TWI826950B - Machining apparatus and method for manufacturing workpiece - Google Patents

Abstract

The present invention is an apparatus for reducing a footprint of a machining apparatus including: a substrate accommodating part 111 accommodating a sealed substrate W; a cutting table 2A and a cutting table 2B machining the sealed substrate W by a cutting mechanism 4; a receiving stage 115 receiving the sealed substrate W from the substrate accommodating part 111; a stage moving mechanism 117 having a moving rail 117a for moving the receiving stage 115 to a conveying position; a first holding mechanism 3 holding the sealed substrate W in order to convey the sealed substrate W to the cutting table 2A and the cutting table 2B; and a conveyance moving mechanism 7 having a transfer shaft 71 for moving the first holding mechanism 3 between the receiving stage 115 at the conveying position and the cutting table 2A and the cutting table 2B, wherein the transfer shaft 71 and the moving rail 117a are orthogonal to each other in a plan view.

Description

Processing device and manufacturing method of processed product

The present invention relates to a processing device and a method for manufacturing processed products.

Previously, as shown in Patent Document 1, a cutting system has been conceivable in which a semiconductor strip cut by a cutting device is supplied from a loading device to an inlet rail and transferred from the inlet rail to the cutting device. The device is cut into individual semiconductor packages by a cutting device.

However, in the cutting system, the loading device, the introduction rail and the cutting device are arranged in a row along the X direction, so the footprint of the cutting system becomes larger. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2007-536727

[Problem to be solved by the invention]

Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is to reduce the occupied area of the processing device. [Means to solve the problem]

That is, the processing apparatus of the present invention is characterized by including: a processing object storage part that stores the processing object; a processing table that processes the processing object by a processing mechanism; and a receiving table that receives the processing object from the processing object storage part. The object to be processed; a table moving mechanism having a moving rail for moving the receiving table to a transfer position; a first holding mechanism to hold the object to be processed in order to transport the object to the processing table; and transportation A moving mechanism is provided with a transmission shaft for moving the first holding mechanism between the receiving table and the processing table at the transport position, and the transmission shaft and the moving rail are in a plane view. are orthogonal to each other. [Effects of the invention]

According to the present invention configured in this way, the occupied area of the processing device can be reduced.

Next, examples of the present invention will be described in more detail. However, the present invention is not limited to the following description.

As described above, the processing device of the present invention is characterized by including: a processing object storage part for storing the processing object; a processing table for processing the processing object by a processing mechanism; and a receiving table for storing the processing object. a section to receive the object to be processed; a table moving mechanism having a moving rail for moving the receiving table to a transfer position; and a first holding mechanism to hold the object to be processed in order to transport the object to the processing table; and a moving mechanism for transportation, having a transmission shaft for moving the first holding mechanism between the receiving table and the processing table located at the transportation position, and the transmission shaft and the moving rail are at Orthogonal to each other when viewed in plan view. In the above-mentioned processing device, the moving rail that moves the receiving table and the transmission axis that moves the first holding mechanism are orthogonal to each other in plan view. Therefore, it is not necessary to arrange the processing object storage portion and the processing table transversely as before. Arranged in a row, the occupied area of the processing equipment can be reduced.

Specifically, it is preferable that the object storage portion and the first holding mechanism are provided on opposite sides to each other with respect to the transmission axis in plan view. With the above structure, the first holding mechanism is provided on one side of the transmission shaft, and the processing object receiving portion is provided on the other side of the transmission shaft. Therefore, processing can be performed without being restricted by the movement range of the first holding mechanism. The object storage portion also increases the freedom of arrangement of the processing object storage portion, thereby reducing the area occupied by the processing device.

Preferably, the processing apparatus of the present invention further includes a processing tool replacement mechanism for replacing the processing tool of the processing mechanism, and is structured to automatically replace the processing tool of the processing mechanism. In the above-mentioned structure, in order to simplify the device structure, it is desirable that the processing tool changing mechanism can be moved by the moving rail.

Desirably, the receiving station has a positioning mechanism for positioning the object to be processed. By having the positioning mechanism in this way, the object to be processed can be positioned on the receiving table located at the transfer position, and the object to be processed can be reliably transported.

Preferably, the receiving station has a carry-in table for carrying in the object to be processed, and a carry-out table for carrying out the half-cut object to be processed, and the processing device of the present invention carries out all the half-cut objects. The object to be processed is transported from the processing table to the unloading table, and the half-cut object to be processed is stored in the object accommodating portion via the unloading table. According to the above structure, the object to be processed can be cut into half, and the half-cut object to be processed can be stored in the object accommodating portion.

In addition, preferably, the processing device of the present invention includes: a transfer table for moving the processed object; and a second holding mechanism for removing the processed object from the processing table. The processed object is transported to the transfer table and held, and the second holding mechanism is configured to be movable along the transmission shaft. According to the above structure, the first holding mechanism and the second holding mechanism share the transmission shaft, so the device structure can be simplified.

In the processing device of the present invention, in order to completely cut the object to be processed, it is desirable that the transfer table moves the fully-cut object to be processed, and the second holding mechanism holds the fully-cut object. Processing object.

Ideally, it further includes a processing moving mechanism that moves the processing mechanism on a horizontal plane in a first direction along the transmission axis and in a second direction orthogonal to the first direction. Move. According to the above structure, the processing moving mechanism moves the processing mechanism on the horizontal plane in the first direction along the transmission axis and in the second direction orthogonal to the first direction. Therefore, the processing table does not need to be moved. The object is processed by moving in the first direction and the second direction. Therefore, the processing table can be moved without using the ball screw mechanism, and the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member are not required. As a result, the device structure of the processing device can be simplified. In addition, since the processing table is configured not to move in the first direction and the second direction on the horizontal plane, the moving space of the processing table and the useless space around it can be reduced, thereby reducing the occupied area of the processing device.

In addition, a method for manufacturing a processed product using the processing device is also an aspect of the present invention.

Furthermore, a method for manufacturing a processed product using the processing device to produce a half-cut product is characterized by including a loading step of loading the object to be processed into half-cut products from the loading table to the processing table. ; a half-cutting step of half-cutting the object to be processed carried in the carrying-in step; a carrying-out step of carrying out the half-cut object to be processed by the half-cutting step to the carrying-out table; and In the accommodation step, the object to be processed carried out to the unloading table in the unloading step is stored in the object accommodating part.

<One embodiment of the present invention> Hereinafter, an embodiment of the processing device of the present invention will be described with reference to the drawings. In addition, any of the figures shown below are appropriately omitted or schematically drawn in an exaggerated manner for easy understanding. The same components are labeled with the same symbols, and descriptions are omitted where appropriate.

＜Overall structure of processing equipment＞ The processing device 100 of this embodiment is a cutting device that cuts the sealed substrate W as the processing object into individual pieces into a plurality of products P as the processed product.

Specifically, as shown in FIG. 1 , the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W; and a first holding mechanism 3 that holds the sealed substrate W. The sealed substrate W is transported to the cutting table 2A and the cutting table 2B to hold the sealed substrate W; the cutting mechanism (processing mechanism) 4 completes the sealing held in the cutting table 2A and the cutting table 2B. The substrate W is cut; the transfer table 5 moves a plurality of products P; the second holding mechanism 6 transfers a plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table 5 A plurality of products P are held; the transport moving mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and the cutting moving mechanism (processing moving mechanism) 8, The cutting mechanism 4 is moved relative to the sealed substrate W held by the cutting tables 2A and 2B.

Here, the sealed substrate W is a substrate to which electronic components such as semiconductor wafers, resistive elements, and capacitive elements are connected, and is formed by resin molding to seal at least the electronic components with resin. As the substrate constituting the sealed substrate W, a lead frame and a printed wiring board can be used. In addition to these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, and ceramic substrates can also be used. Substrates, glass substrates, resin substrates, etc. In addition, the substrate constituting the sealed substrate W may or may not have wiring implemented.

In the following description, the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are respectively referred to as the X direction and the Y direction. The vertical direction orthogonal to the direction is set as the Z direction. Specifically, let the left-right direction in FIG. 1 be the X direction, and let the up-down direction be the Y direction. Although it will be described later, the X direction is the moving direction of the support body 812 and is orthogonal to the longitudinal direction (the direction in which the beam portion extends) of the beam portion (cross beam portion) of the door-shaped support body 812 that bridges the pair of legs. direction (see Figure 2).

＜Workbench for cutting＞ The two cutting tables 2A and 2B are fixedly installed in the X direction, the Y direction, and the Z direction. Furthermore, the cutting table 2A can be rotated in the θ direction by the rotation mechanism 9A provided below the cutting table 2A. In addition, the cutting table 2B can be rotated in the θ direction by the rotation mechanism 9B provided below the cutting table 2B.

These two cutting tables 2A and 2B are installed along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged so that their upper surfaces are located on the same horizontal plane (at the same height position in the Z direction) (see FIG. 4 ), and the upper surfaces of the two cutting tables 2A and 2B are arranged so that The center (specifically, the rotation center of the rotation mechanism 9A and the rotation mechanism 9B) is located on the same straight line extending in the X direction (see FIGS. 2 and 3 ).

In addition, the two cutting tables 2A and 2B adsorb and hold the sealed substrate W. As shown in FIG. 1 , two vacuum pumps 10A and 10B are arranged corresponding to the two cutting tables 2A and 2B for adsorbing and holding the substrate W. . Each of the vacuum pumps 10A and 10B is, for example, a water-sealed vacuum pump.

Here, since the cutting table 2A and the cutting table 2B are fixed in the XYZ direction, the pipes connected from the vacuum pump 10A and the vacuum pump 10B to the cutting table 2A and the cutting table 2B can be shortened (not shown). As shown in the figure), it can reduce the pressure loss of the piping and prevent the reduction of adsorption force. As a result, even a very small package, for example, 1 mm square or less, can be reliably attracted to the cutting table 2A and the cutting table 2B. In addition, the reduction in adsorption force due to pressure loss in the piping can be prevented, so that the capacity of the vacuum pump 10A and the vacuum pump 10B can be reduced, which also leads to downsizing and cost reduction.

＜First holding mechanism＞ As shown in FIG. 1 , the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in FIGS. 5 and 6 , the first holding mechanism 3 has: an adsorption head 31 provided with a plurality of adsorption portions 311 for adsorbing and holding the sealed substrate W; and a vacuum pump (not shown) connected to the adsorption unit. The suction part 311 of the head 31. Then, the sealed substrate W is transported from the substrate supply mechanism 11 to the cutting tables 2A and 2B by moving the suction head 31 to a desired position by the transport moving mechanism 7 described below.

As shown in FIG. 1 , the substrate supply mechanism 11 has: a substrate accommodating part 111 for accommodating a plurality of sealed substrates W from the outside; and a substrate supply part 112 for moving the sealed substrates W accommodated in the substrate accommodating part 111 to a first position. A holding mechanism 3 adsorbs and holds the holding position RP. The holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. Furthermore, the substrate supply mechanism 11 may have a substrate heating part 113 that heats the sealed substrate W adsorbed by the first holding mechanism 3 in order to make it soft and easy to adsorb. In addition, the substrate accommodating part 111 corresponds to a processing object accommodating part. In addition, the substrate accommodating portion 111 may be configured to directly accommodate a plurality of sealed substrates W as processing objects, or may be configured to accommodate a magazine for accommodating a plurality of sealed substrates W as processing objects. W container. The specific structure of the other substrate supply mechanism 11 will be described later.

＜Cutting mechanism (processing mechanism)＞ As shown in FIGS. 1 , 2 and 3 , the cutting mechanism 4 has two rotating tools 40 including a blade 41A and a blade 41B corresponding to a processing tool and two spindle portions 42A and 42B. The two spindle portions 42A and 42B are provided with their rotation axes along the Y direction, and the blades 41A and 41B attached to the spindles are arranged to face each other (see FIG. 3 ). The blade 41A of the spindle part 42A and the blade 41B of the spindle part 42B cut the sealed substrate W held on each of the cutting tables 2A and 2B by rotating in the plane including the X direction and the Z direction. Furthermore, in the cutting device 100 of this embodiment, as shown in FIGS. 3 and 4 , a liquid supply mechanism 12 having a jet is provided in order to suppress the frictional heat generated by the blades 41A and 41B. Spray nozzle 121 for cutting water (machining fluid). The injection nozzle 121 is supported by, for example, a Z-direction moving portion 83 described below.

＜Transfer workbench＞ As shown in FIG. 1 , the transfer table 5 of this embodiment is a table that moves a plurality of products P inspected by an inspection unit 13 to be described later. The transfer table 5 is called a so-called index table and temporarily places the plurality of products P before sorting the plurality of products P into the various pallets 21 . In addition, the transfer table 5 is arranged in line with the two cutting tables 2A and 2B on the horizontal plane along the X direction. Furthermore, the transfer table 5 can move forward and backward along the Y direction, and can move to the sorting mechanism 20 . The plurality of products P placed on the transfer table 5 are classified into various trays 21 by the sorting mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13 .

Furthermore, the various pallets 21 are conveyed to a desired position by the pallet conveying mechanism 22 that moves along the transmission shaft 71, and the products P classified by the sorting mechanism 20 are placed thereon. After sorting, the various pallets 21 are accommodated in the pallet accommodating part 23 by the pallet transport mechanism 22 . In this embodiment, the pallet accommodating part 23 is configured to accommodate, for example, the pallet 21 before accommodating the product P, the pallet 21 accommodating the good product P, and the pallet 21 accommodating the defective product P that needs to be reworked (reinspected). Wait for three kinds of pallets 21.

＜Inspection Department＞ Here, as shown in FIG. 1 , the inspection unit 13 is provided between the cutting table 2A, the cutting table 2B, and the transfer table 5 , and inspects a plurality of products P held by the second holding mechanism 6 . The inspection unit 13 of this embodiment includes a first inspection unit 131 that inspects the sealing surface (packaging surface) of the product P, and a second inspection unit 132 that inspects the lead surface of the product P. The first inspection unit 131 is a camera having an optical system for inspecting the package surface, and the second inspection unit 132 is a camera having an optical system for inspecting the lead surface. Furthermore, the first inspection part 131 and the second inspection part 132 may be shared.

The sealed substrate W and product P of this embodiment have a structure in which one side of the substrate is resin-molded. In this structure, the resin-molded surface is the surface where the electronic components connected to the substrate are sealed with resin, and is called the "sealing surface" or "packaging surface". On the other hand, the non-resin-molded surface opposite to the resin-molded surface exposes leads that usually function as external connection electrodes of the product, and is therefore called a lead surface. When the lead is a protruding electrode used in electronic components such as a Ball Grid Array (BGA), it is sometimes called a "spherical surface". Furthermore, the surface that is not resin-molded and is opposite to the resin-molded surface may also be in a form where no leads are formed, so it is sometimes called the "substrate surface". In the description of this embodiment, the resin-molded surface is described as the "sealing surface" or "packaging surface", and the non-resin-molded surface opposite to the resin-molded surface is described as the "lead surface".

In addition, in order to enable the inspection unit 13 to inspect both sides of the plurality of products P, an inversion mechanism 14 for inverting the plurality of products P is provided (see FIG. 1 ). The reversing mechanism 14 includes a holding table 141 that holds a plurality of products P, and a reversing portion 142 such as a motor that reverses the holding table 141 so that the front and back are reversed.

When the second holding mechanism 6 holds a plurality of products P from the cutting tables 2A and 2B, the packaging surface of the products P faces downward. In this state, while the plurality of products P are being transported from the cutting tables 2A and 2B to the reversing mechanism 14 , the sealing surface of the products P is inspected by the first inspection unit 131 . Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 . In this state, the lead surface of the product P faces downward, and the reversing mechanism 14 is moved to the second inspection part 132 to inspect the lead surface of the product P.

＜Second holding mechanism＞ As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table 5 . As shown in FIG. 8 , the second holding mechanism 6 includes: an adsorption head 61 provided with a plurality of adsorption portions 611 for adsorbing and holding a plurality of products P; and a vacuum pump (not shown) connected to the adsorption head 61 . Adsorption part 611. Then, the suction head 61 is moved to a required position by the conveyance moving mechanism 7 or the like described below, thereby conveying the plurality of products P from the cutting table 2A or the cutting table 2B to the holding table 141 or the holding table 141 . Transfer workbench 5.

＜Moving mechanism for transportation＞ As shown in FIG. 1 , the transport moving mechanism 7 moves the first holding mechanism 3 to a distance between the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 to a distance of The cutting table 2A, the cutting table 2B, and the holding table 141 move among each other.

Furthermore, as shown in FIG. 1 , the transport moving mechanism 7 has a common transmission shaft 71 extending linearly along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5 . It is used to move the first holding mechanism 3 and the second holding mechanism 6 .

The transmission shaft 71 is provided in a range in which the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5 ( Refer to Figure 1). In addition, with respect to the transmission shaft 71 , the first holding mechanism 3 , the second holding mechanism 6 , the cutting table 2A, the cutting table 2B, and the transfer table 5 are provided on the same side ( Near front side). In addition, the inspection part 13 , the reversing mechanism 14 , various pallets 21 , the pallet transport mechanism 22 , the pallet storage part 23 , the first cleaning mechanism 18 and the second cleaning mechanism 19 described below, and the recovery container 172 are also provided relative to the transmission shaft 71 On the same side (near front side).

Furthermore, as shown in FIGS. 5 , 6 and 8 , the transport moving mechanism 7 has: a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transmission shaft 71 ; and a lifting movement. The mechanism 73 makes the first holding mechanism 3 and the second holding mechanism 6 move up and down in the Z direction relative to the transmission shaft 71; and the horizontal movement mechanism 74 makes the first holding mechanism 3 and the second holding mechanism 6 move in the Z direction relative to the transmission shaft 71. Move horizontally in Y direction.

As shown in Figures 5 to 8, the main moving mechanism 72 has: a common guide rail 721, which is provided on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, The first holding mechanism 3 and the second holding mechanism 6 are moved along the guide rail 721 .

The guide rail 721 extends linearly in the X direction along the transmission shaft 71 , and is provided in a range in which the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 and the second holding mechanism 721 extends linearly in the X direction. The second holding mechanism 6 can move above the transfer workbench 5 . A sliding member 723 is slidably provided on the guide rail 721 , and the sliding member 723 is provided with a first holding mechanism 3 and a second holding mechanism 6 via a lifting and lowering movement mechanism 73 and a horizontal movement mechanism 74 . Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6 , but the lifting and lowering movement mechanism 73 , the horizontal movement mechanism 74 and the sliding member 723 are separate for each of the first holding mechanism 3 and the second holding mechanism 6 . settings.

The rack and pinion mechanism 722 has: a cam rack 722a, which is shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion gear 722b, which is respectively provided in the first holding mechanism 3 and the second holding mechanism 6. The actuator (not shown) rotates. The cam rack 722a is provided on the common transmission shaft 71 and can be changed to various lengths by connecting a plurality of cam rack elements. In addition, the pinion 722b is provided on the sliding member 723 and is called a so-called roller pinion. As shown in FIG. 7, it has a pair of roller bodies 722b1 that rotate together with the rotation axis of the motor, and A plurality of roller pins 722b2 are disposed at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are disposed to be rollable relative to the roller body 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion. Therefore, two or more roller pins 722b2 are in contact with the cam rack 722a, and no backlash is generated in the forward and reverse directions, so that the third roller pinion can be used. When the first holding mechanism 3 and the second holding mechanism 6 move in the X direction, the positioning accuracy becomes better.

As shown in FIGS. 5 and 8 , the lifting and lowering movement mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 respectively. As shown in FIGS. 5 and 6 , the lifting and lowering movement mechanism 73 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the main moving mechanism 72 ) and the first holding mechanism 3 , and has a Z-direction guide rail. 73a, which is arranged along the Z direction; and the actuator part 73b, which moves the first holding mechanism 3 along the Z direction guide rail 73a. Furthermore, the actuator part 73b may use a ball screw mechanism, a cylinder, or a linear motor, for example. Furthermore, as shown in FIG. 8 , the structure of the lifting and lowering movement mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and lowering movement mechanism 73 of the first holding mechanism 3 .

As shown in FIGS. 5 , 6 and 8 , the horizontal moving mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 respectively. As shown in FIGS. 5 and 6 , the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the lifting movement mechanism 73 ) and the first holding mechanism 3 , and has: Y direction The guide rail 74a is arranged along the Y direction; the elastic body 74b applies force to the first holding mechanism 3 to one side of the Y direction guide rail 74a; and the cam mechanism 74c makes the first holding mechanism 3 move to the other side of the Y direction guide rail 74a. Move sideways. Here, the cam mechanism 74c uses an eccentric cam, and by rotating the eccentric cam using an actuator such as a motor, the movement amount of the first holding mechanism 3 in the Y direction can be adjusted.

Furthermore, as shown in FIG. 8 , the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the lifting movement mechanism 73 of the first holding mechanism 3 . In addition, the second holding mechanism 6 may not be provided with the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be provided with the horizontal movement mechanism 74 . Furthermore, like the up-and-down movement mechanism 73 , the horizontal movement mechanism 74 does not use the cam mechanism 74 c but may use a ball screw mechanism, a cylinder, or a linear motor.

＜Moving mechanism for cutting (moving mechanism for processing)＞ The cutting moving mechanism 8 linearly moves each of the two spindle portions 42A and 42B independently in the X direction, the Y direction, and the Z direction.

Specifically, as shown in FIGS. 2 , 3 , 9 and 10 , the moving mechanism 8 for cutting includes: an X-direction moving part 81 for linearly moving the spindle parts 42A and 42B in the X direction; Y The direction moving part 82 linearly moves the spindle parts 42A and 42B in the Y direction; and the Z-direction moving part 83 linearly moves the spindle parts 42A and 42B in the Z direction.

The X-direction moving part 81 is shared by the two cutting tables 2A and 2B. As shown in FIGS. 2 and 3 , the X-direction moving part 81 is provided to sandwich the two cutting tables 2A and 2B along the X direction. A pair of X-direction guide rails 811; and a support body 812 move along the pair of X-direction guide rails 811 and support the spindle portions 42A and 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. In addition, the support 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and a beam (crossbeam) installed on the pair of legs and extending in the Y-direction.

Furthermore, the support body 812 linearly reciprocates along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a driving source (not shown) such as a servo motor. In addition, the support body 812 may also be configured to reciprocate by a linear motor or other linear motion mechanism.

Especially as shown in FIG. 3 , the Y-direction moving part 82 has a Y-direction guide rail 821 provided along the Y-direction in the support 812 and a Y-direction slider 822 that moves along the Y-direction guide rail 821 . The Y-direction slider 822 is driven by a linear motor 823, for example, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle parts 42A and 42B can move in the Y direction independently of each other. In addition, the Y-direction slider 822 can also be configured to reciprocate by using other linear motion mechanisms such as ball screw mechanisms.

As shown in FIGS. 2 to 4 , the Z-direction moving part 83 has a Z-direction guide rail 831 provided in each Y-direction slider 822 along the Z-direction; and a Z-direction slider 832 along the Z-direction guide rail 831 The spindle parts 42A and 42B are moved and supported. That is, the Z-direction moving part 83 is provided corresponding to each of the spindle parts 42A and 42B. The Z-direction slider 832 is driven by an eccentric cam mechanism (not shown), for example, and moves linearly back and forth on the Z-direction guide rail 831 . In addition, the Z-direction slider 832 may also be configured to reciprocate by other linear motion mechanisms such as a ball screw mechanism.

Regarding the positional relationship between the cutting moving mechanism 8 and the transmission shaft 71 , as shown in FIGS. 1 and 4 , the transmission shaft 71 is arranged above the cutting moving mechanism 8 and traverses the cutting moving mechanism 8 . . Specifically, the transmission shaft 71 is disposed above the support body 812 and crosses the support body 812 , and the transmission shaft 71 and the support body 812 have a positional relationship orthogonal to each other in plan view.

＜Machining waste storage unit＞ In addition, as shown in FIG. 1 , the cutting device 100 of this embodiment further includes a processing waste storage portion 17 for storing processing waste S such as end materials generated by cutting the sealed substrate W.

As shown in FIGS. 2 to 4 , the processing chip storage portion 17 is provided below the cutting tables 2A and 2B, and has a guide chute 171 surrounding the cutting machine in plan view. The processing chips S guided by the guide chute 171 are recovered using the upper opening 171X of the workbench 2A, the cutting workbench 2B, and the recovery container 172 . By arranging the processing waste storage portion 17 below the cutting tables 2A and 2B, the recovery rate of the processing chips S can be improved.

The guide chute 171 guides the processing chips S scattered or dropped from the cutting table 2A and the cutting table 2B to the recovery container 172 . In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A and 2B (see FIG. 3 ). Therefore, the processing chips S are less likely to be missed, and further improvement can be achieved. Recovery rate of processing chips S. In addition, the guide chute 171 is provided to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4 ) to protect the rotating mechanisms 9A and 9B. The mechanism 9B is constructed in a manner to protect it from machining chips S and cutting water.

In this embodiment, the machining chip storage part 17 is shared by the two cutting tables 2A and 2B, but may be provided corresponding to the cutting table 2A and the cutting table 2B respectively.

The recovery container 172 recovers the processing chips S that have passed through the guide chute 171 due to its own weight. In the present embodiment, as shown in FIG. 4 and others, the recovery container 172 is provided corresponding to the two cutting tables 2A and 2B. Furthermore, the two recovery containers 172 are arranged on the front side of the transmission shaft 71 and are configured to be independently detachable from the front side of the cutting device 100 . With this structure, maintenance such as disposal of machining chips S can be improved. Furthermore, the recovery container 172 may be provided as one under all the cutting tables, taking into account the size of the sealed substrate W, the size and amount of the processing chips S, workability, etc., or may be divided into three or more.

In addition, as shown in FIG. 4 etc., the machining chip storage part 17 has the separation part 173 which separates cutting water and machining chips. As a structure of the separation unit 173 , for example, a filter such as a porous plate that allows cutting water to pass is provided on the bottom surface of the recovery container 172 . The separation part 173 allows the processing chips S to be recovered without accumulating cutting water in the recovery container 172 .

＜First Cleaning Mechanism＞ In addition, as shown in FIGS. 1 and 5 , the cutting device 100 of the present invention further includes a first cleaning mechanism 18 for cleaning the plurality of products P held on the cutting tables 2A and 2B. Surface side (lead side) clean. The first cleaning mechanism 18 uses a spray nozzle 18a (see FIG. 5 ) to clean the upper surface side of product P.

As shown in FIG. 5 , the first cleaning mechanism 18 is configured to be movable along the transmission shaft 71 together with the first holding mechanism 3 . Here, the first cleaning mechanism 18 is provided on the sliding member 723 which slides on the guide rail 721 provided on the transmission shaft 71 . Here, between the first cleaning mechanism 18 and the sliding member 723, a lifting and lowering movement mechanism 181 for lifting and lowering the first cleaning mechanism 18 in the Z direction is provided. As the lifting and lowering movement mechanism 181 , for example, it is conceivable to use a rack and pinion mechanism, a ball screw mechanism, or a cylinder.

＜Second cleaning mechanism＞ Furthermore, as shown in FIG. 1 , the cutting device 100 of the present invention further includes a second cleaning mechanism 19 for cleaning the lower surface side (sealing surface) of the plurality of products P held by the second holding mechanism 6 . The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection part 13, and sprays cleaning liquid and/or compressed air to the lower surfaces of the plurality of products P held by the second holding mechanism 6, Thereby, the lower surface side of the article P is cleaned. That is, while the second holding mechanism 6 is moving along the transmission shaft 71 , the second cleaning mechanism 19 cleans the lower surface side of the product P.

＜Example of operation of cutting device＞ Next, an example of the operation of the cutting device 100 will be described. FIG. 9 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 during the operation of the cutting device 10 . In addition, in this embodiment, the operations of the cutting device 100 include all operations such as conveyance of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, replacement of the blade, and dressing described below. Or control is performed by the control unit CTL (see Figure 1).

The substrate supply part 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodating part 111 to the holding position RP held by the first holding mechanism 3 .

Then, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 adsorbs and holds the sealed substrate W. Thereafter, the transport moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A and the cutting table 2B, and the first holding mechanism 3 releases the adsorption and holding, and moves the sealed substrate W to the cutting table 2A and the cutting table 2B. W is placed on the cutting table 2A and the cutting table 2B. At this time, the X-direction position of the sealed substrate W is adjusted by the main moving mechanism 72 , and the Y-direction position of the sealed substrate W is adjusted by the horizontal moving mechanism 74 . Furthermore, the cutting table 2A and the cutting table 2B adsorb and hold the sealed substrate W.

Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting and lowering movement mechanism 73 raises the first holding mechanism 3 to a position where it is not in contact with the cutting movement mechanism 8 ( support 812) to the point where physical interference occurs. Furthermore, when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, the support 812 is retracted from the cutting table 2B toward the transfer table 5 side. , there is no need to raise or lower the first holding mechanism 3 as described above.

In this state, the cutting moving mechanism 8 sequentially moves the two spindle portions 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate, thereby cutting the sealed substrate W. It is single-piece in lattice shape.

After cutting, the transport moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After the above cleaning, the transport moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

Then, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 adsorbs and holds the plurality of products P. Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surface side (sealing surface) of the plurality of products P held by the second holding mechanism 6 .

After cleaning, the plurality of products P held in the second holding mechanism 6 are inspected on both sides by the inspection part 13 and the reversing mechanism 14 . Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 to the transfer table 5, and the second holding mechanism 6 releases the adsorption and holding, and places the plurality of products P on the transfer table 5. The plurality of products P placed on the transfer table 5 are classified into various trays 21 by the sorting mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13 .

Furthermore, regarding the double-sided inspection, for example, first one of the surfaces of the product P is inspected while being suction-held by the second holding mechanism 6 . Then, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being adsorbed and held by the reversed holding table 141, thereby executing Check both sides. Furthermore, subsequent transportation of the product P from the reversing mechanism 14 to the transfer table 5 can be performed by transferring it from the holding table 141 to the second holding mechanism 6 . In addition, the holding table 141 is configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 is configured to be movable in the Z direction, so that the holding table 141 is moved to Above the transfer workbench 5, the product P can also be transported to the transfer workbench 5 and transferred.

＜Detailed structure of substrate supply mechanism＞ Hereinafter, the detailed structure of the substrate supply mechanism 11 will be described.

As described above, the substrate supply mechanism 11 supplies the sealed substrate W to the first holding mechanism 3 . Specifically, as shown in FIGS. 1 , 10 , and 11 , the substrate supply mechanism 11 has a substrate receiving portion 111 that receives a plurality of sealed substrates W from the outside; and a substrate supply portion 112 that stores the substrates W in the substrate receiving portion. The sealed substrate W of 111 moves to the holding position RP which is adsorbed and held by the first holding mechanism 3 .

As shown in FIGS. 10 and 11 , the substrate accommodating portion 111 is provided with a push-out mechanism 114 for pushing out a portion of the accommodated sealed substrate W to the outside of the substrate accommodating portion 111 . The push-out mechanism 114 has a movable pressing member 114a that presses one end portion of the sealed substrate W, and an actuator portion 114b that moves the pressing member 114a. As the actuator part 114b, a motor, a cylinder, a solenoid, etc. can be used.

As shown in FIGS. 10 and 11 , the substrate supply unit 112 includes a receiving stage 115 that receives the sealed substrate W from the substrate receiving unit 111 , and a substrate moving unit 116 that moves the sealed substrate W from the substrate receiving unit 111 to the receiving stage 115 . ; and a stage moving mechanism that moves the receiving stage 115 to a predetermined transport position X2.

As shown in FIG. 10 , the receiving station 115 of this embodiment is configured not only to receive the sealed substrate W from the substrate accommodating portion 111 but also to transfer the sealed substrate W to the substrate accommodating portion 111 . Specifically, the receiving station 115 includes an importing station 115A that receives the sealed substrate W from the substrate accommodating portion 111 and an unloading station 115B that transfers the sealed substrate W to the substrate accommodating portion 111 . The loading stage 115A is an adsorption stage, and can adsorb and hold the mounted sealed substrate W. In addition, the unloading stage 115B of this embodiment delivers the half-cut sealed substrate W. In addition, the so-called half-cutting is a process of cutting a part of the upper surface (lead surface) of the sealed substrate W to form a groove.

As shown in FIGS. 11 and 12 , the sealed substrate W placed on the loading stage 115A is heated while being pressed against the upper surface of the loading stage 115A from above by the substrate heating unit 113 . Therefore, the sheet-shaped buffer material 115x that absorbs the impact during heating by the substrate heating unit 113 is provided on the loading stage 115A.

In addition, as shown in FIG. 12 , a positioning mechanism 118 for positioning the sealed substrate W is provided on the loading stage 115A. The positioning mechanism 118 has a structure such that one of the pair of side walls 115m and 115n of the loading table 115A is movable relative to the other side wall 115n. By closing the gap between the pair of side walls 115m and 115n, The sealed substrate W is in contact with the other side wall 115n and is positioned with the inner surface of the other side wall 115n as a reference. Furthermore, in this embodiment, one of the side walls 115m can be moved by the actuator 115j, and the other side wall 115n can be moved by the actuator 115k. When the substrate W is heated and sealed by the substrate heating unit 113, the side walls 115m and 115n are retracted by the actuators 115j and 115k so as not to interfere with each other.

As shown in FIG. 11 , the substrate moving part 116 has a clamp part 116 a that clamps the end of the sealed substrate W, an X-direction moving part 116 b that moves the clamp part 116 a in the X direction, and a Z-direction moving part 116 c that moves the clamp part 116 a in the X direction. The clamp part 116a moves in the Z direction.

The procedure for transferring the sealed substrate W from the substrate accommodating part 111 to the receiving stage 115 (importing stage 115A and unloading stage 115B) using the pushing mechanism 114 and the substrate moving part 116 is as follows. The pressing member 114a of the pushing mechanism 114 presses the sealed substrate W accommodated in the substrate accommodating part 111, so that a part of the sealed substrate W protrudes from the substrate accommodating part 111 toward the loading stage 115A side. Then, the portion of the sealed substrate W protruding from the substrate receiving portion 111 is clamped by the clamp portion 116a of the substrate moving portion 116, and the clamp portion 116a is moved in the X direction by the X-direction moving portion 116b. The sealed substrate W is pulled out and placed on the loading stage 115A.

As shown in FIGS. 10 and 11 , the table moving mechanism 117 has a pair of moving rails 117 a for moving the receiving table 115 (carrying-in table 115A and unloading table 115B), and a sliding member 117 b along the moving rails. 117a is moved and provided with a receiving station 115. The sliding member 117b linearly reciprocates along the Y direction on a pair of moving rails 117a by, for example, a ball screw mechanism 117c extending in the Y direction. The ball screw mechanism 117c is driven by a driving source (not shown) such as a servo motor. In addition, the sliding member 117b may also be configured to reciprocate by other linear motion mechanisms such as linear motors.

The moving rail 117a is located below the transmission shaft 71, and the moving rail 117a and the transmission shaft 71 of the transportation moving mechanism 7 are orthogonal to each other in plan view. In this embodiment, the transmission shaft 71 extends in the X direction, and the moving rail 117a extends in the Y direction. In addition, "mutually orthogonal in plan view" means not only the case where the transmission axis 71 and the moving rail 117a intersect perpendicularly (90°), but also includes substantially orthogonal. Substantially orthogonal refers to a state of crossing with a slight error from vertical, for example, a state of crossing at 85° or more and 95° or less.

In addition, since the moving rail 117a is orthogonal to the transmission shaft 71, the moving rail 117a is orthogonal to the X-direction guide rail 811 that moves the support 812 of the cutting moving mechanism 8. In other words, the moving rail 117a and the supporting body 812 of the cutting moving mechanism 8 are parallel in plan view.

Here, when the transmission shaft 71 comes into contact with the peripheral structure of the moving rail 117a, the substrate receiving portion 111 and the first holding mechanism 3 are provided on opposite sides to each other with respect to the transmission shaft 71. Specifically, the substrate receiving portion 111 is provided on the inner side of the transmission shaft 71 in the Y direction, and the first holding mechanism 3 is provided on the front side of the transmission shaft 71 in the Y direction.

Furthermore, as shown in FIGS. 13(a) to 13(c) , the stage moving mechanism 117 moves the loading stage 115A to the receiving position 3 Keep the sealed substrate W moving linearly between the transfer positions X2. The receiving position X1 is located on the inner side of the transmission shaft 71 in the Y-axis direction, and the transfer position X2 is located on the front side of the transmission shaft 71 in the Y-axis direction. In addition, the sealed substrate W on the receiving stage 115 (importing stage 115A) located at the transfer position X2 is located at the holding position RP.

In addition, the stage moving mechanism 117 moves the loading stage 115A to the heating position X3 for heating the mounted sealed substrate W by the substrate heating unit 113 (see (a) to (c) of FIG. 13 ). . The heating position X3 of this embodiment is set to the inner side of the receiving position X1 in the Y direction. At the heating position X3, the substrate heating unit 113 comes into contact with the upper surface of the sealed substrate W placed on the loading stage 115A to heat the sealed substrate W.

Furthermore, as shown in FIGS. 14(d) and 14(e) , the table moving mechanism 117 moves the unloading table 115B to the transport position X2. At this position, the half-cut sealed substrate W is transported to the unloading stage 115B by the first holding mechanism 3 . In addition, the table moving mechanism 117 moves the unloading table 115B to the receiving position X1. At this position, the sealed substrate W is accommodated in the substrate accommodating portion 111 from the unloading stage 115B by the substrate moving portion 116 . Furthermore, although the half-cut sealed substrate W is accommodated in the receiving position X1, a storage position for accommodating the sealed substrate W may also be set, and the sealed substrate W is accommodated in the substrate accommodating portion 111 at the storage position.

＜Blade replacement mechanism＞ As shown in FIGS. 10 and 15 , the cutting device 100 of this embodiment has a blade replacement mechanism 24 that automatically replaces the blades 41A and 41B. Specifically, in this embodiment, the blade replacement mechanism 24 can replace the blades 41A and 41B from the two spindle parts 42A and 42B, respectively. Furthermore, the blade replacement mechanism 24 stores the blades 41A and 41B in the blade accommodating portion 25 while retaining the removed blades 41A and 41B, holds the new blades 41A and 41B, and transports them to the spindle portions 42A and 42A. The spindle part 42B is installed. Furthermore, the blade changing mechanism 24 corresponds to a machining tool changing mechanism.

Here, the structure of the cutting mechanism 4 will be described. As shown in FIG. 16 , it has: blades 41A and 41B; spindle portions 42A and 42B for rotating the blades 41A and 41B; and a pair of protrusions. The edges 43 and 44 detachably fix the blades 41A and 41B to the spindle portions 42A and 42B. The pair of flanges 43 and 44 includes an inner flange 43 fixed to and close to the spindle portions 42A and 42B; and an outer flange 44 opposite to the spindle portion 42A. , the spindle part 42B is detachably configured and is separated from the spindle part 42A, the spindle part 42B. The outer flange 44 is fixed to the central axis portion of the inner flange 43 by a detachable member 45 such as a nut. The attachment and detachment member 45 makes the blade 41A and the blade 41B detachable with respect to the spindle portion 42A and the spindle portion 42B.

Furthermore, as shown in FIGS. 10 and 15 , the blade replacement mechanism 24 includes: an adsorption arm 241 that adsorbs the blade 41A, the blade 41B and the outer flange 44 ; and an arm moving mechanism 242 that moves the adsorption arm 241 relative to the cutting mechanism 4 move relatively. In addition, the arm moving mechanism 242 corresponds to the holding part moving mechanism.

As shown in FIGS. 17(a) and 17(b) , the adsorption arm 241 includes: a first adsorption part 241a, a surface that adsorbs one of the blade 41A and the blade 41B (the surface on the outer flange 44 side); and The second adsorption part 241b is located inside the first adsorption part 241a and adsorbs the surface outside the outer flange 44 (the surface opposite to the inner flange 43). Furthermore, the adsorption arm 241 includes a detachable member rotation part 241 c located inside the second adsorption part 241 b and engaged with the detachable member 45 (here, a nut) of the spindle parts 42A and 42B. Together, the attachment and detachment member 45 is attached and detached. Furthermore, the first adsorption part 241a and the second adsorption part 241b are connected to a suction pump (not shown) provided outside the adsorption arm 241. In addition, the attachment and detachment member rotation part 241c is comprised using the rotation mechanism (not shown), such as a motor which rotates the attachment and detachment member 45, for example.

As shown in FIG. 15 , the arm moving mechanism 242 includes: a Y-direction moving mechanism 242a that moves the suction arm 241 in the Y direction; and an X-direction moving mechanism 242b that moves the suction arm 241 in the X direction. Furthermore, the arm moving mechanism 242 may also have a mechanism for moving the suction arm 241 in the Z direction.

The Y-direction moving mechanism 242a is configured using the moving rail 117a of the stage moving mechanism 117, and has a Y-direction slider 242a1 that slides along the moving rail 117a. The Y-direction slider 242a1 is driven by a linear motor, for example, and moves linearly back and forth on the moving rail 117a. Furthermore, the Y-direction slider 242a1 may also be configured to reciprocate by using other linear motion mechanisms such as ball screw mechanisms.

The X-direction moving mechanism 242b has an X-direction guide rail 242b2 provided along the X-direction on the Y-direction slider 242a1, and an X-direction slider 242b1 that moves along the X-direction guide rail 242b2. The X-direction slider 242b1 is driven by a linear motor, for example, and moves linearly back and forth on the X-direction guide rail 242b2. Furthermore, the X-direction slider 242b1 may also be configured to reciprocate by using other linear motion mechanisms such as ball screw mechanisms.

By configuring the blade replacement mechanism 24 in this way, the movement direction of the blade replacement mechanism 24 (the direction along the movement rail 117a) and the movement direction of the support 812 in the processing movement mechanism 8 (the direction along the X-direction guide rail 811) are in the same position. Orthogonal to each other when viewed in plan view. That is, the suction arm 241 of the blade replacement mechanism 24 moves along the longitudinal direction of the support 812 . In addition, "mutually orthogonal in plan view" means not only the case where the moving rail 117a and the X-direction guide rail 811 intersect perpendicularly (90°), but also includes being substantially orthogonal. Substantially orthogonal refers to a state of crossing with a slight error from vertical, for example, a state of crossing at 85° or more and 95° or less.

In addition, when replacing the blades 41A and 41B, as shown in FIGS. 18(a) and 18(b) , the processing moving mechanism 8 moves the cutting mechanism 4 to a predetermined replacement position. Specifically, the X-direction moving part 81 moves the support body 812 to the moving rail 117a side (the blade replacement mechanism 24 side), and moves the cutting mechanism 4 to a predetermined replacement position. In addition, the blade replacement mechanism 24 moves along the moving rail 117a to remove the blades 41A and 41B of the cutting mechanism 4 located at the replacement position. The blade replacement mechanism 24 stores the removed blades 41A and 41B in the blade accommodating portion 25 , takes out the new blades 41A and 41B, and installs them in the cutting mechanism 4 at the replacement position. When replacing the blades 41A and 41B of the two cutting mechanisms 4, the suction arm 241 is rotated 180 degrees by a rotation mechanism not shown in the figure, and the same operation is performed. Furthermore, when the blade changing mechanism 24 moves along the moving rail 117a, the sliding member 117b provided with the receiving base 115 retreats to a position that does not hinder the movement of the blade changing mechanism 24. On the contrary, when the sliding member 117b provided with the receiving base 115 moves along the moving rail 117a, the blade changing mechanism 24 retreats to a position that does not hinder the movement of the sliding member 117b.

As shown in FIG. 10 , the cutting device 100 of this embodiment includes: a trimming member accommodating portion 26 that accommodates a trimming member DP for trimming the blades 41A and 41B; and a trimming table 27 that mounts the trimming member DP. The blades 41A and 41B are trimmed.

The dressing member accommodating part 26 stores the new dressing member DP and the old dressing member DP respectively. The trimming member accommodating part 26 of this embodiment is provided on the moving rail 117a, specifically, it is provided on the Y-direction slider 242a1 which moves the moving rail 117a.

The trimming table 27 of this embodiment is provided between the two cutting tables 2A and 2B. The trimming member DP is conveyed to the trimming table 27 by the first holding mechanism 3 and the conveyance moving mechanism 7 . Furthermore, the dressing table adsorbs and holds the conveyed dressing member DP. Furthermore, the first holding mechanism 3 is provided with an adsorption portion (not shown) for adsorbing and holding the trimming member DP. While the trimming table 27 holds the trimming member DP, the cutting moving mechanism 8 moves the cutting mechanism 4 to the trimming table 27 to trim the blades 41A and 41B of the cutting mechanism 4 .

Next, a case where the sealed substrate W is fully cut (single-cut) and a case where half-cut (groove processing) is performed will be described with reference to FIGS. 19(a) and 19(b) . In addition, full cutting refers to a process in which the sealed substrate W is cut into individual pieces.

(1) When performing total cutting (single-cutting) (see (a) of Figure 19) The sealed substrate located in the substrate accommodating part 111 is transferred to the import stage 115A of the receiving stage 115 using the ejection mechanism 114 and the substrate moving part 116 .

The loading table 115A is moved to the transport position by the table moving mechanism 117 , the sealed substrate W is held by the first holding mechanism 3 , and is transported to the cutting tables 2A and 2B (loading step).

Then, the sealed substrate W is completely cut (cut) using the cutting tables 2A and 2B to form individual pieces (full cutting step).

The product P is held by the second holding mechanism 6 and transported to the holding table 141 of the reversing mechanism 14 or the transfer table 5 (unloading step). The subsequent operations are as described in <Example of Operation of the Cutting Device>.

(2) When performing half cutting (grooving) (see (b) of Figure 19) The sealed substrate W scheduled to be half-cut in the substrate accommodating part 111 is transferred to the import stage 115A of the receiving stage 115 using the push-out mechanism 114 and the substrate moving part 116 .

The loading stage 115A is moved to the transport position X2, the sealed substrate W is held by the first holding mechanism 3, and is transported to the cutting table 2A and the cutting table 2B (carrying step).

Then, the sealed substrate W is half-cut (grooved) using the cutting tables 2A and 2B (half-cutting step).

The half-cut sealed substrate W is held by the first holding mechanism 3 and transported to the unloading stage 115B located at the transfer position X2 (unloading step).

The unloading stage 115B, which has transferred the half-cut sealed substrate W, is moved to the storage position (receiving position X1) by the stage moving mechanism 117. Then, the substrate moving part 116 accommodates the half-cut sealed substrate W in the substrate accommodating part 111 (accommodating step).

<Effects of this embodiment> According to the cutting device 100 of this embodiment, the moving rail 117a that moves the receiving stage 115 and the transmission shaft 71 that moves the first holding mechanism 3 are orthogonal to each other in plan view. Therefore, it is not necessary to separate the substrate receiving portion 111 as before. Since the cutting table 2A and the cutting table 2B are arranged in a line laterally, the area occupied by the cutting device 100 can be reduced.

In addition, since the first holding mechanism 3 is provided on one side of the transmission shaft 71 and the substrate receiving portion 111 is provided on the other side of the transmission shaft 71, the substrate can be installed without being restricted by the movement range of the first holding mechanism 3. The accommodating part 111, in addition, the degree of freedom in the arrangement of the substrate accommodating part 111 is increased, and the area occupied by the cutting device 100 can be reduced.

In addition, in this embodiment, it is assumed that the first holding mechanism 3 is moved by a common transmission shaft 71 extending along the arrangement direction of the cutting table 2A, the cutting table 2B, and the transfer table 5 . and the structure of moving the second holding mechanism 6. The cutting moving mechanism 8 moves the cutting mechanism 4 on the horizontal plane respectively in the X direction along the transmission shaft 71 and in the Y direction orthogonal to the X direction. Therefore, it is not necessary to use The cutting table 2A and the cutting table 2B move in the X direction and the Y direction to process the sealed substrate W. Therefore, the cutting table 2A and the cutting table 2B can be moved without using the ball screw mechanism, and the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member are not required. As a result, the device structure of the cutting device 100 can be simplified. In addition, the cutting table 2A and the cutting table 2B can be configured not to move in the X direction and the Y direction, so that the area occupied by the cutting device 100 can be reduced.

＜Other variations＞ In addition, the present invention is not limited to the above-described embodiment.

For example, in the above-described embodiment, the blade replacement mechanism 24 is movable on the moving rail 117a of the stage moving mechanism 117, but it may be configured to be movable along other rails.

The cutting device 100 of the above embodiment performs both the full cutting operation and the half cutting operation, but may perform only the full cutting operation. In this case, the receiving station 115 only needs to be the importing station 115A. Alternatively, only half-cutting can be performed. In this case, there is no need for a structure such as the second holding mechanism 6 to carry out the product P.

In the above-mentioned embodiment, the cutting device of the double cutting table type and the double mandrel structure has been described, but it is not limited to this, and a cutting device of the single cutting table type and the single mandrel structure may also be used. Or a cutting device with a single cutting table type and a double mandrel structure, etc.

In addition, the transfer table 5 in the above embodiment is an indexing table that is temporarily placed before sorting into various pallets 21 , but the transfer table 5 may also be used as the holding table 141 of the reversal mechanism 14 .

Furthermore, in the above-described embodiment, the structure is configured to sort the products P from the transfer table 5 to the tray 21. However, the product P may be conveyed and attached to an adhesive tape arranged inside the frame-shaped member.

In addition, the cam rack element constituting the transmission shaft 71 can be configured by connecting a plurality of cam rack elements. Therefore, for example, the cutting device (processing device) 100 can be configured to be separable and connectable between the second cleaning mechanism 19 and the inspection unit 13 ( Modular structure that can be loaded and unloaded). In this case, for example, a module that performs a different type of inspection from the inspection in the inspection unit 13 may be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Furthermore, in addition to the structure illustrated here, the cutting device (processing device) 100 may be configured as a module structure that can be separated and connected (removable) somewhere, or an additional module may be configured as an inspection unit. Modules with various functions other than.

In addition, the processing device of the present invention can also perform processing other than cutting, for example, it can also perform other mechanical processing such as cutting or grinding.

In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. [Industrial availability]

According to the present invention, the occupied area of the processing device can be reduced.

2A, 2B: Cutting table (processing table) 3: The first holding mechanism 4: Cutting mechanism (processing mechanism) 5: Transfer workbench 6: Second holding mechanism 7:Moving mechanism for transportation 8: Moving mechanism for cutting (moving mechanism for processing) 9A, 9B: Rotating mechanism 10A, 10B: Vacuum pump 11:Substrate supply mechanism 12:Liquid supply mechanism 13:Inspection Department 14:Reversal mechanism 17: Processing waste collection department 18:The first cleaning agency 18a, 121: Injection nozzle 19:Second cleaning mechanism 20:Classification agency 21:Pallet 22:Pallet transport mechanism 23:Pallet storage department 24: Blade changing mechanism (processing tool changing mechanism) 241:Adsorption arm 241a: First adsorption part 241b: Second adsorption part 241c: Loading and unloading member rotating part 242:Arm moving mechanism 242a:Y direction moving mechanism 242b:X direction moving mechanism 242a1:Y direction slider 242b1:X direction slider 242b2:X direction guide rail 25:Blade storage department 26: Trimming component storage section 27:Workbench for trimming 31, 61: Adsorption head 40: Rotary tool 41A, 41B: Blade 42A, 42B: Spindle part 43: Inner flange (flange) 44:Outer flange (flange) 45: Loading and unloading components 71:Transmission shaft 72: Main moving mechanism 73: Lifting and moving mechanism 73a:Z direction guide rail 73b: Actuator part 74: Horizontal moving mechanism 74a: Y direction guide rail 74b: Elastomer 74c: Cam mechanism 81:X direction moving part 82:Y direction moving part 83:Z direction moving part 100: Cutting device (processing device) 111: Substrate storage part (processing object storage part) 112:Substrate supply department 113:Substrate heating part 114: Launch organization 114a: Pushing member 114b: Actuator part 115:receiving station 115x: buffer material 115m, 115n: side wall 115A: Move-in table 115B: Move out the table 115j, 115k: actuator 116:Substrate moving part 116a: Fixture Department 116b:X direction moving part 116c:Z direction moving part 117a:Moving track 117b: Sliding member 117c: Ball screw mechanism 117: Taiwan mobile mechanism 118: Positioning mechanism 131:First Inspection Department 132:Second Inspection Department 141:Keep workbench 142:Reversal Department 171:Guide chute 171X: Upper opening 172:Recycling container 173:Separation Department 181: Lifting and moving mechanism 311, 611: Adsorption department 721: Guide rail 722: Rack and pinion mechanism 722a: Cam rack 722b: pinion 722b1:Roller body 722b2:Roller pin 723:Sliding member 811:X direction guide rail 812:Support 813: Ball screw mechanism 821: Y direction guide rail 822:Y direction slider 823: Linear motor 831:Z direction guide rail 832:Z direction slider CTL:Control Department P: products (processed products) RP: maintain position S: Processing chips DP: Trim component X1: receiving position X2:Transportation location X3: Heating position W: Sealed substrate (object to be processed) X, Z, θ: direction Y: direction (axis direction)

FIG. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention. FIG. 2 is a perspective view schematically showing the cutting table of the embodiment and its surrounding structure. FIG. 3 is a diagram (plan view) viewed from the Z direction, schematically showing the structure of the cutting table and its surrounding structures according to the embodiment. FIG. 4 is a diagram (front view) viewed from the Y direction, schematically showing the structure of the cutting table and its surrounding structures according to the embodiment. 5 is a diagram (front view) viewed from the Y direction, schematically showing the structure of the first holding mechanism and the transport moving mechanism of the embodiment. 6 is a diagram (side view) viewed from the X direction, schematically showing the structure of the first holding mechanism and the transport moving mechanism of the embodiment. 7 is a diagram (front view) viewed from the Y direction schematically showing the structure of the second holding mechanism and the transport moving mechanism of the embodiment. FIG. 8 is a cross-sectional view schematically showing the structure of a rack and pinion mechanism according to the embodiment. Fig. 9 is a schematic diagram showing the operation of the cutting device according to the embodiment. FIG. 10 is a diagram (plan view) viewed from the Z direction, schematically showing the structure of the substrate supply mechanism of the embodiment. FIG. 11 is a diagram (front view) viewed from the Y direction schematically showing the structure of the substrate supply mechanism of the embodiment. FIG. 12 is a cross-sectional view schematically showing the structure of the loading table according to the embodiment. 13(a) to 13(c) are views (plan views) schematically illustrating respective positions of the loading table according to the embodiment, viewed from the Z direction. 14(d) and 14(e) are views (plan views) viewed from the Z direction, schematically showing each position of the carry-out table according to the embodiment. FIG. 15 is a diagram (plan view) viewed from the Z direction schematically showing the structure of the blade replacement mechanism of the embodiment. FIG. 16 is a cross-sectional view schematically showing the structure of the cutting mechanism of the embodiment. 17(a) and 17(b) are cross-sectional views schematically showing (a) a state before removal and (b) a state after removal of the blade using the blade replacement mechanism of the embodiment. . 18(a) and 18(b) are views (plan views) viewed from the Z direction showing the replacement state of each blade by the blade replacement mechanism of the embodiment. 19(a) and 19(b) are flowcharts of the full-cut conveying operation and the half-cut conveying operation of the embodiment.

2A, 2B: Cutting table (processing table)

3: The first holding mechanism

7:Moving mechanism for transportation

8: Moving mechanism for cutting (moving mechanism for processing)

9A, 9B: Rotating mechanism

11:Substrate supply mechanism

24: Blade replacement mechanism (processing tool replacement mechanism)

25:Blade storage department

26: Trimming component storage section

27:Workbench for trimming

40: Rotary tool

41A, 41B: Blade

42A, 42B: Spindle part

71:Transmission shaft

81:X direction moving part

111: Substrate storage part (processing object storage part)

113:Substrate heating part

114: Launch organization

114a: Pushing member

114b: Actuator part

115:receiving station

115A: Move-in table

115B: Move out the table

116:Substrate moving part

117: Taiwan mobile mechanism

117a:Moving track

117b: Sliding member

117c: Ball screw mechanism

241:Adsorption arm

242:Arm moving mechanism

811:X direction guide rail

812:Support

DP: Trim component

W: Sealed substrate (object to be processed)

X1: receiving position

X, Z, θ: direction

Y: direction (axis direction)

Claims (8)

A processing device includes: a processing object storage part to store the processing object; a processing workbench to process the processing object by a processing mechanism; and a receiving table to receive the processing object from the processing object storage part; a table moving mechanism having a moving rail for moving the receiving table to a transfer position; a first holding mechanism for holding the object to be processed to the processing table; and a transfer moving mechanism having a The transmission axis that moves the first holding mechanism between the receiving platform and the processing table at the transfer position is orthogonal to each other in plan view, so that the transmission axis and the moving track are orthogonal to each other in plan view. The receiving station has: a carry-in table for carrying in the object to be processed; and a carry-out table for carrying out the half-cut object to be processed, and removing the half-cut object to be processed from the processing workbench. The object is transported to the unloading table, and the half-cut object is stored in the object accommodating portion via the unloading table. The processing device according to claim 1, wherein the object storage portion and the first holding mechanism are provided on opposite sides to each other with respect to the transmission axis in plan view. The processing device as claimed in claim 1 or 2, further comprising a processing tool replacement mechanism for replacing the processing tools of the processing mechanism, The processing tool changing mechanism can be moved by the moving rail. The processing device according to Claim 1 or Claim 2, wherein the receiving station has a positioning mechanism for positioning the object to be processed. The processing device according to claim 1 or claim 2, including: a transfer table for moving the processed object; and a second holding mechanism for removing the processed object from the The processing table is transported to the transfer table and holds the processed object, and the second holding mechanism is configured to be movable along the transmission shaft. The processing apparatus according to claim 5, wherein the transfer table moves the fully-cut object to be processed, and the second holding mechanism holds the fully-cut object to be processed. The processing device according to claim 1 or claim 2, further comprising a processing moving mechanism, which moves the processing mechanism on the horizontal plane in the first direction along the transmission axis and in conjunction with the The first direction is orthogonal to the second direction and moves respectively. A method of manufacturing a processed product using the processing device according to any one of Claims 1 to 7, the manufacturing method of the processed product comprising: a loading step of loading a predetermined product from the loading table. The object to be processed is transported to the processing workbench to be cut in half; in a half-cutting step, the object to be processed is half-cut in the carrying step; an unloading step of unloading the processing object half-cut by the half-cutting step to the unloading table; and a storing step of unloading the processing object to the unloading table by the unloading step The object is stored in the processing object storage portion.

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