JP7496328B2 - Processing device and manufacturing method of processed products - Google Patents

Description

The present invention relates to a processing device and a method for manufacturing processed products.

Conventionally, as shown in Patent Document 1, a cutting system has been devised in which a semiconductor strip to be cut by a cutting device is supplied from an on-loader device to an inlet rail, and then transferred from the inlet rail to the cutting device, where it is cut into individual semiconductor packages.

However, in the above-mentioned cutting system, the on-loader device, the inlet rail, and the cutting device are arranged in a row along the X direction, which results in a large footprint for the cutting system.

JP 2007-536727 A

Therefore, the present invention was made to solve the above problems, and its main objective is to reduce the footprint of the processing equipment.

That is, the processing device according to the present invention includes a workpiece storage section that stores the workpiece, a processing table on which the workpiece is processed by a processing mechanism, a receiving stage that receives the workpiece from the workpiece storage section, a stage moving mechanism having a moving rail for moving the receiving stage to a transfer position, a first holding mechanism that holds the workpiece for transporting it to the processing table, and a transport moving mechanism having a transfer axis for moving the first holding mechanism between the receiving stage at the transfer position and the processing table, and the transfer axis and the moving rail are perpendicular to each other in a plan view.

The present invention configured in this way can reduce the footprint of the processing device.

1 is a diagram showing a schematic configuration of a cutting device according to an embodiment of the present invention; FIG. 2 is a perspective view showing a schematic diagram of a cutting table and its surrounding structure in the embodiment. 11 is a diagram (plan view) showing a schematic configuration of the cutting table and its peripheral structure in the embodiment as viewed from the Z direction. FIG. 13 is a diagram (front view) showing a schematic configuration of the cutting table and its peripheral structure in the embodiment as viewed from the Y direction. FIG. 13 is a diagram (front view) showing a schematic configuration of a first holding mechanism and a transport moving mechanism of the embodiment as viewed from the Y direction. FIG. 13 is a diagram (side view) showing a schematic configuration of a first holding mechanism and a transport moving mechanism of the embodiment when viewed from the X direction. FIG. 13 is a diagram (front view) showing a schematic configuration of a second holding mechanism and a transport moving mechanism of the embodiment as viewed from the Y direction. FIG. FIG. 2 is a cross-sectional view showing a schematic configuration of the rack and pinion mechanism of the embodiment. 5A to 5C are schematic diagrams illustrating the operation of the cutting device according to the embodiment. 11 is a diagram (plan view) showing a schematic configuration of the substrate supply mechanism of the embodiment as viewed from the Z direction. FIG. 4 is a view (front view) seen from the Y direction, which diagrammatically shows the configuration of the substrate supply mechanism of the embodiment. FIG. FIG. 2 is a cross-sectional view showing a schematic configuration of a loading stage according to the embodiment. 11 is a diagram (plan view) showing a schematic view of each position of the loading stage in the embodiment as viewed from the Z direction. FIG. 11 is a diagram (plan view) seen from the Z direction, which diagrammatically illustrates each position of the unloading stage in the embodiment. FIG. 13 is a diagram (plan view) showing a schematic configuration of the blade replacement mechanism of the embodiment as viewed from the Z direction. FIG. FIG. 2 is a cross-sectional view illustrating a schematic configuration of a cutting mechanism of the embodiment. 5A and 5B are cross-sectional views each showing a schematic state of a blade before and after removal by the blade replacement mechanism of the embodiment; 13 is a view (plan view) seen from the Z direction showing the replacement state of each blade by the blade replacement mechanism of the embodiment. FIG. 6 is a flowchart of a conveying operation for full cutting and a conveying operation for half cutting in the embodiment.

Next, the present invention will be described in more detail using examples. However, the present invention is not limited to the following description.

As described above, the processing apparatus of the present invention comprises a workpiece storage section for storing the workpiece, a processing table on which the workpiece is processed by a processing mechanism, a receiving stage for receiving the workpiece from the workpiece storage section, a stage moving mechanism having a moving rail for moving the receiving stage to a transport position, a first holding mechanism for holding the workpiece for transporting it to the processing table, and a transport moving mechanism having a transfer axis for moving the first holding mechanism between the receiving stage at the transport position and the processing table, wherein the transfer axis and the moving rail are perpendicular to each other when viewed in a plane.
With this processing device, the moving rail that moves the receiving stage and the transfer axis that moves the first holding mechanism are perpendicular to each other in a plan view, so that the processing object storage section and the processing table are not arranged in a horizontal row as in the conventional configuration, thereby reducing the footprint of the processing device.

Specifically, it is preferable that the workpiece accommodation portion and the first holding mechanism are provided on opposite sides to each other with respect to the transfer axis in a plan view.
With this configuration, a first holding mechanism is provided on one side of the transfer shaft, and a workpiece storage section is provided on the other side of the transfer shaft, so that the workpiece storage section can be provided without being restricted by the movement range of the first holding mechanism. Furthermore, the freedom in arranging the workpiece storage section is increased, and the footprint of the processing equipment can be reduced.

The processing device of the present invention preferably further includes a processing tool changing mechanism for changing the processing tool of the processing mechanism, and is configured so that the processing tool of the processing mechanism can be automatically changed.
In this configuration, in order to simplify the device configuration, it is desirable that the processing tool changing mechanism be movable by the moving rail.

It is preferable that the receiving stage has a positioning mechanism for positioning the workpiece.
By providing such a positioning mechanism, the workpiece can be positioned on the receiving stage at the transfer position, and the workpiece can be transferred reliably.

The receiving stage has an input stage for inputting the workpiece and an output stage for outputting the half-cut workpiece, and it is desirable that the processing apparatus of the present invention transports the half-cut workpiece from the processing table to the output stage and stores the half-cut workpiece in the workpiece storage section via the output stage.
With this configuration, the workpiece can be half-cut, and the half-cut workpiece can be accommodated in the workpiece accommodation section.

In addition, it is desirable that the processing apparatus of the present invention comprises a transfer table to which the object to be processed is transferred after processing, and a second holding mechanism for holding the object to be processed after processing in order to transport the object to be processed from the processing table to the transfer table, and that the second holding mechanism is configured to be movable along the transfer axis.
With this configuration, the first holding mechanism and the second holding mechanism share the transfer shaft, making it possible to simplify the device configuration.

In the processing device of the present invention, in order to enable the workpiece to be fully cut, it is desirable that the transfer table is a table to which the fully cut workpiece is transferred, and the second holding mechanism is a table that holds the fully cut workpiece.

It is preferable that the machining apparatus further include a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis on a horizontal plane and in a second direction perpendicular to the first direction.
With this configuration, the machining mechanism is moved by the machining movement mechanism in a first direction along the transfer axis on a horizontal plane and in a second direction perpendicular to the first direction, respectively, so that the workpiece can be machined without moving the machining table in the first and second directions. Therefore, the machining table is not moved by the ball screw mechanism, and a bellows member for protecting the ball screw mechanism and a cover member for protecting the bellows member are not required. As a result, the device configuration of the machining device can be simplified. In addition, since the machining table is configured not to move in the first and second directions on a horizontal plane, the movement space of the machining table and the wasted space around it can be reduced, and the footprint of the machining device can be reduced.

An aspect of the present invention is also a method for manufacturing processed products using the above-mentioned processing device.

Furthermore, the manufacturing method of a processed product for producing a half-cut product using the above-mentioned processing device is characterized by comprising a carrying-in process of carrying the object to be processed to be half-cut from the carrying-in stage to the processing table, a half-cut process of half-cutting the object to be processed carried in by the carrying-in process, an unloading process of carrying out the object to be processed that has been half-cut by the half-cut process to the unloading stage, and a storage process of storing the object to be processed that has been carried out to the unloading stage by the carrying-out process in the object storage section.

<One embodiment of the present invention>
Hereinafter, an embodiment of a processing apparatus according to the present invention will be described with reference to the drawings. Note that in all of the drawings shown below, for ease of understanding, some parts are omitted or exaggerated as appropriate and schematic drawings are shown. The same components are given the same reference numerals and the description thereof is omitted as appropriate.

<Overall configuration of processing device>
The processing apparatus 100 of the present embodiment is a cutting apparatus that cuts a sealed substrate W, which is an object to be processed, to separate the sealed substrate W into a plurality of products P, which are processed items.

Specifically, as shown in FIG. 1, the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, a first holding mechanism 3 that holds the sealed substrate W to transport it to the cutting tables 2A and 2B, a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, a transfer table 5 to which multiple products P are transferred, a second holding mechanism 6 that holds multiple products P to transport them from the cutting tables 2A and 2B to the transfer table 5, a transport moving mechanism 7 having a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6, and a cutting moving mechanism (processing moving mechanism) 8 that moves the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B.

Here, the encapsulated substrate W is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is molded with resin to encapsulate at least the electronic elements. The substrate constituting the encapsulated substrate W may be a lead frame or a printed wiring board, and other substrates such as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrate constituting the encapsulated substrate W may or may not be wired.

In the following description, the directions perpendicular to each other in a plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are referred to as the X and Y directions, respectively, and the vertical direction perpendicular to the X and Y directions is referred to as the Z direction. Specifically, the left-right direction in FIG. 1 is referred to as the X direction, and the up-down direction is referred to as the Y direction. As will be described later, the X direction is the direction in which the support 812 moves, and is also the direction perpendicular to the longitudinal direction (extension direction of the beam) of the beam section (beam section) that spans a pair of legs in the gate-shaped support 812 (see FIG. 2).

<Cutting table>
The two cutting tables 2A, 2B are fixed in the X, Y, and Z directions. The cutting table 2A can be rotated in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B can be rotated in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.

These two cutting tables 2A, 2B are arranged along the X direction on a horizontal plane. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are located on the same horizontal plane (same height in the Z direction) (see FIG. 4), and the centers of their upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A, 9B) are located on the same straight line extending in the X direction (see FIGS. 2 and 3).

The two cutting tables 2A, 2B are used to suction and hold the sealed substrate W, and as shown in FIG. 1, two vacuum pumps 10A, 10B for suction and holding are arranged in correspondence with the two cutting tables 2A, 2B. Each vacuum pump 10A, 10B is, for example, a water-sealed vacuum pump.

Here, because the cutting tables 2A, 2B are fixed in the XYZ directions, the piping (not shown) connecting the vacuum pumps 10A, 10B to the cutting tables 2A, 2B can be shortened, reducing pressure loss in the piping and preventing a decrease in suction power. As a result, even extremely small packages, for example, 1 mm square or less, can be reliably suctioned to the cutting tables 2A, 2B. In addition, because a decrease in suction power due to pressure loss in the piping can be prevented, the capacity of the vacuum pumps 10A, 10B can be reduced, leading to size reduction and cost reduction.

<First Retention Mechanism>
As shown in Fig. 1, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in Figs. 5 and 6, the first holding mechanism 3 has a suction head 31 provided with a plurality of suction parts 311 for suction-holding the sealed substrate W, and a vacuum pump (not shown) connected to the suction parts 311 of the suction head 31. The suction head 31 is moved to a desired position by a transport moving mechanism 7 (described later) or the like, thereby transporting the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.

As shown in FIG. 1, the substrate supply mechanism 11 has a substrate accommodation section 111 in which a plurality of sealed substrates W are accommodated from the outside, and a substrate supply section 112 that moves the sealed substrates W accommodated in the substrate accommodation section 111 to a holding position RP where the sealed substrates W are adsorbed and held by the first holding mechanism 3. This holding position RP is set to be aligned with the two cutting tables 2A and 2B in the X direction. The substrate supply mechanism 11 may have a substrate heating section 113 that heats the sealed substrates W adsorbed by the first holding mechanism 3 to make them soft and facilitate adsorption. The substrate accommodation section 111 corresponds to a processing object accommodation section. The substrate accommodation section 111 may be configured to directly accommodate a plurality of sealed substrates W as processing objects, or may be configured to accommodate a magazine that is a container that accommodates a plurality of sealed substrates W as processing objects. Other specific configurations of the substrate supply mechanism 11 will be described later.

<Cutting mechanism (processing mechanism)>
As shown in Figs. 1, 2 and 3, the cutting mechanism 4 has two rotating tools 40 consisting of blades 41A, 41B and two spindles 42A, 42B corresponding to processing tools. The two spindles 42A, 42B are provided so that their rotation axes are along the Y direction, and the blades 41A, 41B attached thereto are arranged to face each other (see Fig. 3). The blade 41A of the spindle 42A and the blade 41B of the spindle 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. In addition, the cutting device 100 of this embodiment is provided with a liquid supply mechanism 12 having an injection nozzle 121 that injects cutting water (machining liquid) to suppress frictional heat generated by the blades 41A, 41B, as shown in Figs. 3 and 4. The injection nozzle 121 is supported, for example, by a Z-direction moving part 83 described later.

<Transfer table>
As shown in FIG. 1, the transfer table 5 in this embodiment is a table to which a plurality of products P inspected by the inspection unit 13 described later is transferred. This transfer table 5 is a so-called index table, on which a plurality of products P are temporarily placed before being sorted into various trays 21. The transfer table 5 is arranged in a line along the X direction on a horizontal plane together with the two cutting tables 2A and 2B. Furthermore, the transfer table 5 can move back and forth along the Y direction and can move to the sorting mechanism 20. The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13.

The various trays 21 are transported to the desired position by a tray transport mechanism 22 that moves along the transfer shaft 71, and the products P to be sorted by the sorting mechanism 20 are placed on them. After sorting, the various trays 21 are stored in the tray storage section 23 by the tray transport mechanism 22. In this embodiment, the tray storage section 23 is configured to store three types of trays 21, such as trays 21 before storing products P, trays 21 storing good products P, and trays 21 storing defective products P that require rework (reinspection).

<Inspection Department>
1, the inspection unit 13 is provided between the cutting tables 2A, 2B and the transfer table 5, and inspects a plurality of products P held by the second holding mechanism 6. The inspection unit 13 in this embodiment has a first inspection unit 131 that inspects the sealing surface (package surface) of the product P, and a second inspection unit 132 that inspects the lead surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the package surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the lead surface. The first inspection unit 131 and the second inspection unit 132 may be a common unit.

In the present embodiment, the sealed substrate W and the product P are configured such that one surface of the substrate is resin-molded. In such a configuration, the resin-molded surface is the surface on which the electronic elements connected to the substrate are resin-molded, and is called the "sealing surface" or "package surface". On the other hand, the non-resin-molded surface opposite the resin-molded surface is called the lead surface because the leads that usually function as the external connection electrodes of the product are exposed. In the case where the leads are protruding electrodes used in electronic components such as BGA (Ball Grid Array), they may also be called the "ball surface". Furthermore, the non-resin-molded surface opposite the resin-molded surface may also be called the "substrate surface" because there are some configurations in which no leads are formed. In the description of this embodiment, the resin-molded surface is referred to as the "sealing surface" or "package surface", and the non-resin-molded surface opposite the resin-molded surface is referred to as the "lead surface".

In addition, an inversion mechanism 14 is provided to invert the multiple products P so that the inspection unit 13 can inspect both sides of the multiple products P (see FIG. 1). This inversion mechanism 14 has a holding table 141 that holds the multiple products P, and an inversion unit 142 such as a motor that inverts the holding table 141 so that the front and back are reversed.

When the second holding mechanism 6 holds multiple products P from the cutting tables 2A, 2B, the package surfaces of the products P face downward. In this state, while the multiple products P are being transported from the cutting tables 2A, 2B to the inversion mechanism 14, the package surfaces of the products P are inspected by the first inspection unit 131. The multiple products P held by the second holding mechanism 6 are then inverted by the inversion mechanism 14. In this state, the lead surfaces of the products P face downward, and the lead surfaces of the products P are inspected by moving the inversion mechanism 14 to the second inspection unit 132.

<Second Retention Mechanism>
As shown in Fig. 1, the second holding mechanism 6 holds a plurality of products P in order to transport the plurality of products P from the cutting tables 2A and 2B to the transfer table 5. As shown in Fig. 8, the second holding mechanism 6 has a suction head 61 provided with a plurality of suction sections 611 for suction-holding the plurality of products P, and a vacuum pump (not shown) connected to the suction sections 611 of the suction head 61. The suction head 61 is moved to a desired position by a transport moving mechanism 7 (described later) or the like, thereby transporting the plurality of products P from the cutting tables 2A and 2B to the holding table 141 or the transfer table 5.

<Transportation movement mechanism>
As shown in FIG. 1, the transport moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A, 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A, 2B and the holding table 141.

The transport movement mechanism 7, as shown in FIG. 1, extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, and has a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6.

The transfer shaft 71 is provided in a range that allows the first holding mechanism 3 to move above the substrate supply section 112 of the substrate supply mechanism 11, and allows the second holding mechanism 6 to move above the transfer table 5 (see FIG. 1). The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (near side) of the transfer shaft 71 in a plan view. In addition, the inspection section 13, the reversing mechanism 14, the various trays 21, the tray transport mechanism 22, the tray storage section 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described below, and the collection container 172 are also provided on the same side (near side) of the transfer shaft 71.

Furthermore, as shown in Figures 5, 6 and 8, the transport movement mechanism 7 has a main movement mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71, an elevation movement mechanism 73 that moves the first holding mechanism 3 and the second holding mechanism 6 up and down in the Z direction relative to the transfer shaft 71, and a horizontal movement mechanism 74 that moves the first holding mechanism 3 and the second holding mechanism 6 horizontally in the Y direction relative to the transfer shaft 71.

As shown in Figures 5 to 8, the main movement mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 that guides the first holding mechanism 3 and the second holding mechanism 6, and a rack and pinion mechanism 722 that moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

The guide rail 721 extends in a straight line in the X direction along the transfer shaft 71, and is provided in a range in which the first holding mechanism 3 can move above the substrate supply section 112 of the substrate supply mechanism 11, and the second holding mechanism 6 can move above the transfer table 5, just like the transfer shaft 71. A slide member 723 is slidably provided on this guide rail 721, on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a lifting mechanism 73 and a horizontal movement mechanism 74. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the lifting mechanism 73, the horizontal movement mechanism 74, and the slide member 723 are provided individually for each of the first holding mechanism 3 and the second holding mechanism 6.

The rack and pinion mechanism 722 has a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion gear 722b provided to each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). The cam rack 722a is provided on a common transfer shaft 71, and can be changed to various lengths by connecting multiple cam rack elements. The pinion gear 722b is provided on a slide member 723 and is a so-called roller pinion, and as shown in FIG. 7, has a pair of roller bodies 722b1 that rotate with the rotating shaft of the motor, and multiple roller pins 722b2 that are provided at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are provided to be able to roll on the roller body 722b1. The rack and pinion mechanism 722 of this embodiment uses the roller pinion described above, so two or more roller pins 722b2 come into contact with the cam rack 722a, which prevents backlash from occurring in the forward and reverse directions, improving positioning accuracy when moving the first holding mechanism 3 and second holding mechanism 6 in the X direction.

As shown in Figs. 5 and 8, the lifting and moving mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in Figs. 5 and 6, the lifting and moving mechanism 73 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and has a Z-direction guide rail 73a provided along the Z direction and an actuator unit 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. The actuator unit 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the lifting and moving mechanism 73 of the second holding mechanism 6 is the same as that of the lifting and moving mechanism 73 of the first holding mechanism 3, as shown in Fig. 8.

As shown in Figs. 5, 6 and 8, the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in Figs. 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, and has a Y-direction guide rail 74a provided along the Y direction, an elastic body 74b that applies a force to one side of the Y-direction guide rail 74a to the first holding mechanism 3, and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.

The horizontal movement mechanism 74 of the second holding mechanism 6 is configured similarly to the lifting movement mechanism 73 of the first holding mechanism 3, as shown in FIG. 8. The second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or neither the first holding mechanism 3 nor the second holding mechanism 6 may be provided with the horizontal movement mechanism 74. Furthermore, like the lifting movement mechanism 73, the horizontal movement mechanism 74 may not use the cam mechanism 74c, but may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.

<Cutting movement mechanism (processing movement mechanism)>
The cutting movement mechanism 8 linearly moves each of the two spindle portions 42A, 42B independently in the X direction, the Y direction, and the Z direction.

Specifically, as shown in Figures 2, 3, 9 and 10, the cutting movement mechanism 8 includes an X-direction movement unit 81 that moves the spindles 42A and 42B linearly in the X direction, a Y-direction movement unit 82 that moves the spindles 42A and 42B linearly in the Y direction, and a Z-direction movement unit 83 that moves the spindles 42A and 42B linearly in the Z direction.

The X-direction moving part 81 is common to the two cutting tables 2A and 2B, and as shown in particular in FIG. 2 and FIG. 3, has a pair of X-direction guide rails 811 arranged along the X direction between the two cutting tables 2A and 2B, and a support 812 that moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving part 82 and the Z-direction moving part 83. The pair of X-direction guide rails 811 are arranged on the sides of the two cutting tables 2A and 2B arranged along the X direction. The support 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and a beam part (beam part) that is bridged across the pair of legs, and the beam part extends in the Y direction.

The support 812 moves linearly back and forth along the X direction on a pair of X-direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. This ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 may be configured to move back and forth by another linear motion mechanism such as a linear motor.

As shown in FIG. 3, the Y-direction moving unit 82 has a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. The Y-direction slider 822 is driven by, for example, a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle units 42A and 42B. This allows the two spindle units 42A and 42B to move in the Y direction independently of each other. Alternatively, the Y-direction slider 822 may be configured to move back and forth by another linear motion mechanism using a ball screw mechanism.

As shown in Figures 2 to 4, the Z-direction moving unit 83 has a Z-direction guide rail 831 provided along the Z direction on each Y-direction slider 822, and a Z-direction slider 832 that moves along the Z-direction guide rail 831 and supports the spindle units 42A and 42B. In other words, the Z-direction moving unit 83 is provided corresponding to each spindle unit 42A and 42B. The Z-direction slider 832 is driven, for example, by an eccentric cam mechanism (not shown), and moves back and forth linearly on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 may be configured to move back and forth by another linear motion mechanism such as a ball screw mechanism.

As shown in Figures 1 and 4, the positional relationship between the cutting movement mechanism 8 and the transfer shaft 71 is such that the transfer shaft 71 is disposed above the cutting movement mechanism 8 and crosses the cutting movement mechanism 8. Specifically, the transfer shaft 71 is disposed above the support 812 and crosses the support 812, and the transfer shaft 71 and the support 812 are positioned perpendicular to each other in a plan view.

<Processing waste storage section>
As shown in FIG. 1, the cutting apparatus 100 of this embodiment further includes a processing waste storage section 17 for storing processing waste S such as scraps generated by cutting the sealed substrate W.

As shown in Figures 2 to 4, the processing debris storage section 17 is provided below the cutting tables 2A, 2B, and has a guide chute 171 with an upper opening 171X that surrounds the cutting tables 2A, 2B in a plan view, and a collection container 172 that collects processing debris S guided by the guide chute 171. By providing the processing debris storage section 17 below the cutting tables 2A, 2B, the collection rate of processing debris S can be improved.

The guide chute 171 guides the machining scraps S that have scattered or fallen from the cutting tables 2A, 2B to the collection container 172. In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A, 2B (see FIG. 3), making it difficult for the machining scraps S to be missed, and the collection rate of the machining scraps S can be further improved. In addition, the guide chute 171 is configured to surround the rotation mechanisms 9A, 9B provided below the cutting tables 2A, 2B (see FIG. 4), and is configured to protect the rotation mechanisms 9A, 9B from the machining scraps S and cutting water.

In this embodiment, the processing waste storage section 17 is common to the two cutting tables 2A and 2B, but it may be provided for each cutting table 2A and 2B.

The collection container 172 collects the processing scraps S that have passed through the guide chute 171 under their own weight, and in this embodiment, as shown in FIG. 4 etc., is provided for each of the two cutting tables 2A, 2B. The two collection containers 172 are arranged on the front side of the transfer shaft 71, and are configured so that they can be independently removed from the front side of the cutting device 100. This configuration improves the ease of maintenance, such as disposal of the processing scraps S. Note that the collection container 172 may be provided in one place under all the cutting tables, or may be divided into three or more, taking into consideration the size of the sealed substrate W, the size and amount of the processing scraps S, and workability.

As shown in FIG. 4 and other figures, the processing debris storage section 17 also has a separation section 173 that separates the cutting water from the processing debris. One possible configuration for this separation section 173 is to provide a filter such as a porous plate that allows the cutting water to pass through the bottom surface of the collection container 172. This separation section 173 allows the processing debris S to be collected without the cutting water accumulating in the collection container 172.

<First cleaning mechanism>
1 and 5, the cutting device 100 of the present invention further includes a first cleaning mechanism 18 for cleaning the upper surfaces (lead surfaces) of the multiple products P held on the cutting tables 2A and 2B. This first cleaning mechanism 18 cleans the upper surfaces of the products P by using an injection nozzle 18a (see FIG. 5) that injects cleaning liquid and/or compressed air onto the upper surfaces of the multiple products P held on the cutting tables 2A and 2B.

As shown in FIG. 5, the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71. Here, a lifting movement mechanism 181 for lifting and moving the first cleaning mechanism 18 up and down in the Z direction is provided between the first cleaning mechanism 18 and the slide member 723. This lifting movement mechanism 181 may be, for example, one that uses a rack and pinion mechanism, one that uses a ball screw mechanism, or one that uses an air cylinder.

<Second Cleaning Mechanism>
1, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the bottom surfaces (package surfaces) of the multiple products P held by the second holding mechanism 6. This second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and cleans the bottom surfaces of the multiple products P held by the second holding mechanism 6 by spraying cleaning liquid and/or compressed air onto the bottom surfaces of the multiple products P. In other words, the second cleaning mechanism 19 cleans the bottom surfaces of the products P while the second holding mechanism 6 is moving along the transfer shaft 71.

<Example of the operation of the cutting device>
Next, an example of the operation of the cutting apparatus 100 will be described. Fig. 9 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 in the operation of the cutting apparatus 10. In this embodiment, all operations and controls of the operation of the cutting apparatus 100, such as transporting the sealed substrate W, cutting the sealed substrate W, inspecting the product P, replacing the blade described later, and dressing, are performed by the controller CTL (see Fig. 1).

The substrate supply section 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation section 111 toward the holding position RP held by the first holding mechanism 3.

Next, the transport movement mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 adsorbs and holds the sealed substrate W. Thereafter, the transport movement mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the adsorption and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the main movement mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal movement mechanism 74 adjusts the position of the sealed substrate W in the Y direction. Then, the cutting tables 2A and 2B adsorb and hold the sealed substrate W.

When the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting and moving mechanism 73 raises the first holding mechanism 3 to a position where it does not physically interfere with the cutting moving mechanism 8 (support 812). Note that when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, if the support 812 is retreated from the cutting table 2B to the transfer table 5 side, there is no need to raise and lower the first holding mechanism 3 as described above.

In this state, the cutting movement mechanism 8 sequentially moves the two spindle parts 42A, 42B in the X direction and Y direction, while the cutting tables 2A, 2B rotate, cutting the sealed substrate W into individual pieces in a lattice pattern.

After cutting, the transport movement mechanism 7 moves the first cleaning mechanism 18 to clean the top surfaces (lead surfaces) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transport movement mechanism 7 retreats the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

Next, the transport movement mechanism 7 moves the second holding mechanism 6 to the post-cutting cutting tables 2A, 2B, and the second holding mechanism 6 suctions and holds the multiple products P. After that, the transport movement mechanism 7 moves the second holding mechanism 6 holding the multiple products P to the second cleaning mechanism 19. This causes the second cleaning mechanism 19 to clean the underside (package surface) of the multiple products P held by the second holding mechanism 6.

After cleaning, the multiple products P held by the second holding mechanism 6 are inspected on both sides by the inspection unit 13 and the inversion mechanism 14. Thereafter, the transport movement mechanism 7 moves the second holding mechanism 6 to the transfer table 5, which then releases the suction hold and places the multiple products P on the transfer table 5. The multiple products P placed on the transfer table 5 are sorted by the sorting mechanism 20 into various trays 21 according to the inspection results (good products, defective products, etc.) by the inspection unit 13.

For double-sided inspection, for example, first, one side of the product P is inspected while it is held by suction with the second holding mechanism 6. Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the inversion mechanism 14, and the other side of the product P is inspected while it is held by suction with the holding table 141 after inversion, thereby performing double-sided inspection. The product P can then be transported from the inversion mechanism 14 to the transfer table 5 by transferring it from the holding table 141 to the second holding mechanism 6. In addition, the holding table 141 can be configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 can be configured to be movable in the Z direction, and the product P can be transported and transferred to the transfer table 5 by moving the holding table 141 above the transfer table 5.

<Specific Configuration of Substrate Supply Mechanism>
The detailed configuration of the substrate supply mechanism 11 will be described below.

As described above, the substrate supply mechanism 11 supplies sealed substrates W to the first holding mechanism 3. Specifically, as shown in Figures 1, 10 and 11, the substrate supply mechanism 11 has a substrate accommodation section 111 in which a plurality of sealed substrates W are accommodated from the outside, and a substrate supply section 112 that moves the sealed substrates W accommodated in the substrate accommodation section 111 to a holding position RP where the sealed substrates W are adsorbed and held by the first holding mechanism 3.

As shown in Figures 10 and 11, the substrate accommodation section 111 is provided with a push-out mechanism 114 that pushes out a portion of the accommodated sealed substrate W to the outside of the substrate accommodation section 111. This push-out mechanism 114 has a movable push member 114a that pushes one end of the sealed substrate W, and an actuator section 114b that moves the push member 114a. The actuator section 114b may be one that uses a motor, an air cylinder, or a solenoid, for example.

As shown in Figures 10 and 11, the substrate supply unit 112 includes a receiving stage 115 that receives the sealed substrate W from the substrate accommodation unit 111, a substrate movement unit 116 that moves the sealed substrate W from the substrate accommodation unit 111 to the receiving stage 115, and a stage movement mechanism 117 that moves the receiving stage 115 to a predetermined transport position X2.

As shown in FIG. 10, the receiving stage 115 of this embodiment is configured not only to receive the sealed substrate W from the substrate accommodation unit 111, but also to transfer the sealed substrate W to the substrate accommodation unit 111. Specifically, the receiving stage 115 has an input stage 115A that receives the sealed substrate W from the substrate accommodation unit 111, and an output stage 115B that transfers the sealed substrate W to the substrate accommodation unit 111. The input stage 115A is an adsorption stage that can adsorb and hold the sealed substrate W placed thereon. The output stage 115B of this embodiment transfers the half-cut sealed substrate W. The half-cut is a process in which a groove is formed by cutting a part of the top surface (lead surface) of the sealed substrate W.

As shown in Figs. 11 and 12, the sealed substrate W placed on the loading stage 115A is heated by the substrate heating unit 113 while being pressed against the upper surface of the loading stage 115A from above. For this reason, the loading stage 115A is provided with a sheet-like cushioning material 115x that absorbs the impact when heated by the substrate heating unit 113.

The loading stage 115A is provided with a positioning mechanism 118 for positioning the sealed substrate W, as shown in FIG. 12. The positioning mechanism 118 is configured such that one of the pair of side walls 115m, 115n of the loading stage 115A, the side wall 115m, is movable relative to the other side wall 115n, and the sealed substrate W abuts against the other side wall 115n by closing the gap between the pair of side walls 115m, 115n, and is positioned based on the inner surface of the other side wall 115n. In this embodiment, the one side wall 115m is movable by the actuator 115j, and the other side wall 115n is movable by the actuator 115k. When the sealed substrate W is heated by the substrate heating unit 113, the side walls 115m, 115n are retracted by the actuators 115j, 115k so as not to interfere with each other.

As shown in FIG. 11, the substrate moving unit 116 has a clip portion 116a that clamps the end of the sealed substrate W, an X-direction moving unit 116b that moves the clip portion 116a in the X-direction, and a Z-direction moving unit 116c that moves the clip portion 116a in the Z-direction.

The procedure for transferring the sealed substrate W from the substrate accommodation unit 111 to the receiving stage 115 (the carry-in stage 115A and the carry-out stage 115B) using the push-out mechanism 114 and the substrate moving unit 116 is as follows.
The sealed substrate W accommodated in the substrate accommodation unit 111 is pushed by the push member 114a of the push-out mechanism 114, and a portion of the sealed substrate W is pushed out from the substrate accommodation unit 111 toward the loading stage 115A. Then, the portion of the sealed substrate W that has left the substrate accommodation unit 111 is clamped by the clip portion 116a of the substrate movement unit 116, and the clip portion 116a is moved in the X direction by the X-direction movement unit 116b, so that the sealed substrate W is pulled out of the substrate accommodation unit 111 and placed on the loading stage 115A.

As shown in Figs. 10 and 11, the stage movement mechanism 117 has a pair of moving rails 117a for moving the receiving stage 115 (loading stage 115A and unloading stage 115B), and a slide member 117b that moves along the moving rails 117a and on which the receiving stage 115 is mounted. The slide member 117b moves linearly back and forth along the Y direction on the pair of moving rails 117a by, for example, a ball screw mechanism 117c extending in the Y direction. This ball screw mechanism 117c is driven by a drive source (not shown) such as a servo motor. Alternatively, the slide member 117b may be configured to move back and forth by another linear motion mechanism such as a linear motor.

The moving rail 117a is located below the transfer shaft 71, and the moving rail 117a and the transfer shaft 71 of the conveying moving mechanism 7 are perpendicular to each other in a plan view. In this embodiment, the transfer shaft 71 extends in the X direction, and the moving rail 117a extends in the Y direction. Note that "perpendicular to each other in a plan view" includes not only the transfer shaft 71 and the moving rail 117a intersecting perpendicularly (90°) but also being substantially perpendicular. "Substantially perpendicular" means that the two intersect with a slight error from perpendicular, for example, at an angle of 85° to 95°.

In addition, since the moving rail 117a is perpendicular to the transfer shaft 71, the moving rail 117a is perpendicular to the X-direction guide rail 811 that moves the support 812 of the cutting movement mechanism 8. In other words, the moving rail 117a is parallel to the support 812 of the cutting movement mechanism 8 in a plan view.

Here, regarding the surrounding structure of the transfer shaft 71 and the moving rail 117a, the substrate accommodating section 111 and the first holding mechanism 3 are provided on opposite sides of the transfer shaft 71. Specifically, the substrate accommodating section 111 is provided on the rear side of the transfer shaft 71 in the Y direction, and the first holding mechanism 3 is provided on the front side of the transfer shaft 71 in the Y direction.

The stage movement mechanism 117, as shown in FIG. 13, moves the loading stage 115A linearly between a receiving position X1 where the sealed substrate W is received from the substrate accommodation section 111, and a transport position X2 where the sealed substrate W is held by the first holding mechanism 3. The receiving position X1 is located further back in the Y-axis direction than the transfer shaft 71, and the transport position X2 is located further forward in the Y-axis direction than the transfer shaft 71. The sealed substrate W on the receiving stage 115 (loading stage 115A) at the transport position X2 is positioned at the holding position RP.

The stage movement mechanism 117 also moves the loading stage 115A to a heating position X3 where the sealed substrate W placed thereon is heated by the substrate heating unit 113 (see FIG. 13). In this embodiment, the heating position X3 is set further back in the Y direction than the receiving position X1. At this heating position X3, the substrate heating unit 113 contacts the top surface of the sealed substrate W placed on the loading stage 115A to heat the sealed substrate W.

Furthermore, as shown in FIG. 14, the stage moving mechanism 117 moves the unloading stage 115B to the transport position X2. At this position, the half-cut sealed substrate W is transported to the unloading stage 115B by the first holding mechanism 3. The stage moving mechanism 117 also moves the unloading stage 115B to the receiving position X1. At this position, the sealed substrate W is accommodated in the substrate accommodation section 111 from the unloading stage 115B by the substrate moving section 116. Note that the half-cut sealed substrate W is accommodated in the receiving position X1, but a separate accommodation position for accommodating the sealed substrate W may be set and the sealed substrate W may be accommodated in the substrate accommodation section 111 at that accommodation position.

<Blade replacement mechanism>
As shown in Fig. 10 and Fig. 15, the cutting device 100 of this embodiment has a blade changing mechanism 24 that automatically changes the blades 41A and 41B. Specifically, in this embodiment, the blade changing mechanism 24 can change the blades 41A and 41B from each of the two spindles 42A and 42B. The blade changing mechanism 24 holds the removed blades 41A and 41B, stores the blades 41A and 41B in the blade storage section 25, and holds new blades 41A and 41B, transports them to the spindles 42A and 42B, and attaches them. The blade changing mechanism 24 corresponds to a processing tool changing mechanism.

The cutting mechanism 4 is configured as follows. As shown in FIG. 16, the cutting mechanism 4 has blades 41A and 41B, spindles 42A and 42B for rotating the blades 41A and 41B, and a pair of flanges 43 and 44 for removably fixing the blades 41A and 41B to the spindles 42A and 42B. The pair of flanges 43 and 44 is composed of an inner flange 43 that is fixed to the spindles 42A and 42B and is closer to the spindles 42A and 42B, and an outer flange 44 that is removably attached to the spindles 42A and 42B and is farther from the spindles 42A and 42B. The outer flange 44 is fixed by a detachable member 45 such as a nut while attached to the central shaft of the inner flange 43. The detachable member 45 allows the blades 41A and 41B to be detached from the spindles 42A and 42B.

As shown in Figures 10 and 15, the blade replacement mechanism 24 includes a suction arm 241 that suctions the blades 41A, 41B and the outer flange 44, and an arm movement mechanism 242 that moves the suction arm 241 relative to the cutting mechanism 4. The arm movement mechanism 242 corresponds to a holder movement mechanism.

As shown in FIG. 17, the suction arm 241 has a first suction portion 241a that suctions one surface (surface on the outer flange 44 side) of the blades 41A and 41B, and a second suction portion 241b that is located inside the first suction portion 241a and suctions the outer surface of the outer flange 44 (surface opposite to the inner flange 43). Furthermore, the suction arm 241 has a detachable member rotating portion 241c that is located inside the second suction portion 241b and engages with the detachable member 45 (here, a nut) of the spindle portion 42A and 42B to detach the detachable member 45. The first suction portion 241a and the second suction portion 241b are connected to a suction pump (not shown) provided outside the suction arm 241. The detachable member rotating portion 241c is configured using a rotation mechanism (not shown), such as a motor, that rotates the detachable member 45.

As shown in FIG. 15, the arm movement mechanism 242 includes a Y-direction movement mechanism 242a that moves the suction arm 241 in the Y direction, and an X-direction movement mechanism 242b that moves the suction arm 241 in the X direction. The arm movement mechanism 242 may also include a mechanism that moves the suction arm 241 in the Z direction.

The Y-direction movement mechanism 242a is configured using the movement rail 117a of the stage movement mechanism 117 described above, and has a Y-direction slider 242a1 that slides along the movement rail 117a. The Y-direction slider 242a1 is driven by, for example, a linear motor, and moves linearly back and forth on the movement rail 117a. Note that the Y-direction slider 242a1 may also be configured to move back and forth by another linear motion mechanism using a ball screw mechanism.

The X-direction movement mechanism 242b has an X-direction guide rail 242b2 provided along the X-direction on the Y-direction slider 242a1, and an X-direction slider 242b1 that moves along the X-direction guide rail 242b2. The X-direction slider 242b1 is driven by, for example, a linear motor, and moves linearly back and forth on the X-direction guide rail 242b2. The X-direction slider 242b1 may also be configured to move back and forth by another linear motion mechanism using a ball screw mechanism.

By configuring the blade changing mechanism 24 in this way, the movement direction of the blade changing mechanism 24 (direction along the moving rail 117a) and the movement direction of the support 812 in the processing moving mechanism 83 (direction along the X-direction guide rail 811) are perpendicular to each other in a plan view. In other words, the suction arm 241 of the blade changing mechanism 24 moves along the longitudinal direction of the support 812. Note that "perpendicular to each other in a plan view" includes not only the moving rail 117a and the X-direction guide rail 811 intersecting perpendicularly (90°) but also substantially perpendicularly. "Substantially perpendicular" means that they intersect with a slight error from perpendicular, for example, they intersect at an angle of 85° to 95°.

When replacing the blades 41A and 41B, as shown in FIG. 18, the processing movement mechanism 83 moves the cutting mechanism 4 to a predetermined replacement position. Specifically, the X-direction movement unit 81 moves the support 812 to the moving rail 117a side (the blade replacement mechanism 24 side) to move the cutting mechanism 4 to the predetermined replacement position. The blade replacement mechanism 24 moves along the moving rail 117a and removes the blades 41A and 41B of the cutting mechanism 4 at the replacement position. The blade replacement mechanism 24 stores the removed blades 41A and 41B in the blade storage unit 25, takes out new blades 41A and 41B, and attaches them to the cutting mechanism 4 at the replacement position. When replacing the blades 41A and 41B of the two cutting mechanisms 4, the suction arm 241 is rotated 180 degrees by a rotation mechanism (not shown) to perform the same operation. When the blade replacement mechanism 24 moves along the moving rail 117a, the slide member 117b on which the receiving stage 115 is provided is retracted to a position that does not interfere with the movement of the blade replacement mechanism 24. Conversely, when the slide member 117b on which the receiving stage 115 is provided moves along the moving rail 117a, the blade replacement mechanism 24 is retracted to a position that does not interfere with the movement of the slide member 117b.

As shown in FIG. 10, the cutting device 100 of this embodiment has a dressing member storage section 26 that stores a dressing member DP for dressing the blades 41A and 41B, and a dressing table 27 on which the dressing member DP is placed to dress the blades 41A and 41B.

The dressing member storage section 26 stores the new dressing member DP and the old dressing member DP. In this embodiment, the dressing member storage section 26 is provided on the moving rail 117a, and more specifically, on the Y-direction slider 242a1 that moves on the moving rail 117a.

The dressing table 27 in this embodiment is provided between the two cutting tables 2A and 2B. The dressing member DP is transported to this dressing table 27 by the first holding mechanism 3 and the transport moving mechanism 7. The dressing table then adsorbs and holds the transported dressing member DP. The first holding mechanism 3 is provided with an adsorption section (not shown) for adsorbing and holding the dressing member DP. With the dressing member DP held on the dressing table 27, the cutting moving mechanism 8 moves the cutting mechanism 4 to the dressing table 27, and the blades 41A and 41B of the cutting mechanism 4 are dressed.

Next, the case of full cutting (dicing) and half cutting (groove processing) of the sealed substrate W will be described with reference to FIG. 19. Note that full cutting is a process in which the sealed substrate W is cut into individual pieces.

(1) Full Cut (Individualization) (See FIG. 19(a))
The sealed substrate in the substrate accommodation unit 111 is delivered to the loading stage 115 A of the receiving stage 115 by using the pushing mechanism 114 and the substrate moving unit 116 .

The loading stage 115A is moved to the transfer position by the stage moving mechanism 117, and the sealed substrate W is held by the first holding mechanism 3 and transferred to the cutting tables 2A and 2B (loading process).

Then, the sealed substrate W is fully cut (cut) into individual pieces using cutting tables 2A and 2B (full cut process).

The second transport mechanism 6 holds the product P and transports it to the holding stage 141 or the transfer stage 5 of the inspection unit 14 (unloading process). The subsequent operations are as described above in <An example of the operation of the cutting device>.

(2) In the case of half-cutting (grooving) (see FIG. 19(b))
The sealed substrate W to be half-cut in the substrate accommodation section 111 is transferred to the loading stage 115 A of the receiving stage 115 by using the pushing mechanism 114 and the substrate moving section 116 .

The loading stage 115A is moved to the transfer position X2, and the sealed substrate W is held by the first holding mechanism 3 and transferred to the cutting tables 2A and 2B (loading process).

Then, the sealed substrate W is half-cut (groove-machined) using cutting tables 2A and 2B (half-cut process).

The first holding mechanism 3 holds the half-cut sealed substrate W and transports it to the unloading stage 115B located at the transport position X2 (unloading process).

The unloading stage 115B, to which the half-cut sealed substrate W has been transferred, is moved to a storage position (receiving position X1) by the stage moving mechanism 117. Then, the substrate moving unit 116 stores the half-cut sealed substrate W in the substrate storage unit 111 (storage process).

<Effects of this embodiment>
According to the cutting device 100 of this embodiment, the moving rail 117a that moves the receiving stage 115 and the transfer axis 71 that moves the first holding mechanism 3 are perpendicular to each other in a planar view, so that the substrate accommodating section 111 and the cutting tables 2A, 2B are not arranged in a horizontal row as in the conventional configuration, and therefore the footprint of the cutting device 100 can be reduced.

In addition, since the first holding mechanism 3 is provided on one side of the transfer shaft 71 and the substrate accommodating section 111 is provided on the other side of the transfer shaft 71, the substrate accommodating section 111 can be provided without being restricted by the movement range of the first holding mechanism 3, and the freedom of positioning of the substrate accommodating section 111 is increased, allowing the footprint of the cutting device 100 to be reduced.

In addition, in this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A, 2B and the transfer table 5, and the cutting mechanism 4 is moved by the cutting movement mechanism 8 in the X direction along the transfer shaft 71 in a horizontal plane and in the Y direction perpendicular to the X direction, so that the sealed substrate W can be processed without moving the cutting tables 2A, 2B in the X direction and the Y direction. Therefore, the cutting tables 2A, 2B do not need to be moved by the ball screw mechanism, and a bellows member for protecting the ball screw mechanism and a cover member for protecting the bellows member are not required. As a result, the device configuration of the cutting device 100 can be simplified. In addition, the cutting tables 2A, 2B can be configured not to move in the X direction and the Y direction, and the footprint of the cutting device 100 can be reduced.

<Other Modified Embodiments>
The present invention is not limited to the above-described embodiment.

For example, in the above embodiment, the blade replacement mechanism 24 is movable along the moving rail 117a of the stage moving mechanism 117, but it may be configured to be movable along a separate rail.

The cutting device 100 in the above embodiment performs both full cut and half cut operations, but it may perform only full cut operations. In this case, the receiving stage 115 may be only the loading stage 115A. It may also perform only half cut operations. In this case, a configuration for transporting the product P, such as the second holding mechanism 6, is not required.

In the above embodiment, a cutting device with a twin cut table system and a twin spindle configuration has been described, but the present invention is not limited to this, and may be a cutting device with a single cut table system and a single spindle configuration, or a cutting device with a single cut table system and a twin spindle configuration.

In addition, the transfer table 5 in the above embodiment was an index table on which the items were temporarily placed before being sorted into the various trays 21, but the transfer table 5 may also be the holding table 141 of the inversion mechanism 14.

In addition, in the above embodiment, the product P is sorted from the transfer table 5 to the tray 21, but the product P may be transported and attached to an adhesive tape placed inside the frame-shaped member.

In addition, since the cam rack elements that make up the transfer shaft 71 can be configured by connecting multiple elements, for example, the cutting device (processing device) 100 can be configured as a module that can be separated and connected (detached) between the second cleaning mechanism 19 and the inspection unit 13. In this case, for example, a module that performs a type of inspection different from the inspection at the inspection unit 13 can be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Note that in addition to the configurations exemplified here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detached) anywhere, and the added module may be a module with various functions other than inspection.

The processing device of the present invention may also perform processing other than cutting, for example, other mechanical processing such as cutting and grinding.

It goes without saying that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the invention.

100...Cutting device (processing device)
W: Sealed substrate (object to be processed)
P: Product (processed product)
2A, 2B...Cutting table (processing table)
3: First holding mechanism 4: Cutting mechanism (processing mechanism)
5: Transfer table 6: Second holding mechanism 7: Conveying moving mechanism 71: Transfer shaft 8: Cutting moving mechanism (processing moving mechanism)
111...Substrate accommodation section (processing object accommodation section)
115: Receiving stage 115A: Loading stage 115B: Unloading stage 117a: Moving rail 117: Stage moving mechanism 118: Positioning mechanism 24: Blade replacement mechanism (processing tool replacement mechanism)

Claims (9)

a processing object accommodation section for accommodating the processing object;
a processing table on which the object is processed by a processing mechanism;
a receiving stage for receiving the workpiece from the workpiece accommodation unit;
a stage moving mechanism having a moving rail for moving the receiving stage to a transfer position;
a first holding mechanism that holds the workpiece for transport to the processing table;
a transfer mechanism having a transfer shaft for moving the first holding mechanism between the receiving stage at the transfer position and the processing table,
The transfer shaft and the moving rail are perpendicular to each other in a plan view,
The processing apparatus , wherein the workpiece accommodation section and the first holding mechanism are provided on opposite sides of the transfer axis in a plan view . a processing object accommodation section for accommodating the processing object;
a processing table on which the object is processed by a processing mechanism;
a receiving stage for receiving the workpiece from the workpiece accommodation unit;
a stage moving mechanism having a moving rail for moving the receiving stage to a transfer position;
a first holding mechanism that holds the workpiece for transport to the processing table;
a transfer mechanism having a transfer shaft for moving the first holding mechanism between the receiving stage at the transfer position and the processing table;
a processing tool exchange mechanism for exchanging a processing tool of the processing mechanism,
The transfer shaft and the moving rail are perpendicular to each other in a plan view,
The processing tool exchange mechanism is movable by the moving rail . a processing object accommodation section for accommodating the processing object;
a processing table on which the object is processed by a processing mechanism;
a receiving stage for receiving the workpiece from the workpiece accommodation unit;
a stage moving mechanism having a moving rail for moving the receiving stage to a transfer position;
a first holding mechanism that holds the workpiece for transport to the processing table;
a transfer mechanism having a transfer shaft for moving the first holding mechanism between the receiving stage at the transfer position and the processing table,
The transfer shaft and the moving rail are perpendicular to each other in a plan view,
the receiving stage has a carry-in stage for carrying in the workpiece and a carry-out stage for carrying out the half-cut workpiece,
a processing apparatus that transports the half-cut workpiece from the processing table to the unloading stage, and accommodates the half-cut workpiece in the workpiece accommodation section via the unloading stage. a processing object accommodation section for accommodating the processing object;
a processing table on which the object is processed by a processing mechanism;
a receiving stage for receiving the workpiece from the workpiece accommodation unit;
a stage moving mechanism having a moving rail for moving the receiving stage to a transfer position;
a first holding mechanism that holds the workpiece for transport to the processing table;
a transfer mechanism having a transfer shaft for moving the first holding mechanism between the receiving stage at the transfer position and the processing table;
a transfer table to which the processed object is transferred after processing;
a second holding mechanism that holds the processed object in order to transport the processed object from the processing table to the transfer table,
The transfer shaft and the moving rail are perpendicular to each other in a plan view,
The second holding mechanism is configured to be movable along the transfer axis. the transfer table is a table onto which the fully cut workpiece is transferred,
The processing apparatus according to claim 4 , wherein the second holding mechanism holds the workpiece that has been fully cut. The processing apparatus according to claim 1 , wherein the receiving stage has a positioning mechanism for positioning the workpiece. The processing apparatus according to claim 1 , further comprising a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and in a second direction perpendicular to the first direction on a horizontal plane. A method for manufacturing a processed product, comprising the steps of: manufacturing a processed product by using the processing apparatus according to any one of claims 1 to 7 ; A method for manufacturing a processed product using the processing apparatus according to claim 3 ,
a carrying step of carrying the object to be half-cut from the carrying stage to the processing table;
a half-cutting step of half-cutting the object carried in by the carrying-in step;
a carrying-out step of carrying out the workpiece half-cut in the half-cutting step to the carrying-out stage;
and a accommodating step of accommodating the workpiece that has been carried out to the carrying-out stage by the carrying-out step in the workpiece accommodating section.