TWI699265B - Cutting device - Google Patents

Abstract

Provides a simple and compact structure of the entire device, while A cutting device that can reduce the number of parts and reduce manufacturing costs.

It is a kind of cutting device, with: The cassette placement mechanism for the cassettes of several workpieces, and the cassette loading mechanism that is placed in the cassette placement mechanism, and the transporting mechanism for the workpiece to be processed, and the temporary placement by transport , The temporary placement mechanism of the workpiece being moved in the loading mechanism, and the holding table that holds the workpiece temporarily placed in the temporary placement mechanism, and the processing feed mechanism that moves the holding table in the processing feed direction, and The first and second cutting means for cutting the workpiece held on the holding table, and the indexing feed means that move the first and second cutting means in the indexing feed direction, respectively, The first cutting means and the second cutting means are provided with an indexing moving base, and cutting tools respectively arranged on the indexing moving base and arranged on the same axis. The indexing movement of the first cutting means The indexing moving base of the base and the second cutting means is supported so as to be movable on the Y-axis guide rail arranged along the Y-axis direction, and the indexing and feeding means are jointly arranged by the Y-axis guide rail. The Y-axis linear rail, and the first Y-axis coil movable member inserted in the Y-axis linear rail in a movable manner and installed on the indexing movable base of the first cutting means, and in a movable manner The Y-axis two-coil movable element is inserted into the Y-axis linear rail and installed on the indexing moving base of the second cutting means.

Description

Cutting device

The present invention relates to a cutting device for cutting a workpiece such as a semiconductor wafer.

In the semiconductor device manufacturing process, a plurality of regions are divided by predetermined dividing lines arranged in a grid on the surface of a semiconductor wafer having a substantially circular plate shape, and devices such as ICs, LSIs, etc. are formed in the divided regions. Then, each semiconductor device is manufactured by cutting the semiconductor wafer along the planned dividing line to divide the area where the device is formed.

A cutting device that cuts processed objects such as semiconductor wafers along the planned dividing line includes: a cassette mounting means for placing a cassette accommodating a plurality of processed objects, and a cutting device that is mounted on the cassette The means of carrying cassettes and the means of carrying in the object to be processed, and the means of temporarily placing the object to be processed by the means of carrying and carrying in, and the means of keeping the object temporarily placed in the temporary The holding table for the workpiece to be held by the means, and the first cutting means and the second cutting means for cutting the workpiece held on the holding table, and the holding table for machining in the machining feed direction The processing feed means, and the first cutting means and the second cutting The first indexing feed means and the second indexing feed means that perform indexing in the indexing feed direction orthogonal to the processing feed direction can efficiently cut the semiconductor crystal along the planned dividing line The to-be-processed object, such as a circle, is cut|disconnected and divided into each apparatus (for example, refer patent document 1).

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 11-26402

However, in the above-mentioned cutting device, in particular, the first indexing feed means and the second indexing feed means for making the first cutting means and the second cutting means perform processing and feeding in the machining feed direction are due to the use of balls The screw mechanism is constituted, so the number of parts increases, the manufacturing cost increases, and the overall structure of the device is complicated and large-scale.

The present invention was created in view of the above situation, and its main technical subject is to provide a first indexing feed means and a second indexing feed means for processing the first cutting means and the second cutting means in the machining feed direction. The structure of the high-speed feeding means is simplified to become a cutting device that is miniaturized, while reducing the number of parts and reducing the manufacturing cost.

In order to solve the above-mentioned main technical problems, if the present invention At the time, a cutting device is provided, which is provided with: a cassette loading mechanism for loading cassettes containing plural workpieces, and carrying in and from the cassettes placed on the cassette loading mechanism. The moving and moving mechanism, and the temporary placement mechanism for temporarily placing the processed object that is moved by the moving and moving mechanism, and the holding table that holds the processed object temporarily placed in the temporary placement mechanism, and The machining feed mechanism in which the holding table moves in the machining feed direction (X-axis direction), and the first cutting means and the second cutting means that apply cutting to the workpiece held on the holding table, and make the The first cutting means and the second cutting means respectively move in the indexing feed direction (Y-axis direction) orthogonal to the X-axis direction. The cutting device is characterized in that: the first cutting means and the first cutting means The two cutting means respectively include: an indexing moving base, and cutting tools respectively arranged on the divided moving base and mutually arranged on the same axis, the indexing moving base of the first cutting means and the The indexing moving base of the second cutting means is supported so as to be movable on the Y-axis guide rail arranged along the Y-axis direction, and the indexing feed means is shared by the Y-axis guide rail arranged along the Y-axis direction. The Y-axis linear rail, and the first Y-axis coil movable member inserted in the Y-axis linear rail in a movable manner and mounted on the index moving base of the first cutting means, and in a movable manner The second Y-axis coil movable element is inserted into the Y-axis linear rail and is installed on the indexing moving base of the second cutting means.

The above-mentioned processing and feeding mechanism consists of the disassembly and assembly area of the workpiece equipped with a temporary placement mechanism, and the first cutting means and the second Between the processing areas of the cutting means, the X-axis guide rail provided with the movable base of the holding table is supported in a movable manner; and the X-axis linear rail is arranged along the X-axis guide rail, and in a movable manner The X-axis coil movable element is inserted into the X-axis linear rail and is installed on the movable base.

The cassette mounting mechanism and the temporary placement mechanism are arranged adjacent to each other in the Y-axis direction, and the carrying and carrying mechanism includes: a support base; is arranged on the support base and holds the cassette being housed The holding member of the processed object; a pair of restriction pins that restrict the processed object to a predetermined position; and the conveying and moving means for moving the support base in the Y-axis direction. The above-mentioned temporary placement mechanism includes: extending in the Y-axis direction It also has a bottom and side parts that support both sides of the workpiece, and the bottom is configured to be able to open and close a pair of support rails; and a switch means for opening and closing the bottom of the pair of support rails; and make the pair of support rails move up and down Moving lifting means.

When the above-mentioned holding table is positioned in the disassembly and assembly area of the workpiece, the workpiece is housed in the cassette and temporarily placed on one of the pair of support rails that constitute the temporary placement mechanism by the carrying and carrying mechanism. The pair of supporting rails are lowered by the lifting means to place the workpiece on the holding table, and the bottom is opened by the switch means to hold the workpiece on the holding table.

Adjacent to the above-mentioned temporary placement mechanism, a cleaning mechanism is provided on the opposite side of the Y-axis direction with respect to the cassette placement mechanism to clean the object to be processed. At the same time, in the cleaning mechanism Directly above is equipped with a structure that communicates with the temporary placement mechanism, and temporarily places the processed object Auxiliary temporary placement mechanism. The auxiliary temporary placement mechanism is provided with a bottom and side portions extending in the Y-axis direction and supporting both sides of the workpiece, and the bottom is configured to be capable of opening and closing a pair of auxiliary support rails; and opening and closing the pair The switch means for the bottom of the auxiliary support rail; and the auxiliary lifting means for moving a pair of auxiliary support rails up and down.

The above-mentioned carrying and carrying mechanism is provided with an auxiliary holding member arranged on the support base and holding an area on the opposite side of the workpiece supported by a pair of auxiliary support rails from the area held by the holding member, and A pair of auxiliary restriction pins that restrict the workpiece supported on a pair of auxiliary support rails to a specified position.

When the holding table that holds the cut workpiece is positioned in the disassembly area of the workpiece, the bottom of the pair of support rails that constitutes the temporary placement mechanism is opened, and the pair of support rails is lowered to lower the bottom After positioning at the lower part of the cut workpiece, the pair of support rails are raised while the bottom is closed to support the cut workpiece, and then the holding is carried out by the moving and moving mechanism. The holding member is used to hold the workpiece contained in the cassette, and at the same time, a pair of auxiliary restriction pins provided on the support base are positioned in the area opposite to the area held by the holding member from the cut workpiece By moving the support base to the side of the auxiliary temporary placement mechanism, the processed object contained in the cassette is positioned in the temporary placement mechanism, and the cut processed object is positioned in the auxiliary temporary placement mechanism. Then , Temporarily by means of auxiliary lifting means constituting auxiliary temporary placement mechanism When placed on a pair of auxiliary support rails, the pair of auxiliary support rails are lowered by the lifting means to place the processed object on the rotating table of the cleaning mechanism, and the bottom is opened by the switch means to cut the processed object Keep it on the rotating table.

The above-mentioned washing mechanism is equipped with a spray nozzle for spraying washing water arranged above the rotating table. The spray nozzle is arranged on the support base constituting the carrying and carrying mechanism and is selectively engaged with each other. The method moves in the Y-axis direction with the movement of the support base, and sprays washing water to at least the area from the outer periphery to the center of the workpiece.

The jet nozzle of the above-mentioned cleaning mechanism is connected to the other end of the wire connecting one end to the hammer body via a pulley, and is configured to move in the Y-axis direction by the weight of the hammer body, The above-mentioned engagement means is provided with an engagement lever arranged on the support base so as to be able to advance and retreat, and contact is made from the spray nozzle in the direction of movement by the weight of the hammer in a state where the engagement lever is moved in and out.

The cutting device of the present invention is constituted as described above, since the indexing feed means of the first cutting means and the second cutting means respectively in the indexing feed direction orthogonal to the machining feed direction are along the Y axis A common Y-axis linear track on which the guide rail is arranged, and a first Y-axis coil movable member that is inserted into the Y-axis linear track in a movable manner and is mounted on the indexing moving base of the first cutting means , And the indexing moving abutment that is inserted into the Y-axis linear rail in a movable manner and installed on the second cutting means The second Y-axis coil movable element is constructed, so the ball screw mechanism is not used, the number of parts can be reduced, the manufacturing cost can be reduced, and the device can be miniaturized.

2: Static abutment

3: Keep the Taiwan mechanism

32: mobile abutment

34: hold the stage

35: Processing feed means

351: X axis linear orbit

352: X-axis coil movable part

4: Cutting mechanism

5a: The first cutting method

5b: The second cutting method

54: Indexing feed method

540: Common Y-axis linear orbit

544a: first Y-axis coil movable part

544b: second Y-axis coil movable part

6: Cassette mounting mechanism

60: cassette

7: Move out and move into the organization

71: Carrying and Moving Means

72: Support abutment

74: holding components

75: A pair of restricted pins

76: Auxiliary control components

77: A pair of auxiliary limit pins

8: Temporary placement of institutions

80: A pair of support rails

9: auxiliary temporary placement mechanism

90: A pair of auxiliary support rails

10: Washing mechanism

11: Wash the shell

12: Rotating table

13: Jet nozzle

14: Hammer

15: Wiring

16: pulley

F: ring frame

T: Cutting tape

W: semiconductor wafer

Fig. 1 is a perspective view of a cutting device constructed in accordance with the present invention.

Figure 2 is an oblique view of important parts of the cutting device shown in Figure 1;

Fig. 3 is a perspective view showing a cutting mechanism installed in the cutting device shown in Fig. 1.

Fig. 4 is a cross-sectional view of A-A in Fig. 1.

Fig. 5 is a perspective view of a carrying and carrying mechanism constituting the cutting device shown in Fig. 1;

FIG. 6 is a front view of important parts of the carrying and carrying mechanism 7 shown in FIG. 5.

Fig. 7 is a perspective view of a temporary placement mechanism and an auxiliary temporary placement mechanism constituting the cutting device shown in Fig. 1.

Fig. 8 is a side view of the temporary placement mechanism shown in Fig. 7;

Fig. 9 is a perspective view of a cleaning mechanism constituting the cutting device shown in Fig. 1;

Fig. 10 is a perspective view showing a state in which the holding member of the carrying and carrying mechanism and a pair of restricting pins are positioned at the standby position.

Fig. 11 is a ring shape showing that the workpiece contained in the cassette placed on the cassette placement mechanism is gripped and supported by the gripping member of the transport mechanism Oblique view of the state of the frame.

Fig. 12 is a perspective view showing a state in which the workpiece supported by the ring frame is transported to one of the pair of support rails of the temporary placement mechanism by the carrying and carrying mechanism.

Fig. 13 is a perspective view showing a state where the workpiece supported by the ring frame is placed on the upper surface of the holding table with the dicing tape interposed therebetween.

Fig. 14 is a perspective view showing a state in which a pair of support rails of the temporary placement mechanism is raised and positioned at an upper position.

Fig. 15 is a perspective view showing a state in which a holding table for sucking and holding a workpiece is moved to a processing area equipped with a cutting mechanism.

Fig. 16 is a perspective view showing a state in which the cut workpiece is positioned at a position where the workpiece is detached and detached from the holding table for suction and holding.

Fig. 17 is a perspective view showing a state in which a pair of support rails of the temporary placement mechanism is positioned at a lower position from the state shown in Fig. 15;

Fig. 18 is a perspective view showing a state in which a pair of support rails of the temporary placement mechanism is positioned at an intermediate position slightly below the upper position from the state shown in Fig. 16.

Fig. 19 is a perspective view showing a state in which the workpiece contained in the cassette placed on the cassette placement mechanism is gripped by the gripping portion of the transport mechanism.

Figure 20 shows the positioning of the new workpiece on one of the supporting rails of the temporary placement mechanism by the gripping part of the carrying and loading mechanism, and the positioning of the cut workpiece on one of the auxiliary supporting tracks of the auxiliary temporary placement mechanism at the same time Oblique view of its state.

Fig. 21 is a perspective view showing the state of being positioned at a lower position of a pair of auxiliary support rails of one of the auxiliary temporary placement mechanisms from the state of Fig. 19;

Figure 22 is an oblique view showing a state in which the upper part of the supporting rail of one of the temporary placement mechanism and one of the auxiliary temporary placement mechanism is positioned from the state of FIG. 20 and the state of the spray nozzle of the cleaning mechanism moving. .

Fig. 23 is a perspective view showing a state in which the carrying and carrying mechanism 7 is positioned in the standby position from the state shown in Fig. 21, and a pair of auxiliary support rails constituting the auxiliary temporary placement mechanism are positioned in the lower position.

Fig. 24 is a perspective view showing a state in which one of the auxiliary temporary placement mechanisms for supporting the washed object supported by the ring frame is positioned in the upper position of the auxiliary support rail.

Fig. 25 is a perspective view showing the state in which the washed object supported on the ring frame is moved from one pair of auxiliary support rails of the auxiliary temporary placement mechanism to one pair of support rails of the temporary placement mechanism from the state of Fig. 23 .

Fig. 26 is an oblique view of a state in which a pair of support rails of the temporary placement mechanism are positioned at an intermediate position from the state of Fig. 24, and the holding members of the carrying and carrying mechanism and a pair of restricting pins are positioned at the standby position.

Fig. 27 is a perspective view showing a state in which the carrying and carrying mechanism is actuated from the state of Fig. 25 to house the washed workpiece supported by the ring frame in the cassette.

The following is a comparison of the cutting device constructed in accordance with the present invention For the best implementation mode, please refer to the attached drawing for detailed description.

Fig. 1 shows a perspective view of an embodiment of a cutting device constructed in accordance with the present invention.

The cutting device in the embodiment shown in the figure is provided with a stationary base 2, a holding table mechanism 3 that holds a workpiece arranged on the stationary base 2, and a machine to be cut held by the holding table mechanism 3.物的Cutting mechanism4.

The holding table mechanism 3 is provided as shown in FIG. 2 with: two X-axis guide rails 31, 31 arranged along the machining feed direction (X-axis direction) indicated by an arrow X on the stationary base 2; The movable base 32 is arranged to be slidable on the two X-axis guide rails 31, 31; it is held rotatably supported by the cylindrical support member 33 arranged on the movable base 32 The holding table 34 of the workpiece; the processing feed means 35 that moves the moving base 32 on which the holding table 34 is arranged along the two X-axis guide rails 31, 31 in the processing feed direction (X-axis direction). The holding table 34 includes a platform main body 341 rotatably supported by the cylindrical support member 33, and a suction jig 342 arranged on the upper surface of the platform main body 341. The platform main body 341 is formed to have an outer diameter larger than the outer diameter of the wafer as the to-be-processed object described later and smaller than the inner diameter of the ring frame supporting the wafer via the dicing tape. The suction jig 342 is formed by porous ceramics, and is connected to a suction means (not shown) to appropriately apply negative pressure. Therefore, the workpiece placed on the suction jig 342 is sucked and held on the suction jig 342 by a suction means (not shown). In addition, the holding table 34 is rotated by a pulse motor (not shown) arranged in the cylindrical support member 33.

The above-mentioned processing and feeding means 35 is composed of an X-axis linear rail 351 which is arranged between the two X-axis guide rails 31 and 31 and extends in the X-axis direction, and is inserted into the X-axis linear rail in a movable manner. 351, and is formed by the X-axis coil movable member 352 installed on the movable base 32 where the holding table 34 is arranged. The X-axis linear rail 351 alternately joins the N poles and S poles of a plurality of cylindrical permanent magnets to form a shaft, and the plurality of cylindrical permanent magnets constituting the shaft are arranged on a non-magnetic material such as stainless steel. The cylindrical shell is formed. The X-axis linear rail 351 constructed in this way has support members 353 and 353 attached to both ends thereof as shown in FIG. 2, and is mounted on the stationary base 2 via the support members 353 and 353. The processing feed means 35 composed of the X-axis linear rail 351 and the X-axis coil movable element 352 constitutes a so-called linear drive shaft motor. When current flows through the X-axis coil movable element 352, the attractive force caused by magnetic force is repeated, The reaction force produces thrust. Therefore, by changing the direction of the current applied to the X-axis coil movable element 352, the direction in which the X-axis coil movable element 352 moves along the X-axis linear rail 351 can be changed. In this way, the processing and feeding means 35 constituted by a so-called linear drive shaft motor is constructed by inserting the X-axis coil movable member 352 so as to be slidable on the X-axis linear rail 351, so the structure is simple and it is not It is driven by contact, so it will not wear out and maintenance is extremely simple. Furthermore, the processing feed means 35 constituted by the so-called linear drive shaft motor does not use a ball screw mechanism as the conventional feed mechanism, so the number of parts can be reduced, the manufacturing cost can be reduced, and the device can be miniaturized. In addition, since the cutting mechanism 4 described later is used for cutting, the holding of the workpiece is When the table 34 is processing feed, the yaw is suppressed, so the cutting accuracy can be improved. The processing and feeding means 35 configured in this way move the movable base 32 provided with the holding table 34 between the workpiece removal area shown in FIG. 2 and the processing area provided with the cutting mechanism 4.

Next, the above-mentioned cutting mechanism 4 will be described.

The cutting mechanism 4 includes a gate-shaped support frame 41 fixed to the above-mentioned stationary base 2. The door-shaped support frame 41 is composed of a first column portion 411 and a second column portion 412 arranged at intervals, and the upper ends of the first column portion 411 and the second column portion 412 are connected, and along and The machining feed direction indicated by the arrow X is orthogonal to the indexing feed direction indicated by the arrow Y (the Y axis direction), and the supporting part 413 is arranged to straddle the two X-axis guides. 31.

In FIGS. 1 and 2 of the supporting portion 413 constituting the door-shaped supporting frame 41, the first cutting means 5a and the second cutting means 5b are arranged on the back side. The first cutting means 5a and the second cutting means 5b will be described with reference to FIGS. 3 and 4. The first cutting means 5a and the second cutting means 5b are provided with an index moving base 51, a cutting depth moving base 52, and a rotating shaft unit 53, respectively. The indexing moving base 51 of the first cutting means 5a and the indexing moving base 51 of the second cutting section 5b are provided with two Y-axes which are respectively arranged on the left side of the support part 413 in FIG. 4 The guided grooves 511, 511 into which the guide rails 413a, 413a are fitted, and by fitting the guided grooves 511, 511 with the two Y-axis guide rails 413a, 413a, the index moving base 51 is configured to be able to move along the two The Y-axis guide rails 413a and 413a move. In addition, in the indexing movement of the first cutting means 5a, the base 51 and the second cutting The surface of one side of the index moving base 51 of the means 5b is respectively formed with recesses 513 in which the index means described later are arranged. Furthermore, the other surface of the indexing moving base 51 of the first cutting means 5a and the indexing moving base 51 of the second cutting means 5b is shown along the arrow Z as shown in FIG. 4 respectively. A pair of guide rails 512, 512 (only one guide rail is shown in FIG. 4) is provided in the divided feed direction shown.

The depth-of-cut moving base 52 of the first cutting means 5a and the depth-of-cut moving base 52 of the second cutting means 5b are formed by a supported portion 521 extending in the vertical direction, and a right angle from the lower end of the supported portion 521 The mounting portion 522 extends horizontally. As shown in FIG. 4, the surface on the side of the mounting portion 522 of the supported portion 521 is provided with a pair of Z-axis guide rails 512, 512 provided on the other surface of the index movement base 51. Guide grooves 523, 523 (only one of the guided grooves is shown in FIG. 4). By fitting the guided grooves 523, 523 to the two Z-axis guides 512, 512, the base is cut deep 52 is configured to be able to move along the two Z-axis guide rails 512, 512 in the cutting depth feed direction indicated by the arrow Z. As a result, the cutting depth moving base 52 installed on the indexing moving base 51 is shown in FIGS. 1 and 2, and the mounting portion 522 is configured to protrude below the supporting portion 413 of the door-shaped supporting frame 41. side.

The above-mentioned rotating shaft unit 53 is respectively mounted under the mounting portion 522 of the cutting depth moving base 52 forming the first cutting means 5a and the second cutting means 5b. The shaft unit 53 of the first cutting means 5a and the shaft unit 53 of the second cutting means 5b, as shown in FIGS. 3 and 4, respectively, are provided with a spindle cover 531, which is rotatably supported by the spindle cover shell The rotating spindle 532 of 531, the cutting blade 533 installed at one end of the rotating spindle 532, and the unillustrated servo motor that rotates the cutting water supply pipe 534 for supplying cutting water and the rotating spindle 532, the rotating spindle 532 The axis direction is arranged along the indexing feed direction indicated by arrow Y. In addition, the cutting blade 533 constituting the rotating shaft unit 53 of the first cutting means 5a and the cutting blade 533 constituting the rotating unit 53 of the second cutting means 5b are arranged to face each other.

The first cutting means 5a and the second cutting means 5b in the embodiment shown in the figure are as shown in FIG. 3, and are equipped with the index moving bases 51, 51 along two Y-axis guides 413a, 413a. The indexing feed means 54 moves in the indexing feed direction (Y-axis direction) indicated by the arrow Y. The indexing feeding means 54 is formed by a common Y-axis linear rail 540 arranged along the two Y-axis guide rails 413a, 413a, and is inserted into the common Y-axis linear rail 540 in a movable manner. The first Y-axis coil movable member 544a of the indexing moving base 51 of the first cutting means 5a, and the second cutting means 5b that is inserted into the common Y-axis linear rail 540 in a movable manner The second Y-axis coil movable member 544b of the base 51 is indexed. The common Y-axis linear rail 540 is formed by alternately joining the N poles and S poles of a plurality of cylindrical permanent magnets to form a shaft, and the plurality of cylindrical permanent magnets constituting the shaft are arranged on a non-magnetic material such as stainless steel. It is composed of a cylindrical shell. The common Y-axis linear rail 540 constructed in this way has support members 543 and 543 attached to both ends thereof as shown in FIG. 3, and is mounted to the support portion 413 of the support frame 41 via the support members 543 and 543. To be able to move The first Y-axis coil movable element 544a and the second Y-axis coil movable element 544b that are inserted into the common Y-axis linear rail 540 are respectively arranged on the indexing moving base 51 and the first cutting means 5a. The recesses 513 of the index moving base 51 of the second cutting means 5b are respectively mounted on the surface of one of the index moving bases 51.

As described above, the indexing feed means 54 constituted by the common Y-axis linear rail 540, the first Y-axis coil movable element 544a and the second Y-axis coil movable element 544b, and the X-axis linear rail 351 and X The shaft coil movable element 352 is composed of the same processing and feeding means 35, and constitutes a so-called drive shaft motor. When current flows into the first Y-axis coil movable element 544a and the second Y-axis coil movable element 544b, the magnetic force is repeated. Attraction and reaction force generate thrust. Therefore, by changing the direction of the current applied to the first Y-axis coil movable element 544a and the second Y-axis coil movable element 544b, the first Y-axis coil movable element 544a and the second Y-axis coil movable element 544b can be changed along The common Y-axis linear rail 540 and the moving direction. In this way, the indexing feed means 54 constituted by a so-called drive shaft motor is inserted into the first Y-axis coil movable element 544a and the second Y-axis coil in a manner that can slide on the common Y-axis linear rail 540. The structure of the movable element 544b is simple in structure, and because it is driven by non-contact, it will not wear out and maintenance is extremely simple. Furthermore, the indexing feeding means 54 constituted by a so-called linear drive shaft motor does not use a ball screw mechanism as the conventional feeding mechanism, so the number of parts can be reduced and the manufacturing cost can be reduced.

Furthermore, the first cutting means 5a and the second cutting means 5b in the illustrated embodiment are as shown in Figs. 3 and 4, with useful features The cutting depth means 55, 55 move the index moving bases 52, 52 along the two Z-axis guide rails 512, 512 in the cutting depth feeding direction (Z-axis direction) indicated by the arrow Z. The cutting depth feeding means 55, 55 are composed of a male screw 551 arranged in parallel with the two Z-axis guides 512, 512, respectively, a bearing 522 that rotatably supports one end of the male screw 551, and is connected to The other end of the male screw 551 is constituted by a pulse motor 553 that drives the male screw 551 forward or backward. The depth-of-cut feeding means 55 and 55 configured in this way are respectively screwed with a male screw 551 and a female screw 521a formed on the supported portion 521 of the above-mentioned depth-moving base 52. Therefore, the cutting depth feeding means 55, 55 can drive the male screw 551 forward or backward by driving the pulse motor 553, respectively, so that the cutting depth moving base 52 is along the two Z-axis guide rails 512, 512, as shown in FIG. 3 Move in the feed direction (Z axis direction) indicated by arrow Z.

When the description is continued with reference to FIG. 1, the stationary base 2 is provided with a cassette mounting mechanism 6 for mounting a cassette 60 for storing plural processed objects such as semiconductor wafers. The cassette 60 carries the processed object, and at the same time the cut-out processed object is carried in to the unloading and carrying mechanism 7 of the cassette 60, and the temporary placing mechanism 8 for temporarily placing the processed object carried out by the unloading and carrying mechanism 7 4. An auxiliary temporary placement mechanism 9 arranged adjacent to the temporary placement mechanism 8, and a cleaning mechanism 10 that cleans the workpiece after cutting. The cassette placing mechanism 6 places the cassette 60 on the cassette table 61 that is raised and lowered by an elevating means (not shown). The cassette 60 contains the semiconductor wafer W pasted on the surface of the dicing tape T mounted on the ring frame F. In addition, on the outer circumference of the ring frame F, There are groove F.1 and plane F.2.

As shown in FIG. 1, the carry-in and carry-in mechanism 7 is composed of a conveying and moving means 71 arranged on the surface side of the support portion 413 of the above-mentioned door-shaped support frame 41, and by the conveying and moving means 71 in the Y-axis direction The movable support base 72 is composed of a connecting member 73 that connects the support base 72 and the conveying and moving means 71. The transport moving means 71 is constituted by a conveyor belt mechanism that moves the connecting member 73 connecting the support base 72 in the Y-axis direction. When continuing the description with reference to FIGS. 5 and 6, the supporting base 72 constituting the carrying-out and carrying-in mechanism 7 is installed with a holding member 74 (refer to FIG. 6), which is provided on the lower side to hold the cutting tape T and a ring-shaped frame F that supports the semiconductor wafer W contained in the cassette 60 of the cassette placement mechanism 6; a cylinder 740 for moving the holding member 74 in the vertical direction; and a pair The restriction pins 75 are arranged on both sides of the holding member 74 and engage with the grooves F.1 and the plane F.2 provided in the ring frame F to restrict the ring frame F to a predetermined position . The carrying-out/carrying-in mechanism 7 is configured to move the support base 72 toward the cassette 60 placed on the cassette placement mechanism 6, and by making a pair of restricting pins 75 and the dicing tape T provided therebetween The groove F.1 and the plane F.2 of the ring frame F supporting the semiconductor wafer W contained in the cassette 60 are engaged with each other to limit the position of the semiconductor wafer W to a predetermined position. Then, the gripping member 74 is moved upward by the cylinder 740, thereby gripping the annular frame F between the support base 72 and the gripping member 74.

Furthermore, on the support base 72 constituting the carry-out and carry-in mechanism 7, an auxiliary gripping member 76 (refer to FIG. 6) is installed, which is arranged On the lower side, a ring frame F for holding the semiconductor wafer W that will be cut to be described later through the dicing tape T; a cylinder 760 for moving the auxiliary holding member 76 in the vertical direction; and a pair of auxiliary restraints The pins 77 are arranged on both sides of the auxiliary holding member 76 and engage with the above-mentioned ring frame F to restrict the ring frame F to a predetermined position. In addition, the support base 72 constituting the carry-out and carry-in mechanism 7 is provided with an engaging means 78 for selectively engaging with the jet nozzle of the washing mechanism described later. The engaging means 78 is composed of an engaging rod 781 arranged below the lower support base 72 so as to be able to advance and retreat, and a cylinder 782 that advances and retreats the engaging rod 781.

The temporary placement mechanism 8 described above will be described with reference to FIGS. 1, 7 and 8. The temporary placement mechanism 8 is adjacent to the cassette placement mechanism 6 in the Y-axis direction, and is disposed directly above the workpiece attachment/detachment area of the holding table 34. The temporary placement mechanism 8 includes a pair of support rails 80 that extend in the Y-axis direction, have bottom portions 81a, 81b, and side portions 82a, 82b that support both sides of the ring frame F, and are composed of bottom portions 81a, 81b can open and close; and switch means 85a, 85b, which are used to open and close the bottom 81a, 81b of the pair of support rails 80; and the lifting means 86, which makes the pair of support rails 80 move in the up and down direction. In addition, the upper ends of the side portions 82a, 82b constituting the pair of support rails 80 are provided with flange portions 83a, 83b protruding to the inside, and the flange portions 83a and 83b are connected to one end by a connecting portion 84. The above-mentioned switch means 85a, 85b are in the embodiment shown in the figure, and are composed of cylinders, which actuate the bottoms 81a, 81b of a pair of supporting rails 80 to the level indicated by solid lines in Fig. 8 respectively. The closed position of the position and the open position of the vertical position indicated by a two-dot chain line. The lifting means 86 is composed of a cylinder 861 attached to a fixing member (not shown), and a piston rod 862 of the cylinder 861 is connected to the connecting portion 84 of the pair of support rails 80.

The auxiliary temporary placement mechanism 9 is adjacent to the temporary placement mechanism 8 in the Y-axis direction and is arranged on the opposite side of the cassette placement mechanism 6 in the Y-axis direction directly above the cleaning mechanism 10 described later. . The auxiliary temporary placement mechanism 9 has the same structure as the above-mentioned temporary placement mechanism 8. As shown in FIG. 7, it is provided with a pair of auxiliary support rails 90 extending in the Y-axis direction and having both sides supporting the ring frame F The bottoms 91a, 91b, and side portions 92a, 92b, and the bottoms 91a, 91b are constituted to be switchable; and the switch means 95a, 95b, which are used to switch the bottoms 91a, 91b of the pair of auxiliary support rails 90; and lift Means 96 is to move the pair of auxiliary support rails 90 in the vertical direction. Moreover, the upper ends of the side portions 92a, 92b constituting the pair of auxiliary support rails 90 are provided with flange portions 93a, 93b protruding inside each other, and the flange portions 93a and 93b are connected to each other by a connecting portion 94. . The above-mentioned switch means 95a, 95b are constituted by cylinders in the embodiment shown in the figure, and the bottoms 91a, 91b of the pair of auxiliary support rails 90 are respectively actuated to the closed position in the horizontal position and the open position in the vertical position. The lifting means 96 is composed of a cylinder 961 attached to a fixed member (not shown), and the piston rod 962 of the cylinder 961 is connected to the connecting portion 94 of the pair of auxiliary support rails 90.

Next, the aforementioned washing mechanism 10 will be described with reference to FIGS. 1 and 9.

The cleaning mechanism 10 in the illustrated embodiment is adjacent to the above-mentioned temporary placement mechanism 8 and is arranged on the opposite side of the cassette placement mechanism 6 in the Y-axis direction. The washing mechanism 10 is provided with a washing cover 11. The washing casing 11 is composed of a front wall 111, a rear wall 112, side walls 113 and 114, and a bottom wall (not shown), and the upper side is opened. A rotating table 12 is arranged in the washing casing 11 having such a configuration. The rotating table 12 is composed of a platform body 121, a suction jig 122 arranged on the platform body 121, and a servo motor 123 that drives the platform body 121 to rotate. The platform body 121 is formed to have an outer diameter larger than the outer diameter of the wafer W and smaller than the inner diameter of the ring frame F supporting the wafer W via the dicing tape T. The suction jig 122 is formed by porous ceramics, and is connected to a suction means (not shown) to appropriately apply negative pressure. Therefore, the workpiece placed on the suction jig 122 is sucked and held on the suction jig 122 by a suction means (not shown).

1 and 9, the front wall 111 of the washing casing 11 is provided with a guide hole 111a formed along the Y-axis direction, and the guide hole 111a is movable in the Y-axis direction. In this way, a spray nozzle 13 for spraying washing water on the workpiece held on the rotating table 12 is arranged. The jet nozzle 13 is connected to the other end of the wire 15 connected to the hammer 14 via a pulley 16 and is configured to move in the direction indicated by the arrow Y1 by the weight of the hammer 14. In addition, in the spray nozzle 13, the engaging means 78 arranged on the support base 72 constituting the above-mentioned carry-in and carry-in mechanism 7 is arranged so as to be able to advance and retreat below the support base 72. With the engaging lever 781 in the state, borrow from The direction indicated by the arrow Y1 moved by the weight of the hammer 14 in the jet nozzle 13 makes contact. In addition, the spray nozzle 13 is connected to a washing water supply means (not shown).

The cutting device in the illustrated embodiment is configured as described above, and its function will be described below.

First, as shown in FIG. 10, the cylinder 861 of the temporary placement mechanism 8 is actuated to position the pair of support rails 80 at the upper position, and the holding member 74 (refer to FIG. 6) provided with the carrying-out and carrying-in mechanism 7 and The supporting base 72 of the pair of restriction pins 75 (refer to FIGS. 5 and 6) is positioned at the standby position shown in the figure.

Next, the carrying and moving means 71 (refer to FIGS. 1 and 5) of the carry-in and carry-in mechanism 7 is actuated, and as shown in FIG. 11, the support base 72 provided with the holding member 74 and the pair of restricting pins 75 is moved to On the cassette mounting mechanism 6 side, a pair of restricting pins 75 (refer to FIGS. 5 and 6) are provided with a ring frame F that supports the semiconductor wafer W contained in the cassette 60 via the dicing tape T. The groove F.1 and the plane F.2 (refer to FIG. 1) are engaged, thereby restricting the position of the semiconductor wafer W to a predetermined position. Furthermore, by operating the cylinder 740, the ring frame F is gripped between the support base 72 and the gripping member 74 (refer to FIG. 6).

If the ring frame F is gripped by the support base 72 and the holding member 74, the conveying and moving means 71 of the carry-out and carry-in mechanism 7 is actuated to move the support base 72 to the opposite side of the cassette mounting mechanism 6, and As shown in FIG. 12, the ring frame F is conveyed to the support rail 80 of one pair of the temporary placement mechanism 8, and is temporarily placed.

When the ring frame F is conveyed to one of the pair of support rails 80 of the temporary placement mechanism 8, as shown in FIG. 13, the cylinder 861 is actuated to lower the pair of support rails 80 and positioned at the lower position. As a result, the dicing tape T mounted on the ring frame F and pasting the semiconductor wafer W is placed on the upper surface of the holding table 34 in the holding platform mechanism 3 which is positioned at the attachment/detachment position of the workpiece. Furthermore, the above-mentioned switch means 85a, 85b (refer to FIGS. 6 and 8) are actuated to position the bottoms 81a, 81b of the pair of support rails 80 from the closed position shown by the solid line to the two-dot chain line in FIG. 8 The opening position.

Next, by actuating a suction means not shown, as shown in FIG. 14, the semiconductor wafer W is sucked and held on the upper surface of the holding table 34 via the dicing tape T. Then, the cylinder 851 of the temporary placement mechanism 8 is actuated to raise the pair of support rails 80 to be positioned at the upper position.

As shown in FIG. 14, the semiconductor wafer W is sucked and held on the holding table 34 with the dicing tape T interposed therebetween, and the processing and feeding means 35 constituting the holding table mechanism 3 is actuated to suck and hold the semiconductor wafer W. The holding table 34 moves to the processing area where the cutting mechanism 4 is provided as shown in FIG. 15. Then, the semiconductor wafer W held by the holding table 34 is subjected to predetermined cutting processing by the first cutting means 5a and the second cutting means 5b. In addition, since the holding table 34 is formed as described above, its outer diameter is larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the ring frame F. Therefore, the ring frame F sags slightly due to its own weight and does not interfere with the cutting process. The cutting blades 533 of the first cutting means 5a and the second cutting wrist 5b do not require a frame pushing mechanism, which reduces the cost.

As described above, when a predetermined cutting process is applied to the semiconductor wafer W held by the holding table 34, the processing feed means 35 is actuated to position the holding table 34 for sucking and holding the cut semiconductor wafer W in the figure. 16 shows the disassembly and assembly position of the processed object. In this state, the cut semiconductor wafer W held by the holding table 34 is positioned directly below the temporary placement mechanism 8.

If the cut semiconductor wafer W held on the holding table 34 is positioned directly below the temporary placement mechanism 8, when the bottoms 81a, 81b of the supporting rails 80 of the temporary placement mechanism 8 are positioned in the open position Next, the cylinder 861 is actuated, and as shown in FIG. 17, the pair of support rails 80 are lowered and positioned at the lower position. Furthermore, the bottoms 81a and 81b of the pair of support rails 80 are positioned at the closed position to support the ring frame F, and the suction and holding of the semiconductor wafer W by the holding table 34 is released.

Next, the cylinder 861 of the temporary placement mechanism 8 is actuated to raise one of the supporting ring frames F to the supporting rail 80, and as shown in FIG. 18, slightly below the upper position, the gripping member 74 of the carrying-in mechanism 7 The pair of restriction pins 75 position the pair of support rails 80 at an intermediate position that can move above the cut semiconductor wafer W supported by the pair of support rails 80.

Furthermore, the carrying and moving means 71 of the carrying-in and carrying-in mechanism 7 is actuated, as shown in FIG. 19, the support base 72 is moved to the cassette mounting mechanism 6 side, and a pair of restricting pins 75 (refer to FIGS. 5 and 6) With the semiconductor installed in the cassette 60 supported by the dicing tape T The groove F.1 of the ring frame F of the wafer W is engaged with the plane F.2 (refer to FIG. 1), thereby restricting the position of the semiconductor wafer W to a predetermined position. Then, by operating the cylinder 740, the ring frame F supporting the new semiconductor wafer W is gripped between the support base 72 and the gripping member 74 (refer to FIG. 6). At this time, the holding member 74 and the pair of restricting pins 75 move above the semiconductor wafer W after cutting.

Next, actuate the cylinder 851 of the temporary placement mechanism 8 to position one of the pair of support rails 80 that support the cut semiconductor wafer W at the upper position, and load the cassette in the ring frame F that supports the cut semiconductor wafer W The end surface on the side of the setting mechanism 6 is positioned at a position facing the pair of auxiliary restricting pins 77. After that, the transport and movement means 71 of the carry-out and carry-in mechanism 7 is actuated. As shown in FIG. 20, the support base 72 is moved to the opposite side of the cassette mounting mechanism 6, and the support is supported by the support base 72 and The ring frame F of the new semiconductor wafer W held by the holding member 74 is transported to a pair of support rails 80 of the temporary placement mechanism 8, and at the same time the support is abutted on the cut semiconductor wafer W of the pair of auxiliary restricting pins 77 The ring frame F is conveyed to a pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9.

When the ring frame F supporting the cut semiconductor wafer W is transported to a pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9, as shown in FIG. 21, the cylinder 961 is activated to lower the pair of auxiliary support rails 90 , Positioned in the lower position. In this state, the dicing tape T to which the semiconductor wafer W is attached is mounted on the ring frame F and is in contact with the upper surface of the rotating table 12 of the cleaning mechanism 10. Moreover, by making a pair of auxiliary The bottoms 91a and 91b of the support rail 90 are positioned from the closed position to the open position, and the cut semiconductor wafer W is placed on the upper surface of the turntable 12 via the dicing tape T. Furthermore, by actuating the suction means (not shown), the semiconductor wafer W that has been cut is sucked and held on the upper surface of the turntable 12 via the dicing tape T.

Next, a pair of support rails 80 of the temporary placement mechanism 8 and a pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9 are positioned in the upper position as shown in FIG. 22(a), and the rotating table 12 is rotated, and at the same time, as shown in FIG. As shown in 22(b), the washing water 130 is sprayed from the spray nozzle 13 by activating the washing water supply means (not shown). At this time, it is positioned at a position where the engaging rod 781 of the engaging means 78 arranged on the support base 72 of the carry-out and carry-in mechanism 7 enters and engages with the jet nozzle 13, and the carrying and moving means 71 is actuated to make The engaging rod 781 reciprocates in the Y-axis direction. Therefore, the weight of the weight 14 connected to one end of the wire 15 connected to the spray nozzle 13 cooperates with the gravity to move the spray nozzle 13 back and forth in the Y-axis direction. In addition, the reciprocating range of the jet nozzle 13 may be at least from the outer periphery to the center of the cut semiconductor wafer W. As a result, the semiconductor wafer W that has been sucked and held on the spin tape 12 via the dicing tape T is rotated and cleaned. In addition, in the reciprocating movement toward the Y-axis direction of the ejection nozzle 13 described above, since the unloading/carrying mechanism 7 serves as a driving source, the size can be reduced and the cost can be reduced. Furthermore, since the turntable 12 is formed as described above, its outer diameter is larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the ring frame F, so the ring frame F is slightly sagged by its own weight and is supplied to the semiconductor wafer The washing water of round W is drained smoothly, the same There is no need for a frame pushing mechanism to reduce costs.

As described above, when the semiconductor wafer W that has been cut is cleaned, the unloading and loading mechanism 7 is positioned at the standby position as shown in FIG. 23, and at the same time, a pair of auxiliary support rails that constitute the auxiliary temporary placement mechanism 9 The bottoms 91a and 91b of 90 are positioned in the lower position with the bottoms 91a and 91b positioned in the open position, so that the bottoms 91a and 91b are in the closed position to support the ring frame F for supporting the cleaned semiconductor wafer W. Then, the suction and holding of the semiconductor wafer W by the turntable 12 is released.

Next, as shown in FIG. 24, one pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9 of the ring frame F supporting the cleaned semiconductor wafer W is positioned at the upper position. Then, the auxiliary gripping member 76 arranged on the support base 72 of the carry-out and carry-in mechanism 7 is operated to grip the ring frame F.

Furthermore, the transport and movement means 71 of the carry-in and carry-in mechanism 7 is activated, as shown in FIG. 25, so that the ring frame F supporting the cleaned semiconductor wafer W is moved from one of the auxiliary temporary placement mechanisms 9 to the auxiliary support rail 90 Move to a pair of support rails 80 of the temporary placement mechanism 8.

Next, as shown in FIG. 26, one of the pair of support rails 80 of the temporary placement mechanism 8 is positioned at an intermediate position, and at the same time, the holding member 74 and the pair of restricting pins are arranged on the support base 72 of the carrying-in mechanism 7 75 is positioned in the standby position.

Furthermore, the transport and movement means 71 of the carry-in and carry-in mechanism 7 is actuated, and as shown in FIG. 27, the support base 72 is moved to the cassette mounting mechanism 6 side to move the holding member 74 and the pair of restriction pins 75 from the standby position It moves to the cassette 60 placed on the cassette placement mechanism 6, and accordingly the ring frame F supporting the cleaned semiconductor wafer W is accommodated in the cassette 60.

In addition, as described above, when the cleaned semiconductor wafer W is cleaned and stored in the cassette 60 at the same time, it is carried out from the cassette 60 to one of the supporting rails 80 of the temporary placement mechanism 8. The new semiconductor wafer W is transported to the holding table 34 constituting the holding table mechanism 3 and sucked and held as described above. Moreover, the new semiconductor wafer W attracted and held by the holding table 34 is moved to the processing area where the cutting mechanism 4 is provided by the processing feed means 35, and is moved by the first cutting means 5a and the second cutting means 5b. Be given the required cutting processing.

As mentioned above, the cutting device in the embodiment shown in the figure is supported by the carrying-out and carrying-in mechanism 7 when the holding table 34 holding the workpiece is positioned in the workpiece disassembly area. The ring frame F of the semiconductor wafer W contained in the cassette 60 is temporarily placed on a pair of support rails 80 constituting the temporary placement mechanism 8, and the pair of support rails 80 are lowered by the lifting means 86 to cut the The tape T is supported by the semiconductor wafer W of the ring frame F and placed on the holding table 34, and the bottoms 81a, 81b are opened by the switch means 85a, 85b, and the semiconductor wafer W is held in Since the holding table 34 is used to transport the ring frame F supporting the semiconductor wafer W as the workpiece via the dicing tape T, essentially only the unloading and loading mechanism 7 is used. Therefore, the number of parts is reduced and the cost is reduced. Miniaturization of the device. Furthermore, because the carry-out and carry-in mechanism 7 has an auxiliary temporary placement mechanism 9 that is also arranged directly above the rotating table 12 of the washing mechanism 10 The cutting tape T supports the function of the ring frame F of the cut semiconductor wafer W, so that the device can be miniaturized.

5a: The first cutting method

5b: The second cutting method

51: Indexing mobile abutment

511: Guiding Ditch

513: recess

52: Cut deep mobile abutment

521: Supported part

522: Installation Department

53: shaft unit

531: Mandrel Cover

532: Rotating Mandrel

533: Cutter

534: Cutting Water Supply Pipe

54: Indexing feed method

540: Common Y-axis linear orbit

543: support member

544a: first Y-axis coil movable part

544b: second coil movable part

55: Depth of Cut

553: Pulse Motor

Claims (5)

A cutting device comprising: a cassette loading mechanism for loading cassettes accommodating a plurality of processed objects, and a loading mechanism for carrying in the cassettes placed on the cassette loading mechanism and the processed objects , Carry-in mechanism, and a temporary placement mechanism for temporarily placing the processed objects that are transported by the transporting mechanism, and a holding platform that holds the processed objects temporarily placed in the temporary placement mechanism, and make the holding platform A machining feed mechanism that moves in the machining feed direction (X-axis direction), and a first cutting means and a second cutting means that apply cutting to the workpiece held on the holding table, and make the first cutting The means and the second cutting means are respectively moved in the indexing feed direction (Y-axis direction) orthogonal to the X-axis direction. The cutting device is characterized in that: the first cutting means and the second cutting means Each is provided with: an index moving base, and cutting tools respectively arranged on the index moving base and mutually arranged on the same axis, the index moving base of the first cutting means, and the second cutting tool The indexing moving base of the means is supported so as to be able to move on the Y-axis guide rail arranged along the Y-axis direction, and the indexing feed means is based on the common Y-axis linearity arranged along the Y-axis guide rail. A rail, and a first Y-axis coil movable member that is movably inserted into the Y-axis linear rail and installed on the indexing moving base of the first cutting means, and is movably inserted The second Y-axis coil movable member on the Y-axis linear track and mounted on the indexing moving base of the second cutting means; the processing and feeding mechanism is provided with the temporary placement mechanism. Between the disassembly and assembly area of the artifacts and the processing area equipped with the first cutting means and the second cutting means in a movable manner, the X-axis guide rail that supports the movable base equipped with the holding table; The X-axis linear rail is equipped with the X-axis guide rail, and the X-axis coil movable member inserted in the X-axis linear rail in a movable manner and installed on the movable base; the cassette is mounted The mechanism and the temporary placement mechanism are arranged adjacent to each other in the Y-axis direction. The carrying and carrying mechanism is equipped with a support base; it is arranged on the support base and holds the processed object contained in the cassette A holding member; a pair of restriction pins that restrict the workpiece to a predetermined position; and a conveying and moving means for moving the support base in the Y-axis direction. The temporary placement mechanism includes: extending in the Y-axis direction and having a support to be processed The bottom and sides of the two sides of the object, and the bottom is configured to be able to open and close a pair of support rails; and a switch means for opening and closing the bottom of the pair of support rails; and the pair of support rails are moved up and down. Lifting means, when the holding table is positioned in the disassembly and assembly area of the workpiece, the workpiece is stored in the cassette and temporarily placed in the temporary placement mechanism by the carrying and carrying mechanism. The pair of support rails are lowered by the lifting means to place the processed object on the holding table, and the bottom is opened by the switch means to hold the processed object on the holding table . The cutting device described in claim 1, wherein in a manner adjacent to the temporary placement mechanism, the cassette placement mechanism is provided on the opposite side of the Y-axis direction with respect to cleaning the workpiece. The washing mechanism of the rotating table, at the same time, is arranged directly above the washing mechanism with an auxiliary temporary placement mechanism that is configured to communicate with the temporary placement mechanism and temporarily place the workpiece. The auxiliary temporary placement mechanism has: on the Y axis Extending in the direction and having a bottom and side portions that support both sides of the workpiece, and the bottom is configured to be able to open and close a pair of auxiliary support rails; and a switch means for opening and closing the bottom of the pair of auxiliary support rails; and A pair of auxiliary support rails move up and down in the auxiliary lifting means. The cutting device according to claim 2, wherein the carrying and carrying mechanism is provided with: is arranged on the support base and held by the workpiece supported by the pair of auxiliary support rails, and by the holding The auxiliary holding member in the area on the opposite side of the area where the member is held, and a pair of auxiliary restricting pins that restrict the workpiece supported by the pair of auxiliary support rails to a predetermined position are used to hold the workpiece after cutting. When the holding table is positioned in the disassembly and assembly area of the workpiece, when the bottom of the pair of supporting rails constituting the temporary placement mechanism is in an open state, the pair of supporting rails is lowered to position the bottom at After cutting the lower part of the workpiece, the pair of support rails are raised while the bottom is closed to support the workpiece, and then the holding member of the carrying and carrying mechanism is used to hold The object to be processed is housed in the cassette, and at the same time, the pair of auxiliary restricting pins provided on the support base are positioned in the processed object after cutting, on the side opposite to the area held by the holding member The end face of the area, and by making the support The support base moves to the side of the auxiliary temporary placement mechanism, positions the processed object contained in the cassette in the temporary placement mechanism, and at the same time positions the cut processed object in the auxiliary temporary placement mechanism, and then, by constructing The auxiliary lifting means of the auxiliary temporary placement mechanism is temporarily placed on the pair of auxiliary support rails, and the pair of auxiliary support rails are lowered by the lifting means to place the processed object on the rotating table of the washing mechanism , And the bottom part is opened by the switch means to keep the cut workpiece on the rotating table. The cutting device according to claim 2 or 3, wherein the washing mechanism is provided with a spray nozzle for spraying washing water arranged above the rotating table, and the spray nozzle is arranged to constitute the carrier, The support base of the loading mechanism is selectively engaged with the engaging means, which moves in the Y-axis direction with the movement of the support base, and sprays washing water to at least the area from the outer periphery to the center of the workpiece . The cutting device according to claim 4, wherein the spray nozzle of the cleaning mechanism is connected to the other end of the wire connected to the hammer body via a pulley, and is configured to move in the Y-axis direction by the weight of the hammer body, The engaging means is provided with an engaging rod arranged on the support base so as to be able to advance and retreat. When the engaging rod is moved in and out, the jet nozzle moves in a direction by the weight of the hammer. contact.

Images