CN116868314A

CN116868314A - Processing device and method for manufacturing processed product

Info

Publication number: CN116868314A
Application number: CN202180093604.3A
Authority: CN
Inventors: 深井元树; 堀聡子; 坂上雄哉; 山本裕子; 吉冈翔; 片冈昌一
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2021-03-24
Filing date: 2021-12-23
Publication date: 2023-10-10
Also published as: KR20230125073A; JP7496328B2; TWI826950B; JP2022148886A; WO2022201700A1; TW202237326A

Abstract

The present invention is an apparatus for reducing the footprint of a processing apparatus, comprising: a substrate accommodating section 111 for accommodating the sealed substrate W; a cutting table 2A and a cutting table 2B, and the sealed substrate W is processed by the cutting mechanism 4; a receiving stage 115 for receiving the sealed substrate W from the substrate accommodating section 111; a stage moving mechanism 117 having a moving rail 117a for moving the receiving stage 115 to the conveying position; a first holding mechanism 3 for holding the sealed substrate W to the cutting tables 2A and 2B; and a transfer movement mechanism 7 having a transfer shaft 71 for moving the first holding mechanism 3 between the receiving stage 115 located at the transfer position and the cutting stages 2A and 2B, the transfer shaft 71 and the movement rail 117a being orthogonal to each other in a plan view.

Description

Processing device and method for manufacturing processed product

Technical Field

The present invention relates to a processing apparatus and a method for manufacturing a processed product.

Background

As described in patent document 1, a cutting system is proposed in which a semiconductor tape cut by a cutting device is supplied from a loading device to an introduction rail (inlet rail), transferred from the introduction rail to the cutting device, and cut into individual semiconductor packages by the cutting device.

However, in the cutting system, the loading device, the introduction rail, and the cutting device are arranged in a row along the X direction, and therefore the occupied area (footprint) of the cutting system becomes large.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2007-536727

Disclosure of Invention

Problems to be solved by the invention

Accordingly, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to reduce the occupied area of a processing apparatus.

Technical means for solving the problems

That is, the processing apparatus of the present invention includes: a processing object accommodating section for accommodating a processing object; a processing table for processing the object by a processing means; a receiving table for receiving the object from the object receiving unit; a stage moving mechanism having a moving rail for moving the receiving stage to a transport position; a first holding mechanism for holding the object to be processed in order to convey the object to the processing table; and a transfer movement mechanism having a transfer shaft for moving the first holding mechanism between the receiving stage and the processing stage at the transfer position, the transfer shaft and the movement rail being orthogonal to each other in a plan view.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention thus constituted, the occupied area of the processing device can be reduced.

Drawings

Fig. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention.

Fig. 2 is a perspective view schematically showing the cutting table and the peripheral structure thereof according to the embodiment.

Fig. 3 is a view (plan view) schematically showing the structure of the cutting table and its peripheral structure according to the above embodiment, as viewed from the Z direction.

Fig. 4 is a view (front view) schematically showing the structure of the cutting table and its peripheral structure according to the above embodiment, as viewed from the Y direction.

Fig. 5 is a view (front view) schematically showing the structure of the first holding mechanism and the conveying movement mechanism according to the above embodiment, as viewed from the Y direction.

Fig. 6 is a view (side view) schematically showing the structure of the first holding mechanism and the conveying movement mechanism according to the embodiment, as viewed from the X direction.

Fig. 7 is a view (front view) schematically showing the structure of the second holding mechanism and the conveying movement mechanism according to the embodiment, as viewed from the Y direction.

Fig. 8 is a cross-sectional view schematically showing the structure of a rack and pinion (rack and pinion) mechanism according to the embodiment.

Fig. 9 is a schematic diagram showing the operation of the cutting device according to the embodiment.

Fig. 10 is a view (plan view) schematically showing the structure of the substrate supply mechanism according to the embodiment, as viewed from the Z direction.

Fig. 11 is a view (front view) schematically showing the structure of the substrate supply mechanism according to the embodiment, as viewed from the Y direction.

Fig. 12 is a cross-sectional view schematically showing the structure of the loading table according to the embodiment.

Fig. 13 is a view (plan view) schematically showing each position of the carry-in table according to the embodiment, as viewed from the Z direction.

Fig. 14 is a view (plan view) schematically showing each position of the carrying-out table according to the embodiment, as viewed from the Z direction.

Fig. 15 is a view (plan view) schematically showing the structure of the blade replacement mechanism according to the embodiment, as viewed from the Z direction.

Fig. 16 is a cross-sectional view schematically showing the structure of the cutting mechanism according to the embodiment.

Fig. 17 is a cross-sectional view schematically showing the blade according to the above embodiment in a state before (a) removal and in a state after (b) removal.

Fig. 18 is a view (plan view) from the Z direction showing a replacement state of each blade by the blade replacement mechanism according to the embodiment.

Fig. 19 is a flowchart of the full-cut conveying operation and the half-cut conveying operation of the embodiment.

Detailed Description

The examples of the invention will be described in more detail. However, the present invention is not limited to the following description.

As described above, the processing apparatus of the present invention includes: a processing object accommodating section for accommodating a processing object; a processing table for processing the object by a processing means; a receiving table for receiving the object from the object receiving unit; a stage moving mechanism having a moving rail for moving the receiving stage to a transport position; a first holding mechanism for holding the object to be processed in order to convey the object to the processing table; and a transfer movement mechanism having a transfer shaft for moving the first holding mechanism between the receiving stage and the processing stage at the transfer position, the transfer shaft and the movement rail being orthogonal to each other in a plan view.

In the processing apparatus, the moving rail for moving the receiving table and the transmission shaft for moving the first holding mechanism are orthogonal to each other in a plan view, and therefore, the object accommodating section and the processing table are not arranged in a row in the lateral direction as in the prior art, and therefore, the occupied area of the processing apparatus can be reduced.

Specifically, it is preferable that the object housing portion and the first holding mechanism are provided on opposite sides of the transmission shaft in a plan view.

In the above-described configuration, since the first holding mechanism is provided on one side of the transmission shaft and the processing object accommodating portion is provided on the other side of the transmission shaft, the processing object accommodating portion can be provided without being limited by the movement range of the first holding mechanism, and the degree of freedom in arrangement of the processing object accommodating portion can be increased, so that the occupied area of the processing apparatus can be reduced.

Preferably, the machining apparatus of the present invention further includes a machining tool replacement mechanism for replacing a machining tool of the machining mechanism, and the machining tool replacement mechanism is configured to automatically replace the machining tool of the machining mechanism.

In the above-described structure, it is desirable that the machining tool changing mechanism be movable by the moving rail in order to simplify the apparatus structure.

Preferably, the receiving stage has a positioning mechanism for positioning the object.

By providing the positioning mechanism in this manner, the object can be positioned on the receiving table located at the conveying position, and the object can be reliably conveyed.

Desirably, the receiving station has: a loading table for loading the object; and a carrying-out table for carrying out the half-cut object, wherein the processing apparatus of the present invention carries the half-cut object from the processing table to the carrying-out table, and stores the half-cut object in the object storing section via the carrying-out table.

In the above configuration, the object may be half-cut, and the half-cut object may be accommodated in the object accommodating portion.

In addition, the processing apparatus of the present invention preferably includes: a transfer table for moving the processed object; and a second holding mechanism configured to be movable along the transfer shaft so as to hold the processed object by conveying the processed object from the processing table to the transfer table.

In the above configuration, the first holding mechanism and the second holding mechanism share the transmission shaft, so that the device structure can be simplified.

In the processing apparatus according to the present invention, it is preferable that the transfer table moves the entirely cut object, and the second holding means holds the entirely cut object so that the object can be entirely cut.

Preferably, the apparatus further includes a processing moving mechanism that moves the processing mechanism in a first direction along the transmission axis and a second direction orthogonal to the first direction on a horizontal plane.

In the above-described configuration, the processing means is moved in the first direction along the transmission axis and the second direction orthogonal to the first direction on the horizontal plane by the processing movement means, so that the object to be processed can be processed without moving the processing table in the first direction and the second direction. Therefore, the machining table can be moved without the ball screw mechanism, without the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member. As a result, the device structure of the processing device can be simplified. Further, since the machining table is not moved in the first direction and the second direction on the horizontal plane, the movement space of the machining table and the dead space around the machining table can be reduced, and the occupied area of the machining apparatus can be reduced.

The method for producing a processed product using the processing apparatus is also an aspect of the present invention.

Further, as a method for manufacturing a processed product by using the processing apparatus, there is provided: a carry-in step of carrying in the object to be machined, which is to be half-cut, from the carry-in table to the machining table; a half-cutting step of half-cutting the object to be processed carried in by the carrying-in step; a carrying-out step of carrying out the object half-cut by the half-cutting step to the carrying-out table; and a housing step of housing the object to be processed that has been carried out to the carrying-out stage by the carrying-out step in the object housing section.

< one embodiment of the invention >

An embodiment of the processing apparatus according to the present invention will be described below with reference to the drawings. In addition, any of the drawings shown below is schematically and omitted or exaggerated for ease of understanding. The same reference numerals are given to the same constituent members, and description thereof is omitted as appropriate.

General structure of the machining device

The processing apparatus 100 according to the present embodiment is a cutting apparatus that cuts a sealed substrate W as a processing target, thereby dividing the substrate into a plurality of products P as processed products.

Specifically, as shown in fig. 1, the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W so as to convey the sealed substrate W to the cutting tables 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B; a transfer table 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P so as to convey the plurality of products P from the cutting tables 2A and 2B to the transfer table 5; the conveying movement mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B.

Here, the sealed substrate W is a substrate to which electronic components such as a semiconductor chip, a resistor element, and a capacitor element are connected, and is formed by resin molding at least the electronic components in a resin-sealed manner. As the substrate constituting the sealed substrate W, a lead frame (lead frame) and a printed wiring board may be used, and in addition to these, a semiconductor substrate (including a semiconductor wafer such as a silicon wafer), a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, and the like may be used. Further, the substrate constituting the sealed substrate W may or may not be wired.

In the following description, directions orthogonal to each other along a plane (horizontal plane) of the upper surfaces of the cutting tables 2A and 2B are respectively referred to as an X direction and a Y direction, and a vertical direction orthogonal to the X direction and the Y direction is referred to as a Z direction. Specifically, the left-right direction in fig. 1 is referred to as the X direction, and the up-down direction is referred to as the Y direction. The X direction is a moving direction of the support 812, and is a direction orthogonal to a longitudinal direction (a direction in which the beam portion extends) of a beam portion (a cross beam portion) of the pair of leg portions of the door-shaped support 812 (see fig. 2), which will be described later.

< working table for cutting >)

The two cutting tables 2A and 2B are fixed in the X direction, the Y direction, and the Z direction. The cutting table 2A is rotatable in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B is rotatable in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.

These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that the upper surfaces thereof are on the same horizontal plane (at the same height position in the Z direction) (see fig. 4), and such that the centers of the upper surfaces thereof (specifically, the centers of rotation of the rotation mechanisms 9A and 9B) are on the same straight line extending in the X direction (see fig. 2 and 3).

As shown in fig. 1, two vacuum pumps 10A and 10B for suction holding are disposed corresponding to the two cutting tables 2A and 2B, and the two cutting tables 2A and 2B suction-hold the sealed substrate W. Each of the vacuum pumps 10A and 10B is, for example, a water seal type vacuum pump.

Here, since the cutting tables 2A and 2B are fixed in XYZ directions, piping (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, pressure loss of the piping can be reduced, and reduction of the suction force can be prevented. As a result, even a very small package of, for example, 1mm square or less can be reliably adsorbed to the cutting tables 2A and 2B. Further, since the decrease in the suction force due to the pressure loss of the piping can be prevented, the capacities of the vacuum pump 10A and the vacuum pump 10B can be reduced, and miniaturization and cost reduction can be brought about.

< first retaining mechanism >)

As shown in fig. 1, the first holding mechanism 3 holds the sealed substrate W so as to convey the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in fig. 5 and 6, the first holding mechanism 3 includes: the suction head 31 having a plurality of suction units 311 for sucking and holding the sealed substrate W; and a vacuum pump (not shown) connected to the suction portion 311 of the suction head 31. The suction head 31 is moved to a desired position by a transfer moving mechanism 7 or the like described later, and the sealed substrate W is transferred from the substrate supply mechanism 11 to the cutting stage 2A and the cutting stage 2B.

As shown in fig. 1, the substrate supply mechanism 11 includes: a substrate housing section 111 for housing a plurality of sealed substrates W from the outside; and a substrate supply unit 112 for moving the sealed substrate W stored in the substrate storage unit 111 to a holding position RP to be sucked and held by the first holding mechanism 3. The holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. The substrate supply mechanism 11 may have a substrate heating portion 113 for heating so that the sealed substrate W sucked by the first holding mechanism 3 is easily sucked in a soft state. The substrate housing portion 111 corresponds to a processing object housing portion. The substrate housing portion 111 may be configured to directly house a plurality of sealed substrates W as objects to be processed, or may be configured to house a magazine (magazine) which is a container for housing a plurality of sealed substrates W as objects to be processed. The specific configuration of the other substrate supply mechanism 11 will be described later.

Cutting mechanism (processing mechanism)

As shown in fig. 1, 2 and 3, the cutting mechanism 4 includes two rotary tools 40 including a blade 41A and a blade 41B, which correspond to machining tools, and two spindle portions 42A and 42B. The two spindle portions 42A and 42B are provided such that the rotation axes thereof extend in the Y direction, and the blades 41A and 41B attached to the spindles are disposed so as to face each other (see fig. 3). The blades 41A and 41B of the spindle portions 42A and 42B rotate in the plane including the X and Z directions, thereby cutting the sealed substrate W held on the cutting tables 2A and 2B. As shown in fig. 3 and 4, in the cutting device 100 of the present embodiment, a liquid supply mechanism 12 is provided for suppressing frictional heat generated by the blades 41A and 41B, and the liquid supply mechanism 12 includes an injection nozzle 121 for injecting cutting water (machining liquid). The injection nozzle 121 is supported by a Z-direction moving part 83, for example, which will be described later.

< transfer workbench >)

As shown in fig. 1, the transfer table 5 of the present embodiment is a table for moving a plurality of products P inspected by an inspection unit 13 described later. The transfer table 5 is called an index table (index table), and temporarily mounts a plurality of products P before sorting the plurality of products P into various trays 21. The transfer table 5 is arranged in a row along the X direction with the two cutting tables 2A and 2B on the horizontal plane. The transfer table 5 is movable back and forth along the Y direction, and is movable to the sorting mechanism 20. The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13.

The various trays 21 are conveyed to a desired position by the tray conveying mechanism 22 moving along the transfer shaft 71, and the products P sorted by the sorting mechanism 20 are placed thereon. After sorting, the various trays 21 are accommodated in the tray accommodating portion 23 by the tray conveying mechanism 22. In the present embodiment, three types of trays 21, for example, a tray 21 before the product P is stored, a tray 21 in which a good product P is stored, and a tray 21 in which a defective product P requiring reworking (re-inspection) is stored, are configured in the tray storage unit 23.

< inspection portion >)

As shown in fig. 1, the inspection unit 13 is provided between the cutting tables 2A and 2B and the transfer table 5, and inspects the plurality of products P held by the second holding mechanism 6. The inspection unit 13 of the present embodiment includes a first inspection unit 131 for inspecting a sealing surface (package surface) of the product P, and a second inspection unit 132 for inspecting a lead surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the package face, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the lead face. The first inspection unit 131 and the second inspection unit 132 may be shared.

The sealed substrate W and the product P of the present embodiment have a structure in which one surface of the substrate is resin-molded. In such a structure, the resin molded surface is a surface obtained by sealing an electronic component connected to a substrate with a resin, and is referred to as a "sealing surface" or a "sealing surface". On the other hand, the surface not resin-molded opposite to the surface not resin-molded exposes a lead wire that normally functions as an external connection electrode of the product, and is therefore called a lead wire surface. When the lead is a bump electrode used for an electronic component such as a Ball Grid Array (BGA), the lead may be referred to as a "spherical surface". Further, the surface not molded with resin on the opposite side from the surface molded with resin is also sometimes referred to as "substrate surface" because no leads are formed. In the description of the present embodiment, the resin molded surface is referred to as a "sealing surface" or a "sealing surface", and the surface not resin molded on the opposite side from the resin molded surface is referred to as a "lead surface".

In order to check both surfaces of the plurality of products P by the checking unit 13, a reversing mechanism 14 (see fig. 1) for reversing the plurality of products P is provided. The reversing mechanism 14 includes a holding table 141 for holding a plurality of products P, and a reversing portion 142 such as a motor for reversing the holding table 141 to reverse the front and back directions.

When the second holding mechanism 6 holds the plurality of products P from the cutting tables 2A and 2B, the packaging surface of the product P faces downward. In this state, the first inspection unit 131 inspects the package surface of the product P while the plurality of products P are being conveyed from the cutting tables 2A and 2B to the reversing mechanism 14. Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14. In this state, the lead surface of the product P faces downward, and the reversing mechanism 14 is moved to the second inspection portion 132, whereby the lead surface of the product P is inspected.

< second holding mechanism >)

As shown in fig. 1, the second holding mechanism 6 holds the plurality of products P so as to convey the plurality of products P from the cutting tables 2A and 2B to the transfer table 5. As shown in fig. 8, the second holding mechanism 6 includes: the suction head 61 is provided with a plurality of suction parts 611 for sucking and holding a plurality of products P; and a vacuum pump (not shown) connected to the suction part 611 of the suction head 61. Then, the suction heads 61 are moved to desired positions by a conveyance moving mechanism 7 or the like described later, so that the plurality of products P are conveyed from the cutting tables 2A and 2B to the holding table 141 or the transfer table 5.

Moving mechanism for conveying

As shown in fig. 1, the conveyance moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A and 2B and the holding table 141.

As shown in fig. 1, the conveying movement mechanism 7 includes: the common transfer shaft 71 extends linearly along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5, and moves the first holding mechanism 3 and the second holding mechanism 6.

The transmission shaft 71 is provided in the following range: the first holding mechanism 3 is movable to above the substrate supply section 112 of the substrate supply mechanism 11, and the second holding mechanism 6 is movable to above the transfer table 5 (see fig. 1). The first holding mechanism 3, the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the transfer table 5 are provided on the same side (near front side) in plan view with respect to the transfer shaft 71. The inspection unit 13, the reversing mechanism 14, the various trays 21, the tray conveyance mechanism 22, the tray housing unit 23, the first cleaning mechanism 18, the second cleaning mechanism 19, and the collection container 172, which will be described later, are also provided on the same side (near front side) with respect to the transfer shaft 71.

As shown in fig. 5, 6, and 8, the conveyance moving mechanism 7 includes: a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 along the transmission shaft 71 in the X direction; a lifting and moving mechanism 73 for lifting and moving the first holding mechanism 3 and the second holding mechanism 6 in the Z direction relative to the transmission shaft 71; and a horizontal movement mechanism 74 for horizontally moving the first holding mechanism 3 and the second holding mechanism 6 in the Y direction with respect to the transmission shaft 71.

As shown in fig. 5 to 8, the main moving mechanism 72 includes: a common guide rail 721 provided on the transmission shaft 71 and guiding the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

The guide rail 721 extends straight along the transmission shaft 71 in the X direction, and is provided in the following range, similarly to the transmission shaft 71: the first holding mechanism 3 is movable to above the substrate supply section 112 of the substrate supply mechanism 11, and the second holding mechanism 6 is movable to above the transfer stage 5. A slide member 723 is slidably provided on the guide rail 721, and the slide member 723 is provided with the first holding mechanism 3 and the second holding mechanism 6 via the elevating and moving mechanism 73 and the horizontal moving mechanism 74. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the elevating movement mechanism 73, the horizontal movement mechanism 74, and the slide member 723 are provided for each of the first holding mechanism 3 and the second holding mechanism 6.

The rack and pinion mechanism 722 has: the cam rack 722a is shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion 722b provided on the first holding mechanism 3 and the second holding mechanism 6, respectively, and rotated by an actuator (not shown). The cam rack 722a is provided on the common transmission shaft 71, and can be changed to various lengths by connecting a plurality of cam rack members. The pinion 722b is provided on the sliding member 723, and is called a so-called roller pinion (roller pin), and includes: a pair of roller bodies 722b1 that rotate together with the rotation shaft of the motor, and a plurality of roller pins 722b2 that are provided between the pair of roller bodies 722b1 at equal intervals in the circumferential direction and that are provided so as to be capable of rolling with respect to the roller bodies 722b 1. Since the rack and pinion mechanism 722 of the present embodiment uses the roller pinion, two or more roller pins 722b2 are in contact with the cam rack 722a, no backlash (backlash) is generated in the forward and reverse directions, and positioning accuracy is improved when the first holding mechanism 3 and the second holding mechanism 6 are moved in the X direction.

As shown in fig. 5 and 8, the elevating and moving mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. As shown in fig. 5 and 6, the elevating and moving mechanism 73 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and includes: a Z-direction guide rail 73a provided along the Z-direction; and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73 a. The actuator portion 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. As shown in fig. 8, the elevating and moving mechanism 73 of the second holding mechanism 6 has the same structure as the elevating and moving mechanism 73 of the first holding mechanism 3.

As shown in fig. 5, 6 and 8, the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in fig. 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the elevating movement mechanism 73) and the first holding mechanism 3, and includes: a Y-direction guide 74a provided along the Y-direction; an elastic body 74b that imparts a force to one side of the Y-direction guide 74a on the first holding mechanism 3; and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide 74 a. Here, the cam mechanism 74c uses an eccentric cam, and the movement amount of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam by an actuator such as a motor.

As shown in fig. 8, the horizontal movement mechanism 74 of the second holding mechanism 6 has the same structure as the lifting movement mechanism 73 of the first holding mechanism 3. The second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or the first holding mechanism 3 and the second holding mechanism 6 may not be provided with the horizontal movement mechanism 74. Further, the horizontal movement mechanism 74 may use a ball screw mechanism, an air cylinder, or a linear motor, instead of the cam mechanism 74c, as in the lifting movement mechanism 73.

< cutting movement mechanism (processing movement mechanism) >)

The cutting movement mechanism 8 linearly moves each of the two spindle portions 42A and 42B independently in the X direction, the Y direction, and the Z direction.

Specifically, as shown in fig. 2, 3, 9, and 10, the cutting movement mechanism 8 includes: an X-direction moving unit 81 that moves the spindle units 42A and 42B linearly in the X-direction; a Y-direction moving section 82 for linearly moving the spindle sections 42A, 42B in the Y-direction; and a Z-direction moving unit 83 that moves the spindle units 42A and 42B linearly in the Z-direction.

The X-direction moving portion 81 is common to the two cutting tables 2A and 2B, and includes, as shown in fig. 2 and 3 in particular: a pair of X-direction guide rails 811 provided so as to sandwich the two cutting tables 2A and 2B along the X-direction; and a support body 812 that moves along the pair of X-direction guide rails 811 and supports the spindle portion 42A and the spindle portion 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. The support 812 is, for example, a door-shaped member having a shape extending in the Y direction. Specifically, the support body 812 includes a pair of legs extending upward from the pair of X-direction rails 811, and a beam portion (cross beam portion) that extends in the Y-direction and is supported by the pair of legs.

The support 812 is linearly reciprocated in the X direction on the pair of X-direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a driving source (not shown) such as a servo motor. The support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.

As shown in fig. 3 in particular, the Y-direction moving portion 82 includes: a Y-direction guide rail 821 provided in the support 812 along the Y-direction; and a Y-direction slider 822 moving along the Y-direction guide 821. The Y-direction slider 822 is driven by, for example, a linear motor 823, and moves linearly back and forth on the Y-direction rail 821. In the present embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle portions 42A, 42B can move in the Y direction independently of each other. The Y-direction slider 822 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.

As shown in fig. 2 to 4, the Z-direction moving unit 83 includes: a Z-direction guide rail 831 provided along the Z-direction in each Y-direction slider 822; and a Z-direction slider 832 moving along the Z-direction guide rail 831 and supporting the spindle portion 42A and the spindle portion 42B. That is, the Z-direction moving portion 83 is provided corresponding to each of the spindle portions 42A and 42B. The Z-direction slider 832 is driven by an eccentric cam mechanism (not shown), for example, and moves linearly back and forth on the Z-direction guide rail 831. The Z-direction slider 832 may be configured to reciprocate by another linear motion mechanism such as a ball screw mechanism.

As shown in fig. 1 and 4, the positional relationship between the cutting movement mechanism 8 and the transmission shaft 71 is such that the transmission shaft 71 passes across the cutting movement mechanism 8 above the cutting movement mechanism 8. Specifically, the transmission shaft 71 is disposed so as to traverse the support body 812 above the support body 812, and the transmission shaft 71 and the support body 812 are in a positional relationship orthogonal to each other in a planar view.

< machining chip storage part >)

As shown in fig. 1, the cutting device 100 according to the present embodiment further includes: the processing chip storage 17 stores processing chips S such as end materials generated by cutting the sealed substrate W.

As shown in fig. 2 to 4, the chip accommodating portion 17 is provided below the cutting tables 2A and 2B, and includes: a guide chute 171 having an upper opening 171X surrounding the cutting table 2A and the cutting table 2B in a plan view; and a collection container 172 for collecting the processing scraps S guided by the guide chute 171. By providing the chip accommodating portion 17 below the cutting tables 2A and 2B, the recovery rate of the chips S can be improved.

The guide chute 171 guides the machining chips S scattered or dropped from the cutting tables 2A and 2B to the collection container 172. In the present embodiment, the upper opening 171X of the guide chute 171 is formed so as to surround the cutting table 2A and the cutting table 2B (see fig. 3), so that the machining chips S are less likely to leak, and the recovery rate of the machining chips S can be further improved. The guide chute 171 is provided so as to surround the rotation mechanisms 9A and 9B provided below the cutting tables 2A and 2B (see fig. 4), and is configured so as to protect the rotation mechanisms 9A and 9B from the chips S and the cutting water.

In the present embodiment, the machining chip storage 17 is shared by the two cutting tables 2A and 2B, but may be provided in correspondence with each of the cutting tables 2A and 2B.

The collection container 172 collects the chips S passing through the guide chute 171 by its own weight, and is provided in the present embodiment so as to correspond to the two cutting tables 2A and 2B, respectively, as shown in fig. 4 and the like. The two collection containers 172 are disposed on the front side of the transfer shaft 71 and are configured to be removable from the front side of the cutting device 100 independently. With this configuration, maintainability such as disposal of the machining chips S can be improved. The collection container 172 may be provided under all the cutting tables in one piece in consideration of the size of the sealed substrate W, the size and amount of the processing chips S, workability, and the like, or may be provided separately from three or more pieces.

As shown in fig. 4 and the like, the chip accommodating portion 17 includes a separating portion 173 for separating the cutting water from the chips. As a configuration of the separation portion 173, for example, a filter such as a perforated plate that allows cutting water to pass through is provided on the bottom surface of the recovery vessel 172. The separation unit 173 can collect the machining chips S without accumulating the cutting water in the collection container 172.

< first cleaning mechanism >)

As shown in fig. 1 and 5, the cutting device 100 of the present invention further includes: the first cleaning mechanism 18 cleans the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. The first cleaning mechanism 18 cleans the upper surfaces of the products P held on the cutting tables 2A and 2B by spraying cleaning liquid and/or compressed air through a spraying nozzle 18a (see fig. 5).

As shown in fig. 5, the first cleaning mechanism 18 is configured to be movable along the transmission shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided to a slide member 723, and the slide member 723 slides on a guide rail 721 provided to the transmission shaft 71. Here, between the first cleaning mechanism 18 and the slide member 723, a lifting movement mechanism 181 for lifting and moving the first cleaning mechanism 18 in the Z direction is provided. As the lifting/lowering mechanism 181, for example, a rack and pinion mechanism, a ball screw mechanism, a cylinder, or the like can be used.

< second cleaning mechanism >)

Further, as shown in fig. 1, the cutting device 100 of the present invention further includes: the second cleaning means 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding means 6. The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and sprays cleaning liquid and/or compressed air to the lower surfaces of the plurality of products P held by the second holding mechanism 6, thereby cleaning the lower surface side of the products P. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P in the middle of the movement of the second holding mechanism 6 along the transfer shaft 71.

< example of the action of the cutting device >

Next, an example of the operation of the cutting device 100 will be described. Fig. 9 shows a movement path of the first holding mechanism 3 and a movement path of the second holding mechanism 6 during the operation of the cutting device 10. In the present embodiment, all operations and controls of the cutting device 100, such as conveyance of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, replacement of a blade, and trimming (dressing), which will be described later, are performed by the control section CTL (see fig. 1).

The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W stored in the substrate storage unit 111 to the holding position RP held by the first holding mechanism 3.

Then, the transfer moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 suctions and holds the sealed substrate W. Thereafter, the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction and holding, and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72, and the position of the sealed substrate W in the Y direction is adjusted by the horizontal moving mechanism 74. The cutting stage 2A and the cutting stage 2B hold the sealed substrate W by suction.

Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, the lifting and lowering mechanism 73 lifts the first holding mechanism 3 to a position where physical interference with the cutting movement mechanism 8 (support 812) does not occur. When the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, the first holding mechanism 3 does not need to be lifted up or down as described above when the support 812 is retracted from the cutting stage 2B to the transfer stage 5.

In this state, the cutting moving mechanism 8 sequentially moves the two spindle portions 42A and 42B in the X direction and the Y direction, and rotates the cutting tables 2A and 2B, whereby the sealed substrate W is cut into a lattice shape and singulated.

After the cutting, the first cleaning means 18 is moved by the conveying moving means 7 to clean the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After the cleaning, the conveyance moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

Then, the conveying moving mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 suctions and holds the plurality of products P. Thereafter, the conveying moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19. Thereby, the second cleaning mechanism 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6.

After cleaning, the plurality of products P held by the second holding mechanism 6 are inspected on both sides by the inspection unit 13 and the reversing mechanism 14. Thereafter, the transfer moving mechanism 7 moves the second holding mechanism 6 to the transfer table 5, and the second holding mechanism 6 releases the suction holding, thereby placing the plurality of products P on the transfer table 5. The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13.

Further, regarding the double-sided inspection, for example, first, one of the surfaces of the product P is inspected in a state of being sucked and held by the second holding mechanism 6. Then, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other surface of the product P is inspected in a state of being sucked and held by the reversed holding table 141, whereby the both-surface inspection can be performed. The product P is transferred from the reversing mechanism 14 to the transfer stage 5 by the self-holding stage 141 to the second holding mechanism 6. The holding table 141 is configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 is configured to be movable in the Z direction, so that the product P can be transferred to the transfer table 5 and transferred by moving the holding table 141 to the upper side of the transfer table 5.

Specific structure of substrate feeding mechanism

The following describes the detailed structure of the substrate supply mechanism 11.

As described above, the substrate supply mechanism 11 supplies the sealed substrate W to the first holding mechanism 3. Specifically, as shown in fig. 1, 10, and 11, the substrate supply mechanism 11 includes: a substrate housing section 111 for housing a plurality of sealed substrates W from the outside; and a substrate supply unit 112 for moving the sealed substrate W stored in the substrate storage unit 111 to a holding position RP to be sucked and held by the first holding mechanism 3.

As shown in fig. 10 and 11, the substrate housing portion 111 is provided with a pushing mechanism 114 for pushing out a part of the housed sealed substrate W to the outside of the substrate housing portion 111. The pushing mechanism 114 includes a movable pushing member 114a for pushing one end of the sealed substrate W, and an actuator portion 114b for moving the pushing member 114 a. As the actuator portion 114b, a motor-using device, a cylinder-using device, a solenoid-using device, or the like can be used.

As shown in fig. 10 and 11, the substrate supply unit 112 includes: a receiving stage 115 for receiving the sealed substrate W from the substrate accommodating section 111; a substrate moving unit 116 for moving the sealed substrate W from the substrate housing unit 111 to the receiving stage 115; and a stage moving mechanism for moving the receiving stage 115 to a predetermined conveyance position X2.

As shown in fig. 10, the receiving stage 115 according to the present embodiment is configured to receive the sealed substrate W from the substrate accommodating portion 111 and to transfer the sealed substrate W to the substrate accommodating portion 111. Specifically, the receiving station 115 has: a carry-in stage 115A for receiving the sealed substrate W from the substrate housing section 111; and a carry-out stage 115B for delivering the sealed substrate W to the substrate housing section 111. The loading stage 115A is a suction stage, and is capable of sucking and holding the mounted sealed substrate W. The carry-out stage 115B of the present embodiment delivers the half-cut sealed substrate W. The half-cut is a process of forming a groove by cutting a part of the upper surface (lead surface) of the sealed substrate W.

As shown in fig. 11 and 12, the sealed substrate W placed on the loading table 115A is heated while being pressed against the upper surface of the loading table 115A from above by the substrate heating section 113. Therefore, the loading table 115A is provided with a sheet-like buffer material 115x that absorbs the impact when heated by the substrate heating unit 113.

As shown in fig. 12, the loading stage 115A is provided with a positioning mechanism 118 for positioning the sealed substrate W. The positioning mechanism 118 is configured such that one side wall 115m of the pair of side walls 115m and 115n of the carry-in stage 115A is movable relative to the other side wall 115n, and the sealed substrate W is positioned by abutting against the other side wall 115n by closing the gap between the pair of side walls 115m and 115n, with reference to the inner surface of the other side wall 115 n. In addition, in the present embodiment, one of the side walls 115m is movable by the actuator 115j, and the other side wall 115n is movable by the actuator 115 k. When the sealed substrate W is heated by the substrate heating section 113, the side walls 115m and 115n are retracted by the actuators 115j and 115k so as not to interfere with each other.

As shown in fig. 11, the substrate moving unit 116 includes: a clamp 116a for clamping the end of the sealed substrate W; an X-direction moving unit 116b that moves the clamp unit 116a in the X-direction; and a Z-direction moving section 116c that moves the clamp section 116a in the Z-direction.

The order of transferring the sealed substrate W from the substrate housing section 111 to the receiving stage 115 (the carry-in stage 115A and the carry-out stage 115B) using the push-out mechanism 114 and the substrate moving section 116 is as follows.

The sealed substrate W stored in the substrate storage section 111 is pressed by the pressing member 114a of the pushing mechanism 114, and a part of the sealed substrate W is protruded from the substrate storage section 111 toward the loading table 115A. Then, the portion of the sealed substrate W protruding from the substrate accommodating portion 111 is held by the clamp portion 116a of the substrate moving portion 116, and the clamp portion 116a is moved in the X direction by the X-direction moving portion 116b, whereby the sealed substrate W is pulled out from the substrate accommodating portion 111 and placed on the carry-in table 115A.

As shown in fig. 10 and 11, the stage moving mechanism 117 includes: a pair of moving rails 117a for moving the receiving stage 115 (the carry-in stage 115A and the carry-out stage 115B); and a slide member 117b that moves along the movement rail 117a and is provided with a receiving stage 115. The slide member 117b linearly reciprocates in the Y direction on a pair of movement rails 117a by, for example, a ball screw mechanism 117c extending in the Y direction. The ball screw mechanism 117c is driven by a driving source (not shown) such as a servo motor. The slide member 117b may be configured to reciprocate by another linear motion mechanism such as a linear motor.

The movement rail 117a is positioned below the transfer shaft 71, and the movement rail 117a and the transfer shaft 71 of the transfer movement mechanism 7 are orthogonal to each other in plan view. In the present embodiment, the transmission shaft 71 extends in the X direction, and the moving rail 117a extends in the Y direction. The term "orthogonal to each other in plan view" means that the transmission axis 71 is substantially orthogonal to the movement rail 117a, except for the case where it crosses perpendicularly (90 °). Substantially orthogonal means a state of intersecting with a few errors from the vertical, for example, a state of intersecting with 85 ° or more and 95 ° or less.

Further, since the moving rail 117a is orthogonal to the transmission shaft 71, the moving rail 117a is orthogonal to the X-direction guide rail 811 that moves the support 812 of the cutting moving mechanism 8. In other words, the movement rail 117a is parallel to the support 812 of the cutting movement mechanism 8 in plan view.

Here, when the transmission shaft 71 contacts the peripheral structure of the moving rail 117a, the substrate housing portion 111 and the first holding mechanism 3 are disposed on opposite sides of the transmission shaft 71. Specifically, the substrate housing portion 111 is provided on the inner side in the Y direction than the transfer shaft 71, and the first holding mechanism 3 is provided on the front side in the Y direction than the transfer shaft 71.

As shown in fig. 13, the stage moving mechanism 117 moves the carry-in stage 115A linearly between a receiving position X1 where the sealed substrate W is received from the substrate housing section 111 and a conveying position X2 where the sealed substrate W is held by the first holding mechanism 3. The receiving position X1 is located further inward in the Y-axis direction than the transfer shaft 71, and the conveying position X2 is located further forward in the Y-axis direction than the transfer shaft 71. The sealed substrate W on the receiving stage 115 (loading stage 115A) located at the transfer position X2 is located at the holding position RP.

The stage moving mechanism 117 moves the loading stage 115A to a heating position X3 (see fig. 13) for heating the mounted sealed substrate W by the substrate heating section 113. The heating position X3 of the present embodiment is set further inward in the Y direction than the receiving position X1. In the heating position X3, the substrate heating section 113 contacts the upper surface of the sealed substrate W placed on the carry-in stage 115A, and heats the sealed substrate W.

Further, as shown in fig. 14, the stage moving mechanism 117 moves the carry-out stage 115B to the conveying position X2. At this position, the half-cut sealed substrate W is transported to the carry-out stage 115B by the first holding mechanism 3. The stage moving mechanism 117 moves the carry-out stage 115B to the receiving position X1. At this position, the sealed substrate W is accommodated in the substrate accommodating portion 111 by the substrate moving portion 116 from the carry-out stage 115B. Further, although the half-cut sealed substrate W is accommodated in the receiving position X1, an accommodating position for accommodating the sealed substrate W may be additionally set, and the sealed substrate W may be accommodated in the substrate accommodating portion 111 at the accommodating position.

Blade replacing mechanism

As shown in fig. 10 and 15, the cutting device 100 of the present embodiment includes a blade replacement mechanism 24 for automatically replacing the blades 41A and 41B. Specifically, in the present embodiment, the blade replacement mechanism 24 may replace the blades 41A and 41B from the two spindle portions 42A and 42B, respectively. The blade replacement mechanism 24 accommodates the blades 41A and 41B in the blade accommodation portion 25 in a state where the removed blades 41A and 41B are held, holds new blades 41A and 41B, and conveys them to the spindle portions 42A and 42B for attachment. The blade replacement mechanism 24 corresponds to a machining tool replacement mechanism.

Here, when the structure of the cutting mechanism 4 is described, as shown in fig. 16, the cutting mechanism includes: blades 41A, 41B; a spindle portion 42A and a spindle portion 42B for rotating the blades 41A and 41B; and a pair of flanges 43, 44 for detachably fixing the blade 41A, 41B to the spindle portion 42A, 42B. The pair of flanges 43, 44 includes: an inner flange 43 fixed to the spindle portion 42A and the spindle portion 42B and located close to the spindle portion 42A and the spindle portion 42B; and an outer flange 44 configured to be detachable from the spindle portions 42A and 42B and to be away from the spindle portions 42A and 42B. The outer flange 44 is fixed by a detachable member 45 such as a nut in a state of being attached to the central shaft portion of the inner flange 43. The blades 41A and 41B are detachable from the spindle portions 42A and 42B by the detachable member 45.

As shown in fig. 10 and 15, the blade replacement mechanism 24 includes: a suction arm 241 sucking the blade 41A, the blade 41B, and the outer flange 44; and an arm moving mechanism 242 for moving the suction arm 241 relative to the cutting mechanism 4. The arm moving mechanism 242 corresponds to a holding portion moving mechanism.

As shown in fig. 17, the adsorption arm 241 includes: a first suction portion 241A that sucks one of the surfaces (the surface on the outer flange 44 side) of the blades 41A and 41B; and a second suction portion 241b that is located inside the first suction portion 241a and sucks a surface (a surface opposite to the inner flange 43) of the outer flange 44. The suction arm 241 further includes a detachable member rotating portion 241c, and the detachable member rotating portion 241c is positioned inside the second suction portion 241B and engages with the detachable members 45 (here, nuts) of the spindle portion 42A and the spindle portion 42B to detach the detachable members 45. The first suction unit 241a and the second suction unit 241b are connected to a suction pump (not shown) provided outside the suction arm 241. The attachment/detachment member rotating portion 241c is configured using a rotating mechanism (not shown) such as a motor for rotating the attachment/detachment member 45.

As shown in fig. 15, the arm moving mechanism 242 includes: a Y-direction moving mechanism 242a for moving the suction arm 241 in the Y-direction; and an X-direction moving mechanism 242b that moves the suction arm 241 in the X-direction. The arm moving mechanism 242 may also have a mechanism for moving the suction arm 241 in the Z direction.

The Y-direction moving mechanism 242a is configured using a moving rail 117a of the stage moving mechanism 117, and has a Y-direction slider 242a1 that slides along the moving rail 117 a. The Y-direction slider 242a1 is driven by a linear motor, for example, and linearly reciprocates on the movement rail 117 a. The Y-direction slider 242a1 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.

The X-direction moving mechanism 242b includes: an X-direction guide 242b2 provided along the X-direction in the Y-direction slider 242a 1; and an X-direction slider 242b1 that moves along the X-direction guide rail 242b 2. The X-direction slider 242b1 is driven by a linear motor, for example, and moves linearly back and forth on the X-direction rail 242b 2. The X-direction slider 242b1 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.

By configuring the blade replacing mechanism 24 in this way, the moving direction of the blade replacing mechanism 24 (the direction along the moving rail 117 a) and the moving direction of the support 812 in the machining moving mechanism 83 (the direction along the X-direction guide 811) are orthogonal to each other in plan view. That is, the suction arm 241 of the blade replacing mechanism 24 moves along the longitudinal direction of the support 812. The term "orthogonal to each other in plan view" means that the movement rails 117a are substantially orthogonal to each other except for the case where they intersect with the X-direction guide rails 811 perpendicularly (90 °). Substantially orthogonal means a state of intersecting with a few errors from the vertical, for example, a state of intersecting with 85 ° or more and 95 ° or less.

In addition, when the blade 41A and the blade 41B are replaced, as shown in fig. 18, the machining moving mechanism 83 moves the cutting mechanism 4 to a predetermined replacement position. Specifically, the X-direction moving unit 81 moves the support body 812 to the moving rail 117a side (the blade replacing mechanism 24 side), and moves the cutting mechanism 4 to a predetermined replacing position. The blade replacement mechanism 24 moves along the movement rail 117a, and removes the blades 41A and 41B of the cutting mechanism 4 at the replacement position. The blade replacing mechanism 24 accommodates the removed blade 41A and blade 41B in the blade accommodating portion 25, and removes the new blade 41A and blade 41B to attach them to the cutting mechanism 4 at the replacing position. When the blades 41A and 41B of the two cutting mechanisms 4 are replaced, the suction arm 241 is rotated 180 degrees by a rotation mechanism, not shown, and the same operation is performed. Further, when the blade replacing mechanism 24 moves along the moving rail 117a, the slide member 117b provided with the receiving table 115 is retracted to a position that does not interfere with the movement of the blade replacing mechanism 24. Conversely, when the slide member 117b provided with the receiving stage 115 moves along the movement rail 117a, the blade replacing mechanism 24 is retracted to a position that does not interfere with the movement of the slide member 117 b.

As shown in fig. 10, the cutting device 100 of the present embodiment includes: a dressing member housing portion 26 housing a dressing member DP for dressing the blades 41A and 41B; and a dressing table 27 on which the dressing member DP is placed to dress the blades 41A and 41B.

The dressing member receiving portion 26 receives the new dressing member DP and the old dressing member DP, respectively. The dressing member housing portion 26 of the present embodiment is provided on the moving rail 117a, specifically, on the Y-direction slider 242a1 that moves the moving rail 117 a.

The trimming table 27 of the present embodiment is provided between the two cutting tables 2A and 2B. The dressing member DP is conveyed to the dressing table 27 by the first holding mechanism 3 and the conveying moving mechanism 7. The dressing table adsorbs and holds the conveyed dressing member DP. Further, the first holding mechanism 3 is provided with an adsorbing portion (not shown) for adsorbing and holding the dressing member DP. In a state where the dressing table 27 holds the dressing member DP, the cutting moving mechanism 8 moves the cutting mechanism 4 to the dressing table 27, and the blades 41A and 41B of the cutting mechanism 4 are dressed.

Next, a case where the sealed substrate W is cut entirely (singulated) and a case where the sealed substrate W is cut half (groove processed) will be described with reference to fig. 19. The dicing is a process of cutting the sealed substrate W to obtain individual pieces.

(1) Case of performing full cut (singulation) (see FIG. 19 (a))

The sealed substrate positioned in the substrate housing section 111 is transferred to the carry-in stage 115A of the receiving stage 115 by the pushing mechanism 114 and the substrate moving section 116.

The stage moving mechanism 117 moves the carry-in stage 115A to the carrying position, and the sealed substrate W is held by the first holding mechanism 3 and carried to the cutting stage 2A and the cutting stage 2B (carrying-in step).

Then, the sealed substrate W is diced (cut) by the dicing tables 2A and 2B to be singulated (dicing step).

The products P are held by the second conveying mechanism 6 and conveyed to the holding table 141 of the inspection unit 14 or the transfer table 5 (carrying-out step). The following operations are as described as < an example of the operation of the cutting device >.

(2) Case of half-cutting (groove processing) (see FIG. 19 (b))

The sealed substrate W to be half-cut is transferred to the carry-in stage 115A of the receiving stage 115 by the pushing mechanism 114 and the substrate moving unit 116.

The carry-in stage 115A is moved to the carrying position X2, and the sealed substrate W is held by the first holding mechanism 3 and carried to the cutting stage 2A and the cutting stage 2B (carrying-in step).

Then, the sealed substrate W is half-cut (groove processing) by the cutting tables 2A and 2B (half-cutting step).

The half-cut sealed substrate W is held by the first holding mechanism 3 and is transferred to the transfer stage 115B located at the transfer position X2 (transfer step).

The carry-out stage 115B, from which the half-cut sealed substrate W is transferred, is moved to the storage position (receiving position X1) by the stage moving mechanism 117. Then, the substrate moving unit 116 stores the half-cut sealed substrate W in the substrate storing unit 111 (storing step).

Effect of the present embodiment >

According to the cutting apparatus 100 of the present embodiment, the moving rail 117a for moving the receiving stage 115 and the transfer shaft 71 for moving the first holding mechanism 3 are orthogonal to each other in plan view, and therefore, the substrate housing section 111, the cutting stage 2A, and the cutting stage 2B are not arranged in a row in the lateral direction as in the prior art, and therefore, the occupied area of the cutting apparatus 100 can be reduced.

Further, since the first holding mechanism 3 is provided on one side of the transmission shaft 71 and the substrate housing portion 111 is provided on the other side of the transmission shaft 71, the substrate housing portion 111 can be provided without being limited by the movement range of the first holding mechanism 3, and the degree of freedom in arrangement of the substrate housing portion 111 can be increased, so that the occupation area of the cutting device 100 can be reduced.

In the present embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by the common transfer shaft 71 extending along the arrangement direction of the cutting stage 2A, the cutting stage 2B, and the transfer stage 5, and the cutting mechanism 4 is moved by the cutting moving mechanism 8 in the horizontal plane in the X direction along the transfer shaft 71 and the Y direction orthogonal to the X direction, respectively, so that the sealed substrate W can be processed without moving the cutting stage 2A and the cutting stage 2B in the X direction and the Y direction. Therefore, the cutting tables 2A and 2B can be moved without using the ball screw mechanism, and the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member are not required. As a result, the device structure of the cutting device 100 can be simplified. Further, the cutting tables 2A and 2B may not be moved in the X direction and the Y direction, and the occupied area of the cutting device 100 may be reduced.

< other variant embodiments >)

Furthermore, the present invention is not limited to the embodiments.

For example, in the above embodiment, the blade replacement mechanism 24 is movable by the movement rail 117a of the stage movement mechanism 117, but may be configured to be movable along another rail.

The cutting device 100 of the above embodiment performs both the full cutting operation and the half cutting operation, but may perform only the full cutting operation. In this case, the receiving station 115 may be only the loading station 115A. In addition, only half-cutting operation may be performed. In this case, the structure for carrying out the product P by the second holding mechanism 6 or the like is not required.

In the above embodiment, the cutting device of the double-table type and double-spindle structure has been described, but the present invention is not limited to this, and may be a cutting device of the single-table type and single-spindle structure, a cutting device of the single-table type and double-spindle structure, or the like.

The transfer table 5 of the embodiment is an index table that is temporarily placed before sorting into the various trays 21, but the transfer table 5 may be a holding table 141 of the reversing mechanism 14.

Further, in the above embodiment, the products P are sorted from the transfer table 5 to the trays 21, but may be carried and attached to an adhesive tape disposed inside the frame-like member.

Further, since the cam rack member constituting the transmission shaft 71 may be constituted by connecting a plurality of cam rack members, for example, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detachable) between the second cleaning mechanism 19 and the inspection unit 13. In this case, for example, a module for performing a different type of inspection from the inspection in the inspection unit 13 may be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. In addition to the configuration illustrated here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detachable) at a place, or an additional module may be configured as a module for various functions other than inspection.

The machining device of the present invention may perform machining other than cutting, for example, cutting or grinding.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

Industrial applicability

According to the present invention, the occupied area of the processing device can be reduced.

Description of symbols

100: cutting device (processing device)

W: sealed substrate (object)

P: product (processed product)

2A, 2B: cutting table (working table)

3: first retaining mechanism

4: cutting mechanism (processing mechanism)

5: load-transferring workbench

6: second holding mechanism

7: moving mechanism for conveying

71: transmission shaft

8: cutting moving mechanism (processing moving mechanism)

111: substrate accommodating portion (object accommodating portion)

115: receiving station

115A: carry-in table

115B: platform for carrying out

117a: mobile rail

118: positioning mechanism

24: blade replacement mechanism (machining tool replacement mechanism)

Claims

1. A processing apparatus comprising:

a processing object accommodating section for accommodating a processing object;

a processing table for processing the object by a processing means;

a receiving table for receiving the object from the object receiving unit;

a stage moving mechanism having a moving rail for moving the receiving stage to a transport position;

a first holding mechanism for holding the object to be processed in order to convey the object to the processing table; and

a transfer moving mechanism having a transfer shaft for moving the first holding mechanism between the receiving table and the processing table at the transfer position,

the transmission axis and the moving track are orthogonal to each other in a planar view.

2. The processing apparatus according to claim 1, wherein the object housing portion and the first holding mechanism are provided on opposite sides of the transmission shaft in a planar view.

3. The processing apparatus according to claim 1 or 2, further comprising a processing tool changing mechanism that changes a processing tool of the processing mechanism,

the machining tool changing mechanism is movable by the moving rail.

4. A processing apparatus according to any one of claims 1 to 3, wherein the receiving stage has a positioning mechanism that performs positioning of the object to be processed.

5. The processing apparatus according to any one of claims 1 to 4, wherein the receiving station has: a loading table for loading the object; and a carrying-out table for carrying out the half-cut object to be processed,

the half-cut object is conveyed from the processing table to the carry-out table, and the half-cut object is accommodated in the object accommodating portion via the carry-out table.

6. The processing apparatus according to any one of claims 1 to 5, comprising: a transfer table for moving the processed object; and

A second holding mechanism for holding the processed object in order to convey the processed object from the processing table to the transfer table,

the second holding mechanism is configured to be movable along the transmission shaft.

7. The processing apparatus according to claim 6, wherein the transfer stage moves the object to be processed which has been completely cut,

the second holding mechanism holds the object subjected to full cutting.

8. The machining device according to any one of claims 1 to 7, further comprising a machining moving mechanism that moves the machining mechanism in a first direction along the transmission axis and a second direction orthogonal to the first direction, respectively, on a horizontal plane.

9. A method of manufacturing a processed product, the processed product being manufactured using the processing apparatus according to any one of claims 1 to 8.

10. A method of manufacturing a processed product, the processed product manufactured using the processing apparatus according to any one of claims 5 to 7, the method comprising:

a carry-in step of carrying in the object to be machined, which is to be half-cut, from the carry-in table to the machining table;

A half-cutting step of half-cutting the object to be processed carried in by the carrying-in step;

a carrying-out step of carrying out the object half-cut by the half-cutting step to the carrying-out table; and

and a storage step of storing the object carried out to the carrying-out table by the carrying-out step in the object storage section.