 As described above, the cutting device of the present invention is an object to be cut in which a plurality of division elements are connected by a connecting portion, and the cutting lines in the adjacent division elements are set on mutually different straight lines. The cutting device for cutting along the cutting line is characterized by comprising: a cutting table for adsorbing and holding the object to be cut; a cutting mechanism for cutting the object to be cut with a blade; and a division element conveying unit that conveys one of the adjacent division elements from the cutting table in a state in which the connection portion is cut by the cutting mechanism and the division elements are separated from each other. In the case of this cutting device, since the dividing element conveying unit is included for conveying one of the adjacent dividing elements from the cutting table in a state where the dividing elements are separated from each other, the adjacent dividing elements can be taken out from the cutting table. One of the split elements. Thereby, it is possible to easily cut an object to be cut in which the cutting lines in the division elements adjacent to each other are set on straight lines different from each other by the blade.

作為所述分割要素搬送部的具體的實施態樣,考慮將互相鄰接的所述分割要素的其中一者自所述切斷工作台搬送至其他切斷工作台。 於該結構的情形時,互相鄰接的分割要素分別於不同的切斷工作台被切斷。再者,於在不同的切斷工作台切斷時,可藉由共用的刀片切斷,亦可藉由不同的刀片切斷。 As a specific embodiment of the division element conveying unit, it is conceivable to convey one of the division elements adjacent to each other from the cutting table to the other cutting table. In the case of this structure, mutually adjacent division|segmentation elements are each cut|disconnected by a different cutting table. Furthermore, when cutting on different cutting tables, it may be cut by a common blade or by different blades.

又,作為所述分割要素搬送部的具體的實施態樣,考慮將互相鄰接的所述分割要素的其中一者自所述切斷工作台搬送至暫置工作台。 於該結構的情形時,切斷機構依序切斷互相鄰接的分割要素。具體而言,於所述分割要素搬送部將互相鄰接的分割要素的其中一者搬送至暫置工作台後,切斷機構於切斷工作台上切斷互相鄰接的分割要素的另一者。然後,將該切斷品自切斷工作台搬出後,分割要素搬送部將互相鄰接的所述分割要素的其中一者自暫置工作台搬送至切斷工作台,切斷機構於切斷工作台上切斷互相鄰接的分割要素的其中一者。 Moreover, as a specific embodiment of the said division|segmentation element conveyance part, it is considered to convey one of the said division|segmentation elements adjacent to each other from the said cutting table to a temporary table. In the case of this structure, the cutting mechanism sequentially cuts the adjacent division elements. Specifically, after the divided element conveying unit conveys one of the adjacent divided elements to the temporary table, the cutting mechanism cuts the other adjacent divided elements on the cutting table. Then, after the cut product is unloaded from the cutting table, the division element conveying unit conveys one of the adjacent division elements from the temporary table to the cutting table, and the cutting mechanism performs the cutting operation. One of the division elements adjacent to each other is cut on the stage.

進而,作為所述分割要素搬送部的具體的實施態樣,考慮自所述切斷工作台搬送並保持互相鄰接的所述分割要素的其中一者。 於該結構的情形時,與搬送至所述暫置工作台的情形時相同,切斷機構依序切斷互相鄰接的分割要素。具體而言,於所述分割要素搬送部自切斷工作台搬送並保持互相鄰接的分割要素的其中一者的狀態下,切斷機構於切斷工作台上切斷互相鄰接的分割要素的另一者。然後,將該切斷品自切斷工作台搬出後,分割要素搬送部將互相鄰接的所述分割要素的其中一者搬送至切斷工作台,切斷機構於切斷工作台上切斷互相鄰接的分割要素的其中一者。 Furthermore, as a specific embodiment of the division element conveying unit, one of the division elements that are conveyed from the cutting table and held adjacent to each other can be considered. In the case of this structure, similarly to the case of transferring to the temporary table, the cutting mechanism sequentially cuts the adjacent division elements. Specifically, the cutting mechanism cuts the other of the adjacent divided elements on the cutting table in a state in which the divided element conveying section conveys and holds one of the adjacent divided elements from the cutting table. one. Then, after the cut product is unloaded from the cutting table, the division element conveying unit conveys one of the adjacent division elements to the cutting table, and the cutting mechanism cuts each other on the cutting table. One of the adjacent split elements.

為了利用分割要素搬送部進行分割要素的搬送,理想的是所述切斷工作台包括:第一工作台吸附部,吸附互相鄰接的所述分割要素中的其中一所述分割要素;以及第二工作台吸附部,獨立於該第一工作台吸附部,吸附另一所述分割要素。 若為該結構,則可停止僅由分割要素搬送部搬送的分割要素的吸附,而可確實地利用分割要素搬送部進行分割要素的搬送。 In order to transfer the divided elements by the divided element transfer section, it is preferable that the cutting table includes: a first table suction section for sucking one of the divided elements adjacent to each other; and a second The table adsorption part is independent of the first table adsorption part and adsorbs the other division element. With this configuration, the suction of the divided elements conveyed only by the divided element conveying unit can be stopped, and the divided elements can be reliably conveyed by the divided element conveying unit.

作為用以利用分割要素搬送部進行分割要素的搬送的具體實施態樣,考慮於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,所述切斷工作台停止所述第一工作台吸附部或所述第二工作台吸附部的其中一者對所述分割要素的吸附,所述分割要素搬送部自所述切斷工作台搬送所述切斷工作台上吸附被停止的所述分割要素。As a specific embodiment for conveying the divided elements by the divided element conveying unit, it is considered that the cutting table is in a state in which the connecting portion is cut by the cutting mechanism and the divided elements are separated from each other. The suction of the divided elements by one of the first table suction part or the second table suction part is stopped, and the divided element transport part transports the cutting table from the cutting table Up-suction of the segmented element that has been stopped.

作為切斷對象物的具體的實施態樣,考慮所述多個分割要素沿著基於所述刀片的切斷方向排列,該些的配置態樣被分為至少兩組,其中一組的所述分割要素的切斷線位於同一直線上,另一組的所述分割要素的切斷線位於同一直線上。 於該結構的切斷對象物中,理想的是所述分割要素搬送部搬送所述其中一組的分割要素或所述另一組的分割要素的其中一者。 As a specific embodiment of the object to be cut, it is considered that the plurality of division elements are arranged along the cutting direction by the blade, and the arrangement of these elements is divided into at least two groups, wherein the The cutting lines of the divided elements are located on the same straight line, and the cutting lines of the divided elements of another group are located on the same straight line. In the object to be cut having this configuration, it is preferable that the division element conveying unit conveys one of the division elements of the one group or the division elements of the other group.

又,理想的是本發明的切斷裝置包括:搬送機構,將所述切斷對象物搬送至所述切斷工作台;以及搬出機構,將所述切斷工作台上被切斷的切斷品搬出,且所述搬送機構或所述搬出機構作為所述分割要素搬送部發揮功能。 若為該結構,則可由搬送機構或搬出機構構成分割要素搬送部,因此與除了搬送機構以及搬出機構以外另行設置分割要素搬送部的情形時相比,可使裝置結構變得簡單。 Furthermore, it is preferable that the cutting device of the present invention includes: a conveying mechanism that conveys the object to be cut to the cutting table; and a carry-out mechanism that cuts off the cutting object on the cutting table The product is unloaded, and the conveying mechanism or the unloading mechanism functions as the division element conveying unit. With this configuration, the division element conveying portion can be constituted by the conveying mechanism or the unloading mechanism, so that the device structure can be simplified compared with the case where the division element conveying portion is separately provided in addition to the conveying mechanism and the unloading mechanism.

關於用於搬送機構或搬出機構作為分割要素搬送部發揮功能的具體實施態樣,考慮所述搬送機構或所述搬出機構包括:第一搬送吸附部,吸附所述其中一組的分割要素;以及第二搬送吸附部,獨立於所述第一搬送吸附部,吸附所述另一組的分割要素,且所述搬送機構或所述搬出機構使用所述第一搬送吸附部或所述第二搬送吸附部,作為所述分割要素搬送部發揮功能。Regarding a specific embodiment for the conveying mechanism or the unloading mechanism to function as the division element conveying portion, it is considered that the conveying mechanism or the unloading mechanism includes: a first conveying suction portion that suctions the division elements of the one group; and The second conveyance suction part is independent of the first conveyance suction part and suctions the divided elements of the other group, and the conveyance mechanism or the unloading mechanism uses the first conveyance suction part or the second conveyance The suction unit functions as the division element transfer unit.

又,使用所述切斷裝置的切斷品的製造方法亦為本發明的一態樣。Moreover, the manufacturing method of the cut product using the said cutting device is also an aspect of this invention.

<本發明的第一實施形態> 以下,參照圖式對本發明的切斷裝置的第一實施形態進行說明。再者,對於以下所示的任一圖,為了容易理解,而適當省略或誇張地示意性繪製。對相同的結構要素標註相同的符號,並適當省略說明。 <The first embodiment of the present invention> Hereinafter, a first embodiment of the cutting device of the present invention will be described with reference to the drawings. It should be noted that any of the drawings shown below are appropriately omitted or exaggerated and schematically drawn for easy understanding. The same symbols are attached to the same structural elements, and explanations are appropriately omitted.

<切斷裝置的整體結構> 本實施形態的切斷裝置100藉由將設定於切斷對象物W的切斷線CL0~切斷線CL2切斷而將其單片化為多個切斷品P(製品P)。 <Overall structure of cutting device> The cutting device 100 of the present embodiment separates the cutting object W into a plurality of cut products P (products P) by cutting the cutting line CL0 to the cutting line CL2 set to the cutting object W.

此處,如圖1以及圖2所示,切斷對象物W藉由連結部W3連結多個分割要素W1、W2,並且互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上。各分割要素W1、分割要素W2藉由樹脂成形將多個晶片密封,此處,將多個晶片配置為一行。又,對應於各晶片而設置有引線。並且,多個分割要素W1、W2沿著基於刀片31(參照圖3)的切斷方向(圖1中為左右方向)排列,該些的兩端部藉由連結部W3連結。具體而言,其中一組的奇數行的分割要素W1與另一組的偶數行的分割要素W2以該些的引線交錯的方式構成。藉此,其中一組的奇數行的分割要素W1的切斷線CL1位於同一直線上,另一組的偶數行的分割要素W2的切斷線CL2位於同一直線上。又,奇數行的分割要素W1的切斷線CL1與偶數行的分割要素W2的切斷線CL2位於互不相同的直線上(參照圖2)。再者,圖2中的符號CL0為用於切斷連結部W3而分離為多個分割要素W1、W2的切斷線。又,各圖所示的切斷線CL0~切斷線CL2為藉由刀片31預定切斷的假想線,實際的切斷對象物W上並不顯示。Here, as shown in FIGS. 1 and 2 , the object to be cut W is connected to a plurality of division elements W1 and W2 by a connecting portion W3, and the division elements W1 and W2 adjacent to each other, the cutting line CL1 in the division element W2, and the cut The disconnection CL2 is set on a straight line different from each other. Each of the division elements W1 and W2 seals a plurality of wafers by resin molding, and here, the plurality of wafers are arranged in a row. In addition, leads are provided corresponding to the respective wafers. The plurality of dividing elements W1 and W2 are arranged along the cutting direction (left-right direction in FIG. 1 ) by the blade 31 (see FIG. 3 ), and both ends of these are connected by the connecting portion W3 . Specifically, the division elements W1 of the odd-numbered rows of one group and the division elements W2 of the even-numbered rows of the other group are configured such that the leads of these are interleaved. Thereby, the cutting lines CL1 of the division elements W1 in odd-numbered rows of one group are located on the same straight line, and the cutting lines CL2 of the division elements W2 in the even-numbered rows of the other group are located on the same straight line. Moreover, the cutting line CL1 of the division element W1 of odd-numbered rows and the cutting line CL2 of division element W2 of the even-numbered row are located on mutually different straight lines (refer FIG. 2). In addition, the code|symbol CL0 in FIG. 2 is a cutting line for cutting|disconnecting the connection part W3, and dividing into several division elements W1 and W2. In addition, the cutting line CL0 - the cutting line CL2 shown in each figure are imaginary lines which are scheduled to be cut by the blade 31, and are not displayed on the actual object to be cut W.

具體而言,如圖3所示,切斷裝置100包括:切斷工作台2,吸附並保持切斷對象物W;切斷機構3,藉由刀片31切斷由切斷工作台2保持的切斷對象物W;搬送機構4(以下亦稱為載入器4),將切斷對象物W搬送至切斷工作台2;以及搬出機構5(以下亦稱為卸載器5),將於切斷工作台2上切斷的切斷品P自切斷工作台2搬出。Specifically, as shown in FIG. 3 , the cutting device 100 includes a cutting table 2 that attracts and holds the object to be cut W; The cutting object W; the conveying mechanism 4 (hereinafter also referred to as the loader 4 ), which transports the cutting object W to the cutting table 2 ; and the unloading mechanism 5 (hereinafter also referred to as the unloader 5 ), which will be The cut product P cut on the cutting table 2 is carried out from the cutting table 2 .

切斷工作台2吸附並保持切斷對象物W,如圖4所示,包括:第一工作台吸附部21,吸附互相鄰接的分割要素W1、分割要素W2中的其中一分割要素W1;以及第二工作台吸附部22,吸附另一分割要素W2。再者,切斷工作台2構成為可藉由未圖示的移動機構而至少沿著Y方向移動。又,切斷工作台2亦可以藉由未圖示的旋轉機構而沿著θ方向旋轉的方式構成。As shown in FIG. 4 , the cutting table 2 suctions and holds the cutting object W, and includes: a first table suction part 21 for suctioning one of the adjacent divided elements W1 and W2; and The second table suction part 22 suctions the other divided element W2. In addition, the cutting table 2 is configured to be movable along at least the Y direction by a movement mechanism not shown. Moreover, the cutting table 2 may be comprised so that it may rotate in the (theta) direction by the rotation mechanism which is not shown in figure.

第一工作台吸附部21以及第二工作台吸附部22互相獨立,以能夠各自獨立地切換吸附與其停止的方式構成。The first stage suction part 21 and the second stage suction part 22 are independent of each other, and are configured so that suction and stop can be switched independently of each other.

具體而言,第一工作台吸附部21統一吸附切斷對象物W中的奇數行(1行、3行、5行、・・・)的分割要素W1,第二工作台吸附部22統一吸附切斷對象物W中的偶數行(2行、4行、6行、・・・)的分割要素W2。即,切斷工作台2以能夠獨立切換奇數行的分割要素W1的吸附或其停止與偶數行的分割要素W2的吸附或其停止的方式構成。Specifically, the first table suction part 21 collectively suctions the division elements W1 of odd-numbered rows (1 row, 3 rows, 5 rows, ・・・) in the object W to be cut, and the second table suction part 22 collectively sucks The division element W2 of the even-numbered lines (2 lines, 4 lines, 6 lines, ・・・) in the object W is cut. That is, the cutting table 2 is configured to be able to independently switch between the suction or stop of the divided elements W1 in odd-numbered rows and the suction or stop of the divided elements W2 in even-numbered rows.

第一工作台吸附部21包括:第一吸附孔21a,於切斷工作台2的上表面開口;第一內部流路21b,與該第一吸附孔21a連續,形成於切斷工作台2的內部;以及第一抽吸泵21c,連接於該第一內部流路21b。又,第二工作台吸附部22包括:第二吸附孔22a,於切斷工作台2的上表面開口;第二內部流路22b,與該第二吸附孔22a連續,形成於切斷工作台2的內部;以及第二抽吸泵22c,連接於該第二內部流路22b。再者,亦可將第一抽吸泵21c與第二抽吸泵22c設為共通,例如使用未圖示的切換閥切換連接於抽吸泵的內部流路。再者,除了抽吸泵以外,亦可使用噴射器。The first table suction part 21 includes: a first suction hole 21a opened on the upper surface of the cutting table 2; inside; and a first suction pump 21c connected to the first internal flow path 21b. In addition, the second table suction part 22 includes: a second suction hole 22a opened on the upper surface of the cutting table 2; and a second internal flow path 22b continuous with the second suction hole 22a and formed in the cutting table 2; and a second suction pump 22c connected to the second internal flow path 22b. In addition, the 1st suction pump 21c and the 2nd suction pump 22c may be made common, for example, the internal flow path connected to the suction pump may be switched using a switching valve not shown. Furthermore, instead of a suction pump, an ejector may also be used.

切斷機構3將切斷對象物W切斷為直線狀,如圖3所示,包括刀片31、使該刀片31旋轉的轉軸部32、以及使該轉軸部32至少沿著X方向以及Z方向移動的移動機構(未圖示)。刀片31的旋轉軸方向平行於切斷工作台2的上表面,此處,為沿著水平方向的方向。並且,藉由使切斷工作台2與切斷機構3相對移動,而利用刀片31將切斷對象物W切斷。The cutting mechanism 3 cuts the object W to be cut into a linear shape, and as shown in FIG. 3 , includes a blade 31 , a rotating shaft portion 32 for rotating the blade 31 , and the rotating shaft portion 32 along at least the X direction and the Z direction. Moving mechanism (not shown). The rotation axis direction of the blade 31 is parallel to the upper surface of the cutting table 2, and here, is the direction along the horizontal direction. Then, by relatively moving the cutting table 2 and the cutting mechanism 3 , the cutting object W is cut by the blade 31 .

載入器4將切斷對象物W自收容切斷對象物W的切斷對象物收容部6(參照圖3)搬送至切斷工作台2。又,如下文所述,載入器4以切斷工作台2中互相鄰接的分割要素W1、分割要素W2的切斷線CL1、切斷線CL2一致的方式使互相鄰接的分割要素W1、分割要素W2的其中一者移動。The loader 4 conveys the object to be cut W to the cutting table 2 from the object to be cut accommodating section 6 (refer to FIG. 3 ) in which the object to be cut W is accommodated. In addition, as will be described later, the loader 4 divides the adjacent division elements W1 and CL2 so that the cutting lines CL1 and CL2 of the division elements W1 and W2 adjacent to each other in the table 2 coincide with each other. One of the elements W2 moves.

具體而言,如圖5所示,載入器4包括:吸附區塊41,設置有用於吸附切斷對象物W的搬送吸附部411、搬送吸附部412;以及移動機構(未圖示),使該吸附區塊41移動。Specifically, as shown in FIG. 5 , the loader 4 includes: a suction block 41 provided with a transfer suction part 411 and a transfer suction part 412 for suctioning the object to be cut W; and a moving mechanism (not shown), The adsorption block 41 is moved.

於吸附區塊41設置有吸附互相鄰接的分割要素W1、分割要素W2中的其中一分割要素W1的第一搬送吸附部411、以及吸附另一分割要素W2的第二搬送吸附部412。即,載入器4的吸附區塊41包括與切斷工作台2的各工作台吸附部21、工作台吸附部22對應的搬送吸附部411、搬送吸附部412。The suction block 41 is provided with a first transfer suction part 411 for suctioning adjacent divided elements W1 and one of the divided elements W2, and a second transfer suction part 412 for suctioning the other divided element W2. That is, the suction block 41 of the loader 4 includes the conveyance suction part 411 and the conveyance suction part 412 corresponding to each of the table suction parts 21 and 22 of the cutting table 2 .

具體而言,第一搬送吸附部411吸附切斷對象物W中的奇數行(1行、3行、5行、・・・)的分割要素W1,第二搬送吸附部412吸附切斷對象物W中的偶數行(2行、4行、6行、・・・)的分割要素W2。即,載入器4以能夠獨立切換奇數行的分割要素W1的吸附或其停止與偶數行的分割要素W2的吸附或其停止的方式構成。Specifically, the first conveyance suction unit 411 suctions the division elements W1 in odd-numbered rows (1 row, 3 rows, 5 rows, ・・・) in the object to be cut W, and the second conveyance suction unit 412 sucks the cutting object Split element W2 of even-numbered rows (2 rows, 4 rows, 6 rows, ・・・) in W. That is, the loader 4 is configured so as to be able to independently switch between the suction or stop of the divided elements W1 of odd-numbered rows and the suction or stop of the divided elements W2 of even-numbered rows.

第一搬送吸附部411包括:第一吸附孔411a,於吸附區塊41的下表面開口;第一內部流路411b,與該第一吸附孔411a連續,形成於吸附區塊41的內部;以及第一抽吸泵411c,連接於該第一內部流路411b。再者,於第一吸附孔411a設置有例如樹脂製的吸附墊411d。又,第二搬送吸附部412包括:第二吸附孔412a,於吸附區塊41的下表面開口;第二內部流路412b,與該第二吸附孔412a連續,形成於吸附區塊41的內部;以及第二抽吸泵412c,連接於該第二內部流路412b。再者,於第二吸附孔412a設置有吸附墊412d。除此以外,亦可構成為將第一抽吸泵411c與第二抽吸泵412c設為共通,例如使用未圖示的切換閥切換連接於抽吸泵的內部流路。The first conveyance suction part 411 includes: a first suction hole 411a opened on the lower surface of the suction block 41; a first internal flow path 411b, continuous with the first suction hole 411a, formed inside the suction block 41; and The first suction pump 411c is connected to the first internal flow path 411b. Moreover, the adsorption|suction pad 411d made of resin is provided in the 1st adsorption|suction hole 411a, for example. In addition, the second transfer suction part 412 includes: a second suction hole 412a opened on the lower surface of the suction block 41; ; and a second suction pump 412c connected to the second internal flow path 412b. Furthermore, an adsorption pad 412d is provided in the second adsorption hole 412a. In addition to this, the first suction pump 411c and the second suction pump 412c may be used in common, and the internal flow path connected to the suction pump may be switched, for example, using a switching valve not shown.

以所述方式構成的載入器4作為於連結部W3被切斷機構3切斷而分割要素W1、分割要素W2互相分離的狀態下,將互相鄰接的分割要素W1、分割要素W2的其中一者自切斷工作台2搬送至其他切斷工作台11(參照圖3)的分割要素搬送部10發揮功能。本實施形態的分割要素搬送部10使用載入器4的第二搬送吸附部412而構成。即,分割要素搬送部10將偶數行的分割要素W2自切斷工作台2搬送至其他切斷工作台11。The loader 4 configured as described above serves as one of the adjacent divided elements W1 and W2 in a state in which the connecting portion W3 is cut by the cutting mechanism 3 and the divided elements W1 and W2 are separated from each other. The division element conveying unit 10 that is conveyed from the cutting table 2 to another cutting table 11 (refer to FIG. 3 ) functions. The divided element transfer unit 10 of the present embodiment is configured using the second transfer suction unit 412 of the loader 4 . That is, the division element conveyance unit 10 conveys the division elements W2 of the even-numbered rows from the cutting table 2 to the other cutting tables 11 .

卸載器5吸附經切斷的切斷品P,將切斷品P自切斷工作台2搬送至切斷品收容部7(參照圖3)。具體而言,如圖6所示,卸載器5包括:吸附區塊51,設置有用於吸附切斷品P的搬送吸附部511、搬送吸附部512;以及移動機構(未圖示),使該吸附區塊51移動。The unloader 5 sucks the cut product P, and conveys the cut product P from the cutting table 2 to the cut product storage portion 7 (see FIG. 3 ). Specifically, as shown in FIG. 6 , the unloader 5 includes a suction block 51 provided with a conveyance suction part 511 and a conveyance suction part 512 for suctioning the cut product P; and a moving mechanism (not shown) for causing the The adsorption block 51 moves.

具體而言,第一搬送吸附部511吸附切斷對象物W中的奇數行(1行、3行、5行、・・・)的分割要素W1的切斷品P,第二搬送吸附部512吸附切斷對象物W中的偶數行(2行、4行、6行、・・・)的分割要素W2的切斷品P。即,卸載器5以能夠獨立地切換奇數行的分割要素W1的切斷品P的吸附或其停止與偶數行的分割要素W2的切斷品P的吸附或其停止的方式構成。Specifically, the first conveyance suction unit 511 suctions the cut products P of the division elements W1 in odd-numbered rows (1 row, 3 rows, 5 rows, ・・・) in the object to be cut W, and the second conveyance suction unit 512 The cut product P of the division element W2 of the even-numbered rows (2 rows, 4 rows, 6 rows, ・・・) in the cutting object W is adsorbed. That is, the unloader 5 is configured to be able to independently switch between the suction or stop of the cut products P of the divided elements W1 in odd-numbered rows and the suction or stop of the cut products P of the divided elements W2 in even-numbered rows.

第一搬送吸附部511包括:第一吸附孔511a,於吸附區塊51的下表面開口;第一內部流路511b,與該第一吸附孔511a連續,形成於吸附區塊51的內部;以及第一抽吸泵511c,連接於該第一內部流路511b。再者,於第一吸附孔511a設置有例如樹脂製的吸附墊511d。又,第二搬送吸附部512包括:第二吸附孔512a,於吸附區塊51的下表面開口;第二內部流路512b,與該第二吸附孔512a連續,形成於吸附區塊51的內部;以及第二抽吸泵512c,連接於該第二內部流路512b。再者,於第二吸附孔512a設置有吸附墊512d。除此以外,亦可構成為將第一抽吸泵511c與第二抽吸泵512c設為共通,例如使用未圖示的切換閥切換連接於抽吸泵的內部流路。再者,於圖6中,奇數行的吸附孔512a與偶數行的吸附孔513a沿著Y方向排列為一直線,亦可互相錯開。The first conveying suction part 511 includes: a first suction hole 511a opened on the lower surface of the suction block 51; a first internal flow path 511b, continuous with the first suction hole 511a, formed inside the suction block 51; and The first suction pump 511c is connected to the first internal flow path 511b. Moreover, the adsorption|suction pad 511d made of resin is provided in the 1st adsorption|suction hole 511a, for example. In addition, the second transfer suction part 512 includes: a second suction hole 512a opened on the lower surface of the suction block 51; ; and a second suction pump 512c connected to the second internal flow path 512b. Furthermore, an adsorption pad 512d is provided in the second adsorption hole 512a. In addition to this, the first suction pump 511c and the second suction pump 512c may be used in common, and the internal flow path connected to the suction pump may be switched, for example, using a switching valve not shown. Furthermore, in FIG. 6 , the adsorption holes 512a in the odd-numbered rows and the adsorption holes 513a in the even-numbered rows are arranged in a straight line along the Y direction, and they can also be staggered from each other.

<切斷裝置100的切斷動作> 參照圖7以及圖8對該切斷裝置100的動作進行說明。再者,以下切斷動作藉由利用控制部CTL(參照圖3)控制各部而進行。 <Cutting operation of the cutting device 100> The operation of the cutting device 100 will be described with reference to FIGS. 7 and 8 . In addition, the following cutting operation|movement is performed by controlling each part by the control part CTL (refer FIG. 3).

(1)切斷對象物W的搬送 載入器4吸附並保持收容於切斷對象物收容部6中的切斷對象物W,將其搬送至切斷工作台2。搬送至切斷工作台2的切斷對象物W被切斷工作台2的第一工作台吸附部21以及第二工作台吸附部22吸附並保持(圖7的<吸附保持切斷對象物>)。此處,切斷對象物W相對於切斷工作台2的定位例如藉由使形成於切斷對象物W的定位用的孔與設置於切斷工作台2的定位銷嵌合而進行。除此以外,亦可藉由使形成於切斷對象物W的定位用的孔與設置於載入器4的定位銷嵌合而進行。 (1) Transport of the object to be cut W The loader 4 sucks and holds the cutting object W accommodated in the cutting object accommodating section 6 , and transfers it to the cutting table 2 . The cutting object W conveyed to the cutting table 2 is sucked and held by the first table suction part 21 and the second table suction part 22 of the cutting table 2 (<Suction and Holding Cutting Object> in FIG. 7 . ). Here, the positioning of the object to be cut W with respect to the cutting table 2 is performed, for example, by fitting a positioning hole formed in the object to be cut W with a positioning pin provided in the cutting table 2 . Alternatively, it may be performed by fitting the positioning holes formed in the object to be cut W with the positioning pins provided in the loader 4 .

(2)連結部W3的切斷 藉由切斷機構3切斷由切斷工作台2吸附保持的切斷對象物W的連結部W3(圖8的<連結部的切斷>)。於本實施形態中,將連結多個分割要素W1、W2的兩端部的連結部W3分別切斷。藉此,切斷對象物W的多個分割要素W1、W2成為互相分離的狀態。於該狀態下,奇數行的分割要素W1與偶數行的分割要素W2的切斷線CL1、切斷線CL2位於互不相同的直線上,而非交錯(錯位狀)地位於同一直線上。 (2) Cutting of the connecting portion W3 The connecting portion W3 of the object to be cut W that is adsorbed and held by the cutting table 2 is cut by the cutting mechanism 3 (<cutting of the connecting portion> in FIG. 8 ). In this embodiment, the connection part W3 which connects the both ends of the some division element W1, W2 is cut|disconnected, respectively. Thereby, the plurality of division elements W1 and W2 of the object to be cut W are in a state of being separated from each other. In this state, the cutting lines CL1 and CL2 of the dividing elements W1 of odd-numbered rows and the dividing elements W2 of even-numbered rows are located on different straight lines, and are not staggered (displaced) on the same straight line.

(3)將偶數行的分割要素W2搬送至其他切斷工作台11 於連結部W3被切斷而互相鄰接的分割要素W1、分割要素W2互相分離的狀態下,切斷工作台2將第二工作台吸附部22對偶數行的分割要素W2的吸附停止。再者,於切斷工作台2上維持第一工作台吸附部21對奇數行的分割要素W1的吸附。此處,於停止由第二工作台吸附部22進行的吸附之前,預先將成為分割要素搬送部10的載入器4的吸附墊(具體而言為第二搬送吸附部412的吸附墊412d)壓抵於偶數行的分割要素W2。藉此,防止了因停止切斷工作台2的第二工作台吸附部22的吸附而引起的偶數行的分割要素W2的位置偏移。然後,成為分割要素搬送部10的載入器4的第二搬送吸附部412將偶數行的分割要素W2搬送至其他切斷工作台11(圖7以及圖8的<將偶數行搬送至其他切斷工作台>)。再者,被搬送至其他切斷工作台11的偶數行的分割要素W2由其他切斷工作台11的吸附部111吸附保持。此處,偶數行的分割要素W2相對於其他切斷工作台11的定位例如考慮藉由相機對偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別而進行等。 (3) Transfer the divided elements W2 of the even-numbered rows to the other cutting table 11 The cutting table 2 stops the suction of the even-numbered rows of the divided elements W2 by the second table suction part 22 in a state where the connecting part W3 is cut and the adjacent divided elements W1 and W2 are separated from each other. In addition, on the cutting table 2, the first table suction part 21 maintains the suction of the divided elements W1 in odd-numbered rows. Here, before the suction by the second table suction part 22 is stopped, the suction pad of the loader 4 (specifically, the suction pad 412 d of the second transfer suction part 412 ) to be the divided element transfer part 10 is previously set. It is pressed against the division element W2 of the even-numbered row. Thereby, positional displacement of the division elements W2 of the even-numbered rows caused by stopping the suction of the second table suction part 22 of the cutting table 2 is prevented. Then, the second transfer suction unit 412 of the loader 4 serving as the divided element transfer unit 10 transfers the divided elements W2 of the even-numbered rows to the other cutting table 11 (<Conveying the even-numbered rows to the other cutting tables 11 in FIGS. 7 and 8 ). break the workbench>). In addition, the division elements W2 of the even-numbered rows conveyed to the other cutting tables 11 are sucked and held by the suction parts 111 of the other cutting tables 11 . Here, the positioning of the division elements W2 of the even-numbered rows relative to the other cutting tables 11 is performed by considering, for example, image recognition of the arrangement of the division elements W2 of the even-numbered rows (for example, feature parts such as edge portions and lead portions) by a camera. Wait.

(4)奇數行以及偶數行的分割要素W1、分割要素W2的切斷 於將偶數行的分割要素W2搬送至其他切斷工作台11後,切斷機構3於切斷工作台2上切斷處於同一直線上的奇數行的分割要素W1的切斷線CL1。又,於其他切斷工作台11上,藉由其他切斷機構或切斷機構3切斷處於同一直線上的偶數行的分割要素W2的切斷線CL2(圖7以及圖8的<奇數行以及偶數行的切斷>)。再者,於本實施形態中,設為對應於各切斷工作台2、切斷工作台11設置切斷機構3的雙轉軸方式(參照圖3),但亦可設為於各切斷工作台2、切斷工作台11設置共通的切斷機構3的單轉軸方式。 (4) Cutting of the division elements W1 and W2 of odd-numbered lines and even-numbered lines After transferring the divided elements W2 of the even-numbered rows to the other cutting table 11 , the cutting mechanism 3 cuts the cutting line CL1 of the divided elements W1 of the odd-numbered rows on the same straight line on the cutting table 2 . On the other cutting table 11, the cutting line CL2 of the even-numbered rows of the division elements W2 on the same straight line is cut by the other cutting mechanism or the cutting mechanism 3 (<odd-numbered rows in FIGS. 7 and 8 ). and even-numbered lines cut off >). In addition, in the present embodiment, the dual-rotation system in which the cutting mechanism 3 is provided corresponding to the cutting table 2 and the cutting table 11 is adopted (refer to FIG. 3 ), but it may be adopted for each cutting operation. The table 2 and the cutting table 11 are provided with a common cutting mechanism 3 of a single-axis type.

(5)切斷品P的搬出 卸載器5使用第一搬送吸附部511吸附並保持由切斷工作台2吸附保持的多個切斷品P,並將其搬送至切斷品收容部7。又,卸載器5使用第二搬送吸附部512吸附並保持由其他切斷工作台11吸附保持的多個切斷品P,並將其搬送至切斷品收容部7。此處,於解除切斷工作台2以及其他切斷工作台11的吸附之前,可藉由將卸載器5的吸附墊511d、吸附墊512d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (5) Carrying out the cut product P The unloader 5 uses the first conveyance suction part 511 to suction and hold the plurality of cut products P suctioned and held by the cutting table 2 , and transports them to the cut product storage part 7 . Moreover, the unloader 5 uses the 2nd conveyance adsorption|suction part 512 to adsorb|suck and hold|maintain the several cut products P which are adsorbed and hold|maintained by the other cutting table 11, and conveys this to the cut product storage part 7. Here, before the suction of the cutting table 2 and the other cutting tables 11 is released, the suction pad 511d and the suction pad 512d of the unloader 5 can be pressed against the plurality of cutting products P, so that the plurality of cutting products P can be prevented. The position of the cut product P is misaligned or the suction is wrong.

<第一實施形態的效果> 根據第一實施形態的切斷裝置100,由於包括於分割要素W1、分割要素W2互相分離的狀態下將互相鄰接的分割要素W1、分割要素W2的其中一者自切斷工作台2搬送至其他切斷工作台11的分割要素搬送部10,故而可自切斷工作台2取出互相鄰接的分割要素W1、分割要素W2的其中一者並使不同的切斷工作台2、切斷工作台11保持。藉此,能夠實現可藉由刀片31容易地切斷互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上的切斷對象物W。 <Effects of the first embodiment> According to the cutting device 100 according to the first embodiment, since the dividing element W1 and the dividing element W2 are separated from each other, one of the dividing elements W1 and W2 adjacent to each other is conveyed from the cutting table 2 to the other. Since the division element conveying unit 10 of the cutting table 11, it is possible to take out one of the division elements W1 and W2 adjacent to each other from the cutting table 2, and make the cutting table 2 and the cutting table 11 different from each other. Keep. Thereby, it is possible to easily cut the cutting object W in which the adjacent division elements W1, the cutting line CL1 in the division element W2, and the cutting line CL2 are set on different straight lines by the blade 31. .

<本發明的第二實施形態> 繼而參照圖式對本發明的切斷裝置的第二實施形態進行說明。再者,第二實施形態的切斷裝置100於不包括其他切斷工作台11的方面,結構不同於所述第一實施形態。再者,其他結構與所述第一實施形態相同。 <Second embodiment of the present invention> Next, a second embodiment of the cutting device of the present invention will be described with reference to the drawings. Furthermore, the cutting apparatus 100 of the second embodiment differs from the above-described first embodiment in that the other cutting table 11 is not included. In addition, the other structure is the same as that of the said 1st Embodiment.

具體而言,如圖9所示,第二實施形態的切斷裝置100為僅將互相鄰接的分割要素W1、分割要素W2的其中一者搬送至暫時載置的暫置工作台12而非切斷工作台的結構。此處,考慮將暫置工作台12設為包括吸附並保持經搬送的分割要素的吸附部的結構。藉由使用該暫置工作台12,切斷機構3於切斷工作台2上依序切斷奇數行的分割要素W1與偶數行的分割要素W2。Specifically, as shown in FIG. 9 , the cutting device 100 of the second embodiment transfers only one of the divided elements W1 and W2 adjacent to each other to the temporarily placed temporary table 12 instead of cutting them. Break the structure of the workbench. Here, it is assumed that the temporary table 12 includes a suction part that suctions and holds the transferred divided elements. By using the temporary table 12 , the cutting mechanism 3 sequentially cuts the divided elements W1 of odd-numbered rows and the divided elements W2 of even-numbered rows on the cutting table 2 .

於該結構的切斷裝置100的切斷動作中,(1)切斷對象物W的搬送、(2)連結部W3的切斷與所述實施形態相同。以下,對連結部W3的切斷後的動作進行說明。In the cutting operation of the cutting device 100 having this configuration, (1) the conveyance of the object to be cut W and (2) the cutting of the connecting portion W3 are the same as those in the above-described embodiment. Below, the operation|movement after cutting of the connection part W3 is demonstrated.

(3)將偶數行的分割要素W2搬送至暫置工作台12 於連結部W3被切斷而互相鄰接的分割要素W1、分割要素W2互相分離的狀態下,切斷工作台2將第二工作台吸附部22對偶數行的分割要素W2的吸附停止。再者,於切斷工作台2上維持第一工作台吸附部21對奇數行的分割要素W1的吸附。此處,於停止由第二工作台吸附部22進行的吸附之前,預先將成為分割要素搬送部10的載入器4的吸附墊(具體而言為第二搬送吸附部412的吸附墊412d)壓抵於偶數行的分割要素W2。藉此,防止了因停止切斷工作台2的第二工作台吸附部22的吸附而引起的偶數行的分割要素W2的位置偏移。然後,成為分割要素搬送部10的載入器4的第二搬送吸附部412將偶數行的分割要素W2搬送至暫置工作台12(圖10的<將偶數行搬送至暫置工作台>)。此處,於需要相對於暫置工作台12將偶數行的分割要素W2定位的情形時,考慮例如藉由相機對偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別而進行等。 (3) The even-numbered row division elements W2 are transferred to the temporary table 12 The cutting table 2 stops the suction of the even-numbered rows of the divided elements W2 by the second table suction part 22 in a state where the connecting part W3 is cut and the adjacent divided elements W1 and W2 are separated from each other. In addition, on the cutting table 2, the first table suction part 21 maintains the suction of the divided elements W1 in odd-numbered rows. Here, before the suction by the second table suction part 22 is stopped, the suction pad of the loader 4 (specifically, the suction pad 412 d of the second transfer suction part 412 ) to be the divided element transfer part 10 is previously set. It is pressed against the division element W2 of the even-numbered row. Thereby, positional displacement of the division elements W2 of the even-numbered rows caused by stopping the suction of the second table suction part 22 of the cutting table 2 is prevented. Then, the second transfer suction unit 412 of the loader 4 serving as the divided element transfer unit 10 transfers the divided elements W2 of the even-numbered rows to the temporary table 12 (<Transfer the even-numbered rows to the temporary table> in FIG. 10 ) . Here, when it is necessary to position the divided elements W2 of the even-numbered rows with respect to the temporary table 12 , it is considered that the arrangement of the divided elements W2 of the even-numbered rows (for example, the feature parts such as edge parts and lead parts) by a camera is performed. image recognition, etc.

(4)奇數行的分割要素W1的切斷 將偶數行的分割要素W2搬送至暫置工作台12後,切斷機構3於切斷工作台2上切斷處於同一直線上的奇數行的分割要素W1的切斷線CL1(圖10的<奇數行的切斷>)。 (4) Cutting of the dividing element W1 of odd-numbered rows After the even-numbered lines of the divided elements W2 are transferred to the temporary table 12, the cutting mechanism 3 cuts the cutting line CL1 of the odd-numbered lines of divided elements W1 on the same straight line on the cutting table 2 (< of FIG. 10 . Cut off odd-numbered lines >).

(5)切斷奇數行的分割要素W1而成的切斷品P的搬出 卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (5) Unloading of the cut product P formed by cutting the division elements W1 of odd-numbered rows The unloader 5 suctions and holds the plurality of cut products P suctioned and held by the cutting table 2 , and transports them to the cut product storage section 7 . Here, before the suction of the cutting table 2 is released, the suction pads 511d of the unloader 5 can be pressed against the plurality of cutting products P, so that the positional deviation or misalignment of the plurality of cutting products P can be prevented. adsorption.

(6)偶數行的分割要素W2的搬送 成為分割要素搬送部10的載入器4的第二搬送吸附部412(分割要素搬送部10)吸附並保持處於暫置工作台12的偶數行的分割要素W2,並將其搬送至切斷工作台2(圖10的<將偶數行搬送至切斷工作台>)。搬送至切斷工作台2的偶數行的分割要素W2被切斷工作台2的第二工作台吸附部22吸附並保持。此處,偶數行的分割要素W2相對於切斷工作台2的定位考慮例如藉由相機對偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別而進行等。 (6) Transfer of the division element W2 of the even-numbered rows The second transfer suction unit 412 (the divided element transfer unit 10 ) of the loader 4 serving as the divided element transfer unit 10 absorbs and holds the divided elements W2 in the even-numbered rows of the temporary table 12 , and transfers them to the cutting work Table 2 (<Conveying even-numbered rows to the cutting table> in FIG. 10 ). The division elements W2 of the even-numbered rows conveyed to the cutting table 2 are sucked and held by the second table suction part 22 of the cutting table 2 . Here, the positioning of the even-numbered rows of the division elements W2 with respect to the cutting table 2 is performed by, for example, performing image recognition of the arrangement of the even-numbered rows of the division elements W2 (for example, feature parts such as edge portions and lead portions) by a camera, etc. .

(7)偶數行的分割要素W2的切斷 將偶數行的分割要素W2搬送至切斷工作台2後,切斷機構3於切斷工作台2上切斷處於同一直線上的偶數行的分割要素W2的切斷線CL2(圖10的<偶數行的切斷>)。 (7) Cutting of the division element W2 of the even-numbered lines After the even-numbered rows of the divided elements W2 are transferred to the cutting table 2, the cutting mechanism 3 cuts the cutting line CL2 of the even-numbered rows of the divided elements W2 on the same straight line on the cutting table 2 (< of FIG. 10 . Even-numbered lines are cut off >).

(8)切斷偶數行的分割要素W2而成的切斷品P的搬出 卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (8) Unloading of the cut product P formed by cutting the division elements W2 of the even-numbered rows The unloader 5 suctions and holds the plurality of cut products P suctioned and held by the cutting table 2 , and transports them to the cut product storage section 7 . Here, before the suction of the cutting table 2 is released, the suction pads 511d of the unloader 5 can be pressed against the plurality of cutting products P, so that the positional deviation or misalignment of the plurality of cutting products P can be prevented. adsorption.

再者,於所述中,設為藉由分割要素搬送部10將偶數行的分割要素W2搬送至暫置工作台12的結構,但亦可設為藉由分割要素搬送部10將奇數行的分割要素W1搬送至暫置工作台12的結構。In addition, in the above description, it is assumed that the divided elements W2 in the even-numbered rows are transported to the temporary table 12 by the divided element transport unit 10 , but the divided elements in the odd-numbered rows may be transported by the divided element transport section 10 . A structure in which the divided element W1 is conveyed to the temporary table 12 .

<第二實施形態的效果> 根據第二實施形態的切斷裝置100,由於包括於分割要素W1、分割要素W2互相分離的狀態下將互相鄰接的分割要素W1、分割要素W2的其中一者自切斷工作台2搬送至暫置工作台12的分割要素搬送部10,故而可自切斷工作台2取出互相鄰接的分割要素W1、分割要素W2的其中一者。藉此,能夠實現可藉由刀片31容易地切斷互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上的切斷對象物W。 <Effects of the second embodiment> According to the cutting device 100 according to the second embodiment, since the dividing element W1 and the dividing element W2 are separated from each other, one of the dividing elements W1 and W2 adjacent to each other is conveyed from the cutting table 2 to the temporary Since the divided element conveying unit 10 of the table 12 is installed, one of the divided elements W1 and W2 adjacent to each other can be taken out from the cutting table 2 . Thereby, it is possible to easily cut the cutting object W in which the adjacent division elements W1, the cutting line CL1 in the division element W2, and the cutting line CL2 are set on different straight lines by the blade 31. .

<本發明的第三實施形態> 繼而參照圖式對本發明的切斷裝置的第三實施形態進行說明。再者,第三實施形態的切斷裝置100於不包括其他切斷工作台11以及暫置工作台12的方面,結構不同於所述各實施形態。再者,其他結構與所述第一實施形態相同。 <The third embodiment of the present invention> Next, a third embodiment of the cutting device of the present invention will be described with reference to the drawings. In addition, the structure of the cutting apparatus 100 of the third embodiment differs from the above-described embodiments in that the other cutting table 11 and the temporary table 12 are not included. In addition, the other structure is the same as that of the said 1st Embodiment.

具體而言,第三實施形態的切斷裝置100並不將互相鄰接的分割要素W1、分割要素W2的其中一者搬送至其他切斷工作台11或暫置工作台12,而是如圖11所示,為自切斷工作台2搬送並保持互相鄰接的分割要素W1、分割要素W2的其中一者的結構。Specifically, the cutting device 100 according to the third embodiment does not convey either the adjacent division element W1 or the division element W2 to the other cutting table 11 or the temporary table 12, but as shown in FIG. 11 . As shown, it is a structure in which one of the division element W1 and division element W2 adjacent to each other is conveyed and held from the cutting table 2 .

於該結構的切斷裝置100的切斷動作中,(1)切斷對象物W的搬送、(2)連結部W3的切斷與所述實施形態相同。以下,對連結部W3的切斷後的動作進行說明。In the cutting operation of the cutting device 100 having this configuration, (1) the conveyance of the object to be cut W and (2) the cutting of the connecting portion W3 are the same as those in the above-described embodiment. Below, the operation|movement after cutting of the connection part W3 is demonstrated.

(3)搬送並保持偶數行的分割要素W2 於連結部W3被切斷而互相鄰接的分割要素W1、分割要素W2互相分離的狀態下,切斷工作台2將第二工作台吸附部22對偶數行的分割要素W2的吸附停止。再者,於切斷工作台2上維持第一工作台吸附部21對奇數行的分割要素W1的吸附。此處,於停止由第二工作台吸附部22進行的吸附之前,預先將成為分割要素搬送部10的載入器4的吸附墊(具體而言為第二搬送吸附部412的吸附墊412d)壓抵於偶數行的分割要素W2。藉此,防止了因停止切斷工作台2的第二工作台吸附部22的吸附而引起的偶數行的分割要素W2的位置偏移。然後,成為分割要素搬送部10的載入器4的第二搬送吸附部412搬送偶數行的分割要素W2,並於切斷工作台2的外側保持(圖12的<偶數行的取出、奇數行的切斷>)。 (3) The division element W2 of the even-numbered lines is transported and held The cutting table 2 stops the suction of the even-numbered rows of the divided elements W2 by the second table suction part 22 in a state where the connecting part W3 is cut and the adjacent divided elements W1 and W2 are separated from each other. In addition, on the cutting table 2, the first table suction part 21 maintains the suction of the divided elements W1 in odd-numbered rows. Here, before the suction by the second table suction part 22 is stopped, the suction pad of the loader 4 (specifically, the suction pad 412 d of the second transfer suction part 412 ) to be the divided element transfer part 10 is previously set. It is pressed against the division element W2 of the even-numbered row. Thereby, positional displacement of the division elements W2 of the even-numbered rows caused by stopping the suction of the second table suction part 22 of the cutting table 2 is prevented. Then, the second transfer suction unit 412 of the loader 4 serving as the divided element transfer unit 10 transfers the divided elements W2 of the even-numbered rows and holds them on the outside of the cutting table 2 (<Extraction of even-numbered rows, odd-numbered rows in FIG. 12 ) cut off >).

(4)奇數行的分割要素W1的切斷 於自切斷工作台2搬送偶數行的分割要素W2後,切斷機構3於切斷工作台2上切斷處於同一直線上的奇數行的分割要素W1的切斷線CL1(圖12的<偶數行的取出、奇數行的切斷>)。 (4) Cutting of the dividing element W1 of odd-numbered rows After the even-numbered lines of divided elements W2 are conveyed from the cutting table 2, the cutting mechanism 3 cuts the cutting line CL1 of the odd-numbered lines of divided elements W1 on the same straight line on the cutting table 2 (< in FIG. 12 . Extraction of even-numbered lines and cutting of odd-numbered lines>).

(5)切斷奇數行的分割要素W1而成的切斷品P的搬出 卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (5) Unloading of the cut product P formed by cutting the division elements W1 of odd-numbered rows The unloader 5 suctions and holds the plurality of cut products P suctioned and held by the cutting table 2 , and transports them to the cut product storage section 7 . Here, before the suction of the cutting table 2 is released, the suction pads 511d of the unloader 5 can be pressed against the plurality of cutting products P, so that the positional deviation or misalignment of the plurality of cutting products P can be prevented. adsorption.

(6)偶數行的分割要素W2的搬送 成為分割要素搬送部10的載入器4的第二搬送吸附部412將所保持的偶數行的分割要素W2搬送至切斷工作台2(圖12的<將偶數行搬送至切斷工作台>)。搬送至切斷工作台2的偶數行的分割要素W2被切斷工作台2的第二工作台吸附部22吸附並保持。此處,偶數行的分割要素W2相對於切斷工作台2的定位考慮例如藉由相機對偶數行的分割要素W2的配置(例如邊緣部分或引線部分等特徵部)進行圖像識別而進行等。 (6) Transfer of the division element W2 of the even-numbered rows The second transfer suction unit 412 of the loader 4 serving as the divided element transfer unit 10 transfers the held divided elements W2 of the even-numbered rows to the cutting table 2 (<Conveying the even-numbered rows to the cutting table> in FIG. 12 ). ). The division elements W2 of the even-numbered rows conveyed to the cutting table 2 are sucked and held by the second table suction part 22 of the cutting table 2 . Here, the positioning of the even-numbered rows of the division elements W2 with respect to the cutting table 2 is performed by, for example, performing image recognition of the arrangement of the even-numbered rows of the division elements W2 (for example, feature parts such as edge portions and lead portions) by a camera, etc. .

(7)偶數行的分割要素W2的切斷 將偶數行的分割要素W2搬送至切斷工作台2後,切斷機構3於切斷工作台2上切斷處於同一直線上的偶數行的分割要素W2的切斷線CL2(圖12的<偶數行的切斷>)。 (7) Cutting of the division element W2 of the even-numbered lines After the even-numbered rows of divided elements W2 are transferred to the cutting table 2, the cutting mechanism 3 cuts the cutting line CL2 of the even-numbered rows of divided elements W2 on the same straight line on the cutting table 2 (< in FIG. 12 . Even-numbered lines are cut off >).

(8)切斷偶數行的分割要素W2而成的切斷品P的搬出 卸載器5吸附並保持由切斷工作台2吸附保持的多個切斷品P,將其搬送至切斷品收容部7。此處,於解除切斷工作台2的吸附之前,亦可藉由將卸載器5的吸附墊511d壓抵於多個切斷品P,而防止多個切斷品P的位置偏移或誤吸附。 (8) Unloading of the cut product P formed by cutting the division elements W2 of the even-numbered rows The unloader 5 suctions and holds the plurality of cut products P suctioned and held by the cutting table 2 , and transports them to the cut product storage section 7 . Here, before the suction of the cutting table 2 is released, the suction pads 511d of the unloader 5 can be pressed against the plurality of cutting products P, so that the positional deviation or misalignment of the plurality of cutting products P can be prevented. adsorption.

<第三實施形態的效果> 根據第三實施形態的切斷裝置100,由於包括於分割要素W1、分割要素W2互相分離的狀態下自切斷工作台2搬送並保持互相鄰接的分割要素W1、分割要素W2的其中一者的分割要素搬送部10,故而可自切斷工作台2取出互相鄰接的分割要素W1、分割要素W2的其中一者。藉此,能夠實現可藉由刀片31容易地切斷互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上的切斷對象物W。 <Effects of the third embodiment> According to the cutting device 100 according to the third embodiment, since the dividing element W1 and the dividing element W2 are conveyed from the cutting table 2 in a state where the dividing element W1 and the dividing element W2 are separated from each other and hold one of the dividing element W1 and the dividing element W2 adjacent to each other, the The divided element conveying unit 10 can take out either of the divided elements W1 and W2 adjacent to each other from the cutting table 2 . Thereby, it is possible to easily cut the cutting object W in which the adjacent division elements W1, the cutting line CL1 in the division element W2, and the cutting line CL2 are set on different straight lines by the blade 31. .

<其他變形實施形態> 再者,本發明並不限於所述各實施形態。 <Other variant embodiments> In addition, this invention is not limited to each said embodiment.

例如,於所述第一實施形態中,為將偶數行的分割要素W2搬送至其他切斷工作台11的結構,但亦可設為藉由分割要素搬送部10將奇數行的分割要素W1搬送至其他切斷工作台11的結構。又,亦可設為於在切斷工作台2上切斷連結部W3後,藉由分割要素搬送部10將奇數行的分割要素W1以及偶數行的分割要素W2分別搬送至不同的切斷工作台的結構。又,於所述第二實施形態中,可設為藉由分割要素搬送部10將奇數行的分割要素W1搬送至暫置工作台12的結構,於第三實施形態中,可設為藉由分割要素搬送部10搬送並保持奇數行的分割要素W1的結構。For example, in the above-described first embodiment, the divided elements W2 of the even-numbered rows are transported to the other cutting table 11 , but the divided elements W1 of the odd-numbered rows may be transported by the divided element transport unit 10 . to other structures of the cutting table 11 . In addition, after the connecting portion W3 is cut on the cutting table 2, the division element conveying unit 10 may be used to convey the division elements W1 of odd-numbered rows and the division elements W2 of even-numbered rows to different cutting operations, respectively. table structure. Furthermore, in the second embodiment, the divided elements W1 in odd-numbered rows may be transferred to the temporary table 12 by the divided element transfer unit 10, and in the third embodiment, the divided elements W1 may be transferred by The divided element transport unit 10 transports and holds the structure of the divided elements W1 in odd-numbered rows.

於所述各實施形態中,載入器4為包括第一搬送吸附部411以及第二搬送吸附部412的結構,但亦可設為僅包括任一者的結構。例如,於載入器4為僅包括第一搬送吸附部411的結構的情形時,於將切斷對象物W搬送至切斷工作台2時,載入器4吸附保持奇數行的分割要素W1而將其搬送。又,於切斷連結部W3後,切斷工作台2的第一工作台吸附部21停止奇數行的分割要素W1的吸附,載入器4的第一搬送吸附部411將吸附被停止的奇數行的分割要素W1搬送至其他切斷工作台11。In each of the above-described embodiments, the loader 4 has a structure including the first conveyance suction part 411 and the second conveyance suction part 412, but may be a structure including only one of them. For example, when the loader 4 is configured to include only the first conveyance suction unit 411 , when the object to be cut W is conveyed to the cutting table 2 , the loader 4 suctions and holds the division elements W1 in odd-numbered rows. and transport it. In addition, after the connection portion W3 is cut off, the first table suction portion 21 of the cutting table 2 stops the suction of the divided elements W1 in odd-numbered rows, and the first transfer suction portion 411 of the loader 4 suctions the stopped odd-numbered elements. The dividing element W1 of the row is conveyed to another cutting table 11 .

又,於所述各實施形態中,為載入器4作為分割要素搬送部10發揮功能的結構,亦可設為卸載器5作為分割要素搬送部10發揮功能的結構。於該情形時,卸載器5成為包括僅吸附奇數行的分割要素W1或偶數行的分割要素W2的其中一者的搬送吸附部的結構。In addition, in each of the above-described embodiments, the loader 4 is configured to function as the divided element transfer unit 10 , but the unloader 5 may be configured to function as the divided element transfer unit 10 . In this case, the unloader 5 has a structure including a conveyance suction part that suctions only one of the divided elements W1 of odd-numbered rows or the divided elements W2 of even-numbered rows.

於所述各實施形態中,為卸載器5將奇數行的分割要素W1的切斷品P與偶數行的分割要素W2的切斷品P逐個搬送至切斷品收容部7的結構,但卸載器5亦可於吸附奇數行的分割要素W1的切斷品P以及偶數行的分割要素W2的切斷品P的兩者後,搬送至切斷品收容部7。In each of the above-described embodiments, the unloader 5 transports the cut products P of the divided elements W1 in odd-numbered rows and the cut products P of the divided elements W2 in even-numbered rows to the cut product storage section 7 one by one. The device 5 may be transported to the cut product storage section 7 after sucking both the cut products P of the divided elements W1 in odd-numbered rows and the cut products P of the divided elements W2 in even-numbered rows.

藉由本發明的切斷裝置100切斷的切斷對象物W並不限於所述實施形態,亦可為未經樹脂成形的例如印刷基板(印刷電路板(Printed Circuit Board,PCB)基板)等基板。於該情形時,切斷對象物W如圖13所示,為例如藉由雕銑加工形成了切口K的基板,該基板藉由連結部W3連結俯視下大致為L字形狀的多個分割要素W1、W2,並且互相鄰接的分割要素W1、分割要素W2內的切斷線CL1、切斷線CL2被設定於互不相同的直線上。於此種切斷對象物W中,亦與所述實施形態同樣,於切斷連結部W3後,可將互相鄰接的分割要素的其中一者搬送至其他切斷工作台11並切斷,或使用暫置工作台12依序切斷,或藉由保持於分割要素搬送部10而依序切斷。The object to be cut W to be cut by the cutting device 100 of the present invention is not limited to the above-described embodiment, and may be a substrate such as a printed circuit board (Printed Circuit Board (PCB) substrate) without resin molding. . In this case, the object to be cut W is, as shown in FIG. 13 , a substrate in which a slit K is formed by, for example, engraving, and the substrate is connected by a connecting portion W3 to a plurality of divided elements having a substantially L-shape in plan view. W1 and W2, the adjacent dividing element W1, and the cutting line CL1 and the cutting line CL2 in the dividing element W2 are set on straight lines that are different from each other. In such a cutting object W, as in the above-described embodiment, after cutting the connecting portion W3, one of the adjacent division elements may be transferred to another cutting table 11 and cut, or Sequential cutting is performed by using the temporary table 12 or by being held in the division element conveying unit 10 .

所述各實施形態的切斷對象物W中多個分割要素的配置態樣被分為兩組(奇數行以及偶數行),奇數行的分割要素W1與偶數行的分割要素W2中切斷線CL1、切斷線CL2互不相同,但並不限於奇數行的分割要素與偶數行的分割要素,亦可應用於包括多個分割要素中切斷線互相不位於同一直線上的分割要素者。例如,亦可為切斷對象物W的多個分割要素的配置態樣以例如左右各兩行且相同等方式進行分組者。除此以外,切斷對象物W亦可為將多個分割要素的配置態樣分為三個以上組者。The arrangement of the plurality of division elements in the object to be cut W in each of the above-described embodiments is divided into two groups (odd-numbered lines and even-numbered lines), and the divisional elements W1 of the odd-numbered lines and the division elements W2 of the even-numbered lines are the cutting lines. CL1 and cutting line CL2 are different from each other, but are not limited to division elements in odd-numbered rows and division elements in even-numbered rows, and can also be applied to division elements including division elements whose cutting lines are not located on the same straight line among a plurality of division elements. For example, the arrangement of the plurality of division elements of the cutting object W may be grouped in the same manner, for example, in two rows on the left and right. In addition to this, the object to be cut W may be one in which the arrangement of the plurality of division elements is divided into three or more groups.

此外,本發明並不限於所述實施形態,當然可於不脫離其主旨的範圍內進行各種變形。 [產業上的可利用性] In addition, this invention is not limited to the said embodiment, It cannot be overemphasized that various deformation|transformation are possible in the range which does not deviate from the summary. [Industrial Availability]

根據本發明,能夠實現可藉由刀片容易地切斷互相鄰接的分割要素內的切斷線被設定於互不相同的直線上的切斷對象物。According to the present invention, it is possible to easily cut an object to be cut in which the cutting lines in the adjacent division elements are set on mutually different straight lines by the blade.

2、11:切斷工作台 3:切斷機構 4:載入器(搬送機構) 5:卸載器(搬出機構) 6:切斷對象物收容部 7:切斷品收容部 10:分割要素搬送部 12:暫置工作台 21:第一工作台吸附部(工作台吸附部) 21a、411a、511a:第一吸附孔 21b、411b、511b:第一內部流路 21c、411c、511c:第一抽吸泵 22:第二工作台吸附部(工作台吸附部) 22a、412a、512a:第二吸附孔 22b、412b、512b:第二內部流路 22c、412c、512c:第二抽吸泵 31:刀片 32:轉軸部 41、51:吸附區塊 100:切斷裝置 111:吸附部 411、511:第一搬送吸附部(搬送吸附部) 411d、412d、511d、512d:吸附墊 412、512:第二搬送吸附部(搬送吸附部) CL0、CL1、CL2:切斷線 CTL:控制部 K:切口 P:切斷品 W:切斷對象物 W1:奇數行的分割要素(多個分割要素) W2:偶數行的分割要素(多個分割要素) W3:連結部 2, 11: Cut off the workbench 3: Cut off mechanism 4: Loader (transport mechanism) 5: Unloader (carry out mechanism) 6: Cut the object storage part 7: Cut-off storage department 10: Divide element conveying section 12: Temporary workbench 21: The first worktable adsorption part (the worktable adsorption part) 21a, 411a, 511a: the first adsorption hole 21b, 411b, 511b: first internal flow path 21c, 411c, 511c: first suction pump 22: Second table adsorption part (table adsorption part) 22a, 412a, 512a: the second adsorption hole 22b, 412b, 512b: Second internal flow path 22c, 412c, 512c: Second suction pump 31: Blades 32: Rotary shaft 41, 51: Adsorption block 100: Cut off device 111: Adsorption part 411, 511: The first conveying suction part (the conveying suction part) 411d, 412d, 511d, 512d: Adsorption pads 412, 512: The second conveying suction part (the conveying suction part) CL0, CL1, CL2: cut line CTL: Control Department K: Cut P: cut product W: cut the object W1: Split elements of odd-numbered rows (multiple split elements) W2: Split elements of even rows (multiple split elements) W3: Link

圖1是示意性地表示切斷對象物的平面圖。 圖2是表示切斷對象物的切斷線的部分放大平面圖。 圖3是示意性地表示本發明的第一實施形態的切斷裝置的結構的平面圖。 圖4是示意性地表示同一實施形態的切斷工作台的結構的平面圖以及截面圖。 圖5是示意性地表示同一實施形態的搬送機構(載入器)的結構的平面圖以及截面圖。 圖6是示意性地表示同一實施形態的搬出機構(卸載器)的結構的平面圖以及截面圖。 圖7是表示同一實施形態的切斷動作的各狀態的截面圖。 圖8是表示同一實施形態的切斷動作中的切斷對象物的各狀態的平面圖。 圖9是示意性地表示第二實施形態的切斷裝置的結構的平面圖。 圖10是表示第二實施形態的切斷動作的各狀態的截面圖。 圖11是示意性地表示第三實施形態的切斷裝置的結構的平面圖。 圖12是表示第三實施形態的切斷動作的各狀態的截面圖。 圖13是表示變形實施形態的切斷對象物以及其切斷方法的平面圖。 圖14是表示使用引線交錯形成的引線框架的樹脂成形基板的平面圖。 FIG. 1 is a plan view schematically showing an object to be cut. FIG. 2 is a partially enlarged plan view showing a cutting line for cutting an object. 3 is a plan view schematically showing the configuration of the cutting device according to the first embodiment of the present invention. 4 is a plan view and a cross-sectional view schematically showing the configuration of the cutting table according to the same embodiment. 5 is a plan view and a cross-sectional view schematically showing the configuration of a conveying mechanism (loader) according to the same embodiment. 6 is a plan view and a cross-sectional view schematically showing the configuration of a carry-out mechanism (unloader) according to the same embodiment. 7 is a cross-sectional view showing each state of the cutting operation in the same embodiment. 8 is a plan view showing each state of the object to be cut in the cutting operation according to the same embodiment. FIG. 9 is a plan view schematically showing the configuration of the cutting device according to the second embodiment. 10 is a cross-sectional view showing each state of the cutting operation in the second embodiment. FIG. 11 is a plan view schematically showing the configuration of the cutting device according to the third embodiment. 12 is a cross-sectional view showing each state of the cutting operation in the third embodiment. 13 is a plan view showing an object to be cut and a method of cutting the same according to a modified embodiment. 14 is a plan view showing a resin-molded substrate using a lead frame formed by staggered leads.

2、11:切斷工作台 2, 11: Cut off the workbench

4:載入器(搬送機構) 4: Loader (transport mechanism)

10:分割要素搬送部 10: Divide element conveying section

21:第一工作台吸附部(工作台吸附部) 21: The first table adsorption part (table adsorption part)

22:第二工作台吸附部(工作台吸附部) 22: Second worktable adsorption part (table adsorption part)

31:刀片 31: Blades

111:吸附部 111: Adsorption part

411:第一搬送吸附部(搬送吸附部) 411: The first conveying suction part (the conveying suction part)

412:第二搬送吸附部(搬送吸附部) 412: Second conveyance suction part (conveyance suction part)

W:切斷對象物 W: cut the object

W1:奇數行的分割要素(多個分割要素) W1: Split elements of odd-numbered rows (multiple split elements)

W2:偶數行的分割要素(多個分割要素) W2: Split elements of even rows (multiple split elements)

W3:連結部 W3: Link

Claims (10)

一種切斷裝置,將藉由連結部連結多個分割要素、並且互相鄰接的所述分割要素內的切斷線被設定於互不相同的直線上的切斷對象物沿著所述切斷線切斷,且包括: 切斷工作台,吸附並保持所述切斷對象物; 切斷機構,藉由刀片切斷所述切斷對象物;以及 分割要素搬送部,於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,自所述切斷工作台搬送互相鄰接的所述分割要素的其中一者。 A cutting device that connects a plurality of division elements by a connecting portion, and along the cutting line, a cutting object in which the cutting lines in the adjacent division elements are set on mutually different straight lines cut off and include: A cutting table, adsorbing and holding the cutting object; a cutting mechanism for cutting the cutting object with a blade; and The division element conveying unit conveys one of the division elements adjacent to each other from the cutting table in a state in which the connection portion is cut by the cutting mechanism and the division elements are separated from each other. 如請求項1所述的切斷裝置,其中所述分割要素搬送部將互相鄰接的所述分割要素的其中一者自所述切斷工作台搬送至其他切斷工作台。The cutting device according to claim 1, wherein the division element conveying section conveys one of the division elements adjacent to each other from the cutting table to the other cutting table. 如請求項1所述的切斷裝置,其中所述分割要素搬送部將互相鄰接的所述分割要素的其中一者自所述切斷工作台搬送至暫置工作台。The cutting device according to claim 1, wherein the division element conveying unit conveys one of the division elements adjacent to each other from the cutting table to the temporary table. 如請求項1所述的切斷裝置,其中所述分割要素搬送部自所述切斷工作台搬送並保持互相鄰接的所述分割要素的其中一者。The cutting device according to claim 1, wherein the division element conveying unit conveys and holds one of the division elements adjacent to each other from the cutting table. 如請求項1至請求項4中任一項所述的切斷裝置,其中所述切斷工作台包括:第一工作台吸附部,吸附互相鄰接的所述分割要素中的其中一所述分割要素;以及第二工作台吸附部,獨立於所述第一工作台吸附部,吸附另一所述分割要素。The cutting device according to any one of claim 1 to claim 4, wherein the cutting table comprises: a first table suction part that suctions one of the division elements among the adjacent division elements an element; and a second table suction part that suctions another of the divided elements independently of the first table suction part. 如請求項5所述的切斷裝置,其中於所述連結部被所述切斷機構切斷而所述分割要素互相分離的狀態下,所述切斷工作台停止所述第一工作台吸附部或所述第二工作台吸附部的其中一者對所述分割要素的吸附, 所述分割要素搬送部自所述切斷工作台搬送所述切斷工作台上吸附被停止的所述分割要素。 The cutting device according to claim 5, wherein the cutting table stops suction by the first table in a state where the connecting portion is cut by the cutting mechanism and the dividing elements are separated from each other adsorption of the divided element by one of the part or the second table adsorption part, The division element conveying unit conveys the division element whose suction on the cutting table is stopped from the cutting table. 如請求項1至請求項6中任一項所述的切斷裝置,其中所述多個分割要素沿著基於所述刀片的切斷方向排列,該些的配置態樣被分為至少兩組,其中一組的所述分割要素的切斷線位於同一直線上,另一組的所述分割要素的切斷線位於同一直線上,且 所述分割要素搬送部搬送所述其中一組的分割要素或所述另一組的分割要素的其中一者。 The cutting device according to any one of claim 1 to claim 6, wherein the plurality of dividing elements are arranged along a cutting direction based on the blade, and the arrangement aspects of these are divided into at least two groups , the cutting lines of the split elements of one group are located on the same straight line, and the cutting lines of the split elements of the other group are located on the same straight line, and The division element conveying unit conveys one of the division elements of the one group or the division elements of the other group. 如請求項1至請求項7中任一項所述的切斷裝置,其包括: 搬送機構,將所述切斷對象物搬送至所述切斷工作台;以及 搬出機構,將所述切斷工作台上被切斷的切斷品搬出,且 所述搬送機構或所述搬出機構作為所述分割要素搬送部發揮功能。 The cutting device according to any one of claim 1 to claim 7, comprising: a conveying mechanism that conveys the object to be cut to the cutting table; and a carry-out mechanism for carrying out the cut products cut on the cutting table, and The conveyance mechanism or the carry-out mechanism functions as the division element conveyance unit. 如引用請求項7的請求項8所述的切斷裝置,其中所述搬送機構或所述搬出機構包括: 第一搬送吸附部,吸附所述其中一組的分割要素;以及 第二搬送吸附部,獨立於所述第一搬送吸附部,吸附所述另一組的分割要素,且 所述搬送機構或所述搬出機構使用所述第一搬送吸附部或所述第二搬送吸附部,作為所述分割要素搬送部發揮功能。 The cutting device according to claim 8 of claim 7, wherein the conveying mechanism or the carrying out mechanism comprises: a first conveyance and adsorption unit for adsorbing the divided elements of the one group; and The second conveyance suction part is independent of the first conveyance suction part and suctions the divided elements of the other group, and The conveyance mechanism or the unloading mechanism functions as the division element conveyance portion using the first conveyance suction portion or the second conveyance suction portion. 一種切斷品的製造方法,其使用如請求項1至請求項9中任一項所述的切斷裝置。A method of manufacturing a cut product using the cutting device according to any one of Claims 1 to 9.
TW110139950A 2020-11-24 2021-10-27 Cutting device and manufacturing method for cut product TWI826854B (en)

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