CN107030902A - Topping machanism - Google Patents
Topping machanism Download PDFInfo
- Publication number
- CN107030902A CN107030902A CN201611071041.5A CN201611071041A CN107030902A CN 107030902 A CN107030902 A CN 107030902A CN 201611071041 A CN201611071041 A CN 201611071041A CN 107030902 A CN107030902 A CN 107030902A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Topping machanism is provided.It has：1st, the 2nd chuck table, they keep machined object and moved in the X-axis direction；1st, the 2nd cutting mechanism, they implement machining to the machined object kept on the 1st, the 2nd chuck table；And cleaning unit, it is cleaned to the machined object after cutting, 1st chuck table, which is positioned at the 1st and taken out of, moves into region and the 1st cutting zone, 2nd chuck table, which is positioned at the 2nd and taken out of, moves into region and the 2nd cutting zone, 1st, 2nd cutting mechanism has the 1st respectively, 2nd cutting unit, they have 2 live spindles being disposed on the straight line of Y direction and are respectively arranged in the cutting tool of the mutually opposing end of 2 live spindles, 1st, 2nd cutting mechanism is disposed in the 1st, 2nd takes out of and moves into the position of the centre position in region for axle point-symmetrically, cleaning unit is disposed in the 1st, 2nd takes out of on the straight line for the Y direction for moving into region link.
Description
Technical field
The present invention relates to the topping machanism for carrying out machining to machined objects such as semiconductor wafers.
Background technology
In semiconductor devices manufacturing process, by grid on the front of the semiconductor wafer as substantially circular plate shape
The segmentation preset lines of shape arrangement and mark off multiple regions, the device such as IC, LSI is formed in the region marked off.Also, it is logical
Cross and the region for being formed with device split so as to produce one by one along segmentation preset lines cut-out semiconductor wafer
Semiconductor devices.
Topping machanism along machined objects such as segmentation preset lines cut-out semiconductor wafers has：Chuck table, its is right
Machined object is kept；Cutting unit, it implements machining to the machined object being maintained on the chuck table；And
Cleaning unit, it is cleaned to the machined object machined cut using the cutting unit, and the topping machanism can
The machined objects such as semiconductor wafer are accurately cut off along segmentation preset lines and are divided into device one by one.
Also, Patent Document 1 discloses following topping machanism following：The topping machanism is equipped with 2 to being added
The chuck table that work thing is kept, and it is equipped with 2 machined object implementation cuttings to being maintained on chuck table
The cutting unit of processing, so as to improve production efficiency.
Patent document 1：Specially permit No. 4571851 publication
But, in the topping machanism disclosed in above-mentioned patent document 1, when using 2 cutting units to being maintained at a side
Chuck table on machined object when implementing machining, to the machined object that is maintained on another chuck table
Operation can be interrupted, and there is the problem of production efficiency might not be well.
The content of the invention
The present invention is to complete in view of the foregoing, and its main technical problem is to provide a kind of topping machanism,
Production efficiency is good and is capable of the maximization of restraining device.
In order to solve above-mentioned main technical task, according to the present invention there is provided a kind of topping machanism, it is real to machined object
Apply machining, it is characterised in that
The topping machanism has：
1st chuck table and the 2nd chuck table, they are kept to machined object and are configured in conduct
Moved in the X-direction for processing direction of feed, and be mutually adjacent to be disposed in and vertical with X-direction be used as index feed side
To Y direction on；
1st cutting mechanism and the 2nd cutting mechanism, they are respectively to the 1st chuck table and the 2nd chuck table institute
The machined object of holding implements machining；And
Cleaning unit, its machined object cut the 1st cutting mechanism and the 2nd cutting mechanism is cleaned,
1st chuck table, which is configured to be located in that machined object is carried out taking out of the move into the 1st to take out of, moves into region
With the 1st cutting zone for being equipped with the 1st cutting mechanism, the 2nd chuck table is configured to be located in the straight of Y direction
Take out of with the 1st to move into region and be adjacent to machined object take out of the move into the 2nd and take out of on line and move into region and be equipped with
2nd cutting zone of the 2nd cutting mechanism,
1st cutting mechanism has the 1st cutting unit and the 2nd cutting unit, the 1st cutting unit and the 2nd cutting unit
With 2 live spindles being disposed on the straight line of Y direction and the mutually opposing end for being respectively arranged in 2 live spindles
The cutting tool in portion, the 2nd cutting mechanism has the 1st cutting unit and the 2nd cutting unit, the 1st cutting unit and the 2nd cutting
Unit has 2 live spindles being disposed on the straight line of Y direction and is respectively arranged in the mutually opposing of 2 live spindles
End cutting tool,
1st cutting mechanism and the 2nd cutting mechanism are disposed in take out of to move into region and take out of with the 2nd with the 1st and moved into
Position of the centre position in region for axle point-symmetrically,
The cleaning unit is disposed in take out of the 1st and moves into region and the 2nd and take out of the Y direction for moving into region link
On straight line.
The topping machanism has transport unit, the transport unit machined object is transported to the above-mentioned 1st take out of move into region,
2nd takes out of and moves into region and the cleaning unit.
Unit temporarily is put in addition, being equipped with the topping machanism, this is temporarily put unit and is configured to machined object is temporarily put
2 guide rails in the top of above-mentioned cleaning unit enter between-line spacing adjustment, and above-mentioned transport unit temporarily puts the cutting of unit by being temporarily put in
Machined object before processing is transported to being positioned at the 1st and take out of to move into the 1st chuck table in region and be positioned at the 2nd and take out of and moved into
2nd chuck table in region, and will clean the machined object that completes from cleaning unit and transport to temporarily putting unit, and from fixed
Take out of to move into the 1st chuck table in region and be positioned at the 2nd and take out of positioned at the 1st and move into the 2nd chuck table in region and will cut
The machined object machined is cut to transport to cleaning unit.
Above-mentioned transport unit has the 1st transport unit and the 2nd transport unit, and the 1st transport unit will temporarily be put in and temporarily put list
Machined object before the machining of member transports to being positioned at the 1st and take out of to move into and the 1st chuck table in region and is positioned at the 2nd
Take out of the 2nd chuck table for moving into region, and the machined object that completes will be cleaned from cleaning unit and transport to temporarily putting unit,
2nd transport unit moves into the 2nd of region from being positioned at the 1st and take out of to move into the 1st chuck table in region and be positioned at the 2nd and take out of
Chuck table transports the machined object that machining is completed to cleaning unit.
Also, box workbench is equipped in topping machanism, the box workbench in the X-axis direction with above-mentioned temporarily to put unit adjacent
Ground is loaded to the box for being accommodated with machined object, and is equipped with to take out of in the topping machanism and is moved into unit, and this, which takes out of, moves into
Machined object before the machining that unit is retreated and will stored in the box placed by box workbench in the X-axis direction take out of to
Temporarily put unit, and box is moved into from temporarily putting unit and cleaning the machined object that completes.
The topping machanism of the present invention has：
1st chuck table and the 2nd chuck table, they are kept to machined object and are configured in conduct
Moved in the X-direction for processing direction of feed, and be mutually adjacent to be disposed in and vertical with X-direction be used as index feed side
To Y direction on；
1st cutting mechanism and the 2nd cutting mechanism, they are kept to the 1st chuck table and the 2nd chuck table respectively
Machined object implement machining；And
Cleaning unit, its machined object cut the 1st cutting mechanism and the 2nd cutting mechanism is cleaned,
1st chuck table be configured to be located in machined object take out of the move into the 1st take out of move into region and
Be equipped with the 1st cutting zone of the 1st cutting mechanism, the 2nd chuck table be configured to be located on the straight line of Y direction with
1st takes out of to move into region and be adjacent to that machined object is carried out taking out of the move into the 2nd taking out of to move into and region and is equipped with the 2nd cutter
2nd cutting zone of structure,
1st cutting mechanism has the 1st cutting unit and the 2nd cutting unit, and the 1st cutting unit and the 2nd cutting unit have
2 live spindles being disposed on the straight line of Y direction are cut with the mutually opposing end for being respectively arranged in 2 live spindles
Cutting knife tool, the 2nd cutting mechanism has the 1st cutting unit and the 2nd cutting unit, and the 1st cutting unit and the 2nd cutting unit, which have, matches somebody with somebody
2 live spindles being located on the straight line of Y direction and the cutting for the mutually opposing end for being respectively arranged in 2 live spindles
Cutter,
1st cutting mechanism and the 2nd cutting mechanism are disposed in take out of with the 1st and move into region and take out of and move into region with the 2nd
Meta is set to axle and position point-symmetrically,
Cleaning unit be disposed in the 1st is taken out of move into region and the 2nd take out of move into region link Y direction straight line
On, therefore, in the 1st chuck table and the 2nd chuck table, the 1st cutting mechanism and the 2nd cutting mechanism and cleaning unit
The space wasted is not present in configuration, topping machanism can be made to be configured to small-sized, and cutting tool is carried out more in operator
Make access good when changing etc. and improve workability.
Also, in the topping machanism of the present invention, the 1st cutting unit and the 2nd cutting of the cutting mechanism of composition the 1st can be made
This 2 cutting tools of unit play a role to being positioned at the machined object kept on the 1st chuck table of the 1st cutting zone
And implement machining, and make the 1st cutting unit and the 2nd cutting unit this 2 cutting tools pair of the cutting mechanism of composition the 2nd
The machined object kept on the 2nd chuck table for being positioned at the 2nd cutting zone plays a role simultaneously to implement regulation
Machining, can further improve productivity.
Brief description of the drawings
Fig. 1 is the stereogram of the topping machanism constituted according to the present invention.
Fig. 2 is the stereogram that the structural element of a part for the topping machanism shown in pie graph 1 is decomposed and illustrated.
Fig. 3 is that the structural element of an others part for the topping machanism shown in pie graph 1 is decomposed and illustrated
Stereogram.
Label declaration
2：Static base station；3：1st chuck table mechanism；32：Movable drill base；34：1st chuck table；35：1st adds
Work feed unit；4：2nd chuck table mechanism；42：Movable drill base；44：2nd chuck table；45：2nd processing feeding is single
Member；5：1st cutting mechanism；5a：1st cutting unit；5b：2nd cutting unit；55：Index feed unit；6：2nd cutting mechanism；
6a：1st cutting unit；6b：2nd cutting unit；65：Index feed unit；7：Cleaning unit；8：Temporarily put unit；9：Box is loaded
Unit；10：Box；11：Take out of and move into unit；12：Transport unit；13：1st transport unit；14：2nd transport unit；F：Ring-type
Framework；T：Dicing tape；W：Semiconductor wafer.
Embodiment
Hereinafter, on according to the present invention and constitute topping machanism preferred embodiment, referring to the drawings in detail
It is bright.
The stereogram of one embodiment of the topping machanism constituted according to the present invention is shown in Fig. 1, shown in Fig. 2 pair
Shown in the stereogram that the structural element of a part for topping machanism shown in pie graph 1 is decomposed and illustrated, Fig. 3 to constituting
The stereogram that the structural element of an others part for topping machanism shown in Fig. 1 is decomposed and illustrated.
Topping machanism in embodiment illustrated has：Static base station 2；1st chuck table mechanism 3 and the 2nd chuck
Table mechanism 4, they are disposed on the static base station 2, machined object are kept；1st cutting mechanism the 5 and the 2nd is cut
Mechanism 6, they to the machined object that is maintained on the 1st chuck table mechanism 3 and are maintained at the 2nd chuck table mechanism respectively
Machined object on 4 implements machining.
As depicted in figs. 1 and 2, the 1st chuck table mechanism 3 has：A pair of X-axis guide rails 31,31, they along process into
It is disposed in direction (X-direction) on static base station 2；Movable drill base 32, it is disposed in a pair of X-axis in the way of it can slide
On guide rail 31,31；1st chuck table 34, it keeps to machined object, machined object branch in the way of it can rotate
Hold in the cylindric supporting member 33 arranged in the movable drill base 32；And the 1st processing feed unit 35, it is used to make to match somebody with somebody
Movable drill base 32 provided with the 1st chuck table 34 is along a pair of X-axis guide rails 31,31 in processing direction of feed (X-direction)
Upper movement.Proceed explanation referring especially to Fig. 2, the 1st chuck table 34 has：Workbench main body 341, it is can rotate
Mode be supported on cylindrical shape supporting member 33；Suction tray 342, it is disposed in the upper surface of the workbench main body 341；And
Fixture 343, it is used for the framework of stationary ring, and the framework is propped up the chip as machined object described later by dicing tape
Hold.Workbench main body 341 is formed as that external diameter is bigger than the external diameter of the chip described later as machined object and ratio is by dicing tape pair
The internal diameter of the framework for the ring-type that chip is supported is small.Suction tray 342 is formed by porous ceramics, is connected with attraction unit (not shown)
Connect, suitably effect has negative pressure.Therefore, by being acted attraction unit (not shown) to mounting on suction tray 342
Machined object on suction tray 342 carries out attracting holding.Also, by being disposed in not scheming in the supporting member 33 of cylindrical shape
The pulse motor shown rotates the 1st chuck table 34.
Above-mentioned 1st processing feed unit 35 is made up of external screw rod 351, bearing 352 and pulse motor 353, the external screw rod
351 are abreast disposed between a pair of X-axis guide rails 31,31, the one end of bearing 352 in the way of it can rotate to external screw rod 351
Portion is supported, and the other end of the pulse motor 353 and external screw rod 351 links, and the external screw rod 351 is rotated forward or instead
Turn driving.On the 1st cutting feed unit 35 so constituted, external screw rod 351 is respectively with being formed at above-mentioned movable drill base 32
Internal screw-thread screw (not shown).Therefore, the 1st cutting feed unit 35 can be driven by respectively to pulse motor 353
And external screw rod 351 is rotated forward or is driven reverse, make to be disposed in the 1st chuck table 34 of above-mentioned movable drill base 32 along
Moved in the processing direction of feed (X-direction) of a pair of X-axis guide rails 31,31 in fig. 1 and 2 shown in arrow X.So constitute
1st chuck table 34 is positioned at and machined object is carried out to take out of shown in Fig. 1 moved into and Fig. 2 by the 1st processing feed unit 35
The 1st take out of the 1st cutting zone B1 for moving into and the 1st cutting mechanism 5 being equipped with region A1 and Fig. 1.
2nd chuck table mechanism 4 is adjacent to arranging with above-mentioned 1st chuck table mechanism 3 in the Y-axis direction, constitutes
To be identical with above-mentioned 1st chuck table mechanism 3.I.e., as depicted in figs. 1 and 2, the 2nd chuck table mechanism 4 has：A pair of X
Axis rail 41,41, they are along processing direction of feed (X-direction) and a pair of X for constituting above-mentioned 1st chuck table mechanism 3
Axis rail 31,31 is abreast disposed on static base station 2；Movable drill base 42, it is disposed in a pair of X in the way of it can slide
On axis rail 41,41；2nd chuck table 44, it keeps to machined object, and the machined object is in the way of it can rotate
It is supported on the cylindric supporting member 43 arranged in the movable drill base 42；And the 2nd processing feed unit 45, it is used to make
The movable drill base 42 for being equipped with the 2nd chuck table 44 is processing direction of feed (X-axis side along a pair of X-axis guide rails 41,41
To) on move.2nd chuck table 44 has：Workbench main body 441, it is supported on cylindrical shape in the way of it can rotate
Supporting member 43；Suction tray 442, it is disposed in the upper surface of the workbench main body 441；And fixture 443, it is used for ring-type
Framework be fixed, the framework is supported by dicing tape to the chip as machined object described later.Workbench main body
441 to be formed as external diameter than the external diameter of the chip described later as machined object bigger and than being supported by dicing tape to chip
The internal diameter of the framework of ring-type is small.Suction tray 442 is formed by porous ceramics, is connected, is suitably acted on attraction unit (not shown)
There is negative pressure.Therefore, by being acted attraction unit (not shown) to being positioned on suction tray 442 on suction tray 442
Machined object carry out attracting holding.Also, pass through the pulse electric (not shown) being disposed in the supporting member 43 of cylindrical shape
Machine and rotate the 2nd chuck table 44.
As depicted in figs. 1 and 2, above-mentioned 2nd processing feed unit 45 is by external screw rod 451, bearing 452 and pulse motor
453 are constituted, and the external screw rod 451 is abreast disposed between a pair of X-axis guide rails 41,41, and the bearing 452 is in the way of it can rotate
The one end of external screw rod 451 is supported, the other end of the pulse motor 453 and external screw rod 451 links, to the external screw rod
451 are rotated forward or are driven reverse.On the 2nd cutting feed unit 45 so constituted, external screw rod 451 is respectively with being formed at
The internal screw-thread screw (not shown) of above-mentioned movable drill base 42.Therefore, the 2nd cutting feed unit 45 can be by respectively to pulse electricity
Motivation 453 is driven and external screw rod 451 is rotated forward or is driven reverse, and makes to be disposed in the 2nd of above-mentioned movable drill base 42
Chuck table 44 is moved along in a pair of X-axis guide rails 41,41 processing direction of feed in fig. 1 and 2 shown in arrow X.This
2nd chuck table 44 is positioned at the above-mentioned 1st and taken out of by the 2nd processing feed unit 45 that sample is constituted moves into region A1, in Y-axis side
To straight line on it is adjacent and to machined object take out of the move into the 2nd and take out of and move into region A2 and be equipped with the in Fig. 1
2nd cutting zone B2 of 2 cutting mechanisms 6.
The 1st above-mentioned chuck table mechanism 3 and the 2nd chuck table mechanism 4, which are disposed in take out of with the 1st, moves into region A1
Taken out of with the 2nd and move into the position of region A2 centre position for axle point-symmetrically.
In addition, the example being shown below in the illustrated embodiment：The 1st of the 1st chuck table mechanism 3 will be constituted to add
The pulse of 2nd processing feed unit 45 of the 2nd chuck table mechanism 4 of pulse motor 353 and composition of work feed unit 35
Motor 453 is disposed in the side (X-direction opposite with the side for being equipped with the 1st cutting mechanism 5 and the 2nd cutting mechanism 6 respectively
On inner side), but be equipped with the He of the 1st cutting mechanism 5 by the way that pulse motor 353 and pulse motor 453 are disposed in respectively
The side (outside in X-direction) of 2nd cutting mechanism 6 and make maintainability good.
Then, the 1st cutting mechanism 5 and the 2nd cutting mechanism 6 are illustrated.
As shown in figure 1, the 1st cutting mechanism 5 has the gate that the 1st cutting zone B1 is disposed on above-mentioned static base station 2
Scaffold 51.The scaffold 51 of the gate is made up of the 1st post portion 511 and the 2nd post portion 512 and support 513, and this
1 post portion 511 and the 2nd post portion 512 are arranged across interval in the Y-axis direction, and the support 513 is by the 1st post portion 511 and the 2nd
The upper end in post portion 512 links, and along the index feed direction (Y direction) vertical with the processing direction of feed shown in arrow X
Arrange, the scaffold 51 of the gate is disposed of across above-mentioned 1st chuck table mechanism 3.
The 1st cutting is equipped on the side 513a in the outside of the support 513 for the scaffold 51 for constituting above-mentioned gate
Unit 5a and the 2nd cutting unit 5b.Reference picture 2 proceeds explanation, and the 1st cutting unit 5a and the 2nd cutting unit 5b have respectively
There are indexing movable drill base 52, incision movable drill base 53 and main axle unit 54.Further, since the cuttings of the 1st cutting unit 5a and the 2nd
Structure substantially the same unit 5b, therefore illustrated with reference to the label that the 1st cutting unit 5a is marked.1st cutting
The unit 5a cutting unit 5b of indexing movable drill base 52 and the 2nd indexing movable drill base 52 is respectively arranged with and above-mentioned support
Set a pair of Y-axis guide rails 510,510 are chimeric on the side 513a in 513 outside a pair are configured to by guide groove 520,520
Can by make this pair it is chimeric with a pair of Y-axis guide rails 510,510 by guide groove 520,520 and make indexing movable drill base 52 along one
Y-axis guide rail 510,510 is moved.In addition, point of the cutting unit 5b of indexing movable drill base 52 and the 2nd in the 1st cutting unit 5a
On the face for spending the side opposed with the side 513a in the outside of support 513 in movable drill base 52, it is respectively formed with for preventing
The escape 521 only interfered with index feed unit described later.Also, in the 1st cutting unit 5a indexing movable drill base
On the face of the opposing party of 52 and the 2nd cutting unit 5b indexing movable drill base 52, respectively along the incision feeding side shown in arrow Z
To being provided with a pair of Z axis guide rails 522,522.
The above-mentioned 1st cutting unit 5a cutting unit 5b of incision movable drill base 53 and the 2nd incision movable drill base 53 is distinguished
It is provided with chimeric with a pair of Z axis guide rails 522,522 set in indexing movable drill base 52 (not shown) by guide groove, is configured to
Can be by making this chimeric with a pair of Z axis guide rails 522,522 and make incision movable drill base 53 along a pair of Z axis guide rails by guide groove
522nd, 522 moved in the incision direction of feed (Z-direction) shown in arrow Z.
Reference picture 2 proceeds explanation, and it is single that above-mentioned main axle unit 54 is respectively arranged in the cuttings of the 1st cutting unit 5a and the 2nd
The lower surface of first 5b incision movable drill base 53.The 1st cutting unit 5a cutting unit 5b of main axle unit 54 and the 2nd main shaft
Unit 54 has respectively：Main shaft housing 541；Live spindle 542, it is supported on the main shaft housing 541 in the way of it can rotate；
Cutting tool 543, it is installed on one end of the live spindle 542；And servomotor (not shown), it is to providing cutting water
Cutting water pipe 544 and live spindle 542 are provided carry out rotation driving, the 1st cutting unit 5a main axle unit 54 and the 2nd is cut
The main axle unit 54 for cutting unit 5b is disposed of the axis direction of live spindle 542 and is positioned at index feed side shown in arrow Y
To on the straight line of (Y direction).Also, the 1st cutting unit 5a cutting tool 543 of main axle unit 54 is constituted with constituting the 2nd
The cutting tool (not shown) of cutting unit 5b main axle unit 54 is arranged opposed to each other.In addition, constituting the 1st cutting unit
Shooting unit is equipped respectively in the main shaft housing 541 of the 5a cutting unit 5b of main axle unit 54 and the 2nd main axle unit 54
540, the machining area that the shooting unit 540 is used for the machined object to being maintained on above-mentioned 1st chuck table 34 is clapped
Take the photograph.
1st cutting unit 5a of embodiment illustrated and the 2nd cutting unit 5b have index feed unit 55, the indexing
Feed unit 55 is used to make above-mentioned indexing movable drill base 52 along a pair of Y-axis guide rails 510,510 in index feed direction (Y-axis side
To) on move.Index feed unit 55 is made up of external screw rod 551, bearing 552 and pulse motor 553 respectively, the external screw rod
551 are abreast disposed between a pair of Y-axis guide rails 510,510, and bearing 552 is in the way of it can rotate to the external screw rod 551
One end is supported, and the other end of the pulse motor 553 and external screw rod 551 links, the external screw rod 551 is rotated forward or
Person is driven reverse.In addition, external screw rod 551 be disposed in it is corresponding respectively with the escape 521 for being arranged at above-mentioned indexing movable drill base 52
Height and position.On the index feed unit 55 so constituted, external screw rod 551 is respectively with being formed at above-mentioned indexing movable drill base
52 internal thread 523 is screwed togather.Therefore, index feed unit 55 can be right by being driven respectively to pulse motor 553
External screw rod 551 rotated forward or be driven reverse and make indexing movable drill base 52 along a pair of Y-axis guide rails 510,510 index into
To being moved in direction (Y direction).By making bearing 552 and external screw rod 551 when the indexing movable drill base 52 is moved through slotting
Enter the escape 521 for being arranged at indexing movable drill base 52, and allow the movement of indexing movable drill base 52.
Also, the 1st cutting unit 5a and the 2nd cutting unit 5b in embodiment illustrated have incision feed unit
56, the incision feed unit 56 is used to make above-mentioned incision movable drill base 53 along a pair of Z axis for being arranged at indexing movable drill base 52
Guide rail 522,522 is moved in incision direction of feed (Z-direction).Feed unit 56 is cut respectively by external screw rod 561, not shown
Bearing and pulse motor 562 constitute, the external screw rod 561 is abreast disposed in a pair of Z axis guide rails 522,522, the bearing with
The mode that can be rotated is supported to the one end of the external screw rod 561, and the pulse motor 562 is another with external screw rod 561
End links, and the external screw rod 561 is rotated forward or is driven reverse.On the incision feed unit 56 so constituted, external screw rod
561 screw togather with being formed at the internal thread (not shown) of above-mentioned incision movable drill base 53 respectively.Therefore, incision feed unit 56 can
External screw rod 561 is rotated forward or is driven reverse by being driven respectively to pulse motor 562, incision is moved base
Platform 53 is moved along a pair of Z axis guide rails 522,522 in incision direction of feed (Z-direction).
Then, the 2nd cutting mechanism 6 is illustrated.
2nd cutting mechanism 6 is disposed in take out of with the above-mentioned 1st and moves into region A1 and the 2nd and take out of the interposition for moving into region A2
It is set to axle and the position with above-mentioned 1st cutting mechanism 5 point-symmetrically.The 2nd cutting mechanism 6 so arranged has：The branch of gate
Support frame frame 61, it is disposed of across above-mentioned 2nd chuck table mechanism 4；And the 1st cutting unit 6a and the 2nd cutting unit
6b, they are disposed in the side 613a in the outside of the support 613 for the scaffold 61 for constituting the gate.In addition, the branch of gate
Support frame frame 61 and the scaffold 51 of the gate of above-mentioned 1st cutting mechanism 5 substantially use identical structure, due to the 1st cutting
Unit 6a and the 2nd cutting unit 6b and above-mentioned 1st cutting mechanism 5 the 1st cutting unit 5a and the 2nd cutting unit 5b are substantially adopted
Identical structure is used, therefore is omitted the description.
As noted previously, as above-mentioned 1st cutting mechanism 5 and the 2nd cutting mechanism 6 are disposed in and take out of carrying-region with the above-mentioned 1st
Domain A1 and the 2nd, which takes out of, moves into the position of region A2 centre position for axle point-symmetrically, therefore, it is possible to the sky in the absence of waste
Between and topping machanism is configured to small-sized, and access good and workability when operator carries out replacing etc. of cutting tool and carry
It is high.
As depicted in figs. 1 and 2, it is illustrated that embodiment in topping machanism there is cleaning unit 7, the cleaning unit 7 is matched somebody with somebody
It is located to take out of the 1st where the 1st chuck table 34 and moves into region A1 and the 2nd taking out of where the 2nd chuck table 44
On the straight line for the Y direction for entering region A2 links.The cleaning unit 7 is made up of known rotary cleaning mechanism, the rotary-cleaning
Mechanism by the 1st chuck table 34 by the machined object after the above-mentioned machining of 1st cutting mechanism 5 and in the 2nd chuck
It is maintained on rotary table 71 and is carried out clear by the machined object after the above-mentioned machining of 2nd cutting mechanism 6 on workbench 44
Wash.
Reference picture 1 proceeds explanation, it is illustrated that embodiment in topping machanism have temporarily put unit 8, this temporarily puts list
Member 8 is disposed in the top of above-mentioned cleaning unit 7, and the machined object before machining is temporarily put.As shown in figure 3, this is temporarily put
Unit 8 is made up of 2 supporting rails 81,81 and supporting rail mobile unit 82, and the section of 2 supporting rails 81,81 is formed as L words
Shape, the base end part of 82 pairs of the supporting rail mobile unit, 2 supporting rails 81,81 is supported and 2 supporting rails 81,81 is existed
Acted on direction close to each other and the direction being separated from each other.2 supporting rails 81,81 are respectively by horizontal part 81a and vertical
Portion 81b is constituted, and the framework of the ring-type supported to the semiconductor wafer as machined object described later is supported in horizontal part
81a.What is so constituted temporarily puts unit 8 and can be adjusted to make 2 supporting rails by being acted supporting rail mobile unit 82
81st, 81 vertical component effect 81b clear width and the corresponding size of the external diameter width of the framework of ring-type described later and 2 supporting rails
81st, the wide size of the external diameter width of 81 horizontal part 81a framework of the clear width than ring-type described later.
Reference picture 1 and Fig. 3 proceed explanation, are adjacent in the above-mentioned X-direction for temporarily putting unit 8 and are equipped with box
The box mounting unit 9 of workbench 91,91 pairs of box workbench is accommodated with the box of the semiconductor wafer as machined object described later
10 (Fig. 1 references) are loaded.The box workbench 91 for making box mounting unit 9 by lifting unit (not shown) is lifted.Such as Fig. 1 institutes
Show, being placed in the box 10 of box workbench 91 has multiple mounting framves, and the mounting frame is used for drawing for being installed on the framework F of ring-type
Being loaded as the semiconductor wafer W of machined object before the machining that piece is bonded on the front with T.To so composition
Machining before the box 10 stored of semiconductor wafer W be positioned on the box workbench 91 of box mounting unit 9.
Reference picture 1 and Fig. 3 proceed explanation, it is illustrated that the topping machanism of embodiment have and take out of and move into unit 11,
This, which takes out of, moves into unit 11 and will be installed on the framework F for the ring-type stored in box 10 placed on above-mentioned box workbench 91
Semiconductor wafer W (hereinafter referred to as semiconductor wafer W) on dicing tape T front before the machining that is bonded is to temporarily putting list
Member 8 is taken out of, and the semiconductor wafer W as machined object of completion will be cleaned as aftermentioned to box 10 from unit 8 is temporarily put
Move into.This, which takes out of, moves into unit 11 and has：Carrying arm 111；Part 112 is held, it is disposed in this towards the side of box mounting unit 9
The leading section of carrying arm 111；And carrying arm mobile unit 113, it supports carrying arm 111 to move along X-direction
It is dynamic.Holding part 112 is configured to the pressure-driven of the air provided by cylinder (not shown), and the framework F of above-mentioned ring-type is entered
Row is held.In addition, carrying arm mobile unit 113 can use known actuating mechanism, the actuating mechanism is for example by following portion
Divide and constitute：Driving pulley, it is driven by pulse motor；Follow-up pulley, it matches somebody with somebody with the driving pulley across defined interval
If；And actuating wire, it is wound in driving pulley and follow-up pulley.
Also, the topping machanism in embodiment illustrated has transport unit 12, the transport unit 12 will be temporarily put in temporarily
Put the machined object before the machining of unit 8 to be positioned at the 1st take out of move into region A1 the 1st chuck table 34 and positioning
Taken out of in the 2nd and move into region A2 the 2nd chuck table 44 and transport, and the machined object completed will be cleaned from cleaning unit 7
Taken out of to temporarily putting unit 8 and transport, and from being positioned at the 1st and taking out of to move into region A1 the 1st chuck table 34 and be positioned at the 2nd
The machined object that region A2 the 2nd chuck table 44 completes machining is moved into transport to cleaning unit 7.Transport unit 12
It is made up of in the illustrated embodiment the 1st transport unit 13 and the 2nd transport unit 14.1st transport unit 13 has：Carrying arm
131, it is formed as leading section and protruded downward；Support rod 132, it is disposed in the way of it can move in the vertical direction
The leading section of the carrying arm 131；4 attracting pads 133, it is installed on the lower end of the support rod 132, to the framework F of above-mentioned ring-type
Carry out attracting holding；And carrying arm mobile unit 134, it is supported on carrying arm in the way of it can be moved along Y direction
131.The lifting units such as the cylinder (not shown) of leading section by being disposed in carrying arm 131 make above-mentioned support rod 132 above and below
Side is moved up.Also, the use of the 2nd transport unit 14 and the above-mentioned identical structure of 1st transport unit 13, in the embodiment party of diagram
The downside of the 1st transport unit 13 is disposed in formula.2nd transport unit 14 has in the same manner as above-mentioned 1st transport unit 13：Conveyance
Arm 141, it is formed as leading section and protruded downward；Support rod 142, it is arranged in the way of it can move in the vertical direction
In the leading section of the carrying arm 141；4 attracting pads 143, it is installed on the lower end of the support rod 142, to the framework of above-mentioned ring-type
F carries out attracting holding；And carrying arm mobile unit 144, it along Y direction in the way of it can move to carrying arm 141
Supported.The lifting units such as the cylinder (not shown) of leading section by being disposed in carrying arm 141 make above-mentioned support rod 142 exist
Upper and lower is moved up.
As shown in figure 1, the 1st transport unit 13 and the 2nd transport unit that so constitute arrange about 14 and are configured to 4 suctions
Draw pad 133 and 143 and move into region A2 and cleaning unit linking the above-mentioned 1st along Y direction and take out of to move into region A1 and the 2nd and take out of
Moved on 7 straight line.Also, in the illustrated embodiment, the 1st transport unit 13 will temporarily be put in the temporary cutting for putting unit 8 and add
Machined object before work takes out of carrying-region to being positioned at the 1st and take out of to move into region A1 the 1st chuck table 34 and be positioned at the 2nd
Domain A2 the 2nd chuck table 44 is transported, and from cleaning unit 7 by the machined object cleaned to temporarily putting unit 8 and transport.Separately
On the one hand, the 2nd transport unit 14 is taken out of from being positioned at the 1st and take out of to move into region A1 the 1st chuck table 34 and be positioned at the 2nd
The machined object that region A2 the 2nd chuck table 44 completes machining is moved into transport to cleaning unit 7.That is, the 2nd conveyance
Unit 14 is realized to be cut and processes generated cutting swarf, cuts the work(that the machined object of water pollution is transported to cleaning unit 7
Energy.
The 1st transport unit 13 constituted as described above and the 2nd transport unit 14 are supported on quiet by appropriate bearing unit
Only on base station 2.Also, the carrying arm 131 and 141 of the 1st transport unit 13 and the 2nd transport unit 14 is not when implementing conveyance operation
It is positioned the position of readiness in figure 3 shown in double dot dash line.
In addition, the carrying arm mobile unit 134 and 144 of the 1st transport unit 13 and the 2nd transport unit 14 can use it is known
Actuating mechanism, the known actuating mechanism with it is above-mentioned take out of move into unit 11 carrying arm mobile unit 113 it is same by as follows
Part constitute：Driving pulley, it is driven by pulse motor；Follow-up pulley, it is with the driving pulley across defined interval
And arrange；And actuating wire, it is wound in driving pulley and follow-up pulley.
The topping machanism of embodiment illustrated is constituted as described above, and the effect is said referring especially to Fig. 1 below
It is bright.
Want to use above-mentioned topping machanism to implementing machining as the semiconductor wafer of machined object, box 10 is carried
Put on the box workbench 91 of box mounting unit 9, the box 10 is to institute on the dicing tape T installed on the framework F of ring-type front
Semiconductor wafer W before the machining of bonding is stored.Then, make to take out of the carrying arm mobile unit for moving into unit 11
113 are acted and carrying arm 111 is advanced towards the box 10 being positioned on box workbench 91 and move, make to be disposed in carrying arm
111 holding part 112 is acted and the framework F of ring-type is held, and framework F is by dicing tape T to being accommodated in box
The semiconductor wafer W of 10 assigned position is supported.After being held to the framework F of ring-type by holding part 112,
Acted carrying arm mobile unit 113 and carrying arm 111 is carried out retrogressing movement towards the opposite side of box 10, by ring-type
Taken out of on the horizontal part 81a for 2 supporting rails 81,81 that framework F temporarily puts unit 8 to constituting, release the holding shape for holding part 112
State, and the framework F of ring-type is temporarily placed on the horizontal part 81a of 2 supporting rails 81,81.Also, make the supporting rail for temporarily putting unit 8
Mobile unit 82 is acted and 2 supporting rails 81,81 is moved in a direction close to each other, by vertical component effect 81b provisionally
The framework F of ring-type is clamped, thus aligned.
After the contraposition of semiconductor wafer W has been implemented, make to take out of the carrying arm mobile unit 113 for moving into unit 11
Acted and the opposite side of carrying arm 111 towards box 10 is further retreated movement, from the zone isolation for temporarily putting unit 8.Connect
, the carrying arm mobile unit 134 of the 1st transport unit 13 is acted and will be disposed in the support rod 132 of carrying arm 131
The attracting pad 133 installed is positioned at the top for being temporarily put in the semiconductor wafer W for temporarily putting unit 8.Also, by making support rod
132 move downwards and make the attracting pad 133 and framework F's by the dicing tape T ring-types supported to semiconductor wafer W upper
Surface is contacted, and attraction unit (not shown) is acted and is carried out attracting holding to the framework F of ring-type by attracting pad 133.
After attracting holding is so carried out to the framework F of ring-type by attracting pad 133, it is moved upward support rod 132, and make
The framework F for the ring-type that carrying arm mobile unit 134 is acted and kept attracting pad 133 is moved into being positioned at the 1st and take out of
The top conveyance of region A1 the 1st chuck table 34.Then, support rod 132 is made to move downwards and by institute in attracting pad 133
The semiconductor wafer W for being supported on the framework F of ring-type by dicing tape T of attracting holding is positioned on the 1st chuck table 34,
And release attracting holding of the attracting pad 133 to the framework F of ring-type.So by make it is (not shown) attraction unit acted and
Attracting holding is carried out to semiconductor wafer W on the 1st chuck table 34, the semiconductor wafer W is supported on the by dicing tape T
The framework F of placed ring-type on 1 chuck table 34.Also, the framework F of ring-type is fixed by fixture 343.
So it will temporarily put the phase that the temporary semiconductor wafer W put and aligned is transported to the 1st chuck table 34 on unit 8
Between, make it is above-mentioned take out of move into unit 11 acted and by be accommodated in box 10 next should machining semiconductor wafer
W (state that the framework F of ring-type is supported on by dicing tape T) to temporarily put unit 8 take out of and implement contraposition.Therefore, the 1st conveyance
Unit 13 is transported to the 1st chuck table 34 will temporarily put the semiconductor wafer W temporarily putting and align on unit 8 as described above
Afterwards, next it will be transported to the 2nd chuck table 44 to temporarily putting the semiconductor wafer W that unit 8 takes out of and align.So pass through
Attraction unit (not shown) is set to be acted and carry out attracting holding to semiconductor wafer W on the 2nd chuck table 44, should be partly
Conductor wafer W is supported on the framework F of ring-type placed on the 2nd chuck table 44 by dicing tape T.Also, pass through fixture
The framework F of 443 pairs of ring-types is fixed.
When attracting as described above on the 1st chuck table 34 and the 2nd chuck table 44 semiconductor wafer W
After holding, the 1st processing feed unit 35 is set to be acted and make the 1st chuck table 34 to being equipped with the 1st cutting mechanism 5
1st cutting zone B1 is moved, and the 2nd processing feed unit 45 is acted and is made the 2nd chuck table 44 to being equipped with
The 2nd cutting zone B2 movements of 2nd cutting mechanism 6.Also, to being positioned on the 1st cutting zone B1 the 1st chuck table 34
The semiconductor wafer W kept implements alignment operation, and the 1st cutting unit 5a of the 1st cutting mechanism 5 is constituted by being respectively arranged at
Machining area is detected with the 2nd cutting unit 5b shooting unit 540.Then, the 1st of the cutting mechanism 5 of composition the 1st is made to cut
The cutting tool 543 for cutting unit 5a and the 2nd cutting unit 5b is acted and to being positioned at the 1st cutting zone B1 the 1st chuck
The semiconductor wafer W kept on workbench 34 implements defined machining.Also, for being positioned at the 2nd cutting zone B2
The 2nd chuck table 44 on the semiconductor wafer W that is kept, by constitute the 2nd cutting mechanism 6 the 1st cutting unit 6a and
2nd cutting unit 6b implements above-mentioned alignment operation and implements defined machining.
As described above, in the topping machanism of embodiment illustrated, the 1st card for being positioned at the 1st cutting zone B1
The semiconductor wafer W kept on disk workbench 34, can cut the 1st cutting unit 5a and the 2nd of the cutting mechanism 5 of composition the 1st
Unit 5b this 2 cutting tools 543 are cut to play a role and implement machining, and for being positioned at the 2nd cutting zone B2's
The semiconductor wafer W kept on 2nd chuck table 44, can make the cutting mechanism 6 of composition the 2nd the 1st cutting unit 6a and
This 2 cutting tools of 2nd cutting unit 6b play a role and simultaneously implement defined machining, can further improve life
Production property.
To the semiconductor wafer W that is maintained on the 1st chuck table 34 and it is being maintained at the 2nd chuck respectively as described above
Semiconductor wafer W on workbench 44 implement as defined in after machining, make the 1st processing feed unit 35 acted and
The 1st chuck table 34 is taken out of to the 1st and move into region A1 returns, and the 2nd processing feed unit 45 is acted and is made
2nd chuck table 44 takes out of to the 2nd moves into region A2 returns.Then, the carrying arm mobile unit of the 2nd transport unit 14 is made
144 are acted and will be disposed in the attracting pad 143 installed in the support rod 142 of carrying arm 141 and be positioned at the 1st chucking work
The top of placed semiconductor wafer W on platform 34.Also, support rod 142 is moved downwards and make attracting pad 143 with by
The framework F for the ring-type that dicing tape T is supported to semiconductor wafer W upper surface, by the attracting pad 143 to ring-type
Framework F carries out attracting holding.After attracting holding is so carried out to the framework F of ring-type by attracting pad 143, make support rod
142 are moved upward, and make the framework F for the ring-type that carrying arm mobile unit 144 acted and kept attracting pad 143
Transported to the top of cleaning unit 7.Then, the support rod 142 is moved downwards and borrow institute's attracting holding in attracting pad 143
The semiconductor wafer W for helping dicing tape T to be supported on the framework F of ring-type is positioned on the rotary table 71 of cleaning unit 7, and is solved
Except attracting holding of the attracting pad 143 to the framework F of ring-type.Now, the horizontal part for 2 supporting rails 81,81 for temporarily putting unit 8 is constituted
81a clear width is expanded to the wide size of external diameter width of the framework F than ring-type.So, to being transported to the rotation of cleaning unit 7
The semiconductor wafer W for implementing machining of revolving worktable 71 carries out rotary-cleaning.
In addition, the rotary work on the semiconductor wafer W after machining as described above to be transported to cleaning unit 7
2nd transport unit 14 of platform 71, position of readiness in figure 3 shown in double dot dash line is positioned by carrying arm 141.
After being cleaned as described above in cleaning unit 7 to the semiconductor wafer W after machining, make the 1st
The carrying arm mobile unit 134 of transport unit 13 is acted and will be disposed in what is installed in the support rod 132 of carrying arm 131
The top for the semiconductor wafer W that attracting pad 133 is positioned at after being cleaned in cleaning unit 7.Also, by making support rod
132 move downwards and make the attracting pad 133 and framework F's by the dicing tape T ring-types supported to semiconductor wafer W upper
Surface is contacted, and attraction unit (not shown) is acted and is carried out attracting holding to the framework F of ring-type by attracting pad 133.
Also, support rod 132 is moved upward and is positioned at the framework F of the ring-type of institute's attracting holding in attracting pad 133 and temporarily puts list
The top of 2 supporting rails 81,81 of member 8.Then, 2 supporting rails 81,81 by unit 8 is temporarily put vertical component effect 81b inner side
Be intervally adjusted to after the slightly wider size of the external diameter width of the framework F than ring-type, make the support rod 132 of the 1st transport unit 13 to
Move and be positioned in the framework F of the ring-type of institute's attracting holding in attracting pad 133 the horizontal part 81a of 2 supporting rails 81,81 in lower section
On, and release the attracting holding of attracting pad 133.In the ring-type that will so be supported by dicing tape T to semiconductor wafer W
Framework F be positioned in temporarily put unit 82 supporting rails 81,81 horizontal part 81a on after, by the attraction of the 1st transport unit 13
Pad 133 is put unit 8 and isolated from temporarily, and make to take out of move into unit 11 acted and by the semiconductor wafer W cleaned to box
10 assigned position is moved into and stored.
So, by return to the 1st take out of kept on the 1st chuck table 34 for moving into region A1 implement cutting
The semiconductor wafer W of processing is transported and cleaned to cleaning unit 7, will clean the semiconductor wafer W of completion to the rule of box 10
After positioning is put and moves into and stored, acted the 2nd transport unit 14 and make to return to the 2nd to take out of and move into region A2's
The semiconductor wafer W for implementing machining kept on 2nd chuck table 44 is transported to cleaning unit 7.Also, work as
After being cleaned in cleaning unit 7 to the semiconductor wafer W being transported to after the machining of cleaning unit 7, make the 1st conveyance single
Member 13 is acted and will clean the semiconductor wafer Ws completed to temporarily putting unit 8 and transporting, and is made to take out of and is moved into unit 11 and acted
And the semiconductor wafer W for being transported to the cleaning completion for temporarily putting unit 8 is moved into and stored to the assigned position of box 10.
As described above, in the illustrated embodiment, region A1 the 1st chucking work is being moved into from being positioned at the 1st and take out of
Platform 34 and it is positioned at the 2nd and takes out of and move into region A2 the 2nd chuck table 44 and will be cut and process generated cutting swarf, cutting
The machined object of water pollution uses the 2nd transport unit 14 when being transported to cleaning unit 7, in other conveyances, that is will temporarily put
The region A1 He of the 1st chuck table 34 is moved into temporarily putting the machined object before the machining of unit 8 to being positioned at the 1st and take out of
Be positioned at the 2nd take out of move into region A2 the 2nd chuck table 44 transport and from cleaning unit 7 will clean complete be processed
Thing uses the 1st transport unit 13, therefore the ring-type supported by dicing tape T to machined object to temporary put when unit 8 is transported
Framework F will not be contaminated.
In addition, in order to reduce the loss of time and it is preferred that when in cleaning unit 7 to being kept on the 1st chuck table 43
While semiconductor wafer W after machining is cleaned, make to take out of and move into unit 11 and acted and make to be accommodated in box 10
Semiconductor wafer W to temporarily putting unit 8 and taking out of, the 1st transport unit 13 is acted and is temporarily put partly leading for unit 8 by taking out of
Body wafer W is transported to the 1st chuck table 34.
Also, in order to reduce the loss of time and it is preferred that when in cleaning unit 7 to being kept on the 2nd chuck table 44
While semiconductor wafer W after machining is cleaned, make to take out of and move into unit 11 and acted and make to be accommodated in box 10
Semiconductor wafer W to temporarily putting unit 8 and taking out of, the 1st transport unit 13 is acted and is temporarily put partly leading for unit 8 by taking out of
Body wafer W is transported to the 2nd chuck table 44.
More than, according to embodiment illustrated, the present invention is described, but the present invention is not limited only to embodiment,
Various modifications can be carried out in the scope of the purport of the present invention.For example, in the above-described embodiment, showing real using monomer
The example of topping machanism is applied, even if applied to as disclosed in such as Japanese Unexamined Patent Publication 2015-8195 publications, along removing
Line sending sets multiple devices and builds the situation of automated system, due to the 1st cutting mechanism 5 and the 2nd cutting mechanism 6 be disposed in
1st takes out of to move into region A1 and the 2nd and take out of and moves into the position of region A2 centre position for axle point-symmetrically, therefore in operation
Access good when person carries out replacing of cutting tool etc. and can promptly be safeguarded.
Claims (5)
1. a kind of topping machanism, it implements machining to machined object, it is characterised in that
The topping machanism has：
1st chuck table and the 2nd chuck table, they are kept to machined object and are configured to as processing
Moved in the X-direction of direction of feed, and be mutually adjacent to be disposed in it is vertical with X-direction as index feed direction
In Y direction；
1st cutting mechanism and the 2nd cutting mechanism, they are kept to the 1st chuck table and the 2nd chuck table respectively
Machined object implement machining；And
Cleaning unit, its machined object cut the 1st cutting mechanism and the 2nd cutting mechanism is cleaned,
1st chuck table, which is configured to be located in machined object take out of the move into the 1st and take out of, to be moved into region and matches somebody with somebody
The 1st cutting zone provided with the 1st cutting mechanism, the 2nd chuck table is configured to be located on the straight line of Y direction
Take out of to move into region and be adjacent to machined object take out of the move into the 2nd and take out of with the 1st and move into region and be equipped with the 2nd
2nd cutting zone of cutting mechanism,
1st cutting mechanism has the 1st cutting unit and the 2nd cutting unit, and the 1st cutting unit and the 2nd cutting unit have
2 live spindles being disposed on the straight line of Y direction and the mutually opposing end for being respectively arranged in 2 live spindles
Cutting tool, the 2nd cutting mechanism has the 1st cutting unit and the 2nd cutting unit, the 1st cutting unit and the 2nd cutting unit
With 2 live spindles being disposed on the straight line of Y direction and the mutually opposing end for being respectively arranged in 2 live spindles
The cutting tool in portion,
1st cutting mechanism and the 2nd cutting mechanism are disposed in take out of with the 1st and move into region and take out of with the 2nd and move into region
Centre position for axle position point-symmetrically,
The cleaning unit, which is disposed in take out of the 1st, moves into the straight line that region takes out of the Y direction for moving into region link with the 2nd
On.
2. topping machanism according to claim 1, wherein,
The topping machanism has transport unit, and machined object is transported to the 1st to take out of by the transport unit moves into region, the 2nd
Take out of and move into region and the cleaning unit.
3. topping machanism according to claim 2, wherein,
It is equipped in the topping machanism and temporarily puts unit, this is temporarily put unit and is configured to machined object to be temporarily put in the cleaning list
2 guide rails of the top of member enter between-line spacing adjustment,
The transport unit, which will temporarily be put in this, temporarily puts the machined object before the machining of unit and transports to being positioned at the 1st and take out of and remove
Enter the 1st chuck table in region and be positioned at the 2nd and take out of the 2nd chuck table for moving into region, and from the cleaning
Unit, which will clean the machined object that completes and transport to this, temporarily puts unit, and moves into the 1st of region from being positioned at the 1st and taking out of
Chuck table and it is positioned at the 2nd and takes out of and move into the 2nd chuck table in region and remove the machined object that machining is completed
Deliver to the cleaning unit.
4. topping machanism according to claim 3, wherein,
The transport unit has the 1st transport unit and the 2nd transport unit,
1st transport unit, which will temporarily be put in this, temporarily puts the machined object before the machining of unit and transports to being positioned at the 1st and remove
Go out to move into the 1st chuck table in region and be positioned at the 2nd and take out of the 2nd chuck table for moving into region, and from this
The machined object for cleaning completion is transported to this and temporarily puts unit by cleaning unit,
2nd transport unit moves into the 1st chuck table in region and is positioned at the 2nd and takes out of from being positioned at the 1st and take out of
The 2nd chuck table for moving into region transports the machined object that machining is completed to the cleaning unit.
5. the topping machanism according to claim 3 or 4, wherein,
Box workbench is equipped with the topping machanism, the box workbench is temporarily put unit with this in the X-axis direction and is adjacent to storing
The box for having machined object is loaded, and is equipped with to take out of in the topping machanism and is moved into unit, and this, which takes out of, moves into unit in X-axis
Machined object before the machining retreated and will stored in the box placed by the box workbench on direction takes out of temporary to this
Put unit, and from this temporarily put unit and will clean the machined object that completes and move into the box.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015233110A JP6560110B2 (en) | 2015-11-30 | 2015-11-30 | Cutting equipment |
| JP2015-233110 | 2015-11-30 |
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| Publication Number | Publication Date |
|---|---|
| CN107030902A true CN107030902A (en) | 2017-08-11 |
| CN107030902B CN107030902B (en) | 2020-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611071041.5A Active CN107030902B (en) | 2015-11-30 | 2016-11-28 | Cutting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6560110B2 (en) |
| KR (1) | KR102463660B1 (en) |
| CN (1) | CN107030902B (en) |
| TW (1) | TWI691018B (en) |
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| CN108573905A (en) * | 2018-04-14 | 2018-09-25 | 安徽吉乃尔电器科技有限公司 | A kind of semiconductor element cleaning equipment and its application method |
| CN109994406A (en) * | 2017-12-22 | 2019-07-09 | 株式会社迪思科 | Cutting apparatus |
| CN110027124A (en) * | 2017-12-08 | 2019-07-19 | 株式会社迪思科 | Cutting apparatus |
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| JP7165510B2 (en) * | 2018-05-25 | 2022-11-04 | 株式会社ディスコ | Transfer jig and replacement method |
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| JP6560110B2 (en) | 2019-08-14 |
| CN107030902B (en) | 2020-05-26 |
| KR102463660B1 (en) | 2022-11-03 |
| KR20170063379A (en) | 2017-06-08 |
| TW201727820A (en) | 2017-08-01 |
| TWI691018B (en) | 2020-04-11 |
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