JP7032122B2 - Cutting equipment - Google Patents

Cutting equipment Download PDF

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JP7032122B2
JP7032122B2 JP2017246092A JP2017246092A JP7032122B2 JP 7032122 B2 JP7032122 B2 JP 7032122B2 JP 2017246092 A JP2017246092 A JP 2017246092A JP 2017246092 A JP2017246092 A JP 2017246092A JP 7032122 B2 JP7032122 B2 JP 7032122B2
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axis direction
workpiece
cassette
cutting
holding
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JP2019114629A (en
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敏文 松山
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Disco Corp
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Disco Corp
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Priority to KR1020180153410A priority patent/KR102619218B1/en
Priority to CN201811540314.5A priority patent/CN109994406B/en
Priority to TW107146349A priority patent/TWI806946B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Confectionery (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Description

本発明は、板状の被加工物を切削する切削装置に関する。 The present invention relates to a cutting device for cutting a plate-shaped workpiece.

ＩＣ、ＬＳＩ等の複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハは、ダイシング装置によって個々のデバイスに分割され、分割された各デバイスは携帯電話、パソコン等の電気機器に利用される。 A wafer in which a plurality of devices such as ICs and LSIs are divided by a scheduled division line and formed on the surface is divided into individual devices by a dicing device, and each divided device is used for an electric device such as a mobile phone or a personal computer. To.

ダイシング装置は、カセットに収容されたウエーハを仮受けテーブルに搬出して位置づけし、仮受けテーブルからチャックテーブルまでウエーハを搬送し、チャックテーブルで保持したウエーハを撮像して分割予定ラインを検出し、検出した分割予定ラインを切削手段によって切削してウエーハを個々のデバイスに分割し、個々のデバイスに分割したウエーハを洗浄手段で洗浄し、洗浄済みのウエーハをカセットに収容する機能を有している（たとえば特許文献１参照。）。 The dicing device carries out the wafer housed in the cassette to the temporary receiving table and positions it, transports the wafer from the temporary receiving table to the chuck table, images the wafer held by the chuck table, detects the scheduled division line, and detects the planned division line. It has the function of cutting the detected scheduled division line by cutting means to divide the wafer into individual devices, cleaning the wafer divided into individual devices by the cleaning means, and storing the cleaned wafer in the cassette. (See, for example, Patent Document 1.).

特開平５－３１５４４４号公報Japanese Unexamined Patent Publication No. 5-315444

しかし、上記特許文献１に開示された切削装置では、ウエーハを切削している際に、仮受けテーブルおよび洗浄手段の可動は停止しており、必ずしも生産性が良好とはいえない。 However, in the cutting apparatus disclosed in Patent Document 1, the temporary receiving table and the cleaning means are not movable when the wafer is being cut, and the productivity is not always good.

上記事実に鑑みてなされた本発明の課題は、生産性が良好な切削装置を提供することである。 An object of the present invention made in view of the above facts is to provide a cutting apparatus having good productivity.

上記課題を解決するために本発明が提供するのは以下の切削装置である。すなわち、板状の被加工物を切削する切削装置であって、被加工物を保持する第一の保持手段および第二の保持手段と、該第一の保持手段をＸ軸方向に加工送りする第一の加工送り手段と、該第一の加工送り手段と隣接し該第二の保持手段をＸ軸方向に加工送りする第二の加工送り手段と、該第一の保持手段に保持された被加工物を切削する第一の切削ブレードを回転可能に備えた第一の切削手段と、該第二の保持手段に保持された被加工物を切削する第二の切削ブレードを回転可能に備えた第二の切削手段と、該第一の切削手段をＸ軸方向に直交するＹ軸方向に割り出し送りする第一の割り出し送り手段と、該第二の切削ブレードを該第一の切削ブレードに対峙させ該第二の切削手段をＹ軸方向に割り出し送りする第二の割り出し送り手段と、該第一の保持手段に保持される被加工物を複数収容した第一のカセットと該第二の保持手段に保持される被加工物を複数収容した第二のカセットとをＸ軸方向に隣接して位置づけるカセットテーブルと、該カセットテーブルをＸ軸方向とＹ軸方向とに直交するＺ軸方向に昇降させる昇降手段と、該カセットテーブルに載置された第一のカセットおよび第二のカセットに隣接して位置づけられ被加工物を仮受けする仮受けテーブルと、第一のカセットおよび第二のカセットから被加工物を引き出し該仮受けテーブルに被加工物を搬送する第一の搬送手段と、該仮受けテーブルに搬送された被加工物を保持し該第一の保持手段および該第二の保持手段に被加工物を搬送する第二の搬送手段と、切削済みの被加工物を洗浄する洗浄手段と、該第一の保持手段に保持された切削済みの被加工物および該第二の保持手段に保持された切削済みの被加工物を保持し該洗浄手段に被加工物を搬送する第三の搬送手段と、から少なくとも構成され、該仮受けテーブルは、Ｙ軸方向に延びると共にＸ軸方向に開閉する一対のガイドレールで構成され、第一のカセットおよび第二のカセットに選択的に仮受けテーブルを位置づける位置づけ手段に配設され、該第一の搬送手段が第一のカセットから被加工物を引き出す際、該仮受けテーブルは第一のカセットに位置づけられ、該第二の搬送手段は該仮受けテーブルに搬送された被加工物を保持し該仮受けテーブルを構成する一対のガイドレールが開き該仮受けテーブルの直下に位置づけられた該第一の保持手段に被加工物を搬送する切削装置である。 In order to solve the above problems, the present invention provides the following cutting equipment. That is, it is a cutting device that cuts a plate-shaped workpiece, and the first holding means and the second holding means for holding the workpiece and the first holding means are machined and fed in the X-axis direction. It was held by the first machining feed means, the second machining feed means adjacent to the first machining feed means and the second holding means to feed the second machining means in the X-axis direction, and the first holding means. A first cutting means for rotatably providing a first cutting blade for cutting a work piece and a second cutting blade for cutting a work piece held by the second holding means are rotatably provided. The second cutting means, the first indexing and feeding means for indexing and feeding the first cutting means in the Y-axis direction orthogonal to the X-axis direction, and the second cutting blade to the first cutting blade. A second indexing and feeding means for facing each other and indexing and feeding the second cutting means in the Y-axis direction, a first cassette containing a plurality of workpieces held by the first holding means, and the second A cassette table that positions a second cassette that houses a plurality of workpieces held by the holding means adjacent to each other in the X-axis direction, and the cassette table in the Z-axis direction that is orthogonal to the X-axis direction and the Y-axis direction. An elevating means for elevating and lowering, a temporary receiving table positioned adjacent to the first cassette and the second cassette placed on the cassette table and temporarily receiving the workpiece, and the first cassette and the second cassette. The first transport means for pulling out the work piece from the work piece and transporting the work piece to the temporary receiving table, and the first holding means and the second holding means for holding the work piece conveyed to the temporary receiving table. A second transport means for transporting the work piece to the means, a cleaning means for cleaning the cut work piece, a cut work piece held by the first holding means, and the second holding. It is composed of at least a third transport means that holds the machined workpiece held by the means and transports the workpiece to the cleaning means, and the temporary receiving table extends in the Y-axis direction and is X-axis. It is composed of a pair of guide rails that open and close in the direction, and is arranged in a positioning means that selectively positions the temporary receiving table in the first cassette and the second cassette, and the first transport means is covered from the first cassette. When the work piece is pulled out, the temporary receiving table is positioned in the first cassette, and the second conveying means holds the work piece conveyed to the temporary receiving table and forms a pair of guides constituting the temporary receiving table. It is a cutting device that transfers a work piece to the first holding means that opens the rail and is positioned directly under the temporary receiving table .

該第二の搬送手段は、被加工物を吸引保持する吸引パッドと、該吸引パッドを支持する支持部と、該支持部をＸ軸方向、Ｙ軸方向、Ｚ軸方向に移動する駆動部と、を備え、該第一の搬送手段は、被加工物を把持する把持部と、該把持部を作用位置と非作用位置とに選択的に位置づける選択部と、該選択部を該第二の搬送手段の該支持部に連結する連結部と、を備え、該第二の搬送手段の該駆動部によってＸ軸方向、Ｙ軸方向、Ｚ軸方向に該第一の搬送手段が移動されるのが好適である。該第三の搬送手段は、被加工物を吸引保持する吸引片と、該吸引片を支持する支持片と、該支持片をＹ軸方向、Ｚ軸方向に移動する駆動機構と、を備え、該第一の保持手段および該第二の保持手段に保持された切削済みの被加工物を保持し該洗浄手段に被加工物を搬送するのが好都合である。該洗浄手段で洗浄された被加工物は該第二の搬送手段によって該仮受けテーブルまで搬送され、該仮受けテーブルに搬送された被加工物は該第一の搬送手段によって所定のカセットに収容されるのが好ましい。 The second transport means includes a suction pad that sucks and holds the workpiece, a support portion that supports the suction pad, and a drive unit that moves the support portion in the X-axis direction, the Y-axis direction, and the Z-axis direction. The first transport means includes a grip portion that grips the workpiece, a selection portion that selectively positions the grip portion between an action position and a non-action position, and the selection portion. A connecting portion connected to the support portion of the transport means is provided, and the first transport means is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction by the drive portion of the second transport means. Is preferable. The third transport means includes a suction piece that sucks and holds the workpiece, a support piece that supports the suction piece, and a drive mechanism that moves the support piece in the Y-axis direction and the Z-axis direction. It is convenient to hold the cut workpiece held by the first holding means and the second holding means and to transport the workpiece to the cleaning means. The workpiece washed by the cleaning means is conveyed to the temporary receiving table by the second conveying means, and the workpiece conveyed to the temporary receiving table is accommodated in a predetermined cassette by the first conveying means. It is preferable to be done.

本発明が提供する切削装置は、被加工物を保持する第一の保持手段および第二の保持手段と、該第一の保持手段をＸ軸方向に加工送りする第一の加工送り手段と、該第一の加工送り手段と隣接し該第二の保持手段をＸ軸方向に加工送りする第二の加工送り手段と、該第一の保持手段に保持された被加工物を切削する第一の切削ブレードを回転可能に備えた第一の切削手段と、該第二の保持手段に保持された被加工物を切削する第二の切削ブレードを回転可能に備えた第二の切削手段と、該第一の切削手段をＸ軸方向に直交するＹ軸方向に割り出し送りする第一の割り出し送り手段と、該第二の切削ブレードを該第一の切削ブレードに対峙させ該第二の切削手段をＹ軸方向に割り出し送りする第二の割り出し送り手段と、該第一の保持手段に保持される被加工物を複数収容した第一のカセットと該第二の保持手段に保持される被加工物を複数収容した第二のカセットとをＸ軸方向に隣接して位置づけるカセットテーブルと、該カセットテーブルをＸ軸方向とＹ軸方向とに直交するＺ軸方向に昇降させる昇降手段と、該カセットテーブルに載置された第一のカセットおよび第二のカセットに隣接して位置づけられ被加工物を仮受けする仮受けテーブルと、第一のカセットおよび第二のカセットから被加工物を引き出し該仮受けテーブルに被加工物を搬送する第一の搬送手段と、該仮受けテーブルに搬送された被加工物を保持し該第一の保持手段および該第二の保持手段に被加工物を搬送する第二の搬送手段と、切削済みの被加工物を洗浄する洗浄手段と、該第一の保持手段に保持された切削済みの被加工物および該第二の保持手段に保持された切削済みの被加工物を保持し該洗浄手段に被加工物を搬送する第三の搬送手段と、から少なくとも構成され、該仮受けテーブルは、Ｙ軸方向に延びると共にＸ軸方向に開閉する一対のガイドレールで構成され、第一のカセットおよび第二のカセットに選択的に仮受けテーブルを位置づける位置づけ手段に配設され、該第一の搬送手段が第一のカセットから被加工物を引き出す際、該仮受けテーブルは第一のカセットに位置づけられ、該第二の搬送手段は該仮受けテーブルに搬送された被加工物を保持し該仮受けテーブルを構成する一対のガイドレールが開き該仮受けテーブルの直下に位置づけられた該第一の保持手段に被加工物を搬送するので、仮受けテーブルと洗浄手段の稼働率が２倍になり生産性が向上する。 The cutting apparatus provided by the present invention includes a first holding means and a second holding means for holding a workpiece, and a first machining feeding means for machining and feeding the first holding means in the X-axis direction. A second machining feed means that is adjacent to the first machining feed means and that the second holding means is machined and fed in the X-axis direction, and a first that cuts the workpiece held by the first holding means. A first cutting means rotatably equipped with a cutting blade of the above, and a second cutting means rotatably provided with a second cutting blade for cutting a workpiece held by the second holding means. The first indexing feed means for indexing and feeding the first cutting means in the Y-axis direction orthogonal to the X-axis direction, and the second cutting means with the second cutting blade facing the first cutting blade. A second indexing feed means for indexing and feeding in the Y-axis direction, a first cassette containing a plurality of workpieces held by the first holding means, and a workpiece held by the second holding means. A cassette table that positions a second cassette containing a plurality of objects adjacent to each other in the X-axis direction, an elevating means that raises and lowers the cassette table in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction, and the cassette. A temporary receiving table positioned adjacent to the first cassette and the second cassette placed on the table to temporarily receive the work piece, and the work piece is pulled out from the first cassette and the second cassette to temporarily receive the work piece. The first transport means for transporting the workpiece to the receiving table and the workpiece transported to the temporary receiving table are held and the workpiece is conveyed to the first holding means and the second holding means. A second transport means, a cleaning means for cleaning the cut workpiece, a cut workpiece held by the first holding means, and a cut piece held by the second holding means. The temporary receiving table is composed of at least a third transport means for holding the workpiece and transporting the workpiece to the cleaning means, and the temporary receiving table extends in the Y-axis direction and opens and closes in the X-axis direction. It is configured by the positioning means for selectively positioning the temporary receiving table in the first cassette and the second cassette, and when the first transport means pulls out the workpiece from the first cassette, the temporary receiving table is used. The receiving table is positioned in the first cassette, and the second conveying means holds the workpiece conveyed to the temporary receiving table, and the pair of guide rails constituting the temporary receiving table opens to open the temporary receiving table. Since the workpiece is transported to the first holding means located directly underneath, the operating rate of the temporary receiving table and the cleaning means is 2. Doubles and improves productivity.

本発明に従って構成された切削装置の斜視図。The perspective view of the cutting apparatus configured according to this invention. 図１に示す切削装置の一部斜視図。A partial perspective view of the cutting apparatus shown in FIG. 1. 図１に示す第一の切削手段および第二の切削手段の斜視図。FIG. 3 is a perspective view of a first cutting means and a second cutting means shown in FIG. 図１に示すカセットテーブル、カセットおよび仮受けテーブルの斜視図。The perspective view of the cassette table, the cassette and the temporary receiving table shown in FIG. 図１に示す第一の搬送手段および第二の搬送手段の斜視図。The perspective view of the first transport means and the second transport means shown in FIG. 1. 図１に示す第三の搬送手段の斜視図。FIG. 3 is a perspective view of the third transport means shown in FIG. 第一の保持手段の上方に仮受けテーブルが位置する状態を示す斜視図。The perspective view which shows the state which the temporary receiving table is located above the first holding means. 第一の搬送工程が実施されている状態を示す斜視図。The perspective view which shows the state which the 1st transfer process is carried out. 第一の搬送工程が実施された状態を示す斜視図。The perspective view which shows the state in which the first transfer process was carried out. 第二の搬送工程が実施されている状態を示す斜視図。The perspective view which shows the state which the 2nd transfer process is carried out.

以下、本発明に従って構成された切削装置の実施形態について図面を参照しつつ説明する。 Hereinafter, embodiments of a cutting apparatus configured according to the present invention will be described with reference to the drawings.

図１および図２に全体を符号２で示す切削装置は、被加工物を保持する第一の保持手段４ａおよび第二の保持手段４ｂと、第一の保持手段４ａを図１に矢印Ｘで示すＸ軸方向に加工送りする第一の加工送り手段６ａと、第一の加工送り手段６ａと隣接し第二の保持手段４ｂをＸ軸方向に加工送りする第二の加工送り手段６ｂとを備える。図２を参照して説明すると、第一の保持手段４ａは、Ｘ軸方向に移動自在に基台８に搭載された第一のＸ軸方向可動板１０ａと、第一のＸ軸方向可動板１０ａの上面に固定された第一の支柱１２ａと、第一の支柱１２ａの上端に回転自在に搭載された第一のチャックテーブル１４ａとを含む。第一のチャックテーブル１４ａは、第一の支柱１２ａに内蔵された第一のチャックテーブル用モータ（図示していない。）により回転される。また、第一のチャックテーブル１４ａの上端部分には、吸引手段（図示していない。）に接続された多孔質の第一の吸着チャック１６ａが配置されている。そして第一の保持手段４ａにおいては、吸引手段で第一の吸着チャック１６ａの上面に吸引力を生成することにより、被加工物を吸着して保持することができる。また、第二の保持手段４ｂは、第一のＸ軸方向可動板１０ａと隣接してＸ軸方向に移動自在に基台８に搭載された第二のＸ軸方向可動板１０ｂと、第二のＸ軸方向可動板１０ｂの上面に固定された第二の支柱１２ｂと、第二の支柱１２ｂの上端に回転自在に搭載された第二のチャックテーブル１４ｂとを含む。第二のチャックテーブル１４ｂは、第二の支柱１２ｂに内蔵された第二のチャックテーブル用モータ（図示していない。）により回転される。また、第二のチャックテーブル１４ｂの上端部分には、吸引手段（図示していない。）に接続された多孔質の第二の吸着チャック１６ｂが配置されている。そして第二の保持手段４ｂにおいては、吸引手段で第二の吸着チャック１６ｂの上面に吸引力を生成することにより、被加工物を吸着して保持することができる。なお、図１に矢印Ｙで示すＹ軸方向はＸ軸方向に直交する方向であり、図１に矢印Ｚで示すＺ軸方向はＸ軸方向とＹ軸方向とのそれぞれに直交する方向である。また、Ｘ軸方向およびＹ軸方向が規定する平面は実質上水平である。 In the cutting apparatus whose entire structure is indicated by reference numeral 2 in FIGS. 1 and 2, the first holding means 4a and the second holding means 4b for holding the workpiece and the first holding means 4a are shown by arrows X in FIG. The first machining feed means 6a for machining feed in the X-axis direction and the second machining feed means 6b adjacent to the first machining feed means 6a to feed the second holding means 4b in the X-axis direction are provided. Be prepared. Explaining with reference to FIG. 2, the first holding means 4a includes a first X-axis direction movable plate 10a mounted on the base 8 so as to be movable in the X-axis direction, and a first X-axis direction movable plate. It includes a first support column 12a fixed to the upper surface of the 10a and a first chuck table 14a rotatably mounted on the upper end of the first support column 12a. The first chuck table 14a is rotated by a first chuck table motor (not shown) built in the first support column 12a. Further, a porous first suction chuck 16a connected to a suction means (not shown) is arranged at the upper end portion of the first chuck table 14a. Then, in the first holding means 4a, the workpiece can be sucked and held by generating a suction force on the upper surface of the first suction chuck 16a by the suction means. Further, the second holding means 4b includes a second X-axis direction movable plate 10b mounted on the base 8 so as to be adjacent to the first X-axis direction movable plate 10a and movable in the X-axis direction, and a second. A second support column 12b fixed to the upper surface of the X-axis direction movable plate 10b, and a second chuck table 14b rotatably mounted on the upper end of the second support column 12b. The second chuck table 14b is rotated by a second chuck table motor (not shown) built in the second support column 12b. Further, a porous second suction chuck 16b connected to a suction means (not shown) is arranged at the upper end portion of the second chuck table 14b. Then, in the second holding means 4b, the workpiece can be sucked and held by generating a suction force on the upper surface of the second suction chuck 16b by the suction means. The Y-axis direction indicated by the arrow Y in FIG. 1 is a direction orthogonal to the X-axis direction, and the Z-axis direction indicated by the arrow Z in FIG. 1 is a direction orthogonal to each of the X-axis direction and the Y-axis direction. .. Further, the plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

図２を参照して説明を続けると、第一の加工送り手段６ａは、第一のＸ軸方向可動板１０ａに連結されＸ軸方向に延びるボールねじ１８ａと、ボールねじ１８ａの片端部に連結されたモータ２０ａとを有する。そして第一の加工送り手段６ａは、ボールねじ１８ａによりモータ２０ａの回転運動を直線運動に変換して第一のＸ軸方向可動板１０ａに伝達し、基台８上の第一の案内レール８ａに沿って第一のＸ軸方向可動板１０ａをＸ軸方向に加工送りする。また、第二の加工送り手段６ｂは、第二のＸ軸方向可動板１０ｂに連結されＸ軸方向に延びるボールねじ１８ｂと、ボールねじ１８ｂの片端部に連結されたモータ２０ｂとを有し、第一の案内レール８ａと隣接して基台８上に設置された第二の案内レール８ｂに沿って、第二のＸ軸方向可動板１０ｂをＸ軸方向に加工送りする。 Continuing the description with reference to FIG. 2, the first machining feed means 6a is connected to the ball screw 18a which is connected to the first X-axis direction movable plate 10a and extends in the X-axis direction, and is connected to one end of the ball screw 18a. It has a motor 20a and a screw. Then, the first processing feed means 6a converts the rotational motion of the motor 20a into a linear motion by the ball screw 18a and transmits it to the first X-axis direction movable plate 10a, and the first guide rail 8a on the base 8 is used. The first movable plate 10a in the X-axis direction is machined and fed in the X-axis direction along the above. Further, the second processing feed means 6b has a ball screw 18b connected to the second X-axis direction movable plate 10b and extending in the X-axis direction, and a motor 20b connected to one end of the ball screw 18b. The second X-axis direction movable plate 10b is machined and fed in the X-axis direction along the second guide rail 8b installed on the base 8 adjacent to the first guide rail 8a.

図２および図３を参照して説明する。図示の実施形態では図２に示すとおり、第一の加工送り手段６ａおよび第二の加工送り手段６ｂを跨ぐ門型の支持フレーム２２が基台８に設けられている。支持フレーム２２は、Ｙ軸方向に間隔をおいて基台８の上面から上方に延びる一対の支柱２４と、支柱２４の上端間に架け渡されＹ軸方向に延びる梁２６とを有する。梁２６の片面（図２における背面）には、第一の保持手段４ａに保持された被加工物を切削する第一の切削ブレード（図示していない。）を回転可能に備えた第一の切削手段３０ａと、第二の保持手段４ｂに保持された被加工物を切削する第二の切削ブレード２８ｂを回転可能に備えた第二の切削手段３０ｂと、第一の切削手段３０ａをＹ軸方向に割り出し送りする第一の割り出し送り手段３２ａ（図３参照。）と、第二の切削ブレード２８ｂを第一の切削ブレードに対峙させ第二の切削手段３０ｂをＹ軸方向に割り出し送りする第二の割り出し送り手段３２ｂ（図３参照。）とが装着されている。 This will be described with reference to FIGS. 2 and 3. In the illustrated embodiment, as shown in FIG. 2, a gate-shaped support frame 22 straddling the first machining feed means 6a and the second machining feed means 6b is provided on the base 8. The support frame 22 has a pair of columns 24 extending upward from the upper surface of the base 8 at intervals in the Y-axis direction, and a beam 26 spanning between the upper ends of the columns 24 and extending in the Y-axis direction. On one side (back surface in FIG. 2) of the beam 26, a first cutting blade (not shown) for cutting a workpiece held by the first holding means 4a is rotatably provided. The cutting means 30a, the second cutting means 30b rotatably provided with the second cutting blade 28b for cutting the workpiece held by the second holding means 4b, and the first cutting means 30a are Y-axis. A first indexing feed means 32a (see FIG. 3) for indexing and feeding in the direction and a second cutting blade 28b facing the first cutting blade and indexing and feeding the second cutting means 30b in the Y-axis direction. The second indexing feed means 32b (see FIG. 3) is attached.

図３に示すとおり、第一の切削手段３０ａは、Ｙ軸方向に移動自在に梁２６の片面に支持される矩形状の第一の割り出し送り片３４ａと、Ｚ軸方向に移動自在に第一の割り出し送り片３４ａに支持された断面Ｌ字状の第一の切り込み送り片３６ａと、第一の切り込み送り片３６ａの下端に固定された第一のスピンドルハウジング３８ａとを有する。第一のスピンドルハウジング３８ａには、Ｙ軸方向に延びる軸線を中心として回転可能にスピンドル（図示していない。）が支持されていると共に、スピンドルを回転させるスピンドル用モータ（図示していない。）が支持されている。そして第一の切削ブレードは、第一のスピンドルハウジング３８ａに支持されたスピンドルの先端に固定されている。また、第一のスピンドルハウジング３８ａには、切削水供給手段（図示していない。）に接続された第一の切削水供給ノズル（図示していない。）が設けられており、第一の切削ブレードで被加工物を切削する際に第一の切削水供給ノズルから切削水が供給される。また、第二の切削手段３０ｂは、第一の切削手段３０ａと同様に、Ｙ軸方向に移動自在に梁２６の片面に支持される矩形状の第二の割り出し送り片３４ｂと、Ｚ軸方向に移動自在に第二の割り出し送り片３４ｂに支持された断面Ｌ字状の第二の切り込み送り片３６ｂと、第二の切り込み送り片３６ｂの下端に固定された第二のスピンドルハウジング３８ｂとを有する。第二のスピンドルハウジング３８ｂには、Ｙ軸方向に延びる軸線を中心として回転可能にスピンドル（図示していない。）が支持されていると共に、スピンドルを回転させるスピンドル用モータ（図示していない。）が支持されている。そして第二の切削ブレード２８ｂは、第二のスピンドルハウジング３８ｂに支持されたスピンドルの先端に固定され、第一の切削ブレードに対面している。また、第二のスピンドルハウジング３８ｂには、切削水供給手段（図示していない。）に接続された第二の切削水供給ノズル３９ｂが設けられており、第二の切削ブレード２８ｂで被加工物を切削する際に第二の切削水供給ノズル３９ｂから切削水が供給される。 As shown in FIG. 3, the first cutting means 30a has a rectangular first indexing feed piece 34a that is movably supported on one side of the beam 26 in the Y-axis direction and a first movably movable in the Z-axis direction. It has a first cut feed piece 36a having an L-shaped cross section supported by the index feed piece 34a, and a first spindle housing 38a fixed to the lower end of the first cut feed piece 36a. The first spindle housing 38a supports a spindle (not shown) rotatably about an axis extending in the Y-axis direction, and a spindle motor (not shown) that rotates the spindle. Is supported. The first cutting blade is fixed to the tip of the spindle supported by the first spindle housing 38a. Further, the first spindle housing 38a is provided with a first cutting water supply nozzle (not shown) connected to a cutting water supply means (not shown), and the first cutting is performed. When cutting a workpiece with a blade, cutting water is supplied from the first cutting water supply nozzle. Further, the second cutting means 30b, like the first cutting means 30a, has a rectangular second indexing feed piece 34b supported on one side of the beam 26 so as to be movable in the Y-axis direction, and the Z-axis direction. A second cut feed piece 36b having an L-shaped cross section supported by the second index feed piece 34b and a second spindle housing 38b fixed to the lower end of the second cut feed piece 36b. Have. The second spindle housing 38b supports a spindle (not shown) rotatably about an axis extending in the Y-axis direction, and a spindle motor (not shown) that rotates the spindle. Is supported. The second cutting blade 28b is fixed to the tip of the spindle supported by the second spindle housing 38b and faces the first cutting blade. Further, the second spindle housing 38b is provided with a second cutting water supply nozzle 39b connected to a cutting water supply means (not shown), and the second cutting blade 28b is used to work. The cutting water is supplied from the second cutting water supply nozzle 39b when cutting.

図３に示すとおり、第一の割り出し送り手段３２ａは、第一の割り出し送り片３４ａに連結されＹ軸方向に延びるボールねじ４０ａと、ボールねじ４０ａの片端部に連結されたモータ４２ａとを有し、梁２６の片面に付設された案内レール（図示していない。）に沿って第一の割り出し送り片３４ａをＹ軸方向に割り出し送りする。また、第二の割り出し送り手段３２ｂは、第二の割り出し送り片３４ｂに連結されＹ軸方向に延びるボールねじ４０ｂと、ボールねじ４０ｂの片端部に連結されたモータ４２ｂとを有し、梁２６の片面に付設された案内レール（図示していない。）に沿って第二の割り出し送り片３４ｂをＹ軸方向に割り出し送りする。 As shown in FIG. 3, the first indexing feed means 32a has a ball screw 40a connected to the first indexing feed piece 34a and extending in the Y-axis direction, and a motor 42a connected to one end of the ball screw 40a. Then, the first indexing feed piece 34a is indexed and fed in the Y-axis direction along a guide rail (not shown) attached to one side of the beam 26. Further, the second indexing feed means 32b has a ball screw 40b connected to the second indexing feed piece 34b and extending in the Y-axis direction, and a motor 42b connected to one end of the ball screw 40b, and the beam 26. The second indexing feed piece 34b is indexed and fed in the Y-axis direction along a guide rail (not shown) attached to one side of the above.

図３に示すとおり、第一の切り込み送り片３６ａは、第一の切り込み送り片３６ａに連結されＺ軸方向に延びるボールねじ（図示していない。）と、このボールねじの片端部に連結されたモータ４４ａとを有する第一の切り込み送り手段４６ａによってＺ軸方向に切り込み送り（昇降）される。また、第二の切り込み送り片３６ｂは、第二の切り込み送り片３６ｂに連結されＺ軸方向に延びるボールねじ（図示していない。）と、このボールねじの片端部に連結されたモータ４４ｂとを有する第二の切り込み送り手段４６ｂによってＺ軸方向に切り込み送りされる。 As shown in FIG. 3, the first notch feed piece 36a is connected to a ball screw (not shown) that is connected to the first notch feed piece 36a and extends in the Z-axis direction, and is connected to one end of the ball screw. The notch feed (elevation) is performed in the Z-axis direction by the first notch feed means 46a having the motor 44a. Further, the second notch feed piece 36b includes a ball screw (not shown) connected to the second notch feed piece 36b and extending in the Z-axis direction, and a motor 44b connected to one end of the ball screw. It is notched and fed in the Z-axis direction by the second notch feeding means 46b having the above.

図２を参照して説明する。梁２６の他面（図２における前面）には、第一の保持手段４ａに保持された被加工物を撮像して切削加工すべき領域を検出するための第一の撮像手段４８ａと、第二の保持手段４ｂに保持された被加工物を撮像して切削加工すべき領域を検出するための第二の撮像手段４８ｂとがＹ軸方向に移動自在に装着されている。第一の撮像手段４８ａは、第一の撮像手段４８ａに連結されＹ軸方向に延びるボールねじ５０ａと、ボールねじ５０ａの片端部に連結されたモータ５２ａとを有する第一の移動機構５４ａによって、梁２６の他面に付設された案内レール２６ａに沿ってＹ軸方向に移動される。また、第二の撮像手段４８ｂは、第二の撮像手段４８ｂに連結されＹ軸方向に延びるボールねじ５０ｂと、ボールねじ５０ｂの片端部に連結されたモータ５２ｂとを有する第二の移動機構５４ｂによって、梁２６の案内レール２６ａに沿ってＹ軸方向に移動される。なお、図示の実施形態では上記のとおり、第一の撮像手段４８ａおよび第二の撮像手段４８ｂの２個の撮像手段が設けられているが、単一の撮像手段によって、第一の保持手段４ａに保持された被加工物を撮像して切削加工すべき領域を検出すると共に、第二の保持手段４ｂに保持された被加工物を撮像して切削加工すべき領域を検出するようにしてもよい。 This will be described with reference to FIG. On the other surface (front surface in FIG. 2) of the beam 26, a first image pickup means 48a for capturing an image of the workpiece held by the first holding means 4a and detecting a region to be cut, and a first image pickup means 48a. A second image pickup means 48b for capturing an image of the workpiece held by the second holding means 4b and detecting a region to be cut is mounted so as to be movable in the Y-axis direction. The first image pickup means 48a is provided by a first moving mechanism 54a having a ball screw 50a connected to the first image pickup means 48a and extending in the Y-axis direction and a motor 52a connected to one end of the ball screw 50a. It is moved in the Y-axis direction along the guide rail 26a attached to the other surface of the beam 26. Further, the second image pickup means 48b has a second moving mechanism 54b having a ball screw 50b connected to the second image pickup means 48b and extending in the Y-axis direction and a motor 52b connected to one end of the ball screw 50b. Is moved in the Y-axis direction along the guide rail 26a of the beam 26. In the illustrated embodiment, as described above, two image pickup means, a first image pickup means 48a and a second image pickup means 48b, are provided, but the first holding means 4a is provided by a single image pickup means. The area to be cut is detected by imaging the workpiece held in the second holding means 4b, and the area to be cut is detected by imaging the workpiece held in the second holding means 4b. good.

図１および図４を参照して説明する。図１に示すとおり基台８の上面には、第一の保持手段４ａに保持される被加工物を複数収容した第一のカセット５６ａと、第二の保持手段４ｂに保持される被加工物を複数収容した第二のカセット５６ｂとをＸ軸方向に隣接して位置づけるカセットテーブル５８が第一の加工送り手段６ａに隣接して配置されている。第一のカセット５６ａおよび第二のカセット５６ｂは、同一の構成でよく、上下方向に間隔をおいて複数枚の板状の被加工物（図示の実施形態ではウエーハＷ）を収容可能に構成されている。図４に示すとおり、板状の被加工物としてのウエーハＷの表面Ｗａは、格子状の分割予定ラインＬによって複数の領域に区画され、複数の領域のそれぞれにはデバイスＤが形成されている。図示の実施形態では、周縁が環状フレームＦに固定された粘着テープＴにウエーハＷの裏面が貼り付けられている。図示の実施形態では図１に示すとおり、複数枚のウエーハＷを収容した第一のカセット５６ａが上下２段積み重ねられた状態でカセットテーブル５８に載置されると共に、複数枚のウエーハＷを収容した第二のカセット５６ｂが上下２段積み重ねられた状態でＸ軸方向において第一のカセット５６ａに隣接してカセットテーブル５８に載置される。矩形状のカセットテーブル５８は基台８上の支持台６０に昇降自在に支持されており、支持台６０の内部にはカセットテーブル５８をＺ軸方向に昇降させる昇降手段（図示していない。）が設けられている。昇降手段は、たとえば、カセットテーブル５８に連結されＺ軸方向に延びるボールねじと、ボールねじを回転させるモータとから構成され得る。 This will be described with reference to FIGS. 1 and 4. As shown in FIG. 1, on the upper surface of the base 8, a first cassette 56a containing a plurality of workpieces held by the first holding means 4a and a workpiece held by the second holding means 4b. A cassette table 58 that positions a second cassette 56b accommodating a plurality of the second cassettes 56b adjacent to each other in the X-axis direction is arranged adjacent to the first processing feed means 6a. The first cassette 56a and the second cassette 56b may have the same configuration, and may accommodate a plurality of plate-shaped workpieces (wafer W in the illustrated embodiment) at intervals in the vertical direction. ing. As shown in FIG. 4, the surface Wa of the wafer W as a plate-shaped workpiece is divided into a plurality of regions by a grid-like division schedule line L, and a device D is formed in each of the plurality of regions. .. In the illustrated embodiment, the back surface of the wafer W is attached to the adhesive tape T whose peripheral edge is fixed to the annular frame F. In the illustrated embodiment, as shown in FIG. 1, the first cassette 56a accommodating a plurality of wafers W is placed on the cassette table 58 in a state of being stacked in two upper and lower stages, and a plurality of wafers W are accommodated. The second cassette 56b is placed on the cassette table 58 adjacent to the first cassette 56a in the X-axis direction in a state of being stacked in two upper and lower stages. The rectangular cassette table 58 is supported by a support base 60 on a base 8 so as to be able to move up and down, and inside the support base 60, a means for raising and lowering the cassette table 58 in the Z-axis direction (not shown). Is provided. The elevating means may be composed of, for example, a ball screw connected to the cassette table 58 and extending in the Z-axis direction, and a motor for rotating the ball screw.

図４を参照して説明を続けると、切削装置２は、カセットテーブル５８に載置された第一のカセット５６ａおよび第二のカセット５６ｂに隣接して位置づけられ被加工物を仮受けする仮受けテーブル６２を備える。図示の実施形態では、仮受けテーブル６２は、Ｙ軸方向に延びると共にＸ軸方向に開閉する断面Ｌ字状の一対のガイドレール６２ａで構成され、第一のカセット５６ａおよび第二のカセット５６ｂに選択的に仮受けテーブル６２を位置づける位置づけ手段６４に配設されている。図４に示すとおり位置づけ手段６４は、第一の加工送り手段６ａの上方において適宜のブラケット（図示していない。）で固定された固定枠６６と、Ｘ軸方向に移動自在に固定枠６６に支持された移動枠６８とを含む。仮受けテーブル６２を構成する一対のガイドレール６２ａは、移動枠６８のＸ軸方向一端部６８ａおよびＸ軸方向他端部６８ｂに互いに対面するように装着されている。また、位置づけ手段６４は移動枠６８をＸ軸方向に移動させるＸ軸方向移動機構７０を含む。Ｘ軸方向移動機構７０は、移動枠６８に連結されＸ軸方向に延びるボールねじ７２と、ボールねじ７２の片端部に連結されたモータ７４とを有する。そして、Ｘ軸方向移動機構７０で移動枠６８がＸ軸方向に移動されることによって、第一のカセット５６ａに対面する位置および第二のカセット５６ｂに対面する位置に仮受けテーブル６２が選択的に位置づけられる。また、一対のガイドレール６２ａは、進退手段７６およびガイドピン７８を介して、移動枠６８のＸ軸方向一端部６８ａおよびＸ軸方向他端部６８ｂにＸ軸方向に進退自在（開閉自在）に装着されている。そして、エアシリンダ又は電動シリンダから構成され得る進退手段７６によって一対のガイドレール６２ａが図４に示す閉位置に位置づけられると、一対のガイドレール６２ａに被加工物が跨って載置される。一方、閉位置よりも相互に離隔した開位置に一対のガイドレール６２ａが進退手段７６によって位置づけられると、一対のガイドレール６２ａ間を通して被加工物を昇降させることが可能になる。 Continuing the description with reference to FIG. 4, the cutting device 2 is positioned adjacent to the first cassette 56a and the second cassette 56b placed on the cassette table 58, and temporarily receives the workpiece. A table 62 is provided. In the illustrated embodiment, the temporary receiving table 62 is composed of a pair of guide rails 62a having an L-shaped cross section that extends in the Y-axis direction and opens and closes in the X-axis direction, and is attached to the first cassette 56a and the second cassette 56b. It is arranged in the positioning means 64 that selectively positions the temporary receiving table 62. As shown in FIG. 4, the positioning means 64 is attached to a fixed frame 66 fixed by an appropriate bracket (not shown) above the first machining feed means 6a and a fixed frame 66 movably movable in the X-axis direction. Includes a supported moving frame 68. The pair of guide rails 62a constituting the temporary receiving table 62 are mounted so as to face each other at one end portion 68a in the X-axis direction and the other end portion 68b in the X-axis direction of the moving frame 68. Further, the positioning means 64 includes an X-axis direction moving mechanism 70 that moves the moving frame 68 in the X-axis direction. The X-axis direction moving mechanism 70 has a ball screw 72 connected to the moving frame 68 and extending in the X-axis direction, and a motor 74 connected to one end of the ball screw 72. Then, by moving the moving frame 68 in the X-axis direction by the X-axis direction moving mechanism 70, the temporary receiving table 62 is selectively positioned at the position facing the first cassette 56a and the position facing the second cassette 56b. It is positioned in. Further, the pair of guide rails 62a can be freely moved forward and backward (openable and closable) in the X-axis direction to the one end 68a in the X-axis direction and the other end 68b in the X-axis direction of the moving frame 68 via the advancing / retreating means 76 and the guide pin 78. It is installed. Then, when the pair of guide rails 62a is positioned at the closed position shown in FIG. 4 by the advancing / retreating means 76 which may be composed of an air cylinder or an electric cylinder, the workpiece is placed over the pair of guide rails 62a. On the other hand, when the pair of guide rails 62a is positioned by the advancing / retreating means 76 at the open position separated from the closed position, the workpiece can be moved up and down through the pair of guide rails 62a.

図１、図５および図６を参照して説明する。切削装置２は、第一のカセット５６ａおよび第二のカセット５６ｂから被加工物を引き出し仮受けテーブル６２に被加工物を搬送する第一の搬送手段８０（図５参照。）と、仮受けテーブル６２に搬送された被加工物を保持し第一の保持手段４ａおよび第二の保持手段４ｂに被加工物を搬送する第二の搬送手段８２（図１および図５参照。）と、切削済みの被加工物を洗浄する洗浄手段８４（図１参照。）と、第一の保持手段４ａに保持された切削済みの被加工物および第二の保持手段４ｂに保持された切削済みの被加工物を保持し洗浄手段８４に被加工物を搬送する第三の搬送手段８６（図１および図６参照。）とを備える。 This will be described with reference to FIGS. 1, 5 and 6. The cutting device 2 has a first transport means 80 (see FIG. 5) for drawing the workpiece from the first cassette 56a and the second cassette 56b and transporting the workpiece to the temporary receiving table 62, and the temporary receiving table. A second transport means 82 (see FIGS. 1 and 5) that holds the workpiece conveyed to 62 and conveys the workpiece to the first holding means 4a and the second holding means 4b, and the machine has been cut. The cleaning means 84 (see FIG. 1) for cleaning the workpiece, the cut workpiece held by the first holding means 4a, and the cut workpiece held by the second holding means 4b. A third transport means 86 (see FIGS. 1 and 6) for holding the object and transporting the workpiece to the cleaning means 84 is provided.

図５に示すとおり第二の搬送手段８２は、被加工物を吸引保持する吸引パッド８８と、吸引パッド８８を支持する支持部９０と、支持部９０をＸ軸方向、Ｙ軸方向、Ｚ軸方向に移動する駆動部９２とを備え、第一の搬送手段８０は、被加工物を把持する把持部９４と、把持部９４を図５に実線で示す作用位置と図５に二点鎖線で示す非作用位置とに選択的に位置づける選択部９６と、選択部９６を第二の搬送手段８２の支持部９０に連結する連結部９８とを備え、第二の搬送手段８２の駆動部９２によってＸ軸方向、Ｙ軸方向、Ｚ軸方向に第一の搬送手段８０が移動されるのが好適である。図示の実施形態では、第二の搬送手段８２の駆動部９２は、Ｙ軸方向に移動自在に配置されたＹ軸方向可動部材１００と、Ｙ軸方向可動部材１００をＹ軸方向に移動させるＹ軸方向駆動部１０２と、Ｘ軸方向に移動自在にＹ軸方向可動部材１００に支持されたＸ軸方向可動部材１０４と、Ｘ軸方向可動部材１０４をＸ軸方向に移動させるＸ軸方向駆動部１０６とを含む。Ｙ軸方向駆動部１０２は、Ｙ軸方向可動部材１００に連結されＹ軸方向に延びるボールねじ１０８と、ボールねじ１０８の片端部に連結されたモータ１１０とを有し、適宜のブラケット（図示していない。）を介して固定された案内レール１１１に沿ってＹ軸方向可動部材１００をＹ軸方向に移動させる。Ｙ軸方向可動部材１００に支持されているＸ軸方向駆動部１０６は、Ｘ軸方向可動部材１０４に連結されＸ軸方向に延びるボールねじ１１２と、ボールねじ１１２の片端部に連結されたモータ１１４とを有し、Ｙ軸方向可動部材１００の下面に形成された案内レール（図示していない。）に沿って、Ｘ軸方向可動部材１０４をＸ軸方向に移動させる。また、Ｘ軸方向可動部材１０４の下端には、エアシリンダ又は電動シリンダから構成され得るＺ軸方向駆動部１１６を介して、第一の搬送手段８０の連結部９８が連結され、この連結部９８の下端に第二の搬送手段８２の支持部９０が固定されている。したがって第一の搬送手段８０と第二の搬送手段８２の支持部９０とは、Ｘ軸方向駆動部１０６によりＸ軸方向に移動され、Ｙ軸方向駆動部１０２によりＹ軸方向に移動され、かつＺ軸方向駆動部１１６によりＺ軸方向に移動されるようになっており、第一の搬送手段８０と第二の搬送手段８２とは駆動部９２を共有している。また、支持部９０の下面には、吸引手段（図示していない。）に接続された４個の吸引パッド８８が間隔をおいて支持されている。そして第二の搬送手段８２においては、吸引手段で各吸引パッド８８に吸引力を生成することにより、各吸引パッド８８で被加工物を吸引保持することができる。 As shown in FIG. 5, the second transport means 82 has a suction pad 88 that sucks and holds the workpiece, a support portion 90 that supports the suction pad 88, and the support portion 90 in the X-axis direction, the Y-axis direction, and the Z-axis. The first transport means 80 includes a drive unit 92 that moves in a direction, and the first transport means 80 has a grip portion 94 that grips the workpiece, an action position in which the grip portion 94 is shown by a solid line in FIG. 5, and a two-dot chain line in FIG. A selection unit 96 that is selectively positioned at the indicated non-acting position and a connecting unit 98 that connects the selection unit 96 to the support unit 90 of the second transport means 82 are provided by the drive unit 92 of the second transport means 82. It is preferable that the first transport means 80 is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction. In the illustrated embodiment, the drive unit 92 of the second transport means 82 has a Y-axis direction movable member 100 movably arranged in the Y-axis direction and a Y that moves the Y-axis direction movable member 100 in the Y-axis direction. Axial drive unit 102, X-axis movable member 104 supported by Y-axis movable member 100 so as to be movable in the X-axis direction, and X-axis direction drive unit that moves the X-axis direction movable member 104 in the X-axis direction. Includes 106. The Y-axis direction drive unit 102 has a ball screw 108 connected to the Y-axis direction movable member 100 and extends in the Y-axis direction, and a motor 110 connected to one end of the ball screw 108, and has an appropriate bracket (shown in the figure). The Y-axis direction movable member 100 is moved in the Y-axis direction along the guide rail 111 fixed via the (not). The X-axis direction drive unit 106 supported by the Y-axis direction movable member 100 is a ball screw 112 connected to the X-axis direction movable member 104 and extending in the X-axis direction, and a motor 114 connected to one end of the ball screw 112. The X-axis direction movable member 104 is moved in the X-axis direction along a guide rail (not shown) formed on the lower surface of the Y-axis direction movable member 100. Further, a connecting portion 98 of the first transport means 80 is connected to the lower end of the X-axis direction movable member 104 via a Z-axis direction driving portion 116 which may be composed of an air cylinder or an electric cylinder, and the connecting portion 98 is connected. The support portion 90 of the second transport means 82 is fixed to the lower end of the cylinder. Therefore, the first transport means 80 and the support portion 90 of the second transport means 82 are moved in the X-axis direction by the X-axis direction drive unit 106, moved in the Y-axis direction by the Y-axis direction drive unit 102, and It is moved in the Z-axis direction by the Z-axis direction drive unit 116, and the first transfer means 80 and the second transfer means 82 share the drive unit 92. Further, four suction pads 88 connected to the suction means (not shown) are supported on the lower surface of the support portion 90 at intervals. Then, in the second transport means 82, the work piece can be sucked and held by each suction pad 88 by generating a suction force in each suction pad 88 by the suction means.

図５を参照して説明を続けると、第一の搬送手段８０の連結部９８は、Ｚ軸方向駆動部１１６に連結された基端部からＹ軸方向に延出している。連結部９８の延出端にはＸ軸方向に延びる支持ピン１１８を介して把持部９４が揺動可能に支持され、支持ピン１１８には選択部９６が連結されている。モータから構成され得る選択部９６は、支持ピン１１８を回転させることにより、図５に実線で示す作用位置と図５に二点鎖線で示す非作用位置とに把持部９４を選択的に位置づける。把持部９４には、一対の把持片９４ａが互いに接近自在かつ離間自在に設けられていると共に、一対の把持片９４ａを接近および離間させる作動手段（図示していない。）が設けられている。そして第一の搬送手段８０においては、ソレノイド機構から構成され得る作動手段で一対の把持片９４ａを作動することにより、被加工物の端部を把持片９４ａで把持することができる。また、第一の搬送手段８０においては、把持片９４ａで被加工物を把持した状態で駆動部９２を作動させることにより、第一のカセット５６ａおよび第二のカセット５６ｂから被加工物を引き出し仮受けテーブル６２に被加工物を搬送することができる。第二の搬送手段８２においては、第一の搬送手段８０によって仮受けテーブル６２に搬送された被加工物を各吸引パッド８８で吸引保持した状態で駆動部９２を作動させることにより、第一の保持手段４ａおよび第二の保持手段４ｂに被加工物を搬送することができる。 Continuing the description with reference to FIG. 5, the connecting portion 98 of the first transport means 80 extends in the Y-axis direction from the base end portion connected to the Z-axis direction driving portion 116. A grip portion 94 is swingably supported at the extending end of the connecting portion 98 via a support pin 118 extending in the X-axis direction, and a selection portion 96 is connected to the support pin 118. The selection unit 96, which may be composed of a motor, selectively positions the grip portion 94 at the action position shown by the solid line in FIG. 5 and the non-action position shown by the alternate long and short dash line in FIG. 5 by rotating the support pin 118. The grip portion 94 is provided with a pair of grip pieces 94a so as to be able to approach and separate from each other, and an operating means (not shown) for bringing the pair of grip pieces 94a close to and apart from each other. Then, in the first transport means 80, the end portion of the workpiece can be gripped by the grip piece 94a by operating the pair of grip pieces 94a with the actuating means that can be configured by the solenoid mechanism. Further, in the first transport means 80, the work piece is pulled out from the first cassette 56a and the second cassette 56b by operating the drive unit 92 while the work piece is being held by the gripping piece 94a. The workpiece can be conveyed to the receiving table 62. In the second transport means 82, the drive unit 92 is operated while the workpiece transported to the temporary receiving table 62 by the first transport means 80 is sucked and held by each suction pad 88. The workpiece can be conveyed to the holding means 4a and the second holding means 4b.

図１を参照して洗浄手段８４について説明する。洗浄手段８４は、被加工物を保持する保持テーブル１２０と、保持テーブル１２０を回転させる保持テーブル用モータ１２２と、保持テーブル１２０を覆うカバー部材１２４と、保持テーブル１２０に保持された切削済みの被加工物に向かって洗浄水を噴射する洗浄水ノズル１２６と、保持テーブル１２０に保持された洗浄後の被加工物に向かってエアーを噴射するエアーノズル１２８とを含む。保持テーブル１２０の上端部分には、吸引手段（図示していない。）に接続された多孔質の吸着チャック１３０が配置されている。そして保持テーブル１２０においては、吸引手段で吸着チャック１３０の上面に吸引力を生成することにより、被加工物を吸着して保持することができる。そして洗浄手段８４においては、被加工物を保持した保持テーブル１２０を保持テーブル用モータ１２２で回転させつつ、所要位置に位置づけた洗浄水ノズル１２６から洗浄水を噴射することにより、被加工物を洗浄して切削屑を除去することができる。また、洗浄手段８４においては、所要位置に位置づけたエアーノズル１２８から乾燥エアーを噴射することにより、被加工物から洗浄水を除去して被加工物を乾燥させることができる。 The cleaning means 84 will be described with reference to FIG. The cleaning means 84 includes a holding table 120 for holding the workpiece, a holding table motor 122 for rotating the holding table 120, a cover member 124 for covering the holding table 120, and a cut cover held on the holding table 120. It includes a cleaning water nozzle 126 that injects cleaning water toward the workpiece, and an air nozzle 128 that injects air toward the workpiece after cleaning held on the holding table 120. A porous suction chuck 130 connected to a suction means (not shown) is arranged at the upper end portion of the holding table 120. Then, in the holding table 120, the workpiece can be sucked and held by generating a suction force on the upper surface of the suction chuck 130 by the suction means. Then, in the cleaning means 84, the workpiece is cleaned by injecting cleaning water from the cleaning water nozzle 126 positioned at a required position while rotating the holding table 120 holding the workpiece by the holding table motor 122. It is possible to remove cutting chips. Further, in the cleaning means 84, by injecting dry air from the air nozzle 128 positioned at a required position, the cleaning water can be removed from the workpiece to dry the workpiece.

図６を参照して第三の搬送手段８６について説明する。図示の実施形態における第三の搬送手段８６は、被加工物を吸引保持する吸引片１３２と、吸引片１３２を支持する支持片１３４と、支持片１３４をＹ軸方向、Ｚ軸方向に移動する駆動機構１３６とを備える。駆動機構１３６は、Ｙ軸方向に移動自在に支持されたＹ軸方向可動片１３８と、Ｙ軸方向可動片１３８をＹ軸方向に移動させるＹ軸方向駆動機構１４０とを含む。Ｙ軸方向駆動機構１４０は、Ｙ軸方向可動片１３８に連結されＹ軸方向に延びるボールねじ１４２と、ボールねじ１４２の片端部に連結されたモータ１４４とを有し、適宜のブラケット（図示していない。）を介して固定された案内レール１４５に沿ってＹ軸方向可動片１３８をＹ軸方向に移動させる。Ｙ軸方向可動片１３８の下端には、エアシリンダ又は電動シリンダから構成され得るＺ軸方向駆動機構１４６を介して支持片１３４が連結されている。したがって支持片１３４は、Ｙ軸方向駆動機構１４０によりＹ軸方向に移動され、かつＺ軸方向駆動機構１４６によりＺ軸方向に移動されるようになっている。また、支持片１３４の下面には、吸引手段（図示していない。）に接続された４個の吸引片１３２が間隔をおいて支持されている。そして第三の搬送手段８６においては、吸引手段で各吸引片１３２に吸引力を生成することにより、各吸引片１３２で被加工物を吸引保持することができると共に、各吸引片１３２で被加工物を吸引保持した状態で駆動機構１３６を作動させることにより、第一の保持手段４ａに保持された切削済みの被加工物および第二の保持手段４ｂに保持された切削済みの被加工物を保持し洗浄手段８４に搬送することができる。 The third transport means 86 will be described with reference to FIG. The third transport means 86 in the illustrated embodiment moves the suction piece 132 that sucks and holds the workpiece, the support piece 134 that supports the suction piece 132, and the support piece 134 in the Y-axis direction and the Z-axis direction. It is provided with a drive mechanism 136. The drive mechanism 136 includes a Y-axis direction movable piece 138 supported so as to be movable in the Y-axis direction, and a Y-axis direction drive mechanism 140 for moving the Y-axis direction movable piece 138 in the Y-axis direction. The Y-axis direction drive mechanism 140 has a ball screw 142 connected to the Y-axis direction movable piece 138 and extending in the Y-axis direction, and a motor 144 connected to one end of the ball screw 142, and has an appropriate bracket (shown in the figure). The Y-axis direction movable piece 138 is moved in the Y-axis direction along the guide rail 145 fixed via the (not). A support piece 134 is connected to the lower end of the Y-axis direction movable piece 138 via a Z-axis direction drive mechanism 146 which may be composed of an air cylinder or an electric cylinder. Therefore, the support piece 134 is moved in the Y-axis direction by the Y-axis direction drive mechanism 140, and is moved in the Z-axis direction by the Z-axis direction drive mechanism 146. Further, on the lower surface of the support piece 134, four suction pieces 132 connected to the suction means (not shown) are supported at intervals. In the third transport means 86, by generating a suction force in each suction piece 132 by the suction means, the work piece can be sucked and held by each suction piece 132, and the work piece is processed by each suction piece 132. By operating the drive mechanism 136 in a state where the object is sucked and held, the cut workpiece held by the first holding means 4a and the cut workpiece held by the second holding means 4b can be moved. It can be held and transported to the cleaning means 84.

上述したとおりの切削装置２によって、被加工物としてのウエーハＷに切削加工を施す切削方法について説明する。切削装置２を用いる切削方法では、まず、粘着テープＴを介して環状フレームＦに支持されたウエーハＷを複数収容した第一のカセット５６ａおよび第二のカセット５６ｂをカセットテーブル５８に載置する載置工程を実施する。図示の実施形態では図１に示すとおり、第一の保持手段４ａに保持される複数枚のウエーハＷを収容した第一のカセット５６ａを上下２段積み重ねた状態でカセットテーブル５８に載置すると共に、第二の保持手段４ｂに保持される複数枚のウエーハＷを収容した第二のカセット５６ｂを上下２段積み重ねた状態でＸ軸方向において第一のカセット５６ａに隣接してカセットテーブル５８に載置する。 A cutting method for performing a cutting process on the wafer W as a workpiece by the cutting device 2 as described above will be described. In the cutting method using the cutting device 2, first, the first cassette 56a and the second cassette 56b containing a plurality of wafers W supported by the annular frame F via the adhesive tape T are placed on the cassette table 58. Carry out the placement process. In the illustrated embodiment, as shown in FIG. 1, the first cassette 56a containing a plurality of wafers W held by the first holding means 4a is placed on the cassette table 58 in a state of being stacked in two upper and lower stages. , The second cassette 56b accommodating a plurality of wafers W held by the second holding means 4b is placed on the cassette table 58 adjacent to the first cassette 56a in the X-axis direction in a state of being stacked in two upper and lower stages. Place.

載置工程を実施した後、第一のカセット５６ａまたは第二のカセット５６ｂからウエーハＷを引き出し仮受けテーブル６２にウエーハＷを搬送する第一の搬送工程を実施する。第一のカセット５６ａから仮受けテーブル６２にウエーハＷを搬送する場合と、第二のカセット５６ｂから仮受けテーブル６２にウエーハＷを搬送する場合とは実質上同一であるので、ここでは、第一のカセット５６ａから仮受けテーブル６２にウエーハＷを搬送する場合について説明する。第一の搬送工程では、まず、位置づけ手段６４の移動枠６８をＸ軸方向に移動させ、仮受けテーブル６２を構成する一対のガイドレール６２ａを第一のカセット５６ａに対面する位置に位置づける。また、図７に示すとおり、環状フレームＦを載置可能な閉位置に一対のガイドレール６２ａを位置づける。次いで、第一の搬送手段８０の把持部９４を作用位置に位置づける。次いで、把持部９４を第一のカセット５６ａに進入させると共に、第一のカセット５６ａ内の環状フレームＦを把持部９４の把持片９４ａで把持させる。そして図８および図９に示すとおり、把持片９４ａで把持した環状フレームＦを第一のカセット５６ａから引き出し仮受けテーブル６２に搬送する。このようにして第一の搬送工程を実施する。環状フレームＦを仮受けテーブル６２まで搬送した後、把持片９４ａを互いに離間させて把持片９４ａによる環状フレームＦの把持を解除すると共に、選択部９６により把持部９４を非作用位置に揺動させる。 After carrying out the mounting step, the first transport step of drawing out the wafer W from the first cassette 56a or the second cassette 56b and transporting the wafer W to the temporary receiving table 62 is carried out. Since the case of transporting the wafer W from the first cassette 56a to the temporary receiving table 62 and the case of transporting the wafer W from the second cassette 56b to the temporary receiving table 62 are substantially the same, the first case is described here. A case of transporting the wafer W from the cassette 56a of the above to the temporary receiving table 62 will be described. In the first transfer step, first, the moving frame 68 of the positioning means 64 is moved in the X-axis direction, and the pair of guide rails 62a constituting the temporary receiving table 62 are positioned at positions facing the first cassette 56a. Further, as shown in FIG. 7, the pair of guide rails 62a are positioned at a closed position where the annular frame F can be placed. Next, the grip portion 94 of the first transport means 80 is positioned at the action position. Next, the grip portion 94 is brought into the first cassette 56a, and the annular frame F in the first cassette 56a is gripped by the grip piece 94a of the grip portion 94. Then, as shown in FIGS. 8 and 9, the annular frame F gripped by the gripping piece 94a is pulled out from the first cassette 56a and conveyed to the temporary receiving table 62. In this way, the first transfer step is carried out. After the annular frame F is conveyed to the temporary receiving table 62, the gripping pieces 94a are separated from each other to release the gripping of the annular frame F by the gripping piece 94a, and the gripping portion 94 is swung to the non-acting position by the selection portion 96. ..

第一の搬送工程を実施した後、仮受けテーブル６２に搬送されたウエーハＷを保持し第一の保持手段４ａまたは第二の保持手段４ｂにウエーハＷを搬送する第二の搬送工程を実施する。仮受けテーブル６２から第一の保持手段４ａにウエーハＷを搬送する例を説明すると、第二の搬送工程では、まず、第二の搬送手段８２の支持部９０を駆動部９２で移動させ、各吸引パッド８８を環状フレームＦの上方に位置づける。次いで支持部９０を下降させ、各吸引パッド８８を環状フレームＦの上面に密着させる。次いで、各吸引パッド８８に接続された吸引手段を作動させ、各吸引パッド８８に吸引力を生成し、各吸引パッド８８で環状フレームＦを吸引保持する。次いで支持部９０を上昇させ、各吸引パッド８８で吸引保持した環状フレームＦを仮受けテーブル６２から離間させる。また、仮受けテーブル６２の直下に第一の保持手段４ａの第一のチャックテーブル１４ａを位置づける。次いで、図１０に示すとおり、一対のガイドレール６２ａを開位置に位置づけると共に、各吸引パッド８８で吸引保持した環状フレームＦを一対のガイドレール６２ａ間を通して下降させることにより、第一のチャックテーブル１４ａの上面にウエーハＷを接触させる。そして、各吸引パッド８８に接続された吸引手段を停止させ、各吸引パッド８８の吸引力を解除し、第一のチャックテーブル１４ａの上面にウエーハＷを載せる。このようにして第二の搬送工程を実施する。なお、仮受けテーブル６２から第二の保持手段４ｂにウエーハＷを搬送する際は、各吸引パッド８８で環状フレームＦを吸引保持した後、環状フレームＦを仮受けテーブル６２から離間させる。次いで、第二の搬送手段８２の支持部９０を移動させると共に、第二の加工送り手段６ｂで第二のチャックテーブル１４ｂを移動させることにより、第二のチャックテーブル１４ｂの上面にウエーハＷを載せる。このように仮受けテーブル６２から第二の保持手段４ｂにウエーハＷを搬送する際は環状フレームＦを一対のガイドレール６２ａ間を通す必要はない。 After carrying out the first transport step, the second transport step of holding the wafer W transported to the temporary receiving table 62 and transporting the wafer W to the first holding means 4a or the second holding means 4b is carried out. .. Explaining an example of transporting the wafer W from the temporary receiving table 62 to the first holding means 4a, in the second transporting step, first, the support portion 90 of the second transporting means 82 is moved by the drive unit 92, and each of them is moved. The suction pad 88 is positioned above the annular frame F. Next, the support portion 90 is lowered to bring each suction pad 88 into close contact with the upper surface of the annular frame F. Next, the suction means connected to each suction pad 88 is operated to generate a suction force in each suction pad 88, and the annular frame F is sucked and held by each suction pad 88. Next, the support portion 90 is raised, and the annular frame F sucked and held by each suction pad 88 is separated from the temporary receiving table 62. Further, the first chuck table 14a of the first holding means 4a is positioned directly under the temporary receiving table 62. Next, as shown in FIG. 10, the pair of guide rails 62a is positioned in the open position, and the annular frame F sucked and held by each suction pad 88 is lowered through the pair of guide rails 62a to lower the first chuck table 14a. The wafer W is brought into contact with the upper surface of the. Then, the suction means connected to each suction pad 88 is stopped, the suction force of each suction pad 88 is released, and the wafer W is placed on the upper surface of the first chuck table 14a. In this way, the second transfer step is carried out. When the wafer W is conveyed from the temporary receiving table 62 to the second holding means 4b, the annular frame F is sucked and held by each suction pad 88, and then the annular frame F is separated from the temporary receiving table 62. Next, the wafer W is placed on the upper surface of the second chuck table 14b by moving the support portion 90 of the second transport means 82 and moving the second chuck table 14b by the second processing feed means 6b. .. As described above, when the wafer W is conveyed from the temporary receiving table 62 to the second holding means 4b, it is not necessary to pass the annular frame F between the pair of guide rails 62a.

第二の搬送工程を実施した後、第一の保持手段４ａまたは第二の保持手段４ｂでウエーハＷを保持すると共に、第一の保持手段４ａまたは第二の保持手段４ｂに保持されたウエーハＷを切削する切削工程を実施する。第一の保持手段４ａに保持されたウエーハＷを切削する場合と、第二の保持手段４ｂに保持されたウエーハＷを切削する場合とは実質上同一であるので、ここでは、第一の保持手段４ａに保持されたウエーハＷを切削する場合について説明する。切削工程では、まず、第一のチャックテーブル１４ａの上面に吸引力を生成し、第一のチャックテーブル１４ａでウエーハＷを吸引保持する。次いで、第一の加工送り手段６ａで第一の撮像手段４８ａの下方にウエーハＷを位置づけると共に、第一の撮像手段４８ａでウエーハＷを撮像する。次いで、第一のチャックテーブル１４ａを回転させ、第一の撮像手段４８ａで撮像したウエーハＷの画像に基づいてウエーハＷの分割予定ラインＬをＸ軸方向に整合させる。また、第一の加工送り手段６ａで第一のチャックテーブル１４ａを移動させると共に、第一の割り出し送り手段３２ａで第一のスピンドルハウジング３８ａを移動させることにより、Ｘ軸方向に整合させた分割予定ラインＬの片端部を第一の切削ブレードの下方に位置づける。次いで、第一の切削ブレードを回転させ、第一の切り込み送り手段４６ａで第一のスピンドルハウジング３８ａを下降させることによりウエーハＷの分割予定ラインＬに第一の切削ブレードの刃先を切り込ませると共に、第一のチャックテーブル１４ａを所定の加工送り速度でＸ軸方向に加工送りすることにより、ウエーハＷの分割予定ラインＬに沿って切削加工を施す。切削加工の際は、第一の切削水供給ノズルから切削領域に切削水が供給される。次いで、ウエーハＷの分割予定ラインＬのＹ軸方向の間隔の分だけ、第一の割り出し送り手段３２ａで第一の切削ブレードをＹ軸方向にインデックス送りする。そして、切削加工とインデックス送りとを交互に繰り返すことにより、Ｘ軸方向に整合させた分割予定ラインＬのすべてに切削加工を施す。また、第一のチャックテーブル１４ａを９０度回転させた上で、切削加工とインデックス送りとを交互に繰り返すことにより、先に切削加工を施した分割予定ラインＬと直交する分割予定ラインＬのすべてにも切削加工を施す。これによって、格子状の分割予定ラインＬに沿ってウエーハＷを個々のデバイスＤに分割することができる。 After carrying out the second transfer step, the wafer W is held by the first holding means 4a or the second holding means 4b, and the wafer W is held by the first holding means 4a or the second holding means 4b. Carry out the cutting process. Since the case of cutting the wafer W held by the first holding means 4a and the case of cutting the wafer W held by the second holding means 4b are substantially the same, here, the first holding is performed. A case of cutting the wafer W held by the means 4a will be described. In the cutting step, first, a suction force is generated on the upper surface of the first chuck table 14a, and the wafer W is sucked and held by the first chuck table 14a. Next, the wafer W is positioned below the first image pickup means 48a by the first processing feed means 6a, and the wafer W is imaged by the first image pickup means 48a. Next, the first chuck table 14a is rotated, and the scheduled division line L of the wafer W is aligned in the X-axis direction based on the image of the wafer W imaged by the first imaging means 48a. Further, by moving the first chuck table 14a by the first machining feed means 6a and moving the first spindle housing 38a by the first index feed means 32a, the division is scheduled to be aligned in the X-axis direction. One end of the line L is positioned below the first cutting blade. Next, by rotating the first cutting blade and lowering the first spindle housing 38a by the first cutting feed means 46a, the cutting edge of the first cutting blade is cut into the scheduled division line L of the waha W. By machining and feeding the first chuck table 14a in the X-axis direction at a predetermined machining feed rate, cutting is performed along the scheduled division line L of the wafer W. During cutting, cutting water is supplied to the cutting area from the first cutting water supply nozzle. Next, the first indexing feed means 32a index feeds the first cutting blade in the Y-axis direction by the distance in the Y-axis direction of the scheduled division line L of the wafer W. Then, by alternately repeating cutting and index feed, cutting is performed on all of the scheduled division lines L aligned in the X-axis direction. Further, by rotating the first chuck table 14a by 90 degrees and alternately repeating cutting and index feed, all of the scheduled division lines L orthogonal to the previously machined split line L. Is also machined. As a result, the wafer W can be divided into individual devices D along the grid-like division schedule line L.

切削工程を実施した後、第一の保持手段４ａに保持された切削済みのウエーハＷまたは第二の保持手段４ｂに保持された切削済みのウエーハＷを保持し洗浄手段８４にウエーハＷを搬送する第三の搬送工程を実施する。第一の保持手段４ａから洗浄手段８４にウエーハＷを搬送する例を説明すると、第三の搬送工程では、まず、第一の加工送り手段６ａで第一のチャックテーブル１４ａをＸ軸方向に移動させ、かつ位置づけ手段６４のＸ軸方向移動機構７０で移動枠６８をＸ軸方向に移動させ、かつ第三の搬送手段８６のＹ軸方向駆動機構１４０でＹ軸方向可動片１３８をＹ軸方向に移動させることにより、第一のチャックテーブル１４ａと移動枠６８と第三の搬送手段８６の支持片１３４とのＸＹ平面における位置を整合させる。次いで、開位置に位置づけられている一対のガイドレール６２ａ間を通して支持片１３４を下降させ、環状フレームＦの上面に各吸引片１３２を密着させる。次いで、各吸引片１３２で環状フレームＦを吸引保持すると共に、第一のチャックテーブル１４ａの吸引力を解除する。次いで、一対のガイドレール６２ａ間を通して、各吸引片１３２で吸引保持した環状フレームＦを上昇させる。次いで支持片１３４をＹ軸方向に移動させ、洗浄手段８４の上方に環状フレームＦを位置づける。次いで支持片１３４を下降させ、洗浄手段８４の保持テーブル１２０の上面にウエーハＷを接触させる。そして、各吸引片１３２の吸引力を解除し、洗浄手段８４の保持テーブル１２０の上面にウエーハＷを載せる。このようにして第三の搬送工程を実施する。なお、第二の保持手段４ｂから洗浄手段８４にウエーハＷを搬送する際は、第二のチャックテーブル１４ｂと第三の搬送手段８６の支持片１３４とのＸＹ平面における位置を整合させた上で、各吸引片１３２で環状フレームＦを吸引保持すると共に第二のチャックテーブル１４ｂの吸引力を解除し、そして各吸引片１３２で吸引保持した環状フレームＦを洗浄手段８４に搬送する。このように第二の保持手段４ｂから洗浄手段８４にウエーハＷを搬送する際は環状フレームＦを一対のガイドレール６２ａ間を通す必要はない。また、第三の搬送工程を第三の搬送手段８６で実施するのは、切削済みのウエーハＷには、切削水や切削屑が付着しているので、洗浄済みのウエーハＷを搬送する後述の第四の搬送工程および収容工程に用いる第一の搬送手段８０および第二の搬送手段８２とは別の第三の搬送手段８６を第三の搬送工程で用いることにより、第一の搬送手段８０および第二の搬送手段８２に切削水や切削屑が付着するのを防止して、第四の搬送工程および収容工程において洗浄済みのウエーハＷに切削水や切削屑が再付着するのを防止するためである。 After performing the cutting step, the cut wafer W held by the first holding means 4a or the cut wafer W held by the second holding means 4b is held and the wafer W is conveyed to the cleaning means 84. A third transfer step is carried out. Explaining an example of transporting the waha W from the first holding means 4a to the cleaning means 84, in the third transporting step, first, the first machining feeding means 6a moves the first chuck table 14a in the X-axis direction. The moving frame 68 is moved in the X-axis direction by the X-axis direction moving mechanism 70 of the positioning means 64, and the Y-axis direction movable piece 138 is moved in the Y-axis direction by the Y-axis direction driving mechanism 140 of the third transport means 86. By moving to, the positions of the first chuck table 14a, the moving frame 68, and the support piece 134 of the third transport means 86 on the XY plane are aligned. Next, the support piece 134 is lowered through the pair of guide rails 62a positioned at the open position, and each suction piece 132 is brought into close contact with the upper surface of the annular frame F. Next, the annular frame F is suction-held by each suction piece 132, and the suction force of the first chuck table 14a is released. Next, the annular frame F sucked and held by each suction piece 132 is raised through between the pair of guide rails 62a. Next, the support piece 134 is moved in the Y-axis direction, and the annular frame F is positioned above the cleaning means 84. Next, the support piece 134 is lowered to bring the wafer W into contact with the upper surface of the holding table 120 of the cleaning means 84. Then, the suction force of each suction piece 132 is released, and the wafer W is placed on the upper surface of the holding table 120 of the cleaning means 84. In this way, the third transfer step is carried out. When the waha W is transported from the second holding means 4b to the cleaning means 84, the positions of the second chuck table 14b and the support piece 134 of the third transport means 86 are aligned on the XY plane. The annular frame F sucked and held by each suction piece 132, the suction force of the second chuck table 14b is released, and the annular frame F sucked and held by each suction piece 132 is conveyed to the cleaning means 84. As described above, when the wafer W is conveyed from the second holding means 4b to the cleaning means 84, it is not necessary to pass the annular frame F between the pair of guide rails 62a. Further, the third transfer step is carried out by the third transfer means 86 because cutting water and cutting chips are attached to the cut waha W, so that the washed waha W is conveyed later. By using a third transport means 86 different from the first transport means 80 and the second transport means 82 used in the fourth transport step and the accommodating step in the third transport step, the first transport means 80 And prevents the cutting water and cutting chips from adhering to the second transporting means 82, and prevents the cutting water and cutting chips from reattaching to the washed wafer W in the fourth transporting step and the accommodating step. Because.

第三の搬送工程を実施した後、切削済みのウエーハＷを洗浄する洗浄工程を実施する。洗浄工程では、まず、保持テーブル１２０の上面に吸引力を生成し、保持テーブル１２０でウエーハＷを吸引保持する。次いで、ウエーハＷを吸引保持した保持テーブル１２０を保持テーブル用モータ１２２で回転させつつ、所要位置に位置づけた洗浄水ノズル１２６からウエーハＷに向かって洗浄水を噴射する。これによって、ウエーハＷを洗浄してウエーハＷから切削屑を除去することができる。切削屑を除去した後、所要位置に位置づけたエアーノズル１２８からウエーハＷに向かって乾燥エアーを噴射する。これによってウエーハＷから洗浄水を除去してウエーハＷを乾燥させることができる。 After carrying out the third transfer step, a washing step of washing the cut wafer W is carried out. In the cleaning step, first, a suction force is generated on the upper surface of the holding table 120, and the wafer W is sucked and held by the holding table 120. Next, the holding table 120 that sucks and holds the waha W is rotated by the holding table motor 122, and the washing water is sprayed from the washing water nozzle 126 positioned at the required position toward the waha W. As a result, the wafer W can be washed and cutting chips can be removed from the wafer W. After removing the cutting chips, dry air is injected toward the wafer W from the air nozzle 128 positioned at the required position. As a result, the washing water can be removed from the wafer W and the wafer W can be dried.

洗浄工程を実施した後、洗浄手段８４で洗浄されたウエーハＷを第二の搬送手段８２によって仮受けテーブル６２まで搬送する第四の搬送工程を実施する。第四の搬送工程では、まず、第二の搬送手段８２の支持部９０を洗浄手段８４の上方に位置づける。次いで、支持部９０を下降させ、環状フレームＦの上面に各吸引パッド８８を密着させる。次いで、各吸引パッド８８で環状フレームＦを吸引保持すると共に、洗浄手段８４の保持テーブル１２０の吸引力を解除する。次いで、支持部９０を上昇させると共にＹ軸方向に移動させることにより、仮受けテーブル６２の上方に環状フレームＦを位置づける。また、環状フレームＦを載置可能な閉位置に一対のガイドレール６２ａを位置づける。次いで支持部９０を下降させ、仮受けテーブル６２に環状フレームＦを接触させる。そして、各吸引パッド８８の吸引力を解除し、仮受けテーブル６２に環状フレームＦを載せる。 After carrying out the cleaning step, a fourth transporting step of transporting the wafer W washed by the cleaning means 84 to the temporary receiving table 62 by the second transporting means 82 is carried out. In the fourth transport step, first, the support portion 90 of the second transport means 82 is positioned above the cleaning means 84. Next, the support portion 90 is lowered to bring each suction pad 88 into close contact with the upper surface of the annular frame F. Next, the annular frame F is suction-held by each suction pad 88, and the suction force of the holding table 120 of the cleaning means 84 is released. Next, the annular frame F is positioned above the temporary receiving table 62 by raising the support portion 90 and moving it in the Y-axis direction. Further, the pair of guide rails 62a are positioned at a closed position where the annular frame F can be placed. Next, the support portion 90 is lowered to bring the annular frame F into contact with the temporary receiving table 62. Then, the suction force of each suction pad 88 is released, and the annular frame F is placed on the temporary receiving table 62.

第四の搬送工程を実施した後、仮受けテーブル６２に搬送されたウエーハＷを第一の搬送手段８０によって所定のカセットに収容する収容工程を実施する。第一のカセット５６ａにウエーハＷを収容する場合と、第二のカセット５６ｂにウエーハＷを収容する場合とは実質上同一であるので、ここでは、第一のカセット５６ａにウエーハＷを収容する場合について説明する。収容工程では、まず、位置づけ手段６４の移動枠６８をＸ軸方向に移動させ、仮受けテーブル６２を第一のカセット５６ａに対面する位置に位置づける。次いで、第一の搬送手段８０の把持部９４を作用位置に位置づける。次いで、駆動部９２で把持部９４の位置を調整した上で、仮受けテーブル６２上の環状フレームＦを把持片９４ａで把持させる（図９参照。）。そして駆動部９２を作動させ、把持片９４ａで把持した環状フレームＦを第一のカセット５６ａに搬送して収容する。 After carrying out the fourth transporting step, the feeding step of accommodating the wafer W transported to the temporary receiving table 62 in a predetermined cassette by the first transporting means 80 is carried out. Since the case of accommodating the wafer W in the first cassette 56a and the case of accommodating the wafer W in the second cassette 56b are substantially the same, here, the case of accommodating the wafer W in the first cassette 56a. Will be explained. In the accommodating step, first, the moving frame 68 of the positioning means 64 is moved in the X-axis direction, and the temporary receiving table 62 is positioned at a position facing the first cassette 56a. Next, the grip portion 94 of the first transport means 80 is positioned at the action position. Next, after adjusting the position of the grip portion 94 by the drive portion 92, the annular frame F on the temporary receiving table 62 is gripped by the grip piece 94a (see FIG. 9). Then, the drive unit 92 is operated, and the annular frame F gripped by the grip piece 94a is conveyed to and accommodated in the first cassette 56a.

切削装置２において実施する各工程は以上のとおりであるが、切削装置２においては、第一の搬送工程および第二の搬送工程を実施して第一のカセット５６ａから第一の保持手段４ａにウエーハＷを搬送した後、第二のカセット５６ｂから第二の保持手段４ｂにウエーハＷを搬送し、第一のカセット５６ａから搬出したウエーハＷおよび第二のカセット５６ｂから搬出したウエーハＷのそれぞれに、適宜の間隔をおいて、切削工程と第三の搬送工程と洗浄工程と第四の搬送工程と収容工程とを実施することができるので、仮受けテーブル６２と洗浄手段８４との稼働率が２倍になり生産性が向上する。 Each step carried out in the cutting apparatus 2 is as described above, but in the cutting apparatus 2, the first transfer step and the second transfer step are carried out from the first cassette 56a to the first holding means 4a. After transporting the wafer W, the wafer W is transported from the second cassette 56b to the second holding means 4b, and is carried out to each of the wafer W carried out from the first cassette 56a and the wafer W carried out from the second cassette 56b. Since the cutting process, the third transfer process, the cleaning process, the fourth transfer process, and the accommodating process can be performed at appropriate intervals, the operating rate of the temporary receiving table 62 and the cleaning means 84 can be increased. It doubles and improves productivity.

２：切削装置
４ａ：第一の保持手段
４ｂ：第二の保持手段
６ａ：第一の加工送り手段
６ｂ：第二の加工送り手段
２８ｂ：第二の切削ブレード
３０ａ：第一の切削手段
３０ｂ：第二の切削手段
３２ａ：第一の割り出し送り手段
３２ｂ：第二の割り出し送り手段
５６ａ：第一のカセット
５６ｂ：第二のカセット
５８：カセットテーブル
６２：仮受けテーブル
６２ａ：ガイドレール
６４：位置づけ手段
８０：第一の搬送手段
８２：第二の搬送手段
８４：洗浄手段
８６：第三の搬送手段
８８：吸引パッド（第二の搬送手段）
９０：支持部（第二の搬送手段）
９２：駆動部（第二の搬送手段）
９４：把持部（第一の搬送手段）
９６：選択部（第一の搬送手段）
９８：連結部（第一の搬送手段）
１３２：吸引片（第三の搬送手段）
１３４：支持片（第三の搬送手段）
１３６：駆動機構（第三の搬送手段） 2: Cutting device 4a: First holding means 4b: Second holding means 6a: First machining feed means 6b: Second machining feed means 28b: Second cutting blade 30a: First cutting means 30b: Second cutting means 32a: First indexing feeding means 32b: Second indexing feeding means 56a: First cassette 56b: Second cassette 58: Cassette table 62: Temporary receiving table 62a: Guide rail 64: Positioning means 80: First transport means 82: Second transport means 84: Cleaning means 86: Third transport means 88: Suction pad (second transport means)
90: Support part (second transport means)
92: Drive unit (second transport means)
94: Grip portion (first transport means)
96: Selection unit (first transport means)
98: Connecting part (first transport means)
132: Suction piece (third transport means)
134: Support piece (third transport means)
136: Drive mechanism (third transport means)

Claims (4)

板状の被加工物を切削する切削装置であって、
被加工物を保持する第一の保持手段および第二の保持手段と、
該第一の保持手段をＸ軸方向に加工送りする第一の加工送り手段と、
該第一の加工送り手段と隣接し該第二の保持手段をＸ軸方向に加工送りする第二の加工送り手段と、
該第一の保持手段に保持された被加工物を切削する第一の切削ブレードを回転可能に備えた第一の切削手段と、
該第二の保持手段に保持された被加工物を切削する第二の切削ブレードを回転可能に備えた第二の切削手段と、
該第一の切削手段をＸ軸方向に直交するＹ軸方向に割り出し送りする第一の割り出し送り手段と、
該第二の切削ブレードを該第一の切削ブレードに対峙させ該第二の切削手段をＹ軸方向に割り出し送りする第二の割り出し送り手段と、
該第一の保持手段に保持される被加工物を複数収容した第一のカセットと該第二の保持手段に保持される被加工物を複数収容した第二のカセットとをＸ軸方向に隣接して位置づけるカセットテーブルと、
該カセットテーブルをＸ軸方向とＹ軸方向とに直交するＺ軸方向に昇降させる昇降手段と、
該カセットテーブルに載置された第一のカセットおよび第二のカセットに隣接して位置づけられ被加工物を仮受けする仮受けテーブルと、
第一のカセットおよび第二のカセットから被加工物を引き出し該仮受けテーブルに被加工物を搬送する第一の搬送手段と、
該仮受けテーブルに搬送された被加工物を保持し該第一の保持手段および該第二の保持手段に被加工物を搬送する第二の搬送手段と、
切削済みの被加工物を洗浄する洗浄手段と、
該第一の保持手段に保持された切削済みの被加工物および該第二の保持手段に保持された切削済みの被加工物を保持し該洗浄手段に被加工物を搬送する第三の搬送手段と、
から少なくとも構成され、
該仮受けテーブルは、Ｙ軸方向に延びると共にＸ軸方向に開閉する一対のガイドレールで構成され、第一のカセットおよび第二のカセットに選択的に仮受けテーブルを位置づける位置づけ手段に配設され、
該第一の搬送手段が第一のカセットから被加工物を引き出す際、該仮受けテーブルは第一のカセットに位置づけられ、
該第二の搬送手段は該仮受けテーブルに搬送された被加工物を保持し該仮受けテーブルを構成する一対のガイドレールが開き該仮受けテーブルの直下に位置づけられた該第一の保持手段に被加工物を搬送する切削装置。 A cutting device that cuts plate-shaped workpieces.
The first holding means and the second holding means for holding the work piece,
The first processing feed means for processing and feeding the first holding means in the X-axis direction,
A second machining feed means adjacent to the first machining feed means and machining and feed the second holding means in the X-axis direction.
A first cutting means rotatably provided with a first cutting blade for cutting a workpiece held by the first holding means, and a first cutting means.
A second cutting means rotatably provided with a second cutting blade for cutting the workpiece held by the second holding means, and a second cutting means.
The first indexing and feeding means for indexing and feeding the first cutting means in the Y-axis direction orthogonal to the X-axis direction, and
A second indexing feed means for facing the second cutting blade to the first cutting blade and indexing and feeding the second cutting means in the Y-axis direction.
A first cassette containing a plurality of workpieces held by the first holding means and a second cassette containing a plurality of workpieces held by the second holding means are adjacent to each other in the X-axis direction. And the cassette table to be positioned
An elevating means for raising and lowering the cassette table in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction.
A temporary receiving table positioned adjacent to the first cassette and the second cassette placed on the cassette table and temporarily receiving the workpiece, and a temporary receiving table.
The first transport means for pulling out the workpiece from the first cassette and the second cassette and transporting the workpiece to the temporary receiving table,
A second transporting means for holding the workpiece transported to the temporary receiving table and transporting the workpiece to the first holding means and the second holding means.
Cleaning means for cleaning the machined material that has already been cut,
A third transport that holds the cut workpiece held by the first holding means and the cut workpiece held by the second holding means and conveys the workpiece to the cleaning means. Means and
Consists of at least from
The temporary receiving table is composed of a pair of guide rails extending in the Y-axis direction and opening and closing in the X-axis direction, and is arranged in a positioning means for selectively positioning the temporary receiving table in the first cassette and the second cassette. ,
When the first transport means pulls the workpiece out of the first cassette, the temporary receiving table is positioned in the first cassette.
The second conveying means holds the workpiece conveyed to the temporary receiving table, and the pair of guide rails constituting the temporary receiving table is opened, and the first holding means is positioned directly under the temporary receiving table. A cutting device that conveys the workpiece to the rail. 該第二の搬送手段は、被加工物を吸引保持する吸引パッドと、該吸引パッドを支持する支持部と、該支持部をＸ軸方向、Ｙ軸方向、Ｚ軸方向に移動する駆動部と、を備え、
該第一の搬送手段は、被加工物を把持する把持部と、該把持部を作用位置と非作用位置とに選択的に位置づける選択部と、該選択部を該第二の搬送手段の該支持部に連結する連結部と、を備え、
該第二の搬送手段の該駆動部によってＸ軸方向、Ｙ軸方向、Ｚ軸方向に該第一の搬送手段が移動される請求項１記載の切削装置。 The second transport means includes a suction pad that sucks and holds the workpiece, a support portion that supports the suction pad, and a drive unit that moves the support portion in the X-axis direction, the Y-axis direction, and the Z-axis direction. , Equipped with
The first transport means includes a grip portion that grips the workpiece, a selection portion that selectively positions the grip portion between an action position and a non-action position, and the selection portion of the second transport means. With a connecting part that connects to the support part,
The cutting device according to claim 1 , wherein the first transport means is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction by the drive unit of the second transport means. 該第三の搬送手段は、被加工物を吸引保持する吸引片と、該吸引片を支持する支持片と、該支持片をＹ軸方向、Ｚ軸方向に移動する駆動機構と、を備え、該第一の保持手段および該第二の保持手段に保持された切削済みの被加工物を保持し該洗浄手段に被加工物を搬送する請求項２記載の切削装置。 The third transport means includes a suction piece that sucks and holds the workpiece, a support piece that supports the suction piece, and a drive mechanism that moves the support piece in the Y-axis direction and the Z-axis direction. The cutting apparatus according to claim 2 , wherein the cut workpiece held by the first holding means and the second holding means is held and the workpiece is conveyed to the cleaning means. 該洗浄手段で洗浄された被加工物は該第二の搬送手段によって該仮受けテーブルまで搬送され、該仮受けテーブルに搬送された被加工物は該第一の搬送手段によって所定のカセットに収容される請求項２記載の切削装置。 The workpiece washed by the cleaning means is conveyed to the temporary receiving table by the second conveying means, and the workpiece conveyed to the temporary receiving table is accommodated in a predetermined cassette by the first conveying means. 2. The cutting apparatus according to claim 2 .
JP2017246092A 2017-12-22 2017-12-22 Cutting equipment Active JP7032122B2 (en)

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CN201811540314.5A CN109994406B (en) 2017-12-22 2018-12-17 Cutting device
TW107146349A TWI806946B (en) 2017-12-22 2018-12-21 cutting device

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JP2003163181A (en) 2001-11-28 2003-06-06 Disco Abrasive Syst Ltd Machining apparatus
JP2006156777A (en) 2004-11-30 2006-06-15 Disco Abrasive Syst Ltd Dividing apparatus for rectangular substrate
JP2016127097A (en) 2014-12-26 2016-07-11 株式会社ディスコ Processing device
JP2017103274A (en) 2015-11-30 2017-06-08 株式会社ディスコ Cutting device

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JP2688623B2 (en) 1992-05-11 1997-12-10 株式会社ディスコ Dicing equipment
JP5236918B2 (en) * 2007-10-02 2013-07-17 株式会社ディスコ Cutting blade detection mechanism of cutting equipment
TWI655685B (en) * 2015-01-28 2019-04-01 迪思科股份有限公司 Cutting device
JP6441737B2 (en) * 2015-04-28 2018-12-19 株式会社ディスコ Cutting equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163181A (en) 2001-11-28 2003-06-06 Disco Abrasive Syst Ltd Machining apparatus
JP2006156777A (en) 2004-11-30 2006-06-15 Disco Abrasive Syst Ltd Dividing apparatus for rectangular substrate
JP2016127097A (en) 2014-12-26 2016-07-11 株式会社ディスコ Processing device
JP2017103274A (en) 2015-11-30 2017-06-08 株式会社ディスコ Cutting device

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