JP7430154B2 - Processing equipment and method for manufacturing processed products - Google Patents

Description

The present invention relates to a processing device and a method for manufacturing a processed product.

Conventionally, as shown in Patent Document 1, a cutting system is provided with a tray picker that unloads a tray on which a package is mounted and loads a new tray. This tray picker is configured so that each of a plurality of trays can be moved horizontally and vertically independently by separate rows of picker drive members.

However, in the above cutting system, each of the plurality of trays is configured to be independently moved horizontally and vertically by a separate row of picker drive members, resulting in a large footprint of the cutting system.

Special Publication No. 2007-536727

The present invention has been made to solve the above-mentioned problems, and its main objective is to reduce the footprint of a processing device.

That is, the processing apparatus according to the present invention includes a processing mechanism that processes a workpiece, a sorting mechanism that sorts the processed workpiece into a plurality of trays, and a tray movement mechanism that moves the tray, The mechanism has three or more tray placement parts on which the trays are placed, and the three or more tray placement parts are arranged in a row and are arranged independently from each other along the direction of the row. It is characterized in that it is configured to be movable to a sorting position by the sorting mechanism.

According to the present invention configured in this way, the footprint of the processing device can be reduced.

1 is a diagram schematically showing the configuration of a cutting device according to an embodiment of the present invention. FIG. 2 is a perspective view schematically showing a cutting table and its peripheral structure according to the same embodiment. It is a figure (plan view) seen from the Z direction showing typically the composition of the cutting table of the same embodiment, and its peripheral structure. FIG. 2 is a view (front view) schematically showing the configuration of the cutting table and its peripheral structure according to the same embodiment as viewed from the Y direction. FIG. 3 is a diagram (front view) schematically showing the configuration of the first holding mechanism and the conveyance moving mechanism of the same embodiment as seen from the Y direction. FIG. 3 is a view (side view) schematically showing the configuration of the first holding mechanism and the conveyance moving mechanism of the same embodiment as seen from the X direction. FIG. 6 is a diagram (front view) schematically showing the configuration of the second holding mechanism and the conveyance moving mechanism of the same embodiment as seen from the Y direction. FIG. 3 is a cross-sectional view schematically showing the configuration of the rack and pinion mechanism of the same embodiment. It is a schematic diagram which shows the operation|movement of the cutting device of the same embodiment. FIG. 3 is a diagram (plan view) schematically showing the configuration of the tray conveyance mechanism and tray movement mechanism of the same embodiment as seen from the Z direction. FIG. 3 is a diagram (plan view) schematically showing the configuration of the tray moving mechanism of the same embodiment as seen from the Z direction. It is a perspective view which shows typically the state in which each tray of the same embodiment is in a sorting position, a storage position, and a retreat position. FIG. 7 is a cross-sectional view schematically showing height positions H1 and H2 of the second tray placement part of the same embodiment. FIG. 7 is a cross-sectional view schematically showing height positions H1 and H2 of the third tray placement part of the same embodiment. It is a perspective view which shows typically the state when the 1st tray mounting part and the 2nd tray mounting part of the same embodiment pass each other. FIG. 3 is a cross-sectional view schematically showing a state when the first tray mounting section and the second tray mounting section of the same embodiment pass each other. It is a perspective view which shows typically the state when the 2nd tray mounting part and the 3rd tray mounting part of the same embodiment pass each other. FIG. 7 is a cross-sectional view schematically showing a state when the second tray mounting section and the third tray mounting section of the same embodiment pass each other. It is a perspective view which shows typically the state when the 1st tray mounting part and the 3rd tray mounting part of the same embodiment pass each other. FIG. 3 is a cross-sectional view schematically showing a state when the first tray mounting section and the third tray mounting section of the same embodiment pass each other.

Next, the present invention will be explained in more detail by giving examples. However, the present invention is not limited by the following explanation.

As described above, the processing apparatus of the present invention includes a processing mechanism for processing a workpiece, a sorting mechanism for sorting the processed workpiece into a plurality of trays, and a tray movement mechanism for moving the tray, The tray moving mechanism has three or more tray placement parts on which the trays are placed, and the three or more tray placement parts are arranged in a row and are independent of each other along the direction of the row. It is characterized in that it is configured to be movable to a sorting position by the sorting mechanism.
With this processing device, three or more tray mounting units are arranged in a line and are configured to be movable independently from each other along the direction of the line to the sorting position by the sorting mechanism. The footprint of processing equipment can be reduced. In addition, since three or more tray placement units are arranged in a row, the distance to each tray is the same when sorting processed workpieces, and the transportation time when sorting into each tray is the same. can improve productivity.

In order to prevent three or more tray placement units from interfering with each other when they move independently, the tray moving mechanism adjusts the height position of at least one of the three or more tray placement units. It is desirable to have a height position changing section.

In order to be able to accurately place processed workpieces on each tray by the sorting mechanism while preventing three or more tray placement units from interfering with each other when they move independently, the above-mentioned steps are required. The height position changing unit moves the tray placement unit up and down between a raised position at a height at the sorting position and a lowered position at a height that does not interfere with other tray placement units. is desirable.

The processing apparatus of the present invention further includes a tray accommodating section that accommodates the tray. In this configuration, it is preferable that the tray moving mechanism moves the three or more tray placement units between the sorting position and a storage position for storing the trays in the tray storage unit.

In order to automatically transport the tray from the tray accommodating section to the tray mounting section and from the tray mounting section to the tray accommodating section, the processing apparatus of the present invention requires It is desirable that the apparatus further include a tray transport mechanism that transports the tray between the tray mounting sections located at different positions.

As a specific embodiment of the tray moving mechanism, the tray moving mechanism has a first moving rail and a second moving rail that are provided parallel to each other, and the first moving rail has two moving rails. The two tray mounting sections are provided movably so as not to interfere with each other, and one tray mounting section is provided on the second moving rail and one tray mounting section is provided on the first moving rail. It is desirable that it be movable so as not to interfere with the

Further, a method for manufacturing a processed product using the above processing apparatus is also an embodiment of the present invention.

<One embodiment of the present invention>
EMBODIMENT OF THE INVENTION Below, one Embodiment of the processing apparatus based on this invention is described with reference to drawings. It should be noted that all the figures shown below are schematically drawn with appropriate omissions or exaggerations in order to make it easier to understand. Identical components will be designated by the same reference numerals and descriptions will be omitted as appropriate.

<Overall configuration of processing equipment>
The processing apparatus 100 of this embodiment is a cutting apparatus that separates a sealed substrate W, which is an object to be processed, into a plurality of products P, which are processed products.

Specifically, as shown in FIG. 1, the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold a sealed substrate W, and a cutting table 2A and 2B that holds a sealed substrate W. A first holding mechanism 3 that holds the sealed substrate W for transportation, a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products P. a transfer table 5 to which a plurality of products are transferred, a second holding mechanism 6 that holds a plurality of products P in order to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, a first holding mechanism 3 and A transportation moving mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 7 for moving the cutting mechanism 4 with respect to the sealed substrate W held on the cutting tables 2A and 2B. A moving mechanism (moving mechanism for processing) 8 is provided.

Here, the sealed substrate W is a substrate to which electronic elements such as a semiconductor chip, a resistor element, a capacitor element, etc. are connected, and which is molded with resin so that at least the electronic elements are sealed with resin. A lead frame and a printed wiring board can be used as the substrate constituting the sealed substrate W, and in addition to these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, and ceramic substrates can be used. , a glass substrate, a resin substrate, etc. can be used. Further, the substrate constituting the sealed substrate W may or may not be provided with wiring.

In the following description, directions perpendicular to each other within a plane (horizontal plane) along the upper surface of the cutting tables 2A and 2B are respectively referred to as the X direction and the Y direction, and a vertical direction perpendicular to the X and Y directions is referred to as the Z direction. Specifically, the left and right direction in FIG. 1 is the X direction, and the up and down direction is the Y direction. As will be described later, the X direction is the moving direction of the support body 812, and also the longitudinal direction (direction in which the beam extends) of a beam portion spanning a pair of legs in the gate-shaped support body 812. (see Figure 2).

<Cutting table>
The two cutting tables 2A and 2B are fixedly provided in the X direction, the Y direction, and the Z direction. Note that the cutting table 2A can be rotated in the θ direction by a rotation mechanism 9A provided under the cutting table 2A. Further, the cutting table 2B can be rotated in the θ direction by a rotation mechanism 9B provided under the cutting table 2B.

These two cutting tables 2A and 2B are provided along the X direction on a horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged so that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction). They are arranged so that the center of the upper surface (specifically, the center of rotation by the rotation mechanisms 9A and 9B) is located on the same straight line extending in the X direction (see FIGS. 2 and 3).

The two cutting tables 2A and 2B are for suctioning and holding the sealed substrate W, and as shown in FIG. Two vacuum pumps 10A and 10B are arranged. Each of the vacuum pumps 10A and 10B is, for example, a water ring vacuum pump.

Here, since the cutting tables 2A and 2B are fixed in the XYZ directions, the piping (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, and the pressure in the piping can be reduced. It is possible to reduce loss and prevent a decrease in adsorption force. As a result, even a very small package of, for example, 1 mm square or less can be reliably attracted to the cutting tables 2A, 2B. Further, since a decrease in adsorption force due to pressure loss in the piping can be prevented, the capacity of the vacuum pumps 10A and 10B can be reduced, leading to miniaturization and cost reduction.

<First holding mechanism>
As shown in FIG. 1, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in FIGS. 5 and 6, the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction parts 311 for suctioning and holding the sealed substrate W, and a suction part of the suction head 31. It has a vacuum pump (not shown) connected to 311. Then, the suction head 31 is moved to a desired position by a transport moving mechanism 7, which will be described later, to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A, 2B.

As shown in FIG. 1, the substrate supply mechanism 11 includes a substrate accommodating section 111 in which a plurality of sealed substrates W are accommodated from the outside, and a first holding section for the sealed substrates W accommodated in the substrate accommodating section 111. It has a substrate supply section 112 that moves the substrate to a holding position RP where it is sucked and held by the mechanism 3. This holding position RP is set to be in the same row as the two cutting tables 2A and 2B in the X direction. Note that the substrate supply mechanism 11 may include a heating unit 113 that heats the sealed substrate W to be sucked by the first holding mechanism 3 to make it flexible and to facilitate the suction.

<Cutting mechanism (processing mechanism)>
As shown in FIGS. 1, 2 and 3, the cutting mechanism 4 has two rotary tools 40 consisting of blades 41A, 41B and two spindle parts 42A, 42B. The two spindle parts 42A and 42B are provided so that their rotational axes are along the Y direction, and the blades 41A and 41B attached thereto are arranged so as to face each other (see FIG. 3). The blade 41A of the spindle part 42A and the blade 41B of the spindle part 42B cut the sealed substrate W held on each of the cutting tables 2A and 2B by rotating in a plane including the X direction and the Z direction. Note that, as shown in FIG. 4, the cutting device 100 of this embodiment includes a liquid supply mechanism 12 having a spray nozzle 121 that sprays cutting water (processing fluid) to suppress frictional heat generated by the blades 41A and 41B. is provided. This injection nozzle 121 is supported, for example, by a Z-direction moving section 83, which will be described later.

<Transfer table>
As shown in FIG. 1, the transfer table 5 of this embodiment is a table to which a plurality of products P inspected by the inspection section 13, which will be described later, are transferred. This transfer table 5 is what is called an index table, and a plurality of products P are temporarily placed thereon before the plurality of products P are sorted into various trays 21. Further, the transfer table 5 is arranged in a line along the X direction on the horizontal plane with the two cutting tables 2A and 2B. Further, the transfer table 5 can be moved back and forth along the Y direction by a table moving mechanism 25, and can be moved up to the sorting mechanism 20. Note that the table moving mechanism 25 may use, for example, a ball screw mechanism, an air cylinder, or a linear motor. Then, the plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection section 13.

Note that the tray 21 before storing the products P is transported to the tray movement mechanism 24 by the tray transport mechanism 22 that moves along the transfer shaft 71, and then transported to a predetermined sorting position X1 by the tray movement mechanism 24. , products P to be sorted by the sorting mechanism 20 are placed. After being sorted, the various trays 21 are stored in the tray housing section 23 by the tray moving mechanism 24 and the tray conveying mechanism 22. In this embodiment, the tray accommodating section 23 includes, for example, a tray 21 before accommodating a product P, a tray 21 accommodating a good product P, and a tray 21 accommodating a defective product P that requires rework (reinspection). It is configured to accommodate three types of trays 21. Note that the tray moving mechanism 24 will be described later.

<Inspection Department>
Here, as shown in FIG. 1, the inspection section 13 is provided between the cutting tables 2A, 2B and the transfer table 5, and inspects the plurality of products P held in the second holding mechanism 6. It is. The inspection section 13 of this embodiment includes a first inspection section 131 that inspects the sealing surface (package surface) of the product P, and a second inspection section 132 that inspects the lead surface of the product P. The first inspection section 131 is an imaging camera that has an optical system for inspecting the package surface, and the second inspection section 132 is an imaging camera that has an optical system for inspecting the lead surface. Note that the first inspection section 131 and the second inspection section 132 may be used in common.

The sealed substrate W and product P of this embodiment have a structure in which one surface of the substrate is molded with resin. In such a configuration, the resin-molded surface is a surface on which electronic elements connected to the substrate are sealed with resin, and is called a "sealing surface" or a "package surface." On the other hand, the resin-molded surface opposite to the resin-molded surface is called a lead surface because the leads that normally function as external connection electrodes of the product are exposed. When this lead is a protruding electrode used in an electronic component such as a BGA (Ball Grid Array), it is sometimes called a "ball surface." Furthermore, the surface that is not resin-molded and is opposite to the resin-molded surface is sometimes referred to as the "substrate surface" because there are some forms in which no leads are formed. In the description of this embodiment, the resin-molded surface is referred to as a "sealing surface" or "package surface," and the resin-molded surface opposite to the resin-molded surface is referred to as a "lead surface."

Further, in order to enable the inspection section 13 to inspect both sides of the plurality of products P, an inversion mechanism 14 is provided to invert the plurality of products P (see FIG. 1). The reversing mechanism 14 includes a holding table 141 that holds a plurality of products P, and a reversing section 142 such as a motor that turns the holding table 141 upside down.

When the second holding mechanism 6 holds a plurality of products P from the cutting tables 2A and 2B, the package surface of the products P faces downward. In this state, while the plurality of products P are being transported from the cutting tables 2A, 2B to the reversing mechanism 14, the first inspection section 131 inspects the package surface of the products P. Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14. In this state, the lead surface of the product P is facing downward, and by moving the reversing mechanism 14 to the second inspection section 132, the lead surface of the product P is inspected.

<Second holding mechanism>
The second holding mechanism 6, as shown in FIG. 1, holds a plurality of products P in order to transport the plurality of products P from the cutting tables 2A and 2B to the transfer table 5. As shown in FIG. 8, the second holding mechanism 6 includes a suction head 61 provided with a plurality of suction sections 611 for suctioning and holding a plurality of products P, and is connected to the suction section 611 of the suction head 61. and a vacuum pump (not shown). Then, the suction head 61 is moved to a desired position by a transport moving mechanism 7, which will be described later, to transport the plurality of products P from the cutting tables 2A, 2B to the holding table 141 or the transfer table 5.

<Transportation mechanism>
As shown in FIG. 1, the transport moving mechanism 7 moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A, 2B, and moves the second holding mechanism 6 between at least the cutting tables. 2A, 2B and the holding table 141.

As shown in FIG. 1, the conveyance moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, It has a common transfer shaft 71 for moving the two holding mechanisms 6.

The transfer shaft 71 is provided in a range that allows the first holding mechanism 3 to move above the substrate supply section 112 of the substrate supply mechanism 11 and allows the second holding mechanism 6 to move above the transfer table 5 ( (see Figure 1). Furthermore, with respect to the transfer shaft 71, the first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (this side in the Y direction) in a plan view. ing. In addition, the inspection section 13, reversing mechanism 14, various trays 21, tray transport mechanism 22, tray storage section 23, first cleaning mechanism 18 and second cleaning mechanism 19, and collection container 172, which will be described later, are also the same with respect to the transfer shaft 71. side (front side in the Y direction). Note that the sorting mechanism 20 is provided on the back side with respect to the transfer shaft 71 in the Y direction.

Further, the transport moving mechanism 7 includes a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer axis 71, as shown in FIGS. 5, 6, and 8. An elevating mechanism 73 that moves the first holding mechanism 3 and the second holding mechanism 6 up and down in the Z direction with respect to the transfer shaft 71; It has a horizontal movement mechanism 74 for horizontal movement.

As shown in FIGS. 5 to 8, the main moving mechanism 72 includes a common guide rail 721 that is provided on the transfer shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6, and a common guide rail 721 that guides the first holding mechanism 3 and the second holding mechanism 6. It has a rack and pinion mechanism 722 that moves the first holding mechanism 3 and the second holding mechanism 6.

The guide rail 721 extends in a straight line in the X direction along the transfer axis 71, and similarly to the transfer axis 71, the guide rail 721 allows the first holding mechanism 3 to move above the substrate supply section 112 of the substrate supply mechanism 11, and also allows the first holding mechanism 3 to move above the substrate supply section 112 of the substrate supply mechanism 11. 2 holding mechanism 6 is provided within a movable range above transfer table 5. This guide rail 721 is slidably provided with a slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via an elevation movement mechanism 73 and a horizontal movement mechanism 74. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the elevating movement mechanism 73, the horizontal movement mechanism 74, and the slide member 723 are They are provided separately for each.

The rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion that is provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). It has a gear 722b. The cam rack 722a is provided on the common transfer shaft 71, and can be changed to various lengths by connecting a plurality of cam rack elements. The pinion gear 722b is provided on the slide member 723 and is a so-called roller pinion, and as shown in FIG. A plurality of roller pins 722b2 are provided at equal intervals in the circumferential direction between the rollers and are rotatably provided with respect to the roller main body 722b1. Since the rack and pinion mechanism 722 of this embodiment uses the above-mentioned roller pinion, two or more roller pins 722b2 come into contact with the cam rack 722a, and backlash does not occur in the forward and reverse directions. Positioning accuracy is improved when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.

As shown in FIGS. 5 and 8, the elevating and lowering movement mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. The elevating and lowering movement mechanism 73 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the main movement mechanism 72) and the first holding mechanism 3, as shown in FIGS. 5 and 6. It has a Z-direction guide rail 73a provided along the Z-direction, and an actuator section 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. Note that the actuator section 73b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the elevating mechanism 73 of the second holding mechanism 6 is the same as that of the elevating mechanism 73 of the first holding mechanism 3, as shown in FIG.

The horizontal movement mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively, as shown in FIGS. 5, 6, and 8. The horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the elevating movement mechanism 73) and the first holding mechanism 3, as shown in FIGS. 5 and 6. The first holding mechanism 3 includes a Y-direction guide rail 74a provided along the Y direction, an elastic body 74b that applies force to one side of the Y-direction guide rail 74a with respect to the first holding mechanism 3, and a Y-direction guide rail 74a provided along the Y direction. It has a cam mechanism 74c that moves the Y-direction guide rail 74a to the other side. Here, the cam mechanism 74c uses an eccentric cam, and by rotating the eccentric cam with an actuator such as a motor, the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted.

The configuration of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3, as shown in FIG. Furthermore, the second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or both the first holding mechanism 3 and the second holding mechanism 6 may not be provided with the horizontal movement mechanism 74. Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism or an air cylinder without using the cam mechanism 74c, similarly to the elevating movement mechanism 73. However, a linear motor may also be used.

<Cutting movement mechanism (processing movement mechanism)>
The cutting movement mechanism 8 linearly moves each of the two spindle parts 42A and 42B independently in the X direction, the Y direction, and the Z direction.

Specifically, as shown in FIGS. 2, 3, 9, and 10, the cutting moving mechanism 8 includes an A Y-direction moving section 82 that linearly moves the spindle sections 42A and 42B in the Y direction, and a Z-direction moving section 83 that moves the spindle sections 42A and 42B linearly in the Z direction.

The X-direction moving unit 81 is common to the two cutting tables 2A and 2B, and is provided along the X direction across the two cutting tables 2A and 2B, particularly as shown in FIGS. 2 and 3. a pair of X-direction guide rails 811 and a support body that moves along the pair of X-direction guide rails 811 and supports the spindle parts 42A and 42B via the Y-direction moving section 82 and the Z-direction moving section 83. 812. A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X direction. Further, the support body 812 is, for example, gate-shaped and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of legs that extend upward from the pair of X-direction guide rails 811, and a beam section that spans the pair of legs, and the beam section extends in the Y direction. extending in the direction.

The support body 812 linearly reciprocates along the X direction on the pair of X direction guide rails 811, for example, by a ball screw mechanism 813 extending in the X direction. This ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support body 812 may be configured to be reciprocated by another linear motion mechanism such as a linear motor.

As particularly shown in FIG. 3, the Y-direction moving unit 82 includes a Y-direction guide rail 821 provided along the Y-direction on the support body 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. have. The Y-direction slider 822 is driven by, for example, a linear motor 823, and linearly reciprocates on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle parts 42A and 42B. Thereby, the two spindle parts 42A and 42B are movable in the Y direction independently of each other. Alternatively, the Y-direction slider 822 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.

As shown in FIGS. 2 to 4, the Z direction moving unit 83 moves along the Z direction guide rail 831 provided along the Z direction in each Y direction slider 822, and the Z direction guide rail 831. It has a Z-direction slider 832 that supports the spindle parts 42A and 32B. That is, the Z direction moving section 83 is provided corresponding to each spindle section 42A, 32B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 may be configured to reciprocate using another linear motion mechanism such as a ball screw mechanism.

As shown in FIGS. 1 and 4, the positional relationship between the cutting moving mechanism 8 and the transfer shaft 71 is such that the transfer shaft 71 is arranged above the cutting moving mechanism 8 and crossing the cutting moving mechanism 8. ing. Specifically, the transfer shaft 71 is disposed above the support 812 so as to cross the support 812, and the transfer shaft 71 and the support 812 are in a mutually intersecting positional relationship.

<Processing waste storage section>
Further, the cutting device 100 of this embodiment further includes a processing waste storage section 17 that stores processing waste S such as scraps generated by cutting the sealed substrate W, as shown in FIG.

As shown in FIGS. 2 to 4, this processing waste storage section 17 is provided below the cutting tables 2A, 2B, and is a guide chute having an upper opening 171X surrounding the cutting tables 2A, 2B in plan view. 171, and a collection container 172 for collecting the processed waste S guided by the guide chute 171. By providing the processing waste storage section 17 below the cutting tables 2A and 2B, the recovery rate of processing waste S can be improved.

The guide chute 171 guides the processing waste S scattered or fallen from the cutting tables 2A and 2B to the collection container 172. In this embodiment, since the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A and 2B (see FIG. 3), it becomes difficult to collect the processed waste S, and the recovery rate of the processed waste S is further improved. can be improved. Further, the guide chute 171 is provided so as to surround the rotating mechanisms 9A, 9B provided under the cutting tables 2A, 2B (see FIG. 4), and prevents machining waste S and cutting water from rotating mechanisms 9A, 9B. configured to protect.

In this embodiment, the processing waste storage section 17 is common to the two cutting tables 2A and 2B, but may be provided corresponding to each of the cutting tables 2A and 2B.

The collection container 172 is for collecting the processed waste S that has passed through the guide chute 171 due to its own weight, and in this embodiment, as shown in FIG. It is being The two recovery containers 172 are arranged on the front side of the transfer shaft, and are configured so that they can be independently removed from the front side of the cutting device 100. With this configuration, maintenance efficiency such as disposal of processing waste S can be improved. In addition, considering the size of the sealed substrate W, the size and amount of processing waste S, workability, etc., the collection container 172 may be provided with one or three collection containers under all the cutting tables. It may be divided into more parts and provided.

Further, the machining waste storage section 17 has a separation section 173 that separates cutting water and machining waste, as shown in FIG. 4 and the like. As a configuration of the separation section 173, for example, a filter such as a perforated plate that allows cutting water to pass through may be provided on the bottom surface of the recovery container 172. This separating section 173 allows the processing waste S to be collected without storing cutting water in the collection container 172.

<First cleaning mechanism>
Further, as shown in FIGS. 1 and 5, the cutting device 100 of the present invention includes a first cleaning mechanism 18 that cleans the upper surface side (lead surface) of the plurality of products P held on the cutting tables 2A and 2B. It also has more. This first cleaning mechanism 18 cleans the upper surfaces of the products P using a spray nozzle 18a (see FIG. 5) that sprays cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. It is for cleaning.

As shown in FIG. 5, the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71. Here, an elevating mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided between the first cleaning mechanism 18 and the slide member 723. This elevating and lowering movement mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.

<Second cleaning mechanism>
Furthermore, as shown in FIG. 1, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6. . This second cleaning mechanism 19 is provided between the cutting table 2B and the inspection section 13, and injects cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. By doing so, the lower surface side of the product P is cleaned. That is, while the second holding mechanism 6 is being moved along the transfer shaft 71, the second cleaning mechanism 19 cleans the lower surface side of the product P.

<An example of the operation of the cutting device>
Next, an example of the operation of the cutting device 100 will be explained. FIG. 9 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 in the operation of the cutting device 10. In this embodiment, all operations of the cutting device 100, such as transporting the sealed substrate W, cutting the sealed substrate W, inspecting the product P, moving various trays described later, and sorting the products P, are performed. The operation and control of is performed by a control unit CTL (see FIG. 1).

The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate storage unit 111 toward the holding position RP held by the first holding mechanism 3.

Next, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 holds the sealed substrate W by suction. Thereafter, the transport moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A, 2B, and the first holding mechanism 3 releases the suction holding and removes the sealed substrate W. The substrate W is placed on the cutting tables 2A and 2B. At this time, the main movement mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal movement mechanism 74 adjusts the position of the sealed substrate W in the Y direction. The cutting tables 2A and 2B hold the sealed substrate W by suction.

Here, when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, the elevating movement mechanism 73 moves the first holding mechanism 3 to the cutting moving mechanism 8 (support body 812). Raise it to a position where there is no physical interference. Note that when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, when retracting the support body 812 from the cutting table 2B to the transfer table 5 side, the above-mentioned procedure is required. There is no need to raise and lower the first holding mechanism 3.

In this state, the cutting moving mechanism 8 sequentially moves the two spindle parts 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate, thereby cutting the sealed substrate W into a grid pattern. Cut into pieces.

After cutting, the transportation moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After this cleaning, the transport moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to a predetermined position.

Next, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A, 2B after cutting, and the second holding mechanism 6 holds the plurality of products P by suction. Thereafter, the conveyance moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19. Thereby, the second cleaning mechanism 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6.

After cleaning, the plurality of products P held by the second holding mechanism 6 are inspected on both sides by the inspection section 13 and the reversing mechanism 14. After that, the transport moving mechanism 7 moves the second holding mechanism 6 to the transfer table 5, and the second holding mechanism 6 releases the suction holding and places the plurality of products P on the transfer table 5. . The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection section 13.

Regarding the double-sided inspection, for example, first, one side of the product P is inspected while being suction-held by the second holding mechanism 6. Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being sucked and held by the holding table 141 after reversing. Tests can be performed. The product P can then be transferred from the reversing table 14 to the transfer table 5 by transferring it from the holding table 141 to the second holding mechanism 6. Further, the holding table 141 is configured to be movable in the X direction, and at least one of the holding table 141 or the transfer table 5 is configured to be movable in the Z direction, so that the holding table 141 is moved above the transfer table 5. Accordingly, the product P can also be transported and transferred to the transfer table 5.

<Tray movement mechanism>
Next, a detailed configuration of the tray moving mechanism 24 of this embodiment will be described.
The tray moving mechanism 24 of this embodiment moves each of the three types of trays 21, as shown in FIGS. 10 to 12. Here, the three types of trays 21 are, for example, first and second trays 21a and 21b that accommodate good products P, and a third tray that accommodates defective products P that require rework (reinspection). This is the tray 21c.

Specifically, as shown in FIGS. 10 and 11, the tray moving mechanism 24 includes tray placement sections 241a to 241c on which three types of trays 21a to 21c are placed, and tray placement sections 241a to 241c. It is provided with moving rails 242A and 242B that are moved in a straight line. In the tray moving mechanism 24, the three tray placement parts 241a to 241c are arranged in a line along the Y direction, and the sorting mechanism 20 sorts the trays independently from each other along the direction of the line (Y direction). It is configured to be movable to position X1.

Note that in the following, the tray mounting section 241a on which the first tray 21a is placed is referred to as a first tray mounting section 241a, and the tray mounting section 241b on which the second tray 21b is placed is referred to as a second tray placement section 241a. The tray mounting portion 241c on which the third tray 21c is placed is referred to as a third tray mounting portion 241c.

Specifically, the moving rails 242A and 242B of this embodiment include a first moving rail 242A and a second moving rail 242B that are provided in parallel to each other. Both the first moving rail 242A and the second moving rail 242B extend along the Y direction. The first moving rail 242A is provided with first and second tray mounting sections 241a and 241b movably so as not to interfere with each other, and the second moving rail 242B is provided with a third tray mounting section 241a and 241b. The mounting section 241c is provided movably so as not to interfere with the first and second tray mounting sections 241a and 241b provided on the first moving rail 242A.

In this embodiment, the first and second tray mounting parts 241a and 241b are movably provided on the left and right side surfaces (side surfaces in the X direction) facing each other on the first moving rail 242A. Specifically, the first tray placement section 241a is movably provided on the left side of the first moving rail 242A, and the second tray placement section 241b is movable on the right side of the first moving rail 242A. possible. Further, the first and second tray placement parts 241a and 241b are arranged in a line on the first moving rail 242A. In the first moving rail 242A, each of the first and second tray mounting parts 241a and 241b is moved linearly along the Y direction on the first moving rail 242A by a ball screw mechanism 243A extending in the Y direction. Travel back and forth. This ball screw mechanism 243A is driven by a drive source (not shown) such as a servo motor. In addition, the first and second tray placement parts 241a and 241b may be configured to be reciprocated by another linear motion mechanism such as a linear motor.

A third tray mounting section 241c is movably provided on the left side surface of the second moving rail 242B. Further, the third tray mounting section 241c provided on the second moving rail 242B extends toward the first moving rail 242A so as to be in line with the first and second tray mounting sections 241a and 241b. ing. The third tray mounting portion 241c on the second moving rail 242B linearly reciprocates along the Y direction on the second moving rail 242B by a ball screw mechanism 243B extending in the Y direction. This ball screw mechanism 243B is driven by a drive source (not shown) such as a servo motor. Alternatively, the third tray mounting portion 241c may be configured to be reciprocated by another linear motion mechanism such as a linear motor.

As shown in FIGS. 10 to 12, the tray moving mechanism 24 moves each of the first to third tray mounting portions 241a to 241c to a sorting position X1 sorted by the sorting mechanism 20 and a tray 21a to 21c. is moved between a housing position X2 for housing the tray in the tray housing part 23 and a retreat position X3 to which it is retreated when the other tray mounting parts 241a to 241c are at the sorting position X1 or the housing position X2. The sorting position X1 is set on the back side with respect to the transfer shaft 71 in the Y direction, and the storage position X2 is set on the near side with respect to the transfer shaft 71 in the Y direction. Further, the retracted position X3 is set to the front side of the accommodation position X2 in the Y direction with respect to the transfer shaft 71.

The first to third tray placement sections 241a to 241c arranged in a line in this manner are configured so as not to interfere with each other when they move. Specifically, as shown in FIGS. 11 to 14, the tray moving mechanism 24 moves the second and third tray mounting sections 241b and 241c among the first to third tray mounting sections 241a to 241c. It has a height position changing section 244 that changes the height position. Note that the first tray mounting section 241a, which is not provided with the height position changing section 244, is fixed at the raised position H1, which is the height at the sorting position X1 by the sorting mechanism 20.

The height position changing section 244 is provided corresponding to the second and third tray mounting sections 241b and 241c, respectively, and is, for example, one using a rack and pinion mechanism, or one using a ball screw mechanism. , or one using an air cylinder. Specifically, the height position changing section 244 moves the second and third tray placement sections 241b and 241c to the elevated position H1, which is the height at the sorting position X1 by the sorting mechanism 20, as shown in FIGS. 13 and 14. , and a lowered position H2 at a height that does not interfere with the other tray mounting parts 241a to 241c located at the raised position H1.

For example, as shown in FIGS. 15 and 16, when the first tray placement section 241a and the second tray placement section 241b pass each other, the second tray placement section 241b 244, it is set to the lowered position H2. As a result, the second tray placing part 241b passes under the first tray placing part 241a, and the first tray placing part 241a and the second tray placing part 241b interfere with each other. Move without doing anything.

Further, as shown in FIGS. 17 and 18, when the second tray placement section 241b and the third tray placement section 241c pass each other, the second tray placement section 241b is placed in the height position changing section. 244, the third tray mounting section 241c is set to the lowered position H2, and the height position changing section 244 sets the third tray mounting section 241c to the raised position H1. As a result, the second tray placing part 241b passes under the third tray placing part 241c, and the second tray placing part 241b and the third tray placing part 241c interfere with each other. Move without doing anything.

Furthermore, as shown in FIGS. 19 and 20, when the first tray placement part 241a and the third tray placement part 241c pass each other, the third tray placement part 241c 244, it is set to the lowered position H2. As a result, the third tray mounting section 241c passes under the first tray mounting section 241a, and the first tray mounting section 241a and the third tray mounting section 241c interfere with each other. Move without doing anything.

In this embodiment, when the first to third tray placement parts 241a to 241c move to the respective positions X1 to X3, they pass each other in the three ways described above, so that they do not interfere with each other. Note that when the second and third tray mounting sections 241b and 241c are at the storage position X2, the second and third tray mounting sections 241b and 241c are The placing portions 241b and 241c are in the raised position H1. Furthermore, in the present embodiment, the first tray placement part 241a is fixed at the raised position H1, and the second and third tray placement parts 241b and 241c are movable up and down between the raised position H1 and the lowered position H2. Therefore, the three tray mounting sections 241a to 241c do not overlap in the Z direction, and the space through which the three tray mounting sections 241a to 241c pass in the Z direction can be reduced.

<Sort operation into trays>
Next, the sorting operation into the trays 21a to 21c will be explained.

As shown in <Example of Operation of Cutting Device> described above, a plurality of products P are placed on the transfer table 5 after being inspected by the inspection section 13.

The transfer table 5 on which a plurality of products P are placed is moved in the Y direction by the table moving mechanism 25 and moved to a predetermined sorting position by the sorting mechanism 20.

Further, the tray moving mechanism 24 moves the desired tray placement parts 241a to 241c to the storage position X2, and the tray transport mechanism 22 moves the desired trays 21a to 21c to the tray placement parts 241a to 241c in the storage position X2. transport and place it on the

Then, the tray moving mechanism 24 moves any one of the tray placement sections 241a to 241c on which the various trays 21a to 21c are placed to the sorting position X1. Note that the other tray placement units 241a to 241c that are not moved to the sorting position X1 are moved to the storage position X2 or the retracted position X3.

With the transfer table 5 moved to a predetermined sorting position X1 and one tray placement section 241a to 241c moved to the sorting position The products P are sorted into the trays 21a to 21c on the tray mounting sections 241a to 241c located at the sorting position X1 according to the inspection results (good products, defective products, etc.) by the inspection section 13.

For example, when the first and second tray placement parts 241a and 241b on which the first and second trays 21a and 21b are placed are at the sorting position The determined products P are sorted into first and second trays 21a and 21b. Furthermore, when the third tray placement section 241c on which the third tray 21c is placed is at the sorting position Sort into tray 21c.

When the various trays 21a to 21c reach the maximum number of products P that can be stored (full, full), or when the sorting of the products P is completed, the tray moving mechanism 24 is at the sorting position X1. The tray placement parts 241a to 241c are moved to the storage position X2. Then, the tray transport mechanism 22 transports the trays 21a to 21c from the tray mounting parts 241a to 241c located at the storage position X2 to the tray storage part 23. Further, the tray transport mechanism 22 transports new trays 21a to 21c in the tray storage section 23 to the tray mounting sections 241a to 241c located at the storage position X2. Note that when sorting is to be continued, the tray moving mechanism 24 moves the tray placement sections 241a to 241c on which new trays 21a to 21c are placed to the sorting position X1.

<Effects of this embodiment>
According to the cutting device 100 of this embodiment, the three tray placement parts 241a to 241c are arranged in a line, and can be moved independently from each other along the direction of the line to the sorting position X1 by the sorting mechanism 20. With this configuration, the footprint of the cutting device 100 can be reduced. Furthermore, since the three tray placement sections 241a to 241c are arranged in a line, the distance between the transfer table 5 on which the products P before being sorted are placed and each tray 21a to 21c is the same. The transportation time for sorting into each tray 21a to 21c can be made the same, and productivity can be improved.

Further, since the tray moving mechanism 24 includes a height position changing section 244 that changes the height position of at least one of the three tray mounting sections 241a to 241c, the three tray mounting sections 241a to 241c are independent of each other. It is possible to prevent them from interfering with each other when moving. Here, the height position changing section 244 moves the tray placement sections 241a to 241c between a raised position H1 that is the height at the sorting position X1 and a height position H2 that does not interfere with the other tray placement sections 241a to 241c. Since the three tray placement sections 241a to 241c are moved up and down in the vertical direction, the sorting mechanism 20 can accurately place the products P on each tray 21a to 21c while preventing interference with each other when the three tray placement sections 241a to 241c move independently. become.

In addition, in this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A, 2B and the transfer table 5, and Since the cutting mechanism 4 is moved in the horizontal plane by the moving mechanism 8 in the X direction along the transfer axis 71 and in the Y direction perpendicular to the X direction, the cutting tables 2A and 2B are not moved in the X direction and the Y direction. The sealed substrate W can be processed. Therefore, without moving the cutting tables 2A, 2B by the ball screw mechanism, it is possible to eliminate the need for a bellows member for protecting the ball screw mechanism and a cover member for protecting the bellows member. As a result, the configuration of the cutting device 100 can be simplified. Further, the cutting tables 2A and 2B can be configured not to move in the X direction and the Y direction, and the footprint of the cutting device 100 can be reduced.

<Other modified embodiments>
Note that the present invention is not limited to the above embodiments.

In the embodiment described above, the configuration includes three tray placement sections 241a to 241c, but the configuration may include four or more tray placement sections. For example, by providing two tray placement sections 241c and 241d on the second moving rail 242B, a configuration having four tray placement sections 241a to 241d can be achieved. In addition, by adding more moving rails, the number of tray mounting sections can be increased.

Although the height position changing unit 244 of the embodiment described above moves up and down at two height positions, it may be configured to move up and down at three or more height positions.

In the embodiment described above, the height position of the first tray placement part 241a is fixed, and the height position of the second and third tray placement parts 241b and 241c is configured to be changeable. The height position of the second tray placing part 241b or the third tray placing part 241c may be fixed, and the height position of the remaining two tray placing parts may be changeable. .

In the embodiment described above, the height of two of the three tray placement sections 241a to 241c can be changed by the height changing mechanism 243, but one tray placement section has a height changeable structure. It may be configured such that the height can be changed by the height changing mechanism 243. Further, each of the three tray mounting sections 241a to 241c may have a configuration in which the height can be changed by a height changing mechanism.

In the embodiment, the height at the sorting position X1 by the sorting mechanism 20 is set as the raised position H1, and the lowered position H2 is set below the raised position H1, so that the tray mounting parts do not interfere with each other. However, the height at the sorting position You may do so.

In the embodiment described above, the height positions of the tray placement parts 241a to 241c are configured to be changeable, but the height position changing part 244 is not provided so that the three tray placement parts 241a to 241c do not interfere with each other. It may also be configured to be fixed at a height position.

In the embodiment described above, the three tray mounting sections 241a to 241c were moved using the two moving rails 242A and 242B, but the three tray mounting sections 241a to 241c are movably provided on one moving rail. It's okay.

In the embodiment described above, a cutting device having a twin cut table type and a twin spindle configuration has been described, but the present invention is not limited to this. Alternatively, a cutting device having a twin spindle configuration or the like may be used.

Furthermore, although the transfer table 5 in the embodiment described above is an index table that is temporarily placed before sorting into the various trays 21, the transfer table 5 may be used as the holding table 141 of the reversing mechanism 14.

Furthermore, in the embodiment described above, the product P is sorted from the transfer table 5 to the tray 21, but the product P may be transported and pasted onto an adhesive tape placed inside a frame-shaped member.

Furthermore, in the configuration of the embodiment described above, the grooves may be formed without cutting the sealed substrate on the cutting tables 2A, 2B. In this case, for example, the sealed substrate W that has been grooved by the cutting tables 2A and 2B may be returned to the substrate supply unit 112 by the first holding mechanism 3 and the transportation moving mechanism 7. Alternatively, the sealed substrate W returned to the substrate supply section 112 may be accommodated in the substrate storage section 111.

Further, since a plurality of cam rack elements constituting the transfer shaft 71 can be configured by connecting them, for example, the cutting device (processing device) 100 can be separated and connected between the second cleaning mechanism 19 and the inspection section 13. It can be configured as a removable module. In this case, for example, a module that performs a different type of test from the test performed by the test section 13 can be added between the module on the second cleaning mechanism 19 side and the module on the test section 13 side. In addition to the configuration exemplified here, the cutting device (processing device) 100 may have a module configuration that can be separated and connected (detachable) at any point, and additional modules may have various functions other than inspection. .

Further, the processing device of the present invention may be one that performs processing other than cutting, for example, may be one that performs other mechanical processing such as cutting and grinding.

In addition, it goes without saying that the present invention is not limited to the embodiments described above, and that various modifications can be made without departing from the spirit thereof.

100...Cutting device (processing device)
W...Sealed substrate (processed object)
P...Product (processed product)
2A, 2B...Cutting table (processing table)
4... Cutting mechanism (processing mechanism)
20... Sorting mechanism 21... Tray 22... Tray transport mechanism 23... Tray storage section 24... Tray moving mechanism 241a to 241c... Tray mounting section 242A... First movement Rail 242B... Second moving rail X1... Sorting position X2... Accommodation position 243... Height position changing section H1... Height position (raised position)
H2...Height position (lowering position)

Claims (7)

a processing mechanism that processes the workpiece;
a sorting mechanism that sorts processed workpieces into multiple trays;
and a tray moving mechanism that moves the tray,
The tray moving mechanism has three or more tray placement parts on which the trays are placed, and the three or more tray placement parts are arranged in a row and are spaced from each other along the direction of the row. A processing device configured to be independently movable to a sorting position by the sorting mechanism. The processing apparatus according to claim 1, wherein the tray moving mechanism includes a height position changing section that changes the height position of at least one of the three or more tray mounting sections. The height position changing unit moves the tray placement unit up and down between a raised position at a height at the sorting position and a lowered position at a height that does not interfere with other tray placement units. , The processing device according to claim 2. further comprising a tray accommodating section that accommodates the tray,
Any one of claims 1 to 3, wherein the tray moving mechanism moves the three or more tray placement units between the sorting position and a storage position for storing the trays in the tray storage unit. The processing device according to item 1. The processing apparatus according to claim 4, further comprising a tray transport mechanism that transports the tray between the tray storage section and the tray mounting section at the storage position. The tray moving mechanism has a first moving rail and a second moving rail that are provided parallel to each other,
The two tray mounting parts are provided movably on the first moving rail so as not to interfere with each other,
Claims 1 to 5, wherein the one tray mounting section on the second moving rail is movably provided so as not to interfere with the two tray mounting sections provided on the first moving rail. The processing device according to any one of the above. A method for manufacturing a processed product, comprising manufacturing a processed product using the processing apparatus according to any one of claims 1 to 6.