JP2013116532A - Cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device decreasing an occupying area of the device and a moving area required for operation of an operator.SOLUTION: In the cutting device including a workpiece holding means 3, a cutting means 41, a cut-feeding means, an index-feeding means, a cleaning means 6, a cassette placing means 8, a workpiece carrying in/out means 9, a temporary placing means 7 and workpiece conveying means 11 and 12, the cut-feeding means is constituted such that the workpiece holding means 3 is moved to a cutting region and a workpiece attaching and detaching region, the cleaning means 6 is disposed on the side of the workpiece attaching and detaching region, the temporary placing means 7 is disposed on the upper side of the cleaning means 6, the workpiece conveying means 11 and 12 are structured so as to be movable between the temporary placing means 7 and the cleaning means 6 and the workpiece attaching and detaching region, the cassette placing means 8 is disposed on a front side to be a side opposite to the cutting region side from the temporary placing means 7 and an operator operation space enclosed in an L-shape by a line connecting the cassette placing means 8 and the temporary placing means 7 and a line connecting the temporary placing means 7 and the workpiece attaching and detaching region is formed.

Description

  The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and devices such as ICs, LSIs, etc. are partitioned in the partitioned regions. Form. Then, the semiconductor wafer is cut along the streets to divide the region in which the device is formed to manufacture individual semiconductor devices. In addition, optical device wafers in which gallium nitride compound semiconductors are laminated on the surface of sapphire substrates are also divided into optical devices such as individual light-emitting diodes and laser diodes by cutting along the streets. It's being used.

  Cutting along the streets of the semiconductor wafer and the optical device wafer described above is generally performed by a cutting apparatus called a dicer. This cutting apparatus includes a chuck table as a workpiece holding means having a holding surface for holding a workpiece such as a semiconductor wafer, and a cutting means including a cutting blade for cutting the workpiece held on the chuck table. Cutting feed means for relatively moving the chuck table and the cutting means in the cutting feed direction; index feed means for relatively moving the chuck table and the cutting means in the index feed direction orthogonal to the cutting feed direction; Cleaning means for cleaning the workpiece cut by the cutting means. (For example, refer to Patent Document 1.)

JP 2001-298000 A

  Thus, since the above-described cutting apparatus is installed in a clean room with a high unit price, there is a problem that the equipment cost increases when the occupation area and the movement area necessary for the operation of the operator are wide.

  The present invention has been made in view of the above-described facts, and a main technical problem thereof is to provide a cutting apparatus that can reduce the occupation area of the apparatus and the movement area necessary for the operation of the operator.

In order to solve the main technical problem, according to the present invention, a workpiece holding means for holding a workpiece and a cutting blade provided with a cutting blade for cutting the workpiece held by the workpiece holding means. Means, a cutting feed means for moving the workpiece holding means relative to the cutting feed direction (X-axis direction), and a cutting feed means (Y-axis direction) perpendicular to the cutting feed direction. Index feeding means, cleaning means for cleaning the workpiece cut by the cutting means, cassette placing means for placing a cassette containing the workpiece, and placed on the cassette placing means Workpiece loading / unloading means for loading / unloading the workpiece contained in the cassette, temporary placing means for temporarily placing the workpiece carried by the workpiece loading / unloading means, the temporary placing means, and the cleaning Means and work piece storage In cutting anda workpiece conveying means for conveying the workpiece to and from the unit,
The cutting feed means is configured to move the workpiece holding means to a cutting area by the cutting means and a workpiece attaching / detaching area for attaching / detaching the workpiece,
The cleaning means is disposed laterally in the Y-axis direction of the workpiece attaching / detaching region,
The temporary placement means is disposed above the cleaning means,
The workpiece conveying means is configured to be movable in the Y-axis direction between the temporary placement means and the cleaning means and the workpiece attaching / detaching region.
The cassette placing means is disposed on the near side opposite to the cutting area side in the X-axis direction from the temporary placing means, a line connecting the cassette placing means and the temporary placing means, and the temporary placing means An operator working space that is enclosed in an L shape by a line connecting the workpiece attaching / detaching region is formed.
A cutting device is provided.

Each of the above means is disposed in the housing except for the cassette mounting means. The housing is provided with an open / close door with an operation panel mounted on the operator work space side, and the open / close door is positioned at the open position. In this state, the operation panel is directed to the operator work space.
The cutting means includes a first cutting means including a first rotating spindle and a first cutting blade attached to one end of the first rotating spindle, a second rotating spindle, and the second rotation. And a second cutting means having a second cutting blade mounted on one end of the spindle, the first cutting blade and the second cutting blade being arranged to face each other, The first rotary spindle and the second rotary spindle are arranged in a straight line so that the axis is directed in the Y-axis direction.
The workpiece conveying means includes a first workpiece conveying means for conveying the workpiece temporarily placed on the temporary placing means to the workpiece holding means, and a cutting means held by the workpiece holding means. And a second transport unit that transports the workpiece cut by the cleaning unit to the cleaning unit.

  In the cutting apparatus according to the present invention, the temporary placing means is disposed above the cleaning means, the cassette placing means is disposed on the near side opposite to the cutting region side in the X-axis direction from the temporary placing means, and the cassette placing The operator working space enclosed in an L shape is formed by the line connecting the means and the temporary placing means and the line connecting the temporary placing means and the workpiece attaching / detaching area, thereby reducing the occupation area of the cutting device and the movement area of the operator. Can be made.

The perspective view which shows the principal part of the cutting device comprised according to this invention. The perspective view of the housing which accommodates the principal part of the cutting device shown in FIG. The top view which shows the closed state and open state of the 2nd opening / closing door with which the housing shown in FIG. 2 is mounted | worn.

  Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of one embodiment of the main components of a cutting device constructed in accordance with the present invention.
The cutting device in the illustrated embodiment includes a stationary base 2. The stationary base 2 includes a workpiece holding mechanism 3 that holds a workpiece and a cutting mechanism 4 that cuts the workpiece held by the workpiece holding mechanism 3. The workpiece holding mechanism 3 includes a pair of guide rails 31, 31 arranged in parallel along the cutting feed direction (X-axis direction) indicated by an arrow X on the stationary base 2, and the pair of guide rails 31, A moving base 32 slidably disposed on 31, and a work piece that holds a work piece rotatably supported by a cylindrical support member 34 disposed on the moving base 32. A chuck table 35 as holding means is provided. The chuck table 35 includes a chuck table main body 351 rotatably supported by a cylindrical support member 34, and an adsorption chuck 352 disposed on the upper surface of the chuck table main body 351. The suction chuck 352 is connected to a suction means (not shown) so that a negative pressure is appropriately applied. Accordingly, the workpiece placed on the holding, which is the upper surface of the suction chuck 352, is sucked and held on the suction chuck 352 by operating a suction means (not shown). The chuck table 35 is rotated by a pulse motor (not shown) disposed in the cylindrical support member 34.

  Further, the chuck table mechanism 3 includes a cutting feed means 36 for moving the moving base 32 on which the chuck table 35 is disposed along the pair of guide rails 31 and 31 in the X-axis direction. The cutting feed means 36 includes a drive source such as a male screw rod 361 disposed in parallel between the pair of guide rails 31, 31 and a pulse motor 362 for rotationally driving the male screw rod 361. A male screw rod 361 is screwed into a female screw hole 321 formed in the moving base 32. Therefore, by rotating the male screw rod 361 by the pulse motor 62, the moving base 32 on which the chuck table 35 is disposed is moved in the X-axis direction. The cutting feed means 36 configured in this way is configured to move the chuck table 35 as the workpiece holding means between the workpiece attaching / detaching area 30 shown in FIG. 1 and the cutting area 40 by the cutting mechanism 4. Has been.

  The cutting mechanism 4 moves in the Y-axis direction on a support base (not shown) disposed along the index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the X-axis direction above the cutting region 40. A first cutting means 41a and a second cutting means 41b supported in a possible manner are provided. The first cutting means 41a and the second cutting means 41b are respectively a first moving base 42a and a second moving base 42b supported so as to be movable in the Y-axis direction along a support base (not shown). An L-shaped first suspension bracket 43a and a second suspension bracket 43b mounted on the first movement base 42a and the second movement base 42b, and the first suspension bracket 43a and the second suspension bracket 43a. The first spindle unit 44a and the second spindle unit 44b mounted on the lower surface of the second suspension bracket 43b, and the first suspension bracket 43a mounted with the first spindle unit 44a and the second spindle unit 44b. The first moving base 42a and the second moving base 42b to which the second suspension bracket 43b is attached are arranged in the Y-axis direction along a support base (not shown). The first and second indexing feeding means 45a and 45b, and the first and second suspension brackets 43a and 43b to which the first and second spindle units 44a and 44b are mounted. Along the guide rail (not shown) provided on the first moving base 42a and the second moving base 42b in the cutting feed direction (Z-axis direction) indicated by the arrow Z perpendicular to the holding surface of the chuck table 35. A first notch feed means 46a and a second notch feed means 46b to be moved are provided.

  The first spindle unit 44a and the second spindle unit 44b include a first spindle housing 441a and a second spindle housing 441b fixed to the first suspension bracket 43a and the second suspension bracket 43b, respectively. A first rotary spindle 422a and a second rotary spindle (not shown) rotatably supported by the first spindle housing 441a and the second spindle housing 441b, respectively, and the first rotary spindle 442a and the second rotary spindle 442a. A first cutting blade 443a and a second cutting blade (not shown) mounted on one end of the first rotating spindle, and a first servo for rotationally driving the first rotating spindle 442a and the second rotating spindle, respectively. Motor 444a and second first It consists of a servo motor 444b. The first spindle unit 44a and the second spindle unit 44b configured as described above are disposed so that the first cutting blade 443a and the second cutting blade (not shown) face each other, The first rotary spindle 422a and the second rotary spindle (not shown) are arranged in a straight line such that the axis is directed in the Y-axis direction.

  The first index feed means 45a and the second index feed means 45b include a first male screw rod 451a and a second male screw rod 451b disposed along the Y-axis direction, respectively, and the first male screw rod. 451a and the second male screw rod 451b are provided with a first pulse motor 452a and a second pulse motor 452b for rotationally driving the first male screw rod 451a and the second male screw rod 451b. Screwed into female screw holes 421a and 421b formed in the moving base 42a and the second moving base 42b. The first index feed means 45a and the second index feed means 45b configured as described above drive the first pulse motor 452a and the second pulse motor 452b, and thereby the first male screw rod 451a and the second index feed means 452b. By rotating the male screw rod 451b, the first moving base 42a and the second moving base 42b can be moved in the Y-axis direction along a support base (not shown).

  The first notch feed means 46a and the second notch feed means 46b are arranged in the Z-axis direction in the same manner as the first index feed means 45a and the second index feed means 45b. A male screw rod (not shown) and a second male screw rod (not shown), and a first for rotationally driving the first male screw rod (not shown) and the second male screw rod (not shown) Pulse motor 462a and second pulse motor 462b, the first male screw rod (not shown) and the second male screw rod (not shown) being the first suspension bracket 43a and the second suspension motor. It is screwed into a female screw block (not shown) provided on the bracket 43b. The first notch feed means 46a and the second notch feed means 46b configured in this manner rotate the first pulse motor 462a and the second pulse motor 462b, thereby causing the first suspension bracket 43a and The infeed direction of the second suspension bracket 43b indicated by an arrow Z perpendicular to the holding surface of the chuck table 35 along a guide rail (not shown) provided on the first moving base 42a and the second moving base 42b. It can move in (Z-axis direction).

  The cutting apparatus in the illustrated embodiment has a cleaning means for cleaning the workpiece held by the chuck table 35 as the workpiece holding means and cut by the first cutting means 41a and the second cutting means 41b. 6 is provided. The cleaning means 6 is disposed on the side of the workpiece attachment / detachment region 30 of the chuck table 35 in the Y-axis direction. The cleaning means 6 is a known spinner cleaning / drying means having a spinner table 61.

  Temporary placing means 7 for temporarily placing a workpiece accommodated in a cassette placed on a cassette placing means described later is disposed above the cleaning means 6 described above. The temporary placing means 7 includes a pair of alignment members 71 and 71 each having an L-shaped cross section disposed parallel to each other along the X-axis direction. The pair of alignment members 71 and 71 are configured to be movable in directions toward and away from each other, and are moved in directions toward and away from each other by an operating mechanism (not shown). Thus, by arranging the temporary placement means 7 above the cleaning means 6, the area of the cutting device can be suppressed.

  A cassette placing means 8 is disposed on the near side opposite to the cutting region 40 side in the X-axis direction from the temporary placing means 7. The cassette mounting means 8 includes a cassette table 81 arranged so as to be movable up and down by a lifting means (not shown), and a cassette 80 for storing a workpiece is placed on the cassette table 81. . The workpiece W such as a semiconductor wafer accommodated in the cassette 80 is accommodated in a state where the back surface is adhered to the surface of the dicing tape T attached to the annular frame F. In this way, by placing the cassette placing means 8 on the near side opposite to the cutting region 40 side in the X-axis direction from the temporary placing means 7, a straight line connecting the cassette placing means 8 and the temporary placing means 7 and the temporary placing means 7 are provided. An operator work space 50 that is enclosed in an L shape is formed by a straight line connecting the placing means 7 and the workpiece attaching / detaching region 30. Thus, since the operator work space 50 where the operator is located is provided, the occupation area of the cutting device and the movement area of the operator can be reduced.

  The cutting apparatus in the illustrated embodiment includes a workpiece loading / unloading means 9 for loading / unloading a workpiece accommodated in a cassette 80 placed on a cassette table 81 of the cassette placing means 8. . The workpiece carrying-in / out means 9 includes a hand 91 that holds the annular frame F, a support member 92 that supports the hand 91, and a guide rail that supports the support member 92 so as to be movable along the X-axis direction. 93, and the support member 92 is moved along the guide rail 93 by a moving means (not shown).

  In the illustrated embodiment, the cutting apparatus transports the workpiece temporarily placed on the temporary placing means 7 to the chuck table 35 serving as the workpiece holding means positioned in the workpiece attaching / detaching area 30. The workpiece transporting means 11 and the workpiece held by the chuck table 35, which is cut by the first cutting means 41a and the second cutting means 41b and positioned in the workpiece attaching / detaching area 30, are cleaned. 6 is provided with second workpiece conveying means 12 for conveying the workpiece. The first workpiece conveying means 11 includes a holding member 111 for sucking and holding the annular frame F, a supporting means 112 for supporting the holding member 111, and the supporting means 112 being movable along the Y-axis direction. The support member 112 is moved along the common guide rail 113 by the moving means (not shown) between the temporary placing means 7 and the workpiece attaching / detaching area 30 in the Y-axis direction. It can be moved. The support means 112 is configured to be movable and adjustable in the vertical direction. The second workpiece conveying means 12 includes a holding member 121 for sucking and holding the annular frame F, as in the first workpiece conveying means 11, and a supporting means 122 for supporting the holding member 121. The common guide rail 113 that supports the support means 122 so as to be movable along the Y-axis direction. The support member 122 is moved along the common guide rail 113 by a moving means (not shown). 30 and the cleaning means 6 can be moved in the Y-axis direction. The support means 122 is configured to be movable and adjustable in the vertical direction.

  Each means constituting the cutting apparatus in the illustrated embodiment is arranged in the housing 10 shown in FIG. 2 except for the cassette placing means 8. A first door 101 and a second door 102 are mounted on the housing 10 on the operator work space 50 side. The first opening / closing door 101 is disposed on the side facing the cassette mounting means 8, and one side of the first opening / closing door 101 is configured to be opened and closed with the support shaft 101 a as a fulcrum. The first opening / closing door 101 configured in this manner is for allowing the workpiece W accommodated in the cassette 80 placed on the cassette table 81 of the cassette placing means 8 to be carried out and carried in the lower part. An opening 101b is provided. A handle 101 c is attached to the surface of the first opening / closing door 101.

  The second opening / closing door 102 is disposed facing the operator work space 50 at a position facing the chuck table mechanism 3. On the surface of the second opening / closing door 102, an operation panel 102a for inputting work conditions and the like by an operator is mounted, and a handle 102b is mounted. The second opening / closing door 102 configured in this way is supported by an opening / closing mechanism 103 shown in FIGS. 3A and 3B so as to be opened and closed. The opening / closing mechanism 103 includes an opening / closing stay 103a having one end pivotably supported on the main body side of the housing 10 and the other end pivotally pivotally supported by a side intermediate portion of the second opening / closing door 102; And a guide rail 103c that engages the guide member 103b and guides the guide member movably along the Y-axis direction. . When the second opening / closing door 102 configured as described above has a handle 102b and is pulled toward the operator work space 50 side, the regulating member 102b moves along the guide rail 102c, whereby (b) in FIG. In FIG. 2, the operation panel 102 a is configured to be directed toward the operator work space 50 in a state of being positioned at the open position as indicated by a two-dot chain line. Therefore, the operator can replace the cutting blade while operating the operation panel 10 and can maintain the above-described means, so that the moving area required for the operation is reduced.

The cutting apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
When a cutting start switch (not shown) is turned on, the lifting / lowering means (not shown) of the cassette placing means 8 is operated to position the cassette 80 placed on the cassette table 81 at the loading / unloading position. When the cassette 80 is positioned at the loading / unloading position, the workpiece loading / unloading means 9 is activated and the hand 91 enters the cassette 80 through the opening 101b provided in the first opening / closing door 101 attached to the housing 10. The annular dicing frame F that supports the workpiece W placed on a predetermined shelf via the dicing tape T is held. The hand 91 holding the annular dicing frame F in this way is moved toward the temporary placing means 7, and the annular dicing frame F is placed on the pair of alignment members 71, 71 constituting the temporary placing means 7. Put. Then, by moving the pair of alignment members 71 and 71 in a direction approaching each other, the center alignment of the workpiece W having the dicing tape T supported by the annular dicing frame F is performed. Next, the first workpiece conveying means 11 is actuated, and the annular dicing frame that supports the workpiece W centered in the temporary placing means 7 by the holding member 111 via the dicing tape T. F is held and placed on the chuck table 35 of the chuck table mechanism 3 positioned in the workpiece attaching / detaching region 30. Then, the workpiece W is sucked and held on the chuck table 35 by operating a suction means (not shown). The dicing frame F that supports the workpiece W via the dicing tape T is supported by frame support means 353 mounted on the chuck table 35.

  If the workpiece W is sucked and held on the chuck table 35 as described above, the cutting feed means 36 is operated to move the chuck table 35 holding the workpiece W to the cutting area 40. Then, the first cutting means 41a and the second cutting means 41b are operated to perform a predetermined cutting process on the workpiece W held on the chuck table 35 (cutting process). When the cutting process is performed in this manner, the chuck table 35 holding the workpiece W cut by operating the cutting feed means 36 is positioned in the workpiece attaching / detaching region 30. Then, the suction holding of the workpiece W by the chuck table 35 is released. Next, the second workpiece conveying means 12 is operated, and the workpiece W that has been cut and placed on the chuck table 35 is supported by the holding member 121 via the dicing tape T. The annular dicing frame F is held and conveyed onto the spinner table 61 of the cleaning means 6. At this time, the pair of positioning members 71, 71 constituting the temporary placement means 7 disposed above the cleaning means 6 are actuated in directions away from each other, and the workpiece by the second workpiece transport means 12. It is positioned at the retreat position that does not hinder the conveyance of W. Then, the workpiece W is sucked and held on the spinner table 61 by operating a suction means (not shown). The dicing frame F that supports the workpiece W via the dicing tape T is supported by frame support means (not shown) mounted on the spinner table 61. Next, the cleaning means 6 is operated to clean and dry the workpiece W that has been cut.

  As described above, when the workpiece W cut by the cleaning means 6 is cleaned and dried, the suction holding of the workpiece W by the spinner table 61 is released. Then, the first workpiece conveying means 11 is operated, and the ring-shaped dicing which supports the workpiece W after cleaning placed on the spinner table 61 by the holding member 111 via the dicing tape T. While holding the frame F, it moves above the temporary placement means 7. Next, the pair of alignment members 71 and 71 constituting the temporary placing means 7 are moved in a direction approaching each other and positioned at a predetermined workpiece receiving position. Then, the first workpiece conveying means 11 is actuated to lower the annular dicing frame F supporting the workpiece W held by the holding member 111 via the dicing tape T, and a pair of Place on the alignment members 71, 71. Next, by moving the pair of alignment members 71 and 71 in a direction approaching each other, the center alignment of the workpiece W having the dicing tape T supported by the annular dicing frame F is performed. When the center alignment is performed in this way, the workpiece W placed on the pair of alignment members 71 and 71 constituting the temporary placing means 7 by operating the workpiece carrying-in / out means 9 is moved. The annular dicing frame F supported via the dicing tape T is gripped, and the cassette 80 placed on the cassette table 81 is placed on the cassette table 81 through the opening 101b provided in the first opening / closing door 101 attached to the housing 10. Store in place.

Next, the replacement of the cutting blade and the maintenance of each means will be described.
When exchanging the cutting blade and performing maintenance of each means, the first opening / closing door 101 and the second opening / closing door 102 are positioned at the open position. When the first opening / closing door 101 is positioned at the open position, the cassette 80 placed on the cassette table 81 of the cassette placing means 8 is removed. By positioning the first opening / closing door 101 and the second opening / closing door 102 in the open position in this manner, the operator located in the operator work space 50 can detect the first spindle unit 44a and the second spindle unit 44b in the first position. The cutting blade 443a and the second cutting blade (not shown) can be exchanged and maintenance of each means can be performed. At this time, the second open / close door 102 is configured such that the operation panel 102a is directed to the operator work space 50 in a state where the second open / close door 102 is positioned at the open position as indicated by a two-dot chain line in FIG. Therefore, the operator can replace the cutting blade and maintain each means while operating the operation panel 10.

  Although the present invention has been described based on the illustrated embodiment, the present invention is not limited to the embodiment, and various modifications are possible within the scope of the gist of the present invention. For example, in the illustrated embodiment, the first workpiece conveying means 11 for conveying the workpiece temporarily placed on the temporary placing means 7 to the chuck table 35 positioned in the workpiece attaching / detaching area 30; The example provided with the 2nd workpiece conveyance means 12 which conveys to the washing | cleaning means 6 the to-be-cleaned workpiece held by the chuck table 35 located in the workpiece attachment / detachment area 30 was shown. However, it may be one workpiece transfer means that can move between the temporary placing means 7 and the cleaning means 6 and the workpiece attaching / detaching area 30.

2: stationary base 3: workpiece holding mechanism 35: chuck table 36: cutting feed means 4: cutting mechanism 41a: first cutting means 41b: second cutting means 44a: first spindle unit 44b: second Spindle unit 45a: first index feed means 45b: second index feed means 46a: first cut feed means 46b: second cut feed means 6: cleaning means 7: temporary placement means 8: cassette mounting means 80: cassette 9: workpiece carrying-in / out means 10: housing 101: first opening / closing door 102: second opening / closing door 11: first workpiece conveying means 12: second workpiece conveying means

Claims (4)

A workpiece holding means for holding a workpiece, a cutting means having a cutting blade for cutting the workpiece held by the workpiece holding means, and a cutting feed direction (X Cutting feed means that is moved relatively in the axial direction), index feeding means that moves the cutting means in an index feed direction (Y-axis direction) perpendicular to the cutting feed direction, and a workpiece cut by the cutting means Cleaning means for cleaning, cassette placing means on which a cassette containing the workpiece is placed, and workpiece to be carried in and out of the workpiece contained in the cassette placed on the cassette placing means Unloading / unloading means, temporarily placing means for temporarily placing the workpiece unloaded by the workpiece loading / unloading means, and the workpiece between the temporarily placing means, the cleaning means, and the workpiece holding means. Workpiece transfer means for transferring In cutting apparatus comprising,
The cutting feed means is configured to move the workpiece holding means to a cutting area by the cutting means and a workpiece attaching / detaching area for attaching / detaching the workpiece,
The cleaning means is disposed laterally in the Y-axis direction of the workpiece attaching / detaching region,
The temporary placement means is disposed above the cleaning means,
The workpiece conveying means is configured to be movable in the Y-axis direction between the temporary placement means and the cleaning means and the workpiece attaching / detaching region.
The cassette placing means is disposed on the near side opposite to the cutting area side in the X-axis direction from the temporary placing means, a line connecting the cassette placing means and the temporary placing means, and the temporary placing means An operator working space that is enclosed in an L shape by a line connecting the workpiece attaching / detaching region is formed.
The cutting device characterized by the above.   Each means is disposed in the housing except for the cassette mounting means. The housing is provided with an opening / closing door having an operation panel mounted on the operator work space side, and the opening / closing door is in an open position. The cutting apparatus according to claim 1, wherein the operation panel is configured to be directed to the operator work space in a state where the operation panel is positioned on the operator.   The cutting means includes: a first cutting means including a first rotating spindle and a first cutting blade attached to one end of the first rotating spindle; a second rotating spindle; and the second rotation. And a second cutting means having a second cutting blade mounted on one end of the spindle, and the first cutting blade and the second cutting blade are disposed so as to face each other. The cutting apparatus according to claim 1 or 2, wherein the first rotary spindle and the second rotary spindle are arranged on a straight line such that the axis of the first rotary spindle faces the Y-axis direction.   The workpiece conveying means includes a first workpiece conveying means for conveying the workpiece temporarily placed on the temporary placing means to the workpiece holding means, and held by the workpiece holding means. The cutting apparatus according to any one of claims 1 to 3, comprising a second conveying unit that conveys the workpiece cut by the cutting unit to the cleaning unit.

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