KR100988634B1 - Apparatus for transferring a substrate and apparatus for bonding a die including the same - Google Patents

Abstract

The substrate transfer device includes a first rail, a second rail, a first stage, a second stage, a first vertical driver and a second vertical driver. The first and second rails are arranged parallel to each other. The first and second stages are connected with each of the first and second rails so as to be movable along each of the first and second rails, and first and second substrates for a die bonding process are placed, respectively. . The first and second vertical driving units connect between the first and second stages and the first and second rails, respectively, and the first and second stages are parallel to the first and second rails. The height of each of the first and second stages is adjusted to prevent interference with each other when moving in one direction. Thus, the substrate for carrying out the die bonding process can be transferred to a more simplified configuration.

Description

Substrate transfer apparatus and die bonding apparatus including the same {APPARATUS FOR TRANSFERRING A SUBSTRATE AND APPARATUS FOR BONDING A DIE INCLUDING THE SAME}

The present invention relates to a substrate transfer apparatus and a die bonding apparatus including the same, and more particularly, to an apparatus for transferring a substrate to which a die is bonded, and an apparatus for bonding the die to the substrate, including the apparatus as a member. will be.

In general, a semiconductor device includes a bonding process of bonding a wafer on which a plurality of dies, which are semiconductor chips, are formed to an adhesive sheet, a sawing process of cutting the wafer bonded to the adhesive sheet to individualize each of the dies, and the individualized said A die bonding step of separating the die from the adhesive sheet and attaching the die separated from the adhesive sheet to a substrate, a wire bonding step of electrically connecting the die with a connection pad of the substrate, and connecting the die to an epoxy resin And a terminal forming step of forming a connection terminal electrically extended from the substrate to the outside.

Among these, the die bonding process specifically loads the substrate on the first stage, then applies an adhesive to the substrate loaded on the first stage, and transfers the substrate on which the adhesive is applied to the second stage. After the transfer, the second stage may be transferred to bond the die separated from the adhesive sheet and discharged to the outside.

Thus, in the die bonding process, a first conveying apparatus for conveying the first stage and a second conveying apparatus for conveying the second stage are used.

As the first and second transfer apparatuses substantially transfer the first and second stages only in the horizontal direction, respectively, the first and second transfer apparatuses repeatedly transfer only a predetermined section due to the interference of the first and second stages.

That is, each of the first and second transfer devices individually transfers the first and second stages only in a section in which the adhesive is applied and in a section in which the die is bonded.

Accordingly, a separate transfer device for transferring the substrate is required between the section where the adhesive is applied and the section where the die is bonded.

Accordingly, the process of bonding the die to the substrate is delayed due to the transfer device, and the configuration for bonding the die is complicated.

Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a substrate transfer apparatus capable of continuously carrying out transfer of a substrate for bonding a die.

Another object of the present invention is to provide a die bonding apparatus including the substrate transfer apparatus.

In order to achieve the above object of the present invention, a substrate transfer apparatus according to one feature includes a first rail, a second rail, a first stage, a second stage, a first vertical driver and a second vertical driver.

The first and second rails are arranged parallel to each other. The first and second stages are connected with each of the first and second rails so as to be movable along each of the first and second rails, and first and second substrates for a die bonding process are placed, respectively. . The first and second vertical driving units connect between the first and second stages and the first and second rails, respectively, and the first and second stages are parallel to the first and second rails. The height of each of the first and second stages is adjusted to prevent interference with each other when moving in one direction.

Here, each of the first and second rails is disposed outside of each of the second and first stages.

Thus, each of the first and second rails may be coupled to opposite ends of the first and second stages.

In addition, each of the first and second vertical drives may include first and second cylinders.

Meanwhile, each of the first and second rails includes first and second ball screws. In this case, the substrate transfer apparatus may further include first and second motors for moving the first and second stages by rotating the first and second ball screws, respectively.

In addition, each of the first and second stages may be provided with first and second clamps for fixing the first and second substrates.

In order to achieve the above object of the present invention, a die bonding apparatus according to one feature includes a first rail, a second rail, a first stage, a second stage, a loading portion, a bonding portion, an unloading portion, and a first vertical driving portion. And a second vertical driver.

The first and second rails are arranged parallel to each other. The first and second stages are connected with each of the first and second rails to be movable along each of the first and second rails. The loading unit is installed adjacent to the first and second rails, and loads the first and second substrates onto the first and second stages, respectively. The bonding part is installed adjacent to the loading part and bonds the dies to the first and second substrates of the first and second stages horizontally transported along each of the first and second rails. The unloading unit is installed adjacent to the bonding unit, and unloads the first and second substrates on which the dies are bonded from the first and second stages. The first and second vertical drives connect between the first and second stages and the first and second rails, respectively, and the first and second stages are parallel to the first and second rails. The height of each of the first and second stages is adjusted to prevent interference with each other when moving in one direction.

Thus, the die bonding apparatus may further include an application unit installed between the loading unit and the bonding unit to apply an adhesive to the first and second substrates.

The die bonding apparatus further includes an ejector arranged adjacent to the bonding portion to separate the dies from the adhesive sheet to which the dies are bonded, and a picker to pick and transfer the dies separated by the ejector to the bonding portion. can do.

According to such a substrate transfer apparatus and a die bonding apparatus including the same, first and second stages on which first and second substrates are loaded are first moved along the first and second rails, and the first and second stages are moved. By adjusting the heights of the first and second stages through the first and second vertical drives when the two stages move in parallel in opposite directions, it is possible to prevent the first and second stages from interfering with each other during parallel transport. Can be. .

That is, as the first and second stages can be continuously returned to the position where the first and second substrates were loaded, the first and second substrates placed on the first and second stages are subjected to. By advancing an adhesive substance application | coating process and a die bonding process continuously, process time can be shortened. Thereby, productivity improvement can be expected.

In addition, by simply configuring the delivery device and other elements described in the background art, it is possible to expect a reduction in manufacturing costs.

Hereinafter, a substrate transfer apparatus and a die bonding apparatus including the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text.

However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a schematic view showing a die bonding apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a die bonding apparatus 1000 according to an exemplary embodiment may include an ejector 100, a picker 150, a loading unit 200, a substrate transfer unit 600, an application unit 300, and a bonding unit. The unit 400 and the unloading unit 500 is included.

The ejector 100 is located on the opposite side to which the dies D, which are the semiconductor chips sawed from the wafer of the adhesive sheet AS, are bonded. The ejector 100 includes a pin 110 through which the adhesive sheet AS can pass.

Thus, the ejector 100 separates the dies D from the adhesive sheet AS by penetrating through the portions where the dies D of the adhesive sheet AS are positioned through the pins 110.

The picker 150 is positioned on a surface on which the dies D of the adhesive sheet AS are disposed. The picker 150 picks the dies D separated from the adhesive sheet AS by the ejector 100 using a vacuum pressure provided from the outside. Here, a part of picking the dies D of the picker 150 may be formed of a material having a predetermined elasticity to prevent damage of the dies D.

The loading unit 200 loads the first and second substrates S1 and S2 patterned with an arbitrary circuit into the substrate transfer unit 600. The loading unit 200 continuously loads the first and second substrates S1 and S2 into the substrate transfer unit 600.

Accordingly, the substrate transfer part 600 receives the first and second substrates S1 and S2 from the loading part 200, and the coating part 300 and the bonding part ( 400 and the first and second substrates S1 and S2 are transferred to a position where the unloading unit 500 is installed.

The applicator 300 is installed in a path through which the substrate transfer part 600 transfers the first and second substrates S1 and S2 along a first direction a, thereby providing the first and second substrates S1. , S2) to apply the adhesive (AM).

The bonding part 400 is continuously connected to the applicator 300 in the path of the substrate transfer part 600 along the first direction a. The bonding unit 400 is connected to the picker 150 to receive the dies D from the picker 150. The bonding part 400 bonds the dies D to the first and second substrates S1 and S2 to which the adhesive AM is coated.

The unloading part 500 is installed in succession to the applicator 300 in the path of the substrate transfer part 600 along the first direction a. The unloading part 500 unloads the first and second substrates S1 and S2 to which the dies D are bonded to the outside.

Hereinafter, the first and second substrates S1 and S2 may be transferred between the loading part 200, the applicator 300, the bonding part 400, and the unloading part 500. The substrate transfer unit 600 will be described in more detail with reference to FIGS. 2, 3, and 4.

2 is a detailed view of the substrate transfer unit according to the exemplary embodiment of the die bonding apparatus illustrated in FIG. 1, FIG. 3 is a side view of the substrate transfer unit illustrated in FIG. 2, and FIG. 4 is illustrated in FIG. 2. It is the figure which looked at the board | substrate conveyance part from the front.

2, 3, and 4, the substrate transfer unit 600 may include a first rail 610, a second rail 620, a first stage 630, a second stage 640, and a first stage 640. The vertical driver 650 and the second vertical driver 660 are included.

The first and second rails 610 and 620 are arranged to be parallel to each other. The first and second rails 610 and 620 have a structure extending between the loading part 200, the applicator 300, the bonding part 400, and the unloading part 500. .

Each of the first and second stages 630 and 640 has a structure combined with each of the first and second rails 610 and 620. Here, each of the first and second stages 630 and 640 is loaded with the first and second substrates from the loading unit 200.

Accordingly, the loading unit 200 may be installed at any one position P1 of the first and second rails 610 and 620, and the bonding unit 400 may be installed on the first and second rails. The second positions P2 may be installed at successive second positions P2 in the first direction a of the 610 and 620. In this case, the applicator 300 may be installed between the first and second positions P1 and P2.

In this case, the loading unit 200 simply loads the first and second substrates S1 and S2 into the first and second stages 630 and 640, respectively, and thus, the coating unit 300. Even if it is installed in the first position (P1) may not be affected because it does not receive a process interference.

In addition, the unloading unit 500 also serves to unload the first and second substrates S1 and S2 to the outside from each of the first and second stages 630 and 640. It may be installed in the second position (P2) in which the unit 400 is installed.

Each of the first and second stages 630 and 640 is provided with first and second clamps 632 and 642 to fix the loaded first and second substrates S1 and S2.

Each of the first and second clamps 632 and 642 may be used when the first and second substrates S1 and S2 are loaded or unloaded into the loading unit 200 or the unloading unit 500. Except for always having a structure for fixing the first and second substrates (S1, S2).

Each of the first and second stages 630 and 640 may move along the same path along each of the first and second rails 610 and 620. To this end, ball screws may be used as the first and second rails 610 and 620, and the substrate transfer part 600 may include first and second connected to the first and second rails 610 and 620. Motors 612 and 622 may be included.

Accordingly, the first and second rails 610 and 620 may be rotated by the first and second motors 612 and 622 to horizontally transport the first and second stages 630 and 640. Will be.

Each of the first and second vertical drivers 650 and 660 is coupled to each of the first and second rails 610 and 620. Specifically, each of the first and second vertical drivers 650 and 660 may be disposed between each of the first and second rails 610 and 620 and each of the first and second stages 630 and 640. First and second cylinders 652 and 662 coupled to the first and second cylinders 652 and 662. That is, the first and second stages 630 and 640 vertically transfer by the linear driving force of the first and second cylinders 652 and 662. That is, each of the first and second cylinders 652 and 662 adjusts the height of the first and second stages 630 and 640.

In this case, each of the first and second rails 610 and 620 may be configured to prevent the first and second rails 610 and 640 from interfering with each other when the first and second stages 630 and 640 vertically move. 640 and 630 are disposed outside of each.

In addition, each of the first and second rails 610 and 620 is coupled to opposite ends of each of the first and second stages 630 and 640, and thus the first and second rails 610 and 620. Cylinders 652 and 662 are also coupled at opposite ends of the first and second stages 630 and 640.

Meanwhile, the substrate transfer part 600 may facilitate coupling of each of the first and second cylinders 652 and 662 to each of the first and second rails 610 and 620 formed of ball screws. The first and second blocks 670 and 680 are coupled between them.

Each of the first and second blocks 670 and 680 has a first and second ball nuts 672 and 682 such that the first and second rails 610 and 620 formed of ball screws in the center thereof are coupled to each other. Can be formed.

Accordingly, each of the first and second blocks 670 and 680 coupled to the first and second rails 610 and 620 may be coupled to the ground, thereby providing the first and second stages ( The movement of each of the first and second rails 610 and 620 of the 630 and 640 may be stabilized.

As such, the first and second stages 630 and 640 are vertically conveyed by the first and second vertical drivers 650 and 660 so that the first and second stages 630 and 640 are connected to each other. In the opposite direction, for example, each may be prevented from interfering with each other when horizontally conveyed to each other along the first direction a and the second direction b opposite thereto.

The process of bonding the dies D to each of the first and second substrates S1 and S2 by the above configuration will be described. First, in the first position P1 of the first rail 610, The first substrate S1 is loaded from the loading unit 200 on the first stage 630. In this case, the first clamp 632 fixes the loaded first substrate S1.

Subsequently, the adhesive AM is applied onto the first substrate S1 placed on the first stage 630 through the applicator 300 at the first position P1. Subsequently, the first stage 630 is horizontally transferred along the first rail 610 in the first direction a to transfer the first substrate S1 to a second position of the first rail 610. Position in P2).

At the same time, the second substrate S2 is loaded from the loading unit 200 to the second stage 640 at the first position P1 of the second rail 620, and the first position is continuously performed. In P1, the adhesive AM is applied onto the second substrate S2 placed on the second stage 640 through the applicator 300. Here, the second clamp 642 fixes the second substrate S2 on which the loading is performed.

Subsequently, the picker 150 is disposed on the first substrate S1 on which the adhesive AM is applied to the first stage 630 through the bonding part 400 at the second position P2. Bond the dies (D) received from.

Subsequently, the first substrate S1 to which the dies D are bonded from the first stage 630 is unloaded into the unloading unit 500 at the second position P2. In this case, the first clamp 632 releases the fixing of the first substrate S1.

Subsequently, the first stage 630 on which the first substrate S1 is unloaded is lowered through the first cylinder 652. Subsequently, the first stage 630 is horizontally moved along the second direction b to be positioned below the position where the first substrate S1 is loaded. Subsequently, the first stage 630 is raised through the first cylinder 652 to return to the position where the first substrate S1 was loaded.

At the same time, the second stage 640 is horizontally moved along the second rail 620 in the first direction a to move the first substrate S1 to a second position of the first rail 610. (P2).

In this case, the first stage 630 for horizontally conveying along the first direction a and the second stage 640 for horizontally conveying along the second direction b are spaced apart from each other in a vertical direction. By having the height difference, the interference does not occur even though the same paths are transported on the plane.

Subsequently, as in the first substrate S1, the second substrate on which the adhesive AM is applied and placed on the second stage 640 through the bonding part 400 at the second position P2. Bond the dies (D) received from the picker 150 on (S2).

In addition, the second substrate S2 to which the dies D are bonded from the second stage 640 is unloaded to the unloading part 500 at the second position P2. In this case, the second clamp 642 releases the fixing of the second substrate S2.

Accordingly, the first and second stages 630 and 640 on which the first and second substrates S1 and S2 are loaded may be moved horizontally along the first and second rails 610 and 620. The first and second stages 630 and 640 through the first and second vertical drivers 650 and 660 when the first and second stages 630 and 640 move in parallel in opposite directions. By adjusting the height of the field, the first and second stages 630 and 640 can be prevented from interfering with each other during parallel transport.

That is, the first and second stages 630 and 640 may be continuously returned to the position where the first and second substrates S1 and S2 have been loaded. The application process of the adhesive AM and the bonding process of the dies D may be continuously performed on the first and second substrates S1 and S2 placed on the first and second substrates 640. As a result, the overall process time can be shortened, thereby improving productivity.

In addition, by simply configuring the delivery device and other elements described in the background art, it is possible to expect a reduction in manufacturing costs.

FIG. 5 is a detailed view of a substrate transfer part according to another exemplary embodiment of the die bonding apparatus illustrated in FIG. 1.

In the present embodiment, except for the coupling position of the first and second vertical driving portions of the substrate transfer portion, the same as the configuration shown in Figs. 2, 3 and 4, the same reference numerals are used, the overlapping Detailed description will be omitted.

Referring to FIG. 5, the substrate transfer part 700 according to another embodiment of the present invention may include first and second rails 710 directly coupled to ends of the first and second stages 630 and 640, respectively. 720 and first and second vertical drivers 730 and 740 coupled to the first and second rails 710 and 720, respectively.

Each of the first and second vertical drivers 730 and 740 may be opposite to the first and second stages 630 and 640 based on the first and second rails 710 and 720, respectively. Combined first and second cylinders 732, 742.

Accordingly, each of the first and second cylinders 732 and 742 vertically transports each of the first and second rails 710 and 720 and each of the first and second stages 630 and 640 together. To adjust their height.

In this case, each of the first and second cylinders 732 and 742 may have a structure coupled to the ground, so that the vertical transfer of the first and second stages 630 and 640 coupled thereto may be stably performed. can do.

The substrate transfer part 700 may include the first and second rails 710 and 720, the first and second stages 630 and 640, and the first and second cylinders 732 and 742, respectively. It further includes first and second blocks 750, 760 coupled directly to each of them.

The first and second blocks 750 and 760 move horizontally by the rotation of the first and second rails 710 and 720 formed of ball screws. That is, the first and second stages 630 and 640 are horizontally transported by the first and second blocks 750 and 760 directly coupled to each other.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

The present invention as described above allows the first and second stages on which the first and second substrates are loaded to be horizontally moved along the first and second rails, and the first and second stages move in parallel in opposite directions. By adjusting the heights of the first and second stages via the first and second vertical drives, the first and second stages can be used in an apparatus that can prevent the first and second stages from interfering during parallel transport.

1 is a schematic view showing a die bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a detailed view of the substrate transfer part according to the exemplary embodiment of the die bonding apparatus illustrated in FIG. 1.

FIG. 3 is a side view of the substrate transfer part shown in FIG. 2.

4 is a front view of the substrate transfer part illustrated in FIG. 2.

FIG. 5 is a detailed view of a substrate transfer part according to another exemplary embodiment of the die bonding apparatus illustrated in FIG. 1.

<Explanation of symbols for the main parts of the drawings>

S1: first substrate S2: second substrate

AM: Adhesive D: Die

200: loading part 300: coating part

400: bonding unit 500: unloading unit

600: substrate transfer unit 610: first rail

620: second rail 630: first stage

640: second stage 650: first vertical driving unit

660: second vertical drive unit 1000: die bonding apparatus

Claims (8)

First and second rails disposed parallel to each other; First and second stages connected to each of the first and second rails so as to be movable along each of the first and second rails, and on which first and second substrates for a die bonding process are placed, respectively; And Connecting between the first and second stages and the first and second rails, respectively, and interfering with each other when the first and second stages move in a direction parallel to the first and second rails. To prevent the first and second stages to adjust the height of each of the first and second vertical driving parts, And each of the first and second stages is provided with first and second clamps for fixing the first and second substrates. 2. The method of claim 1, wherein each of the first and second rails is coupled to opposite ends of the first and second stages while being disposed outside each of the second and first stages. Substrate transfer device. The substrate transport apparatus of claim 2, wherein each of the first and second vertical drives includes first and second cylinders. The method of claim 1, wherein each of the first and second rails includes first and second ball screws, and the first and second ball screws are rotated to move the first and second stages, respectively. Further comprising first and second motors for making the substrate move. delete First and second rails disposed parallel to each other; First and second stages connected to each of the first and second rails to be movable along each of the first and second rails; A loading unit disposed adjacent to the first and second rails and configured to load first and second substrates onto each of the first and second stages; A bonding unit installed adjacent to the loading unit and bonding dies to the first and second substrates of the first and second stages horizontally transported along each of the first and second rails; An unloading unit installed adjacent to the bonding unit and unloading the first and second substrates on which the dies are bonded from the first and second stages; And Connecting between the first and second stages and the first and second rails, respectively, and interfering with each other when the first and second stages move in a direction parallel to the first and second rails. To prevent the first and second stages to adjust the height of each of the first and second vertical driving parts, And each of the first and second stages is provided with first and second clamps for fixing the first and second substrates. The die bonding apparatus of claim 6, further comprising an application unit disposed between the loading unit and the bonding unit to apply an adhesive to the first and second substrates. The method of claim 6, An ejector disposed adjacent to the bonding portion to separate the dies from the adhesive sheet to which the dies are bonded; And And a picker picking the dies separated by the ejector and transferring the pickers to the bonding unit.

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