TW201700244A - Cutting device to make the overall structure of the device simple and compact and reduce the number of parts and manufacturing cost - Google Patents

Abstract

The invented cutting device is presented to make the overall structure of the device simple and compact, and reduce the number of parts and manufacturing cost. The cutting device comprises a cassette loading mechanism mounted cassettes stored a plurality of workpieces, a workpiece move out/in mechanism for moving out/in cassettes mounted on the cassette loading mechanism, a temporary placing mechanism to temporarily place the workpieces moved out/in from the move out/in mechanism, a holding table for keeping the workpieces that are temporarily placed on the temporary placing mechanism, a processing feed mechanism to let the holding table be moved in the processing feed direction, a first cutting means and a second cutting means to let the workpieces that are kept on the holding table be processed for cutting, an indexing feed mechanism to let the first cutting means and the second cutting means be moved separately in the indexing feed direction. The first cutting means and the second cutting means respectively comprise a movable base, cutting knifes respectively arranged on the movable base and on the same axis. The movable bases of the first cutting means and the second cutting means are supported so as to be movable on a Y-axis guide along the Y-axis direction. The indexing feed means that is equipped with a common Y-axis linear guide along the Y-axis guide, a first coil movable member that is inserted into the Y-axis linear guide in a movable manner and mounted on the movable base of the first cutting means, and a second coil movable member that is inserted into the Y-axis linear guide in a movable manner and mounted on the movable base of the second cutting means.

Description

Cutting device

The present invention relates to a cutting device for cutting a workpiece such as a semiconductor wafer.

In the semiconductor device manufacturing process, a plurality of regions are arranged in a grid-like manner in a predetermined line region arranged on the surface of a semiconductor wafer having a substantially circular plate shape, and devices such as ICs and LSIs are formed in the regions to be partitioned. Further, each semiconductor device is manufactured by cutting a semiconductor wafer along a predetermined dividing line and dividing a region in which the device is formed.

A cutting device for cutting a workpiece such as a semiconductor wafer along a predetermined dividing line includes a cassette mounting means for placing a cassette in which a plurality of workpieces are stored, and a cassette mounting means for mounting the plurality of workpieces thereon a means for carrying out the loading and unloading of the workpiece, a temporary placement means for temporarily storing the workpiece to be carried out by the loading and unloading means, and a temporary holding means for temporarily placing the workpiece in the temporary placement means a holding table for the workpiece, a first cutting means and a second cutting means for applying a cutting work to the workpiece held by the holding table, and a machining process for feeding the holding table in the machining feed direction Giving means, and making the first cutting means and the second cutting The first indexing feeding means and the second indexing feeding means for indexing feeding in the indexing feeding direction orthogonal to the processing feed direction can cut the semiconductor crystal efficiently along the dividing line The workpiece such as a circle is cut and divided into individual devices (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 11-26402

However, in the above cutting device, in particular, the first indexing means and the second indexing means for feeding the first cutting means and the second cutting means in the machining feed direction are caused by the balls Since the screw mechanism is formed, the number of parts is increased, the manufacturing cost is increased, and the entire configuration of the apparatus is complicated and large.

The present invention has been made in view of the above circumstances, and a main technical object thereof is to provide a first index feeding means and a second point for processing feed of a first cutting means and a second cutting means in a machining feed direction. The cutting device has a simplification and a miniaturization, and the number of parts can be reduced, and the manufacturing cost can be reduced.

In order to solve the above main technical problems, by the present invention In the meantime, there is provided a cutting apparatus comprising: a cassette mounting mechanism on which a cassette containing a plurality of workpieces is placed, and a cassette loaded from the cassette mounting mechanism and loaded into the workpiece a loading and unloading mechanism, and a temporary placement mechanism for temporarily storing the workpiece to be carried out by the loading and unloading mechanism, and a holding table for holding the workpiece temporarily placed in the temporary placement mechanism, and the holding table is placed a machining feed mechanism that moves in a machining feed direction (X-axis direction), a first cutting means and a second cutting means that apply a cutting process to the workpiece held by the holding table, and the first cutting means And the indexing feed mechanism that moves the second cutting means in the indexing feed direction (Y-axis direction) orthogonal to the X-axis direction, wherein the cutting device is characterized in that the first cutting means and the second cutting means are respectively a movable base, and a cutting blade respectively disposed on the moving base and disposed on the same axis, the moving base of the first cutting means and the moving base of the second cutting means are supported Into Moving along a Y-axis rail disposed along the Y-axis direction, the indexing feed means is a common Y-axis linear track disposed along the Y-axis guide rail, and is movably inserted The Y-axis linear track is mounted on the first coil movable member of the moving base of the first cutting means, and is movably inserted into the Y-axis linear track and mounted to the second cutting means The second coil movable member of the moving base is formed.

The processing feed mechanism is disposed in a disassembly area of the workpiece to which the temporary placement mechanism is disposed, and is equipped with the first cutting means and the second An X-axis guide rail that movably supports a moving base on which the holding table is disposed between the processing regions of the cutting means; and an X-axis linear track disposed along the X-axis guide rail, and in a movable manner The X-axis coil movable member is inserted into the X-axis linear track and mounted on the moving base.

The cassette mounting mechanism and the temporary placement mechanism are disposed adjacent to each other in the Y-axis direction, and the loading and unloading mechanism includes a support base; the support base is disposed on the support base, and the grip is received in the cassette a holding member for the workpiece; a pair of restricting pins for restricting the workpiece to a predetermined position; and a transporting means for moving the supporting base in the Y-axis direction, the temporary placing mechanism having the Y-axis extending Having a bottom portion and a side portion supporting both sides of the workpiece, and the bottom portion is configured to be capable of switching one of the pair of support rails; and a switching means for switching the bottom of the pair of support rails; and moving the pair of support rails in the up and down direction The means of lifting.

When the holding table is positioned in the workpiece attachment/detachment area, the object to be processed is carried out by the carry-out and carry-in mechanism, and is temporarily placed on one of the temporary placement mechanisms to support the rail, and is lifted and lowered. The means lowers the pair of support rails to place the workpiece on the holding table, and opens the bottom by the switching means to hold the workpiece on the holding table.

A cleaning mechanism for cleaning the rotary table of the workpiece is provided on the side opposite to the Y-axis direction with respect to the cassette mounting mechanism so as to be adjacent to the temporary placement mechanism, and at the same time Directly above, it is configured to communicate with the temporary placement mechanism, and temporarily place the workpiece. Assist in temporarily placing the mechanism, The auxiliary temporary placement mechanism has a bottom portion and a side portion extending in the Y-axis direction and supporting both sides of the workpiece, and the bottom portion is configured to be capable of switching one pair of auxiliary support rails; and switching the bottom of the pair of auxiliary support rails And means for switching; and an auxiliary lifting means for moving the pair of auxiliary support rails in the up and down direction.

The carry-out and carry-in mechanism includes an auxiliary grip member that is disposed on the support base and that is held in a region on the opposite side of the region supported by the grip member by the workpiece supported by the pair of auxiliary support rails, and A pair of auxiliary restriction pins supported by a pair of auxiliary support rails at a predetermined position.

When the holding table of the workpiece to be cut is positioned in the workpiece dismounting area, the pair of supporting rails are lowered and the bottom is lowered in a state in which one of the temporary placing mechanisms is opened to the bottom of the supporting rail. After being positioned at the lower portion of the workpiece to be processed, the pair of support rails are raised in a state where the bottom portion is closed to support the workpiece to be cut, and then the grip is held by the carry-out and carry-in mechanism The member holds the workpiece accommodated in the cassette, and is disposed at one of the support bases to position the auxiliary restriction pin in the area on the opposite side of the area to be cut by the holding member. The end surface, and by moving the support base to the auxiliary temporary placement mechanism side, positioning the workpiece accommodated in the cassette in the temporary placement mechanism, and positioning the cut workpiece in the auxiliary temporary placement mechanism, and then, By means of an auxiliary lifting means that constitutes an auxiliary temporary placement mechanism When placed on a pair of auxiliary support rails, the pair of auxiliary support rails are lowered by the lifting means to place the workpiece on the rotating table of the cleaning mechanism, and the bottom portion is opened by the switching means to cut the workpiece. Keep on the rotary table.

The cleaning mechanism includes an injection nozzle for spraying the washing water disposed above the rotary table, and the injection nozzle is disposed by being attached to a support base that constitutes the loading and unloading mechanism and selectively engaged. As the support base moves, it moves in the Y-axis direction, and at least the washing water is sprayed from the outer circumference to the center of the workpiece.

The other end of the wire connecting the injection nozzle of the cleaning mechanism to the hammer body via the pulley is configured to be moved in the Y-axis direction by the gravity of the hammer body, and the engagement means is provided to be movable forward and backward. The engagement lever of the support base contacts the direction in which the movement of the hammer is moved by the gravity of the hammer body in a state where the engagement lever is moved in and out.

According to the cutting apparatus of the present invention, the indexing feed means for dividing the first cutting means and the second cutting means in the indexing feed direction orthogonal to the machining feed direction is along the Y axis. a common Y-axis linear track that is disposed on the guide rail, and a first coil movable member that is movably inserted into the Y-axis linear track and is attached to the moving base of the first cutting means, and is capable of The second coil that is inserted into the Y-axis linear or is mounted on the moving base of the second cutting means can be Since the moving member is configured, the number of components can be reduced, the manufacturing cost can be reduced, and the size of the device can be reduced without using the ball screw mechanism.

2‧‧‧Standing abutment

3‧‧‧ Maintaining the institution

32‧‧‧Mobile abutments

34‧‧‧ Keeping the table

35‧‧‧Processing means of feeding

351‧‧‧X-axis orbit

352‧‧‧X-axis coil movable parts

4‧‧‧ cutting mechanism

5a‧‧‧First cutting means

5b‧‧‧Second cutting means

54‧‧‧Divided feeding means

540‧‧‧Common Y-axis orbit

544a‧‧‧First Y-axis coil movable parts

544b‧‧‧second coil movable parts

6‧‧‧Carcass loading mechanism

60‧‧‧Carmen

7‧‧‧ Moving out and moving into the organization

71‧‧‧Transportation means

72‧‧‧Support abutment

74‧‧‧ Holding components

75‧‧‧A pair of restriction pins

76‧‧‧Auxiliary gripping members

77‧‧‧A pair of auxiliary restraint pins

8‧‧‧ Temporary placement agency

80‧‧‧A pair of support tracks

9‧‧‧ Temporary placement agency

90‧‧‧A pair of auxiliary support tracks

10‧‧‧ Washing agency

11‧‧‧Clean cover

12‧‧‧Rotating table

13‧‧‧jet nozzle

14‧‧‧ Hammer

15‧‧‧ wiring

16‧‧‧ pulley

F‧‧‧Ring frame

T‧‧‧ cutting tape

W‧‧‧Semiconductor Wafer

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a cutting apparatus constructed in accordance with the present invention.

Fig. 2 is a perspective view showing an essential part of the cutting device shown in Fig. 1.

Fig. 3 is a perspective view showing a cutting mechanism attached to the cutting device shown in Fig. 1;

Figure 4 is a cross-sectional view taken along line A-A of Figure 1.

Fig. 5 is a perspective view showing a mechanism for carrying out the loading and unloading mechanism of the cutting device shown in Fig. 1;

Fig. 6 is a front elevational view showing an essential part of the carry-out and carry-in mechanism 7 shown in Fig. 5.

Fig. 7 is a perspective view showing a temporary placement mechanism and an auxiliary temporary placement mechanism constituting the cutting device shown in Fig. 1.

Figure 8 is a side elevational view of the temporary placement mechanism of Figure 7.

Fig. 9 is a perspective view showing a cleaning mechanism constituting the cutting device shown in Fig. 1.

FIG. 10 is a perspective view showing a state in which the holding member of the carry-out and carry-in mechanism and the pair of regulating pins are positioned at the standby position.

FIG. 11 is a perspective view showing a state in which the holding member of the carrying-out and loading mechanism grips and supports the annular frame of the workpiece placed on the cassette of the cassette mounting mechanism.

FIG. 12 is a perspective view showing a state in which a workpiece supported by the annular frame is transported to one of the temporary placement mechanisms by the carry-out and carry-in mechanism to the support rail.

Fig. 13 is a perspective view showing a state in which a workpiece supported by an annular frame is placed on a top surface of a holding table with a dicing tape interposed therebetween.

Fig. 14 is a perspective view showing a state in which one of the temporary placement mechanisms is raised to the support rail and positioned at the upper position.

Fig. 15 is a perspective view showing a state in which a holding table for sucking and holding a workpiece is moved to a processing region where a cutting mechanism is disposed.

Fig. 16 is a perspective view showing a state in which the workpiece to be cut is positioned in a position at which the workpiece of the holding table is sucked and held.

Fig. 17 is a perspective view showing a state in which one of the temporary placement mechanisms is positioned at a lower position with respect to the support rail from the state shown in Fig. 15;

Fig. 18 is a perspective view showing a state in which one of the temporary placement mechanisms is positioned at an intermediate position slightly below the upper position from the state of the upper portion from the state shown in Fig. 16.

FIG. 19 is a perspective view showing a state in which the workpiece held by the cassette mounting mechanism is gripped by the grip portion of the loading/unloading mechanism.

Figure 20 is a view of a pair of temporary placement mechanisms for positioning a new workpiece to be carried by the gripping portion of the loading and unloading mechanism, and positioning the cut workpiece at one of the auxiliary temporary placement mechanisms for the auxiliary support rail. An oblique view of the state.

Figure 21 is a view showing the positioning from the state of Figure 19 in the auxiliary temporary placement mechanism An oblique view of the state of one of the lower positions of the auxiliary support rails.

Figure 22 is a perspective view showing a state in which one of the temporary placement mechanism is positioned from the state of Figure 20 to the upper position of one of the support rail and the auxiliary temporary placement mechanism to the upper position of the auxiliary support rail, and the state of the spray nozzle movement of the cleaning mechanism. .

FIG. 23 is a perspective view showing a state in which the carry-out/loading mechanism 7 is positioned at the standby position from the state shown in FIG. 21, and one of the auxiliary temporary placing mechanisms is positioned at the lower position.

Fig. 24 is a perspective view showing a state in which one of the auxiliary temporary placement mechanisms for supporting the workpiece to be supported by the annular frame is positioned at the upper position with respect to the auxiliary support rail.

Fig. 25 is a perspective view showing a state in which the workpiece supported by the annular frame is moved from one of the auxiliary temporary placement mechanisms to the auxiliary support rail to the state of the support rail from the state of Fig. 23; .

Fig. 26 is a perspective view showing a state in which one of the temporary placement mechanisms is positioned at an intermediate position with respect to the support rail from the state of Fig. 24, and the holding member of the carry-out and carry-in mechanism and the pair of restriction pins are positioned at the standby position.

FIG. 27 is a perspective view showing a state in which the workpiece to be supported by the annular frame is stored in the cassette by the loading and unloading mechanism in the state of FIG.

Hereinafter, preferred embodiments of the cutting apparatus constructed in accordance with the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing an embodiment of a cutting device constructed in accordance with the present invention.

The cutting device in the embodiment shown in the figure includes a stationary base 2, a holding table mechanism 3 that holds a workpiece placed on the stationary base 2, and a machining in which the cutting is held in the holding mechanism 3 Cutting mechanism 4 of the object.

As shown in FIG. 2, the holding table mechanism 3 includes two X-axis guide rails 31 and 31 which are disposed on the stationary base 2 along the machining feed direction (X-axis direction) indicated by an arrow X; A moving base 32 that is slidable on the two X-axis guides 31, 31; and a cylindrical support member 33 that is rotatably supported by the cylindrical support member 33 disposed on the moving base 32 is held The holding table 34 of the workpiece; the processing feed means 35 for moving the moving base 32 on which the holding table 34 is disposed along the two X-axis guides 31, 31 in the machining feed direction (X-axis direction). The holding table 34 includes a stage body 341 that is rotatably supported by the cylindrical support member 33, and a suction jig 342 that is disposed on the upper surface of the platform body 341. The stage main body 341 is formed to have an outer diameter larger than the outer diameter of the wafer as a workpiece to be described later, and smaller than the inner diameter of the annular frame that supports the wafer via the dicing tape. The adsorption jig 342 is formed by porous ceramics, and is connected to a suction means (not shown) to appropriately apply a negative pressure. Therefore, the workpiece to be placed on the adsorption jig 342 is sucked and held by the suction jig 342 by being actuated by a suction means (not shown). Further, the holding table 34 is rotated by a pulse motor (not shown) disposed in the cylindrical support member 33.

The above processing feeding means 35 is provided on two X axes An X-axis linear rail 351 extending between the guide rails 31 and 31 and extending in the X-axis direction, and a movable base station that is movably inserted into the X-axis linear rail 351 and mounted on the holding table 34 The X-axis coil movable member 352 of 32 is constituted. The X-axis linear rail 351 is formed by, for example, interchanging the N pole and the S pole of a plurality of cylindrical permanent magnets to form a shaft shape, and arranging the plurality of permanent magnets constituting the shaft shape in a non-magnetic material such as stainless steel. It is composed of a cylindrical casing. The X-axis linear rails 351 thus configured are attached to the support members 353 and 353 at both end portions thereof as shown in FIG. 2, and are attached to the stationary base 2 via the support members 353 and 353. The machining feed means 35 composed of the X-axis linear rail 351 and the X-axis coil movable member 352 constitutes a so-called linear drive shaft motor, and when the X-axis coil movable member 352 flows a current, the attraction force due to the magnetic force is repeated, The reaction force generates thrust. Therefore, the direction in which the X-axis coil movable member 352 moves along the X-axis linearity rail 351 can be changed by changing the direction of the current applied to the X-axis coil movable member 352. In this way, the processing feed means 35 constituted by the so-called linear drive shaft motor has a configuration in which the X-axis coil movable member 352 can be inserted so as to be slidable on the X-axis linear rail 351, so that the configuration is simple. The contact is driven, so it will not wear out and the maintenance is extremely simple. Further, since the machining feed means 35 constituted by the so-called linear drive shaft motor does not use the ball screw mechanism as in the conventional feed mechanism, the number of parts can be reduced, the manufacturing cost can be reduced, and the size of the apparatus can be reduced. In addition, when cutting is performed by the cutting mechanism 4 to be described later, when the holding table 34 holding the workpiece is subjected to the machining feed, the yaw is suppressed, so that the cutting can be improved. Cutting accuracy. The processing feed means 35 is configured such that the moving base 32 on which the holding table 34 is disposed moves between the workpiece attachment/detachment area shown in FIG. 2 and the processing area in which the cutting mechanism 4 is disposed.

Next, the above-described cutting mechanism 4 will be described.

The cutting mechanism 4 includes a door type support frame 41 that is fixed to the stationary base 2. The door type support frame 41 is composed of a first column portion 411 and a second column portion 412 which are disposed at intervals, and connects the upper ends of the first column portion 411 and the second column portion 412, and The supporting portion 413 disposed in the indexing feeding direction (Y-axis direction) indicated by the arrow Y in the processing feed direction indicated by the arrow X is disposed to span the two X-axis guide rails 31.

In FIGS. 1 and 2 constituting the support portion 413 of the door type support frame 41, a first cutting means 5a and a second cutting means 5b are disposed on the back side. The first cutting means 5a and the second cutting means 5b will be described with reference to Figs. 3 and 4 . Each of the first cutting means 5a and the second cutting means 5b includes an index moving base 51, a depth-cut moving base 52, and a rotating shaft unit 53, respectively. The indexing moving base 51 of the indexing moving base 51 and the second cutting section 5b of the first cutting means 5a is provided with two Y axes which are respectively disposed on the left side in FIG. 4 of the supporting portion 413 The guide grooves 511 and 511 to which the guide rails 413a and 413a are fitted are fitted to the two Y-axis guide rails 413a and 413a by the guide grooves 511 and 511, and the indexing movement base 51 is configured to be able to The root Y-axis guides 413a, 413a move. Further, on the surface of one of the indexing moving base 51 of the indexing moving base 51 and the second cutting means 5b of the first cutting means 5a, a surface is formed A concave portion 513 of an indexing means to be described later is provided. Further, on the other surface of the index moving base 51 of the first cutting means 5a and the indexing moving base 51 of the second cutting means 5b, respectively, as indicated by an arrow Z as shown in FIG. A pair of guide rails 512, 512 (only one of the guide rails is shown in Fig. 4) is provided in the divided feed direction.

The depth-of-cut moving base 52 of the first cutting means 5a and the depth-cutting moving base 52 of the second cutting means 5b are supported by the support portion 521 extending in the up-and-down direction, respectively, and from the lower end of the supported portion 521 And a horizontally extending mounting portion 522. As shown in FIG. 4, a surface of the supported portion 521 on the side of the mounting portion 522 is provided with a pair of Z-axis guides 512, 512 provided on the other surface of the index moving base 51. Guide grooves 523 and 523 (only one of the guided grooves is shown in FIG. 4), and the guided grooves 523 and 523 are fitted to the two Z-axis guides 512 and 512 to cut the depth of the base. The 52 is configured to be movable along the two Z-axis guides 512, 512 in the depth-feeding direction indicated by the arrow Z. As shown in FIGS. 1 and 2, the mounting portion 522 is configured to protrude to the lower portion of the support portion 413 constituting the door type support frame 41, as shown in FIGS. 1 and 2. side.

The above-described rotating shaft units 53 are respectively mounted below the mounting portion 522 of the depth-cut moving base 52 forming the first cutting means 5a and the second cutting means 5b. As shown in FIGS. 3 and 4, the spindle unit 53 of the first cutting means 5a and the spindle unit 53 of the second cutting means 5b are provided with a spindle housing 531 rotatably supported by the spindle housing. a rotating mandrel 532 of the casing 531, and is mounted to one end of the rotating mandrel 532 The cutting blade 533 and the non-illustrated servo motor that rotationally drives the cutting water supply pipe 534 and the rotating main shaft 532 that supply the cutting water, the axial direction of the rotating main shaft 532 is along the indexing feeding direction indicated by the arrow Y And is assigned. Further, the cutting blade 533 constituting the rotating shaft unit 53 of the first cutting means 5a and the cutting blade 533 constituting the rotating unit 53 of the second cutting means 5b are disposed to face each other.

The first cutting means 5a and the second cutting means 5b in the illustrated embodiment are provided such that the indexing moving bases 51, 51 are along the two Y-axis guides 413a, 413a as shown in FIG. On the other hand, the index feeding means 54 is moved in the indexing feed direction (Y-axis direction) indicated by the arrow Y. The indexing feed means 54 is movably inserted into the common Y-axis linear track 540 by a common Y-axis linear track 540 disposed along the two Y-axis guide rails 413a, 413a. The first Y-axis coil movable member 544a of the indexing moving base 51 of the first cutting means 5a is attached to the second cutting means 5b which is movably inserted into the common Y-axis linear track 540. The second Y-axis coil movable member 544b of the moving base 51 is indexed. The common Y-axis linear track 540 is formed by, for example, interchanging the N pole and the S pole of a plurality of cylindrical permanent magnets to form a shaft shape, and arranging the plurality of permanent magnets constituting the shaft shape in a non-magnetic material such as stainless steel. The cylindrical casing is configured to be constructed. The Y-axis linear rails 540 having the same configuration are attached to the support members 543 and 543 at both end portions thereof as shown in FIG. 3, and are attached to the support portion 413 of the support frame 41 via the support members 543 and 543. a first coil that is insertably inserted into the common Y-axis linear track 540 in a movable manner The movable member 544a and the second coil movable member 544b are respectively disposed on the indexing moving base 51 of the first cutting means 5a and the concave portion 513 of the indexing moving base 51 of the second cutting means 5b, and are respectively mounted on the indexing The surface of one of the bases 51 is moved.

As described above, the indexing feed means 54 composed of the common Y-axis linearity rail 540 and the first coil movable member 544a and the second coil movable member 544b, and the X-axis linear rail 361 and the X-axis coil movable member The machining feed means 35 constituted by 362 is the same, and constitutes a so-called transmission shaft motor. When current flows into the first coil movable member 544a and the second coil movable member 544b, the attraction force and the reaction force due to the magnetic force are repeated to generate the thrust. . Therefore, the first coil movable member 544a and the second coil movable member 544b can be changed along the common Y-axis linearity 540 by changing the direction of the current applied to the first coil movable member 544a and the second coil movable member 544b. The direction of movement. In this way, the indexing feed means 54 formed by the so-called drive shaft motor is inserted into the first coil movable member 544a and the second coil movable member 544b so as to be slidable in the common Y-axis linearity rail 540. The structure is simple, and since it is driven by non-contact, it is not worn and the maintenance is extremely simple. Further, since the index feed means 54 constituted by the so-called linear drive shaft motor uses the ball screw mechanism as compared with the conventional feed mechanism, the number of parts can be reduced and the manufacturing cost can be reduced.

Further, in the illustrated embodiment, the first cutting means 5a and the second cutting means 5b are provided as shown in Figs. 3 and 4, so that the indexing moving bases 52, 52 are provided along two. Z-axis guide 512, 512 Further, the depth-of-depth means 55, 55 are moved in the depth-feeding direction (Z-axis direction) indicated by the arrow Z. The deep-cut feeding means 55, 55 are a male screw 551 which is disposed in parallel with the two Z-axis guides 512, 512, and a bearing 522 which rotatably supports one end of the male screw 551, and is coupled to The other end of the male screw 551 is formed by a pulse motor 553 that causes the male screw 551 to rotate forward or reverse. The deep-feeding means 55, 55, which are configured as such, are screwed together with the female screw 521a formed on the supported portion 521 of the deep-depth moving base 52, respectively. Therefore, the depth-feeding means 55, 55 can drive the male screw 551 forward or reverse by the drive pulse motor 553, respectively, so that the depth-of-cutting moving base 52 is along the two Z-axis guides 512, 512 in FIG. Move in the depth-feed direction (Z-axis direction) indicated by the arrow Z.

As will be described with reference to FIG. 1, the stationary base 2 includes a cassette mounting mechanism 6 on which a cassette 60 for storing a plurality of workpieces such as semiconductor wafers is placed, and is placed on the cassette mounting mechanism 6. When the cassette 60 carries out the workpiece, the workpiece to be processed is carried into the loading and unloading mechanism 7 of the cassette 60, and the temporary placement mechanism 8 for the workpiece to be carried out by the loading and unloading mechanism 7 is temporarily placed. An auxiliary temporary placement mechanism 9 disposed adjacent to the temporary placement mechanism 8 and a cleaning mechanism 10 for cleaning the workpiece after cutting. The cassette mounting mechanism 6 causes the cassette 60 to be placed on the cassette 61 that is lifted and lowered by a lifting means (not shown). The semiconductor wafer W adhered to the surface of the dicing tape T attached to the annular frame F is housed in the cassette 60. Further, on the outer circumference of the annular frame F, a groove F.1 and a plane F.2 in which the restriction pin is engaged will be provided.

As shown in FIG. 1, the carry-out/loading mechanism 7 is a transport moving means 71 disposed on the surface side of the support portion 413 constituting the door type support frame 41, and the transport moving means 71 is in the Y-axis direction. The moving support base 72 is constituted by a connecting member 73 that connects the support base 72 and the transport moving means 71. The transport moving means 71 is constituted by a conveyor mechanism that moves the connecting member 73 that connects the support base 72 in the Y-axis direction. As will be described with reference to FIGS. 5 and 6, the holding member 74 (see FIG. 6) is attached to the support base 72 constituting the carry-out/loading mechanism 7, and is placed on the lower side for holding the dicing tape. T supports the annular frame F of the semiconductor wafer W placed on the cassette 60 of the cassette mounting mechanism 6; the cylinder 740 is configured to move the holding member 74 in the up and down direction; and a pair The restriction pin 75 is disposed on both sides of the grip member 74 and is engaged with the groove F.1 and the plane F.2 provided in the annular frame F to restrict the annular frame F to a predetermined position. . The loading and unloading mechanism 7 is configured such that the support base 72 moves toward the cassette 60 placed on the cassette mounting mechanism 6, and the pair of restriction pins 75 are disposed between the cutting tapes T and the cutting tape T. The groove F.1 and the plane F.2 which support the annular frame F of the semiconductor wafer W accommodated in the cassette 60 are engaged, and the position of the semiconductor wafer W is restricted to a predetermined position. Further, the grip member 74 is moved upward by the cylinder 740, whereby the annular frame F is held between the support base 72 and the grip member 74.

Further, the support base 72 constituting the carry-out and carry-in mechanism 7 is attached with an auxiliary grip member 76 (see FIG. 6), which is disposed on the lower side, and is supported by the dicing tape T for support. Half An annular frame F of the conductor wafer W; a cylinder 760 for moving the auxiliary holding member 76 in the up and down direction; and a pair of auxiliary limiting pins 77 disposed on both sides of the auxiliary holding member 76 and The annular frame F is engaged with the annular frame F to restrict the annular frame F to a predetermined position. Further, the supporting base 72 constituting the loading/unloading mechanism 7 is provided with an engaging means 78 that selectively engages with the injection nozzle of the cleaning mechanism to be described later. The engagement means 78 is constituted by an engagement lever 781 that is disposed to be movable forward and downward below the support base 72, and a cylinder 782 that moves the engagement lever 781 forward and backward.

The temporary placement mechanism 8 will be described with reference to Figs. 1, 7, and 8. The temporary placement mechanism 8 is disposed adjacent to the cassette mounting mechanism 6 in the Y-axis direction and disposed directly above the workpiece attachment/detachment area of the holding table 34. The temporary placement mechanism 8 includes a pair of support rails 80 extending in the Y-axis direction, having bottom portions 81a and 81b that support both side portions of the annular frame F, and side portions 82a and 82b, and configured to constitute a bottom portion 81a. 81b is switchable; and switching means 85a, 85b for switching the bottom portions 81a, 81b of the pair of support rails 80; and lifting means 86 for moving the pair of support rails 80 in the up and down direction. Further, flange portions 83a and 83b projecting from the inside are provided at the upper ends of the side portions 82a and 82b constituting the pair of support rails 80. The flange portions 83a and 83b are connected to each other by the joint portion 84. The switching means 85a, 85b are formed in the illustrated embodiment, and the bottom portions 81a, 81b of the pair of support rails 80 are respectively moved to the closed position of the horizontal position indicated by the solid line in Fig. 8 and The two-point chain line indicates the open position of the vertical position Set. The elevating means 86 is constituted by a cylinder 861 attached to a fixing member (not shown), and the piston rod 862 of the cylinder 861 is coupled to the connecting portion 84 of the pair of supporting rails 80.

The auxiliary temporary placement mechanism 9 is disposed adjacent to the temporary placement mechanism 8 in the Y-axis direction and is disposed directly above the cleaning mechanism 10 to be described later on the side opposite to the Y-axis direction with respect to the cassette mounting mechanism 6. . The auxiliary temporary placement mechanism 9 has the same configuration as the temporary placement mechanism 8, and includes a pair of auxiliary support rails 90 extending in the Y-axis direction and having both sides supporting the annular frame F as shown in FIG. The bottom portions 91a, 91b, and the side portions 92a, 92b, and configured to be able to open and close the bottom portions 91a, 91b; and the switching means 95a, 95b for switching the bottom portions 91a, 91b of the pair of auxiliary support rails 90; The means 96 moves the pair of auxiliary support rails 90 in the up and down direction. Further, at the upper ends of the side portions 92a, 92b constituting the pair of auxiliary support rails 90, flange portions 93a, 93b which are protruded from the inner side are provided, and the flange portions 93a and 93b are connected to each other by the joint portion 94. . The above-described switching means 95a, 95b are constituted by cylinders in the illustrated embodiment, and the bottoms 91a, 91b of the pair of auxiliary support rails 90 are respectively moved to the closed position of the horizontal position and the open position of the vertical position. The lifting/lowering means 96 is constituted by a cylinder 961 attached to a fixing member (not shown), and the piston rod 962 of the cylinder 961 is coupled to the connecting portion 94 of the pair of auxiliary supporting rails 90.

Next, the cleaning mechanism 10 will be described with reference to FIGS. 1 and 9 .

The cleaning mechanism 10 in the illustrated embodiment and the temporary placement machine described above The structures 8 are adjacent to each other and are disposed on the side opposite to the Y-axis direction with respect to the cassette mounting mechanism 6. The cleaning mechanism 10 is provided with a cleaning cover 11. The cleaning cover 11 is composed of a front wall 111 and a rear wall 112, side walls 113 and 114, and a bottom wall (not shown), and the upper portion is opened. A rotary table 12 is disposed in such a cleaning cover 11 . The rotary table 12 is composed of a platform body 121, an adsorption jig 122 disposed above the platform body 121, and a servo motor 123 for rotationally driving the platform body 121. The stage body 121 is formed to have an outer diameter larger than the outer diameter of the wafer W and smaller than the inner diameter of the annular frame F supporting the wafer W via the dicing tape T. The adsorption jig 122 is formed by porous ceramics, and is connected to a suction means (not shown) to appropriately apply a negative pressure. Therefore, the workpiece to be placed on the adsorption jig 122 is sucked and held by the suction jig 122 by being actuated by a suction means (not shown).

When the description is continued with reference to FIGS. 1 and 9, the wall 111 is provided with a guide hole 111a formed along the Y-axis direction before the cover 11 is cleaned, and the guide hole 111a is movable in the Y-axis direction. In the embodiment, the injection nozzle 13 that sprays the washing water to the workpiece held by the rotary table 12 is disposed. The other end of the wire 15 connected to the hammer body 14 at one end via the pulley 16 is connected to the injection nozzle 13, and is configured to move in the direction indicated by the arrow Y1 by the gravity of the hammer 14. Further, in the injection nozzle 13, the engagement means 78 disposed on the support base 72 constituting the carry-out and carry-in mechanism 7 is disposed so as to be able to advance and retreat so as to be disposed below the lower surface of the support base 72. In the state in which the engagement lever 781 is moved in and out, it is indicated by an arrow Y1 which is moved by the gravity of the hammer 14 in the injection nozzle 13. The direction makes contact. Further, the injection nozzle 13 is connected to a washing water supply means (not shown).

The cutting device in the embodiment shown in the drawings is configured as described above, and the operation thereof will be described below.

First, as shown in FIG. 10, the cylinder 861 of the temporary placement mechanism 8 is actuated to position the pair of support rails 80 at the upper position, and the holding member 74 (see FIG. 6) for carrying out the loading and unloading mechanism 7 is disposed. The support base 72 of the pair of restriction pins 75 (see FIGS. 5 and 6) is positioned at the standby position shown.

Then, the conveyance means 71 (see FIGS. 1 and 5) of the carry-out and carry-in mechanism 7 is actuated, and as shown in FIG. 11, the support base 72 in which the holding member 74 and the pair of restricting pins 75 are disposed is moved to The cassette mounting mechanism 6 side is provided with a pair of restriction pins 75 (see FIGS. 5 and 6) and an annular frame F provided to support the semiconductor wafer W accommodated in the cassette 60 via the dicing tape T. The groove F.1 and the plane F.2 (see FIG. 1) are engaged, whereby the position of the semiconductor wafer W is restricted to a predetermined position. Further, by actuating the cylinder 740, the annular frame F is held between the support base 72 and the grip member 74 (see Fig. 6).

When the annular frame F is gripped by the support base 72 and the grip member 74, the transporting means 71 of the carry-out and carry-in mechanism 7 is actuated to move the support base 72 to the side opposite to the cassette mounting mechanism 6, and As shown in Fig. 12, the annular frame F is transported to the support rail 80 of one of the temporary placement mechanisms 8 for temporary placement.

If the annular frame F is transported to one of the temporary placement mechanisms 8 When the rail 80 is supported, as shown in Fig. 13, the cylinder 861 is actuated to lower the pair of support rails 80 and positioned at the lower position. As a result, the dicing tape T attached to the annular frame F and pasted on the semiconductor wafer W is placed on the upper surface of the holding table 34 which is positioned at the workpiece detaching position in the holding stage mechanism 3. Further, the switching means 85a, 85b (see Figs. 6 and 8) are actuated to position the bottom portions 81a, 81b of the pair of support rails 80 in a closed position indicated by a solid line in Fig. 8 by a two-dot chain line. The open position.

Next, by moving the suction means (not shown), as shown in FIG. 14, the semiconductor wafer W is sucked and held by the dicing tape T on the upper surface of the holding stage 34. Then, the cylinder 851 of the temporary placement mechanism 8 is actuated to raise the pair of support rails 80 to be positioned at the upper position.

As shown in FIG. 14, the semiconductor wafer W is sucked and held on the holding table 34 via the dicing tape T, and the processing feed means 35 constituting the holding stage mechanism 3 is actuated to suck and hold the semiconductor wafer W. The holding table 34 is moved to a processing area in which the cutting mechanism 4 is disposed as shown in FIG. Further, the semiconductor wafer W held by the holding stage 34 is subjected to a predetermined cutting process by the first cutting means 5a and the second cutting means 5b. In addition, since the holding stage 34 is formed to have an outer diameter larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the annular frame F as described above, the annular frame F is slightly sagged by its own weight, and does not interfere in the cutting process. The cutting blade 533 of the first cutting means 5a and the second cutting wrist 5b does not require a frame pressing mechanism, thereby reducing the cost.

As described above, if the semiconductor is held in the holding stage 34 When the wafer W is subjected to a predetermined cutting process, the machining feed means 35 is actuated to position the holding table 34 for sucking and holding the cut semiconductor wafer W at the workpiece attachment/detachment position shown in FIG. In this state, the semiconductor wafer W that has been cut by the holding stage 34 is positioned directly below the temporary placement mechanism 8.

If the semiconductor wafer W held by the holding stage 34 is positioned directly under the temporary placement mechanism 8, the state in which one of the temporary placement mechanisms 8 is positioned at the bottom 81a, 81b of the support rail 80 is in the open position. Next, the cylinder 861 is actuated, and as shown in Fig. 17, the pair of support rails 80 are lowered to be positioned at the lower position. Further, the bottom portions 81a, 81b of the pair of support rails 80 are positioned at the closed position to support the annular frame F, and the suction holding of the semiconductor wafer W by the holding table 34 is released.

Next, the cylinder 861 of the temporary placement mechanism 8 is actuated to raise one of the support annular frames F to the support rail 80, and as shown in Fig. 18, the holding member 74 of the loading and unloading mechanism 7 is slightly lower than the upper position. And a pair of restraining pins 75 position the pair of support rails 80 at intermediate positions that are movable above the cut semiconductor wafer W supported by the pair of support rails 80.

Then, the conveyance means 71 of the carry-out/loading mechanism 7 is actuated, and as shown in Fig. 19, the support base 72 is moved to the side of the cassette mounting mechanism 6, and a pair of restriction pins 75 are provided (see Fig. 5 and Fig. 5). 6) a groove F.1 and a plane F.2 (see FIG. 1) provided in the annular frame F of the semiconductor wafer W accommodated in the cassette 60 via the dicing tape T The engagement is performed to limit the position of the semiconductor wafer W to a predetermined position. Further, by actuating the cylinder 740, the annular frame F supporting the new semiconductor wafer W is held between the support base 72 and the grip member 74 (see Fig. 6). At this time, the grip member 74 and the pair of restriction pins 75 move over the semiconductor wafer W after cutting.

Next, the cylinder 851 of the temporary placement mechanism 8 is actuated to position one of the support-cut semiconductor wafers W to the upper position of the support rail 80, and the support in the annular frame F supporting the semiconductor wafer W is loaded. The end face on the side of the mechanism 6 is positioned at a position facing the pair of auxiliary restricting pins 77. Thereafter, the transporting means 71 of the carry-out and carry-in mechanism 7 is actuated, and as shown in FIG. 20, by supporting the support base 72 to the side opposite to the cassette mounting mechanism 6, the support is supported by the support base 72 and The annular frame F of the new semiconductor wafer W held by the grip member 74 is transported to the support rail 80 of the temporary placement mechanism 8 while the semiconductor wafer W is supported by the pair of auxiliary limiting pins 77. The annular frame F is transported to one of the auxiliary temporary placement mechanisms 9 to the auxiliary support rail 90.

When the annular frame F supporting the semiconductor wafer W is transported to the auxiliary support rail 90, as shown in FIG. 21, the cylinder 961 is actuated to lower the pair of auxiliary support rails 90. , positioned in the lower position. In this state, the dicing tape T attached to the annular frame F and having the semiconductor wafer W adhered thereto is in contact with the upper surface of the rotary table 12 of the cleaning mechanism 10. Moreover, by positioning the bottoms 91a, 91b of the pair of auxiliary support rails 90 from the closed position in the open position The cut semiconductor wafer W is placed on the upper surface of the turntable 12 via the dicing tape T. Further, by moving the suction means (not shown), the cut semiconductor tape W is sucked and held on the upper surface of the turntable 12 via the dicing tape T.

Next, one of the pair of support rails 80 and one of the auxiliary temporary placement mechanisms 9 is positioned in the upper position as shown in FIG. 22(a), and the rotary table 12 is rotated as shown in FIG. 22(a). As shown in FIG. 22(b), the washing water 130 is sprayed from the injection nozzle 13 by operating the washing water supply means (not shown). At this time, the engagement lever 781 of the engagement means 78 disposed on the support base 72 of the carry-out/loading mechanism 7 is moved in and out of engagement with the injection nozzle 13, and the conveyance means 71 is actuated to cause the card to be activated. The closing lever 781 reciprocates in the Y-axis direction. Therefore, the gravity of the hammer body 14 coupled to one end of the wire 15 connected to the injection nozzle 13 cooperates to reciprocate the injection nozzle 13 in the Y-axis direction. Further, the reciprocating range of the injection nozzle 13 may be at least from the outer circumference to the center of the semiconductor wafer W after cutting. As a result, the semiconductor wafer W that has been sucked and held by the rotating tape 12 via the dicing tape T is spin-washed. In addition, in the reciprocating movement in the Y-axis direction of the injection nozzle 13, the carry-out and carry-in mechanism 7 serves as a drive source, so that the size can be reduced and the cost can be reduced. Further, since the rotating table 12 is formed to have an outer diameter larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the annular frame F as described above, the annular frame F is supplied to the semiconductor crystal by a slight sag of its own weight. The washing water of the circle W is discharged smoothly, and the frame pushing mechanism is not required, thereby reducing the cost.

As described above, when the semiconductor wafer W that has been cut is cleaned, as shown in FIG. 23, the carry-out and carry-in mechanism 7 is positioned at the standby position, and at the same time, one of the auxiliary temporary placement mechanisms 9 is configured as an auxiliary support rail. The bottom portions 91a, 91b of the 90 are positioned at the lower position in the state of being in the open position, and the bottom portions 91a, 91b are brought into the closed position to support the annular frame F for supporting the cleaned semiconductor wafer W. Further, the suction holding of the semiconductor wafer W by the turntable 12 is released.

Next, as shown in FIG. 24, one of the auxiliary temporary placement mechanisms 9 supporting the annular frame F of the cleaned semiconductor wafer W is positioned at the upper position on the auxiliary support rail 90. Then, the auxiliary grip member 76 disposed on the support base 72 of the carry-out and carry-in mechanism 7 is actuated to grip the annular frame F.

Then, the transporting means 71 of the carry-out and carry-in mechanism 7 is actuated, and as shown in FIG. 25, the annular frame F supporting the cleaned semiconductor wafer W is supplied from the auxiliary temporary placement mechanism 9 to the auxiliary support rail 90. Move to one of the pair of temporary placement mechanisms 8 to support the track 80.

Next, as shown in FIG. 26, one of the temporary placement mechanisms 8 is positioned at the intermediate position with respect to the support rail 80, and the holding member 74 and the pair of restriction pins that are disposed on the support base 72 of the carry-out and carry-in mechanism 7 are disposed. 75 is positioned in the standby position.

Then, the conveyance means 71 of the carry-out/loading mechanism 7 is actuated, and as shown in Fig. 27, the support base 72 is moved to the side of the cassette mounting mechanism 6, and the holding member 74 and the pair of restriction pins 75 are moved from the standby position. Moving to the cassette 60 placed on the cassette mounting mechanism 6, thereby supporting The annular frame F of the cleaned semiconductor wafer W is housed in the cassette 60.

Further, as described above, when the semiconductor wafer W that has been cleaned is cleaned and stored in the cassette 60, the cassette 60 is carried out from the cassette 60 to the support rail 80 of the temporary placement mechanism 8. The new semiconductor wafer W is transported to the holding stage 34 constituting the holding stage mechanism 3 as described above and is sucked and held. Further, the new semiconductor wafer W sucked and held by the holding stage 34 is moved by the processing feed means 35 to the processing area where the cutting mechanism 4 is disposed, and by the first cutting means 5a and the second cutting means 5b The specified cutting process is applied.

As described above, the cutting device in the embodiment shown in the figure is supported by the loading and unloading mechanism 7 while being held by the cutting tape T when the holding table 34 holding the workpiece is positioned in the workpiece attaching and detaching area. The annular frame F of the semiconductor wafer W accommodated in the cassette 60 is temporarily placed on one of the pair of support rails 80 constituting the temporary placement mechanism 8, and the pair of support rails 80 are lowered by the lifting means 86 to be cut by the gap The semiconductor wafer W supported on the ring frame F by the tape T is placed on the holding table 34, and the bottom portions 81a, 81b are opened by the switching means 85a, 85b, whereby the semiconductor wafer W is held by the dicing tape T. Since the holding means 34 is provided, the transport means for transporting the annular frame F as the semiconductor wafer W as the workpiece via the dicing tape T is substantially only the carry-out and carry-in mechanism 7, so that the number of parts can be reduced and the cost can be reduced. The device is miniaturized. Further, the carry-out/loading mechanism 7 has a ring shape in which the semiconductor wafer W that has been cut by the dicing tape T is supported by the auxiliary temporary placement mechanism 9 disposed directly above the turntable 12 of the cleaning mechanism 10. Frame F Therefore, it is possible to further reduce the size of the device.

5a‧‧‧First cutting means

5b‧‧‧Second cutting means

51‧‧‧Division mobile abutments

511‧‧‧ Guide groove

513‧‧‧ recess

52‧‧‧Deep depth mobile abutment

521‧‧‧Supported Department

522‧‧‧Installation Department

53‧‧‧ shaft unit

531‧‧‧X-axis housing

532‧‧‧Rotating mandrel

533‧‧‧Cutter

534‧‧‧Cutting water supply pipe

54‧‧‧Divided feeding means

540‧‧‧Common Y-axis orbit

543‧‧‧Support members

544a‧‧‧First Y-axis coil movable parts

544b‧‧‧second coil movable parts

55‧‧‧Deep-deep means

553‧‧‧pulse motor

Claims (7)

A cutting device includes: a cassette mounting mechanism that mounts a cassette in which a plurality of workpieces are stored, and a loading and unloading of the workpiece from the cassette placed on the cassette mounting mechanism And a temporary placement mechanism for temporarily storing the workpiece to be carried out by the loading and unloading mechanism, and a holding table for holding the workpiece temporarily placed in the temporary placement mechanism, and feeding the holding table in the processing a machining feed mechanism that moves in a direction (X-axis direction), a first cutting means and a second cutting means that apply a cutting process to the workpiece held by the holding table, and the first cutting means and the second cutting means The indexing feed mechanism that moves the cutting means in the indexing feed direction (Y-axis direction) orthogonal to the X-axis direction, wherein the cutting device is characterized in that the first cutting means and the second cutting means respectively have: a base, and a cutting blade respectively disposed on the moving base and disposed on the same axis, the moving base of the first cutting means and the moving base of the second cutting means are supported to be capable of being Along the Y axis Moving on the Y-axis guide rail that is disposed, the indexing feed means is a common Y-axis linear track disposed along the Y-axis guide rail, and is movably inserted into the Y-axis linearity a first coil movable member that is mounted on the moving base of the first cutting means, and a movable base that is movably inserted in the Y-axis linear track and mounted on the second cutting means The second coil movable member is constructed. A cutting device as recited in claim 1, wherein The machining feed mechanism is movably supported between the object loading and unloading area in which the temporary placing mechanism is disposed, and the processing area in which the first cutting means and the second cutting means are disposed An X-axis guide rail on which the moving base of the holding table is disposed; an X-axis linear track disposed along the X-axis guide rail, and a movably mounted to the X-axis linear track and mounted on The X-axis coil movable member of the moving base is formed. The cutting device according to claim 2, wherein the cassette mounting mechanism and the temporary placement mechanism are disposed adjacent to each other in the Y-axis direction, and the carry-out and carry-in mechanism includes a support base; a support base, a grip member that holds the workpiece accommodated in the cassette, a pair of restriction pins that restrict the workpiece to a predetermined position, and a transport moving means for moving the support base in the Y-axis direction, The temporary placement mechanism has a bottom portion and a side portion extending in the Y-axis direction and supporting both sides of the workpiece, and the bottom portion is configured to be capable of switching one of the pair of support rails; and switching the bottom of the pair of support rails And a lifting means for moving the pair of supporting rails in the vertical direction, and when the holding table is positioned in the workpiece attaching and detaching area, the loading and unloading mechanism is carried out and stored in the cassette The workpiece is temporarily placed on the pair of support rails constituting the temporary placement mechanism, and the pair of support rails are lowered by the lifting means to place the workpiece on the holding table, and the switch is mounted by the switch The means opens the bottom to hold the workpiece at the holding table. A cutting device as recited in claim 3, wherein A cleaning mechanism including a rotary table for washing the workpiece is disposed on a side opposite to the Y-axis direction with respect to the cassette mounting mechanism so as to be adjacent to the temporary placement mechanism, and the cleaning is performed at the same time. An auxiliary temporary placement mechanism configured to be in communication with the temporary placement mechanism and temporarily placing the workpiece is disposed directly above the mechanism, the auxiliary temporary placement mechanism having: extending in the Y-axis direction and having both sides supporting the workpiece a bottom portion and a side portion, and the bottom portion is configured to be a pair of auxiliary support rails; and a switching means for switching the bottom of the pair of auxiliary support rails; and an auxiliary lifting for moving the pair of auxiliary supporting rails in the up and down direction means. The cutting device according to claim 4, wherein the loading and unloading mechanism includes: a holding member disposed on the supporting base and held by the workpiece supported by the pair of auxiliary supporting rails, and the holding member The auxiliary grip member in the region on the opposite side of the gripped area and the pair of auxiliary restricting pins that are to be supported by the pair of auxiliary support rails at a predetermined position are held by the workpiece to be cut. When the holding table is positioned in the workpiece dismounting area, the pair of supporting rails are lowered to position the bottom portion in the state in which the bottom of the pair of supporting rails constituting the temporary placing mechanism is opened. After the lower portion of the workpiece is finished, the pair of support rails are raised in a state in which the bottom portion is closed to support the workpiece to be cut, and then the grip member is held by the carry-out and carry-in mechanism. The workpiece to be processed at the same time, which will be placed on the support base Positioning the auxiliary limiting pin on the end face of the region on the opposite side of the region to be gripped by the holding member, and by moving the supporting base to the auxiliary temporary placing mechanism side The workpiece accommodated in the cassette is positioned in the temporary placement mechanism, and the cut workpiece is positioned in the auxiliary temporary placement mechanism, and then temporarily placed in the auxiliary lifting mechanism constituting the auxiliary temporary placement mechanism The pair of auxiliary support rails, and the pair of auxiliary support rails are lowered by the lifting means to place the workpiece on the rotating table of the cleaning mechanism, and the bottom portion is opened by the switching means to complete the cutting The workpiece is held on the rotary table. The cutting device according to claim 4, wherein the cleaning mechanism includes an injection nozzle for spraying the washing water disposed above the rotary table, and the injection nozzle is disposed to constitute the loading and unloading The engaging means for selectively supporting the base of the mechanism moves in the Y-axis direction as the support base moves, and at least the washing water is sprayed from the outer circumference to the center of the workpiece. The cutting device according to claim 6, wherein the injection nozzle of the cleaning mechanism is connected to the other end of the wire connected to the hammer body via a pulley, and is configured to move in the Y-axis direction by the gravity of the hammer body. The engagement means includes an engagement lever that is disposed on the support base so as to be able to advance and retreat, and the direction in which the engagement rod moves in the state in which the engagement lever moves in and out of the injection nozzle by the gravity of the weight contact.