CN106098621A - Topping machanism - Google Patents

Topping machanism Download PDF

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Publication number
CN106098621A
CN106098621A CN201610274010.3A CN201610274010A CN106098621A CN 106098621 A CN106098621 A CN 106098621A CN 201610274010 A CN201610274010 A CN 201610274010A CN 106098621 A CN106098621 A CN 106098621A
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China
Prior art keywords
machined object
pair
base station
rail
cutting
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Granted
Application number
CN201610274010.3A
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Chinese (zh)
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CN106098621B (en
Inventor
大河原聪
八木原惇
寺师健太郎
赤濑胜彦
松冈伸太郎
田中万平
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Disco Corp
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Disco Corp
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Publication of CN106098621A publication Critical patent/CN106098621A/en
Application granted granted Critical
Publication of CN106098621B publication Critical patent/CN106098621B/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Topping machanism is provided, makes simple in construction and the miniaturization of device entirety, and reduce parts number of packages and reduce manufacturing cost.In topping machanism, processing feed mechanism has: X-axis guide rail, it is can to move in the X-axis direction between the machined object loading and unloading area and the machining area being equipped with cutting mechanism that are equipped with temporary laying mechanism by keeping stage support, take out of/moving-in mechanism has: supporting base station；Holding parts, it is disposed in supporting base station and holds the machined object being accommodated in box；A pair banking pin, machined object is limited in the position of regulation by them；Transporting mobile member, it makes supporting base station move in the Y-axis direction, and temporary laying mechanism has: a pair supporting rail, and they are configured to extend in the Y-axis direction, has bottom and sidepiece that the both sides to machined object support, and bottom can opening and closing；Open and close member, it carries out opening and closing to the bottom of a pair supporting rail；Lift component, it makes a pair supporting rail move in the vertical direction.

Description

Topping machanism
Technical field
The present invention relates to the topping machanism for the machined objects such as semiconductor wafer are cut.
Background technology
In semiconductor device manufacturing process, by arrangement on the front of the semiconductor wafer as substantially circular plate shape Become cancellate segmentation preset lines to mark off multiple region, this region marked off is formed the devices such as IC, LSI. Further, manufacture by the region being formed with device being split along segmentation preset lines cut-out semiconductor wafer Go out each semiconductor device.
Along segmentation preset lines, the topping machanism that the machined objects such as semiconductor wafer cut off is had: box mounting component, its The box being accommodated with multiple machined object is loaded；Taking out of/move into component, it is contained relative to this box mounting component Machined object is taken out of and moves into by the box put；Putting component temporarily, it is put temporarily and is taken out of/moved into that component takes out of is added by this Work thing；Keeping workbench, this is put the machined object that component puts temporarily and keeps by temporarily；Cutting member, it is to guarantor The machined object held on this holding workbench cuts；And processing feeding component, it is at processing direction of feed (X Direction of principal axis) on this holding workbench is processed feeding.Further, as cutting member have the 1st cutting member and 2nd cutting member, it is possible to be cut off by the machined objects such as semiconductor wafer efficiently along segmentation preset lines and split Become each device, the 1st cutting member can possess the 1st cutting tool in the way of rotating, the 2nd cutting member with The mode that can rotate possesses the 2nd cutting tool (example of the 1st opposed arranging of cutting tool with the 1st cutting member As, with reference to patent documentation 1).
Patent documentation 1: Japanese Unexamined Patent Publication 11-26402 publication
But, there is following problem in above-mentioned topping machanism: in particular for multiple machines for transporting machined object Structure, the structure of device entirety is complicated and maximizes, and parts number of packages is more and manufacturing cost uprises.
Summary of the invention
The present invention completes in view of the foregoing, and its main technical problem is to provide a kind of topping machanism, Simple in construction and the miniaturization of device entirety can be made, and reduce parts number of packages and reduce manufacturing cost.
In order to solve above-mentioned main technical task, according to the present invention, it is provided that a kind of topping machanism, it possesses: box carries Putting mechanism, the box being accommodated with multiple machined object is loaded by it；Taking out of/moving-in mechanism, it is by machined object phase Box placed by this box carrying mechanism is taken out of and moved into；Laying mechanism temporarily, it takes out of/moving-in mechanism to by this The machined object taken out of is put temporarily；Keeping workbench, its machined object put this temporary laying mechanism temporarily keeps； Cutting mechanism, the machined object being maintained on this holding workbench is cut by it；And processing feed mechanism, its X-direction as processing direction of feed is processed feeding to this holding workbench, the spy of this topping machanism Levy and be,
This processing feed mechanism has: X-axis guide rail, its by this holding stage support for can put temporarily being equipped with this As processing direction of feed between machined object loading and unloading area and the machining area being equipped with this cutting mechanism of mechanism X-direction on move；And process feeding component, it makes this holding workbench move along this X-axis guide rail,
This temporary laying mechanism is adjacent in the Y direction vertical with X-direction with this box carrying mechanism arrange,
This takes out of/and moving-in mechanism has: supporting base station；Holding parts, it is disposed in this supporting base station and to being accommodated in Machined object in box holds；A pair banking pin, machined object is limited in the position of regulation by them；And remove Sending mobile member, it makes this supporting base station move in the Y-axis direction,
This temporary laying mechanism has: a pair supporting rail, and they are configured to extend in the Y-axis direction, have processed The both sides of thing carry out bottom and the sidepiece supported, and can opening and closing bottom this；Open and close member, it is to this pair supporting Opening and closing is carried out bottom this of rail；And lift component, it makes this pair supporting rail move in the vertical direction,
When by this holding table positions in this machined object loading and unloading area, take out of/moving-in mechanism general's storage by this Machined object in box takes out of and is placed on temporarily on this pair supporting rail constituting this temporary laying mechanism, by this lift component This pair supporting rail is made to decline and be positioned in by machined object on this holding workbench, and by this open and close member by this end Portion opens, thus is maintained at by machined object on this holding workbench.
It is adjacent with above-mentioned temporary laying mechanism and be equipped with wiper mechanism relative to box carrying mechanism in Y direction opposition side, This wiper mechanism has the rotary table for being carried out machined object, and, just going up at this wiper mechanism Side is equipped with the temporary laying mechanism of the auxiliary put machined object temporarily, and the temporary laying mechanism of this auxiliary is configured to temporary laying mechanism even Logical, the temporary laying mechanism of this auxiliary has: a pair aiding support rail, and they are configured to extend in the Y-axis direction, have The bottom that the both sides of machined object are supported and sidepiece, and can opening and closing bottom this；Open and close member, it is to this Opening and closing is carried out bottom this of a pair aiding support rail；And assistance for lifting component, it makes a pair aiding support rail up and down Side moves up.
Above-mentioned take out of/moving-in mechanism has: auxiliary holds parts, and it is disposed in supporting base station, auxiliary to being supported on a pair Being in the machined object of supporting rail is helped to hold with by the region holding the opposition side, region that parts hold；And A pair auxiliary banking pin, they will bear upon the machined object of a pair aiding support rail and are limited in the position of regulation,
When by when remain this holding table positions of the machined object cut in machined object loading and unloading area, Make under the state that the bottom of a pair supporting rail of the temporary laying mechanism of composition opens, to make this pair supporting rail decline and by bottom Bottom is made to close and make this pair supporting rail carry cutting after being positioned at the bottom of the machined object cut Rise under the state of the machined object completed,
Then, by taking out of/machined object being accommodated in box holds and will by the parts that hold of moving-in mechanism Be arranged at that a pair of base station auxiliary banking pin of supporting be positioned in machined object cut is in by holding parts On the end face in the region of the opposition side, region held, and this supporting base station is made to move to this auxiliary temporary laying mechanism side, thus The machined object being accommodated in box is positioned temporary laying mechanism and the machined object that cutting completed is positioned auxiliary temporarily Laying mechanism,
A pair auxiliary it is put in temporarily by constituting the machined object assisting the assistance for lifting component of temporary laying mechanism cutting to be completed Supporting rail, makes a pair aiding support rail decline that machined object to be placed in the rotation work of wiper mechanism by lift component Station, and by open and close member, bottom is opened, thus machined object cutting completed is maintained on rotary table.
Above-mentioned wiper mechanism has the injection nozzle of the jet cleaning water of the top being disposed in rotary table, and this injection is sprayed Mouth by be disposed in constitute take out of/fastened component that engages of the supporting base station and optionally carrying out of moving-in mechanism and adjoint The movement this supporting base station is moved in the Y-axis direction, at least spraying from the region at outer thoughtful center machined object Penetrate rinse water.
The other end of the wire rod that one end links with hammer links via the injection nozzle of pulley with above-mentioned wiper mechanism, this injection Nozzle is configured to move in the Y-axis direction by the gravity of hammer,
Fastened component has can be disposed in the clamping rpole of supporting base station in the way of retreating, at the shape making clamping rpole advance Under state, from the gravity by hammer of injection nozzle, the direction of movement contacts fastened component with injection nozzle.
Above-mentioned cutting mechanism has: the 1st cutting member, and it is can possess the 1st cutting tool in the way of rotating；The 2 cutting members, it is can possess the 1st opposed arranging of cutting tool with the 1st cutting member in the way of rotating 2nd cutting tool；Y-axis guide rail, its by the 1st cutting member and the 2nd cutting member supporting for can with X Move in the Y direction that direction of principal axis is vertical；1st index feed component, it makes the 1st cutting member along this Y Axis rail moves；And the 2nd index feed component, it makes the 2nd cutting member move along this Y-axis guide rail.
The topping machanism of the present invention is constituted as described above, due to when remain the holding table positions of machined object When machined object loading and unloading area, by taking out of/machined object being accommodated in box takes out of and is placed on temporarily by moving-in mechanism Constitute on a pair supporting rail of temporary laying mechanism, make a pair supporting rail decline be positioned in by machined object by lift component Keep on workbench, and by open and close member, bottom is opened and machined object is maintained on holding workbench, therefore, The conveyance component transporting machined object the most simply takes out of/moving-in mechanism, and therefore the reduction of component number of packages forms This reduction, and it is capable of the miniaturization of device.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the topping machanism constituted according to the present invention.
Fig. 2 be the topping machanism shown in Fig. 1 want portion's axonometric chart.
Fig. 3 is to illustrate the axonometric chart of the cutting mechanism of equipment in the topping machanism shown in Fig. 1.
Fig. 4 is the A-A sectional view of Fig. 1.
Fig. 5 is the axonometric chart of the taking out of of the topping machanism shown in pie graph 1/moving-in mechanism.
Fig. 6 be taking out of shown in Fig. 5/moving-in mechanism 7 want portion's front view.
Fig. 7 is temporary laying mechanism and the axonometric chart of the temporary laying mechanism of auxiliary of the topping machanism shown in pie graph 1.
Fig. 8 is the side view of the temporary laying mechanism shown in Fig. 7.
Fig. 9 is the axonometric chart of the wiper mechanism of the topping machanism shown in pie graph 1.
Figure 10 be illustrate taking out of/moving-in mechanism hold parts and a pair banking pin is positioned the state of position of readiness Axonometric chart.
Figure 11 be shown through taking out of/moving-in mechanism hold parts to hold the axonometric chart of the state of ring-type framework, The machined object being accommodated in the box being placed in box carrying mechanism is supported by this ring-type framework.
Figure 12 be shown through taking out of/moving-in mechanism will bear upon the machined object of ring-type framework and is transported to temporary laying mechanism The axonometric chart of state of a pair supporting rail.
Figure 13 is to be placed with, on the upper surface being shown in and keeping workbench, the quilt being supported on ring-type framework across dicing tape The axonometric chart of the state of machining object.
Figure 14 is that a pair supporting rail illustrating and making temporary laying mechanism rises and be positioned at the axonometric chart of the state of upper position.
Figure 15 is to illustrate to make attracting holding the holding movable workbench of machined object to the processing being equipped with cutting mechanism The axonometric chart of the state in region.
Figure 16 is that the holding table positions illustrating and attracting holding the machined object cut fills at machined object Unload the axonometric chart of the state of position.
Figure 17 is the state illustrating and a pair supporting rail of temporary laying mechanism being positioned at from the state shown in Figure 15 lower position Axonometric chart.
Figure 18 is to illustrate to be positioned at compared with upper position by a pair supporting rail of temporary laying mechanism from the state shown in Figure 16 The axonometric chart of the state in centre position slightly below.
Figure 19 be shown through taking out of/handle part of moving-in mechanism held and has been accommodated in the box being placed in box carrying mechanism The axonometric chart of state of machined object.
Figure 20 be shown through taking out of/new machined object is positioned at a pair of temporary laying mechanism by the handle part of moving-in mechanism Supporting rail and machined object cutting completed are positioned at the state of a pair aiding support rail assisting temporary laying mechanism Axonometric chart.
Figure 21 is to illustrate the shape that the state from Figure 19 is positioned at a pair aiding support rail lower position assisting temporary laying mechanism The axonometric chart of state.
(a) of Figure 22 is to illustrate that the state from Figure 20 is positioned at a pair supporting rail of temporary laying mechanism and auxiliary puts machine temporarily The axonometric chart of the state of a pair aiding support rail upper position of structure, (b) of Figure 22 illustrates movable cleaning structure The axonometric chart of the state of injection nozzle.
Figure 23 be illustrate from the state shown in Figure 21 will take out of/moving-in mechanism 7 be positioned at position of readiness and will constitute The a pair aiding support rail assisting temporary laying mechanism is positioned at the axonometric chart of the state of lower position.
Figure 24 is to illustrate that the auxiliary by the machined object completing the cleaning being supported on ring-type framework supports is put temporarily A pair aiding support rail of mechanism is positioned at the axonometric chart of the state of upper position.
Figure 25 is to illustrate that the machined object that the state from Figure 23 makes the cleaning being supported on ring-type framework complete is temporary from auxiliary A pair aiding support rail of laying mechanism moves to the axonometric chart of the state of a pair supporting rail of temporary laying mechanism.
Figure 26 is to illustrate from the state of Figure 24 a pair supporting rail of temporary laying mechanism be centrally positioned position and will take out of / moving-in mechanism hold parts and a pair banking pin is positioned at the axonometric chart of state of position of readiness.
Figure 27 be illustrate the state from Figure 25 make to take out of/moving-in mechanism carries out action and will bear upon ring-type framework The axonometric chart of the state that the machined object cleaned is accommodated in box.
Label declaration
2: static base station；3: keep table mechanism；32: mobile base station；34: keep workbench；35: processing Feeding component；351:X axle straight line rail；352:X axial coil mover；4: cutting mechanism；5a: the 1 cutting structure Part；5b: the 2 cutting member；54: index feed component；540: the Y-axis straight line rail shared；544a: the first Y-axis coil mover；544b: the second Y-axis coil mover；6: box carrying mechanism；60: box；7: take out of/move into Mechanism；71: conveyance mobile member；72: supporting base station；74: hold parts；75: a pair banking pins；76: auxiliary Help holding parts；77: a pair auxiliary banking pins；8: laying mechanism temporarily；80: a pair supporting rails；9: auxiliary puts machine temporarily Structure；90: a pair aiding support rails；10: wiper mechanism；11: cleaning cover；12: rotary table；13: injection Nozzle；14: hammer；15: wire rod；16: pulley；F: ring-type framework；T: dicing tape；W: semiconductor wafer.
Detailed description of the invention
Hereinafter, referring to the drawings preferred embodiment saying the topping machanism constituted according to the present invention the most in detail Bright.
The axonometric chart of one embodiment of the topping machanism constituted according to the present invention shown in Fig. 1.
The topping machanism of embodiment illustrated has: static base station 2；It is disposed on this static base station 2 and to being added Work thing carries out the holding table mechanism 3 kept；And to the machined object being maintained on this holding table mechanism 3 Carry out the cutting mechanism 4 cut.
Table mechanism 3 is kept to have as shown in Figure 2: 2 X-axis guide rails 31,31, it is at static base station 2 On along shown in arrow X processing direction of feed (X-direction) arrange；Mobile base station 32, it is sliding Mode be disposed on these 2 X-axis guide rails 31,31；The holding workbench 34 that machined object is kept, its Can be supported on the supporting parts 33 of cylindrical shape in the way of rotating, these supporting parts 33 are disposed in this and move base station 32 On；And processing feeding component 35, it is for making the mobile base station 32 being equipped with this holding workbench 34 along 2 Bar X-axis guide rail 31,31 is upper mobile in processing direction of feed (X-direction).Workbench 34 is kept to have: work Station main body 341, it is can be supported on the supporting parts 33 of cylindrical shape in the way of rotating；And absorption chuck 342, It is disposed in the upper surface of this workbench main body 341.Workbench main body 341 is formed as external diameter than described later as being added The external diameter of the wafer of work thing is big and ratio is little across the internal diameter of the ring-type framework of dicing tape supporting wafer.Absorption chuck 342 Formed by porous ceramics and be connected with not shown attracting member, it has suitably been acted on negative pressure.Therefore, it is positioned in Machined object on absorption chuck 342 is attracted to maintain because not shown attracting member carries out action at absorption chuck On 342.Further, keep workbench 34 by the not shown pulse electricity in the supporting parts 33 being disposed in cylindrical shape Motivation and rotate.
Above-mentioned processing feeding component 35 is made up of X-axis straight line rail 351 and X-axis coil mover 352, and this X-axis is straight Line rail 351 is disposed between 2 X-axis guide rails 31 and 31 and extends in the X-axis direction, this X-axis coil mover 352 can be intercalated in this X-axis straight line rail 351 in the way of moving, and be assemblied in be equipped and keep workbench 34 Mobile base station 32.N pole and the S pole of multiple columned permanent magnets are such as alternately engaged by X-axis straight line rail 351 And be configured to shaft-like, and this multiple columned permanent magnet being configured to shaft-like is disposed in non magnetic by rustless steel etc. Cylindric housing that material is made and constitute.The X-axis straight line rail 351 so constituted is in its both ends such as Fig. 2 institute Show and be equipped with supporting parts 353,353 like that, be installed on above-mentioned static base station by these supporting parts 353,353 2.The processing feeding component 35 being made up of X-axis straight line rail 351 and X-axis coil mover 352 constitutes what is called and linearly changes To motor (liner shift motor), if electric current flows in X-axis coil mover 352, repeat based on magnetic force Captivation, bounce and produce thrust.Therefore, the electric current of X-axis coil mover 352 it is applied to by change Direction such that it is able to the direction that change X-axis coil mover 352 moves along X-axis straight line rail 351.So constitute Processing feeding component 35 make to be equipped with the mobile base station 32 keeping workbench 34 and fill at the machined object shown in Fig. 2 Unload and move between region and the machining area being equipped with cutting mechanism 4.In addition it is shown that the adding of embodiment illustrated The example that work feeding component 35 is made up of the linear reversing motor of what is called but it also may be made up of ball screw framework.
Then, above-mentioned cutting mechanism 4 is illustrated.
Cutting mechanism 4 has the scaffold 41 of the gate being fixed on above-mentioned static base station 2.The supporting of this gate Framework 41 includes: the 1st post portion 412 of post portion the 411 and the 2nd arranged across interval；And by the 1st post portion 411 Link and along shown in the arrow Y vertical with the processing direction of feed shown in arrow X with the upper end in the 2nd post portion 412 The support 413 that arranges of index feed direction (Y direction), the scaffold 41 of this gate is to cross over above-mentioned 2 The mode of bar X-axis guide rail 31 arranges.
Rear side in Fig. 1 and Fig. 2 constituting the support 413 of scaffold 41 of above-mentioned gate, is equipped 1st cutting member 5a and the 2nd cutting member 5b.With reference to Fig. 3 and Fig. 4, the 1st cutting member 5a and the 2nd is cut Cut component 5b to illustrate.1st cutting member 5a and the 2nd cutting member 5b be respectively provided with the mobile base station 51 of indexing, The mobile base station 52 of incision and main axle unit 53.Base station the 51 and the 2nd cutting is moved in the indexing of the 1st cutting member 5a The indexing of component 5b is moved base station 51 and is respectively arranged with by guide groove 511,511, this by guide groove 511,511 with above-mentioned 2 Y-axis guide rail 413a, the 413a arranged on the side of left in Fig. 4 of support 413 are chimeric, are configured to logical Cross and make this chimeric with 2 Y-axis guide rail 413a, 413a by guide groove 511,511, thus index mobile base station 51 energy Enough move along 2 Y-axis guide rail 413a, 413a.It addition, base station is moved in the indexing at the 1st cutting member 5a Be respectively formed with on the face of one side of the mobile base station 51 of indexing of the 51 and the 2nd cutting member 5b for described later index into The recess 513 arranged to component.Further, the indexing at the 1st cutting member 5a is moved base station the 51 and the 2nd and is cut structure Respectively as shown in Figure 4 along the incision shown in arrow Z on the face of the opposing party of the mobile base station 51 of indexing of part 5b Direction of feed is provided with pair of guide rails 512,512 (only illustrating the guide rail of a side in Fig. 4).
Base station 52 is moved in the incision of mobile base station the 52 and the 2nd cutting member 5b of incision of above-mentioned 1st cutting member 5a Respectively by the supported portion 521 extended in the vertical direction and the most horizontal-extending from the lower end of this supported portion 521 Department of assembly 522 is constituted.It is provided with and above-mentioned indexing on the face of the side, department of assembly 522 of supported portion 521 as shown in Figure 4 Chimeric (being schemed by guide groove 523,523 of a pair Z axis guide rail 512,512 arranged on the face of the opposing party of mobile base station 51 Only illustrate in 4 a side by guide groove), the mobile base station 52 of incision is configured to by making this by guide groove 523,523 and 2 Z axis guide rail 512,512 chimeric and can be along 2 Z axis guide rails 512,512 in the incision feeding shown in arrow Z Side moves up.Move in base station 52 in the incision being so assemblied in the mobile base station 51 of indexing, department of assembly 522 such as Fig. 1 As shown in Figure 2 to configure in the way of the downside of the support 413 of the scaffold 41 being constituted gate is prominent.
Above-mentioned main axle unit 53 is assemblied in the formation incision of the 1st cutting member 5a and the 2nd cutting member 5b respectively and moves The lower surface of the department of assembly 522 of dynamic base station 52.The main axle unit the 53 and the 2nd of the 1st cutting member 5a cuts structure The main axle unit 53 of part 5b has the most as shown in Figure 3 and Figure 4: main shaft shell 531；Rotate main shaft 532, It is can be supported on this main shaft shell 531 in the way of rotating；Cutting tool 533, it is assemblied in this rotation main shaft 532 One end；And not shown servomotor, it is to supplying the cutting water supplying pipe 534 of cutting water and rotating main shaft 532 carry out rotating driving, and the axis direction rotating main shaft 532 arranges along the index feed direction shown in arrow Y. Further, constitute the cutting tool 533 of the main axle unit 53 of the 1st cutting member 5a and constitute the 2nd cutting member 5b The cutting tool 533 of main axle unit 53 arrange opposed to each other.
1st cutting member 5a of embodiment illustrated and the 2nd cutting member 5b have as shown in Figure 3 for Make above-mentioned indexing move base station 51,51 to enter along 2 Y-axis guide rail 413a, 413a in the indexing shown in arrow Y Index feed component 54 to direction (Y direction) upper movement.Index feed component 54 is by along above-mentioned 2 Y Axis rail 413a, 413a arrange share Y-axis straight line rail 540, by can be intercalated in the way of moving this share Y-axis straight line rail 540 and the first Y-axis coil of the mobile base station 51 of indexing that is assemblied in the 1st cutting member 5a move Sub-544a and by can be intercalated in the way of moving shared Y-axis straight line rail 540 and be assemblied in the 2nd cutting structure Second Y-axis coil mover 544b of the mobile base station 51 of indexing of part 5b is constituted.Y-axis straight line rail 540 example shared As alternately engaged with and be configured to shaft-like in the N pole of multiple columned permanent magnets and S pole, this axle will be configured to The multiple columned permanent magnet of shape is disposed in the cylindric housing and structure being made up of nonmagnetic substances such as rustless steels Become.So constitute share Y-axis straight line rail 540 at its both ends as shown in Figure 3 assemble supporting parts 543, 543, and the support 413 of above-mentioned scaffold 41 it is installed on via these supporting parts 543,543.Moving Dynamic mode is intercalated in the 1st coil mover 544a and the 2nd coil mover 544b of this Y-axis straight line rail 540 shared The indexing being disposed in mobile base station the 51 and the 2nd cutting member 5b of indexing being arranged at the 1st cutting member 5a respectively moves The recess 513 of dynamic base station 51, and it is assemblied in the face of a side of the mobile base station 51 of indexing respectively.
As described above by Y-axis straight line rail the 540, the 1st coil mover 544a shared and the 2nd coil mover 544b The index feed component 54 constituted enters with the processing being made up of above-mentioned X-axis straight line rail 361 and X-axis coil mover 362 So-called reversing motor is similarly constituted, if electric current moves at the 1st coil mover 544a and the 2nd coil to component 35 Sub-544b flows, repeat captivation based on magnetic force, bounce and produce thrust.Therefore, applied by change To the 1st coil mover 544a and the sense of current of the 2nd coil mover 544b such that it is able to change the 1st coil moves The direction that sub-544a and the 2nd coil mover 544b moves along shared Y-axis straight line rail 540.In addition it is shown that The example that the index feed component 54 of embodiment illustrated is made up of the linear reversing motor of what is called but it also may It is made up of ball screw framework.
And, it is illustrated that embodiment the 1st cutting member 5a and the 2nd cutting member 5b as shown in Figure 3 and Figure 4 There is incision feeding component 55,55 like that, this incision feeding component 55,55 be used for making above-mentioned incision move base station 52, 52 is upper mobile in the incision direction of feed (Z-direction) shown in arrow Z along 2 Z axis guide rails 512,512. Incision feeding component 55,55 respectively by with the external screw rod 551 of the parallel arranging of 2 Z axis guide rails 512,512, will outward The one end supporting of screw rod 551 is the bearing 552 that can rotate and links and right with the other end of external screw rod 551 The pulse motor 553 that this external screw rod 551 carries out rotating forward or inverting driving is constituted.Enter as the incision so constituted To component 55,55, external screw rod 551 respectively with in the supported portion 521 being formed at above-mentioned incision and moving base station 52 Female thread 521a screws togather.Accordingly, as incision feeding component 55,55, by driving pulse motor 553 respectively And external screw rod 551 is rotated forward or inverts driving such that it is able to make incision move base station 52 along 2 Z axis Guide rail 512, the 512 incision direction of feed (Z-direction) shown in arrow Z in figure 3 is upper mobile.
Illustrating with reference to Fig. 1, have: box carrying mechanism 6 on above-mentioned static base station 2, it is placed with storage half The box 60 of multiple machined objects such as conductor wafer；Taking out of/moving-in mechanism 7, it is from placed by this box carrying mechanism 6 Box 60 takes out of machined object and the machined object that cutting completed moves into box 60；Laying mechanism 8 temporarily, it is put temporarily by this Take out of/the machined object that takes out of of moving-in mechanism 7；Assisting temporary laying mechanism 9, it arranges adjacently with this temporary laying mechanism 8； And wiper mechanism 10, the machined object after cutting is carried out by it.Box 60 is positioned in and borrows by box carrying mechanism 6 On the box workbench 61 helping not shown lift component and lift.It is accommodated with semiconductor wafer W in box 60, should Semiconductor wafer W is pasted onto on the front of dicing tape T being assemblied in ring-type framework F.It addition, at ring-type frame The periphery of frame F is provided with the breach F-1 and tabular surface F-2 engaged with banking pin described later.
Take out of/moving-in mechanism 7 is as shown in Figure 1 by the support 413 at the scaffold 41 constituting above-mentioned gate Face side on arrange conveyance mobile member 71, by this conveyance mobile member 71 move in the Y-axis direction Hold base station 72 and the connecting member 73 that this supporting base station 72 and conveyance mobile member 71 link is constituted.Conveyance Mobile member 71 is by the conveyer mechanism making the connecting member 73 being linked with supporting base station 72 move in the Y-axis direction Constitute.If proceeding explanation with reference to Fig. 5 and Fig. 6, then take out of/supporting the base station 72 of moving-in mechanism 7 constituting On be provided with: holding parts 74 (with reference to Fig. 6), it is disposed in downside, for holding ring-type framework F, this ring The semiconductor wafer W being accommodated in the box 60 being placed in box carrying mechanism 6 is entered by the framework F of shape across dicing tape T Row supporting；Cylinder 740, it makes these holding parts 74 move in the vertical direction；A pair banking pin 75, it arranges Hold parts 74 both sides, engage with the breach F-1 and tabular surface F-2 being arranged at above-mentioned ring-type framework F and Ring-type framework F is limited in the position of regulation.So constitute take out of/moving-in mechanism 7 is by making supporting base station 72 Move towards the box 60 being placed in box carrying mechanism 6, and make a pair banking pin 75 and across dicing tape T support containing The breach F-1 arranged in the ring-type framework F of the semiconductor wafer W of box 60 and tabular surface F-2 engaging, thus By semiconductor wafer W position limitation in the position of regulation.Further, holding parts 74 are made upward by cylinder 740 Mobile, thus hold ring-type framework F between supporting base station 72 and holding parts 74.
Further, constitute take out of/the supporting base station 72 of moving-in mechanism 7 on be provided with: auxiliary holds parts 76 (reference Fig. 6), it is disposed in downside, for holding ring-type framework F, this ring-type framework F across dicing tape T to rear The semiconductor wafer W that the cutting stated completes supports；Cylinder 760, it makes this auxiliary hold parts 76 up and down Side moves up；And a pair auxiliary banking pin 77, it is disposed in auxiliary and holds the both sides of parts 76, with above-mentioned ring The framework F of shape engages and ring-type framework F is limited in the position of regulation.Additionally, take out of/moving-in mechanism in composition The supporting base station 72 of 7 is equipped with the fastened component 78 that the injection nozzle with wiper mechanism described later optionally engages. This fastened component 78 is by the clamping rpole 781 arranged as retreating downwards from the lower surface of supporting base station 72 and makes this The cylinder 782 that clamping rpole 781 is retreated is constituted.
With reference to Fig. 1, Fig. 7 and Fig. 8, above-mentioned temporary laying mechanism 8 is illustrated.Temporarily laying mechanism 8 in the Y-axis direction with Above-mentioned box carrying mechanism 6 is adjacent to be disposed in the surface of the machined object loading and unloading area of above-mentioned holding workbench 34. This temporary laying mechanism 8 has: a pair supporting rail 80, and it extends in the Y-axis direction and has ring-type framework F's Both sides carry out bottom 81a, 81b and sidepiece 82a, the 82b supported, and bottom 81a, 81b are configured to opening and closing； Open and close member 85a, 85b, it carries out opening and closing to bottom 81a, 81b of this pair supporting rail 80；And lifting structure Part 86, it makes this pair supporting rail 80 move in the vertical direction.It addition, in the side constituting a pair supporting rail 80 The upper end of portion 82a, 82b is provided with flange part 83a, 83b that inwardly side is prominent each other, this flange part 83a and 83b One end connecting portion 84 each other link.Above-mentioned open and close member 85a, 85b are in the illustrated embodiment by sky Pneumoelectric motivation is constituted, and drives bottom 81a, 81b of a pair supporting rail 80 to as shown in solid in Fig. 8 respectively The closed position of horizontal level and the open position as the upright position shown in double dot dash line.Above-mentioned lift component 86 It is made up of the cylinder 861 being installed on not shown fixed component, the piston rod 862 of this cylinder 861 and above-mentioned a pair The linking part 84 of support rail 80 links.
The temporary laying mechanism of above-mentioned auxiliary 9 is adjacent with above-mentioned temporary laying mechanism 8 in the Y-axis direction, and carries relative to above-mentioned box Put mechanism 6 and be disposed in the surface of wiper mechanism 10 described later in Y direction opposition side.The temporary laying mechanism of this auxiliary 9 Use the structure identical with above-mentioned temporary laying mechanism 8, have as shown in Figure 7: a pair aiding support rail 90, its Extend in the Y-axis direction, there is bottom 91a, 91b and sidepiece that the both sides to ring-type framework F support 92a, 92b, bottom 91a, 91b are configured to opening and closing；Open and close member 95a, 95b, this pair auxiliary is propped up by it Bottom 91a, 91b of support rail 90 carry out opening and closing；And lift component 96, it makes this pair aiding support rail 90 exist Upper and lower moves up.It addition, be provided with that in the upper end of sidepiece 92a, 92b of constituting a pair aiding support rail 90 Flange part 93a, 93b that this inside side is prominent, the one end connecting portion 94 each other of this flange part 93a Yu 93b Link.Above-mentioned open and close member 95a, 95b are made up of air motor in the illustrated embodiment, by a pair auxiliary Bottom 91a, 91b of supporting rail 90 drives respectively to as the closed position of horizontal level and beating as upright position Open position.Above-mentioned lift component 96 is made up of the cylinder 961 being installed on not shown fixed component, this cylinder 961 The linking part 94 of piston rod 962 and above-mentioned a pair aiding support rail 90 link.
Then, with reference to Fig. 1 and Fig. 9, above-mentioned wiper mechanism 10 is illustrated.
The wiper mechanism 10 of embodiment illustrated is adjacent with above-mentioned temporary laying mechanism 8 and joins relative to box carrying mechanism 6 It is located at Y direction opposition side.This wiper mechanism 10 has cleaning cover 11.This cleaning cover 11 by antetheca 111, after Wall 112, sidewall 113 and 114 and diapire (not shown) are constituted, and top is open.So constitute Rotary table 12 it is equipped with in cleaning cover 11.Rotary table 12 by workbench main body 121, be disposed in this work The upper surface of platform main body 121 absorption chuck 122 and workbench main body 121 is carried out rotate drive servo electricity Motivation 123 is constituted.The external diameter of workbench main body 121 is formed as bigger than the external diameter of above-mentioned wafer W and ratio is across scribing The internal diameter of the ring-type framework F supported wafer W with T is little.Absorption chuck 122 formed by porous ceramics and It is connected with not shown attracting member, it has suitably been acted on negative pressure.Therefore, it is positioned on absorption chuck 122 Machined object because not shown attracting member carries out action, adsorbing on chuck 122 by attracting holding.
If proceeding explanation with reference to Fig. 1 and Fig. 9, the antetheca 111 at cleaning cover 11 is provided with along Y direction The bullport 111a formed, can arrange oriented guarantor in the way of moving in the Y-axis direction in this bullport 111a Hold the injection nozzle 13 of machined object jet cleaning water on above-mentioned rotary table 12.It is configured to one end be linked with The other end of the wire rod 15 of hammer 14 links with this injection nozzle 13 via pulley 16, because of the gravity of hammer 14 to arrow Head direction shown in Y1 is moved.Further, it is disposed in constitute and above-mentioned takes out of the/card of the supporting base station 72 of moving-in mechanism 7 Close component 78 and arrange the shape for having advanced from the clamping rpole 781 that the lower surface of supporting base station 72 is retreated downwards Under state, the direction shown in arrow Y1 moved from the gravity because of hammer 14 of injection nozzle 13 and this injection nozzle 13 Contact.It addition, injection nozzle 13 is connected with not shown rinse water supply member.
Topping machanism in embodiment illustrated is constituted in the way of as above, illustrates its effect below.
First, the cylinder 861 making temporary laying mechanism 8 as shown in Figure 10 carries out action and is positioned at by a pair supporting rail 80 Upper position and take out of/the holding parts of moving-in mechanism 7 74 (with reference to Fig. 6) and a pair banking pin 75 by being equipped with The supporting base station 72 of (with reference to Fig. 5 and Fig. 6) is positioned at the position of readiness of diagram.
Then, make to take out of/the conveyance mobile member 71 (with reference to Fig. 1 and Fig. 5) of moving-in mechanism 7 carries out action, and The supporting base station 72 being equipped with holding parts 74 and a pair banking pin 75 is made to move to box carrying mechanism as shown in figure 11 6 sides, make a pair banking pin 75 (with reference to Fig. 5 and Fig. 6) and are arranged on across dicing tape T being accommodated in box 60 Semiconductor wafer W carry out the breach F-1 on the ring-type framework F that supports and tabular surface F-2 (with reference to Fig. 1) card Close, thus by the position limitation of semiconductor wafer W in the position of regulation.Further, by making cylinder 740 move Make and ring-type framework F held at supporting base station 72 and hold between parts 74 (with reference to Fig. 6).
After having held ring-type framework F by supporting base station 72 and holding parts 74, make to take out of/moving-in mechanism 7 Conveyance mobile member 71 carry out action and make supporting base station 72 move to the opposition side of box carrying mechanism 6, as figure Shown in 12, ring-type framework F is transported to a pair supporting rail 80 of temporary laying mechanism 8, and puts temporarily.
After ring-type framework F is transported to a pair supporting rail 80 of temporary laying mechanism 8, make cylinder as shown in figure 13 861 carry out action and make a pair supporting rail 80 decline and be positioned at lower position.Its result is, is assemblied in ring-type Framework F and be pasted with dicing tape T of semiconductor wafer W and be positioned in and be positioned to keep being added of table mechanism 3 On the upper surface keeping workbench 34 of work thing loading position.Further, above-mentioned open and close member 85a, 85b (reference is made Fig. 6 and Fig. 8) carry out action and by closedown shown in solid from Fig. 8 to bottom 81a, 81b of a pair supporting rail 80 Location positioning is to the open position shown in double dot dash line.
Then, by making not shown attracting member carry out action, and will partly lead across dicing tape T as shown in figure 14 Body wafer W attracting holding is on the upper surface keeping workbench 34.Further, the cylinder 851 of temporary laying mechanism 8 is made to enter Action is made and is made a pair supporting rail 80 rise and be positioned at upper position.
As shown in figure 14 on the upper surface keeping workbench 34 across dicing tape T attracting holding semiconductor wafer After W, composition is made to keep the processing feeding component 35 of table mechanism 3 to carry out action and make attracting holding and partly lead The holding workbench 34 of body wafer W is as moving as shown in Figure 15 to the machining area being equipped with cutting mechanism 4. Further, by the 1st cutting member 5a and the 2nd cutting member 5b to being maintained at the quasiconductor kept on workbench 34 Wafer W implements the machining of regulation.Further, since keep workbench 34 to be formed as external diameter ratio half as described above Big and than ring-type framework F the internal diameter of the external diameter of conductor wafer W is little, and the most ring-type framework F is because of deadweight somewhat Sagging, will not occur with the cutting tool 533 of the 1st cutting member 5a and the 2nd cutting member 5b in machining Interfering, and need not framework pressing mechanism, cost reduces.
As described above to being maintained at the machining keeping the semiconductor wafer W on workbench 34 to implement regulation Afterwards, processing feeding component 35 is made to carry out action and attracting holding the holding of the semiconductor wafer W cut Workbench 34 is positioned at the machined object loading position shown in Figure 16.In this condition, will remain in holding workbench The semiconductor wafer W that cutting on 34 completes is positioned at the underface of temporary laying mechanism 8.
Just it is being positioned at temporary laying mechanism 8 will remain in the semiconductor wafer W keeping the cutting on workbench 34 to complete After Xia Fang, in the state that bottom 81a, 81b of a pair supporting rail 80 of temporary laying mechanism 8 are positioned at open position Under make cylinder 861 carry out action, and make a pair supporting rail 80 decline and be positioned at lower position as shown in figure 17.And And, bottom 81a, 81b of a pair supporting rail 80 are positioned at closed position and ring-type framework F are supported, And release the holding workbench 34 attracting holding to semiconductor wafer W.
Then, the cylinder 861 making temporary laying mechanism 8 carries out action and makes to carry a pair supporting rail of ring-type framework F 80 rise, and as shown in figure 18 a pair supporting rail 80 are centrally positioned position, this centre position and upper position phase Ratio is positioned at slightly below, and take out of/the holding parts 74 of moving-in mechanism 7 and a pair banking pin 75 can be supported on one The top that the cutting of supporting rail 80 completes semiconductor wafer W is moved.
Further, by making to take out of/the conveyance mobile member 71 of moving-in mechanism 7 carries out action, and makes as shown in figure 19 Supporting base station 72 moves to box carrying mechanism 6 side, makes a pair banking pin 75 (with reference to Fig. 5 and Fig. 6) and is arranged on Breach on the ring-type framework F that the semiconductor wafer W being accommodated in box 60 is supported by dicing tape T F-1 and tabular surface F-2 (with reference to Fig. 1) engaging and by the position limitation of semiconductor wafer W in the position of regulation.And And, by making cylinder 740 carry out action, the ring-type framework F that carry new semiconductor wafer W is held Between supporting base station 72 and holding parts 74 (with reference to Fig. 6).Now, parts 74 and a pair banking pin 75 are held Move above semiconductor wafer W having cut.
Then, the cylinder 851 making temporary laying mechanism 8 carries out action and has cut semiconductor wafer W by carry A pair supporting rail 80 is positioned at upper position, and will carry the ring-type framework having cut semiconductor wafer W The end face of box carrying mechanism 6 side in F is positioned at and assists, with a pair, the position that banking pin 77 is relative.Then, pass through Make to take out of/the conveyance mobile member 71 of moving-in mechanism 7 carries out action, make as shown in Figure 20 supporting base station 72 to The opposition side of box carrying mechanism 6 is moved, and carries new half by held by supporting base station 72 and holding parts 74 The ring-type framework F of conductor wafer W is transported to a pair supporting rail 80 of temporary laying mechanism 8, and will carry a pair The cutting that auxiliary banking pin 77 is abutted completes the ring-type framework F of semiconductor wafer W and is transported to assist temporary laying mechanism A pair aiding support rail 90 of 9.
It is being transported to assist the one of temporary laying mechanism 9 by carry the ring-type framework F having cut semiconductor wafer W After aiding support rail 90, cylinder 961 is made to carry out action and make a pair aiding support rail as shown in figure 21 90 decline and are positioned at lower position.In this condition, it is assemblied in ring-type framework F and is pasted with semiconductor wafer The upper surface of the rotary table 12 of dicing tape T of W and wiper mechanism 10.Further, by auxiliary by a pair Bottom 91a, the 91b helping supporting rail 90 navigates to open position from closed position, thus will cutting across dicing tape T The semiconductor wafer W completed is positioned on the upper surface of rotary table 12.Further, by making not shown attraction Component carries out action, and cut across dicing tape T attracting holding on the upper surface of rotary table 12 half Conductor wafer W.
Then, by a pair supporting rail 80 and a pair aiding support rail 90 of the temporary laying mechanism 9 of auxiliary of temporary laying mechanism 8 As shown in (a) of Figure 22, it is positioned at upper position, makes rotary table 12 rotate, and such as (b) of Figure 22 As shown in make not shown rinse water supply member carry out action, thus from injection nozzle 13 jet cleaning water 130. Now, make to be disposed in take out of/clamping rpole 781 of the fastened component 78 of the supporting base station 72 of moving-in mechanism 7 before and then It is positioned at the position engaged with injection nozzle 13, makes conveyance mobile member 71 carry out action and make clamping rpole 781 at Y Move back and forth on direction of principal axis.Therefore, injection nozzle 13 is connected with the one end of the wire rod 15 being linked to injection nozzle 13 The gravity of the hammer 14 of knot moves back and forth with collaborating in the Y-axis direction.It addition, injection nozzle 13 move back and forth model Enclose the scope that can be at least the outer thoughtful center from the semiconductor wafer W cut.Its result is, to across The semiconductor wafer W that the cutting on rotary table 12 of the dicing tape T attracting holding completes carries out rotary-cleaning.Separately Outward, in above-mentioned injection nozzle 13 moving back and forth in the Y-axis direction, take out of/moving-in mechanism 7 becomes driving source, Therefore, it is possible to realize miniaturization, and it is capable of the reduction of cost.Further, owing to rotary table 12 is as above-mentioned Be formed as bigger than the external diameter of semiconductor wafer W and than ring-type framework F the internal diameter of external diameter like that little, the most ring-type Framework F is the most sagging because of deadweight, and the rinse water being supplied to semiconductor wafer W is successfully discharged to periphery, and Need not framework pressing mechanism, cost reduces.
After having carried out the semiconductor wafer W cut as described above cleaning, will take out of as shown in figure 23 / moving-in mechanism 7 is positioned at above-mentioned position of readiness, and will constitute a pair aiding support rail 90 assisting temporary laying mechanism 9 Bottom 91a, 91b be positioned at open position state under be positioned at lower position, bottom 91a, 91b are placed in pass Closed position and support ring-type framework F, the semiconductor wafer W cleaned is supported by this ring-type framework F. Further, the rotary table 12 attracting holding to semiconductor wafer W is released.
Then, it is positioned at top by constituting a pair aiding support rail 90 assisting temporary laying mechanism 9 like that as shown in figure 24 Position, the temporary laying mechanism of this auxiliary 9 supports ring-type framework F, this ring-type framework F semiconductor die to having cleaned Sheet W supports.Further, make to be disposed in take out of/auxiliary of the supporting base station 72 of moving-in mechanism 7 holds parts 76 Carry out action and hold ring-type framework F.
Further, make to take out of/the conveyance mobile member 71 of moving-in mechanism 7 carries out action, and makes as shown in fig. 25 The ring-type framework F of the semiconductor wafer W that supporting has been cleaned is from a pair aiding support rail assisting temporary laying mechanism 9 90 a pair supporting rail 80 moving to temporary laying mechanism 8.
Then, like that a pair supporting rail 80 of temporary laying mechanism 8 is centrally positioned position, and will join as shown in figure 26 Be located at take out of/the supporting holding parts 74 of base station 72 of moving-in mechanism 7 and a pair banking pin 75 be positioned at position of readiness.
Further, make to take out of/the conveyance mobile member 71 of moving-in mechanism 7 carries out action, and makes as shown in figure 27 Supporting base station 72 makes holding parts 74 and a pair banking pin 75 move from position of readiness to box carrying mechanism 6 side shifting Move the box 60 being placed in box carrying mechanism 6, the ring-type frame of the semiconductor wafer W thus supporting cleaned Frame F is accommodated in box 60.
It addition, the semiconductor wafer W cleaned is carried out and is accommodated in box 60 implementing as described above In operation time, the new semiconductor wafer W picture of a pair supporting rail 80 taking out of temporary laying mechanism 8 from box 60 State to be transported to like that constitute and keep the holding workbench 34 of table mechanism 3 and be attracted to maintain.Further, attract to protect Hold and keeping the new semiconductor wafer W processed feeding component 35 on workbench 34 to move to be equipped with cutter The machining area of structure 4, implements the machining of regulation by the 1st cutting member 5a and the 2nd cutting member 5b.
As it has been described above, in the topping machanism of embodiment illustrated, when the holding work that machined object will be kept When platform 34 is positioned at machined object loading and unloading area, by taking out of/moving-in mechanism 7 by be accommodated in box 60 across drawing The ring-type framework F that semiconductor wafer W is supported by sheet band T takes out of and is placed on temporarily and constitutes the one of temporary laying mechanism 8 To on supporting rail 80, and make a pair supporting rail 80 decline by lift component 86 and will be supported on across dicing tape T The semiconductor wafer W of ring-type framework F is positioned on holding workbench 34, and by open and close member 85a, 85b Open bottom 81a, 81b thus across dicing tape T, semiconductor wafer W is maintained on holding workbench 34, because of The ring-type framework F that carry the semiconductor wafer W as machined object across dicing tape T is transported by this Conveyance component is the most only to take out of/moving-in mechanism 7, therefore reduces parts number of packages and reduces cost, and is capable of The miniaturization of device.Further, take out of/moving-in mechanism 7 has the rotary table being also directed to be disposed in wiper mechanism 10 The temporary laying mechanism 9 that assists of the surface of 12 transports the ring of the semiconductor wafer W cut across the supporting of dicing tape T The function of shape framework F, therefore, it is possible to realize the miniaturization of device further.

Claims (6)

1. a topping machanism, it possesses:
Box carrying mechanism, the box being accommodated with multiple machined object is loaded by it；
Taking out of/moving-in mechanism, machined object is taken out of relative to the box placed by this box carrying mechanism and moves into by it；
Temporarily laying mechanism, its to by this take out of/machined object that takes out of of moving-in mechanism puts temporarily；
Keeping workbench, its machined object put this temporary laying mechanism temporarily keeps；
Cutting mechanism, the machined object being maintained on this holding workbench is cut by it；And
Processing feed mechanism, this holding workbench is processed in the X-direction as processing direction of feed by it Feeding,
This topping machanism is characterised by,
This processing feed mechanism has:
X-axis guide rail, this holding stage support is can be in the machined object loading place being equipped with this temporary laying mechanism by it Move in the X-direction as processing direction of feed between territory and the machining area being equipped with this cutting mechanism；With And
Processing feeding component, it makes this holding workbench move along this X-axis guide rail,
This temporary laying mechanism is adjacent in the Y direction vertical with X-direction with this box carrying mechanism arrange,
This takes out of/and moving-in mechanism has:
Supporting base station；
Holding parts, it is disposed in this supporting base station and holds the machined object being accommodated in box；
A pair banking pin, machined object is limited in the position of regulation by them；And
Transporting mobile member, it makes this supporting base station move in the Y-axis direction,
This temporary laying mechanism has:
A pair supporting rail, they are configured to extend in the Y-axis direction, have the both sides to machined object and carry out propping up The bottom held and sidepiece, and can opening and closing bottom this；
Open and close member, its to this pair supporting rail this bottom carry out opening and closing；And
Lift component, it makes this pair supporting rail move in the vertical direction,
When by this holding table positions in this machined object loading and unloading area, take out of/moving-in mechanism general's storage by this Machined object in box takes out of and is placed on temporarily on this pair supporting rail constituting this temporary laying mechanism, by this lift component This pair supporting rail is made to decline and be positioned in by machined object on this holding workbench, and by this open and close member by this end Portion opens, thus is maintained at by machined object on this holding workbench.
Topping machanism the most according to claim 1, wherein,
It is adjacent with this temporary laying mechanism and be equipped with wiper mechanism relative to this box carrying mechanism in Y direction opposition side, This wiper mechanism has the rotary table for being carried out machined object, and, just going up at this wiper mechanism Side is equipped with the temporary laying mechanism of the auxiliary put machined object temporarily, and the temporary laying mechanism of this auxiliary is configured to and this temporary laying mechanism Connection,
The temporary laying mechanism of this auxiliary has:
A pair aiding support rail, they are configured to extend in the Y-axis direction, have the both sides to machined object and enter The bottom of row supporting and sidepiece, and can opening and closing bottom this；
Open and close member, its to this pair aiding support rail this bottom carry out opening and closing；And
Assistance for lifting component, it makes this pair aiding support rail move in the vertical direction.
Topping machanism the most according to claim 2, wherein,
This takes out of/and moving-in mechanism has:
Auxiliary holds parts, and it is disposed in this supporting base station, in the machined object being supported on this pair aiding support rail The region with the opposition side, region held by these holding parts that is in hold；And
A pair auxiliary banking pin, they will bear upon the machined object of this pair aiding support rail and are limited in the position of regulation Put,
When by when remain this holding table positions of the machined object cut in this machined object loading and unloading area, When make this temporary laying mechanism of composition this pair supporting rail this bottom open make this pair supporting rail decline and Make after being positioned at the bottom of the machined object cut bottom by this to close bottom this and make this pair supporting rail Rise when carry the machined object cut,
Then, by this take out of/machined object being accommodated in box holds also by these holding parts of moving-in mechanism And this pair auxiliary banking pin being arranged at this supporting base station is positioned at being in this machined object cut On the end face in the region of the opposition side, region held by these holding parts, and make this supporting base station move to this auxiliary to put temporarily Mechanism side, thus the machined object being accommodated in box is positioned this temporary laying mechanism and machined object cutting completed It is positioned the temporary laying mechanism of this auxiliary,
Machined object cutting completed by constituting this assistance for lifting component of the temporary laying mechanism of this auxiliary be put in temporarily this one To aiding support rail, make this pair aiding support rail decline by this lift component and machined object is placed in this cleaning This rotary table of mechanism, and opened bottom this by this open and close member, thus the machined object that cutting is completed It is maintained on this rotary table.
4. according to the topping machanism described in Claims 2 or 3, wherein,
This wiper mechanism has the injection nozzle of the jet cleaning water of the top being disposed in this rotary table, and this injection is sprayed Mouth by be disposed in constitute this take out of/fastened component that engages of this supporting base station of moving-in mechanism and optionally carrying out and Movement along with this supporting base station is moved in the Y-axis direction, at least the district from outer thoughtful center to machined object Territory jet cleaning water.
Topping machanism the most according to claim 4, wherein,
The other end of the wire rod that one end links with hammer links via this injection nozzle of pulley with this wiper mechanism, this injection Nozzle is configured to move in the Y-axis direction by the gravity of this hammer,
This fastened component has can be disposed in the clamping rpole of this supporting base station in the way of retreating, before making this clamping rpole Under the state entered this fastened component from the gravity by this hammer of this injection nozzle the direction of movement and this injection nozzle Contact.
Topping machanism the most according to claim 1, wherein,
This cutting mechanism has:
1st cutting member, it is can possess the 1st cutting tool in the way of rotating；
2nd cutting member, it is opposed with the 1st cutting tool of the 1st cutting member can possess in the way of rotating The 2nd cutting tool arranged；
Y-axis guide rail, the 1st cutting member and the 2nd cutting member are supported as can hang down with X-direction by it Move in straight Y direction；
1st index feed component, it makes the 1st cutting member move along this Y-axis guide rail；And
2nd index feed component, it makes the 2nd cutting member move along this Y-axis guide rail.
CN201610274010.3A 2015-04-28 2016-04-28 Cutting device Active CN106098621B (en)

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CN106098621B (en) 2021-08-03
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