TWI674180B - Cutting device - Google Patents

Cutting device Download PDF

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Publication number
TWI674180B
TWI674180B TW105107381A TW105107381A TWI674180B TW I674180 B TWI674180 B TW I674180B TW 105107381 A TW105107381 A TW 105107381A TW 105107381 A TW105107381 A TW 105107381A TW I674180 B TWI674180 B TW I674180B
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Taiwan
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pair
workpiece
cutting
auxiliary
cassette
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TW105107381A
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TW201703957A (en
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大河原聡
八木原惇
寺師健太郎
赤瀬勝彦
松岡伸太郎
田中万平
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

提供使裝置全體之構成單純而小型化，同時可 以減少零件數量而降低製造成本的切削裝置。 Provides simple and miniaturization of the entire structure of the device. Cutting device to reduce the number of parts and reduce manufacturing costs.

為一種切削裝置，具備：卡匣載置機構，和 從被載置在卡匣載置機構之卡匣搬岀及搬入被加工物之搬岀、搬入機構，和暫時放置藉由搬岀、搬入機構被搬岀之被加工物的暫時放置機構，和保持被暫時放置在暫時放置機構之被加工物的保持台，和切削被保持在保持台之被加工物的切削機構，和使保持台在加工進給方向(X軸方向)進行加工進給的加工進給機構，加工進給機構具備：X軸導軌，其係用以支撐成使該保持台在配設有暫時放置機構之被加工物拆裝區域，和配設有切削機構之加工區域之間於X軸方向能夠移動；和加工進給手段，其係沿著該X軸導軌而使該保持台移動，搬岀、搬入機構具備支撐基台；被配設在支撐基台，把持被收容在卡匣之被加工物的把持構件；將被加工物限制在規定之位置的一對限制銷；及使支撐基台在Y軸方向移動之搬運移動手段，暫時放置機構具備：在Y軸方向延伸並具有支撐被加工物之兩側部的底部和側部，且底部被構成能夠開關之一對支撐軌道；和開關一對支撐軌道之該底部的開關手段；和使一對支撐軌道在上下方向移動之升降手段。 Is a cutting device comprising: a cassette mounting mechanism; and And a temporary placement mechanism for temporarily moving objects to be processed by the transfer and transfer mechanism from a cassette loaded on the cassette loading mechanism, and a transfer and transfer mechanism for transferring the workpiece, and A holding table that holds a workpiece temporarily placed in a temporary placement mechanism, a cutting mechanism that cuts a workpiece that is held in a holding table, and a processing feed that causes the holding table to perform a machining feed in the processing feed direction (X-axis direction) Processing feed mechanism, the processing feed mechanism is provided with: an X-axis guide rail, which is used to support the holding table in a processing object disassembly area equipped with a temporary placement mechanism, and a processing area equipped with a cutting mechanism. It can move in the X-axis direction; and a processing feed means that moves the holding table along the X-axis guide. The moving and loading mechanism has a supporting abutment; it is arranged on the supporting abutment and is held and stored A holding member for the workpiece in the cassette; a pair of restriction pins that restrict the workpiece to a predetermined position; and a transporting and moving means for moving the support base in the Y-axis direction. The temporary placement mechanism includes: in the Y-axis direction. Extension The bottom and sides supporting both sides of the workpiece are supported, and the bottom is configured to be able to switch one pair of support rails; and a switching means for switching the bottom of the pair of support rails; Lifting means.

Description

切削裝置 Cutting device

本發明係關於用以切削半導體晶圓等之被加工物的切削裝置。 The present invention relates to a cutting device for cutting a workpiece such as a semiconductor wafer.

在半導體裝置製造工程中，藉由格子狀地被配列在為略圓板形狀之半導體晶圓之表面上的分割預定線區劃岀複數區域，在該被區劃之區域形成IC、LSI等之裝置。而且，藉由沿著分割預定線切斷半導體晶圓，分割形成有裝置的區域而製造岀各個半導體裝置。 In a semiconductor device manufacturing process, a plurality of regions are divided by a predetermined division line arranged in a grid pattern on a surface of a semiconductor wafer having a substantially circular plate shape, and devices such as ICs and LSIs are formed in the divided regions. Further, each semiconductor device is manufactured by cutting a semiconductor wafer along a predetermined dividing line and dividing a region where the device is formed.

沿著分割預定線切斷半導體晶圓等之被加工物的切削裝置，具備：載置收容有複數之被加工物的卡匣之卡匣載置手段，和從被載置在該卡匣載置手段之卡匣搬岀及搬入被加工物之搬岀、搬入手段，和暫時放置藉由該搬岀、搬入手段被搬岀之被加工物的暫時放置手段，和保持被暫時放置在該暫時放置手段之被加工物的保持台，和切削被保持在該保持台之被加工物的切削手段，和使該保持台在加工進給方向(X軸方向)進行加工進給的加工進給手段。而且，藉由切削手段具備：以能夠旋轉之方式具 備第一切削刀之第一切削手段，和以能夠旋轉之方式具備被配設成與該第一切削手段之第一切削刀相向之第二切削刀的第二切削手段，可以沿著分割預定線效率佳地切斷半導體晶圓等之被加工物切斷而分割成各個裝置(例如，參照專利文獻1)。 A cutting device for cutting a processed object such as a semiconductor wafer along a predetermined division line includes a cassette mounting means for mounting a cassette containing a plurality of processed objects, and loading the cassette from the cassette. Removal of cassettes by means of relocation and relocation by means of relocation, relocation means, and provisional means for temporarily placing relocations of objects to be processed by means of the relocation, relocation means, and keeping temporarily placed A holding table for a workpiece to be placed, a cutting device for cutting a workpiece to be held on the holding table, and a processing feed device for making the holding table perform processing feed in a processing feed direction (X-axis direction). . In addition, the cutting means includes: The first cutting means provided with a first cutting blade and the second cutting means rotatably provided with a second cutting blade arranged to oppose the first cutting blade of the first cutting means can be scheduled along the division. The object to be processed, such as a semiconductor wafer, is cut with good linear efficiency and divided into individual devices (for example, refer to Patent Document 1).

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開平11-26402號公報 [Patent Document 1] Japanese Patent Laid-Open No. 11-26402

然後，上述切削裝置有尤其用以搬運被加工物之機構需要複數使得裝置全體之構成複雜且大型化，並且零件數量變多，製造成本變高的問題。 Then, the above-mentioned cutting device has a problem that, in particular, a mechanism for conveying a workpiece requires a plurality of components, which complicates and enlarges the overall structure of the device, increases the number of parts, and increases manufacturing costs.

本發明係鑒於上述情形而創作岀，其主要之技術課題，在於提供可以使裝置全體之構成單純而成為小型化，並且減少零件數量而降低製造成本之切削裝置。 The present invention has been made in view of the above-mentioned circumstances, and its main technical problem is to provide a cutting device that can simplify the overall configuration of the device, reduce the size of the device, and reduce the number of parts and manufacturing costs.

為了解決上述主要技術課題，若藉由本發明時，提供一種切削裝置，具備：載置收容有複數之被加工物的卡匣之卡匣載置機構，和從被載置在該卡匣載置機構之卡匣搬岀及搬入被加工物之搬岀、搬入機構，和暫時放 置藉由該搬岀、搬入機構被搬岀之被加工物的暫時放置機構，和保持被暫時放置在該暫時放置機構之被加工物的保持台，和切削被保持在該保持台之被加工物的切削機構，和使該保持台在加工進給方向(X軸方向)進行加工進給的加工進給機構，該切削裝置之特徵在於：該加工進給機構具備：X軸導軌，其係用以支撐成使該保持台在配設有該暫時放置機構之被加工物拆裝區域，和配設有該切削機構之加工區域之間於加工進給方向(X軸方向)能夠移動；和加工進給手段，其係沿著該X軸導軌而使該保持台移動，該暫時放置機構和該卡匣載置機構係在與X軸方向正交之Y軸方向上相鄰接而配設，該搬岀、搬入機構具備支撐基台；被配設在該支撐基台，把持被收容在卡匣之被加工物的把持構件；將被加工物限制在規定之位置的一對限制銷；及使該支撐基台在Y軸方向移動之搬運移動手段，該暫時放置機構具備：在Y軸方向延伸並具有支撐被加工物之兩側部的底部和側部，且該底部被構成能夠開關之一對支撐軌道；和開關該一對支撐軌道之該底部的開關手段；和使該一對支撐軌道在上下方向移動之升降手段，該保持台被定位在該被加工物拆裝區域之時，藉由該搬岀、搬入機構，搬岀被收容在卡匣之被加工物而暫時放置在構成該暫時放置機構之該一對支撐軌道，並藉由該升降手段使該一對支撐軌道下降而將被加工物載置在該保持 台，且藉由該開關手段開啟該底部，將被加工物保持在該保持台。 In order to solve the above-mentioned main technical problem, if the present invention is adopted, a cutting device is provided, which includes a cassette mounting mechanism for mounting a cassette containing a plurality of processed objects, and a cassette mounting mechanism for mounting the cassette therefrom. Removal of cassettes in institutions and relocation of objects to be processed, relocation into institutions, and temporary storage A temporary placement mechanism for a workpiece to be carried by the transfer and loading mechanism, a holding table for holding the workpiece temporarily placed in the temporary placement mechanism, and a workpiece to be cut while being held on the holding table An object cutting mechanism and a processing feed mechanism that causes the holding table to perform processing feed in the processing feed direction (X-axis direction). The cutting device is characterized in that the processing feed mechanism includes: an X-axis guide rail, For supporting the holding table to be movable in the processing feed direction (X-axis direction) between the processing object dismounting area provided with the temporary placement mechanism and the processing area provided with the cutting mechanism; and The processing feed means moves the holding table along the X-axis guide, and the temporary placement mechanism and the cassette placement mechanism are arranged adjacent to each other in the Y-axis direction orthogonal to the X-axis direction. The loading and unloading mechanism is provided with a supporting base; a holding member arranged on the supporting base to hold the processed object stored in the cassette; a pair of restriction pins that limit the processed object to a predetermined position; And make the supporting abutment in the Y-axis direction The temporary placing mechanism includes a bottom portion and a side portion extending in the Y-axis direction and supporting both sides of the workpiece, and the bottom portion is configured to be capable of opening and closing a pair of support rails; and opening and closing the one A means for opening and closing the bottom of the support rail; and a lifting means for moving the pair of support rails in the up-down direction, when the holding table is positioned in the disassembly area of the workpiece, by the moving and loading mechanism, The workpieces stored in the cassette are moved and temporarily placed on the pair of support rails constituting the temporary placement mechanism, and the pair of support rails are lowered by the lifting means to place the workpieces on the holding The base is opened by the switch means, and the workpiece is held on the holding table.

以與上述暫時放置機構相鄰接之方式，在相對於卡匣載置機構為Y軸方向相反側配設具備用以洗淨被加工物之旋轉台的洗淨機構，同時在該洗淨機構之正上方配設有被構成與暫時放置機構連通且暫時放置被加工物之輔助暫時放置機構，該輔助暫時放置機構具備：在Y軸方向延伸且具有支撐被加工物之兩側部之底部和側部，被構成該底部能夠開關之一對輔助支撐軌道；開關該一對輔助支撐軌道之底部的開關手段；及使一對輔助支撐軌道在上下方向移動之輔助升降手段。 A cleaning mechanism provided with a rotary table for cleaning the workpiece is arranged on the side opposite to the Y-axis direction with respect to the cassette mounting mechanism in a manner adjacent to the temporary placement mechanism, and the cleaning mechanism is provided at the same time. Directly above is provided an auxiliary temporary placement mechanism which is configured to communicate with the temporary placement mechanism and temporarily place the workpiece. The auxiliary temporary placement mechanism includes a bottom portion extending in the Y-axis direction and supporting both sides of the workpiece, and The side part is constituted by a pair of auxiliary support rails that can be opened and closed at the bottom; switching means for opening and closing the bottom of the pair of auxiliary support rails; and an auxiliary lifting means for moving the pair of auxiliary support rails in the vertical direction.

上述搬岀、搬入機構具備：被配設在支撐基台且把持在被支撐於一對輔助支撐軌道之被加工物中與藉由把持構件被把持之區域相反側之區域的輔助把持構件，和將被支撐於一對輔助支撐軌道之被加工物限制在規定之位置的一對輔助限制銷，於保持切削完之被加工物之保持台被定位在被加工物拆裝區域之時，在構成暫時放置機構之一對支撐軌道之底部呈開啟之狀態下，使該一對支撐軌道下降而將底部定位在切削完之被加工物之下部之後，在使該底部關閉而支撐切削完之被加工物之狀態下，使該一對支撐軌道上升，接著，藉由搬岀、搬入機構之把持構件而把持被收容在卡匣之被加工物，同時將被設置在支撐基台之一對輔助限制銷定位在切削完之被加工物中與藉由把持構件被把持 之區域相反側之區域的端面，且藉由使該支撐基台移動至該輔助暫時放置機構側，將被收容在卡匣之被加工物定位在暫時放置機構，同時將切削完之被加工物定位在輔助暫時放置機構，藉由構成輔助暫時放置機構之輔助升降手段暫時放置在一對輔助支撐軌道，並藉由升降手段使一對輔助支撐軌道下降而將被加工物載置在洗淨機構之旋轉台，且藉由開關手段開啟底部使切削完之被加工物保持在旋轉台。 The carrying and loading mechanism includes an auxiliary holding member disposed on a support abutment and holding an object to be processed supported by a pair of auxiliary supporting rails, and an area opposite to an area held by the holding member, and A pair of auxiliary restricting pins that restrict the workpieces supported on a pair of auxiliary supporting rails to a predetermined position, and when the holding table holding the cut workpiece is positioned in the workpiece disassembly area, When the bottom of one of the supporting rails is temporarily opened by one of the temporarily placing mechanisms, the pair of supporting rails are lowered and the bottom is positioned below the processed workpiece, and then the bottom is closed to support the processed workpiece. In the state of the object, the pair of supporting rails is raised, and then the workpiece to be stored in the cassette is held by the holding member of the carrying and loading mechanism, and at the same time, it is set to be supported on one of the supporting bases to assist the restriction The pin is positioned in the workpiece after being cut and held by the holding member The end face of the area on the opposite side of the area, and by moving the support abutment to the side of the auxiliary temporary placement mechanism, the workpiece to be stored in the cassette is positioned in the temporary placement mechanism, and at the same time, the workpiece to be machined is cut. Positioned on the auxiliary temporary placement mechanism, temporarily placed on a pair of auxiliary support rails by the auxiliary lifting means constituting the auxiliary temporary placement mechanism, and the pair of auxiliary support rails are lowered by the lifting means to place the workpiece on the cleaning mechanism The rotary table is turned on and the bottom is opened by the switch means, so that the workpiece to be cut is held on the rotary table.

上述洗淨機構具備被配設在旋轉台之上方的噴射洗淨水之噴射噴嘴，噴射噴嘴藉由被配設在構成搬岀、搬入機構之支撐基台且選擇性地進行卡合的卡合手段，隨著該支撐基台之移動，在Y軸方向移動，至少對從被加工物之外周至中心的區域噴射洗淨水。 The cleaning mechanism includes a spray nozzle for spraying washing water, which is disposed above the rotary table. The spray nozzle is selectively engaged by being arranged on a support base constituting a carrying and loading mechanism. Means: As the support abutment moves, it moves in the Y-axis direction, and at least the area from the periphery to the center of the workpiece is sprayed with washing water.

在上述洗淨機構之噴射噴嘴經滑輪連結一端與錘體連結的接線之另一端，且被構成藉由錘體之重力在Y軸方向移動，卡合手段具備以能夠進退之方式被配設在支撐基台的卡合桿，在卡合桿進出之狀態下從噴射噴嘴中藉由錘體之重力而移動的方向使接觸。 The spray nozzle of the cleaning mechanism is connected to the other end of the wire connected to the hammer body via a pulley, and is configured to move in the Y-axis direction by the gravity of the hammer body. The engaging means is provided to be able to advance and retreat. The engaging rod supporting the abutment is brought into contact with the direction in which the gravity of the hammer body moves from the spray nozzle while the engaging rod is in and out.

上述切削機構具備；以能夠旋轉之方式具備第一切削刀之第一切削手段，和以能夠旋轉之方式具備被配設成與該第一切削手段之第一切削刀相向之第二切削刀的第二切削手段，以能夠在與X軸方向正交之Y軸方向移動之方式支撐該第一切削手段和該第二切削手段之Y軸導 軌；和沿著該Y軸導軌使第一切削手段移動之第一分度進給手段，及沿著Y軸導軌使第二切削手段移動的第二分度進給手段。 The cutting mechanism includes: a first cutting means rotatably provided with a first cutting blade; and a second cutting blade rotatably provided with a second cutting blade disposed to oppose the first cutting blade of the first cutting means. The second cutting means supports the Y-axis guide of the first cutting means and the second cutting means in a manner capable of moving in a Y-axis direction orthogonal to the X-axis direction. A first indexing feeding means for moving the first cutting means along the Y-axis guide, and a second indexing feeding means for moving the second cutting means along the Y-axis guide.

本發明之切削裝置因被構成上述般，於保持被加工物之保持台被定位在被加工物拆裝區域之時，藉由搬岀、搬入機構搬岀被收容在卡匣之被加工物而暫時放置在構成暫時放置機構之一對支撐導軌，且藉由升降手段使一對支撐導軌下降而將被加工物載置在保持台，且藉由開關手段開啟底部，將被加工物保持在保持台，故搬運被加工物之搬運手段實質上僅有搬岀、搬入機構，因此可以減少零件數量而降低成本，同時可以謀求裝置之小型化。 The cutting device of the present invention is structured as described above. When the holding table for holding the workpiece is positioned in the workpiece disassembly area, the workpiece to be stored in the cassette is moved by the moving and loading mechanism. Place temporarily on a pair of support rails constituting a temporary placement mechanism, and lower the pair of support rails by lifting means to place the workpiece on the holding table, and open the bottom by the switch means to keep the workpiece on the holding Platform, so the only means of conveying the processed object is only the moving and loading mechanism, so the number of parts can be reduced and the cost can be reduced. At the same time, the device can be miniaturized.

2‧‧‧靜止基台 2‧‧‧ static abutment

3‧‧‧保持台機構 3‧‧‧maintaining agency

32‧‧‧移動基台 32‧‧‧ Mobile Abutment

34‧‧‧保持台 34‧‧‧holding table

35‧‧‧加工進給手段 35‧‧‧ processing feed means

351‧‧‧X軸線性軌道 351‧‧‧X axis linear orbit

352‧‧‧X軸線圈可動件 352‧‧‧X-axis coil moving parts

4‧‧‧切削機構 4‧‧‧ cutting mechanism

5a‧‧‧第一切削手段 5a‧‧‧The first cutting method

5b‧‧‧第二切削手段 5b‧‧‧Second cutting method

54‧‧‧分度進給手段 54‧‧‧ Indexing feeding means

540‧‧‧共同之Y軸線性軌道 540‧‧‧ Common Y-axis linear orbit

544a‧‧‧第一Y軸線圈可動件 544a‧‧‧The first Y-axis coil moving part

544b‧‧‧第二Y軸線圈可動件 544b‧‧‧Second Y-axis coil moving part

6‧‧‧卡匣載置機構 6‧‧‧ Cassette loading mechanism

60‧‧‧卡匣 60‧‧‧ Cassette

7‧‧‧搬出、搬入機構 7‧‧‧ move out, move in institutions

71‧‧‧搬運移動手段 71‧‧‧Transportation means

72‧‧‧支撐基台 72‧‧‧ support abutment

74‧‧‧把持構件 74‧‧‧ holding component

75‧‧‧一對限制銷 75‧‧‧ pair of restricted pins

76‧‧‧輔助把持構件 76‧‧‧Auxiliary holding member

77‧‧‧一對輔助限制銷 77‧‧‧A pair of auxiliary limit pins

8‧‧‧暫時放置機構 8‧‧‧ Temporary placement facility

80‧‧‧一對支撐軌道 80‧‧‧ pair of support rails

9‧‧‧輔助暫時放置機構 9‧‧‧ auxiliary temporary placement mechanism

90‧‧‧一對輔助支撐軌道 90‧‧‧ a pair of auxiliary support rails

10‧‧‧洗淨機構 10‧‧‧cleaning agency

11‧‧‧洗淨殼罩 11‧‧‧wash the shell

12‧‧‧旋轉台 12‧‧‧ rotating table

13‧‧‧噴射噴嘴 13‧‧‧jet nozzle

14‧‧‧錘體 14‧‧‧ Hammer

15‧‧‧接線 15‧‧‧ Wiring

16‧‧‧滑輪 16‧‧‧ pulley

F‧‧‧環狀框架 F‧‧‧ ring frame

T‧‧‧切割膠帶 T‧‧‧Cutting Tape

W‧‧‧半導體晶圓 W‧‧‧Semiconductor wafer

圖1為依照本發明而構成之切削裝置之斜視圖。 FIG. 1 is a perspective view of a cutting device constructed in accordance with the present invention.

圖2為圖1所示之切削裝置之重要部分斜視圖。 FIG. 2 is a perspective view of an important part of the cutting device shown in FIG. 1. FIG.

圖3為表示被安裝於圖1所示之切削裝置的切削機構的斜視圖。 Fig. 3 is a perspective view showing a cutting mechanism mounted on the cutting device shown in Fig. 1.

圖4為圖1中之A-A剖面圖。 Fig. 4 is a sectional view taken along A-A in Fig. 1.

圖5為構成圖1所示之切削裝置之搬岀、搬入機構的斜視圖。 Fig. 5 is a perspective view of a moving and loading mechanism constituting the cutting device shown in Fig. 1.

圖6為圖5所示之搬岀、搬入機構7之重要部分前視 圖。 FIG. 6 is a front view of an important part of the moving and loading mechanism 7 shown in FIG. 5 Illustration.

圖7為構成圖1所示之切削裝置之暫時放置機構及輔助暫時放置機構之斜視圖。 Fig. 7 is a perspective view of a temporary placement mechanism and an auxiliary temporary placement mechanism constituting the cutting device shown in Fig. 1.

圖8為圖7所示之暫時放置機構之側面圖。 FIG. 8 is a side view of the temporary placement mechanism shown in FIG. 7.

圖9為構成圖1所示之切削裝置之洗淨機構的斜視圖。 Fig. 9 is a perspective view of a cleaning mechanism constituting the cutting device shown in Fig. 1.

圖10為表示將搬岀、搬入機構之把持構件及一對限制銷定位在待機位置之狀態的斜視圖。 FIG. 10 is a perspective view showing a state in which a gripping member and a pair of restricting pins of the carrying and carrying mechanism are positioned in a standby position.

圖11為表示藉由搬岀、搬入機構之把持構件把持支撐被收容在載置於卡匣載置機構之卡匣的被加工物的環狀框架之狀態的斜視圖。 FIG. 11 is a perspective view showing a state in which a ring frame of a workpiece accommodated in a cassette placed on a cassette loading mechanism is gripped and supported by a gripping member of a carrying and loading mechanism.

圖12為表示藉由搬岀、搬入機構將被支撐於環狀框架之被加工物搬運至暫時放置機構之一對支撐軌道之狀態的斜視圖。 FIG. 12 is a perspective view showing a state in which a workpiece to be supported on a ring frame is transferred to a pair of support rails of a temporary placement mechanism by a carrying and carrying mechanism.

圖13為表示在保持台之上面隔著切割膠帶而載置被支撐在環狀框架之被加工物之狀態的斜視圖。 FIG. 13 is a perspective view showing a state in which a workpiece to be supported by the ring frame is placed on the upper surface of the holding table via a dicing tape.

圖14為表示使暫時放置機構之一對支撐軌道上升而定位在上部位置之狀態的斜視圖。 FIG. 14 is a perspective view showing a state in which one pair of support rails of the temporary placement mechanism is raised and positioned at an upper position.

圖15為表示將吸引保持被加工物之保持台移動至配設有切削機構之加工區域之狀態的斜視圖。 FIG. 15 is a perspective view showing a state in which a holding table that attracts and holds a workpiece is moved to a processing area where a cutting mechanism is provided.

圖16為表示將切削完之被加工物定位在吸引保持之保持台被加工物拆裝位置之狀態的斜視圖。 FIG. 16 is a perspective view showing a state in which the cut workpiece is positioned at the workpiece removal / attachment position of the holding table attracted and held.

圖17為表示從圖15所示之狀態將暫時放置機構之一對支撐軌道定位在下部位置之狀態的斜視圖。 FIG. 17 is a perspective view showing a state in which one pair of support rails of the temporary placement mechanism is positioned at a lower position from the state shown in FIG. 15.

圖18為表示從圖16所示之狀態將暫時放置機構之一對 支撐軌道定位在較上部位置些許下方之中間位置之狀態的斜視圖。 FIG. 18 shows a pair of temporary placement mechanisms from the state shown in FIG. An oblique view showing a state in which the support rail is positioned at an intermediate position slightly below the upper position.

圖19為表示藉由搬岀、搬入機構之把持部把持被收容在載置於卡匣載置機構之卡匣的被加工物之狀態的斜視圖。 FIG. 19 is a perspective view showing a state in which a processed object stored in a cassette loaded on a cassette loading mechanism is gripped by a gripping unit of a carrying and loading mechanism.

圖20為藉由搬岀、搬入機構之把持部將新的被加工物定位在暫時放置機構之一對支撐軌道，同時將切削完之被加工物定位在輔助暫時放置機構之一對輔助支撐軌道之狀態的斜視圖。 FIG. 20 shows that the new workpiece is positioned on one pair of support tracks of the temporary placement mechanism by the holding part of the carrying and loading mechanism, and the cut workpiece is positioned on the pair of auxiliary support tracks of the auxiliary temporary placement mechanism. Perspective view of the state.

圖21為表示從圖19之狀態定位在輔助暫時放置機構之一對輔助支撐軌道下部位置之狀態的斜視圖。 FIG. 21 is a perspective view showing a state of being positioned at a lower position of a pair of auxiliary support rails of one of the auxiliary temporary placement mechanisms from the state of FIG. 19.

圖22為表示從圖20之狀態定位在暫時放置機構之一對支撐軌道和輔助暫時放置機構之一對輔助支撐軌道上部位置之狀態的斜視圖及洗淨機構之噴射噴嘴移動之狀態的斜視圖。 FIG. 22 is a perspective view showing a state where the pair of support rails of the temporary placement mechanism and a pair of auxiliary support rails of the auxiliary temporary placement mechanism are positioned from the state of FIG. 20 and a state where the spray nozzle of the cleaning mechanism is moved; .

圖23為表示從圖21所示之狀態將搬岀、搬入機構7定位在待機位置，同時將構成輔助暫時放置機構之一對輔助支撐軌道定位在下部位置之狀態的斜視圖。 FIG. 23 is a perspective view showing a state in which the carrying and loading mechanism 7 is positioned at a standby position from the state shown in FIG. 21, and at the same time, a pair of auxiliary support rails constituting the auxiliary temporary placement mechanism is positioned at a lower position.

圖24為表示將支撐被支撐於環狀框架之洗淨完的被加工物之輔助暫時放置機構之一對輔助支撐軌道定位在上部位置之狀態的斜視圖。 FIG. 24 is a perspective view showing a state where a pair of auxiliary support rails are positioned at an upper position of one of the auxiliary temporary placement mechanisms supporting the washed workpieces supported by the ring frame.

圖25為表示從圖23之狀態將被支撐於環狀框架之洗淨完的被加工物從輔助暫時放置機構之一對輔助支撐軌道移動至暫時放置機構之一對支撐軌道之狀態的斜視圖。 25 is a perspective view showing a state in which the washed workpieces supported by the ring frame are moved from one pair of auxiliary support rails of the auxiliary temporary placement mechanism to one pair of support rails of the temporary placement mechanism from the state of FIG. 23. .

圖26為從圖24之狀態將暫時放置機構之一對支撐軌道定位在中間位置，同時將搬岀、搬入機構之把持構件及一對限制銷定位在待機位置之狀態的斜視圖。 FIG. 26 is a perspective view of a state in which a pair of support rails of the temporary placement mechanism is positioned at an intermediate position from the state of FIG. 24, and a holding member and a pair of restriction pins of the carry-in and carry-in mechanism are positioned at a standby position.

圖27為表示從圖25之狀態使搬岀、搬入機構作動而將被支撐於環狀框架之洗淨完的被加工物收容在卡匣之狀態的斜視圖。 FIG. 27 is a perspective view showing a state in which the processed object supported by the ring frame is stored in the cassette by operating the carrying and loading mechanism from the state of FIG. 25.

以下，針對依照本發明構成之切削裝置之較佳實施型態，參照附件圖面予以詳細說明。 Hereinafter, a preferred embodiment of a cutting device constructed in accordance with the present invention will be described in detail with reference to the attached drawings.

圖1表示依照本發明而構成之切削裝置之一實施型態的斜視圖。 FIG. 1 is a perspective view showing an embodiment of a cutting device constructed in accordance with the present invention.

圖示之實施型態中之切削裝置具備靜止基台2、保持被配設在該靜止基台2上之被加工物的保持台機構3、和切削被保持在該保持台機構3之被加工物的切削機構4。 The cutting device in the illustrated embodiment includes a stationary base 2 and a holding table mechanism 3 for holding a workpiece to be disposed on the stationary base 2 and a workpiece to be cut and held on the holding table mechanism 3.物 的 Cutting mechanism 4.

保持台機構3如圖2所示般具備：在靜止基台2上沿著以箭號X表示之加工進給方向(X軸方向)而被配設之兩根X軸導軌31、31；被配設成能夠在該兩根X軸導軌31、31上滑動之移動基台32；保持以能夠旋轉之方式被支撐於配設在該移動基台32上之圓筒狀之支撐構件33之被加工物的保持台34；使配設該保持台34之移動基台32沿著兩根X軸導軌31、31而在加工進給方向(X軸方向)移動之加工進給手段35。保持台34具備：以能夠旋轉之方式被支撐於圓筒狀之支撐構件33之平台本體341，和被配設在 該平台本體341之上面的吸附夾具342。平台本體341被形成外徑大於作為後述被加工物之晶圓之外徑，且小於隔著切割膠帶而支撐晶圓之環狀框架之內徑。吸附夾具342係藉由多孔陶磁而形成，且被連接於無圖示之吸引手段，適當地使負壓作用。因此，被載置吸附夾具342上之被加工物藉由使無圖示之吸引手段作動，被吸引保持在吸附夾具342上。再者，保持台34係藉由被配設在圓筒狀之支撐構件33內之無圖示之脈衝馬達使轉動。 As shown in FIG. 2, the holding table mechanism 3 includes two X-axis guides 31 and 31 arranged on the stationary base 2 along the processing feed direction (X-axis direction) indicated by an arrow X; A mobile base 32 configured to be able to slide on the two X-axis guides 31 and 31; and a bed that is rotatably supported by a cylindrical support member 33 provided on the mobile base 32 A processing base 35 for processing a workpiece; and a processing feed means 35 for moving a moving base 32 provided with the holding base 34 along two X-axis guides 31 and 31 in a processing feed direction (X-axis direction). The holding table 34 includes a platform main body 341 which is rotatably supported by a cylindrical support member 33, and is provided at A suction fixture 342 on the platform body 341. The platform body 341 is formed to have an outer diameter larger than an outer diameter of a wafer to be processed, which is described later, and smaller than an inner diameter of a ring-shaped frame that supports the wafer via a dicing tape. The suction jig 342 is formed by a porous ceramic magnet, and is connected to a suction means (not shown) to appropriately apply a negative pressure. Therefore, the workpiece placed on the suction jig 342 is attracted and held on the suction jig 342 by operating a suction means (not shown). The holding table 34 is rotated by a pulse motor (not shown) arranged in the cylindrical support member 33.

上述加工進給手段35係由被配設在兩根X軸導軌31和31之間，且在X軸方向延伸之X軸線性軌道351，和以能夠移動之方式被嵌插於該X軸線性軌道351，且被安裝於配設保持台34之移動基台32的X軸線圈可動件352所構成。X軸線性軌道351係例如交互接合複數圓柱狀之永久磁鐵之N極和S極而構成軸狀，且將構成該軸狀之複數圓柱狀之永久磁鐵配設在由不鏽鋼等之非磁性材所構成之圓筒狀之殼體而構成。如此構成之X軸線性軌道351係在其兩端部如圖2所示般安裝有支撐構件353、353，經由該支撐構件353、353而被安裝於上述靜止基台2。由X軸線性軌道351和X軸線圈可動件352所構成之加工進給手段35構成所謂的線性傳動軸馬達，當在X軸線圈可動件352流通電流時，重覆磁力所致之吸引力、反作用力而產生推力。因此，藉由改變施加於X軸線圈可動件352之電流的方向，可以變更X軸線圈可動件352沿著X軸線性軌道351移動之方向。構成如此之加工進給手段35係使配設有保持台34之移 動基台32在圖2所示之被加工物拆裝區域和配設切削機構4之加工區域之間移動。另外，圖示之實施型態中之加工進給手段35雖然表示藉由所謂的線性傳動軸馬達而構成之例，但是即使藉由滾珠螺桿機構而構成亦可。 The above-mentioned processing feed means 35 is an X-axis linear track 351 arranged between two X-axis guides 31 and 31 and extending in the X-axis direction, and is inserted into the X-axis linearly in a movable manner. The rail 351 is constituted by an X-axis coil movable member 352 mounted on a moving base 32 provided with a holding base 34. The X-axis linear orbit 351 is, for example, an N-pole and an S-pole of a plurality of cylindrical permanent magnets which are alternately connected to form an axis, and the plurality of cylindrical permanent magnets constituting the axis are arranged in a non-magnetic material such as stainless steel. It is constituted by a cylindrical casing. The X-axis linear rail 351 thus configured is provided with support members 353 and 353 at both ends thereof as shown in FIG. 2, and is mounted on the stationary base 2 via the support members 353 and 353. The processing feed means 35 composed of the X-axis linear orbit 351 and the X-axis coil movable element 352 constitutes a so-called linear drive shaft motor. When an electric current flows through the X-axis coil movable element 352, the attractive force caused by the magnetic force is repeated. The reaction forces generate thrust. Therefore, by changing the direction of the current applied to the X-axis coil mover 352, the direction in which the X-axis coil mover 352 moves along the X-axis linear track 351 can be changed. The processing feed means 35 constituted in this way moves the disposition holder 34 The movable base 32 moves between the processing object dismounting area shown in FIG. 2 and the processing area where the cutting mechanism 4 is provided. In addition, although the processing feed means 35 in the illustrated embodiment shows the example which consists of what is called a linear drive shaft motor, it can also be comprised by the ball screw mechanism.

接著，針對上述切削機構4予以說明。 Next, the cutting mechanism 4 will be described.

切削機構4具備被固定在上述靜止基台2上之門型之支撐框架41。該門型之支撐框架41係由隔著間隔而配設之第一柱部411及第二柱部412，和連結該第一柱部411及第二柱部412之上端，且沿著與以箭頭X所示之加工進給方向正交之箭號Y所示之分度進給方向(Y軸方向)而配設之支撐部413所構成，被配設成橫跨上述兩根X軸導軌31。 The cutting mechanism 4 includes a gate-shaped support frame 41 fixed to the stationary base 2. The gate-shaped support frame 41 is formed by a first pillar portion 411 and a second pillar portion 412 arranged at intervals, and connects the upper ends of the first pillar portion 411 and the second pillar portion 412 along the front and rear sides. The processing feed direction indicated by the arrow X is orthogonal to the indexed feed direction (Y-axis direction) indicated by the arrow Y. The support portion 413 is configured to be arranged across the two X-axis guides. 31.

在構成上述門型之支撐框架41之支撐部413之圖1及圖2中，在背面側配設有第一切削手段5a和第二切削手段5b。針對第一切削手段5a和第二切削手段5b，參照圖3及圖4進行說明。第一切削手段5a及第二切削手段5b分別具備分度移動基台51和切深移動基台52及轉軸單元53。第一切削手段5a之分度移動基台51及第二切削手段5b之分度移動基台51設置有與分別在上述支撐部413之圖4中被設置在左方之側面之兩根Y軸導軌413a、413a嵌合之被導引溝511、511，藉由將該被導引溝511、511與兩根Y軸導軌413a、413a嵌合，分度移動基台51被構成能夠沿著兩根Y軸導軌413a、413a移動。另外，在第一切削手段5a之分度移動基台51及第二切削手段5b之分度移動基台51之一方之表面，分別形成有配設後述分度進給手段之凹部513。再 者，在第一切削手段5a之分度移動基台51及第二切削手段5b之分度移動基台51之另一方之表面，分別如圖4所示般沿著以箭號Z表示所示之切深進給方向設置一對導軌512、512(在圖4中僅表示一方之導軌)。 In FIG. 1 and FIG. 2 of the support part 413 which comprises the said gate-shaped support frame 41, the 1st cutting means 5a and the 2nd cutting means 5b are arrange | positioned on the back side. The first cutting means 5a and the second cutting means 5b will be described with reference to Figs. 3 and 4. The first cutting means 5a and the second cutting means 5b include an index moving base 51, a depth-moving base 52, and a rotating shaft unit 53, respectively. The indexable moving base 51 of the first cutting means 5a and the indexable moving base 51 of the second cutting means 5b are provided with two Y-axes respectively provided on the left side in FIG. 4 of the support portion 413 described above. The guided grooves 511 and 511 where the guide rails 413a and 413a are fitted. By fitting the guided grooves 511 and 511 with the two Y-axis guide rails 413a and 413a, the index moving base 51 is configured to be able to follow the two The Y-axis guides 413a and 413a move. In addition, on one of the index moving base 51 of the first cutting means 5a and the index moving base 51 of the second cutting means 5b, recessed portions 513 are formed on the surfaces of the index moving means 51 to be described later. again Or, the other surfaces of the index moving base 51 of the first cutting means 5a and the index moving base 51 of the second cutting means 5b are shown along the arrow Z as shown in FIG. 4 respectively. A pair of guide rails 512, 512 are provided in the cutting depth feed direction (only one guide rail is shown in FIG. 4).

上述第一切削手段5a之切深移動基台52及第二切削手段5b之切深移動基台52係由分別在上下方向延伸之被支撐部521，和從該被支撐部521之下端轉直角而水平延伸的安裝部522。如圖4所示般，在被支撐部521中之安裝部522側之面設置有與被設置在上述分度移動基台51之另一方表面的一對Z軸導軌512、512嵌合之被導引溝523、523(在圖4中僅表示一方之被導引溝)，藉由將該被導引溝523、523嵌合至兩根之Z軸導軌512、512，切深移動基台52被構成能夠沿著兩根Z軸導軌512、512而在以箭號Z表示之切深進給方向移動。如此一來被安裝於分度移動基台51之切深移動基台52如圖1及圖2所示般，安裝部522被配置成突出至構成門型之支撐框架41之支撐部413的下側。 The cutting depth moving base 52 of the first cutting means 5a and the cutting depth moving base 52 of the second cutting means 5b are respectively formed by a supported portion 521 extending in the up-down direction and turned at right angles from the lower end of the supported portion 521. And the mounting portion 522 extends horizontally. As shown in FIG. 4, on the surface on the side of the mounting portion 522 of the supported portion 521, a pair of Z-axis guides 512 and 512 provided on the other surface of the index moving base 51 is fitted. Guide grooves 523 and 523 (only one guided groove is shown in FIG. 4), and the guided grooves 523 and 523 are fitted into two Z-axis guides 512 and 512 to move the abutment deeply. 52 is configured to move along the two Z-axis guides 512 and 512 in the cutting feed direction indicated by the arrow Z. In this way, as shown in FIG. 1 and FIG. 2, the cutting depth moving base 52 mounted on the index moving base 51 is arranged so that the mounting portion 522 protrudes below the supporting portion 413 of the gate-shaped supporting frame 41. side.

上述轉軸單元53分別被安裝在形成第一切削手段5a和第二切削手段5b之切深移動基台52的安裝部522之下面。該第一切削手段5a之轉軸單元53及第二切削手段5b之轉軸單元53分別如圖3及圖4所示般，具備心軸罩殼531，和以能夠旋轉之方式被支撐於該心軸罩殼531的旋軸心軸532，和被安裝於該旋轉心軸532之一端的切削刀533，和使供給切削水之切削水供給管534及旋轉心軸532旋轉驅動之無圖示伺服馬達，旋轉心軸532之軸線方向係 沿著以箭號Y所示之分度進給方向而被配設。而且，構成第一切削手段5a之轉軸單元53之切削刀533，和構成第二切削手段5b之旋轉單元53之切削刀533被配設成互相相向。 The above-mentioned rotating shaft unit 53 is mounted below the mounting portions 522 forming the depth-of-cut moving base 52 of the first cutting means 5a and the second cutting means 5b, respectively. The rotating shaft unit 53 of the first cutting means 5a and the rotating shaft unit 53 of the second cutting means 5b are provided with a mandrel cover 531 as shown in Figs. 3 and 4, respectively, and are rotatably supported by the mandrel. A rotary spindle 532 of the cover 531, a cutting blade 533 attached to one end of the rotary spindle 532, and a non-illustrated servo motor that drives a cutting water supply pipe 534 and rotary spindle 532 to supply cutting water. ， The axis direction of the rotating mandrel 532 is It is arranged along the index feed direction indicated by an arrow Y. The cutting blade 533 constituting the rotating shaft unit 53 of the first cutting means 5a and the cutting blade 533 constituting the rotating unit 53 of the second cutting means 5b are disposed to face each other.

圖示之實施型態中之第一切削手段5a和第二切削手段5b係如圖3所示般，具備有用以使上述分度移動基台51、51沿著兩根Y軸導軌413a、413a而在以箭號Y所示之分度進給方向(Y軸方向)移動之分度進給手段54。分度進給手段54係由沿著上述兩根之Y軸導軌413a、413a而被配設之共同的Y軸線性軌道540、以能夠移動之方式被嵌插於該共同之Y軸線性軌道540之第一切削手段5a之分度移動基台51的第一Y軸線圈可動件544a，和被安裝於以能夠移動之方式被嵌插於共同之Y軸線性軌道540之第二切削手段5b之分度移動基台51的第二Y軸線圈可動件544b。共同之Y軸線性軌道540係例如交互接合複數圓柱狀之永久磁鐵之N極和S極而構成軸狀，且將構成該軸狀之複數圓柱狀之永久磁鐵配置在由不鏽鋼等之非磁性材所構成之圓筒狀之殼體而構成。如此構成之共同之Y軸線性軌道540係在其兩端部如圖3所示般安裝有支撐構件543、543，經由該支撐構件543、543而被安裝於上述支撐框架41之支撐部413。以能夠移動之方式被嵌插至該共同之Y軸線性軌道540之第一Y軸線圈可動件544a及第二Y軸線圈可動件544b分別被配設在第一切削手段5a之分度移動基台51及第二切削手段5b之分度移動基台51的凹部513，分別被安裝於分 度移動基台51之一方之表面。 The first cutting means 5a and the second cutting means 5b in the illustrated embodiment are as shown in FIG. 3, and are provided to enable the index moving bases 51, 51 along two Y-axis guides 413a, 413a. On the other hand, the index feed means 54 is moved in the index feed direction (Y-axis direction) indicated by the arrow Y. The indexing feeding means 54 is a common Y-axis linear track 540 arranged along the two Y-axis guides 413a and 413a, and is movably inserted into the common Y-axis linear track 540. The first Y-axis coil movable member 544a of the indexing moving base 5a of the first cutting means 5a, and the second cutting means 5b mounted on the common Y-axis linear track 540 that are movably inserted into the common Y-axis linear track 540. The second Y-axis coil mover 544b of the base 51 is indexed and moved. The common Y-axis linear orbit 540 is, for example, an N-pole and an S-pole of a plurality of cylindrical permanent magnets which are alternately joined to form an axis, and the plurality of cylindrical permanent magnets constituting the axis are arranged in a non-magnetic material such as stainless steel. It is constituted by a cylindrical casing. The common Y-axis linear rail 540 configured in this manner is provided with support members 543 and 543 at both ends thereof as shown in FIG. 3, and is attached to the support portion 413 of the support frame 41 via the support members 543 and 543. The first Y-axis coil movable element 544a and the second Y-axis coil movable element 544b, which are inserted into the common Y-axis linear track 540 in a movable manner, are respectively arranged on the index moving base of the first cutting means 5a. The indexing movement of the table 51 and the second cutting means 5b with the recessed portions 513 of the base table 51 are respectively mounted on the indexing Surface of one side of the moving base 51.

如上述般，由共同之Y軸線性軌道540和第一Y軸線圈可動件544a及第二Y軸線圈可動件544b所構成之分度進給手段54，與由上述X軸線性軌道351和X軸線圈可動件352所構成之加工進給手段35相同，構成所謂的傳動軸馬達，當電流流入第一Y軸線圈可動件544a及第二Y軸線圈可動件544b時，重覆磁力所致之吸引力、反作用力而產生推力。因此，藉由改變施加於第一Y軸線圈可動件544a及第二Y軸線圈可動件544b之電流的方向，可以變更第一Y軸線圈可動件544a及第二Y軸線圈可動件544b沿著共同之Y軸線性軌道540而移動之方向。另外，圖示之實施型態中之分度進給手段54雖然表示藉由所謂的線性傳動軸馬達而構成之例，但是即使藉由滾珠螺桿機構而構成亦可。 As described above, the indexing feeding means 54 constituted by the common Y-axis linear orbit 540, the first Y-axis coil movable element 544a, and the second Y-axis coil movable element 544b, and the X-axis linear orbit 351 and X The processing feed means 35 formed by the shaft coil movable member 352 is the same and constitutes a so-called transmission shaft motor. When current flows into the first Y-axis coil movable member 544a and the second Y-axis coil movable member 544b, the magnetic force is repeated. Attraction and reaction forces generate thrust. Therefore, by changing the direction of the current applied to the first Y-axis coil mover 544a and the second Y-axis coil mover 544b, the first Y-axis coil mover 544a and the second Y-axis coil mover 544b can be changed along the direction. The direction in which the common Y-axis linear orbit 540 moves. In addition, although the indexing feed means 54 in the illustrated embodiment shows an example of a configuration with a so-called linear drive shaft motor, it may be configured with a ball screw mechanism.

再者，圖示之實施型態中之第一切削手段5a和第二切削手段5b係如圖3及圖4所示般，具備有用以使上述切深移動基台52、52沿著兩根Z軸導軌512、512而在以箭號Z所示之切深進給方向(Z軸方向)移動之切深進給手段55、55。切深進給手段55、55係由被配設成分別與兩根Z軸導軌512、512平行之公螺桿551、以能夠旋轉之方式支撐公螺桿551之一端部的軸承552，和被連結於公螺桿551之另一端，且使該公螺桿551正轉或逆轉驅動之脈衝馬達553所構成。被構成如此之切深進給手段55、55分別係公螺桿551與被形成在上述切深移動基台52之被支撐部521之母螺桿521a螺合。因此，切深進給手段55、55可以分別藉 由驅動脈衝馬達553使公螺桿551正轉或逆轉驅動，使切深移動基台52沿著兩根Z軸導軌512、512而在圖3中以箭號Z所示之切深進給方向(Z軸方向)移動。 Furthermore, the first cutting means 5a and the second cutting means 5b in the illustrated embodiment are as shown in FIG. 3 and FIG. 4, and are provided to enable the cutting depth moving bases 52, 52 along two The Z-axis guides 512 and 512 are depth-feed mechanisms 55 and 55 that move in the depth-feed direction (Z-axis direction) indicated by the arrow Z. The cutting depth feeding means 55 and 55 are a male screw 551 arranged parallel to the two Z-axis guide rails 512 and 512, respectively, a bearing 552 that rotatably supports one end of the male screw 551, and are connected to The other end of the male screw 551 is constituted by a pulse motor 553 that drives the male screw 551 to rotate forward or reverse. The cutting depth feed means 55 and 55 configured as described above are respectively screwed with a male screw 551 and a female screw 521a formed on the supported portion 521 of the cutting depth moving base 52. Therefore, the cutting depth feeding means 55, 55 can be borrowed separately The driving screw motor 553 drives the male screw 551 forward or reverse to drive the cutting depth moving base 52 along the two Z-axis guides 512 and 512 and the cutting depth feed direction shown by the arrow Z in FIG. 3 ( Z axis direction).

當參照圖1持續說明時，上述靜止基台2具備載置收容半導體晶圓等之複數被加工物之卡匣60的卡匣載置機構6、從被載置於該卡匣載置機構6之卡匣60搬岀被加工物，同時將切削完之被加工物搬入至卡匣60之搬出、搬入機構7、暫時放置藉由該搬出、搬入機構7被搬出之被加工物的暫時放置機構8、與該暫時放置機構8相鄰接而被配設的輔助暫時放置機構9，和洗淨切削後之被加工物的洗淨機構10。卡匣載置機構6使卡匣60被載置於藉由無圖示之升降手段而升降的卡匣台61上。在卡匣60收容有被黏貼於安裝於環狀框架F之切割膠帶T之表面的半導體晶圓W。另外，在環狀框架F之外周，設置有後述限制銷卡合之溝槽F-1及平面F-2。 While continuing to describe with reference to FIG. 1, the stationary base 2 includes a cassette mounting mechanism 6 on which a cassette 60 for storing a plurality of processed objects such as semiconductor wafers is placed, and the cassette mounting mechanism 6 is mounted on the cassette mounting mechanism 6. The cassette 60 carries the workpiece, and at the same time, the cut workpiece is transferred to the cassette 60's unloading, loading mechanism 7, and a temporary placement mechanism for temporarily removing the processed material by the loading and unloading mechanism 7. 8. An auxiliary temporary placement mechanism 9 disposed adjacent to the temporary placement mechanism 8 and a washing mechanism 10 for washing the workpiece after cutting. The cassette mounting mechanism 6 causes the cassette 60 to be placed on a cassette table 61 that is raised and lowered by a lifting means (not shown). The cassette 60 contains a semiconductor wafer W adhered to the surface of the dicing tape T mounted on the ring frame F. In addition, a groove F-1 and a plane F-2 for restricting pin engagement described later are provided on the outer periphery of the annular frame F.

搬出、搬入機構7如圖1所示般係由被配設在構成上述門型之支撐框架41的支撐部413之表面側的搬運移動手段71，和藉由該搬運移動手段71在Y軸方向移動的支撐基台72，和連結該支撐基台72和搬運移動手段71之連結構件73所構成。搬運移動手段71係由使連結支撐基台72之連結構件73在Y軸方向移動之輸送帶機構所構成。當參照圖5及圖6持續說明時，在構成搬出、搬入機構7之支撐基台72，安裝有：把持構件74(參照圖6)，其係被配設在下側，用以把持隔著切割膠帶T而支撐被收容在載置於 卡匣載置機構6之卡匣60的半導體晶圓W之環狀框架F；汽缸740，其係用以使該把持構件74在上下方向移動；和一對限制銷75，其係被配設在把持構件74之兩側且與被設置在上述環狀框架F之溝槽F-1及平面F-2卡合而將環狀框架F限制在規定之位置。構成如此之搬出、搬入機構7係使支撐基台72朝向被載置在卡匣載置機構6之卡匣60移動，且藉由使一對限制銷75與被設置在隔著切割膠帶T而支撐被收容在卡匣60之半導體晶圓W之環狀框架F的溝槽F-1及平面F-2卡合，將半導體晶圓W位置限制在規定之位置。而且，藉由汽缸740使把持構件74朝上方移動，依此在支撐基台72和把持構件74之間把持環狀框架F。 As shown in FIG. 1, the carrying-out / carrying-in mechanism 7 includes a carrying-moving means 71 arranged on the surface side of the supporting portion 413 constituting the gate-shaped supporting frame 41, and the carrying-moving means 71 in the Y-axis direction. The moving support base 72 is constituted by a connecting member 73 that connects the support base 72 and the conveyance moving means 71. The conveyance moving means 71 is constituted by a conveyor mechanism that moves the connecting member 73 that connects and supports the base 72 in the Y-axis direction. While continuing to describe with reference to FIGS. 5 and 6, a holding member 72 (see FIG. 6) is attached to the supporting base 72 constituting the carrying-out / carrying-in mechanism 7, which is arranged on the lower side to hold the cutting across. Tape T is supported while being contained The ring frame F of the semiconductor wafer W of the cassette 60 of the cassette mounting mechanism 6; the cylinder 740 for moving the holding member 74 in the vertical direction; and a pair of restriction pins 75, which are arranged The ring frame F is restricted to a predetermined position by engaging the groove F-1 and the plane F-2 provided on the ring frame F on both sides of the holding member 74. The carrying-out and carrying-in mechanism 7 configured as described above moves the support base 72 toward the cassette 60 mounted on the cassette mounting mechanism 6 and moves a pair of restriction pins 75 and The grooves F-1 and the plane F-2 supporting the ring frame F of the semiconductor wafer W accommodated in the cassette 60 are engaged to restrict the position of the semiconductor wafer W to a predetermined position. Then, the grip member 74 is moved upward by the cylinder 740, and the ring frame F is gripped between the support base 72 and the grip member 74 in accordance therewith.

再者，在構成搬出、搬入機構7之支撐基台72，安裝有：輔助把持構件76(參照圖6)，其係被配設在下側，用以把持隔著切割膠帶T而支撐後述切削完之半導體晶圓W之環狀框架F；汽缸760，其係用以使該輔助把持構件76在上下方向移動；和一對輔助限制銷77，其係被配設在輔助把持構件76之兩側且與上述環狀框架F卡合而將環狀框架F限制在規定之位置。而且，在構成搬出、搬入機構7之支撐基台72，配設有選擇性地與後述洗淨機構之噴射噴嘴卡合之卡合手段78。該卡合手段78係由以能夠進退之方式被配設在較支撐基台72之下面下方之卡合桿781，和使該卡合桿781進退之汽缸782所構成。 Further, an auxiliary holding member 76 (see FIG. 6) is attached to the supporting base 72 constituting the carrying-out and carrying-in mechanism 7. The auxiliary holding member 76 (refer to FIG. 6) is disposed on the lower side to hold the cutting tape T as described later. A ring frame F of a semiconductor wafer W; a cylinder 760 for moving the auxiliary holding member 76 in the up-and-down direction; and a pair of auxiliary limiting pins 77 provided on both sides of the auxiliary holding member 76 The ring frame F is engaged with the ring frame F to restrict the ring frame F to a predetermined position. Further, the support base 72 constituting the unloading and loading mechanism 7 is provided with an engaging means 78 that selectively engages a spray nozzle of a cleaning mechanism described later. The engaging means 78 is composed of an engaging rod 781 which is arranged below the supporting base 72 in a manner capable of advancing and retracting, and a cylinder 782 which advances and retracts the engaging rod 781.

針對上述暫時放置機構8，參照圖1、圖7及圖8進行說明。暫時放置機構8係在Y軸方向與上述卡匣載置 機構6相鄰接而被配設在上述保持台34之被加工物拆裝區域之正上方。該暫時放置機構8具備：一對支撐軌道80，其係在Y軸方向延伸，具有支撐環狀框架F之兩側部的底部81a、81b，和側部82a、82b，且被構成底部81a、81b能夠開關；和開關手段85a、85b，其係用以開關該一對支撐軌道80之底部81a、81b；和升降手段86，其係使該一對支撐軌道80在上下方向移動。另外，在構成一對支撐軌道80之側部82a、82b之上端設置有互相設置有突出於內側之凸緣部83a、83b，該凸緣部83a和83b互相藉由連結部84連結一端部。上述開關手段85a、85b係在圖示之實施型態中，由汽缸所構成，使一對支撐軌道80之底部81a、81b分別作動至圖8中以實線表示之水平位置之關閉位置和以二點鏈線表示之垂直位置的開啟位置。上述升降手段86係由被安裝於無圖示之固定構件之汽缸861所構成，該汽缸861之活塞桿862與上述一對支撐軌道80之連結部84連結。 The temporary placement mechanism 8 will be described with reference to FIGS. 1, 7 and 8. The temporary placement mechanism 8 is mounted on the cassette in the Y-axis direction. The mechanisms 6 are arranged adjacent to each other directly above the processing object dismounting area of the holding table 34. The temporary placement mechanism 8 includes a pair of support rails 80 that extend in the Y-axis direction, have bottom portions 81a and 81b that support both sides of the ring-shaped frame F, and side portions 82a and 82b, and are configured as bottom portions 81a, 81b can be turned on and off; and switching means 85a and 85b for turning on and off the bottoms 81a and 81b of the pair of support rails 80; and lifting means 86 for moving the pair of support rails 80 in the up-down direction. In addition, flange portions 83 a and 83 b protruding from the inside are provided on the upper ends of the side portions 82 a and 82 b constituting the pair of support rails 80. The flange portions 83 a and 83 b are connected to one end portion by a connecting portion 84. The above-mentioned switching means 85a and 85b are constituted by cylinders in the illustrated embodiment, and the bottoms 81a and 81b of the pair of support rails 80 are respectively moved to the closed position and the closed position indicated by the solid line in FIG. The two-point chain line indicates the open position in the vertical position. The lifting means 86 is constituted by a cylinder 861 mounted on a fixed member (not shown), and a piston rod 862 of the cylinder 861 is connected to the connecting portion 84 of the pair of support rails 80.

上述輔助暫時放置機構9係在Y軸方向與上述暫時放置機構8相鄰接且在相對於上述卡匣載置機構6為Y軸方向相反側上被配設在後述洗淨機構10之正上方。該輔助暫時放置機構9與上述暫時放置機構8相同之構成，如圖7所示般，具備：一對輔助支撐軌道90，其係在Y軸方向延伸，具有支撐環狀框架F之兩側部的底部91a、91b，和側部92a、92b，且被構成底部91a、91b能夠開關；和開關手段95a、95b，其係用以開關該一對輔助支撐軌道90之底部91a、91b；和輔助升降手段96，其係使該一對輔助支撐軌 道90在上下方向移動。而且，在構成一對輔助支撐軌道90之側部92a、92b之上端設置有互相設置有突出於內側之凸緣部93a、93b，該凸緣部93a和93b互相藉由連結部94連結一端部。上述開關手段95a、95b在圖示之實施型態中係由汽缸所構成，使一對輔助支撐導軌90之底部91a、91b分別作動至水平位置之關閉位置和垂直位置之開啟位置。上述補助升降手段96係由被安裝於無圖示之固定構件之汽缸961所構成，該汽缸961之活塞桿962與上述一對輔助支撐軌道90之連結部94連結。 The auxiliary temporary placement mechanism 9 is adjacent to the temporary placement mechanism 8 in the Y-axis direction and is disposed directly above the washing mechanism 10 described later on a side opposite to the Y-axis direction with respect to the cassette placement mechanism 6. . This auxiliary temporary placement mechanism 9 has the same configuration as the above-mentioned temporary placement mechanism 8 and, as shown in FIG. 7, includes a pair of auxiliary support rails 90 extending in the Y-axis direction and having both sides supporting the annular frame F. Bottom portions 91a, 91b, and side portions 92a, 92b, which are configured to be able to be turned on and off; and switching means 95a, 95b, which are used to turn on and off the bottom portions 91a, 91b of the pair of auxiliary support rails 90; and auxiliary Lifting means 96, which makes the pair of auxiliary support rails The road 90 moves in the vertical direction. Further, flange portions 93 a and 93 b protruding from the inside are provided on the upper ends of the side portions 92 a and 92 b constituting the pair of auxiliary support rails 90. The flange portions 93 a and 93 b are connected to one end portion by a connecting portion 94. . The above-mentioned switching means 95a and 95b are constituted by a cylinder in the illustrated implementation mode, so that the bottoms 91a and 91b of the pair of auxiliary support rails 90 are respectively moved to the closed position in the horizontal position and the open position in the vertical position. The auxiliary lifting means 96 is constituted by a cylinder 961 mounted on a fixed member (not shown), and a piston rod 962 of the cylinder 961 is connected to the connection portion 94 of the pair of auxiliary support rails 90.

接著，針對上述洗淨機構10，參照圖1及圖9進行說明。 Next, the above-mentioned washing mechanism 10 will be described with reference to FIGS. 1 and 9.

圖示之實施型態中之洗淨機構10與上述暫時放置機構8相鄰接且被配設在相對於卡匣載置機構6為Y軸方向相反側上。該洗淨機構10具備有洗淨殼罩11。該洗淨殼罩11係由前壁111和後壁112和側壁113及114和底壁(無圖示)所構成，上方被開放。在構成如此的洗淨殼罩11內配設有旋轉台12。旋轉台12係由平台本體121、被配設在該平台本體121之上面的吸附夾具122，和使平台本體121旋轉驅動之伺服馬達123所構成。平台本體121被形成外徑大於上述晶圓W之外徑，且小於隔著切割膠帶T而支撐晶圓W之環狀框架F之內徑。吸附夾具122係藉由多孔陶磁而形成，且被連接於無圖示之吸引手段，適當地使負壓作用。因此，被載置吸附夾具122上之被加工物藉由使無圖示之吸引手段作動，被吸引保持在吸附夾具122上。 The cleaning mechanism 10 in the illustrated embodiment is adjacent to the temporary placement mechanism 8 and is disposed on a side opposite to the Y-axis direction with respect to the cassette placement mechanism 6. The cleaning mechanism 10 includes a cleaning cover 11. The cleaning cover 11 is composed of a front wall 111 and a rear wall 112, side walls 113 and 114, and a bottom wall (not shown), and the upper side is opened. A rotary table 12 is disposed in the cleaning casing 11 constituting such a case. The rotary table 12 is composed of a platform body 121, an adsorption jig 122 arranged on the platform body 121, and a servo motor 123 that drives the platform body 121 to rotate. The stage body 121 is formed to have an outer diameter larger than the outer diameter of the wafer W and smaller than the inner diameter of the ring frame F that supports the wafer W with the dicing tape T interposed therebetween. The suction jig 122 is formed by a porous ceramic magnet, and is connected to a suction means (not shown) to appropriately apply a negative pressure. Therefore, the workpiece to be placed on the suction jig 122 is attracted and held on the suction jig 122 by operating a suction means (not shown).

當參照圖1及圖9持續進行說明時，在洗淨殼罩11之前壁111設置有沿著Y軸方向而形成的導引孔111a，在該導引孔111a以能夠在Y軸方向移動之方式配設有對被保持於上述旋轉台12之被加工物噴射洗淨水之噴射噴嘴13。在該噴射噴嘴13經滑輪16連結一端與錘體14連結的接線15之另一端，且被構成藉由錘體14之重力在以箭號Y1所示之方向上移動。而且，在噴射噴嘴13中，被配設在構成上述搬出、搬入機構7之支撐基台72的卡合手段78，係在以能夠進退之方式被配設在較支撐基台72之下面下方的卡合桿781進岀的狀態下，從藉由噴射噴嘴13中之錘體14之重力而移動的箭號Y1所示之方向使接觸。而且，噴射噴嘴13被連接於無圖示之洗淨水供給手段。 1 and 9, when the description is continued, the front wall 111 of the housing cover 11 is provided with a guide hole 111 a formed along the Y-axis direction, and the guide hole 111 a is movable in the Y-axis direction. A spray nozzle 13 for spraying washing water on a workpiece held on the rotary table 12 is provided. The spray nozzle 13 is connected to the other end of the wire 15 connected to the hammer body 14 via the pulley 16 at one end, and is configured to move in a direction indicated by an arrow Y1 by the gravity of the hammer body 14. Further, in the injection nozzle 13, the engaging means 78 arranged on the supporting base 72 constituting the above-mentioned carrying-out and carrying-in mechanism 7 is arranged below the supporting base 72 so as to be able to advance and retreat. In a state where the engaging lever 781 is pushed in, the contact is made from a direction indicated by an arrow Y1 which is moved by the gravity of the hammer body 14 in the spray nozzle 13. The spray nozzle 13 is connected to a washing water supply means (not shown).

圖示之實施型態中之切削裝置被構成上述般，以下針對其作用進行說明。 The cutting device in the illustrated embodiment is configured as described above, and its action will be described below.

首先，如圖10所示般，使暫時放置機構8之汽缸861作動而將一對支撐軌道80定位在上部位置，同時將配設有搬出、搬入機構7之把持構件74(參照圖6)及一對限制銷75(參照圖5及圖6)的支撐基台72定位在圖示之待機位置上。 First, as shown in FIG. 10, the cylinder 861 of the temporary placement mechanism 8 is operated to position a pair of support rails 80 at the upper position, and at the same time, a holding member 74 (refer to FIG. 6) provided with the carrying-out and carrying-in mechanism 7 The support base 72 of the pair of restriction pins 75 (see FIGS. 5 and 6) is positioned at the standby position shown in the figure.

接著，使搬出、搬入機構7之搬運移動手段71(參照圖1及圖5)作動，如圖11所示般，使配設有把持構件74及一對限制銷75之支撐基台72移動至卡匣載置機構6側，且使一對限制銷75(參照圖5及圖6)與被設置在隔著切割膠帶T而支撐被收容在卡匣60之半導體晶圓W之環狀 框架F的溝槽F-1及平面F-2(參照圖1)卡合，依此將半導體晶圓W位置限制在規定位置上。而且，藉由使汽缸740作動，將環狀框架F把持在支撐基台72和把持構件74(參照圖6)之間。 Next, the conveyance and movement means 71 (refer to FIGS. 1 and 5) of the unloading and loading mechanism 7 is operated, and as shown in FIG. 11, the support base 72 provided with the holding member 74 and the pair of restriction pins 75 is moved to On the cassette mounting mechanism 6 side, a pair of restriction pins 75 (see FIGS. 5 and 6) and a ring provided to support the semiconductor wafer W accommodated in the cassette 60 with a dicing tape T interposed therebetween are provided. The groove F-1 of the frame F and the plane F-2 (see FIG. 1) are engaged with each other, thereby restricting the position of the semiconductor wafer W to a predetermined position. Then, by activating the cylinder 740, the ring frame F is held between the support base 72 and the holding member 74 (see FIG. 6).

若藉由支撐基台72和把持構件74把持環狀框架F時，使搬出、搬入機構7之搬運移動手段71作動而將支撐基台72移動至與卡匣載置機構6相反側，且如圖12所示般，將環狀框架F搬運至暫時放置機構8之一對支撐軌道80，進行暫時放置。 If the ring frame F is held by the support base 72 and the holding member 74, the support moving mechanism 71 of the carry-out and carry-in mechanism 7 is operated to move the support base 72 to the side opposite to the cassette mounting mechanism 6, and if As shown in FIG. 12, the ring-shaped frame F is transported to a pair of support rails 80 of the temporary placement mechanism 8 for temporary placement.

若將環狀框架F搬運至暫時放置機構8之一對支撐軌道80時，如圖13所示般，使汽缸861作動而使一對支撐軌道80下降，定位在下部位置上。其結果，被安裝於環狀框架F，且黏貼半導體晶圓W之切割膠帶T被載置在保持台機構3中被定位在被加工物拆裝位置上的保持台34之上面。而且，使上述開關手段85a、85b(參照圖6及圖8)作動而將一對支撐軌道80之底部81a、81b在圖8中從以實線表示之關閉位置定位在以二點鏈線表示之開啟位置。 When the ring frame F is transported to one pair of support rails 80 of the temporary placement mechanism 8, as shown in FIG. 13, the cylinder 861 is actuated to lower the pair of support rails 80 and positioned at a lower position. As a result, the dicing tape T attached to the ring frame F and the semiconductor wafer W adhered thereto is placed on the holding table 34 in the holding table mechanism 3 and positioned at the workpiece removal position. Then, the above-mentioned switching means 85a and 85b (refer to FIGS. 6 and 8) are actuated to position the bottom portions 81a and 81b of the pair of support rails 80 from the closed positions indicated by solid lines in FIG. 8 to the two-dot chain lines. Open position.

接著，藉由使無圖示之吸引手段作動，如圖14所示般，在保持台34之上面隔著切割膠帶T而吸引保持半導體晶圓W。而且，使暫時放置機構8之汽缸851作動而使一對支撐軌道80上升而定位在上部位置。 Next, as shown in FIG. 14, a suction means (not shown) is operated, and the semiconductor wafer W is sucked and held by the dicing tape T on the holding table 34. Then, the cylinder 851 of the temporary placement mechanism 8 is actuated to raise the pair of support rails 80 to be positioned at an upper position.

如圖14所示般，一面隔著切割膠帶T而在保持台34之上面吸引保持半導體晶圓W，一面使構成保持台機構3之加工進給手段35作動而將吸引保持半導體晶圓W之 保持台34如圖15所示般移動至配設有切削機構4之加工區域。而且，藉由第一切削手段5a和第二切削手段5b對被保持台34保持之半導體晶圓W施予規定之切削加工。另外，保持台34因如上述般被形成其外徑大於半導體晶圓W之外徑且小於環狀框架F之內徑，故環狀框架F藉由自重些許下垂，在切削加工中，不干擾第一切削手段5a和第二切削手段5b之切削刀533，不需要框架推壓機構，降低成本。 As shown in FIG. 14, while holding the semiconductor wafer W on the holding table 34 via the dicing tape T, the processing feed means 35 constituting the holding table mechanism 3 is operated to attract and hold the semiconductor wafer W. As shown in FIG. 15, the holding table 34 moves to a processing area where the cutting mechanism 4 is arranged. The semiconductor wafer W held by the holding table 34 is subjected to a predetermined cutting process by the first cutting means 5a and the second cutting means 5b. In addition, since the holding table 34 is formed as described above, its outer diameter is larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the annular frame F. Therefore, the annular frame F sags slightly by its own weight, and does not interfere with the cutting process. The cutting blade 533 of the first cutting means 5a and the second cutting means 5b does not require a frame pressing mechanism, thereby reducing costs.

如上述般，若對被保持於保持台34之半導體晶圓W施予規定之切削加工時，使加工進給手段35作動而將吸引保持切削完之半導體晶圓W之保持台34定位在圖16所示之被加工物拆裝位置。在該狀態下，被保持於保持台34之切削完的半導體晶圓W被定位在暫時放置機構8之正下方。 As described above, when a predetermined cutting process is performed on the semiconductor wafer W held on the holding table 34, the processing feed means 35 is operated to position the holding table 34 that attracts and holds the semiconductor wafer W that has been cut. Removal position of the workpiece shown in FIG. In this state, the cut semiconductor wafer W held on the holding table 34 is positioned directly below the temporary placement mechanism 8.

若將被保持在保持台34之切削完之半導體晶圓W定位在暫時放置機構8之正下方時，在將暫時放置機構8之一對支撐軌道80之底部81a、81b定位在開啟位置之狀態下，使汽缸861作動，如圖17所示般，使一對支撐軌道80下降而定位在下部位置上。而且，將一對支撐軌道80之底部81a、81b定位在關閉位置而支撐環狀框架F，並且解除藉由保持台34進行的半導體晶圓W之吸引保持。 When the cut semiconductor wafer W held on the holding table 34 is positioned directly below the temporary placement mechanism 8, the bottom portions 81a and 81b of one pair of support rails 80 of the temporary placement mechanism 8 are positioned in the open position. Then, the cylinder 861 is actuated, and as shown in FIG. 17, the pair of support rails 80 are lowered and positioned at a lower position. Then, the bottom portions 81 a and 81 b of the pair of support rails 80 are positioned in the closed position to support the ring frame F, and the suction and holding of the semiconductor wafer W by the holding stage 34 is released.

接著，使暫時放置機構8之汽缸861作動而使支撐環狀框架F之一對支撐軌道80上升，且如圖18所示般，在較上部位置些許下方，搬出、搬入機構7之把持構件74及一對限制銷75將一對支撐軌道80定位在可以在被支 撐於一對支撐軌道80之切削完半導體晶圓W之上方移動之中間位置。 Next, the cylinder 861 of the temporary placement mechanism 8 is actuated to raise one of the support rails 80 to the support rail 80, and as shown in FIG. 18, the holding member 74 of the mechanism 7 is carried out and carried in a little below the upper position as shown in FIG. And a pair of restriction pins 75 positioning a pair of support rails 80 An intermediate position supported by the pair of support rails 80 above the cut semiconductor wafer W is moved.

而且，使搬出、搬入機構7之搬運移動手段71作動，如圖19所示般，將支撐基台72移動至卡匣載置機構6側，且使一對限制銷75(參照圖5及圖6)與被設置在隔著切割膠帶T而支撐被收容在卡匣60之半導體晶圓W之環狀框架F的溝槽F-1及平面F-2(參照圖1)卡合，依此將半導體晶圓W位置限制在規定位置上。而且，藉由使汽缸740作動，將支撐新的半導體晶圓W之環狀框架F把持在支撐基台72和把持構件74(參照圖6)之間。此時，把持構件74和一對限制銷75係在切削完半導體晶圓W之上方移動。 Then, as shown in FIG. 19, the conveying and moving means 71 of the unloading and loading mechanism 7 is operated, and the support base 72 is moved to the cassette mounting mechanism 6 side, and a pair of restriction pins 75 (see FIG. 5 and FIG. 6) Engage with the groove F-1 and the plane F-2 (see FIG. 1) provided on the ring frame F supporting the semiconductor wafer W accommodated in the cassette 60 with the dicing tape T interposed therebetween, and so on The position of the semiconductor wafer W is restricted to a predetermined position. The cylinder 740 is actuated, and the ring frame F supporting the new semiconductor wafer W is held between the support base 72 and the holding member 74 (see FIG. 6). At this time, the holding member 74 and the pair of restriction pins 75 are moved above the semiconductor wafer W after cutting.

接著，使暫時放置機構8之汽缸851作動而將支撐切削完半導體晶圓W之一對支撐軌道80定位在上部位置，並且將支撐切削完半導體晶圓W之環狀框架F中之卡匣載置機構6側之端面定位在與一對輔助限制銷77相向之位置上。之後，使搬出、搬入機構7之搬運移動手段71作動，如圖20所示般，藉由使支撐基台72移動至與卡匣載置機構6相反側，將支撐藉由支撐基台72和把持構件74所把持之新的半導體晶圓W之環狀框架F搬運至暫時放置機構8之一對支撐軌道80，同時將支撐與一對輔助限制銷77抵接的切削完半導體晶圓W之環狀框架F搬運至輔助暫時放置機構9之一對輔助支撐軌道90。 Next, the cylinder 851 of the temporary placement mechanism 8 is actuated to position one pair of support rails 80 supporting the cut semiconductor wafer W at an upper position, and a cassette in the ring frame F supporting the cut semiconductor wafer W is loaded. The end surface on the setting mechanism 6 side is positioned at a position facing the pair of auxiliary restricting pins 77. Thereafter, as shown in FIG. 20, the conveying and moving means 71 of the unloading and loading mechanism 7 is operated, and as shown in FIG. 20, the support base 72 is moved to the side opposite to the cassette mounting mechanism 6, and the support is supported by the support base 72 and The ring-shaped frame F of the new semiconductor wafer W held by the holding member 74 is transferred to one pair of support rails 80 of the temporary placement mechanism 8 and simultaneously supports the cut semiconductor wafer W which abuts against the pair of auxiliary limiting pins 77. The ring frame F is carried to one pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9.

若將支撐切削完半導體晶圓W之環狀框架F搬運至輔助暫時放置機構9之一對輔助支撐軌道90時，如圖 21所示般，使汽缸961作動而使一對輔助支撐軌道90下降，定位在下部位置上。在該狀態下，被安裝於環狀框架F，且黏貼有半導體晶圓W之切割膠帶T與洗淨機構10之旋轉台12之上面接觸。而且，藉由使一對輔助支撐軌道90之底部91a、91b從關閉位置定位在開啟位置，將切削完之半導體晶圓W隔著切割膠帶T而載置在旋轉台12之上面。而且，藉由使無圖示之吸引手段作動，在旋轉台12之上面隔著切割膠帶T而吸引保持切削完之半導體晶圓W。 If the ring frame F supporting the cut semiconductor wafer W is transported to a pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9, as shown in FIG. As shown at 21, the cylinder 961 is actuated to lower the pair of auxiliary support rails 90 and positioned at a lower position. In this state, the dicing tape T attached to the ring frame F and the semiconductor wafer W adhered thereto is in contact with the upper surface of the rotary table 12 of the cleaning mechanism 10. Then, by positioning the bottoms 91a and 91b of the pair of auxiliary support rails 90 from the closed position to the open position, the cut semiconductor wafer W is placed on the turntable 12 with the dicing tape T interposed therebetween. Then, a suction means (not shown) is operated to suck and hold the cut semiconductor wafer W on the upper surface of the turntable 12 via a dicing tape T.

接著，將暫時放置機構8之一對支撐軌道80和輔助暫時放置機構9之一對輔助支撐軌道90如圖22(a)所示般定位在上部位置，且使旋轉台12旋轉，同時如圖22(b)所示般，藉由使無圖示之洗淨水供給手段作動，從噴射噴嘴13噴射洗淨水130。此時，定位在被配設在搬出、搬入機構7之支撐基台72的卡合手段78之卡合桿781進岀而與噴射噴嘴13卡合的位置上，使搬運移動手段71作動而使卡合桿781在Y軸方向往返移動。因此，與被連結於噴射噴嘴13之接線15之一端連結的錘體14之重力協同作用而使噴射噴嘴13在Y軸方向往返移動。另外，噴射噴嘴13之往返移動範圍至少從切削完之半導體晶圓W之外周至中心的範圍即可。其結果，隔著切割膠帶T被吸引保持在旋轉台12之切削完之半導體晶圓W被旋轉洗淨。另外，在朝向上述噴射噴嘴13之Y軸方向的往返移動中，因搬出、搬入機構7成為驅動源，故能夠小型化，同時可以謀求降低成本。再者，旋轉台12因如上述般被形成其外徑大於半導體 晶圓W之外徑，且小於環狀框架F之內徑，故環狀框架F藉由自重些許下垂，被供給至半導體晶圓W之洗淨水滑順地被排岀，同時不需要框架推壓機構，降低成本。 Next, one pair of support rails 80 of the temporary placement mechanism 8 and one pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9 are positioned in the upper position as shown in FIG. 22 (a), and the rotary table 12 is rotated, as shown in FIG. As shown in 22 (b), the washing water 130 is sprayed from the spray nozzle 13 by activating a washing water supply means (not shown). At this time, it is positioned at a position where the engaging lever 781 of the engaging means 78 of the supporting base 72 of the carrying-out and carrying-in mechanism 7 enters and engages with the injection nozzle 13, and the carrying and moving means 71 is operated to cause The engaging lever 781 moves back and forth in the Y-axis direction. Therefore, the gravity of the hammer body 14 connected to one end of the wiring 15 connected to the injection nozzle 13 cooperates with the gravity to move the injection nozzle 13 back and forth in the Y-axis direction. The reciprocating movement range of the spray nozzle 13 may be at least the range from the outer periphery to the center of the semiconductor wafer W after cutting. As a result, the cut semiconductor wafer W that is sucked and held on the turntable 12 via the dicing tape T is rotated and cleaned. In addition, during the reciprocating movement in the Y-axis direction of the spray nozzle 13, since the unloading and loading mechanism 7 is a driving source, the size can be reduced and the cost can be reduced. In addition, since the turntable 12 is formed as described above, its outer diameter is larger than that of the semiconductor. The outer diameter of the wafer W is smaller than the inner diameter of the ring frame F. Therefore, the ring frame F sags by its own weight, and the washing water supplied to the semiconductor wafer W is smoothly discharged without a frame. Push the mechanism to reduce costs.

如上述般，若洗淨切削完之半導體晶圓W時，如圖23所示般，將搬出、搬入機構7定位在上述待機位置，同時在將構成輔助暫時放置機構9之一對輔助支撐軌道90之底部91a、91b定位在開啟位置之狀態下定位於下部位置，使底部91a、91b成為關閉位置而支撐用以支撐洗淨完之半導體晶圓W的環狀框架F。而且，解除藉由旋轉台12所進行的半導體晶圓W之吸引保持。 As described above, when the cut semiconductor wafer W is cleaned, as shown in FIG. 23, the unloading and loading mechanism 7 is positioned at the standby position, and at the same time, a pair of auxiliary support rails constituting one of the auxiliary temporary placement mechanisms 9 is positioned. The bottom portions 91a and 91b of the 90 are positioned in the lower position in the state of being opened, so that the bottom portions 91a and 91b become the closed position and support the annular frame F for supporting the cleaned semiconductor wafer W. Then, the suction and holding of the semiconductor wafer W by the turntable 12 is released.

接著，如圖24所示般，將支撐洗淨完之半導體晶圓W之環狀框架F的輔助暫時放置機構9之一對輔助支撐軌道90定位在上部位置上。而且，使被配設在搬出、搬入機構7之支撐基台72的輔助把持構件76作動而把持環狀框架F。 Next, as shown in FIG. 24, a pair of auxiliary supporting rails 90 is positioned at an upper position of one of the auxiliary temporary placing mechanisms 9 supporting the ring-shaped frame F of the cleaned semiconductor wafer W. Then, the auxiliary holding member 76 disposed on the support base 72 of the carrying-in / out mechanism 7 is operated to grip the ring frame F.

而且，使搬出、搬入機構7之搬運移動手段71作動，如圖25所示般，使支撐洗淨完之半導體晶圓W之環狀框架F從輔助暫時放置機構9之一對輔助支撐軌道90移動至暫時放置機構8之一對支撐軌道80。 Then, as shown in FIG. 25, the conveying and moving means 71 of the unloading and loading mechanism 7 is operated, and the ring frame F supporting the cleaned semiconductor wafer W is moved from one of the auxiliary temporary placement mechanisms 9 to the auxiliary supporting rail 90. Move to one pair of support rails 80 of the temporary placement mechanism 8.

接著，如圖26所示般，將暫時放置機構8之一對支撐軌道80定位在中間位置，同時將被配設在搬出、搬入機構7之支撐基台72的把持構件74及一對限制銷75定位在待機位置。 Next, as shown in FIG. 26, one pair of support rails 80 of the temporary placement mechanism 8 is positioned at an intermediate position, and at the same time, a holding member 74 and a pair of restriction pins arranged on the support base 72 of the carry-out and carry-in mechanism 7 75 is positioned in the standby position.

而且，使搬出、搬入機構7之搬運移動手段71 作動，如圖27所示般，使支撐基台72移動至卡匣載置機構6側而將把持構件74及一對限制銷75從待機位置移動至被載置在卡匣載置機構6之卡匣60，依此將支撐洗淨完之半導體晶圓W的環狀框架F收容在卡匣60。 Furthermore, the conveying and moving means 71 of the unloading and loading mechanism 7 As shown in FIG. 27, the support base 72 is moved to the cassette mounting mechanism 6 side, and the holding member 74 and the pair of restricting pins 75 are moved from the standby position to the cassette mounting mechanism 6 as shown in FIG. 27. The cassette 60 stores the ring frame F supporting the cleaned semiconductor wafer W in the cassette 60 accordingly.

另外，如上述般，與對洗淨完之半導體晶圓W進行洗淨，同時實施收容至卡匣60之作業之時，從卡匣60被搬出至暫時放置機構8之一對支撐軌道80之新的半導體晶圓W，如上述般被搬運至構成保持台機構3之保持台34且被吸引保持。而且，被吸引保持在保持台34之新的半導體晶圓W藉由加工進給手段35被移動至配設有切削機構4之加工區域，且藉由第一切削手段5a和第二切削手段5b被施予規定之切削加工。 In addition, as described above, when the cleaned semiconductor wafer W is cleaned and the operation of accommodating it into the cassette 60 is performed at the same time, the cassette 60 is carried out from the pair of support rails 80 of the temporary placement mechanism 8 The new semiconductor wafer W is transferred to the holding table 34 constituting the holding table mechanism 3 as described above, and is sucked and held. Further, the new semiconductor wafer W attracted and held on the holding table 34 is moved to the processing area provided with the cutting mechanism 4 by the processing feed means 35, and the first cutting means 5a and the second cutting means 5b are moved. The prescribed cutting process is applied.

如上述般，圖示之實施型態中之切削裝置係於保持被加工物之保持台34被定位在被加工物拆裝區域之時，藉由搬出、搬入機構7搬出隔著切割膠帶T支撐被收容在卡匣60之半導體晶圓W之環狀框架F而暫時放置在構成暫時放置機構8之一對支撐軌道80，且藉由升降手段86使一對支撐軌道80下降而將隔著切割膠帶T被支撐於環狀框架F之半導體晶圓W載置於保持台34，且藉由開關手段85a、85b開啟底部81a、81b，依此由於隔著切割膠帶T將半導體晶圓W保持在保持台34，故搬運隔著切割膠帶T支撐作為被加工物之半導體晶圓W的環狀框架F的搬運手段實質上僅有搬出、搬入機構7，所以零件數量減少而降低成本，同時可以謀求裝置之小型化。再者，因搬出、搬入機構 7具有也在被配設在洗淨機構10之旋轉台12之正上方的輔助暫時放置機構9搬運隔著切割膠帶T支撐切削完之半導體晶圓W之環狀框架F之功能，故可以更謀求裝置之小型化。 As described above, in the illustrated embodiment, the cutting device is supported by the cutting-out tape T when the holding table 34 holding the workpiece is positioned in the workpiece disassembly area by the carrying-out and carrying-in mechanism 7. The ring-shaped frame F of the semiconductor wafer W accommodated in the cassette 60 is temporarily placed on a pair of support rails 80 constituting a temporary placement mechanism 8, and the pair of support rails 80 is lowered by lifting means 86 to be cut across. The adhesive tape T is supported by the semiconductor wafer W supported by the ring frame F on the holding table 34, and the bottoms 81a and 81b are opened by the switching means 85a and 85b. As a result, the semiconductor wafer W is held by the dicing tape T The holding table 34 can transport only the ring-shaped frame F that supports the semiconductor wafer W as a workpiece through the dicing tape T. The carrier means can basically only carry out and carry in the mechanism 7. Therefore, the number of parts can be reduced, and the cost can be reduced. Miniaturization of the device. Furthermore, due to moving out, 7 has a function of an auxiliary temporary placement mechanism that is disposed directly above the rotary table 12 of the cleaning mechanism 10, and has a function of conveying the ring frame F that supports the semiconductor wafer W that has been cut through the dicing tape T. Strive for miniaturization of the device.

Claims (6)

一種切削裝置，具備：載置收容有複數之被加工物的卡匣之卡匣載置機構，和從被載置在該卡匣載置機構之卡匣搬岀及搬入被加工物之搬岀、搬入機構，和暫時放置藉由該搬岀、搬入機構被搬岀之被加工物的暫時放置機構，和保持被暫時放置在該暫時放置機構之被加工物的保持台，和切削被保持在該保持台之被加工物的切削機構，和使該保持台在加工進給方向(X軸方向)進行加工進給的加工進給機構，該切削裝置之特徵在於：該加工進給機構具備：X軸導軌，其係用以支撐成使該保持台在配設有該暫時放置機構之被加工物拆裝區域，和配設有該切削機構之加工區域之間於加工進給方向(X軸方向)能夠移動；和加工進給手段，其係沿著該X軸導軌而使該保持台移動，該暫時放置機構和該卡匣載置機構係在與X軸方向正交之Y軸方向相鄰接而被配設，該搬岀、搬入機構具備支撐基台；被配設在該支撐基台，把持被收容在卡匣之被加工物的把持構件；將被加工物限制在規定之位置的一對限制銷；及使該支撐基台在Y軸方向移動之搬運移動手段，該暫時放置機構具備：在Y軸方向延伸並具有支撐被加工物之兩側部的底部和側部，且該底部被構成能夠開關之一對支撐軌道；和開關該一對支撐軌道之該底部的開關手段；和使該一對支撐軌道在上下方向移動之升降手段， 於該保持台被定位在該被加工物拆裝區域之時，藉由該搬岀、搬入機構，搬岀被收容在卡匣之被加工物而暫時放置在構成該暫時放置機構之該一對支撐軌道，並藉由該升降手段使該一對支撐軌道下降而將被加工物載置在該保持台，且藉由該開關手段開啟該底部，將被加工物保持在該保持台。 A cutting device includes a cassette mounting mechanism for mounting a cassette containing a plurality of processed objects, and a cassette loading mechanism for loading and unloading a cassette loaded into the cassette mounting mechanism. , A carry-in mechanism, a temporary placement mechanism for temporarily placing a workpiece to be carried by the carry-in and carry-in mechanism, and a holding table for holding a workpiece to be temporarily placed in the temporary placement mechanism, and cutting is held at The cutting mechanism of the workpiece on the holding table, and the processing feeding mechanism that causes the holding table to perform processing feed in the processing feed direction (X-axis direction). The cutting device is characterized in that the processing feed mechanism includes: The X-axis guide is used to support the holding table between the processing object disassembly area equipped with the temporary placement mechanism and the processing area equipped with the cutting mechanism in the processing feed direction (X-axis (Direction) can be moved; and a processing feed means that moves the holding table along the X-axis guide, and the temporary placement mechanism and the cassette placement mechanism are in a Y-axis direction orthogonal to the X-axis direction. It is arranged next to each other. The input mechanism includes a supporting base; a holding member arranged on the supporting base to hold the workpiece to be stored in the cassette; a pair of restriction pins that restrict the workpiece to a predetermined position; and the supporting base The temporary moving mechanism includes a bottom portion and a side portion that extend in the Y-axis direction and support both sides of the workpiece, and the bottom portion is configured as a pair of support rails that can be opened and closed. ; And opening and closing means for opening and closing the bottom of the pair of support rails; and lifting means for moving the pair of support rails in the up and down direction, When the holding table is positioned in the processing object dismounting area, the processing object stored in the cassette is moved by the moving and loading mechanism and temporarily placed on the pair constituting the temporary placing mechanism. Support the rail, and lower the pair of support rails by the lifting means to place the workpiece on the holding table, and open the bottom portion by the switching means to hold the workpiece on the holding table. 如請求項1所記載之切削裝置，其中以與該暫時放置機構相鄰接之方式，在相對於該卡匣載置機構為Y軸方向相反側配設具備用以洗淨被加工物之旋轉台的洗淨機構，同時配設有被構成在該洗淨機構之正上方與該暫時放置機構連通，且暫時放置被加工物之輔助暫時放置機構，該輔助暫時放置機構具備：在Y軸方向延伸並具有支撐被加工物之兩側部的底部和側部，且該底部被構成能夠開關之一對輔助支撐軌道；和開關該一對輔助支撐軌道之該底部的開關手段；和使該一對輔助支撐軌道在上下方向移動之輔助升降手段。 The cutting device according to claim 1, wherein the cutting device is provided with a rotation for cleaning the workpiece on a side opposite to the Y-axis direction with respect to the cassette placing mechanism so as to be adjacent to the temporary placing mechanism. The washing mechanism of the table is also provided with an auxiliary temporary placement mechanism which is formed directly above the cleaning mechanism and communicates with the temporary placement mechanism and temporarily places the processed object. The auxiliary temporary placement mechanism is provided in the Y-axis direction. Extending and having a bottom and a side supporting both sides of the workpiece, and the bottom is configured to be capable of opening and closing a pair of auxiliary support rails; and a switching means for opening and closing the bottom of the pair of auxiliary support rails; and Auxiliary lifting means for the auxiliary supporting track to move in the up and down direction. 如請求項2所記載之切削裝置，其中該搬岀、搬入機構具備：被配設在該支撐基台且把持在被支撐於該一對輔助支撐軌道之被加工物中，與藉由該把持構件被把持之區域相反側之區域的輔助把持構件，和將被支撐於該一對輔助支撐軌道之被加工物限制在規定之位置的一對輔助限制銷，於保持切削完之被加工物之該保持台被定位在該被加 工物拆裝區域之時，在構成該暫時放置機構之該一對支撐軌道之該底部呈開啟之狀態下，使該一對支撐軌道下降而將該底部定位在切削完之被加工物之下部之後，在使該底部關閉而支撐切削完之被加工物之狀態下，使該一對支撐軌道上升，接著，藉由該搬岀、搬入機構之該把持構件把持被收容在卡匣之被加工物，同時將被設置在該支撐基台之該一對輔助限制銷定位在切削完之該被加工物中，與藉由該把持構件被把持之區域相反側之區域的端面，且藉由使該支撐基台移動至該輔助暫時放置機構側，將被收容在卡匣之被加工物定位在該暫時放置機構，同時將切削完之被加工物定位在該輔助暫時放置機構，藉由構成該輔助暫時放置機構之該輔助升降手段暫時放置在該一對輔助支撐軌道，並藉由該升降手段使該一對輔助支撐軌道下降而將被加工物載置在該洗淨機構之該旋轉台，且藉由該開關手段開啟該底部使切削完之被加工物保持在該旋轉台。 The cutting device according to claim 2, wherein the loading and unloading mechanism is provided with the supporting base and is held in a workpiece to be supported by the pair of auxiliary supporting rails, and the holding The auxiliary holding member in the area opposite to the area where the member is held, and the pair of auxiliary restricting pins that limit the workpieces supported by the pair of auxiliary support rails to a predetermined position, hold the workpieces that have been cut. The holding table is positioned at the When the work object is disassembled, the bottom of the pair of support rails is lowered to position the bottom of the processed object after the bottom of the pair of support rails constituting the temporary placement mechanism is opened. After that, the pair of supporting rails is raised in a state where the bottom is closed to support the machined workpiece, and then the processing member stored in the cassette is held by the holding member of the moving and loading mechanism to be processed. At the same time, the pair of auxiliary limiting pins provided on the supporting abutment are positioned on the end face of the area opposite to the area being held by the holding member, and The support abutment moves to the auxiliary temporary placement mechanism side, positions the processed object stored in the cassette in the temporary placing mechanism, and simultaneously positions the cut workpiece in the auxiliary temporary placing mechanism, by constituting the The auxiliary lifting means of the auxiliary temporary placing mechanism is temporarily placed on the pair of auxiliary supporting rails, and the pair of auxiliary supporting rails is lowered by the lifting means to place the workpiece on the pair of auxiliary supporting rails. The turntable mechanism of the net, and the switching means is turned on by the cutting of the bottom of the finished workpiece held in the turntable. 如請求項2或3所記載之切削裝置，其中該洗淨機構具備被配設在該旋轉台之上方的噴射洗淨水之噴射噴嘴，該噴射噴嘴藉由被配設在構成該搬岀、搬入機構之該支撐基台且選擇性地進行卡合的卡合手段，隨著該支撐基台之移動，在Y軸方向移動，至少對從被加工物之外周至中心的區域噴射洗淨水。 The cutting device according to claim 2 or 3, wherein the cleaning mechanism is provided with a spray nozzle for spraying washing water, which is disposed above the rotary table, and the spray nozzle is disposed in a configuration which constitutes the moving, The engaging means for carrying in the supporting base of the mechanism and selectively engaging, moves with the supporting base in the Y-axis direction, and sprays at least the area from the periphery to the center of the workpiece . 如請求項4所記載之切削裝置，其中 在該洗淨機構之該噴射噴嘴經滑輪連結一端與錘體連結的接線之另一端，且被構成藉由該錘體之重力在Y軸方向移動，該卡合手段具備以能夠進退之方式被配設在該支撐基台的卡合桿，在該卡合桿進出之狀態下，從該噴射噴嘴中藉由錘體之重力而移動的方向使接觸。 The cutting device according to claim 4, wherein The spray nozzle of the cleaning mechanism is connected to the other end of the wire connected to the hammer body via a pulley, and is configured to move in the Y-axis direction by the weight of the hammer body. The engaging rod arranged on the supporting base is brought into contact with the direction in which the gravity of the hammer body moves from the spray nozzle when the engaging rod is in and out. 如請求項1所記載之切削裝置，其中該切削機構具備；以能夠旋轉之方式具備第一切削刀之第一切削手段，和以能夠旋轉之方式具備被配設成與該第一切削手段之第一切削刀相向之第二切削刀的第二切削手段，以能夠在與X軸方向正交之Y軸方向移動之方式支撐該第一切削手段和該第二切削手段之Y軸導軌；和沿著該Y軸導軌使該第一切削手段移動之第一分度進給手段，及沿著該Y軸導軌使該第二切削手段移動的第二分度進給手段。 The cutting device according to claim 1, wherein the cutting mechanism is provided with: a first cutting means provided with a first cutter rotatably; and a first cutting means provided with the first cutting means rotatably. A second cutting means of a second cutting blade opposite to the first cutting blade, supporting the Y-axis guide of the first cutting means and the second cutting means in a manner capable of moving in a Y-axis direction orthogonal to the X-axis direction; and A first indexing feeding means for moving the first cutting means along the Y-axis guide, and a second indexing feeding means for moving the second cutting means along the Y-axis guide.
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