JP2017123437A - Substrate cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cutting device which can perform both cutting and bevelling of a substrate automatically.SOLUTION: A substrate cutting device includes a first position having a splitting table for suction holding a substrate, and division means for cutting and dividing the substrate suction held by the splitting table, and a second position having a bevelling table placed on the downstream side of the first position, and suction holding multiple substrates cut at the first position, and bevelling means for cutting and bevelling the corners of the cut substrate suction held on the bevelling table. Suction means for suction holding the substrate, and transporting the cut substrate from the first position to the second position is also provided.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate cutting apparatus.

  As an apparatus for cutting a substrate, for example, there is one shown in Patent Document 1. The substrate cutting apparatus of Patent Document 1 includes a table that horizontally holds and holds a substrate, a loading unit that loads the substrate into the table, a cutting unit that cuts the substrate and divides the substrate into a plurality of pieces, and a piece from the table. Unloading means for unloading is provided. In the operation of the substrate cutting apparatus, the substrate is loaded onto the table by the loading means, and the substrate on the table is cut into a plurality of rows in one direction by the cutting means. Thereafter, the table is rotated 90 ° in the circumferential direction in the horizontal plane, and the substrate is cut again by the cutting means in a direction perpendicular to the one direction. In this way, the substrate is cut into a lattice shape and divided into a plurality of pieces. When the cutting of the substrate is completed, the individual pieces on the table are carried out by the carrying-out means.

There is also a substrate cutting device that quarter-cuts a large substrate with a dividing means such as a blade. In this case, the corner of each substrate after cutting has a sharp edge. For this reason, if the corner is left with a sharp edge, the magazine for holding the substrate may be scraped, or a hole will be made in the mask (which is a printing plate used for printing and mounted on the substrate) during the mask process. There is a risk that the sheet may be torn by contact with the sheet used during exposure. In order to prevent these problems, it is necessary to chamfer the corners of each substrate after dividing the large substrate with a blade.

Therefore, conventionally, there is a method of dividing and chamfering a substrate by router processing. As shown in FIG. 8A, the router processing is performed by moving a rotary cutting tool 102 (router bit) having a cutting edge 101 in contact with the workpiece 100 while moving the workpiece 100. The outer diameter is processed. In this case, a plurality of large substrates (for example, 10) are stacked as the workpiece 100, and the waste plate 103 is disposed on the uppermost surface of the large substrate in order to suppress the burr of the substrate or prevent the substrate from warping. Mount. Then, as shown in FIG. 8 (a), the large board is cut along the alternate long and short dash line by the router bit 102 together with the discard plate 103, and further, as shown in FIG. The corner portion is chamfered by forming a radius by moving and cutting the router bit 102 in contact with the outer diameter surface of the edge portion of the corner portion.

Japanese Patent No. 3530483

However, the above method has a problem that it takes time and effort because an operator piles up a large board and further mounts a discard board and sets it on the router machine. Further, since the router bit generally has a processing speed of about 20 to 40 mm / sec, there is a problem that it takes time to cut and divide a large substrate. Furthermore, in the method of cutting a plurality of large substrates in a stacked manner, recognition correction cannot be performed for each substrate, so that it cannot be cut with high accuracy. When the cutting accuracy is poor, it is necessary to cut off the inaccurate end portion (hatching in FIG. 9) as an end material, resulting in a problem that an area usable as a product is narrowed.

  Therefore, in view of such a situation, the present invention intends to provide a substrate cutting apparatus that can automatically perform both cutting and chamfering of a substrate.

The substrate cutting apparatus of the present invention includes a first position having a dividing table for sucking and holding a substrate, and a dividing means for cutting and dividing the substrate sucked and held by the dividing table, and the first position. A chamfering table that is disposed on the downstream side of the chamfer and holds the plurality of cutting substrates cut at the first position by suction, and a corner portion of the cutting substrate that is sucked and held by the chamfering table is cut. And a second position having chamfering means for chamfering, and a suction means for sucking and holding the substrate and transporting the cut substrate from the first position to the second position.

  According to the substrate cutting apparatus of the present invention, the dividing means is provided at the first position, the chamfering means is provided at the second position, and the suction means for conveying the cut substrate from the first position to the second position is provided. Thus, when the large substrate is transferred to the first position, the large substrate is divided, and then the cut substrate is transferred to the second position and chamfered. In this case, when chamfering is performed at the second position, the next large substrate transported at the first position can be divided, and chamfering and division can be performed simultaneously. Furthermore, division with a large amount of machining is performed at the first position, and chamfering with a small amount of machining is performed at the second position. Since these are divided, a dividing means for cutting and a chamfering means for cutting are provided. Each can be provided separately, can be processed by means according to the processing amount, and each operation can be performed efficiently. Further, since the substrates are processed one by one, the alignment (positioning mark) of each substrate can be recognized and the position can be corrected each time before processing, so that accurate processing can be performed.

The said structure WHEREIN: The said division | segmentation means can be provided with a blade cutting blade. In addition, the chamfering means may include a router bit that is attached to the tip of the spindle and is driven to rotate to perform router processing.

  The said structure WHEREIN: You may provide the water discharge port which discharges water toward the front-end | tip part of a router in the said chamfering means. Thereby, the powder generated by cutting or cutting the substrate can be removed.

  In the above configuration, the chamfering table has four table components disposed along the circumferential direction of the central portion, a camshaft disposed immediately below the central portion, and moves the camshaft up and down. A vertical movement mechanism and four slide mechanisms that slide integrally with the respective table components by the vertical movement of the camshaft, the camshaft, the vertical movement mechanism, and the respective slide mechanisms; Thereby, each said table structure can be spaced apart and approached from the said center part. In this case, the respective table constituents can be separated from the central portion by the raising of the camshaft, and the respective table constituents can approach the central portion by the lowering of the camshaft. Thereby, the cut substrates are separated from each other to form a gap, and a space for the chamfering means to enter can be secured. Thereby, chamfering can be performed smoothly.

  In the present invention, both cutting and chamfering of the substrate can be automatically performed.

It is a simplified top view which shows the board | substrate cutting device of this invention. It is a simplified side view which shows the board | substrate cutting device of the said FIG. It is a simplified top view which shows the state which the table structure body of the chamfering table which comprises the said board | substrate cutting device of the said FIG. 1 approached. It is a simplified top view which shows the state which the table structure body of the table for chamfering which comprises the board | substrate cutting device of the said FIG. 1 separated. It is a simplified side view of the chamfering table which comprises the board | substrate cutting device of the said FIG. It is a simple perspective view which shows the method of cut | disconnecting a board | substrate with the board | substrate cutting device of this invention, (a) shows cutting of a board | substrate, (b) is a figure which shows chamfering of a board | substrate. It is a figure which shows the board | substrate cut | disconnected by the board | substrate cutting device of this invention, (a) shows before cutting | disconnection of a board | substrate, (b) is a figure which shows after chamfering of a board | substrate. It is a simplified perspective view which shows the method of cut | disconnecting a board | substrate with the conventional board | substrate cutting apparatus, (a) shows cutting of a board | substrate, (b) is a figure which shows chamfering of a board | substrate. It is a figure which shows the board | substrate cut | disconnected by the conventional board | substrate cutting device.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  The substrate cutting apparatus of the present invention chamfers the corner portion of the cut substrate after dividing the large substrate.

  FIG. 1 is a plan view showing a substrate cutting apparatus according to the present invention. This substrate cutting device is arranged at a first position P1 for dividing the large substrate 1 (see FIG. 2) and a plurality of cuts arranged at the downstream side of the first position P1 and cut at the first position P1. 2nd position P2 which chamfers the corner part of board | substrates 2a-2d (refer FIG. 2). Furthermore, the first position P1 includes a workpiece replacement position P1a and a processing position P1b, and the second position P2 includes a workpiece replacement position P2a and a processing position P2b. In addition, the substrate cutting apparatus of the present invention includes a suction unit 3 that sucks and holds the substrate and transports the substrate from the first position P1 to the second position P2. In the first position P1, a nozzle 30 is provided between the workpiece replacement position P1a and the machining position P1b to discharge water and wash away the cutting powder. In the second position P2, Between the replacement position P2a and the processing position P2b, there is provided a nozzle 31 that can discharge water and wash away the cutting powder.

The first position P1 has a dividing table 4 for sucking and holding the large substrate 1 and a dividing means 5 for cutting and dividing the large substrate 1 sucked and held by the dividing table 4. Further, position recognition means (not shown) for recognizing the position of the large substrate 1 is provided.

The dividing table 4 is arranged horizontally, and a large number of suction ports (not shown) for sucking and holding the large substrate 1 are formed on the upper surface of the dividing table 4. A pair of guide rails 6 and 6 are arranged extending in the x direction in the figure, and the dividing table 4 is arranged along the guide rails 6 and 6 with the workpiece replacement position P1a as indicated by an arrow A. A reciprocating movement with the processing position P1b is possible. The dividing table 4 is configured to rotate in the circumferential direction within a horizontal plane by a rotation mechanism (not shown).

The dividing means 5 has a blade cutting blade (hereinafter simply referred to as a blade 8) attached to the spindle 7 and capable of rotating at high speed. The spindle 7 and the blade 8 are arranged symmetrically on both sides in the direction orthogonal to the longitudinal direction of the guide rail 6. The spindle 7 and the blade 8 are configured to be reciprocally movable in a direction (Y direction) orthogonal to the moving direction (X direction) of the dividing table 4. Further, the spindle 7 and the blade 8 are movable in the vertical direction, so that the blade 8 can approach / separate the large substrate 1 on the dividing table 4.

The second position P2 includes a chamfering table 9 that sucks and holds the plurality of cutting substrates 2a to 2d, and a surface that is chamfered by cutting corner portions of the cutting substrates 2a to 2d sucked and held by the chamfering table 9. And taking means 10. Moreover, the position recognition means (illustration omitted) which recognizes the position of the cutting substrates 2a-2d is provided.

The chamfering table 9 is disposed so as to be horizontal. As shown in FIGS. 3 and 4, the chamfering table 9 includes four table components 16a to 16d disposed along the circumferential direction of the central portion 15 of the chamfering table 9, and FIG. As described above, the camshaft 18 disposed immediately below the center, the vertical movement mechanism 19 that moves the camshaft 18 up and down, and the vertical movement of the camshaft cause the table structure bodies 16a to 16d to slide integrally. The four slide mechanisms 20a to 20d are provided.

Each of the table components 16a to 16d has a plurality of suction ports (not shown) for holding the cut substrates 2a to 2d by suction on the upper surface. Each of these table components 16a to 16 can be separated from the central portion 15 as indicated by the arrows in FIG. 3 or approached from the central portion 15 as indicated by the arrows in FIG. .

As shown in FIG. 5, the camshaft 18 includes a tapered portion 21 having a tip portion whose diameter increases downward and a large-diameter portion 22. The camshaft 18 moves up and down by a vertical movement mechanism 19 made of, for example, an air cylinder.

The slide mechanisms 20a to 20d include cam followers 23a to 23d, arms 24a to 24d, block bodies 25a to 25d, sliders 26a to 26d, shafts 28a to 28d, and support bodies 27a to 27d, respectively. . The shafts 28a to 28d are supported by the supports 27a to 27d so as to extend in the horizontal direction, and the sliders 26a to 26d are slidably fitted to the shafts 28a to 28d. Further, block bodies 25a to 25d are provided integrally with the sliders 26a to 26d, and table constituent bodies 16a to 16d and arms 24a to 24d are attached to the block bodies 25a to 25d, and the arms 24a to 24d. Cam followers 23a to 23d are provided at the tip of 24d.

As shown in FIGS. 3 and 5, the cam followers 23 a to 23 d are in contact with the tapered portions 21 a to 21 d of the cam shaft 18. When the camshaft 18 is lifted by driving the vertical movement mechanism 19, the cam followers 23 a to 23 d come into contact with the large diameter portion 22 by being guided by the tapered portion 21. Accordingly, the cam followers 23a to 23d, the arms 24a to 24d, the block bodies 25a to 25d, the sliders 26a to 26d, and the table constituent bodies 16a to 16d are integrally slid and moved as indicated by arrows in FIG. Then, as shown in FIG. 4, the table constituting bodies 16 a to 16 d are separated from the central portion 15. 5 shows the table constituent bodies 16a and 16d and the slide mechanisms 20a and 20d, the table constituent bodies 16b and 16c and the slide mechanisms 20b and 20c have the same configuration.

As shown in FIG. 4, when the camshaft 18 is lowered by driving the vertical movement mechanism 19 from the state where the table constituting bodies 16 a to 16 d are separated from the central portion 15, the cam followers 23 a to 23 d abut against the tapered portion 21. As a result, the cam followers 23a to 23d, the arms 24a to 24d, the block bodies 25a to 25d, the sliders 26a to 26d, and the table constituent bodies 16a to 16d are integrally slid and moved as indicated by arrows in FIG. Then, as shown in FIG. 3, the table components 16 a to 16 d approach the center portion 15.

As shown in FIG. 1, a pair of guide rails 11, 11 are arranged to extend in the x direction of FIG. 1, and a chamfering table 9 (that is, table components 16 a to 16 d and a camshaft) 18, the vertical movement mechanism 19 and the slide mechanisms 20a to 20d) can reciprocate between the workpiece replacement position P2a and the machining position P2b as indicated by an arrow B along the guide rails 11 and 11. . Further, the chamfering table 9 is configured to rotate in a circumferential direction within a horizontal plane by a rotation mechanism (not shown).

As shown in FIG. 2, the chamfering means 10 includes a spindle 12, a router bit 13 that is attached to the tip of the spindle 12 and is driven to rotate, and a water discharge nozzle 14. The router bit 13 is rotated by a rotary drive unit such as a servo motor (not shown), and the spindle 12 and the router bit 13 reciprocate in a direction (Y direction) orthogonal to the moving direction (X direction) of the chamfering table 9. It is configured to be movable. Further, the spindle 12 and the router bit 13 are movable in the vertical direction, so that the router bit 13 can approach / separate the cutting substrates 2 a to 2 d on the chamfering table 9.

The water discharge nozzle 14 is provided so as to be able to move integrally with the spindle 12 and the router bit 13, and the nozzle tip portion serving as a water discharge port faces the tip portion side (lower end portion side) of the router bit 13. . Thereby, water supplied from a water supply source (not shown) is discharged from the water discharge nozzle 14 toward the tip of the router bit 13.

The suction means 3 sucks and holds the substrate at its tip, and, as shown by the arrow C in FIG. 1 or the arrow in FIG. 2, via the transport means (not shown), the workpiece replacement position P1a at the first position P1 Movement between the workpiece replacement position P2a at the second position P2 is possible. In the suction means 3, the substrate is vacuum-sucked through a suction hole opened in the lower end surface thereof, and the substrate is sucked into the lower end surface of the suction means 3. When the vacuum suction (evacuation) is released, the substrate is detached from the suction means 3.

A method for cutting a substrate using the substrate cutting apparatus of the present invention will be described. As shown in FIG. 1, the dividing table 4 is located at the workpiece replacement position P1a of the first position P1. When the large substrate 1 held by the suction means 3 is conveyed to the dividing table 4, the dividing table 4 moves to the processing position P1b of the first position P1.

The large substrate 1 is previously provided with an alignment (positioning mark) for recognizing the position, and the position data of the large substrate 1 can be acquired by recognizing the alignment by the position recognition means. Based on this position data, while controlling the operation of the spindle 7, the large substrate 1 is cut into four parts by the blade 8 as shown by the one-dot chain line in FIGS. At this time, the large substrate 1 is cut by the blade 8 at a processing speed of, for example, about 150 mm to 200 mm / sec.

After dividing the large substrate 1, the dividing table 4 moves to the workpiece replacement position P1a at the first position P1. During or after the cutting of the large substrate 1, the nozzle 30 discharges water to wash away the cutting powder.

The chamfering table 9 is located at the workpiece replacement position P2a of the second position P2. As shown by the arrows in FIG. 2, the suction means 3 descends from above the dividing table 4, holds the divided substrates 2 a to 2 d placed on the dividing table 4, and rises, thereby chamfering the table 9. Then, the divided substrates 2 a to 2 d are transported to the chamfering table 9. In this case, one divided substrate 2a is placed on one table structure 16a. That is, one divided substrate 2b, 2c, and 2d is mounted on the table structures 16b, 16c, and 16d, respectively.

When the divided substrates 2a to 2d are transferred to the workpiece replacement position P2a at the second position P2, the large substrate 1 to be processed next is placed on the division table 4 positioned at the workpiece replacement position P1a at the first position P1. Be transported.

Thereafter, the chamfering table 9 moves to the machining position P2b of the second position P2. Even at the first position P1, the dividing table 4 moves to the machining position P1b of the first position P1.

As the air cylinder 19 is driven, the camshaft 18 is raised, and the respective table components 16a to 16d are separated from the central portion 15 as indicated by arrows in FIG. Thereby, as shown in FIG. 4, each table structure (namely, each cutting board | substrate) mutually spaces apart, and a clearance gap is formed. This gap becomes a space for the router bit 13 to enter, and the router bit 13 can move while contacting the side surfaces of the divided substrates 2a to 2d.

Even at the processing position P2b of the second position P2, position data of the divided substrates 2a to 2d can be acquired by recognizing alignment by the position recognition unit. Based on this position data, while controlling the operation of the spindle 12, the router bit 13 moves while abutting against the side surfaces of the corner portions of the cutting substrates 2 a to 2 d, so that FIGS. 6 (b) and 7 (b). As shown, the corner is cut to form a round. In this way, the corner portions of the respective divided substrates 2a to 2d are chamfered. At this time, the cutting substrates 2a to 2d are cut by the router bit 13 at a processing speed of, for example, about 20 mm to 40 mm / sec. Moreover, it discharges with the nozzle 14 and it cuts, removing the powder which generate | occur | produced by cutting.

Simultaneously with the cutting at the second position P2, at the first position P1, the large substrate 1 is cut by the method described above.

When the camshaft 18 is lowered after chamfering the cut substrates 2a to 2d, the respective table components 16a to 16d approach toward the central portion 15 as shown by arrows in FIG. Thereafter, the chamfering table 9 moves to the workpiece replacement position P2a at the second position P2. In addition, during the cutting of the cut substrates 2a to 2d or after the cutting, the nozzle 31 discharges water to wash away the cutting powder. Even at the first position P1, the dividing table 4 moves to the workpiece replacement position P1a.

The suction means 3 is lowered from above the chamfering table 9, the chamfered cut substrates 2a to 2d are held, and the cut substrates 2a to 2d are transferred to a subsequent process. Further, the cutting substrates 2a to 2d positioned at the workpiece replacement position P1a at the first position P1 are conveyed to the chamfering table 9, and chamfering is performed at the second position P2 by the above-described method.

  In the substrate cutting apparatus according to the present invention, the dividing means 5 is provided at the first position P1, the chamfering means 10 is provided at the second position P2, and the cutting substrates 2a to 2d from the first position P1 to the second position P2. Is provided, the large substrate 1 is divided when the large substrate 1 is conveyed to the first position P1, and then the cut substrates 2a to 2d are conveyed to the second position P2. It is possible to chamfer and automatically perform both cutting and chamfering of the substrate.

In this case, when chamfering is performed at the second position P1, the next large substrate 1 transported at the first position P1 can be divided, and chamfering and division can be performed simultaneously. it can. Further, division with a large machining amount is performed at the first position P1, and chamfering with a small machining amount is performed at the second position P2, and these are divided. Therefore, the dividing means 5 for cutting and the chamfering for cutting are separated. The means 10 can be provided separately, and can be processed by means according to the processing amount, so that each operation can be performed efficiently. Further, since the substrates are processed one by one, the alignment (positioning mark) of each substrate can be recognized and the position can be corrected each time before processing, so that accurate processing can be performed.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications are possible. For example, in the embodiment, workpiece replacement positions P1a and P2a are provided. These may be omitted and may be directly conveyed to the processing positions P1b and P2b by the suction means 3. The tapered portion 21 at the distal end portion of the camshaft 18 is opposite to the embodiment (that is, the distal end portion is reduced in diameter downward), and as the camshaft 18 is lifted, the respective table components 16a to 16d are Each of the table constituting bodies 16 a to 16 d may be moved away from the central portion 15 by approaching the central portion 15 and lowering the camshaft 18. The vertical movement mechanism 19 is not limited to an air cylinder. The nozzles 14, 30, and 31 may be omitted. The division of the large substrate 1 by the dividing unit 8 is not limited to four divisions, and the chamfering by the chamfering unit 13 may be performed at all four corner portions or only at any one of the corner portions.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Cutting substrate 3 Suction means 4 Dividing table 8 Blade 9 Chamfering table 13 Router bit 14 Water outlet 15 Central portion 16 Table structure 18 Camshaft 19 Air cylinder 20 Slide mechanism P1 First position P2 Second position position

The substrate cutting apparatus according to the present invention has a first position having a dividing table for sucking and holding the substrate and a dividing means having a blade cutting blade and for cutting and dividing the substrate sucked and held by the dividing table. A chamfering table that is disposed downstream of the first position and that holds a plurality of cut substrates cut at the first position by suction, and is attached to the tip of the spindle and is driven to rotate. And a chamfering means for chamfering by cutting a corner portion of the cutting substrate adsorbed and held by the chamfering table. And a second position having suction means for sucking and holding the substrate and transporting the cut substrate from the first position to the second position. .

Claims (6)

A first position having a dividing table for sucking and holding the substrate, and a dividing means for cutting and dividing the substrate sucked and held by the dividing table;
A chamfering table that is disposed downstream of the first position and that holds a plurality of cutting substrates cut at the first position by suction, and a cutting substrate that is sucked and held by the chamfering table. A second position having chamfering means for chamfering by cutting the corner portion,
An apparatus for cutting a substrate, comprising: suction means for sucking and holding the substrate and transporting the cut substrate from the first position to the second position.   The substrate cutting apparatus according to claim 1, wherein the dividing unit includes a blade cutting blade. The substrate cutting apparatus according to claim 1, wherein the chamfering unit includes a router bit that is attached to a tip end of a spindle and rotates to drive the chamfering unit.   The substrate cutting apparatus according to any one of claims 1 to 3, wherein the chamfering means is provided with a water discharge port for discharging water toward the tip of the router.   The chamfering table includes four table components disposed along a circumferential direction of a central portion, a camshaft disposed immediately below the central portion, and a vertical movement mechanism that moves the camshaft up and down. And four slide mechanisms that slide integrally with the respective table components by the vertical movement of the camshaft, and the camshaft, the vertical movement mechanism, and the respective slide mechanisms, respectively. 5. The substrate cutting apparatus according to claim 1, wherein the table structure is spaced from and approaches the central portion. The table structure is separated from the central portion by raising the camshaft, and the table constituting body approaches the central portion by lowering the camshaft. 5. The substrate cutting apparatus according to 5.

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