JP2010125488A - Cutting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting apparatus in which productivity is improved by reducing time required for setting change. <P>SOLUTION: The cutting apparatus 1 for cutting a workpiece 10 includes: a feeding part 100 for feeding a workpiece 10; a machining part 200 for cutting the workpiece 10 with cutting blades 71-74 to divide it into a plurality of individualized workpieces 11; a storing part 300 for storing the plurality of individualized workpieces 11; a loader 40 for transporting the workpiece 10 from the feeding part 100 to the machining part 200; and an unloader 41 for transporting the plurality of individualized workpieces 11 from the machining part 200 to the storing part 300. The feeding part 100, the machining part 200 and the storing part 300 are arranged detachably in a line. The loader 40 is connected to a driving source for workpiece holding operation with a first connecting member, wherein the transporting range R1 of the loader 40 is variable by changing the length of the first connecting member. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a workpiece cutting apparatus that shortens the time required for setup change and improves productivity.

  The semiconductor device assembly process (post-process) includes a cutting process (dicing process) in which a workpiece such as a semiconductor wafer or a resin-encapsulated substrate is cut by batch processing to obtain a large number of semiconductor devices (divided workpieces). is there. Subsequently, after the cutting process, a cleaning process, an inspection process, and the like are performed.

  In a cutting apparatus that cuts a workpiece, the processing time varies depending on the workpiece. However, in the cutting of a semiconductor device that is actively developed, the cutting target is frequently changed, and the processing time of the workpiece also changes frequently. For this reason, it is necessary to flexibly correspond to the workpiece cutting ability, and there may be a demand to improve the cutting efficiency depending on the occasion.

  For example, Patent Document 1 discloses a singulation apparatus for manufacturing electronic components. In this document, as an optional part in the singulation apparatus, it is disclosed that the efficiency at the time of singulation is improved by mounting a module having the same cutting mechanism as the cutting mechanism of the singulation part. . Patent Document 2 discloses a dicing apparatus in which two cutting unit units are arranged symmetrically with respect to a dicing apparatus for dicing a wafer into individual chips.

Thus, by providing two cutting parts, the efficiency at the time of workpiece cutting can be improved to some extent.
JP 2008-153565 A JP 2002-280328 A

  However, in the above-described cutting apparatus, for example, when cutting a wide variety of workpieces, it is necessary to change the setting of the cutting portion, and thus the efficiency at the time of cutting the workpiece cannot be sufficiently improved.

  In order to efficiently cut a wide variety of workpieces, it is necessary to flexibly change the types and the number of units constituting the cutting device according to the types. Moreover, it is necessary to change the unit which comprises a cutting device according to the process objective of a workpiece | work.

  Therefore, the present invention provides a cutting apparatus that shortens the time required for setup change and improves productivity.

  A cutting device according to an aspect of the present invention is a cutting device that cuts a workpiece, the workpiece is cut by a supply unit that supplies the workpiece, and a cutting blade, and the workpiece is divided into a plurality of individualized workpieces. A processing unit to be divided, a storage unit that stores the plurality of individualized workpieces, a loader that conveys the workpiece from the supply unit to the processing unit, and the storage of the plurality of individualized workpieces from the processing unit The supply unit, the processing unit, and the storage unit are detachably arranged in series, and the loader is driven by the first connecting member for the work holding operation. It is connected to a source, and the conveyance range of the loader is variable by changing the length of the first connecting member.

  Other objects and advantages of the present invention are illustrated in the following examples.

  ADVANTAGE OF THE INVENTION According to this invention, the cutting device which shortened the time which setup change required and improved productivity can be provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  First, the structure of the cutting device in Example 1 of this invention is demonstrated. The cutting device of the present embodiment can be configured by arbitrarily changing the type and number of the plurality of units constituting the cutting device. In the present embodiment, a cutting apparatus as an example of the present embodiment will be described with reference to FIGS. 1 to 8 and FIG.

  Fig.1 (a) is a schematic block diagram of the cutting device 1 as an example of a present Example. FIG. 2A is a schematic configuration diagram of a conveying unit in the cutting apparatus 1.

  The cutting device 1 is a device that manufactures a plurality of individualized workpieces 11 (separated semiconductor devices) by cutting a workpiece 10 such as a semiconductor wafer or a resin-encapsulated substrate. In the present embodiment, twelve individual workpieces 11 are manufactured from one workpiece 10, but the invention is not limited to these. Individual workpieces other than 12 can be manufactured from a single workpiece or a plurality of workpieces.

  As illustrated in FIG. 1A, the cutting device 1 includes a supply unit 100, a processing unit 200, and a storage unit 300.

  The workpiece 10 carried in from the outside to the carry-in unit 120 in the supply unit 100 is conveyed to the tray 20 of the supply unit 100 by a conveyance unit (not shown) and placed thereon. The workpieces 10 placed on the tray 20 in the supply unit 100 are sequentially transported and supplied to the processing unit 200 by a loader 40 (work transporting unit) movable in the X-axis direction.

  As shown in FIG. 2 (a), the work 10 is transported in the X-axis direction by a loader 40 (work transport means). The loader 40 has a suction part on the lower surface, and sucks air with a vacuum pump (not shown) to suck the work 10 placed on the tray 20 with the suction part. Thus, the workpiece 10 on the tray 20 is sucked up in the Z-axis direction by the suction portion of the loader 40.

  The workpiece 10 adsorbed by the adsorbing portion of the loader 40 is conveyed by the loader 40 as it is in the X-axis direction. The loader 40 is connected to a plastic chain 42 that accommodates a pipe line that is a connection member (first connection member) with a vacuum pump that is a drive source for a workpiece holding operation. It is connected to the. The loader 40 is suspended and supported by a beam-like track 400 (FIG. 2) installed between the supply unit 100 and the storage unit 300, and is configured to be movable along the track 400 in the X-axis direction. Has been. For example, this track 400 moves separately in the X-axis direction by providing a plurality of guide mechanisms (not shown) using a belt, a chain, and a rack and pinion, and a guide for hanging and supporting the loader 40 and an unloader described later. It is configured to be possible.

    When the loader 40 that has sucked the workpiece 10 reaches the processing unit 200, the loader 40 stops sucking the workpiece 10 by the vacuum pump and delivers the workpiece 10 to the processing unit 200.

  In addition, after the workpiece 10 is conveyed to the processing unit 200, a new workpiece 10 loaded from the loading unit 120 is placed on the tray 20.

  The processing unit 200 includes three units, a laser processing unit 210, a chamfered cutting unit 220, and a cutting unit 230, and a main control unit (not shown). The workpiece 10 conveyed from the supply unit 100 to the processing unit 200 passes through the plurality of units (three in this example) in order and is subjected to predetermined processing, thereby obtaining a plurality of individualized workpieces 11. be able to.

  As shown in FIG. 1A, the laser processing unit 210 includes a laser processing apparatus 50 for performing laser processing on the workpiece 10, a stage 31, and a control unit (not shown).

  FIG. 3A shows a state where the workpiece 10 is being processed by the laser processing apparatus 50 in the present embodiment. As shown in FIG. 3A, the laser processing apparatus 50 emits laser light L toward the surface of the workpiece 10 and performs predetermined processing on the workpiece 10.

  The workpiece 10 conveyed from the supply unit 100 is first placed on the stage 31 (laser processing stage) in the laser processing unit 210 arranged on the supply unit 100 side in the processing unit 200. The stage 31 can hold one workpiece 10 and can move in the Y-axis direction (arrow direction) in FIG. 1A within the laser processing unit 210.

  When the workpiece 10 is placed at the accepting position of the workpiece 10, the stage 31 performs laser processing of the workpiece 10, so that the stage 31 moves from the accepting position of the workpiece 10 to the laser processing apparatus 50 in the Y-axis direction (upward in the figure). Moving. Although the laser processing apparatus 50 performs the curve cutting process etc. of the workpiece | work 10, it is not limited to this. A control unit (not shown) controls each operation of the stage 31 and the laser processing device 50 in the laser processing unit 210 under the control of a main control unit that controls the entire apparatus.

  When the processing by the laser processing apparatus 50 is completed, the workpiece 10 becomes the workpiece 10a that has been subjected to laser processing. The stage 31 on which the workpiece 10a is placed moves from the laser processing apparatus 50 in the Y-axis direction (downward in the figure) and returns to the delivery position of the workpiece 10a (the acceptance position of the workpiece 10).

  1A shows a state in which the workpiece 10a after laser processing is placed on the stage 31 at the delivery position of the workpiece 10a. In the present embodiment and the embodiments to be described later, even if the configuration in which the accepting position before processing the workpiece in each unit and the delivery position after processing the workpiece are the same position is described, these may be used as necessary. The positions may be different.

  Next, the workpiece 10a after the laser processing is transported to the chamfer cutting unit 220 by the loader 40 that can transport in the X-axis direction.

  As shown in FIG. 2A, the workpiece 10a is further conveyed in the X-axis direction by the loader 40. In the same manner as described above, the loader 40 sucks and sucks the workpiece 10a placed on the stage 31 in the Z-axis direction by the suction portion.

  The workpiece 10a adsorbed by the adsorbing portion of the loader 40 is conveyed by the loader 40 as it is in the X-axis direction. When the loader 40 that has sucked the workpiece 10 a reaches the stage 32 in the chamfered cutting portion 220 adjacent to the laser processing portion 210, the load of the workpiece 10 a by the vacuum pump is stopped and the workpiece 10 a is placed on the stage 32.

  As shown in FIG. 1A, the chamfer cutting unit 220 includes a stage 32 (chamfer cutting stage), spindles 61 and 62, cutting blades 71 and 72, an imaging device (not shown), and a control unit (not shown). Have.

  FIG.3 (b) is the principal part enlarged view which showed the state which is processing the workpiece | work by the chamfering cutting part in a present Example. As shown in FIG. 3B, for example, a cutting blade 71 is attached to the tip of the rotation shaft of a spindle 61 mainly composed of a motor. The cutting blade 71 also rotates with the rotation of the spindle 61 (rotating shaft), and engraving cutting for chamfering the workpiece 10 a placed on the stage 32 is performed. The spindle 62 and the cutting blade 72 provided so as to face these also have the same configuration and operation. Moreover, although this figure has shown schematic structure of the chamfering cutting part, the schematic structure of a cutting part is also the same.

  The stage 32 is configured to be able to hold one workpiece 10a by air suction and to move in the Y-axis direction (arrow direction) in FIG. After receiving the workpiece 10a from the loader 40, the stage 32 performs chamfering cutting of the workpiece 10a with the cutting blades 71 and 72 attached to the respective tip portions of the spindles 61 and 62. Move upward). Further, the stage 32 moves in the Y-axis direction (downward) in order to convey the workpiece 10b formed by chamfering the workpiece 10a to the cutting unit 230 after the chamfering cutting.

  The stage 32 is configured to be rotatable in the XY plane. For this reason, the cutting direction of the workpiece 10a placed on the stage 32 can be arbitrarily set. The rotational position in the stage 32 is controlled based on position information obtained from an imaging device (not shown). The imaging device is attached to, for example, one spindle 61 and is provided to perform alignment between the workpiece 10a and the cutting blades 71 and 72 before chamfering the workpiece 10a. Since the alignment between the workpiece 10a and the cutting blades 71 and 72 is performed based on the position information of the workpiece 10a acquired by the imaging device, the workpiece 10a can be chamfered with high accuracy.

  When the rotation shafts of the spindles 61 and 62 are rotated, the cutting blades 71 and 72 attached to the tip portions thereof are rotated, and the workpiece 10a can be chamfered. The spindles 61 and 62 are configured to be movable in the X-axis direction (left-right direction), and the chamfer cutting position of the workpiece 10a can be changed in the X-axis direction.

  A control unit (not shown) controls each operation of the stage 32, spindles 61 and 62, cutting blades 71 and 72, and an imaging device (not shown) in the chamfer cutting unit 220 under the control of the main control unit.

  The chamfered cutting part 220 of the present embodiment is provided with two cutting blades 71 and 72 attached to the tips of the spindles 61 and 62 so as to face each other. By providing a plurality of cutting blades, it becomes possible to shorten the chamfering cutting time of the workpiece 10a and improve the productivity.

  The workpiece 10 a placed on the stage 32 is chamfered by cutting blades 71 and 72. In the chamfered cutting part 220, the workpiece 10a is machined using the cutting blades 71 and 72, so that linear machining of the workpiece 10a is mainly performed.

    Further, as shown in FIG. 1A, a cutting portion 230 is arranged next to the chamfered cutting portion 220 in the processing portion 200. The cutting unit 230 includes a stage 33 (cutting stage), spindles 63 and 64, cutting blades 73 and 74, and an imaging device (not shown), and has a configuration other than the type of attached cutting blade and the structure of the stage 33. Is the same as the chamfered cut portion 220.

  FIG. 4 is a plan view showing an example of a machining area of the workpiece 10 in this embodiment. A lattice-shaped narrow region sandwiched between two broken lines 401 is a portion cut by the cutting unit 230. As shown in FIG. 4 (a), in this embodiment, one workpiece 10 is cut and divided into pieces, so that a total of 12 processed products of 4 vertical and 3 horizontal. The singulated work 11 is formed. Note that the individualized workpiece 11 may be a workpiece that is completed by individualization, such as a memory card, or may be a semi-finished product such as a semiconductor chip that is further processed in a later step.

  In FIG. 4B, a narrow arc-shaped region surrounded by the curve 402 is a portion where curved cutting by the laser processing unit 210 is performed. A band-like region 413 sandwiched between alternate long and short dash lines 403 is an end portion where chamfer cutting (engraved cutting) is performed by the chamfer cutting unit 220.

  FIG. 5 is a cross-sectional view showing an example of a cutting blade in the present embodiment. FIG. 5A shows the tip portions of the cutting blades 71 and 72 of the chamfered cutting portion, and FIG. 5B shows the tip portions of the cutting blades 73 and 74 of the cutting portion.

  As shown in FIG. 5A, the cutting blades 71 and 72 have a tip 710 inclined at a predetermined inclination angle in the thickness direction in order to perform chamfering cutting of the workpiece 10a. By chamfering the workpiece 10a using such a cutting blade 71, an inclined surface (C surface) represented as a region 413 (chamfered portion) is formed on the workpiece 10a.

  Further, as shown in FIG. 5B, the cutting blades 73 and 74 have a tip 730 having a sharper diameter than the cutting blades 71 and 72 and a uniform diameter in the thickness direction in order to cut the workpiece 10b. Yes. When the cutting blades 73 and 74 cut the grid-like region 411 surrounded by the broken line 401, the workpiece 10b is cut. Details of the cutting part will be described later.

  FIG. 6 is a cross-sectional view showing another example of the cutting blade in the present embodiment. Both FIG. 6A and FIG. 6B are modifications of the cutting blade in the chamfered cutting portion 220. The cutting blade 71a shown in FIG. 6A is provided with a tip 711 whose center projects, thereby forming a V notch (chamfered portion) in the workpiece 10a. Further, the cutting blade 71b shown in FIG. 6B forms a flat cutting portion (half edge) in the workpiece 10a by cutting the tip portion 712 having a uniform diameter in the thickness direction to a depth equal to or less than the workpiece thickness. To do. By cutting the workpieces that have been subjected to these cutting processes into pieces, it becomes possible to easily perform V-notch processing and half-edge processing on the end surfaces of the workpieces. Further, the cutting blade is not limited to one having a different shape, and a configuration in which a cutting blade suitable for cutting (cutting) of the material for each material of the cutting portion of the workpiece can be employed. For example, a cutting blade for cutting resin may be attached to one spindle and a cutting blade for cutting metal may be attached to the other spindle.

  The workpiece 10a becomes the workpiece 10b by being chamfered. After chamfering cutting, the stage 32 on which the workpiece 10b is placed moves in the Y-axis direction (downward in the figure) in FIG.

  1A shows a state where the workpiece 10b after chamfering is placed on the stage 32 at the delivery position of the workpiece 10b.

  Next, the workpiece 10b after the chamfer cutting is transported to the cutting unit 230 by the loader 40 that can transport in the X-axis direction.

  As shown in FIG. 2A, the workpiece 10 b is further transported in the X-axis direction by the loader 40. In the same manner as described above, the loader 40 sucks and sucks the workpiece 10b placed on the stage 32 in the Z-axis direction by the suction portion. Since the loader 40 is in a state where the workpieces 10, 10a, and 10b to be conveyed are not cut, it is sufficient that the loader 40 can suck one workpiece. For this reason, the holding structure of the loader 40 may be a simple structure, and a structure that does not use a vacuum pump as a drive source for the loader 40 can also be adopted.

  The workpiece 10b adsorbed by the adsorbing portion of the loader 40 is conveyed by the loader 40 as it is in the X-axis direction. When the loader 40 that has sucked the workpiece 10 b reaches the stage 33 in the cutting unit 230, the load of the workpiece 10 b by the vacuum pump is stopped and the workpiece 10 b is placed on the stage 33.

    The cutting unit 230 replaces the chamfering cutting of the cutting unit 220 and cuts the chamfered workpiece 10b with the cutting blades 73 and 74 into 12 individual workpieces 11. Specifically, the cutting unit 230 cuts the workpiece 10b with the cutting blades 73 and 74 along a grid-like street illustrated as an area sandwiched between the broken lines 401, thereby separating pieces of 4 rows and 3 columns. Is divided into the workpieces 11. As described above, since the plurality of individualized workpieces 11 must be held, the stage 33 is configured to be able to suck and hold each individualized workpiece 11 individually.

  FIG. 7 is a plan view and a side view showing the workpiece cut and cut by the processing portion in the present embodiment. FIG. 7A shows a workpiece before cutting, and shows a state after chamfering cutting. FIG. 7B shows the workpiece after cutting divided into a plurality of individualized workpieces 11. After cutting, the stage 33 on which the plurality of individualized workpieces 11 are placed moves in the Y-axis direction (downward in the figure) in FIG.

  The cutting unit 230 in FIG. 1A shows a state in which twelve individual workpieces 11 are placed on the stage 33 at the delivery position of the plurality of individual workpieces 11.

  Next, the unloader 41 (individualized workpiece conveying means) adsorbs the twelve individualized workpieces 11 placed on the stage 33 and moves them in the X-axis direction. 11 is conveyed to the storage unit 300.

  Fig.8 (a) is a top view which shows an example of the singulation workpiece | work divided | segmented with the cutting device of a present Example. Moreover, FIG.8 (b) is principal part sectional drawing of the unloader in a present Example.

  As illustrated in FIG. 8B, the unloader 41 includes a suction unit 430 for sucking each of the plurality of individualized workpieces 11. The suction part 430 is made of an elastic body such as rubber, for example, so that the individualized workpiece 11 can be sucked and held. Further, the suction part 430 is provided with as many suction holes 425 as the number of the individual workpieces 11. For this reason, in this embodiment, twelve suction holes 425 are provided. In FIG. 8 (b), the three suction holes 425 are shown because the portion that adsorbs the three separated workpieces 11 arranged side by side in FIG. 8 (a) is shown.

  The unloader 41 is provided with a plurality of suction holes 425 for sucking the twelve pieces 11 individually. By using the vacuum pump (not shown) to suck the air in the suction hole 425, the individualized workpiece 11 can be sucked to the suction portion 430.

  As shown in FIG. 2A, the plurality of individualized workpieces 11 are conveyed in the X-axis direction by an unloader 41 (an individualized workpiece conveying unit). The unloader 41 is connected to a plastic chain 43 that accommodates a pipe line that is a connection member (second connection member) with a vacuum pump that is a drive source for the individualized workpiece holding operation. Connected to a vacuum pump. Similarly to the loader 40, the unloader 41 is suspended and supported on the track 400, and is configured to be movable along the track 400 in the X-axis direction by a driving unit (not shown). Unlike the loader 40, the unloader 41 has a complicated shape as described above, and has a suction portion that can suck more workpieces. The unloader 41 sucks air with a vacuum pump (not shown), and sucks the plurality of individualized workpieces 11 placed on the stage 33 by the suction unit 430.

  In this case, the twelve suction holes 425 in the suction unit 430 are connected to a vacuum pump via a plurality of conduits, for example, to prevent the entire fall. Each of the twelve individualized workpieces 11 is adsorbed directly below the twelve suction holes 425. In addition, each of the suction holes 425 can be connected to an independent vacuum pump so that they can be operated independently. In addition, since the unloader 41 has a large number of suctions, it is necessary to reliably hold all of the individual workpieces 11 and to simplify the configuration of the unloader holding unit, and the configuration by air suction using a vacuum pump is required. It has been adopted.

  However, the unloader of a present Example is not limited to this, You may comprise so that the separate workpiece | work other than 12 may be conveyed. The number of suction holes is changed as appropriate according to the number of pieces to be conveyed.

  Thus, the plurality of individualized workpieces 11 on the stage 33 are sucked up in the Z-axis direction by the suction portion of the unloader 41. The plurality of individualized workpieces 11 sucked by the suction portion of the unloader 41 are transported by the unloader 41 in the X-axis direction. When the unloader 41 adsorbing the plurality of individualized workpieces 11 moves along the track 400 and reaches a predetermined position in the storage unit 300 at the end of the track 400, the unloader 41 of the plurality of individualized workpieces 11 by the vacuum pump is used. Suction is stopped and the individualized workpiece 11 is placed at that position.

  For example, in this embodiment, the unloader 41 places a plurality of individualized workpieces 11 on a cleaning / inspection unit 90 (cleaning / inspection stage) provided in the storage unit 300.

  The cleaning / inspection unit 90 provided in the storage unit 300 includes a cleaning unit and an inspection unit. The cleaning unit cleans the cut surfaces and the like of the plurality of individualized workpieces 11 conveyed from the cutting unit 230. Further, the inspection unit performs inspections such as an appearance inspection and a continuity inspection for each of the plurality of individualized workpieces 11 and determines whether each individualized workpiece 11 is a non-defective product. The individualized workpieces 11 that have passed the inspection are stored in the tray 24.

  As described above, in this embodiment, the loader 40 that transports the workpiece in the X-axis direction and the unloader 41 that transports the singulated workpiece 11 in the X-axis direction are provided.

  As described above, the loader 40 conveys one workpiece between the supply unit 100 and the cutting unit 230, and the unloader 41 has a plurality of loads larger than the conveyance number of the loader 40 between the cutting unit 230 and the storage unit 300. A single piece work is transported. As shown in FIGS. 1A and 2A, the transport range of the loader 40 is represented by R1, and the transport range of the unloader 41 is represented by R2. In this case, since the loader 40 has to move between the supply unit 100 and the plurality of units, the transfer range R1 of the loader 40 is transferred by the unloader 41 that moves only between the supply unit 100 and the cutting unit 230. It is wider than the range R2. In other words, the moving distance of the loader 40 is longer than that of the unloader 41.

  The cutting unit 230 is disposed between the chamfered cutting unit 220 and the storage unit 300 and is disposed adjacent to the storage unit 300. That is, the cutting unit 230 is disposed at a position closest to the storage unit 300 among the plurality of units constituting the processing unit 200. For this reason, the conveyance range of the unloader 41 which conveys the several separate workpiece | work 11 at once can be made small, and it becomes possible to aim at stabilization of the cutting device 1. FIG. Moreover, since the distance of the pipe line which connects the vacuum pump and the adsorption | suction part 430 in the unloader 41 can be shortened by narrowing conveyance range R2 of the unloader 41, the adsorption | suction part 430 resulting from the increase in pipe line length. This makes it possible to suppress the delay in the adsorption operation.

  Next, a configuration of a cutting apparatus as another example of the present embodiment will be described. FIG. 1B is a schematic configuration diagram of a cutting device 1a as an example of the present embodiment. Moreover, FIG.2 (b) is a schematic block diagram of the conveyance means in the cutting device 1a. Since the basic configuration of the cutting device 1a is the same as that of the cutting device 1, the description of the same parts as the cutting device 1 is omitted.

  The cutting device 1 a includes a processing unit 201 including a laser processing unit 210 and a cutting unit 231. The cutting device 1a performs chamfering cutting of the workpiece in the cutting unit 231 and also cuts the workpiece.

As shown in FIG. 1B, the cutting unit 231 has the same configuration as the cutting unit 230 except for the cutting blade to be attached, and includes a stage 33 (cutting stage), spindles 63a and 64a, and a cutting blade 73a. 74a, an imaging device (not shown), and a control unit (not shown).
At the time of cutting by the cutting device 1a, the loader 40 directly conveys the workpiece 10a subjected to laser processing from the laser processing unit 210 to the cutting unit 231. The cutting unit 231 receives the workpiece 10a subjected to laser processing from the loader 40, and then chamfers and cuts the workpiece 10a with the cutting blades 73a and 74a attached to the respective tip portions of the spindles 63a and 64a. .

  Specifically, in the cutting unit 231, the workpiece 10a is first chamfered by the cutting blade 73a. As the cutting blade 73a, for example, the same cutting blades 71 and 72 as shown in FIG. 5A are used.

  After chamfering cutting of the workpiece 10a by the cutting blade 73a is completed, the workpiece 10b after chamfering cutting is cut by the cutting blade 74a. As the cutting blade 74a, for example, the same cutting blades 73 and 74 as shown in FIG. 5B are used.

  Thus, according to the cutting device 1a shown in FIG. 1B, both the chamfering and cutting of the workpiece are performed in the cutting unit 231 which is a single unit. That is, the cutting device 1a has a configuration in which one unit of the cutting unit 231 is incorporated instead of the two units of the chamfering cutting unit 220 and the cutting unit 230 in the cutting device 1. According to the cutting device 1a of FIG. 1B, it is possible to execute the same processing as the cutting device 1 of FIG.

  In this case, the loader 40 conveys the workpiece between the supply unit 100 and the cutting unit 231, and the unloader 41 conveys the singulated workpiece between the cutting unit 231 and the storage unit 300. In other words, the loader 40 is cut in that only two types of transfer, that is, transfer of the workpiece 10 from the supply unit 100 to the laser processing unit 210 and transfer of the workpiece 10a from the laser processing unit 210 to the cutting unit 231 are assigned. Different from the loader 40 of the device 1. On the other hand, the unloader 41 is assigned to transport a plurality of individualized workpieces 11 from the cutting unit 231 to the storage unit 300, and is the same as the unloader 41 of the cutting device 1. Therefore, as shown in FIG. 1B and FIG. 2B, the transport range of the loader 40 is represented by R3 and is different from the loader 40 of the cutting device 1, but the transport range of the unloader 41 is represented by R2. This is the same as the unloader 41 of the cutting device 1.

  As shown in FIG. 2B, the processing unit 201 of the cutting device 1 a includes two units, a laser processing unit 210 and a cutting unit 231. For this reason, the movement distance of the loader 40 is short compared with the cutting device 1 provided with the process part 200 comprised by three units. That is, the conveyance range R3 of the loader 40 in the cutting device 1a is smaller than the conveyance range R1 of the loader 40 in the cutting device 1. Therefore, the plastic chain 42a of the cutting device 1a and the pipe line accommodated therein may be shorter than those of the cutting device 1. In this case, when the cutting apparatus 1 is manufactured, a short connecting member may be used in advance, and the plastic chain and the pipe line may be shortened by the width of the omitted unit. Further, the length of the track 400 is adjusted as necessary. On the other hand, when the number of units is adjusted as necessary for the processing to be performed, these may be replaced with ones having an appropriate length.

  As described above, in this embodiment, the conveyance range of the loader 40 is variable by a simple operation of adjusting the length of the plastic chain and switching the pipe line or the track 400 to an appropriate length. For this reason, in the cutting device of the present embodiment, the processing unit can be configured using an arbitrary number of units. Therefore, when manufacturing the cutting device, a unit with a common design is prepared and added as necessary, and the length of the plastic chain etc. is expanded and contracted to make it an appropriate length. You can increase or decrease.

  FIG. 12 is a schematic configuration diagram of a plastic chain in the cutting apparatus of the present embodiment. FIG. 12A is a schematic configuration diagram of a conveying unit including a plastic chain, and FIG. 12B is an enlarged view of a main part of the plastic chain.

  As shown in FIGS. 12A and 12B, the plastic chain 42 is formed by connecting a plurality of cylindrical members with openings, and is connected to a vacuum pump of the cutting unit 230, for example. It extends from the base end toward the supply unit 100, and is configured to bend and extend in the middle in the direction opposite to the extending direction. On the other hand, the plastic chain 43 has the same configuration as the plastic chain 42, and extends from the base end portion connected to the vacuum pump of the cutting portion 230 toward the storage portion 300, for example, and is opposite to the extending direction. It is configured to bend in the direction and extend in the middle. Further, a beam-like support member is installed under the plastic chains 42 and 43 in order to prevent the tip end side from drooping. As a result, the plastic chains 42 and 43 have a distal end provided below the proximal end in accordance with the movement of the loader 40 or unloader 41 to which the distal end is connected. It is moved in the axial direction. Therefore, the cutting apparatus can be freely routed while protecting the pipelines accommodated in the plastic chains 42 and 43.

    In this case, by removing and reassembling the cylindrical member at one end E1 of the plastic chain 42, the length of the plastic chain 42 in FIG. The length of the plastic chain 42a in (b) can be changed. In this case, the length of the plastic chain 42 is shortened, but conversely, the plastic chain 42 can be lengthened by adding a cylindrical member to the end of the plastic chain. In addition, it adjusts so that the length of the pipe line accommodated inside may be expanded and contracted. On the other hand, since the length adjustment on the side of the unloader 41 having a complicated pipeline structure is unnecessary, it is possible to easily cope with an increase or decrease in the number of units.

  In the present embodiment, the supply unit, the processing unit, and the storage unit are detachably arranged in series. The number of units constituting the processing unit can be changed as appropriate. By changing the length of the plastic chain on the loader side, the conveyance range of the loader can be made variable according to the configuration of the processing unit.

  Thus, according to the present embodiment, the type and number of units constituting the cutting apparatus can be flexibly changed according to the type of workpiece and the purpose of processing. Therefore, according to the present embodiment, it is possible to provide a cutting device capable of improving productivity by shortening the time required for setup change and reducing the manufacturing time of the device itself.

  Next, the structure of the cutting device in Example 2 of this invention is demonstrated.

  The cutting apparatus according to the present embodiment has an independent work transport unit for transporting a work. Moreover, the position of the workpiece carrying-in part or the individualized workpiece carrying-out part can be appropriately changed and configured.

  Fig.9 (a) is a schematic block diagram of the cutting device 2 as an example of a present Example. Moreover, FIG.9 (b) is a schematic block diagram of the cutting device 2a as another example of a present Example. In addition, in this figure and each figure mentioned later, the same reference number is attached | subjected about the member same as the Example demonstrated previously, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 9A, the cutting device 2 includes a supply unit 101, a processing unit 202, a storage unit 300, a work transfer unit 500, and a main control unit (not shown). As described above, the cutting device 2 of the present embodiment is different from the cutting devices 1 and 1a of the first embodiment in that the workpiece conveying unit 500 independent from the supply unit 101 and the processing unit 202 is provided.

  The workpiece 10 in the supply unit 101 is transferred to the tray 20 in the workpiece transfer unit 500 by a transfer unit (not shown) (in the direction of the arrow) and placed thereon. The workpiece 10 placed on the tray 20 in the supply unit 100 is conveyed in the X-axis direction (arrow direction) inside the workpiece conveyance unit 500 by a loader (work conveyance means) that can move in the X-axis direction. The configuration of the loader is the same as that of the first embodiment.

  The processing unit 202 includes three units: a laser processing unit 212, a chamfered cutting unit 222, and a cutting unit 232. The workpiece 10 conveyed from the supply unit 101 to the processing unit 202 passes through these three units in order and is subjected to predetermined processing, whereby a plurality of individualized workpieces 11 can be obtained.

  As shown in FIG. 9A, the laser processing unit 212 includes a laser processing apparatus 50 for performing laser processing on the workpiece 10, a stage 34 (laser processing stage), and a control unit (not shown).

  Unlike the stage 31 of the first embodiment, the stage 34 is configured to be movable between the laser processing unit 212 and the workpiece transfer unit 500. The stage 34 stands by at a predetermined position in the workpiece transfer unit 500 (a position where the workpiece 10 is accepted) in a state where the workpiece 10 is not placed. When the loader transports the workpiece 10 in the X-axis direction within the workpiece transport unit 500 and reaches a position above a predetermined position where the stage 34 stands by (the acceptance position of the workpiece 10), the loader 10 separates the attracted workpiece 10 and moves the stage 34. Place on top.

  The stage 34 that has received the workpiece 10 from the loader moves in the Y-axis direction with the workpiece 10 placed thereon in order to perform laser processing on the workpiece 10.

  When the processing by the laser processing apparatus 50 is completed, the stage 34 on which the workpiece 10a subjected to laser processing is placed is moved to the delivery position of the workpiece 10a in the workpiece transfer section 500 (the acceptance position of the workpiece 10) in the Y-axis direction (downward direction). )

  Next, the workpiece 10a after the laser processing is transported to the chamfer cutting unit 222 by a loader in the workpiece transport unit 500.

  As shown in FIG. 9A, the chamfer cutting unit 222 includes a stage 35 (chamfer cutting stage), spindles 61 and 62, cutting blades 71 and 72, an imaging device (not shown), and a control unit (not shown). Have.

  Unlike the stage 32 of the first embodiment, the stage 35 is configured to be movable between the chamfered cutting unit 222 and the workpiece transfer unit 500. The stage 35 stands by at a predetermined position in the workpiece transfer unit 500 (a position where the workpiece 10a is accepted) in a state where the workpiece 10a is not placed. When the loader transports the workpiece 10a in the X-axis direction within the workpiece transport unit 500 and reaches above a predetermined position where the stage 35 stands by (the acceptance position of the workpiece 10a), the loader 10 separates the attracted workpiece 10a. Place on top.

  The stage 35 that has received the workpiece 10a from the loader moves in the Y-axis direction (upward) in a state where the workpiece 10a is placed in order to chamfer the workpiece 10a.

  When the chamfering cut is completed, the stage 35 on which the chamfered workpiece 10b is placed moves in the Y-axis direction (downward) to the delivery position of the workpiece 10b (the acceptance position of the workpiece 10a) in the workpiece conveyance unit 500.

  Next, the workpiece 10 b after chamfering cutting is conveyed to the cutting unit 232 by the loader in the workpiece conveyance unit 500.

  As shown in FIG. 9A, the cutting unit 232 includes a stage 36 (cutting stage), spindles 63 and 64, cutting blades 73 and 74, an imaging device (not shown), and a control unit (not shown).

  Unlike the stage 33 of the first embodiment, the stage 36 is configured to be movable between the cutting unit 232 and the workpiece transfer unit 500. The stage 36 stands by at a predetermined position in the workpiece transfer unit 500 (a position where the workpiece 10b is accepted) in a state where the workpiece 10b is not placed. When the loader transports the workpiece 10b in the X-axis direction within the workpiece transport unit 500 and reaches a position above a predetermined position where the stage 36 stands by (the acceptance position of the workpiece 10b), the loader 10 separates the attracted workpiece 10b. Place on top.

  The stage 36 that has received the workpiece 10b from the loader moves in the Y-axis direction (upward) with the workpiece 10b placed thereon in order to cut the workpiece 10b.

  As in the first embodiment, the cutting unit 232 according to the present embodiment is provided with a pair of spindles 63 and 64 and a pair of cutting blades 73 and 74.

  The workpiece 10 b placed on the stage 36 is cut by cutting blades 71 and 72.

  When the cutting of the workpiece 10b is completed, the stage 36 on which the individualized workpiece 11 is placed moves in the Y-axis direction (downward) to the delivery position of the individualized workpiece 11 in the cutting unit 232. Thus, in the present embodiment, the delivery position of the individualized workpiece 11 is different from the acceptance position of the workpiece 10b.

  Next, the unloader (divided work conveying means) is configured to be movable along the same track as that of the above-described implementation ray, and sucks the individualized work 11 placed on the stage 36 to X It moves in the axial direction and transports to the storage unit 300. In this embodiment, the unloader places a plurality of individualized workpieces 11 on a cleaning / inspection unit 90 (cleaning / inspection stage) provided in the storage unit 300. The configuration of the unloader is the same as that of the first embodiment.

  In the cutting device 2, the loader transports the workpiece along a track provided in the workpiece transport unit 501, while the unloader travels along another track provided between the processing unit 204 and the storage unit 301. Transports individualized workpieces. For this reason, the delivery position of the workpiece by the loader and the delivery position of the singulated workpiece by the unloader are arranged on straight lines defined by the respective tracks whose plane positions and lengths are different from each other.

  In the cleaning / inspection unit 90 provided in the storage unit 300, cleaning and inspection are performed as in the first embodiment. As described above, according to the present embodiment, in addition to the function and effect of the configuration similar to the above-described embodiment, the work transport unit 500 is configured separately from the supply unit 101, the processing unit 202, and the storage unit 300. , Each can be designed independently, and can be easily assembled by simply assembling the units at the time of assembly. Further, the operation on the supply unit 101 and the storage unit 300 and the visual recognition of the processing by the processing unit 202 can be performed from the same surface side of the apparatus, and the convenience for the user can be improved.

  Also in the present embodiment, similar to the first embodiment, the type and number of units constituting the cutting device can be flexibly changed according to the type of workpiece and the processing purpose. At this time, the plastic chain for holding and moving the loader and the workpiece transfer unit 500 are configured such that their lengths can be adjusted.

  In the cutting device 2a shown in FIG. 9B, a carry-in unit 120 (feed unit) for carrying in a workpiece from the outside and a carry-out unit 320 for carrying out the individualized workpiece 11 are arranged on the same side. This is different from the cutting device 2 of FIG.

  Specifically, as shown in FIG. 9B, the workpiece 10 is externally placed on the tray 20 in the workpiece transport unit 501 via the carry-in unit 120, and thereafter the cutting device in FIG. 9A. Processing similar to 2 is performed. The individualized workpieces 11 cut by the cutting unit 232 are cleaned and inspected, and are carried out from a carry-out unit 320 provided on the front side of the cutting device 2a.

  Thus, in the cutting device 2a of the present embodiment, in addition to the same effects as the above-described embodiment, both the carry-in unit 120 (supply unit) and the carry-out unit 320 are on the user side (in FIG. 2B). Therefore, handling is facilitated and user convenience can be improved.

  Next, the structure of the cutting device in Example 3 of this invention is demonstrated. In the cutting apparatus according to the present embodiment, the configuration of the storage unit is different from those of the above embodiments.

  FIG. 10A is a schematic configuration diagram of a cutting device 3 as an example of the present embodiment. Moreover, FIG.10 (b) is a schematic block diagram of the cutting device 3a as another example of a present Example.

  As shown in FIG. 10A, the configuration of the cutting device 3 is the same as that of the cutting device 1 a according to the first embodiment except for the storage portion 302.

  The storage unit 302 of the cutting device 3 includes a cleaning unit 95, a drying unit 96, an inspection unit 97, a tray 98, and a carry-out area 99.

  The cleaning unit 95 cleans the cut surfaces and the like of the plurality of individualized workpieces 11 conveyed from the cutting unit 231. The drying unit 96 dries the plurality of individualized workpieces 11 cleaned by the cleaning unit 95.

  The inspection unit 97 performs inspections such as an appearance inspection and a continuity inspection for each of the plurality of individualized workpieces 11 and determines whether each individualized workpiece 11 is a non-defective product. The inspection unit 97 includes a rotatable inspection table, and the inspection of the plurality of individualized workpieces 11 is performed on this inspection table. In this case, the direction of the individualized workpiece 11 is changed by the inspection table, and the individualized workpiece 11 that has passed the inspection is stored in the tray 98, and the front side of the storage unit 302 via the carry-out area 99. It is taken out from (user side).

  Thus, in the cutting device 3 of the present embodiment, since the carry-out area 99 is arranged on the front side (user side) of the storage portion 302, handling becomes easy and user convenience can be improved. In addition to the above, the orientation of the individualized workpieces 11 can be appropriately changed and stored as necessary, and the individualized workpieces 11 are rearranged and stored in the tray 98 so that they can be easily handled in later steps. Can do.

  As shown in FIG. 10B, the cutting device 3a, which is a modification of the present embodiment, is provided with a chamfered cutting portion 220 instead of the laser processing portion 210, so that the cutting device shown in FIG. Different from the device 3. The other configuration of the cutting device 3a is the same as that of the cutting device 3.

  When the curve machining of the workpiece 10 is unnecessary, the laser machining unit 210 can be omitted. In the cutting device 3a, it is possible to form the individualized workpiece 11a having no curved surface processing portion.

  Next, the structure of the cutting device in Example 4 of this invention is demonstrated.

  The cutting device of this embodiment is the same as the above embodiments in that the length of the loader can be adjusted according to the number of units constituting the cutting device, but the length of the unloader is also adjusted in addition to the loader. This is different from the above embodiments in that it is possible.

  Fig.11 (a) is a schematic block diagram of the cutting device 4 as an example of a present Example. Moreover, FIG.11 (b) is a schematic block diagram of the cutting device 4a as another example of a present Example.

  As shown in FIG. 11 (a), the cutting device 4 is similar to the cutting device 2a of the second embodiment (FIG. 9 (b)), except for a method of transporting a work or an individualized work by a loader or unloader. It has a configuration.

  As illustrated in FIG. 11A, the cutting device 4 includes a carry-in unit 120 (supply unit), a processing unit 204, a storage unit 301, a carry-out unit 320, and a work conveyance unit 501. In this embodiment, a configuration including the supply unit 101 in place of the carry-in unit 120 can also be employed.

    The processing unit 204 of the cutting device 4 includes a laser processing unit 212 and cutting units 231 and 233. In this respect, the cutting device 2a is different from the cutting device 2a including the processing unit 202 including the laser processing unit 212, the chamfered cutting unit 222, and the cutting unit 232. In the cutting device 4, the cutting portions 231 and 233 have the same configuration as each other and are provided for cutting different workpieces 10 a. That is, the cutting part 231 as the first cutting part cuts the first work, and the cutting part 233 as the second cutting part cuts the second work.

  The workpieces 10 placed on the tray 20 in the workpiece conveyance unit 501 are sequentially conveyed in the X-axis direction (arrow direction) inside the workpiece conveyance unit 501 by a loader (work conveyance unit) movable in the X-axis direction. The

  In the present embodiment, the workpiece 10 transferred from the carry-in unit 120 to the workpiece transfer unit 501 is first subjected to predetermined processing by the laser processing unit 212 and then cut or cut (cutting unit 231 (first cutting unit)). It is conveyed to any one of the parts 233 (second cutting part).

  In the present embodiment, the cutting portions 231 and 233 perform the same processing as described later, but may be configured to perform different processing in these cutting portions. For example, when the cutting unit 233 has a different type of cutting blade from the cutting unit 231, it is possible to manufacture a wide variety of individualized workpieces at a time. In this case, in the storage unit 301, all of the different processing performed in the same storage unit may be stored in one type of tray, but the storage destination tray may be different for each processing type.

  As described above, the processing unit 204 of the present embodiment is provided with three units, but each workpiece 10 passes through only two of them and becomes a singulated workpiece 11.

  The stage 36 a is configured to be movable between the cutting unit 231 and the workpiece transfer unit 501. The stage 36a stands by at a predetermined position in the work transport unit 501 (an acceptance position of the work 10a) in a state where the work 10a is not placed. When the loader transports the workpiece 10a in the X-axis direction within the workpiece transport unit 501 and reaches a position above a predetermined position where the stage 36a stands by (the position where the workpiece 10a is received), the loader 10a is separated to release the attracted workpiece 10a. Place on top.

  The stage 36b has a configuration similar to that of the stage 36a, and is configured to be movable between the cutting unit 233 and the workpiece transfer unit 501. The stage 36b stands by at a predetermined position in the work transport unit 501 (a position where the work 10a is accepted) in a state where the next work 10a is not placed. The loader transports the workpiece 10a in the X-axis direction within the workpiece transport unit 501, and passes directly above a predetermined position where the stage 36a stands by. The loader further conveys the workpiece 10a in the X-axis direction, and when it reaches above a predetermined position where the stage 36b waits (the position where the workpiece 10a is accepted), the adsorbed workpiece 10a is separated and placed on the stage 36b. .

  For example, the first workpiece 10a (first workpiece) that has been subjected to laser processing is transported to the stage 36a by a loader, but the workpiece 10a (second workpiece) that has been subjected to laser processing next to the stage 36b by the loader. Be transported. In this way, the workpiece 10a is alternately placed on the stages 36a and 36b from the one subjected to laser processing.

  The stage 36a that has received the workpiece 10a from the loader moves in the Y-axis direction (upward) with the workpiece 10a placed thereon in order to cut and cut the workpiece 10a. Similarly, the stage 36b that has received the next workpiece 10a moves in the Y-axis direction (upward) with the workpiece 10a placed thereon in order to cut and cut the workpiece 10a.

  The cutting portion 231 is provided with two cutting blades: a cutting blade 73a attached to the tip of the spindle 63a and a cutting blade 74a attached to the tip of the spindle 64a.

  Similarly, the cutting unit 233 is provided with two cutting blades, a cutting blade 73b attached to the tip of the spindle 63b and a cutting blade 74b attached to the tip of the spindle 64b.

  In the cutting portions 231 and 232, the chamfering and cutting of the workpiece 10a are performed in the same manner as in the above-described embodiment. The processing in the cutting units 231 and 232 may be performed simultaneously, and the processing timings may be different from each other.

  The workpiece 10a cut by the cutting unit 231 becomes a plurality of individualized workpieces 11 (first individualized workpieces). After cutting, the stage 36a moves to a predetermined position inside the cutting part 231. The plurality of individualized workpieces 11 placed on the stage 36 a are attracted by the unloader (individualized workpiece conveying means) at this predetermined position and conveyed to the storage unit 301.

  Moreover, the workpiece | work 10a cut | disconnected by the cutting | disconnection part 233 also becomes a several piece work 11 (2nd piece work). After cutting, the stage 36b moves to a predetermined position inside the cutting part 233. The plurality of individualized workpieces 11 placed on the stage 36 b are adsorbed by the unloader (individualized workpiece conveying means) at this predetermined position and conveyed to the storage unit 301.

  The individualized workpieces 11 conveyed from the two stages 36a and 36b to the storage unit 301 are cleaned and inspected by the cleaning / inspection unit 91 (cleaning / inspection stage). The individualized workpieces 11 that have passed the inspection are stored in the tray 24 and are carried out from the carry-out unit 320.

  In the present embodiment, the loader is configured to be movable between the tray 20 and the stage 36b inside the work transfer unit 501. More specifically, the loader conveys the work 10 placed on the tray 20 to the stage 34, and alternately places the work 10a placed on the stage 34 on either the stage 36a or the stage 36b. Transport to.

  As shown in FIG. 11A, the loader conveyance range is represented by R1. The conveyance range R1 is appropriately changed according to the number of units constituting the processing unit. The connection member on the loader side is configured to be adjustable according to the number of units. For example, the conveyance range R1 can be changed by adjusting the length of the plastic chain or the pipeline.

  On the other hand, the unloader is configured to be movable between the processing unit 204 and the storage unit 301 along a track arranged at a plane position different from the track of the loader. More specifically, the unloader sucks the individual workpiece 11 cut by the cutting unit 231 and conveys it to the storage unit 301, and sucks the individual workpiece 11 cut by the cutting unit 233. Then, it is conveyed to the storage unit 301. These conveyances are performed alternately, for example.

  The cutting device 4a shown in FIG. 11 (b) is the same as the cutting device 1 (FIG. 1 (a)) of the first embodiment except that the unloader transport range is variable. Also in the configuration of the cutting device 4a, the unloader conveyance range can be made variable by changing the length of the connecting member on the unloader side.

  For example, when the chamfer cutting unit 220 performs only chamfer cutting of a workpiece as in the first embodiment, it is preferable that the loader conveys the workpiece 10b to the stage 33. On the other hand, when the unit arranged at the position of the chamfered cutting unit 220 also cuts the workpiece, the unloader conveys the cut workpiece (divided workpiece) from the stage 32 to the stage 33 or the storage unit 300. Can be configured.

  Thus, when the unloader is not only provided with one cutting part provided at the end part on the storage part side but also with a plurality of cutting parts on the processing part, a plurality of cutting parts on the storage part side are provided. It is preferable to be set to a part.

  As shown in FIGS. 11A and 11B, the unloader conveyance range is represented by R4. The conveyance range R4 is appropriately changed according to the number of cutting parts constituting the processing part. For example, when another cutting part is provided in the cutting parts 231 and 233 shown in FIG. 11A, the connecting member that connects the unloader and the vacuum pump is adjusted to be long. As described above, in this embodiment, the length of the connection member connected to the unloader is configured to be adjustable according to the number of units. By changing the length of the connection member on the unloader side, the unloader can be transported. The range R4 can be made variable. Therefore, as shown in FIG. 11, it is also possible to set so that both conveyance ranges R1 and R4 overlap. In this case, in the cutting device 4 shown in FIG. 11 (a), the track of the loader and the unloader are arranged at different plane positions, so that they can be freely moved to the processing section, and efficient conveyance is possible. Can be realized. On the other hand, in the cutting device 4a shown in FIG. 11 (b), since the loader and the unloader are moved on the same track, the plane area used for conveyance can be narrowed and the depth can be reduced. It can be downsized.

  As described above, in this embodiment, the unloader transport range R4 is variably configured in addition to the loader transport range R1. For this reason, the workpiece | work after a process other than a cutting | disconnection can be conveyed with a loader, and the several separated workpiece | work after a cutting | disconnection can be conveyed with an unloader. In this case, since all the singulated workpieces are conveyed by the unloader, the number of workpieces held by the loader is smaller than the number of singulated workpieces held by the unloader. Therefore, the configuration of the loader can be simplified.

  In each of the above embodiments, each cutting part is provided with two cutting blades. However, the present invention is not limited to this, and each cutting part is provided with one cutting blade or three or more cutting blades. It may be done. Further, when a plurality of cutting blades are provided in each cutting portion, the plurality of cutting blades may be different types of cutting blades. With such a configuration, productivity can be further improved.

  In each of the above embodiments, a water jet that performs processing with pressurized water or an abrasive jet that performs processing by adding an abrasive may be used as a unit constituting the processing unit. Also, a wire saw that cuts using a fine wire, a band saw that cuts by rotating a band having a saw blade formed on its side surface in one direction, and the like can be used. Further, a unit such as a cleaning device or an inspection device can be added as a unit constituting the processing unit. In addition, a reversing unit that reverses the work surface of the workpiece between multiple operations, such as between cutting and cutting, is added, and after half-cutting one surface at a predetermined depth, the same position on the other surface is half-cut It is also possible to adopt a configuration that divides into pieces.

  In each of the above-described embodiments, the supply unit, the processing unit, and the storage unit are detachably arranged in series, and the work conveyance range by the loader is variable. For this reason, according to each of the above embodiments, it is possible to provide a cutting device that can shorten the time required for the setup change to improve the productivity and also reduce the manufacturing time of the device itself.

    Moreover, although the above-mentioned Example demonstrated the structure which adsorb | sucks a workpiece | work with a loader using a vacuum pump as a drive source for holding | maintenance operation | movement of a loader, this invention is not limited to this. For example, in the above-described embodiment, a compressor is used as a drive source, and air is supplied to the loader through a pipe line (positive pressure is applied). Further, by providing the loader with an ejector that generates negative pressure by the supplied air, it is possible to employ a configuration in which the ejector is driven by the supplied air to hold the workpiece by suction. In this case, it is possible to use a thinner plastic chain because high-speed operation can be maintained even if the pipe line is narrowed by supplying positive pressure to the loader. Moreover, the structure which hold | maintains a workpiece | work mechanically by driving an air cylinder with the air supplied from the compressor by providing an air cylinder in a loader can also be employ | adopted.

    In the above-described embodiment, a power source is used as a driving source, and a driving power source signal is supplied to the loader via a wiring as a connecting member. Further, by providing the solenoid in the loader, it is possible to employ a configuration in which the workpiece is mechanically held by driving the solenoid with the supplied signal.

  Further, in the above-described embodiment, the configuration has been described in which one main control unit controls the entire apparatus by controlling the control units of each unit of the machining unit, but the present invention is limited to this. is not. For example, it is possible to adopt a configuration in which each unit in the processing unit includes a control unit that can control each unit independently.

  In the above-described embodiment, the stage of each unit has been described with respect to the configuration example in which the workpiece can be sucked by air, but the present invention is not limited to this. For example, a configuration in which a workpiece is attached with an adhesive tape and held on a stage, or a configuration in which the workpiece is mechanically held can be employed.

    Moreover, although the plastic chain 42 and 43 demonstrated the structure by which the base end part was provided above the front-end | tip part in the above-mentioned figure etc., this invention is not limited to this. For example, a configuration in which the base end portion is provided below the tip end portion can be employed. In this case, it is also possible to adopt a configuration in which a beam-like support member is installed to prevent the plastic chains 42 and 43 from hanging down on the base end side.

  Further, in the cutting apparatuses 2, 2a, and 4 shown in FIGS. 9 and 11A, the configuration in which the stage provided in each unit can move between the workpiece transfer unit and each unit has been described. Is not limited to this. For example, a temporary placement stage for temporary placement of a workpiece is provided at a position in front of each unit of the workpiece transport unit, and the loader performs transport between the supply unit and the temporary placement stage and transport between the temporary placement stages. To do. In this case, a moving hand that moves between the stage of each unit and the temporary placement stage arranged at a corresponding position is further provided. By adopting such a configuration, the next workpiece can be placed on the temporary placement stage immediately after the processing of the previous workpiece is started, and the workpiece can be always supplied. Therefore, processing can be started and the operating rate of each unit can be further improved.

  A driving source such as a vacuum pump can be freely arranged. For example, a vacuum pump for holding the workpiece on the stage is placed in each unit, a loader and an unloader are connected to the vacuum pump of the unit where the base end of the plastic chain is located, and the suction state is controlled by a switching valve You can also. In this case, when the number of units is increased or decreased, the loader and the unloader can be connected to the vacuum pump of the unit where the base end portion of the plastic chain is located. Therefore, the number of units can be increased and decreased with a simple configuration. Moreover, the structure which provides a vacuum pump for a loader and an unloader is also employable. Furthermore, for example, the loader and the unloader can be controlled by a vacuum pump provided in the cutting unit.

  In the above-described embodiment, the configuration in which the unloader suction portion 430 is connected to the vacuum pump via a plurality of pipes has been described, but the present invention is not limited thereto. For example, a configuration in which the unloader suction portion 430 is connected to a vacuum pump via a single pipe line may be employed.

  In the above-described embodiment, the configuration in which the individualized workpiece 11 is held by the suction portion 430 in which the plurality of suction holes 425 are formed has been described, but the present invention is not limited to this. For example, the structure which equips the lower surface of an unloader with the round pad-shaped adsorption | suction part 430 which can hold | maintain the one piece work 11 can be employ | adopted.

  In the above, the Example of this invention was described concretely. However, the present invention is not limited to the matters described in the above embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

It is a schematic block diagram of the cutting device in Example 1. It is a schematic block diagram of the conveyance means in the cutting device of a present Example. It is a principal part enlarged view of the process part in a present Example. It is a top view which shows an example of the process area | region of the workpiece | work in a present Example. It is sectional drawing which shows an example of the cutting blade in a present Example. It is sectional drawing which shows another example of the cutting blade in a present Example. It is the top view and side view which show the workpiece | work cut and cut | disconnected by the process part in a present Example. (A) It is a top view which shows an example of the individualized workpiece | work divided | segmented with the cutting device of a present Example. (B) It is principal part sectional drawing of the unloader in a present Example. It is a schematic block diagram of the cutting device in Example 2. FIG. It is a schematic block diagram of the cutting device in Example 3. It is a schematic block diagram of the cutting device in Example 3. It is a schematic block diagram of the plastic chain in the cutting device of a present Example.

Explanation of symbols

1, 2, 3, 4: Cutting device 10, 10a, 10b: Work piece 11: Piece work 20, 24: Tray 31, 32, 33, 34, 35, 36: Stage 40: Loader 41: Unloader 42, 42a 43: Plastic chains 61, 62, 63, 64: Spindles 71, 72, 73, 74: Cutting blade 90, 91: Cleaning / inspection unit 100, 101: Supply unit 120: Loading unit 200, 201, 202, 203, 204: Processing parts 210, 211, 212: Laser processing parts 220, 221, 222: Chamfer cutting parts 230, 231, 232, 233: Cutting parts 300, 301, 302: Storage part 320: Unloading part 425: Suction hole 430: Suction unit 500: Work transfer unit

Claims (6)

A cutting device for cutting a workpiece,
A supply unit for supplying the workpiece;
Cutting the workpiece with a cutting blade, and dividing the workpiece into a plurality of individualized workpieces;
A storage section for storing the plurality of individualized workpieces;
A loader for conveying the workpiece from the supply unit to the processing unit;
An unloader that conveys the plurality of individualized workpieces from the processing unit to the storage unit,
The supply unit, the processing unit, and the storage unit are detachably arranged in series,
The loader is connected to the drive source for the work holding operation by a first connecting member, and the conveying range of the loader is variable by changing the length of the first connecting member. . The processing unit includes a chamfering cutting unit that performs chamfering cutting of the workpiece, and a cutting unit that divides the workpiece subjected to chamfering cutting into the plurality of individualized workpieces,
The loader conveys the workpiece from the supply unit to the chamfered cutting unit, and conveys the workpiece from the chamfered cutting unit to the cutting unit,
The cutting apparatus according to claim 1, wherein the unloader conveys the plurality of individualized workpieces from the cutting unit to the storage unit. The supply unit sequentially supplies the workpiece to the processing unit,
The processing unit includes a first cutting unit that cuts a first workpiece out of the workpieces and divides the workpiece into a plurality of first singulated workpieces, and a plurality of cutting a second workpiece among the workpieces. A second cutting part that is divided into a second individualized workpiece,
The loader conveys the first workpiece from the supply unit to the first cutting unit, conveys the second workpiece from the supply unit to the second cutting unit,
The unloader conveys the plurality of first individualized workpieces from the first cutting unit to the storage unit, and transfers the plurality of second individualized workpieces from the second cutting unit to the storage unit. The cutting apparatus according to claim 1, wherein the cutting apparatus is transported to the center.   The cutting apparatus according to claim 3, wherein the second cutting unit has a different type of cutting blade from the first cutting unit.   The unloader is connected to the drive source for the singulated workpiece holding operation by a second connecting member, and the conveyance range of the unloader is variable by changing the length of the second connecting member. The cutting device according to any one of claims 1 to 4.   The cutting apparatus according to claim 1, wherein the processing unit further includes a laser processing unit that performs curved cutting of the workpiece.