JP7233813B2 - processing equipment - Google Patents

processing equipment Download PDF

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JP7233813B2
JP7233813B2 JP2018227441A JP2018227441A JP7233813B2 JP 7233813 B2 JP7233813 B2 JP 7233813B2 JP 2018227441 A JP2018227441 A JP 2018227441A JP 2018227441 A JP2018227441 A JP 2018227441A JP 7233813 B2 JP7233813 B2 JP 7233813B2
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workpiece
cassette
guide rail
moving
contact
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JP2020092143A (en
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云峰 楊
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Disco Corp
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Description

本発明は、板状の被加工物の加工に用いられる加工装置に関する。 The present invention relates to a processing apparatus used for processing a plate-like workpiece.

基板上に実装された複数のデバイスチップを樹脂層（モールド樹脂）で被覆した樹脂パッケージ基板や、半導体ウェーハに形成された複数のデバイスを樹脂層で被覆したＷＬ－ＣＳＰ（Wafer Level Chip Size Package）等に代表される各種のパッケージ基板を分割することにより、パッケージデバイスが製造される。このパッケージデバイスは、携帯電話やパーソナルコンピュータに代表される様々な電子機器に内蔵される。 A resin package substrate in which multiple device chips mounted on a substrate are coated with a resin layer (mold resin), and a WL-CSP (Wafer Level Chip Size Package) in which multiple devices formed on a semiconductor wafer are coated with a resin layer. A package device is manufactured by dividing various package substrates represented by, for example. This package device is incorporated in various electronic equipment represented by mobile phones and personal computers.

パッケージ基板の分割は、パッケージ基板を加工する加工装置を用いて実施される。例えば加工装置として、パッケージ基板を保持するチャックテーブルと、パッケージ基板を切削する円環状の切削ブレードが装着される切削ユニットとを備える切削装置が用いられる。また、近年では、チャックテーブルによって保持されたパッケージ基板に向かってレーザービームを照射するレーザー照射ユニットを備えたレーザー加工装置を用いて、パッケージ基板を分割する手法も用いられている。 The division of the package substrate is performed using a processing apparatus that processes the package substrate. For example, as a processing apparatus, a cutting apparatus is used that includes a chuck table that holds a package substrate and a cutting unit to which an annular cutting blade for cutting the package substrate is mounted. In recent years, a method of dividing a package substrate using a laser processing apparatus having a laser irradiation unit that irradiates a laser beam toward a package substrate held by a chuck table has also been used.

パッケージ基板等の被加工物を加工装置によって加工する際には、複数の被加工物を収容可能なカセットが加工装置に載置される。そして、加工装置が備える搬送ユニットによって、加工前の被加工物がカセットから搬出され、また、加工後の被加工物がカセットへ搬入される。例えば特許文献１には、挟持部（クランプ）によって被加工物の端部を挟持し、被加工物をカセットから搬出する搬送ユニットを備えた切削装置が開示されている。 2. Description of the Related Art When a workpiece such as a package substrate is processed by a processing apparatus, a cassette capable of accommodating a plurality of workpieces is mounted on the processing apparatus. Then, the unprocessed workpiece is unloaded from the cassette and the processed workpiece is loaded into the cassette by a transport unit provided in the processing apparatus. For example, Japanese Patent Laid-Open No. 2002-200000 discloses a cutting device that includes a conveying unit that clamps the end of a workpiece with a clamping portion (clamp) and transports the workpiece out of a cassette.

特開２０１４－２０４０２０号公報JP 2014-204020 A

被加工物には、その製造工程において反りが発生する場合がある。例えば、パッケージ基板を製造する際に樹脂層を硬化させるための加熱処理を行うと、樹脂層が収縮してパッケージ基板に反りが生じることがある。このような被加工物を加工装置によって加工する場合、反った状態の被加工物がカセットに収容される。 A workpiece may warp during its manufacturing process. For example, if a heat treatment is performed to cure a resin layer when manufacturing a package substrate, the resin layer may shrink and warp the package substrate. When such a workpiece is processed by a processing apparatus, the warped workpiece is accommodated in a cassette.

被加工物をカセットから搬出する際、反った状態の被加工物の端部を、例えば一対の接触面を持つプレート状の挟持部材によって上下から挟持すると、該端部の反対側に位置する被加工物の端部が持ち上がり、被加工物がカセットの内部で傾くことがある。この場合、被加工物がカセットの内壁等に接触して損傷する恐れがある。また、被加工物をカセットに搬入する際も、傾いた状態で挟持された被加工物をカセットに向かって移動させると、被加工物がカセットの適切な位置に挿入されずにカセットの外壁等に接触し、損傷する恐れがある。 When the workpiece is unloaded from the cassette, if the end of the warped workpiece is clamped from above and below by, for example, a plate-shaped clamping member having a pair of contact surfaces, the workpiece located on the opposite side of the edge is clamped. The edges of the workpiece may lift and the workpiece may tilt inside the cassette. In this case, the workpiece may contact the inner wall of the cassette and be damaged. Also, when the work piece is loaded into the cassette, if the work piece that is clamped in an inclined state is moved toward the cassette, the work piece will not be inserted into the proper position of the cassette, and the outer wall of the cassette, etc. will be damaged. may be touched and damaged.

本発明はかかる問題に鑑みてなされたものであり、搬送時における被加工物の損傷を防止することが可能な加工装置の提供を目的とする。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a processing apparatus capable of preventing damage to a workpiece during transportation.

本発明の一態様によれば、板状の被加工物を保持するチャックテーブルと、該チャックテーブルによって保持された被加工物を加工する加工ユニットと、複数の該被加工物を収容可能なカセットが載置されるカセット載置部と、該カセットから搬出された該被加工物、又は該カセットに搬入される該被加工物が仮置きされる仮置き部と、該カセットと該仮置き部との間で該被加工物を搬送する搬送ユニットと、を備え、該カセットは、底部と、該底部と接続され互いに対面する第１側壁及び第２側壁と、該第１側壁から該第２側壁側に突出するように配置され、該被加工物の外周領域を支持する第１ガイドレールと、該第２側壁から該第１側壁側に突出するように配置され、該被加工物の外周領域を支持する第２ガイドレールと、を備え、該搬送ユニットは、該被加工物の外周領域を上下から挟持する挟持部と、該挟持部を該カセットと該仮置き部との間で移動させる移動部と、を備え、該挟持部は、該移動部の移動方向と垂直な方向に沿って該被加工物の上面側と複数の点又は線状に接触する第１接触部と、該移動部の移動方向と垂直な方向に沿って該被加工物の下面側と複数の点又は線状に接触する第２接触部と、を備える加工装置が提供される。 According to one aspect of the present invention, there is provided a chuck table that holds a plate-shaped workpiece, a processing unit that processes the workpiece held by the chuck table, and a cassette that can accommodate a plurality of workpieces. a temporary placement portion where the workpiece unloaded from the cassette or the workpiece loaded into the cassette is temporarily placed; and the cassette and the temporary placement portion. a transport unit for transporting the workpieces between the cassette, the cassette comprising: a bottom portion; first and second side walls connected to the bottom portion and facing each other; a first guide rail arranged so as to protrude from the side wall and supporting an outer peripheral region of the workpiece; and a second guide rail for supporting the region, the conveying unit includes a clamping portion that clamps the peripheral region of the workpiece from above and below, and moves the clamping portion between the cassette and the temporary placement portion. a first contact portion that makes contact with the upper surface side of the workpiece in a plurality of points or lines along a direction perpendicular to the moving direction of the moving portion; A processing apparatus is provided that includes a second contact portion that contacts the lower surface side of the workpiece in a plurality of points or lines along a direction perpendicular to the moving direction of the moving portion.

本発明の一態様に係る加工装置は、被加工物を挟持する挟持部と、挟持部をカセットと仮置き部との間で移動させる移動部と、を備える搬送ユニットを備える。そして、挟持部は、移動部の移動方向と垂直な方向に沿って被加工物の上面側と複数の点又は線状に接触する第１接触部と、移動部の移動方向と垂直な方向に沿って被加工物の下面側と複数の点又は線状に接触する第２接触部と、を備える。 A processing apparatus according to an aspect of the present invention includes a transport unit that includes a holding section that holds a workpiece, and a moving section that moves the holding section between a cassette and a temporary placement section. The holding portion includes a first contact portion that contacts the upper surface side of the workpiece in a plurality of points or lines in a direction perpendicular to the moving direction of the moving portion, and a first contact portion in a direction perpendicular to the moving direction of the moving portion. a second contact portion that contacts the lower surface side of the workpiece along a plurality of points or lines.

上記の第１接触部と第２接触部とによって被加工物を挟持すると、被加工物と挟持部とが接触する領域の幅が小さく抑えられる。これにより、反った状態の被加工物を挟持部で挟持した際の被加工物の傾きが抑えられ、被加工物がカセット等に衝突して破損することを防止できる。 When the workpiece is sandwiched between the first contact portion and the second contact portion, the width of the region where the workpiece and the sandwiching portion are in contact can be reduced. As a result, the tilting of the warped workpiece is suppressed when the workpiece is gripped by the gripping portion, and the workpiece can be prevented from colliding with the cassette or the like and being damaged.

図１（Ａ）は被加工物を示す平面図であり、図１（Ｂ）は被加工物を示す底面図であり、図１（Ｃ）は被加工物を示す正面図である。1(A) is a plan view showing a workpiece, FIG. 1(B) is a bottom view showing the workpiece, and FIG. 1(C) is a front view showing the workpiece. 加工装置を示す斜視図である。It is a perspective view which shows a processing apparatus. 図３（Ａ）はカセット載置部に載置されたカセット及び被加工物を示す断面図であり、図３（Ｂ）はカセット載置部に載置されたカセットを示す断面図である。FIG. 3A is a cross-sectional view showing the cassette and the workpiece placed on the cassette placing portion, and FIG. 3B is a cross-sectional view showing the cassette placed on the cassette placing portion. 図４（Ａ）は挟持部を示す正面図であり、図４（Ｂ）は挟持部の第１挟持部材を示す底面図である。FIG. 4A is a front view showing the holding portion, and FIG. 4B is a bottom view showing the first holding member of the holding portion. 図５（Ａ）は変形例に係る挟持部を示す正面図であり、図５（Ｂ）は変形例に係る挟持部の第１挟持部材を示す底面図である。FIG. 5A is a front view showing a holding portion according to a modification, and FIG. 5B is a bottom view showing a first holding member of the holding portion according to a modification. 挟持部がカセットの近傍に配置された状態の加工装置を示す断面図である。FIG. 10 is a cross-sectional view showing the processing device in which the clamping section is arranged near the cassette; 被加工物が挟持部によって挟持された状態の加工装置を示す断面図である。FIG. 4 is a cross-sectional view showing the processing apparatus in a state in which a workpiece is held by a holding portion; 被加工物がカセットから搬出される際の加工装置を示す断面図である。FIG. 4 is a cross-sectional view showing the processing apparatus when the workpiece is unloaded from the cassette;

以下、添付図面を参照して本発明の実施形態を説明する。まず、本実施形態に係る加工装置によって加工可能な被加工物の構成例について説明する。図１（Ａ）は被加工物１１を示す平面図であり、図１（Ｂ）は被加工物１１を示す底面図であり、図１（Ｃ）は被加工物１１を示す正面図である。 Embodiments of the present invention will be described below with reference to the accompanying drawings. First, a configuration example of a workpiece that can be processed by the processing apparatus according to the present embodiment will be described. 1A is a plan view showing the workpiece 11, FIG. 1B is a bottom view showing the workpiece 11, and FIG. 1C is a front view showing the workpiece 11. .

被加工物１１は、表面１３ａ及び裏面１３ｂを有し平面視で矩形状に形成された板状の基板１３と、ＩＣ（Integrated Circuit）、ＬＳＩ（Large Scale Integration）等のデバイスを含み基板１３の表面１３ａ側に配置された複数のデバイスチップ（不図示）とを備える。また、基板１３の表面１３ａ側には、複数のデバイスチップを覆って封止する樹脂層（モールド樹脂）１５が形成されている。 The workpiece 11 includes a plate-like substrate 13 having a front surface 13a and a back surface 13b and formed in a rectangular shape in plan view, and devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration). and a plurality of device chips (not shown) arranged on the surface 13a side. A resin layer (mold resin) 15 that covers and seals the plurality of device chips is formed on the surface 13a side of the substrate 13 .

なお、ここでは被加工物１１として、デバイスチップを樹脂層１５で覆って形成されたパッケージ基板を用いているが、被加工物１１の種類、材質、形状、構造、大きさ等に制限はない。例えば被加工物１１は、表面側にＩＣ、ＬＳＩ等のデバイスが形成された円盤状のシリコンウェーハであってもよい。また、被加工物１１は、シリコン以外の半導体（ＧａＡｓ、ＩｎＰ、ＧａＮ、ＳｉＣ等）、ガラス、セラミックス、樹脂、金属等の材料でなるウェーハであってもよい。 Although a package substrate formed by covering a device chip with a resin layer 15 is used as the workpiece 11 here, the type, material, shape, structure, size, etc. of the workpiece 11 are not limited. . For example, the workpiece 11 may be a disk-shaped silicon wafer having devices such as ICs and LSIs formed on its front surface. Moreover, the workpiece 11 may be a wafer made of a material such as a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), glass, ceramics, resin, metal, or the like.

図１（Ｂ）に示すように、被加工物１１は互いに交差するように格子状に配列された複数の分割予定ライン（ストリート）１７によって区画された複数のデバイス領域１１ａを備えており、デバイスチップはそれぞれこのデバイス領域１１ａに配置されている。また、図１（Ｃ）に示すように、被加工物１１は、被加工物１１の中央側に位置し複数のデバイスチップを含む中央領域１１ｂと、中央領域１１ｂを囲繞し被加工物１１の外周縁を含む外周領域１１ｃとを備える。 As shown in FIG. 1B, the workpiece 11 has a plurality of device regions 11a partitioned by a plurality of dividing lines (streets) 17 arranged in a lattice so as to intersect each other. Each chip is arranged in this device region 11a. Further, as shown in FIG. 1C, the workpiece 11 includes a central region 11b located on the central side of the workpiece 11 and including a plurality of device chips, and a central region 11b surrounding the central region 11b. and an outer peripheral region 11c including an outer peripheral edge.

被加工物１１を分割予定ライン１７に沿って分割することにより、デバイスチップをそれぞれ含む複数のパッケージデバイスが得られる。なお、基板１３の裏面１３ｂ側には分割予定ライン１７の位置を示す複数のマーカー１９が付されており、このマーカー１９は被加工物１１を分割予定ライン１７に沿って加工する際の目印となる。 By dividing the workpiece 11 along the dividing lines 17, a plurality of package devices each including a device chip are obtained. A plurality of markers 19 indicating the positions of the dividing lines 17 are attached to the rear surface 13b side of the substrate 13, and the markers 19 serve as marks when the workpiece 11 is processed along the dividing lines 17. Become.

また、基板１３の裏面１３ｂ側には、金属でなる複数の電極２１が分割予定ライン１７に沿って配列されている。電極２１は、基板１３の表面１３ａ側に配置されたデバイスチップと金属ワイヤー（不図示）等を介して接続されており、その一部が基板１３の裏面１３ｂ側で露出している。この電極２１は、被加工物１１が複数のパッケージデバイスに分割された後、該パッケージデバイスを他の実装基板等に実装する際の接続電極として機能する。 A plurality of electrodes 21 made of metal are arranged along the division lines 17 on the rear surface 13 b side of the substrate 13 . The electrode 21 is connected to a device chip arranged on the front surface 13a side of the substrate 13 via a metal wire (not shown) or the like, and a part of the electrode 21 is exposed on the back surface 13b side of the substrate 13 . The electrodes 21 function as connection electrodes when the package devices are mounted on another mounting board or the like after the workpiece 11 is divided into a plurality of package devices.

被加工物１１には、加工装置によって種々の加工が施される。例えば被加工物１１は、切削装置を用いた切削加工やレーザー加工装置を用いたレーザー加工によって、複数のパッケージデバイスに分割される。また、研削装置によって樹脂層１５を研削することにより、被加工物１１を薄くすることができる。以下では一例として、被加工物１１に切削加工を施す加工装置（切削装置）について説明する。 Various processing is performed on the workpiece 11 by a processing device. For example, the workpiece 11 is divided into a plurality of package devices by cutting using a cutting device or laser processing using a laser processing device. Further, by grinding the resin layer 15 with a grinding device, the workpiece 11 can be thinned. As an example, a processing device (cutting device) for cutting the workpiece 11 will be described below.

図２は、加工装置２を示す斜視図である。加工装置２は、加工装置２を構成する各構成要素を支持する基台４を備える。基台４の上面の前方側の角部近傍には開口４ａが形成されており、この開口４ａの内部には昇降機構（不図示）によって昇降するカセット載置部６が設けられている。このカセット載置部６上には、複数の被加工物１１を収容可能なカセット８が載置される。 FIG. 2 is a perspective view showing the processing device 2. As shown in FIG. The processing device 2 includes a base 4 that supports each component constituting the processing device 2 . An opening 4a is formed in the vicinity of the front corner of the upper surface of the base 4, and a cassette mounting portion 6 which is lifted and lowered by an elevating mechanism (not shown) is provided inside the opening 4a. A cassette 8 capable of accommodating a plurality of workpieces 11 is mounted on the cassette mounting portion 6 .

図３（Ａ）はカセット載置部６に載置されたカセット８及び被加工物１１を示す断面図であり、図３（Ｂ）はカセット載置部６に載置されたカセット８を示す断面図である。なお、図３（Ａ）はカセット８及び被加工物１１をＹＺ平面と平行な面で切断した場合の断面図であり、図３（Ｂ）はカセット８をＸＹ平面と平行な面で切断した場合の断面図である。カセット８は、直方体状の箱型に形成されており、カセット８の内部には複数の被加工物１１が収容される。 3A is a sectional view showing the cassette 8 and the workpiece 11 placed on the cassette placing portion 6, and FIG. 3B shows the cassette 8 placed on the cassette placing portion 6. FIG. It is a sectional view. 3A is a cross-sectional view of the cassette 8 and the workpiece 11 cut along a plane parallel to the YZ plane, and FIG. 3B is a cross-sectional view of the cassette 8 cut along a plane parallel to the XY plane. It is a cross-sectional view of the case. The cassette 8 is formed in a rectangular parallelepiped box shape, and a plurality of workpieces 11 are accommodated inside the cassette 8 .

カセット８は、平面視で矩形状に形成された板状の底部８ａを備える。底部８ａのＸ軸方向（前後方向、加工送り方向）における端部にはそれぞれ、板状の第１側壁８ｂ及び第２側壁８ｃが互いに対面するように接続されている。第１側壁８ｂ及び第２側壁８ｃは、Ｚ軸方向（鉛直方向）に沿って底部８ａと概ね垂直に配置されている。 The cassette 8 has a plate-like bottom portion 8a that is rectangular in plan view. A plate-like first side wall 8b and a plate-like second side wall 8c are connected to the ends of the bottom portion 8a in the X-axis direction (front-rear direction, processing feed direction) so as to face each other. The first side wall 8b and the second side wall 8c are arranged substantially perpendicular to the bottom portion 8a along the Z-axis direction (vertical direction).

また、カセット８は、底部８ａ、第１側壁８ｂ、及び第２側壁８ｃと接続され、仮置き部１６（図２参照）とは反対側に配置された板状の第３側壁８ｄを備える。第３側壁８ｄは、底部８ａ、第１側壁８ｂ、及び第２側壁８ｃと概ね垂直に配置されている。また、カセット８は、第１側壁８ｂ、第２側壁８ｃ、及び第３側壁８ｄと接続され、底部８ａと概ね平行に配置された板状の上壁８ｅを備える。 The cassette 8 also includes a plate-like third side wall 8d connected to the bottom portion 8a, the first side wall 8b, and the second side wall 8c and arranged on the side opposite to the temporary placement portion 16 (see FIG. 2). The third side wall 8d is arranged generally perpendicular to the bottom portion 8a, the first side wall 8b and the second side wall 8c. The cassette 8 also includes a plate-like upper wall 8e that is connected to the first side wall 8b, the second side wall 8c, and the third side wall 8d and that is arranged substantially parallel to the bottom portion 8a.

さらにカセット８は、第３側壁８ｄとは反対側に、仮置き部１６（図２参照）に向かって開口する開口部８ｆを備える。被加工物１１は、この開口部８ｆを介して搬出及び搬入される。 Further, the cassette 8 has an opening 8f that opens toward the temporary placement portion 16 (see FIG. 2) on the side opposite to the third side wall 8d. The workpiece 11 is carried out and carried in through this opening 8f.

カセット８の内部には、被加工物１１を支持する複数の支持部５０が設けられている。支持部５０はそれぞれ、第１側壁８ｂから第２側壁８ｃ側に突出し、高さ方向がＹ軸方向（左右方向、割り出し送り方向）に沿うように配置された柱状の第１ガイドレール５２と、第２側壁８ｃから第１側壁８ｂ側に突出し、高さ方向がＹ軸方向に沿うように配置された柱状の第２ガイドレール５４とによって構成されている。 A plurality of supports 50 for supporting the workpieces 11 are provided inside the cassette 8 . Each of the support portions 50 protrudes from the first side wall 8b toward the second side wall 8c, and has a columnar first guide rail 52 arranged so that the height direction is along the Y-axis direction (horizontal direction, index feed direction); A columnar second guide rail 54 protrudes from the second side wall 8c toward the first side wall 8b and is arranged so that its height direction is along the Y-axis direction.

第１ガイドレール５２の上面は被加工物１１の外周領域１１ｃを支持する支持面５２ａを構成し、第２ガイドレール５４の上面は被加工物１１の外周領域１１ｃを支持する支持面５４ａを構成する。支持面５２ａと支持面５４ａとはそれぞれ、水平方向（ＸＹ平面方向）と概ね平行に配置されている。 The upper surface of the first guide rail 52 constitutes a support surface 52a that supports the outer peripheral region 11c of the workpiece 11, and the upper surface of the second guide rail 54 constitutes a support surface 54a that supports the outer peripheral region 11c of the workpiece 11. do. The support surface 52a and the support surface 54a are respectively arranged substantially parallel to the horizontal direction (XY plane direction).

なお、第１ガイドレール５２及び第２ガイドレール５４の幅は、第１ガイドレール５２と第２ガイドレール５４とが互いに接続されない範囲で設定される。そのため、第１ガイドレール５２と第２ガイドレール５４との間には隙間５６が形成されている。なお、第１ガイドレール５２及び第２ガイドレール５４の具体的な幅は、カセット８に収容される被加工物１１の寸法等に応じて適宜設定される。 The widths of the first guide rail 52 and the second guide rail 54 are set within a range in which the first guide rail 52 and the second guide rail 54 are not connected to each other. Therefore, a gap 56 is formed between the first guide rail 52 and the second guide rail 54 . The specific widths of the first guide rail 52 and the second guide rail 54 are appropriately set according to the dimensions of the workpiece 11 accommodated in the cassette 8 and the like.

被加工物１１はそれぞれ、その長手方向が第１ガイドレール５２及び第２ガイドレール５４の長さ方向（Ｙ軸方向）に沿うようにカセット８に収容される。具体的には、被加工物１１は、外周領域１１ｃのうち第１側壁８ｂ側に位置する領域が第１ガイドレール５２の支持面５２ａに支持され、外周領域１１ｃのうち第２側壁８ｃ側に位置する領域が第２ガイドレール５４の支持面５４ａによって支持され、中央領域１１ｂが隙間５６と重なるように、カセット８に収容される。 Each workpiece 11 is accommodated in the cassette 8 so that its longitudinal direction is along the longitudinal direction (Y-axis direction) of the first guide rail 52 and the second guide rail 54 . Specifically, the workpiece 11 is supported by the support surface 52a of the first guide rail 52 in the region located on the first side wall 8b side in the outer peripheral region 11c, and is supported in the outer peripheral region 11c on the second side wall 8c side. It is accommodated in the cassette 8 so that the area where it is located is supported by the support surface 54 a of the second guide rail 54 and the central area 11 b overlaps the gap 56 .

なお、図３（Ａ）では５段の支持部５０が設けられた構成を示しているが、支持部５０の段数はカセット８に収容される被加工物１１の数に応じて適宜設定される。 Although FIG. 3A shows a configuration in which five stages of support portions 50 are provided, the number of stages of support portions 50 is appropriately set according to the number of workpieces 11 accommodated in cassette 8. .

図２に示す基台４の上面のうちカセット載置部６の側方に位置する領域には、長手方向がＸ軸方向に沿う矩形状の開口４ｂが形成されている。開口４ｂ内には、ボールネジ式のＸ軸移動機構（不図示）と、Ｘ軸移動機構を覆うテーブルカバー１０及び蛇腹状の防塵防滴カバー１２とが設けられている。また、Ｘ軸移動機構は、テーブルカバー１０によって覆われたＸ軸移動テーブル（不図示）を備えており、このＸ軸移動テーブルをテーブルカバー１０とともにＸ軸方向に沿って移動させる。 A rectangular opening 4b whose longitudinal direction is along the X-axis direction is formed in a region of the upper surface of the base 4 shown in FIG. A ball-screw type X-axis moving mechanism (not shown), a table cover 10 covering the X-axis moving mechanism, and a bellows-shaped dust and drip proof cover 12 are provided in the opening 4b. The X-axis moving mechanism also includes an X-axis moving table (not shown) covered with a table cover 10, and moves this X-axis moving table together with the table cover 10 along the X-axis direction.

Ｘ軸移動テーブル上には、被加工物１１を保持するチャックテーブル１４がテーブルカバー１０から露出するように設けられている。チャックテーブル１４はモータ等の回転駆動源（不図示）に連結されており、この回転駆動源はチャックテーブル１４をＺ軸方向（鉛直方向）に概ね平行な回転軸の周りに回転させる。 A chuck table 14 for holding a workpiece 11 is provided on the X-axis moving table so as to be exposed from the table cover 10 . The chuck table 14 is connected to a rotation drive source (not shown) such as a motor, and this rotation drive source rotates the chuck table 14 around a rotation axis substantially parallel to the Z-axis direction (vertical direction).

チャックテーブル１４の上面は、被加工物１１を吸引保持する保持面１４ａを構成する。保持面１４ａは、Ｘ軸方向及びＹ軸方向に対して概ね平行に形成されており、チャックテーブル１４の内部に設けられた吸引路（不図示）等を介してエジェクタ等の吸引源（不図示）に接続されている。被加工物１１を保持面１４ａ上に配置した状態で、保持面１４ａに吸引源の負圧を作用させることにより、被加工物１１がチャックテーブル１４によって吸引保持される。 The upper surface of the chuck table 14 constitutes a holding surface 14a that holds the workpiece 11 by suction. The holding surface 14a is formed substantially parallel to the X-axis direction and the Y-axis direction, and is connected to a suction source (not shown) such as an ejector through a suction path (not shown) provided inside the chuck table 14. )It is connected to the. With the workpiece 11 placed on the holding surface 14a, the workpiece 11 is sucked and held by the chuck table 14 by applying the negative pressure of the suction source to the holding surface 14a.

また、カセット載置部６の側方の開口４ａと重なる領域には、被加工物１１が仮置きされる仮置き部１６が設けられている。仮置き部１６は、Ｙ軸方向に沿って互いに概ね平行に配置された第１ガイドレール１８及び第２ガイドレール２０を備える。第１ガイドレール１８と第２ガイドレール２０とは、Ｘ軸方向に沿って互いに接近及び離隔するように移動する。 A temporary placement portion 16 on which the workpiece 11 is temporarily placed is provided in a region overlapping the side opening 4a of the cassette placing portion 6. As shown in FIG. The temporary placement section 16 includes a first guide rail 18 and a second guide rail 20 that are arranged substantially parallel to each other along the Y-axis direction. The first guide rail 18 and the second guide rail 20 move toward and away from each other along the X-axis direction.

第１ガイドレール１８は、被加工物１１を支持する概ね水平な支持面１８ａと、支持面１８ａに対して概ね垂直な挟持面１８ｂとを備える。また、第２ガイドレール２０は、被加工物１１を支持する概ね水平な支持面２０ａと、支持面２０ａに対して概ね垂直な挟持面２０ｂとを備える。被加工物１１を支持面１８ａ，２０ａによって支持した状態で、第１ガイドレール１８と第２ガイドレール２０とを接近させ、挟持面１８ｂ，２０ｂを被加工物１１の側面に接触させることにより、被加工物１１の位置合わせが行われる。 The first guide rail 18 includes a substantially horizontal support surface 18a that supports the workpiece 11, and a clamping surface 18b that is substantially perpendicular to the support surface 18a. The second guide rail 20 also includes a substantially horizontal support surface 20a that supports the workpiece 11, and a clamping surface 20b that is substantially perpendicular to the support surface 20a. With the workpiece 11 supported by the support surfaces 18a and 20a, the first guide rail 18 and the second guide rail 20 are brought closer together, and the clamping surfaces 18b and 20b are brought into contact with the side surface of the workpiece 11. Alignment of the workpiece 11 is performed.

チャックテーブル１４の上方には、被加工物１１を加工する２組の加工ユニット２２ａ，２２ｂが設けられている。また、基台４の上面には、加工ユニット２２ａ，２２ｂを支持する門型の第１支持構造２４が、開口４ｂを跨ぐように配置されている。 Two sets of processing units 22 a and 22 b for processing the workpiece 11 are provided above the chuck table 14 . Further, on the upper surface of the base 4, a gate-shaped first support structure 24 that supports the processing units 22a and 22b is arranged so as to straddle the opening 4b.

第１支持構造２４の上部の前面側には、加工ユニット２２ａをＹ軸方向及びＺ軸方向に沿って移動させるボールネジ式の移動ユニット（移動機構）２６ａと、加工ユニット２２ｂをＹ軸方向及びＺ軸方向に沿って移動させるボールネジ式の移動ユニット（移動機構）２６ｂとが設けられている。移動ユニット２６ａの下部には加工ユニット２２ａが固定されており、移動ユニット２６ｂの下部には加工ユニット２２ｂが固定されている。 On the front side of the upper part of the first support structure 24, a ball screw type moving unit (moving mechanism) 26a for moving the processing unit 22a along the Y-axis direction and the Z-axis direction, A ball screw type moving unit (moving mechanism) 26b for moving along the axial direction is provided. The processing unit 22a is fixed to the lower portion of the moving unit 26a, and the processing unit 22b is fixed to the lower portion of the moving unit 26b.

加工ユニット２２ａは移動ユニット２６ａに支持された筒状のハウジング２８ａを備え、加工ユニット２２ｂは移動ユニット２６ｂに支持された筒状のハウジング２８ｂを備える。ハウジング２８ａ，２８ｂにはそれぞれ、Ｙ軸方向に沿って配置されモータ等の回転駆動源と接続されたスピンドル（不図示）が収容されている。 The processing unit 22a has a cylindrical housing 28a supported by a moving unit 26a, and the processing unit 22b has a cylindrical housing 28b supported by a moving unit 26b. Each of the housings 28a and 28b accommodates a spindle (not shown) arranged along the Y-axis direction and connected to a rotational drive source such as a motor.

ハウジング２８ａに収容されたスピンドルの先端部はハウジング２８ａの外側に露出しており、ハウジング２８ｂに収容されたスピンドルの先端部はハウジング２８ｂの外側に露出している。これらのスピンドルの先端部にはそれぞれ、被加工物１１を切削する円環状の切削ブレード３０が互いに対面するように装着される。 The tip of the spindle housed in the housing 28a is exposed outside the housing 28a, and the tip of the spindle housed in the housing 28b is exposed outside the housing 28b. Annular cutting blades 30 for cutting the workpiece 11 are attached to the tips of these spindles so as to face each other.

切削ブレード３０を回転駆動源から伝わる力によって回転させた状態で、被加工物１１に切り込ませることにより、被加工物１１が切削される。すなわち、加工ユニット２２ａ，２２ｂは、被加工物１１に対して切削加工を施す切削ユニットとして機能する。 The workpiece 11 is cut by cutting into the workpiece 11 while the cutting blade 30 is rotated by the force transmitted from the rotary drive source. That is, the processing units 22a and 22b function as cutting units that cut the workpiece 11. As shown in FIG.

また、第１支持構造２４の前面側には、門型の第２支持構造３２が開口４ｂを跨ぐように配置されている。第２支持構造３２の前面側には、ガイドレール３４がＹ軸方向に沿って固定されている。このガイドレール３４には、被加工物１１を搬送する搬送ユニット（搬送機構）３６がＹ軸方向に沿ってスライド可能な態様で支持されている。 A gate-shaped second support structure 32 is arranged on the front side of the first support structure 24 so as to straddle the opening 4b. A guide rail 34 is fixed to the front side of the second support structure 32 along the Y-axis direction. A transport unit (transport mechanism) 36 that transports the workpiece 11 is supported by the guide rail 34 so as to be slidable along the Y-axis direction.

搬送ユニット３６は、カセット８と仮置き部１６との間、及び、仮置き部１６とチャックテーブル１４との間で被加工物１１を搬送する。具体的には、搬送ユニット３６は、ガイドレール３４に装着された移動部３８と、移動部３８の先端部の下面側に接続されエアシリンダ等でなる昇降機構４０とを備える。また、昇降機構４０の下端側には、被加工物１１を吸引保持する板状の吸引部４２が固定されている。 The transport unit 36 transports the workpiece 11 between the cassette 8 and the temporary placement section 16 and between the temporary placement section 16 and the chuck table 14 . Specifically, the transport unit 36 includes a moving portion 38 attached to the guide rail 34, and an elevating mechanism 40 connected to the lower surface side of the leading end portion of the moving portion 38 and composed of an air cylinder or the like. A plate-shaped suction part 42 for sucking and holding the workpiece 11 is fixed to the lower end side of the lifting mechanism 40 .

移動部３８は、ガイドレール３４に沿ってＹ軸方向に移動する。移動部３８を移動させることにより、吸引部４２のＹ軸方向における位置が制御される。また、昇降機構４０を動作させると、吸引部４２が昇降し、吸引部４２のＺ軸方向における位置が制御される。 The moving part 38 moves along the guide rail 34 in the Y-axis direction. By moving the moving portion 38, the position of the suction portion 42 in the Y-axis direction is controlled. Further, when the lifting mechanism 40 is operated, the suction portion 42 is lifted and the position of the suction portion 42 in the Z-axis direction is controlled.

吸引部４２は、被加工物１１の形状に対応して平面視で矩形状に形成されている。また、吸引部４２の下面側には、被加工物１１を吸引する複数の吸着パッド（不図示）が固定されている。例えば、吸引部４２には、被加工物１１の樹脂層１５（図１（Ｃ）参照）の外周領域と重畳する４つの吸着パッドが設けられている。ただし、吸引部４２の形状や吸着パッドの数及び配置に制限はない。 The suction part 42 is formed in a rectangular shape in plan view corresponding to the shape of the workpiece 11 . A plurality of suction pads (not shown) for sucking the workpiece 11 are fixed to the lower surface side of the suction portion 42 . For example, the suction unit 42 is provided with four suction pads that overlap the peripheral region of the resin layer 15 (see FIG. 1C) of the workpiece 11 . However, the shape of the suction unit 42 and the number and arrangement of suction pads are not limited.

吸引部４２のカセット８側の端部には、被加工物１１を挟持する挟持部４４が設けられている。挟持部４４は、被加工物１１の搬送時に被加工物１１を上下方向から挟んで保持する。 A holding portion 44 for holding the workpiece 11 is provided at the end of the suction portion 42 on the cassette 8 side. The clamping portion 44 clamps and holds the workpiece 11 from above and below when the workpiece 11 is conveyed.

例えば挟持部４４は、被加工物１１をカセット８から搬出する際、カセット８に収容された被加工物１１の外周領域１１ｃのうち、仮置き部１６側に位置する領域を挟持する。この状態で、移動部３８によって挟持部４４をＹ軸方向に沿って仮置き部１６側に移動させると、被加工物１１がカセット８から搬出される。 For example, when the workpiece 11 is unloaded from the cassette 8 , the clamping section 44 clamps a region of the outer peripheral region 11 c of the workpiece 11 accommodated in the cassette 8 that is located on the temporary placement section 16 side. In this state, when the holding portion 44 is moved toward the temporary placement portion 16 along the Y-axis direction by the moving portion 38 , the workpiece 11 is unloaded from the cassette 8 .

また、挟持部４４は、被加工物１１をカセット８に搬入する際、仮置き部１６に仮置きされた被加工物１１の外周領域１１ｃのうち、カセット８とは反対側に位置する領域を挟持する。この状態で、移動部３８によって挟持部４４をＹ軸方向に沿ってカセット８側に移動させると、被加工物１１がカセット８に搬入される。 Further, when the workpiece 11 is loaded into the cassette 8 , the clamping section 44 moves the area of the outer peripheral area 11 c of the workpiece 11 temporarily placed on the temporary placement section 16 , which is located on the opposite side of the cassette 8 . pinch. In this state, when the holding portion 44 is moved toward the cassette 8 along the Y-axis direction by the moving portion 38 , the workpiece 11 is carried into the cassette 8 .

ここで、被加工物１１には、その製造工程において反りが発生する場合がある。例えば、被加工物１１を製造する際に樹脂層１５を硬化させるための加熱処理を行うと、樹脂層１５が収縮し、被加工物１１は、上面側（基板１３の表面１３ａ側）が長手方向の一端側から他端側に向かって凹状に湾曲するように反った状態となることがある（図１（Ｃ）参照）。 Here, the workpiece 11 may be warped during its manufacturing process. For example, when heat treatment is performed to harden the resin layer 15 when manufacturing the workpiece 11, the resin layer 15 shrinks, and the workpiece 11 is elongated on the upper surface side (surface 13a side of the substrate 13). It may be in a warped state so as to be concavely curved from one end side of the direction to the other end side (see FIG. 1(C)).

そして、被加工物１１は図３（Ａ）に示すように、反った状態のままカセット８に収容される。そのため、被加工物１１の外周領域１１ｃのうち、第１側壁８ｂ側及び第２側壁８ｃ側に位置する領域の一部が、第１ガイドレール５２及び第２ガイドレール５４によって支持される。 Then, as shown in FIG. 3A, the workpiece 11 is accommodated in the cassette 8 while being warped. Therefore, part of the outer peripheral region 11 c of the workpiece 11 located on the side of the first side wall 8 b and the side of the second side wall 8 c is supported by the first guide rail 52 and the second guide rail 54 .

被加工物１１をカセット８から搬出する際、反った状態の被加工物１１の開口部８ｆ側に位置する外周領域１１ｃを、例えば一対のプレート状の挟持部材によって上下から挟持すると、被加工物１１の第３側壁８ｄ側に位置する外周領域１１ｃが持ち上がり、被加工物１１がカセット８の内部で傾くことがある。この場合、被加工物１１がカセット８の上壁８ｅ、第１ガイドレール５２、第２ガイドレール５４等に接触して損傷する恐れがある。 When carrying out the workpiece 11 from the cassette 8, if the outer peripheral region 11c located on the opening 8f side of the warped workpiece 11 is sandwiched from above and below, for example, by a pair of plate-shaped sandwiching members, the workpiece The outer peripheral region 11c located on the side of the third side wall 8d of the workpiece 11 may be lifted and the workpiece 11 may be tilted inside the cassette 8. In this case, the workpiece 11 may come into contact with the upper wall 8e of the cassette 8, the first guide rail 52, the second guide rail 54, etc. and be damaged.

また、被加工物１１をカセット８に搬入する際も、反った状態の被加工物１１を例えば一対のプレート状の挟持部材によって上下から挟持すると、被加工物１１が傾く。この状態で被加工物１１をカセット８に向かって移動させると、被加工物１１がカセット８の適切な位置に挿入されず、カセット８の上壁８ｅ、第１ガイドレール５２、第２ガイドレール５４等に接触して損傷する恐れがある。 Also, when the workpiece 11 is loaded into the cassette 8, if the warped workpiece 11 is clamped from above and below, for example, by a pair of plate-shaped clamping members, the workpiece 11 is tilted. If the workpiece 11 is moved toward the cassette 8 in this state, the workpiece 11 will not be inserted into the appropriate position of the cassette 8, and the top wall 8e of the cassette 8, the first guide rail 52, the second guide rail 52, and the upper wall 8e of the cassette 8 will move. There is a risk of contact with the 54 or the like and damage.

本実施形態に係る加工装置２は、移動部３８の移動方向と垂直な方向に沿って被加工物１１の上面側と点状に接触する複数の第１接触部と、移動部３８の移動方向と垂直な方向に沿って被加工物１１の下面側と点状に接触する複数の第２接触部と、を備える挟持部４４によって被加工物１１を挟持する。 The processing apparatus 2 according to the present embodiment includes a plurality of first contact portions that point-likely contact the upper surface side of the workpiece 11 along the direction perpendicular to the moving direction of the moving portion 38, and the moving direction of the moving portion 38. The work piece 11 is held by the holding portion 44 including a plurality of second contact portions that make point-like contact with the lower surface side of the work piece 11 along the direction perpendicular to .

上記の第１接触部と第２接触部とによって被加工物１１を挟持すると、被加工物１１と挟持部４４とが接触する領域の幅（Ｙ軸方向における長さ）が小さく抑えられる。これにより、反った状態の被加工物１１を挟持した際の被加工物１１の傾きが抑えられ、被加工物１１がカセット８等に衝突して破損することを防止できる。 When the workpiece 11 is sandwiched between the first contact portion and the second contact portion, the width (the length in the Y-axis direction) of the contact area between the workpiece 11 and the sandwiching portion 44 can be reduced. As a result, the inclination of the workpiece 11 when the warped workpiece 11 is clamped can be suppressed, and the workpiece 11 can be prevented from colliding with the cassette 8 or the like and being damaged.

以下、搬送ユニット３６が備える挟持部４４の具体的な構成例を説明する。図４（Ａ）は、挟持部４４を示す正面図である。 A specific configuration example of the holding section 44 included in the transport unit 36 will be described below. FIG. 4A is a front view showing the holding portion 44. FIG.

挟持部４４は、直方体状に形成された支持部６０と、支持部６０によって支持された板状の第１挟持部材（上部挟持部材）６２ａ及び第２挟持部材（下部挟持部材）６２ｂとを備える。第１挟持部材６２ａ及び第２挟持部材６２ｂは、支持部６０からカセット８側に突出するように設けられている。 The holding portion 44 includes a support portion 60 formed in a rectangular parallelepiped shape, and a plate-like first holding member (upper holding member) 62a and a plate-shaped second holding member (lower holding member) 62b supported by the support portion 60. . The first holding member 62a and the second holding member 62b are provided so as to protrude from the support portion 60 toward the cassette 8 side.

第１挟持部材６２ａ及び第２挟持部材６２ｂは、例えばステンレス鋼（ＳＵＳ）等によってそれぞれ平面視で矩形状に形成されており、第１挟持部材６２ａの下面と第２挟持部材６２ｂの上面とが互いに対向するように水平方向（ＸＹ平面方向）に沿って配置されている。また、第１挟持部材６２ａ及び第２挟持部材６２ｂはそれぞれ移動機構（不図示）と接続されており、Ｚ軸方向に沿って互いに接近及び離隔するように移動する。 The first holding member 62a and the second holding member 62b are each formed of stainless steel (SUS) or the like in a rectangular shape in a plan view, and the lower surface of the first holding member 62a and the upper surface of the second holding member 62b are aligned. They are arranged along the horizontal direction (XY plane direction) so as to face each other. Also, the first holding member 62a and the second holding member 62b are each connected to a moving mechanism (not shown), and move toward and away from each other along the Z-axis direction.

第１挟持部材６２ａの下面側には、第１挟持部材６２ａの下面から下方に突出する複数の半球状の第１接触部６４ａが設けられている。また、第２挟持部材６２ｂの上面側には、第２挟持部材６２ｂの上面から上方に突出する複数の半球状の第２接触部６４ｂが設けられている。第１接触部６４ａと第２接触部６４ｂとは、平面視で互いに重なるように配置されている。 A plurality of semispherical first contact portions 64a protruding downward from the lower surface of the first holding member 62a are provided on the lower surface side of the first holding member 62a. Further, a plurality of hemispherical second contact portions 64b projecting upward from the upper surface of the second holding member 62b are provided on the upper surface side of the second holding member 62b. The first contact portion 64a and the second contact portion 64b are arranged so as to overlap each other in plan view.

図４（Ｂ）は、挟持部４４の第１挟持部材６２ａを示す底面図である。なお、図４（Ｂ）では第２挟持部材６２ｂの図示を省略している。複数の第１接触部６４ａは、移動部３８（図２参照）の移動方向（Ｙ軸方向）と垂直な方向（Ｘ軸方向）に沿って配列されており、被加工物１１の上面側（例えば、基板１３の表面１３ａや樹脂層１５）と接触する領域に相当する。 FIG. 4B is a bottom view showing the first holding member 62a of the holding portion 44. FIG. Note that the illustration of the second holding member 62b is omitted in FIG. 4B. The plurality of first contact portions 64a are arranged along the direction (X-axis direction) perpendicular to the moving direction (Y-axis direction) of the moving portion 38 (see FIG. 2), and are arranged on the upper surface side of the workpiece 11 ( For example, it corresponds to a region in contact with the surface 13a of the substrate 13 and the resin layer 15).

また、複数の第２接触部６４ｂも同様に、移動部３８の移動方向と垂直な方向に沿って配列されている。複数の第２接触部６４ｂは、被加工物１１の下面側（例えば、基板１３の裏面１３ｂ）と接触する領域に相当する。 Similarly, the plurality of second contact portions 64b are arranged along the direction perpendicular to the moving direction of the moving portion 38. As shown in FIG. The plurality of second contact portions 64b correspond to regions that come into contact with the lower surface side of the workpiece 11 (for example, the back surface 13b of the substrate 13).

なお、図４（Ｂ）では２つの第１接触部６４ａが設けられた例を示しているが、第１接触部６４ａ及び第２接触部６４ｂの数に制限はない。すなわち、第１接触部６４ａ及び第２接触部６４ｂの数は１であってもよいし、２以上の任意の数であってもよい。 Although FIG. 4B shows an example in which two first contact portions 64a are provided, the number of first contact portions 64a and second contact portions 64b is not limited. That is, the number of the first contact portion 64a and the second contact portion 64b may be one, or any number of two or more.

第１接触部６４ａと第２接触部６４ｂとの間に被加工物１１の一部が配置された状態で、第１挟持部材６２ａと第２挟持部材６２ｂとを接近させると、第１接触部６４ａが被加工物１１の上面側に接触し、第２接触部６４ｂが被加工物１１の下面側に接触する。これにより、被加工物１１が挟持部４４によって上下から挟持される。このとき、被加工物１１の上面側には複数の第１接触部６４ａがＸ軸方向に沿って点状に接触し、被加工物１１の下面側には複数の第２接触部６４ｂがＸ軸方向に沿って点状に接触する。 When the first clamping member 62a and the second clamping member 62b are brought close to each other in a state where a part of the workpiece 11 is arranged between the first contact portion 64a and the second contact portion 64b, the first contact portion The second contact portion 64 a contacts the upper surface side of the workpiece 11 and the second contact portion 64 b contacts the lower surface side of the workpiece 11 . Thereby, the workpiece 11 is clamped from above and below by the clamping portion 44 . At this time, a plurality of first contact portions 64a contact the upper surface side of the workpiece 11 in a point shape along the X-axis direction, and a plurality of second contact portions 64b contact the lower surface side of the workpiece 11. Dot-like contact along the axial direction.

なお、第１接触部６４ａ及び第２接触部６４ｂは、例えばステンレス鋼（ＳＵＳ）等でなり、第１挟持部材６２ａ及び第２挟持部材６２ｂと一体に形成される。ただし、第１接触部６４ａ及び第２接触部６４ｂは、第１挟持部材６２ａ及び第２挟持部材６２ｂとは別途製造された後、第１挟持部材６２ａ及び第２挟持部材６２ｂに固定されてもよい。この場合、第１接触部６４ａ及び第２接触部６４ｂには、第１挟持部材６２ａ及び第２挟持部材６２ｂとは異なる材料（ゴムや樹脂等）を用いることができる。 The first contact portion 64a and the second contact portion 64b are made of stainless steel (SUS), for example, and formed integrally with the first clamping member 62a and the second clamping member 62b. However, the first contact portion 64a and the second contact portion 64b may be manufactured separately from the first clamping member 62a and the second clamping member 62b and then fixed to the first clamping member 62a and the second clamping member 62b. good. In this case, the first contact portion 64a and the second contact portion 64b can be made of a material (rubber, resin, etc.) different from that of the first clamping member 62a and the second clamping member 62b.

また、第１接触部６４ａ及び第２接触部６４ｂの形状は、被加工物１１と点状に接触することが可能であれば制限されない。例えば、第１接触部６４ａ及び第２接触部６４ｂは、半球以外の曲面を有する形状（例えば、半楕円体状）、角錐状（例えば、三角錐状や四角錐状）、又は円錐状に形成されていてもよい。 Further, the shapes of the first contact portion 64a and the second contact portion 64b are not limited as long as they can make point-like contact with the workpiece 11 . For example, the first contact portion 64a and the second contact portion 64b are formed in a shape having a curved surface other than a hemisphere (for example, a semi-ellipsoid shape), a pyramid shape (for example, a triangular pyramid shape or a square pyramid shape), or a conical shape. may have been

さらに、上記では複数の第１接触部６４ａと複数の第２接触部６４ｂとがそれぞれＸ軸方向に沿って配列された構成例を示したが、第１接触部６４ａ及び第２接触部６４ｂは、例えばＸ軸方向に沿って帯状に形成されていてもよい。挟持部４４の変形例を、図５（Ａ）及び図５（Ｂ）に示す。 Furthermore, although the configuration example in which the plurality of first contact portions 64a and the plurality of second contact portions 64b are arranged along the X-axis direction has been described above, the first contact portions 64a and the second contact portions 64b are , for example, may be formed in a belt shape along the X-axis direction. A modified example of the holding portion 44 is shown in FIGS. 5(A) and 5(B).

図５（Ａ）は変形例に係る挟持部４６を示す正面図であり、図５（Ｂ）は変形例に係る挟持部４６の第１挟持部材６２ａを示す底面図である。挟持部４６は、第１接触部６４ａとは形状が異なる第１接触部６６ａと、第２接触部６４ｂとは形状が異なる第２接触部６６ｂとを備える点を除いて、挟持部４４と同様に構成されている。 FIG. 5A is a front view showing a holding portion 46 according to a modification, and FIG. 5B is a bottom view showing a first holding member 62a of the holding portion 46 according to a modification. The sandwiching portion 46 is similar to the sandwiching portion 44 except that it includes a first contact portion 66a different in shape from the first contact portion 64a and a second contact portion 66b different in shape from the second contact portion 64b. is configured to

第１挟持部材６２ａの下面側には、第１挟持部材６２ａの下面から下方に突出し、被加工物１１の上面側と接触する半円筒状の第１接触部６６ａが設けられている。また、第２挟持部材６２ｂの上面側には、第２挟持部材６２ｂの上面から上方に突出し、被加工物１１の下面側と接触する半円筒状の第２接触部６６ｂが設けられている。第１接触部６６ａ及び第２接触部６６ｂはそれぞれ、移動部３８の移動方向（Ｙ軸方向）と垂直な方向（Ｘ軸方向）に沿って配置されており、被加工物１１と線状に接触する。 A semi-cylindrical first contact portion 66a that protrudes downward from the lower surface of the first holding member 62a and contacts the upper surface of the workpiece 11 is provided on the lower surface side of the first holding member 62a. A semi-cylindrical second contact portion 66b that protrudes upward from the upper surface of the second holding member 62b and contacts the lower surface of the workpiece 11 is provided on the upper surface of the second holding member 62b. The first contact portion 66a and the second contact portion 66b are arranged along a direction (X-axis direction) perpendicular to the moving direction (Y-axis direction) of the moving portion 38, and linearly connected to the workpiece 11. Contact.

なお、第１接触部６６ａと第２接触部６６ｂとの形状は、被加工物１１と線状に接触することが可能であれば制限されない。例えば、第１接触部６６ａ及び第２接触部６６ｂは三角柱状に形成され、その高さ方向がＹ軸方向に沿うように配置されていてもよい。 The shapes of the first contact portion 66a and the second contact portion 66b are not limited as long as they can linearly contact the workpiece 11 . For example, the first contact portion 66a and the second contact portion 66b may be formed in the shape of a triangular prism and arranged such that the height direction thereof is along the Y-axis direction.

上記の挟持部４４又は挟持部４６を備える搬送ユニット３６を用いると、被加工物１１が反りを有する場合でも、搬送時の被加工物１１の傾きを抑制することができる。以下、搬送ユニット３６を備える加工装置２の具体的な動作例について説明する。なお、ここでは一例として、搬送ユニット３６が挟持部４４（図４（Ａ）参照）を備える場合について説明する。 By using the conveying unit 36 having the clamping portion 44 or the clamping portion 46, even if the workpiece 11 is warped, the inclination of the workpiece 11 during transportation can be suppressed. A specific operation example of the processing apparatus 2 including the transport unit 36 will be described below. Here, as an example, a case where the transport unit 36 is provided with a holding portion 44 (see FIG. 4A) will be described.

まず、図２に示すように、複数の被加工物１１を収容したカセット８をカセット載置部６上に搭載する。なお、複数の被加工物１１はそれぞれ、上面側（基板１３の表面１３ａ側）が長手方向の一端側から他端側に向かって凹状に湾曲するように反った状態でカセット８に収容されている（図６参照）。そして、搬送ユニット３６の移動部３８をカセット８に向かって移動させ、挟持部４４をカセット８の開口部８ｆに近づける。 First, as shown in FIG. 2, a cassette 8 containing a plurality of workpieces 11 is mounted on the cassette mounting portion 6. As shown in FIG. Each of the plurality of workpieces 11 is accommodated in the cassette 8 in a state in which the upper surface side (the surface 13a side of the substrate 13) is curved concavely from one longitudinal end side to the other longitudinal end side. (See Figure 6). Then, the moving portion 38 of the transport unit 36 is moved toward the cassette 8 to bring the clamping portion 44 close to the opening 8f of the cassette 8 .

図６は、挟持部４４がカセット８の近傍に配置された状態の加工装置２を示す断面図である。このとき、カセット８の高さは、一の第１ガイドレール５２の支持面５２ａ（図３（Ｂ）参照）及び一の第２ガイドレール５４の支持面５４ａが、仮置き部１６（図２参照）の支持面１８ａ及び支持面２０ａと概ね同一の高さに配置されるように、カセット載置部６によって調整される。 FIG. 6 is a cross-sectional view showing the processing apparatus 2 with the clamping portion 44 arranged in the vicinity of the cassette 8. As shown in FIG. At this time, the height of the cassette 8 is such that the supporting surface 52a of the one first guide rail 52 (see FIG. 3B) and the supporting surface 54a of the one second guide rail 54 are at the temporary placement portion 16 (see FIG. 2). ) are adjusted by the cassette mounting portion 6 so that they are arranged at approximately the same height as the support surfaces 18a and 20a.

また、挟持部４４の位置は、該一の第１ガイドレール５２及び該一の第２ガイドレール５４によって支持された被加工物１１を挟持部４４によって挟持可能となるように調整される。具体的には、挟持部４４の水平方向の位置は、第１接触部６４ａと第２接触部６４ｂとの間に被加工物１１が配置されるように、移動部３８（図２参照）によって調整される。また、挟持部４４の高さは、第１接触部６４ａが基板１３の表面１３ａよりも上方に配置され、第２接触部６４ｂが基板１３の裏面１３ｂよりも下方に配置されるように、昇降機構４０（図２参照）によって調整される。 Also, the position of the clamping portion 44 is adjusted so that the workpiece 11 supported by the one first guide rail 52 and the one second guide rail 54 can be clamped by the clamping portion 44 . Specifically, the horizontal position of the clamping portion 44 is adjusted by the moving portion 38 (see FIG. 2) such that the workpiece 11 is positioned between the first contact portion 64a and the second contact portion 64b. adjusted. Moreover, the height of the clamping portion 44 is raised and lowered so that the first contact portion 64 a is arranged above the front surface 13 a of the substrate 13 and the second contact portion 64 b is arranged below the back surface 13 b of the substrate 13 . Adjusted by mechanism 40 (see FIG. 2).

次に、挟持部４４によって被加工物１１を挟持する。図７は、被加工物１１が挟持部４４によって挟持された状態の加工装置２を示す断面図である。被加工物１１を挟持する際は、例えば、被加工物１１の外周領域１１ｃの一部（図７では基板１３の開口部８ｆ側の端部）が第１接触部６４ａと第２接触部６４ｂとの間に配置された状態で、第１挟持部材６２ａと第２挟持部材６２ｂとをそれぞれ、互いに接近するようにＺ軸方向に沿って移動させる。 Next, the workpiece 11 is held by the holding portion 44 . FIG. 7 is a cross-sectional view showing the processing apparatus 2 in which the workpiece 11 is held by the holding portion 44. As shown in FIG. When the workpiece 11 is clamped, for example, a portion of the outer peripheral region 11c of the workpiece 11 (the end on the opening 8f side of the substrate 13 in FIG. 7) is connected to the first contact portion 64a and the second contact portion 64b. , the first holding member 62a and the second holding member 62b are moved along the Z-axis direction so as to approach each other.

その結果、第１接触部６４ａが被加工物１１の上面側（基板１３の表面１３ａ側）と接触し、第２接触部６４ｂが被加工物１１の下面側（基板１３の裏面１３ｂ側）と接触する。これにより、被加工物１１の外周領域１１ｃが挟持部４４によって挟持される。 As a result, the first contact portion 64a contacts the upper surface side of the workpiece 11 (the front surface 13a side of the substrate 13), and the second contact portion 64b contacts the lower surface side of the workpiece 11 (the back surface 13b side of the substrate 13). Contact. Thereby, the outer peripheral region 11 c of the workpiece 11 is held by the holding portion 44 .

なお、第１接触部６４ａ及び第２接触部６４ｂは、例えば半球状に形成されており、移動部３８の移動方向（Ｙ軸方向）と垂直な方向（Ｘ軸方向）に沿って被加工物１１と点状に接触する。これにより、被加工物１１と挟持部４４とが接触する領域の幅（Ｙ軸方向における長さ）が小さく抑えられる。 The first contact portion 64a and the second contact portion 64b are formed, for example, in a hemispherical shape, and extend along the direction (X-axis direction) perpendicular to the moving direction (Y-axis direction) of the moving portion 38 so as to contact the workpiece. 11 and point-like contact. As a result, the width (the length in the Y-axis direction) of the contact area between the workpiece 11 and the clamping portion 44 can be kept small.

そのため、上面側が長手方向の一端側から他端側に向かって凹状に湾曲するように反った状態の被加工物１１を挟持部４４によって挟持しても、被加工物１１の第３側壁８ｄ側の端部が持ち上げられて被加工物１１が大きく傾くことがない。よって、被加工物１１がカセット８の上壁８ｅ、第１ガイドレール５２、第２ガイドレール５４等に接触して破損することを防止できる。 Therefore, even if the clamping portion 44 clamps the workpiece 11 whose upper surface side is warped in a concave shape from one longitudinal end to the other longitudinal end, the third sidewall 8 d side of the workpiece 11 is held. is lifted and the workpiece 11 is not greatly inclined. Therefore, it is possible to prevent the workpiece 11 from contacting the upper wall 8e of the cassette 8, the first guide rail 52, the second guide rail 54 and the like and being damaged.

なお、挟持部４４に代えて挟持部４６（図５（Ａ）参照）を用いる場合、第１接触部６６ａ及び第２接触部６６ｂは、移動部３８の移動方向（Ｙ軸方向）と垂直な方向（Ｘ軸方向）に沿って被加工物１１と線状に接触する。この場合も、反りを有する被加工物１１がカセット８の内部で大きく傾くことを防止できる。 In addition, when the holding portion 46 (see FIG. 5A) is used instead of the holding portion 44, the first contact portion 66a and the second contact portion 66b are perpendicular to the moving direction of the moving portion 38 (Y-axis direction). It makes linear contact with the workpiece 11 along the direction (X-axis direction). In this case as well, it is possible to prevent the warped workpiece 11 from greatly tilting inside the cassette 8 .

次に、挟持部４４を移動させ、被加工物１１をカセット８から仮置き部１６に搬出する。図８は、被加工物１１がカセット８から搬出される際の加工装置２を示す断面図である。 Next, the clamping portion 44 is moved to unload the workpiece 11 from the cassette 8 to the temporary placement portion 16 . FIG. 8 is a cross-sectional view showing the processing apparatus 2 when the workpiece 11 is unloaded from the cassette 8. As shown in FIG.

挟持部４４によって被加工物１１を挟持した状態で、挟持部４４をＹ軸方向に沿って仮置き部１６側に向かって移動させると、被加工物１１は開口部８ｆを介してカセット８から引き出され、仮置き部１６（図２参照）の支持面１８ａ及び支持面２０ａによって支持されながら移動する。そして、被加工物１１の全体が仮置き部１６上に配置されると、挟持部４４による被加工物１１の挟持が解除され、被加工物１１の搬出が完了する。 When the clamping portion 44 is moved toward the temporary placement portion 16 along the Y-axis direction while clamping the workpiece 11 by the clamping portion 44, the workpiece 11 is removed from the cassette 8 through the opening 8f. It is pulled out and moves while being supported by the support surfaces 18a and 20a of the temporary placement section 16 (see FIG. 2). Then, when the entire workpiece 11 is placed on the temporary placement section 16, the clamping of the workpiece 11 by the clamping section 44 is released, and unloading of the workpiece 11 is completed.

そして、図２に示す仮置き部１６に被加工物１１が仮置きされた後、第１ガイドレール１８と第２ガイドレール２０とをＸ軸方向に沿って互いに接近するように移動させ、被加工物１１を挟持面１８ｂ，２０ｂによって挟み込む。これにより、被加工物１１の位置合わせが行われる。 After the workpiece 11 is temporarily placed on the temporary placement portion 16 shown in FIG. The workpiece 11 is sandwiched between the sandwiching surfaces 18b and 20b. As a result, the workpiece 11 is aligned.

次に、搬送ユニット３６の吸引部４２を被加工物１１の上方に移動させ、吸引部４２の下面側に設けられた複数の吸着パッドによって被加工物１１を吸引保持する。また、チャックテーブル１４をＸ軸方向に沿って移動させ、被加工物１１の下方に配置する。 Next, the suction unit 42 of the transport unit 36 is moved above the workpiece 11 , and the workpiece 11 is suction-held by a plurality of suction pads provided on the lower surface side of the suction unit 42 . Also, the chuck table 14 is moved along the X-axis direction and arranged below the workpiece 11 .

そして、第１ガイドレール１８及び第２ガイドレール２０をＸ軸方向に沿って互いに離隔するように移動させるとともに、昇降機構４０によって吸引部４２を下降させ、被加工物１１をチャックテーブル１４の保持面１４ａ上に配置する。その後、保持面１４ａに吸引源の負圧を作用させ、被加工物１１をチャックテーブル１４によって吸引保持する。 Then, the first guide rail 18 and the second guide rail 20 are moved away from each other along the X-axis direction, and the lifting mechanism 40 lowers the suction unit 42 to hold the workpiece 11 on the chuck table 14. It is arranged on the surface 14a. After that, a negative pressure of a suction source is applied to the holding surface 14 a to suck and hold the workpiece 11 by the chuck table 14 .

次に、被加工物１１を保持した状態のチャックテーブル１４をＸ軸方向に沿って後方に移動させ、加工ユニット２２ａ，２２ｂの下方に配置する。そして、加工ユニット２２ａ，２２ｂによって被加工物１１に対して所定の切削加工を施す。 Next, the chuck table 14 holding the workpiece 11 is moved rearward along the X-axis direction and arranged below the machining units 22a and 22b. Then, the workpiece 11 is subjected to a predetermined cutting process by the machining units 22a and 22b.

被加工物１１の加工が完了したら、チャックテーブル１４を仮置き部１６の下方に移動させ、搬送ユニット３６の吸引部４２によって被加工物１１を吸引保持する。そして、吸引部４２によって被加工物１１を第１ガイドレール１８及び第２ガイドレール２０上に搬送する。その後、第１ガイドレール１８及び第２ガイドレール２０をＸ軸方向に沿って互いに接近するように移動させ、被加工物１１を挟持面１８ｂ，２０ｂによって挟み込むことにより、被加工物１１の位置合わせを行う。 When the machining of the workpiece 11 is completed, the chuck table 14 is moved below the temporary placement section 16 , and the workpiece 11 is sucked and held by the suction section 42 of the transfer unit 36 . Then, the suction unit 42 conveys the workpiece 11 onto the first guide rail 18 and the second guide rail 20 . Thereafter, the first guide rail 18 and the second guide rail 20 are moved toward each other along the X-axis direction, and the workpiece 11 is sandwiched between the clamping surfaces 18b and 20b, thereby aligning the workpiece 11. I do.

次に、仮置き部１６に仮置きされた被加工物１１の外周領域１１ｃの一部（例えば、基板１３のカセット８とは反対側の端部）を挟持部４４によって挟持する。このときの挟持部４４の動作は、被加工物１１の搬出時に被加工物１１を挟持する挟持部４４の動作と同様である。そして、移動部３８によって挟持部４４をカセット８に向かって移動させ、被加工物１１をカセット８の内部に搬送する。これにより、被加工物１１はカセット８に搬入され、第１ガイドレール５２及び第２ガイドレール５４（図３（Ｂ）参照）によって支持される。 Next, a portion of the outer peripheral region 11 c of the workpiece 11 temporarily placed on the temporary placement section 16 (for example, the end of the substrate 13 opposite to the cassette 8 ) is held by the holding section 44 . The operation of the clamping portion 44 at this time is the same as the operation of the clamping portion 44 that clamps the workpiece 11 when the workpiece 11 is unloaded. Then, the clamping portion 44 is moved toward the cassette 8 by the moving portion 38 to convey the workpiece 11 into the cassette 8 . Thereby, the workpiece 11 is loaded into the cassette 8 and supported by the first guide rail 52 and the second guide rail 54 (see FIG. 3B).

被加工物１１をカセット８に搬入する際も、挟持部４４は、移動部３８の移動方向（Ｙ軸方向）と垂直な方向（Ｘ軸方向）に沿って被加工物１１と点状に接触する。そのため、被加工物１１が挟持部４４によって挟持された際に大きく傾くことがなく、搬入時に被加工物１１がカセットの上壁８ｅ、第１ガイドレール５２、第２ガイドレール５４等に接触して損傷することを防止できる。 Also when the workpiece 11 is carried into the cassette 8, the clamping portion 44 makes point-like contact with the workpiece 11 along the direction (X-axis direction) perpendicular to the moving direction (Y-axis direction) of the moving portion 38. do. Therefore, when the workpiece 11 is clamped by the clamping portion 44, it does not tilt greatly, and the workpiece 11 does not come into contact with the upper wall 8e of the cassette, the first guide rail 52, the second guide rail 54, etc. during loading. can be prevented from being damaged.

なお、上記では、加工装置２が加工ユニット２２ａ，２２ｂによって被加工物１１を切削する切削装置である場合について説明した。ただし、加工装置２は、カセット載置部６、仮置き部１６、及び搬送ユニット３６を備えていれば、切削装置に限られない。 In addition, above, the case where the processing apparatus 2 was a cutting apparatus which cuts the to-be-processed object 11 by the processing units 22a and 22b was demonstrated. However, the processing device 2 is not limited to a cutting device as long as it includes the cassette mounting portion 6, the temporary placement portion 16, and the transport unit 36.

例えば加工装置２は、加工ユニット２２ａ，２２ｂに代えて、被加工物１１を研削するための研削砥石が装着される加工ユニット（研削ユニット）、被加工物１１を研磨するための研磨パッドが装着される加工ユニット（研磨ユニット）、又はレーザービームの照射によって被加工物１１を加工する加工ユニット（レーザー照射ユニット）を備えていてもよい。この場合、加工装置２はそれぞれ、研削装置、研磨装置、レーザー加工装置として機能する。 For example, the processing apparatus 2 is equipped with a processing unit (grinding unit) in which a grinding wheel for grinding the workpiece 11 and a polishing pad for polishing the workpiece 11 are attached instead of the processing units 22a and 22b. A processing unit (polishing unit) for polishing or a processing unit (laser irradiation unit) for processing the workpiece 11 by irradiating the workpiece 11 with a laser beam may be provided. In this case, the processing device 2 functions as a grinding device, a polishing device, and a laser processing device, respectively.

その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structures, methods, and the like according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention.

１１ 被加工物
１１ａ デバイス領域
１１ｂ 中央領域
１１ｃ 外周領域
１３ 基板
１３ａ 表面
１３ｂ 裏面
１５ 樹脂層（モールド樹脂）
１７ 分割予定ライン（ストリート）
１９ マーカー
２１ 電極
２ 切削装置
４ 基台
４ａ 開口
４ｂ 開口
６ カセット載置部
８ カセット
８ａ 底部
８ｂ 第１側壁
８ｃ 第２側壁
８ｄ 第３側壁
８ｅ 上壁
８ｆ 開口部
１０ テーブルカバー
１２ 防塵防滴カバー
１４ チャックテーブル
１４ａ 保持面
１６ 仮置き部
１８ 第１ガイドレール
２０ 第２ガイドレール
１８ａ，２０ａ 支持面
１８ｂ，２０ｂ 挟持面
２２ａ，２２ｂ 加工ユニット
２４ 第１支持構造
２６ａ，２６ｂ 移動ユニット（移動機構）
２８ａ，２８ａ ハウジング
３０ 切削ブレード
３２ 第２支持構造
３４ ガイドレール
３６ 搬送ユニット（搬送機構）
３８ 移動部
４０ 昇降機構
４２ 吸引部
４４ 挟持部
４６ 挟持部
５０ 支持部
５２ 第１ガイドレール
５２ａ 支持面
５４ 第２ガイドレール
５４ａ 支持面
５６ 隙間
６０ 支持部
６２ａ 第１挟持部材（上部挟持部材）
６２ｂ 第２挟持部材（下部挟持部材）
６４ａ，６６ａ 第１接触部
６４ｂ，６６ｂ 第２接触部 Reference Signs List 11 workpiece 11a device region 11b central region 11c peripheral region 13 substrate 13a front surface 13b rear surface 15 resin layer (mold resin)
17 Planned division line (street)
19 Marker 21 Electrode 2 Cutting device 4 Base 4a Opening 4b Opening 6 Cassette mounting part 8 Cassette 8a Bottom part 8b First side wall 8c Second side wall 8d Third side wall 8e Upper wall 8f Opening part 10 Table cover 12 Dust and drip proof cover 14 Chuck table 14a Holding surface 16 Temporary placement unit 18 First guide rail 20 Second guide rail 18a, 20a Support surface 18b, 20b Clamping surface 22a, 22b Processing unit 24 First support structure 26a, 26b Moving unit (moving mechanism)
28a, 28a housing 30 cutting blade 32 second support structure 34 guide rail 36 transport unit (transport mechanism)
38 moving part 40 lifting mechanism 42 suction part 44 clamping part 46 clamping part 50 support part 52 first guide rail 52a support surface 54 second guide rail 54a support surface 56 gap 60 support part 62a first clamping member (upper clamping member)
62b Second holding member (lower holding member)
64a, 66a first contact portion 64b, 66b second contact portion

Claims (1)

板状の被加工物を保持するチャックテーブルと、
該チャックテーブルによって保持された被加工物を加工する加工ユニットと、
複数の該被加工物を収容可能なカセットが載置されるカセット載置部と、
該カセットから搬出された該被加工物、又は該カセットに搬入される該被加工物が仮置きされる仮置き部と、
該カセットと該仮置き部との間で該被加工物を搬送する搬送ユニットと、を備え、
該カセットは、
底部と、
該底部と接続され互いに対面する第１側壁及び第２側壁と、
該第１側壁から該第２側壁側に突出するように配置され、該被加工物の外周領域を支持する第１ガイドレールと、
該第２側壁から該第１側壁側に突出するように配置され、該被加工物の外周領域を支持する第２ガイドレールと、を備え、
該搬送ユニットは、
該被加工物の外周領域を上下から挟持する挟持部と、
該挟持部を該カセットと該仮置き部との間で移動させる移動部と、を備え、
該挟持部は、
該移動部の移動方向と垂直な方向に沿って該被加工物の上面側と複数の点又は線状に接触する第１接触部と、
該移動部の移動方向と垂直な方向に沿って該被加工物の下面側と複数の点又は線状に接触する第２接触部と、を備えることを特徴とする加工装置。 a chuck table for holding a plate-like workpiece;
a machining unit for machining the workpiece held by the chuck table;
a cassette mounting portion on which a cassette capable of accommodating a plurality of workpieces is mounted;
a temporary placement section where the workpiece carried out from the cassette or the workpiece carried into the cassette is temporarily placed;
a transport unit that transports the workpiece between the cassette and the temporary placement unit;
The cassette is
a bottom;
a first sidewall and a second sidewall connected to the bottom and facing each other;
a first guide rail arranged so as to protrude from the first side wall toward the second side wall and supporting an outer peripheral region of the workpiece;
a second guide rail arranged to project from the second side wall toward the first side wall and supporting the outer peripheral region of the workpiece;
The transport unit is
a clamping portion that clamps the outer peripheral region of the workpiece from above and below;
a moving part that moves the holding part between the cassette and the temporary placement part,
The holding portion is
a first contact portion that makes contact with the upper surface side of the workpiece in a plurality of points or lines along a direction perpendicular to the moving direction of the moving portion;
A processing apparatus, comprising: a second contact portion that contacts the lower surface side of the workpiece in a plurality of points or lines along a direction perpendicular to the moving direction of the moving portion.
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