TW201703957A - Cutting apparatus can reduce quantity of parts to reduce costs and look for miniaturization at the same time - Google Patents

Cutting apparatus can reduce quantity of parts to reduce costs and look for miniaturization at the same time Download PDF

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TW201703957A
TW201703957A TW105107381A TW105107381A TW201703957A TW 201703957 A TW201703957 A TW 201703957A TW 105107381 A TW105107381 A TW 105107381A TW 105107381 A TW105107381 A TW 105107381A TW 201703957 A TW201703957 A TW 201703957A
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workpiece
cutting
pair
moving
auxiliary
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TW105107381A
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Chinese (zh)
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TWI674180B (en
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Satoshi Ohkawara
Makoto Yagihara
Kentaro Terashi
Katsuhiko Akase
shintaro Matsuoka
Kazunari Tanaka
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A cutting apparatus enabling the entire composition to have simple and miniaturization and capable of reducing quantity of parts at the same time is provided. The cutting device comprises: a cassette carrying mechanism; a moving-in/moving-out mechanism of moving cassettes, which are carried at the cassette loading mechanism, in and out; a temporary placing mechanism of temporarily placing the processed articles moved out by the moving-in/moving-out mechanism; a retaining table of retaining the processed articles temporarily placed at the temporary placing mechanism; a cutting mechanism of cutting the processed articles retained in the retaining table; and a processing-feeding mechanism for carrying out processing-feeding for the retaining table in the processing-feeding direction (X-axis direction). The processing-feeding mechanism comprises: an X-axis guide rail for supporting the retaining table to move between the processed article dismantling/assembling area configured with the temporary placing mechanism and the processing area configured with the cutting mechanism in the X-axis direction; and a processing-feeding means for moving the retaining table along the X-axis guide rail. The moving-in/moving-out mechanism comprises: a supporting stage; a grasping member configured on the supporting stage to grasp the processed articles accommodated in the cassette; a pair of limiting pins of limiting the processed articles at the specified position; and a conveyance moving means for moving the supporting stage in the Y-axis direction. The temporary placing mechanism comprises: a pair of supporting rails extending in the Y-axis direction and having a bottom part and a side part for supporting both sides of the processed articles, and enabling the bottom part to be opened; an opening means to open the bottom part of the pair of supporting rails; and an elevation means to move the pair of supporting rails in the vertical direction.

Description

切削裝置 Cutting device

本發明係關於用以切削半導體晶圓等之被加工物的切削裝置。 The present invention relates to a cutting device for cutting a workpiece such as a semiconductor wafer.

在半導體裝置製造工程中，藉由格子狀地被配列在為略圓板形狀之半導體晶圓之表面上的分割預定線區劃岀複數區域，在該被區劃之區域形成IC、LSI等之裝置。而且，藉由沿著分割預定線切斷半導體晶圓，分割形成有裝置的區域而製造岀各個半導體裝置。 In the semiconductor device manufacturing process, a plurality of divided regions are arranged in a lattice shape on a surface of a semiconductor wafer having a substantially circular plate shape, and a device such as an IC or an LSI is formed in the region to be divided. Further, each semiconductor device is manufactured by cutting the semiconductor wafer along the planned dividing line and dividing the region in which the device is formed.

沿著分割預定線切斷半導體晶圓等之被加工物的切削裝置，具備：載置收容有複數之被加工物的卡匣之卡匣載置手段，和從被載置在該卡匣載置手段之卡匣搬岀及搬入被加工物之搬岀、搬入手段，和暫時放置藉由該搬岀、搬入手段被搬岀之被加工物的暫時放置手段，和保持被暫時放置在該暫時放置手段之被加工物的保持台，和切削被保持在該保持台之被加工物的切削手段，和使該保持台在加工進給方向(X軸方向)進行加工進給的加工進給手段。而且，藉由切削手段具備：以能夠旋轉之方式具 備第一切削刀之第一切削手段，和以能夠旋轉之方式具備被配設成與該第一切削手段之第一切削刀相向之第二切削刀的第二切削手段，可以沿著分割預定線效率佳地切斷半導體晶圓等之被加工物切斷而分割成各個裝置(例如，參照專利文獻1)。 A cutting device for cutting a workpiece such as a semiconductor wafer along a predetermined dividing line includes a cassette mounting means for placing a cassette in which a plurality of workpieces are stored, and a cassette mounting means for mounting the plurality of workpieces thereon The means for transporting and transporting the processed objects, and the means for temporarily placing the workpieces that have been moved by the loading and unloading means, and temporarily holding the temporarily placed objects in the temporary loading A holding table for the workpiece to be placed, and a cutting means for cutting the workpiece held by the holding table, and a machining feeding means for feeding the holding table in the machining feed direction (X-axis direction) . Moreover, the cutting means is provided to be capable of rotating a first cutting means for preparing the first cutting blade and a second cutting means for rotatably providing the second cutting blade disposed to face the first cutting blade of the first cutting means The workpiece is cut and cut into individual devices by cutting off the workpiece such as a semiconductor wafer (see, for example, Patent Document 1).

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開平11-26402號公報 [Patent Document 1] Japanese Patent Laid-Open No. 11-26402

然後，上述切削裝置有尤其用以搬運被加工物之機構需要複數使得裝置全體之構成複雜且大型化，並且零件數量變多，製造成本變高的問題。 In addition, the above-described cutting device has a problem that the mechanism for transporting the workpiece is required to be complicated, and the configuration of the entire device is complicated and large, and the number of components is increased, and the manufacturing cost is increased.

本發明係鑒於上述情形而創作岀，其主要之技術課題，在於提供可以使裝置全體之構成單純而成為小型化，並且減少零件數量而降低製造成本之切削裝置。 The present invention has been made in view of the above circumstances, and a main technical object thereof is to provide a cutting device which can reduce the manufacturing cost by reducing the number of components and reducing the number of components.

為了解決上述主要技術課題，若藉由本發明時，提供一種切削裝置，具備：載置收容有複數之被加工物的卡匣之卡匣載置機構，和從被載置在該卡匣載置機構之卡匣搬岀及搬入被加工物之搬岀、搬入機構，和暫時放 置藉由該搬岀、搬入機構被搬岀之被加工物的暫時放置機構，和保持被暫時放置在該暫時放置機構之被加工物的保持台，和切削被保持在該保持台之被加工物的切削機構，和使該保持台在加工進給方向(X軸方向)進行加工進給的加工進給機構，該切削裝置之特徵在於：該加工進給機構具備：X軸導軌，其係用以支撐成使該保持台在配設有該暫時放置機構之被加工物拆裝區域，和配設有該切削機構之加工區域之間於加工進給方向(X軸方向)能夠移動；和加工進給手段，其係沿著該X軸導軌而使該保持台移動，該暫時放置機構和該卡匣載置機構係在與X軸方向正交之Y軸方向上相鄰接而配設，該搬岀、搬入機構具備支撐基台；被配設在該支撐基台，把持被收容在卡匣之被加工物的把持構件；將被加工物限制在規定之位置的一對限制銷；及使該支撐基台在Y軸方向移動之搬運移動手段，該暫時放置機構具備：在Y軸方向延伸並具有支撐被加工物之兩側部的底部和側部，且該底部被構成能夠開關之一對支撐軌道；和開關該一對支撐軌道之該底部的開關手段；和使該一對支撐軌道在上下方向移動之升降手段，該保持台被定位在該被加工物拆裝區域之時，藉由該搬岀、搬入機構，搬岀被收容在卡匣之被加工物而暫時放置在構成該暫時放置機構之該一對支撐軌道，並藉由該升降手段使該一對支撐軌道下降而將被加工物載置在該保持 台，且藉由該開關手段開啟該底部，將被加工物保持在該保持台。 In order to solve the above-mentioned main technical problems, the present invention provides a cutting apparatus including: a cassette mounting mechanism that mounts a cassette in which a plurality of workpieces are stored, and is placed on the cassette The card of the organization will be moved and moved into the processed object, moved into the organization, and temporarily placed A temporary placement mechanism for the workpiece to be moved by the loading and unloading mechanism, and a holding table for holding the workpiece temporarily placed in the temporary placement mechanism, and the cutting is held in the holding table. a cutting mechanism for the object, and a machining feed mechanism for feeding the holding table in the machining feed direction (X-axis direction), the cutting device characterized in that the machining feed mechanism includes: an X-axis guide rail a support for moving the holding stage between the workpiece dismounting area in which the temporary placing mechanism is disposed, and a processing area in which the cutting mechanism is disposed in the machining feed direction (X-axis direction); and The machining feed means moves the holding table along the X-axis guide rail, and the temporary placement mechanism and the cassette mounting mechanism are adjacent to each other in the Y-axis direction orthogonal to the X-axis direction The loading and unloading mechanism includes a supporting base; a holding member disposed on the supporting base to hold the workpiece accommodated in the cassette; and a pair of regulating pins for restricting the workpiece to a predetermined position; And making the support abutment in the Y-axis direction The temporary moving mechanism includes: a bottom portion and a side portion extending in the Y-axis direction and supporting both side portions of the workpiece, and the bottom portion is configured to be capable of switching one of the pair of support rails; and the switch a switching means for supporting the bottom of the rail; and a lifting means for moving the pair of supporting rails in the vertical direction, wherein the holding table is positioned in the workpiece dismounting area, by the loading and unloading mechanism The pair of support rails constituting the temporary placement mechanism are temporarily placed and placed in the cassette, and the pair of support rails are lowered by the lifting means to place the workpiece on the holder. And the bottom of the table is opened by the switch means to hold the workpiece on the holding table.

以與上述暫時放置機構相鄰接之方式，在相對於卡匣載置機構為Y軸方向相反側配設具備用以洗淨被加工物之旋轉台的洗淨機構，同時在該洗淨機構之正上方配設有被構成與暫時放置機構連通且暫時放置被加工物之輔助暫時放置機構，該輔助暫時放置機構具備：在Y軸方向延伸且具有支撐被加工物之兩側部之底部和側部，被構成該底部能夠開關之一對輔助支撐軌道；開關該一對輔助支撐軌道之底部的開關手段；及使一對輔助支撐軌道在上下方向移動之輔助升降手段。 A cleaning mechanism including a rotary table for washing the workpiece is disposed on a side opposite to the Y-axis direction with respect to the cassette mounting mechanism so as to be adjacent to the temporary placement mechanism, and the cleaning mechanism is provided at the same time. An auxiliary temporary placement mechanism that is configured to be in contact with the temporary placement mechanism and temporarily places the workpiece, is disposed directly above the auxiliary temporary placement mechanism, and has a bottom portion extending in the Y-axis direction and having both sides supporting the workpiece The side portion is configured as an auxiliary support rail for one of the bottom switchable switches; a switch means for switching the bottom of the pair of auxiliary support rails; and an auxiliary lifting means for moving the pair of auxiliary support rails in the up and down direction.

上述搬岀、搬入機構具備：被配設在支撐基台且把持在被支撐於一對輔助支撐軌道之被加工物中與藉由把持構件被把持之區域相反側之區域的輔助把持構件，和將被支撐於一對輔助支撐軌道之被加工物限制在規定之位置的一對輔助限制銷，於保持切削完之被加工物之保持台被定位在被加工物拆裝區域之時，在構成暫時放置機構之一對支撐軌道之底部呈開啟之狀態下，使該一對支撐軌道下降而將底部定位在切削完之被加工物之下部之後，在使該底部關閉而支撐切削完之被加工物之狀態下，使該一對支撐軌道上升，接著，藉由搬岀、搬入機構之把持構件而把持被收容在卡匣之被加工物，同時將被設置在支撐基台之一對輔助限制銷定位在切削完之被加工物中與藉由把持構件被把持 之區域相反側之區域的端面，且藉由使該支撐基台移動至該輔助暫時放置機構側，將被收容在卡匣之被加工物定位在暫時放置機構，同時將切削完之被加工物定位在輔助暫時放置機構，藉由構成輔助暫時放置機構之輔助升降手段暫時放置在一對輔助支撐軌道，並藉由升降手段使一對輔助支撐軌道下降而將被加工物載置在洗淨機構之旋轉台，且藉由開關手段開啟底部使切削完之被加工物保持在旋轉台。 The loading and unloading mechanism includes an auxiliary grip member that is disposed on the support base and that is held in a region on the opposite side of the region supported by the grip member by the workpiece supported by the pair of auxiliary support rails, and A pair of auxiliary restricting pins that are supported by a pair of auxiliary support rails at a predetermined position, and are configured when the holding table of the workpiece to be cut is positioned in the workpiece dismounting area When one of the temporary placement mechanisms is opened to the bottom of the support rail, the pair of support rails are lowered to position the bottom portion after the cut portion of the workpiece, and the bottom portion is closed to support the cutting and being processed. In the state of the object, the pair of support rails are raised, and then the workpiece to be handled in the cassette is gripped by the gripping member of the loading and unloading mechanism, and the auxiliary support is placed on one of the support bases. The pin is positioned in the machined workpiece and is held by the holding member An end surface of the region on the opposite side of the region, and by moving the support base to the auxiliary temporary placement mechanism side, positioning the workpiece accommodated in the cassette at the temporary placement mechanism, and simultaneously cutting the workpiece Positioned in the auxiliary temporary placement mechanism, temporarily placed on the pair of auxiliary support rails by the auxiliary lifting means constituting the auxiliary temporary placement mechanism, and the workpiece is placed on the cleaning mechanism by lowering the pair of auxiliary support rails by the lifting means The rotating table is opened, and the bottom portion is opened by the switching means to keep the workpiece to be processed on the rotating table.

上述洗淨機構具備被配設在旋轉台之上方的噴射洗淨水之噴射噴嘴，噴射噴嘴藉由被配設在構成搬岀、搬入機構之支撐基台且選擇性地進行卡合的卡合手段，隨著該支撐基台之移動，在Y軸方向移動，至少對從被加工物之外周至中心的區域噴射洗淨水。 The cleaning mechanism includes an injection nozzle for spraying the washing water disposed above the rotary table, and the injection nozzle is selectively engaged with the support base that constitutes the loading and unloading mechanism. The means moves in the Y-axis direction as the support base moves, and at least the washing water is sprayed from the outer circumference to the center of the workpiece.

在上述洗淨機構之噴射噴嘴經滑輪連結一端與錘體連結的接線之另一端，且被構成藉由錘體之重力在Y軸方向移動，卡合手段具備以能夠進退之方式被配設在支撐基台的卡合桿，在卡合桿進出之狀態下從噴射噴嘴中藉由錘體之重力而移動的方向使接觸。 The other end of the wire connecting the one end of the cleaning mechanism to the hammer body via the pulley is configured to move in the Y-axis direction by the gravity of the hammer body, and the engaging means is provided to be able to move forward and backward. The engaging lever of the supporting base contacts the direction in which the moving force of the hammer moves by the gravity of the hammer body in a state where the engaging lever is moved in and out.

上述切削機構具備；以能夠旋轉之方式具備第一切削刀之第一切削手段，和以能夠旋轉之方式具備被配設成與該第一切削手段之第一切削刀相向之第二切削刀的第二切削手段，以能夠在與X軸方向正交之Y軸方向移動之方式支撐該第一切削手段和該第二切削手段之Y軸導 軌；和沿著該Y軸導軌使第一切削手段移動之第一分度進給手段，及沿著Y軸導軌使第二切削手段移動的第二分度進給手段。 The cutting mechanism includes: a first cutting means that rotatably includes a first cutting blade; and a rotatably provided second cutting blade that is disposed to face the first cutting blade of the first cutting means The second cutting means supports the first cutting means and the Y-axis guide of the second cutting means so as to be movable in the Y-axis direction orthogonal to the X-axis direction a rail; a first indexing means for moving the first cutting means along the Y-axis rail; and a second indexing means for moving the second cutting means along the Y-axis rail.

本發明之切削裝置因被構成上述般，於保持被加工物之保持台被定位在被加工物拆裝區域之時，藉由搬岀、搬入機構搬岀被收容在卡匣之被加工物而暫時放置在構成暫時放置機構之一對支撐導軌，且藉由升降手段使一對支撐導軌下降而將被加工物載置在保持台，且藉由開關手段開啟底部，將被加工物保持在保持台，故搬運被加工物之搬運手段實質上僅有搬岀、搬入機構，因此可以減少零件數量而降低成本，同時可以謀求裝置之小型化。 In the cutting device of the present invention, when the holding table for holding the workpiece is positioned in the workpiece detachable area, the workpiece is stored in the cassette by the loading and unloading mechanism. Temporarily placed on one of the pair of temporary placement mechanisms to support the guide rails, and the pair of support rails are lowered by the lifting means to place the workpiece on the holding table, and the bottom portion is opened by the switching means to keep the workpiece in the holding state. Since the transport means for transporting the workpiece is basically only the transporting and transporting mechanism, the number of components can be reduced, the cost can be reduced, and the size of the device can be reduced.

2‧‧‧靜止基台 2‧‧‧Standing abutment

3‧‧‧保持台機構 3‧‧‧ Maintaining the institution

32‧‧‧移動基台 32‧‧‧Mobile abutments

34‧‧‧保持台 34‧‧‧ Keeping the table

35‧‧‧加工進給手段 35‧‧‧Processing means of feeding

351‧‧‧X軸線性軌道 351‧‧‧X-axis orbit

352‧‧‧X軸線圈可動件 352‧‧‧X-axis coil movable parts

4‧‧‧切削機構 4‧‧‧ cutting mechanism

5a‧‧‧第一切削手段 5a‧‧‧First cutting means

5b‧‧‧第二切削手段 5b‧‧‧Second cutting means

54‧‧‧分度進給手段 54‧‧‧Divided feeding means

540‧‧‧共同之Y軸線性軌道 540‧‧‧Common Y-axis orbit

544a‧‧‧第一Y軸線圈可動件 544a‧‧‧First Y-axis coil movable parts

544b‧‧‧第二線圈可動件 544b‧‧‧second coil movable parts

6‧‧‧卡匣載置機構 6‧‧‧Carcass loading mechanism

60‧‧‧卡匣 60‧‧‧Carmen

7‧‧‧搬出、搬入機構 7‧‧‧ Moving out and moving into the organization

71‧‧‧搬運移動手段 71‧‧‧Transportation means

72‧‧‧支撐基台 72‧‧‧Support abutment

74‧‧‧把持構件 74‧‧‧ Holding components

75‧‧‧一對限制銷 75‧‧‧A pair of restriction pins

76‧‧‧輔助把持構件 76‧‧‧Auxiliary gripping members

77‧‧‧一對輔助限制銷 77‧‧‧A pair of auxiliary restraint pins

8‧‧‧暫時放置機構 8‧‧‧ Temporary placement agency

80‧‧‧一對支撐軌道 80‧‧‧A pair of support tracks

9‧‧‧輔助暫時放置機構 9‧‧‧Assisted temporary placement agency

90‧‧‧一對輔助支撐軌道 90‧‧‧A pair of auxiliary support tracks

10‧‧‧洗淨機構 10‧‧‧ Washing agency

11‧‧‧洗淨殼罩 11‧‧‧Clean cover

12‧‧‧旋轉台 12‧‧‧Rotating table

13‧‧‧噴射噴嘴 13‧‧‧jet nozzle

14‧‧‧錘體 14‧‧‧ Hammer

15‧‧‧接線 15‧‧‧ wiring

16‧‧‧滑輪 16‧‧‧ pulley

F‧‧‧環狀框架 F‧‧‧Ring frame

T‧‧‧切割膠帶 T‧‧‧ cutting tape

W‧‧‧半導體晶圓 W‧‧‧Semiconductor Wafer

圖1為依照本發明而構成之切削裝置之斜視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a cutting apparatus constructed in accordance with the present invention.

圖2為圖1所示之切削裝置之重要部分斜視圖。 Fig. 2 is a perspective view showing an essential part of the cutting device shown in Fig. 1.

圖3為表示被安裝於圖1所示之切削裝置的切削機構的斜視圖。 Fig. 3 is a perspective view showing a cutting mechanism attached to the cutting device shown in Fig. 1;

圖4為圖1中之A-A剖面圖。 Figure 4 is a cross-sectional view taken along line A-A of Figure 1.

圖5為構成圖1所示之切削裝置之搬岀、搬入機構的斜視圖。 Fig. 5 is a perspective view showing a loading and unloading mechanism constituting the cutting device shown in Fig. 1;

圖6為圖5所示之搬岀、搬入機構7之重要部分前視 圖。 Figure 6 is a front view of an important part of the loading and unloading mechanism 7 shown in Figure 5 Figure.

圖7為構成圖1所示之切削裝置之暫時放置機構及輔助暫時放置機構之斜視圖。 Fig. 7 is a perspective view showing a temporary placement mechanism and an auxiliary temporary placement mechanism constituting the cutting device shown in Fig. 1.

圖8為圖7所示之暫時放置機構之側面圖。 Figure 8 is a side elevational view of the temporary placement mechanism of Figure 7.

圖9為構成圖1所示之切削裝置之洗淨機構的斜視圖。 Fig. 9 is a perspective view showing a cleaning mechanism constituting the cutting device shown in Fig. 1.

圖10為表示將搬岀、搬入機構之把持構件及一對限制銷定位在待機位置之狀態的斜視圖。 FIG. 10 is a perspective view showing a state in which the holding member of the loading and unloading mechanism and the pair of regulating pins are positioned at the standby position.

圖11為表示藉由搬岀、搬入機構之把持構件把持支撐被收容在載置於卡匣載置機構之卡匣的被加工物的環狀框架之狀態的斜視圖。 FIG. 11 is a perspective view showing a state in which the holding member of the loading and unloading mechanism grips and supports the annular frame of the workpiece placed on the cassette of the cassette mounting mechanism.

圖12為表示藉由搬岀、搬入機構將被支撐於環狀框架之被加工物搬運至暫時放置機構之一對支撐軌道之狀態的斜視圖。 FIG. 12 is a perspective view showing a state in which a workpiece supported by an annular frame is conveyed to one of the temporary placement mechanisms by the loading and unloading mechanism to the support rail.

圖13為表示在保持台之上面隔著切割膠帶而載置被支撐在環狀框架之被加工物之狀態的斜視圖。 Fig. 13 is a perspective view showing a state in which a workpiece supported by an annular frame is placed on a top surface of a holding table with a dicing tape interposed therebetween.

圖14為表示使暫時放置機構之一對支撐軌道上升而定位在上部位置之狀態的斜視圖。 Fig. 14 is a perspective view showing a state in which one of the temporary placement mechanisms is raised to the support rail and positioned at the upper position.

圖15為表示將吸引保持被加工物之保持台移動至配設有切削機構之加工區域之狀態的斜視圖。 Fig. 15 is a perspective view showing a state in which a holding table for sucking and holding a workpiece is moved to a processing region where a cutting mechanism is disposed.

圖16為表示將切削完之被加工物定位在吸引保持之保持台被加工物拆裝位置之狀態的斜視圖。 Fig. 16 is a perspective view showing a state in which the workpiece to be cut is positioned in a position at which the workpiece of the holding table is sucked and held.

圖17為表示從圖15所示之狀態將暫時放置機構之一對支撐軌道定位在下部位置之狀態的斜視圖。 Fig. 17 is a perspective view showing a state in which one of the temporary placement mechanisms is positioned at a lower position with respect to the support rail from the state shown in Fig. 15;

圖18為表示從圖16所示之狀態將暫時放置機構之一對 支撐軌道定位在較上部位置些許下方之中間位置之狀態的斜視圖。 Figure 18 is a view showing a pair of temporary placement mechanisms from the state shown in Figure 16 An oblique view in which the support rail is positioned at an intermediate position slightly below the upper position.

圖19為表示藉由搬岀、搬入機構之把持部把持被收容在載置於卡匣載置機構之卡匣的被加工物之狀態的斜視圖。 FIG. 19 is a perspective view showing a state in which the workpiece held by the cassette mounting mechanism is gripped by the gripping portion of the loading and unloading mechanism.

圖20為藉由搬岀、搬入機構之把持部將新的被加工物定位在暫時放置機構之一對支撐軌道，同時將切削完之被加工物定位在輔助暫時放置機構之一對輔助支撐軌道之狀態的斜視圖。 Figure 20 is a view of the auxiliary support rail by positioning the new workpiece to the support rail by the gripping portion of the loading and unloading mechanism, and positioning the cut workpiece in the auxiliary temporary placement mechanism. An oblique view of the state.

圖21為表示從圖19之狀態定位在輔助暫時放置機構之一對輔助支撐軌道下部位置之狀態的斜視圖。 Fig. 21 is a perspective view showing a state in which one of the auxiliary temporary placement mechanisms is positioned at a lower position of the auxiliary support rail from the state of Fig. 19;

圖22為表示從圖20之狀態定位在暫時放置機構之一對支撐軌道和輔助暫時放置機構之一對輔助支撐軌道上部位置之狀態的斜視圖及洗淨機構之噴射噴嘴移動之狀態的斜視圖。 Figure 22 is a perspective view showing a state in which one of the temporary placement mechanism is positioned from the state of Figure 20 to the upper position of one of the support rail and the auxiliary temporary placement mechanism to the upper position of the auxiliary support rail, and the state of the spray nozzle movement of the cleaning mechanism. .

圖23為表示從圖21所示之狀態將搬岀、搬入機構7定位在待機位置，同時將構成輔助暫時放置機構之一對輔助支撐軌道定位在下部位置之狀態的斜視圖。 FIG. 23 is a perspective view showing a state in which the loading/unloading mechanism 7 is positioned at the standby position from the state shown in FIG. 21, and one of the auxiliary temporary placement mechanisms is positioned at the lower position.

圖24為表示將支撐被支撐於環狀框架之洗淨完的被加工物之輔助暫時放置機構之一對輔助支撐軌道定位在上部位置之狀態的斜視圖。 Fig. 24 is a perspective view showing a state in which one of the auxiliary temporary placement mechanisms for supporting the workpiece to be supported by the annular frame is positioned at the upper position with respect to the auxiliary support rail.

圖25為表示從圖23之狀態將被支撐於環狀框架之洗淨完的被加工物從輔助暫時放置機構之一對輔助支撐軌道移動至暫時放置機構之一對支撐軌道之狀態的斜視圖。 Fig. 25 is a perspective view showing a state in which the workpiece supported by the annular frame is moved from one of the auxiliary temporary placement mechanisms to the auxiliary support rail to the state of the support rail from the state of Fig. 23; .

圖26為從圖24之狀態將暫時放置機構之一對支撐軌道定位在中間位置，同時將搬岀、搬入機構之把持構件及一對限制銷定位在待機位置之狀態的斜視圖。 Fig. 26 is a perspective view showing a state in which one of the temporary placement mechanisms is positioned at an intermediate position with respect to the support rail from the state of Fig. 24, and the holding member of the loading and unloading mechanism and the pair of restriction pins are positioned at the standby position.

圖27為表示從圖25之狀態使搬岀、搬入機構作動而將被支撐於環狀框架之洗淨完的被加工物收容在卡匣之狀態的斜視圖。 FIG. 27 is a perspective view showing a state in which the workpiece to be supported by the annular frame is stored in the cassette by the loading and unloading mechanism in the state of FIG.

以下，針對依照本發明構成之切削裝置之較佳實施型態，參照附件圖面予以詳細說明。 Hereinafter, preferred embodiments of the cutting apparatus constructed in accordance with the present invention will be described in detail with reference to the accompanying drawings.

圖1表示依照本發明而構成之切削裝置之一實施型態的斜視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing an embodiment of a cutting device constructed in accordance with the present invention.

圖示之實施型態中之切削裝置具備靜止基台2、保持被配設在該靜止基台2上之被加工物的保持台機構3、和切削被保持在該保持台機構3之被加工物的切削機構4。 The cutting device in the embodiment shown in the figure includes a stationary base 2, a holding table mechanism 3 that holds a workpiece placed on the stationary base 2, and a machining in which the cutting is held in the holding mechanism 3 Cutting mechanism 4 of the object.

保持台機構3如圖2所示般具備：在靜止基台2上沿著以箭號X表示之加工進給方向(X軸方向)而被配設之兩根X軸導軌31、31；被配設成能夠在該兩根X軸導軌31、31上滑動之移動基台32；保持以能夠旋轉之方式被支撐於配設在該移動基台32上之圓筒狀之支撐構件33之被加工物的保持台34；使配設該保持台34之移動基台32沿著兩根X軸導軌31、31而在加工進給方向(X軸方向)移動之加工進給手段35。保持台34具備：以能夠旋轉之方式被支撐於圓筒狀之支撐構件33之平台本體341，和被配設在 該平台本體341之上面的吸附夾具342。平台本體341被形成外徑大於作為後述被加工物之晶圓之外徑，且小於隔著切割膠帶而支撐晶圓之環狀框架之內徑。吸附夾具342係藉由多孔陶磁而形成，且被連接於無圖示之吸引手段，適當地使負壓作用。因此，被載置吸附夾具342上之被加工物藉由使無圖示之吸引手段作動，被吸引保持在吸附夾具342上。再者，保持台34係藉由被配設在圓筒狀之支撐構件33內之無圖示之脈衝馬達使轉動。 As shown in FIG. 2, the holding table mechanism 3 includes two X-axis guide rails 31 and 31 which are disposed on the stationary base 2 along the machining feed direction (X-axis direction) indicated by an arrow X; A moving base 32 that is slidable on the two X-axis guides 31, 31; and a cylindrical support member 33 that is rotatably supported by the cylindrical support member 33 disposed on the moving base 32 is held The holding table 34 of the workpiece; the processing feed means 35 for moving the moving base 32 on which the holding table 34 is disposed along the two X-axis guides 31, 31 in the machining feed direction (X-axis direction). The holding table 34 is provided with a platform body 341 that is rotatably supported by the cylindrical support member 33, and is disposed at An adsorption jig 342 above the platform body 341. The stage main body 341 is formed to have an outer diameter larger than the outer diameter of the wafer as a workpiece to be described later, and smaller than the inner diameter of the annular frame that supports the wafer via the dicing tape. The adsorption jig 342 is formed by porous ceramics, and is connected to a suction means (not shown) to appropriately apply a negative pressure. Therefore, the workpiece to be placed on the adsorption jig 342 is sucked and held by the suction jig 342 by being actuated by a suction means (not shown). Further, the holding table 34 is rotated by a pulse motor (not shown) disposed in the cylindrical support member 33.

上述加工進給手段35係由被配設在兩根X軸導軌31和31之間，且在X軸方向延伸之X軸線性軌道351，和以能夠移動之方式被嵌插於該X軸線性軌道351，且被安裝於配設保持台34之移動基台32的X軸線圈可動件352所構成。X軸線性軌道351係例如交互接合複數圓柱狀之永久磁鐵之N極和S極而構成軸狀，且將構成該軸狀之複數圓柱狀之永久磁鐵配設在由不鏽鋼等之非磁性材所構成之圓筒狀之殼體而構成。如此構成之X軸線性軌道351係在其兩端部如圖2所示般安裝有支撐構件353、353，經由該支撐構件353、353而被安裝於上述靜止基台2。由X軸線性軌道351和X軸線圈可動件352所構成之加工進給手段35構成所謂的線性傳動軸馬達，當在X軸線圈可動件352流通電流時，重覆磁力所致之吸引力、反作用力而產生推力。因此，藉由改變施加於X軸線圈可動件352之電流的方向，可以變更X軸線圈可動件352沿著X軸線性軌道351移動之方向。構成如此之加工進給手段35係使配設有保持台34之移 動基台32在圖2所示之被加工物拆裝區域和配設切削機構4之加工區域之間移動。另外，圖示之實施型態中之加工進給手段35雖然表示藉由所謂的線性傳動軸馬達而構成之例，但是即使藉由滾珠螺桿機構而構成亦可。 The machining feed means 35 is an X-axis linear rail 351 which is disposed between the two X-axis guide rails 31 and 31 and extends in the X-axis direction, and is movably inserted into the X-axis linearity. The rail 351 is attached to the X-axis coil movable member 352 on which the moving base 32 of the holding table 34 is disposed. The X-axis linear rail 351 is formed by, for example, interchanging the N-pole and the S-pole of a plurality of cylindrical permanent magnets to form a shaft shape, and the permanent magnets constituting the shaft-shaped plurality of cylindrical shapes are disposed in a non-magnetic material such as stainless steel. It is constituted by a cylindrical casing. The X-axis linear rails 351 thus configured are attached to the support members 353 and 353 at both end portions thereof as shown in FIG. 2, and are attached to the stationary base 2 via the support members 353 and 353. The machining feed means 35 composed of the X-axis linear rail 351 and the X-axis coil movable member 352 constitutes a so-called linear drive shaft motor, and when the X-axis coil movable member 352 flows a current, the attraction force due to the magnetic force is repeated, The reaction force generates thrust. Therefore, the direction in which the X-axis coil movable member 352 moves along the X-axis linearity rail 351 can be changed by changing the direction of the current applied to the X-axis coil movable member 352. The processing feed means 35 is configured such that the holding table 34 is disposed The movable base 32 moves between the workpiece attachment/detachment area shown in Fig. 2 and the processing area in which the cutting mechanism 4 is disposed. Further, although the machining feed means 35 in the embodiment shown in the figure shows an example constituted by a so-called linear drive shaft motor, it may be constituted by a ball screw mechanism.

接著，針對上述切削機構4予以說明。 Next, the above-described cutting mechanism 4 will be described.

切削機構4具備被固定在上述靜止基台2上之門型之支撐框架41。該門型之支撐框架41係由隔著間隔而配設之第一柱部411及第二柱部412，和連結該第一柱部411及第二柱部412之上端，且沿著與以箭頭X所示之加工進給方向正交之箭號Y所示之分度進給方向(Y軸方向)而配設之支撐部413所構成，被配設成橫跨上述兩根X軸導軌31。 The cutting mechanism 4 includes a door type support frame 41 that is fixed to the stationary base 2. The door type support frame 41 is composed of a first column portion 411 and a second column portion 412 which are disposed at intervals, and connects the upper ends of the first column portion 411 and the second column portion 412, and The supporting portion 413 disposed in the indexing feeding direction (Y-axis direction) indicated by the arrow Y in the processing feed direction indicated by the arrow X is disposed to span the two X-axis guide rails 31.

在構成上述門型之支撐框架41之支撐部413之圖1及圖2中，在背面側配設有第一切削手段5a和第二切削手段5b。針對第一切削手段5a和第二切削手段5b，參照圖3及圖4進行說明。第一切削手段5a及第二切削手段5b分別具備分度移動基台51和切深移動基台52及轉軸單元53。第一切削手段5a之分度移動基台51及第二切削手段5b之分度移動基台51設置有與分別在上述支撐部413之圖4中被設置在左方之側面之兩根Y軸導軌413a、413a嵌合之被導引溝511、511，藉由將該被導引溝511、511與兩根Y軸導軌413a、413a嵌合，分度移動基台51被構成能夠沿著兩根Y軸導軌413a、413a移動。另外，在第一切削手段5a之分度移動基台51及第二切削手段5b之分度移動基台51之一方之表面，分別形成有配設後述分度進給手段之凹部513。再 者，在第一切削手段5a之分度移動基台51及第二切削手段5b之分度移動基台51之另一方之表面，分別如圖4所示般沿著以箭號Z表示所示之切深進給方向設置一對導軌512、512(在圖4中僅表示一方之導軌)。 In FIGS. 1 and 2 constituting the support portion 413 of the door type support frame 41, a first cutting means 5a and a second cutting means 5b are disposed on the back side. The first cutting means 5a and the second cutting means 5b will be described with reference to Figs. 3 and 4 . Each of the first cutting means 5a and the second cutting means 5b includes an index moving base 51, a depth-cut moving base 52, and a rotating shaft unit 53, respectively. The indexing moving base 51 of the indexing moving base 51 and the second cutting means 5b of the first cutting means 5a is provided with two Y-axiss which are disposed on the left side in FIG. 4 of the supporting portion 413, respectively. The guide grooves 511 and 511 to which the guide rails 413a and 413a are fitted are fitted to the two Y-axis guide rails 413a and 413a by the guide grooves 511 and 511, and the indexing movement base 51 is configured to be able to The root Y-axis guides 413a, 413a move. Further, on the surface of one of the indexing moving bases 51 of the indexing moving base 51 and the second cutting means 5b of the first cutting means 5a, a concave portion 513 in which an indexing feeding means to be described later is disposed is formed. again The surface of the other of the indexing moving base 51 of the indexing moving base 51 and the second cutting means 5b of the first cutting means 5a is shown by an arrow Z as shown in FIG. A pair of guide rails 512, 512 (only one of the guide rails is shown in Fig. 4) is provided in the deep feed direction.

上述第一切削手段5a之切深移動基台52及第二切削手段5b之切深移動基台52係由分別在上下方向延伸之被支撐部521，和從該被支撐部521之下端轉直角而水平延伸的安裝部522。如圖4所示般，在被支撐部521中之安裝部522側之面設置有與被設置在上述分度移動基台51之另一方表面的一對Z軸導軌512、512嵌合之被導引溝523、523(在圖4中僅表示一方之被導引溝)，藉由將該被導引溝523、523嵌合至兩根之Z軸導軌512、512，切深移動基台52被構成能夠沿著兩根Z軸導軌512、512而在以箭號Z表示之切深進給方向移動。如此一來被安裝於分度移動基台51之切深移動基台52如圖1及圖2所示般，安裝部522被配置成突出至構成門型之支撐框架41之支撐部413的下側。 The depth-of-cut moving base 52 of the first cutting means 5a and the depth-cutting moving base 52 of the second cutting means 5b are supported by the support portion 521 extending in the up-and-down direction, respectively, and from the lower end of the supported portion 521 And a horizontally extending mounting portion 522. As shown in FIG. 4, a surface of the supported portion 521 on the side of the mounting portion 522 is provided with a pair of Z-axis guides 512, 512 provided on the other surface of the index moving base 51. Guide grooves 523 and 523 (only one of the guided grooves is shown in FIG. 4), and the guided grooves 523 and 523 are fitted to the two Z-axis guides 512 and 512 to cut the depth of the base. The 52 is configured to be movable along the two Z-axis guides 512, 512 in the depth-feeding direction indicated by the arrow Z. As shown in FIGS. 1 and 2, the mounting portion 522 is configured to protrude to the lower portion of the support portion 413 constituting the door type support frame 41, as shown in FIGS. 1 and 2. side.

上述轉軸單元53分別被安裝在形成第一切削手段5a和第二切削手段5b之切深移動基台52的安裝部522之下面。該第一切削手段5a之轉軸單元53及第二切削手段5b之轉軸單元53分別如圖3及圖4所示般，具備心軸罩殼531，和以能夠旋轉之方式被支撐於該心軸罩殼531的旋軸心軸532，和被安裝於該旋轉心軸532之一端的切削刀533，和使供給切削水之切削水供給管534及旋轉心軸532旋轉驅動之無圖示伺服馬達，旋轉心軸532之軸線方向係 沿著以箭號Y所示之分度進給方向而被配設。而且，構成第一切削手段5a之轉軸單元53之切削刀533，和構成第二切削手段5b之旋轉單元53之切削刀533被配設成互相相向。 The above-described rotating shaft units 53 are respectively mounted below the mounting portion 522 of the depth-cut moving base 52 forming the first cutting means 5a and the second cutting means 5b. As shown in FIGS. 3 and 4, the spindle unit 53 of the first cutting means 5a and the spindle unit 53 of the second cutting means 5b are provided with a spindle housing 531 and rotatably supported by the spindle. A rotary shaft 532 of the casing 531, a cutter 533 attached to one end of the rotary spindle 532, and a servo motor (not shown) for rotationally driving the cutting water supply pipe 534 and the rotary spindle 532 for supplying cutting water , the axis direction of the rotating mandrel 532 It is arranged along the indexing feed direction indicated by the arrow Y. Further, the cutting blade 533 constituting the rotating shaft unit 53 of the first cutting means 5a and the cutting blade 533 constituting the rotating unit 53 of the second cutting means 5b are disposed to face each other.

圖示之實施型態中之第一切削手段5a和第二切削手段5b係如圖3所示般，具備有用以使上述分度移動基台51、51沿著兩根Y軸導軌413a、413a而在以箭號Y所示之分度進給方向(Y軸方向)移動之分度進給手段54。分度進給手段54係由沿著上述兩根之Y軸導軌413a、413a而被配設之共同的Y軸線性軌道540、以能夠移動之方式被嵌插於該共同之Y軸線性軌道540之第一切削手段5a之分度移動基台51的第一Y軸線圈可動件544a，和被安裝於以能夠移動之方式被嵌插於共同之Y軸線性軌道540之第二切削手段5b之分度移動基台51的第二Y軸線圈可動件544b。共同之Y軸線性軌道540係例如交互接合複數圓柱狀之永久磁鐵之N極和S極而構成軸狀，且將構成該軸狀之複數圓柱狀之永久磁鐵配置在由不鏽鋼等之非磁性材所構成之圓筒狀之殼體而構成。如此構成之共同之Y軸線性軌道540係在其兩端部如圖3所示般安裝有支撐構件543、543，經由該支撐構件543、543而被安裝於上述支撐框架41之支撐部413。以能夠移動之方式被嵌插至該共同之Y軸線性軌道540之第一線圈可動件544a及第二線圈可動件544b分別被配設在第一切削手段5a之分度移動基台51及第二切削手段5b之分度移動基台51的凹部513，分別被安裝於分度移動 基台51之一方之表面。 The first cutting means 5a and the second cutting means 5b in the illustrated embodiment are provided such that the indexing moving bases 51, 51 are along the two Y-axis guides 413a, 413a as shown in FIG. On the other hand, the index feeding means 54 is moved in the indexing feed direction (Y-axis direction) indicated by the arrow Y. The indexing feed means 54 is movably inserted into the common Y-axis linear track 540 by a common Y-axis linear track 540 disposed along the two Y-axis guide rails 413a, 413a. The first Y-axis coil movable member 544a of the indexing moving base 51 of the first cutting means 5a is attached to the second cutting means 5b which is movably inserted into the common Y-axis linear track 540. The second Y-axis coil movable member 544b of the moving base 51 is indexed. The common Y-axis linear track 540 is formed by, for example, interchanging the N pole and the S pole of a plurality of cylindrical permanent magnets to form a shaft shape, and arranging the plurality of permanent magnets constituting the shaft shape in a non-magnetic material such as stainless steel. The cylindrical casing is configured to be constructed. The Y-axis linear rails 540 having the same configuration are attached to the support members 543 and 543 at both end portions thereof as shown in FIG. 3, and are attached to the support portion 413 of the support frame 41 via the support members 543 and 543. The first coil movable member 544a and the second coil movable member 544b that are inserted into the common Y-axis linearity 540 in a movable manner are respectively disposed on the indexing moving base 51 and the first cutting means 5a The dimples 513 of the indexing moving base 51 of the two cutting means 5b are respectively mounted on the indexing movement The surface of one of the bases 51.

如上述般，由共同之Y軸線性軌道540和第一線圈可動件544a及第二線圈可動件544b所構成之分度進給手段54，與由上述X軸線性軌道361和X軸線圈可動件362所構成之加工進給手段35相同，構成所謂的傳動軸馬達，當電流流入第一線圈可動件544a及第二線圈可動件544b時，重覆磁力所致之吸引力、反作用力而產生推力。因此，藉由改變施加於第一線圈可動件544a及第二線圈可動件544b之電流的方向，可以變更第一線圈可動件544a及第二線圈可動件544b沿著共同之Y軸線性軌道540而移動之方向。另外，圖示之實施型態中之分度進給手段54雖然表示藉由所謂的線性傳動軸馬達而構成之例，但是即使藉由滾珠螺桿機構而構成亦可。 As described above, the indexing feed means 54 composed of the common Y-axis linearity rail 540 and the first coil movable member 544a and the second coil movable member 544b, and the X-axis linear rail 361 and the X-axis coil movable member The machining feed means 35 constituted by 362 is the same, and constitutes a so-called transmission shaft motor. When current flows into the first coil movable member 544a and the second coil movable member 544b, the attraction force and the reaction force due to the magnetic force are repeated to generate the thrust. . Therefore, the first coil movable member 544a and the second coil movable member 544b can be changed along the common Y-axis linearity 540 by changing the direction of the current applied to the first coil movable member 544a and the second coil movable member 544b. The direction of movement. Further, although the index feeding means 54 in the illustrated embodiment is configured by a so-called linear drive shaft motor, it may be configured by a ball screw mechanism.

再者，圖示之實施型態中之第一切削手段5a和第二切削手段5b係如圖3及圖4所示般，具備有用以使上述切深移動基台52、52沿著兩根Z軸導軌512、512而在以箭號Z所示之切深進給方向(Z軸方向)移動之切深進給手段55、55。切深進給手段55、55係由被配設成分別與兩根Z軸導軌512、512平行之公螺桿551、以能夠旋轉之方式支撐公螺桿551之一端部的軸承552，和被連結於公螺桿551之另一端，且使該公螺桿551正轉或逆轉驅動之脈衝馬達553所構成。被構成如此之切深進給手段55、55分別係公螺桿551與被形成在上述切深移動基台52之被支撐部521之母螺桿521a螺合。因此，切深進給手段55、55可以分別藉 由驅動脈衝馬達553使公螺桿551正轉或逆轉驅動，使切深移動基台52沿著兩根Z軸導軌512、512而在圖3中以箭號Z所示之切深進給方向(Z軸方向)移動。 Further, in the illustrated embodiment, the first cutting means 5a and the second cutting means 5b are provided as shown in FIGS. 3 and 4 so that the depth of cut moving bases 52, 52 are along two. The depth-feeding means 55, 55 are moved by the Z-axis guides 512, 512 in the depth-feeding direction (Z-axis direction) indicated by the arrow Z. The deep-depth feeding means 55, 55 are a male screw 551 which is disposed in parallel with the two Z-axis guides 512, 512, and a bearing 552 which rotatably supports one end of the male screw 551, and is coupled to The other end of the male screw 551 is formed by a pulse motor 553 that causes the male screw 551 to rotate forward or reverse. The deep-feeding means 55, 55, which are configured as such, are screwed together with the female screw 521a formed on the supported portion 521 of the deep-depth moving base 52, respectively. Therefore, the deep-depth feeding means 55, 55 can be respectively borrowed The male screw 551 is driven forward or reverse by the drive pulse motor 553, so that the depth-of-cutting moving base 52 is along the two Z-axis guides 512, 512 in the depth-feeding direction indicated by the arrow Z in FIG. Z axis direction) moves.

當參照圖1持續說明時，上述靜止基台2具備載置收容半導體晶圓等之複數被加工物之卡匣60的卡匣載置機構6、從被載置於該卡匣載置機構6之卡匣60搬岀被加工物，同時將切削完之被加工物搬入至卡匣60之搬出、搬入機構7、暫時放置藉由該搬出、搬入機構7被搬出之被加工物的暫時放置機構8、與該暫時放置機構8相鄰接而被配設的輔助暫時放置機構9，和洗淨切削後之被加工物的洗淨機構10。卡匣載置機構6使卡匣60被載置於藉由無圖示之升降手段而升降的卡匣台61上。在卡匣60收容有被黏貼於安裝於環狀框架F之切割膠帶T之表面的半導體晶圓W。另外，在環狀框架F之外周，設置有後述限制銷卡合之溝槽F-1及平面F-2。 As will be described with reference to FIG. 1, the stationary base 2 includes a cassette mounting mechanism 6 on which a cassette 60 for storing a plurality of workpieces such as a semiconductor wafer is placed, and is placed on the cassette mounting mechanism 6 The cassette 60 carries the workpiece, and the workpiece to be processed is carried into the loading and unloading mechanism 7 of the cassette 60, and the temporary placement mechanism for the workpiece to be carried out by the loading and unloading mechanism 7 is temporarily placed. 8. The auxiliary temporary placement mechanism 9 disposed adjacent to the temporary placement mechanism 8 and the cleaning mechanism 10 for cleaning the workpiece after cutting. The cassette mounting mechanism 6 causes the cassette 60 to be placed on the cassette 61 that is lifted and lowered by a lifting means (not shown). The semiconductor wafer W adhered to the surface of the dicing tape T attached to the annular frame F is housed in the cassette 60. Further, on the outer circumference of the annular frame F, a groove F-1 and a plane F-2 in which the restriction pin is engaged will be provided.

搬出、搬入機構7如圖1所示般係由被配設在構成上述門型之支撐框架41的支撐部413之表面側的搬運移動手段71，和藉由該搬運移動手段71在Y軸方向移動的支撐基台72，和連結該支撐基台72和搬運移動手段71之連結構件73所構成。搬運移動手段71係由使連結支撐基台72之連結構件73在Y軸方向移動之輸送帶機構所構成。當參照圖5及圖6持續說明時，在構成搬出、搬入機構7之支撐基台72，安裝有：把持構件74(參照圖6)，其係被配設在下側，用以把持隔著切割膠帶T而支撐被收容在載置於 卡匣載置機構6之卡匣60的半導體晶圓W之環狀框架F；汽缸740，其係用以使該把持構件74在上下方向移動；和一對限制銷75，其係被配設在把持構件74之兩側且與被設置在上述環狀框架F之溝槽F-1及平面F-2卡合而將環狀框架F限制在規定之位置。構成如此之搬出、搬入機構7係使支撐基台72朝向被載置在卡匣載置機構6之卡匣60移動，且藉由使一對限制銷75與被設置在隔著切割膠帶T而支撐被收容在卡匣60之半導體晶圓W之環狀框架F的溝槽F-1及平面F-2卡合，將半導體晶圓W位置限制在規定之位置。而且，藉由汽缸740使把持構件74朝上方移動，依此在支撐基台72和把持構件74之間把持環狀框架F。 As shown in FIG. 1, the carry-out/loading mechanism 7 is a transport moving means 71 disposed on the surface side of the support portion 413 constituting the door type support frame 41, and the transport moving means 71 is in the Y-axis direction. The moving support base 72 is constituted by a connecting member 73 that connects the support base 72 and the transport moving means 71. The transport moving means 71 is constituted by a conveyor mechanism that moves the connecting member 73 that connects the support base 72 in the Y-axis direction. As will be described with reference to FIGS. 5 and 6, the holding member 74 (see FIG. 6) is attached to the support base 72 constituting the carry-out/loading mechanism 7, and is disposed on the lower side for holding and cutting. Tape T and support is contained in the carrier An annular frame F of the semiconductor wafer W of the cassette 60 of the cassette mounting mechanism 6; a cylinder 740 for moving the holding member 74 in the vertical direction; and a pair of restriction pins 75, which are arranged The annular frame F is restricted to a predetermined position on both sides of the grip member 74 and engaged with the groove F-1 and the plane F-2 provided in the annular frame F. The loading and unloading mechanism 7 is configured such that the support base 72 moves toward the cassette 60 placed on the cassette mounting mechanism 6, and the pair of restriction pins 75 are disposed between the cutting tapes T and the cutting tape T. The groove F-1 and the plane F-2 which support the annular frame F of the semiconductor wafer W accommodated in the cassette 60 are engaged, and the position of the semiconductor wafer W is restricted to a predetermined position. Further, the grip member 74 is moved upward by the cylinder 740, whereby the annular frame F is held between the support base 72 and the grip member 74.

再者，在構成搬出、搬入機構7之支撐基台72，安裝有：輔助把持構件76(參照圖6)，其係被配設在下側，用以把持隔著切割膠帶T而支撐後述切削完之半導體晶圓W之環狀框架F；汽缸760，其係用以使該輔助把持構件76在上下方向移動；和一對輔助限制銷77，其係被配設在輔助把持構件76之兩側且與上述環狀框架F卡合而將環狀框架F限制在規定之位置。而且，在構成搬出、搬入機構7之支撐基台72，配設有選擇性地與後述洗淨機構之噴射噴嘴卡合之卡合手段78。該卡合手段78係由以能夠進退之方式被配設在較支撐基台72之下面下方之卡合桿781，和使該卡合桿781進退之汽缸782所構成。 Further, the support base 72 constituting the carry-out and carry-in mechanism 7 is attached with an auxiliary grip member 76 (see FIG. 6), which is disposed on the lower side, and is supported by the dicing tape T for support. An annular frame F of the semiconductor wafer W; a cylinder 760 for moving the auxiliary holding member 76 in the up and down direction; and a pair of auxiliary limiting pins 77 disposed on both sides of the auxiliary holding member 76 Further, the annular frame F is engaged with the annular frame F to restrict the annular frame F to a predetermined position. Further, the supporting base 72 constituting the loading/unloading mechanism 7 is provided with an engaging means 78 that selectively engages with the injection nozzle of the cleaning mechanism to be described later. The engagement means 78 is constituted by an engagement lever 781 that is disposed to be movable forward and downward below the support base 72, and a cylinder 782 that moves the engagement lever 781 forward and backward.

針對上述暫時放置機構8，參照圖1、圖7及圖8進行說明。暫時放置機構8係在Y軸方向與上述卡匣載置 機構6相鄰接而被配設在上述保持台34之被加工物拆裝區域之正上方。該暫時放置機構8具備：一對支撐軌道80，其係在Y軸方向延伸，具有支撐環狀框架F之兩側部的底部81a、81b，和側部82a、82b，且被構成底部81a、81b能夠開關；和開關手段85a、85b，其係用以開關該一對支撐軌道80之底部81a、81b；和升降手段86，其係使該一對支撐軌道80在上下方向移動。另外，在構成一對支撐軌道80之側部82a、82b之上端設置有互相設置有突出於內側之凸緣部83a、83b，該凸緣部83a和83b互相藉由連結部84連結一端部。上述開關手段85a、85b係在圖示之實施型態中，由汽缸所構成，使一對支撐軌道80之底部81a、81b分別作動至圖8中以實線表示之水平位置之關閉位置和以二點鏈線表示之垂直位置的開啟位置。上述升降手段86係由被安裝於無圖示之固定構件之汽缸861所構成，該汽缸861之活塞桿862與上述一對支撐軌道80之連結部84連結。 The temporary placement mechanism 8 will be described with reference to Figs. 1, 7, and 8. The temporary placement mechanism 8 is placed in the Y-axis direction and the above-mentioned cassette The mechanism 6 is adjacent to each other and disposed directly above the workpiece attachment/detachment area of the holding table 34. The temporary placement mechanism 8 includes a pair of support rails 80 extending in the Y-axis direction, having bottom portions 81a and 81b that support both side portions of the annular frame F, and side portions 82a and 82b, and configured to constitute a bottom portion 81a. 81b is switchable; and switching means 85a, 85b for switching the bottom portions 81a, 81b of the pair of support rails 80; and lifting means 86 for moving the pair of support rails 80 in the up and down direction. Further, flange portions 83a and 83b projecting from the inside are provided at the upper ends of the side portions 82a and 82b constituting the pair of support rails 80. The flange portions 83a and 83b are connected to each other by the joint portion 84. The switching means 85a, 85b are formed in the illustrated embodiment, and the bottom portions 81a, 81b of the pair of support rails 80 are respectively moved to the closed position of the horizontal position indicated by the solid line in Fig. 8 and The two-point chain line indicates the open position of the vertical position. The elevating means 86 is constituted by a cylinder 861 attached to a fixing member (not shown), and the piston rod 862 of the cylinder 861 is coupled to the connecting portion 84 of the pair of supporting rails 80.

上述輔助暫時放置機構9係在Y軸方向與上述暫時放置機構8相鄰接且在相對於上述卡匣載置機構6為Y軸方向相反側上被配設在後述洗淨機構10之正上方。該輔助暫時放置機構9與上述暫時放置機構8相同之構成，如圖7所示般，具備：一對輔助支撐軌道90，其係在Y軸方向延伸，具有支撐環狀框架F之兩側部的底部91a、91b，和側部92a、92b，且被構成底部91a、91b能夠開關；和開關手段95a、95b，其係用以開關該一對輔助支撐軌道90之底部91a、91b；和升降手段96，其係使該一對輔助支撐軌道90 在上下方向移動。而且，在構成一對輔助支撐軌道90之側部92a、92b之上端設置有互相設置有突出於內側之凸緣部93a、93b，該凸緣部93a和93b互相藉由連結部94連結一端部。上述開關手段95a、95b在圖示之實施型態中係由汽缸所構成，使一對輔助支撐導軌90之底部91a、91b分別作動至水平位置之關閉位置和垂直位置之開啟位置。上述升降手段96係由被安裝於無圖示之固定構件之汽缸961所構成，該汽缸961之活塞桿962與上述一對輔助支撐軌道90之連結部94連結。 The auxiliary temporary placement mechanism 9 is disposed adjacent to the temporary placement mechanism 8 in the Y-axis direction and is disposed directly above the cleaning mechanism 10 to be described later on the side opposite to the Y-axis direction with respect to the cassette mounting mechanism 6. . The auxiliary temporary placement mechanism 9 has the same configuration as the temporary placement mechanism 8, and includes a pair of auxiliary support rails 90 extending in the Y-axis direction and having both sides supporting the annular frame F as shown in FIG. The bottom portions 91a, 91b, and the side portions 92a, 92b, and configured to be able to open and close the bottom portions 91a, 91b; and the switching means 95a, 95b for switching the bottom portions 91a, 91b of the pair of auxiliary support rails 90; Means 96 for causing the pair of auxiliary support rails 90 Move in the up and down direction. Further, at the upper ends of the side portions 92a, 92b constituting the pair of auxiliary support rails 90, flange portions 93a, 93b which are protruded from the inner side are provided, and the flange portions 93a and 93b are connected to each other by the joint portion 94. . The above-described switching means 95a, 95b are constituted by cylinders in the illustrated embodiment, and the bottoms 91a, 91b of the pair of auxiliary support rails 90 are respectively moved to the closed position of the horizontal position and the open position of the vertical position. The lifting/lowering means 96 is constituted by a cylinder 961 attached to a fixing member (not shown), and the piston rod 962 of the cylinder 961 is coupled to the connecting portion 94 of the pair of auxiliary supporting rails 90.

接著，針對上述洗淨機構10，參照圖1及圖9進行說明。 Next, the cleaning mechanism 10 will be described with reference to FIGS. 1 and 9 .

圖示之實施型態中之洗淨機構10與上述暫時放置機構8相鄰接且被配設在相對於卡匣載置機構6為Y軸方向相反側上。該洗淨機構10具備有洗淨殼罩11。該洗淨殼罩11係由前壁111和後壁112和側壁113及114和底壁(無圖示)所構成，上方被開放。在構成如此的洗淨殼罩11內配設有旋轉台12。旋轉台12係由平台本體121、被配設在該平台本體121之上面的吸附夾具122，和使平台本體121旋轉驅動之伺服馬達123所構成。平台本體121被形成外徑大於上述晶圓W之外徑，且小於隔著切割膠帶T而支撐晶圓W之環狀框架F之內徑。吸附夾具122係藉由多孔陶磁而形成，且被連接於無圖示之吸引手段，適當地使負壓作用。因此，被載置吸附夾具122上之被加工物藉由使無圖示之吸引手段作動，被吸引保持在吸附夾具122上。 The cleaning mechanism 10 in the embodiment shown in the figure is adjacent to the temporary placement mechanism 8 and disposed on the side opposite to the Y-axis direction with respect to the cassette mounting mechanism 6. The cleaning mechanism 10 is provided with a cleaning cover 11. The cleaning cover 11 is composed of a front wall 111 and a rear wall 112, side walls 113 and 114, and a bottom wall (not shown), and the upper portion is opened. A rotary table 12 is disposed in such a cleaning cover 11 . The rotary table 12 is composed of a platform body 121, an adsorption jig 122 disposed above the platform body 121, and a servo motor 123 for rotationally driving the platform body 121. The stage body 121 is formed to have an outer diameter larger than the outer diameter of the wafer W and smaller than the inner diameter of the annular frame F supporting the wafer W via the dicing tape T. The adsorption jig 122 is formed by porous ceramics, and is connected to a suction means (not shown) to appropriately apply a negative pressure. Therefore, the workpiece to be placed on the adsorption jig 122 is sucked and held by the suction jig 122 by being actuated by a suction means (not shown).

當參照圖1及圖9持續進行說明時，在洗淨殼罩11之前壁111設置有沿著Y軸方向而形成的導引孔111a，在該導引孔111a以能夠在Y軸方向移動之方式配設有對被保持於上述旋轉台12之被加工物噴射洗淨水之噴射噴嘴13。在該噴射噴嘴13經滑輪16連結一端與錘體14連結的接線15之另一端，且被構成藉由錘體14之重力在以箭號Y1所示之方向上移動。而且，在噴射噴嘴13中，被配設在構成上述搬出、搬入機構7之支撐基台72的卡合手段78，係在以能夠進退之方式被配設在較支撐基台72之下面下方的卡合桿781進岀的狀態下，從藉由噴射噴嘴13中之錘體14之重力而移動的箭號Y1所示之方向使接觸。而且，噴射噴嘴13被連接於無圖示之洗淨水供給手段。 When the description is continued with reference to FIGS. 1 and 9, the wall 111 is provided with a guide hole 111a formed along the Y-axis direction before the cover 11 is cleaned, and the guide hole 111a is movable in the Y-axis direction. In the embodiment, the injection nozzle 13 that sprays the washing water to the workpiece held by the rotary table 12 is disposed. The other end of the wire 15 connected to the hammer body 14 at one end via the pulley 16 is connected to the injection nozzle 13, and is configured to move in the direction indicated by the arrow Y1 by the gravity of the hammer 14. Further, in the injection nozzle 13, the engagement means 78 disposed on the support base 72 constituting the carry-out and carry-in mechanism 7 is disposed so as to be able to advance and retreat so as to be disposed below the lower surface of the support base 72. In a state where the engagement lever 781 is pushed in, the contact is made from the direction indicated by the arrow Y1 which is moved by the gravity of the hammer 14 in the injection nozzle 13. Further, the injection nozzle 13 is connected to a washing water supply means (not shown).

圖示之實施型態中之切削裝置被構成上述般，以下針對其作用進行說明。 The cutting device in the embodiment shown in the drawings is configured as described above, and the operation thereof will be described below.

首先，如圖10所示般，使暫時放置機構8之汽缸861作動而將一對支撐軌道80定位在上部位置，同時將配設有搬出、搬入機構7之把持構件74(參照圖6)及一對限制銷75(參照圖5及圖6)的支撐基台72定位在圖示之待機位置上。 First, as shown in FIG. 10, the cylinder 861 of the temporary placement mechanism 8 is actuated to position the pair of support rails 80 at the upper position, and the holding member 74 (see FIG. 6) for carrying out the loading and unloading mechanism 7 is disposed. The support base 72 of the pair of restriction pins 75 (see FIGS. 5 and 6) is positioned at the standby position shown.

接著，使搬出、搬入機構7之搬運移動手段71(參照圖1及圖5)作動，如圖11所示般，使配設有把持構件74及一對限制銷75之支撐基台72移動至卡匣載置機構6側，且使一對限制銷75(參照圖5及圖6)與被設置在隔著切割膠帶T而支撐被收容在卡匣60之半導體晶圓W之環狀 框架F的溝槽F-1及平面F-2(參照圖1)卡合，依此將半導體晶圓W位置限制在規定位置上。而且，藉由使汽缸740作動，將環狀框架F把持在支撐基台72和把持構件74(參照圖6)之間。 Then, the conveyance means 71 (see FIGS. 1 and 5) of the carry-out and carry-in mechanism 7 is actuated, and as shown in FIG. 11, the support base 72 in which the holding member 74 and the pair of restricting pins 75 are disposed is moved to The cassette mounting mechanism 6 side is provided with a pair of restriction pins 75 (see FIGS. 5 and 6) and a ring that is provided to support the semiconductor wafer W accommodated in the cassette 60 via the dicing tape T. The groove F-1 of the frame F and the plane F-2 (see FIG. 1) are engaged, whereby the position of the semiconductor wafer W is restricted to a predetermined position. Further, by actuating the cylinder 740, the annular frame F is held between the support base 72 and the grip member 74 (see Fig. 6).

若藉由支撐基台72和把持構件74把持環狀框架F時，使搬出、搬入機構7之搬運移動手段71作動而將支撐基台72移動至與卡匣載置機構6相反側，且如圖12所示般，將環狀框架F搬運至暫時放置機構8之一對支撐軌道80，進行暫時放置。 When the annular frame F is gripped by the support base 72 and the grip member 74, the transporting means 71 of the carry-out and carry-in mechanism 7 is actuated to move the support base 72 to the side opposite to the cassette mounting mechanism 6, and As shown in Fig. 12, the annular frame F is transported to the support rail 80 of the temporary placement mechanism 8 for temporary placement.

若將環狀框架F搬運至暫時放置機構8之一對支撐軌道80時，如圖13所示般，使汽缸861作動而使一對支撐軌道80下降，定位在下部位置上。其結果，被安裝於環狀框架F，且黏貼半導體晶圓W之切割膠帶T被載置在保持台機構3中被定位在被加工物拆裝位置上的保持台34之上面。而且，使上述開關手段85a、85b(參照圖6及圖8)作動而將一對支撐軌道80之底部81a、81b在圖8中從以實線表示之關閉位置定位在以二點鏈線表示之開啟位置。 When the annular frame F is transported to the pair of support rails 80 of the temporary placement mechanism 8, as shown in Fig. 13, the cylinder 861 is actuated to lower the pair of support rails 80 and to be positioned at the lower position. As a result, the dicing tape T attached to the annular frame F and pasted on the semiconductor wafer W is placed on the upper surface of the holding table 34 which is positioned at the position at which the workpiece is detached from the holding table mechanism 3. Further, the switching means 85a, 85b (see Figs. 6 and 8) are actuated to position the bottom portions 81a, 81b of the pair of support rails 80 in a closed position indicated by a solid line in Fig. 8 by a two-dot chain line. The open position.

接著，藉由使無圖示之吸引手段作動，如圖14所示般，在保持台34之上面隔著切割膠帶T而吸引保持半導體晶圓W。而且，使暫時放置機構8之汽缸851作動而使一對支撐軌道80上升而定位在上部位置。 Next, by moving the suction means (not shown), as shown in FIG. 14, the semiconductor wafer W is sucked and held by the dicing tape T on the upper surface of the holding stage 34. Then, the cylinder 851 of the temporary placement mechanism 8 is actuated to raise the pair of support rails 80 to be positioned at the upper position.

如圖14所示般，一面隔著切割膠帶T而在保持台34之上面吸引保持半導體晶圓W，一面使構成保持台機構3之加工進給手段35作動而將吸引保持半導體晶圓W之 保持台34如圖15所示般移動至配設有切削機構4之加工區域。而且，藉由第一切削手段5a和第二切削手段5b對被保持台34保持之半導體晶圓W施予規定之切削加工。另外，保持台34因如上述般被形成其外徑大於半導體晶圓W之外徑且小於環狀框架F之內徑，故環狀框架F藉由自重些許下垂，在切削加工中，不干擾第一切削手段5a和第二切削手段5b之切削刀533，不需要框架推壓機構，降低成本。 As shown in FIG. 14, the semiconductor wafer W is sucked and held on the holding table 34 via the dicing tape T, and the processing feed means 35 constituting the holding stage mechanism 3 is actuated to suck and hold the semiconductor wafer W. The holding table 34 is moved to a processing area in which the cutting mechanism 4 is disposed as shown in FIG. Further, the semiconductor wafer W held by the holding stage 34 is subjected to a predetermined cutting process by the first cutting means 5a and the second cutting means 5b. In addition, since the holding stage 34 is formed to have an outer diameter larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the annular frame F as described above, the annular frame F is slightly sagged by its own weight, and does not interfere in the cutting process. The cutting blade 533 of the first cutting means 5a and the second cutting means 5b does not require a frame pressing mechanism, and the cost is reduced.

如上述般，若對被保持於保持台34之半導體晶圓W施予規定之切削加工時，使加工進給手段35作動而將吸引保持切削完之半導體晶圓W之保持台34定位在圖16所示之被加工物拆裝位置。在該狀態下，被保持於保持台34之切削完的半導體晶圓W被定位在暫時放置機構8之正下方。 As described above, when a predetermined cutting process is performed on the semiconductor wafer W held by the holding stage 34, the processing feed means 35 is actuated to position the holding stage 34 of the semiconductor wafer W that has been sucked and held. The position at which the workpiece is removed is shown in Fig. 16. In this state, the semiconductor wafer W that has been cut by the holding stage 34 is positioned directly below the temporary placement mechanism 8.

若將被保持在保持台34之切削完之半導體晶圓W定位在暫時放置機構8之正下方時，在將暫時放置機構8之一對支撐軌道80之底部81a、81b定位在開啟位置之狀態下，使汽缸861作動，如圖17所示般，使一對支撐軌道80下降而定位在下部位置上。而且，將一對支撐軌道80之底部81a、81b定位在關閉位置而支撐環狀框架F，並且解除藉由保持台34進行的半導體晶圓W之吸引保持。 If the semiconductor wafer W held by the holding stage 34 is positioned directly under the temporary placement mechanism 8, the state in which one of the temporary placement mechanisms 8 is positioned at the bottom 81a, 81b of the support rail 80 is in the open position. Next, the cylinder 861 is actuated, and as shown in Fig. 17, the pair of support rails 80 are lowered to be positioned at the lower position. Further, the bottom portions 81a, 81b of the pair of support rails 80 are positioned at the closed position to support the annular frame F, and the suction holding of the semiconductor wafer W by the holding table 34 is released.

接著，使暫時放置機構8之汽缸861作動而使支撐環狀框架F之一對支撐軌道80上升，且如圖18所示般，在較上部位置些許下方，搬出、搬入機構7之把持構件74及一對限制銷75將一對支撐軌道80定位在可以在被支 撐於一對支撐軌道80之切削完半導體晶圓W之上方移動之中間位置。 Next, the cylinder 861 of the temporary placement mechanism 8 is actuated to raise one of the support annular frames F to the support rail 80, and as shown in Fig. 18, the holding member 74 of the loading and unloading mechanism 7 is slightly lower than the upper position. And a pair of restriction pins 75 positioning a pair of support rails 80 to be supported The intermediate position of the pair of support rails 80 on which the semiconductor wafer W is moved is moved.

而且，使搬出、搬入機構7之搬運移動手段71作動，如圖19所示般，將支撐基台72移動至卡匣載置機構6側，且使一對限制銷75(參照圖5及圖6)與被設置在隔著切割膠帶T而支撐被收容在卡匣60之半導體晶圓W之環狀框架F的溝槽F-1及平面F-2(參照圖1)卡合，依此將半導體晶圓W位置限制在規定位置上。而且，藉由使汽缸740作動，將支撐新的半導體晶圓W之環狀框架F把持在支撐基台72和把持構件74(參照圖6)之間。此時，把持構件74和一對限制銷75係在切削完半導體晶圓W之上方移動。 Then, the conveyance means 71 of the carry-out/loading mechanism 7 is actuated, and as shown in Fig. 19, the support base 72 is moved to the side of the cassette mounting mechanism 6, and a pair of restriction pins 75 are provided (see Fig. 5 and Fig. 5). 6) engaging with the groove F-1 and the plane F-2 (see FIG. 1) provided in the annular frame F of the semiconductor wafer W accommodated in the cassette 60 via the dicing tape T, and accordingly The position of the semiconductor wafer W is limited to a predetermined position. Further, by actuating the cylinder 740, the annular frame F supporting the new semiconductor wafer W is held between the support base 72 and the grip member 74 (see Fig. 6). At this time, the grip member 74 and the pair of restriction pins 75 move over the semiconductor wafer W after cutting.

接著，使暫時放置機構8之汽缸851作動而將支撐切削完半導體晶圓W之一對支撐軌道80定位在上部位置，並且將支撐切削完半導體晶圓W之環狀框架F中之卡匣載置機構6側之端面定位在與一對輔助限制銷77相向之位置上。之後，使搬出、搬入機構7之搬運移動手段71作動，如圖20所示般，藉由使支撐基台72移動至與卡匣載置機構6相反側，將支撐藉由支撐基台72和把持構件74所把持之新的半導體晶圓W之環狀框架F搬運至暫時放置機構8之一對支撐軌道80，同時將支撐與一對輔助限制銷77抵接的切削完半導體晶圓W之環狀框架F搬運至輔助暫時放置機構9之一對輔助支撐軌道90。 Next, the cylinder 851 of the temporary placement mechanism 8 is actuated to position one of the support-cut semiconductor wafers W to the upper position of the support rail 80, and the support in the annular frame F supporting the semiconductor wafer W is loaded. The end face on the side of the mechanism 6 is positioned at a position facing the pair of auxiliary restricting pins 77. Thereafter, the transporting means 71 of the carry-out and carry-in mechanism 7 is actuated, and as shown in FIG. 20, by supporting the support base 72 to the side opposite to the cassette mounting mechanism 6, the support is supported by the support base 72 and The annular frame F of the new semiconductor wafer W held by the grip member 74 is transported to the support rail 80 of the temporary placement mechanism 8 while the semiconductor wafer W is supported by the pair of auxiliary limiting pins 77. The annular frame F is transported to one of the auxiliary temporary placement mechanisms 9 to the auxiliary support rail 90.

若將支撐切削完半導體晶圓W之環狀框架F搬運至輔助暫時放置機構9之一對輔助支撐軌道90時，如圖 21所示般，使汽缸961作動而使一對輔助支撐軌道90下降，定位在下部位置上。在該狀態下，被安裝於環狀框架F，且黏貼有半導體晶圓W之切割膠帶T與洗淨機構10之旋轉台12之上面接觸。而且，藉由使一對輔助支撐軌道90之底部91a、91b從關閉位置定位在開啟位置，將切削完之半導體晶圓W隔著切割膠帶T而載置在旋轉台12之上面。而且，藉由使無圖示之吸引手段作動，在旋轉台12之上面隔著切割膠帶T而吸引保持切削完之半導體晶圓W。 If the annular frame F supporting the semiconductor wafer W is transported to one of the auxiliary temporary placement mechanisms 9 to the auxiliary support rail 90, as shown in the figure As shown in Fig. 21, the cylinder 961 is actuated to lower the pair of auxiliary support rails 90 and to be positioned at the lower position. In this state, the dicing tape T attached to the annular frame F and having the semiconductor wafer W adhered thereto is in contact with the upper surface of the rotary table 12 of the cleaning mechanism 10. Further, by positioning the bottom portions 91a, 91b of the pair of auxiliary support rails 90 from the closed position at the open position, the cut semiconductor wafer W is placed on the upper surface of the turntable 12 via the dicing tape T. Further, by moving the suction means (not shown), the cut semiconductor tape W is sucked and held on the upper surface of the turntable 12 via the dicing tape T.

接著，將暫時放置機構8之一對支撐軌道80和輔助暫時放置機構9之一對輔助支撐軌道90如圖22(a)所示般定位在上部位置，且使旋轉台12旋轉，同時如圖22(b)所示般，藉由使無圖示之洗淨水供給手段作動，從噴射噴嘴13噴射洗淨水130。此時，定位在被配設在搬出、搬入機構7之支撐基台72的卡合手段78之卡合桿781進岀而與噴射噴嘴13卡合的位置上，使搬運移動手段71作動而使卡合桿781在Y軸方向往返移動。因此，與被連結於噴射噴嘴13之接線15之一端連結的錘體14之重力協同作用而使噴射噴嘴13在Y軸方向往返移動。另外，噴射噴嘴13之往返移動範圍至少從切削完之半導體晶圓W之外周至中心的範圍即可。其結果，隔著切割膠帶T被吸引保持在旋轉台12之切削完之半導體晶圓W被旋轉洗淨。另外，在朝向上述噴射噴嘴13之Y軸方向的往返移動中，因搬出、搬入機構7成為驅動源，故能夠小型化，同時可以謀求降低成本。再者，旋轉台12因如上述般被形成其外徑大於半導體 晶圓W之外徑，且小於環狀框架F之內徑，故環狀框架F藉由自重些許下垂，被供給至半導體晶圓W之洗淨水滑順地被排岀，同時不需要框架推壓機構，降低成本。 Next, one of the pair of support rails 80 and one of the auxiliary temporary placement mechanisms 9 is positioned in the upper position as shown in FIG. 22(a), and the rotary table 12 is rotated as shown in FIG. 22(a). As shown in FIG. 22(b), the washing water 130 is sprayed from the injection nozzle 13 by operating the washing water supply means (not shown). At this time, the engagement lever 781 of the engagement means 78, which is disposed on the support base 72 of the carry-out and carry-in mechanism 7, is engaged with the injection nozzle 13, and the conveyance means 71 is actuated. The engagement lever 781 reciprocates in the Y-axis direction. Therefore, the gravity of the hammer body 14 coupled to one end of the wire 15 connected to the injection nozzle 13 cooperates to reciprocate the injection nozzle 13 in the Y-axis direction. Further, the reciprocating range of the injection nozzle 13 may be at least from the outer circumference to the center of the semiconductor wafer W after cutting. As a result, the semiconductor wafer W that has been sucked and held by the turret 12 while being cut and held by the turret 12 is rotatably washed. In addition, in the reciprocating movement in the Y-axis direction of the injection nozzle 13, the carry-out and carry-in mechanism 7 serves as a drive source, so that the size can be reduced and the cost can be reduced. Furthermore, the rotary table 12 is formed to have an outer diameter larger than that of the semiconductor as described above. The outer diameter of the wafer W is smaller than the inner diameter of the annular frame F, so that the annular frame F is drooped by the self-weight, and the washing water supplied to the semiconductor wafer W is drained smoothly, without requiring a frame. Push the mechanism to reduce costs.

如上述般，若洗淨切削完之半導體晶圓W時，如圖23所示般，將搬出、搬入機構7定位在上述待機位置，同時在將構成輔助暫時放置機構9之一對輔助支撐軌道90之底部91a、91b定位在開啟位置之狀態下定位於下部位置，使底部91a、91b成為關閉位置而支撐用以支撐洗淨完之半導體晶圓W的環狀框架F。而且，解除藉由旋轉台12所進行的半導體晶圓W之吸引保持。 As described above, when the semiconductor wafer W that has been cut is cleaned, as shown in FIG. 23, the carry-out and carry-in mechanism 7 is positioned at the standby position, and at the same time, one of the auxiliary temporary placement mechanisms 9 is configured as an auxiliary support rail. The bottom portions 91a, 91b of the 90 are positioned at the lower position in the state of being in the open position, and the bottom portions 91a, 91b are brought into the closed position to support the annular frame F for supporting the cleaned semiconductor wafer W. Further, the suction holding of the semiconductor wafer W by the turntable 12 is released.

接著，如圖24所示般，將支撐洗淨完之半導體晶圓W之環狀框架F的輔助暫時放置機構9之一對輔助支撐軌道90定位在上部位置上。而且，使被配設在搬出、搬入機構7之支撐基台72的輔助把持構件76作動而把持環狀框架F。 Next, as shown in FIG. 24, one of the auxiliary temporary placement mechanisms 9 supporting the annular frame F of the cleaned semiconductor wafer W is positioned at the upper position on the auxiliary support rail 90. Then, the auxiliary grip member 76 disposed on the support base 72 of the carry-out and carry-in mechanism 7 is actuated to grip the annular frame F.

而且，使搬出、搬入機構7之搬運移動手段71作動，如圖25所示般，使支撐洗淨完之半導體晶圓W之環狀框架F從輔助暫時放置機構9之一對輔助支撐軌道90移動至暫時放置機構8之一對支撐軌道80。 Then, the transporting means 71 of the carry-out and carry-in mechanism 7 is actuated, and as shown in FIG. 25, the annular frame F supporting the cleaned semiconductor wafer W is supplied from the auxiliary temporary placement mechanism 9 to the auxiliary support rail 90. Move to one of the pair of temporary placement mechanisms 8 to support the track 80.

接著，如圖26所示般，將暫時放置機構8之一對支撐軌道80定位在中間位置，同時將被配設在搬出、搬入機構7之支撐基台72的把持構件74及一對限制銷75定位在待機位置。 Next, as shown in FIG. 26, one of the temporary placement mechanisms 8 is positioned at the intermediate position with respect to the support rail 80, and the holding member 74 and the pair of restriction pins that are disposed on the support base 72 of the carry-out and carry-in mechanism 7 are disposed. 75 is positioned in the standby position.

而且，使搬出、搬入機構7之搬運移動手段71 作動，如圖27所示般，使支撐基台72移動至卡匣載置機構6側而將把持構件74及一對限制銷75從待機位置移動至被載置在卡匣載置機構6之卡匣60，依此將支撐洗淨完之半導體晶圓W的環狀框架F收容在卡匣60。 Further, the transporting means 71 for carrying out and carrying in the mechanism 7 As shown in FIG. 27, the support base 72 is moved to the side of the cassette mounting mechanism 6, and the holding member 74 and the pair of restriction pins 75 are moved from the standby position to be placed on the cassette mounting mechanism 6. The cassette 60 receives the annular frame F supporting the cleaned semiconductor wafer W in the cassette 60.

另外，如上述般，與對洗淨完之半導體晶圓W進行洗淨，同時實施收容至卡匣60之作業之時，從卡匣60被搬出至暫時放置機構8之一對支撐軌道80之新的半導體晶圓W，如上述般被搬運至構成保持台機構3之保持台34且被吸引保持。而且，被吸引保持在保持台34之新的半導體晶圓W藉由加工進給手段35被移動至配設有切削機構4之加工區域，且藉由第一切削手段5a和第二切削手段5b被施予規定之切削加工。 Further, as described above, when the semiconductor wafer W that has been cleaned is cleaned and stored in the cassette 60, the cassette 60 is carried out from the cassette 60 to the support rail 80 of the temporary placement mechanism 8. The new semiconductor wafer W is transported to the holding stage 34 constituting the holding stage mechanism 3 as described above and is sucked and held. Further, the new semiconductor wafer W sucked and held by the holding stage 34 is moved by the processing feed means 35 to the processing area where the cutting mechanism 4 is disposed, and by the first cutting means 5a and the second cutting means 5b The specified cutting process is applied.

如上述般，圖示之實施型態中之切削裝置係於保持被加工物之保持台34被定位在被加工物拆裝區域之時，藉由搬出、搬入機構7搬出隔著切割膠帶T支撐被收容在卡匣60之半導體晶圓W之環狀框架F而暫時放置在構成暫時放置機構8之一對支撐軌道80，且藉由升降手段86使一對支撐軌道80下降而將隔著切割膠帶T被支撐於環狀框架F之半導體晶圓W載置於保持台34，且藉由開關手段85a、85b開啟底部81a、81b，依此由於隔著切割膠帶T將半導體晶圓W保持在保持台34，故搬運隔著切割膠帶T支撐作為被加工物之半導體晶圓W的環狀框架F的搬運手段實質上僅有搬出、搬入機構7，所以零件數量減少而降低成本，同時可以謀求裝置之小型化。再者，因搬出、搬入機構 7具有也在被配設在洗淨機構10之旋轉台12之正上方的輔助暫時放置機構9搬運隔著切割膠帶T支撐切削完之半導體晶圓W之環狀框架F之功能，故可以更謀求裝置之小型化。 As described above, the cutting device in the embodiment shown in the figure is supported by the loading and unloading mechanism 7 while being held by the cutting tape T when the holding table 34 holding the workpiece is positioned in the workpiece attaching and detaching area. The annular frame F of the semiconductor wafer W accommodated in the cassette 60 is temporarily placed on one of the pair of support rails 80 constituting the temporary placement mechanism 8, and the pair of support rails 80 are lowered by the lifting means 86 to be cut by the gap The semiconductor wafer W supported on the ring frame F by the tape T is placed on the holding table 34, and the bottom portions 81a, 81b are opened by the switching means 85a, 85b, whereby the semiconductor wafer W is held by the dicing tape T. Since the holding means 34 is provided, the transport means for transporting the annular frame F as the semiconductor wafer W as the workpiece via the dicing tape T is substantially only the carry-out and carry-in mechanism 7, so that the number of parts can be reduced and the cost can be reduced. The device is miniaturized. Furthermore, due to moving out and moving in 7 has a function of the auxiliary temporary placement mechanism 9 disposed directly above the rotary table 12 of the cleaning mechanism 10, and transports the annular frame F of the semiconductor wafer W that has been cut through the dicing tape T, so that it can be further The device is miniaturized.

2‧‧‧靜止基台 2‧‧‧Standing abutment

3‧‧‧保持台機構 3‧‧‧ Maintaining the institution

34‧‧‧保持台 34‧‧‧ Keeping the table

341‧‧‧平台本體 341‧‧‧ platform ontology

342‧‧‧吸附夾具 342‧‧‧Adsorption fixture

4‧‧‧切削機構 4‧‧‧ cutting mechanism

41‧‧‧支撐框架 41‧‧‧Support frame

411‧‧‧第一柱部 411‧‧‧The first column

412‧‧‧第二柱部 412‧‧‧Second column

413‧‧‧支撐部 413‧‧‧Support

5a‧‧‧第一切削手段 5a‧‧‧First cutting means

5b‧‧‧第二切削手段 5b‧‧‧Second cutting means

522‧‧‧安裝部 522‧‧‧Installation Department

6‧‧‧卡匣載置機構 6‧‧‧Carcass loading mechanism

60‧‧‧卡匣 60‧‧‧Carmen

61‧‧‧卡匣台 61‧‧‧Card

7‧‧‧搬出、搬入機構 7‧‧‧ Moving out and moving into the organization

71‧‧‧搬運移動手段 71‧‧‧Transportation means

72‧‧‧支撐基台 72‧‧‧Support abutment

73‧‧‧連結構件 73‧‧‧Connected components

8‧‧‧暫時放置機構 8‧‧‧ Temporary placement agency

80‧‧‧一對支撐軌道 80‧‧‧A pair of support tracks

9‧‧‧輔助暫時放置機構 9‧‧‧Assisted temporary placement agency

90‧‧‧一對輔助支撐軌道 90‧‧‧A pair of auxiliary support tracks

10‧‧‧洗淨機構 10‧‧‧ Washing agency

11‧‧‧洗淨殼罩 11‧‧‧Clean cover

111‧‧‧前壁 111‧‧‧ front wall

114‧‧‧側壁 114‧‧‧ side wall

12‧‧‧旋轉台 12‧‧‧Rotating table

13‧‧‧噴射噴嘴 13‧‧‧jet nozzle

14‧‧‧錘體 14‧‧‧ Hammer

15‧‧‧接線 15‧‧‧ wiring

16‧‧‧滑輪 16‧‧‧ pulley

F‧‧‧環狀框架 F‧‧‧Ring frame

T‧‧‧切割膠帶 T‧‧‧ cutting tape

W‧‧‧半導體晶圓 W‧‧‧Semiconductor Wafer

F-1‧‧‧溝槽 F-1‧‧‧ trench

F-2‧‧‧平面 F-2‧‧ plane

Claims (6)

一種切削裝置，具備：載置收容有複數之被加工物的卡匣之卡匣載置機構，和從被載置在該卡匣載置機構之卡匣搬岀及搬入被加工物之搬岀、搬入機構，和暫時放置藉由該搬岀、搬入機構被搬岀之被加工物的暫時放置機構，和保持被暫時放置在該暫時放置機構之被加工物的保持台，和切削被保持在該保持台之被加工物的切削機構，和使該保持台在加工進給方向(X軸方向)進行加工進給的加工進給機構，該切削裝置之特徵在於：該加工進給機構具備：X軸導軌，其係用以支撐成使該保持台在配設有該暫時放置機構之被加工物拆裝區域，和配設有該切削機構之加工區域之間於加工進給方向(X軸方向)能夠移動；和加工進給手段，其係沿著該X軸導軌而使該保持台移動，該暫時放置機構和該卡匣載置機構係在與X軸方向正交之Y軸方向相鄰接而被配設，該搬岀、搬入機構具備支撐基台；被配設在該支撐基台，把持被收容在卡匣之被加工物的把持構件；將被加工物限制在規定之位置的一對限制銷；及使該支撐基台在Y軸方向移動之搬運移動手段，該暫時放置機構具備：在Y軸方向延伸並具有支撐被加工物之兩側部的底部和側部，且該底部被構成能夠開關之一對支撐軌道；和開關該一對支撐軌道之該底部的開關手段；和使該一對支撐軌道在上下方向移動之升降手段， 於該保持台被定位在該被加工物拆裝區域之時，藉由該搬岀、搬入機構，搬岀被收容在卡匣之被加工物而暫時放置在構成該暫時放置機構之該一對支撐軌道，並藉由該升降手段使該一對支撐軌道下降而將被加工物載置在該保持台，且藉由該開關手段開啟該底部，將被加工物保持在該保持台。 A cutting device includes: a cassette mounting mechanism that mounts a cassette that accommodates a plurality of workpieces; and a loading and unloading of the workpiece from a cassette placed on the cassette mounting mechanism a loading mechanism, and a temporary placement mechanism for temporarily storing the workpiece to be moved by the loading and unloading mechanism, and a holding table for holding the workpiece temporarily placed in the temporary placement mechanism, and the cutting is held at The cutting mechanism for holding the workpiece of the holding table and the machining feeding mechanism for feeding the holding table in the machining feed direction (X-axis direction), the cutting device is characterized in that the machining feed mechanism includes: The X-axis guide rail is configured to support the holding table in the workpiece loading and unloading area where the temporary placing mechanism is disposed, and the machining direction in which the cutting mechanism is disposed in the machining feed direction (X-axis) a direction capable of moving; and a machining feed means for moving the holding table along the X-axis guide rail, the temporary placement mechanism and the cassette mounting mechanism being in a Y-axis direction orthogonal to the X-axis direction Arranged adjacent to each other, the moving, moving The entry mechanism includes a support base; a holding member disposed on the support base to hold the workpiece accommodated in the cassette; a pair of restriction pins for restricting the workpiece to a predetermined position; and the support base a transporting means for moving the table in the Y-axis direction, the temporary placing mechanism having a bottom portion and a side portion extending in the Y-axis direction and supporting both sides of the workpiece, and the bottom portion is configured to be capable of switching one of the support rails And a switching means for switching the bottom of the pair of support rails; and a lifting means for moving the pair of support rails in the up and down direction, When the holding table is positioned in the workpiece attachment/detachment area, the object to be processed is placed in the cassette by the loading and unloading mechanism, and the pair is temporarily placed in the temporary placement mechanism. The rail is supported, and the pair of support rails are lowered by the lifting means to place the workpiece on the holding table, and the bottom portion is opened by the switching means to hold the workpiece on the holding table. 如請求項1所記載之切削裝置，其中以與該暫時放置機構相鄰接之方式，在相對於該卡匣載置機構為Y軸方向相反側配設具備用以洗淨被加工物之旋轉台的洗淨機構，同時配設有被構成在該洗淨機構之正上方與該暫時放置機構連通，且暫時放置被加工物之輔助暫時放置機構，該輔助暫時放置機構具備：在Y軸方向延伸並具有支撐被加工物之兩側部的底部和側部，且該底部被構成能夠開關之一對輔助支撐軌道；和開關該一對輔助支撐軌道之該底部的開關手段；和使該一對輔助支撐軌道在上下方向移動之輔助升降手段。 The cutting device according to claim 1, wherein the cutting device is disposed adjacent to the temporary placing mechanism, and is provided with a rotation for washing the workpiece on a side opposite to the Y-axis direction with respect to the cassette mounting mechanism. The cleaning mechanism of the table is also provided with an auxiliary temporary placement mechanism that is configured to be in communication with the temporary placement mechanism directly above the cleaning mechanism and temporarily places the workpiece, the auxiliary temporary placement mechanism having: in the Y-axis direction Extending and having a bottom portion and a side portion supporting both sides of the workpiece, and the bottom portion is configured to be capable of switching one pair of auxiliary support rails; and switching means for switching the bottom of the pair of auxiliary support rails; and An auxiliary lifting means for moving the auxiliary support rail in the up and down direction. 如請求項2所記載之切削裝置，其中該搬岀、搬入機構具備：被配設在該支撐基台且把持在被支撐於該一對輔助支撐軌道之被加工物中，與藉由該把持構件被把持之區域相反側之區域的輔助把持構件，和將被支撐於該一對輔助支撐軌道之被加工物限制在規定之位置的一對輔助限制銷，於保持切削完之被加工物之該保持台被定位在該被加 工物拆裝區域之時，在構成該暫時放置機構之該一對支撐軌道之該底部呈開啟之狀態下，使該一對支撐軌道下降而將該底部定位在切削完之被加工物之下部之後，在使該底部關閉而支撐切削完之被加工物之狀態下，使該一對支撐軌道上升，接著，藉由該搬岀、搬入機構之該把持構件把持被收容在卡匣之被加工物，同時將被設置在該支撐基台之該一對輔助限制銷定位在切削完之該被加工物中，與藉由該把持構件被把持之區域相反側之區域的端面，且藉由使該支撐基台移動至該輔助暫時放置機構側，將被收容在卡匣之被加工物定位在該暫時放置機構，同時將切削完之被加工物定位在該輔助暫時放置機構，藉由構成該輔助暫時放置機構之該輔助升降手段暫時放置在該一對輔助支撐軌道，並藉由該升降手段使該一對輔助支撐軌道下降而將被加工物載置在該洗淨機構之該旋轉台，且藉由該開關手段開啟該底部使切削完之被加工物保持在該旋轉台。 The cutting device according to claim 2, wherein the loading and unloading mechanism includes: being disposed on the support base and being held by a workpiece supported by the pair of auxiliary support rails, and by the holding An auxiliary holding member in a region on the opposite side of the region where the member is gripped, and a pair of auxiliary restricting pins for restraining the workpiece supported by the pair of auxiliary supporting rails at a predetermined position to hold the workpiece to be cut The holding station is positioned at the added At the time of the workpiece dismounting area, the pair of support rails are lowered in a state in which the bottom of the pair of support rails constituting the temporary placement mechanism is opened, and the bottom portion is positioned at the lower portion of the workpiece to be cut. Thereafter, the pair of support rails are raised while the bottom portion is closed to support the workpiece to be cut, and then the gripping member of the loading and unloading mechanism grips and is processed in the cassette. And at the same time, the pair of auxiliary limiting pins disposed on the supporting base are positioned at the end face of the region on the side opposite to the region to be gripped by the holding member, and by The support base moves to the auxiliary temporary placement mechanism side, and the workpiece accommodated in the cassette is positioned in the temporary placement mechanism, and the cut workpiece is positioned in the auxiliary temporary placement mechanism, thereby The auxiliary lifting means for assisting the temporary placement mechanism is temporarily placed on the pair of auxiliary support rails, and the pair of auxiliary support rails are lowered by the lifting means to place the workpiece on the workpiece The turntable mechanism of the net, and the switching means is turned on by the cutting of the bottom of the finished workpiece held in the turntable. 如請求項2或3所記載之切削裝置，其中該洗淨機構具備被配設在該旋轉台之上方的噴射洗淨水之噴射噴嘴，該噴射噴嘴藉由被配設在構成該搬岀、搬入機構之該支撐基台且選擇性地進行卡合的卡合手段，隨著該支撐基台之移動，在Y軸方向移動，至少對從被加工物之外周至中心的區域噴射洗淨水。 The cutting device according to claim 2 or 3, wherein the cleaning mechanism includes an injection nozzle for spraying the washing water disposed above the rotary table, and the injection nozzle is disposed to constitute the transfer nozzle, The engaging means for the supporting base of the loading mechanism and selectively engaging is moved in the Y-axis direction as the supporting base moves, and at least the washing water is sprayed from the outer circumference to the center of the workpiece. . 如請求項4所記載之切削裝置，其中 在該洗淨機構之該噴射噴嘴經滑輪連結一端與錘體連結的接線之另一端，且被構成藉由該錘體之重力在Y軸方向移動，該卡合手段具備以能夠進退之方式被配設在該支撐基台的卡合桿，在該卡合桿進出之狀態下，從該噴射噴嘴中藉由錘體之重力而移動的方向使接觸。 A cutting device as recited in claim 4, wherein The injection nozzle of the cleaning mechanism is connected to the other end of the wire connected to the hammer body via a pulley, and is configured to move in the Y-axis direction by the gravity of the hammer body. The engagement means is provided to be able to advance and retreat. The engagement lever provided on the support base contacts the direction in which the movement of the hammer is moved by the gravity of the hammer while the engagement lever is in and out. 如請求項1所記載之切削裝置，其中該切削機構具備；以能夠旋轉之方式具備第一切削刀之第一切削手段，和以能夠旋轉之方式具備被配設成與該第一切削手段之第一切削刀相向之第二切削刀的第二切削手段，以能夠在與X軸方向正交之Y軸方向移動之方式支撐該第一切削手段和該第二切削手段之Y軸導軌；和沿著該Y軸導軌使該第一切削手段移動之第一分度進給手段，及沿著該Y軸導軌使該第二切削手段移動的第二分度進給手段。 The cutting device according to claim 1, wherein the cutting mechanism includes: a first cutting means that rotatably includes a first cutting blade; and a rotatably provided first cutting means a second cutting means of the second cutting blade facing the first cutting blade supports the first cutting means and the Y-axis guide of the second cutting means so as to be movable in a Y-axis direction orthogonal to the X-axis direction; and a first indexing feeding means for moving the first cutting means along the Y-axis rail, and a second indexing means for moving the second cutting means along the Y-axis rail.
TW105107381A 2015-04-28 2016-03-10 Cutting device TWI674180B (en)

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TWI674180B (en) 2019-10-11

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