JP6441737B2 - Cutting equipment - Google Patents

Cutting equipment Download PDF

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JP6441737B2
JP6441737B2 JP2015092101A JP2015092101A JP6441737B2 JP 6441737 B2 JP6441737 B2 JP 6441737B2 JP 2015092101 A JP2015092101 A JP 2015092101A JP 2015092101 A JP2015092101 A JP 2015092101A JP 6441737 B2 JP6441737 B2 JP 6441737B2
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workpiece
cutting
pair
auxiliary
temporary placement
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JP2016207988A (en
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大河原　聡
聡 大河原
惇 八木原
惇 八木原
健太郎 寺師
健太郎 寺師
勝彦 赤瀬
勝彦 赤瀬
伸太郎 松岡
伸太郎 松岡
万平 田中
万平 田中
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Disco Corp
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Priority to TW105107381A priority patent/TWI674180B/en
Priority to KR1020160048047A priority patent/KR102405690B1/en
Priority to CN201610274010.3A priority patent/CN106098621B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Description

本発明は、半導体ウエーハ等の被加工物を切削するための切削装置に関する。   The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer.

半導体デバイス製造工程においては、略円板形状である半導体ウエーハの表面に格子状に配列された分割予定ラインによって複数の領域が区画され、この区画された領域にＩＣ、ＬＳＩ等のデバイスを形成する。そして、半導体ウエーハを分割予定ラインに沿って切断することによりデバイスが形成された領域を分割して個々の半導体デバイスを製造している。   In the semiconductor device manufacturing process, a plurality of regions are partitioned by division lines arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in the partitioned regions. . Then, the semiconductor wafer is cut along the planned division line to divide the region where the device is formed to manufacture individual semiconductor devices.

半導体ウエーハ等の被加工物を分割予定ラインに沿って切断する切削装置は、複数の被加工物を収容したカセットが載置されるカセット載置手段と、該カセット載置手段に載置されたカセットから被加工物を搬出および搬入する搬出・搬入手段と、該搬出・搬入手段によって搬出された被加工物を仮置きする仮置き手段と、該仮置き手段に仮置きされた被加工物を保持する保持テーブルと、該保持テーブルに保持された被加工物を切削する切削手段と、該保持テーブルを加工送り方向（X軸方向）に加工送りする加工送り手段と、を具備している。そして、切削手段として第１の切削ブレードを回転可能に備えた第１の切削手段と、該第１の切削手段の第１の切削ブレードと対向して配設された第２の切削ブレードを回転可能に備えた第２の切削手段を具備することにより、半導体ウエーハ等の被加工物を分割予定ラインに沿って効率よく切断して個々のデバイスに分割することができる（例えば、特許文献１参照）。   A cutting apparatus for cutting a workpiece such as a semiconductor wafer along a division line, a cassette placing means for placing a cassette containing a plurality of workpieces, and placed on the cassette placing means An unloading / loading means for unloading and loading the workpiece from the cassette, a temporary placing means for temporarily placing the workpiece unloaded by the unloading / loading means, and a workpiece temporarily placed on the temporary placing means. A holding table for holding, a cutting means for cutting a workpiece held on the holding table, and a processing feed means for processing and feeding the holding table in the processing feed direction (X-axis direction) are provided. Then, a first cutting means provided rotatably with a first cutting blade as a cutting means, and a second cutting blade disposed opposite to the first cutting blade of the first cutting means are rotated. By providing the second cutting means that is possible, it is possible to efficiently cut a workpiece such as a semiconductor wafer along the planned dividing line and divide it into individual devices (for example, see Patent Document 1). ).

特開平１１−２６４０２号公報JP-A-11-26402

しかるに、上述した切削装置は、特に被加工物を搬送するための機構が複数必要で装置全体の構成が複雑で大型化するとともに、部品点数が多く製造コストが高くなるという問題がある。   However, the above-described cutting apparatus has a problem that a plurality of mechanisms for conveying a workpiece are necessary, and the configuration of the entire apparatus is complicated and large, and the number of parts is large and the manufacturing cost is increased.

本発明は上記事実に鑑みてなされたものであり、その主たる技術的課題は、装置全体の構成を単純にして小型化するとともに、部品点数を少なくして製造コストを低減することができる切削装置を提供することにある。   The present invention has been made in view of the above-mentioned facts, and a main technical problem thereof is a cutting apparatus capable of reducing the manufacturing cost by reducing the number of parts while simplifying the size of the entire apparatus and reducing the size. Is to provide.

上記主たる技術課題を解決するため、本発明によれば、複数の被加工物を収容したカセットが載置されるカセット載置機構と、該カセット載置機構に載置されたカセットから被加工物を搬出および搬入する搬出・搬入機構と、該搬出・搬入機構によって搬出された被加工物を仮置きする仮置き機構と、該仮置き機構に仮置きされた被加工物を保持する保持テーブルと、該保持テーブルに保持された被加工物を切削する切削機構と、該保持テーブルを加工送り方向（X軸方向）に加工送りする加工送り機構と、を具備する切削装置であって、
該加工送り機構は、該保持テーブルを該仮置き機構が配設された被加工物着脱領域と、該切削機構が配設された加工領域との間を加工送り方向（X軸方向）に移動可能に支持するX軸ガイドレールと、該X軸ガイドレールに沿って該保持テーブルを移動せしめる加工送り手段を備え、
該仮置き機構と該カセット載置機構はX軸方向と直交するY軸方向に隣接して配設されており、
該搬出・搬入機構は、支持基台と、該支持基台に配設されカセットに収容された被加工物を把持する把持部材と、被加工物を所定の位置に規制する一対の規制ピンと、該支持基台をY軸方向に移動する搬送移動手段とを備え、
該仮置き機構は、Y軸方向に延在し被加工物の両側部を支持する底部と側部とを有し該底部が開閉可能に構成された一対の支持レールと、該一対の支持レールの該底部を開閉する開閉手段と、該一対の支持レールを上下方向に移動せしめる昇降手段と、を備えており、
該保持テーブルが該被加工物着脱領域に位置付けられている際に、該搬出・搬入機構によってカセットに収容された被加工物を搬出して該仮置き機構を構成する該一対の支持レールに仮置きし、該昇降手段によって該一対の支持レールを下降して被加工物を該保持テーブルに載置し、該開閉手段によって該底部を開くことにより被加工物を該保持テーブルに保持する、
ことを特徴とする切削装置が提供される。 In order to solve the main technical problem, according to the present invention, a cassette mounting mechanism on which a cassette containing a plurality of workpieces is mounted, and a workpiece from the cassette mounted on the cassette mounting mechanism. An unloading / loading mechanism for unloading and unloading, a temporary placing mechanism for temporarily placing the workpiece unloaded by the unloading / loading mechanism, and a holding table for holding the workpiece temporarily placed on the temporary placing mechanism; A cutting device comprising: a cutting mechanism for cutting a workpiece held on the holding table; and a processing feed mechanism for processing and feeding the holding table in a processing feed direction (X-axis direction),
The machining feed mechanism moves the holding table in a machining feed direction (X-axis direction) between a workpiece attaching / detaching area where the temporary placement mechanism is arranged and a machining area where the cutting mechanism is arranged. An X-axis guide rail that can be supported, and a processing feed means for moving the holding table along the X-axis guide rail,
The temporary placement mechanism and the cassette placement mechanism are disposed adjacent to each other in the Y-axis direction perpendicular to the X-axis direction,
The unloading / carrying-in mechanism includes a support base, a gripping member that grips the workpiece disposed in the support base and accommodated in a cassette, and a pair of regulation pins that regulate the workpiece to a predetermined position; A transport moving means for moving the support base in the Y-axis direction,
The temporary placement mechanism includes a pair of support rails that extend in the Y-axis direction and support both side portions of the workpiece and have a bottom portion and side portions that are configured to be openable and closable, and the pair of support rails And an opening / closing means for opening and closing the bottom portion, and an elevating means for moving the pair of support rails in the vertical direction,
When the holding table is positioned in the workpiece attaching / detaching area, the workpiece stored in the cassette is unloaded by the unloading / loading mechanism and temporarily attached to the pair of support rails constituting the temporary placing mechanism. The workpiece is placed on the holding table by lowering the pair of support rails by the elevating means, and the workpiece is held on the holding table by opening the bottom by the opening / closing means.
A cutting device is provided.

上記仮置き機構に隣接しカセット載置機構に対してY軸方向反対側に被加工物を洗浄するためのスピンナーテーブルを備えた洗浄機構が配設されるとともに、該洗浄機構の直上に仮置き機構と連通するように構成され被加工物を仮置きする補助仮置き機構が配設されており、該補助仮置き機構は、Y軸方向に延在し被加工物の両側部を支持する底部と側部とを有し該底部が開閉可能に構成された一対の補助支持レールと、該一対の補助支持レールの底部を開閉する開閉手段と、一対の補助支持レールを上下方向に移動せしめる補助昇降手段とを備えている。   A cleaning mechanism having a spinner table for cleaning a workpiece adjacent to the temporary placement mechanism and on the opposite side of the cassette mounting mechanism in the Y-axis direction is disposed, and temporarily placed immediately above the cleaning mechanism. An auxiliary temporary placement mechanism that is configured to communicate with the mechanism and temporarily places the workpiece is disposed, and the auxiliary temporary placement mechanism extends in the Y-axis direction and supports both sides of the workpiece. And a pair of auxiliary support rails configured to open and close the bottom, opening and closing means for opening and closing the bottom of the pair of auxiliary support rails, and assisting the pair of auxiliary support rails to move in the vertical direction Elevating means.

上記搬出・搬入機構は、支持基台に配設され一対の補助支持レールに支持された被加工物における把持部材によって把持される領域と反対側の領域を把持する補助把持部材と、一対の補助支持レールに支持された被加工物を所定の位置に規制する一対の補助規制ピンとを備え、
切削済みの被加工物を保持した保持テーブルが被加工物着脱領域に位置付けられている際に、仮置き機構を構成する一対の支持レールの底部を開にした状態で該一対の支持レールを下降して底部を切削済みの被加工物の下部に位置付けた後に該底部を閉にして切削済みの被加工物を支持した状態で該一対の支持レールを上昇させ、
次に、搬出・搬入機構の把持部材によってカセットに収容された被加工物を把持するとともに支持基台に設けられた一対の補助規制ピンを切削済みの被加工物における把持部材によって把持された領域と反対側の領域の端面に位置付け、該支持基台を該補助仮置き機構側に移動することにより、カセットに収容された被加工物を仮置き機構に位置付けるとともに切削済みの被加工物を補助仮置き機構に位置付け、
補助仮置き機構を構成する補助昇降手段によって一対の補助支持レールに仮置きし、昇降手段によって一対の補助支持レールを下降して被加工物を洗浄機構のスピンナーテーブルに載置し、開閉手段によって底部を開くことにより切削済みの被加工物をスピンナーテーブルに保持する。 The carry-out / carry-in mechanism includes an auxiliary gripping member that grips a region opposite to a region gripped by a gripping member on a workpiece that is disposed on a support base and supported by a pair of auxiliary support rails, and a pair of auxiliary members. A pair of auxiliary restricting pins for restricting the work piece supported by the support rail to a predetermined position;
When the holding table that holds the cut workpiece is positioned in the workpiece attachment / detachment area, the pair of support rails are lowered with the bottoms of the pair of support rails constituting the temporary placement mechanism open. Then, after the bottom portion is positioned at the lower part of the cut workpiece, the pair of support rails are raised in a state where the bottom portion is closed and the cut workpiece is supported,
Next, the region in which the workpiece stored in the cassette is gripped by the gripping member of the unloading / loading mechanism and the pair of auxiliary regulating pins provided on the support base is gripped by the gripping member in the already-worked workpiece By positioning the support base to the auxiliary temporary placement mechanism side, the workpiece stored in the cassette is positioned in the temporary placement mechanism and assists the cut workpiece. Positioned in the temporary placement mechanism,
Temporary placing on the pair of auxiliary support rails by the auxiliary lifting means constituting the auxiliary temporary placement mechanism, lowering the pair of auxiliary support rails by the lifting means, and placing the workpiece on the spinner table of the cleaning mechanism, by the opening and closing means The cut workpiece is held on the spinner table by opening the bottom.

上記洗浄機構は、スピンナーテーブルの上方に配設された洗浄水を噴射する噴射ノズルを備えており、噴射ノズルは搬出・搬入機構を構成する支持基台に配設され選択的に係合する係合手段によって該支持基台の移動に伴いY軸方向に移動し、少なくとも被加工物の外周から中心までの領域に洗浄水を噴射する。   The cleaning mechanism includes a spray nozzle that sprays cleaning water disposed above the spinner table, and the spray nozzle is disposed on a support base that constitutes a carry-out / load-in mechanism and is selectively engaged. The joint means moves in the Y-axis direction along with the movement of the support base, and the cleaning water is jetted at least in the region from the outer periphery to the center of the workpiece.

上記洗浄機構の噴射ノズルには、一端に錘が連結されたワイヤーの他端がプーリーを介して連結され、錘の重力によってY軸方向に移動するように構成されており、
係合手段は、支持基台に進退可能に配設された係合ロッドを備え、係合ロッドを進出した状態で噴射ノズルにおける錘の重力によって移動する方向から接触せしめる。 The spray nozzle of the cleaning mechanism is configured such that the other end of a wire having a weight connected to one end is connected via a pulley and moves in the Y-axis direction by the gravity of the weight.
The engagement means includes an engagement rod disposed on the support base so as to be able to advance and retreat, and makes the contact from the direction of movement due to the gravity of the weight in the injection nozzle when the engagement rod is advanced.

上記切削機構は、第１の切削ブレードを回転可能に備えた第１の切削手段と、該第１の切削手段の第１の切削ブレードと対向して配設された第２の切削ブレードを回転可能に備えた第２の切削手段と、該第１の切削手段と該第２の切削手段をX軸方向と直交するY軸方向に移動可能に支持するY軸ガイドレールと、該Y軸ガイドレールに沿って第１の切削手段を移動せしめる第１の割り出し送り手段およびY軸ガイドレールに沿って第２の切削手段を移動せしめる第2の割り出し送り手段とを具備している。   The cutting mechanism rotates a first cutting means rotatably provided with a first cutting blade, and a second cutting blade disposed opposite to the first cutting blade of the first cutting means. Second cutting means provided in a possible manner, a Y-axis guide rail that supports the first cutting means and the second cutting means movably in the Y-axis direction orthogonal to the X-axis direction, and the Y-axis guide A first indexing means for moving the first cutting means along the rail and a second indexing means for moving the second cutting means along the Y-axis guide rail.

本発明による切削装置は、上述したように構成され、被加工物を保持する保持テーブルが被加工物着脱領域に位置付けられている際に、搬出・搬入機構によってカセットに収容された被加工物を搬出して仮置き機構を構成する一対の支持レールに仮置きし、昇降手段によって一対の支持レールを下降して被加工物を保持テーブルに載置し、開閉手段によって底部を開くことにより被加工物を保持テーブルに保持するので、被加工物を搬送する搬送手段は実質的に搬出・搬入機構のみであるため、部品点数が低減してコストが低減が低減するとともに、装置の小型化を図ることができる。   The cutting device according to the present invention is configured as described above, and when the holding table for holding the workpiece is positioned in the workpiece attaching / detaching area, the workpiece stored in the cassette by the carry-out / load-in mechanism is provided. Worked by unloading and temporarily placing on a pair of support rails constituting a temporary placement mechanism, lowering the pair of support rails by lifting means, placing the workpiece on a holding table, and opening the bottom by opening / closing means Since the object is held on the holding table, the conveying means for conveying the workpiece is substantially only the unloading / loading mechanism, so that the number of parts is reduced, the cost is reduced, and the apparatus is downsized. be able to.

本発明に従って構成された切削装置の斜視図。The perspective view of the cutting device comprised according to this invention. 図１に示す切削装置の要部斜視図。The principal part perspective view of the cutting device shown in FIG. 図１に示す切削装置に装備される切削機構を示す斜視図。The perspective view which shows the cutting mechanism with which the cutting apparatus shown in FIG. 1 is equipped. 図１におけるA―A断面図。FIG. 2 is a sectional view taken along line AA in FIG. 図１に示す切削装置を構成する搬出・搬入機構の斜視図。The perspective view of the carrying-out / carry-in mechanism which comprises the cutting apparatus shown in FIG. 図５に示す搬出・搬入機構７の要部正面図Front view of essential parts of the carry-out / carry-in mechanism 7 shown in FIG. 図１に示す切削装置を構成する仮置き機構および補助仮置き機構の斜視図。The perspective view of the temporary placement mechanism and auxiliary temporary placement mechanism which comprise the cutting device shown in FIG. 図７に示す仮置き機構の側面図。The side view of the temporary placement mechanism shown in FIG. 図１に示す切削装置を構成する洗浄機構の斜視図。The perspective view of the washing | cleaning mechanism which comprises the cutting device shown in FIG. 搬出・搬入機構の把持部材および一対の規制ピンを待機位置に位置付けた状態を示す斜視図。The perspective view which shows the state which positioned the holding member of a carrying out and carrying-in mechanism, and a pair of control pin in a standby position. 搬出・搬入機構の把持部材によってカセット載置機構に載置されたカセットに収容されている被加工物を支持した環状のフレームを把持する状態を示す斜視図。The perspective view which shows the state which hold | grips the cyclic | annular flame | frame which supported the to-be-processed object accommodated in the cassette mounted in the cassette mounting mechanism with the holding member of a carrying out / carry-in mechanism. 搬出・搬入機構によって環状のフレームに支持された被加工物を仮置き機構の一対の支持レールに搬送する状態を示す斜視図。The perspective view which shows the state which conveys the workpiece supported by the cyclic | annular flame | frame by the carrying-out / carry-in mechanism to a pair of support rail of a temporary placement mechanism. 保持テーブルの上面に環状のフレームにダイシングテープを介して支持された被加工物を載置した状態を示す斜視図。The perspective view which shows the state which mounted the to-be-processed object supported through the dicing tape on the upper surface of the holding table. 仮置き機構の一対の支持レールを上昇して上部位置に位置付けた状態を示す斜視図。The perspective view which shows the state which raised a pair of support rail of the temporary placement mechanism, and was located in the upper position. 被加工物を吸引保持した保持テーブルを切削機構が配設された加工領域に移動した状態を示す斜視図。The perspective view which shows the state which moved the holding | maintenance table which hold | maintained the workpiece to the suction to the process area | region where the cutting mechanism was arrange | positioned. 切削済みの被加工物を吸引保持した保持テーブル被加工物着脱位置に位置付けた状態を示す斜視図。The perspective view which shows the state located in the holding table workpiece attachment or detachment position which sucked and held the cut workpiece. 図１５に示す状態から仮置き機構の一対の支持レールを下部位置に位置付けた状態を示す斜視図。FIG. 16 is a perspective view illustrating a state in which the pair of support rails of the temporary placement mechanism is positioned at a lower position from the state illustrated in FIG. 15. 図１６に示す状態から仮置き機構の一対の支持レールを上部位置より僅かに下方の中間位置に位置付けた状態を示す斜視図。FIG. 17 is a perspective view showing a state in which the pair of support rails of the temporary placement mechanism are positioned at an intermediate position slightly below the upper position from the state shown in FIG. 16. 搬出・搬入機構の把持部によってカセット載置機構に載置されたカセットに収容された被加工物を把持した状態を示す斜視図。The perspective view which shows the state which hold | gripped the to-be-processed object accommodated in the cassette mounted in the cassette mounting mechanism by the holding part of the carrying out / carry-in mechanism. 搬出・搬入機構の把持部によって新たな被加工物を仮置き機構の一対の支持レールに位置付けるとともに、切削済み被加工物を補助仮置き機構の一対の補助支持レールに位置付けた状態を示す斜視図。A perspective view showing a state in which a new workpiece is positioned on the pair of support rails of the temporary placement mechanism by the grip portion of the unloading / loading mechanism and the cut workpiece is positioned on the pair of auxiliary support rails of the auxiliary temporary placement mechanism. . 図１９の状態から補助仮置き機構の一対の補助支持レール下部位置に位置付けた状態を示す斜視図。The perspective view which shows the state located in a pair of auxiliary | assistant support rail lower position of the auxiliary temporary placement mechanism from the state of FIG. 図２０の状態から仮置き機構の一対の支持レールと補助仮置き機構の一対の補助支持レール上部位置に位置付けた状態を示す斜視図および洗浄機構の噴射ノズルを移動する状態を示す斜視図。FIG. 21 is a perspective view illustrating a state in which the pair of support rails of the temporary placement mechanism and the pair of auxiliary support rails of the auxiliary temporary placement mechanism are positioned at the upper positions from the state illustrated in FIG. 図２１に示す状態から搬出・搬入機構７を待機位置に位置付けるとともに、補助仮置き機構を構成する一対の補助支持レールを下部位置に位置付けた状態を示す斜視図。FIG. 22 is a perspective view showing a state where the carry-out / carry-in mechanism 7 is positioned at the standby position from the state shown in FIG. 21 and the pair of auxiliary support rails constituting the auxiliary temporary placement mechanism are positioned at the lower position. 環状のフレームに支持された洗浄済みの被加工物を支持した補助仮置き機構の一対の補助支持レールを上部位置に位置付けた状態を示す斜視図。The perspective view which shows the state which positioned the pair of auxiliary | assistant support rail of the auxiliary | assistant temporary placement mechanism which supported the workpiece after washing | cleaning supported by the cyclic | annular flame | frame at the upper position. 図２３の状態から環状のフレームに支持された洗浄済みの被加工物を補助仮置き機構の一対の補助支持レールから仮置き機構の一対の支持レールに移動した状態を示す斜視図。The perspective view which shows the state which moved the workpiece after washing | cleaning supported by the cyclic | annular flame | frame from the state of FIG. 23 from a pair of auxiliary support rail of an auxiliary temporary placement mechanism to a pair of support rail of a temporary placement mechanism. 図２４の状態から仮置き機構の一対の支持レールを中間位置に位置付けるとともに、搬出・搬入機構の把持部材および一対の規制ピンを待機位置に位置付けた状態を示す斜視図。FIG. 25 is a perspective view showing a state in which the pair of support rails of the temporary placement mechanism are positioned at an intermediate position from the state of FIG. 24 and the gripping member and the pair of regulation pins of the unloading / loading mechanism are positioned at the standby position. 図２５の状態から搬出・搬入機構を作動して環状のフレームに支持された洗浄済みの被加工物をカセットに収容する状態を示す斜視図。The perspective view which shows the state which act | operates a carrying out and carrying-in mechanism from the state of FIG.

以下、本発明に従って構成された切削装置の好適な実施形態について、添付図面を参照して詳細に説明する。   Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in detail with reference to the accompanying drawings.

図１には、本発明に従って構成された切削装置の一実施形態の斜視図が示されている。
図示の実施形態における切削装置は、静止基台２と、該静止基台２上に配設され被加工物を保持する保持テーブル機構３と、該保持テーブル機構３に保持された被加工物を切削する切削機構４とを具備している。 FIG. 1 shows a perspective view of one embodiment of a cutting device constructed in accordance with the present invention.
The cutting apparatus in the illustrated embodiment includes a stationary base 2, a holding table mechanism 3 that is disposed on the stationary base 2 and holds a workpiece, and a workpiece held by the holding table mechanism 3. And a cutting mechanism 4 for cutting.

保持テーブル機構３は、図２に示すように静止基台２上に矢印Ｘで示す加工送り方向(X軸方向)に沿って配設された２本のX軸ガイドレール３１、３１と、該２本のX軸ガイドレール３１、３１上に摺動可能に配設された移動基台３２と、該移動基台３２上に配設された円筒状の支持部材３３に回転可能に支持された被加工物を保持する保持テーブル３４と、該保持テーブル３４が配設された移動基台３２を２本のX軸ガイドレール３１、３１に沿って加工送り方向(X軸方向)に移動させるための加工送り手段３５とを具備している。保持テーブル３４は、円筒状の支持部材３３に回転可能に支持されたテーブル本体３４１と、該テーブル本体３４１の上面に配設された吸着チャック３４２とを具備している。テーブル本体３４１は、外径が後述する被加工物としてのウエーハの外径より大きくウエーハをダイシングテープを介して支持する環状のフレームの内径より小さく形成されている。吸着チャック３４２は、ポーラスセラミックスによって形成され図示しない吸引手段に接続されており、適宜負圧が作用せしめられるようになっている。従って、吸着チャック３４２上に載置された被加工物は、図示しない吸引手段を作動することにより吸着チャック３４２上に吸引保持される。また、保持テーブル３４は、円筒状の支持部材３３内に配設された図示しないパルスモータによって回動せしめられるようになっている。   As shown in FIG. 2, the holding table mechanism 3 includes two X-axis guide rails 31, 31 disposed on the stationary base 2 along the processing feed direction (X-axis direction) indicated by an arrow X, A movable base 32 slidably disposed on the two X-axis guide rails 31, 31 and a cylindrical support member 33 disposed on the movable base 32 are rotatably supported. In order to move the holding table 34 that holds the workpiece and the moving base 32 on which the holding table 34 is disposed along the two X-axis guide rails 31 and 31 in the processing feed direction (X-axis direction). The processing feed means 35 is provided. The holding table 34 includes a table main body 341 that is rotatably supported by a cylindrical support member 33, and a suction chuck 342 disposed on the upper surface of the table main body 341. The table main body 341 is formed to have an outer diameter larger than an outer diameter of a wafer as a workpiece to be described later and smaller than an inner diameter of an annular frame that supports the wafer via a dicing tape. The suction chuck 342 is made of porous ceramics and is connected to suction means (not shown) so that a negative pressure is appropriately applied. Therefore, the workpiece placed on the suction chuck 342 is sucked and held on the suction chuck 342 by operating a suction means (not shown). The holding table 34 can be rotated by a pulse motor (not shown) disposed in a cylindrical support member 33.

上記加工送り手段３５は、２本のX軸ガイドレール３１と３１の間に配設されX軸方向に延在するX軸リニアレール３５１と、該X軸リニアレール３５１に移動可能に嵌挿され保持テーブル３４が配設された移動基台３２に装着されたX軸コイル可動子３５２とからなっている。X軸リニアレール３５１は、例えば複数の円柱状の永久磁石のN極とS極とを交互に接合して軸状に構成し、この軸状に構成された複数の円柱状の永久磁石をステンレス鋼等の非磁性材からなる円筒状のケースに配設して構成されている。このように構成されたX軸リニアレール３５１は、その両端部に図２に示すように支持部材３５３、３５３が装着されており、この支持部材３５３、３５３を介して上記支静止基台２に取付けられる。X軸リニアレール３５１とX軸コイル可動子３５２とからなる加工送り手段３５は、所謂リニアシャフトモータを構成しており、X軸コイル可動子３５２に電流が流れると磁力による吸引力、反発力を繰り返して推力が発生する。従って、X軸コイル可動子３５２に印加する電流の方向を変えることにより、X軸コイル可動子３５２がX軸リニアレール３５１に沿って移動する方向を変更することができる。このように構成された加工送り手段３５は、保持テーブル３４が配設された移動基台３２を図２に示す被加工物着脱領域と切削機構４が配設された加工領域との間を移動せしめる。なお、図示の実施形態における加工送り手段３５は所謂リニアシャフトモータによって構成した例を示したが、ボールねじ機構によって構成してもよい。   The machining feed means 35 is disposed between the two X-axis guide rails 31 and 31 and extends in the X-axis direction, and is inserted into the X-axis linear rail 351 so as to be movable. It consists of an X-axis coil mover 352 mounted on a moving base 32 on which a holding table 34 is disposed. For example, the X-axis linear rail 351 is formed into a shaft shape by alternately joining N poles and S poles of a plurality of columnar permanent magnets, and the plurality of columnar permanent magnets configured in this shaft shape are made of stainless steel. It is configured by being disposed in a cylindrical case made of a nonmagnetic material such as steel. As shown in FIG. 2, the X-axis linear rail 351 configured in this manner is provided with support members 353 and 353 at both ends, and the support base pedestal 2 is connected to the support bases 353 and 353 via the support members 353 and 353. Mounted. The machining feed means 35 comprising the X-axis linear rail 351 and the X-axis coil mover 352 constitutes a so-called linear shaft motor, and when an electric current flows through the X-axis coil mover 352, an attractive force and a repulsive force are generated. Thrust is generated repeatedly. Accordingly, the direction in which the X-axis coil mover 352 moves along the X-axis linear rail 351 can be changed by changing the direction of the current applied to the X-axis coil mover 352. The processing feeding means 35 configured as described above moves the moving base 32 provided with the holding table 34 between the workpiece attaching / detaching region shown in FIG. 2 and the processing region provided with the cutting mechanism 4. Let me. In addition, although the example which comprised the process feed means 35 in embodiment shown in figure by what was called a linear shaft motor was shown, you may comprise by a ball screw mechanism.

次に、上記切削機構４について説明する。
切削機構４は、上記静止基台２上に固定された門型の支持フレーム４１を具備している。この門型の支持フレーム４１は、間隔を置いて配設された第１の柱部４１１および第２の柱部４１２と、該第１の柱部４１１と第２の柱部４１２の上端を連結し矢印Xで示す加工送り方向と直交する矢印Yで示す割り出し送り方向（Y軸方向）に沿って配設された支持部４１３とからなり、上記２本のX軸ガイドレール３１を跨ぐように配設されている。 Next, the cutting mechanism 4 will be described.
The cutting mechanism 4 includes a gate-shaped support frame 41 fixed on the stationary base 2. The gate-shaped support frame 41 connects the first pillar part 411 and the second pillar part 412 that are arranged at intervals, and the upper ends of the first pillar part 411 and the second pillar part 412. And a support portion 413 disposed along an index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the machining feed direction indicated by an arrow X, and straddling the two X-axis guide rails 31 It is arranged.

上記門型の支持フレーム４１を構成する支持部４１３の図１および図２において背面側には、第１の切削手段５aと第２の切削手段５bが配設されている。第１の切削手段５aおよび第２の切削手段５bについて、図３および図４を参照して説明する。第１の切削手段５aおよび第２の切削手段５bは、それぞれ割り出し移動基台５１と切り込み移動基台５２およびスピンドルユニット５３を具備している。第１の切削手段５aの割り出し移動基台５１および第２の切削手段５bの割り出し移動基台５１は、それぞれ上記支持部４１３の図４において左方の側面に設けられた２本のY軸ガイドレール４１３a、４１３aと嵌合する被案内溝５１１、５１１が設けられており、この被案内溝５１１、５１１を２本のY軸ガイドレール４１３a、４１３aに嵌合することにより、割り出し移動基台５１は２本のY軸ガイドレール４１３a、４１３aに沿って移動可能に構成される。なお、第１の切削手段５aの割り出し移動基台５１および第２の切削手段５bの割り出し移動基台５１の一方の面には、それぞれ後述する割り出し送り手段が配設される凹部５１３が形成されている。また、第１の切削手段５aの割り出し移動基台５１および第２の切削手段５bの割り出し移動基台５１の他方の面には、それぞれ図４に示すように矢印Zで示す切り込み送り方向に沿って一対の案内レール５１２、５１２(図４には一方の案内レールのみが示されている)が設けられている。   A first cutting means 5a and a second cutting means 5b are disposed on the back side of the support portion 413 constituting the portal-type support frame 41 in FIGS. The 1st cutting means 5a and the 2nd cutting means 5b are demonstrated with reference to FIG. 3 and FIG. The first cutting means 5 a and the second cutting means 5 b include an indexing movement base 51, a cutting movement base 52 and a spindle unit 53, respectively. The index movement base 51 of the first cutting means 5a and the index movement base 51 of the second cutting means 5b are respectively two Y-axis guides provided on the left side surface of the support portion 413 in FIG. Guided grooves 511 and 511 that are fitted to the rails 413a and 413a are provided. By fitting the guided grooves 511 and 511 to the two Y-axis guide rails 413a and 413a, the index moving base 51 Is configured to be movable along two Y-axis guide rails 413a and 413a. A concave portion 513 in which an index feeding means to be described later is provided is formed on one surface of the index movement base 51 of the first cutting means 5a and the index movement base 51 of the second cutting means 5b. ing. Further, the other surfaces of the indexing movement base 51 of the first cutting means 5a and the indexing movement base 51 of the second cutting means 5b are respectively along the cutting feed direction indicated by the arrow Z as shown in FIG. A pair of guide rails 512 and 512 (only one guide rail is shown in FIG. 4) is provided.

上記第１の切削手段５aの切り込み移動基台５２および第２の切削手段５bの切り込み移動基台５２は、それぞれ上下方向に延びる被支持部５２１と、該被支持部５２１の下端から直角に水平に延びる装着部５２２とからなっている。図４に示すように被支持部５２１における装着部５２２側の面には上記割り出し移動基台５１の他方の面に設けられた一対のZ軸ガイドレール５１２、５１２と嵌合する被案内溝５２３、５２３(図４には一方の被案内溝のみが示されている)が設けられており、この被案内溝５２３、５２３を２本のZ軸ガイドレール５１２、５１２に嵌合することにより、切り込み移動基台５２は２本のZ軸ガイドレール５１２、５１２に沿って矢印Zで示す切り込み送り方向に移動可能に構成される。このようにして割り出し移動基台５１に装着された切り込み移動基台５２は、図１および図２に示すように装着部５２２が門型の支持フレーム４１を構成する支持部４１３の下側に突出して配置される。   The incision moving base 52 of the first cutting means 5a and the incision movement base 52 of the second cutting means 5b are horizontally supported at a right angle from the supported portion 521 extending in the vertical direction and the lower end of the supported portion 521, respectively. And a mounting portion 522 extending in the direction. As shown in FIG. 4, a guided groove 523 fitted to a pair of Z-axis guide rails 512 and 512 provided on the other surface of the indexing movement base 51 is provided on the surface of the supported portion 521 on the mounting portion 522 side. 523 (only one guided groove is shown in FIG. 4), and by fitting the guided grooves 523 and 523 to the two Z-axis guide rails 512 and 512, The cutting base 52 is configured to be movable in the cutting feed direction indicated by the arrow Z along the two Z-axis guide rails 512 and 512. In the cutting movement base 52 mounted on the indexing movement base 51 in this way, the mounting portion 522 protrudes below the support portion 413 constituting the portal-type support frame 41 as shown in FIGS. Arranged.

上記スピンドルユニット５３は、第１の切削手段５aと第２の切削手段５bの切り込み移動基台５２を形成する装着部５２２の下面にそれぞれ装着されている。この第１の切削手段５aのスピンドルユニット５３および第２の切削手段５bのスピンドルユニット５３は、それぞれ図３および図４に示すようにスピンドルハウジング５３１と、該スピンドルハウジング５３１に回転可能に支持された回転スピンドル５３２と、該回転スピンドル５３２の一端に装着された切削ブレード５３３と、切削水を供給する切削水供給管５３４および回転スピンドル５３２を回転駆動する図示しないサーボモータを具備しており、回転スピンドル５３２の軸線方向が矢印Yで示す割り出し送り方向に沿って配設されている。そして、第１の切削手段５aのスピンドルユニット５３を構成する切削ブレード５３３と第２の切削手段５bのスピンドルユニット５３を構成する切削ブレード５３３は、互いに対向して配設されている。   The spindle unit 53 is mounted on the lower surface of the mounting portion 522 that forms the cutting movement base 52 of the first cutting means 5a and the second cutting means 5b. The spindle unit 53 of the first cutting means 5a and the spindle unit 53 of the second cutting means 5b are rotatably supported by the spindle housing 531 and the spindle housing 531 as shown in FIGS. The rotary spindle 532, a cutting blade 533 attached to one end of the rotary spindle 532, a cutting water supply pipe 534 for supplying cutting water, and a servo motor (not shown) for rotationally driving the rotary spindle 532 are provided. The axial direction of 532 is arranged along the index feed direction indicated by the arrow Y. The cutting blade 533 constituting the spindle unit 53 of the first cutting means 5a and the cutting blade 533 constituting the spindle unit 53 of the second cutting means 5b are arranged to face each other.

図示の実施形態における第１の切削手段５aと第２の切削手段５bは、図３に示すように上記割り出し移動基台５１、５１を２本のY軸ガイドレール４１３a、４１３aに沿って矢印Yで示す割り出し送り方向（Y軸方向）に移動するための割り出し送り手段５４を具備している。割り出し送り手段５４は、上記２本のY軸ガイドレール４１３a、４１３aに沿って配設された共通のY軸リニアレール５４０と、該共通のY軸リニアレール５４０に移動可能に嵌挿され第１の切削手段５aの割り出し移動基台５１に装着された第１のY軸コイル可動子５４４aと、共通のY軸リニアレール５４０に移動可能に嵌挿され第２の切削手段５bの割り出し移動基台５１に装着された第２のY軸コイル可動子５４４bとからなっている。共通のY軸リニアレール５４０は、例えば複数の円柱状の永久磁石のN極とS極とを交互に接合して軸状に構成し、この軸状に構成された複数の円柱状の永久磁石をステンレス鋼等の非磁性材からなる円筒状のケースに配設して構成されている。このように構成された共通のY軸リニアレール５４０は、その両端部に図３に示すように支持部材５４３、５４３が装着されており、この支持部材５４３、５４３を介して上記支持フレーム４１の支持部４１３に取付けられる。この共通のY軸リニアレール５４０に移動可能に嵌挿された第１のコイル可動子５４４aおよび第２のコイル可動子５４４bは、それぞれ第１の切削手段５aの割り出し移動基台５１および第２の切削手段５bの割り出し移動基台５１に設けられた凹部５１３に配設され、それぞれ割り出し移動基台５１の一方の面に装着される。   As shown in FIG. 3, the first cutting means 5a and the second cutting means 5b in the illustrated embodiment are arranged such that the index moving bases 51 and 51 are moved along the two Y-axis guide rails 413a and 413a by the arrow Y. The index feeding means 54 for moving in the index feeding direction (Y-axis direction) shown in FIG. The index feeding means 54 is a common Y-axis linear rail 540 disposed along the two Y-axis guide rails 413a and 413a, and is movably fitted and inserted into the common Y-axis linear rail 540. The index movement base of the second cutting means 5b is movably fitted to the first Y-axis coil mover 544a mounted on the index movement base 51 of the cutting means 5a and the common Y-axis linear rail 540. 51 and a second Y-axis coil mover 544b attached to the main body 51. The common Y-axis linear rail 540 is formed into a shaft shape by alternately joining N poles and S poles of a plurality of columnar permanent magnets, for example, and a plurality of columnar permanent magnets configured in this shaft shape. Are arranged in a cylindrical case made of a nonmagnetic material such as stainless steel. As shown in FIG. 3, the common Y-axis linear rail 540 configured in this manner is mounted with support members 543 and 543 as shown in FIG. 3, and the support frame 41 of the support frame 41 is interposed via the support members 543 and 543. It is attached to the support portion 413. The first coil mover 544a and the second coil mover 544b that are movably fitted in the common Y-axis linear rail 540 are respectively the index moving base 51 and the second coil mover 51a of the first cutting means 5a. It is disposed in a recess 513 provided in the indexing movement base 51 of the cutting means 5b and is mounted on one surface of the indexing movement base 51, respectively.

上記のように共通のY軸リニアレール５４０と第１のコイル可動子５４４aおよび第２のコイル可動子５４４bとからなる割り出し送り手段５４は、上記X軸リニアレール３６１とX軸コイル可動子３６２とからなる加工送り手段３５と同様に所謂シャフトモータを構成しており、第１のコイル可動子５４４aおよび第２のコイル可動子５４４bに電流が流れると磁力による吸引力、反発力を繰り返して推力が発生する。従って、第１のコイル可動子５４４aおよび第２のコイル可動子５４４bに印加する電流の方向を変えることにより、第１のコイル可動子５４４aおよび第２のコイル可動子５４４bが共通のY軸リニアレール５４０に沿って移動する方向を変更することができる。なお、図示の実施形態における割り出し送り手段５４は所謂リニアシャフトモータによって構成した例を示したが、ボールねじ機構によって構成してもよい。   As described above, the index feeding means 54 including the common Y-axis linear rail 540, the first coil mover 544a, and the second coil mover 544b includes the X-axis linear rail 361, the X-axis coil mover 362, and the like. A so-called shaft motor is formed in the same manner as the machining feed means 35, and when an electric current flows through the first coil movable element 544a and the second coil movable element 544b, a thrust is generated by repeating an attractive force and a repulsive force. Occur. Therefore, by changing the direction of the current applied to the first coil mover 544a and the second coil mover 544b, the first coil mover 544a and the second coil mover 544b can be shared by the Y-axis linear rail. The direction of movement along 540 can be changed. In the illustrated embodiment, the index feeding means 54 is configured by a so-called linear shaft motor, but may be configured by a ball screw mechanism.

また、図示の実施形態における第１の切削手段５aと第２の切削手段５bは、図３および図４に示すように上記切り込み移動基台５２、５２を２本のZ軸ガイドレール５１２、５１２に沿って矢印Zで示す切り込み送り方向（Z軸方向）に移動するための切り込み送り手段５５、５５を具備している。切り込み送り手段５５、５５は、それぞれ２本のZ軸ガイドレール５１２、５１２と平行に配設された雄ネジロッド５５１と、雄ネジロッド５５１の一端部を回転可能に支持する軸受５５２と、雄ネジロッド５５１の他端に連結され該雄ネジロッド５５１を正転または逆転駆動するパルスモータ５５３とからなっている。このように構成された切り込み送り手段５５、５５は、それぞれ雄ネジロッド５５１が上記切り込み移動基台５２の被支持部５２１に形成された雌ネジ５２１aに螺合される。従って、切り込み送り手段５５、５５は、それぞれパルスモータ５５３を駆動して雄ネジロッド５５１を正転または逆転駆動することにより、切り込み移動基台５２を２本のZ軸ガイドレール５１２、５１２に沿って図３において矢印Zで示す切り込み送り方向（Z軸方向）に移動することができる。   Further, the first cutting means 5a and the second cutting means 5b in the illustrated embodiment have the above-mentioned cutting movement bases 52, 52 as two Z-axis guide rails 512, 512, as shown in FIGS. Are provided with cutting feed means 55, 55 for moving in the cutting feed direction (Z-axis direction) indicated by the arrow Z. The cut-in feeding means 55 and 55 include a male screw rod 551 disposed in parallel with the two Z-axis guide rails 512 and 512, a bearing 552 that rotatably supports one end of the male screw rod 551, and a male screw rod 551. And a pulse motor 553 that is connected to the other end of the motor and drives the male screw rod 551 to rotate forward or backward. In the cutting feed means 55 and 55 configured as described above, the male screw rod 551 is screwed into a female screw 521 a formed on the supported portion 521 of the cutting moving base 52. Accordingly, the cutting feed means 55 and 55 drive the pulse motor 553 to drive the male screw rod 551 in the normal direction or the reverse direction, thereby moving the cutting base 52 along the two Z-axis guide rails 512 and 512. In FIG. 3, it can move in the cutting feed direction (Z-axis direction) indicated by an arrow Z.

図１を参照して説明を続けると、上記静止基台２には、半導体ウエーハ等の複数の被加工物を収容するカセット６０が載置されるカセット載置機構６と、該カセット載置機構６に載置されたカセット６０から被加工物を搬出するとともに切削済の被加工物をカセット６０に搬入する搬出・搬入機構７と、該搬出・搬入機構７によって搬出された被加工物を仮置きする仮置き機構８と、該仮置き機構８と隣接して配設された補助仮置き機構９と、切削後の被加工物を洗浄する洗浄機構１０とを具備している。カセット載置機構６は、図示しない昇降手段によって昇降せしめられるカセットテーブル６１上にカセット６０が載置されるようになっている。カセット６０には環状のフレームFに装着されたダイシングテープTの表面に貼着された半導体ウエーハWが収容されている。なお、環状のフレームFの外周には、後述する規制ピンが係合するノッチF-1およびフラット面Ｆ-2が設けられている。   The description will be continued with reference to FIG. 1. On the stationary base 2, a cassette mounting mechanism 6 on which a cassette 60 for storing a plurality of workpieces such as semiconductor wafers is mounted, and the cassette mounting mechanism. The work piece is carried out from the cassette 60 placed on the work piece 6 and the cut work piece is carried into the cassette 60, and the work piece carried out by the carry-out / carry-in mechanism 7 is temporarily A temporary placement mechanism 8 to be placed, an auxiliary temporary placement mechanism 9 disposed adjacent to the temporary placement mechanism 8, and a cleaning mechanism 10 for cleaning a workpiece after cutting are provided. The cassette mounting mechanism 6 is configured such that a cassette 60 is mounted on a cassette table 61 that is lifted and lowered by a lifting means (not shown). The cassette 60 accommodates a semiconductor wafer W attached to the surface of a dicing tape T attached to an annular frame F. In addition, on the outer periphery of the annular frame F, a notch F-1 and a flat surface F-2 that engage with a regulation pin described later are provided.

搬出・搬入機構７は、図１に示すように上記門型の支持フレーム４１を構成する支持部４１３の表面側に配設された搬送移動手段７１と、該搬送移動手段７１によってY軸方向移動せしめられる支持基台７２と、該支持基台７２と搬送移動手段７１とを連結する連結部材７３とからなっている。搬送移動手段７１は支持基台７２が連結された連結部材７３をY軸方向に移動せしめるベルト機構からなっている。図５および図６を参照して説明を続けると、搬出・搬入機構７を構成する支持基台７２には、下側に配設されカセット載置機構６に載置されたカセット６０に収容された半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFを把持するための把持部材７４（図６参照）と、該把持部材７４を上下方向に移動するエアーシリンダー７４０と、把持部材７４の両側に配設され上記環状のフレームFに設けられたノッチF-1およびフラット面Ｆ-2と係合して環状のフレームFを所定の位置に規制する一対の規制ピン７５が取り付けられている。このように構成された搬出・搬入機構７は、支持基台７２をカセット載置機構６に載置されたカセット６０に向けて移動し、一対の規制ピン７５をカセット６０に収容された半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFに設けられたノッチF-1およびフラット面Ｆ-2と係合することにより、半導体ウエーハWを所定の位置に位置規制する。そして、エアーシリンダー７４０によって把持部材７４を上方に移動することにより、環状のフレームFを支持基台７２と把持部材７４との間に把持する。   As shown in FIG. 1, the carry-out / carry-in mechanism 7 includes a transfer movement means 71 disposed on the surface side of the support portion 413 constituting the portal-type support frame 41, and the transfer movement means 71 moves in the Y-axis direction. It comprises a support base 72 to be fastened, and a connecting member 73 that connects the support base 72 and the transport movement means 71. The transport moving means 71 is composed of a belt mechanism that moves the connecting member 73 connected to the support base 72 in the Y-axis direction. The description will be continued with reference to FIGS. 5 and 6. The support base 72 constituting the carry-out / carry-in mechanism 7 is accommodated in a cassette 60 disposed on the lower side and placed on the cassette placement mechanism 6. A gripping member 74 (see FIG. 6) for gripping the annular frame F that supports the semiconductor wafer W via the dicing tape T, an air cylinder 740 that moves the gripping member 74 in the vertical direction, and a gripping member 74 A pair of restricting pins 75 are attached to restrict the annular frame F to a predetermined position by engaging with the notches F-1 and the flat surface F-2 provided on the annular frame F. Yes. The carry-out / carry-in mechanism 7 configured as described above moves the support base 72 toward the cassette 60 placed on the cassette placement mechanism 6, and the semiconductor wafer in which the pair of regulation pins 75 are accommodated in the cassette 60. By engaging W with a notch F-1 and a flat surface F-2 provided on an annular frame F that supports a dicing tape T, the position of the semiconductor wafer W is regulated at a predetermined position. Then, the annular frame F is gripped between the support base 72 and the gripping member 74 by moving the gripping member 74 upward by the air cylinder 740.

また、搬出・搬入機構７を構成する支持基台７２には、下側に配設され後述する切削済の半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFを把持するための補助把持部材７６（図６参照）と、該補助把持部材７６を上下方向に移動するエアーシリンダー７６０と、補助把持部材７６の両側に配設され上記環状のフレームFと係合して環状のフレームFを所定の位置に規制する一対の補助規制ピン７７が取り付けられている。更に、搬出・搬入機構７を構成する支持基台７２には、後述する洗浄機構の噴射ノズルと選択的に係合する係合手段７８が配設されている。この係合手段７８は、支持基台７２の下面より下方に進退可能に配設された係合ロッド７８１と、該係合ロッド７８１を進退せしめるエアーシリンダー７８２とからなっている。   Further, the support base 72 constituting the carry-out / carry-in mechanism 7 has an auxiliary for gripping an annular frame F that is disposed on the lower side and supports a cut semiconductor wafer W, which will be described later, via a dicing tape T. A gripping member 76 (see FIG. 6), an air cylinder 760 that moves the auxiliary gripping member 76 in the vertical direction, and an annular frame F that is disposed on both sides of the auxiliary gripping member 76 and engages with the annular frame F. A pair of auxiliary restricting pins 77 are attached to restrict the position to a predetermined position. Further, the support base 72 constituting the carry-out / carry-in mechanism 7 is provided with an engaging means 78 that selectively engages with an ejection nozzle of a cleaning mechanism described later. The engaging means 78 includes an engaging rod 781 disposed so as to be able to advance and retract downward from the lower surface of the support base 72, and an air cylinder 782 for moving the engaging rod 781 forward and backward.

上記仮置き機構８について、図１、図７および図８を参照して説明する。仮置き機構８は、上記カセット載置機構６とY軸方向に隣接して上記保持テーブル３４の被加工物着脱領域の直上に配設されている。この仮置き機構８は、Y軸方向に延在し環状のフレームFの両側部を支持する底部８１a、８１ｂと側部８２a、８２bとを有し底部８１a、８１bが開閉可能に構成された一対の支持レール８０と、該一対の支持レール８０の底部８１a、８１bを開閉する開閉手段８５a、８５bと、該一対の支持レール８０を上下方向に移動せしめる昇降手段８６とを備えている。なお、一対の支持レール８０を構成する側部８２a、８２bの上端には互いに内側に突出するフランジ部８３a、８３bが設けられており、該フランジ部８３aと８３bの互いに一端部が連結部８４によって連結されている。上記開閉手段８５a、８５ｂは、図示の実施形態においてはエアーモーターからなっており、一対の支持レール８０の底部８１a、８１bを図８において実線で示す水平位置である閉位置と２点鎖線で示す垂直位置である開位置にそれぞれ作動せしめる。上記昇降手段８６は、図示しない固定部材に取り付けられたエアーシリンダー８６１からなっており、該エアーシリンダー８６１のピストンロッド８６２が上記一対の支持レール８０の連結部８４に連結されている。   The temporary placement mechanism 8 will be described with reference to FIGS. 1, 7 and 8. The temporary placement mechanism 8 is disposed immediately above the workpiece attachment / detachment area of the holding table 34 adjacent to the cassette placement mechanism 6 in the Y-axis direction. The temporary placement mechanism 8 includes a pair of bottom portions 81a and 81b and side portions 82a and 82b that extend in the Y-axis direction and support both side portions of the annular frame F, and the bottom portions 81a and 81b are configured to be openable and closable. Support rails 80, opening / closing means 85 a and 85 b for opening and closing the bottom portions 81 a and 81 b of the pair of support rails 80, and elevating means 86 for moving the pair of support rails 80 in the vertical direction. In addition, flange portions 83a and 83b projecting inward from each other are provided at the upper ends of the side portions 82a and 82b constituting the pair of support rails 80, and one end portions of the flange portions 83a and 83b are connected to each other by the connecting portion 84. It is connected. The opening / closing means 85a and 85b are air motors in the illustrated embodiment, and the bottom portions 81a and 81b of the pair of support rails 80 are indicated by a closed position and a two-dot chain line which are horizontal positions indicated by solid lines in FIG. Operate each to the open position, which is the vertical position. The elevating means 86 includes an air cylinder 861 attached to a fixing member (not shown), and a piston rod 862 of the air cylinder 861 is connected to the connecting portion 84 of the pair of support rails 80.

上記補助仮置き機構９は、上記仮置き機構８とY軸方向に隣接し上記カセット載置機構６に対してY軸方向反対側において後述する洗浄機構１０の直上に配設されている。この補助仮置き機構９は、上記仮置き機構８と同様の構成であり、図７に示すようにY軸方向に延在し環状のフレームFの両側部を支持する底部９１a、９１bと側部９２a、９２bとを有し底部９１a、９１ｂが開閉可能に構成された一対の補助支持レール９０と、該一対の補助支持レール９０の底部９１a、９１bを開閉する開閉手段９５a、９５bと、該一対の補助支持レール９０を上下方向に移動せしめる昇降手段９６とを備えている。なお、一対の補助支持レール９０を構成する側部９２a、９２bの上端には互いに内側に突出するフランジ部９３a、９３ｂが設けられており、該フランジ部９３aと９３ｂの互いに一端部が連結部９４によって連結されている。上記開閉手段９５a、９５bは、図示の実施形態においてはエアーモーターからなっており、一対の補助支持レール９０の底部９１a、９１ｂを水平位置である閉位置と垂直位置である開位置にそれぞれ作動せしめる。上記昇降手段９６は、図示しない固定部材に取り付けられたエアーシリンダー９６１からなっており、該エアーシリンダー９６１のピストンロッド９６２が上記一対の補助支持レール９０の連結部９４に連結されている。   The auxiliary temporary placement mechanism 9 is adjacent to the temporary placement mechanism 8 in the Y-axis direction and is disposed immediately above a cleaning mechanism 10 described later on the opposite side of the cassette placement mechanism 6 in the Y-axis direction. The auxiliary temporary placement mechanism 9 has the same configuration as the temporary placement mechanism 8, and includes bottom portions 91a, 91b and side portions that extend in the Y-axis direction and support both side portions of the annular frame F as shown in FIG. A pair of auxiliary support rails 90 having bottom portions 91a and 91b that can be opened and closed, opening and closing means 95a and 95b for opening and closing the bottom portions 91a and 91b of the pair of auxiliary support rails 90, and the pair Lifting / lowering means 96 for moving the auxiliary support rail 90 in the vertical direction. In addition, flange portions 93a and 93b projecting inward from each other are provided at the upper ends of the side portions 92a and 92b constituting the pair of auxiliary support rails 90, and one end portions of the flange portions 93a and 93b are connected to the connecting portion 94. Are connected by The opening / closing means 95a and 95b are air motors in the illustrated embodiment, and operate the bottom portions 91a and 91b of the pair of auxiliary support rails 90 to a closed position that is a horizontal position and an open position that is a vertical position, respectively. . The elevating means 96 includes an air cylinder 961 attached to a fixing member (not shown), and a piston rod 962 of the air cylinder 961 is connected to the connecting portion 94 of the pair of auxiliary support rails 90.

次に、上記洗浄機構１０について、図１および図９を参照して説明する。
図示の実施形態における洗浄機構１０は、上記仮置き機構８に隣接しカセット載置機構６に対してY軸方向反対側に配設される。この洗浄機構１０は、洗浄ハウジング１１を具備している。この洗浄ハウジング１１は、前壁１１１と後壁１１２と側壁１１３および１１４と底壁（図示せず）とからなっており、上方が解放されている。このように構成された洗浄ハウジング１１内には、スピンナーテーブル１２が配設されている。スピンナーテーブル１２は、テーブル本体１２１と、該テーブル本体１２１の上面に配設された吸着チャック１２２と、テーブル本体１２１を回転駆動するサーボモータ１２３とからなっている。テーブル本体１２１は、外径が上記ウエーハWの外径より大きくウエーハWをダイシングテープTを介して支持する環状のフレームFの内径より小さく形成されている。吸着チャック１２２は、ポーラスセラミックスによって形成され図示しない吸引手段に接続されており、適宜負圧が作用せしめられるようになっている。従って、吸着チャック１２２上に載置された被加工物は、図示しない吸引手段を作動することにより吸着チャック１２２上に吸引保持される。 Next, the cleaning mechanism 10 will be described with reference to FIGS. 1 and 9.
The cleaning mechanism 10 in the illustrated embodiment is disposed adjacent to the temporary placement mechanism 8 and on the opposite side to the cassette mounting mechanism 6 in the Y-axis direction. The cleaning mechanism 10 includes a cleaning housing 11. The cleaning housing 11 includes a front wall 111, a rear wall 112, side walls 113 and 114, and a bottom wall (not shown), and an upper portion is released. A spinner table 12 is disposed in the cleaning housing 11 thus configured. The spinner table 12 includes a table main body 121, a suction chuck 122 disposed on the upper surface of the table main body 121, and a servo motor 123 that rotationally drives the table main body 121. The table body 121 is formed so that the outer diameter is larger than the outer diameter of the wafer W and smaller than the inner diameter of the annular frame F that supports the wafer W via the dicing tape T. The suction chuck 122 is made of porous ceramics and is connected to a suction means (not shown) so that a negative pressure is appropriately applied. Therefore, the workpiece placed on the suction chuck 122 is sucked and held on the suction chuck 122 by operating a suction means (not shown).

図１および図９を参照して説明を続けると、洗浄ハウジング１１の前壁１１１にはY軸方向に沿って形成された案内穴１１１aが設けられているおり、この案内穴１１１aに上記スピンナーテーブル１２に保持された被加工物に洗浄水を噴射する噴射ノズル１３がY軸方向に移動可能に配設されている。この噴射ノズル１３には一端に錘１４が連結されたワイヤー１５の他端がプーリー１６を介して連結され、錘１４の重力によって矢印Y1で示す方向に移動するように構成されている。そして、噴射ノズル１３には、上記搬出・搬入機構７を構成する支持基台７２に配設された係合手段７８は、支持基台７２の下面より下方に進退可能に配設された係合ロッド７８１が進出した状態で噴射ノズル１３における錘１４の重力によって移動する矢印Y1で示す方向から接触せしめられる。なお、噴射ノズル１３は、図示しない洗浄水供給手段に接続されている。   1 and 9, the front wall 111 of the cleaning housing 11 is provided with a guide hole 111a formed along the Y-axis direction, and the spinner table is formed in the guide hole 111a. An injection nozzle 13 for injecting cleaning water onto the workpiece held by 12 is arranged to be movable in the Y-axis direction. The jet nozzle 13 is connected to the other end of a wire 15 having a weight 14 connected to one end via a pulley 16 and is moved in the direction indicated by the arrow Y1 by the gravity of the weight 14. The engaging means 78 disposed on the support base 72 constituting the carry-out / carry-in mechanism 7 is engaged with the injection nozzle 13 so as to be able to advance and retract downward from the lower surface of the support base 72. The rod 781 is brought into contact from the direction indicated by the arrow Y <b> 1 that moves due to the gravity of the weight 14 in the injection nozzle 13 in the advanced state. The injection nozzle 13 is connected to a cleaning water supply means (not shown).

図示の実施形態における切削装置は以上のように構成されており、以下その作用について説明する。
先ず、図１０に示すように仮置き機構８のエアーシリンダー８６１を作動して一対の支持レール８０を上部位置に位置付けるとともに、搬出・搬入機構７の把持部材７４（図６参照）および一対の規制ピン７５（図５および図６参照）が配設された支持基台７２を図示の待機位置に位置付ける。 The cutting apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
First, as shown in FIG. 10, the air cylinder 861 of the temporary placement mechanism 8 is operated to position the pair of support rails 80 at the upper position, and the gripping member 74 (see FIG. 6) of the unloading / loading mechanism 7 and the pair of restrictions. The support base 72 on which the pin 75 (see FIGS. 5 and 6) is disposed is positioned at the standby position shown.

次に、搬出・搬入機構７の搬送移動手段７１（図１および図５参照）を作動して、図１１に示すように把持部材７４および一対の規制ピン７５が配設された支持基台７２をカセット載置機構６側に移動し、一対の規制ピン７５（図５および図６参照）をカセット６０に収容された半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFに設けられたノッチF-1およびフラット面Ｆ-2（図１参照）と係合することにより、半導体ウエーハWを所定の位置に位置規制する。そして、エアーシリンダー７４０を作動することにより、環状のフレームFを支持基台７２と把持部材７４（図６参照）との間に把持する。   Next, the transport moving means 71 (see FIGS. 1 and 5) of the carry-out / carry-in mechanism 7 is operated, and the support base 72 in which the gripping member 74 and the pair of regulation pins 75 are disposed as shown in FIG. Is moved to the cassette mounting mechanism 6 side, and a pair of regulating pins 75 (see FIGS. 5 and 6) are provided on the annular frame F that supports the semiconductor wafer W accommodated in the cassette 60 via the dicing tape T. By engaging with the notch F-1 and the flat surface F-2 (see FIG. 1), the position of the semiconductor wafer W is regulated at a predetermined position. Then, by operating the air cylinder 740, the annular frame F is gripped between the support base 72 and the gripping member 74 (see FIG. 6).

環状のフレームFを支持基台７２と把持部材７４によって把持したならば、搬出・搬入機構７の搬送移動手段７１を作動して支持基台７２をカセット載置機構６と反対側に移動し、図１２に示すように環状のフレームFを仮置き機構８の一対の支持レール８０に搬送し、仮置きする。   If the annular frame F is gripped by the support base 72 and the gripping member 74, the transport movement means 71 of the unloading / loading mechanism 7 is operated to move the support base 72 to the opposite side of the cassette mounting mechanism 6. As shown in FIG. 12, the annular frame F is transported to a pair of support rails 80 of the temporary placement mechanism 8 and temporarily placed.

環状のフレームFを仮置き機構８の一対の支持レール８０に搬送したならば、図１３に示すようにエアーシリンダー８６１を作動して一対の支持レール８０を下降して下部位置に位置付ける。この結果、環状のフレームFに装着され半導体ウエーハWが貼着されているダイシングテープTが、保持テーブル機構３における被加工物着脱位置に位置付けられている保持テーブル３４の上面に載置される。そして、上記開閉手段８５a、８５b（図６および図８参照）を作動して一対の支持レール８０の底部８１a、８１bを図８において実線で示す閉位置から２点鎖線で示す開位置に位置付ける。   When the annular frame F is conveyed to the pair of support rails 80 of the temporary placement mechanism 8, as shown in FIG. 13, the air cylinder 861 is operated to lower the pair of support rails 80 and position them at the lower position. As a result, the dicing tape T attached to the annular frame F and having the semiconductor wafer W attached thereto is placed on the upper surface of the holding table 34 positioned at the workpiece attaching / detaching position in the holding table mechanism 3. Then, the opening / closing means 85a and 85b (see FIGS. 6 and 8) are operated to position the bottom portions 81a and 81b of the pair of support rails 80 from the closed position indicated by the solid line to the open position indicated by the two-dot chain line in FIG.

次に、図示しない吸引手段を作動することにより、図１４に示すように保持テーブル３４の上面にダイシングテープTを介して半導体ウエーハWを吸引保持する。そして、仮置き機構８のエアーシリンダー８５１を作動して一対の支持レール８０を上昇して上部位置に位置付ける。   Next, by operating a suction means (not shown), the semiconductor wafer W is sucked and held on the upper surface of the holding table 34 via the dicing tape T as shown in FIG. Then, the air cylinder 851 of the temporary placement mechanism 8 is operated to raise the pair of support rails 80 and position them at the upper position.

図１４に示すように保持テーブル３４の上面にダイシングテープTを介して半導体ウエーハWを吸引保持したならば、保持テーブル機構３を構成する加工送り手段３５を作動して半導体ウエーハWを吸引保持した保持テーブル３４を図１５に示すように切削機構４が配設された加工領域に移動する。そして、第１の切削手段５aと第２の切削手段５bとによって保持テーブル３４に保持された半導体ウエーハWに所定の切削加工が施される。なお、保持テーブル３４は上述したように外径が半導体ウエーハWの外径より大きく環状のフレームFの内径より小さく形成されているので、環状のフレームFが自重によって僅かに垂れ下がり、切削加工において第１の切削手段５aと第２の切削手段５bの切削ブレード５３３と干渉することがないとともに、フレーム押え機構が不要となりコスト低減になる。   As shown in FIG. 14, when the semiconductor wafer W is sucked and held on the upper surface of the holding table 34 via the dicing tape T, the processing feed means 35 constituting the holding table mechanism 3 is operated to suck and hold the semiconductor wafer W. As shown in FIG. 15, the holding table 34 is moved to the machining area where the cutting mechanism 4 is disposed. A predetermined cutting process is performed on the semiconductor wafer W held on the holding table 34 by the first cutting means 5a and the second cutting means 5b. As described above, the holding table 34 is formed so that the outer diameter is larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the annular frame F. There is no interference with the cutting blade 533 of the first cutting means 5a and the second cutting means 5b, and the frame pressing mechanism is not required, thereby reducing the cost.

上述したように保持テーブル３４に保持された半導体ウエーハWに所定の切削加工を施したならば、加工送り手段３５を作動して切削済みの半導体ウエーハWを吸引保持した保持テーブル３４を図１６に示す被加工物着脱位置に位置付ける。この状態で、保持テーブル３４に保持された切削済みの半導体ウエーハWは、仮置き機構８の直下に位置付けられる。   When the semiconductor wafer W held on the holding table 34 is subjected to predetermined cutting as described above, the holding table 34 that sucks and holds the cut semiconductor wafer W by operating the processing feeding means 35 is shown in FIG. Position it at the workpiece attachment / detachment position shown. In this state, the cut semiconductor wafer W held on the holding table 34 is positioned directly below the temporary placement mechanism 8.

保持テーブル３４に保持された切削済みの半導体ウエーハWを仮置き機構８の直下に位置付けたならば、仮置き機構８の一対の支持レール８０の底部８１a、８１bを開位置に位置付けた状態でエアーシリンダー８６１を作動して、図１７に示すように一対の支持レール８０を下降して下部位置に位置付ける。そして、一対の支持レール８０の底部８１a、８１bを閉位置に位置付けて環状のフレームFを支持するとともに、保持テーブル３４による半導体ウエーハWの吸引保持を解除する。   If the cut semiconductor wafer W held on the holding table 34 is positioned immediately below the temporary placement mechanism 8, the air is applied with the bottom portions 81a and 81b of the pair of support rails 80 of the temporary placement mechanism 8 positioned at the open position. The cylinder 861 is operated, and the pair of support rails 80 are lowered and positioned at the lower position as shown in FIG. Then, the bottom portions 81a and 81b of the pair of support rails 80 are positioned at the closed position to support the annular frame F, and the suction holding of the semiconductor wafer W by the holding table 34 is released.

次に、仮置き機構８のエアーシリンダー８６１を作動して環状のフレームFを支持した一対の支持レール８０を上昇させ、図１８に示すように上部位置より僅かに下方で搬出・搬入機構７の把持部材７４および一対の規制ピン７５が一対の支持レール８０に支持された切削済み半導体ウエーハWの上方を移動できる中間位置に一対の支持レール８０を位置付ける。   Next, the air cylinder 861 of the temporary placement mechanism 8 is actuated to raise the pair of support rails 80 that support the annular frame F, and the carry-out / load-in mechanism 7 is slightly below the upper position as shown in FIG. The pair of support rails 80 are positioned at an intermediate position where the gripping member 74 and the pair of regulation pins 75 can move above the cut semiconductor wafer W supported by the pair of support rails 80.

そして、搬出・搬入機構７の搬送移動手段７１を作動して、図１９に示すように支持基台７２をカセット載置機構６側に移動し、一対の規制ピン７５（図５および図６参照）をカセット６０に収容された半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFに設けられたノッチF-1およびフラット面Ｆ-2（図１参照）と係合することにより、半導体ウエーハWを所定の位置に位置規制する。そして、エアーシリンダー７４０を作動することにより、新たな半導体ウエーハWを支持した環状のフレームFを支持基台７２と把持部材７４（図６参照）との間に把持する。このとき、把持部材７４と一対の規制ピン７５は、切削済み半導体ウエーハWの上方を移動する。   Then, the transport moving means 71 of the unloading / loading mechanism 7 is operated to move the support base 72 to the cassette mounting mechanism 6 side as shown in FIG. 19, and a pair of regulating pins 75 (see FIGS. 5 and 6). ) Is engaged with a notch F-1 and a flat surface F-2 (see FIG. 1) provided on an annular frame F that supports the semiconductor wafer W accommodated in the cassette 60 via the dicing tape T. The position of the semiconductor wafer W is regulated to a predetermined position. Then, by operating the air cylinder 740, the annular frame F supporting the new semiconductor wafer W is gripped between the support base 72 and the gripping member 74 (see FIG. 6). At this time, the gripping member 74 and the pair of regulating pins 75 move above the cut semiconductor wafer W.

次に、仮置き機構８のエアーシリンダー８５１を作動して切削済み半導体ウエーハWを支持した一対の支持レール８０を上部位置に位置付けるとともに、切削済み半導体ウエーハWを支持する環状のフレームFにおけるカセット載置機構６側の端面を一対の補助規制ピン７７と対向する位置に位置付ける。その後、搬出・搬入機構７の搬送移動手段７１を作動して、図２０に示すように支持基台７２をカセット載置機構６と反対側に移動することにより、支持基台７２と把持部材７４によって把持された新たな半導体ウエーハWを支持した環状のフレームFを仮置き機構８の一対の支持レール８０に搬送するとともに、一対の補助規制ピン７７が当接される切削済み半導体ウエーハWを支持した環状のフレームFを補助仮置き機構９の一対の補助支持レール９０に搬送する。   Next, the air cylinder 851 of the temporary placement mechanism 8 is operated to position the pair of support rails 80 that support the cut semiconductor wafer W at the upper position, and the cassette is mounted on the annular frame F that supports the cut semiconductor wafer W. The end surface on the placement mechanism 6 side is positioned at a position facing the pair of auxiliary regulating pins 77. Thereafter, the transport moving means 71 of the unloading / loading mechanism 7 is operated to move the support base 72 to the opposite side of the cassette mounting mechanism 6 as shown in FIG. The annular frame F supporting the new semiconductor wafer W held by the carrier is transported to the pair of support rails 80 of the temporary placement mechanism 8 and supports the semiconductor wafer W after being cut against which the pair of auxiliary regulating pins 77 abut. The annular frame F is conveyed to a pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9.

切削済み半導体ウエーハWを支持した環状のフレームFを補助仮置き機構９の一対の補助支持レール９０に搬送したならば、図２１に示すようにエアーシリンダー９６１を作動して一対の補助支持レール９０を下降して下部位置に位置付ける。この状態で、環状のフレームFに装着され半導体ウエーハWが貼着されているダイシングテープTが、洗浄-機構１０のスピンナーテーブル１２の上面に接触する。そして、一対の補助支持レール９０の底部９１a、９１bを閉位置から開位置に位置付けることにより、切削済みの半導体ウエーハWをダイシングテープTを介してスピンナーテーブル１２の上面に載置する。そして、図示しない吸引手段を作動することにより、スピンナーテーブル１２の上面にダイシングテープTを介して切削済みの半導体ウエーハWを吸引保持する。   When the annular frame F supporting the cut semiconductor wafer W is transferred to the pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9, the air cylinder 961 is operated as shown in FIG. Move down to the lower position. In this state, the dicing tape T attached to the annular frame F and attached with the semiconductor wafer W contacts the upper surface of the spinner table 12 of the cleaning mechanism 10. Then, by positioning the bottom portions 91a and 91b of the pair of auxiliary support rails 90 from the closed position to the open position, the cut semiconductor wafer W is placed on the upper surface of the spinner table 12 via the dicing tape T. Then, by operating a suction means (not shown), the semiconductor wafer W that has been cut is sucked and held on the upper surface of the spinner table 12 via the dicing tape T.

次に、仮置き機構８の一対の支持レール８０と補助仮置き機構９の一対の補助支持レール９０を図２２の(a)に示すように上部位置に位置付け、スピンナーテーブル１２を回転するとともに、図２２の(b)に示すように図示しない洗浄水供給手段を作動することにより噴射ノズル１３から洗浄水１３０を噴射する。このとき、搬出・搬入機構７の支持基台７２に配設された係合手段７８の係合ロッド７８１を進出して噴射ノズル１３と係合する位置に位置付け、搬送移動手段７１を作動して係合ロッド７８１をY軸方向に往復動させる。従って、噴射ノズル１３に連結されたワイヤー１５の一端に連結された錘１４の重力と協働して噴射ノズル１３はY軸方向に往復動せしめられる。なお、噴射ノズル１３の往復動範囲は、少なくとも切削済みの半導体ウエーハWの外周から中心までの範囲でよい。この結果、スピンナーテーブル１２にダイシングテープTを介して吸引保持された切削済みの半導体ウエーハWはスピンナー洗浄される。なお、上記噴射ノズル１３のY軸方向への往復動においては、搬出・搬入機構７が駆動源となっているので、小型化が可能となるとともに、コストの低減を図ることができる。また、スピンナーテーブル１２は上述したように外径が半導体ウエーハWの外径より大きく環状のフレームFの内径より小さく形成されているので、環状のフレームFが自重によって僅かに垂れ下がり、半導体ウエーハWに供給された洗浄水が円滑に外周に排出されるとともに、フレーム押え機構が不要となりコスト低減になる。   Next, as shown in FIG. 22A, the pair of support rails 80 of the temporary placement mechanism 8 and the pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9 are positioned at the upper position, and the spinner table 12 is rotated. As shown in FIG. 22B, the cleaning water 130 is sprayed from the spray nozzle 13 by operating the cleaning water supply means (not shown). At this time, the engaging rod 781 of the engaging means 78 disposed on the support base 72 of the carry-out / carry-in mechanism 7 is advanced to the position where it engages with the injection nozzle 13, and the transport moving means 71 is operated. The engagement rod 781 is reciprocated in the Y-axis direction. Therefore, the injection nozzle 13 is reciprocated in the Y-axis direction in cooperation with the gravity of the weight 14 connected to one end of the wire 15 connected to the injection nozzle 13. The reciprocating range of the injection nozzle 13 may be at least the range from the outer periphery to the center of the cut semiconductor wafer W. As a result, the cut semiconductor wafer W sucked and held on the spinner table 12 via the dicing tape T is subjected to spinner cleaning. In the reciprocating movement of the injection nozzle 13 in the Y-axis direction, the carry-out / carry-in mechanism 7 serves as a drive source, so that the size can be reduced and the cost can be reduced. Since the spinner table 12 is formed so that the outer diameter is larger than the outer diameter of the semiconductor wafer W and smaller than the inner diameter of the annular frame F as described above, the annular frame F slightly hangs down by its own weight. The supplied cleaning water is smoothly discharged to the outer periphery, and the frame pressing mechanism is unnecessary, thereby reducing the cost.

上述したように切削済みの半導体ウエーハWを洗浄したならば、図２３に示すように搬出・搬入機構７を上記待機位置に位置付けるとともに、補助仮置き機構９を構成する一対の補助支持レール９０の底部９１a、９１ｂを開位置に位置付けた状態で下部位置に位置付け、底部９１a、９１ｂを閉位置にして洗浄済みの半導体ウエーハWを支持する環状のフレームFを支持する。そして、スピンナーテーブル１２による半導体ウエーハWの吸引保持を解除する。   When the cut semiconductor wafer W is cleaned as described above, the unloading / loading mechanism 7 is positioned at the standby position as shown in FIG. With the bottom portions 91a and 91b positioned at the open position, the bottom portion 91a and 91b are positioned at the lower position, and the bottom portions 91a and 91b are closed and the annular frame F that supports the cleaned semiconductor wafer W is supported. Then, the suction and holding of the semiconductor wafer W by the spinner table 12 is released.

次に、図２４に示すように洗浄済みの半導体ウエーハWを支持する環状のフレームFを支持した補助仮置き機構９を構成する一対の補助支持レール９０を上部位置に位置付ける。そして、搬出・搬入機構７の支持基台７２に配設された補助把持部材７６を作動して環状のフレームFを把持する。   Next, as shown in FIG. 24, a pair of auxiliary support rails 90 constituting the auxiliary temporary placement mechanism 9 that supports the annular frame F that supports the cleaned semiconductor wafer W are positioned at the upper position. Then, the auxiliary gripping member 76 disposed on the support base 72 of the unloading / loading mechanism 7 is operated to grip the annular frame F.

そして、搬出・搬入機構７の搬送移動手段７１を作動して、図２５に示すように洗浄済みの半導体ウエーハWを支持する環状のフレームFを補助仮置き機構９の一対の補助支持レール９０から仮置き機構８の一対の支持レール８０まで移動する。   Then, the transport movement means 71 of the carry-out / carry-in mechanism 7 is operated, and the annular frame F that supports the cleaned semiconductor wafer W is moved from the pair of auxiliary support rails 90 of the auxiliary temporary placement mechanism 9 as shown in FIG. It moves to the pair of support rails 80 of the temporary placement mechanism 8.

次に、図２６に示すように仮置き機構８の一対の支持レール８０を中間位置に位置付けるとともに、搬出・搬入機構７の支持基台７２に配設された把持部材７４および一対の規制ピン７５を待機位置に位置付ける。   Next, as shown in FIG. 26, the pair of support rails 80 of the temporary placement mechanism 8 are positioned at an intermediate position, and the gripping member 74 and the pair of restriction pins 75 disposed on the support base 72 of the carry-out / load-in mechanism 7. At the standby position.

そして、搬出・搬入機構７の搬送移動手段７１を作動して、図２７に示すように支持基台７２をカセット載置機構６側に移動して把持部材７４および一対の規制ピン７５を待機位置からカセット載置機構６に載置されたカセット６０まで移動することにより、洗浄済みの半導体ウエーハWを支持する環状のフレームFをカセット６０に収容する。   Then, the transport moving means 71 of the carry-out / carry-in mechanism 7 is operated to move the support base 72 toward the cassette mounting mechanism 6 as shown in FIG. 27 so that the gripping member 74 and the pair of regulating pins 75 are moved to the standby position. To the cassette 60 mounted on the cassette mounting mechanism 6, the annular frame F that supports the cleaned semiconductor wafer W is accommodated in the cassette 60.

なお、上述したように洗浄済みの半導体ウエーハWを洗浄するとともにカセット６０に収容する作業を実施している際に、カセット６０から仮置き機構８の一対の支持レール８０に搬出された新たな半導体ウエーハWは、上述したように保持テーブル機構３を構成する保持テーブル３４に搬送され吸引保持される。そして、保持テーブル３４に吸引保持された新たな半導体ウエーハWは、加工送り手段３５によって切削機構４が配設された加工領域に移動せしめられ、第１の切削手段５aと第２の切削手段５bによって所定の切削加工が施される。   As described above, a new semiconductor carried out from the cassette 60 to the pair of support rails 80 of the temporary placement mechanism 8 when the cleaned semiconductor wafer W is cleaned and accommodated in the cassette 60 is implemented. As described above, the wafer W is conveyed to the holding table 34 constituting the holding table mechanism 3 and sucked and held. Then, the new semiconductor wafer W sucked and held by the holding table 34 is moved to the machining area where the cutting mechanism 4 is disposed by the machining feed means 35, and the first cutting means 5a and the second cutting means 5b. A predetermined cutting process is performed.

以上のように、図示の実施形態における切削装置は、被加工物を保持する保持テーブル３４が被加工物着脱領域に位置付けられている際に、搬出・搬入機構７によってカセット６０に収容された半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFを搬出して仮置き機構８を構成する一対の支持レール８０に仮置きし、昇降手段８６によって一対の支持レール８０を下降して環状のフレームFにダイシングテープTを介して支持された半導体ウエーハWを保持テーブル３４に載置し、開閉手段８５a、８５bによって底部８１a、８１bを開くことによりダイシングテープTを介して半導体ウエーハWを保持テーブル３４に保持するので、被加工物としての半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFを搬送する搬送手段は実質的に搬出・搬入機構７のみであるため、部品点数が低減してコストが低減が低減するとともに、装置の小型化を図ることができる。また、搬出・搬入機構７は、洗浄機構１０のスピンナーテーブル１２の直上に配設された補助仮置き機構９にも切削済の半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFを搬送する機能を有しているので、更に装置の小型化を図ることができる。   As described above, the cutting apparatus in the illustrated embodiment is configured such that the semiconductor housed in the cassette 60 by the carry-out / carry-in mechanism 7 when the holding table 34 that holds the workpiece is positioned in the workpiece attachment / detachment region. The annular frame F that supports the wafer W via the dicing tape T is unloaded and temporarily placed on a pair of support rails 80 constituting the temporary placement mechanism 8. The semiconductor wafer W supported on the frame F via the dicing tape T is placed on the holding table 34, and the bottoms 81a and 81b are opened by the opening / closing means 85a and 85b to hold the semiconductor wafer W via the dicing tape T. Since it is held on the table 34, an annular frame F that supports a semiconductor wafer W as a workpiece through a dicing tape T is conveyed. Conveying means for substantially only out-carrying mechanism 7, the cost is reduced reduced reduced number of parts, it is possible to reduce the size of the apparatus. Further, the carry-out / carry-in mechanism 7 also has an annular frame F that supports the cut semiconductor wafer W via the dicing tape T also in the auxiliary temporary placement mechanism 9 disposed immediately above the spinner table 12 of the cleaning mechanism 10. Since it has the function to convey, the apparatus can be further miniaturized.

２：静止基台
３：保持テーブル機構
３２：移動基台
３４：保持テーブル
３５：加工送り手段
３５１：X軸リニアレール
３５２：X軸コイル可動子
４：切削機構
５a：第１の切削手段
５b：第２の切削手段
５４：割り出し送り手段
５４０：共通のY軸リニアレール
５４４a：第１のY軸コイル可動子
５４４b：第２のコイル可動子
６：カセット載置機構
６０：カセット
７：搬出・搬入機構
７１：搬送移動手段
７２：支持基台
７４：把持部材
７５：一対の規制ピン
７６：補助把持部材
７７：一対の補助規制ピン
８：仮置き機構
８０：一対の支持レール
９：補助仮置き機構
９０：一対の補助支持レール
１０：洗浄機構
１１：洗浄ハウジング
１２：スピンナーテーブル
１３：噴射ノズル
１４：錘
１５：ワイヤー
１６：プーリー
F：環状のフレーム
T：ダイシングテープ
W：半導体ウエーハ 2: Stationary base 3: Holding table mechanism 32: Moving base 34: Holding table 35: Processing feed means 351: X-axis linear rail 352: X-axis coil mover 4: Cutting mechanism 5a: First cutting means 5b: Second cutting means 54: Index feeding means 540: Common Y-axis linear rail 544a: First Y-axis coil mover 544b: Second coil mover 6: Cassette mounting mechanism 60: Cassette 7: Unloading / loading Mechanism 71: Transport moving means 72: Support base 74: Holding member 75: A pair of restricting pins 76: Auxiliary holding member 77: A pair of auxiliary restricting pins 8: Temporary placement mechanism 80: A pair of support rails 9: Auxiliary temporary placement mechanism 90: A pair of auxiliary support rails 10: Cleaning mechanism 11: Cleaning housing 12: Spinner table 13: Injection nozzle 14: Weight 15: Wire 16: Pulley
F: Ring frame
T: Dicing tape
W: Semiconductor wafer

Claims (6)

複数の被加工物を収容したカセットが載置されるカセット載置機構と、該カセット載置機構に載置されたカセットから被加工物を搬出および搬入する搬出・搬入機構と、該搬出・搬入機構によって搬出された被加工物を仮置きする仮置き機構と、該仮置き機構に仮置きされた被加工物を保持する保持テーブルと、該保持テーブルに保持された被加工物を切削する切削機構と、該保持テーブルを加工送り方向（X軸方向）に加工送りする加工送り機構と、を具備する切削装置であって、
該加工送り機構は、該保持テーブルを該仮置き機構が配設された被加工物着脱領域と、該切削機構が配設された加工領域との間を加工送り方向（X軸方向）に移動可能に支持するX軸ガイドレールと、該X軸ガイドレールに沿って該保持テーブルを移動せしめる加工送り手段を備え、
該仮置き機構と該カセット載置機構はX軸方向と直交するY軸方向に隣接して配設されており、
該搬出・搬入機構は、支持基台と、該支持基台に配設されカセットに収容された被加工物を把持する把持部材と、被加工物を所定の位置に規制する一対の規制ピンと、該支持基台をY軸方向に移動する搬送移動手段とを備え、
該仮置き機構は、Y軸方向に延在し被加工物の両側部を支持する底部と側部とを有し該底部が開閉可能に構成された一対の支持レールと、該一対の支持レールの該底部を開閉する開閉手段と、該一対の支持レールを上下方向に移動せしめる昇降手段と、を備えており、
該保持テーブルが該被加工物着脱領域に位置付けられている際に、該搬出・搬入機構によってカセットに収容された被加工物を搬出して該仮置き機構を構成する該一対の支持レールに仮置きし、該昇降手段によって該一対の支持レールを下降して被加工物を該保持テーブルに載置し、該開閉手段によって該底部を開くことにより被加工物を該保持テーブルに保持する、
ことを特徴とする切削装置。 A cassette mounting mechanism on which a cassette containing a plurality of workpieces is mounted, a carry-out / carry-in mechanism for carrying out and carrying in the workpieces from the cassette placed on the cassette mounting mechanism, and the carry-out / carry-in Temporary placement mechanism for temporarily placing the workpiece carried out by the mechanism, holding table for holding the workpiece temporarily placed on the temporary placement mechanism, and cutting for cutting the workpiece held on the holding table A cutting device comprising a mechanism and a processing feed mechanism for processing and feeding the holding table in a processing feed direction (X-axis direction),
The machining feed mechanism moves the holding table in a machining feed direction (X-axis direction) between a workpiece attaching / detaching area where the temporary placement mechanism is arranged and a machining area where the cutting mechanism is arranged. An X-axis guide rail that can be supported, and a processing feed means for moving the holding table along the X-axis guide rail,
The temporary placement mechanism and the cassette placement mechanism are disposed adjacent to each other in the Y-axis direction perpendicular to the X-axis direction,
The unloading / carrying-in mechanism includes a support base, a gripping member that grips the workpiece disposed in the support base and accommodated in a cassette, and a pair of regulation pins that regulate the workpiece to a predetermined position; A transport moving means for moving the support base in the Y-axis direction,
The temporary placement mechanism includes a pair of support rails that extend in the Y-axis direction and support both side portions of the workpiece and have a bottom portion and side portions that are configured to be openable and closable, and the pair of support rails And an opening / closing means for opening and closing the bottom portion, and an elevating means for moving the pair of support rails in the vertical direction,
When the holding table is positioned in the workpiece attaching / detaching area, the workpiece stored in the cassette is unloaded by the unloading / loading mechanism and temporarily attached to the pair of support rails constituting the temporary placing mechanism. The workpiece is placed on the holding table by lowering the pair of support rails by the elevating means, and the workpiece is held on the holding table by opening the bottom by the opening / closing means.
The cutting device characterized by the above. 該仮置き機構に隣接し該カセット載置機構に対してY軸方向反対側に被加工物を洗浄するためのスピンナーテーブルを備えた洗浄機構が配設されるとともに、該洗浄機構の直上に該仮置き機構と連通するように構成され被加工物を仮置きする補助仮置き機構が配設されており、
該補助仮置き機構は、Y軸方向に延在し被加工物の両側部を支持する底部と側部とを有し該底部が開閉可能に構成された一対の補助支持レールと、該一対の補助支持レールの該底部を開閉する開閉手段と、該一対の補助支持レールを上下方向に移動せしめる補助昇降手段とを備えている、請求項１記載の切削装置。 A cleaning mechanism provided with a spinner table for cleaning a workpiece adjacent to the temporary placement mechanism and on the opposite side to the cassette mounting mechanism in the Y-axis direction is disposed, and the cleaning mechanism is disposed immediately above the cleaning mechanism. An auxiliary temporary placement mechanism that is configured to communicate with the temporary placement mechanism and temporarily places the workpiece is disposed,
The auxiliary temporary placement mechanism includes a pair of auxiliary support rails that extend in the Y-axis direction and have a bottom portion and a side portion that support both side portions of the workpiece, and the bottom portion is configured to be openable and closable. The cutting apparatus according to claim 1, further comprising: an opening / closing means for opening and closing the bottom portion of the auxiliary support rail; and an auxiliary lifting means for moving the pair of auxiliary support rails in the vertical direction. 該搬出・搬入機構は、該支持基台に配設され該一対の補助支持レールに支持された被加工物における該把持部材によって把持される領域と反対側の領域を把持する補助把持部材と、該一対の補助支持レールに支持された被加工物を所定の位置に規制する一対の補助規制ピンとを備え、
切削済みの被加工物を保持した該保持テーブルが該被加工物着脱領域に位置付けられている際に、該仮置き機構を構成する該一対の支持レールの該底部を開にした状態で該一対の支持レールを下降して該底部を切削済みの被加工物の下部に位置付けた後に該底部を閉にして切削済みの被加工物を支持した状態で該一対の支持レールを上昇させ、
次に、該搬出・搬入機構の該把持部材によってカセットに収容された被加工物を把持するとともに該支持基台に設けられた該一対の補助規制ピンを切削済みの該被加工物における該把持部材によって把持された領域と反対側の領域の端面に位置付け、該支持基台を該補助仮置き機構側に移動することにより、カセットに収容された被加工物を該仮置き機構に位置付けるとともに切削済みの被加工物を該補助仮置き機構に位置付け、
該補助仮置き機構を構成する該補助昇降手段によって該一対の補助支持レールに仮置きし、該昇降手段によって該一対の補助支持レールを下降して被加工物を該洗浄機構の該スピンナーテーブルに載置し、該開閉手段によって該底部を開くことにより切削済みの被加工物を該スピンナーテーブルに保持する、請求項２記載の切削装置。 The carry-in / carry-in mechanism includes an auxiliary gripping member that grips a region opposite to a region gripped by the gripping member in a workpiece that is disposed on the support base and supported by the pair of auxiliary support rails; A pair of auxiliary restriction pins for restricting the workpiece supported by the pair of auxiliary support rails to a predetermined position;
When the holding table holding the cut workpiece is positioned in the workpiece attaching / detaching region, the pair of support rails constituting the temporary placement mechanism are opened with the bottom portions open. The pair of support rails are raised in a state where the bottom is closed and the cut workpiece is supported after the bottom is positioned below the cut workpiece and the bottom is closed.
Next, the workpiece stored in the cassette is gripped by the gripping member of the unloading / loading mechanism, and the pair of auxiliary regulating pins provided on the support base are gripped on the workpiece after cutting. Positioned on the end surface of the region opposite to the region gripped by the member, and moves the support base to the auxiliary temporary placement mechanism side, thereby positioning the workpiece contained in the cassette to the temporary placement mechanism and cutting Positioning the finished workpiece on the auxiliary temporary placement mechanism,
Temporarily placing the auxiliary support rails on the pair of auxiliary support rails by the auxiliary lifting means constituting the auxiliary temporary placing mechanism, and lowering the pair of auxiliary support rails by the lifting means to place the workpiece on the spinner table of the cleaning mechanism. 3. The cutting apparatus according to claim 2, wherein the workpiece to be cut is held on the spinner table by placing and opening the bottom by the opening / closing means. 該洗浄機構は、該スピンナーテーブルの上方に配設された洗浄水を噴射する噴射ノズルを備えており、該噴射ノズルは該搬出・搬入機構を構成する該支持基台に配設され選択的に係合する係合手段によって該支持基台の移動に伴いY軸方向に移動し、少なくとも被加工物の外周から中心までの領域に洗浄水を噴射する、請求項２又は３に記載の切削装置。   The cleaning mechanism includes a spray nozzle that sprays cleaning water disposed above the spinner table, and the spray nozzle is disposed on the support base that constitutes the carry-out / load-in mechanism and selectively. The cutting apparatus according to claim 2 or 3, wherein the engagement means moves in the Y-axis direction as the support base moves, and the cleaning water is sprayed at least in a region from the outer periphery to the center of the workpiece. . 該洗浄機構の該噴射ノズルには、一端に錘が連結されたワイヤーの他端がプーリーを介して連結され、該錘の重力によってY軸方向に移動するように構成されており、
該係合手段は、該支持基台に進退可能に配設された係合ロッドを備え、該係合ロッドを進出した状態で該噴射ノズルにおける該錘の重力によって移動する方向から接触せしめる、請求項４記載の切削装置。 The spray nozzle of the cleaning mechanism is connected to the other end of a wire having a weight connected to one end via a pulley, and is configured to move in the Y-axis direction due to the gravity of the weight.
The engagement means includes an engagement rod disposed on the support base so as to be capable of advancing and retreating, and makes the contact from the direction of movement by the gravity of the weight in the injection nozzle in the advanced state. Item 5. The cutting device according to Item 4. 該切削機構は、第１の切削ブレードを回転可能に備えた第１の切削手段と、該第１の切削手段の第１の切削ブレードと対向して配設された第２の切削ブレードを回転可能に備えた第２の切削手段と、該第１の切削手段と該第２の切削手段をX軸方向と直交するY軸方向に移動可能に支持するY軸ガイドレールと、該Y軸ガイドレールに沿って該第１の切削手段を移動せしめる第１の割り出し送り手段および該Y軸ガイドレールに沿って該第２の切削手段を移動せしめる第２の割り出し送り手段とを具備している、請求項１記載の切削装置。   The cutting mechanism rotates a first cutting means rotatably provided with a first cutting blade, and a second cutting blade disposed to face the first cutting blade of the first cutting means. Second cutting means provided in a possible manner, a Y-axis guide rail that supports the first cutting means and the second cutting means movably in the Y-axis direction orthogonal to the X-axis direction, and the Y-axis guide First index feed means for moving the first cutting means along the rail and second index feed means for moving the second cutting means along the Y-axis guide rail, The cutting device according to claim 1.
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